Photosensitive component and camera module and manufacturing method thereof

Abstract

The present invention provides a photosensitive component, which includes at least one photosensitive element, a substrate; and at least one window circuit board, wherein the window circuit board includes a circuit board body, and the circuit board body has at least one window, the photosensitive element is arranged in the window, and the substrate is arranged below the photosensitive element.

Description

Technical Field

[0001] The present invention relates to the field of camera modules, and further to a photosensitive component and a camera module and a method for manufacturing the same. Background Art

[0002] Traditional camera modules are usually packaged through the COB (Chip On Board) process. As a relatively mature packaging technology, COB packaging has its advantages, but also has many disadvantages.

[0003] A traditional camera module usually includes a circuit board, a photosensitive chip, a filter, a base, a driver, a lens, and a resistor and capacitor. After these components are packaged in a COB manner, the photosensitive chip is mounted on the circuit board, the base is mounted on the circuit board, the filter is mounted on the base and is located in the photosensitive path of the photosensitive chip, the driver is mounted on the base, and the lens is mounted on the driver so as to be located in the photosensitive path of the photosensitive chip, and the focal length of the camera module can be adjusted by the driver.

[0004] First, in the existing method, the photosensitive chip is attached to the upper surface of the circuit board. In this process, the chip is usually attached to the circuit board by gluing. For the camera module, the consistency of the optical axis is an extremely important aspect. Therefore, here, the flatness of the circuit board of the photosensitive chip is relatively high, so as to facilitate the subsequent consistency of the main optical axis of the lens and the central optical axis of the photosensitive chip. Secondly, the base is fixed to the circuit board by gluing, and the filter, driver and lens components are all based on the base, so the flatness of the base itself and the flatness of the installation are required to be high.

[0005] Third, the photosensitive chip is electrically connected to the circuit board through gold wires, and the resistor and capacitor components protrude from the circuit board. Therefore, when installing the base, it is necessary to reserve space for the gold wires and the resistor and capacitor components so that the gold wires and the resistor and capacitor components will not be touched in all directions, which causes unnecessary space occupation. On the other hand, the resistor and capacitor components are easily contaminated with dust and debris, which will affect the imaging of the module and form black spots.

[0006] Fourth, and relatively important, the development of various intelligent devices, such as smart phones, has put higher and higher requirements on the thinness of camera modules. With the development of camera modules, almost every tiny space is very important to the camera modules. In this assembly method, the photosensitive chip, the circuit board, and the resistor and capacitor components occupy their own space, making it difficult to reduce the size of the camera module. In this attached structure, since the photosensitive chip has a certain thickness, when installing other components, the base must be installed to provide a space for the photosensitive chip to protrude from the circuit board.

[0007] Fifth, the height of the camera module needs to meet the requirements of optical imaging. In this assembly method, the chip is attached to the circuit board, and the filter is mounted on the base. Therefore, the back focal length of the camera module is larger and the overall height of the camera module is larger. Summary of the invention

[0008] One object of the present invention is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the photosensitive component includes a photosensitive element, a window circuit board and a packaging body, and the photosensitive element and the window circuit board are integrally packaged by the packaging body.

[0009] Another object of the present invention is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the photosensitive element and the window circuit board are integrally packaged by the packaging body in a spatially overlapping manner, thereby reducing the relative height of the photosensitive element and the window circuit board.

[0010] Another object of the present invention is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the window circuit board has a window to accommodate the photosensitive element, thereby reducing the relative height of the photosensitive element and the window circuit board, thereby reducing the height of the camera module.

[0011] Another object of the present invention is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the window of the window circuit board is a through hole, so that the relative height of the photosensitive element and the circuit board element can be adjusted to accommodate circuit boards of different thicknesses.

[0012] Another object of the present invention is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the bottom of the photosensitive element is exposed to the outside, thereby increasing the heat dissipation performance of the photosensitive element.

[0013] Another object of the present invention is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the photosensitive element and the window circuit board are electrically connected via a connecting wire, and the connecting wire is integrally encapsulated by the encapsulation body.

