Display panel and display device

Abstract

The present invention provides a display panel and a display device. The display panel includes a substrate, the substrate has a display area, a binding area and a cutting line area, the binding area is provided with a plurality of binding terminals, the cutting line area is provided with a plurality of connecting wires, and the connecting wires are used to connect the binding terminals and test terminals; the connecting wires include: a first metal layer; the binding terminal includes: a second metal layer, located on a side of the first metal layer away from the substrate, and connected to the first metal layer; a third metal layer, located on a side of the second metal layer away from the first metal layer, and connected to the second metal layer; a planarization layer, covering both side edge areas of the third metal layer in a first direction, the first direction being perpendicular to the extension direction of the connecting wires; at the overlapping position of the connecting wires and the binding terminals, the line width of the first metal layer is smaller than the line width of the third metal layer, and the orthographic projection of the first metal layer on the substrate is located within the orthographic projection area of ​​the third metal layer on the substrate.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] AMOLED (Active Matrix Organic Light Emitting Diode) display panels have the advantages of self-luminescence, wide color gamut, high contrast, flexibility, high response, etc., and have broad application prospects. For a whole AMOLED display panel motherboard, it is necessary to first perform a cutting process along the EAC (EVEN After Cell) cutting line to cut the AMOLED display panel motherboard into multiple small AMOLED display panels, and then perform a lighting test on each AMOLED display panel. After the lighting test is completed, it is cut along the MDL (Module) cutting line on the AMOLED display panel to cut off the ET (Electrical Test) pad (terminal).

[0003] In the MDL cutting line area, connection traces are set up to connect the electrical test terminals and the PCB binding terminals (pads). At the overlap position of the PCB binding terminals and the connection traces, the upper metal of the PCB binding terminals is higher, and the planarization layer used to cover the upper side will become thinner due to metal reflection and other effects during the exposure and development process, resulting in the upper metal side being exposed, which will bring adverse effects. Summary of the invention

[0004] The embodiments of the present invention provide a display panel and a display device, which are used to solve the problem that the upper metal layer of the circuit board binding terminal is higher at the overlap position of the circuit board binding terminal and the connection wiring, causing the upper metal side to be exposed, thereby causing defects.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0006] In a first aspect, an embodiment of the present invention provides a display panel, including a substrate substrate, wherein the substrate substrate has a display area, a binding area located on one side of the display area, and a cutting line area located on a side of the binding area away from the display area, wherein the binding area is provided with a plurality of binding terminals, and the cutting line area is provided with a plurality of connecting wires, wherein the connecting wires are used to connect the binding terminals and the test terminals;

[0007] The connecting trace comprises: a first metal layer, disposed on the substrate;

[0008] The binding terminal comprises:

[0009] a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate and connected to the first metal layer;

[0010] A third metal layer, the third metal layer is disposed on a side of the second metal layer away from the first metal layer and connected to the second metal layer; and

[0011] A planarization layer filling the area between two adjacent binding terminals and covering a portion of the surface of the third metal layer;

[0012] Among them, at the overlapping position of the connecting trace and the binding terminal, the line width of the first metal layer in the first direction is smaller than the line width of the third metal layer in the first direction, and the orthographic projection of the first metal layer on the base substrate is located within the orthographic projection area of ​​the third metal layer on the base substrate, and the first direction is perpendicular to the extension direction of the connecting trace.

[0013] Optionally, at the overlapping position of the connecting trace and the binding terminal, the orthographic projection of the boundary of the second metal layer in the first direction on the substrate is located between the orthographic projection of the boundary of the third metal layer on the same side in the first direction on the substrate and the orthographic projection of the boundary of the first metal layer on the same side in the first direction on the substrate.

[0014] Optionally, at the overlapping position of the connecting trace and the binding terminal, the line width of the second metal layer in the first direction is smaller than the line width of the first metal layer in the first direction, and the orthographic projection of the second metal layer on the base substrate is located within the orthographic projection area of ​​the first metal layer on the base substrate.

[0015] Optionally, at the overlapping position of the connecting trace and the binding terminal, the orthographic projection of the boundary of the second metal layer in the first direction on the base substrate coincides with the orthographic projection of the boundary of the third metal layer on the same side in the first direction on the base substrate.

