Stress skin backed panel for preventing image artifacts

Abstract

A backing panel (210) for a transducer (204) of an ultrasound scanner probe (200) is disclosed, the backing panel comprising a core layer (214) sandwiched by a first skin layer (212a) and a second skin layer (212b). The transducer can comprise a front portion and a back portion, wherein the front portion is directed in a direction of a target of the ultrasound scanner probe, and the first skin layer is adjacent to the back portion of the transducer.

Description

Technical Field

[0001] Some embodiments involve an acoustic structure. More specifically, some embodiments involve a stress-skinned backing panel for preventing image artifacts. Background Technology

[0002] As part of the diagnostic process, medical imaging devices (such as, for example, ultrasound scanners) can be used to image at least a part of a patient's body. An ultrasound scanner may include a probe that emits, for example, sound waves.

[0003] By comparing such systems with some aspects of this disclosure as set forth with reference to the accompanying drawings in the remainder of this application, further limitations and disadvantages of conventional and traditional methods will become apparent to those skilled in the art. Summary of the Invention

[0004] A stress-skinned backing panel for preventing image artifacts is disclosed, the stress-skinned backing panel being substantially as shown in at least one of the accompanying drawings and / or as described in conjunction with at least one of the accompanying drawings, as set forth more fully in the claims.

[0005] These and other advantages, aspects and novel features of this disclosure, as well as details of its illustrative embodiments, will be more fully understood from the following description and accompanying drawings. Attached Figure Description

[0006] Figure 1 This is a block diagram of an exemplary ultrasound system according to various implementation schemes.

[0007] Figure 2 This is an illustration of a portion of an exemplary probe for an ultrasound system according to various implementation schemes.

[0008] Figures 3 to 14 This is an illustration of an exemplary stress-skinned backing panel according to various embodiments.

[0009] Figure 15 This is an illustration of the exemplary propagation of sound waves according to various implementation schemes.

[0010] Figure 16 This is an illustration of an exemplary stress-skin backing panel having a skin covering an additional surface, according to various embodiments.

[0011] Figure 17 This is a diagram illustrating the finite element simulation of an exemplary embodiment of a stress-skinned backing panel.

[0012] Figure 18 Exemplary transducer structures for catheter applications according to various embodiments are shown. Detailed Implementation

[0013] Certain implementations can be found in methods and systems for using stress-skinned backing panels to prevent image artifacts. The root causes of image artifacts can vary depending on the application. In some cases, image artifacts can be caused by echoes reflected from an interface in the rear structure of the transducer that cannot be filtered by the imaging system and combine with signals of interest from the observed region of the human body. In other cases, such as in cardiac applications, image artifacts can occur when sound waves propagate through the entire transducer structure and can acoustically penetrate human structures outside the region of interest. For example, in various implementations, the acoustic structure of the ultrasound transducer may include an absorbing layer (backing) designed to absorb energy radiated in the direction opposite to the direction of observation in order to minimize pseudo-reflections that will combine with the transmitted available signal and cause image artifacts. In some implementations, a thinner backing panel with sufficient mechanical stiffness may be useful. As used, the term stress-skinned panel refers to a type of rigid structure comprising an inner core sandwiched between two skins.

[0014] For example, in situations where space is extremely limited, a thin absorbent backing can be used. Absorbent backings also provide sufficient mechanical rigidity for manufacturing purposes. They also remove heat to prevent the front surface temperature from exceeding the maximum temperature permitted by applicable regulations.

[0015] The foregoing invention and the following detailed description of certain embodiments will be better understood when read in conjunction with the accompanying drawings. The provided drawings illustrate schematic diagrams of functional blocks for various embodiments, and these functional blocks do not necessarily indicate the division between mechanical parts.

[0016] It should be understood that the various embodiments are not limited to the arrangements and tools shown in the accompanying drawings, and various embodiments can be combined. Other embodiments may be utilized and structural changes may be made without departing from the scope of the various embodiments. For example, different types of materials with similar mechanical properties may be used in various embodiments of this disclosure. Therefore, the following detailed description should not be regarded as limiting, and the scope of this disclosure is defined by the appended claims and their equivalents.

[0017] As used herein, elements or steps listed in the singular and beginning with the word "a" or "an" should be understood to not exclude multiple said elements or steps, unless such exclusion is explicitly stated. Furthermore, references to "exemplary embodiments," "various embodiments," "certain embodiments," "representative embodiments," etc., are not intended to be construed as excluding the existence of additional embodiments that also incorporate the described features. Moreover, unless explicitly stated to the contrary, embodiments that "comprise," "include," or "have" one or more elements having a particular property may include additional elements that do not have that property.