[0014] Another object of the present invention is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the photosensitive component includes a filter, which is disposed on the photosensitive element to shield the photosensitive element from contamination and reduce the back focal length of the camera module.

[0015] Another object of the present invention is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the packaging body includes a lens portion that extends upward as a whole and is suitable for installing the lens of the camera module, thereby providing flat and stable installation conditions for the lens.

[0016] Another object of the present invention is to provide a photosensitive component and a camera module and a method for manufacturing the same, wherein the packaging body can extend downward to the bottom of the photosensitive component to encapsulate the photosensitive component from the bottom layer.

[0017] In order to achieve the above objectives and other objectives and advantages of the present invention, one aspect of the present invention provides a photosensitive component, which includes at least one photosensitive element; at least one window circuit board; and at least one packaging body, wherein the photosensitive element and the window circuit board are integrally packaged by the packaging body, and the packaging body forms a light window corresponding to the photosensitive element, the window circuit board includes a circuit board body, and the circuit board body has at least one window, and the photosensitive element is arranged in the window.

[0018] In some embodiments, the window is a groove, and the photosensitive element is disposed in the groove.

[0019] In some embodiments, the photosensitive element and the circuit board body are electrically connected via at least one electrical connection element, one end of the electrical connection element is connected to the photosensitive element, and the other end is connected to the top surface of the circuit board body, and the top surface of the circuit board body connected to the other end of the photosensitive element is located outside the window.

[0020] In some embodiments, the photosensitive element and the circuit board body are electrically connected via at least one electrical connection element, one end of the electrical connection element is connected to the photosensitive element, and the other end is connected to the top surface of the circuit board body, and the top surface of the circuit board body connected to the other end of the photosensitive element is located within the window.

[0021] In some embodiments, the window is a through hole, and the photosensitive element is disposed in the through hole.

[0022] In some embodiments, the photosensitive element is electrically connected via at least one electrical connection element, one end of the electrical connection element is connected to the photosensitive element, and the other end of the electrical connection element is connected to the top surface of the circuit board body.

[0023] In some embodiments, the photosensitive component includes a substrate, which is disposed below the photosensitive element.

[0024] In some embodiments, the photosensitive component includes a substrate, the substrate is in a groove shape, the substrate is disposed in the window, and the photosensitive element is accommodated in the substrate.

[0025] In some embodiments, the package body integrally encapsulates the electrical connection element.

[0026] In some embodiments, the photosensitive assembly includes at least one electronic component that protrudes or partially protrudes from the circuit board body, and the packaging body integrally encapsulates the electronic component.

[0027] In some embodiments, the photosensitive element includes a photosensitive area and a non-photosensitive area, and the packaging body integrally packages at least a portion of the non-photosensitive area.

[0028] In some embodiments, the photosensitive component further includes an annular barrier, which is disposed around the photosensitive area of ​​the photosensitive element.

[0029] In some embodiments, the surface of the package body is a step-shaped structure.

[0030] In some embodiments, the surface of the package body is a planar structure.

[0031] In some embodiments, the package body includes a bracket portion and a lens portion, the outer portion of the lens portion extends integrally along the bracket portion, and the inner portion forms a step shape, the bracket portion is used to install a filter, and the lens portion is used to install a lens.

[0032] In some embodiments, the interior of the lens head is flat and suitable for mounting a threadless lens.

[0033] In some embodiments, the lens has a threaded structure inside, suitable for installing a threaded lens.

[0034] In some embodiments, the circuit board body has a reinforcement hole, and the packaging body extends into the reinforcement hole.

[0035] In some embodiments, the circuit board body has a reinforcement hole, and the packaging body passes through the reinforcement hole and extends to the bottom of the circuit board body.

[0036] In some embodiments, the photosensitive component includes a filter, which is attached to the photosensitive element.

[0037] In some embodiments, the photosensitive component includes a filter, and the edge of the filter is integrally encapsulated by the encapsulation body.

[0038] In some embodiments, the photosensitive component includes a back plate, which is mounted on the bottom of the circuit board body.

[0039] In some embodiments, the integrated packaging method is a molding method.

