Miniature distribution box and method for manufacturing a miniature distribution box using a dedicated electronic packaging technique

Abstract

A miniature power distribution box is provided, comprising: a device having a substrate, a first finger, a second finger, and an electrical component, the first and second fingers having a first portion, a second portion, and a third portion, the substrate being overmolded to the first portion of the first and second fingers, the substrate not being overmolded to the second portion or the third portion of the first and second fingers, the second portion of the first and second fingers extending outwardly from the substrate, the third portion of the first and second fingers being exposed via at least one aperture disposed through the substrate, the electrical component being directly mounted to the third portion of the first and second fingers so as to electrically connect the electrical component to each of the first finger and the second finger; a connector / housing configured to receive the device therein and configured to connect to a mating connector; and a cover configured to be secured to the connector / housing in a manner that prevents the device from being removed from the connector / housing.

Description

[0001] This application is a divisional application of the invention patent application of Morales Ltd. (filed on July 5, 2017, application number 201780042212.8, entitled "Miniature power distribution box and method for manufacturing miniature power distribution box using dedicated electronic packaging technology").

[0002] Related applications

[0003] This application claims priority to U.S. Provisional Patent Application No. 62 / 359,275, filed July 7, 2016, which is incorporated herein by reference in its entirety. Technical Field

[0004] This invention relates to electronic devices and the manufacture of such devices. More specifically, this invention relates to miniature power distribution boxes and the manufacture of miniature power distribution boxes using application-specific electronics packaging (ASP) technology. Background Technology

[0005] Molded interconnect devices (“MIDs”) are three-dimensional manufactured parts that typically consist of plastic components and electronic circuit traces. A plastic substrate or housing is created, and electrical circuitry and devices are plated, layered, or embedded onto the substrate. MIDs generally have fewer parts than conventionally manufactured devices, saving space and weight. Applications of MIDs include mobile phones, ATMs, automotive steering wheel components, RFID components, lighting devices, medical devices, and many consumer products.

[0006] Currently, the processes used to manufacture MIDs include two-shot molding and laser-direct molding (LDS). Two-shot molding involves using two separate plastic parts, typically one plated and one non-plated. The plated part forms the circuitry, while the non-plated part performs the mechanical function and is molded. The two parts are fused together, and the circuitry is created using electroless plating. The plated plastic is metallized, while the non-plated plastic remains non-conductive. In contrast, LDS involves an injection molding step, a laser activation step of the plastic material, and then a metallization step. The laser etches a wiring pattern onto the part, preparing it for metallization. Using LDS, only a single thermoplastic material is required, making the molding step a one-shot process.

[0007] However, there is a need for improved systems and processes to rapidly and efficiently manufacture three-dimensional structures that can incorporate a combination of multiple devices. In particular, there is a need to incorporate electronic packaging into a smaller space to include more features operating at higher speeds while utilizing less power and reducing heat, all at the cost of lower manufacturing costs.

[0008] An example of the need for improved systems and processes for rapidly and efficiently manufacturing three-dimensional structures is the fabrication of micro power distribution boxes (PDBs). A micro PDB is a reduced-size module typically used to control electrical power within next-generation vehicles—whether automotive, commercial, structural, or otherwise. As vehicles become increasingly "electrified," the need for power control increases. Distributing the ability to control power minimizes cabling, power losses, and overall cost compared to performing all control from a centralized location.

[0009] One of the most significant challenges in designing a miniature PDB is handling the heat generated within the module due to the very high currents the system must carry. To handle 50 amps or higher, which are typically required to be controlled, very large contacts are employed. These contacts are often soldered to a printed circuit board (PCB), which is fabricated with thick traces (up to 5 ounces of copper (0.2 mm thick)). The reason for using these very thick traces and contacts is that the "resistive heat" associated with high-current connections is calculated by multiplying the square of the current carried by the resistance in the current path. In fact, a 50-amp current carried in one path, along with a 10 milliohm resistance, generates 25 watts of heat.

[0010] Therefore, there is a need for an improved micro PDB and an improved method for manufacturing micro PDBs. Summary of the Invention

[0011] A first preferred embodiment of the present invention provides a miniature power distribution box, comprising a connector, a housing, and a device formed by a dedicated electronic packaging manufacturing process. The housing is fixed to the connector. The device has a substrate, at least one finger, and at least one electrical component. The substrate is fixed to the connector. The substrate has at least one opening disposed therethrough. The substrate is overmolded onto a first portion of the at least one finger. The at least one opening of the substrate exposes a second portion of the at least one finger. The at least one electrical component is electrically connected to the second portion of the at least one finger through the at least one opening of the substrate.

[0012] The at least one electrical component in the first preferred embodiment of the micro power distribution box is preferably a high-power field-effect transistor, an internal microprocessor, or a relay and a fuse.

[0013] The device in the first preferred embodiment of the micro power distribution box preferably has a first finger and a second finger. Both the first and second fingers have a third portion. The substrate is not overmolded over the third portions of the first and second fingers. The third portions extend outward from the substrate. The third portion of the first finger may be a high-current contact or a contact pin. When the third portion of the first finger is a contact pin, the second finger does not have a second portion exposed through the at least one opening in the substrate.

[0014] The dedicated electronic packaging manufacturing process for the device of the first preferred embodiment of the micro power distribution box preferably includes the following steps: forming a continuous strip having a plurality of lead frames, each lead frame defining an opening and having at least one finger extending into the opening; overmolding a substrate on the finger of each lead frame; electrically connecting the at least one electrical component to the at least one finger of each lead frame to form a plurality of devices; and individualizing each of the plurality of devices from the continuous strip.

[0015] The substrate of the first preferred embodiment of the micro power distribution box is preferably formed of a thermally conductive liquid crystal polymer.

[0016] A second preferred embodiment of the present invention provides a miniature power distribution box, which is manufactured by a process comprising the following steps: forming a continuous strip having a plurality of lead frames, each lead frame defining an opening and having a plurality of fingers extending into the opening; overmolding a substrate onto the plurality of fingers of each lead frame; electrically connecting an electrical component to at least one of the plurality of fingers of each lead frame to form a plurality of devices, each device having at least one electrical component; individualizing each of the plurality of devices from the continuous strip; securing the devices to a connector; and securing a housing to the connector.

