Lens module and electronic device

Abstract

The application provides a lens module, comprising a circuit board, a lens assembly, a filter and a mounting frame, the lens assembly is arranged on one side of the circuit board, the mounting frame is arranged between the lens assembly and the circuit board; the mounting frame is provided with a through hole penetrating through the mounting frame, the inner side wall of the mounting frame extends towards the central axis of the through hole to form a flange, the filter is mounted on the flange; a first blocking layer is arranged at the edge of the surface of the filter away from the circuit board, a second blocking layer is arranged between the filter and the inner side wall of the mounting frame, and the surface of the second blocking layer away from the circuit board is higher than the first blocking layer. The first blocking layer and the second blocking layer in the lens module can more effectively shield some specific strong light, and the quality of the imaging of the photographed picture is improved. The application also provides an electronic device applying the lens module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic and optical devices, and in particular to a lens module and an electronic device. BACKGROUND

[0002] Electronic products (such as mobile phones or tablet computers) usually contain a camera. With the development of electronic products, people have higher requirements for the shooting quality and performance of the camera.

[0003] When the camera shoots a scene in strong light, some strong light at a specific angle may be reflected inside the lens barrel, and then reflected onto the photosensitive chip, forming obvious light spots or stains in the image, affecting the imaging quality. SUMMARY

[0004] Therefore, the present application provides a lens module capable of reducing light spots or stains in the image.

[0005] In addition, it is necessary to provide an electronic device with the lens module.

[0006] The present application provides a lens module, comprising a circuit board, the lens module further comprising a lens assembly, a filter and a mounting bracket, the lens assembly being arranged on the surface of the circuit board, the mounting bracket being arranged between the lens assembly and the circuit board;

[0007] The mounting bracket is provided with a through hole penetrating through the mounting bracket, the inner side wall of the mounting bracket forming the through hole extending towards the central axis of the through hole to form a flange, and the filter being mounted on the flange;

[0008] The filter is provided with a first blocking layer at the edge away from the surface of the circuit board, a gap is provided between the filter and the inner side wall of the mounting bracket, a second blocking layer is provided in the gap, and the second blocking layer is higher than the first blocking layer away from the surface of the circuit board.

[0009] In some embodiments, the second blocking layer also covers at least part of the first blocking layer;

[0010] In some embodiments, the flange comprises a support surface away from the circuit board, and the filter is arranged on the support surface;

[0011] The mounting bracket comprises a top surface away from the circuit board, the lens assembly is fixed to the top surface, the inner side wall is connected between the top surface and the support surface, and the distance between the support surface and the circuit board is less than the distance between the top surface and the circuit board;

[0012] The mounting frame is provided with a slot at the connection between the top surface and the inner side wall, and the slot communicates with the gap.

[0013] In some embodiments, the mounting frame comprises a bottom surface at the position where the slot is formed, the bottom surface being connected between the top surface and the inner side wall, and the bottom surface being arranged obliquely compared with the support surface.

[0014] In some embodiments, the mounting frame comprises a bottom surface and a side surface at the position where the slot is formed, the bottom surface being connected to the inner side wall, and the side surface being connected between the bottom surface and the top surface.

[0015] In some embodiments, the distance between the connection between the bottom surface and the inner side wall and the support surface is smaller than the distance between the surface of the filter away from the circuit board and the support surface.

[0016] In some embodiments, the distance between the top surface and the support surface is greater than the distance between the surface of the first barrier layer away from the circuit board and the support surface.

[0017] In some embodiments, the first barrier layer comprises a first edge facing the inner side wall and a second edge opposite to the first edge, and the first edge is flush with the edge of the filter.

[0018] In some embodiments, the support surface has an inner edge, and the orthographic projection of the inner edge on the first barrier layer is coincident with the second edge of the first barrier layer or located within the first barrier layer.

[0019] The application also provides an electronic device comprising the lens module.

[0020] In the application, the first barrier layer is arranged at the edge of the filter, which can block the strong light of a specific angle from being incident on the surface of the circuit board away from the filter and being reflected onto the photosensitive chip. Meanwhile, the second barrier layer is arranged between the filter and the mounting frame in the application, and the surface of the second barrier layer away from the circuit board is higher than that of the first barrier layer, which is beneficial to the first barrier layer and the second barrier layer to cover the edge (especially the corner position) of the filter, so as to block the strong light of a specific angle from being incident on the corner of the filter and being reflected onto the photosensitive chip, reduce the light spot or spot in the photographed image, improve the sharpness of the photographed image, and improve the imaging quality. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic diagram of a lens module provided by an embodiment of the application.

[0022] Figure 2 is Figure 1 is an exploded view of the lens module in an embodiment.

[0023] Figure 3 is Figure 1 is an exploded view of another perspective of the lens module in one embodiment.

