Air-tight connector and method of manufacturing the same

Abstract

The present application provides a hermetic connector and a manufacturing method thereof, which can have dense circuit wiring without using a mask. The hermetic connector has a skin portion and a non-skin portion on the surface of a connector base having a hole formed by injection molding of synthetic resin or the like, and has a conductive portion formed as a unitary member in close contact with the surface of the non-skin portion that is roughened and covering the hole.

Description

Technical Field

[0001] The present invention relates to a hermetic connector that maintains airtightness and provides electrical connection via conductive terminals, and a method for manufacturing the same. Background Technology

[0002] Previously, the performance of small electronic components was significantly affected by moisture and the viscosity of sealing gases. Therefore, to prevent corrosion of internal circuits due to humidity and malfunctions caused by changes in gas viscosity, they were sealed using vacuum or inert gases. Furthermore, to enable electronic components to operate in vacuum / pressure / liquid / gas environments, sealed containers are used. Power is introduced without compromising the airtightness of the sealed container, or airtight (sealed) connectors are used to extract internal sensor signals.

[0003] As described in Patent Documents 1 and 2, existing airtight connectors have the following features: a through hole is provided in an insulating substrate such as a ceramic plate, glass epoxy board, or metal plate used to isolate internal and external ambient gases; a metal pin for electrical connection is inserted into the through hole; and the gap is filled by glass sealing, silver soldering, tin soldering, or the like to achieve the connection.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2006-40766

[0007] Patent Document 2: Japanese Patent Application Publication No. 2013-89313 Summary of the Invention

[0008] The technical problem that the invention aims to solve

[0009] In hermetic connectors used in small electronic components, their hermeticity was tested in ultra-fine leak detection tests at the level of 1×10⁻¹⁵ Pa / m³ / s (He) and fine leak detection tests at the level of 1×10⁻⁹ Pa / m³ / s (He). In the aforementioned prior art hermetic connectors, bonding problems arise during manufacturing due to soldering or tin-soldering, and cracks develop due to aging, resulting in a failure to ensure a good seal. Furthermore, alternatives to soldering or tin-soldering include techniques that use glass to fill the gap between the insulating substrate and the metal leads, achieving a high-temperature thermal fusion bond. However, this requires bonding three materials with different coefficients of linear expansion: the substrate, the metal leads, and the glass. Because there is an interface in the through-hole direction, gaps easily form between the substrate and the glass, and between the glass and the metal leads, making it difficult to reliably prevent leakage. This leads to lower product yield and increased cost for this type of hermetic connector.

[0010] In addition, in the electrical / electronics field, thermoplastic synthetic resins with good corrosion resistance, insulation, and suitability for injection molding are widely used not only for substrate mounting but also for component housings. Liquid crystal polymer (LCP) resins, in particular, offer numerous advantages such as good flowability during molding, high heat resistance, and good chemical resistance. However, LCP resins also suffer from drawbacks such as anisotropy in molded products and low weld strength. To mitigate these shortcomings, modifications are made by filling with materials like glass fibers. Furthermore, inorganic fillers such as glass microspheres and calcium pyrophosphate are used for reinforcement to improve elasticity and strength. In recent years, there has been an increasing need for hermetic connectors to form circuit wiring for mounting small electronic components. Therefore, there is a need for a hermetic connector and its manufacturing method that can form dense circuit wiring without increasing manufacturing costs through a masking process.

[0011] Technical solutions for solving technical problems

[0012] (1) The airtight connector of the first embodiment of the present invention is an airtight connector for maintaining the airtightness between a first space and a second space and electrically connecting a first conductor in the first space and a second conductor in the second space. The airtight connector is characterized in that it has a connector base with an insulator, the connector base is provided with a hole communicating with the first space and the second space, and has a partition wall portion that divides the two spaces by a portion other than the hole. The first surface of the connector base has a first skinned portion and a first unskinned portion, and has a first conductive portion, such as a plated portion, formed in close contact with the roughened surface of the first unskinned portion and as an integral part covering the hole.

[0013] With the above structure, the conductive portion of the plugged hole can maintain the airtightness between the first and second spaces, and electrically connect the first and second conductors, achieving good conductivity and high airtightness. Furthermore, by forming the conductive portion into a loop wiring, electronic components can be mounted on it.

[0014] (2) In the airtight connector of the second embodiment of the present invention, the airtight connector based on (1) is characterized in that the second surface of the connector base located on a surface different from the first surface, for example, the opposite side, has a second skinned portion and a second unskinned portion, and has a second conductive portion formed in close contact with the roughened surface of the second unskinned portion and electrically connected to the first conductive portion.

[0015] The above structure enables high airtightness and also forms circuit wiring for mounting electronic components not only on the upper surface of the connector base, but also on the lower surface.