[0016] Optionally, at the overlapping position of the connecting trace and the binding terminal, the line width of the third metal layer in the first direction is smaller than the line width of the second metal layer in the first direction, and the orthographic projection of the boundary of the third metal layer in the first direction on the substrate is located within the orthographic projection area of ​​the same side boundary of the second metal layer in the first direction on the substrate.

[0017] Optionally, in the cutting line region, a line width of at least a portion of the connecting line in the first direction is greater than a line width of the connecting line in the first direction at a overlapping position of the connecting line with the binding terminal.

[0018] Optionally, the first metal layer is provided in the same layer and with the same material as the gate of the display panel, and the first metal layer includes Mo metal.

[0019] Optionally, the second metal layer is provided in the same layer and with the same material as the source and drain of the display panel, and the second metal layer comprises a Ti—Al—Ti film layer structure.

[0020] Optionally, the third metal layer is provided in the same layer and with the same material as the source-drain connection line of the display panel, and the third metal layer comprises a Ti—Al—Ti film layer structure.

[0021] Optionally, the binding terminal further includes:

[0022] The touch metal layer is located on a side of the third metal layer away from the first metal layer and is connected to the third metal layer.

[0023] Optionally, the film layer structure at the overlapping position of the connecting wire and the binding terminal further includes:

[0024] A first insulating layer is located on a side of the first metal layer away from the base substrate; wherein the second metal layer is connected to the first metal layer through a via hole on the first insulating layer;

[0025] A second insulating layer is located on a side of the second metal layer away from the base substrate; wherein the third metal layer is connected to the second metal layer through a via hole on the second insulating layer;

[0026] The third insulating layer is located on a side of the planarization layer away from the base substrate, and covers the planarization layer; wherein the touch metal layer is located on a side of the third insulating layer away from the base substrate.

[0027] In a second aspect, an embodiment of the present invention provides a display device, comprising the display panel described in the first aspect.

[0028] In an embodiment of the present invention, at the overlapping position of the binding terminal and the connecting wire of the display panel, the connecting wire is retracted so that the third metal layer of the binding terminal at the overlapping position is at a lower position. The planarization layer can completely protect the side of the third metal layer to avoid the side of the third metal layer being exposed and not being affected by subsequent etching processes, thereby improving product yield and reliability performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Moreover, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0030] Figure 1 A schematic diagram of a display panel after EAC cutting;

[0031] Figure 2 A top view of the area near the junction of the circuit board binding terminal and the Gate1 metal trace;

[0032] Figure 3A Ideally Figure 2 A schematic cross-sectional view at A1-A2 in FIG.

[0033] Figure 3B For actual situation Figure 2 A schematic cross-sectional view at A1-A2 in FIG.

[0034] Figure 4 A schematic diagram of divided areas of a display panel after MDL cutting according to an embodiment of the present invention;

[0035] Figure 5 A schematic diagram of the local structure of the display panel before MDL cutting;

[0036] Figure 6 for Figure 5 An enlarged schematic diagram of the dotted box X1 in FIG.

[0037] Figure 7 for Figure 6 An enlarged schematic diagram of the dotted box X2 in FIG.

[0038] Figure 8 for Figure 7 A schematic cross-sectional view along A3-A4 in FIG.

[0039] Fig. 9 Another schematic diagram of the connection wiring and the bonding terminal of the display panel according to the embodiment of the present invention at the overlapping position;

[0040] Fig.10 for Fig. 9 A schematic cross-sectional view along A5-A6 in FIG.

[0041] Fig.11 It is another schematic diagram of the connection wiring and the overlapping position of the binding terminal of the display panel according to the embodiment of the present invention;

[0042] Fig.12 for Fig.11A schematic cross-sectional view along A7-A8 in FIG.