[0024] Figure 4 is Figure 1 is a cross-sectional view along IV-IV of the lens module in one embodiment.

[0025] Figure 5 is Figure 1 is a cross-sectional view along IV-IV of the lens module in another embodiment.

[0026] Figure 6 is a perspective view of an electronic device of the lens module in one embodiment.

[0027] Main component symbol explanation

[0028] Lens module 100

[0029] Lens assembly 10

[0030] Lens holder 101

[0031] Aperture 1011

[0032] First lens barrel 102

[0033] Second lens barrel 103

[0034] Third lens barrel 104

[0035] Circuit board 20

[0036] First board portion 201

[0037] Second board portion 202

[0038] Third board portion 203

[0039] Base surface 21

[0040] Photosensitive chip 30

[0041] Electronic element 31

[0042] Electrical connection portion 32

[0043] Mounting frame 40

[0044] Top surface 401

[0045] Inner side wall 402

[0046] Through hole 403

[0047] Slot 404

[0048] Bottom 4041

[0049] Side view 4042

[0050] First Installation Area 405

[0051] Second Installation Area 406

[0052] Flange 41

[0053] Support surface 411

[0054] Inner edge 412

[0055] Gap 42

[0056] Filter 50

[0057] First barrier layer 51

[0058] First Edge 511

[0059] Second edge 512

[0060] Second barrier layer 52

[0061] First adhesive layer 60

[0062] Third adhesive layer 61

[0063] Second adhesive layer 62

[0064] Electronic devices 200

[0065] The following detailed implementation methods will be combined with the above appendix. Figures 1-6 Further explanation of this application. Detailed Implementation

[0066] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0067] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component.

[0068] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0069] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0070] Example 1

[0071] Please see Figures 1 to 6 The preferred embodiment of this application provides a lens module 100, which includes a circuit board 20 and a lens assembly 10. The lens assembly 10 is disposed on the surface of the circuit board 20. A photosensitive chip 30, a mounting bracket 40 and a filter 50 are also provided between the circuit board 20 and the lens assembly 10.

[0072] See Figure 1 and Figure 2 The circuit board 20 includes a first board portion 201, a second board portion 202, and a third board portion 203. The lens assembly 10 is mounted on the first board portion 201, and the second board portion 202 is connected between the first board portion 201 and the third board portion 203. The side of the circuit board 20 facing the lens assembly 10 is the base surface 21. The circuit board 20 can be a flexible board, a rigid board, or a rigid-flex board. In this embodiment, the circuit board 20 is a rigid-flex board, the first board portion 201 and the third board portion 203 are both rigid boards, and the second board portion 202 is a flexible board. The third board portion 203 is provided with an electrical connection portion 32, which is located on the base surface 21. The electrical connection portion 32 can be a connector or a gold finger, used to realize signal transmission between the lens module 100 and other electronic components in the electronic device 200.

[0073] See Figure 2 and Figure 3 The photosensitive chip 30 is fixed on the base surface 21 and located on the first plate portion 201. The first plate portion 201 has a plurality of electronic components 31 disposed at the edge of the photosensitive chip 30. The electronic components 31 may be passive components such as resistors, capacitors, diodes, transistors, relays, and electrically erasable programmable read-only memory (EEPROM).

[0074] See Figure 1 and Figure 2 A first adhesive layer 60 is provided between the circuit board 20 and the mounting bracket 40, and the mounting bracket 40 is fixed to the circuit board 20 by the first adhesive layer 60.

[0075] See Figure 2 and Figure 3The mounting bracket 40 is disposed between the lens assembly 10 and the circuit board 20. The mounting bracket 40 is generally a square frame structure. A through hole 403 is provided in the middle of the mounting bracket 40, which is square. In other embodiments, different shapes of through holes 403 can be used according to actual needs.

[0076] Mounting bracket 40 includes a top surface 401 away from circuit board 20 and an inner sidewall 402 forming a through hole 403. The inner sidewall 402 of mounting bracket 40 extends toward the central axis of the through hole 403 to form a flange 41. Please also refer to Figure 4 The flange 41 includes a support surface 411 away from the circuit board 20. The inner sidewall 402 is connected between the top surface 401 and the support surface 411. The distance a between the support surface 411 and the base surface 21 is less than the distance b between the top surface 401 and the base surface 21. This arrangement can appropriately reduce the height of the filter 50, thereby reducing the overall height of the lens module 100.