[0040] According to another aspect of the present invention, the present invention provides a camera module, which includes the photosensitive component described above; and at least one lens, wherein the lens is located in the photosensitive path of the photosensitive element of the photosensitive component.

[0041] In some embodiments, the camera module includes at least one driver, the lens is mounted on the driver, and the driver is mounted on the photosensitive component.

[0042] In some embodiments, the camera module includes at least one bracket, which is mounted on the photosensitive component.

[0043] In some embodiments, the camera module includes a plurality of the photosensitive elements and a plurality of the lenses to form an array camera module.

[0044] In some embodiments, the window circuit boards of each of the photosensitive components are integrally connected.

[0045] According to another aspect of the present invention, the present invention also provides a method for manufacturing a photosensitive component, which comprises the steps of:

[0046] (A) a photosensitive element is disposed in a window of a window circuit board;

[0047] (B) electrically connecting the photosensitive element and the window circuit board; and

[0048] (C) forming a package body integrally combined with the photosensitive element and the window circuit board, and making the package body form a light window opposite to the photosensitive element.

[0049] In some embodiments, in step (C), the photosensitive element and the window circuit board are in contact with each other, and the packaging body integrally connects the photosensitive element and the window circuit board.

[0050] In some embodiments, in the step (C), the photosensitive element and the window circuit board are spaced apart, and the encapsulation body is integrally connected and filled between the photosensitive element and the window circuit board to reinforce the photosensitive element and the window circuit board.

[0051] In some embodiments, in the step (C), the photosensitive element and the window circuit board are in indirect contact via a medium, and the package body integrally connects the photosensitive element, the medium and the window circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 It is a stereoscopic schematic diagram of a camera module according to a first preferred embodiment of the present invention.

[0053] Figure 2 It is a schematic diagram of the decomposition of the camera module according to the first preferred embodiment of the present invention.

[0054] Figure 3 It is a cross-sectional schematic diagram of a camera module according to a first preferred embodiment of the present invention.

[0055] Figure 4 It is a schematic diagram of the manufacturing process of the photosensitive component of the camera module according to the first preferred embodiment of the present invention.

[0056] Figure 5A and 5B These are two equivalent implementations of the packaging body of the photosensitive component of the camera module according to the first preferred embodiment of the present invention.

[0057] Figure 6 It is the first variant implementation of the photosensitive component of the camera module according to the first preferred embodiment of the present invention.

[0058] Figure 7 It is a second variant implementation of the photosensitive component of the camera module according to the first preferred embodiment of the present invention.

[0059] Figure 8 A schematic cross-sectional view of a camera module according to a second preferred embodiment of the present invention.

[0060] Fig. 9 A schematic diagram of the decomposition of the photosensitive component of the camera module according to the second preferred embodiment of the present invention.

[0061] Fig.10 A modified implementation of the photosensitive component of the camera module according to the second preferred embodiment of the present invention.

[0062] Fig.11 It is a cross-sectional schematic diagram of a camera module according to a third preferred embodiment of the present invention.

[0063] Fig.12 It is a stereoscopic schematic diagram of a photosensitive component of a camera module according to a third preferred embodiment of the present invention.

[0064] Fig.13 It is a variant implementation of the photosensitive component of the camera module according to the third preferred embodiment of the present invention.

[0065] Fig.14It is a cross-sectional schematic diagram of a camera module according to a fourth preferred embodiment of the present invention.

[0066] Fig.15 It is a modified implementation of the camera module according to the fourth preferred embodiment of the present invention.

[0067] Fig.16 It is a cross-sectional schematic diagram of a camera module according to a fifth preferred embodiment of the present invention.

[0068] Fig.17 It is a variant implementation of the photosensitive component of the camera module according to the fifth preferred embodiment of the present invention.

[0069] Fig.18 It is a schematic cross-sectional view of a camera module according to a sixth preferred embodiment of the camera module of the present invention.

[0070] Fig.19 It is a modified implementation of the photosensitive component of the camera module according to the sixth preferred embodiment of the present invention.

[0071] Fig. 20 It is a cross-sectional schematic diagram of a camera module according to the seventh preferred embodiment of the present invention.

[0072] Fig.21 It is a cross-sectional schematic diagram of a camera module according to the eighth preferred embodiment of the present invention.