[0043] Fig.13 It is another schematic diagram of the connection wiring and the overlapping position of the binding terminal of the display panel according to the embodiment of the present invention;

[0044] Fig.14 for Fig.13 Schematic diagram of the cross section along A9-A10 in . DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] A large display panel template includes multiple small display panels. After the display panel process is completed, the display panel template needs to be cut into multiple small display panels along the EAC cutting line. Please refer to Figure 1 , Figure 1 The schematic diagram of the display panel after EAC cutting is shown in FIG. 1 . Each small display panel includes a display area, a binding area, a cutting line area, and an area where a test (ET) terminal is located. The test terminal is connected to a binding terminal (not shown) in the binding area through a connecting line (not shown) on the cutting line area, thereby completing the lighting test. After the lighting test is completed, the display panel is cut along the MDL cutting line to cut off the area where the test terminal is located.

[0047] The connection traces usually use a single layer of Gate 1 metal. The resistance of Gate 1 metal is relatively large. Therefore, the line width of Gate 1 metal traces in the MDL cutting line area will be increased as much as possible to avoid resistance mutations and thus large current burns during the EAC Aging process. That is, the line width of Gate 1 metal traces is greater than the line width of the circuit board binding terminal. The circuit board binding terminal usually includes multiple layers of stacked metal, such as SD (source and drain) 1 and SD2.

[0048] Please refer to Figure 2 , Figure 3A and Figure 3B , Figure 2 This is a top view of the area near the junction of the circuit board binding terminal and the Gate1 metal trace. Figure 2It can be seen that at the overlap position of the circuit board binding terminal and the Gate1 metal trace 11, the Gate1 metal trace 11 has been widened, and the SD1 layer 12 of the circuit board binding terminal is also widened accordingly, so as to be connected to the Gate1 metal trace 11 through the via hole on the ILD (interlayer dielectric layer) layer. Generally, in order to ensure the bonding effect and avoid short circuit, the line width of the SD2 layer 13 will not be changed at will. This design will cause the boundary of the SD2 layer 13 to be above the Gate1 metal trace 11. The SD2 layer 13 is higher in terrain. During the exposure and development process of the PLN layer, it will become thinner due to the influence of metal reflection, resulting in the side of the SD2 layer 13 being exposed. See Figure 3B The area enclosed by the dotted ellipse.

[0049] In the subsequent Anode wet etching process, there are a large number of Ag ions in the acid etching solution. The acid etching solution reacts with the exposed SD2 layer metal and replaces Ag (see Figure 3B ), which will cause the following two problems: (1) During the subsequent process of flushing, Ag particles will enter the display area (AA area) and form dark spots; (2) During the reliability process, the residual Ag will migrate under the condition of voltage difference driven by the electric field, resulting in a short circuit between the binding terminals of two adjacent circuit boards, causing no display or abnormal display, thereby reducing the product yield.

[0050] To solve the above problems, an embodiment of the present invention provides a display panel. Figure 4 The display panel includes a base substrate 20, wherein the base substrate 20 has a display area, a binding area located at one side of the display area, and a cutting line area located at a side of the binding area away from the display area. Figure 5 , the binding area is provided with a plurality of binding terminals B1, the cutting line area is provided with a plurality of connecting wires L, and the connecting wires L are used to connect the binding terminals B1 and the test terminals B2; Figure 5 It is a schematic diagram of the structure of the display panel before MDL cutting. The display panel also includes: a test terminal area, on which a plurality of test terminals B2 are arranged. In an embodiment of the present invention, the binding terminal is used to bind a circuit board, such as an FPC (Flexible Printed Circuit) or a COF (Chip On Film). The test terminal is used for lighting test.

[0051] Please refer to Figure 6 , Figure 7 and Figure 8 , the connecting trace L comprises: a first metal layer 21, disposed on the base substrate 20;

[0052] The binding terminal B1 includes:

[0053] A second metal layer 23, the second metal layer 23 is located on a side of the first metal layer 21 away from the base substrate 20, and is connected to the first metal layer 21;

[0054] A third metal layer 25, the third metal layer 25 is disposed on a side of the second metal layer 23 away from the first metal layer 21 and connected to the second metal layer 23; and

[0055] A planarization layer 26 fills the area between two adjacent binding terminals B1 and covers a portion of the surface of the third metal layer 25;

[0056] Among them, at the overlapping position of the connecting line L and the binding terminal B1, the line width of the first metal layer 21 in the first direction is smaller than the line width of the third metal layer 25 in the first direction, and the orthographic projection of the first metal layer 21 on the base substrate 20 is located within the orthographic projection area of ​​the third metal layer 25 on the base substrate, and the first direction is perpendicular to the extension direction of the connecting line L.

