Connector Kits and Connectors

Abstract

The present invention provides a connector kit and a connector, which can prevent the connector housing and cover from deforming or causing solder cracks during reflow. The connector kit comprises: a plurality of connectors (1) and a cover (100) assembled on the plurality of connectors (1) when the plurality of connectors (1) are reflow mounted on a substrate, a long hole (33) as a mating part and a positioning long pin (138) as a mating part mating with the long hole (33) are provided at each end of the connector (1) and the cover (100), and an opening is provided on the long hole (33), and the opening is used to absorb the thermal expansion from one end side to the other end side caused by the change of the reflow temperature to make the positioning long pin (138) movable.

Description

Technical Field

[0001] The present invention relates to a high-speed transmission connector mounted on a circuit board, and more particularly to a mezzanine connector for electrically connecting different circuit boards to each other. Background Art

[0002] Among the connectors that relay high-speed signal transmission between the circuit substrate and the extension substrate, there is a type in which the connector installed on the circuit substrate side is a socket-type connector, and the connector installed on the extension substrate side is a plug-type connector, and the terminals of the two connectors are connected by fitting the plug-type connector in the lateral range of the connector. This type of connector is called a "middle layer connector".

[0003] As an example of a document that discloses technology related to this type of connector, there is Patent Document 1. The connector described in this document has a box-shaped housing and contacts arranged side by side on its wall surface. On the bottom surface of the housing of the connector, there is a protrusion that is inserted into a positioning hole on the circuit board, and contacts are provided in the housing in a lateral range opposite to the side where the protrusion is provided. The reflow installation of this connector on the substrate is performed by placing the connector at a predetermined position on the substrate while keeping the cover installed on the connector unchanged, raising the temperature from room temperature to about 260 degrees to melt the solder and returning it to room temperature.

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-113146

[0005] However, the housing and cover of this connector are both made of resin. If the housing and cover are molded in different directions, the thermal expansion rates of the two may differ greatly during reflow. In this case, the connector housing may be stretched due to excessive expansion of the cover, causing deformation of the connector housing or solder cracks. Summary of the invention

[0006] The present invention has been made in view of such a problem, and an object of the present invention is to provide a technical solution capable of preventing the housing and cover of a connector from being deformed or solder cracked during reflow.

[0007] In order to solve the above-mentioned problems, a connector kit as a preferred embodiment of the present invention comprises a plurality of connectors and covers assembled to the plurality of connectors when the plurality of connectors are reflow mounted on a substrate, characterized in that an engaged portion and an engaging portion engaged with the engaged portion are provided at each end of the connector and the cover, and an open portion is provided at the engaged portion, and the open portion is used to absorb thermal expansion from one end side to the other end side caused by a change in reflow temperature to enable the engaging portion to move.

[0008] In this embodiment, the engaged portion may be a long hole provided in the connector, the engaging portion may be a long positioning pin provided in the cover, a round hole may be provided on the connector on the side opposite to the side on which the long hole is provided, and a positioning pin engaged with the round hole may be provided on the cover on the side opposite to the side on which the long positioning pin is provided.

[0009] Furthermore, the connector may include: a housing having a plurality of slots partitioned by partition walls; and a plurality of contacts arranged in the slots.

[0010] Furthermore, the plurality of connectors may be arranged in a direction perpendicular to a direction in which the slot extends, and may be held by the cover.

[0011] Alternatively, in one of the connectors, the number of the slots is two.

[0012] Alternatively, the shell may have a bottom and two first wall portions and a second wall portion that are opposite to each other and sandwich the slot, the first wall portion extending in a direction orthogonal to the slot, and a hanging spring is provided on the cover, and when the positioning pin is inserted into the circular hole, the long positioning pin is inserted into the long hole, and the hanging spring is embedded in the inner side of the first wall portion to assemble the cover to the connector, the connector is supported from the inside by the hanging spring of the cover.

[0013] Furthermore, the housing may have a rotationally asymmetric shape when viewed from a direction in which a connector of a communication partner is fitted.

[0014] Furthermore, some of the plurality of connectors may be mounted on the substrate in parallel with the remaining connectors in opposite directions.

