IC chip mounting device and IC chip mounting method

Abstract

The IC chip mounting device of the present application has: a plurality of nozzles, each of which is movable between a first position and a second position, configured to adsorb an IC chip when positioned at the first position and to arrange the IC chip on an adhesive positioned at a reference position of a corresponding antenna of an antenna continuum when positioned at the second position; a nozzle mounting portion on which the plurality of nozzles are mounted; and a control portion that controls an angular velocity when the nozzle mounting portion is rotated so that the nozzle that reaches the second position after the nozzle that is judged not to have adsorbed the IC chip, i.e., a non-adsorption nozzle, corresponds to the antenna where the IC chip is arranged.

Description

TECHNICAL FIELD

[0001] The present application relates to an IC chip mounting device and an IC chip mounting method. BACKGROUND

[0002] With the spread of RFID tags, production of the inlay having an antenna and a sheet-shaped inlay body electrically connected to the antenna is expanding. When manufacturing the inlay, a process is provided in which, on the antenna formed on a base substrate, an IC chip supplied from the outside is arranged at a prescribed reference position on the antenna as a reference for mounting the IC chip (for example, Japanese Patent Application Laid-Open No. 2008-123406).

[0003] In Japanese Patent Application Laid-Open No. 2008-123406, it is described that one of four sets of mounting devices for mounting IC chips on antennas is provided as a backup-dedicated device for mounting IC chips on antennas that are not mounted by the other three sets of mounting devices. SUMMARY

[0004] In Japanese Patent Application Laid-Open No. 2008-123406, it is considered that by providing the backup-dedicated mounting device, the yield can be improved in the manufacturing process of the inlay, but it is disadvantageous in terms of cost and space saving to have to have the backup-dedicated mounting device.

[0005] Therefore, an object of one embodiment of the present application is to improve the yield in the manufacturing process of the inlay without providing an additional device.

[0006] One embodiment of the present application is an IC chip mounting device including: a discharge portion that discharges an adhesive to a reference position of each antenna of an antenna continuous body in which a plurality of antennas for inlays are continuously formed on a substrate; a plurality of nozzles each of which is movable between a first position and a second position, and is configured to adsorb an IC chip when positioned at the first position and to arrange the IC chip on the adhesive positioned at the reference position of a corresponding antenna of the antenna continuous body when positioned at the second position; a nozzle mounting portion that mounts the plurality of nozzles; a rotation portion that rotates the nozzle mounting portion in a manner such that a moving direction of each nozzle when positioned at the second position is aligned with a transport direction of the antenna continuous body while the plurality of nozzles move on a ring-shaped track in a plane orthogonal to the transport surface; a judgment portion that judges whether or not an IC chip is adsorbed by each nozzle during movement of each nozzle from the first position to the second position; and a control portion that controls an angular velocity at which the nozzle mounting portion is rotated so that an IC chip is arranged on an antenna corresponding to a non-adsorbed nozzle pair, that is, a nozzle pair in which it is judged by the judgment portion that an IC chip is not adsorbed, after the non-adsorbed nozzle pair reaches the second position.

[0007] According to one embodiment of the present application, in the manufacturing process of the inlay, the yield can be improved without providing an additional device. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is a plan view of an antenna of an embodiment and partial enlarged views of an IC chip mounting before and after the antenna.

[0009] Figure 2 is a view showing an antenna sheet and a roller body on which the antenna sheet is wound.

[0010] Figure 3 is a view showing a portion corresponding to an IC chip arrangement process in the IC chip mounting device of the embodiment.

[0011] Figure 4 is a view showing a chip containing tape and an enlarged cross section thereof.

[0012] Figure 5 is a side view of a rotary die bonder in the IC chip mounting device of the embodiment.

[0013] Figure 6A , Figure 6B is a plan view and a side view of a nozzle unit mounted on the rotary die bonder.

[0014] Figure 7 is a view roughly explaining the relationship between the rotary die bonder and the antenna sheet.

[0015] Figure 8 is a perspective view showing a state in which the chip containing tape is separated by a separation roller.

[0016] Figure 9 is a view explaining the operation of supplying the IC chip from the chip containing tape to the nozzle unit.

[0017] Figure 10 is a front view showing a moving mechanism in the width direction of the rotary die bonder.

[0018] Figure 11 is a functional block diagram of a control section that controls the rotary die bonder.

[0019] Figure 12 is a view showing an example of an image captured by a camera.

[0020] Figure 13 is a view exemplifying the IC chip adsorbed to the nozzle before and after the nozzle is rotated.

[0021] Figure 14 is a view explaining the operation of the rotary die bonder.

[0022] Figure 15is a diagram that explains the operation of a rotary chip mounter.

[0023] Figure 16 is a diagram that shows a portion corresponding to the curing process in the IC chip mounting apparatus of the embodiment.

[0024] Figure 17 is a diagram that shows a portion of the pressing unit and the ultraviolet irradiator as viewed from the arrow direction J of Figure 16 .

[0025] Figure 18 is a diagram that shows a method of conveying the antenna sheet of one embodiment.

[0026] Figure 19 is a diagram that explains the IC chip arrangement process of one embodiment.

[0027] Figure 20 is a diagram that explains the curing process of one embodiment.

[0028] Figure 21 is a diagram that shows a configuration example of the ultraviolet curing unit in Figure 20 .

[0029] Figure 22 is a diagram that explains the curing process of one embodiment. DETAILED DESCRIPTION

[0030] The present application is associated with Patent Application 2019-235420 and Patent Application 2020-216460, which were filed with the Japan Patent Office on December 26, 2019 and December 25, 2020, respectively, and the entire contents of these applications are incorporated herein by reference in their entirety.

[0031] Hereinafter, an IC chip mounting apparatus and an IC chip mounting method according to an embodiment will be described with reference to the drawings.

[0032] The IC chip mounting apparatus 1 according to the embodiment is an apparatus that mounts an IC chip on a thin film-shaped antenna when manufacturing a non-contact communication inlay such as an RFID inlay.

[0033] An exemplary antenna AN having a prescribed antenna pattern is shown in Figure 1 , but is not intended to be limited to this antenna pattern. In addition, an enlarged view of the E portion before and after the IC chip C is mounted on the antenna AN is also shown in Figure 1 . In this example, the IC chip C is mounted at a prescribed reference position Pref that is decided in advance with the antenna pattern as a reference. The IC chip C is extremely small, for example, several hundred μm in the longitudinal and lateral directions, and it is required to correctly mount this extremely small IC chip C at the reference position Pref.

[0034] When the IC chip C is mounted on the antenna AN, an IC chip mounting process and a curing process are required. In the IC chip mounting process, an adhesive is applied to the reference position Pref of the antenna AN, and the IC chip C is mounted on the adhesive. In the curing process, the adhesive is cured to firmly connect the antenna AN and the IC chip C.

