Test apparatus, test method, and computer-readable storage medium

Abstract

[Problem to be solved by the invention] In a method of checking optical characteristics of one LED of a pair of LEDs that are to be checked by causing the one LED to emit light and receiving the light by the other LED, using a current value of a current output by a photoelectric effect, optical characteristics of a plurality of LEDs cannot be checked at once. [Solution] A test device includes: an electrical connection portion electrically connected to terminals of each of a plurality of light emitting elements that are to be tested; a light source portion that irradiates light to the plurality of light emitting elements together; a measurement portion that measures a photoelectric signal output from the plurality of light emitting elements by photoelectric conversion of light irradiated by the light source portion and via the electrical connection portion; an acquisition portion that acquires a correction map including a correction value for correcting unevenness in intensity of light irradiated by the light source portion to positions of each of the plurality of light emitting elements; and a determination portion that determines whether each of the plurality of light emitting elements is good or not based on a measurement result of the measurement portion and the correction map acquired by the acquisition portion.

Description

TECHNICAL FIELD

[0001] The present application relates to a test device, a test method, and a computer-readable storage medium. BACKGROUND

[0002] There is known a method of causing one of a pair of LEDs (Light Emitting Diode) that are an inspection target to emit light, and receiving the light by the other LED, and checking an optical characteristic of the LED using a current value of a current that is output by a photoelectric effect (for example, refer to Patent Documents 1 and 2).

[0003] [BACKGROUND ART DOCUMENTS]

[0004] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Laid-Open No. 2019-507953

[0006] [Patent Document 2] Japanese Patent Laid-Open No. 2010-230568 SUMMARY

[0007] [PROBLEMS TO BE SOLVED BY THE INVENTION]

[0008] However, in the method, it is necessary to cause each LED to emit light in turn to perform the inspection, and it is not possible to check the optical characteristics of a plurality of LEDs at once.

[0009] [MEANS FOR SOLVING THE PROBLEMS]

[0010] One aspect of the present application provides a test device. The test device can include an electrical connection portion electrically connected to a terminal of each of a plurality of light emitting elements that are a test target. The test device can include a light source portion that irradiates light to the plurality of light emitting elements together. The test device can include a measurement portion that measures a photoelectric signal that is output via the electrical connection portion as a result of photoelectric conversion of the light irradiated by the light source portion by each of the plurality of light emitting elements. The test device can include an acquisition portion that acquires a correction map including a correction value for correcting unevenness in intensity of the light irradiated by the light source portion to a position of each of the plurality of light emitting elements. The test device can include a determination portion that determines whether each of the plurality of light emitting elements is good or not based on a result of the measurement by the measurement portion and the correction map acquired by the acquisition portion.

[0011] The determination portion can correct a measurement value of the photoelectric signal measured by the measurement portion for each of the plurality of light emitting elements using the correction value for the position of each of the plurality of light emitting elements in the correction map, and determine whether each of the plurality of light emitting elements is good or not based on the measurement value of the photoelectric signal after the correction.

[0012] The determination unit can determine at least one light emitting element of the plurality of light emitting elements to be defective, the at least one light emitting element being a light emitting element whose corrected value, which is obtained by correcting the measured photoelectric signal using the correction map, is outside the normal range.

[0013] The determination unit can use, as the normal range, a range based on a statistical quantity corresponding to the corrected value obtained by correcting the photoelectric signal output from each of the plurality of light emitting elements using the correction map.

[0014] The determination unit can use, as the normal range, a range based on a statistical quantity corresponding to the corrected value obtained by correcting the photoelectric signal output from the light emitting element disposed at the same position among the groups of the plurality of light emitting elements for which the measurement unit simultaneously performs the measurement a plurality of times, using the correction map.

[0015] The test device can further include a second measurement unit that measures the intensity of the light emitted from the light source unit toward each position of the plurality of light emitting elements. The test device can further include a generation unit that generates the correction map based on a second measurement result of the second measurement unit.

[0016] The second measurement unit can have a number of sensors equal to the number of the plurality of light emitting elements. The plurality of sensors can be disposed at positions respectively identical to the positions of the plurality of light emitting elements.

[0017] The second measurement unit can have a two-dimensional brightness meter for measuring the intensity of the light emitted toward the positions of the plurality of light emitting elements at one time.

[0018] The test device can further include a second measurement unit that measures the intensity of the light emitted from the light source unit toward each position of the plurality of light emitting elements. The test device can further include a generation unit that generates the correction map based on a second measurement result of the second measurement unit.

[0019] The second measurement unit can have a number of sensors less than the number of the plurality of light emitting elements. The plurality of sensors can be disposed at the positions of the light emitting elements. The plurality of sensors can be spaced apart from each other by a predetermined interval.

[0020] The second measurement unit can have a two-dimensional brightness meter for measuring the intensity of the light emitted toward the positions of the light emitting elements at one time. The two-dimensional brightness meter can have a number of pixels less than a number of pixels of another two-dimensional brightness meter for measuring the intensity of the light emitted toward the positions of the plurality of light emitting elements at one time.

[0021] The test device can further include a second measurement section that sequentially measures the intensity of light emitted by the light source section toward each of the plurality of light emitting elements by sequentially moving along the positions of the plurality of light emitting elements. The test device can further include a generation section that generates a correction map based on a second measurement result of the second measurement section.

[0022] The test device can further include a correction section that corrects the measurement values of the plurality of sensors of the second measurement section using the area light source whose uniformity has been corrected.

[0023] The test device can further include a generation section that generates a correction map based on the average value of the photoelectric signals output by the light emitting elements disposed at the same position among the groups of the plurality of light emitting elements in the measurement result obtained by the measurement section by changing the group of the plurality of light emitting elements that sequentially become the test target at the same time.

[0024] One aspect of the present application provides a test method. The test method can include an electrical connection stage of electrically connecting an electrical connection section to a terminal of each of a plurality of light emitting elements that become a test target. The test method can include an irradiation stage of irradiating light toward the plurality of light emitting elements together. The test method can include a measurement stage of measuring a photoelectric signal that is output by the plurality of light emitting elements by photoelectrically converting the light that is irradiated and via the electrical connection section. The test method can include an acquisition stage of acquiring a correction map that includes a correction value for correcting unevenness in the intensity of light irradiated toward each of the plurality of light emitting elements. The test method can include a determination stage of determining whether each of the plurality of light emitting elements is good or not based on the measurement result of the measurement stage and the correction map acquired at the acquisition stage.

[0025] One aspect of the present application provides a test device. The test device can include an electrical connection section that is electrically connected to a terminal of each of a plurality of light emitting elements that become a test target. The test device can include a light source section that irradiates light toward the plurality of light emitting elements together. The test device can include a measurement section that measures a photoelectric signal that is output by the plurality of light emitting elements by photoelectrically converting the light irradiated by the light source section and via the electrical connection section. The test device can include a light source control section that changes the intensity of the light generated by the light source section. The test device can include a determination section that determines whether each of the plurality of light emitting elements is good or not based on the measurement result of the measurement section when the intensity is changed by the light source control section.

[0026] The determination section can calculate the photoelectric gain of each of the plurality of light emitting elements based on the measurement result under each of two or more different intensities, and determine at least one light emitting element of the plurality of light emitting elements whose photoelectric gain is outside a normal range as being defective.

[0027] The determination section can determine at least one light emitting element, whose photoelectric gain is outside the normal range at two or more different intensities, as defective.

[0028] The determination section can determine at least one light emitting element, which is a light emitting element whose photoelectric signal measured at each of two or more different intensities is outside the normal range, as defective.

[0029] The determination section can determine at least one light emitting element, whose photoelectric signal is outside the normal range at two or more different intensities, as defective.

[0030] The determination section can use, as the normal range, a range based on a statistical quantity corresponding to the photoelectric signals output by the plurality of light emitting elements.

[0031] The determination section can use, as the normal range, a range based on a statistical quantity corresponding to the photoelectric signals output by the light emitting elements disposed at the same position in the groups of the plurality of light emitting elements in a measurement result obtained by the measurement section by changing the groups of the plurality of light emitting elements successively to be the test targets while performing the measurement a plurality of times.

[0032] One aspect of the present application provides a test method. The test method can include an electrical connection stage of electrically connecting an electrical connection section to a terminal of each of a plurality of light emitting elements that are test targets. The test method can include an irradiation stage of irradiating light to the plurality of light emitting elements together. The test method can include a measurement stage of measuring a photoelectric signal output by the plurality of light emitting elements by photoelectric conversion of the irradiated light and via the electrical connection section. The test method can include a light source control stage of changing an intensity of the light irradiated in the irradiation stage. The test method can include a determination stage of determining whether each of the plurality of light emitting elements is good or not based on a measurement result of the measurement stage in a case where the intensity is changed in the light source control stage.

[0033] One aspect of the present application provides a test device. The test device can include an electrical connection section electrically connected to a terminal of each of a plurality of light emitting elements that are test targets. The test device can include a light source section that irradiates light to the plurality of light emitting elements together. The test device can include a measurement section that measures a photoelectric signal output by the plurality of light emitting elements by photoelectric conversion of the light irradiated by the light source section and via the electrical connection section. The test device can include a light source control section that changes a wavelength of the light emitted by the light source section in a predetermined range including a predetermined reaction wavelength of the plurality of light emitting elements. The test device can include a determination section that determines whether each of the plurality of light emitting elements is good or not based on a measurement result of the measurement section when the wavelength is changed by the light source control section.

[0034] The determination unit can calculate the photoelectric gain of each of the plurality of light emitting elements based on the measurement results at each of the two or more different wavelengths, and determine at least one light emitting element of the plurality of light emitting elements whose photoelectric gain is outside the normal range as being defective.

[0035] The determination unit can determine at least one light emitting element whose photoelectric gain is outside the normal range at each of the two or more different wavelengths as being defective.

[0036] The determination unit can determine at least one light emitting element of the plurality of light emitting elements as being defective, the at least one light emitting element being a light emitting element whose photoelectric signal measured at each of the two or more different wavelengths is outside the normal range.

[0037] The determination unit can determine at least one light emitting element whose photoelectric signal is outside the normal range at each of the two or more different wavelengths as being defective.

[0038] The determination unit can use, as the normal range, a range based on a statistic amount corresponding to the photoelectric signal output by each of the plurality of light emitting elements.

[0039] The determination unit can use, as the normal range, a range based on a statistic amount corresponding to the photoelectric signal output by the light emitting element disposed at the same position between groups of the plurality of light emitting elements in a measurement result obtained by the measurement unit by changing the group of the plurality of light emitting elements successively to be a test target and simultaneously performing the measurement a plurality of times.

[0040] One aspect of the present application provides a test method. The test method can include an electrical connection stage of electrically connecting an electrical connection unit to a terminal of each of a plurality of light emitting elements that are a test target. The test method can include an irradiation stage of irradiating light to the plurality of light emitting elements together. The test method can include a measurement stage of measuring a photoelectric signal output by each of the plurality of light emitting elements by photoelectrically converting the light irradiated in the irradiation stage. The test method can include a light source control stage of changing a wavelength of the light irradiated in the irradiation stage within a predetermined range including a predetermined reaction wavelength of the plurality of light emitting elements. The test method can include a determination stage of determining whether each of the plurality of light emitting elements is good or not based on a measurement result of the measurement stage in a case where the wavelength is changed in the light source control stage.

[0041] The light source unit can irradiate light in a reaction wavelength band of the plurality of light emitting elements to the plurality of light emitting elements.

[0042] The test device can further include a temperature control unit that suppresses an increase in temperature of the plurality of light emitting elements due to the irradiated light.

[0043] The temperature control unit may include an air supply mechanism that blows air toward multiple light-emitting elements. The test apparatus may also include a static electricity removal unit that prevents the multiple light-emitting elements from becoming statically charged due to the airflow from the air supply mechanism.