[0057] In the embodiment of the present invention, the overlapping position of the connecting trace L and the binding terminal B1 includes direct contact and indirect contact between the first metal layer 21 and the second metal layer 23, and the indirect contact refers to contact through the overlapping hole on the insulating layer between the two metal layers.

[0058] In an embodiment of the present invention, at the overlapping position of the binding terminal and the connecting wire of the display panel, the connecting wire is retracted so that the third metal layer of the binding terminal at the overlapping position is at a lower position. The planarization layer can completely protect the side of the third metal layer to avoid the side of the third metal layer from being exposed and not being affected by the subsequent etching process. It can effectively avoid Ag precipitation, reduce dark spots and abnormal display or no display caused by Ag during the high temperature and high humidity reliability process, and improve product yield and reliability performance.

[0059] In some embodiments of the present invention, optionally, please refer to Figure 8 At the overlapping position of the connecting trace L and the binding terminal B1, the orthographic projection of the boundary of the second metal layer 23 in the first direction on the base substrate 20 is located between the orthographic projection of the boundary of the third metal layer 25 on the same side in the first direction on the base substrate and the orthographic projection of the boundary of the first metal layer 21 on the same side in the first direction on the base substrate.

[0060] In some other embodiments of the present invention, optionally, please refer to Fig. 9 and Fig.10At the overlapping position of the connecting line L and the binding terminal B1, the line width of the second metal layer 23 in the first direction is smaller than the line width of the first metal layer 21 in the first direction, and the orthographic projection of the second metal layer 23 on the base substrate 20 is located within the orthographic projection area of ​​the first metal layer 21 on the base substrate 20.

[0061] In some other embodiments of the present invention, optionally, please refer to Fig.11 and Fig.12 , at the overlapping position of the connecting line L and the binding terminal B1, the line width of the third metal layer 25 in the first direction is smaller than the line width of the second metal layer 23 in the first direction, and the orthographic projection of the boundary of the third metal layer 25 in the first direction on the base substrate 20 is located within the orthographic projection area of ​​the same side boundary of the second metal layer 23 in the first direction on the base substrate 20. In some other embodiments of the present invention, optionally, please refer to Fig.13 and Fig.14 At the overlapping position of the connecting line L and the binding terminal B1, the orthographic projection of the boundary of the second metal layer 23 in the first direction on the base substrate 20 coincides with the orthographic projection of the boundary of the third metal layer 25 on the same side in the first direction on the base substrate 20.

[0062] It should be noted that the above Figure 8 , Fig.10 , Fig.12 and Fig.14 The cross-sectional view shows only a portion of the display panel, not the entire panel.

[0063] In the above embodiments, at the overlapping position of the binding terminal and the connecting wire of the display panel, the connecting wire is retracted so that the third metal layer of the binding terminal at the overlapping position is at a lower position.

[0064] In the embodiment of the present invention, please refer to Figure 7 In the cutting line area, the line width of at least part of the connecting line L in the first direction is greater than the line width of the connecting line L in the first direction at the overlapping position with the binding terminal B1, that is, the connecting line is retracted at the overlapping position, and the line width can be increased when it exceeds the overlapping position, so as to ensure that the connecting line is wide enough, thereby avoiding a sudden change of resistance at the connecting line position.

[0065] In the embodiment of the present invention, optionally, the first metal layer is provided in the same layer and the same material as the gate layer of the display panel, and is formed by a single patterning process with the gate. The first metal layer includes Mo (molybdenum) metal, and the reason for using Mo metal is that compared with the Ti-Al-Ti (titanium-aluminum-titanium) structure used in SD, Mo metal has lower activity and is not easily damaged or corroded during the cutting process.

[0066] In the embodiment of the present invention, optionally, the second metal layer is provided with the same layer and the same material as the source and drain of the display panel, and is formed by a single patterning process. The second metal layer includes a Ti-Al-Ti film layer structure.