[0035] As shown in FIG. 1, in the IC chip mounting process, a roller PR is provided, and an antenna sheet AS (an example of an antenna continuum) in which a plurality of antennas AN are formed on a base material BM at constant intervals is wound around the roller PR. The antenna sheet AS is continuously pulled out from the roller PR and fed to a production line of the IC chip mounting process. Figure 2

[0036] The material of the base material BM is not particularly limited, and for example, a paper base material such as high-quality paper, coated paper, or art paper, a synthetic resin film using PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), or PS (polystyrene) as a raw material, a sheet combining a plurality of the above-described synthetic resins, or a composite sheet combining a synthetic resin film and paper can be used.

[0037] The antenna AN is formed, for example, by adhering a metal foil to the base material BM or screen printing or vapor depositing a conductive material on the base material BM in a predetermined pattern.

[0038] Further, in the following description, as shown in FIG. 2, an XYZ coordinate system is defined. In the following description, when referring to a view of a state in each process, a view observed in the YZ plane is referred to as a front view, a view observed in the XY plane is referred to as a plan view, and a view observed in the XZ plane is referred to as a side view. Figure 2

[0039] The X direction is a direction in which the antenna sheet AS pulled out from the roller PR is transported in each process described below, and is also appropriately referred to as a transport direction Dl. In addition, the Y direction is a width direction of the antenna sheet AS, and is also appropriately referred to as a width direction D2. The Z direction is a direction orthogonal to the antenna sheet AS.

[0040] (1) IC Chip Mounting Process

[0041] Hereinafter, the IC chip mounting process will be described with reference to FIGS. 3 to 6. Figures 3-10 is a view showing a portion corresponding to the IC chip mounting process in the IC chip mounting device 1 of the embodiment. Figure 3 is a view showing a plan view of the chip containing tape CT and an enlarged view of an A-A cross section thereof. Figure 4

[0042] ​​​In the IC chip arrangement process, by the IC chip mounting device 1, the reference positions Pref (refer to Figure 1 ) of the respective antennas AN on the antenna sheet AS are arranged with high precision with respect to the extremely small IC chips.

[0043] As shown in FIG. 1, in the IC chip arrangement process, the IC chip mounting device 1 includes a conveyor 81, a dispenser 2, a rotary die bonder 3, an ultraviolet irradiator 41, photographing devices CA1 to CA3, a tape feeder 71, a tape main body winding reel 72, a film winding reel 73, and a separation roller 74. Figure 3

[0044] The conveyor 81 conveys the antenna sheet AS pulled out from the roll body PR (refer to Figure 2 ) to the downstream of the process at a predetermined conveyance speed. The upper surface of the conveyor 81 corresponds to a conveyance surface.

[0045] The dispenser 2 (one example of a discharge portion) discharges a predetermined amount of anisotropic conductive paste (ACP (Anisotropic Conductive Paste); hereinafter, simply referred to as "conductive paste") to the reference positions Pref of the respective antennas AN being conveyed. The conductive paste is one example of an ultraviolet-curable adhesive. In order to correctly position the discharge position with respect to the reference positions Pref of the respective antennas AN, the dispenser 2 is configured to be able to adjust the discharge position in the width direction.

[0046] The photographing device CA1 is provided at a position upstream of the dispenser 2, and photographs a partial image of the vicinity of the reference position Pref of the respective antennas AN in order to determine the position at which the conductive paste is applied. The photographing device CA2 is provided at a position downstream of the dispenser 2, and photographs a partial image of the vicinity of the reference position Pref of the respective antennas AN in order to check whether or not the conductive paste is applied to the respective antennas AN and to check whether or not the conductive paste is correctly applied to the region including the reference position Pref.

[0047] The rotary die bonder 3 is a chip bonder that arranges the IC chips on the conductive paste applied to the respective antennas AN, and rotates in the counterclockwise direction of Figure 3 . The rotary die bonder 3 is mounted to and suspended from a suspension plate 86. The suspension plate 86 is supported to the support table 85 in a manner that is movable in the Y direction. Thus, the rotary die bonder 3 is configured to be suspended from above the support table 85 and movable in the Y direction.

[0048] ​As described later, the rotary chip mounter 3 releases and mounts (picks up) the IC chip C adhered to the reference position Pref of each antenna AN on the antenna sheet AS. At this time, in order to correctly mount the IC chip C at the reference position Pref of the antenna AN, a process of correcting the position and orientation of the adhered IC chip C is performed. In order to perform the correction process of correcting the position and orientation of the IC chip C when the IC chip C is mounted on the antenna AN, the imaging device CA3 images the IC chip C in a state of being adhered to a nozzle (described later).

[0049] The tape feeder 71 is configured to load the chip containing tape in a wound state, and sequentially pull out the chip containing tape at a speed synchronized with the rotary chip mounter 3 in the arrow direction. Figure 3

[0050] Here, with reference to Figure 4 , one example of the chip containing tape will be described.

[0051] As shown in Figure 4 , the chip containing tape CT includes a tape body T in which depressions Td containing IC chips C are formed at constant intervals, and a cover film CF adhered to the tape body T so as to seal the depressions Td. The depressions Td are formed, for example, by embossing the tape body T. The IC chips C are contained in each depression Td along the extension direction of the chip containing tape CT. Mounting holes H are formed at constant intervals in the extension direction of the chip containing tape CT. The mounting holes H are provided for correct positioning with respect to the peripheral surface of the separation roller 74, and are inserted by the protrusions 74p (described later) provided to the separation roller 74 when the chip containing tape CT is conveyed to the separation roller 74.

[0052] As shown in Figure 4 , an adhesion hole Ts is formed between the bottom surface of the depression Td and the back surface of the tape body T (the surface on the side opposite to the surface to which the cover film CF is adhered). The adhesion hole Ts is provided in order to adhere the IC chip C by the separation roller 74 so that the IC chip C does not fall from the depression Td when the cover film CF is peeled off.

[0053] Referring again to Figure 3 , at the separation roller 74, the cover film CF is peeled off from the chip containing tape CT supplied from the tape feeder 71 through one or a plurality of auxiliary rollers, and the chip containing tape CT is separated into the tape body T and the cover film CF. The IC chip C exposed by peeling off the cover film CF is sequentially adhered to each nozzle provided to the rotary chip mounter 3.

[0054] ​After the chip includes the tape CT is separated into the tape body T and the cover film CF by the separation roller 74, the tape body T is wound on the tape body winding reel 72 through one or more auxiliary rollers, and the cover film CF is wound on the film winding reel 73 through one or more auxiliary rollers.

[0055] Next, referring to Figures 5-7 , the rotary chip mounter 3 will be described.