[0044] One aspect of the present invention provides a computer-readable storage medium storing a program that is executed by a testing apparatus for testing a plurality of light-emitting elements and is used to cause the testing apparatus to perform the testing method.

[0045] Furthermore, the summary of the invention does not list all the features required by the invention. Additionally, sub-combinations of these feature groups can also be considered inventions. Attached Figure Description

[0046] Figure 1 This is an example of an overall diagram showing a general layout of a test apparatus 100 for testing multiple LEDs 10.

[0047] Figure 2 Examples of side views (A) and top views (B) of the electrical connection portion 110 in a state where multiple probes 113 are in contact with the mounting portion 150, the LED group mounted on the mounting portion 150, and a specific group of multiple LEDs 10 in the LED group.

[0048] Figure 3 This is an example of a top view of the mounting portion 150 and the light intensity measuring component 170 mounted on the mounting portion 150.

[0049] Figure 4 This is an example of a flowchart illustrating the process of a test method performed using test apparatus 100.

[0050] Figure 5 This is an example of a flowchart illustrating the process of generating a correction diagram to calculate the corrected measured values ​​of the photoelectric signals of each LED 10 using the test apparatus 100.

[0051] Figure 6 This is an example of a flowchart illustrating the process of calculating correction values ​​for calibrating the measured values ​​of multiple sensors 173 of the light intensity measuring component 170 using the test apparatus 100.

[0052] Figure 7 This is an example of an overall diagram showing a general layout of a test apparatus 200 for testing multiple LEDs 20.

[0053] Figure 8 This is an example of a top view of the mounting portion 150 and the light intensity measuring component 175 mounted on the mounting portion 150.

[0054] Figure 9is an example of a flowchart illustrating a flow of a test method performed by the test device 200.

[0055] Figure 10 is an example of a flowchart illustrating a flow of a process of generating a correction chart to calculate a corrected measured value of a photoelectric signal of each LED 10 performed by the test device 200.

[0056] Figure 11 is another example of a flowchart illustrating a flow of a process of generating a correction chart to calculate a corrected measured value of a photoelectric signal of each LED 10 performed by the test device 200.

[0057] Figure 12 is still another example of a flowchart illustrating a flow of a process of generating a correction chart to calculate a corrected measured value of a photoelectric signal of each LED 10 performed by the test device 200.

[0058] Figure 13 is another example of a flowchart illustrating a flow of a test method performed by the test device 200.

[0059] Figure 14 is still another example of a flowchart illustrating a flow of a test method performed by the test device 200.

[0060] Figure 15 is an example of an overall view showing an outline of a test device 300 that tests a plurality of LEDs 30.

[0061] Figure 16 is a view showing an example of a computer 1200 that can realize all or a part of the plurality of modes of the present application. DETAILED DESCRIPTION

[0062] Hereinafter, the present application will be described through embodiments of the application, but the following embodiments do not limit the application of the claims. In addition, the combination of features described in the embodiments is not necessarily essential to the solution means of the application. Furthermore, in the drawings, the same reference numerals are assigned to the same or similar parts, and sometimes the repeated description is omitted.

[0063] Figure 1 is an example of an overall view showing an outline of a test device 100 that tests a plurality of LEDs 10. Figure 1 In the drawings, an X-axis in a right direction when facing a paper surface is shown in a mutually orthogonal manner as a +X direction, a Z-axis in an upward direction when facing the paper surface is shown in a mutually orthogonal manner as a +Z direction, and a Y-axis in a depth direction when facing the paper surface is shown in a mutually orthogonal manner as a +Y direction. Hereinafter, sometimes the three axes are used for the description.

[0064] The test device 100 tests the optical characteristics of a plurality of LEDs 10 together based on a photoelectric signal output from the LED 10 irradiated with light using the photoelectric effect of the LED 10. The test device 100 includes an electrical connection portion 110, a light source portion 120, a temperature control portion 126, a measurement portion 130, a control portion 140, a storage portion 145, a placement portion 150, and a shielding portion 160. The test device 100 can not include the temperature control portion 126, the storage portion 145, the placement portion 150, and the shielding portion 160.

[0065] The test device 100 in the present embodiment tests the optical characteristics of a group of a plurality of LEDs 10 together in a state in which the group of LEDs 10 is placed on the placement portion 150, for example, on a wafer 15 on which the LEDs 10 are formed before wiring is provided using a base plate. The LED 10 in the present embodiment is a Micro-LED (micro light emitting diode) having a size of 100 μm or less. In addition, the LED 10 can be a Mini-LED (submillimeter light emitting diode) having a size of more than 100 μm and 200 μm or less, or an LED having a size of more than 200 μm, instead of a Micro-LED, and can be another light emitting element such as an LD (laser diode), in addition to the above.

[0066] In addition, the plurality of LEDs 10 in the present embodiment are not electrically connected to each other on the wafer 15. In addition, the plurality of LEDs 10 can be formed on a wafer provided with an electrical wiring, or a panel (PLP) of a glass substrate having a substantially square shape, and can be assembled or unitized by being electrically connected to each other, in which case, the respective colors of RGB (Red Green Blue) can be mixed by, for example, a technique of performing laser lift-off and transfer from various monochromatic wafers of RGB, or a technique of performing dyeing or applying a fluorescent paint on any one of the monochromatic wafers of RGB.

[0067] The electrical connection portion 110 is, for example, a probe card (probe substrate) that is electrically connected to the respective terminals 11 of the plurality of LEDs 10 that are the test targets. In addition, in the specification of the present application, when defined as "electrically connected", it means electrically connected in a contact manner or electrically connected in a non-contact manner. The electrical connection portion 110 in the present embodiment is electrically connected by being connected to the respective terminals 11 of the plurality of LEDs 10, but can be electrically connected in a non-contact manner by electromagnetic induction or close proximity wireless communication, for example.

[0068] In addition, the electrical connection section 110 in this embodiment switches the group of the plurality of LEDs that become the connection destination in turn as the test target from among the plurality of LEDs placed on the placement section 150 by moving the placement section 150 in a state where the plurality of LEDs are placed. The electrical connection section 110 in this embodiment is disposed between the light source section 120 and the plurality of LEDs 10, and has a substrate 111 and a plurality of probes 113.

[0069] The substrate 111 has an opening 112 that transmits light from the light source section 120 to the plurality of LEDs 10. Figure 1 In the drawing, the opening 112 is indicated by a dashed line.

[0070] The plurality of probes 113 extend toward each of the plurality of LEDs 10 that protrude from the substrate 111 within the opening 112, and contact the terminals 11 of the plurality of LEDs 10, respectively. The other end of each probe 113, which is opposite the end that contacts the terminal 11, is electrically connected to an electrical wiring provided on the substrate 111. The plurality of electrical wirings of the plurality of probes 113 extend from the side surface of the substrate 111, and are electrically connected to the measurement section 130.

[0071] In addition, with regard to the plurality of probes 113, in order to equalize the light receiving amount of each of the plurality of LEDs 10, it is preferable that the plurality of probes 113 have the same shape and size, and that the distance between the plurality of probes 113 and the LEDs 10 that they contact be equal. In addition, it is preferable that the plurality of probes 113 be plated or colored on the surface of each probe 113 so that light is not diffusely reflected.

[0072] The light source section 120 irradiates the plurality of LEDs 10 with light. The light source section 120 in this embodiment irradiates the plurality of LEDs with light in the wavelength band to which the plurality of LEDs respond. The light source section 120 in this embodiment has a light source 121 and a lens assembly 123.

[0073] The light source 121 emits light in the wavelength band to which the plurality of LEDs 10 respond. The light source 121 can be a light source that emits light in a wide wavelength band, such as a xenon light source, or a light source that emits light in a narrow wavelength band, such as a laser light source. The light source 121 can also include a plurality of laser light sources having different wavelengths.

[0074] The lens assembly 123 includes one or more lenses, and is disposed adjacent to the irradiation section of the light source 121 so that the diffused light emitted from the light source 121 becomes parallel light 122. Figure 1 In the drawing, the parallel light 122 is indicated by diagonal lines. The projection of the parallel light 122 on the XY plane covers at least the opening 112 of the substrate 111.

[0075] The temperature control unit 126 suppresses the heating of the multiple LEDs 10 due to illumination. In this embodiment, the temperature control unit 126 includes a temperature suppression filter 125 and a filter holding unit 124. The temperature suppression filter 125 has high light transmittance and absorbs the heat rays of the incident light. The filter holding unit 124 is disposed adjacent to the lens assembly 123 to hold the temperature suppression filter 125. In addition, the temperature control unit 126 may also include a cooler for cooling the heat absorbed by the temperature suppression filter 125.

[0076] To maintain the multiple LEDs 10 at a constant temperature, the temperature control unit 126 may, instead of the above configuration, include a temperature application device for adjusting the temperature of the multiple LEDs 10, or an air supply mechanism for blowing air towards the multiple LEDs 10. When using an air supply mechanism, the temperature control unit 126 may also include an antistatic unit to suppress static electricity buildup on the multiple LEDs 10 caused by the airflow from the air supply mechanism. The antistatic unit may be, for example, an ionizer. The temperature application device may be provided in contact with the multiple LEDs 10 in the mounting portion 150 or the substrate 111, etc. Alternatively, the air supply mechanism may be provided on the side of the mounting portion 150 without contacting the multiple LEDs 10.

[0077] The measuring unit 130 measures the photoelectric signals generated by the multiple LEDs 10 after photoelectric conversion of the light irradiated by the light source unit 120 and output via the electrical connection unit 110. In this embodiment, the measuring unit 130 measures the photoelectric signals from a group of multiple LEDs 10 sequentially connected to the electrical connection unit 110.

[0078] More specifically, in this embodiment, the measuring unit 130 is connected to an electrical wiring that is electrically connected to each probe 113 of the electrical connection unit 110, and measures the current value of the current output from a group of multiple LEDs 10 that are switched in contact with multiple probes 113 in the LED group mounted on the mounting unit 150. Alternatively, the measuring unit 130 may measure the voltage value corresponding to the current value instead of the current value.

[0079] In this embodiment, the measuring unit 130 further measures the intensity of light irradiated by the light source unit 120 at each position of the plurality of LEDs 10. Furthermore, the measuring unit 130 also functions as an example of a second measuring unit.

[0080] The control section 140 controls each of the components of the test device 100. The control section 140 in the present embodiment controls the irradiation time, wavelength, and intensity of the parallel light 122 that is once irradiated to the plurality of LEDs 10 by controlling the light source 121 of the light source section 120. In addition, the control section 140 in the present embodiment controls in a manner that switches the group of the plurality of LEDs 10 that sequentially become the test target from among the LED group placed on the placement section 150 by controlling the placement section 150. More specifically, the control section 140 drives the placement section 150 in a manner that brings the probe 113 into contact with the terminal 11 of each of the LEDs 10 of the group. Furthermore, the control section 140 can also grasp the position coordinates of the plurality of probes 113 in the space and the relative positions of the plurality of probes 113 to each of the LEDs 10 on the placement section 150 by referring to the reference data of the storage section 145.

[0081] The control section 140 further acquires a correction map that contains a correction value for correcting the unevenness of the intensity of the light irradiated by the light source section 120 to each of the positions of the plurality of LEDs 10. The control section 140 in the present embodiment generates this correction map in advance on the basis of the measurement results of the measurement section 130 and stores the correction map in the storage section 145. The control section 140 in the present embodiment acquires the correction map from the storage section 145 in a case where the measurement results of the plurality of LEDs 10 are acquired. Furthermore, the correction map can also be generated and held by an external device that has the same light source as the light source 121, in which case the control section 140 can acquire the correction map from the external device.