[0017] In the second preferred embodiment of the micro power distribution box, the at least one electrical component is preferably a high-power field-effect transistor, an internal microprocessor, or a relay and a fuse.

[0018] The substrate of the second preferred embodiment of the micro power distribution box is preferably formed of a thermally conductive liquid crystal polymer.

[0019] A third preferred embodiment of the present invention provides a method for forming a miniature power distribution box, the method comprising the steps of: forming a continuous strip having a plurality of lead frames, each lead frame defining an opening and having a plurality of fingers extending into the opening; overmolding a substrate on the plurality of fingers of each lead frame, each substrate having at least one opening disposed therethrough, exposing at least a portion of one of the plurality of fingers; electrically connecting an electrical component via the at least one opening of the substrate to the exposed portion of the fingers of each lead frame to form a plurality of devices, each device having at least one electrical component; individualizing each of the plurality of devices from the continuous strip; securing the device to a connector; and securing a housing to the connector.

[0020] A fourth preferred embodiment of the present invention provides a miniature power distribution box, comprising: a device formed by a dedicated electronic packaging manufacturing process; and a housing. The device has a substrate, at least one finger, and at least one electrical component. The substrate is formed as a connector. The substrate has at least one opening disposed therethrough. Each finger has an opening disposed therethrough. The substrate is overmolded over at least a portion of the at least one finger, whereby the at least one opening of the substrate is aligned with a corresponding opening of the at least one finger. The at least one electrical component is electrically connected to the at least one finger through the at least one opening of the substrate. The housing is fixed to the connector.

[0021] The at least one electrical component in the fourth preferred embodiment of the micro power distribution box is preferably a high-power field-effect transistor or an internal microprocessor.

[0022] The substrate of the fourth preferred embodiment of the micro power distribution box is preferably formed of a thermally conductive liquid crystal polymer.

[0023] In the fourth preferred embodiment of the micro power distribution box, at least one finger has a high-current contact portion. The substrate is not overmolded onto the high-current contact portion of the at least one finger.

[0024] The dedicated electronic packaging manufacturing process for the device of the fourth preferred embodiment for forming the micro power distribution box includes the following steps: forming a continuous strip having a plurality of lead frames, each lead frame defining an opening and having at least one finger extending into the opening; overmolding a substrate on the finger of each lead frame; electrically connecting at least one electrical component to the at least one finger of each lead frame to form a plurality of devices; and individualizing each of the plurality of devices from the continuous strip.

[0025] A fifth preferred embodiment provides a miniature power distribution box fabricated by a process comprising the steps of: forming a continuous strip having a plurality of lead frames, each lead frame defining an opening and having at least one finger extending into the opening; overmolding a substrate onto the finger of each lead frame, the substrate forming a connector; electrically connecting at least one electrical component to the at least one finger of each lead frame to form a plurality of devices, each device having at least one electrical component, the at least one electrical component including a high-power field-effect transistor; individualizing each of the plurality of devices from the continuous strip; and securing a housing to the connector.

[0026] The substrate of the fifth preferred embodiment of the micro power distribution box is preferably formed of a thermally conductive liquid crystal polymer.

[0027] A sixth preferred embodiment provides a method for forming a miniature power distribution box, the method comprising the steps of: forming a continuous strip having a plurality of lead frames, each lead frame defining an opening and having at least one finger extending into the opening; overmolding a substrate on the finger of each lead frame, the substrate being formed as a connector, each substrate having at least one opening disposed therethrough exposing a portion of the at least one finger; electrically connecting at least one electrical component via the at least one opening of the substrate to the at least one finger of each lead frame to form a plurality of devices, each device having at least one electrical component, the at least one electrical component including a high-power field-effect transistor; individualizing each of the plurality of devices from the continuous strip; and securing a housing to the connector.

[0028] A seventh preferred embodiment provides a miniature power distribution box including a device, a connector / housing, and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to each other. The at least one first finger has a first portion, a second portion, and a third portion. The at least one second finger has a first portion and a second portion. The substrate is overmolded onto the first portion of the at least one first and second finger. The substrate is not overmolded onto the second portion of the at least one first and second finger or not overmolded onto the third portion of the at least one first finger. The second portion of the at least one first and second finger extends outwardly from the substrate. The second portion of the at least one first finger is a high-current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an opening configured to pass through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger to electrically connect the at least one electrical component to the at least one first finger. The connector / housing is configured to house the device therein and is configured to connect to a mating connector. The cover is configured to secure the device to the connector / housing in a manner that prevents the device from being removed from the connector / housing.

[0029] In the seventh preferred embodiment of the miniature power distribution box, the at least one electrical component is preferably a high-power field-effect transistor or an internal microprocessor.

[0030] In the seventh preferred embodiment of the micro power distribution box, the substrate is preferably formed of a thermally conductive liquid crystal polymer.

[0031] The device in the seventh preferred embodiment of the miniature power distribution box is preferably formed by a dedicated electronic packaging manufacturing process.

[0032] In a seventh preferred embodiment of the micro power distribution box, the at least one first finger and the at least one second finger are preferably electrically connected to each other via a busbar. The substrate is preferably overmolded onto the busbar.

[0033] The seventh preferred embodiment of the miniature power distribution box preferably further includes: a gasket fixed between the cover and the connector / housing. Attached Figure Description

[0034] Figure 1 It is a flow chart illustrating the steps of an embodiment of an ASEP manufacturing process;

[0035] Figure 2This is a flow diagram of the steps of this embodiment of the ASEP manufacturing process;

[0036] Figures 2A to 2K yes Figure 2 Enlarged views of multiple independent steps in the work diagram;

[0037] Figure 3 This is a cross-sectional view of the miniature power distribution box that the applicant is currently developing;

[0038] Figure 4 This is a work diagram of the steps in forming a first embodiment of a micro power distribution box, wherein the micro power distribution box includes a modified ASEP device formed by a modified ASEP manufacturing process;

[0039] Figure 5 This is a work diagram of the steps in forming a second embodiment of a miniature power distribution box, wherein the miniature power distribution box includes an ASEP device formed by an ASEP manufacturing process;