[0056] Figure 5 is a side view of the rotary chip mounter 3 in the IC chip mounting apparatus 1 of the embodiment. Figure 6A is a plan view of the nozzle unit mounted on the rotary chip mounter 3. Figure 6B is a side view of the nozzle unit 30. Figure 7 is a diagram that roughly explains the relationship between the rotary chip mounter 3 and the antenna sheet AS.

[0057] As shown in Figure 5 , in the rotary chip mounter 3, a plurality of (12 in the illustrated example) nozzle units 30-1 to 30-12 are radially provided from the rotary head 3H (one example of a nozzle mounting portion). In the following description, when referring to matters common to the nozzle units 30-1 to 30-12, the expression "nozzle unit 30" is used in general.

[0058] Regarding the rotary head 3H, although details are not illustrated, it is connected with a rotary drive motor (described later as the rotary drive motor M31) that rotates the nozzle units 30-1 to 30-12 in the counterclockwise direction of Figure 5 , a vacuum pump for adsorbing an IC chip by the nozzle unit 30, and a blower for releasing an IC chip from the nozzle unit 30.

[0059] Referring to Figure 6A , Figure 6B , the nozzle unit 30 is provided with a nozzle 32, a sleeve 33, a solenoid valve 35, and a cylinder drive motor M30. The nozzle 32 is provided at the front end of the nozzle unit 30 and is coupled with the cylinder drive motor M30 in the sleeve 33. The cylinder drive motor M30 is a motor (for example, a stepping motor) that rotates the nozzle 32 around its axis. A passage that can communicate with a suction pipe 36 and an exhaust pipe 37 is formed in the nozzle 32.

[0060] The suction pipe 36 and the exhaust pipe 37 are coupled with the sleeve 33. The suction pipe 36 is connected with a vacuum pump (not illustrated), and the exhaust pipe 37 is connected with a blower (not illustrated).

[0061] Solenoid valve 35 (an example of a control valve) is, for example, a three-port solenoid valve, configured such that, depending on the energization state of solenoid valve 35, the passage 34 of nozzle 32 is open to the intake pipe 36 while the exhaust pipe 37 is closed, or the passage 34 of nozzle 32 is open to the exhaust pipe 37 while the intake pipe 36 is closed. Solenoid valve 35 is configured to perform either a suction action (drawing air through the intake pipe 36 via nozzle 32) or a discharge action (discharging air from nozzle 32 through exhaust pipe 37).

[0062] Reference Figure 7 A rotary drive motor (not shown) rotates the rotating head 3H counterclockwise, thereby sequentially switching the circumferential position of the rotating head 3H of each nozzle unit 30. That is, a specific nozzle unit 30, according to the rotation of the rotating head 3H, moves on a circular track in a plane orthogonal to the conveying surface, sequentially occupying each of the 12 positions PA to PL in the circumferential direction of the rotating head 3H from position PA to position PL in a counterclockwise direction.

[0063] Here, position PA (an example of the first position) is the position where the nozzle unit 30 reattaches the IC chip C from the chip-containing CT. Position PE is the position where an image of the IC chip C in the state of being attached to the nozzle unit 30 is captured by the imaging device CA3.

[0064] Position PK (an example of the second position) is the position where the adsorbed IC chip C is released from the conductive paste of the antenna AN coated on the transported antenna sheet AS. At position PK, the movement direction of the nozzle tip is consistent with the transport direction D1 of the antenna sheet AS. At position PK, air is vented from the nozzle of nozzle unit 30 to release the IC chip C.

[0065] Since the IC chip C has been completely released at position PK, no IC chip C is adsorbed on the nozzle unit 30 at position PL. Furthermore, at position PL, air can be released from the nozzle to remove any residue that may have adhered to it. Figure 7 The image shows an example of a residue collection tray TR configured at position PL to collect residue that may be released from the nozzle.

[0066] For example, repeatedly performing the following action, namely: Figure 7 The nozzle unit 30-1, located at position PA, re-attaches the IC chip C, rotates counterclockwise while maintaining the attached IC chip C, releases the IC chip C upon reaching position PK, and then re-attaches a new IC chip C upon returning to position PA. This IC chip mounting method allows for continuous placement of IC chips onto each antenna AN without interrupting the delivery of the antenna sheet AS, resulting in high productivity.

[0067] The angular velocity of the rotary head 3H and the conveyance speed of the antenna sheet AS are set or controlled so that the nozzle units 30 that reach the positions PK in order release the IC chips C to the reference positions Pref of the respective antennas AN of the antenna sheet AS conveyed from the upstream. In order to reliably arrange the IC chips C, it is preferable that the interval in which the speed of the front end of the nozzle units 30 provided in the vicinity of the positions PK becomes constant with the conveyance speed of the antenna sheet AS.

[0068] Further, in the present embodiment, an example in which the rotary head 3H is provided with 12 nozzle units 30 is shown, but is not limited thereto. The number of the nozzle units 30 provided in the rotary head 3H can be arbitrarily set.

[0069] Next, with reference to Figure 8 and Figure 9 , the operation of sucking the IC chip C by the nozzle unit 30 will be described.

[0070] Figure 8 is a perspective view showing a state in which the chip containing tape CT is separated by the separation roller 74. Figure 9 is a side view of the vicinity of the separation roller 74, and is a view for explaining the operation of supplying the IC chip C from the chip containing tape CT to the nozzle unit 30. In Figure 9 , only the chip containing tape CT is shown in a cross section so as to make the state of the chip containing tape CT clear.

[0071] As shown in Figure 8 , the protrusion 74p of the separation roller 74 is inserted into the mounting hole H of the chip containing tape CT supplied from the tape feeder 71, and thereby the chip containing tape CT is conveyed in a state in which the width direction positioning of the chip containing tape CT is performed. At this time, the cover film CF of the chip containing tape CT is peeled off by the branch member 75 and is directed toward the film winding roller 73. On the other hand, the tape body T of the chip containing tape CT is directed toward the tape body winding roller 72.

[0072] As shown in Figure 9 , the IC chip C exposed by peeling the cover film CF is immediately sucked by the nozzle unit 30. The separation roller 74 is provided with a suction path (not shown) for attracting the IC chip C toward the center of rotation of the separation roller 74, so that the IC chip C does not fall down for a short time from the time when the IC chip C is exposed by the nozzle unit 30. The IC chip C is sucked by the suction path and the suction hole Ts (refer to Figure 4 ) provided in the tape body T.

[0073] Next, with reference to Figure 10 , the moving mechanism 8 that moves the rotary head 3H in the width direction D2 will be described. Figure 10 is a front view of the moving mechanism 8.