[0082] The control section 140 further determines whether each of the plurality of LEDs 10 is good or not on the basis of the measurement results of the measurement section 130 and the correction map. More specifically, the control section 140 in the present embodiment corrects the measured values of the photoelectric signals respectively measured by the measurement section 130 for the plurality of LEDs 10 using the correction values for the positions of the plurality of LEDs 10 in the correction map. The control section 140 in the present embodiment further determines whether each of the plurality of LEDs 10 is good or not on the basis of the measured values of the corrected photoelectric signals.

[0083] The control section 140 in the present embodiment further determines at least one of the plurality of LEDs 10 to be defective, which is an LED for which the correction value obtained by correcting the measured photoelectric signal using the correction map is outside the normal range. The control section 140 sequentially controls each of the components by referring to the storage section 145. Furthermore, the control section 140 functions as an example of an acquisition section, a determination section, and a generation section.

[0084] The storage section 145 stores the correction map, reference data for determining whether each of the plurality of LEDs 10 is good or not, a determination result, reference data for moving the placement section 150, a sequence or a program for controlling each constituent of the test device 100, and the like. The storage section 145 is referred to by the control section 140.

[0085] The placement section 150 places the LED group. The placement section 150 in the illustrated example has a substantially circular outer shape in plan view, but can have another outer shape. The placement section 150 has a holding function of a vacuum chuck, an electrostatic chuck, or the like, and holds the wafer 15 of the LED group placed thereon. In addition, the placement section 150 is two-dimensionally moved in an XY plane and is raised and lowered in a Z-axis direction by drive control by the control section 140. Further, the placement section 150 is moved in the XY plane by a predetermined distance in accordance with the control by the control section 140. Figure 1 In the drawing, the Z-axis negative direction side of the placement section 150 is omitted. In addition, Figure 1 In the drawing, the movement direction of the placement section 150 is indicated by a hollow arrow. The same is true in the following drawings.

[0086] The shielding section 160 shields light other than light from the light source section 120. The surface of the shielding section 160 in the present embodiment is entirely blackened to prevent diffuse reflection of light on the surface. In addition, as shown in Figure 1 the drawing, the shielding section 160 in the present embodiment is provided so as to be in close contact with the outer periphery of the light source 121 and the outer periphery of the substrate 111, respectively, and shields light other than light from the light source section 120 by this configuration.

[0087] Figure 2 is an example (A) of a side view and an example (B) of a plan view of the electrical connection section 110 in a state in which the plurality of probes 113 are in contact with the placement section 150, the LED group placed on the placement section 150, and a specific plurality of LEDs 10 in the LED group. Figure 2 (A) is a drawing in which only the placement section 150, the LED group, and the electrical connection section 110 shown in Figure 1 are extracted and illustrated. In Figure 2 (B), a plurality of LEDs 10 that cannot be observed through the substrate 111 in the LED group on the placement section 150 are indicated by broken lines.

[0088] As shown in Figure 2 (B), two terminals 11 are formed on each LED 10 so as to be spaced apart from each other in the Y-axis direction. In addition, the plurality of LEDs 10 are placed on the placement section 150 in a state in which they are arranged in a matrix shape, and in the illustrated example, are arranged in a matrix shape of six columns in the X-axis direction and six rows in the Y-axis direction.

[0089] The opening 112 of the substrate 111 has an oblong profile that is longer in the Y-axis direction. In the example shown, as a group of multiple LEDs 10 for which optical characteristics are to be measured, 12 LEDs 10, 2 columns in the X-axis direction and 6 rows in the Y-axis direction, are exposed within the opening 112. The configuration is such that, for the multiple terminals 11 located within the opening 112 of the substrate 111, one probe 113 of the respective electrical connection portion 110 is in contact with each of the terminals 11.

[0090] Figure 3 is a plan view of the placement portion 150 and the light intensity measurement assembly 170 placed on the placement portion 150. The light intensity measurement assembly 170 is arranged on the placement portion 150 in the same position as the wafer 15 when the wafer 15 is not placed on the placement portion 150. Figure 3 In the example shown, the opening 112 and the multiple LEDs 10 are indicated by dashed lines, respectively.

[0091] The measurement portion 130 in the present embodiment has a light intensity measurement assembly 170. The light intensity measurement assembly 170 in the present embodiment has a holding portion 171 and multiple sensors 173. The holding portion 171 is a substrate-like member that holds the multiple sensors 173 arranged on the surface. The multiple sensors 173 can each be a sensor that detects the brightness and / or the illuminance of the surrounding environment, such as a photodiode. The multiple sensors 173 can each be sized according to, for example, the ratio of the number of the multiple sensors 173 to the number of the multiple LEDs 10. When the ratio is one-to-one, each sensor 173 can have the same size as an LED 10, for example.

[0092] The light intensity measurement assembly 170 has a group of sensors 173 that covers the same area as the multiple LEDs 10 exposed within the opening 112 of the substrate 111. As an example, the light intensity measurement assembly 170 can have the same number of sensors 173 as the number of the multiple LEDs 10 exposed within the opening 112. Figure 1 and Figure 2 As shown in the wafer 15, the multiple sensors 173 exposed within the opening 112 are each arranged in the same position as the respective position of the multiple LEDs 10 exposed within the opening 112 when the holding portion 171 is placed on the placement portion 150.

[0093] In addition, the light intensity measurement assembly 170 can be provided on the placement portion 150 instead of the configuration described above. In this case, when the wafer 15 is not placed on the placement portion 150, i.e., when the light from the light source portion 120 is not blocked by the wafer 15, the light can be received by the multiple sensors 173 of the light intensity measurement assembly 170.

[0094] Figure 4is an example of a flowchart illustrating a flow of a test method performed by the test device 100. The flow is started by, for example, the user inputting to the test device 100 an instruction for starting the test of the LED group in a state where the LED group is placed on the placement portion 150.

[0095] The test device 100 performs an electrical connection stage (step S101) of electrically connecting the electrical connection portion 110 to the terminals 11 of the respective ones of the plurality of LEDs 10 that are the test targets. As a specific example, the control portion 140 outputs an instruction to the placement portion 150 to move the placement portion 150 in a manner such that the group of the plurality of LEDs 10 that are first the test targets among the LED group on the placement portion 150 come into contact with the plurality of probes 113.

[0096] The test device 100 performs an irradiation stage (step S103) of irradiating light to the plurality of LEDs 10 together. As a specific example, the control portion 140 outputs an instruction to the light source portion 120 to cause the parallel light 122 to be irradiated to the group of the plurality of LEDs 10 that are exposed in the opening 112.

[0097] The test device 100 performs a measurement stage of measuring the photoelectric signals that are output from the plurality of LEDs 10 that are photoelectrically converted from the irradiated light and output via the electrical connection portion 110 (step S105). As a specific example, the control portion 140 outputs an instruction to the measurement portion 130 to measure the current values of the currents output from the group of the plurality of LEDs 10 that are switched to be in contact with the plurality of probes 113 among the LED group placed on the placement portion 150 and outputs the measurement results to the control portion 140. The control portion 140 stores the respective measurement results of the group of the plurality of LEDs 10 to the storage portion 145.

[0098] The test device 100 determines whether the measurement of all the LEDs 10 placed on the placement portion 150 has ended (step S107), and when the measurement has not ended (step S107: NO), performs a group switching stage (step S109) of switching the group of the plurality of LEDs 10 that are the test targets, and returns to step S101. As a specific example, the control portion 140 refers to the reference data of the storage portion 145 to determine whether the measurement results of all the LEDs 10 placed on the placement portion 150 have been stored, and in the case where the measurement results have not been stored, outputs an instruction to the placement portion 150 to move the placement portion 150 in a manner such that the group of the plurality of LEDs 10 that are next the test targets are switched.

[0099] When the test device 100 ends the measurement of all the LEDs 10 placed on the placement portion 150 in step S107 (step S107: YES), the test device 100 performs a correction map acquisition stage of acquiring a correction map including correction values for correcting the unevenness of the intensity of light irradiated to each position of the plurality of LEDs (step S110). As a specific example, the control portion 140 acquires the correction map that is generated in advance and stored in the storage portion 145.

[0100] The test device 100 performs a determination stage of determining whether each of the plurality of LEDs 10 is good or not based on the measurement results of the determination stage and the correction map (step S111), and the flow ends. As a specific example, the control portion 140 refers to the reference data of the storage portion 145, and when the measurement results of all the LEDs 10 placed on the placement portion 150 are stored, determines whether each of the plurality of LEDs 10 is good or not based on the measurement results and the correction map.

[0101] The control portion 140 in the present embodiment determines at least one LED 10 of the plurality of LEDs 10 to be defective as described above, the at least one LED 10 being an LED 10 of which the correction value obtained by correcting the photoelectric signal measured using the correction map is outside a normal range. As an example of the normal range, a range based on a statistical amount corresponding to the correction value obtained by correcting the photoelectric signal output from each of the plurality of LEDs 10 using the correction map can be used.

[0102] More specifically, as an example of the normal range, a range based on a statistical amount of the wafer 15 as a whole, i.e., a statistical amount of the plurality of LEDs 10, of the correction value obtained by correcting the current value of the current output from each of the plurality of LEDs 10 placed on the placement portion 150 using the correction map, or a range based on a statistical amount of the correction value of the entire batch including the wafer 15 can be used. As an example of the statistical amount, a range within ±1σ of the average value of the correction value, a range within ±2σ of the average value, or a range within ±3σ of the average value can be used.

[0103] In this case, the control portion 140 corrects the current value of the current output from each of the plurality of LEDs 10 placed on the placement portion 150 using the correction map to calculate the correction value, and calculates the average value and the standard unevenness σ based on the correction value. In addition, in a case where the correction value has a plurality of peaks, the statistical amount of the correction value can be calculated using a statistical process capable of corresponding to the plurality of peaks instead of the standard unevenness.

[0104] In addition, as another example of the normal range, a range in which the measurement unit 130 obtains measurement results by changing the group of the plurality of LEDs 10 that sequentially become the test target from among the LED groups while performing a plurality of measurements, and obtains correction values by correcting the photoelectric signals output from the LEDs 10 arranged at the same position among the groups of the plurality of LEDs 10 using the correction map, and a range based on the statistic corresponding to the correction values can be used. More specifically, as an example of the normal range, a range in which, for example, the LEDs 10 arranged at the same row and the same column in the LED group arranged in a matrix shape of 6 columns in the X-axis direction and 6 rows in the Y-axis direction on the placement portion 150 shown in FIG. 10 are the subject LEDs, and a range of the average value ± 1σ, a range of the average value ± 2σ, or a range of the average value ± 3σ of the correction values obtained by correcting the current values of the currents output from the subject LEDs in the plurality of LED groups on the plurality of placement portions 150 using the correction map can be used. Figure 2

[0105] In addition, as another example of the normal range, a range in which a margin determined based on the specifications of the LEDs 10 is added to a reference value determined based on the specifications of the LEDs 10 can be used. In this case, the control unit 140 can refer to information indicating the range that is stored in advance in the storage unit 145.

[0106] Figure 5 is an example of a flowchart illustrating a flow of the process of generating a correction map to calculate the corrected measurement values of the photoelectric signals of the respective LEDs 10 using the test device 100. The flow is started by, for example, the user inputting an instruction to start the flow to the test device 100 in a state in which the light intensity measurement assembly 170 is arranged on the placement portion 150.

[0107] The test device 100 irradiates the group of the plurality of sensors 173 exposed in the opening 112 with light using the light source 121, and measures the luminance of each sensor 173 (step S201). The test device 100 quantizes the measured luminance values, and stores the values as the light intensity data of the respective LEDs 10 in the storage unit 145. Figure 5 The data of the correction map illustrated as such is stored in the storage unit 145 (step S203).