[0018] Additionally, as used herein, the term "imager" broadly refers to an ultrasound scanner. However, other devices and / or structures that require the absorption of acoustic energy may also utilize embodiments of this disclosure.

[0019] Various embodiments of this disclosure provide a backing structure consisting of a core layer sandwiched between two skin layers. The material forming the core layer can be made of a highly attenuating or diffusing material, such as, for example, but not limited to, an epoxy matrix filled with attenuating and diffusing particles such as, for example, but not limited to, tungsten or alumina powder, or a silicone-based composition, wherein the skin layers can contain a rigid material such as, for example, but not limited to, tungsten carbide. The backing structure can be configured such that acoustic energy (waves) entering the structure can be trapped in the core layer and highly attenuated due to a design for strong reflection at the interface between the skin layer and the core layer.

[0020] For example, when energy enters the backing structure, propagation within the "core" of the backing structure ensures attenuation of that energy. Due to the strong acoustic impedance mismatch between the core material and the skin material, the first reflection occurs at the core / bottom skin layer interface. The energy reflected at this interface propagates again within the core layer, reflects at the core / top skin layer interface, and so on, to minimize the amplitude of spurious waves emanating from the backing structure. The core material can have a low acoustic impedance in, for example, a few MRay. For example, the acoustic impedance of foam can be less than 1 MRay, that of silicone resin can be about 1 MRay, and that of an epoxy resin matrix filled with metal particles can be 4 MRay to 6 MRay, etc. The skin material can have a higher acoustic impedance in the range of 10 s to 100 s MRay. For example, the acoustic impedance of tungsten carbide can be about 80 MRay to 100 MRay.

[0021] Various embodiments may also include a structure comprising multiple reinforcing members made of, for example, the same material as the skin layer. These reinforcing members may be referred to as "support columns." Other embodiments may include support columns made of a different material than the skin layer.

[0022] In various implementations, both the "skin" layer and the "core" layer can be designed in such a way that the thermal conductivity of the stress-skin backing structure helps to dissipate heat from the front of the transducer. The core layer can be, for example, a composite material comprising one or more highly conductive metal particles, graphite, etc., wherein the graphite may include one or more of, for example, pyrolytic graphite, graphene, etc.

[0023] Figure 1 This is a block diagram of an exemplary ultrasound system 100 according to various implementation schemes. Reference Figure 1An ultrasound system 100 is shown. The ultrasound system 100 includes a transmitter 102, an ultrasound probe 104, a transmit beamformer 110, a receiver 118, a receive beamformer 120, an A / D converter 122, an RF processor 124, an RF / IQ buffer 126, a user input device 130, a signal processor 132, an image buffer 136, a display system 134, and a file 138.

[0024] Transmitter 102 may include suitable logic, circuitry, interfaces, and / or code operable to drive ultrasound probe 104. Ultrasound probe 104 may include a two-dimensional (2D) array of piezoelectric elements. Ultrasound probe 104 may include a set of transmitting transducer elements 106 and a set of receiving transducer elements 108 that generally constitute the same components. In some embodiments, ultrasound probe 104 is operable to acquire ultrasound image data covering at least a majority of anatomical structures, such as the heart, blood vessels, or any suitable anatomical structure.

[0025] The transmitting beamformer 110 may include suitable logic, circuitry, interfaces, and / or code operable to control the transmitter 102, which drives the set of transmitting transducer elements 106 via the transmitting sub-aperture beamformer 114 to transmit ultrasonic signals to a region of interest (e.g., humans, animals, underground cavities, physical structures, etc.). The transmitted ultrasonic signals may be backscattered from structures (such as blood cells or tissue) within the object of interest to generate echoes. The echoes are received by the receiving transducer element 108.

[0026] The set of receiving transducer elements 108 in the ultrasonic probe 104 is operable to convert the received echo into an analog signal, perform sub-aperture beamforming via the receiving sub-aperture beamformer 116, and then transmit it to the receiver 118. The receiver 118 may include suitable logic, circuitry, interfaces, and / or code operable to receive the signal from the receiving sub-aperture beamformer 116. The analog signal can be transmitted to one or more of a plurality of A / D converters 122.

