Carrier thermoforming machine

Abstract

The present invention provides a carrier thermoplastic machine. The carrier thermoplastic machine includes a lower mold mechanism and an upper mold mechanism. The lower mold mechanism includes a lower mold unit and a first driving device. The first driving device can drive the lower mold unit to rise and fall to carry the carrier, and the lower mold unit can provide negative pressure to absorb the carrier. The upper mold mechanism includes an upper mold unit, a second driving device and a plurality of hot air guns. The second driving device can drive the upper mold unit to rise and fall, so that the upper mold unit is lowered and placed on the carrier, and hot air is directly delivered to the carrier through the hot air gun to provide positive pressure so that the carrier can be thermoplastically formed. The hot air can also flow back through the reflow channel. A temperature sensor can also be provided at the air outlet of the hot air gun to control the air outlet temperature. In this way, it can be used to solve the problems of carrier warping and solder ball coplanarity.

Description

Technical Field

[0001] The invention relates to a carrier plate thermoforming machine, in particular to a carrier plate thermoforming machine which can be used for performing carrier plate thermoplastic forming. Background Art

[0002] The main function of the carrier is to carry IC as a carrier, and to connect the signal between the chip and the printed circuit board through the internal circuit of the carrier. The carrier can also be used to carry various electronic components. When the existing carrier is completed, it must be tested for warpage and solder ball coplanarity. If it fails the test, it must be eliminated or the material or product structure of the carrier must be changed, which will inevitably increase the manufacturing cost. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a carrier thermoforming machine to solve the problems of carrier warping and solder ball coplanarity.

[0004] In order to solve the above technical problems, the present invention provides a carrier thermoplastic machine, comprising: a lower mold mechanism, the lower mold mechanism comprising a lower mold unit and a first driving device, the lower mold unit is connected to the first driving device, the first driving device can be used to drive the lower mold unit to rise and fall, the lower mold unit comprises at least one lower mold, the lower mold has a lower module, the top surface of the lower module has a bearing surface, which can be used to place the carrier, the bearing surface is provided with at least one suction port, which can be used to draw a vacuum, so that the lower mold has a negative pressure suction force, which is used to suck the carrier; and an upper mold mechanism, the upper mold mechanism is located above the lower mold mechanism, The upper mold mechanism includes an upper mold unit, a second driving device and at least one hot air gun. The upper mold unit is connected to the second driving device, and the second driving device can be used to drive the upper mold unit to rise and fall. The upper mold unit includes at least one upper mold. The upper mold has an upper module. The bottom surface of the upper module has a pressing surface, and the pressing surface can be used to press the carrier. The pressing surface is provided with at least one air outlet. The hot air gun has an air outlet, and the air outlet of the hot air gun is connected to the air outlet of the upper mold. Positive pressure and heated gas can be output to the upper mold through the hot air gun to provide a downward pressure force of positive pressure on the carrier to shape the carrier.

[0005] Preferably, the lower mold is arranged on a lower linkage seat, the lower linkage seat is connected to the first driving device, and the first driving device can drive the lower mold to rise and fall through the lower linkage seat; the upper mold is arranged on an upper linkage seat, the upper linkage seat is connected to the second driving device, and the second driving device can drive the upper mold to rise and fall through the upper linkage seat.

[0006] Preferably, the air intake port is located at the center of the carrying surface, a plurality of air intake grooves are provided on the carrying surface, the plurality of air intake grooves are connected to the air intake port, a plurality of ribs are formed between the plurality of air intake grooves, and the plurality of ribs can contact and support the carrier.

[0007] Preferably, the pressing surface and the bearing surface are parallel to each other.

[0008] Preferably, the pressing surface is provided with a plurality of the air outlets, and the plurality of the air outlets are located at the center and the edge of the pressing surface.

[0009] Preferably, a reflux channel is provided at the periphery of the air outlet of the hot air gun, so that the gas output by the hot air gun can reflux through the reflux channel.

[0010] Preferably, a temperature sensor is provided at the air outlet of the hot air gun to control the temperature of the air outlet.

[0011] Preferably, a pressure sensing device is disposed between the upper mold unit and the second driving device, and the pressure sensing device can be used to monitor the downward pressing force of the upper mold unit.

[0012] Preferably, the gas pressure delivered to the upper mold by the hot air gun is 6Kpa to 500Kpa and the temperature is 30°C to 300°C.

[0013] The lower mold has a negative pressure suction force of -1.3Kpa to -90Kpa to hold the carrier.