[0108] The test device 100 corrects the photoelectric signals of the respective LEDs 10 using the correction map stored in the storage unit 145 (step S204). Figure 5 ​The wafer 15 is moved in parallel by driving the placement portion 150 as indicated by the black solid arrow, and the plurality of LEDs 10 exposed in the opening 112 are irradiated with light by the same light source 121, and the photoelectric signals output from the photoelectric conversion of the light by each LED 10 are measured (step S205). The test device 100 acquires the correction map from the storage portion 145, and applies the correction map to the measured values of the photoelectric signals of each LED 10 for each group of the plurality of LEDs 10 (step S207). The test device 100 calculates the corrected measured values of the photoelectric signals of each LED 10 (step S209), and ends the flow.

[0109] Further, step S205 in the flow corresponds to Figure 4 Steps S101 to S109 of the flow shown in FIG. 10, step S207 and S209 in the flow correspond to Figure 4 Steps S110 to S111 of the flow shown in FIG. 11. The corrected measured values calculated by the flow are used for Figure 4 the determination of step S111 shown in FIG. 11.

[0110] Figure 6 is an example of a flowchart illustrating a flow for calculating correction values for calibrating the measured values of the plurality of sensors 173 of the light intensity measurement assembly 170 by the test device 100. The flow is started, for example, by the user inputting to the test device 100 for starting the flow in a state where the light source 121 of the light source portion 120 is replaced with a surface light source whose uniformity has been corrected, and the light intensity measurement assembly 170 is disposed on the placement portion 150.

[0111] The control portion 140 in the present embodiment can additionally use the surface light source whose uniformity has been corrected to calibrate the measured values of the plurality of sensors 173 of the light intensity measurement assembly 170. The test device 100 irradiates a group of the plurality of sensors 173 exposed in the opening 112 with light by the surface light source whose uniformity has been corrected, and measures the luminance of each sensor 173 (step S251). The test device 100 numerically values the measured luminance, and stores the correction values for calibrating the measured values obtained by the plurality of sensors 173 measured for the correction map to the storage portion 145 (step S253), and the flow ends.

[0112] As a comparative example of the test method by the test device 100 of the present embodiment, for example, consider a test method for the optical characteristics of LEDs, in which the plurality of LEDs arranged on the wafer are sequentially lit one by one, and the light is received by an image sensor, a spectrometer luminance meter, or the like, to determine whether or not the light is accurately emitted.

[0113] In a case where the optical characteristics of the plurality of LEDs are measured at one time in the test method using the comparative example, the light emitted from the adjacent plurality of LEDs interferes with each other, so that a defective LED whose optical characteristics are relatively deteriorated cannot be accurately specified, and in addition, an image sensor or the like used for recognizing an image with high accuracy in a wide range is very expensive. This problem becomes particularly significant when a plurality of Micro-LEDs are tested.

[0114] In contrast to this, according to the test device 100 of the present embodiment, the electrical connection portion 110 is electrically connected to the terminal 11 of each of the plurality of LEDs 10 that are test targets, light is irradiated to the plurality of LEDs 10 together, and the photoelectric signals output from the plurality of LEDs 10 by photoelectric conversion of the irradiated light are measured. According to the test device 100, whether each of the plurality of LEDs 10 is good or not is determined further based on the measurement results of the plurality of LEDs 10. Thus, the test device 100 can not only shorten the processing time by measuring the photoelectric signals of the plurality of LEDs 10 at one time, but also determine whether the LED 10 is good or not by using the photoelectric signals measured without being affected by the measurement of the optical characteristics of the other LEDs 10, so that a defective LED 10 whose optical characteristics are deteriorated can be accurately specified. In addition, according to the test device 100, the number of LEDs 10 that are measured at one time can be easily increased.

[0115] In addition, in a case where the photoelectric signals output by irradiating light from the light source to the plurality of LEDs together are measured, there are a case where the irradiation area of the light irradiated from the light source to the plurality of LEDs is darker on the outside than on the center, and a case where the intensity of the light varies depending on the position within the irradiation area. In contrast to this, according to the test device 100 of the present embodiment, whether each of the plurality of LEDs 10 is good or not is determined based on the measured values of the photoelectric signals output from the plurality of LEDs 10 respectively, and a correction map including a correction value for correcting the intensity unevenness of the light irradiated by the light source portion 120 to the position of each of the plurality of LEDs 10. Thus, the test device 100 can correct the intensity unevenness of the light irradiated by the light source portion 120 to the position of each of the plurality of LEDs 10, and improve the measurement accuracy of the optical characteristics of the plurality of LEDs 10.

[0116] In addition, according to the test device 100 of the present embodiment, the plurality of probes 113 and the substrate 111 used for the measurement of the optical characteristics of the plurality of LEDs 10 can also be shared in the measurement of the electrical characteristics of the plurality of LEDs 10 such as VI test using an LED tester. In addition, according to the test device 100 of the present embodiment, the other configurations other than the light source portion 120 and the shielding portion 160, that is, the electrical connection portion 110, the measurement portion 130, the control portion 140, the storage portion 145, and the placement portion 150, can use the corresponding configurations used when a device other than an optical device such as an LED group is tested.

[0117] In the above embodiment, the configuration is described in which the plurality of LEDs 10 have the terminals 11 on the light emitting surface side. Instead, the plurality of LEDs 10 can have the terminals 11 on the side opposite to the light emitting surface. The plurality of probes 113 can have different lengths depending on whether the respective terminals 11 of the plurality of LEDs 10 are on the light emitting surface side or on the side opposite to the light emitting surface.

[0118] In the above embodiment, the configuration is described in which, after the placement portion 150 on which the LED group is placed is moved so that the position coordinates of the plurality of probes 113 of the electrical connection portion 110 coincide with the position coordinates of the plurality of LEDs 10 of the LED group in the XY plane, the placement portion 150 is raised and lowered, thereby bringing the plurality of terminals 11 of the plurality of LEDs 10 into contact with the plurality of probes 113. Instead, the plurality of terminals 11 of the plurality of LEDs 10 can be brought into contact with the plurality of probes 113 by raising and lowering the substrate 111 after the movement in the XY plane.

[0119] In the above embodiment, the configuration is described in which the placement portion 150 has a substantially circular outer shape. Instead, in the case where the placement portion 150 is placed on a panel (PLP) of a glass substrate on which an electrical wiring is formed and which has a substantially square outer shape, for example, the placement portion 150 can have a substantially square outer shape corresponding to the outer shape of the LED group.

[0120] Figure 7 is an example of an overall view showing an outline of a test device 200 that tests the plurality of LEDs 20. In Figure 7 In the description of the embodiment shown in Figures 1 to 6 the same configuration as the embodiment described using the corresponding reference numerals, and the repeated description is omitted. However, in Figure 7 only for the sake of making the description clearer, the description using Figures 1 to 6 the test device 100 described is omitted. In the drawings of the embodiments described later, the repeated description is also omitted.

[0121] In the embodiment described using Figures 1 to 6 the configuration is described in which the electrical connection portion 110 is disposed between the light source portion 120 and the plurality of LEDs 10, and has the substrate 111 and the plurality of probes 113 provided in the opening 112 of the substrate 111. In Figure 7In the embodiments shown later, instead, the electrical connection portion 210 is arranged such that a plurality of LEDs 20, 30 are located between the light source portion 120 and the electrical connection portion 210, and has a substrate 211 and a plurality of probes 213 extending from the substrate 211 toward each of the plurality of LEDs 20, 30 and contacting the terminals 21, 31 of each of the plurality of LEDs 20, 30.

[0122] exist Figure 7 In the illustrated embodiment, the LED group is a plurality of LEDs 20 whose light-emitting surfaces do not face the front of the wafer 25. Each terminal 21 of the plurality of LEDs 20 faces the wafer 25, and a plurality of through holes 26 extending along the Z-axis at the position of each terminal 21 are formed on the wafer 25. In this case, the electrical connection portion 210 can make a plurality of probes 213 contact each terminal 21 of the plurality of LEDs 20 from the negative Z-axis direction side of the wafer 25 through the plurality of through holes 26 formed on the wafer 25.

[0123] exist Figure 7 In the electrical connection portion 210 of the illustrated embodiment, the substrate 211 may not have a substrate. Figures 1 to 6 In the described embodiment, the opening 112 of the electrical connection portion 110 allows the plurality of probes 213 to not extend within the XY plane. For example... Figure 7 As shown, multiple probes 213 can be formed together with the substrate 211 into a flower socket shape, extending toward the terminals 21 of each LED 20 along the Z-axis. The same applies to the embodiments described later, and repeated descriptions will be omitted.

[0124] Figure 8 This is an example of a top view of the mounting section 150 and the light intensity measuring component 175 mounted on the mounting section 150. In this embodiment, the measuring section 130 has the light intensity measuring component 175 instead of using... Figures 1 to 6 The light intensity measuring component 170 in the described embodiment. The light intensity measuring component 175 has the same number of sensors 173 as the plurality of LEDs 20, and the plurality of sensors 173 are respectively arranged at the same positions as the plurality of LEDs 20. Alternatively, the light intensity measuring component 175 may replace the plurality of sensors 173 as the plurality of LEDs 20, and have a two-dimensional luminance meter for measuring the intensity of light illuminating the respective positions of the plurality of LEDs 20 at a time.

[0125] Figure 9 This is an example of a flowchart illustrating the process of a test method performed using the test apparatus 200. The test apparatus 200 of this embodiment and the use of... Figures 1 to 6 The test apparatus 100 of the described embodiment also functions to perform... Figure 4Steps S101, S103, S105, S110, and S111 of the flowchart shown in FIG. 10. However, the test device 200 of the present embodiment is different from the test device 100 of the embodiment described above in that the test device 200 does not execute Figures 1 to 6 Steps S107 and S109 of the flowchart shown in FIG. 10. Figure 4 Steps S107 and S109 of the flowchart shown in FIG. 10.

[0126] Figure 10 is an example of a flowchart for explaining a flow of generating a correction map to calculate corrected measured values of photoelectric signals of the respective LEDs 20 using the test device 200. This flow is the same as the flow shown in FIG. 10, and is started by, for example, a user making an input for starting the flow to the test device 200 in a state where the light intensity measurement assembly 175 is disposed on the placement portion 150. Figure 5 is an example of a flowchart for explaining a flow of generating a correction map to calculate corrected measured values of photoelectric signals of the respective LEDs 20 using the test device 200. This flow is the same as the flow shown in FIG. 10, and is started by, for example, a user making an input for starting the flow to the test device 200 in a state where the light intensity measurement assembly 175 is disposed on the placement portion 150.

[0127] The test device 200 irradiates light from the light source 121 to the plurality of sensors 173 together, and measures luminance amounts of the respective sensors 173 (step S301). The test device 200 numbers the measured luminance amounts, and stores the numbers as image data of the respective sensors 173 in the storage portion 145. Figure 10 The data of the correction map exemplified above is stored in the storage portion 145 (step S303).

[0128] The test device 200 irradiates light from the same light source 121 to the plurality of LEDs 20 together, and measures photoelectric signals of the respective LEDs 20 that photoelectrically convert light and output (step S305). The test device 200 acquires the correction map from the storage portion 145, and applies the correction map to measured values of the photoelectric signals of the respective LEDs 20 (steps S307). The test device 200 calculates corrected measured values of the photoelectric signals of the respective LEDs 20 (step S309), and ends the flow.

[0129] Further, step S305 in this flow corresponds to steps S101 to S105 of the flowchart shown in FIG. 10, and steps S307 and S309 in this flow correspond to steps S107 and S109 of the flowchart shown in FIG. 10. Figure 9 Further, step S305 in this flow corresponds to steps S101 to S105 of the flowchart shown in FIG. 10, and steps S307 and S309 in this flow correspond to steps S107 and S109 of the flowchart shown in FIG. 10. Figure 9 Steps S110 to S111 of the flowchart shown in FIG. 10. The corrected measured values calculated by this flow are used for the determination of step S111 shown in FIG. 10. Figure 9 Steps S110 to S111 of the flowchart shown in FIG. 10. The corrected measured values calculated by this flow are used for the determination of step S111 shown in FIG. 10.