[0027] Multiple A / D converters 122 may include suitable logic, circuitry, interfaces, and / or code operable to convert analog signals from receiver 118 into corresponding digital signals. The multiple A / D converters 122 are disposed between receiver 118 and RF processor 124. However, this disclosure is not limited in this respect. Therefore, in some embodiments, multiple A / D converters 122 may be integrated within receiver 118.

[0028] RF processor 124 may include suitable logic, circuitry, interfaces, and / or code operable to demodulate digital signals output from a plurality of A / D converters 122. According to one embodiment, RF processor 124 may include a demodulator (not shown) operable to demodulate digital signals to form I / Q data pairs representing corresponding echo signals. The RF or I / Q signal data can then be transmitted to an RF / IQ buffer 126. RF / IQ buffer 126 may include suitable logic, circuitry, interfaces, and / or code operable to provide temporary storage of the RF or I / Q signal data generated by RF processor 124.

[0029] The receiver beamformer 120 may include suitable logic, circuitry, interfaces, and / or code operable to perform digital beamforming processing, such as summing a delayed channel signal received from the RF processor 124 via the RF / IQ buffer 126 and outputting a beam sum signal. The resulting processed information may be a beam sum signal output from the receiver beamformer 120 and transmitted to the signal processor 132. According to some embodiments, the receiver 118, multiple A / D converters 122, the RF processor 124, and the beamformer 120 may be integrated into a single beamformer, which may be digital. In various embodiments, the ultrasound system 100 includes multiple receiver beamformers 120.

[0030] User input device 130 can be used to input patient data, scan parameters, settings, select protocols and / or templates, etc. In an exemplary embodiment, user input device 130 is operable to configure, manage and / or control the operation of one or more components and / or modules in ultrasound system 100. In this regard, user input device 130 can be used to configure, manage and / or control the operation of transmitter 102, ultrasound probe 104, transmit beamformer 110, receiver 118, receive beamformer 120, RF processor 124, RF / IQ buffer 126, user input device 130, signal processor 132, image buffer 136, display system 134 and / or file 138. User input device 130 may include buttons, rotary encoders, touch screens, motion tracking, voice recognition, mouse devices, keyboards, cameras and / or any other devices capable of receiving user commands. In some embodiments, for example, one or more user input devices in user input device 130 may be integrated into other components (such as display system 134 or ultrasound probe 104). For example, user input device 130 may include a touch screen display.

[0031] Signal processor 132 may include suitable logic, circuitry, interfaces, and / or code operable to process ultrasound scan data (i.e., summed IQ signals) to generate an ultrasound image for presentation on display system 134. Signal processor 132 is operable to perform one or more processing operations based on multiple selectable ultrasound modalities on the acquired ultrasound scan data. In exemplary embodiments, signal processor 132 may be used to perform display processing and / or control processing, etc. Acquired ultrasound scan data can be processed in real time during a scanning session as echo signals are received. Alternatively or concurrently, ultrasound scan data may be temporarily stored in RF / IQ buffer 126 during a scanning session and processed in a less real-time manner during online or offline operation. In various embodiments, processed image data may be presented at display system 134 and / or stored at archive 138. Archive 138 may be a local archive, a Picture Archiving and Communication System (PACS), or any suitable device for storing images and related information.

[0032] Signal processor 132 may be one or more central processing units, microprocessors, microcontrollers, etc. For example, signal processor 132 may be an integrated component or may be distributed in various locations. In an exemplary embodiment, signal processor 132 may be able to receive input information from user input device 130 and / or file 138, generate output that can be displayed by display system 134, and manipulate the output in response to input information from user input device 130, etc. Signal processor 132 may be able to perform, for example, any of the methods and / or instruction sets discussed herein according to various embodiments.

[0033] The ultrasound system 100 is operable to continuously acquire ultrasound scan data at a frame rate suitable for the imaging situation under consideration. Typical frame rates are in the range of 20 to 120, but can be lower or higher. The acquired ultrasound scan data can be displayed on the display system 134 at the same, slower, or faster display rate as the frame rate. An image buffer 136 is included for storing frames of acquired ultrasound scan data that are not scheduled for immediate display. Preferably, the image buffer 136 has sufficient capacity to store frames of ultrasound scan data for at least several minutes. The frames of ultrasound scan data are stored in a manner that facilitates retrieval based on their acquisition order or time. The image buffer 136 can be embodied in any known data storage medium.