[0014] The beneficial effect of the present invention is that the carrier thermoforming machine provided by the present invention includes a lower mold mechanism and an upper mold mechanism, the lower mold mechanism includes a lower mold unit and a first driving device, the upper mold mechanism includes an upper mold unit, a second driving device and at least one hot air gun, the carrier can be placed on the bearing surface of the lower mold of the lower mold unit, and the carrier is sucked by negative pressure suction so that the carrier is stably fixed on the lower mold, the lower mold unit can be driven to rise by the first driving device, and the upper mold unit can be driven to descend by the second driving device so that the carrier is sandwiched between the upper mold and the lower mold, and the hot air gun can be used to output heated positive pressure gas to shape the carrier. Therefore, the present invention can solve the problems of carrier warping and solder ball coplanarity, and the present invention simultaneously uses temperature, positive pressure, negative pressure and machine pressure to enable rapid thermoplastic forming of the carrier and has a better shaping effect.

[0015] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only provided for reference and explanation and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of the carrier plate thermoforming machine of the present invention.

[0017] Figure 2 It is a three-dimensional diagram of the lower mold mechanism of the present invention.

[0018] Figure 3 It is a three-dimensional diagram of the upper mold mechanism of the present invention.

[0019] Figure 4 It is a cross-sectional view of the lower mold mechanism of the present invention.

[0020] Figure 5 It is a cross-sectional view of the upper mold mechanism of the present invention.

[0021] Figure 6 It is a three-dimensional diagram of the lower mold of the present invention.

[0022] Figure 7 It is a three-dimensional diagram of the upper mold of the present invention. DETAILED DESCRIPTION

[0023] [Example]

[0024] See also Figures 1 to 5 The present invention provides a carrier thermoforming machine that can be used for thermoplastic forming of PCB carriers, etc. The carrier can be used to carry ICs. The structure of the carrier is not limited, for example, it can be a printed circuit board, etc., and can also be used to carry various electronic components. The carrier thermoforming machine includes a lower mold mechanism 100 and an upper mold mechanism 200.

[0025] The lower mold mechanism 100 can be set on an appropriate frame (not shown) to ensure a stable setting of the lower mold mechanism 100. The lower mold mechanism 100 includes a lower mold unit 1 and a first driving device 2. The first driving device 2 is preferably an electric cylinder, but is not limited to this. For example, it can also be other driving devices such as a pneumatic cylinder or a hydraulic cylinder. The lower mold unit 1 is connected to the first driving device 2, and the first driving device 2 can be used to drive the lower mold unit 1 to rise and fall.

[0026] The lower mold unit 1 includes at least one lower mold 11. Preferably, the lower mold unit 1 includes multiple lower molds 11. The number of multiple lower molds 11 is not limited. Multiple lower molds 11 can be arranged on a lower linkage seat 12. The lower linkage seat 12 is connected to the first driving device 2, so that the first driving device 2 can drive the multiple lower molds 11 to rise and fall through the lower linkage seat 12.

[0027] Each of the plurality of lower molds 11 has a lower module 111. The lower module 111 can be a square block or other shapes. The lower module 111 can be made of metal or non-metal material. The top surface of the lower module 111 has a bearing surface 112 (such as Figure 6The carrier can be placed on a carrier plate 300 to be transported between the lower mold mechanism 100 and the upper mold mechanism 200. The carrying surface 112 is provided with at least one suction port 113, which can be located at the center of the carrying surface 112. The suction port 113 can be connected to an existing suction device (not shown) so as to evacuate the suction port 113 so that the lower mold 11 has a negative pressure suction force to suck the carrier. In this embodiment, the lower mold 11 has a negative pressure suction force of -1.3 to -90Kpa to suck the carrier, but this is not limited.

[0028] Preferably, the bearing surface 112 is also provided with a plurality of suction grooves 114, which are distributed on the entire bearing surface 112, and are connected to the suction port 113. When the suction port 113 is evacuated, the entire bearing surface 112 can have suction through the plurality of suction grooves 114, so that the suction is more uniform. A plurality of ribs 115 can be formed between the suction grooves 114, and the plurality of ribs 115 can contact and support the carrier, so that the carrier is evenly pressed and heated quickly and evenly.

[0029] The upper mold mechanism 200 can be set on a suitable frame (not shown) to ensure a stable setting of the upper mold mechanism 200. The upper mold mechanism 200 is located above the lower mold mechanism 100. The upper mold mechanism 200 includes an upper mold unit 5, a second driving device 6 and at least one hot air gun 7. The second driving device 6 is preferably an electric cylinder, but is not limited to this. For example, it can also be other driving devices such as a pneumatic cylinder or a hydraulic cylinder. The upper mold unit 5 is connected to the second driving device 6, and the second driving device 6 can be used to drive the upper mold unit 5 to rise and fall.