[0077] See Figure 2 and Figure 3 The flange 41 divides the mounting bracket 40 into a first mounting area 405 and a second mounting area 406. The second mounting area 406 is located close to the circuit board 20, and the photosensitive chip 30 and electronic components 31 are housed within the second mounting area 406. The first mounting area 405 corresponds to the second mounting area 406, and the filter 50 is mounted on the flange 41 and located in the first mounting area 405. That is, the filter 50 and the photosensitive chip 30 are located on opposite sides of the flange 41. A second adhesive layer 62 is also provided at the connection between the filter 50 and the flange 41, and the connection between the filter 50 and the flange 41 is achieved through the adhesiveness of the second adhesive layer 62.

[0078] See Figure 2 , Figure 3 and Figure 4A first blocking layer 51 is provided at the edge of the filter 50 away from the circuit board 20. The first blocking layer 51 can be made of black glue or light-shielding ink, but is not limited to these. The first blocking layer 51 can absorb light of different wavelengths and can block strong light at a specific angle from entering and being reflected onto the photosensitive chip 30 through the edge of the filter 50 away from the circuit board 20. The first blocking layer 51 includes a first edge 511 and a second edge 512. The first edge 511 is flush with the corresponding edge of the filter 50, and the second edge 512 corresponds to the first edge 511. The orthographic projection of the inner edge 412 of the flange 41 onto the first blocking layer 51 coincides with or is located between the first edge 511 and the second edge 512 of the first blocking layer 51. That is, the distance c between the second edge 512 and the central axis of the through hole 403 is less than or equal to the distance d between the inner edge 412 of the flange 41 and the central axis of the through hole 403. This arrangement allows the first blocking layer 51 to block the flange 41, reducing the reflection of certain strong light through the flange 41 into the lens barrel, and then onto the photosensitive chip 30.

[0079] See Figure 4 A gap 42 is provided between the filter 50 and the inner wall 402 of the mounting bracket 40. A second barrier layer 52 is disposed within the gap 42. Specifically, the surface of the second barrier layer 52 away from the circuit board 20 is higher than the first barrier layer 51. The second barrier layer 52 can be made of black glue or light-shielding ink. The second barrier layer 52 can be obtained by injecting black glue or light-shielding ink into the gap 42 between the filter 50 and the mounting bracket 40 and then curing it.

[0080] The distance g between the top surface 401 of the mounting bracket 40 and the support surface 411 is greater than the distance f between the base surface 21 of the first blocking layer 51 away from the circuit board 20 and the support surface 411. This arrangement allows the adhesive to flow more easily towards the first blocking layer 51 during the injection process, enabling the second blocking layer 52 to cover at least a portion of the first blocking layer 51. This ensures that the first and second blocking layers 51 and 52 completely cover the corners of the filter 50, further preventing strong light at specific angles from entering and being reflected onto the photosensitive chip 30 through these corners. Simultaneously, the second blocking layer 52 also prevents debris generated during the use of the lens assembly 10 from entering the second mounting area 406.

[0081] See Figure 4The mounting bracket 40 has a slot 404 formed at the connection between the top surface 401 and the inner sidewall 402. The slot 404 can be a chamfered area formed at the connection. Specifically, the location of the mounting bracket 40 forming the slot 404 includes a bottom surface 4041, which is connected to both the top surface 401 and the inner sidewall 402. The bottom surface 4041 is inclined relative to the support surface 411. The distance e between the connection between the bottom surface 4041 and the inner sidewall 402 of the slot 404 and the support surface 411 is less than the distance f between the base surface 21 of the filter 50 away from the circuit board 20 and the support surface 411. This arrangement allows the slot 404 to have a certain spatial size. The slot 404 is connected to the gap 42. During the process of injecting black glue or light-blocking ink between the filter 50 and the inner wall 402 of the mounting bracket 40 to form the second barrier layer 52, the black glue or light-blocking ink flows into the gap 42 through the slot 404. The slot 404 plays a guiding role in the injection of black glue or light-blocking ink into the gap 42, which facilitates the injection of black glue or light-blocking ink into the gap 42 and improves the production efficiency of the lens module 100. Since the lens assembly 10 is a precision component, this method also greatly improves the product yield.

[0082] See Figure 4 The lens assembly 10 includes a lens mount 101, a first lens barrel 102, a second lens barrel 103, and a third lens barrel 104. The lens mount 101 has an opening 1011 in its center. When the lens assembly 10 is fixed to the mounting bracket 40, the position of the opening 1011 corresponds to the position of the through hole 403 on the mounting bracket 40. In this embodiment, the lens mount 101 is a cuboid, and the mounting bracket 40 is adapted to the shape and size of the lens mount 101. The first lens barrel 102 is located close to the lens mount 101, the third lens barrel 104 is furthest from the lens mount 101, and the second lens barrel 103 is located between the first lens barrel 102 and the third lens barrel 104. The inner diameters of the first lens barrel 102, second lens barrel 103, and third lens barrel 104 decrease sequentially. The lens mount 101, first lens barrel 102, second lens barrel 103, and third lens barrel 104 can be integrally injection molded from plastic.