[0073] Fig. 22 It is a cross-sectional schematic diagram of a camera module according to the ninth preferred embodiment of the present invention.

[0074] Fig.23 It is a block diagram of the method for manufacturing a photosensitive component according to the above preferred embodiment of the present invention. DETAILED DESCRIPTION

[0075] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0076] Those skilled in the art should understand that, in the disclosure of the present invention, the orientation or position relationship indicated by the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0077] like Figures 1 to 4 1 is a camera module according to a first preferred embodiment of the present invention, wherein the camera module comprises at least one photosensitive component 10 , at least one lens 20 and at least one filter 30 .

[0078] The filter 30 is installed on the photosensitive component 10 and is located in the photosensitive path of the photosensitive component 10. The lens 20 is located in the photosensitive path of the photosensitive component 10. For example, in the process of image acquisition, the light reflected by the target object enters the interior of the camera module through the lens 20, and the light reaches the photosensitive component 10 after the optical action of the lens 20 and the filter 30. After the photosensitivity of the photosensitive component 10, the photoelectric conversion is performed to convert the optical signal into an electrical signal, and then the electrical signal can be transmitted to the electronic device using the camera module through the photosensitive component 10 to achieve image reproduction, that is, to complete the image acquisition process of a target object.

[0079] Furthermore, the camera module may also include at least one driver 40, the lens 20 is installed on the driver 40, and the driver 40 is installed on the photosensitive component 10, so that the lens 20 is located in the photosensitive path of the photosensitive component 10, and the focal length of the camera module can be adjusted by the driver 40. The driver 40 can be implemented as a motor, for example but not limited to, a voice coil motor, a piezoelectric motor. That is to say, in this embodiment of the present invention, the camera module is an automatic focus camera module AFM (Automatic Focus Model). Of course, in other embodiments of the present invention, the camera module can also be other types, such as a fixed focus camera module FFM (Fix Focus Model). Those skilled in the art should understand that the type of the camera module is not a limitation of the present invention.

[0080] The filter 30 may be an infrared cut-off filter, a wafer-level infrared cut-off filter or a blue glass filter. It should be understood by those skilled in the art that the specific type of the filter 30 is not a limitation of the present invention.

[0081] The photosensitive assembly 10 includes at least one photosensitive element 11, at least one window circuit board 12 and at least one packaging body 13. The photosensitive element 11 and the window circuit board 12 are arranged in a spatially overlapping manner, thereby reducing the relative height of the photosensitive element 11 and the window circuit board 12. The photosensitive element 11 and the window circuit board 12 are integrally packaged by the packaging body 13.

[0082] The package body 13 has at least one light window 134 for providing a light path for the photosensitive element 11. That is, the light entering from the lens 20 passes through the light window 134 and reaches the photosensitive element 11 for photoelectric conversion.

[0083] In this embodiment of the present invention, a step-like structure is formed inside the package body 13 to facilitate installation of the optical filter 30. Of course, the step-like structure can also be used to install the driver 40 or the lens 20. It should be understood by those skilled in the art that the installation component of the package body 13 is not a limitation of the present invention.

[0084] The photosensitive element 11 includes a top surface 111 and a bottom surface 112. The top surface 111 is opposite to the lens 10 and is used for photoelectric conversion.

[0085] Furthermore, the top surface 111 of the photosensitive element 11 includes a photosensitive area 1111 and a non-photosensitive area 1112, wherein the photosensitive area 1111 is used for light sensing, and the non-photosensitive area 1112 is electrically connected to the window circuit board 12, so that the electrical signal after the photoelectric conversion of the photosensitive area 1111 is transmitted to the window circuit board 12. In one embodiment, the photosensitive element 11 can be implemented as a square CCD or CMOS chip, and the non-photosensitive area 1112 surrounds the periphery of the photosensitive area 1111. The window circuit board 12 may include a pre-embedded circuit for processing the electrical signal transmitted by the photosensitive element 11.