[0074] The moving mechanism 8 is designed to correct the position of the IC chip C, which has been adsorbed by the nozzle unit 30, in the width direction D2. For example... Figure 10 As shown, the moving mechanism 8 has a bearing 76, a shaft 77, a suspension plate 86, a guide plate 87, a slider 88, and a width-direction drive motor M32.

[0075] Bearing 76, shaft 77, and width-direction drive motor M32 are mounted on support platform 85. Shaft 77 is a rod-shaped component with a threaded cutting portion, which is rotated by width-direction drive motor M32. Shaft 77 is supported by bearing 76 (at 2 locations) fixed to the upper surface of support platform 85 to enable rotation.

[0076] A rotating head 3H is mounted on a suspension plate 86. A threaded hole (not shown) is formed at the upper end of the suspension plate 86, which engages with the threaded portion of the shaft 77. Therefore, in response to the rotation of the shaft 77, the suspension plate 86 and the rotating head 3H mounted on it can move in the width direction D2. Furthermore, hollow portions are provided on the upper part of the support platform 85 and the guide plate 87 within the movable range of the suspension plate 86 in the width direction D2. A slider 88 is mounted on the suspension plate 86 and slides on the upper surface of the guide plate 87 as the suspension plate 86 moves in the width direction D2.

[0077] With the above structure, the moving mechanism 8 can cause the rotating head 3H to be displaced in the width direction D2 in response to the rotational drive of the width direction drive motor M32.

[0078] In this embodiment, an example is shown where the rotating head 3H is moved in the width direction D2 by the moving mechanism 8, thereby moving the nozzle unit 30 mounted on the rotating head 3H in the width direction D2, but this is not a limitation. For example, the rotating head may be configured such that each nozzle unit 30 can be independently displaced in the width direction D2 inside the rotating head without moving the rotating head in the width direction D2.

[0079] Refer again Figure 3 At the position where the IC chip is released from the nozzle unit 30 of the rotary pick and place machine 3 to the antenna AN ( Figure 7 Near the location PK), set up an ultraviolet irradiator 41.

[0080] The ultraviolet irradiator 41 is configured to irradiate the conductive paste on the antenna AN with ultraviolet rays. The irradiation of ultraviolet rays by the ultraviolet irradiator 41 and the irradiation of ultraviolet rays in the curing process, which is a post-process of the IC chip placement process (to be described later), have different purposes, and the purpose of the former is to adjust the viscosity of the conductive paste on the antenna AN. In this regard, it is preferable that the cumulative light quantity of the ultraviolet rays given to the conductive paste by the ultraviolet irradiator 41 be less than the cumulative light quantity of the ultraviolet rays given to the conductive paste in the subsequent curing process. The cumulative light quantity of ultraviolet rays is expressed by the product of the light intensity and the irradiation time, and therefore, in order to adjust the cumulative light quantity, at least either the light intensity or the irradiation time can be adjusted.

[0081] In the IC chip mounting device 1 of the present embodiment, the dispenser 2 can also apply a thermally curable adhesive such as an epoxy-based resin to the antenna AN, and a thermally curing device can be provided instead of the ultraviolet irradiator 41.

[0082] In the Figure 3 , the ultraviolet irradiator 41 is configured to irradiate ultraviolet rays after the IC chip is placed, but is not limited thereto. The ultraviolet irradiator 41 can also be configured to irradiate ultraviolet rays before the IC chip is placed, or can be configured to irradiate ultraviolet rays simultaneously with the placement of the IC chip.

[0083] When ultraviolet rays are irradiated after the IC chip is placed, it is difficult for the IC chip to be displaced or tilted after being placed on the conductive paste, because the viscosity of the conductive paste is reduced. When ultraviolet rays are irradiated before the IC chip is placed, or simultaneously with the placement of the IC chip, the IC chip is placed on the conductive paste in a state in which the viscosity of the conductive paste is reduced, and therefore, it is difficult for the IC chip to be displaced or tilted after being placed on the conductive paste.

[0084] In either case, by irradiating ultraviolet rays at a position in the vicinity of where the IC chip is placed, it is possible to avoid a situation in which the IC chip is unstable on the conductive paste due to the fluidity of the conductive paste. That is, by irradiating ultraviolet rays by the ultraviolet irradiator 41, it is possible to improve the mounting accuracy of the IC chip.

[0085] Next, the control performed by the control section 100 that controls the rotary die bonder 3 will be described with reference to Figures 11-13 to FIG. 9. Figure 11 is a functional block diagram of the control section 100. Figure 12 shows an example of an image captured by the imaging device CA1. Figure 13 is a diagram illustrating an IC chip C that has been adsorbed to the nozzle 32 before and after the nozzle 32 is rotated. Figure 13 the state of the nozzle before rotation shows an example of an image captured by the imaging device CA3. Figure 13The state after the rotation of the nozzle shows the XYZ axes when the nozzle is in the position PK (refer to Figure 7 ).

[0086] The control section 100 is packaged in a circuit substrate not shown, and is electrically connected to the imaging devices CA1 to CA3, the dispenser 2, the cylinder drive motor M30, the rotation drive motor M31, the width direction drive motor M32, the electromagnetic valve 35, and the ultraviolet irradiator 41. The rotation drive motor M31 (one example of a rotation section) is a drive module that rotates the nozzle units 30-1 to 30-12 with the rotation head 3H.

[0087] The control section 100 includes a microcomputer, memories (a Random Access Memory (RAM), a Read Only Memory (ROM)), a storage, and a drive circuit group. The microcomputer reads and executes a program recorded in the memories, and functions of each of the present discharge position adjustment module 101, the IC chip correction module 102, the valve control module 103, the curing execution module 104, the adsorption judgment module 105, and the rotation head rotation control module 106.

[0088] The present discharge position adjustment module 101 has a function of deciding the discharge position of the conductive paste based on the image captured by the imaging device CA1, and adjusting the discharge timing of the conductive paste and the position of the dispenser 2 in the width direction D2. With reference to Figure 12 , the method of deciding the discharge position of the conductive paste is as follows.

[0089] As illustrated in Figure 12 , the image captured by the imaging device CA1 is a partial image of the vicinity of the reference position Pref of the antenna AN.

[0090] The present discharge position adjustment module 101 determines the reference position Pref from a characteristic portion of the shape included in the image. Specifically, the present discharge position adjustment module 101 analyzes the shape of the antenna AN in the image, determines the reference lines L1, L2 parallel to each other in the X direction and the reference lines L3, L4 parallel to each other in the Y direction, and determines the intersection of the line in the center of the reference lines L1, L2 and the line in the center of the reference lines L3, L4 as the reference position Pref. Figure 12

[0091] Figure 12 ​The point Pj1 in the image is a target position of the reference position Pref on the image, and is a position decided in advance as a result of calibration between the image captured by the imaging device CA1 and the dropping position of the conductive paste of the dispenser 2. That is, the discharge time point of the dispenser 2 and the position in the width direction D2 are adjusted so that the reference position Pref determined on the image and the target position Pj1 coincide, and thus the conductive paste can be applied to the reference position of the actual antenna AN.

