Heating Component, Atomizer and Electronic Atomization Device

Abstract

The present application discloses a heating component, an atomizer and an electronic atomization device. The heating component includes a first substrate and a second substrate; the first substrate has a first surface and a second surface arranged opposite to each other, and the first surface is the liquid absorption surface; the first substrate has a plurality of first micropores for guiding the aerosol-forming matrix from the liquid absorption surface to the second surface; the second substrate has a third surface and a fourth surface arranged opposite to each other, and the fourth surface is the atomization surface; the second surface is arranged opposite to the third surface; the second substrate is a dense substrate, and the second substrate is provided with a plurality of second micropores penetrating through the third surface and the fourth surface, and the second micropores are used for guiding the aerosol-forming matrix from the third surface to the atomization surface; one side of the edge of the first substrate has a liquid inlet, and the first substrate and / or the second substrate form a flow channel, and the flow channel communicates with the first micropores, the second micropores and the liquid inlet, and air bubbles can be discharged through the flow channel to avoid the formation of air bubble blockage for liquid supply on the liquid absorption surface, thereby avoiding dry burning.

Description

Technical Field

[0001] The present application relates to the technical field of electronic atomization, and particularly to a heating component, an atomizer and an electronic atomization device. Background Art

[0002] An electronic atomization device is composed of a heating element, a battery, a control circuit and other parts. As the core component of the electronic atomization device, the characteristics of the heating element determine the atomization effect and user experience of the electronic atomization device.

[0003] One type of existing heating element is a cotton core heating element. Most cotton core heating elements are structures in which a spring-shaped metal heating wire is wound around a cotton rope or a fiber rope. The liquid aerosol generating matrix to be atomized is sucked by both ends of the cotton rope or the fiber rope, and then transmitted to the central metal heating wire for heating and atomization. Due to the limited end area of the cotton rope or the fiber rope, the adsorption and transmission efficiency of the aerosol generating matrix is low. In addition, the structural stability of the cotton rope or the fiber rope is poor, and phenomena such as dry burning, carbon deposition and burnt smell are likely to occur after multiple thermal cycles.

[0004] Another type of existing heating element is a ceramic heating element. Most ceramic heating elements form a metal heating film on the surface of a porous ceramic body; the porous ceramic body plays a role in liquid conduction and liquid storage, and the metal heating film realizes the heating and atomization of the liquid aerosol generating matrix. However, it is difficult to precisely control the position distribution and size accuracy of micropores in the porous ceramic prepared by high-temperature sintering. In order to reduce the risk of liquid leakage, it is necessary to reduce the pore diameter and porosity, but in order to achieve sufficient liquid supply, it is necessary to increase the pore diameter and porosity, and the two are contradictory. At present, under the conditions of pore diameter and porosity that meet the low liquid leakage risk, the liquid conduction ability of the porous ceramic matrix is limited, and a burnt smell will occur under high-power conditions.

[0005] With the progress of technology, users' requirements for the atomization effect of electronic atomization devices are getting higher and higher. In order to meet the needs of users, a thin heating element is provided to improve the liquid supply ability, but this thin heating element is prone to form bubbles on the liquid absorption surface, blocking the liquid inlet and causing the heating element to dry burn. Summary of the Invention

[0006] The heating component, atomizer and electronic atomization device provided by the present application solve the technical problem that a thin heating element in the prior art is prone to form bubbles on the liquid absorption surface.

[0007] To solve the above technical problems, the first technical solution provided by the present application is: to provide a heating component, including a first substrate and a second substrate; the first substrate has a first surface and a second surface arranged opposite to each other, and the first surface is a liquid absorption surface; the first substrate has a plurality of first micropores for guiding an aerosol-forming matrix from the liquid absorption surface to the second surface; the second substrate has a third surface and a fourth surface arranged opposite to each other, and the fourth surface is an atomization surface; the second surface is arranged opposite to the third surface; the second substrate is a dense substrate, and the second substrate is provided with a plurality of second micropores penetrating through the third surface and the fourth surface for guiding the aerosol-forming matrix from the third surface to the atomization surface; wherein, one side of the edge of the first substrate has a liquid inlet, and the first substrate and / or the second substrate form a flow channel, and the flow channel communicates with the first micropores, the second micropores and the liquid inlet.

[0008] Wherein, a through hole or a notch is arranged at the edge of the first substrate; the through hole or the notch serves as the liquid inlet.

[0009] Wherein, the heating component further includes a seal, and the seal has a liquid downward hole; at least a part of the edge of the first substrate is spaced from the pore wall of the liquid downward hole to form the liquid inlet, and the second substrate straddles the entire liquid downward hole.

[0010] Wherein, a gap is arranged between the second surface and the third surface at intervals, and the gap serves as the flow channel.

[0011] Wherein, the heating component further includes a spacer; the spacer is arranged between the second surface and the third surface and is located at the edge of the first substrate and / or the second substrate so that the first substrate and the second substrate are spaced apart to form the gap.

[0012] Wherein, the spacer is an independently arranged gasket; or, the spacer is a support column or a support frame fixed on the second surface and / or the third surface; or, the spacer is a protrusion integrally formed with the first substrate and / or the second substrate.

[0013] Wherein, the heating component further includes a seal, and the seal has a liquid downward hole; a fixing structure is arranged on the pore wall of the liquid downward hole to fix the first substrate and / or the second substrate so that the first substrate and the second substrate are spaced apart to form the gap.

[0014] Wherein, along the direction parallel to the first substrate, the height of the gap is the same.

[0015] Wherein, along the direction parallel to the first substrate heating component, the height of the gap gradually increases.

[0016] Wherein, the height of the gap gradually increases from zero.

[0017] Wherein, the heating component further includes a plurality of micro-columns, and the plurality of micro-columns are disposed in the gap.

[0018] Wherein, one end of the micro-column abuts against the second surface, and the other end of the micro-column is spaced from the third surface; or, one end of the micro-column abuts against the third surface, and the other end of the micro-column is spaced from the second surface; or, one end of the micro-column abuts against the second surface, and the other end of the micro-column abuts against the third surface.

[0019] Wherein, the third surface is provided with a plurality of first grooves extending in a first direction and a plurality of second grooves extending in a second direction, and the first grooves and the second grooves are arranged in a crosswise manner; the plurality of first grooves and the plurality of second grooves form the flow channel.

[0020] Wherein, the plurality of second micropores are arranged in an array, each first groove corresponds to one row or multiple rows of the second micropores, and each second groove corresponds to one column or multiple columns of the second micropores.

[0021] Wherein, the ratio of the depth to the width of the first groove is 0-20, and the ratio of the depth to the width of the second groove is 0-20.

[0022] Wherein, the second surface is provided with a plurality of third grooves extending in a third direction and a plurality of fourth grooves extending in a fourth direction, and the third grooves and the fourth grooves are arranged in a crosswise manner; the plurality of first grooves, the plurality of second grooves, the plurality of third grooves and the plurality of fourth grooves together form the flow channel.

[0023] Wherein, the first substrate is a dense substrate, and the first micropores penetrate through the first surface and the second surface; the plurality of first micropores are arranged in an array, each third groove corresponds to one row or multiple rows of the first micropores, and each fourth groove corresponds to one column or multiple columns of the first micropores.

[0024] Wherein, the ratio of the depth to the width of the third groove is 0-20, and the ratio of the depth to the width of the fourth groove is 0-20.

[0025] Wherein, the capillary force of the first groove and the second groove is greater than the capillary force of the third groove and the fourth groove.

[0026] Wherein, the second surface and the third surface are spaced apart to form a gap.

[0027] Wherein, the second surface is in contact with the third surface.

[0028] Wherein, the depth of the first groove and the depth of the second groove are greater than the depth of the third groove and the depth of the fourth groove.

[0029] Wherein, the central axis of the second micropore is perpendicular to the third surface.

[0030] Wherein, the thickness of the second substrate is 0.1 mm - 1 mm, and the pore diameter of the second micropore is 1 μm - 100 μm.

[0031] Wherein, the ratio of the thickness of the second substrate to the pore diameter of the second micropore is 20:1 - 3:1.

[0032] Wherein, the ratio of the center - to - center distance between adjacent second micropores to the pore diameter of the second micropore is 3:1 - 5:1.

[0033] Wherein, the first substrate is a dense substrate, and the first micropore penetrates through the first surface and the second surface.

[0034] Wherein, the capillary force of the second micropore is greater than the capillary force of the first micropore.

[0035] Wherein, along the thickness direction of the first substrate, the pore diameter of the first micropore gradually increases; the constriction opening of the first micropore is located on the first surface, and the expansion opening of the first micropore is located on the second surface.

[0036] Wherein, the area on the first substrate where the first micropore is provided completely covers the area on the second substrate where the second micropore is provided in projection.

[0037] Wherein, the pore diameter of the first micropore is 1 μm - 100 μm.

[0038] Wherein, the thickness of the first substrate is less than the thickness of the second substrate.

[0039] Wherein, the heating assembly further includes a heating element, and the heating element is an independent element disposed on the atomizing surface; or, the second substrate has a conductive function.

[0040] Wherein, the projection of the first substrate on the atomizing surface completely covers the heating element.

[0041] To solve the above technical problems, the second technical solution provided by this application is as follows: Provide a heating component, including a first substrate and a second substrate; the first substrate has a first surface and a second surface arranged oppositely, and the first surface is a liquid absorption surface; the first substrate has a plurality of first micropores, and the first micropores are used to guide the aerosol generating matrix from the liquid absorption surface to the second surface; the second substrate has a third surface and a fourth surface arranged oppositely, and the fourth surface is an atomization surface; the second surface is arranged opposite to the third surface; the second substrate has a plurality of second micropores, and the second micropores are used to guide the aerosol generating matrix from the third surface to the atomization surface; wherein, one side of the edge of the first substrate has a liquid inlet, and the first substrate and / or the second substrate form a flow channel, and the flow channel communicates with the first micropores, the second micropores and the liquid inlet.