[0086] The package 13 integrally packages at least a portion of the non-photosensitive area 1112 of the photosensitive element 11. In other words, the package 13 may package a portion of the non-photosensitive area 1112 of the photosensitive element 11, or may package the entire non-photosensitive area 1112 of the photosensitive element 11.

[0087] The photosensitive element 11 is electrically connected to the window circuit board 12 through at least one electrical connection element 14, so as to realize the transmission of electrical signals between the photosensitive element 11 and the window circuit board 12. The electrical connection element 14 can be a connection element made of one or more of gold, silver, copper, aluminum, and conductive non-metals, for example but not limited to, gold wire, silver wire, copper wire, and aluminum wire. In one manufacturing method, the electrical connection element 14 is arranged on the photosensitive element 11 and the window circuit board 12 through a W / B (Wired / Bond) process. Further, the electrical connection element 14 connects the non-photosensitive area 1112 of the photosensitive element and the window circuit board 12.

[0088] The photosensitive assembly 10 includes at least one electronic component 123, and the electronic component 123 protrudes from the window circuit board 12. The electronic component 123 is electrically connected to the window circuit board 12. The electronic component 123 can be a resistor, a capacitor, a driving element, a signal processing element, a storage element, etc. The electronic component 123 is the electronic component 123 of the window circuit board 12, which completes the transmission of the electrical signal. In other embodiments, the electronic component 123 may not be protruding or the electronic component may be buried in the window circuit board 12. It should be understood by those skilled in the art that the type and arrangement of the electronic component 123 are not limitations of the present invention.

[0089] The electronic components 123 and the electrical connection elements 14 are encapsulated in the encapsulation body 13. In other words, the electrical connection elements 14 and the electronic components 123 are wrapped by the encapsulation body 13, so as not to be exposed to the external environment. In the existing method, the connecting gold wires and the resistor and capacitor components are usually exposed to the outside. On the one hand, the dust on the gold wires and the resistor and capacitor components will affect the imaging quality of the camera module. On the other hand, it is necessary to reserve the installation space for the gold wires and the resistor and capacitor components, thus resulting in a waste of space in the camera module.

[0090] The window circuit board 12 includes a circuit board body 121, and the window circuit board 12 has a window 122. The window 122 is arranged on the circuit board body 121, thereby forming a window-shaped circuit board. The photosensitive element 11 is accommodated in the window 122, thereby reducing the extra space occupied by the photosensitive element.

[0091] That is, the photosensitive element 11 is accommodated in the window 122 of the window circuit board 12, so that the position of the photosensitive element 11 relative to the circuit board body 121 is sunken, so that the relative height of the photosensitive element 11 and the circuit board body 121 is reduced. When the height of the top surface 111 of the photosensitive element 11 is not higher than the top surface 1211 of the circuit board body 121, the circuit board body 11 provides a sufficient space environment for the photosensitive element 11, and the overall height of the photosensitive element 11 and the circuit board body 121 is only expressed as the height of the circuit board body 121.

[0092] The circuit board body 121 has a top surface 1211 and a bottom surface 1212, and the package body 13 is packaged in the top surface 1211 of the circuit board body 121 and the non-photosensitive area 1112 of the top surface 111 of the photosensitive element 11. The size of the window 122 of the window circuit board 12 can be set according to the size of the photosensitive element 11, and can be comparable to the size of the photosensitive element 11, so that the window 122 is suitable for accommodating the photosensitive element 11, or it can be smaller than the photosensitive element 11, so that it is convenient to accommodate the photosensitive element 11 and adjust the photosensitive element 11. In one implementation process, a gap 125 can be reserved between the photosensitive element 11 and the window circuit board 12 for easy installation, and the gap 125 is filled by the package body 13 to fix the photosensitive element 11. Refer to Figure 3 In one embodiment, the package body 13 enters the gap, fills the space between the circuit board body 121 and the photosensitive element 11, and makes the position where the package body 13 extends into the gap 125 substantially consistent with the bottom surface 112 of the photosensitive element 11 and the bottom surface 1212 of the circuit board body 121. In this way, the package body 13 can reinforce the photosensitive element 11 and the window circuit board 12.