[0016] (3) The airtight connector of the third embodiment of the present invention is an airtight connector for maintaining the airtightness between the first space and the second space and electrically connecting the first conductor in the first space and the second conductor in the second space. The airtight connector is characterized in that it has a connector base with an insulator, the connector base is provided with a hole communicating with the first space and the second space, and has a partition wall portion that divides the two spaces by the portion other than the hole. The connector base is an injection molded article of synthetic resin. The first surface of the connector base has a first skinned portion and a first unskinned portion. The surface of the unskinned portion has a recess and a conductive portion formed in such a way as to enter the recess and as an integral part of the covering hole.

[0017] With the above structure, by utilizing the high tightness of the conductive part and the skinless part, high airtightness and high tightness of the contact that can withstand the installation of electronic components can be obtained.

[0018] (4) The manufacturing method of the airtight connector according to the first embodiment of the present invention is a manufacturing method of an airtight connector for maintaining the airtightness between the first space and the second space and electrically connecting the first conductor in the first space and the second conductor in the second space. The manufacturing method is characterized by comprising: a connector base forming step, which forms a connector base having a hole communicating between the first space and the second space and having a skin layer on its surface by injection molding of synthetic resin; a hole plugging step, which fills the hole with a molded body; a first skin layer removal step, which selectively removes the skin layer on a portion of the surface of the connector base to form a first unskinned portion; a first conductive portion forming step, which forms a first conductive portion on the surface of the first unskinned portion and the molded body; and a molded body removal step, which removes the molded body.

[0019] With the above structure, conductive parts can be formed without the need for a mask, and loop wiring can be performed in the hermetic connector by selectively forming conductive parts.

[0020] (5) The manufacturing method of the airtight connector according to the second embodiment of the present invention is based on the manufacturing method of (4), characterized in that it further includes a first roughening process for roughening the first unskinned portion, a first conductive portion forming process for forming a first conductive portion on the surface of the roughened first unskinned portion and the molded body, and includes: a second skin layer removal process for selectively removing the skin layer from a portion of the surface of a surface different from the surface of the roughened surface where the skin layer was removed in the first skin layer removal process; a second roughening process for roughening the second unskinned portion where the skin layer was removed in the second skin layer removal process; and a second conductive portion forming process for forming a second conductive portion electrically connected to the first conductive portion on the second unskinned portion roughened in the second roughening process.

[0021] With the above structure, high airtightness of the airtight connector can be achieved without the use of a mask, and loop wiring for mounting electronic components can be formed not only on the upper surface side of the connector base, but also on the lower surface side, for example.

[0022] (6) The manufacturing method of the airtight connector according to the first embodiment of the present invention is a manufacturing method for an airtight connector used to maintain the airtightness between a first space and a second space and to electrically connect a first conductor in the first space and a second conductor in the second space. The manufacturing method is characterized by comprising: a connector base forming step, which forms a connector base having a hole communicating between the first space and the second space and having a skin layer on its surface by injection molding of synthetic resin; a hole plugging step, which fills the hole with a molded body; a first skin layer removal step, which selectively removes the skin layer on a portion of the surface of the connector base by laser processing to form a first unskinned portion; a roughening step, which forms a recess on the surface of the unskinned portion by chemical etching; a conductive portion forming step, which forms a conductive portion on the surface of the unskinned portion and the molded body by plating in such a way that metal enters the recess; and a molded body removal step, which removes the molded body.

[0023] With the above structure, without the need for a mask, a coated portion can be formed on the surface of the core layer without the skin layer removed, and a loop wiring for mounting electronic components on the surface of the connector base can be formed at low cost.

[0024] The effects of the invention

[0025] According to the present invention, a hermetically sealed connector structure with dense loop wiring can be achieved without using masks that increase manufacturing costs. Attached Figure Description

[0026] Figure 1 This is a cross-sectional overview diagram showing a structural example of an airtight connector to which the present invention is applied.

[0027] Figure 2 (A) is a cross-sectional schematic view showing the structure of an airtight connector according to one embodiment of the present invention. Figure 2 (B) is a partially enlarged view.

[0028] Figure 3 (A) means Figure 2 A cross-sectional view of a portion of the structure of the airtight connector of the illustrated embodiment. Figure 3 (B) is a bottom view showing its structural overview. Figure 3 (C) is a side view showing its structural overview.

[0029] Figure 4 It means Figure 3Cross-sectional overview of steps (A) to (E) of the manufacturing method of the airtight connector with the structure shown.

[0030] Figure 5 It means Figure 3 Cross-sectional overview of steps (F) to (I) of the manufacturing method of the airtight connector with the structure shown.

[0031] Figure 6 This is a cross-sectional overview diagram illustrating a method for manufacturing an airtight connector according to another embodiment of the present invention. Detailed Implementation

[0032] Hereinafter, with reference to the accompanying drawings, one embodiment of the present invention will be described. Figure 1 This is a cross-sectional schematic diagram illustrating an example of an airtight connector to which the present invention is applied. Figure 1 In this design, the connector base 1 of the insulator is molded, for example, from a polyester-based liquid crystal polymer (LCP), and has a partition 4 dividing the first space 2 and the second space 3. It should be noted that, during the molding of the connector base 1, appropriate fillers (fillers) may be included to improve the properties of the liquid crystal polymer (LCP). Typically, one space is, for example, a vacuum / pressure / liquid / gas environment, and the other space is, for example, an atmospheric environment for housing electronic components. It should be noted that electronic components are sometimes also installed in spaces such as vacuum / pressure / liquid / gas environments.