[0042] To solve the above technical problems, the third technical solution provided by this application is as follows: Provide an atomizer, including a liquid storage cavity and a heating component; the liquid storage cavity is used to store the aerosol generating matrix; the heating component is in fluid communication with the liquid storage cavity, and the heating component is used to atomize the aerosol generating matrix; the heating component is the heating component described in any one of the above.

[0043] To solve the above technical problems, the fourth technical solution provided by this application is as follows: Provide an electronic atomization device, including an atomizer and a main body; the atomizer is the atomizer described above; the main body is used to provide electrical energy for the operation of the atomizer and control the heating component to atomize the aerosol generating matrix.

[0044] The heating component, atomizer and electronic atomization device provided by this application, the heating component includes a first substrate and a second substrate; the first substrate has a first surface and a second surface arranged oppositely, and the first surface is a liquid absorption surface; the first substrate has a plurality of first micropores, and the first micropores are used to guide the aerosol generating matrix from the liquid absorption surface to the second surface; the second substrate has a third surface and a fourth surface arranged oppositely, and the fourth surface is an atomization surface; the second surface is arranged opposite to the third surface; the second substrate is a dense substrate, and a plurality of second micropores penetrating the third surface and the fourth surface are provided on the second substrate, and the second micropores are used to guide the aerosol generating matrix from the third surface to the atomization surface; wherein, one side of the edge of the first substrate has a liquid inlet, and the first substrate and / or the second substrate form a flow channel, and the flow channel communicates with the first micropores, the second micropores and the liquid inlet, and air bubbles can be excluded through the flow channel, avoiding the formation of air bubble blockage in the liquid supply on the liquid absorption surface, and further avoiding dry burning. Description of the Drawings

[0045] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0046] Figure 1 is a schematic structural diagram of an embodiment of an electronic atomization device provided by the present application;

[0047] Figure 2 is a schematic structural diagram of an atomizer provided by an embodiment of the present application;

[0048] Figure 3a is a schematic structural diagram of the first embodiment of the heating component provided by the present application;

[0049] Figure 3b is Figure 3a a schematic structural diagram of the second substrate of the heating component viewed from the atomization surface side provided;

[0050] Figure 3c is Figure 3a a schematic structural diagram of the first substrate of the heating component viewed from the liquid absorption surface side provided;

[0051] Figure 3d is Figure 3a a schematic structural diagram of another embodiment of the spacer in the heating component provided;

[0052] Figure 4 is a schematic structural diagram of the second embodiment of the heating component provided by the present application;

[0053] Figure 5a is a schematic structural diagram of another embodiment of the seal in the second embodiment of the heating component provided by the present application;

[0054] Figure 5b is Figure 5a a schematic structural diagram of the assembly structure of the seal, the first dense matrix, and the second substrate provided;

[0055] Figure 6a is a schematic structural diagram of another embodiment of the seal in the second embodiment of the heating component provided by the present application;

[0056] Figure 6b is Figure 6a a schematic structural diagram of the assembly structure of the seal, the first dense matrix, and the second substrate provided;

[0057] Figure 7a is a schematic structural diagram of the third embodiment of the heating component provided by the present application;

[0058] Figure 7b is Figure 7a Partial structural schematic diagram of the second substrate of the provided heating component as viewed from one side of the third surface;

[0059] Figure 7c is Figure 7a Partial structural schematic diagram of the first substrate of the provided heating component as viewed from one side of the second surface;

[0060] Figure 8 Another structural schematic diagram of the third embodiment of the heating component provided by this application;

[0061] Figure 9a Top - view structural schematic diagram of the fourth embodiment of the heating component provided by this application;

[0062] Figure 9b is Figure 9a Cross - sectional schematic diagram of the provided heating component along the B - B direction;

[0063] Figure 9c is Figure 9a Cross - sectional schematic diagram of the provided heating component along the C - C direction;

[0064] Figure 9d Structural schematic diagram of another implementation manner of the liquid inlet in the fourth embodiment of the heating component provided by this application;

[0065] Figure 9e Structural schematic diagram of yet another implementation manner of the liquid inlet in the fourth embodiment of the heating component provided by this application;

[0066] Figure 10a Top - view structural schematic diagram of the fifth embodiment of the heating component provided by this application;

[0067] Figure 10b Structural schematic diagram of another implementation manner of the liquid inlet in the fifth embodiment of the heating component provided by this application;

[0068] Figure 10c Structural schematic diagram of yet another implementation manner of the liquid inlet in the fifth embodiment of the heating component provided by this application;

[0069] Figure 10d Structural schematic diagram of the sixth embodiment of the heating component provided by this application;

[0070] Figure 11 Structural schematic diagram of the seventh embodiment of the heating component provided by this application;

[0071] Figure 12 Structural schematic diagram of the first experimental piece;

[0072] Figure 13 Structural schematic diagram of the second experimental piece;

[0073] Figure 14 It is a schematic structural diagram of the third test piece. Specific implementation manners

[0074] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0075] In the following description, specific details such as specific system structures, interfaces, and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the present application.

[0076] The terms "first", "second", and "third" in the present application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", and "third" may explicitly or implicitly include at least one of the said features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly. The terms "including" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or components inherent to these processes, methods, products, or devices.

[0077] Referring to "embodiment" in this article means that the specific features, structures, or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The phrase appearing in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0078] The present application will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0079] Please refer to Figure 1 , Figure 11 is a schematic diagram of the structure of an embodiment of the electronic atomization device provided in the present application. In this embodiment, an electronic atomization device 100 is provided. The electronic atomization device 100 can be used for atomization of an aerosol-generating matrix. The electronic atomization device 100 includes an atomizer 1 and a host 2 electrically connected to each other.

[0080] The atomizer 1 is used to store the aerosol generating matrix and atomize the aerosol generating matrix to form an aerosol for users to inhale. The atomizer 1 can be used in different fields, such as medical treatment, beauty, leisure smoking, etc. In a specific embodiment, the atomizer 1 can be used in an electronic aerosolization device to atomize the aerosol generating matrix and generate an aerosol for the smoker to inhale. The following embodiments are all based on this leisure smoking as an example; of course, in other embodiments, the atomizer 1 can also be used in hair spray equipment to atomize hair spray for hair styling; or in equipment for treating upper and lower respiratory system diseases to atomize medical drugs.

[0081] The specific structure and function of the atomizer 1 may refer to the specific structure and function of the atomizer 1 involved in any of the following embodiments, and the same or similar technical effects can be achieved, which will not be repeated here.

[0082] The host 2 includes a battery (not shown) and a controller (not shown). The battery is used to provide electrical energy for the operation of the atomizer 1, so that the atomizer 1 can atomize the aerosol-generating matrix to form an aerosol; the controller is used to control the operation of the atomizer 1. The host 2 also includes other components such as a battery holder and an airflow sensor.

[0083] The atomizer 1 and the host 2 can be integrally arranged or detachably connected, and can be designed according to specific needs.

[0084] See also Figure 2 , Figure 2 It is a schematic diagram of the structure of an atomizer provided in one embodiment of the present application.

[0085] The atomizer 1 includes a shell 10, an atomizer seat 11 and a heating component 12. The shell 10 has a liquid storage chamber 13 and an air outlet channel 14. The liquid storage chamber 13 is used to store a liquid aerosol-generating matrix, and the liquid storage chamber 13 is arranged around the air outlet channel 14. The end of the shell 10 also has a suction port 15, and the suction port 15 is connected to the air outlet channel 14; specifically, the suction port 15 can be formed by a port of the air outlet channel 14. The shell 10 has a receiving chamber 16 on the side of the liquid storage chamber 13 away from the suction port 15, and the atomizer seat 11 is arranged in the receiving chamber 16. The atomizer seat 11 includes an atomizer top seat 111 and an atomizer base 112. The atomizer top seat 111 and the atomizer base 112 cooperate to form a receiving chamber 113; that is, the atomizer seat 11 has a receiving chamber 113. The heating component 12 is arranged in the receiving chamber 113, and is arranged in the receiving chamber 16 together with the atomizer seat 11.

[0086] The atomizing top base 111 is provided with two fluid channels 114. Specifically, two fluid channels 114 are provided on the top wall of the atomizing top base 111, and the two fluid channels 114 are arranged on both sides of the air outlet channel 14. One end of the fluid channel 114 is communicated with the liquid storage cavity 13, and the other end is communicated with the receiving cavity 113. That is, the fluid channel 114 communicates the liquid storage cavity 13 with the receiving cavity 113, so that the aerosol generating matrix in the liquid storage cavity 13 enters the heating component 12 through the fluid channel 114. That is to say, the heating component 12 is in fluid communication with the liquid storage cavity 13, and the heating component 12 is used to absorb and heat the atomized aerosol generating matrix. The controller of the main unit 2 controls the heating component 12 to atomize the aerosol generating matrix.

[0087] In this embodiment, the surface of the heating component 12 away from the liquid storage cavity 13 is the atomizing surface. An atomizing cavity 115 is formed between the atomizing surface of the heating component 12 and the inner wall surface of the receiving cavity 113, and the atomizing cavity 115 is communicated with the air outlet channel 14. The atomizing base 112 is provided with an air inlet 116 to communicate the outside with the atomizing cavity 115. The outside air enters the atomizing cavity 115 through the air inlet 116, carries the atomized aerosol of the heating component 12 into the air outlet channel 14, and finally reaches the suction port 15 and is inhaled by the user.

[0088] The atomizer 1 further includes a conducting member 17, and the conducting member 17 is fixed to the atomizing base 112. One end of the conducting member 17 is electrically connected to the heating component 12, and the other end is used to be electrically connected to the main unit 2 so that the heating component 12 can work.