[0093] Reference Figure 5A In another embodiment, the package body 13 does not enter the gap 125, and the package body 13 and the top surface 111 of the photosensitive element 11 and the top surface 1211 of the circuit board body 121 are substantially the same height. In the implementation process, the photosensitive element 11 and the circuit board body 121 are bonded by an adhesive, such as glue, to prevent the package body 13 from entering the gap 125. Figure 5BIn another embodiment, the encapsulation body 13 extends into the gap and passes through the gap 125 to cover the bottom of the photosensitive component 10. It should be understood by those skilled in the art that the gap and the relationship between the encapsulation body and the gap can be set as needed, and the size of the gap and the position where the encapsulation body 13 extends in the gap are not limitations of the present invention.

[0094] It is worth mentioning that, in another embodiment, the circuit board body 121 may not be spaced apart from the photosensitive element 11 to form the gap 125, but may be in direct contact. It is worth mentioning that when the package body 13 reinforces the window circuit board 12 and the photosensitive element 11, unlike the prior art where a reinforcing plate is required at the bottom of the circuit board, the package body can play a reinforcing role for the window circuit board. Of course, a reinforcing plate may be further provided on the back side of the window circuit board 12 of the present invention to further strengthen the packaging strength of the photosensitive component.

[0095] In the process of manufacturing the photosensitive component 10, a window is first opened on a circuit board substrate to form the window circuit board 12 having the window 122, and then the photosensitive element 11 is set in the window 122 (the photosensitive element 11 and the window circuit board 12 can also be fixed by glue), and then the photosensitive element 11 and the circuit board body 121 are electrically connected through the electrical connection element 14, such as by bonding, and then the non-photosensitive area 1112 of the photosensitive element 11, the electrical connection element 14, the electronic component 123, and the window circuit board 12 are packaged as a whole through an integrated packaging method.

[0096] The material of the circuit board body 121 can be a rigid-flex board RG (Rigid Flex), a flexible printed circuit board FPC (Flex Print Circuit), a rigid printed circuit board PCB (Printed Circuit Board), a ceramic substrate (without a flexible board), etc.

[0097] It is worth mentioning that the packaging area of ​​the non-photosensitive area 1112 of the photosensitive element 11 can be set according to needs, that is, the non-photosensitive area 1112 can be fully encapsulated or partially encapsulated. Those skilled in the art should understand that the size and shape of the packaging area are not limitations of the present invention.

[0098] In the present invention, the package body 13 is integrally formed by a molding process, and is different from a traditional base and bonded to a circuit board. When manufacturing the photosensitive component 10, the photosensitive element 11 and the window circuit board 12 are placed in a mold, and then a molding material is applied to the mold, and after curing, the package body 13 of a predetermined shape is formed, and the photosensitive element 11 and the window circuit board 12 are fixed by the package body 13. The molding material can be selected from nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin and other thermoplastic or thermosetting materials.

[0099] This integrated packaging method reduces the process of traditional glue bonding base, and the package body 13 is manufactured by molding, the shape is easier to control, and the surface flatness is better, so it can provide a flat installation condition for the filter 30, the driver 40 and the lens 20, which helps to ensure the consistency of the optical axis of the camera module. On the other hand, it reduces the traditional glue bonding space, which helps to reduce the height of the camera module. Furthermore, in an embodiment of the present invention, the photosensitive element 11 is arranged in the window 122 and then packaged as a whole. Therefore, when forming the package body 13, there is no need to consider the thickness of the photosensitive element 11, thereby further providing a possible space for reducing the height of the camera module.

[0100] The package body 13 is an annular structure when viewed from above, for example, but not limited to, a square, a circle, or a triangle, so as to provide a mounting position for the optical filter 30, the driver 40, or the lens 20, so that a closed internal environment is formed when the driver 40 or the lens 20 is mounted in the package body 13. And with the advantage of molded integrated packaging, the surface of the package body 13 can be guaranteed to be flat, thereby providing a flat mounting condition for the optical filter 30, the lens 20, or the driver 40.

[0101] According to this embodiment of the present invention, the window 122 is a through hole, that is, the window 122 is connected to both sides of the circuit board body 121, thereby providing an adjustable space for the photosensitive element 11. In other words, the relative position of the photosensitive element 11 in the window 122 and the circuit board body 121 can be set as needed.