[0033] Besides their applications in aerospace, defense, and security, airtight connectors are also used in many industrial fields such as air conditioning compressors, gas sensors, flow sensors, and medical sensors. The shape of the connector base 1 varies depending on the application of the airtight connector, and may be approximately cylindrical or rectangular.

[0034] A hole 5 is provided in the partition wall portion 4, and a conductive coating portion 6 of copper or the like with a thickness of about 25 μm is formed to cover the hole 5 and its surrounding area. In this example, the coating portion 6 is formed in order to cover the hole 5 and its surrounding area.

[0035] Pins 7 and 8 are brazed on one side of the portion covering the hole 5 of the plated part 6. Pins 7 and 8 are components for electrical connection that have been plated with gold, tin, or the like on the surface of a substrate such as pure copper, brass, or phosphor bronze. Brazing is performed by tin soldering, silver soldering, or gold-tin (AuSn) bonding under high-frequency induction heating (IH). In case of leakage of LCP raw materials, epoxy resin, epoxy resin impregnation, or acrylic resin impregnation sealing parts 9 and 10 may also be provided. In the above-described hermetic connector, a structure is formed in which the plated part 6 maintains an airtight seal and provides an electrical connection. In particular, because the plated part 6 is formed to cover the hole 5 and its periphery, the contact area between the partition wall part 4 and the plated part 6 is increased. Therefore, when a force is applied to the pins 7 and 8, the plated part 6 is difficult to peel off from the partition wall part 4, and the breaking strength of the hermetic connector is improved. The plated part 6 is in close contact with the partition wall part 4 and is formed as a single or integral component relative to the portion covering the hole 5. It should be noted that when a coating layer with increased thickness is formed through repeated chemical plating and electroplating, it can also be formed as an integral or separate component.

[0036] Next, refer to Figure 2 An embodiment of the airtight connector of the present invention will be described. Figure 2 In (A), a simplified diagram is shown. Figure 1 The structure shown has the same cross-sectional structure. Figure 2 In (A), the connector base 20 is an injection-molded body of synthetic resin, such as LCP (liquid crystal polymer), formed into a structure consisting of a surface skin layer 11 and an inner core layer 12. During the injection molding process, a structure called a skin layer with a thickness of approximately 0.1 mm to 0.3 mm exists on the surface of the molded part where the liquid crystal polymer (LCP) resin contacts the mold. The formation of the skin layer is considered to be related to the mold temperature, holding pressure, and resin temperature. To reduce molding compression and improve the dimensional accuracy of the molded part, it is necessary to stably form the skin layer. On the other hand, even if a loop pattern is formed on this skin layer, damage may occur in the skin layer portion, causing the conductor portion to peel off from the substrate. In reality, the thickness of the skin layer 11 varies depending on the injection conditions, and is approximately 0.1 mm to 0.3 mm. Figure 2 (A) is shown schematically and is not related to the actual ratio of the thickness to the core layer.

[0037] A coated portion 6 is formed on the upper surface of the connector base 20 where the skinless layer 11 is not covered. The portion of the connector base 20 without the coated portion 6 is a skinned portion 21 with the skinned layer 11, and a skinless portion 22 is formed below a portion of the coated portion 6, where the core layer 12 is exposed. The surface of the core layer 12 in this skinless portion 22 is a rough surface with uneven surfaces, which improves the tight contact with the coated portion 6 and reliably prevents leakage. Figure 2 In (A), the dashed lines represent rough surfaces with uneven surfaces.

[0038] The coated portion 6 is in close contact with the roughened core layer 12 and is formed as a single or integral component relative to the portion covering the hole 5. It should be noted that even when the coated portion is formed with increased thickness through repeated chemical plating and electroplating, it is still formed as a single or integral component. In the unskinned portion 22 on the lower surface side of the connector base 20, the coated portion 26 is also in close contact with the roughened core layer 12 and is electrically connected to the coated portion 6. Because the coated portions 6 and 26 are formed on the roughened core layer 12, the coating material penetrates the uneven surface, increasing the adhesive strength and thus providing sufficient strength for mounting electronic components. It should be noted that in the hermetic connector of this embodiment, because the connector base 20 is covered by the skin layer 11 or the coated portions 6 and 26, it has high gas barrier properties. Furthermore, the skinned portion 21, where the coated portions 6 and 26 are not formed, has higher mechanical strength because of the remaining skin layer.

[0039] Figure 2 (B) is Figure 2 A magnified view of part 29 in (A). Figure 2 In (B), the core layer 12 contains a large amount of additive 15 that has been injection molded together with the liquid crystal polymer resin. Only one additive is illustrated in the figures. The surface of the core layer 12 without the skin 22 has, for example, multiple recesses showing traces of the additive 15 removed by chemical etching. The coating portion 6 is formed by inserting metal into these recesses.