[0040] Figure 6 This is a work diagram of the steps in forming a third embodiment of a miniature power distribution box, wherein the miniature power distribution box includes an ASEP device formed by an ASEP manufacturing process;

[0041] Figure 7 This is a perspective view of the ASEP device of the third embodiment of the miniature power distribution box;

[0042] Figure 8 yes Figure 7 Another 3D view of the ASEP device;

[0043] Figure 9 This is an exploded perspective view of the third embodiment of the miniature power distribution box;

[0044] Figure 10 This is a perspective view of a connector assembly in an un-mating arrangement, including a third embodiment of the micro power distribution box and a mating connector; and

[0045] Figure 11 yes Figure 10 A 3D view of the connector assembly in a mated state. Detailed Implementation

[0046] This invention relates to improvements in the design and manufacture of micro power distribution boxes (micro PDBs). The micro PDBs of this invention are preferably manufactured using an Application Specific Electronics Packaging (ASEP) system and method. This process is suitable for the creation of a variety of devices, such as printed circuit boards, flexible circuits, connectors, thermal management features, EMI shielding, high-current conductors, RFID devices, antennas, wireless power supplies, sensors, MEMS devices, LEDs, microprocessors and memories, ASICs, passive devices, and other electrical and electromechanical devices. The ASEP manufacturing process has been described and illustrated above in International Application PCT / US16 / 39860, filed June 28, 2016, the disclosure of which is incorporated herein by reference.

[0047] Figure 1 A flowchart of a preferred embodiment of an ASEP manufacturing process 20 for constructing an ASEP device 10 is shown. Figure 2 A working diagram of ASEP manufacturing process 20 is shown, wherein ASEP manufacturing process 20 includes steps A to K. Figures 2A to 2K Enlarged images from steps A to K are provided, in which Figure 2A Step A is shown. Figure 2B Step B is shown, and so on.

[0048] Advantageously, manufacturing process 20 is preferably continuous for reasons of speed and cost. Such as Figure 2 The reel-to-reel technology shown allows the ASEP device 10 to be formed simultaneously with being attached to a carrier web 22. The carrier web 22 is preferably unwound from a first (bulk source) reel (not shown) and, if necessary, collected in a second (rewind) reel (not shown), wherein manufacturing process 20 is performed between the first and second reels. The carrier web 22 has opposite ends 24a, 24b and a middle portion (not shown) spanning the distance between the opposite ends 24a, 24b. The ends 24a, 24b have carrier holes 26 extending through them. The carrier holes 26 allow the carrier web 22 to traverse like a conveyor belt along a production line in a continuous flow. The tape 22 is preferably formed of any desired conductive metal (such as a copper alloy), but the tape 22 may alternatively be formed of a flexible polyimide material, such as a flexible circuit having one or more layers (in some embodiments the flexible material can have four or more layers).

[0049] like Figure 1 , Figure 2 and Figure 2A As shown, manufacturing process 20 begins with step A, which occurs at position A, located between and after the first and second reels. In step A, the middle portion of the strip 22 is stamped (thus removing the unwanted portion of the middle portion of the strip 22) to form a lead frame 28. The lead frame 28 is formed with a desired structure suitable for the formation of the ASEP device 10. Figure 2A As best shown, the lead frame 28 preferably includes ends 24a, 24b (understood to be continuous with the ends 24a, 24b of an adjacent lead frame 28), and a pair of stabilizing portions 30a, 30b (understood to be preferably the stabilizing portion 30a of an adjacent lead frame 28), wherein each stabilizing portion 30a, 30b spans the distance between the opposite ends 24a, 24b (the ends 24a, 24b preferably do not undergo the stamping of step A). ​​The opposite ends 24a, 24b and the stabilizing portions 30a, 30b thus generally form a rectangular frame defining an opening 32 between them. The lead frame 28 also preferably includes a plurality of fingers 34 connected to any one of the opposite ends 24a, 24b and the stabilizing portions 30a, 30b and extending inward into the opening 32. Each finger 34 may have one or more apertures 36 configured to pass through it.

[0050] like Figure 1 , Figure 2 as well as Figure 2B As shown, manufacturing process 20 continues to step B, which occurs at station B, located between the first and second reels and after station A. In step B, a substrate 38 is overmolded onto the plurality of fingers 34 of the lead frame 28. The substrate 38 may have openings 40 disposed therethrough, preferably aligned with openings 36 of the fingers 34. Figure 2B As shown, certain portions 42 of the finger portion 34 are not covered by the substrate 38 and are not connected to either the opposite ends 24a, 24b or the stabilizing portions 30a, 30b. These portions 42 can serve as contact pins for the ASEP device 10 to be formed. The overmolding in step B can be performed using single or double injection molding processes or any other conventional molding process.

[0051] like Figure 1 , Figure 2 and Figure 2CAs shown, manufacturing process 20 continues with step C, which occurs at station C, located between the first and second reels and after station B. In step C, patterning is performed on substrate 38. Patterning provides the formation of one or more patterns 44 (which may be circuit patterns) on the surface of substrate 38. Pattern 44 can be formed by any number of suitable processes, including a laser process, a plasma process (which may be an atmospheric process), a UV process, and / or a fluorination process. Depending on the process used (e.g., plasma, UV, and / or fluorination), patterning may include patterning (i.e., a surface treatment) a large portion (if not all) of the surface of substrate 38. Thus, pattern 44 may be formed on all or almost all of the surface of substrate 38.

[0052] like Figure 1 , Figure 2 and Figure 2D As shown, manufacturing process 20 continues with step D, which occurs at station D, located between the first and second reels and after station C. In step D, a metal layer (typically referred to as a sublayer) is deposited on all or part of the pattern 44 (typically deposited on all of the pattern 44 when the pattern 44 is formed by a laser process, and typically deposited on part of the pattern 44 when the pattern 44 is formed by a plasma, UV, and / or fluorination process) and attached to the substrate 38. This metal layer provides a conductive pattern or trace 46. The trace 46 is also disposed along the walls of the openings 40, 36, thereby electrically connecting the trace 46 to the finger 34 and also electrically connecting the trace 46 to the remainder of the lead frame 28. The deposition of the metal layer can be performed by any suitable process, including a chemical plating process, an inkjet process, a screening process, or an aerosol process. Depending on the process employed, the deposited metal can be formed in any suitable form, including ink or paste. The deposited metal preferably has high conductivity and low binder content to increase its conductivity. The deposited metal also preferably has high chemical stability in plating baths and a viscosity compatible with the desired deposition process. Although not shown, it should be understood that a portion of the plurality of fingers 34 can serve as internal buses for the traces 46 electrically connected to the surface of the substrate 38.