[0067] In the embodiment of the present invention, optionally, the third metal layer is provided in the same layer and the same material as the source-drain connection line of the display panel, and is formed by a single patterning process. The third metal layer includes a Ti-Al-Ti film layer structure. For example, in some embodiments, the source-drain may be referred to as the SD1 metal layer, and the source-drain connection line may be referred to as the SD2 metal layer.

[0068] In the embodiment of the present invention, please refer to Figure 8 Optionally, the binding terminal B1 further includes: a touch metal layer 28, which is located on a side of the third metal layer 25 away from the first metal layer 21 and connected to the third metal layer 25, thereby further reducing the resistance of the binding terminal B1.

[0069] In the embodiment of the present invention, please refer to Figure 8 The film layer structure at the overlapping position of the connecting wire L and the binding terminal B1 specifically includes:

[0070] The substrate 20;

[0071] The first metal layer 21;

[0072] A first insulating layer 22 is located on a side of the first metal layer 21 away from the base substrate 20; In the embodiment of the present invention, the first insulating layer 22 may be an interlayer dielectric layer (ILD) layer + a gate insulating layer (GI2 layer);

[0073] The second metal layer 23 is located on a side of the first insulating layer 22 away from the base substrate 20 , and the second metal layer 23 is connected to the first metal layer 21 through a via hole on the first insulating layer 22 ;

[0074] The second insulating layer 24 is located on a side of the second metal layer 23 away from the base substrate 20 . In the embodiment of the present invention, the second insulating layer 24 may be a passivation layer (PVX).

[0075] The third metal layer 25 is located on a side of the second insulating layer 24 away from the base substrate 20 , and the third metal layer 25 is connected to the second metal layer 23 through a via hole on the second insulating layer 24 ;

[0076] A planarization layer 26, filling the area between two adjacent binding terminals and covering a portion of the surface of the third metal layer 25;

[0077] a third insulating layer 27, located on a side of the planarization layer 26 away from the base substrate 20, and covering the planarization layer 26;

[0078] The touch metal layer 28 is located on a side of the third insulating layer 27 away from the base substrate 20 , and is connected to the third metal layer 25 .

[0079] The display panel in the embodiment of the present invention may be an OLED display panel, and of course, other types of display panels are not excluded.

[0080] The display area of ​​the display panel is provided with a light-emitting device and a driving circuit for driving the light-emitting device to emit light, the driving circuit includes at least one thin film transistor (TFT), and the thin film transistor includes a gate, a gate insulating layer, an active layer, an interlayer dielectric layer (ILD), a source and a drain.

[0081] In some embodiments, the first metal layer in the above embodiments may be provided at the same layer and with the same material as the gate electrode in the thin film transistor.

[0082] In some embodiments, the second metal layer in the above embodiments can be provided in the same layer and with the same material as the source and drain in the thin film transistor.

[0083] In some embodiments, the display panel further includes source-drain connection lines, wherein the source-drain is called SD1 metal layer, and the source-drain connection line is called SD2 metal layer. The third metal layer in the above embodiment can be set in the same layer and material as the source-drain connection line.

[0084] The first insulating layer in the above embodiment may include one layer, for example, it may be an interlayer dielectric layer or a gate insulating layer of the display panel. The first insulating layer may also include two or more layers, for example, an interlayer dielectric layer and a gate insulating layer, wherein the gate insulating layer is located between the gate and the active layer, and the interlayer dielectric layer is located between the active layer and the source and drain.

[0085] An embodiment of the present invention further provides a display device, comprising the display panel in any one of the above embodiments.

[0086] The display device may be a display device such as a mobile phone, a tablet computer, a personal computer or a television.

[0087] In an embodiment of the present invention, at the overlapping position of the binding terminal and the connecting wire of the display panel of the display device, the connecting wire is retracted so that the third metal layer of the binding terminal at the overlapping position is at a lower position. The planarization layer can completely protect the side of the third metal layer to avoid the side of the third metal layer from being exposed and not being affected by the subsequent etching process. Ag precipitation can be effectively avoided, and dark spots and abnormal display or no display caused by Ag during the high temperature and high humidity reliability process can be reduced, thereby improving the product yield and reliability performance of the display device.