[0040] Figure 3 This diagram schematically illustrates the connector base in one embodiment of the airtight connector of the present invention. The connector base 30 is molded, for example, from an LDS material used for manufacturing injection-molded circuit components (MIDs) via LDS (Laser Direct Structuring), in this example using a liquid crystal polymer (LCP) resin. It should be noted that other suitable LDS materials include thermoplastics such as acrylonitrile butadiene (ABS) resin, polycarbonate (PC) resin, PC / ABS resin, polycarbonate (PC) + polyethylene terephthalate (PET) resin, polyphthalamide (PPA) resin, polyamide / polyphthalamide (PA / PPA) resin, polybutylene terephthalate (PBT) resin, cyclic olefin polymer (COP) resin, polyphenylene ether (PPE) resin, polyetherimide (PEI) resin, and polyetheretherketone (PEEK) resin, as well as thermosetting resins such as phenol and epoxy.

[0041] Furthermore, for synthetic resin molded articles other than LDS molding materials, the material can be any thermoplastic or thermosetting resin that can firmly adhere to the metal film. However, considering that the molded article will undergo harsh processing such as welding later, a resin with high heat resistance and good mechanical strength is preferred. In addition, from the perspective of mass production, thermoplastic resins that can be injection molded are preferred. For example, aromatic polyesters, polyamides, polyacetals, polycarbonates, polyaryl sulfides, polysulfones, polyphenylene ethers, polyimides, polyetherketones, polyarylates, and combinations thereof can be included. Liquid crystal polymers (such as liquid crystal polyesters and polyesteramides) and polyaryl sulfides are particularly suitable from the perspectives of high melting point, high strength, high rigidity, and processability, but are not limited to these. In addition, to improve the tight contact of the metal film, appropriate substances such as easily etchable substances can be added to the material as needed.

[0042] like Figure 3 As shown in (A), the upper surface of the connector base 30 is... Figure 2 Similar to the connector base 20, a coated portion 6 is formed on the unskinned portion 22, which fills the hole 5. A skinned portion 21 and an unskinned portion 22 are also formed on the lower surface of the connector base 30. A coated portion 36 is formed on the roughened surface of the core layer 12 of the unskinned portion 22. This coated portion 36 is electrically connected to the coated portion 6. Furthermore, a coated portion 37 formed on this coated portion 36 is also electrically connected to both the coated portion 36 and the coated portion 6. It should be noted that the coated portions 6, 36, and 37 form a single, integrated coated portion.

[0043] Figure 3 (B) indicates the lower surface of the connector base 30, where the plating portion 37 has a loop pattern of plating portions 37A, 37B, and 37C. Plating portion 37A is... Figure 2 The portion corresponding to the coating section of the filling hole 5, the coating section 37B forms a circuit wiring that is electrically connected to the coating section 37A, and the coating section 37C forms a circuit wiring that is electrically insulated from the coating section 37A. Figure 3 (C) indicates the side surface of the connector base 30. The plated portion 37D formed on the side surface is electrically connected to the plated portion 37A via the plated portion 37B. In this way, circuit wiring is formed on the upper surface, lower surface, and side surface of the connector base 30, allowing small electronic components to be mounted on it.

[0044] Next, refer to Figure 4 and Figure 5 ,right Figure 2 and Figure 3 The manufacturing method of the shown hermetic connector will be described. Figure 4In process (A), synthetic resins such as LCP (liquid crystal polymer), PPA, PA, and thermosetting resin are first injection molded together with additives to form a connector base 30 with holes 5. As described above, the connector base 30 formed by injection molding liquid crystal polymer (LCP) resin has a skin layer 11 on the outside and a core layer 12 on the inside.

[0045] The preferred material for the connector base 30 is an aromatic liquid crystal polymer, polysulfone, polyether polysulfone, polyarylsulfone, polyetherimide, polyester, acrylonitrile-butadiene-styrene copolymer resin, polyamide, modified polyphenylene ether resin, norbornene resin, phenolic resin, epoxy resin, polyphenylene sulfide resin (PPS) resin, polybutylene terephthalate (PBT) resin, etc. More preferably, it is a polyester liquid crystal polymer that exhibits heat resistance and a coefficient of thermal expansion close to that of metals over a wide temperature range, possesses the same elasticity as a metal film, and displays the same good properties as a metal film in thermal cycling tests.