[0089] The atomizer 1 further includes a sealing top cover 18. The sealing top cover 18 is arranged on the surface of the atomizing top base 111 close to the liquid storage cavity 13, and is used to seal between the liquid storage cavity 13, the atomizing top base 111 and the air outlet channel 14 to prevent liquid leakage. Optionally, the material of the sealing top cover 18 is silica gel or fluororubber.

[0090] Please refer to Figure 3a 、 3b 、3c, Figure 3a which is a schematic structural diagram of the first embodiment of the heating component provided by the present application, Figure 3b is Figure 3a a schematic structural diagram of the second substrate of the heating component viewed from the atomizing surface side provided by Figure 3c is Figure 3a a schematic structural diagram of the first substrate of the heating component viewed from the liquid absorption surface side provided by

[0091] The heating component 12 includes a first substrate 121 and a second substrate 122. The first substrate 121 has a first surface 1211 and a second surface 1212 which are oppositely arranged, and the first surface 1211 is the liquid absorption surface; the first substrate 121 has a plurality of first micropores 1213, and the first micropores 1213 are used to guide the aerosol generating matrix from the first surface 1211 to the second surface 1212, that is, the first micropores 1213 are used to guide the aerosol generating matrix from the liquid absorption surface to the second surface 1212. The second substrate 122 has a third surface 1221 and a fourth surface 1222 which are oppositely arranged, and the fourth surface 1222 is the atomization surface; the second substrate 122 has a plurality of second micropores 1223, and the second micropores 1223 are used to guide the aerosol generating matrix from the third surface 1221 to the fourth surface 1222, that is, the second micropores 1223 are used to guide the aerosol generating matrix from the third surface 1221 to the atomization surface. Wherein, the second surface 1212 and the third surface 1221 are oppositely arranged. The first substrate 121 and / or the second substrate 122 form a flow channel, and the flow channel communicates the first micropores 1213 and the second micropores 1223. It can be understood that the aerosol generating matrix flows from the liquid absorption surface to the atomization surface under the action of gravity and / or capillary force.

[0092] Through the above settings, the heating component 12 provided by the present application has a high liquid supply capacity, and the flow channel can avoid the formation of large bubbles on the liquid absorption surface to block the liquid supply, thereby avoiding dry burning.

[0093] In this embodiment, a gap 123 is formed between the second surface 1212 and the third surface 1221 at intervals, and this gap 123 serves as the above-mentioned flow channel; that is to say, the second surface 1212 of the first substrate 121 and the third surface 1221 of the second substrate 122 cooperate to form a flow channel. By forming a gap 123 between the first substrate 121 and the second substrate 122, the bubbles entering from the atomization surface during the atomization process can be excluded, the formation of bubbles on the liquid absorption surface to block the liquid supply can be avoided, and the entry of bubbles into the liquid storage cavity 13 to hinder the liquid supply can be prevented, thereby avoiding dry burning.

[0094] The first substrate 121 can be a porous substrate, for example, porous ceramics, cotton, quartz sand core, materials with a foam structure; the first substrate 121 can also be a dense substrate. When the first substrate 121 is a dense substrate, the material of the first substrate 121 is glass, dense ceramics or silicon. When the material of the first substrate 121 is glass, it can be one of ordinary glass, quartz glass, borosilicate glass, and photosensitive lithium aluminosilicate glass. In a specific embodiment, the first substrate 121 is borosilicate glass. In another specific embodiment, the first substrate 121 is photosensitive lithium aluminosilicate glass.

[0095] The second substrate 122 can be a porous substrate, such as porous ceramics, cotton, quartz sand core, materials with foam structure; the second substrate 122 can also be a dense substrate. When the second substrate 122 is a dense substrate, the material of the second substrate 122 is glass, dense ceramics or silicon. When the material of the second substrate 122 is glass, it can be one of ordinary glass, quartz glass, borosilicate glass, photosensitive lithium aluminosilicate glass. In a specific embodiment, the second substrate 122 is borosilicate glass. In another specific embodiment, the second substrate 122 is photosensitive lithium aluminosilicate glass.

[0096] The materials of the first substrate 121 and the second substrate 122 can be the same or different. The first substrate 121 and the second substrate 122 can be combined arbitrarily. For example, the first substrate 121 is porous ceramics and the second substrate 122 is a dense substrate; for another example, the first substrate 121 is porous ceramics and the second substrate 122 is porous ceramics; for another example, the first substrate 121 is a dense substrate and the second substrate 122 is porous ceramics; for another example, the first substrate 121 is a dense substrate and the second substrate 122 is a dense substrate.

[0097] Taking the first substrate 121 as a dense substrate and the second substrate 122 as a dense substrate as an example, the heating component 12 will be introduced in detail below.

[0098] The first substrate 121 is a dense substrate, and the first substrate 121 has a plurality of first micropores 1213 penetrating the first surface 1211 and the second surface 1212. The second substrate 122 is a dense substrate, and the second substrate 122 has a plurality of second micropores 1223 penetrating the third surface 1221 and the fourth surface 1222. Among them, both the first micropores 1213 and the second micropores 1223 have capillary forces. The first micropores 1213 use their capillary forces to guide the aerosol generating matrix from the liquid absorption surface of the first substrate 121 to the gap 123; the second micropores 1223 use their capillary forces to guide the aerosol generating matrix from the gap 123 to the atomization surface of the second substrate 122.

[0099] It can be understood that when the first substrate 121 is porous ceramics, the first substrate 121 uses its own capillary force to guide the aerosol generating matrix from the liquid absorption surface of the first substrate 121 to the gap 123; when the second substrate 122 is porous ceramics, the second substrate 122 uses its own capillary force to guide the aerosol generating matrix from the gap 123 to the atomization surface of the second substrate 122.

[0100] It can be understood that by setting the second substrate 122 as a dense substrate and providing the second micropores 1223 penetrating the third surface 1221 and the fourth surface 1222 on the second substrate 122, it is easier to conduct liquid and connect with the first micropores 1213 of the first substrate 121, which is beneficial to improving the liquid supply efficiency.

[0101] The height of the gap 123 is less than or equal to 200 μm, and the height of the gap 123 is the distance between the second surface 1212 and the third surface 1221. When the height of the gap 123 is greater than 200 μm, there is a risk of liquid leakage from the first micropore 1213 and / or the second micropore 1223, and there is also a risk of lateral coalescence and growth of bubbles. When the height of the gap 123 is too small, the gap 123 cannot effectively remove the bubbles entering through the second micropore 1223. In a specific embodiment, the height of the gap 123 is less than or equal to 50 μm. In another specific embodiment, the height of the gap 123 is less than or equal to 20 μm.

[0102] By setting the gap 123, lateral liquid replenishment can be achieved. Even if bubbles adhere to the liquid absorption surface of the first substrate 121 and cover part of the first micropores 1213, it does not affect the liquid supply of the second substrate 122. Further, setting the height of the gap 123 within the above range limits the range of bubble growth, making it difficult to form bubbles that break away from the second micropore 1223. When the bubbles collapse, they are discharged from the atomization surface, thereby preventing large bubbles from adhering to the liquid absorption surface of the first substrate 121 and affecting the liquid supply.

[0103] In this embodiment, as Figure 3b shown, the heating assembly 12 further includes a heating element 124, a positive electrode 128, and a negative electrode 129. The two ends of the heating element 124 are electrically connected to the positive electrode 128 and the negative electrode 129 respectively. The positive electrode 128 and the negative electrode 129 are both disposed on the atomization surface of the second substrate 122 for easy electrical connection with the host 2. The heating element 124 can be a heating sheet, a heating film, a heating mesh, etc., as long as it can heat and atomize the aerosol generating matrix. The heating element 124 can be disposed on the atomization surface of the second substrate 122 or buried inside the second substrate 122, and is specifically designed according to needs. In another embodiment, the second substrate 122 has a conductive function and can generate heat itself, such as a self-heating conductive ceramic or a glass with a conductive function. In this case, there is no need to separately provide a heating element 124. That is to say, the heating element 124 is an optional structure.

[0104] When the heating element 124 is a separately provided component, the projection of the first substrate 121 on the atomization surface completely covers the heating element 124 to ensure that the liquid supply speed can meet the atomization speed of the heating element 124 and achieve a good atomization effect.

[0105] Further, by disposing the first substrate 121 on the side of the second substrate 122 close to the liquid storage cavity 13, the first substrate 121 can insulate to a certain extent and prevent the heat on the second substrate 122 from being conducted to the liquid storage cavity 13, which is beneficial to ensuring the consistency of the taste.

[0106] See Figure 3b, in this embodiment, a plurality of second micropores 1223 are arranged in an array on only a partial surface of the second substrate 122. Specifically, the second substrate 122 is provided with a micropore array region 1224 and a blank region 1225 arranged around the micropore array region 1224 for one week. The micropore array region 1224 has a plurality of second micropores 1223; the heating element 124 is arranged in the micropore array region 1224 to heat and atomize the aerosol generating matrix; the positive electrode 128 and the negative electrode 129 are arranged in the blank region 1225 of the atomizing surface (the fourth surface 1222) to ensure the stability of the electrical connection between the positive electrode 128 and the negative electrode 129.

[0107] By providing the micropore array region 1224 on the second substrate 122 and the blank region 1225 arranged around the micropore array region 1224 for one week, it can be understood that no second micropores 1223 are provided on the blank region 1225, reducing the number of second micropores 1223 on the second substrate 122, thereby improving the strength of the second substrate 122 and reducing the production cost of providing the second micropores 1223 on the second substrate 122. The micropore array region 1224 in the second substrate 122 serves as the atomizing region, covering the heating element 124 and the peripheral region of the heating element 124, that is, basically covering the region reaching the temperature of the aerosol generating matrix, making full use of the thermal efficiency.

