Carrier device, semiconductor processing apparatus and method of using a carrier device

Abstract

The application provides a bearing device, a semiconductor processing device and a use method of the bearing device. The bearing device comprises a bearing member and an adjusting member. The bearing member is provided with a recess, the side wall of the recess comprises a bearing surface, the bearing surface is provided with a first adsorption unit, the first adsorption unit is used for adsorbing a first area of a workpiece to the bearing surface, the recess corresponds to a second area of the workpiece, and the bottom wall of the recess is spaced from the second area of the workpiece. The adjusting member comprises a second adsorption unit, the second adsorption unit is used for adsorbing the workpiece so that the flatness of the workpiece is within a preset range, and the adjusting member can move so that the workpiece is clamped between the bearing member and the adjusting member. In the bearing device, the first adsorption unit of the bearing member adsorbs the first area of the workpiece, and the second adsorption unit of the adjusting member performs pre-flattening treatment on the workpiece, so as to ensure the requirement of the subsequent treatment on the flatness of the workpiece, and then ensure the processing precision of the semiconductor workpiece.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and more particularly, to a bearing device, a semiconductor processing equipment and a method for using the bearing device. BACKGROUND

[0002] At present, the thickness of a semiconductor workpiece varies between tens to hundreds of microns due to different process and use requirements. When the workpiece thickness is relatively thin, it is prone to generate a relatively large warping due to the manufacturing process, and because of its own thin thickness, it will also generate a large sagging deformation when placed on a bearing device due to the action of gravity. For example, when the back surface of a patterned wafer is processed, the front surface of the patterned wafer cannot be in contact with the bearing device because the front surface of the patterned wafer already has a process pattern, and the front surface of the wafer cannot be adsorbed in a large area to process the back surface of the patterned wafer. Such a bearing device cannot guarantee the flatness of the semiconductor workpiece, thereby affecting the processing accuracy of the semiconductor workpiece. SUMMARY

[0003] The present application provides a bearing device, a semiconductor processing equipment and a method for using the bearing device.

[0004] The bearing device of the present application comprises a bearing member and an adjusting member. The bearing member is provided with a groove, the side wall of the groove comprises a bearing surface, the bearing surface is provided with a first adsorption unit, the first adsorption unit is used for adsorbing a first area of a workpiece to the bearing surface, the groove corresponds to a second area of the workpiece, and the bottom wall of the groove is spaced apart from the second area of the workpiece. The adjusting member comprises a second adsorption unit, the second adsorption unit is used for adsorbing the workpiece to make the flatness of the workpiece within a preset range, and the adjusting member is movable to make the workpiece clamped between the bearing member and the adjusting member.

[0005] In some embodiments, the adjusting member is coaxially arranged with the bearing member.

[0006] In some embodiments, when the workpiece is clamped between the bearing member and the adjusting member, a sealed cavity is formed between the workpiece and the bearing member.

[0007] In some embodiments, the first adsorption unit comprises a first gas groove arranged in a ring shape on the bearing surface.

[0008] In some embodiments, the first adsorption unit comprises a plurality of first gas holes, and the plurality of first gas holes are spaced apart and uniformly distributed on the bearing surface.

[0009] In some embodiments, the supporting device comprises a first driving member and / or a second driving member. The first driving member is configured to drive the adjustment member to move and / or rotate; and the second driving member is configured to drive the supporting member to move and / or rotate.

[0010] In some embodiments, the second adsorption unit comprises a plurality of annular second air grooves arranged on the adjustment member, and each of the second air grooves is concentric.

[0011] In some embodiments, the second adsorption unit comprises a plurality of second air holes, and the second air holes are spaced apart and uniformly distributed.

[0012] In some embodiments, the adjustment member is a porous ceramic structure, and the second adsorption unit comprises a plurality of second air holes of the porous ceramic structure.

[0013] In some embodiments, the recess is circular, and the supporting surface corresponds to the first area of the workpiece.

[0014] In some embodiments, the recesses are a plurality of recesses, and the plurality of recesses are sequentially formed from the center to the periphery of the supporting member, and the plurality of recesses have gradually increasing sizes. The workpieces of different sizes can be supported on the supporting surfaces of the plurality of recesses, and the recesses of the largest size are located on the bottom surfaces of the recesses of the previous larger size. The adjustment members are a plurality of adjustment members, and each of the adjustment members corresponds to the supporting surface of one of the recesses.

[0015] The application also provides a semiconductor processing device, which comprises a processing device and the supporting device of any one of the embodiments described above. The processing device corresponds to the supporting device and is configured to process the workpiece supported on the supporting device.

[0016] The application also provides a method for using the supporting device, which comprises the following steps: placing a workpiece on a supporting member, so that a first area of the workpiece is located on a supporting surface of the supporting member, and a second area of the workpiece corresponds to a recess of the supporting member and is spaced apart from a bottom wall of the recess; moving an adjustment member to a first side of the workpiece away from the supporting member, so that a second side of the workpiece and the supporting member form a sealed cavity; using a second adsorption unit of the adjustment member to adsorb the workpiece, so that the flatness of the workpiece is within a preset range; using a first adsorption unit on the supporting surface to adsorb the first area of the workpiece; and turning off the second adsorption unit and moving away the adjustment member, so that the first adsorption unit keeps adsorbing the first area of the workpiece on the supporting surface.

[0017] The application also provides a method for using the bearing device, which comprises the following steps: placing a workpiece on an adjusting member; adsorbing the workpiece by a second adsorption unit of the adjusting member and making the flatness of the workpiece within a preset range; moving the adjusting member to a first side of the workpiece away from the bearing member, and making a first area of the workpiece located on a bearing surface of the bearing member and a second area of the workpiece corresponding to a groove of the bearing member and spaced from a bottom wall of the groove, a sealed cavity being formed between the workpiece and the bearing member, the first side of the workpiece being opposite to the second side of the workpiece; adsorbing the first area of the workpiece by a first adsorption unit on the bearing surface; and closing the second adsorption unit and moving away the adjusting member, the first adsorption unit keeping adsorbing the first area of the workpiece on the bearing surface.