[0034] Figure 2 This is an illustration of a portion of an exemplary probe for an ultrasound system according to various embodiments. Reference Figure 2The image shows a probe 200 with transducer elements 202. Transducer elements 202 may resemble, for example, transmitting transducer element 106 and / or receiving transducer element 108. Each transducer element 202 may include, for example, a transducer 204 and a stress-skin backing panel 210. The stress-skin backing panel 210 may include, for example, a first skin layer and a second skin 212 sandwiching a core layer 214.

[0035] The transducer 204 can be any suitable transducer made of materials such as lead zirconate titanate (PZT), single crystal piezoelectric elements, or transducer types such as capacitive micromechanical ultrasonic transducers (CMUT).

[0036] The stress-skin backing panel 210 provides an acoustically effective absorption structure. The absorption level provided by the stress-skin backing panel 210 can depend on, for example, the transducer design and the targeted application. For example, the stress-skin backing panel 210 can provide an echo amplitude reflected at the bottom surface of the stress-skin backing panel 210 that is approximately 60 dB (or more) lower than the amplitude of the main echo received in the test apparatus. For example, the test apparatus may include a transducer piezoelectric element that is excited to cause the transducer to radiate sound waves in water in front of a fully reflective target. In the same manner, for example for catheter applications, the stress-skin backing panel 210 can provide a suppression level greater than, for example, 60 dB between waves reflected from the front (region of interest) and waves reflected from the opposite direction. Therefore, the stress-skin backing panel 210 can be used in a variety of applications, including those where there are constraints on thickness area and backing stiffness. These applications may include, for example, transducers mounted in catheters for intracardiac applications.

[0037] Transducer 204 may include, for example, at least one active layer (PZT, single crystal, etc.) and a set of matching layers. The total thickness of this subsystem may be, for example, several hundred micrometers, where the thickness can be driven by the frequency of transducer operation and the materials used. The degrees of freedom to significantly reduce the thickness of this subsystem may be limited. The thickness of the layers of devices (e.g., ASICs) incorporated into the stack to electrically drive the transducer are also limited to some extent by the technology and can be in the range of several hundred micrometers. Therefore, the space available for the backing may be limited to several hundred micrometers.

[0038] In various embodiments of this disclosure, the core layer 214 may include, for example, a polymer-based material, such as silicone or epoxy resin; carbon or polymer-based foam; or one or more types of graphite, such as, for example, pyrolytic graphite, graphene, etc. The first skin layer and the second skin layer 212 may include materials that can provide stiffness to the stress-skinned backing panel 210, such as, for example, tungsten carbide, brass, steel, silicon carbide, etc.

[0039] A portion of the acoustic energy incident on the stress-skin backing panel 210 can enter the core layer 214 from the stress-skin backing panel 210, and then the acoustic energy can be trapped in the core layer 214. The acoustic energy can be trapped in the core layer 214 due to a portion of the acoustic energy reflected at the core layer 214 and the skin layer 212. For example, a portion of the acoustic energy reflected from the skin layer 212 into the core layer 214 can be greater than a portion of the acoustic energy incident on the stress-skin backing panel 210 reflected from the skin layer 212. For the reflection coefficient R at the interface between the "core" material and the "skin" material, the portion of the acoustic energy reflected from the skin layer 212 into the core layer 214 can be given by Equation 1:

[0040] R=(Zskin-Zcore) / (Zskin+Zcore) Formula 1

[0041] Where "Zskin" is the acoustic impedance of the "skin" material, and "Zcore" is the acoustic impedance of the "core" material. It can be approximately 80 MRay. For example, when Zskin = 4 MRay and Zcore = 80 MRay, the reflection coefficient R is greater than 0.9. That is, the reflected energy is greater than 90% of the incident energy.

[0042] Figures 3 to 14 This is an illustration of an exemplary stress-skin backing panel according to various embodiments. Reference Figure 3 The diagram illustrates a stress-skin backing panel 210 having a skin layer 212 and a core layer 214. Support posts 320a and 320b are also shown. As shown, support post 320a is flush with the lower skin layer 212b and embedded in the upper skin layer 212a. Support post 320b is flush with the upper skin layer 212a and embedded in the lower skin layer 212b. The lower end of support post 320a can be attached to or adjacent to the lower skin layer 212b. Similarly, the upper end of support post 320b can be attached to or adjacent to the upper skin layer 212a. Therefore, support posts 320a and 320b can be alternately embedded in the upper or lower skin layer 212a to provide stiffness support for the stress-skin backing panel 210.