[0130] Figure 11 is another example of a flowchart for explaining a flow of generating a correction map to calculate corrected measured values of photoelectric signals of the respective LEDs 20 using the test device 200. The measurement portion 130 of the present embodiment has a light intensity measurement assembly 176 instead of using the light intensity measurement assembly 175 in the embodiment described above. Figure 10 is another example of a flowchart for explaining a flow of generating a correction map to calculate corrected measured values of photoelectric signals of the respective LEDs 20 using the test device 200. The measurement portion 130 of the present embodiment has a light intensity measurement assembly 176 instead of using the light intensity measurement assembly 175 in the embodiment described above.

[0131] In this embodiment, the measuring unit 130 measures a portion of the light irradiated by the light source unit 120 at the respective positions of the plurality of LEDs 20, i.e., the intensity of the light irradiated at the positions of the plurality of LEDs 20. The light intensity measuring component 176 of the measuring unit 130 in this embodiment has fewer sensors 173 than the plurality of LEDs 20, and the plurality of sensors 173 are respectively disposed at the positions of the plurality of LEDs 20. The plurality of sensors 173 are, for example, like... Figure 11 As shown, they are spaced apart by a predetermined interval. Compared to the light intensity measuring assembly 175, the light intensity measuring assembly 176 reduces the number of sensors 173. Furthermore, Figure 11 The configuration of multiple sensors 173 shown is only one example; other configurations are also possible.

[0132] Furthermore, the light intensity measuring component 176 may have a two-dimensional luminance meter for simultaneously measuring the intensity of light illuminating the positions of a plurality of LEDs 20, instead of a sensor 173 which has a smaller number of LEDs 20. The number of pixels of this two-dimensional luminance meter may be less than the number of pixels of other two-dimensional luminance meters used to simultaneously measure the intensity of light illuminating the individual positions of a plurality of LEDs 20.

[0133] Figure 11 The process shown is the same as Figure 10 The process shown is also started by, for example, by a user inputting information into the test apparatus 200 to start the process while the light intensity measuring component 176 is disposed on the mounting section 150.

[0134] The experimental apparatus 200 uses a light source 121 to illuminate multiple sensors 173 together and measures the brightness of each sensor 173 (step S401).

[0135] In this embodiment, the control unit 140, based on the measurement results of the multiple sensors 173 of the measurement unit 130, interpolates the intensity of light illuminating the positions of the remaining LEDs 20 (excluding the aforementioned plurality of LEDs 20) to generate a correction map. Specifically, the test apparatus 200 quantifies the brightness amount measured in step S401, calculates a correction coefficient based on the quantified data, and uses this correction coefficient to interpolate the values ​​at positions where no sensors 173 are located on the multiple LEDs 20. The test apparatus 200 stores the interpolated data as a correction map in the storage unit 145 (step S403) and proceeds to... Figure 10 Step S305 of the process shown.

[0136] Figure 12is another example of a flowchart for explaining a procedure of generating a correction map to calculate a corrected measured value of a photoelectric signal of each LED 20 using the test device 200. The measurement unit 130 of the present embodiment has a light intensity measurement assembly 177 instead of using Figure 11 the light intensity measurement assembly 176 of the explained embodiment.

[0137] The light intensity measurement assembly 177 of the measurement unit 130 of the present embodiment sequentially measures intensities of light irradiated by the light source unit 120 to each of the positions of the plurality of LEDs 20 by sequentially moving along the positions. The light intensity measurement assembly 177 has one sensor 173 that is movable on the surface of the holding unit 171. The light intensity measurement assembly 177 can further reduce the number of sensors 173 compared to the light intensity measurement assemblies 175 and 176. In addition, the light intensity measurement assembly 177 can sequentially measure intensities of light irradiated to each of the positions of the plurality of LEDs 20 by sequentially moving along the positions without moving the plurality of LEDs 20. Figure 12 The movement path of the sensor 173 indicated by the arrow in the present embodiment is only an example, and other movement paths can also be used.

[0138] Figure 12 The flow illustrated in FIG. 27 is the same as the flow illustrated in FIG. 25. Figure 11 The flow illustrated in FIG. 27 is the same as the flow illustrated in FIG. 25. The flow is started by, for example, a user inputting to the test device 200 to start the flow in a state where the light intensity measurement assembly 177 is disposed on the placement unit 150.

[0139] The test device 200 irradiates light to the sensor 173 that sequentially moves along each of the positions of the plurality of LEDs 20 using the light source 121, measures the luminance of the sensor 173 at each position (step S501), and proceeds to Figure 10 step S303 of the flow illustrated in FIG. 27.

[0140] The test device 200 according to the above explained embodiment has the same effects as the test device 100 of the explained embodiment using Figures 1 to 6 the test device 200 has the same effects as the test device 100 of the explained embodiment using Figures 1 to 6 the test device 200 has the same effects as the test device 100 of the explained embodiment using

[0141] Further, in the present embodiment, the plurality of terminals 21 of the plurality of LEDs 20 can be brought into contact with the plurality of probes 213 by moving the placement portion 150 on which the LED group is placed in such a manner that the position coordinates of the plurality of probes 113 of the electrical connection portion 110 coincide with the position coordinates of the plurality of LEDs 20 of the LED group, and then raising and lowering the substrate 211 of the electrical connection portion 210 as indicated by the hollow arrows in the respective drawings.

[0142] Further, in the present embodiment, the plurality of terminals 21 of the plurality of LEDs 20 can be brought into contact with the plurality of probes 213 by moving the placement portion 150 on which the LED group is placed in such a manner that the position coordinates of the plurality of probes 113 of the electrical connection portion 110 coincide with the position coordinates of the plurality of LEDs 20 of the LED group, and then raising and lowering the substrate 211 of the electrical connection portion 210 as indicated by the hollow arrows in the respective drawings. Figure 7 The configuration illustrated in FIG. 16 is reversed in the Z-axis direction, and is configured to irradiate the parallel light 122 from the light source portion 120 to the plurality of LEDs 20 from the negative direction of the Z-axis.

[0143] Further, in the present embodiment, in order to prevent the wafer 25 from being deformed by the pressing of the plurality of probes 213 of the electrical connection portion 210, a support plate that transmits light, such as glass, can be interposed between the wafer 25 and the shielding portion 160, for example, in the case where the plurality of LEDs 20 are located on the light source portion 120 side as illustrated in FIG. 17. This support plate is preferably configured not to be in contact with the plurality of LEDs 20 in order not to break the plurality of LEDs 20 formed on the wafer 25. The aspects described above are also the same in the plurality of embodiments described later, and the repeated description is omitted. Figure 7

[0144] Further, in the test apparatus 100, 200 of the above embodiments, it is described that the control portion 140 is configured to generate the correction map using the holding portion 171 that holds one or a plurality of sensors 173 or a luminance meter instead of the wafer 15, 25 that holds the plurality of LEDs 10, 20. Instead, the control portion 140 can generate the correction map based on the average value of the photoelectric signals output by the LEDs 10, 20 arranged at the same position among the plurality of groups of LEDs 10, 20 from which the measurement portion 130 changes the order of the plurality of LEDs 10, 20 to be sequentially subjected to the test while performing the measurement a plurality of times.

[0145] For example, when the wafer 15, 25 to be subjected to the test is set to, for example, 30 pieces, the photoelectric signals of the 30 pieces of the wafer 15, 25 can be measured, the average value of the photoelectric signals output by the LEDs 10, 20 arranged at the same position among the plurality of groups of LEDs 10, 20 can be calculated, and the correction map can be generated based on the average value. Thus, the test apparatus 100, 200 can omit the light intensity measurement assembly 170 and the like.

[0146] ​In this case, the measured value of the photoelectric signal output from the LED 10, 20 arranged at the same position among the groups of the plurality of LEDs 10, 20 can be excluded, for example, like the measured value of the photoelectric signal output from the defective LED 10, 20, which is significantly abnormal compared with other measured values. This exclusion can use a threshold value prescribed in advance for the measured value. Thereby, the calculation accuracy of the average value can be improved.

[0147] Figure 13 This is another example of a flowchart illustrating the flow of the test method using the test device 200. The control section 140 of the test device 200 of the present embodiment additionally or alternatively changes the intensity of the light emitted from the light source section 120, and determines whether each of the plurality of LEDs 20 is good or not based on the measurement result of the measurement section 130 at the time of the change in intensity. In other words, the control section 140 changes the intensity of the light emitted from the light source section 120, and judges the reaction of each LED 20 corresponding to the change in intensity of the light. Further, the control section 140 of the present embodiment functions as an example of a light source control section.

[0148] The higher the current value applied to the LED 20, the stronger the light emitted, but there is an individual difference, and when the current value is low, there is a case where the characteristics cannot be sufficiently exhibited, i.e., the light cannot be properly emitted. Therefore, in the case where the LED 20 is caused to perform photoelectric conversion, as long as the LED 20 can make a proper reaction, i.e., properly output a photoelectric signal even if weak light is irradiated to the LED 20, it can be regarded as an LED 20 that can properly emit light even with a low current value.

[0149] Figure 13 The flow illustrated in Figure 4 As with the flow illustrated in Figure 4 corresponding to steps S101, S103, and S105 in the flow illustrated in

[0150] The test apparatus 200 changes the light intensity and determines whether the measurement results required for determining whether each of the multiple LEDs 20 on the wafer 25 is in good condition have been obtained (step S127). If not, (step S127: No) the light source control stage that changes the intensity of the light irradiated in the irradiation stage of step S123 is executed (step S129), and the process returns to step S123. As a specific example, the control unit 140 can refer to the reference data in the storage unit 145 to determine whether the measurement results are stored when the multiple LEDs 20 are irradiated with light of an intensity above a predetermined threshold and when they are irradiated with light of an intensity below a predetermined threshold. When the storage unit 145 does not store at least one of these measurement results, the control unit 140 changes the intensity of the light emitted by the light source unit 120 and irradiates the multiple LEDs 20 again.

[0151] In step S127, if the test apparatus 200 obtains the measurement results required to determine whether each of the multiple LEDs 20 on the wafer 25 is good (step S127: Yes), based on the measurement results of the measurement stage when the intensity is changed in the light source control stage of step S129, the test apparatus 200 performs the determination stage to determine whether each of the multiple LEDs 20 is good (step S131), and the process ends.

[0152] The test apparatus 200 according to the embodiments described above has the same characteristics as that used in the test apparatus 200. Figures 1 to 12 The test apparatuses 100 and 200 of the various embodiments described have the same effect. In this embodiment, the control unit 140 can, for example, calculate the photoelectric gain of each of the multiple LEDs 20 based on measurement results under two or more different intensities. In this case, the control unit 140 can determine that at least one LED 20 among the multiple LEDs 20 whose photoelectric gain is outside the normal range is defective. More specifically, the control unit 140 can determine that at least one LED 20 whose photoelectric gain is outside the normal range under two or more different intensities is defective.

[0153] In this embodiment, the control unit 140 can, for example, determine at least one LED 20 out of a plurality of LEDs 20 as defective. This at least one LED 20 is one whose photoelectric signal measured at two or more different intensities is outside the normal range. More specifically, the control unit 140 can determine at least one LED 20 whose photoelectric signal is outside the normal range at two or more different intensities as defective.

[0154] Figure 14This is another example of a flowchart that explains the flow of the test method performed using the test device 200. The control section 140 of the test device 200 of this embodiment additionally or alternatively causes the wavelength of the light emitted by the light source section 120 to vary within a predetermined range including the predetermined reaction wavelength of the plurality of LEDs 20, and determines whether each of the plurality of LEDs 20 is good or not based on the measurement results of the measurement section 130 at the time of the variation in wavelength. In other words, the control section 140 causes the wavelength of the light emitted by the light source section 120 to vary within a predetermined range including the predetermined reaction wavelength of the plurality of LEDs 20, and judges the reaction of each LED 20 corresponding to the variation in wavelength of the light.