[0015] As another preferred embodiment of the present invention, the connector is gathered by a cover and reflow mounted on a substrate, and is characterized in that it comprises: a plurality of slots extending in one direction and separated by partitions; a bottom, which becomes the bottom of the connector; two first wall portions, which surround the slots and face each other in a direction perpendicular to the slots; and two second wall portions, which surround the slots and face each other in a direction parallel to the slots, wherein one of the two first wall portions is provided with a circular hole engaged with a positioning pin of the cover, and the other of the two first wall portions is provided with a long hole engaged with a positioning long pin of the cover, the long hole is open to the other side, and when the cover expands together with the connector, the positioning long pin embedded in the long hole moves in the long hole toward the other side.

[0016] As another preferred embodiment of the present invention, a connector kit comprises a plurality of connectors and covers assembled to the connectors when the connectors are reflow mounted on a substrate, wherein the covers are in the shape of a box having an opening for accommodating and holding the connectors, and an adsorption sheet is adsorbed on the surface of the plurality of covers on the opposite side to the opening.

[0017] In this aspect, a dividing slit may be formed between adjacent connectors.

[0018] The present invention comprises a plurality of connectors and a cover mounted on the plurality of connectors when the plurality of connectors are reflow mounted on a substrate, wherein a fitted portion and a fitting portion fitted with the fitted portion are provided at one end of each of the connector and the cover, and an opening portion is provided on the fitted portion, wherein the opening portion is used to absorb thermal expansion from one end side to the other end side caused by reflow temperature change to move the fitting portion. Thus, the housing of the connector and the cover can be prevented from being deformed or solder cracked during reflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a perspective view of the connector 1 and the cover 100 mounted on the connector 1 as one embodiment of the present invention.

[0020] exist Figure 2 (A) is viewed from the -Z side Figure 1 100, (B) is an enlarged view of the area within frame C in (A).

[0021] exist Figure 3 In (A), Figure 1 (B) is a stereoscopic view of the connector 1 viewed from the opposite side of (A).

[0022] exist Figure 4 In (A), Figure 3 (A) is the enlarged view in frame A, (B) is Figure 3 Enlarged view of frame B in (A).

[0023] Figure 5 yes Figure 1 Exploded view of connector 1.

[0024] Figure 6 yes Figure 5 A perspective view of the solder bonding terminal 7 of the connector 1.

[0025] Figure 7 yes Figure 5 A perspective view of contacts 8 of connector 1 .

[0026] exist Figure 8, (A) is a cross-sectional view of the component after the cover 100 is mounted on the connector 1, which is parallel to the XZ plane, and (B) is an enlarged view of the portion on the +X side of (A).

[0027] Fig. 9 , (A) is a perspective view of a cover 100 as a modified example of the present invention, and (B) is an exploded view of (A).

[0028] Description of Reference Numerals

[0029] 1 connector; 7 solder lap terminal; 8 contact; 10 housing; 11 wall; 12 wall; 13 bottom; 17 partition wall; 18 gap; 19 slot; 31 round hole; 33 long hole; 34 engaging piece; 35 angle slot; 36 slot; 71 substrate; 72 tab; 81 straight portion; 82 terminal; 83 fork; 100 cover; 100A cover; 111 wall; 112 wall; 113 top plate; 130 opening; 134 lower end; 135 spring; 136 spring storage portion; 138 positioning pin; 139 positioning long pin; 191 first suction piece; 192 second suction piece; 197 dividing slit. DETAILED DESCRIPTION

[0030] Hereinafter, a connector 1 and a cover 100 of a connector kit as an embodiment of the present invention will be described with reference to the accompanying drawings. The connector 1 is a so-called socket-type connector. The connector 1 is used in conjunction with a so-called plug-type connector. The connector 1 and the plug-type connector 1 are respectively mounted on two electronic substrates. When the head of the communication partner connector is engaged in the slot 19 of the connector 1, the contacts 8 of the two connectors 1 are electrically connected, and high-speed differential transmission based on PAM (Pulse Amplitude Modulation) can be achieved. When the connector 1 is reflow mounted on the substrate, the cover 100 is assembled to the connector 1.

[0031] In the following description, the direction in which the cover 100 is assembled to the connector 1 is appropriately referred to as the Z direction, a direction orthogonal to the Z direction is appropriately referred to as the X direction, and a direction orthogonal to both the Z direction and the X direction is appropriately referred to as the Y direction. In addition, the +Z side is sometimes referred to as the upper side, the -Z side is sometimes referred to as the lower side, the +X side is sometimes referred to as the front side, the -X side is sometimes referred to as the rear side, the +Y side is sometimes referred to as the left side, and the -Y side is sometimes referred to as the right side.