[0046] In addition, to improve the anisotropy and low welding strength of the molded product, or to enhance elasticity and strength, the connector base 30 may be injection molded using one or more of the following as fine powder additives: glass microspheres, glass beads, glass powder, elements of Group II of the periodic table and their oxides, sulfates, phosphates, silicates, carbonates, or elements of aluminum, silicon, tin, lead, antimony, bismuth and their oxides. Oxides of elements of Group II of the periodic table include compounds such as magnesium oxide, calcium oxide, barium oxide, and zinc oxide; phosphates include compounds such as magnesium phosphate, calcium phosphate, barium phosphate, zinc phosphate, magnesium pyrophosphate, and calcium pyrophosphate; sulfates include compounds such as magnesium sulfate, calcium sulfate, and barium sulfate; silicates include compounds such as magnesium silicate, calcium silicate, aluminum silicate, kaolin, talc, clay, diatomaceous earth, and wollastonite; and carbonates include compounds such as calcium carbonate, magnesium carbonate, barium carbonate, and zinc carbonate. Phosphates are particularly preferred. Alternatively, in addition to the above, it is preferable to select one or more from the group consisting of amphoteric metal elements such as zinc, aluminum, silicon, tin, lead, antimony, and bismuth, or oxides of the above elements, especially amphoteric metal elements such as zinc, aluminum, tin, and lead and their oxides.

[0047] The particle size of the aforementioned fine powder inorganic filler or additive is preferably in the range of 0.01 μm to 100 μm with an average particle size, preferably 0.1 μm to 30 μm, and more preferably 0.5 μm to 10 μm. Alternatively, organic materials such as butadiene can be used as additives in injection molding. The total amount of the additive is preferably, for example, about 25% to about 55% by weight of the polymer composition. The particle size of the aforementioned fine powder inorganic filler is preferably in the range of 0.01 μm to 100 μm with an average particle size, preferably 0.1 μm to 30 μm, and more preferably 0.5 μm to 10 μm.

[0048] In step (B), the lower side surface inside the hole 5 of the connector base 30 is roughened by etching. Then, a molded body 40 is formed using acrylonitrile / butadiene / styrene (ABS) resin, biodegradable resin, etc., to fill the hole 5.

[0049] Next, in step (C), the skin layer 11 corresponding to the holes and surrounding areas on the lower surface of the connector base 30 is removed by laser processing. Laser processing involves selectively etching away the portion of the skin layer 11 by irradiating the surface of the skin layer 11 with a laser beam. For example, a skin layer with a line width of 0.126 mm and a spacing of 0.126 mm is removed using a 3.5W laser output, a frequency of 200 kHz, and an etching rate of 3 m / s. This forms a skinless portion 22. In the skinless portion 22, the core layer 12 is exposed. As a result, a skinned portion 21 and a skinless portion 22 are formed on the lower surface of the connector base 30.

[0050] The laser beam irradiating the skin layer 21 is a YAG laser, carbon dioxide laser, or similar type. A laser marking machine with a computer-controlled XY-axis scanning mechanism selectively irradiates a pre-set loop pattern. Furthermore, when forming loops on complex three-dimensional molded products, the laser beam can be guided in a three-dimensional direction using optical fibers, prisms, etc., allowing for accurate three-dimensional irradiation of a specified area under computer control. Alternatively, three-dimensional irradiation can be achieved by combining a laser marking machine with an XY-axis scanning mechanism with a five-axis worktable that moves synchronously in the XYZ directions, as well as rotation and tilting, all controlled by a computer. Additionally, this method offers the advantage of easily creating and modifying patterns simply by changing the drawing program for the laser irradiation area.

[0051] Furthermore, since it is difficult to change the spot diameter and make the spot diameter variable to irradiate the laser beam within the same process, when it is desired to remove the width of multiple mixed skin layers, the irradiation can be performed by moving the Z-axis, deviating the laser focal position, increasing the laser spot diameter, or irradiating the overlapping parts of the laser multiple times.

[0052] Lasers can range from UV lasers to CO2 lasers, such as UV lasers with a wavelength of 355nm, green lasers with a wavelength of 532nm, hybrid lasers with a wavelength of 1064nm, YVO4 lasers, YAG lasers, fiber lasers with a wavelength of 1090nm, and CO2 lasers with a wavelength of 10600nm.

[0053] UV lasers are characterized by high absorption and low thermal stress regardless of the material. Green lasers, due to their shorter wavelength, have high energy and high absorption rate. Depending on the object and purpose, various laser types can be used, such as YVO4 lasers (high peak power / short pulse lasers for high-quality and fine processing), fiber lasers (long pulse lasers suitable for heating and deep drilling), and YAG lasers (lower quality but high heat generation). CO2 lasers are frequently used for marking paper, resin, glass, and ceramics; their wavelength can also be absorbed by transparent materials, and they are also used for marking thin films. By achieving high output, they can also be used for gate cutting of molded products and cutting of PET sheets.

[0054] To remove the skin layer 11 without damaging the core layer 12, the aforementioned laser is used under appropriate conditions such as laser power, scanning speed, frequency, number of prints, and printing position. For example, based on an energy of 0.1 W / mm... 2 ~1W / mm 2 The wavelength of the laser is also a factor. For example, it is 0.2W to 0.5W for YAG lasers and 1.5W to 4.5W for YVO4 lasers. By changing parameters such as scanning speed, frequency, and number of printing passes, the processing accuracy can be improved.