[0155] The reaction peak corresponding to the light from the light source 121 of the LED 10 whose emission wavelength has become bad due to the shift will also shift. Therefore, the test device 200 additionally has a function of shifting the wavelength of the light emitted by the light source 121, that is, a wavelength selection function. As a specific example, in the case where the light source 121 is a light source having a wide wavelength band, such as a xenon light source, the test device 200 can have a configuration in which, on the output side (front end) of the light of the light source 121, for example, a light splitter such as one using a slit is provided to split the light from the light source 121 and allow only light of a specific wavelength to pass through. In addition, as another example, in the case where the light source 121 is a laser light source having a narrow wavelength band, the test device 200 can include a diffraction grating or the like on the front end of the light source 121. In addition, as another example, the light source 121 can include a plurality of laser light sources having a narrow wavelength band.

[0156] The control section 140 judges which wavelength each LED 10 reacts to by scanning the wavelength of the light from the light source 121, for example, from 350 nm in steps of 1 nm to 400 nm, and thereby can judge the emission wavelength of each LED 10.

[0157] Figure 14 The flow illustrated in Figure 4 As with the flow illustrated in Figure 4 corresponding to steps S101, S103, and S105 in the flow illustrated in

[0158] The test device 200 causes the wavelength of the light to vary within a predetermined range including the predetermined reaction wavelength of the plurality of LEDs 20, judges whether or not the measurement results required to judge whether or not each of the plurality of LEDs 20 on the wafer 25 is good are obtained (step S147), in the case where they are not obtained (step S147: No), executes a light source control stage of causing the wavelength of the light irradiated in the irradiation stage of step S143 to vary within a predetermined range including the predetermined reaction wavelength of the plurality of LEDs 20 (step S149), and returns to step S143. As a specific example, the control section 140 can refer to the reference data of the storage section 145, and judge whether or not the measurement results in the case where the plurality of LEDs 20 are irradiated with a specified number of different wavelengths of light centered on the reaction wavelength on the design of the plurality of LEDs 20 are stored. In the case where the measurement results based on the specified number or more of different wavelengths of light are not stored in the storage section 145, the control section 140 causes the light emitted from the light source section 120 to shift in wavelength by, for example, a predetermined wavelength width, and again irradiates the plurality of LEDs 20 with light.

[0159] The test device 200, in the case where the measurement results required to judge whether or not each of the plurality of LEDs 20 on the wafer 25 is good are obtained in step S147 (step S147: Yes), executes a judgment stage of judging whether or not each of the plurality of LEDs 20 is good based on the measurement results of the measurement stage in the case where the wavelength is changed in the light source control stage of step S149 (step S151), and this flow ends.

[0160] The test device 200 according to the embodiment described above has the same effects as the test devices 100, 200 of the plurality of embodiments described above. The control section 140 in this embodiment can, for example, calculate the photoelectric gain of each of the plurality of LEDs 20 based on the measurement results under each of two or more different wavelengths. In this case, the control section 140 can judge at least one LED 20 of the plurality of LEDs 20 whose photoelectric gain is outside the normal range as being defective. More specifically, the control section 140 can judge at least one LED 20 whose photoelectric gain is outside the normal range under each of two or more different wavelengths as being defective. Figures 1 to 13 The control section 140 in this embodiment can, for example, judge at least one LED 20 of the plurality of LEDs 20 as being defective, which is an LED 20 whose photoelectric signal measured under each of two or more different wavelengths is outside the normal range. More specifically, the control section 140 judges at least one LED 20 whose photoelectric signal is outside the normal range under each of two or more different wavelengths as being defective.

[0161]

[0162] Figure 15 ​This is an example of an overall diagram showing a schematic configuration of a test apparatus 300 for testing multiple LEDs 30. Unlike test apparatuses 100 and 200, test apparatus 300 is positioned with the entire test apparatus 200 reversed in the Z-axis direction. Figure 15 In the illustrated embodiment, the LED group is a back-emitting type where the light-emitting surfaces of multiple LEDs 30 face the wafer 35, and the wafer 35 allows light to pass through. The terminals 31 of the multiple LEDs 30 do not face the wafer 35. Furthermore, for back-emitting LED groups like this embodiment, the multiple LEDs 30 and the wafer 35 on which the multiple LEDs 30 are mounted are sometimes collectively referred to as a wafer.

[0163] In this configuration, the electrical connection portion 210 allows multiple probes 213 to contact the terminals 31 of the multiple LEDs 30 from the positive Z-axis direction side of the wafer 35. Additionally, in Figure 15 In the illustrated embodiment, the mounting portion 155 differs from the mounting portion 150 in that, in order not to block the light emitted by the plurality of LEDs 30 and transmitted through the wafer 35, a light-transmitting portion 156 is provided at the center of the XY plane, and the wafer 35 is held around the light-transmitting portion 156. As an example, the light-transmitting portion 156 can be a simple through-hole, or it can be a configuration in which a light-transmitting component such as glass is embedded within the through-hole. According to... Figure 15 The test apparatus 300 of the illustrated embodiment has a design compatible with the use of Figures 1 to 14 The test apparatus 100 and 200 of the various embodiments described have the same effect.

[0164] In the above embodiments, when the LED group is configured such that multiple LEDs are formed on a panel (PLP) with electrical wiring and a generally square shape, the electrical connection part can be configured such that the probe contacts each wiring arranged on the two sides of the panel in the row direction and column direction.

[0165] Various embodiments of the present application can be described with reference to flow charts and block diagrams that illustrate the architectural, functional, and operational aspects of the processes that comprise the present application. Block diagrams can be employed to illustrate the functional components of the processes that comprise the present application. The flow charts and block diagrams can depict the architecture, functionality, and operation of possible implementations of apparatuses and methods relating to the present application. In this regard, each block in the flow charts or block diagrams can represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical functions ("hardware" or "software" modules). It should also be noted that each block of the flow charts or block diagrams and, wherein appropriate, combinations of blocks in the flow charts or block diagrams can represent a process, or a portion of a process. The processes can be implemented in hardware, software, or a combination of hardware and software. The processes can also be implemented by specially configured processors, or by a computer readable medium containing executable instructions for implementing the processes. The computer readable medium can include a computer readable storage medium and a computer readable communication medium. The computer readable storage medium can include, for example, a floppy disk, a flexible disk, a hard disk, a magnetic tape, a magnetic disk, a punch card, a compact disk (CD), a digital versatile disk (DVD), a Blu-ray disk, a memory stick, a memory card, a RAM, a ROM, an erasable programmable ROM (EPROM), an electrically erasable programmable ROM (EEPROM), a programmable ROM (PROM), a flash ROM, and the like. The computer readable communication medium can include, for example, a computer readable signal that can be transmitted through an electrical cable, a fiber optic cable, or a wireless transmission medium, and the like.

[0166] The computer readable medium can include any tangible device that can store instructions for execution by an appropriate device, and the computer readable medium having instructions stored therein includes a product that includes the instructions executable by a means for manufacturing a device to perform the operations specified by the flow chart or block diagram. As examples of the computer readable medium, there can be included electronic storage media, magnetic storage media, optical storage media, electromagnetic storage media, semiconductor storage media, and the like. As more specific examples of the computer readable medium, there can be included a floppy disk, a diskette, a hard disk, a random access memory (RAM), a read only memory (ROM), an erasable programmable read only memory (EPROM or flash memory), an electrically erasable programmable read only memory (EEPROM), a static random access memory (SRAM), a compact disk read only memory (CD-ROM), a digital versatile disk (DVD), a Blu-ray (RTM) disk, a Memory Stick, an integrated circuit card, and the like.

[0167] The computer readable instructions can include assembly instructions, instruction-set architecture (ISA) instructions, machine instructions, machine dependent instructions, microcode, firmware instructions, state-setting data, or any combination of source code or object code in any combination of one or more programming languages, including Smalltalk, Java, C++, and conventional procedural programming languages, such as the "C" programming language or similar programming languages.

[0168] The computer readable instructions can be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, implement the operations specified by the flow diagrams or block diagrams. As used in this specification, the terms "computer", "processor", and "memory" all refer to electronic or other technological devices. Examples of computer

[0169] Figure 16 The computer 1200 represents a computing device where all or part of an embodiment of the present application can be implemented. The programs installed in the computer 1200 can cause the computer 1200 to function as or perform the operations of one or more "parts" of the apparatus of an embodiment of the present application, or cause the computer 1200 to perform the procedures or stages of the procedures of an embodiment of the present application. Such programs can be executed by the CPU (Central Processing Unit) 1212 to cause the computer 1200 to perform specific operations associated with a number or all of the blocks in the flow diagrams and block diagrams of the present specification.

[0170] The computer 1200 of the present embodiment includes the CPU 1212, the RAM 1214, the graphics controller 1216, and the display device 1218, which are connected to each other through the host controller 1210. The computer 1200 further includes input / output components such as the communication interface 1222, the hard disk drive 1224, the DVD-ROM (Digital Versatile Disc-Read Only Memory) drive 1226, and the IC card drive, which are connected to the host controller 1210 via the input / output controller 1220. The computer further includes conventional input / output components such as the ROM 1230 and the keyboard 1242, which are connected to the input / output controller 1220 via the input / output chip 1240.

[0171] The CPU 1212 acts in accordance with programs stored in the ROM 1230 and the RAM 1214, thereby controlling the components. The video controller 1216 acquires video data generated by the CPU 1212 in a frame buffer or the like provided in the video controller 1216 itself, and causes the video data to be displayed on the display device 1218.

[0172] The communication interface 1222 communicates with other electronic devices via a network. The hard disk drive 1224 stores programs and data used by the CPU 1212 in the computer 1200. The DVD-ROM drive 1226 reads programs or data from the DVD-ROM 1201, and provides the programs or data to the hard disk drive 1224 via the RAM 1214. The IC card drive reads programs and data from an IC card, and / or writes programs and data into the IC card.

[0173] The ROM 1230 internally stores a boot program or the like executed by the computer 1200 at activation, and / or a program related to the hardware of the computer 1200. The input / output chip 1240 can additionally connect various input / output components to the input / output controller 1220 via a parallel port, a serial port, a keyboard port, a mouse port, or the like.

[0174] A program is provided by a computer-readable storage medium such as the DVD-ROM 1201 or the IC card. The program is read from the computer-readable storage medium, and installed into the hard disk drive 1224, the RAM 1214, or the ROM 1230, which are examples of computer-readable storage media, and executed by the CPU 1212. Information processing described in these programs is read by the computer 1200, thereby realizing cooperation between the programs and the various types of hardware resources. An apparatus or a method can be configured to realize operation or processing of information as the computer 1200 is used.

[0175] For example, when communication is performed between the computer 1200 and an external device, the CPU 1212 can execute a communication program loaded into the RAM 1214, instruct the communication interface 1222 to perform communication processing based on processing described in the communication program. The communication interface 1222 reads transmission data stored in a transmission buffer area provided in a recording medium such as the RAM 1214, the hard disk drive 1224, the DVD-ROM 1201, or the IC card, under the control of the CPU 1212, and transmits the read transmission data to a network, or writes reception data received from the network into a reception buffer area or the like provided on the recording medium.

[0176] In addition, the CPU 1212 can read all or a desired part of a file or a database stored in an external recording medium such as the hard disk drive 1224, the DVD-ROM drive 1226 (DVD-ROM 1201), an IC card, and the like into the RAM 1214, and perform various types of processing on the data on the RAM 1214. The CPU 1212 can then write back the processed data into the external recording medium.