[0043] refer to Figure 4 The figure illustrates a stress-skin backing panel 210 having a skin layer 212, a core layer 214, and support columns 420. As shown, each support column 420 is embedded in the upper and lower skin layers 212. Therefore, the support columns 420 embedded in the skin layers 212 provide stiffness support for the stress-skin backing panel 210.

[0044] refer to Figure 5The figure illustrates a stress-skin backing panel 210 having a skin layer 212, a core layer 214, and support columns 520. As shown, each support column 520 may be flush with the upper and lower skin layers 212. The ends of the support columns 520 may be attached to or adjacent to the skin layer 212. Therefore, the support columns 420 provide stiffness support for the stress-skin backing panel 210.

[0045] refer to Figure 6 The figure illustrates a stress-skin backing panel 210 having a skin layer 212, a core layer 214, and support columns 620. As shown, the support columns 620, along with the upper and lower skin layers 212, may be a single piece that has, for example, been formed together as a single unit. Therefore, the support columns 620 provide stiffness support for the stress-skin backing panel 210.

[0046] refer to Figure 7 The figure shows a stress-skin backing panel 210 having a skin layer 212, a core layer 214, and support pillars 720a and 720b. As shown, support pillar 720a is flush with the lower skin layer 212, and support pillar 720b is flush with the upper skin layer 212. Therefore, support pillars 720a and 720b provide stiffness support for the stress-skin backing panel 210. Additionally, similar to... Figure 3 Various embodiments of this disclosure allow support columns 720a to be embedded in the lower skin layer 212b and support columns 720b to be embedded in the upper skin layer 212a. Furthermore, in some embodiments, the ends of support columns 720a and 720b in the core layer 214 may be enlarged to form feet 721 that help anchor the support columns 720a and 720b in the core layer 214. The ends of support columns 720a and 720b may be attached to or adjacent to the respective skin layer 212. Thus, support columns 720a and 720b can provide stiffness support for the stress-reinforced skin backing panel 210.

[0047] Various embodiments of this disclosure may have support columns with different shapes. For example, the horizontal cross-section of the support column may be circular, elliptical, rectangular, etc. Therefore, the support column may also extend in a direction perpendicular to the drawings (the direction extending into / out of the paper of the drawings).

[0048] refer to Figure 8The diagram illustrates a stress-skinned backing panel 210 having a skin layer 212 and a core layer 214. As shown, the surface of the skin layer 212 facing the core layer 214 can be an uneven surface. Therefore, a gap may exist between the skin layer 212 and the core layer 214. This gap may be filled with, for example, one or more epoxy resin materials 802 to allow the skin layer 212 to adhere to the core layer 214. While the epoxy resin material 802 may differ from the material used for the skin layer 212 or the core layer 214, various embodiments of this disclosure may make the epoxy resin material 802 the same as the material used for the core layer 214. This may be the case, for example, when the core layer 214 comprises an epoxy resin material or some other material that allows adhesion to the skin layer 212.

[0049] refer to Figure 9 The diagram shows a stress-skin backing panel 210 with a lower skin layer 212b, which has a structure similar to... Figure 8 The serrated surface of the skin layer 212 in the middle. (Reference) Figure 10 The diagram shows a stress-skinned backing panel 210 with skin layers 212a and 212b, both of which have similar characteristics to... Figure 8 The serrated surface of the skin layer 212 in the middle.

[0050] refer to Figure 11 The diagram shows a stress-skin backing panel 210 with a lower skin layer 212b having a rounded surface. (Reference) Figure 12 The diagram shows a stress-skinned backing panel 210 with skin layers 212a and 212b, both of which have rounded surfaces.

[0051] refer to Figure 13 The diagram shows a stress-skin backing panel 210 with a lower skin layer 212b having a triangular surface. (Reference) Figure 14 The diagram shows a stress-skinned backing panel 210 with skin layers 212a and 212b, both of which have triangular surfaces.

[0052] Therefore, it can be seen that regarding Figures 8 to 14 The described uneven surface can be used in any embodiment of this disclosure. Furthermore, while various specific examples are presented, it should be understood that any other uneven surface can be used for the skin layer. Moreover, a separate epoxy layer 802 can also be used for any stress-skin backing panel and / or the core layer 214 of any stress-skin backing panel may comprise an epoxy material. Additionally, it should be understood that any stress-skin backing panel may comprise, with respect to… Figures 3 to 7 Any of the support columns described, and any other support columns that can provide a similar structure.