[0092] In Figure 12 the example, in order to make the reference position Pref determined on the image and the target position Pj1 coincide, it is necessary to adjust the position x1 in the X direction and the position y1 in the Y direction. Specifically, the discharge time point of the dispenser 2 is decided based on x1 taking into account the conveyance speed of the antenna AN, and the displacement in the width direction D2 of the dispenser 2 is performed based on y1. That is, the discharge position adjustment module 101 transmits a control signal indicating the discharge time point and the displacement in the width direction D2 of the dispenser 2 to the dispenser 2, and the dispenser 2 performs the discharge operation based on the control signal.

[0093] Except for the point that the conductive paste is applied, the image captured by the imaging device CA2 is the same image as Figure 12 .

[0094] The IC chip correction module 102 (one example of a correction amount decision section) has a function of correcting the IC chip that has been adsorbed to the nozzle 32. Referring to Figure 12 and Figure 13 , the method of correcting the IC chip is as follows.

[0095] As shown in the state before rotation of Figure 13 , the image captured by the imaging device CA3 (one example of an image acquisition section) includes the nozzle end 32e of the nozzle 32, and the IC chip C that has been adsorbed to the nozzle end 32e. The point Pc1 is the center position of the IC chip C before rotation of the nozzle. Figure 13 The point Pj2 in the image is a target position of the center position of the IC chip C on the image, and is set to coincide with the target position Pj1 of Figure 12 . That is, by making the center position of the IC chip C coincide with the target position Pj1, it is possible to arrange the IC chip C at the reference position of the actual antenna AN that is conveyed.

[0096] Due to mounting deviation and the like of the nozzle units 30-1 to 30-12, the rotation center Prc of the nozzle 32 around the axis is not the theoretical axis center of each nozzle. The rotation center Prc differs depending on each nozzle unit, and is determined based on, for example, measured data obtained in advance.

[0097] First, when the center Pc1 of the IC chip C displayed in the image is rotated around the rotation center Prc of the axis of the nozzle 32, the rotation amount until the reference line (for example, the reference edge Sc) of the IC chip C becomes parallel to the Y direction is determined. Figure 13

[0098] In the example of the state after the rotation, Figure 13 the reference edge Sc of the IC chip C is made parallel to the Y direction. The rotation angle at this time is determined as the correction amount in the rotation direction of the IC chip C (one example of the first correction amount). Here, in the case where the center position of the moved IC chip C is set as a point Pc2, in order to make the point Pc2 coincide with the target position Pj2, the correction amount in the X direction (one example of the second correction amount) is determined as x2, and the correction amount in the Y direction (one example of the third correction amount) is determined as y2.

[0099] The IC chip correction module 102 sends a control signal corresponding to the correction amount in the rotation direction of the axis of the nozzle 32 to the cylinder drive motor M30, whereby the nozzle 32 is rotated around the axis between the position PE (the position photographed by the photographing device CA3) and the position PK at which the IC chip is released.

[0100] The IC chip correction module 102 sends a control signal corresponding to the correction amount x2 in the X direction to the drive circuit that drives the rotation drive motor M31, whereby the angular velocity of the rotation head 3H is adjusted. The IC chip correction module 102 sends a control signal corresponding to the correction amount y2 in the Y direction to the drive circuit that drives the width direction drive motor M32, whereby the position in the width direction D2 of the rotation head 3H is adjusted. By adjusting the position in the width direction D2 of the rotation head 3H, the position in the width direction D2 of the nozzle 32 can also be adjusted.

[0101] In the IC chip mounting device 1 of the present embodiment, the correction of the position of the IC chip in the X direction and the Y direction, and the orientation of the IC chip in the plane orthogonal to the axis of the nozzle is performed by the IC chip correction module 102, so there is the advantage that the mounting precision of the reference position of the IC chip with respect to the antenna is very high.

[0102] The valve control module 103 controls each of the electromagnetic valves 35 so as to perform either of the actions of sucking or discharging air from each of the nozzle units 30-1 to 30-12 included in the rotary patch machine 3 in accordance with the position of each of the nozzle units 30. Specifically, the valve control module 103 controls the electromagnetic valves 35 so as to perform the action of sucking air from each of the nozzle units 30 when the nozzle unit 30 is located at the position PA to PJ (refer to FIG. 4), and so as to perform the action of discharging air from each of the nozzle units 30 when the nozzle unit 30 is located at the position PK to PL (refer to FIG. 4). Figure 7 ​When the nozzle unit 30 is in position PK or PL, air is drawn from the nozzle unit 30, and the solenoid valve 35 is controlled to discharge air from the nozzle unit 30.

[0103] The curing execution module 104 sends a specified drive signal to the ultraviolet irradiator 41 so that each of the antennas AN being transported is irradiated with ultraviolet light from the ultraviolet irradiator 41 with a preset cumulative light amount.

[0104] During the period from the position PA where the IC chip is first attracted to the nozzle unit 30 to the position PK where the IC chip is released, the adsorption determination module 105 determines whether an IC chip is attracted to each nozzle unit 30. In this embodiment, the adsorption determination unit 105 determines whether an IC chip is attracted to the nozzle unit 30 that arrives at the position PE sequentially based on an image captured by the imaging device CA3 (an example of an image acquisition unit).

[0105] The rotating head rotation control module 106 controls the angular velocity of the rotating head 3H so that the nozzle unit 30, which is determined to not have an IC chip attached (referred to as the "non-attached nozzle unit"), releases the IC chip to the antenna corresponding to the non-attached nozzle unit after reaching position PK (an example of the second position).

[0106] Here, in connection with the rotating head rotation control module 106, refer to Figure 14 as well as Figure 15 This section explains the actions taken when the rotary chip mounter fails to pick up the IC chip C. Figure 14 as well as Figure 15 This diagram illustrates the actions of the rotary pick-and-place machine 3 when it fails to pick up the IC chip C, and roughly shows the relationship between the rotary pick-and-place machine 3 and the antenna piece AS. Figure 14 as well as Figure 15 The status of the rotary chip mounter 3 is displayed in the order of time T1 to T4 as time passes.

[0107] exist Figure 14 At time T1, assume that the nozzle unit 30-1 at position PA fails to adsorb the IC chip C. That is, the nozzle unit 30-1 is equivalent to a non-adsorption nozzle unit.

[0108] exist Figure 14 At time T2, the nozzle unit 30-1 rotates counterclockwise and reaches position PE. At this time point, the imaging device CA3 captures an image of the nozzle 32 of the nozzle unit 30-1, and determines that the nozzle unit 30-1 is a non-adsorption nozzle unit.