[0177] Various types of information such as various types of programs, data, tables, and databases can be stored into a recording medium to perform information processing. The CPU 1212 can perform various types of processing such as various types of operations, information processing, conditional judgment, conditional branching, unconditional branching, search / replacement of information, and the like, which are described anywhere in the present disclosure and are specified by an instruction sequence of a program, on the data read from the RAM 1214, and write back the results to the RAM 1214. In addition, the CPU 1212 can search for information in a file and a database and the like within a recording medium. For example, when a plurality of entries each having an attribute value of a first attribute associated with an attribute value of a second attribute are stored within a recording medium, the CPU 1212 can search for an entry that matches a condition in which an attribute value of the first attribute is specified from among the plurality of entries, read the attribute value of the second attribute stored within the entry, and thereby acquire the attribute value of the second attribute associated with the first attribute that satisfies a predetermined condition.

[0178] The programs or software modules described above can be stored into a computer readable storage medium on or near the computer 1200. In addition, a recording medium such as a hard disk or a RAM provided within a server system connected to a dedicated communication network or the Internet can be used as a computer readable storage medium, whereby a program is provided to the computer 1200 via a network.

[0179] The present application has been described above using embodiments, but the technical scope of the present application is not limited to the scope described in the embodiments. Various changes or modifications can be made to the embodiments by those skilled in the art. In addition, matters described with respect to a certain embodiment can be applied to other embodiments within a range not contradictory in the technical field. In addition, each component can have the same characteristics as another component having the same name but a different reference sign. Such a manner in which changes or modifications are made is also included in the technical scope of the present application according to the recitations of the claims.

[0180] It should be noted that the order of execution of the processes illustrated in the claims, specification, and drawings, such as the actions, sequences, steps, and stages of the devices, systems, programs, and methods, can be carried out in any order unless specifically stated otherwise, and that the output of a previous process is not necessarily used as input to a subsequent process. With regard to the flow of actions in the claims, specification, and drawings, even if described in a particular order, the use of "first," "second," etc., does not necessarily indicate that the actions are carried out in that order unless specifically stated otherwise.

[0181] [Explanation of symbols]

[0182] 10, 20, 30 LED

[0183] 11, 21, 31 terminal

[0184] 15, 25, 35 wafer

[0185] 100, 200, 300 test device

[0186] 110, 210 electrical connection portion

[0187] 111, 211 substrate

[0188] 112 opening

[0189] 113, 213 probe

[0190] 120 light source portion

[0191] 121 light source

[0192] 122 parallel light

[0193] 123 lens assembly

[0194] 124 filter holding portion

[0195] 125 temperature suppression filter

[0196] 126 temperature control portion

[0197] 130 measurement portion

[0198] 140 control portion

[0199] 145 storage portion

[0200] 150, 155 placement portion

[0201] 156 light-transmitting portion

[0202] 160 shielding portion

[0203] 170, 175, 176, 177 light intensity measurement assembly

[0204] 171 holding portion

[0205] 173 sensor

[0206] 1200 computer

[0207] 1201 DVD-ROM

[0208] 1210 host controller

[0209] 1212 CPU

[0210] 1214 RAM

[0211] 1216 graphics controller

[0212] 1218 display device

[0213] 1220 input / output controller

[0214] 1222 communication interface

[0215] 1224 hard disk drive

[0216] 1226 DVD-ROM drive

[0217] 1230 ROM

[0218] 1240 input / output chip

[0219] 1242 keyboard

Claims

1. An inspection apparatus comprising: an electrical connection portion electrically connected to terminals of a plurality of light emitting elements that are to be inspected; a light source portion that irradiates light to the plurality of light emitting elements together; a measurement portion that measures photoelectric signals output from the plurality of light emitting elements that respectively photoelectrically convert light irradiated by the light source portion and are output via the electrical connection portion; an acquisition portion that acquires a correction map including correction values for correcting unevenness in intensity of light irradiated by the light source portion to positions of the plurality of light emitting elements; a determination portion that determines whether or not each of the plurality of light emitting elements is good or not based on a measurement result of the measurement portion and the correction map acquired by the acquisition portion; the determination portion determines at least one light emitting element of the plurality of light emitting elements as being not good, the at least one light emitting element being a light emitting element whose correction value, which is obtained by correcting the measured photoelectric signal using the correction map, is outside a normal range; the determination portion uses, as the normal range, a range based on a statistic amount corresponding to the correction value, which is obtained by correcting measurement results of the measurement portion, which are obtained by simultaneously measuring a plurality of times from among a group of light emitting elements while changing the plurality of light emitting elements that sequentially become the inspection targets, using the correction map to correct the photoelectric signals output from light emitting elements disposed at the same position among the groups of the plurality of light emitting elements in the measurement results.

2. An inspection apparatus comprising: an electrical connection portion electrically connected to terminals of a plurality of light emitting elements that are to be inspected; a light source portion that irradiates light to the plurality of light emitting elements together; a measurement portion that measures photoelectric signals output from the plurality of light emitting elements that respectively photoelectrically convert light irradiated by the light source portion and are output via the electrical connection portion; an acquisition portion that acquires a correction map including correction values for correcting unevenness in intensity of light irradiated by the light source portion to positions of the plurality of light emitting elements; a determination portion that determines whether or not each of the plurality of light emitting elements is good or not based on a measurement result of the measurement portion and the correction map acquired by the acquisition portion; a second measurement portion that measures intensity of light irradiated by the light source portion to positions of the plurality of light emitting elements; and a generation portion that generates the correction map based on a second measurement result of the second measurement portion.

3. An inspection apparatus comprising: an electrical connection portion electrically connected to terminals of a plurality of light emitting elements that are to be inspected; a light source portion that irradiates light to the plurality of light emitting elements together; a measurement portion that measures photoelectric signals output from the plurality of light emitting elements that respectively photoelectrically convert light irradiated by the light source portion and are output via the electrical connection portion; an acquisition portion that acquires a correction map including correction values for correcting unevenness in intensity of light irradiated by the light source portion to positions of the plurality of light emitting elements; a determination portion that determines whether or not each of the plurality of light emitting elements is good or not based on a measurement result of the measurement portion and the correction map acquired by the acquisition portion; ​ ​ ​ ​ a second measurement section that measures intensity of light emitted by the light source section toward positions of a plurality of light emitting elements other than the plurality of light emitting elements; a generation section that generates the correction map based on a second measurement result of the second measurement section.

4. A test device comprising: an electrical connection section that is electrically connected to terminals of a plurality of light emitting elements that are test targets; a light source section that emits light toward the plurality of light emitting elements; a measurement section that measures photoelectric signals that are output from the plurality of light emitting elements via the electrical connection section, the photoelectric signals being obtained by photoelectrically converting light emitted by the light source section; an acquisition section that acquires a correction map that includes correction values for correcting unevenness in intensity of light emitted by the light source section toward positions of the plurality of light emitting elements; a determination section that determines whether or not the plurality of light emitting elements are good based on a measurement result of the measurement section and the correction map acquired by the acquisition section; a second measurement section that measures intensity of light emitted by the light source section toward positions of the plurality of light emitting elements by sequentially moving along the positions of the plurality of light emitting elements; and a generation section that generates the correction map based on a second measurement result of the second measurement section.

5. A test device comprising: an electrical connection section that is electrically connected to terminals of a plurality of light emitting elements that are test targets; a light source section that emits light toward the plurality of light emitting elements; a measurement section that measures photoelectric signals that are output from the plurality of light emitting elements via the electrical connection section, the photoelectric signals being obtained by photoelectrically converting light emitted by the light source section; an acquisition section that acquires a correction map that includes correction values for correcting unevenness in intensity of light emitted by the light source section toward positions of the plurality of light emitting elements; a determination section that determines whether or not the plurality of light emitting elements are good based on a measurement result of the measurement section and the correction map acquired by the acquisition section; a generation section that generates the correction map based on an average value of the photoelectric signals output from light emitting elements disposed at the same position among groups of the plurality of light emitting elements in a measurement result obtained by the measurement section by changing the groups of the plurality of light emitting elements that are sequentially test targets while performing a plurality of measurements.

6. The test device according to claim 1, wherein the determination section corrects measurement values of the photoelectric signals measured by the measurement section with respect to the plurality of light emitting elements using the correction values for the positions of the plurality of light emitting elements in the correction map, and determines whether or not the plurality of light emitting elements are good based on the measurement values of the photoelectric signals after correction.

7. The test device according to claim 1, wherein the determination section uses a range based on a statistic corresponding to a correction value obtained by correcting the photoelectric signals output from the plurality of light emitting elements using the correction map as the normal range. ​ ​ ​ 8. The test device according to claim 2, wherein the second measuring section has the same number of sensors as the plurality of light emitting elements, the plurality of sensors are respectively arranged at the same positions as the respective positions of the plurality of light emitting elements.

9. The test device according to claim 2, wherein the second measuring section has a two-dimensional brightness meter for measuring the intensity of light irradiated on the respective positions of the plurality of light emitting elements at one time.

10. The test device according to claim 3, wherein the second measuring section has a smaller number of sensors than the plurality of light emitting elements, the plurality of sensors are respectively arranged at the positions of the light emitting elements, the plurality of sensors are spaced apart from each other by a predetermined interval.

11. The test device according to claim 3, wherein the second measuring section has a two-dimensional brightness meter for measuring the intensity of light irradiated on the positions of the light emitting elements at one time; and the two-dimensional brightness meter has a smaller number of pixels than another two-dimensional brightness meter for measuring the intensity of light irradiated on the respective positions of the plurality of light emitting elements at one time.

12. The test device according to claim 8 or 10, further comprising a correction section for calibrating the measured values of the plurality of sensors of the second measuring section using a surface light source whose uniformity has been corrected.

13. A test method comprising: an electrical connection stage of electrically connecting an electrical connection section to the respective terminals of a plurality of light emitting elements that are test targets; an irradiation stage of irradiating light on the plurality of light emitting elements together; a measurement stage of measuring photoelectric signals that are output from the plurality of light emitting elements by photoelectric conversion of the irradiated light; an acquisition stage of acquiring a correction map including correction values for correcting unevenness in the intensity of light irradiated on the respective positions of the plurality of light emitting elements; and a determination stage of determining whether or not the plurality of light emitting elements are good or not based on the measurement results of the measurement stage and the correction map acquired in the acquisition stage; the determination stage determines at least one light emitting element of the plurality of light emitting elements to be defective, the at least one light emitting element being a light emitting element whose correction value obtained by correcting the measured photoelectric signal using the correction map is outside a normal range; the determination stage uses, as the normal range, a range based on a statistic value corresponding to the correction values obtained by correcting the photoelectric signals output from the light emitting elements arranged at the same positions among the groups of the plurality of light emitting elements that are sequentially changed as test targets in the measurement stage while the measurement is performed a plurality of times.

14. A test method comprising: an electrical connection stage of electrically connecting an electrical connection section to the respective terminals of a plurality of light emitting elements that are test targets; an irradiation stage of irradiating light on the plurality of light emitting elements together; a measurement stage of measuring photoelectric signals outputted from the plurality of light emitting elements through the electrical connection portion by photoelectric conversion of the light irradiated to each of the plurality of light emitting elements; a generation stage of generating the correction map based on the second measurement result of the second measurement stage. and a determination stage of determining whether each of the plurality of light emitting elements is good or not based on the measurement result of the measurement stage and the correction map acquired in the acquisition stage. a second measurement stage of measuring intensities of the light irradiated to each of the plurality of light emitting elements in the irradiation stage; and a generation stage of generating the correction map based on the second measurement result of the second measurement stage.

15. A test method, comprising: an electrical connection stage of electrically connecting an electrical connection portion to a terminal of each of a plurality of light emitting elements which are test targets; an irradiation stage of irradiating light to the plurality of light emitting elements together; a measurement stage of measuring photoelectric signals outputted from the plurality of light emitting elements through the electrical connection portion by photoelectric conversion of the light irradiated to each of the plurality of light emitting elements; an acquisition stage of acquiring a correction map including a correction value for correcting unevenness of intensity of the light irradiated to each of the plurality of light emitting elements; and a determination stage of determining whether each of the plurality of light emitting elements is good or not based on the measurement result of the measurement stage and the correction map acquired in the acquisition stage. a second measurement stage of measuring intensities of a part of the light irradiated to each of the plurality of light emitting elements in the irradiation stage, that is, intensities of the light irradiated to a plurality of light emitting elements; and a generation stage of generating the correction map based on the second measurement result of the second measurement stage by interpolating intensities of the light irradiated to the remaining light emitting elements other than the plurality of light emitting elements among the plurality of light emitting elements.