[0108] It can be understood that the size of the region around the micropore array region 1224 of the second substrate 122 in this application is larger than the pore diameter of the second micropores 1223 to be called the blank region 1225; that is, the blank region 1225 in this application is the region where second micropores 1223 can be formed but are not formed, rather than the region around the micropore array region 1224 where second micropores 1223 cannot be formed. In one embodiment, the distance between the second micropore 1223 closest to the side line of the second substrate 122 and the side line of the second substrate 122 is greater than the pore diameter of the second micropores 1223, and then it is considered that a blank region 1225 is provided in the circumferential direction of the micropore array region 1224.

[0109] Whether the first micropores 1213 are provided on the entire surface of the first substrate 121 or only on a partial surface can be designed according to needs. Optionally, referring to Figure 3c , the first substrate 121 is provided with a micropore array region 1214 and a blank region 1215 arranged around the micropore array region 1214 for one week. The micropore array region 1214 has a plurality of first micropores 1213.

[0110] The shapes of the first substrate 121 and the second substrate 122 can be flat, cylindrical, arc-shaped, etc., and are specifically designed according to needs; the shapes of the first substrate 121 and the second substrate 122 are cooperatively arranged to form a gap 123 between the first substrate 121 and the second substrate 122. For example,Figure 3a Both the first substrate 121 and the second substrate 122 of the provided heating component 12 are plate-shaped. The shapes and sizes of the first substrate 121 and the second substrate 122 may be the same or different. In this embodiment, as Figure 3a shown, the shapes and sizes of the first substrate 121 and the second substrate 122 are the same, and the projections completely overlap.

[0111] The first substrate 121 and the second substrate 122 may be set to regular shapes, such as rectangular plate shapes, circular plate shapes, etc. The plurality of first micro-holes 1213 provided on the first substrate 121 are arranged in an array; that is, the plurality of first micro-holes 1213 provided on the first substrate 121 are regularly arranged, and the center-to-center distance between adjacent first micro-holes 1213 among the plurality of first micro-holes 1213 is the same. The plurality of second micro-holes 1223 provided on the second substrate 122 are arranged in an array; that is, the plurality of second micro-holes 1223 provided on the second substrate 122 are regularly arranged, and the center-to-center distance between adjacent second micro-holes 1223 among the plurality of second micro-holes 1223 is the same.

[0112] The extending direction of the first micro-hole 1213 may be parallel to the thickness direction of the first substrate 121, or may form an angle with the thickness direction of the first substrate 121, and the range of the angle is 80 degrees - 90 degrees. The cross-section of the first micro-hole 1213 may be circular, and the longitudinal section may be rectangular. The extending direction of the second micro-hole 1223 may be parallel to the thickness direction of the second substrate 122, or may form an angle with the thickness direction of the second substrate 122, and the range of the angle is 80 degrees - 90 degrees. The cross-section of the second micro-hole 1223 may be circular, and the longitudinal section may be rectangular, etc. The longitudinal section shapes and extending directions of the first micro-hole 1213 and the second micro-hole 1223 may be designed as needed. In this embodiment, both the first micro-hole 1213 and the second micro-hole 1223 are straight through-holes parallel to the thickness direction of the first substrate 121 or the second substrate 122; that is, the central axis of the first micro-hole 1213 is perpendicular to the first surface 1211, and the central axis of the second micro-hole 1223 is perpendicular to the third surface 1221.

[0113] In this embodiment, the area where the first micro-holes 1213 are provided on the first substrate 121 completely covers the area where the second micro-holes 1223 are provided on the second substrate 122, so as to ensure that the liquid supply speed can meet the atomization speed of the heating element 124 provided on the atomization surface of the second substrate 122, and achieve a better atomization effect.

[0114] The pore diameter of the first micropores 1213 on the first substrate 121 is 1 μm - 100 μm. When the pore diameter of the first micropores 1213 is less than 1 μm, the liquid supply requirement cannot be met, resulting in a decrease in the amount of aerosol; when the pore diameter of the first micropores 1213 is greater than 100 μm, the aerosol-forming matrix easily flows out of the first micropores 1213, causing liquid leakage and a decrease in atomization efficiency. It can be understood that the pore diameter of the first substrate 121 is selected according to actual needs.

[0115] The pore diameter of the second micropores 1223 on the second substrate 122 is 1 μm - 100 μm. When the pore diameter of the second micropores 1223 is less than 1 μm, the liquid supply requirement cannot be met, resulting in a decrease in the amount of aerosol; when the pore diameter of the second micropores 1223 is greater than 100 μm, the aerosol-forming matrix easily flows out of the second micropores 1223, causing liquid leakage and a decrease in atomization efficiency. Optionally, the pore diameter of the second micropores 1223 is 20 μm - 50 μm. It can be understood that the pore diameter of the second substrate 122 is selected according to actual needs.

[0116] Optionally, the pore diameter of the first micropores 1213 is greater than the pore diameter of the second micropores 1223 (as Figure 3a shown), so that the capillary force of the second micropores 1223 is greater than the capillary force of the first micropores 1213, and the aerosol-forming matrix can flow from the gap 123 to the atomization surface of the second substrate 122. Since the first micropores 1213 also have capillary force, when the suction port 15 is used downward, liquid backflow can be prevented and insufficient liquid supply can be avoided.

[0117] The thickness of the second substrate 122 is 0.1 mm - 1 mm. When the thickness of the second substrate 122 is greater than 1 mm, the liquid supply requirement cannot be met, resulting in a decrease in the amount of aerosol, and there is a lot of heat loss, and the cost of setting the second micropores 1223 is high; when the thickness of the second substrate 122 is less than 0.1 mm, the strength of the second substrate 122 cannot be guaranteed, which is not conducive to improving the performance of the electronic atomization device. Optionally, the thickness of the second substrate 122 is 0.2 mm - 0.5 mm. It can be understood that the thickness of the second substrate 122 is selected according to actual needs.

[0118] The thickness of the first substrate 121 is 0.1 mm - 1 mm. Optionally, the thickness of the first substrate 121 is less than the thickness of the second substrate 122, where the thickness of the first substrate 121 is the distance between the first surface 1211 and the second surface 1212, and the thickness of the second substrate 122 is the distance between the third surface 1221 and the fourth surface 1222.

[0119] The ratio of the thickness of the second substrate 122 to the pore diameter of the second micropores 1223 is 20:1 - 3:1 to improve the liquid supply capacity. When the ratio of the thickness of the second substrate 122 to the pore diameter of the second micropores 1223 is greater than 20:1, the aerosol - generating matrix supplied by the capillary action through the second micropores 1223 is difficult to meet the atomization demand of the heating element 124, which not only easily leads to dry burning, but also reduces the amount of aerosol generated by a single atomization; when the ratio of the thickness of the second substrate 122 to the pore diameter of the second micropores 1223 is less than 3:1, the aerosol - generating matrix easily flows out of the second micropores 1223, causing waste and reducing the atomization efficiency, and further reducing the total amount of aerosol. Optionally, the ratio of the thickness of the second substrate 122 to the pore diameter of the second micropores 1223 is 15:1 - 5:1.

[0120] The ratio of the center - to - center distance between two adjacent second micropores 1223 to the pore diameter of the second micropores 1223 is 3:1 - 1.5:1, so as to improve the strength of the second substrate 122 as much as possible on the premise of meeting the liquid supply capacity of the second micropores 1223 on the second substrate 122; optionally, the ratio of the center - to - center distance between two adjacent second micropores 1223 to the pore diameter of the second micropores 1223 is 3:1 - 2:1; further optionally, the ratio of the center - to - center distance between two adjacent second micropores 1223 to the pore diameter of the second micropores 1223 is 3:1 - 2.5:1.

[0121] In this embodiment, the heating assembly 12 further includes a spacer 125. The spacer 125 is disposed between the second surface 1212 of the first substrate 121 and the third surface 1221 of the second substrate 122, and is located at the edge of the first substrate 121 and / or the second substrate 122, so that the first substrate 121 and the second substrate 122 are spaced apart to form a gap 123.

[0122] In one embodiment, along the direction parallel to the first substrate 121, the height of the gap 123 is the same; that is, the second surface 1212 and the third surface 1221 are parallel. For example, two spacers 125 with the same height are disposed between the second surface 1212 and the third surface 1221, and the two spacers 125 with the same height are located at the edges of the opposite ends of the first substrate 121 and the second substrate 122 (as Figure 3a shown); or an annular spacer 125 with the same height is disposed between the second surface 1212 and the third surface 1221, such as a rubber frame.

[0123] Please refer to Figure 3d , Figure 3d which Figure 3a is a schematic structural diagram of another embodiment of the spacer in the heating assembly provided.

[0124] In another embodiment, along a direction parallel to the first substrate 121, the height of the gap 123 gradually increases; for example, the height of the gap 123 gradually increases along the length direction, width direction or diagonal direction of the first substrate 121. That is to say, the second surface 1212 and the third surface 1221 are not parallel. Optionally, the height of the gap 123 gradually increases from zero. For example, only one spacer 125 is provided between the second surface 1212 and the third surface 1221, and the spacer 125 is located at the edge of one end of the first substrate 121 and the second substrate 122 (as Figure 3d shown), while the edges of the other end of the first substrate 121 and the second substrate 122 are in contact. For another example, two spacers 125 with different heights are located at the edges of the opposite ends of the first substrate 121 and the second substrate 122. By setting the gaps 123 with uneven heights, the liquid between the gaps 123 is easy to flow laterally between the gaps 123, which can prevent the bubbles in the gaps 123 from blocking the ports of the first micropores 1213 or the second micropores 1223, better discharge the bubbles, and reduce the influence of the bubbles on the liquid supply speed.

[0125] Next, the structure of the spacer 125 in the solution where the height of the gap 123 is the same along the direction parallel to the first substrate 121 will be specifically introduced.