[0018] In the bearing device, the semiconductor processing equipment and the method for using the bearing device, the first adsorption unit of the bearing member adsorbs the first area of the workpiece, and the second adsorption unit of the adjusting member performs pre-flatness processing on the workpiece, so as to ensure the requirement of subsequent processing on the flatness of the workpiece and further ensure the processing precision of the semiconductor workpiece.

[0019] Additional aspects and advantages of the embodiments of the application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0020] The above and / or additional aspects and advantages of the application will become apparent and be readily appreciated from the following description, including the appended drawings, wherein:

[0021] Figure 1 is a structural schematic view of a bearing device and a workpiece according to some embodiments of the application;

[0022] Figure 2 is a perspective schematic view of a bearing member of a bearing device according to some embodiments of the application;

[0023] Figure 3 is a sectional schematic view of the bearing member of the bearing device according to some embodiments of the application;

[0024] Figure 4 is a perspective schematic view of an adjusting member of the bearing device according to some embodiments of the application;

[0025] Figure 5 is a perspective schematic view of the adjusting member of the bearing device according to some embodiments of the application;

[0026] Figure 6 is Figure 1 is a sectional schematic view of the bearing device along the line VI-VI in

[0027] Figures 7 to 9This is a schematic diagram of the structure of a semiconductor processing device according to certain embodiments of this application;

[0028] Figures 10 to 12 This is a flowchart illustrating the method of using the carrier device according to certain embodiments of this application. Detailed Implementation

[0029] The embodiments of this application will be further described below with reference to the accompanying drawings. The same or similar reference numerals in the drawings denote the same or similar elements or elements having the same or similar functions throughout.

[0030] Furthermore, the embodiments of this application described below in conjunction with the accompanying drawings are exemplary and are only used to explain the embodiments of this application, and should not be construed as limiting this application.

[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] Please see Figure 1 and Figure 4 The supporting device 100 of this application includes a supporting member 10 and an adjusting member 20. The supporting member 10 is provided with a groove 11, and the side wall 12 of the groove 11 includes a supporting surface 121. The supporting surface 121 is provided with a first adsorption unit 13, which is used to adsorb the first region 31 of the workpiece 30 onto the supporting surface 121. The groove 11 corresponds to the second region 32 of the workpiece 30, and the bottom wall 110 of the groove 11 is spaced apart from the second region 32 of the workpiece 30. The adjusting member 20 includes a second adsorption unit 21, which is used to adsorb the workpiece 30 so that the flatness of the workpiece 30 is within a preset range. The adjusting member 20 is movable so that the workpiece 30 is clamped between the supporting member 10 and the adjusting member 20.

[0033] Among them, in the support device 100, the support member 10 can be used to support various workpieces 30 for use in the semiconductor processing equipment 1000. Figure 8The workpiece 30 includes, but is not limited to, a wafer, a chip, a display panel, a front cover of a mobile phone, a rear cover of a mobile phone, a VR glasses, an AR glasses, a smart watch cover plate, glass, a lens, wood, a sheet of iron, a housing of any device (such as a mobile phone case), and the like. At present, the thickness of the workpiece 30 varies between tens of microns and hundreds of microns due to different processes and use requirements. When the thickness of the workpiece 30 is relatively thin, it is prone to relatively large warping due to the manufacturing process, and it will also produce relatively large deformation due to gravity when placed on the bearing device 100 because of its own relatively thin thickness. For example, when the back of a patterned wafer is processed, the front of the patterned wafer cannot be in contact with the bearing device 100 because the front of the patterned wafer has a process pattern, and the front of the wafer cannot be adsorbed in a large area to process the back of the patterned wafer. Such a bearing device 100 cannot guarantee the flatness of the workpiece 30, thereby affecting the processing precision of the workpiece 30.

[0034] Specifically, the second adsorption unit 21 is connected to an air extraction device, and the air extraction device adjusts the pressure in the second adsorption unit 21, so that the second adsorption unit 21 can uniformly adsorb the back of the workpiece 30, and ensure that the flatness of the workpiece 30 is within a predetermined range. For example, when the workpiece 30 is detected, the predetermined range of the flatness of the workpiece 30 is [0.01mm, 0.5mm], the pressure of the second adsorption unit 21 is adjusted to negative pressure to adsorb the workpiece 30, and when the flatness of the workpiece 30 is within the range of [0.01mm, 0.5mm], the pressure of the second adsorption unit 21 is stopped adjusting; when the workpiece 30 is cut, the predetermined range of the flatness of the workpiece 30 is [0.01mm, 0.7mm], and the pressure of the second adsorption unit 21 is adjusted to negative pressure to adsorb the workpiece 30, and when the flatness of the workpiece 30 is within the range of [0.01mm, 0.7mm], the pressure of the second adsorption unit 21 is stopped adjusting. Specifically, the predetermined range of the flatness can be set according to the processing procedure or the characteristics of the workpiece 30 itself, so as to control the pressure of the second adsorption unit 21 to make the flatness of the workpiece 30 within the predetermined range.

[0035] In the bearing device 100 of the present application, the first adsorption unit 13 of the bearing 10 adsorbs the first area 31 of the workpiece 30, and the second adsorption unit 21 of the adjusting piece 20 performs pre-flatness processing on the workpiece 30, to ensure the requirements of subsequent processing on the flatness of the workpiece 30, and thus ensure the processing precision of the semiconductor workpiece 30.

[0036] Further description will be made below in conjunction with the drawings.