16. A test method, comprising: an electrical connection stage of electrically connecting an electrical connection portion to a terminal of each of a plurality of light emitting elements which are test targets; an irradiation stage of irradiating light to the plurality of light emitting elements together; a measurement stage of measuring photoelectric signals outputted from the plurality of light emitting elements through the electrical connection portion by photoelectric conversion of the light irradiated to each of the plurality of light emitting elements; an acquisition stage of acquiring a correction map including a correction value for correcting unevenness of intensity of the light irradiated to each of the plurality of light emitting elements; and a determination stage of determining whether each of the plurality of light emitting elements is good or not based on the measurement result of the measurement stage and the correction map acquired in the acquisition stage. a second measurement stage of measuring intensities of the light irradiated to each of the plurality of light emitting elements in the irradiation stage by sequentially moving along positions of the plurality of light emitting elements; and a generation stage of generating the correction map based on the second measurement result of the second measurement stage.

17. A test method, comprising: an electrical connection stage of electrically connecting an electrical connection portion to a terminal of each of a plurality of light emitting elements which are test targets; an irradiation stage of irradiating light to the plurality of light emitting elements together; a measurement stage of measuring photoelectric signals outputted from the plurality of light emitting elements through the electrical connection portion by photoelectric conversion of the light irradiated to each of the plurality of light emitting elements; ​ an acquisition stage of acquiring a correction map including correction values for correcting unevenness in intensity of light emitted to each of the plurality of light emitting elements; and a determination stage of determining whether each of the plurality of light emitting elements is good or not based on the measurement result of the measurement stage and the correction map acquired in the acquisition stage; an acquisition stage of acquiring a correction map including correction values for correcting unevenness in intensity of light emitted to each of the plurality of light emitting elements; 18. A test device comprising: an electrical connection portion electrically connected to a terminal of each of a plurality of light emitting elements that are test targets; a light source portion that irradiates light to the plurality of light emitting elements together; a measurement portion that measures a photoelectric signal output from the plurality of light emitting elements through the electrical connection portion, the photoelectric signal being photoelectrically converted by the plurality of light emitting elements from the light irradiated by the light source portion; a light source control portion that changes intensity of the light emitted from the light source portion; and a determination portion that determines whether each of the plurality of light emitting elements is good or not based on a measurement result of the measurement portion when the intensity is changed by the light source control portion; the determination portion calculates a photoelectric gain of each of the plurality of light emitting elements based on the measurement result under each of two or more different intensities, and determines at least one light emitting element of the plurality of light emitting elements whose photoelectric gain is outside a normal range as being defective.

19. A test device comprising: an electrical connection portion electrically connected to a terminal of each of a plurality of light emitting elements that are test targets; a light source portion that irradiates light to the plurality of light emitting elements together; a measurement portion that measures a photoelectric signal output from the plurality of light emitting elements through the electrical connection portion, the photoelectric signal being photoelectrically converted by the plurality of light emitting elements from the light irradiated by the light source portion; a light source control portion that changes intensity of the light emitted from the light source portion; and a determination portion that determines whether each of the plurality of light emitting elements is good or not based on a measurement result of the measurement portion when the intensity is changed by the light source control portion; the determination portion determines at least one light emitting element of the plurality of light emitting elements as being defective, the at least one light emitting element being a light emitting element whose photoelectric signal measured under each of two or more different intensities is outside a normal range.

20. The test device according to claim 18, wherein the determination portion determines at least one light emitting element whose photoelectric gain is outside a normal range under each of the two or more different intensities as being defective.

21. The test device according to claim 19, wherein the determination portion determines at least one light emitting element whose photoelectric signal is outside a normal range under each of the two or more different intensities as being defective.

22. The test device according to any one of claims 18 to 21, wherein the determination portion uses a range based on a statistic of the photoelectric signal output from each of the plurality of light emitting elements as the normal range.

23. The test device according to any one of claims 18 to 21, wherein the determination section uses, as the normal range, a range based on a statistical quantity corresponding to the photoelectric signal output from the light emitting element arranged at the same position in the groups of the plurality of light emitting elements in the measurement results obtained by the measurement section by changing the groups of the plurality of light emitting elements successively to be the test target while performing the measurement a plurality of times.

24. A test method comprising: an electrical connection stage of electrically connecting an electrical connection section to a terminal of each of a plurality of light emitting elements that are test targets; an irradiation stage of irradiating light to the plurality of light emitting elements together; a measurement stage of measuring a photoelectric signal output from the plurality of light emitting elements by photoelectric conversion of the irradiated light and via the electrical connection section; a light source control stage of changing an intensity of the light irradiated in the irradiation stage; and a determination stage of determining whether each of the plurality of light emitting elements is good or not based on the measurement results of the measurement stage when the intensity is changed in the light source control stage; the determination stage calculates a photoelectric gain of each of the plurality of light emitting elements based on the measurement results under each of two or more different intensities, and determines at least one light emitting element of the plurality of light emitting elements whose photoelectric gain is outside a normal range as being not good.

25. A test method comprising: an electrical connection stage of electrically connecting an electrical connection section to a terminal of each of a plurality of light emitting elements that are test targets; an irradiation stage of irradiating light to the plurality of light emitting elements together; a measurement stage of measuring a photoelectric signal output from the plurality of light emitting elements by photoelectric conversion of the irradiated light and via the electrical connection section; a light source control stage of changing an intensity of the light irradiated in the irradiation stage; and a determination stage of determining whether each of the plurality of light emitting elements is good or not based on the measurement results of the measurement stage when the intensity is changed in the light source control stage; the determination stage determines at least one light emitting element of the plurality of light emitting elements as being not good, the at least one light emitting element being a light emitting element whose photoelectric signal measured under each of two or more different intensities is outside a normal range.

26. A test device comprising: an electrical connection section electrically connected to a terminal of each of a plurality of light emitting elements that are test targets; a light source section that irradiates light to the plurality of light emitting elements together; a measurement section that measures a photoelectric signal output from the plurality of light emitting elements by photoelectric conversion of the light irradiated by the light source section and via the electrical connection section; a light source control section that changes a wavelength of the light emitted by the light source section within a predetermined range including a predetermined reaction wavelength of the plurality of light emitting elements; and a determination section that determines whether each of the plurality of light emitting elements is good or not based on the measurement results of the measurement section when the wavelength is changed by the light source control section; the determination section calculates a photoelectric gain of each of the plurality of light emitting elements based on the measurement results under each of two or more different wavelengths, and determines at least one light emitting element of the plurality of light emitting elements whose photoelectric gain is outside a normal range as being not good. ​ at least one of the plurality of light emitting elements whose photoelectric gain is outside the normal range is determined to be defective.

27. A test device comprising: an electrical connection portion electrically connected to a terminal of each of a plurality of light emitting elements that are test targets; a light source portion that irradiates light to the plurality of light emitting elements together; a measurement portion that measures a photoelectric signal that is output from the plurality of light emitting elements via the electrical connection portion, the photoelectric signal being photoelectrically converted by each of the plurality of light emitting elements from the light irradiated by the light source portion; The light source control section causes the light source section to change the wavelength of the light emitted thereby within a predetermined range including a predetermined reaction wavelength of the plurality of light emitting elements. a light source control portion that changes a wavelength of the light irradiated in the irradiation portion within a predetermined range including a predetermined reaction wavelength of the plurality of light emitting elements; and a determination portion that determines whether each of the plurality of light emitting elements is good or not based on a measurement result of the measurement portion when the wavelength is changed by the light source control portion; the determination portion determines at least one of the plurality of light emitting elements to be defective, the at least one of the plurality of light emitting elements being a light emitting element whose photoelectric signal measured at each of two or more different wavelengths is outside a normal range.

28. The test device according to claim 26, wherein the determination portion determines at least one of the plurality of light emitting elements to be defective, the at least one of the plurality of light emitting elements being a light emitting element whose photoelectric gain is outside a normal range at each of the two or more different wavelengths.

29. The test device according to claim 27, wherein the determination portion determines at least one of the plurality of light emitting elements to be defective, the at least one of the plurality of light emitting elements being a light emitting element whose photoelectric signal is outside a normal range at each of the two or more different wavelengths.

30. The test device according to any one of claims 26 to 29, wherein the determination portion uses, as the normal range, a range based on a statistic corresponding to the photoelectric signal output from each of the plurality of light emitting elements.

31. The test device according to any one of claims 26 to 29, wherein the determination portion uses, as the normal range, a range based on a statistic corresponding to the photoelectric signal output from a light emitting element disposed at the same position among groups of the plurality of light emitting elements, the measurement result being obtained by the measurement portion by measuring a plurality of times while changing the groups of the plurality of light emitting elements that are sequentially test targets.

32. A test method comprising: an electrical connection stage of electrically connecting an electrical connection portion to a terminal of each of a plurality of light emitting elements that are test targets; an irradiation stage of irradiating light to the plurality of light emitting elements together; a measurement stage of measuring a photoelectric signal that is output from the plurality of light emitting elements via the electrical connection portion, the photoelectric signal being photoelectrically converted by each of the plurality of light emitting elements from the light irradiated; a light source control stage of changing a wavelength of the light irradiated in the irradiation stage within a predetermined range including a predetermined reaction wavelength of the plurality of light emitting elements; and a determination stage of determining whether each of the plurality of light emitting elements is good or not based on a measurement result of the measurement stage when the wavelength is changed in the light source control stage; the determination stage calculates a photoelectric gain of each of the plurality of light emitting elements based on the measurement result at each of two or more different wavelengths, and determines at least one of the plurality of light emitting elements to be defective, the at least one of the plurality of light emitting elements being a light emitting element whose photoelectric gain is outside a normal range.

33. A test method comprising: ​ an electrical connection stage in which the electrical connection portion is electrically connected to the terminal of each of the plurality of light emitting elements that are the test targets; an irradiation stage in which light is irradiated to the plurality of light emitting elements together; a measurement stage in which the photoelectric signal that is output from the photoelectric conversion of the irradiated light by each of the plurality of light emitting elements is measured; a light source control stage in which the wavelength of the light irradiated in the irradiation stage is changed within a predetermined range that includes the predetermined reaction wavelength of the plurality of light emitting elements; and a determination stage in which it is determined whether each of the plurality of light emitting elements is good or not based on the measurement results of the measurement stage when the wavelength is changed in the light source control stage. In the determination stage, at least one light emitting element of the plurality of light emitting elements is determined to be not good, the at least one light emitting element being a light emitting element in which the photoelectric signal measured at each of two or more different wavelengths is outside a normal range.

34. The test device according to any one of claims 1 to 11, 18 to 21, and 26 to 29, wherein the light source portion irradiates the plurality of light emitting elements with light in a reaction wavelength band of the plurality of light emitting elements.

35. The test device according to any one of claims 1 to 11, 18 to 21, 26 to 29, further comprising a temperature control portion that suppresses an increase in temperature of the plurality of light emitting elements due to the irradiation of the light.

36. The test device according to claim 35, wherein the temperature control portion includes a blowing mechanism that blows air toward the plurality of light emitting elements, and the test device further comprises a static electricity removal portion that suppresses static electricity of the plurality of light emitting elements due to the blowing of air by the blowing mechanism.

37. A computer-readable storage medium storing a program that is executed by a test device that tests a plurality of light emitting elements and causes the test device to execute the test method according to any one of claims 13 to 17, 24 to 25, and 32 to 33. ​

Images