[0032] like Figure 5 As shown in FIG. 1 , the connector 1 comprises a housing 10, solder bonding terminals 7 and contacts 8. The housing 10 of the connector 1 is formed by Figure 1 The connector 1 is formed by injecting resin in the direction of arrow B. The housing 10 of the connector 1 has a rotationally asymmetric shape.

[0033] To explain in more detail, two slots 19 are provided in the housing 10 of the connector 1. The two slots 19 extend in the X direction. The housing 10 has: a bottom 13, which serves as the bottom of the housing 10; a wall 11 and a wall 12, which face each other in the X direction and the Y direction with the slots 19 sandwiched therebetween; and a partition wall 17, which separates the two slots 19 in a lateral range surrounded by the wall 11 and the wall 12. The wall 11 extends in the Y direction, and the wall 12 extends in the X direction.

[0034] like Figure 4 As shown in (B), the end of the -X side of the partition wall 17 is connected to the wall portion 11 on the -X side. Figure 4 As shown in (A), the end of the partition wall 17 on the +X side is not connected to the wall portion 11 on the +X side, and a gap 18 is formed between the end of the partition wall 17 on the +X side and the wall portion 11 on the +X side.

[0035] A circular hole 31 is provided in the middle of the Y direction in the wall portion 11 on the -X side. A long hole 33 is provided in the middle of the Y direction in the wall portion 11 on the +X side. The +X side of the long hole 33 is open. An angle groove 35 is provided in the wall portion 11 on the -X side and on the +Y side and -Y side of the hole in the wall portion 11 on the +X side. The angle groove 35 is recessed from the upper surface of the wall portion 11 toward the bottom 13. A hole is drilled in the bottom of the angle groove 35, and the solder bridging terminal 7 is embedded and fixed in the hole. As shown in FIG. Figure 6 As shown, the solder strap terminal 7 includes an elongated base portion 71 and two protruding pieces 72 rising from both ends of one long side of the base portion 71. The two protruding pieces 72 are fitted into the bottom holes of the angle groove 35 of the housing 10.

[0036] like Figure 8 As shown in FIG. 1B , on the lower side of the inner surface of the wall portion 11 on the +X side and the −X side on the side of the slot 19 , there is an engagement piece 34 protruding toward the slot 19 .

[0037] A groove 36 is provided on the inner surface of the wall portion 12 and the side surface of the partition wall 17. The contact 8 is accommodated in the groove 36. Figure 7 As shown, the contact 8 has a straight portion 81 extending in one direction, a terminal portion 82 at one end of the straight portion 81, and a fork portion 83 at the other end of the straight portion 81. The terminal portion 82 is bent into a "く" shape. The fork portion 83 is divided into two branches. Solder 9 is riveted and fixed to the fork portion 83. The contact 8 is held in the wall portion 12 and the groove 36 of the partition wall 17, and the fork portion 83 and the solder 9 of the contact 8 are exposed to the side opposite to the groove 36 through the hole of the bottom 13.

[0038] like Figure 1 as well as Figure 2As shown in FIG. 1 , the cover 100 is in a box shape having a width slightly larger than that of a component formed by arranging eight connectors 1 in the X direction and the Y direction. Figure 1 The resin is injected in the direction of arrow A to form the mold.

[0039] like Figure 2 As shown in (A), an opening 130 for accommodating and holding the connector 1 is provided on the -Z side of the cover 100. The cover 100 has: a top plate portion 113, which serves as the ceiling of the cover 100; and a wall portion 111 and a wall portion 112, which are opposite to each other in the X direction and the Y direction with the opening 130 sandwiched therebetween. A hanging spring 135 and a spring receiving portion 136 are provided on the inner side of the wall portion 112 on the -X side and the wall portion 112 on the +X side at positions corresponding to the respective slots 19 of the eight shells 10. As shown Figure 8 As shown in (B), the lower end portion 134 of the hook spring 135 protrudes outward in a triangular shape.