[0126] Specifically, when the projection of the first substrate 121 on the second substrate 122 completely coincides with the second substrate 122, that is, when the structures and sizes of the first substrate 121 and the second substrate 122 are exactly the same, the spacer 125 is located at the edges of the first substrate 121 and the second substrate 122 (as Figure 3a shown). When the projection of the first substrate 121 on the second substrate 122 completely covers the second substrate 122, that is, when the size of the first substrate 121 is larger than that of the second substrate 122, the spacer 125 is located at the edge of the second substrate 122 and at a position close to one side of the first substrate 121. When the projection of the second substrate 122 on the first substrate 121 completely covers the first substrate 121, that is, when the size of the second substrate 122 is larger than that of the first substrate 121, the spacer 125 is located at the edge of the first substrate 121 and at a position close to one side of the second substrate 122. That is to say, the setting position of the spacer 125 can be determined according to the specific sizes of the first substrate 121 and the second substrate 122, as long as the first substrate 121, the second substrate 122 and the spacer 125 can enclose to form the gap 123.

[0127] Among them, the spacer 125 can be arranged circumferentially along the first substrate 121 and the second substrate 122, that is, the spacer 125 is in a ring structure to prevent the aerosol-forming matrix in the gap 123 from leaking out. The spacer 125 can also be multiple and arranged at intervals circumferentially along the first substrate 121 and the second substrate 122, and the circumferences of the first substrate 121 and the second substrate 122 are sealed by the seal 126.

[0128] In one embodiment, the spacer 125 is a gasket provided independently, and the gasket is detachably connected to the first substrate 121 and the second substrate 122, and the gasket is in a ring structure. The specific operation is as follows: a first micro-hole 1213 is formed on the first substrate 121, a second micro-hole 1223 is formed on the second substrate 122, and then the gasket is arranged between the first substrate 121 and the second substrate 122. Specifically, the gasket is arranged between the blank area 1215 of the first substrate 121 and the blank area 1225 of the second substrate 122. For example, the spacer 125 can be a silica gel frame or a plastic frame.

[0129] In another embodiment, the spacer 125 is a support column or a support frame fixed on the second surface 1212 of the first substrate 121 and / or the third surface 1221 of the second substrate 122, and the support column or the support frame is fixed on the second surface 1212 of the first substrate 121 and / or the third surface 1221 of the second substrate 122 by clamping or welding. The specific operation is as follows: a first micro-hole 1213 is formed on the first substrate 121, a second micro-hole 1223 is formed on the second substrate 122, and then, by means of welding or clamping, the support column or the support frame is integrated with the first substrate 121 and the second substrate 122. For example, the first substrate 121 and the second substrate 122 are glass plates. Glass powder is coated on the edge of the first substrate 121, and then after covering the second substrate 122, the glass powder is sintered into glass by laser to fix the support column or the support frame to the first substrate 121 and the second substrate 122.

[0130] In yet another embodiment, the spacer 125 is a protrusion integrally formed with the first substrate 121 and / or the second substrate 122. If the spacer 125 is a protrusion integrally formed with the first substrate 121, a first micropore 1213 is formed on the first substrate 121, and a second micropore 1223 is formed on the second substrate 122. Then, the second substrate 122 is lapped on the protrusion to form a gap 123. If the spacer 125 is a protrusion integrally formed with the second substrate 122, a first micropore 1213 is formed on the first substrate 121, and a second micropore 1223 is formed on the second substrate 122. Then, the first substrate 121 is lapped on the protrusion to form a gap 123. For example, a groove is etched on the second surface 1212 of the first substrate 121, and the side wall of the groove serves as the spacer 125, and the first micropore 1213 is formed on the bottom wall of the groove; the third surface 1221 of the second substrate 122 is a plane, and the third surface 1221 of the second substrate 122 is lapped on the end face of the side wall of the groove on the second surface 1212, that is, the third surface 1221 of the second substrate 122 is in contact with the second surface 1212 of the first substrate 121, and the third surface 1221 and the groove cooperate to form a gap 123. If the bottom surface of the groove is interpreted as the second surface 1212, the side wall of the groove can be interpreted as a protrusion of the second surface 1212.

[0131] The heating assembly 12 further includes a seal 126, and the seal 126 has a lower liquid hole 1261. The lower liquid hole 1261 is in fluid communication with the liquid storage cavity 13 through a fluid channel 114. The first substrate 121 and / or the second substrate 122 is embedded in the lower liquid hole 1261. That is, the seal 126 is used to seal the periphery of the first substrate 121 and / or the second substrate 122 to prevent liquid leakage. Optionally, the first substrate 121 and the second substrate 122 are disposed in the lower liquid hole 1261. When the seal 126 covers the periphery of the second substrate 122, the seal 126 does not block the heating element 124, and the lower liquid hole 1261 can completely expose the heating element 124. In this embodiment, the hole wall of the lower liquid hole 1261 has an annular mounting groove (not shown), and the edge of the first substrate 121 and / or the second substrate 122 is embedded in the annular mounting groove.

[0132] Please refer to Figure 4 , Figure 4 which is a schematic structural diagram of the second embodiment of the heating assembly provided by the present application.

[0133] In the second embodiment of the heating component 12, compared with the first embodiment of the heating component 12, the difference lies in that: in the first embodiment of the heating component 12, the spacer 125 is used to maintain the gap 123 between the first substrate 121 and the second substrate 122, while in the second embodiment of the heating component 12, the seal 126 is used to maintain the gap 123 between the first substrate 121 and the second substrate 122, and there is no need to specially provide a separate spacer 125. In the second embodiment of the heating component 12, except that the way of maintaining the gap 123 is different from that in the first embodiment of the heating component 12, the setting methods of other structures are the same as those in the first embodiment of the heating component 12, and will not be elaborated here.

[0134] In the second embodiment of the heating component 12, a fixing structure 1261a is provided on the pore wall of the lower liquid hole 1261 of the seal 126 to fix the first substrate 121 and / or the second substrate 122, and to space the first substrate 121 and the second substrate 122 to form a gap 123. The specific setting method of the fixing structure 1261a is as follows.

[0135] In one embodiment, a first installation groove 1261b and a second installation groove 1261c are spaced on the pore wall of the lower liquid hole 1261. Both the first installation groove 1261b and the second installation groove 1261c are annular grooves, and the first installation groove 1261b and the second installation groove 1261c serve as the fixing structure 1261a. The first installation groove 1261b and the second installation groove 1261c have a common side wall. The periphery of the first substrate 121 is embedded in the first installation groove 1261b, and the periphery of the second substrate 122 is embedded in the second installation groove 1261c. The common side wall of the first installation groove 1261b and the second installation groove 1261c keeps the first substrate 121 and the second substrate 122 spaced apart and forms a gap 123 therebetween (as Figure 4 shown).

[0136] Please refer to Figure 5a and Figure 5b ., Figure 5a which is a schematic structural diagram of another embodiment of the seal in the second embodiment of the heating component provided by the present application, Figure 5b is Figure 5a a schematic assembly structure diagram of the seal provided by, the first dense matrix, and the second substrate.

[0137] In one embodiment, the lower liquid hole 1261 includes a first sub-lower liquid hole 1261d and a second sub-lower liquid hole 1261e that communicate with each other. The aperture of the first sub-lower liquid hole 1261d is larger than that of the second sub-lower liquid hole 1261e, so that a step structure A is formed between the first sub-lower liquid hole 1261d and the second sub-lower liquid hole 1261e. An annular protrusion B is provided on the pore wall of the second sub-lower liquid hole 1261e. The step structure A and the annular protrusion B serve as the fixing structure 1261a. The periphery of the first substrate 121 overlaps on the step surface of the step structure, that is, the periphery of the first substrate 121 overlaps on the connection surface between the first sub-lower liquid hole 1261d and the second sub-lower liquid hole 1261e; the periphery of the second substrate 122 overlaps on the annular protrusion B, and a gap 123 is formed between the first substrate 121 and the second substrate 122. It can be understood that the second substrate 122 can also be fixed by an interference fit with the second sub-lower liquid hole 1261e to form the gap 123.

[0138] Please refer to Figure 6a and Figure 6b , Figure 6a which is a schematic structural diagram of another embodiment of the seal in the second embodiment of the heating component provided by the present application, Figure 6b and Figure 6a is a schematic assembly structure diagram of the seal provided by

[0139] In one embodiment, a protrusion 1261f is provided on the pore wall of the lower liquid hole 1261 of the seal 126, forming a first step structure C and a second step structure D. The protrusion 1261f and the seal 126 are of an integrally formed structure. The first step structure C and the second step structure D serve as the fixing structure 1261a. The first substrate 121 is disposed on the step surface of the first step structure C, and the second substrate 122 is disposed on the step surface of the second step structure D, and a gap 123 is formed between the first substrate 121 and the second substrate 122.

[0140] Please refer to Figure 7a and Figure 7b , Figure 7a which is a schematic structural diagram of the third embodiment of the heating component provided by the present application, Figure 7b and Figure 7a is a partial structural diagram of the second substrate of the heating component provided by

[0141] Compared with the first embodiment of the heating component 12, the third embodiment of the heating component 12 is different in that the first substrate 121 and / or the second substrate 122 form the flow channel in a different way. Except for this, the setting methods of other structures are the same as those of the first embodiment of the heating component 12 and will not be repeated.

[0142] Different from the first embodiment of the heating component 12 where the flow channel is formed by the gap 123, in the third embodiment of the heating component 12, a plurality of first grooves 1221a extending in the first direction and a plurality of second grooves 1221b extending in the second direction are provided on the third surface 1221. The first grooves 1221a and the second grooves 1221b are arranged in a crosswise manner, and the plurality of first grooves 1221a and the plurality of second grooves 1221b form the above-mentioned flow channel. In this embodiment, the first direction is perpendicular to the second direction.