[0037] Please refer to Figure 2In some embodiments, the recess 11 is circular, and the recess 11 corresponds to the second area 32 of the workpiece 30, and the bearing surface 121 corresponds to the first area 31 of the workpiece 30. That is, the bearing surface 121 surrounds the recess 11, and the first area 31 surrounds the second area 32. For example, when the back surface (the surface without the pattern) of the workpiece 30 with the process pattern is detected, the front surface of the workpiece 30 faces the recess 11, so that the front surface of the workpiece 30 is prevented from contacting the bearing device 100 and the process pattern of the workpiece 30 is prevented from being damaged. In other embodiments, the recess 11 can also be triangular, quadrangular, pentagonal, hexagonal, or other regular or irregular shapes, and correspondingly, the shape of the outer contour of the bearing member 10 and / or the shape of the outer contour of the adjusting member 20 can correspond to the shape of the recess 11, and can also be triangular, quadrangular, pentagonal, hexagonal, or other regular or irregular shapes, so as to be suitable for workpieces 30 of different shapes; or the outer contour of the bearing member 10 and / or the outer contour of the adjusting member 20 can still be circular as shown, and the shape of the bearing surface 121 is the shape of the remaining part after the shape of the recess 11 (triangular, quadrangular, pentagonal, hexagonal, or other regular or irregular shapes) is removed from the circular shape. Or the shape of the outer contour of the bearing member 10 and / or the shape of the outer contour of the adjusting member 20 do not correspond to the shape of the recess 11, as long as the bearing member 10 has the bearing surface 121 for bearing the first area 31 of the workpiece 30 and the adjusting member 20 can completely adsorb the entire surface of the workpiece 30. Figure 1

[0038] Please continue to refer to Figure 2 In some embodiments, the number of recesses 11 can be one, and at this time, the bearing member 10 is used to bear a workpiece 30 of a size. Correspondingly, the number of adjusting members 20 is also one, and the size corresponds to the size of the workpiece 30 that can be borne by the bearing member 10.

[0039] Please refer to Figure 3 ​In some embodiments, the number of recesses 11 can be multiple, and the sizes of the multiple recesses 11 gradually increase from the center to the periphery of the carrier 10. Multiple workpieces 30 of different sizes can be carried on the corresponding carrier surfaces 121 of the multiple recesses 11. The recesses 11 of the largest size are located on the bottom surface 111 of the recesses 11 of the previous larger size. For example, the number of recesses 11 is three, and in the vertical direction extending from the carrier surface 121a to the carrier surface 121c, they are the recess 11a, the recess 11b, and the recess 11c, respectively. The size (e.g., diameter) of the recess 11c is greater than that of the recess 11b and the recess 11c. The size (e.g., diameter) of the recess 11b is greater than that of the recess 11a. The recess 11b is located at the position of the bottom surface 111 of the recess 11c, that is, the recess 11b is located on the carrier surface 121a of the recess 11a. Multiple carrier surfaces 121 can be suitable for workpieces 30 of different sizes. When replacing workpieces 30 of different sizes, the carrier device 100 does not need to be replaced, saving materials while meeting the production needs.

[0040] Correspondingly, the number of adjusting members 20 is multiple, and each adjusting member 20 corresponds to the carrier surface 121 of a recess 11. When using the carrier device 100, it can be ensured that the flatness of the workpiece 30 of the corresponding size is within the preset range.

[0041] For example, the carrier surface 121a corresponding to the recess 11a is suitable for a workpiece 30 of 8 inches in size, and the corresponding adjusting member 20 performs pre-flattening processing on the workpiece 30. The carrier surface 121b corresponding to the recess 11b is suitable for a workpiece 30 of 12 inches in size, and the corresponding adjusting member 20 performs pre-flattening processing on the workpiece 30. The carrier surface 121c corresponding to the recess 11c is suitable for a workpiece 30 of 16 inches in size, and the corresponding adjusting member 20 performs pre-flattening processing on the workpiece 30. The size is not limited to 8 inches, 12 inches, and 16 inches, but can also be 17 inches, 15 inches, 14 inches, 13 inches, 11 inches, 7 inches, 6 inches, 5 inches, 4 inches, 3 inches, 2 inches, 1 inch, etc. The size of the carrier 10 can be set according to the size of the actual workpiece 30.

[0042] Please refer to Figure 1 In one embodiment, the first adsorption unit 13 can include a plurality of first air holes 131, and the plurality of first air holes 131 are spaced apart from each other and uniformly distributed on the carrier surface 121. Specifically, the air pressure of the first air hole 131 can be adjusted by the air pump communicating with the first air hole 131, thereby realizing the adsorption of the first area 31 of the workpiece 30 on the carrier surface 121. The uniformly spaced and distributed first air holes 131 can uniformly adsorb the first area 31 of the workpiece 30, so that each part of the first area 31 is uniformly stressed, avoiding the warping of the first area 31, and at the same time, ensuring that the adsorption through the first air hole 131 can stably adsorb the workpiece 30 on the carrier 10.

[0043] In another embodiment, the first adsorption unit 13 can include a first annular air groove (not shown in the figure) arranged on the bearing surface 121, i.e., the first annular air groove is concave downward on the bearing surface 121. The first annular air groove can include one or more (greater than or equal to two) annular first air grooves arranged in concentric circles on the bearing surface 121, and the plurality of annular first air grooves can increase the adsorption area of the first area 31 so as to stably adsorb the first area 31 of the workpiece 30 on the bearing surface 121. Similarly, the air pressure of the first air groove can be adjusted by the air pump in communication with the first air groove, so as to adsorb the first area 31 of the workpiece 30 on the bearing surface 121.

[0044] Referring to Figure 4 In an embodiment, the second adsorption unit 21 can include a plurality of annular second air grooves 211 arranged on the surface of the adjusting member 20 facing the bearing member 10, and each annular second air groove 211 is arranged in concentric circles. The adjusting member 20 can be provided with an air passage in communication with the plurality of second air grooves 211, and the second air grooves 211 are pumped by an air pump or other air extraction device to adjust the pressure of the second air grooves 211 to negative pressure, so as to adsorb the back surface of the workpiece 30 and realize the pre-flattening treatment of the workpiece 30.

[0045] Referring to Figure 5 In another embodiment, the second adsorption unit 21 can also include a plurality of second air holes 212 arranged on the surface of the adjusting member 20 facing the bearing member 10, and the plurality of second air holes 212 are spaced apart and uniformly arranged on the adjusting member 20. Similarly, the adjusting member 20 can be provided with an air passage in communication with the plurality of second air holes 212, and the second air holes 212 are pumped by an air pump or other air extraction device to adjust the pressure in the second air holes 212 to negative pressure, so as to adsorb the back surface of the workpiece 30 and realize the pre-flattening treatment of the workpiece 30.