[0040] A positioning pin 138 is provided at a position corresponding to the circular hole 31 between the adjacent spring receiving portions 136 on the inner side of the wall portion 112 on the -X side. The positioning pin 138 has a shape that is received in the circular hole 31. A positioning long pin 139 is provided at a position corresponding to the long hole 33 between the adjacent spring receiving portions 136 on the inner side of the wall portion 112 on the +X side. The positioning long pin 139 has a shape that is received in the long hole 33.

[0041] The assembly of the cover 100 to the connector 1 and its reflow installation are performed as follows. First, eight connectors 1 are arranged in parallel so that the orientation of the gaps 18 of some of the connectors 1 is opposite to the orientation of the gaps 18 of the remaining connectors 1 (for example, the gaps 18 of the two connectors 1 in the middle are on the -X side, and the gaps 18 of the two connectors 1 at the ends are on the +X side).

[0042] Next, the cover 100 is assembled to the eight connectors 1 by inserting the positioning pin 138 into the circular hole 31 on the -X side, inserting the positioning long pin 139 into the long hole 33 on the +X side, and inserting the tension spring 135 into the inner side of the wall portion 11 on the +X side and the -X side. Figure 8 (A) and Figure 8 As shown in (B), when the cover 100 is assembled onto eight connectors 1, the lower end 134 of the hanging spring 135 of the cover 100 engages with the engaging piece 34 of the connector 1, and the connector 1 is supported from the inside in the X direction by the hanging spring 135 of the cover 100.

[0043] Next, eight connectors 1 gathered by the cover 100 are placed at a predetermined position on the electronic substrate and placed in a reflow device, and the temperature in the device is changed from 20°C to 260°C to 20°C. As the temperature rises, the cover 100 expands together with the housing 10. Figure 1 As shown, the injection direction of the cover 100 is orthogonal to the injection direction of the housing 10. For injection molded products, thermal expansion is more likely to occur in the direction orthogonal to the injection direction than in the injection direction, and there is a difference of about 5 times in the thermal expansion coefficients between the injection direction and the orthogonal direction. When the cover 100 is assembled to the connector 1 and heated, the expansion amount of the cover 100 in the X direction is greater than the expansion amount of the connector 1 in the X direction. The positioning pin 138 of the cover 100 is engaged with the circular hole 31 of the connector 1 and does not move, so the part on the +X side expands toward the +X side compared with the positioning pin 138 of the cover 100. When the cover 100 expands together with the connector 1, the long hole 33 of the connector 1 plays a "clearance" role, and the positioning long pin 139 embedded in the long hole 33 moves in the long hole 33 toward the open part on the +X side.

[0044] When the temperature exceeds 217°C, the solder 9 at the front end of the contact 8 of the connector 1 melts, and when it returns to room temperature, the solder 9 solidifies. The contact 8 of the connector 1 and the pad of the electronic substrate are connected by the solidification of the solder 9. After the connector 1 is assembled on the electronic substrate, the cover 100 is removed from the connector 1.

[0045] The above is the details of the structure of this embodiment. The connector kit of this embodiment comprises: a plurality of connectors 1 and a cover 100 mounted on the plurality of connectors 1 when the plurality of connectors 1 are reflow mounted on a substrate, a long hole 33 as a mating portion and a positioning long pin 138 as a mating portion mating with the long hole 33 are provided at each end of the connector 1 and the cover 100, and an opening is provided in the long hole 33, and the opening absorbs the thermal expansion from one end side to the other end side caused by the change of the reflow temperature to move the positioning long pin 138. Thus, the shell 10 of the connector 1 and the cover 100 can be prevented from deformation of the shell 10 or solder cracks during reflow.

[0046] In addition, in the present embodiment, the housing 10 of the connector 1 has a rotationally asymmetric shape. Thus, a connector can be provided in which reverse insertion is less likely to occur by using a connector of a communication partner also having a rotationally asymmetric shape.

[0047] As mentioned above, although embodiment of this invention is demonstrated, the following deformation|transformation may be added to this embodiment.

[0048] (1) In the above-mentioned embodiment, the number of connectors 1 that are mounted on the substrate by being gathered by the cover 100 may be 2 to 3, or may be 4 or more.

[0049] (2) In the above embodiment, the number of slots 19 in one connector 1 may be one row or three or more rows.

[0050] (3) In the above embodiment, the connector 1 may be provided with the positioning pin 138 and the positioning long pin 139 , and the cover 100 may be provided with the round hole 31 and the long hole 33 .