[0143] It can be understood that in other embodiments, only a plurality of first grooves 1221a extending in the first direction or only a plurality of second grooves 1221b extending in the second direction may be provided, that is, the adjacent second micropores 1223 are connected only in one direction. The first grooves 1221a and / or the second grooves 1221b have a capillary action, which can laterally guide the aerosol generation matrix, enabling the aerosol generation matrix to uniformly enter the plurality of second micropores 1223, thereby playing a role in lateral liquid replenishment. Lateral refers to a direction not parallel to the extension direction of the second micropores 1223, for example, a direction perpendicular to the central axis of the second micropores 1223.

[0144] Furthermore, by providing the first grooves 1221a and the second grooves 1221b intersecting with each other on the third surface 1221, whether the first substrate 121 is in contact with the second substrate 122 or the first substrate 121 and the second substrate 122 are arranged at intervals, it can be ensured that the first substrate 121 does not cover the second micropores 1223 on the second substrate 122, ensuring that the aerosol generation matrix can flow to the atomization surface and avoiding dry burning. And the first grooves 1221a and the second grooves 1221b can also achieve lateral liquid replenishment of the aerosol generation matrix, further avoiding dry burning.

[0145] The plurality of second micropores 1223 are arranged in an array. Each first groove 1221a corresponds to one row or multiple rows of second micropores 1223, and each second groove 1221b corresponds to one column or multiple columns of second micropores 1223, which are specifically designed according to needs. In this embodiment, each first groove 1221a corresponds to one row of second micropores 1223, and each second groove 1221b corresponds to one column of second micropores 1223 (as Figure 7b shown).

[0146] The ratio of the depth to the width of the first groove 1221a is 0 - 20; when the ratio of the depth to the width of the first groove 1221a is greater than 20, the capillary force of the first groove 1221a cannot achieve a good lateral liquid replenishment effect. In a specific embodiment, the ratio of the depth to the width of the first groove 1221a is 1 - 5.

[0147] The ratio of the depth to the width of the second groove 1221b is 0 - 20; when the ratio of the depth to the width of the second groove 1221b is greater than 20, the capillary force of the second groove 1221b cannot achieve a good lateral liquid replenishment effect. In a specific embodiment, the ratio of the depth to the width of the second groove 1221b is 1 - 5.

[0148] Please refer to Figure 7c , Figure 7c which Figure 7a is a partial structural schematic diagram of the first substrate of the heating component provided as viewed from one side of the second surface.

[0149] Furthermore, a plurality of third grooves 1212a extending in the third direction and a plurality of fourth grooves 1212b extending in the fourth direction are provided on the second surface 1212, and the third grooves 1212a and the fourth grooves 1212b are arranged in a cross pattern; the plurality of first grooves 1221a, the plurality of second grooves 1221b, the plurality of third grooves 1212a, and the plurality of fourth grooves 1212b together form the above-mentioned flow channels. In this embodiment, the third direction is perpendicular to the fourth direction; the third direction is the same as the first direction, and the fourth direction is the same as the second direction.

[0150] It can be understood that in other embodiments, only a plurality of third grooves 1212a extending in the third direction or only a plurality of fourth grooves 1212b extending in the fourth direction may be provided, that is, only adjacent first micropores 1213 are connected in one direction. The third grooves 1212a and / or the fourth grooves 1212b have capillary action and can laterally guide the aerosol generation matrix, so that the aerosol generation matrix uniformly enters the plurality of second micropores 1223, thereby playing a role in lateral liquid replenishment.

[0151] The plurality of first micropores 1213 are arranged in an array, each third groove 1212a corresponds to one or more rows of first micropores 1213, and each fourth groove 1212b corresponds to one or more columns of first micropores 1213, which are specifically designed according to needs. In this embodiment, each third groove 1212a corresponds to one row of first micropores 1213, and each fourth groove 1212b corresponds to one column of first micropores 1213 (as Figure 7c shown).

[0152] The ratio of the depth to the width of the third groove 1212a is 0 - 20; when the ratio of the depth to the width of the third groove 1212a is greater than 20, the capillary force of the third groove 1212a cannot achieve a good lateral liquid replenishment effect. In a specific embodiment, the ratio of the depth to the width of the third groove 1212a is 0 - 5.

[0153] The ratio of the depth to the width of the fourth groove 1212b is 0-20; when the ratio of the depth to the width of the fourth groove 1212b is greater than 20, the capillary force of the fourth groove 1212b cannot achieve a good lateral liquid replenishment effect. In a specific embodiment, the ratio of the depth to the width of the fourth groove 1212b is 0-5.

[0154] The capillary forces of the first groove 1221a and the second groove 1221b on the third surface 1221 are greater than the capillary forces of the third groove 1212a and the fourth groove 1212b on the second surface 1212.

[0155] It can be understood that the third groove 1212a and the fourth groove 1212b on the second surface 1212 are optional structures and are designed according to needs.

[0156] In an embodiment, a gap 123 is formed by being spaced between the second surface 1212 and the third surface 1221 (as Figure 7a shown), specifically, the gap 123 can be formed by a spacer 125 (see the first embodiment of the heating component 12), or the gap 123 can be formed by a seal 126 (see the second embodiment of the heating component 12), which will not be elaborated. That is to say, the flow channels are formed jointly by the gap 123, the plurality of first grooves 1221a and the plurality of second grooves 1221b; or the flow channels are formed jointly by the gap 123, the plurality of first grooves 1221a, the plurality of second grooves 1221b, the plurality of third grooves 1212a and the plurality of fourth grooves 1212b. Wherein, the height of the gap 123 is the distance between the second surface 1212 and the third surface 1221.

[0157] At this time, the third groove 1212a and the fourth groove 1212b on the second surface 1212 are optional structures; when there are a plurality of intersecting third grooves 1212a and fourth grooves 1212b on the second surface 1212, the liquid storage capacity of the gap 123 can be increased. The main function of the first substrate 121 is to feed liquid and block bubbles. Wherein, along the direction parallel to the first substrate 121, the height of the gap 123 can be the same or gradually increase; when the height of the gap 123 gradually increases along the direction parallel to the first substrate 121, along the direction in which the height of the gap 123 gradually decreases, the capillary force of the gap 123 gradually increases, which is beneficial to the flow of the aerosol-forming matrix in the gap 123 and prevents bubbles from staying in the gap 123. That is to say, the uneven gap 123 can be more beneficial to the lateral flow of the aerosol-forming matrix in the gap 123, so as to better replenish liquid laterally and discharge bubbles.

[0158] Due to the capillary action of the first groove 1221a and the second groove 1221b, it can supply liquid laterally. The combined gap 123 can ensure gas-liquid separation and reduce the influence of bubbles on liquid supply. Moreover, by providing a plurality of intersecting first grooves 1221a and second grooves 1221b on the third surface 1221, it is beneficial to guide the aerosol generation matrix in the gap 123 to the second micropore 1223, which helps with liquid supply. Specifically, during the suction process, gas will enter the first groove 1221a and the second groove 1221b through the second micropore 1223. Due to reasons such as surface tension, bubbles are more inclined to enter the gap 123, thereby ensuring the smoothness of the first groove 1221a and the second groove 1221b, and further ensuring liquid supply. At the same time, through the gap 123, large bubbles can be prevented from reaching the liquid suction surface and then entering the liquid storage cavity 13. The liquid storage function of the gap 123 can ensure that at least two backdraws will not cause burnout.

[0159] Please refer to Figure 8 , Figure 8 which is another schematic structural diagram of the third embodiment of the heating component provided by the present application.

[0160] In another embodiment, the second surface 1212 is in contact with the third surface 1221 (as Figure 8 shown). That is to say, a flow channel is jointly formed by a plurality of first grooves 1221a, a plurality of second grooves 1221b, a plurality of third grooves 1212a and a plurality of fourth grooves 1212b. Among them, the depths of the first groove 1221a and the second groove 1221b are both greater than the depths of the third groove 1212a and the fourth groove 1212b; optionally, the ratio of the depth to the width of the first groove 1221a is 2-5, and the ratio of the depth to the width of the second groove 1221b is 2-5. It can be understood that the depths of the first groove 1221a and the second groove 1221b are both greater than the depths of the third groove 1212a and the fourth groove 1212b, and the capillary action of the first groove 1221a and the capillary action of the second groove 1221b are both greater than the capillary action of the third groove 1212a and the capillary action of the fourth groove 1212b. Among them, the depths of the first groove 1221a and the second groove 1221b cannot be too large, otherwise, a "stratification" phenomenon will occur during lateral liquid supply. The liquid flow velocity near the bottom of the groove is fast, and the liquid flow velocity gradually slows down along the direction away from the bottom of the groove, there is a risk of blocking bubbles, and even bubbles may be stuck in the first groove 1221a.

[0161] By providing a plurality of intersecting third grooves 1212a and fourth grooves 1212b on the second surface 1212, the liquid storage capacity between the first substrate 121 and the second substrate 122 can be increased, and it can also prevent the first substrate 121 from blocking the second micropore 1223 when the first substrate 121 is in contact with the second substrate 122.

[0162] In other embodiments, the first micropore 1213 and the second micropore 1223 can be connected by aligning the central axes of the first micropore 1213 and the second micropore 1223 or by at least partially overlapping the ports of the first micropore 1213 and the second micropore 1223, so as to prevent the first substrate 121 from blocking the second micropore 1223 when the first substrate 121 contacts the second substrate 122; at this time, it is not necessary to provide a plurality of intersecting third grooves 1212a and fourth grooves 1212b on the second surface 1212.

[0163] Please refer to Figure 9a 、 Figure 9b 、 Figure 9c 、 Figure 9d 、 Figure 9e , Figure 9a is a top view structural schematic diagram of the fourth embodiment of the heating component provided by the present application, Figure 9b is Figure 9a a cross-sectional schematic diagram of the heating component provided along the B-B direction, Figure 9c is Figure 9a a cross-sectional schematic diagram of the heating component provided along the C-C direction, Figure 9d is a structural schematic diagram of another embodiment of the liquid inlet in the fourth embodiment of the heating component provided by the present application, Figure 9e is a structural schematic diagram of yet another embodiment of the liquid inlet in the fourth embodiment of the heating component provided by the present application.