[0030] The upper mold unit 5 includes at least one upper mold 51. Preferably, the upper mold unit 5 includes multiple upper molds 51. The number of upper molds 51 is not limited. The multiple upper molds 51 can be arranged on an upper linkage seat 52. The upper linkage seat 52 is connected to the second driving device 6, so that the second driving device 6 can drive the multiple upper molds 51 to rise and fall through the upper linkage seat 52. The multiple upper molds 51 are respectively arranged above the multiple lower molds 11. When the multiple upper molds 51 descend and the multiple lower molds 11 ascend, the multiple carriers can be clamped between the multiple upper molds 51 and the multiple lower molds 11 respectively.

[0031] Each of the plurality of upper molds 51 has an upper mold block 511. The upper mold block 511 may be a square block or other shapes. The bottom surface of the upper mold block 511 has a pressing surface 512 (such as Figure 7As shown in the figure, the pressing surface 512 can be parallel to the carrying surface 112, and the pressing surface 512 can be used to press the carrier. The pressing surface 512 is provided with at least one air outlet 513. Preferably, the pressing surface 512 is provided with multiple air outlets 513. The multiple air outlets 513 can be located at the center and edge of the pressing surface 512. The air outlet 513 can be connected to the hot air gun 7 so that the hot air generated by the hot air gun 7 can be transported to the air outlet 513, so that the upper mold 51 has a positive pressure to press the carrier downward. In this embodiment, when the second driving device 6 drives the upper mold unit 5 to descend, the upper mold 51 presses the carrier downward with a force of 100 to 1200 kg, but it is not limited. In this embodiment, multiple air outlets 513 are provided and distributed at the center and edge of the pressing surface 512. When the multiple air outlets 513 output positive pressure gas, the pressure is more uniform, so that the carrier can be pressed evenly and heated quickly and evenly.

[0032] The hot air gun 7 may be provided with one or more. In the present embodiment, the hot air gun 7 is provided with multiple ones. The multiple hot air guns 7 are a device capable of outputting heated and pressurized gas. The multiple hot air guns 7 can be connected to the gas supply device and heat the gas by means of electric heating or the like to output the heated and pressurized gas. The multiple hot air guns 7 each have an air outlet 71 (such as Figure 5 As shown in FIG. 1 , the air outlet 71 may be provided at one end (lower end) of the hot air gun 7. The air outlets 71 of the multiple hot air guns 7 are respectively connected to the air outlets 513 of the multiple upper molds 51. The hot air can be directly delivered to the carrier through the multiple hot air guns 7 to provide positive pressure so that the carrier can be thermoplastically formed. In addition, the outer periphery of the air outlets 71 of the multiple hot air guns 7 can also be provided with a reflux channel 72 so that the gas output by the multiple hot air guns 7 can flow back through the reflux channel 72. A temperature sensor 73 may also be provided at each of the air outlets 71 of the multiple hot air guns 7 to control the temperature of the air outlet 71. In the present embodiment, the multiple hot air guns 7 can be used to output heated and pressurized (positive pressure) nitrogen. The gas pressures delivered by the multiple hot air guns 7 to the multiple upper molds 51 are 6Kpa to 500Kpa and the temperatures are 30°C to 300°C, respectively, and are maintained for tens of seconds to shape the carrier.

[0033] In addition, a pressure sensing device 8 may be provided between the upper mold unit 5 and the second driving device 6. The pressure sensing device 8 may be a load cell, etc. The pressure sensing device 8 may be used to monitor the downward force of the upper mold unit 5. Preferably, the maximum downward pressure may be set to 1200 kg, but is not limited.

[0034] When the present invention intends to perform thermoplastic shaping of a carrier, the carrier can be placed on the bearing surface 112 of the lower mold 11, and the carrier can be sucked by negative pressure suction so that the carrier is stably fixed on the lower mold 11. Then, the first driving device 2 can be used to drive the lower mold unit 1 to rise, and the second driving device 6 can be used to drive the upper mold unit 5 to descend, so that the carrier is clamped between the upper mold 51 and the lower mold 11, and the hot air gun 7 can be used to output heated positive pressure gas to maintain a predetermined time to shape the carrier.