[0055] A laser beam with appropriately adjusted output and laser spot diameter is irradiated onto the surface of the connector base 30 to selectively remove the skin layer 11 from that portion. The laser spot diameter and the width of the removed skin layer 11 are particularly important. If the removed width is too narrow, a short circuit in the conductive circuit may occur due to etching in the next process, which is undesirable. Therefore, a wider removed skin layer is preferable, provided it does not hinder circuit formation. When using a laser beam with a spot diameter smaller than 50 μm, the energy density is higher, allowing the skin layer to be removed with a width wider than the spot diameter. However, a sufficiently wide skin layer cannot be removed in a single irradiation, resulting in excessive irradiation times and prolonged laser irradiation time, leading to low productivity and uneconomical practices. Furthermore, the laser energy may degrade the resin.

[0056] Conversely, when using a laser beam with a spot diameter larger than 500 μm for irradiation, the energy density is low, so the energy required to remove the skin layer cannot be guaranteed, resulting in skin layer residue. Based on this viewpoint, the spot diameter of the laser beam used to remove the skin layer 11 is 50 μm to 500 μm, preferably 150 μm to 250 μm. Furthermore, when the width of the removed skin layer 11 is wider than 500 μm, compared to multiple irradiations with a laser beam with a spot diameter of 500 μm, using a laser beam with a smaller spot diameter to irradiate the contour of the insulating portion improves the circuit accuracy.

[0057] According to this viewpoint, the width of the removed skin layer is 100μm to 500μm, preferably 150μm to 250μm. As long as the width is within this range, short circuits in the conductive circuit will not occur due to electroplating. Furthermore, because the laser irradiation time is shortened, productivity is increased, making it suitable. As described above, in this embodiment, by specifying the thickness of the skin layer 11 and the laser spot diameter, the connector base 30, which serves as the substrate, is not damaged. A circuit pattern with a width of 150μm to 250μm can be formed, preventing short circuits in the conductive circuit due to electroplating, shortening the laser irradiation time, and improving productivity.

[0058] In process (D), chemical etching is used to achieve a good coating appearance and tight contact. When the connector base 30 is injection molded without additives, the surface of the skinless portion 22 is roughened by chemical etching to form a recess.

[0059] Furthermore, when the connector base 30 is formed of a liquid crystal polymer resin containing additives, an acidic etching solution such as hydrochloric acid (HCl) is applied to the exposed core layer 12 of the skinless portion 22 to wash away and remove the additives near the exposed surface. It is preferable to use an acidic solution such as 3% to 20% hydrochloric acid or hydrofluoric acid at a temperature of 25°C to 40°C. By removing a portion of the additives contained in the exposed core layer of the skinless portion, the surface roughening effect of the skinless portion can be further improved. Multiple micropores, i.e., recesses, are more clearly formed on the exposed surface of the etched core layer. This additive removal process can also be a process of dissolving / removing additives by acidic, alkaline, or solvent treatment, ultrasonic water washing, or wet etching.

[0060] Additionally, after degreasing the exposed surfaces of the unskinned portion 22 of the connector base 30 and the molded body 40, roughening can also be performed using chromic acid or potassium hydroxide (KOH) solution. Various etching methods can be applied as a method for roughening the surface. Etching methods include wet and dry methods, and an appropriate etching method can be adopted depending on the type of material used in the substrate. Dry methods can be performed, for example, by irradiating plasma or using gas.

[0061] Wet etching methods can be achieved by using aqueous solutions of alkali metal hydroxides such as NaOH and KOH, aqueous solutions of alkali metal alkoxides such as sodium alkoxide and potassium alkoxide, or organic solvents such as dimethylformamide. The etching solution is applied to the substrate surface, or the substrate is immersed in the solution for contact etching. When using aqueous solutions of NaOH or KOH, a concentration of approximately 35 wt% to 45 wt% and a temperature of approximately 70°C to 95°C are preferred.

[0062] Additionally, methods using aqueous solutions of alkali metal alkoxides, dimethylformamide, or other organic solvents are suitable for roughening applications after coating with water-soluble or hydrolyzable polymers. It should be noted that when using organic solvents, the matrix may only swell without achieving the desired roughening. In such cases, acid or alkali treatment can be performed after organic solvent treatment.

[0063] In process (E), a coating catalyst such as Pd or Pt is applied to the exposed surface of the core layer 12, which is obtained by immersion in a accelerator solution such as sulfuric acid, hydrochloric acid, sodium hydroxide, or ammonia, and then electroless or electroplating is performed using copper, nickel, gold, or other metals. Alternatively, dry coating methods such as vapor deposition or sputtering can also be used.

[0064] Known catalysts can be used as catalysts for coating, with catalysts containing Pd or Pt being preferred. These catalysts are used, for example, as inorganic salts such as chlorides. The application of the coating catalyst is carried out by depositing the inorganic salt onto the substrate and then treating it with an accelerator to precipitate the catalyst metal. To allow the inorganic salt to adhere to the substrate, the inorganic salt solution can be brought into contact with the substrate, for example, by immersing the substrate in the inorganic salt solution or by coating the aqueous solution onto the substrate.