[0053] like Figure 1 , Figure 2 and Figure 2EAs shown, manufacturing process 20 continues with step E, which occurs at station E, located between the first and second reels and after station D. In step E, trace 46 is made conductive (sintered), thereby forming conductive trace 48. The sintering process can be performed by a laser or by rapid heating (rapid heating) or by any other desired process that provides sufficient heat energy, such as to melt particles (e.g., nanometers or micrometers in size) in an ink or paste. Sintering helps ensure that the deposited metal forming trace 46 adheres to the substrate 38 and also ensures that the deposited metal is conductive (because often this is the case where the applied conductivity of the deposited metal is insufficient to apply a voltage potential to trace 46). As can be appreciated, if step D is performed using a chemical plating process, step E is unnecessary because there is no need to sinter the chemical plating.

[0054] It should also be noted that if both steps C and E are performed using lasers, a preferred system and process integrates multiple lasers into a single production station / workstation, thereby saving space in manufacturing process 20 and helping to ensure that the lasers are correctly registered. Additionally, integrating multiple lasers into a single production station / workstation allows for faster material handling.

[0055] like Figure 1 , Figure 2 and Figure 2F As shown, manufacturing process 20 continues with step F, which occurs at station F, located between the first and second reels and after station E. In step F, a voltage potential is applied to lead frame 28 (lead frame 28 is electrically connected to trace 46 / conductive trace 48 via the internal busbar) and subsequently lead frame 28, substrate 38, and trace 46 / conductive trace 48 are exposed to an electroplating bath, where trace 46 / conductive trace 48 is electroplated. The electroplating process not only electroplats trace 46 / conductive trace 48 to form electronic circuit trace 50, but also electroplats lead frame 28 to form an electroplated lead frame 54, which has electroplated fingers 56, and the electroplated fingers 56 have electroplated contact pin portions 58. Step F may involve a single-step plating process (which constructs a single layer of a single material (such as copper)) or a multi-step plating process (which constructs multiple layers of multiple materials (such as a copper layer and a tin layer)). It is understood that other suitable materials may also be used. The increased thickness increases the current carrying capacity, and generally, electroplating processes tend to create a material with high conductivity, thereby improving the performance of the resulting electronic circuit trace 50.

[0056] The trace 46, connected to the internal busbar, enables electroplating of all metals, including copper, nickel, gold, silver, tin, lead, palladium, and other materials. The process of forming the trace 46, connected to the internal busbar and subsequently electroplated, allows for faster metal deposition than known electroless plating processes. Furthermore, compared to many conventional batch processes, the plating process is smoother and less costly when implemented using reel-to-reel technology.

[0057] In other embodiments, techniques such as those encompassed by the Mesoscribe technique can be used to deposit a full-thickness copper (or other conductive material) on a surface. A picosecond laser can then be used to isolate the desired conductive pattern within the conductive material. This approach can be used to replace step F, as described herein, or as an additional step beyond step F if one or more materials are desired to be plated.

[0058] Steps C, D, E, and F can be used to provide good retention of electronic circuit traces 50 to the surface of substrate 38 on a isodiotactic polystyrene (SPS) provided by XAREC.

[0059] like Figure 1 , Figure 2 and Figure 2G As shown, manufacturing process 20 continues with step G, which occurs at station G, located between the first and second reels and after station F. In step G, a solder mask 52 is configured to cover selected portions of the electronic circuit traces 50 and all or substantially all of the exposed surfaces of the substrate 38.

[0060] like Figure 1 , Figure 2 and Figure 2H As shown, manufacturing process 20 continues with step H, which occurs at station H, located between the first and second reels and after station G. In step H, solder paste 54 is stenciled onto the exposed portions of the electronic circuit traces 50 (i.e., those portions not covered by solder resist 52).

[0061] like Figure 1 , Figure 2 and Figure 2IAs shown, manufacturing process 20 continues with step I, which occurs at station I, located between the first and second reels and after station H. In step I, electrical components 86 are positioned on solder paste 54 to electrically connect the electrical components 86 to the electronic circuit trace 50. While the electrical components 86 are positioned on the solder paste 54, a reflow process can subsequently be used to form the ASEP device 10. It should be noted that, alternatively or outside of steps G and H, the electrical components 86 may be wire-bonded to the electronic circuit trace 50.

[0062] like Figure 1 , Figure 2 and Figure 2J As shown, manufacturing process 20 continues with step J, which occurs at station J, located between the first and second reels and after station I. In step J, most of the remaining exposed electroplated fingers 56 connected to the "frame" of the electroplated lead frame 54 are punched / removed, leaving only the necessary number (e.g., two, as shown). Figure 2J The exposed electroplated finger 56 (as shown) remains connected to the "frame" of the electroplated lead frame 54. At this point in time, the formed ASEP device 10 can be electrically tested if necessary.

[0063] like Figure 1 , Figure 2 and Figure 2K As shown, manufacturing process 20 continues with step K, which occurs at station K, located outside the first and second reels. In step K, once the ASEP device 10 is formed, in order for the ASEP device 10 to be used, the ASEP device 10 must be removed from the conveyor belt 22 to individualize the ASEP device 10. After this, the individualized ASEP device 10 can be used as needed, for example, as part of a final assembly (not shown).

[0064] ASEP device 10 enables an integrated device to be formed in a largely additive manner. Because electroplating is a relatively efficient process, a relatively short dwell time of less than 30 minutes, traversing a plating bath in a reciprocating path, is likely sufficient to achieve a complex set of geometry and structure in less than one hour. Of course, adding additional plating layers may increase the overall manufacturing time, but it still provides a significant reduction in total time from start to finish compared to conventional PCB-based processes.