[0164] Compared with the first embodiment of the heating component 12, the fourth embodiment of the heating component 12 is different in that: in the fourth embodiment of the heating component 12, a liquid inlet 1217 is provided on one side of the edge of the first substrate 121, and the setting manners of other structures except this are the same as those in the first embodiment of the heating component 12, and will not be described in detail.

[0165] In the fourth embodiment of the heating component 12, at least a part of the edge of the first substrate 121 is spaced from the pore wall of the lower liquid hole 1261 of the seal 126 to form the liquid inlet 1217; or, a notch 1216a or a through hole 1216b is provided on the edge of the first substrate 121 to form the liquid inlet 1217. The second substrate 122 straddles the entire lower liquid hole 1261.

[0166] Optionally, two symmetrically arranged liquid inlets 1217 are formed by spacing the opposite long sides of the first substrate 121 from the pore wall of the lower liquid hole 1261 respectively (as Figure 9a shown).

[0167] Optionally, a notch 1216a is provided at the edge of the first substrate 121, and the notch 1216a cooperates with the pore wall of the lower liquid hole 1261 to form a liquid inlet 1217; the opening size and the number of the notches 1216a are designed according to requirements (such as Figure 9d shown).

[0168] Optionally, a through hole 1216b is provided at the edge of the first substrate 121 to form a liquid inlet 1217; the size, shape and number of the through holes 1216b are designed according to requirements (such as Figure 9e shown).

[0169] The projection of the first substrate 121 on the atomization surface completely covers the heating element 124, and the liquid inlet 1217 is arranged offset from the heating element 124. The cross-sectional dimension of the liquid inlet 1217 is larger than the pore diameter of the first micropore 1213, that is, the liquid flowing speed of the aerosol-forming substrate from the liquid inlet 1217 is greater than the liquid flowing speed from the first micropore 1213. By providing the liquid inlet 1217 on the first substrate 121, not only can the gap 123 be replenished with liquid through the liquid inlet 1217, but also air bubbles can be discharged through the liquid inlet 1217, avoiding the influence of air bubbles entering the liquid storage cavity 13 on liquid supply, and further avoiding the dry burning phenomenon.

[0170] It can be understood that in the fourth embodiment of the heating assembly 12, a fixing structure 1261a can also be provided on the pore wall of the lower liquid hole 1261 of the seal 126 to fix the first substrate 121 and / or the second substrate 122, and the first substrate 121 and the second substrate 122 are arranged at intervals to form a gap 123. Refer to the second embodiment of the heating assembly 12 for details and will not be elaborated here. The liquid inlet 1217 provided in the fourth embodiment of the heating assembly 12 can also be applied to other embodiments of the heating assembly 12 and is designed according to specific requirements.

[0171] Please refer to Figure 10a 、 Figure 10b 、 Figure 10c , Figure 10a which is a top view structural schematic diagram of the fifth embodiment of the heating assembly provided by the present application, Figure 10b which is a structural schematic diagram of another embodiment of the liquid inlet in the fifth embodiment of the heating assembly provided by the present application, Figure 10c which is a structural schematic diagram of yet another embodiment of the liquid inlet in the fifth embodiment of the heating assembly provided by the present application.

[0172] Compared with the first embodiment of the heating assembly 12, the fifth embodiment of the heating assembly 12 is different in that: in the fifth embodiment of the heating assembly 12, a liquid inlet 1217 is provided on one side of the edge of the first substrate 121, and the first micropore 1213 is not provided on the first substrate 121. The setting manners of other structures are the same as those in the first embodiment of the heating assembly 12 and will not be elaborated here.

[0173] In the fifth embodiment of the heating component 12, the first micropores 1213 are not provided on the first substrate 121. At least a part of the edge of the first substrate 121 is spaced from the pore wall of the lower liquid hole 1261 of the seal 126 to form a liquid inlet 1217; alternatively, a notch 1216a or a through hole 1216b is provided on the edge of the first substrate 121 to form a liquid inlet 1217. The second substrate 122 spans the entire lower liquid hole 1261.

[0174] Optionally, two opposite long sides of the first substrate 121 are respectively spaced from the pore wall of the lower liquid hole 1261 to form two symmetrically arranged liquid inlets 1217 (as Figure 10a shown).

[0175] Optionally, a notch 1216a is provided on the edge of the first substrate 121, and the notch 1216a cooperates with the pore wall of the lower liquid hole 1261 to form a liquid inlet 1217; the opening size and the number of the notch 1216a are designed according to needs (as Figure 10b shown).

[0176] Optionally, a through hole 1216b is provided on the edge of the first substrate 121 to form a liquid inlet 1217; the size, shape and number of the through hole 1216b are designed according to needs (as Figure 10c shown).

[0177] The projection of the first substrate 121 on the atomization surface completely covers the heating element 124, and the liquid inlet 1217 is arranged in a dislocation manner with respect to the heating element 124. By providing the liquid inlet 1217 on the first substrate 121, not only can the gap 123 be replenished with liquid through the liquid inlet 1217, but also air bubbles can be excluded through the liquid inlet 1217, avoiding the influence of air bubbles on liquid supply in the liquid storage cavity 13, and further avoiding the dry burning phenomenon.

[0178] Please refer to Figure 10d , Figure 10d which is a schematic structural diagram of the sixth embodiment of the heating component provided by the present application.

[0179] Compared with the first embodiment of the heating component 12, the difference in the sixth embodiment of the heating component 12 is that: the heating component 12 further includes a plurality of micro-columns 127, and the plurality of micro-columns 127 are arranged in the gap 123. Except that a plurality of micro-columns 127 are further arranged in the gap 123 in the sixth embodiment of the heating component 12, the setting manners of other structures are the same as those in the first embodiment of the heating component 12, and will not be described in detail.

[0180] Specifically, one end of the micro-column 127 abuts against the second surface 1212 of the first substrate 121, and the other end of the micro-column 127 is spaced from the third surface 1221 of the second substrate 122 (the first mode); alternatively, one end of the micro-column 127 abuts against the third surface 1221 of the second substrate 122, and the other end of the micro-column 127 is spaced from the second surface 1212 of the first substrate 121 (the second mode); alternatively, one end of the micro-column 127 abuts against the second surface 1212 of the first substrate 121, and the other end of the micro-column 127 abuts against the third surface 1221 of the second substrate 122 (the third mode).

[0181] Multiple micro-columns 127 can all be in the first mode; multiple micro-columns 127 can also all be in the second mode; multiple micro-columns 127 can also all be in the third mode; multiple micro-columns 127 can be partially in the first mode, partially in the second mode, and partially in the third mode.

[0182] The micro-column 127 can be waste generated during the processing of the first substrate 121 and the second substrate 122. For example, when the materials of the first substrate 121 and the second substrate 122 are glass or silicon, the micro-column 127 can be micro-protrusions generated during the drilling of the first substrate 121 and the second substrate 122; when the materials of the first substrate 121 and the second substrate 122 are dense ceramics, the micro-column 127 can be slag residues remaining after the drilling of the first substrate 121 and the second substrate 122.

[0183] By arranging the micro-columns 127 in the gap 123, after the aerosol generating matrix enters the first micro-pore 1213, it can climb along the micro-columns 127 into the gap 123, so as to well fill the gap 123 with the aerosol generating matrix; a similar liquid bridge effect can be generated between the micro-columns 127 to achieve the function of lateral liquid replenishment, and the adhesion force between the aerosol generating matrix and the micro-columns 127 can increase the flow resistance and effectively prevent backflow.

[0184] It can be understood that the structure of arranging multiple micro-columns 127 in the gap 123 in the sixth embodiment of the heating component 12 can also be applied to other embodiments of the heating component 12, and is specifically designed according to needs.

[0185] Please refer to Figure 11 , Figure 11 which is a schematic structural diagram of the seventh embodiment of the heating component provided by the present application.

[0186] Compared with the first embodiment of the heating component 12, the seventh embodiment of the heating component 12 is different in that: in the seventh embodiment of the heating component 12, along the thickness direction of the first substrate 121, the aperture of the first micropore 1213 gradually increases, the contraction opening of the first micropore 1213 is located on the first surface 1211, and the expansion opening of the first micropore 1213 is located on the second surface 1212. In the seventh embodiment of the heating component 12, except that the longitudinal cross-sectional shape of the first micropore 1213 is different from that of the first embodiment of the heating component 12, the setting methods of other structures are the same as those of the first embodiment of the heating component 12 and will not be elaborated herein.

[0187] By arranging the contraction opening of the first micropore 1213 on the first surface 1211, the contraction opening is communicated with the liquid storage cavity 13, and the expansion opening is communicated with the gap 123, which can ensure the stable downward flow of the first micropore 1213 on the first substrate 121 and can fully fill the gap 123; at the same time, this setting method of the first micropore 1213 can prevent the aerosol generation matrix from flowing back to the liquid storage cavity 13 from the gap 123 and ensure that gas will not enter the liquid storage cavity 13 after the suction is completed.

[0188] In one embodiment, along the thickness direction of the first substrate 121, the longitudinal cross-section of the first micropore 1213 is trapezoidal. The longitudinal cross-sections of the first micropore 1213 being rectangular and trapezoidal are compared below.

[0189] It can be understood that the setting method of the first micropore 1213 in the seventh embodiment of the heating component 12 can also be applied to other embodiments of the heating component 12, and specific designs can be made according to needs.

[0190] Please refer to Figures 12 - 14 , Figure 12 which is a schematic structural diagram of the first experimental piece, Figure 13 which is a schematic structural diagram of the second experimental piece, Figure 14 which is a schematic structural diagram of the third experimental piece.

[0191] The first experimental piece includes a liquid collecting cavity 30 and a pipeline 31, and the longitudinal cross-section of the pipeline 31 is rectangular.