[0109] exist Figure 15The time T3 is the time at which the nozzle unit 30-1, which is a non-adsorbing nozzle unit, reaches the position PJ. As shown in the figure, the antenna corresponding to the nozzle unit 30-1 is the antenna AN-2 on the antenna sheet AS. That is, if the nozzle unit 30-1 has adsorbed an IC chip, the release target of the IC chip is the antenna AN-2.

[0110] Figure 15 The time T4 is the time point at which the IC chip is released to the antenna AN-2. At this time, the angular velocity of the rotary head 3H of the rotary die bonder 3 is controlled so that the IC chip is released to the antenna AN-2 corresponding to the nozzle unit 30-1, which is a non-adsorbing nozzle unit. That is, the rotation of the rotary head 3H of the rotary die bonder 3 is accelerated so that the IC chip is released to the antenna AN by the other nozzle unit subsequent to the nozzle unit 30-1. As a result, at the time T4, the IC chip is released to the antenna AN-2 by the nozzle unit 30-2 (i.e., the nozzle unit that first reaches the position PK after the nozzle unit 30-1) subsequent to the nozzle unit 30-1. Therefore, it is possible to prevent the antenna AN-2 from flowing to the subsequent process in a state in which the IC chip is not attached, and it is possible to improve the yield.

[0111] Furthermore, it is not limited to the case in which the IC chip is released to the antenna AN-2 from the nozzle unit 30-2, and the IC chip can be released to the antenna AN-2 from the other nozzle unit (e.g., the nozzle unit 30-3) subsequent to the nozzle unit 30-1.

[0112] In the case in which the actions shown in Figs. 1 to 3 are performed, Figure 14 and Figure 15 The rotary head rotation control module 106 controls the rotary drive motor M31 and the electromagnetic valve 35 so that the rotary head 3H is accelerated when the non-adsorbing nozzle unit, which has not adsorbed the IC chip C, approaches the position PK, and so that the nozzle unit 30 that reaches the position PK after the non-adsorbing nozzle unit releases the IC chip to the antenna corresponding to the non-adsorbing nozzle unit.

[0113] Furthermore, it is preferable that the valve control module 103 control the electromagnetic valve 35 of the non-adsorbing nozzle unit so that the non-adsorbing nozzle unit does not perform the suction action. Thereby, it is possible to prevent the non-cured (i.e., high-fluidity) conductive paste on the antenna from adhering to the non-adsorbing nozzle unit and causing contamination.

[0114] In addition, it is preferable that the valve control module 103 control the electromagnetic valve 35 of the non-adsorbing nozzle unit so that the non-adsorbing nozzle unit does not perform the discharge action at the position PK. Thereby, it is possible to prevent the non-cured (i.e., high-fluidity) conductive paste on the antenna at the position PK from scattering and contaminating the antenna.

[0115] (2) Curing Step

[0116] Next, the operation of the apparatus 1 will be described with reference to Figs. 4 to 6.Figure 16 and Figure 17 The curing process will be described.

[0117] In the curing process, the conductive paste applied to each antenna after the IC chip arrangement process is cured, the physical connection of the antenna and the IC chip is stabilized, and the electrical conduction of the antenna and the IC chip is made reliable.

[0118] Figure 16 is a view showing a portion corresponding to the curing process in the IC chip mounting device 1 of the embodiment. Figure 17 is a view showing a portion of the pressing unit 6 and the ultraviolet irradiator 42 viewed from the arrow direction J of Figure 16

[0119] As shown in Figure 16 , in the curing process, the IC chip mounting device 1 includes a conveyor 82, a curing device 4, and a camera device CA4.

[0120] The conveyor 82 conveys the antenna sheet AS conveyed from the upstream IC chip arrangement process to the downstream at a predetermined conveying speed.

[0121] The camera device CA4 is arranged above the antenna sheet AS at the most upstream side in the curing process (i.e., the most downstream side in the IC chip arrangement process) and captures an image of each antenna AN conveyed from the IC chip arrangement process. The camera device CA4 is provided for checking whether the IC chip is arranged at an appropriate position in the IC chip arrangement process.

[0122] As shown in Figure 16 , the curing device 4 has one or a plurality of pressing units 6 and an ultraviolet irradiator 42.

[0123] The pressing unit 6 performs a lifting action in a direction orthogonal to the conveying surface and presses the IC chip arranged on the conductive paste of the antenna AN during the irradiation of ultraviolet to each antenna AN. The number of the pressing units 6 is not limited, but can be set to an arbitrary number from the viewpoint of productivity and cost.

[0124] The ultraviolet irradiator 42 is arranged along the conveying direction D1. Therefore, it is possible to simultaneously irradiate ultraviolet to many antennas AN on the antenna sheet AS.

[0125] Referring to Figure 17 , a state in which ultraviolet is irradiated to each antenna AN by the ultraviolet irradiator 42 is shown. As shown in Figure 17 , the pressing unit 6 is configured in which the pressing portion 61 is attached to the front end of the shaft 63. The side surface of the pressing portion 61 of the pressing unit 6 (i.e., the surface of the side on which the ultraviolet irradiator 42 is arranged) is open. The glass plate 61p constituting the pressing surface of the pressing portion 61 is formed of glass that can transmit ultraviolet. ​

[0126] The ultraviolet irradiator 42 has a light source 42e, such as an LED (Light Emitting Device). The light source 42e is configured to irradiate ultraviolet light toward the antenna AN from a direction that is tilted relative to the transmission surface.

[0127] By pressing the IC chip coated on the conductive paste of each antenna AN while irradiating it with ultraviolet light, the conductive paste coated on each antenna AN is cured, the physical connection between the antenna and the IC chip becomes stable, and the electrical conduction between the antenna and the IC chip becomes reliable.

[0128] As described above, a strip-shaped antenna sheet with multiple antennas formed on a substrate at constant spacing is fed into the production line. After an IC chip placement process and a curing process, an IC chip is mounted on each antenna. In this embodiment, the IC chip mounting apparatus applies adhesive to the reference position of the antenna in the IC chip placement process and places the IC chip on the adhesive. In the curing process, the adhesive is cured to secure the connection between the antenna and the IC chip. In the IC chip placement process, IC chips adsorbed by nozzles are sequentially placed at the reference positions of the antennas. At this time, according to this embodiment, in the IC chip placement process, the rotation of the rotary mounter's rotating head is controlled so that IC chips are released from the antennas corresponding to the non-adsorption nozzle units in subsequent nozzle units. Therefore, it is possible to prevent antennas from flowing to subsequent processes without IC chips, thereby improving the yield.