[0065] It should be recognized that in some applications, not all steps A through K will be required. It should also be recognized that in some applications, the order of steps A through K may be appropriately modified. Furthermore, it should be recognized that in some applications, the order of stations A through K may be appropriately modified, and in some applications, some stations A through K may be identical to other stations A through K.

[0066] It should also be noted that although the accompanying drawings only show manufacturing process 20 applied to one side of substrate 38, manufacturing process 20 can be similarly applied to other sides of substrate 38 and to internal layers. It should be noted that the use of a metal strip 22 provides a structure best suited for applications with only two layers other than the metal strip 22 (one layer on each side of substrate 38). If additional layers are required, it has been determined that using a strip 22 formed of a polyimide flexible material may be more advantageous in allowing for the addition of additional internal layers.

[0067] Various embodiments have been described above with reference to ASEP device 10; however, these are only a few examples of devices that can be formed using ASEP technology. With ASEP, connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layered functionality can be directly integrated into a single product.

[0068] Regarding the manufacture of micro PDBs, the applicant is currently developing a micro PDB 60 (which is not entirely or partially formed using ASEP technology) that provides an improvement over existing micro PDBs. The micro PDB 60 is shown in... Figure 3 A larger 6mm blade-type component 62 is used to conduct currents up to 40 amps to a PCB 64 with four ounces of copper. Traces on the PCB 64 interconnect a relay 66 and a fuse 68. The blade-type component 62, PCB 64, relay 66, and fuse 68 form an assembly 70, which is secured to a connector 72. A housing 74 is secured to the connector 72 and further protects the assembly 70. In this current miniature PDB 60, there are six sets of solder joints and a significant path length of four ounces of copper. However, the very high temperatures created within the miniature PDB 60 limit how much current the system can handle at various ambient temperatures. If the temperature becomes too high, the system will fail. Regardless of the foregoing, there have been various efforts to further increase the current capacity of the miniature PDB to up to 50 amps and above.

[0069] To achieve the required current carrying capacity of 50 amps and above, the resistances within the system must be reduced. One way to achieve this is to reduce the bulk and contact resistance between the contacts at one end of the miniature PDB, through the relay and fuse, and at the other end of the system. The optimal way to achieve this is to minimize the thermal resistance of the conductor passing through the contacts at both ends. This includes the volume resistivity of the conductor between the two external contacts and the number and quality of the contact interfaces (i.e., removable contact points and solder joints).

[0070] In a first embodiment of a miniature PDB 160, the miniature PDB 160 is partially formed using a modified ASEP manufacturing process 120, reducing the number of solder joints from six to four, and replacing the four-ounce copper PCB entirely with conductors of the same thickness (0.8 mm) used as high-current contacts, thereby eliminating the higher resistance associated with the PCB. It is anticipated that the path resistance associated with the miniature PDB 160 will be reduced by up to 50%, thereby allowing the system to operate in a “cooler environment” with the same input current or increasing the current the system can ultimately carry.

[0071] The miniature PDB 160 is partially achieved using ASEP technology, whereby connector contacts, PCB circuit traces, and all necessary components are integrated in a manner that minimizes the interface between the connector, the PCB, and the components. By using contact material directly extending to the relay for manufacturing high-power contacts, the interface between the contacts and the PCB can be eliminated.

[0072] focus on Figure 4 , Figure 4 The formation of an ASEP device 110 using a modified ASEP manufacturing process 120 is illustrated, wherein the formed ASEP device 110 is subsequently used as part of a micro PDB 160. The modified ASEP manufacturing process 120 includes steps A and B of ASEP manufacturing process 20, as well as steps I' and K' that modify steps I and K of ASEP manufacturing process 20.

[0073] like Figure 4As shown, manufacturing process 120 begins with step A. Similar to manufacturing process 20, although manufacturing process 120 preferably occurs between a pair of reels due to the size of the ASEP device 110 being formed, it should be understood that the ASEP device 110 may need to be removed from the strip 122 before reaching the take-up reel. In step A, the middle portion of the strip 122 is stamped (thereby removing the unwanted portion of the middle portion of the strip 122) to form a lead frame 128. The lead frame 128 is formed in a desired structure suitable for forming the ASEP device 110. The lead frame 128 preferably includes ends 124a, 124b (understood to be continuous with the ends 124a, 124b of the adjacent lead frame 128), and a pair of stabilizing portions 130a, 130b (understood to be preferably the stabilizing portion 130a of the adjacent lead frame 128), wherein each stabilizing portion 130a, 130b spans the distance between the opposite ends 124a, 124b (which preferably do not undergo the stamping of step A). ​​The opposite ends 124a, 124b and the stabilizing portions 130a, 130b thus generally form a rectangular frame defining an opening 132 between them.

[0074] The lead frame 128 preferably also includes a plurality of fingers 134 connected to any one of opposite ends 124a, 124b and stabilizing portions 130a, 130b and extending inward into an opening 132. Each finger 134 may have one or more openings 136 disposed therethrough. In the formation of the ASEP device 110, it is understood that the plurality of fingers 134 form a plurality of blade-shaped elements (high-current contacts) 141 and a plurality of contact pins 142.

[0075] like Figure 4 As shown, manufacturing process 120 continues to perform step B. In step B, a substrate 138 is overmolded onto a plurality of fingers 134 of the lead frame 128, but not overmolded onto the blade-shaped member 141 or the contact pin 142. The substrate 138 may have an opening 140 disposed therethrough, the opening 140 preferably aligned with the opening 136 of the fingers 134.

[0076] like Figure 4 As shown, manufacturing process 120 continues with step I'. In step I', electrical components 186 are electrically connected to the finger portion 134 through openings 140 in the substrate 138 in any number of known manners, thereby forming the ASEP device 110. The electrical components 186 of the ASEP device 110 preferably include a relay 166 and a fuse 168.

[0077] like Figure 4As shown, manufacturing process 120 continues to execute step K. In step K, once the ASEP device 110 is formed, it must be removed from the strip 122 in order for the ASEP device 110 to be used, so that the ASEP device 110 is individualized.

[0078] Once the ASEP device 110 is individualized, it can be fixed to a connector 172, and a housing 174 can be fixed to the connector 172, thereby forming a miniature PDB 160, such as Figure 4 As shown.