[0192] The second experimental piece includes a liquid collecting cavity 30 and a pipeline 31, the longitudinal cross-section of the pipeline 31 is trapezoidal, and the expansion opening of the trapezoid is communicated with the liquid collecting cavity 30.

[0193] The third experimental piece includes a liquid collecting cavity 30 and a pipeline 31, the longitudinal cross-section of the pipeline 31 is trapezoidal, and the contraction opening of the trapezoid is communicated with the liquid collecting cavity 30.

[0194] By conducting experiments on the first experimental piece, the second experimental piece and the third experimental piece, it is found that under the action of surface tension, the liquid is blocked in the pipeline 31, and the liquid level bulges downward at the opening of the pipeline 31 (see Figures 12 - 14)。When the liquid levels in the liquid collection cavity 30 are at the same height, it is found that the liquid surface at the opening of the pipeline 31 in the third experimental piece bulges downward the most. Therefore, the first micropores 1213 can be arranged along the thickness direction of the first substrate 121, the pore diameter of the first micropores 1213 gradually increases, the contraction openings of the first micropores 1213 are located on the first surface 1211, and the expansion openings of the first micropores 1213 are located on the second surface 1212. Thus, the aerosol-forming matrix protruding from the first micropores 1213 can more easily contact the surface of the second substrate 122, and further the aerosol-forming matrix communicates with the second micropores 1223 of the second substrate 122, accelerating the liquid guiding speed.

[0195] The above are only the embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A heating component, characterized in that, Comprising: A first substrate having a first surface and a second surface disposed opposite to each other, wherein the first surface is a liquid absorption surface; The first substrate has a plurality of first micropores for guiding an aerosol generating matrix from the liquid absorption surface to the second surface; the thickness of the first substrate is 0.1 mm - 1 mm; A second substrate having a third surface and a fourth surface disposed opposite to each other, wherein the fourth surface is an atomization surface; the second surface is disposed opposite to the third surface; the second substrate is a dense substrate, and the second substrate is provided with a plurality of second micropores penetrating through the third surface and the fourth surface for guiding the aerosol generating matrix from the third surface to the atomization surface; the thickness of the second substrate is 0.1 mm - 1 mm; Wherein, one side of the edge of the first substrate has a liquid inlet, and the cross-sectional dimension of the liquid inlet is larger than the pore diameter of the first micropores; the first substrate and / or the second substrate form a flow channel, and the flow channel communicates the first micropores, the second micropores and the liquid inlet; A gap is formed by spacing the second surface and the third surface apart, and the gap serves as the flow channel; or, the third surface is provided with a first groove structure, and the first groove structure serves as the flow channel; or, the third surface is provided with a first groove structure, and the second surface is provided with a second groove structure, and the first groove structure and the second groove structure cooperate to serve as the flow channel.

2. The heating component according to claim 1, wherein The edge of the first substrate is provided with a through hole or a notch; the through hole or the notch serves as the liquid inlet.

3. The heating component according to claim 1, wherein The heating component further includes a seal having a liquid outlet hole; at least a part of the edge of the first substrate is spaced from the pore wall of the liquid outlet hole to form the liquid inlet, and the second substrate straddles the entire liquid outlet hole.

4. The heating component according to claim 1, characterized in that, The heating component further includes a spacer; the spacer is disposed between the second surface and the third surface and at the edge of the first substrate and / or the second substrate to space the first substrate and the second substrate apart to form the gap.

5. The heating component according to claim 4, wherein The spacer is an independently provided gasket; Or, the spacer is a support column or a support frame fixed to the second surface and / or the third surface; Or, the spacer is a protrusion integrally formed with the first substrate and / or the second substrate.

6. The heating component according to claim 1, wherein The heating component further includes a seal having a liquid outlet hole; a fixing structure is provided on the pore wall of the liquid outlet hole to fix the first substrate and / or the second substrate to space the first substrate and the second substrate apart to form the gap.

7. The heating component according to claim 1, wherein Along the direction parallel to the first substrate, the height of the gap is the same.

8. The heating component according to claim 1, wherein Along the direction parallel to the heating component of the first substrate, the height of the gap gradually increases.

9. The heating component according to claim 8, wherein The height of the gap gradually increases from zero.

10. The heating component according to claim 1, characterized in that, The heating component further includes a plurality of micro-columns, and the plurality of micro-columns are disposed in the gap.

11. The heating component according to claim 10, characterized in that, One end of the micro-column abuts against the second surface, and the other end of the micro-column is spaced from the third surface; Or, one end of the micro-column abuts against the third surface, and the other end of the micro-column is spaced from the second surface; Or, one end of the micro-column abuts against the second surface, and the other end of the micro-column abuts against the third surface.

12. The heating component according to claim 1, wherein The third surface is provided with the first groove structure, and the first groove structure includes a plurality of first grooves extending in a first direction and a plurality of second grooves extending in a second direction, and the first grooves and the second grooves are arranged in a crosswise manner.

13. The heating component according to claim 12, characterized in that, A plurality of the second micropores are arranged in an array, each of the first grooves corresponds to one row or multiple rows of the second micropores, and each of the second grooves corresponds to one column or multiple columns of the second micropores.

14. The heating component according to claim 12, wherein The ratio of the depth to the width of the first groove is 0-20, and the ratio of the depth to the width of the second groove is 0-20.

15. The heating component according to claim 12, wherein The second surface is provided with the second groove structure, and the second groove structure includes a plurality of third grooves extending in a third direction and a plurality of fourth grooves extending in a fourth direction, and the third grooves and the fourth grooves are arranged in a crosswise manner.

16. The heating component according to claim 15, wherein The first substrate is a dense substrate, and the first micropores penetrate through the first surface and the second surface; a plurality of the first micropores are arranged in an array, each of the third grooves corresponds to one row or multiple rows of the first micropores, and each of the fourth grooves corresponds to one column or multiple columns of the first micropores.

17. The heating component according to claim 15, wherein The ratio of the depth to the width of the third groove is 0-20, and the ratio of the depth to the width of the fourth groove is 0-20.

18. The heating component according to claim 15, wherein The capillary force of the first groove and the second groove is greater than the capillary force of the third groove and the fourth groove.

19. The heating component according to any one of claims 12-18, characterized in that, The second surface and the third surface are arranged at intervals to form a gap.

20. The heating component according to any one of claims 12-18, characterized in that, The second surface is in contact with the third surface.

21. The heating component according to any one of claims 15-18, characterized in that, The second surface is in contact with the third surface, and the depth of the first groove and the depth of the second groove are greater than the depth of the third groove and the depth of the fourth groove.

22. The heating component according to claim 1, wherein The central axis of the second micropore is perpendicular to the third surface.

23. The heating component according to claim 1, wherein, The pore diameter of the second micropore is 1 μm-100 μm.

24. The heating component according to claim 1, wherein The ratio of the thickness of the second substrate to the pore diameter of the second micropore is 20:1-3:

1.

25. The heating component according to claim 1, wherein, The ratio of the center-to-center distance of adjacent second micropores to the pore diameter of the second micropore is 3:1-5:

1.

26. The heating component according to claim 1, wherein The first substrate is a dense substrate, and the first micropores penetrate through the first surface and the second surface.

27. The heating component according to claim 26, wherein The capillary force of the second micropore is greater than the capillary force of the first micropore.

28. The heating component according to claim 26, wherein Along the thickness direction of the first substrate, the pore diameter of the first micropore gradually becomes larger; the constriction opening of the first micropore is located on the first surface, and the expansion opening of the first micropore is located on the second surface.

29. The heating component according to claim 26, wherein The projection of the area where the first micropores are provided on the first substrate on the second substrate completely covers the area where the second micropores are provided on the second substrate.

30. The heating component according to claim 26, wherein The pore diameter of the first micropore is 1 μm-100 μm.

31. The heating component according to claim 1, characterized in that, The thickness of the first substrate is less than the thickness of the second substrate.

32. The heating component according to claim 1, wherein The heating component further includes a heating element, and the heating element is an independent element arranged on the atomization surface; or, the second substrate has a conductive function.

33. The heating component according to claim 32, wherein, The projection of the first substrate on the atomization surface completely covers the heating element.

34. A heating component, characterized in that, Comprising: A first substrate having a first surface and a second surface arranged opposite to each other, and the first surface is a liquid absorption surface; The first substrate has a plurality of first micro-pores for guiding the aerosol-forming substrate from the liquid absorption surface to the second surface; the thickness of the first substrate is 0.1 mm to 1 mm; A second substrate having a third surface and a fourth surface disposed opposite to each other, the fourth surface being an atomization surface; the second surface is disposed opposite to the third surface; the second substrate has a plurality of second micro-pores for guiding the aerosol-forming substrate from the third surface to the atomization surface; the thickness of the second substrate is 0.1 mm to 1 mm; Wherein, one side of the edge of the first substrate has a liquid inlet, and the cross-sectional dimension of the liquid inlet is larger than the pore diameter of the first micro-pore; the first substrate and / or the second substrate form a flow channel, and the flow channel communicates the first micro-pore, the second micro-pore and the liquid inlet; A gap is formed between the second surface and the third surface at intervals, and the gap serves as the flow channel; or, a first groove structure is provided on the third surface, and the first groove structure serves as the flow channel; or, a first groove structure is provided on the third surface, and a second groove structure is provided on the second surface, and the first groove structure and the second groove structure cooperate to serve as the flow channel.

35. An atomizer, characterized in that, Comprising: A liquid storage cavity for storing the aerosol-forming substrate; A heating component, the heating component is in fluid communication with the liquid storage cavity, and the heating component is used for atomizing the aerosol-forming substrate; the heating component is the heating component according to any one of claims 1-34.

36. An electronic atomization device, characterized in that, Comprising: An atomizer, the atomizer is the atomizer according to claim 35; A main body for providing electric energy for the operation of the atomizer and controlling the heating component to atomize the aerosol-forming substrate.

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