[0053] Various embodiments of this disclosure can reduce interference between multiple echoes in the core layer 214 due to narrowband resonance, which can cause pseudo-waveforms that produce image artifacts in the transducer impulse response. Therefore, in various embodiments of this disclosure, one or both of the skin layers 212a and 212b may have a rough profile or grooves, or be shaped (bent, triangular, or any other shape) so that energy can diffuse in multiple directions rather than recombine in phase with the incident wave.

[0054] Figure 15 This is an illustration of exemplary propagation of sound waves according to various implementation schemes. (Reference) Figure 15 The diagram shows a stress-skin backing panel 210, which includes a core layer 214 sandwiched between skin layers 212. An incident acoustic wave 1500 from, for example, a transducer 204 is shown. The incident acoustic wave 1500 propagates in an undesirable direction. After reaching the upper skin layer 212a, a portion of the incident acoustic wave 1500 is reflected as a reflected acoustic wave 1501, and another portion travels as a sound wave 1502 to the core layer 214.

[0055] After reaching the lower skin layer 212b, a portion of the acoustic wave 1502 is reflected as acoustic wave 1510, and a portion of the acoustic wave 1502 is propagated as acoustic wave 1504 from the stress skin backing panel 210.

[0056] After reaching the upper skin layer 212a, a portion of the acoustic wave 1510 is reflected as acoustic wave 1511, and a portion of the acoustic wave 1510 propagates out of the stress skin backing panel 210 as acoustic wave 1512. The reflection / propagation of acoustic wave 1511 can continue in a similar manner to acoustic wave 1502.

[0057] Therefore, it can be seen that reducing sound waves 1501 and 1512 can reduce image artifacts.

[0058] In various embodiments of this disclosure, a vertical cross-section of a stress-skin backing panel 210 having an upper skin layer and a lower skin layer 212 has been shown. However, various embodiments of this disclosure may also include additional skin layers covering one or more of the other circumferential surfaces of the stress-skin backing panel 210. For example, Figure 16 A side surface of the stress-skin backing panel 210 covered by skin layer 1600 is shown. Similarly, the front and rear surfaces of the stress-skin backing panel 210 may also be covered by corresponding skin layers. Various embodiments of this disclosure allow all skin layers (212, 1600, etc.) to be aligned with the relevant... Figures 2 to 14The described skin layers are similar, or different skin layers may have different properties (e.g., sound energy reflection properties). As previously mentioned, an epoxy resin layer 213 may be present between skin layer 212 and / or 1600 and core layer 214.

[0059] Figure 17 This is a graphical representation of a finite element simulation of an exemplary embodiment. (Reference) Figure 17 Figure 1700 illustrates the curves, where the sound frequency is along the X-axis and the sound level (sound pressure) is on the Y-axis. Figure 1700 shows the frequency-dependent sound pressure transmitted through transducer element 202 when it receives a sound wave.

[0060] Graph 1710 is shown for a conventional backing panel and graph 1720 for an embodiment of a stress-skinned backing panel. Interpolation linear graphs 1712 and 1722 for graph 1710 and graph 1720, respectively, are shown. As can be seen from interpolation graphs 1712 and 1722, the stress-skinned backing panel provides approximately 20 dB better back / foreground suppression than the conventional backing panel.

[0061] Figure 18 Exemplary transducer structures for catheter applications according to various embodiments are shown. References Figure 18 Transducer structures 1810 and 1820 are shown. Transducer structure 1810 includes a conduit end acoustic window 1830, a matching layer 1832, a piezoelectric layer 1834, a dematching layer 1835, a connecting layer 1836, a stress skin backing panel 1838 similar to the stress skin backing panel 210, and a conduit end 1840.

[0062] Sound waves can be generated by a transmitting transducer in the piezoelectric layer 1834 to propagate through the acoustic window 1830 at the end of the conduit. The transmitting transducer can be similar to, for example, transmitting transducer element 106.

[0063] Matching layer 1832 can be designed to maximize the propagation of acoustic waves generated in piezoelectric layer 1834 toward the target to be scanned. Dematching layer 1835 can be designed to maximize the reflection of propagated acoustic waves toward conduit end 1840. Due to the short propagation delay before the acoustic waves reflected from dematching layer 1835 are received by the receiving transducer, the acoustic waves from dematching layer 1835 can be filtered out by a receiving gate that is turned on after the short propagation delay. The receiving transducer can be similar to, for example, receiving transducer element 108.