[0046] In another embodiment, the adjusting member 20 is a porous ceramic structure, and the second adsorption unit 21 can include a plurality of second air holes 212 of the porous ceramic structure. Since the porous ceramic belongs to an insulating material, the adjusting member 20 of the porous ceramic structure can dissipate the static electricity when adsorbing the workpiece 30, so as to avoid damaging or contaminating the workpiece 30 during the pre-flattening treatment of the adjusting member 20.

[0047] Specifically, the adjuster 20 adjusts the pressure in the second adsorption unit 21 to ensure that the flatness of the workpiece 30 is within the preset range. For example, assuming that the preset flatness range is [0.01mm, 0.5mm], the pressure in the second adsorption unit 21 is adjusted to negative pressure by the air extraction device. When the flatness of the workpiece 30 is within the range of [0.01mm, 0.5mm], the pressure in the second adsorption unit 21 is stopped adjusting. When the flatness of the workpiece 30 is not within the range of [0.01mm, 0.5mm], the pressure in the second adsorption unit 21 is continuously adjusted until the flatness of the workpiece 30 is adjusted to be within the range of [0.01mm, 0.5mm] and the flatness of the workpiece 30 is kept within the preset range. The flatness of the workpiece 30 within the range of [0.01mm, 0.5mm] is acceptable to the equipment. If the flatness is greater than 0.5mm, the detection equipment needs to be refocused when detecting different areas of the workpiece to obtain ideal results, which will seriously affect the work efficiency and is not conducive to production needs. If the flatness is less than 0.01mm, precise electrical control components are required, which will increase the cost of the detection equipment. After the flatness of the workpiece 30 is kept within the preset range, the adjuster 20 can be moved upwards, and the adsorption force generated by the first adsorption unit 13 of the carrier 10 can stably adsorb the workpiece 30 on the carrier 10 and ensure that the flatness of the workpiece 30 is kept within the preset range. At this time, the processing device 200 of the semiconductor processing equipment 1000 can detect or process the workpiece 30. Figure 8 The processing device 200 can detect or process the workpiece 30. Figure 8 The processing device 200 can detect or process the workpiece 30.

[0048] In some embodiments, the carrier 10 and the adjuster 20 are coaxially arranged, which can reduce the movement of the adjuster 20. When the adjuster 20 moves, it only needs to align the carrier 10 to be raised and lowered. In this way, the second adsorption unit 21 can generate uniform adsorption force to uniformly adsorb the workpiece 30 and efficiently adjust the flatness of the workpiece 30 to be within the preset range.

[0049] Please refer to Figure 6 When the workpiece 30 is clamped between the carrier 10 and the adjuster 20, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10. When the workpiece 30 is placed with the front surface facing the bottom wall 110 of the groove 11, the cavity 40 can avoid the process pattern on the front surface of the workpiece 30 to ensure the integrity of the process pattern on the front surface of the workpiece 30. At this time, the second adsorption unit 21 of the adjuster 20 is opened and the flatness of the workpiece 30 is adjusted to be within the preset range, so that the processing device 200 of the semiconductor processing equipment 1000 can process the workpiece 30 to improve the processing precision of the workpiece 30. Figure 8 The processing device 200 can detect or process the workpiece 30. Figure 8 The processing device 200 can detect or process the workpiece 30.

[0050] Further, please refer toFigure 7 The bearing device 100 can further comprise a first driving member 50 for driving the adjusting member 20 to move and / or rotate. Specifically, the first driving member 50 can be an electric motor, a pneumatic cylinder, a hydraulic cylinder, or the like driving device, which can drive the adjusting member 20 to move or rotate along at least one of the X-axis, the Y-axis, and the Z-axis shown in the figure. Figure 7 The first driving member 50 drives the adjusting member 20 to move and / or rotate, so that the adjusting member 20 is coaxial with the bearing member 10. In this way, the second adsorption unit 21 can generate uniform adsorption force to uniformly adsorb the workpiece 30, thereby efficiently adjusting the flatness of the workpiece 30 to be within the preset range. Meanwhile, the adjusting member 20 being coaxial with the bearing member 10 can also enable the first adsorption unit 13 to accurately and uniformly adsorb the first area 31 of the workpiece 30. After the adjusting member 20 is removed, the adsorption force generated by the first adsorption unit 13 can still stably adsorb the workpiece 30 on the bearing member 10, and can ensure that the flatness of the workpiece 30 remains within the preset range.

[0051] Specifically, when the workpiece 30 is processed, the carrier 10 is separated from the adjusting member 20, i.e., the adjusting member 20 is located at a high position relative to the carrier 10, the first side 33 (back) of the workpiece 30 is placed on the carrier 10 towards the adjusting member 20, due to the existence of the groove 11, only the first area 31 of the workpiece 30 is in contact with the bearing surface 121, the second area 32 of the workpiece 30 corresponds to the groove 11, and the area of the second side 34 (front) of the workpiece 30 with the process pattern remains non-contact. At this time, the adjusting member 20 is moved along the axial direction of the workpiece 30 towards the carrier 10 by the first driving member 50, since the first side 33 (back) of the workpiece 30 is towards the adjusting member 20, at the same time, the first area 31 of the second side 34 (front) of the workpiece 30 is carried on the bearing surface 121 of the carrier 10, so that the workpiece 30 is clamped between the carrier 10 and the adjusting member 20, and a sealed cavity 40 is formed between the workpiece 30 and the carrier 10. At this time, the vacuum suction switch of the second suction unit 21 of the adjusting member 20 is turned on, the pressure of the second suction unit 21 is adjusted to negative pressure, the workpiece 30 is completely adsorbed flat on the adjusting member 20, and the flatness of the workpiece 30 is adjusted to a predetermined range, at this time the warping of the workpiece 30 due to its own process and gravity can be corrected and flattened. Then, the vacuum suction switch of the first suction unit 13 is turned on, and the pressure of the first suction unit 13 is adjusted to negative pressure, so that the first area 31 of the second side 34 (front) of the workpiece 30 is simultaneously adsorbed on the bearing surface 121. At this time, since the workpiece 30 has been pre-corrected to be flat by the adjusting member 20, and the first area 31 of the second side 34 (front) of the workpiece 30 is uniformly adsorbed on the bearing surface 121 in the flat state, when the vacuum suction switch of the second suction unit 21 is turned off, the workpiece 30 can still remain in the flat state. Finally, the adjusting member 20 is moved away from the carrier 10 by the first driving member 50, and the subsequent processing work of the workpiece 30 can be performed.