[0065] The specific conditions vary depending on the substrate material, the coating material, the catalyst material used for coating, and the method of attaching inorganic salts, and cannot be generalized. However, taking the case of using palladium chloride as the salt of the coating catalyst and adopting the immersion method as an example, we can illustrate it as follows.

[0066] Catalyst salt solution composition

[0067] PdCl2 / 2H2O: 0.1g / dm3~0.3g / dm3

[0068] SnCl2 / 2H2O: 10g / dm3~20g / dm3

[0069] HCl: 150cm³ / dm³~250cm³ / dm³

[0070] Immersion conditions

[0071] Temperature: 20℃~45℃

[0072] Time: 1 minute to 10 minutes

[0073] Next, copper (Cu) electroless plating is performed on the exposed surfaces of the connector base 30 and the molded body 40. Through electroless plating, a plating portion 36 is formed on the roughened, skinless portion 22. For example... Figure 2As shown in (B), the coated portion 36 is formed by entering a tiny recess in the surface of the roughened core layer 22 of the skinless portion 22. As a result, the coated portion 36 makes a tight contact with the connector base 30 with high strength, improving the airtightness of the hermetic connector and increasing the adhesion strength between small electronic components and the circuit wiring formed in the hermetic connector. Furthermore, by performing electroplating with Cu, Au, or the like, a coated portion 36 with increased thickness can be obtained.

[0074] In this embodiment, the skin layer 11 is removed by laser processing, exposing the skinless layer 22 of the core layer 12, which is then metallized, while the remaining skin layer 21 with the skin layer 11 is not metallized. Thus, because the etched areas are selectively coated, a mask is not required, and selective metallization can be performed.

[0075] The coating method can employ known metallization methods (chemical plating, electroplating). Examples of suitable coating metals include copper, nickel, gold, and various other metals. The coating process can also be performed in multiple steps. It should be noted that a pre-coating step can be included after the catalyst application step. The pre-coating step can also be performed using known metallization methods, preferably chemical plating, and the coating metal can be the same as the metal used in the aforementioned coating steps.

[0076] By incorporating this pre-coating process, the coating quality in this coating process can be further improved. Alternatively, a post-coating process can also be included. The post-coating process can also utilize known metallization methods, preferably chemical plating. The coating metal can be the same as, but different from, the metal used in this coating process. It should be noted that in this embodiment, electroplating is performed after chemical plating to form a thicker coating portion 36.

[0077] It should be noted that the skinned portion 21 does not require coating, and there is no need to use a mask layer or the like for patterning. Furthermore, by removing the skinned layer 11 using the desired pattern during laser processing in step (C), only the coated portion 36 can be formed in the skinless portion 22, resulting in... Figure 3 (B) and (C) are the coating portions of the desired loop pattern.

[0078] exist Figure 5In step (F), the molded body 40 is removed using an organic solvent or the like. It should be noted that the organic solvent can be one that dissolves only the molded body 40 but has difficulty dissolving the raw material of the connector base 30. It should also be noted that the molded body 40 can be removed by laser processing. In step (G), a laser beam is irradiated onto the upper surface of the connector base 30 and the inner surface of the hole 5 to selectively remove the skin layer 11. This laser processing is the same as that described in step (C). Next, in step (H), the surface of the core layer 12 without the skin 22 is roughened. The roughening method is the same as that described in step (D).

[0079] Next, in step (I), the roughened, skinless portion 22 on the upper surface of the connector base 30 is coated to form a coated portion 6. This coating process can be performed using the same metallization method as in step (E). It should be noted that before this coating process, the oxide coating on the coated portion 36 formed in steps (E) and (F) is removed. In step (I), a coated portion 37 is also formed on top of the coated portion 36. Here, for convenience, the coated portion at the lower part of the connector base 20 is referred to as both the coated portion 36 and the coated portion 37, but as a result, they are a single coated portion, and its thickness B is greater than the thickness C of the coated portion 6, i.e., B > C.

[0080] Next, refer to Figure 6 Another embodiment of the airtight connector and its manufacturing method according to the present invention will be described. Figure 6 In the middle, it only indicates Figure 4 and Figure 5 Different parts of the manufacturing process are shown; other processes are... Figure 4 and Figure 5 The process is the same. After filling hole 5 with molded body 40 in process (B), in... Figure 6 In step (C'), the skin layer 11 on the lower surface is removed by laser processing, and the lower surface of the molded body 40 is removed to a depth of length d. Here, d is, for example, 0.05 mm. Next, in step (D'), the core layer 12 exposed by chemical etching and the lower surface of the molded body 40 are roughened. In step (E'), metallization is performed to form a coated portion 36' on the lower surface of the molded body 40 without the skin layer 22.

