Air guide member, test device unit, test device, socket for electrical component, and test device having a plurality of sockets for electrical components
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ENPLAS CORP
- Filing Date
- 2020-12-24
- Publication Date
- 2026-06-26
AI Technical Summary
In the prior art, heat sinks are manufactured by metal cutting, resulting in high costs, and additional rotating components are required when removing IC sockets and inserting IC packages, further increasing costs.
By employing an air guide component, through-holes are formed in the main body of the plate-shaped air guide component to guide the airflow of the air supply component to the electrical component via the socket side. The through-hole design makes the air velocity on the outlet side faster than that on the inlet side, forming a vortex-shaped airflow to improve cooling efficiency.
While controlling costs, it effectively cools electrical components, avoiding the use of radiators and additional components, thus improving cooling efficiency.
Smart Images

Figure CN114746761B_ABST