[0052] Please continue to refer to Figure 7 The carrier device 100 can further include a second driving member 60 for driving the carrier 10 to move and / or rotate. Specifically, the second driving member 60 can be a motor, a cylinder, a hydraulic drive device, etc., which can drive the carrier 10 to move along Figure 7At least one of the X, Y, and Z axes shown can be moved or rotated. The second driving member 60 drives the carrier member 10 to move and / or rotate, enabling the carrier member 10 to be coaxial with the adjusting member 20. Thus, the second adsorption unit 21 can generate a uniform adsorption force to uniformly adsorb the workpiece 30, thereby efficiently adjusting the flatness of the workpiece 30 to a preset range. Simultaneously, the coaxiality of the carrier member 10 and the adjusting member 20 also allows the first adsorption unit 13 to accurately and uniformly adsorb the first region 31 of the workpiece 30. After the carrier member 10 is removed, the adsorption force generated by the first adsorption unit 13 can still stably adsorb the workpiece 30 onto the carrier member 10, ensuring that the flatness of the workpiece 30 remains within a preset range for processing device 200 ( Figure 8 The workpiece 30 is processed to ensure its processing accuracy. Specifically, when processing the workpiece 30, the carrier 10 and the adjusting member 20 are separated, that is, the adjusting member 20 is positioned higher than the carrier 10. First, the first side 33 (back) of the workpiece 30 is placed on the carrier 10 with the adjusting member 20 facing it. Due to the presence of the groove 11, only the first area 31 of the workpiece 30 contacts the bearing surface 121, and the second area 32 of the workpiece 30 corresponds to the groove 11. The area with the process pattern on the second side 34 (front) of the workpiece 30 remains non-contact. At this time, the carrier 10 is moved along the axial direction of the workpiece 30 towards the direction where the adjusting member 20 is located by the second driving member 60. Since the first side 33 (back) of the workpiece 30 faces the adjusting member 20, and the first area 31 of the second side 34 (front) of the workpiece 30 is supported on the bearing surface 121 of the carrier 10, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10 when the workpiece 30 is clamped between the carrier 10 and the adjusting member 20. At this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjusting component 20 is turned on, and the pressure of the second adsorption unit 21 is adjusted to negative pressure, so that the workpiece 30 is completely adsorbed and flattened on the adjusting component 20, and the flatness of the workpiece 30 is adjusted to the preset range. At this time, the warping of the workpiece 30 due to its own process and gravity can be corrected and flattened. Then, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to negative pressure, so that the first area 31 of the second side 34 (front) of the workpiece 30 is simultaneously adsorbed on the bearing surface 121. At this time, since the workpiece 30 has been pre-corrected to a flat state by the adjusting component 20, and the first area 31 of the second side 34 (front) of the workpiece 30 is evenly adsorbed on the bearing surface 121 in the flat state, the workpiece 30 can still maintain a flat state when the vacuum adsorption switch of the second adsorption unit 21 is turned off. Finally, the second driving member 60 drives the carrier member 10 to move away from the adjusting member 20. At this time, the first adsorption unit 13 still adsorbs the workpiece 30, so that the second driving member 60 can drive the carrier member 10 and the workpiece 30 to move together, so that the workpiece 30 can be processed later.

[0053] Please refer to [link / reference]Figure 7 The bearing device 100 can also simultaneously comprise the first driving member 50 and the second driving member 60. The first driving member 50 is used to drive the adjustment member 20 to move and / or rotate, and the second driving member 60 is used to drive the bearing member 10 to move and / or rotate. Specifically, the first driving member 50 and the second driving member 60 can be motors, cylinders, hydraulic driving devices, etc., and can respectively drive the adjustment member 20 and the bearing member 10 to move or rotate along at least one of the X-axis, the Y-axis, and the Z-axis shown in the figure. Figure 7 The first driving member 50 and the second driving member 60 can be simultaneously turned on, that is, while the first driving member 50 drives the adjustment member 20 to move and / or rotate, the second driving member 60 drives the bearing member 10 to move and / or rotate, and controls the adjustment member 20 and the bearing member 10 to be coaxial. In this way, the second adsorption unit 21 can generate uniform adsorption force to uniformly adsorb the workpiece 30, and thus can efficiently adjust the flatness of the workpiece 30 to be within the preset range. At the same time, the adjustment member 20 and the bearing member 10 being coaxial can also enable the first adsorption unit 13 to accurately and uniformly adsorb the first area 31 of the workpiece 30. After the adjustment member 20 is removed, the adsorption force generated by the first adsorption unit 13 can still stably adsorb the workpiece 30 on the bearing member 10, and can ensure that the flatness of the workpiece 30 is maintained within the preset range.