[0102] It is worth mentioning that in the present invention, the photosensitive element 11 and the window circuit board 12 are integrally packaged by the package body 13, so that when the photosensitive element 11 is set in the window 122, no additional supporting components are required to fix the photosensitive element 11, so that the position of the photosensitive element 11 can be selected relatively freely. In other words, the package body 13 provides a fixing function for the photosensitive element 11 and the circuit board body 121 from above, so that the circuit board body 121 or other components are not required to provide support and fixing functions for the photosensitive element 11 from other directions, such as from below. And through the integrated packaging function of the package body 13, the structural strength of the circuit board body 121 and the photosensitive element 11 can be enhanced.

[0103] Further, according to this embodiment of the present invention, the photosensitive element 11 is arranged at a position close to the bottom of the window 122, one end of the electrical connection element 14 is connected to the non-photosensitive area 1112 of the photosensitive element 11, and the other end of the connection passes through the window 122 to be connected to the circuit board body 121.

[0104] Furthermore, the bottom surface 112 of the photosensitive element 11 and the bottom surface 1212 of the circuit board body 121 are relatively consistent in height, so that the bottom of the photosensitive component 10 is relatively flat without obvious steps. In other words, the bottom surface 112 of the photosensitive element 11 and the bottom surface 1212 of the circuit board body are substantially flush.

[0105] In this manner, the bottom surface 112 of the photosensitive element 11 is exposed to the external space, thereby enhancing the heat dissipation function of the photosensitive element 11. This is different from the attachment manner in which the bottom surface 112 is blocked by the circuit board and the heat dissipation performance is poor.

[0106] For example, the present invention provides two methods for manufacturing the window circuit board 12. In one method, the window 122 is first opened in the substrate layer, and the size of the window 122 is determined according to the photosensitive element 11. Then, the substrate layers are stacked and the circuit is buried between the predetermined substrate layers, thereby forming a window circuit board 12 with the window 122. In another method, the substrates are stacked and the circuit is buried between the substrate layers according to a predetermined route, and the buried route is determined according to the placement position of the photosensitive element 11. Then, the window 122 is opened on the stacked substrate layers. The window 122 is within the buried circuit and is determined according to the shape of the photosensitive element 11, that is, the circuit will not be damaged.

[0107] like Figure 6As shown, it is a first variant implementation of the photosensitive component 10 of the camera module according to the first preferred embodiment of the present invention. Different from the above-mentioned implementation, in this implementation, the top surface 111 of the photosensitive element 11 and the top surface 1211 of the circuit board body 121 are relatively consistent in height. In other words, the top surface 111 of the photosensitive element 11 and the top surface 1211 of the circuit board body 121 are substantially flush, and a space is reserved below the photosensitive element 11. When the upper surfaces are flush, the photosensitive element 11 and the window circuit board 12 are electrically connected through the electrical connection element 14.

[0108] In the process of manufacturing such a photosensitive element 11, a boss-shaped jig can be provided to support the photosensitive element 11, so that the photosensitive element 11 and the upper surface of the window circuit board 12 are flush, and then the photosensitive element 11 and the window circuit board 12 are packaged as a whole to form the package body 13, so that the relative position of the photosensitive element 11 and the window circuit board is fixed by the package body 13.

[0109] like Figure 7 As shown, it is a second variant implementation of the photosensitive component 10 of the camera module according to the first preferred embodiment of the present invention. Different from the above implementation, in this implementation, the photosensitive element 11 includes a barrier 15, and the barrier 15 is arranged at the position where the packaging body 13 and the photosensitive element 11 are connected, and is used to prevent the packaging body 13 from affecting the inner area of ​​the photosensitive element 11, such as contaminating the photosensitive area 1111, that is, the barrier 15 is arranged outside the photosensitive area 111, so as to prevent the fluid molding material from entering the photosensitive area 1111 during the manufacturing process, and protect the photosensitive element 11 during the packaging mold operation.