[0035] [Beneficial Effects of Embodiments]

[0036] The beneficial effect of the present invention is that the carrier thermoforming machine provided by the present invention includes a lower mold mechanism and an upper mold mechanism, the lower mold mechanism includes a lower mold unit and a first driving device, the upper mold mechanism includes an upper mold unit, a second driving device and at least one hot air gun, the carrier can be placed on the bearing surface of the lower mold of the lower mold unit, and the carrier is sucked by negative pressure suction so that the carrier is stably fixed on the lower mold, the lower mold unit can be driven to rise by the first driving device, and the upper mold unit can be driven to descend by the second driving device so that the carrier is clamped between the upper mold and the lower mold, and the hot air gun can be used to output heated positive pressure gas to shape the carrier. Therefore, the present invention can solve the problems of carrier warping and solder ball coplanarity, and the present invention simultaneously uses temperature, positive pressure, negative pressure and machine pressure to enable rapid thermoplastic forming of the carrier and has a better shaping effect. In addition, the present invention has a simple structure, which is convenient for production and manufacturing, and is simple and easy to operate, which is convenient for the operation of carrier molding.

[0037] However, the above description is only a preferred embodiment of the present invention and is not intended to limit the patent protection scope of the present invention. Therefore, all equivalent changes made using the contents of the present invention's specification and drawings are also included in the scope of protection of the present invention and are hereby stated.

Claims

1. A carrier plate thermoforming machine, characterized in that: include: A lower mold mechanism, the lower mold mechanism comprises a lower mold unit and a first driving device, the lower mold unit is connected to the first driving device, the first driving device can be used to drive the lower mold unit to rise and fall, the lower mold unit comprises at least one lower mold, the lower mold has a lower module, the top surface of the lower module has a bearing surface, can be used to place the carrier, the bearing surface is provided with at least one suction port, can be used to draw a vacuum, so that the lower mold has a negative pressure suction force, used to suck the carrier; and An upper mold mechanism is located above the lower mold mechanism, the upper mold mechanism includes an upper mold unit, a second driving device and at least one hot air gun, the upper mold unit is connected to the second driving device, the second driving device can be used to drive the upper mold unit to rise and fall, the upper mold unit includes at least one upper mold, the upper mold has an upper module, the bottom surface of the upper module has a pressing surface, the pressing surface can be used to press the carrier, the pressing surface is provided with at least one air outlet, the hot air gun has an air outlet, the air outlet of the hot air gun is connected to the air outlet of the upper mold, and positive pressure and heated gas can be output to the upper mold through the hot air gun to provide a positive pressure downward force for the carrier to shape the carrier.

2. The carrier thermoforming machine according to claim 1, characterized in that: The lower mold is arranged on a lower linkage seat, and the lower linkage seat is connected to the first driving device. The first driving device can drive the lower mold to rise and fall through the lower linkage seat; the upper mold is arranged on an upper linkage seat, and the upper linkage seat is connected to the second driving device. The second driving device can drive the upper mold to rise and fall through the upper linkage seat.

3. The carrier thermoforming machine according to claim 1, characterized in that: The air intake port is located at the center of the carrying surface. A plurality of air intake grooves are arranged on the carrying surface. The plurality of air intake grooves are connected to the air intake port. A plurality of ribs are formed between the plurality of air intake grooves. The plurality of ribs can contact and support the carrier.

4. The carrier thermoforming machine according to claim 1, characterized in that: The pressing surface and the bearing surface are parallel to each other.

5. The carrier thermoforming machine according to claim 1, characterized in that: The pressing surface is provided with a plurality of the air outlets, and the plurality of the air outlets are located at the center and the edge of the pressing surface.

6. The carrier thermoforming machine according to claim 1, characterized in that: A reflux channel is provided at the periphery of the air outlet of the hot air gun, so that the gas output by the hot air gun can reflux through the reflux channel.

7. The carrier thermoforming machine according to claim 1, characterized in that: A temperature sensor is provided at the air outlet of the hot air gun to control the temperature of the air outlet.

8. The carrier thermoforming machine according to claim 1, characterized in that: A pressure sensing device is arranged between the upper mold unit and the second driving device, and the pressure sensing device can be used to monitor the downward pressing force of the upper mold unit.

9. The carrier thermoforming machine according to claim 1, characterized in that: The gas pressure delivered to the upper mold by the hot air gun is 6Kpa to 500Kpa and the temperature is 30°C to 300°C.

10. The carrier thermoforming machine according to claim 1, characterized in that: The lower mold has a negative pressure suction force of -1.3Kpa to -90Kpa to hold the carrier.

Images