[0054] Similarly, when the workpiece 30 is processed, the carrier 10 is separated from the adjusting member 20, i.e., the adjusting member 20 is located at the high position relative to the carrier 10, the first side 33 (back) of the workpiece 30 is placed on the carrier 10 towards the adjusting member 20, due to the existence of the groove 11, only the first area 31 of the workpiece 30 is in contact with the bearing surface 121, the second area 32 of the workpiece 30 corresponds to the groove 11, and the area of the second side 34 (front) of the workpiece 30 with the process pattern remains non-contact. At this time, the first driving member 50 drives the adjusting member 20 to move and / or rotate, and the second driving member 60 drives the carrier 10 to move and / or rotate, which saves the coaxial adjustment time and improves the coaxial adjustment efficiency, thereby shortening the time of the entire processing process and improving the processing efficiency. Since the first side 33 (back) of the workpiece 30 is towards the adjusting member 20, and at the same time, the first area 31 of the second side 34 (front) of the workpiece 30 is carried on the bearing surface 121 of the carrier 10, the workpiece 30 is clamped between the carrier 10 and the adjusting member 20, and a sealed cavity 40 is formed between the workpiece 30 and the carrier 10. At this time, the vacuum suction switch of the second suction unit 21 of the adjusting member 20 is turned on, the pressure of the second suction unit 21 is adjusted to negative pressure, the workpiece 30 is completely sucked and flattened on the adjusting member 20, and the flatness of the workpiece 30 is adjusted to a predetermined range, at this time, the warping of the workpiece 30 due to its own process and gravity can be corrected and flattened. Then, the vacuum suction switch of the first suction unit 13 is turned on, and the pressure of the first suction unit 13 is adjusted to negative pressure, so that the first area 31 of the second side 34 (front) of the workpiece 30 is simultaneously sucked on the bearing surface 121. At this time, since the workpiece 30 has been pre-corrected to be flat by the adjusting member 20, and the first area 31 of the second side 34 (front) of the workpiece 30 is uniformly sucked on the bearing surface 121 in the flat state, when the vacuum suction switch of the second suction unit 21 is turned off, the workpiece 30 can still remain in the flat state. Finally, the adjusting member 20 is moved away from the carrier 10 by the first driving member 50 and / or the carrier 10 is moved away from the adjusting member 20 by the second driving member 60, so as to facilitate the processing device 200 Figure 8 to process the workpiece 30; at the same time, the carrier 10 can be moved by the second driving member 60, so that the semiconductor processing equipment 1000 Figure 8 processes the workpiece 30 (such as optical detection), and is located at the focusing position, thereby improving the processing precision of the workpiece 30; or the carrier 10 can be rotated by the second driving member 60, so as to realize the rotation processing (such as detection, coating, etching, and cutting) of the workpiece 30.

[0055] Please refer to Figure 8The application further provides a semiconductor processing device 1000, which comprises a processing device 200 and the carrier device 100 of any one of the above embodiments, the processing device 200 corresponding to the carrier device 100 and being used for processing the workpiece 30 carried on the carrier device 100.

[0056] In one embodiment, the processing device 200 can be a detector, which is used for detecting defects of the workpiece 30 carried on the carrier device 100. In one embodiment, the processing device 200 can be an etching device, which is used for etching the workpiece 30 carried on the carrier device 100. In another embodiment, the processing device 200 can also be a coating device, which is used for evaporating, sputtering or the like on the workpiece 30 carried on the carrier device 100. The processing device 200 can also be of other types, which all fall within the protection scope of the application, and are not listed here.

[0057] Please refer to Figure 8 and Figure 10 The application further provides a use method of the carrier device 100, which comprises the following steps:

[0058] 01: placing the workpiece 30 on the carrier 10, so that the first area 31 of the workpiece 30 is located on the carrier surface 121 of the carrier 10, and the second area 32 of the workpiece 30 corresponds to the groove 11 of the carrier 10 and is spaced from the bottom wall 110 of the groove 11;

[0059] 02: moving the adjusting member 20 to the first side 33 of the workpiece 30 away from the carrier 10, and forming the sealed cavity 40 between the second side 34 of the workpiece 30 and the carrier 10, the first side 33 of the workpiece 30 being opposite to the second side 34 of the workpiece 30;

[0060] 03: adsorbing the workpiece 30 by the second adsorption unit 21 of the adjusting member 20 so that the flatness of the workpiece 30 is within a preset range;

[0061] 04: adsorbing the first area 31 of the workpiece 30 by the first adsorption unit 13 on the carrier surface 121; and

[0062] 05: closing the second adsorption unit 21 and moving away the adjusting member 20, and the first adsorption unit 13 keeps adsorbing the first area 31 of the workpiece 30 on the carrier surface 121.

[0063] Specifically, when the workpiece 30 is processed, the carrier 10 is separated from the adjusting member 20, i.e., the adjusting member 20 is located at a high position relative to the carrier 10, the first side 33 (back) of the workpiece 30 is placed on the carrier 10 towards the adjusting member 20, due to the existence of the groove 11, only the first area 31 of the workpiece 30 is in contact with the bearing surface 121, the second area 32 of the workpiece 30 corresponds to the groove 11 and is spaced from the bottom wall 110 of the groove 11, and the second side 34 (front) of the workpiece 30 keeps non-contact with the area of the process pattern. At this time, the adjusting member 20 is moved to the first side 33 of the workpiece 30 by the first driving member 50, because the first side 33 (back) of the workpiece 30 is towards the adjusting member 20, at the same time, the first area 31 of the second side 34 (front) of the workpiece 30 is carried on the bearing surface 121 of the carrier 10, so that the workpiece 30 is clamped between the carrier 10 and the adjusting member 20, the cavity 40 is formed between the workpiece 30 and the carrier 10. At this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjusting member 20 is turned on, the pressure of the second adsorption unit 21 is adjusted to negative pressure, the workpiece 30 is completely adsorbed and flattened on the adjusting member 20, and the flatness of the workpiece 30 is adjusted to a preset range, at this time, the warping of the workpiece 30 due to its own process and gravity can be corrected and flattened. Then, the vacuum adsorption switch of the first adsorption unit 13 is turned on, the pressure of the first adsorption unit 13 is adjusted to negative pressure, so that the first area 31 of the second side 34 (front) of the workpiece 30 is adsorbed on the bearing surface 121 at the same time. At this time, because the workpiece 30 has been pre-corrected to be flat by the adjusting member 20, and in the flat state, the first adsorption unit 13 keeps adsorbing the first area 31 of the second side 34 (front) of the workpiece 30 on the bearing surface 121 uniformly, so when the vacuum adsorption switch of the second adsorption unit 21 is turned off, the workpiece 30 can still keep the flat state. Finally, the adjusting member 20 can be moved away from the carrier 10 by the first driving member 50, and the processing device 200 can perform subsequent processing work on the workpiece 30.