[0079] Several new technologies have now become available, enabling a dramatic increase in the performance, size, and cost of next-generation miniature PDB components when combined. Two of these technologies are high-power FET (field-effect transistor) devices and ASEP technology. High-power FET devices (such as Smart High or Low-Side Power Switches manufactured and marketed by Infineon) have very low resistance when on and high resistance when off, and can switch up to 80 amps. Integrating high-power FET devices into miniature PDB designs by interconnecting the FETs, driver circuitry, and passive components into a compact and more integrated package using ASEP technology creates a new generation of significantly “better in every way” power controls.

[0080] A second embodiment of a miniature PDB 260 is partially formed using an ASEP manufacturing process 220. (Note: The last sentence appears to be incomplete and possibly contains errors. It has been left as is.) Figure 5 , Figure 5 The diagram illustrates the formation of an ASEP device 210 using ASEP fabrication process 220, wherein the formed ASEP device 210 is subsequently used as part of a miniature PDB 260. ASEP fabrication process 220 preferably includes each of steps A through K of ASEP fabrication process 20, but for simplicity... Figure 5 Steps A through K are not shown, and each step is described below.

[0081] like Figure 5As shown, manufacturing process 220 begins with step A. Similar to manufacturing process 20, although manufacturing process 220 preferably occurs between a pair of reels due to the size of the ASEP device 210 being formed, it should be understood that the ASEP device 210 may need to be removed from the strip 222 before reaching the take-up reel. In step A, the middle portion of the strip 222 is stamped (thereby removing the unwanted portion of the middle portion of the strip 222) to form a lead frame 228. The lead frame 228 is formed in a desired structure suitable for forming the ASEP device 210. The lead frame 228 preferably includes ends 224a, 224b (understood to be continuous with the ends 224a, 224b of the adjacent lead frame 228), and a pair of stabilizing portions 230a, 230b (understood to be preferably the stabilizing portion 230a of the adjacent lead frame 228), wherein each stabilizing portion 230a, 230b spans the distance between the opposite ends 224a, 224b (which preferably do not undergo the stamping of step A). ​​The opposite ends 224a, 224b and the stabilizing portions 230a, 230b thus generally form a rectangular frame defining an opening 232 between them.

[0082] The lead frame 228 preferably also includes a plurality of fingers 234 connected to any one of opposite ends 224a, 224b and stabilizing portions 230a, 230b and extending inward into the opening 232. In the formation of the ASEP device 210, it is understood that some of the fingers 234 form high-current contacts 241.

[0083] like Figure 5 As shown, manufacturing process 220 continues with step B. In step B, a substrate 238 is overmolded onto a plurality of fingers 234 of the lead frame 228. The substrate 238 preferably has a plurality of openings disposed therethrough, the plurality of openings preferably exposing different portions of the fingers 234 (including portions of the high-current contacts 241). In this manufacturing process 220, the substrate 238 formed is a connector 272 for a miniature PDB 260.

[0084] Manufacturing process 220 continues with steps C, D, and E (patterning, metal deposition to form traces, and if performed, making the traces conductive (by sintering) to form conductive traces), but only the result of step E is shown in Figure 5 That is, traces 246 / conductive traces 248 are provided on substrate 238.

[0085] like Figure 5As shown, manufacturing process 220 continues with step F. In step F, a voltage potential is applied to lead frame 228 (lead frame 228 is electrically connected to trace 246 / conductive trace 248 via an internal busbar), and then lead frame 228, substrate 238, and trace 246 / conductive trace 248 are exposed to an electroplating bath, where trace 246 / conductive trace 248 is electroplated. The electroplating process not only electroplats trace 246 / conductive trace 248 to form electronic circuit trace 250, but also electroplats lead frame 228 to form an electroplated lead frame 254, which has electroplated fingers 256, and the electroplated fingers 256 have electroplated high-current contacts 257.

[0086] Manufacturing process 220 continues to execute steps G and H (setting the solder mask and setting the solder paste), but Figure 5 These steps are not shown. It should also be understood that steps G and H may be omitted from manufacturing process 220 if necessary.

[0087] like Figure 5 As shown, manufacturing process 220 continues with step I. In step I, electrical component 286 is electrically connected to plated high-current contacts 257 and electronic circuit traces 250, preferably via soldering. Thus, electrical component 286 is directly mounted to contacts 257 and traces 250, resulting in very low thermal resistance for both thermal and electrical paths. Consequently, temperature can be controlled much better than on a standard PCB. As mentioned above, electrical component 286 preferably includes at least one high-power FET, such as those manufactured and sold by Infineon.

[0088] Manufacturing process 220 continues with step J, but Figure 5 This step is not shown.

[0089] like Figure 5 As shown, manufacturing process 220 continues with step K. In step K, once the ASEP device 210 is formed (which incorporates connector 272), the ASEP device 210 must be removed from the tape 222 in order for it to be used, thus individualizing the ASEP device 210.

[0090] Once the ASEP device 210 is individualized, a housing 274 can be attached to the connector 272 of the ASEP device 210, thereby forming a miniature PDB 260, such as Figure 5 As shown. It should be recognized that, due to the ASEP manufacturing process 220, the size of housing 274 is significantly reduced compared to the size of housings 74 and 174.

[0091] A third embodiment of a miniature PDB 360 is partially formed using an ASEP manufacturing process 320. (Note: The last sentence appears to be incomplete and possibly contains errors. It has been left as is.) Figure 6 , Figure 6 The diagram illustrates the formation of an ASEP device 310 using ASEP fabrication process 320, wherein the formed ASEP device 310 is subsequently used as part of a miniature PDB 360. ASEP fabrication process 320 preferably includes steps A through K of ASEP fabrication process 20, but for simplicity... Figure 6 Steps A through K are not shown, and each step will be described below.