[0064] Therefore, less sound waves can propagate to the stress-skin backing panel 1838, which is similar to the stress-skin backing panel 210. Consequently, less sound waves can be reflected from the stress-skin backing panel 1838 to the receiving transducer that may be located in the piezoelectric layer 1834.

[0065] The connection layer 1836 may include various processing devices, such as processors, application-specific integrated circuits (ASICs), controllers, etc., supporting logic / circuits, and interconnections between various electronic devices to control the generation and reception of sound waves. The connection layer 1836 may also include an acoustic matching layer and / or a dematching layer.

[0066] The transducer structure 1820 is similar to the transducer structure 1810, but it does not have the dematching layer 1835.

[0067] Furthermore, various embodiments of this disclosure may incorporate a thermally conductive material into the core layer 114, enabling the stress-reinforced skin backing panel 210 to function as a heat sink. The thermally conductive material may include, for example, metal particles, one or more types of graphite, such as pyrolytic graphite, graphene, etc. Additionally, when using epoxy resin to adhere the skin layers 212, 1600, etc., to the core layer 114, the epoxy resin may be a thermally conductive epoxy resin.

[0068] Therefore, it can be seen that this disclosure provides a stress-skin backing panel 210 for a transducer 204 of an ultrasound scanner probe 200, the stress-skin backing panel including a core layer 214 sandwiched between a first skin layer and a second skin layer 212. The transducer 204 may include a front portion and a rear portion, wherein the front portion of the transducer 204 points toward a target of the ultrasound scanner probe 200. The first skin layer 212a may be adjacent to the rear portion of the transducer 204. The first skin layer 212a may be directly adjacent to the transducer 204.

[0069] The core layer 214 may include an epoxy resin material. The core layer 214 may also include a silicone resin-based material. One or both of the first skin layer 212a or the second skin layer 212b may include tungsten carbide. The stress-skin backing panel 210 may include a thermally conductive element for conducting heat generated by the transducer 204. The thermally conductive element may include, for example, one or both of metal particles and graphite, wherein the graphite may include, for example, one or more of pyrolytic graphite, graphene, etc.

[0070] The stress-sensitive skin backing panel 210 may include support columns 320, 420, etc., connected to one or both of the first skin layer 212a and the second skin layer 212b. The support columns may be made of the same material as one or both of the first skin layer 212a and the second skin layer 212b. One or both of the first skin layer 212a and the second skin layer 212b may be a single piece having support columns.

[0071] The first skin layer 212a and the second skin layer 212b may each include a first side facing the core layer 214, and one or both of the respective first sides may be substantially uneven surfaces.

[0072] The first portion of the first acoustic wave in the core layer 214 reflected by the first skin layer 212a or the second skin layer 212b may be greater than the second portion of the second acoustic wave outside the stress skin backing panel 210 reflected by the first skin layer 212a or the second skin layer 212b.

[0073] The epoxy resin material may be a conductive epoxy resin material, which can be used to adhere the first skin layer 212a and / or the second skin layer 212b to the core layer 214. One or more circumferential surfaces of the core layer not covered by the first skin layer 212a and the second skin layer 212b may be covered by the third skin layer 900.

[0074] This disclosure may also provide a stress-skin backing panel 210, which includes a core layer 214 sandwiched between a first skin layer 212a and a second skin layer 212b, and support pillars 320, 420, etc., connected to one or both of the first skin layer 212a and the second skin layer 212b. The core layer 214 may include one or both of an epoxy resin material and a silicone resin-based material, wherein the transducer 204 may include a front portion and a rear portion. The front portion of the transducer 204 points in the direction of the target of the ultrasonic scanner probe, and the first skin layer 212a is adjacent to the rear portion of the transducer 204.

[0075] One or both of the first skin layer 212a or the second skin layer 212b may comprise tungsten carbide. The stress-skin backing panel 210 may include a thermally conductive element for conducting heat generated by the transducer 204. The thermally conductive element may comprise one or both of metal particles and graphite, wherein the graphite may include one or more of, for example, pyrolytic graphite, graphene, etc. The first skin layer 212a and the second skin layer 212b may each include a first side facing the core layer 214, and one or both of the respective first sides may be substantially non-flat surfaces.