[0088] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A display panel, comprising a base substrate, wherein the base substrate has a display area, a binding area located at one side of the display area, and a cutting line area located at a side of the binding area away from the display area, characterized in that: The binding area is provided with a plurality of binding terminals, and the cutting line area is provided with a plurality of connecting wires, and the connecting wires are used to connect the binding terminals and the test terminals; The connecting trace comprises: a first metal layer, disposed on the substrate; The binding terminal comprises: a second metal layer, the second metal layer being located on a side of the first metal layer away from the substrate and connected to the first metal layer; A third metal layer, the third metal layer is disposed on a side of the second metal layer away from the first metal layer and connected to the second metal layer; and a planarization layer, the planarization layer filling the area between two adjacent binding terminals and covering a portion of the surface of the third metal layer; Among them, at the overlapping position of the connecting trace and the binding terminal, the line width of the first metal layer in the first direction is smaller than the line width of the third metal layer in the first direction, and the orthographic projection of the first metal layer on the base substrate is located within the orthographic projection area of ​​the third metal layer on the base substrate, and the first direction is perpendicular to the extension direction of the connecting trace.

2. The display panel according to claim 1, wherein: At the overlapping position of the connecting trace and the binding terminal, the orthographic projection of the boundary of the second metal layer in the first direction on the substrate is located between the orthographic projection of the boundary of the third metal layer on the same side in the first direction on the substrate and the orthographic projection of the boundary of the first metal layer on the same side in the first direction on the substrate.

3. The display panel according to claim 2, wherein: At the overlapping position of the connecting trace and the binding terminal, the line width of the second metal layer in the first direction is smaller than the line width of the first metal layer in the first direction, and the orthographic projection of the second metal layer on the base substrate is located within the orthographic projection area of ​​the first metal layer on the base substrate.

4. The display panel according to claim 1, wherein: At the overlapping position of the connecting trace and the binding terminal, the orthographic projection of the boundary of the second metal layer in the first direction on the base substrate coincides with the orthographic projection of the boundary of the third metal layer on the same side in the first direction on the base substrate.

5. The display panel according to claim 1, wherein: At the overlapping position of the connecting trace and the binding terminal, the line width of the third metal layer in the first direction is smaller than the line width of the second metal layer in the first direction, and the orthographic projection of the boundary of the third metal layer in the first direction on the substrate is located within the orthographic projection area of ​​the same side boundary of the second metal layer in the first direction on the substrate.

6. The display panel according to claim 1, wherein: In the cutting line region, a line width of at least a portion of the connecting line in the first direction is greater than a line width of the connecting line in the first direction at a position where the connecting line overlaps the binding terminal.

7. The display panel according to claim 1, wherein: The first metal layer is provided in the same layer and with the same material as the gate electrode of the display panel, and the material of the first metal layer includes Mo metal.

8. The display panel according to claim 1, wherein: The second metal layer is provided in the same layer and with the same material as the source and drain electrodes of the display panel, and the second metal layer comprises a Ti-Al-Ti film layer structure.

9. The display panel according to claim 1, wherein: The third metal layer is provided in the same layer and with the same material as the source-drain connection line of the display panel, and the third metal layer comprises a Ti-Al-Ti film layer structure.

10. The display panel according to any one of claims 1 to 9, characterized in that: The binding terminal also includes: The touch metal layer is located on a side of the third metal layer away from the first metal layer and is connected to the third metal layer.

11. The display panel according to claim 10, wherein: The film layer structure at the overlapping position of the connecting wire and the binding terminal also includes: A first insulating layer is located on a side of the first metal layer away from the base substrate; wherein the second metal layer is connected to the first metal layer through a via hole on the first insulating layer; A second insulating layer is located on a side of the second metal layer away from the base substrate; wherein the third metal layer is connected to the second metal layer through a via hole on the second insulating layer; The third insulating layer is located on a side of the planarization layer away from the base substrate, and covers the planarization layer; wherein the touch metal layer is located on a side of the third insulating layer away from the base substrate.

12. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-11.

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