[0092] like Figure 6 As shown, manufacturing process 320 begins with step A. Similar to manufacturing process 20, although manufacturing process 320 preferably occurs between a pair of reels due to the size of the ASEP device 310 being formed, it should be understood that the ASEP device 310 may need to be removed from the strip 322 before reaching the take-up reel (although the size of the ASEP device 310 preferably means that removal from the strip 322 before reaching the take-up reel would not be required). In step A, the middle portion of the strip 322 is stamped (thereby removing the unwanted portion of the middle portion of the strip 322) to form a lead frame 328. The lead frame 328 is formed in a desired structure suitable for forming the ASEP device 310. The lead frame 328 preferably includes ends 324a, 324b (understood to be continuous with the ends 324a, 324b of an adjacent lead frame 328), and a pair of stabilizing portions 330a, 330b (understood to be preferably the stabilizing portion 330a of an adjacent lead frame 328), wherein each stabilizing portion 330a, 330b spans the distance between the opposite ends 324a, 324b (which preferably do not undergo the stamping of step A). ​​The opposite ends 324a, 324b and the stabilizing portions 330a, 330b thus generally form a rectangular frame defining an opening 332 between them.

[0093] The lead frame 328 preferably also includes a plurality of fingers 334, which are connected to either of the opposite ends 324a, 324b and the stabilizing portions 330a, 330b and extend inward into the opening 332. In the formation of the ASEP device 310, it is understood that some fingers 334 form high-current contacts 341 while others form contact pins 342.

[0094] like Figure 6As shown, manufacturing process 320 continues to perform step B. In step B, a substrate 338 is overmolded onto a plurality of fingers 334 formed on the lead frame 328. The substrate 338 may have a plurality of openings (not shown) provided therethrough, the plurality of openings preferably exposing different portions of the fingers 334 (including portion 341a of the high current contact 341).

[0095] Manufacturing process 320 continues to perform steps C, D, and E (patterning, metal deposition to form traces, and making the traces conductive (sintering) to form conductive traces), and for simplicity, and according to the foregoing description of manufacturing process 20, in Figure 6 In step C, a pattern 344 is formed; in step D, a trace 346 is formed; and in step E, a conductive trace 348 is formed.

[0096] like Figure 6 As shown, manufacturing process 320 continues with step F. In step F, a voltage potential is applied to lead frame 328 (lead frame 328 is electrically connected to trace 346 / conductive trace 348 via an internal busbar) and then lead frame 328, substrate 338, and trace 346 / conductive trace 348 are exposed in an electroplating bath, where trace 346 / conductive trace 348 is electroplated. The electroplating process not only electroplats trace 346 / conductive trace 348 to form electronic circuit trace 350, but also electroplats lead frame 328 to form an electroplated lead frame 354, which has electroplated fingers 356, electroplated fingers 356 having electroplated high-current contacts 357 (wherein a portion 357a of the electroplated high-current contacts 357 is exposed through an opening in substrate 338) and electroplated contact pins 358.

[0097] Manufacturing process 320 continues to execute steps G and H (setting the solder mask and setting the solder paste), but... Figure 6 These steps are not shown.

[0098] like Figure 6 As shown, manufacturing process 320 continues with step I. In step I, electrical component 386 is electrically connected to the exposed portion 357a of the electroplated high-current contact 357 and the electronic circuit trace 350, preferably via soldering. Thus, electrical component 386 is directly mounted to the contact 35 and the trace 350, resulting in very low thermal resistance for both the thermal and electrical paths. Consequently, temperature can be controlled much better than on a standard PCB. As in manufacturing process 220, electrical component 386 preferably includes at least one high-power FET, such as those manufactured and sold by Infineon.

[0099] Manufacturing process 320 continues with step J, but Figure 6 This step is not shown.

[0100] like Figure 6 As shown, manufacturing process 320 continues to execute step K. In step K, once the ASEP device 310 is formed, in order for the ASEP device 310 to be used, the ASEP device 310 must be removed from the strip 322 to individualize the ASEP device 310.

[0101] Once the ASEP device 310 is individualized, it can be assembled / connected to a completely redesigned connector / housing 375 to form a miniature PDB 360. The miniature PDB 360 will have an even smaller footprint / profile compared to the miniature PDB 260, which has already been significantly reduced compared to the miniature PDBs 60 and 160.

[0102] Figure 7 and Figure 8 A preferred configuration of the ASEP device 310 is shown. A substrate 338 has a plurality of heat dissipation fins 388 on the side opposite to the mounting electrical components 386 of the substrate 338. The substrate 338 has a leading edge 390, a trailing edge 392, and first and second side edges 394 and 396.

[0103] Figure 9 and Figure 10 A miniature PDB 360 is shown. As illustrated, the connector / housing 375 includes a first interior (not shown) into which the ASEP device 310 is inserted and housed. First and second side edges 394, 396 are preferably inserted into a track portion (not shown) defined by the connector / housing 375 until the leading edge 390 abuts against a wall (not shown) of an interior of the connector / housing 375. The first interior has an opening that exposes the heat sink fins 388 of the substrate 338. The wall of the interior separates the first interior of the connector / housing 375 from a second interior 398. The wall of the interior has a plurality of openings (not shown) extending through it, which allow plated high-current contacts 357 and plated contact pins 358 to extend into the second interior 398.

[0104] like Figure 10 As shown, a cover 400 can be secured to the connector / housing 375 by known means to close and essentially encapsulate the ASEP device 310 within a first interior. The cover 400 and the walls of the interior can be configured such that the track portion receives the trailing edge 392 and the leading edge 390, respectively, thereby stabilizing the ASEP device 310 in position. A gasket 402 can be disposed between the cover 400 and the connector / housing 375 to seal the ASEP device 310 relative to external devices.

[0105] A miniature PDB 360 is formed, which can be connected to a mating connector 500, thereby providing a connector assembly 600, wherein the mating connector 500 is configured to be electrically connected to the miniature PDB 360 via plated high-current contacts 357 and plated contact pins 358. The connector assembly 600 can be installed in a vehicle, typically on a panel, either via the miniature PDB 360 or via the mating connector 500 (or both, if desired), in various known manners.

[0106] Overall, the Mini PDB 360 is about 55% smaller and about 60% lighter than the well-known standard PDB.

[0107] It should be noted that the substrate 338 of the ASEP device 310 may be formed without heat sink fins 388. In such a case, the connector / housing 375 may need to be modified so that the opening of the connector / housing 375 exposing the heat sink fins 388 is eliminated.