[0064] Please refer to Figure 8 and Figure 11 In one embodiment, the order of 02 and 04 in the use method of the carrier device 100 can be adjusted, i.e., the use method can include:

[0065] 01: placing the workpiece 30 on the carrier 10, so that the first area 31 of the workpiece 30 is located on the bearing surface 121 of the carrier 10, and the second area 32 of the workpiece 30 corresponds to the groove 11 of the carrier 10 and is spaced from the bottom wall 110 of the groove 11;

[0066] 04: adsorbing the first area 31 of the workpiece 30 by the first adsorption unit 13 on the bearing surface 121;

[0067] 02: moving the adjustment member 20 to the first side 33 of the workpiece 30 away from the carrier 10, and forming the sealed cavity 40 between the second side 34 of the workpiece 30 and the carrier 10, the first side 33 of the workpiece 30 being opposite to the second side 34 of the workpiece 30;

[0068] 03: adsorbing the workpiece 30 by the second adsorption unit 21 of the adjustment member 20 to make the flatness of the workpiece 30 within a preset range; and

[0069] 05: turning off the second adsorption unit 21 and moving away the adjustment member 20, the first adsorption unit 13 keeping adsorbing the first area 31 of the workpiece 30 to the carrier surface 121.

[0070] Specifically, when the workpiece 30 is processed, the carrier 10 is separated from the adjustment member 20, i.e. the adjustment member 20 is located at a high position relative to the carrier 10, the first side 33 (back) of the workpiece 30 is placed on the carrier 10 towards the adjustment member 20, due to the existence of the groove 11, only the first area 31 of the workpiece 30 is in contact with the carrier surface 121, the second area 32 of the workpiece 30 corresponds to the groove 11 and is spaced from the bottom wall 110 of the groove 11, and the area of the second side 34 (front) of the workpiece 30 with process patterns remains non-contact. At this time, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to negative pressure, so that the first area 31 of the second side 34 (front) of the workpiece 30 is adsorbed on the carrier surface 121 at the same time. Then, the adjustment member 20 can be moved to the first side 33 of the workpiece 30 by the first driving member 50, because the first side 33 (back) of the workpiece 30 is towards the adjustment member 20, and at the same time, the first area 31 of the second side 34 (front) of the workpiece 30 is carried on the carrier surface 121 of the carrier 10, so that when the workpiece 30 is clamped between the carrier 10 and the adjustment member 20, the sealed cavity 40 is formed between the workpiece 30 and the carrier 10. At this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjustment member 20 is turned on, and the pressure of the second adsorption unit 21 is adjusted to negative pressure, so that the workpiece 30 is completely adsorbed and flattened on the adjustment member 20 and the flatness of the workpiece 30 is adjusted to a preset range, at this time the warping of the workpiece 30 due to its own process and gravity can be corrected and flattened. At this time, because the workpiece 30 has been pre-corrected to be flat by the adjustment member 20, and in the flat state, the first adsorption unit 13 still keeps adsorbing the first area 31 of the second side 34 (front) of the workpiece 30 to the carrier surface 121, so when the vacuum adsorption switch of the second adsorption unit 21 is turned off, the workpiece 30 can still remain in the flat state. Finally, the adjustment member 20 can be moved away from the carrier 10 by the first driving member 50, and the processing device 200 can perform subsequent processing work on the workpiece 30.

[0071] In the method 01-05, the workpiece 30 is first carried on the carrier 10 by the first adsorption unit 13, and then the adjusting member 20 is moved to the position of the carrier 10, and the workpiece 30 is pre-flattened, and the workpiece 30 with a flatness within a preset range does not need to be adjusted to align the first area 31 of the workpiece 30 with the carrying surface 121, reducing the position adjustment of the workpiece 30, and preventing the process pattern on the second side 34 (front side) of the workpiece 30 from being damaged during the position adjustment.

[0072] Referring to Figure 9 and Figure 12 In another embodiment, the use method can further include:

[0073] 06: placing the workpiece 30 on the adjusting member 20;

[0074] 07: using the second adsorption unit 21 of the adjusting member 20 to make the flatness of the workpiece 30 within a preset range;

[0075] 08: moving the adjusting member 20 to the first side 33 of the workpiece 30 away from the carrier 10, and making the first area 31 of the workpiece 30 located on the carrying surface 121 of the carrier 10, and the second area 32 of the workpiece 30 corresponding to the groove 11 of the carrier 10 and spaced from the bottom wall 110 of the groove 11, forming a sealed cavity 40 between the workpiece 30 and the carrier 10, and the first side 33 of the workpiece 30 being opposite to the second side 34 of the workpiece;

[0076] 09: using the first adsorption unit 13 on the carrying surface 121 to adsorb the first area 31 of the workpiece 30; and

[0077] 010: closing the second adsorption unit 21 and moving away the adjusting member 20, and the first adsorption unit 13 keeps adsorbing the first area 31 of the workpiece 30 on the carrying surface 121.

[0078] Specifically, when the workpiece 30 is processed, the carrier 10 is separated from the adjusting member 20, that is, the adjusting member 20 is located at a low position relative to the carrier 10, and the first side 33 (back side) of the workpiece 30 is placed on the adjusting member 20, at this time, the vacuum adsorption switch of the second adsorption unit 21 of the adjusting member 20 is turned on, the pressure of the second adsorption unit 21 is adjusted to negative pressure, the workpiece 30 is completely adsorbed and flattened on the adjusting member 20, and the flatness of the workpiece 30 is adjusted to a preset range, at this time, the warping of the workpiece 30 due to its own process and gravity can be corrected and flattened. Then, the first driving member 50 ( Figure 8As shown, the adjusting member 20 is moved to the position of the carrier 10. Since the first side 33 (back) of the workpiece 30 faces the adjusting member 20, and the first area 31 of the second side 34 (front) of the workpiece 30 is located on the bearing surface 121 of the carrier 10, and the second area 32 of the workpiece 30 corresponds to the groove 11, a sealed cavity 40 is formed between the workpiece 30 and the carrier 10 when the workpiece 30 is clamped between the carrier 10 and the adjusting member 20. At this time, the vacuum adsorption switch of the first adsorption unit 13 is turned on, and the pressure of the first adsorption unit 13 is adjusted to negative pressure, so that the first area 31 of the second side 34 (front) of the workpiece 30 is simultaneously adsorbed onto the bearing surface 121. At this time, since the workpiece 30 has been pre-corrected to a flat state by the adjusting member 20, and in the flat state, the first adsorption unit 13 still maintains uniform adsorption of the first area 31 of the second side 34 (front) of the workpiece 30 onto the bearing surface 121, the workpiece 30 can still maintain a flat state when the vacuum adsorption switch of the second adsorption unit 21 is turned off. Finally, it can be driven by the first drive unit 50 ( Figure 8 As shown, the adjusting component 20 moves away from the bearing component 10, and the processing device 200 can then perform subsequent processing on the workpiece 30.