[0081] Following this, similar to step (F), the molded body 40 is removed, and similar to step (G), the skin layer 11 on the upper surface of the connector base 30' is removed by laser processing, forming a skinned portion 21 and a skinless portion 22 on the upper surface of the connector base 30'. Next, similar to step (H), the surface of the exposed core layer 12 of the skinless portion 22 is roughened by chemical etching. In step (I'), the roughened core layer 12 on the upper surface side of the connector base 30' is metallized to form a plating portion 6'. Furthermore, a plating portion 37' is also formed on the lower surface side, overlapping the plating portion 36'. Thus, plating portions 6', 36', and 37' with an upwardly raised length d can be formed at the lower part of the hole 5. This allows for a change in the shape of the formed plating layer.

[0082] It should be noted that the conductive part of the present invention is not limited to the coated part, and other processing methods can also be used to form the conductor.

[0083] Explanation of reference numerals in the attached figures

[0084] 1 Connector base; 2 First space; 3 Second space; 4 Partition; 5 Hole; 6, 6' Coated portion; 7 Pin; 8 Pin; 9 Sealing portion; 10 Sealing portion; 11 Skin layer; 12 Core layer; 15 Additive; 20 Connector base; 21 With skin; 22 Without skin; 26 Coated portion; 29 Part; 30, 30' Connector base; 36, 36' Coated portion; 37, 37' Coated portion; 37A, 37B, 37C, 37D Coated portion; 40 Molded body.

Claims

1. An airtight connector for maintaining an airtight connection between a first space and a second space, and for electrically connecting a first conductor in the first space to a second conductor in the second space, characterized in that... The connector base has an insulator, the connector base having a hole communicating with the first space and the second space, and having a partition portion other than the hole dividing the first space and the second space. The first surface of the connector base has a first skinned portion and a first unskinned portion. It has a first conductive portion that is in close contact with the roughened surface of the first unskinned portion and is formed as an integral part covering the hole. The first conductor is electrically connected to one side of the first conductive portion, and the second conductor is electrically connected to the other side of the first conductive portion.

2. The airtight connector as described in claim 1, characterized in that, The second surface of the connector base, located on a surface different from the first surface, has a second skinned portion and a second unskinned portion. It has a second conductive portion that is in close contact with the roughened surface of the second skinless portion and is electrically connected to the first conductive portion.

3. An airtight connector for maintaining an airtight connection between a first space and a second space, and for electrically connecting a first conductor in the first space to a second conductor in the second space, characterized in that... The connector base has an insulator, the connector base having a hole communicating with the first space and the second space, and having a partition portion other than the hole dividing the first space and the second space. The connector base is an injection-molded synthetic resin product. The first surface of the connector base has a first skinned portion and a first unskinned portion. The surface of the unskinned portion has a recess. It has a conductive portion formed in such a way as to enter the recess and is formed as an integral part covering the hole.

4. A method for manufacturing an airtight connector, the airtight connector being used to maintain airtightness between a first space and a second space, and electrically connecting a first conductor in the first space to a second conductor in the second space, the method for manufacturing the airtight connector being characterized by having: The connector base forming process forms a connector base having a hole connecting the first space and the second space and having a skin layer on the surface by injection molding of synthetic resin. The hole plugging process involves filling the hole with a molded body. The first skin layer removal process selectively removes the skin layer from a portion of the surface of the connector base to form a first skinless portion; The first conductive part forming process forms a first conductive part on the surface of the first skinless part and the molded body; The molding body removal process removes the molded body; The first conductor is electrically connected to one side of the first conductive portion, and the second conductor is electrically connected to the other side of the first conductive portion.

5. The method for manufacturing a hermetic connector as described in claim 4, characterized in that, The process includes a first roughening step that roughens the surface of the first skinless portion, and a first conductive portion forming step that forms the first conductive portion on the surfaces of the roughened first skinless portion and the molded body. It also has: The second skin layer removal process selectively removes the skin layer from a portion of the surface of a surface that is different from the surface where the skin layer was removed in the first skin layer removal process, forming a second skinless portion. The second roughening process roughens the surface of the second skinless portion. The second conductive part forming process forms a second conductive part that is electrically connected to the first conductive part in a second skinless part that has been roughened by the second roughening process.

6. A method for manufacturing an airtight connector, the airtight connector being used to maintain airtightness between a first space and a second space, and electrically connecting a first conductor in the first space to a second conductor in the second space, the method for manufacturing the airtight connector being characterized by having: The connector base forming process forms a connector base having a hole connecting the first space and the second space and having a skin layer on the surface by injection molding of synthetic resin; The hole plugging process involves filling the hole with a molded body. The first skin layer removal process involves selectively removing the skin layer from a portion of the surface of the connector base through laser processing, forming a first skinless portion. The surface roughening process involves selectively etching the first skinless portion using chemical etching to form recesses on the surface of the skinless portion. The conductive part forming process involves forming a conductive part on the surface of the skinless part and the molded body by means of a coating process, in which metal is introduced into the recess; The molding body removal process removes the molded body.

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