[0108] It should also be noted that, as shown in Figures 6 to 9 The ASEP device 310 shown in the diagram has two plated high-current contacts 357, while Figure 10 The diagram shows three plated high-current contacts 357. It should be understood that the ASEP device 310 can have any number of plated high-current contacts 357 as needed.

[0109] In addition to high-power FETs, the electrical components 286, 386 of ASEP devices 210, 310 may preferably include an internal microprocessor capable of programming various functions for local interconnect network (LIN) control.

[0110] The substrates 138, 238, and 338 of each of the ASEP devices 110, 210, and 310 can also advantageously be formed of a thermally conductive liquid crystal polymer (LCP). By making the substrates 138, 238, and 339 from thermally conductive LCP, the thermal load of the electronic components in the ASEP devices 110, 210, and 310, and thereby in the micro PDBs 160, 260, and 360, can be significantly reduced.

[0111] All references cited herein, including publications, patent applications and patents, are incorporated to the same extent by reference, just as each reference is individually and specifically indicated as being incorporated by reference and explained in its entirety.

[0112] In the context of describing the invention (especially in the context of the appended claims), the use of the terms “a (before a consonant)” and “a (before a vowel)” and “the,” as well as “at least one” and similar referents, shall be construed to cover both singular and plural forms unless otherwise stated herein or explicitly denied by the context. The use of the term “at least one” following a list of one or more items (e.g., “at least one of A and B”) shall be construed to refer to one item (A or B) selected from the listed items or any combination of two or more of the listed items (A and B), unless otherwise stated or explicitly denied by the context. Unless otherwise stated, the terms “comprising,” “having,” “including,” and “containing” shall be construed as open-ended terms (i.e., meaning “including but not limited to”). Numerical ranges referenced herein are intended only as a simplified way of independently referring to individual values ​​falling within those ranges, and unless otherwise stated herein, and each individual value is incorporated into this specification as if it were independently referenced herein. All processes described herein may be performed in any suitable order unless otherwise stated herein or explicitly denied by the context. The use of any and all examples or exemplary language (e.g., “such as”) provided herein is intended only to better explain the invention and not to limit its scope, unless otherwise claimed. No language in this application should be construed as indicating that any unclaimed component is essential to the practice of the invention.

[0113] This document describes preferred embodiments of the invention, including the best methods of carrying out the invention as understood by the inventors. Variations of these preferred embodiments may become apparent to those skilled in the art upon reading the foregoing description. The inventors expect those skilled in the art to appropriately use these variations, and the inventors intend that the invention will be practiced in ways other than those specifically described herein. Therefore, the invention includes all modifications and equivalents of the subject matter referenced in the appended claims, where permitted by applicable law. Furthermore, any combination of the foregoing components under all possible variations is included within the scope of the invention unless otherwise stated or explicitly denied by the context.

Claims

1. A method for forming a miniature distribution box, the method comprising the following steps: A continuous strip is formed having multiple lead frames, each lead frame defining an opening and having a first finger and a second finger extending into the opening; A substrate is overmolded onto the first and second fingers of each lead frame, and each substrate has at least one opening configured to pass through it, the opening exposing a portion of the first finger and a portion of the second finger; Electroplating the exposed portion of each of the first finger and the second finger; as well as An electrical component is directly mounted to the exposed portion of each of the first and second fingers so that a corresponding electrical component is electrically connected to the corresponding first and second fingers to form multiple devices. Individualizing each of the devices from the continuous strip; An individualized device is housed within a connector / housing configured to connect to a mating connector; and A cover is secured to the connector / housing in a manner that prevents individual components from being removed from the connector / housing.

2. The method according to claim 1, wherein, The electrical component is a high-power field-effect transistor.

3. A miniature power distribution box, formed by the method according to any one of claims 1-2, the miniature power distribution box comprising: A device having a substrate, a first finger, a second finger, and an electrical component, wherein the first finger has a first portion, a second portion, and a third portion, and the second finger has a first portion, a second portion, and a third portion, the substrate being overmolded on the first portion of the first finger and the first portion of the second finger, the substrate not being overmolded on the second portion of the first finger or the second portion of the second finger, the second portion of the first finger and the second portion of the second finger extending outward from the substrate, the third portion of the first finger and the third portion of the second finger being exposed via at least one opening provided through the substrate, and the electrical component being directly mounted to the third portion of the first finger and the third portion of the second finger to electrically connect the electrical component to each of the first finger and the second finger; A connector / housing configured to house the device therein and configured to connect to a mating connector; and A cover is fixed to the connector / housing in a manner that prevents the device from being removed from the connector / housing.

4. The miniature power distribution box according to claim 3, wherein, The substrate is formed of a thermally conductive liquid crystal polymer.

5. The miniature power distribution box according to claim 3, wherein, The electrical component includes a high-power field-effect transistor.

6. The miniature power distribution box according to claim 3, wherein, At least one of the electrical components includes an internal microprocessor.

7. The miniature power distribution box according to claim 3, wherein, The device is formed using a dedicated electronic packaging manufacturing process.

8. The miniature power distribution box according to claim 3, wherein the first finger and the second finger are electrically connected to each other via a busbar.

9. The miniature power distribution box according to claim 8, wherein, The substrate is overmolded onto the busbar.

10. The miniature power distribution box according to claim 3 further includes a gasket fixed between the cover and the connector / housing.

11. The miniature power distribution box according to claim 3, wherein, Each of the first finger and the second finger is a high-current contact.

12. The miniature power distribution box according to claim 3 further includes at least one third finger, the at least one third finger having a first portion and a second portion, the substrate being overmolded on the first portion of the at least one third finger, the substrate not being overmolded on the second portion of the at least one third finger, the second portion of the at least one third finger extending outward from the substrate.

13. The miniature power distribution box according to claim 12, wherein, The second portion of at least one third finger is a contact pin.

14. The miniature power distribution box according to claim 12, wherein, The second portion of at least one third finger is electroplated.

15. The miniature power distribution box according to claim 3, wherein the second and third portions of the first finger and the second and third portions of the second finger are electroplated.

16. The miniature power distribution box according to claim 3, wherein, The at least one opening disposed through the substrate includes a first opening and a second opening, wherein a third portion of the first finger is exposed through the first opening and a third portion of the second finger is exposed through the second opening.

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