[0129] The embodiments of the IC chip mounting device and IC chip mounting method have been described above, but the present invention is not limited to the above embodiments. Furthermore, various improvements and modifications can be made to the above embodiments without departing from the spirit of the present invention.

[0130] For example, in Figure 3 The embodiment shown illustrates a unidirectional transport of the antenna chip AS on the conveyor 81 during the IC chip configuration process, but is not limited to this.

[0131] like Figure 18 As shown, in one embodiment, during the IC chip configuration process, adsorption rollers 92, 94 and multiple conveyor rollers (e.g., in...) can also be used. Figure 17 The middle section uses conveyor rollers 91, 93, and 95 to convey the antenna piece AS. Figure 18In the state where the adsorption roller 92 is at the highest position, the conductive paste is discharged at the reference position of the antenna AN of the antenna sheet AS by the dispenser 2. In addition, in the state where the adsorption roller 94 is at the highest position, the IC chip is arranged on the conductive paste. In this case, it is preferable that at least the adsorption rollers 92, 94 are adsorption rollers that adsorb the back surface of the antenna sheet AS. Thereby, it is possible to prevent the positional deviation of the antenna sheet AS (particularly, in the long side direction), and it is possible to discharge the conductive paste and arrange the IC chip with high accuracy.

[0132] In one embodiment, instead of releasing the IC chip on the conductive paste of the antenna AN coated on the conveyed antenna sheet AS, the IC chip can be arranged by pushing the IC chip against the conductive paste.

[0133] Figure 19 The operation of the rotary die bonder 3 in the case where the IC chip is arranged by pushing the IC chip against the conductive paste is shown in time series. In one embodiment, each nozzle unit 30 of the rotary die bonder 3 is configured to be able to move independently in the radial direction by means of a built-in drive device.

[0134] The state ST1 is a state where the nozzle unit 30 adsorbs the IC chip C. As shown in the state ST2, when the adsorbed IC chip C is arranged, the nozzle unit 30 is moved toward the reference position (i.e., the downward direction, i.e., the Z direction) in a manner extending in the radial direction, and the IC chip C is pushed against the conductive paste coated on the antenna AN, thereby arranging the IC chip C on the conductive paste. After the IC chip C is arranged, the adsorption is released and the nozzle unit 30 is returned to the position in the state ST1. For example, the operation of the states ST1 to ST3 is performed at the time point when the nozzle unit 30 reaches the position PK (refer to FIG. 6), thereby being able to arrange the IC chip C on the conductive paste coated on the antenna AN. Figure 2 Figure 7

[0135] In the state where the adsorption roller 92 is at the highest position, the conductive paste is discharged at the reference position of the antenna AN of the antenna sheet AS by the dispenser 2. In addition, in the state where the adsorption roller 94 is at the highest position, the IC chip is arranged on the conductive paste. In this case, it is preferable that at least the adsorption rollers 92, 94 are adsorption rollers that adsorb the back surface of the antenna sheet AS. Thereby, it is possible to prevent the positional deviation of the antenna sheet AS (particularly, in the long side direction), and it is possible to discharge the conductive paste and arrange the IC chip with high accuracy. Figure 20 Figure 20 The curing process of one embodiment is shown in FIG. 10. The curing device 4A used in the curing process of one embodiment is shown in FIG. 11. For the curing device 4A, a plurality of ultraviolet curing units 43 are detachably attached to an attachment plate 44. A plurality of attachment plates 44 having different attachment positions are prepared in accordance with the interval of the adjacent antennas AN of the antenna sheet AS, and the attachment plate 44 is exchanged in accordance with the interval, so that it is possible to correspond to various antenna sheets AS.

[0136] A support shaft 45 supports the attachment plate 44, and is configured to be able to raise and lower the attachment plate 44. The antenna sheet AS conveyed from the IC chip arrangement process is sent to the curing process via the conveying rollers 96 to 98. The conveying roller 97 is configured to be able to be raised and lowered by a drive device not shown.

[0137] ​​​A constitution example of the ultraviolet curing unit 43 is shown in Figure 21 Fig. 43. As shown in Figure 21 Fig. 43, the ultraviolet curing unit 43 is provided with a light source 432 (for example, an LED light source) for irradiating ultraviolet rays inside a housing 431. The light source 432 is supplied with power through a cable 436 (not shown in Figure 20 Fig. 43) provided from the outside of the ultraviolet curing unit 43. Inside the housing 431, a condenser lens for condensing the ultraviolet rays irradiated by the light source 432 can also be provided. A holding plate 434 is joined to the housing 431, and holds a glass plate 435. The ultraviolet rays irradiated from the light source 432 are irradiated toward the conductive paste applied to each antenna AN, thereby curing the conductive paste.

[0138] Referring again to Figure 20 Fig. 42, the conveyance state shows a state in which the antenna sheet AS is conveyed from the IC chip arrangement step. At the time point at which the antenna AN to which the uncured conductive paste is applied is positioned directly below the ultraviolet curing unit 43, the conveyance of the antenna sheet AS is stopped. Then, in the state in which the conveyance of the antenna sheet AS is stopped (stop state), the ultraviolet curing unit 43 is moved downward to press the antenna AN by the glass plate 435, and the ultraviolet rays are irradiated, thereby curing the conductive paste.

[0139] The antenna sheet AS is conveyed from the IC chip arrangement step even in the stop state, so during the irradiation of the ultraviolet rays, the conveyance roller 97 is lowered by the weight, and absorbs the conveyed antenna sheet AS between the conveyance roller 96 and the conveyance roller 98. If the irradiation of the ultraviolet rays is ended, the antenna ANs corresponding to the number of the ultraviolet curing units 43 are rapidly conveyed downstream, and then stopped so that the uncured antenna ANs are positioned directly below the ultraviolet curing units 43. That is, in the curing step of one embodiment, the conveyance state of the antenna sheet AS and the stop state (state in which the ultraviolet rays are irradiated) are repeated. At the time of rapid conveyance of the antenna ANs, the conveyance roller 97 is raised by the tension applied to the antenna sheet AS.

[0140] The curing step of one embodiment can also be performed using a heat curing device. That is, when a heat-curable adhesive such as an epoxy-based resin is applied at the dispenser 2, in the curing step, the adhesive is cured by performing a heat curing process.

[0141] Figure 22 is the same as Figure 20The curing device 4B is configured to repeatedly perform the conveying state and the stopped state of the antenna sheet AS. The curing device 4B is different from the curing device 4A and is provided with a plurality of heat curing units 46. A heat source that operates by being supplied with electric power through a cable not shown is arranged in each heat curing unit 46. When the antenna sheet AS is in the stopped state, the support shaft 45 is driven to lower the support shaft 45, and the adhesive is heated to cure the adhesive while pressing the antenna AN corresponding to each heat curing unit 46. When the heating is completed, the support shaft 45 is driven to raise the support shaft 45, and the conveying of the antenna sheet AS is performed.