[0083] A third adhesive layer 61 is provided between the lens assembly 10 and the mounting bracket 40, and the lens mount 101 and the mounting bracket 40 are connected through the third adhesive layer 61.

[0084] See Figure 6 The lens module 100 can be applied to various electronic devices 200 with camera modules, such as mobile phones, wearable devices, vehicles, cameras, or monitoring devices. In this embodiment, the lens module 100 is applied to a mobile phone.

[0085] In this application, by providing a first blocking layer 51 at the edge of the filter 50, strong light at a specific angle can be blocked from entering and being reflected onto the photosensitive chip 30 through the edge of the filter 50 away from the circuit board 20. Simultaneously, a second blocking layer 52 is provided between the filter 50 and the mounting bracket 40. The surface of the second blocking layer 52 away from the circuit board 20 is higher than the first blocking layer 51. Therefore, it is advantageous for the first blocking layer 51 and the second blocking layer 52 to cover the edge of the filter 50 (especially the corner positions), thereby blocking strong light at a specific angle from entering and being reflected onto the photosensitive chip 30 through the corners of the filter 50, reducing light spots or blemishes in the captured image, improving the sharpness of the captured image, and enhancing image quality.

[0086] Example 2

[0087] The difference between Example 2 and Example 1 lies in the structure of the slotted 404.

[0088] See Figure 5 The mounting bracket 40 includes a bottom surface 4041 and a side surface 4042 at the location where the slot 404 is formed. The bottom surface 4041 is connected to the inner sidewall 402, and the side surface 4042 is connected between the bottom surface 4041 and the top surface 401. In this embodiment, the bottom surface 4041 is planar and perpendicular to the side surface 4042. The distance between the connection point of the bottom surface 4041 and the inner sidewall 402 and the support surface 411 is less than the distance between the surface of the filter 50 away from the circuit board 20 and the support surface 411. In other embodiments, multiple slots 404 can also be provided between the top surface 401 and the inner sidewall 402. The multiple slots 404 form a stepped surface, which facilitates the injection of black glue or light-blocking ink into the gap 42 to form a second barrier layer 52.

[0089] The above embodiments are merely illustrative of this application, and should not be limited to these embodiments in actual applications. Other modifications and alterations made by those skilled in the art based on the technical concept of this application should fall within the protection scope of the claims of this application.

Claims

1. A lens module, comprising a circuit board, characterized in that, The lens module also includes a lens assembly, a filter, and a mounting bracket. The lens assembly is disposed on the surface of the circuit board, and the mounting bracket is disposed between the lens assembly and the circuit board. The mounting bracket has a through hole, and the mounting bracket has an inner sidewall of the through hole extending toward the central axis of the through hole to form a flange, and the filter is mounted on the flange; A first blocking layer is provided at the edge of the filter away from the surface of the circuit board. A gap is provided between the filter and the inner sidewall of the mounting bracket. A second blocking layer is provided in the gap. The surface of the second blocking layer away from the circuit board is higher than the first blocking layer. The second blocking layer also covers at least a portion of the first blocking layer. The flange includes a support surface away from the circuit board, and the filter is disposed on the support surface; The mounting bracket includes a top surface away from the circuit board, the lens assembly is fixed to the top surface, the inner sidewall is connected between the top surface and the support surface, and the distance between the support surface and the circuit board is less than the distance between the top surface and the circuit board. The mounting bracket has a slot at the connection between the top surface and the inner sidewall, and the slot communicates with the gap.

2. The lens module as described in claim 1, characterized in that, The mounting bracket includes a bottom surface at the location where the slot is formed. The bottom surface is connected between the top surface and the inner sidewall, and the bottom surface is inclined relative to the supporting surface.

3. The lens module as described in claim 1, characterized in that, The mounting bracket includes a bottom surface and a side surface at the location where the slot is formed. The bottom surface is connected to the inner sidewall, and the side surface is connected between the bottom surface and the top surface.

4. The lens module as described in claim 2 or 3, characterized in that, The distance between the connection point of the bottom surface and the inner sidewall and the supporting surface is less than the distance between the surface of the filter away from the circuit board and the supporting surface.

5. The lens module as described in claim 1, characterized in that, The distance between the top surface and the supporting surface is greater than the distance between the surface of the first barrier layer away from the circuit board and the supporting surface.

6. The lens module as described in claim 1, characterized in that, The first barrier layer includes a first edge facing the inner sidewall and a second edge opposite to the first edge, the first edge being flush with the edge of the filter.

7. The lens module as described in claim 6, characterized in that, The support mask has an inner edge, the orthographic projection of which on the first barrier layer coincides with or is located within the first barrier layer.

8. An electronic device, characterized in that, Includes the lens module according to any one of claims 1-7.

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