[0051] (4) In the above embodiment, instead of using one cover 100 to gather and hold the plurality of connectors 1, one cover 100 may be mounted on one connector 1 and the plurality of covers 100 may be gathered together by a linear member. Fig. 9 (A) and Fig. 9 As shown in (B), in this modification, a plurality of caps 100A are gathered together by two linear first adsorption sheets 191, and a dividing slit 197 is formed between adjacent caps 100A. Each cap 100A is box-shaped. An opening for accommodating and holding the connector 1 is provided in each cap 100A. The first adsorption sheet 191 is adsorbed on the surface of the cap 100A on the opposite side to the opening side. In addition, the second adsorption sheet 192 is adsorbed between the two first adsorption sheets 191 in the cap 100A. The second adsorption sheet 192 is used to hold the cap 100A during reflow. According to this modification, the expansion of the cap 100A in the long side direction can be stabilized.

Claims

1. A connector kit comprising: a plurality of connectors and a cover mounted on the plurality of connectors when the plurality of connectors are reflow mounted on a substrate, It is characterized in that A fitted portion and a fitting portion fitted with the fitted portion are provided at each end of the connector and the cover, and an opening portion is provided at the fitted portion, and the opening portion is used to absorb thermal expansion from one end side to the other end side caused by the change of the reflow temperature to make the fitting portion movable. The engaged portion is a long hole provided in the connector, the engaging portion is a long positioning pin provided in the cover, a round hole is provided in the connector on the side opposite to the side provided with the long hole, and a positioning pin engaged with the round hole is provided in the cover on the side opposite to the side provided with the long positioning pin. or The engaged portion is a long hole provided in the cover, and the engaging portion is a long positioning pin provided in the connector. A round hole is provided in the cover on the side opposite to the side provided with the long hole, and a positioning pin engaged with the round hole is provided in the connector on the side opposite to the side provided with the long positioning pin.

2. The connector kit according to claim 1, It is characterized in that The connector has: a housing having a plurality of slots separated by partition walls; and A plurality of contacts are arranged in the slot.

3. The connector kit according to claim 2, It is characterized in that The plurality of connectors are arranged in a direction perpendicular to a direction in which the slots extend, and are held by the cover.

4. The connector kit according to claim 3, It is characterized in that In one of the connectors, the number of the slots is 2.

5. The connector kit according to claim 4, It is characterized in that The housing has a bottom and two first walls and a second wall that are opposite to each other and sandwich the slot. The first wall portion extends in a direction perpendicular to the slot. A hanging spring is provided on the cover. When the cover is assembled to the connector by inserting the positioning pin into the round hole, inserting the positioning long pin into the long hole, and embedding the hanging spring into the inner side of the first wall portion, the connector is supported from the inside by the hanging spring of the cover.

6. The connector kit according to claim 5, It is characterized in that The housing has a rotationally asymmetric shape when viewed from a direction in which a connector of a communication partner is fitted.

7. The connector kit according to claim 6, It is characterized in that Some of the plurality of connectors and the remaining connectors are mounted on the substrate in parallel in opposite directions.

8. A connector, which is gathered by a cover and reflow mounted on a substrate, It is characterized in that have: a plurality of slots extending in one direction and separated by partition walls; a bottom portion, which becomes the bottom portion of the connector; two first wall portions, which are opposite to each other in a direction perpendicular to the slot in a manner of surrounding the slot; as well as Two second wall portions are disposed opposite to each other in a direction parallel to the slot so as to surround the slot. A circular hole is provided on one of the two first wall portions, which is engaged with the positioning pin of the cover. The other of the two first wall portions is provided with a long hole engaged with the positioning long pin of the cover, and the long hole is a long hole open to the other side. When the cover expands together with the connector, the long positioning pin embedded in the long hole moves toward the other side in the long hole.

9. A connector kit comprising a plurality of connectors according to any one of claims 1 to 7 and covers mounted on the connectors when the connectors are reflow mounted on a substrate, It is characterized in that The cover is in the shape of a box having an opening for receiving and holding the connector. A suction sheet is suctioned onto the surface of the plurality of covers on the side opposite to the opening.

10. The connector kit according to claim 9, It is characterized in that A dividing slit is formed between adjacent ones of the connectors.

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