[0142] Further, in the case where the conductive paste is cured by ultraviolet rays, instead of the ultraviolet curing unit 43 in which a light source is built in, a pressing unit that presses the antenna AN via a glass plate can be used, and an ultraviolet irradiation device that irradiates the conductive paste on the antenna AN being pressed in the stopped state with ultraviolet rays from the outside in the width direction or obliquely from above can be provided. Figure 20

[0143] In one embodiment, a plurality of ultraviolet curing units 43 can be circularly moved in conjunction with the traveling speed of the antenna sheet AS, and the ultraviolet rays can be irradiated by the built-in light source while pressing the antenna AN, so that the antenna sheet AS is not brought to the stopped state when the ultraviolet rays are irradiated.

[0144] Similarly, in one embodiment, in the case where the conductive paste is heat-cured, a plurality of heat curing units 46 can be configured to circularly move in conjunction with the traveling speed of the antenna sheet AS, and heating can be performed while pressing the antenna AN.​

Claims

1. An IC chip mounting device, characterized in that, have: The discharge section discharges adhesive to the reference position of each antenna in an antenna continuum on which multiple antennas for inlays are continuously formed on a substrate. Multiple nozzles, each movable between a first position and a second position, are configured to adsorb an IC chip when in the first position and to place the IC chip on the adhesive at a reference position of the corresponding antenna of the antenna continuum when in the second position. A nozzle mounting section, on which the plurality of nozzles are mounted; The rotating part causes the nozzle mounting part to rotate in such a way that the plurality of nozzles move on a circular track in a plane orthogonal to the transport surface of the antenna continuum, and that the direction of movement of each nozzle when it is in the second position is consistent with the transport direction of the antenna continuum. The determination unit determines whether an IC chip is adsorbed on each nozzle during the movement of each nozzle from the first position to the second position; and The control unit controls the angular velocity of the nozzle mounting part when it rotates, so that after the determination unit determines that the nozzle does not have an IC chip attached, i.e., a non-attached nozzle, the nozzle that reaches the second position configures the IC chip for the antenna corresponding to the non-attached nozzle.

2. The IC chip mounting device according to claim 1, characterized in that, The control unit controls the angular velocity in such a way that the determination unit determines that an IC chip is adsorbed and that the IC chip is placed on the nozzle that arrives at the second position first after the non-adsorbed nozzle.

3. The IC chip mounting device according to claim 1 or 2, characterized in that, The device includes an image acquisition unit that acquires an image of the nozzle when it is located at a predetermined position between the first position and the second position. The determination unit determines whether an IC chip is adsorbed on the nozzle based on the image acquired by the image acquisition unit.

4. The IC chip mounting device according to claim 1 or 2, characterized in that, It has a control valve connected to the nozzle, configured to perform either a suction action (drawing air through the nozzle) or a discharge action (discharging air from the nozzle). The control unit controls the control valve in a manner that prevents the non-adsorption nozzle from performing a suction action.

5. The IC chip mounting device according to claim 1 or 2, characterized in that, It has a control valve connected to the nozzle, configured to perform either a suction action (drawing air through the nozzle) or a discharge action (discharging air from the nozzle). The control unit controls the control valve in such a way that the non-adsorption nozzle does not discharge when it is in the second position.

6. The IC chip mounting device according to claim 3, characterized in that, The device includes a correction amount determination unit, which determines, based on the image acquired by the image acquisition unit, a correction amount for the angle around the axis of the nozzle (i.e., a first correction amount), a correction amount for the position of the antenna continuum in the transport direction (i.e., a second correction amount), and a correction amount for the position of the antenna continuum in the width direction (i.e., a third correction amount), as the correction amount for the IC chip attached to the nozzle.

7. A method for mounting an IC chip, characterized in that, Adhesive is dispensed via a dispenser to the specified reference positions of each antenna in an antenna continuum on which multiple antennas for inlays are continuously formed on a substrate. When each of the multiple nozzles capable of moving between a first position and a second position is in the first position, the IC chip is sequentially adsorbed through each nozzle. The nozzle mounting part, on which the plurality of nozzles are mounted, rotates such that the plurality of nozzles move on a circular track in a plane orthogonal to the transport surface of the antenna continuum, and that the direction of movement of each nozzle when it is in the second position is consistent with the transport direction of the antenna continuum. During the movement of each nozzle from the first position to the second position, it is determined whether an IC chip is adsorbed on each nozzle. For each nozzle identified as having an IC chip adsorbed, when each nozzle is in the second position, the IC chip is sequentially disposed onto the adhesive at the reference position of the corresponding antenna of the antenna continuum through each nozzle. The angular velocity of the nozzle mounting part is controlled so that the nozzle that reaches the second position after being determined to be a non-adsorbed nozzle (i.e., a nozzle without an adsorbed IC chip) is configured with an IC chip for the antenna corresponding to the non-adsorbed nozzle.

8. The IC chip mounting method according to claim 7, characterized in that, The angular velocity is controlled in such a way that the nozzle that is determined to have an IC chip adsorbed and is the first nozzle to reach the second position after the non-adsorbed nozzle is equipped with an IC chip.

9. The IC chip mounting method according to claim 7 or 8, characterized in that, Obtain an image of the nozzle when it is located at a predetermined position between the first position and the second position. Based on the obtained image, it is determined whether an IC chip is adsorbed on the nozzle.

10. The IC chip mounting method according to claim 7 or 8, characterized in that, The non-adsorption nozzle is prevented from performing a suction action by controlling a control valve, wherein the control valve is connected to the nozzle and configured to perform either a suction action that draws air through the nozzle or a discharge action that discharges air from the nozzle.

11. The IC chip mounting method according to claim 7 or 8, characterized in that, The non-adsorption nozzle is prevented from discharging in the second position by controlling the control valve, wherein the control valve is connected to the nozzle and configured to perform either a suction action of drawing through the nozzle or a discharge action of discharging air from the nozzle.

12. The IC chip mounting method according to claim 9, characterized in that, Based on the obtained image, the correction amount of the angle around the axis of the nozzle, i.e., the first correction amount, the correction amount of the position of the antenna continuum in the transport direction, i.e., the second correction amount, and the correction amount of the position of the antenna continuum in the width direction, i.e., the third correction amount, are determined as the correction amount of the IC chip attached to the nozzle.

13. The IC chip mounting method according to claim 7, characterized in that, When the non-adsorption nozzle is present, the control is performed to accelerate the angular velocity of the nozzle mounting part during rotation, thereby sequentially configuring the IC chip onto each of the multiple antennas that are continuously delivered.

Images