[0079] In methods 06 to 010, the workpiece 30 is first pre-flattened, and then the adjusting component 20 is controlled to be coaxial with the carrier component 10. The pre-flattened workpiece 30 is then placed stably on the carrier component 10 to prevent the warped workpiece 30 from falling into the groove 11 when placed on the carrier component 10. The first adsorption unit 13 can better adsorb the first area 31 of the workpiece 30.

[0080] Please see Figure 8 In the carrier device 100, semiconductor processing equipment 1000, and method of using the carrier device 100 of this application, the first adsorption unit 13 of the carrier 10 adsorbs the first region 31 of the workpiece 30, and the adjusting member 20 can be moved to the position of the carrier 10 to clamp the workpiece 30 between the carrier 10 and the adjusting member 20, and through the second adsorption unit 21 of the adjusting member 20 ( Figure 4 As shown, the workpiece 30 is pre-flattened to ensure the flatness requirements of the workpiece 30 in subsequent processing, thereby ensuring that the flatness of the semiconductor workpiece 30 is within the preset range.

[0081] In the description of the specification, the description of the terms "certain embodiments", "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" means that the particular feature, structure, material or characteristic being described is included in at least one embodiment or example of the application. The illustrative appearances of the above terms in various places in the specification are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0082] In addition, the terms "first", "second", "third", etc. are used herein only to describe various circumstances, and are not to be construed as indicating or implying relative importance or a specific number of the technical features indicated. Thus, the features defined with "first", "second", etc. can explicitly or implicitly include at least one of the features. In the description of the application, the meaning of "plurality" is at least two, for example, two, three, unless otherwise explicitly specified.

[0083] Although the embodiments of the application have been shown and described above, it is to be understood that the above-described embodiments are exemplary, and are not to be construed as limiting the application, and those skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the application, and the scope of the application is defined by the claims and their equivalents.

Claims

1. A load bearing device, characterized by, The carrier is provided with a recess, a side wall of the recess comprises a carrier surface, the carrier surface is provided with a first adsorption unit for adsorbing a first area of a workpiece to the carrier surface, the recess corresponds to a second area of the workpiece, and a bottom wall of the recess is spaced from the second area of the workpiece. The adjusting member comprises a second adsorption unit for adsorbing the workpiece to make the flatness of the workpiece within a preset range, and the adjusting member is movable to make the workpiece clamped between the carrier and the adjusting member. The adjusting member is coaxially arranged with the carrier. When the workpiece is clamped between the carrier and the adjusting member, a sealed cavity is formed between the workpiece and the carrier.

2. The load bearing device of claim 1, wherein, The first adsorption unit comprises a first annular air groove arranged on the carrier surface, or the first adsorption unit comprises a plurality of first air holes which are spaced from each other and uniformly distributed on the carrier surface.

3. The load bearing device of claim 1, wherein, The carrier device comprises:

4. The load bearing device of claim 1, wherein, a first driving member for driving the adjusting member to move and / or rotate; and / or 5. The load bearing device of claim 1, wherein, a second driving member for driving the carrier to move and / or rotate. The second adsorption unit comprises a plurality of second annular air grooves arranged on the adjusting member, and each second air groove is concentric; or the second adsorption unit comprises a plurality of second air holes which are spaced from each other and uniformly distributed; or 6. The load bearing device of claim 1, wherein, the adjusting member is a porous ceramic structure, and the second adsorption unit comprises a plurality of second air holes of the porous ceramic structure. The recess is circular, and the carrier surface corresponds to the first area of the workpiece. The number of the recesses is multiple, and a plurality of recesses with gradually increasing sizes are sequentially formed from the center to the periphery of the carrier, a plurality of workpieces with different sizes can be carried on the carrier surfaces of the plurality of recesses, and the recesses with sizes larger than the maximum size are located on the bottom surface of the recess with the previous larger size; the number of the adjusting members is multiple, and each adjusting member corresponds to the carrier surface of one recess.

7. The load bearing device of claim 1, wherein, The carrier device comprises:

8. The load bearing device of claim 1, wherein, a processing device; and 9. A semiconductor processing apparatus, characterized by comprising: the carrier device of any one of claims 1-8, and the processing device corresponds to the carrier device and is used for processing the workpiece carried on the carrier device. The carrier device comprises: placing a workpiece on a carrier, so that a first area of the workpiece is located on a carrier surface of the carrier, and a second area of the workpiece corresponds to a recess of the carrier and is spaced from a bottom wall of the recess; moving an adjusting member to a first side of the workpiece away from the carrier, so that a second side of the workpiece and the carrier form a sealed cavity, and the first side of the workpiece is opposite to the second side of the workpiece; 10. A method of using a load bearing device, characterized by, adsorbing the workpiece by using a second adsorption unit of the adjusting member to make the flatness of the workpiece within a preset range; adsorbing the first area of the workpiece by using a first adsorption unit on the carrier surface; and closing the second adsorption unit and moving away the adjusting member, and the first adsorption unit keeps adsorbing the first area of the workpiece to the carrier surface. The carrier device comprises: placing a workpiece on an adjusting member; ​ ​ 11. A method of using a load bearing device, characterized by, ​ ​ Sucking the workpiece by a second suction unit of the adjusting member and making the flatness of the workpiece within a preset range; Moving the adjusting member to a first side of the workpiece away from the carrier, and making a first area of the workpiece located on a bearing surface of the carrier, and a second area of the workpiece corresponding to a groove of the carrier and spaced from a bottom wall of the groove, a sealed cavity being formed between the workpiece and the carrier, the first side of the workpiece being opposite to the second side of the workpiece; Sucking the first area of the workpiece by a first suction unit on the bearing surface; And Turning off the second suction unit and moving away the adjusting member, the first suction unit keeping sucking the first area of the workpiece on the bearing surface.

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