[0076] As used herein, “and / or” refers to any one or more items in a list linked by “and / or”. For example, “x and / or y” refers to any element in the three-element set {(x),(y),(x,y)}. As another example, “x, y and / or z” refers to any element in the seven-element set {(x),(y),(z),(x,y),(x,z),(y,z),(x,y,z)}. As used herein, the term “exemplary” means used as a non-limiting example, instance, or illustration. As used herein, the terms “e.g.” and “for example” introduce a list of one or more non-limiting examples, instances, or illustrations.

[0077] Therefore, this disclosure can be implemented using various materials. While this disclosure has been described with reference to certain embodiments, those skilled in the art will understand that various changes and substitutions can be made without departing from the scope of this disclosure. Furthermore, many modifications can be made to adapt particular situations or materials to the teachings of this disclosure without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the specific embodiments disclosed, but rather to include all embodiments falling within the scope of the appended claims.

Claims

1. A stress-skin backing panel for a transducer of an ultrasonic scanner probe, the stress-skin backing panel comprising: A core layer, the core layer including a top surface, a bottom surface and a circumferential surface extending between the top surface and the bottom surface; The first skin layer completely covers the top surface of the core layer; and The second skin layer completely covers the bottom surface of the core layer. in: The transducer includes a front section and a rear section. The front portion of the transducer points in the direction of the target of the ultrasonic scanner probe, and The first skin layer is adjacent to the rear portion of the transducer.

2. The stress-skin backing panel according to claim 1, wherein the first skin layer is directly adjacent to the transducer.

3. The stress-skin backing panel according to claim 1, wherein the core layer comprises an epoxy resin material.

4. The stress-skinned backing panel according to claim 1, wherein the core layer comprises a silicone-based material.

5. The stress-skinned backing panel of claim 1, wherein one or both of the first skin layer or the second skin layer comprises tungsten carbide.

6. The stress-skin backing panel of claim 1, wherein the stress-skin backing panel includes at least one thermally conductive element for conducting heat generated by the transducer.

7. The stress-skinned backing panel of claim 6, wherein the at least one thermally conductive element comprises one or both of metal particles and graphite.

8. The stress-skin backing panel of claim 1, wherein the stress-skin backing panel includes a support column connected to one or both of the first skin layer and the second skin layer.

9. The stress-skin backing panel of claim 8, wherein the stress-skin backing panel includes support columns, wherein the support columns comprise the same material as one or both of the first skin layer and the second skin layer.

10. The stress-skin backing panel of claim 8, wherein one or both of the first skin layer and the second skin layer are a single piece having the support column.

11. The stress-skinned backing panel of claim 1, wherein the first skin layer and the second skin layer each include a first side facing the core layer, and one or both of the respective first sides are non-flat surfaces.

12. The stress-skin backing panel of claim 1, wherein a first portion of a first acoustic wave in the core layer reflected by the first skin layer or the second skin layer is greater than a second portion of a second acoustic wave outside the stress-skin backing panel reflected by the first skin layer or the second skin layer.

13. The stress-skin backing panel according to claim 1, wherein the stress-skin backing panel comprises an epoxy resin material for adhering the first skin layer and the second skin layer to the core layer.

14. The stress-skin backing panel of claim 13, wherein the epoxy resin material is a conductive epoxy resin material.

15. The stress-skinned backing panel of claim 1, wherein one or more circumferential surfaces of the core layer not covered by the first skin layer and the second skin layer can be covered by a third skin layer.

16. A stress-skin backing panel for a transducer of an ultrasonic scanner probe, the stress-skin backing panel comprising: A core layer, the core layer including a top surface and a bottom surface opposite the top surface; The first skin layer completely covers the top surface of the core layer; and The second skin layer completely covers the bottom surface of the core layer; and A support column, the support column being connected to one or both of the first skin layer and the second skin layer. in: The core layer comprises one or both of epoxy resin and silicone resin-based materials. The transducer includes a front section and a rear section. The front portion of the transducer points in the direction of the target of the ultrasonic scanner probe, and The first skin layer is adjacent to the rear portion of the transducer.

17. The stress-skinned backing panel of claim 16, wherein one or both of the first skin layer or the second skin layer comprises tungsten carbide.

18. The stress-skin backing panel of claim 16, wherein the stress-skin backing panel includes at least one thermally conductive element for conducting heat generated by the transducer.

19. The stress-skinned backing panel of claim 18, wherein the at least one thermally conductive element comprises one or both of metal particles and graphite.

20. The stress-skinned backing panel of claim 16, wherein the first skin layer and the second skin layer each include a first side facing the core layer, and one or both of the respective first sides are non-flat surfaces.

Images