[0110] The barrier 15 is in a ring-shaped or frame-shaped structure and is disposed on the photosensitive element 11. That is, the position where the inner edge of the packaging body 13 and the photosensitive element 11 meet is blocked by the barrier 15.

[0111] The barrier 15 may be formed by colloid or a plastic element of a predetermined shape.

[0112] In the process of manufacturing the photosensitive component 10, before the photosensitive element 11 and the window circuit board 12 are integrally packaged, it is necessary to set the barrier 15 on the photosensitive element 11, such as by applying glue, and then form the packaging body 13 with the barrier 15 as the boundary, so that the material of the packaging body 13 will not contaminate the area of ​​the photosensitive element 11 located inside the barrier 15.

[0113] like Figure 8 and Fig. 9 As shown, a camera module according to a second preferred embodiment of the present invention. Different from the above preferred embodiment, the window 122A is a groove structure, that is, the photosensitive element 11 is accommodated in the groove structure, so that the relative height of the surface of the photosensitive element 11 and the window circuit board 12 is reduced. Furthermore, when the depth of the groove structure is greater than or equal to the thickness of the photosensitive element 11, the overall thickness of the photosensitive element 11 and the window circuit board 12 is expressed as the thickness of the window circuit board 12.

[0114] The window 122A corresponds to a window bottom 124A, and the photosensitive element 11 is arranged at the window bottom 124A. In other words, the window bottom 124A supports the photosensitive element 11. The size of the window 122A can match the size of the photosensitive element 11, so that the surface of the photosensitive element 11 and the circuit board body 121 are flush. Of course, there can also be a gap between the photosensitive element 11 and the circuit board body 121, and then the photosensitive chip is fixed to the circuit board body 121 by an adhesive.

[0115] In this embodiment of the present invention, the electrical connection element 14 is electrically connected to the photosensitive element 11 and the circuit board body 121. That is, the electrical connection element 14 connects the photosensitive element 11 located in the window 122A and the top surface of the circuit board outside the window 122A.

[0116] like Fig.10 A modified implementation of the photosensitive component 10 of the camera module according to the second preferred embodiment of the present invention is shown. Different from the above preferred embodiment, the electrical connection element 14 is arranged in the window 122A of the window circuit board. Furthermore, one end of the electrical connection element 14 is connected to the non-photosensitive area 1112 of the photosensitive element 11, and the other end is connected to the circuit board surface 124A at the bottom of the window corresponding to the window 122A. Compared with the above embodiment, since an electrical connection structure is provided on the circuit board surface 124A at the bottom of the window of the circuit board body 121, and the electrical connection process of the electrical connection element 14 and the photosensitive element 11 is completed in a smaller space, the process difficulty is greater than the above embodiment.

[0117] Compared with the first preferred embodiment, the processing difficulty of the groove-shaped window 122 in the second embodiment is greater than that of the through-hole-shaped window 122A. Since the thickness of the circuit board is relatively small, the process accuracy is required to be high when the groove is set on the circuit board with a smaller thickness, and if the electrical connection element 14 is set in the groove, it is equivalent to setting the circuit on a thinner circuit board, which is more difficult. Therefore, considering the overall situation, the through-hole-shaped window 122A and the way in which the electrical connection element 14 is connected to the outside are more suitable for implementation, and provide more space for the photosensitive element 11 to be adjusted, and have better heat dissipation performance.

[0118] like Fig.11 and Fig.12 , is a camera module according to a third preferred embodiment of the present invention. Different from the above preferred implementation, in this implementation, the photosensitive component 10 includes a filter 30B, and the filter 30B is attached to the photosensitive element 11. In other words, the filter 30B blocks the photosensitive element 11, thereby reducing the contamination of the photosensitive element 11 and the damage of the mold to the photosensitive element 11.

[0119] In this embodiment, the upper surface of the package body 13 can be a flat planar structure, and does not need to be set as a step-like structure to install the filter 30B. The driver 40 or the lens 20 is installed on the package body 13.

[0120] For example, the filter 30B can be connected to the photosensitive element 11 by bonding. In other embodiments, the filter 30B can also be connected to the photosensitive element 11 by adsorption. It should be understood by those skilled in the art that the specific connection method between the filter 30B and the photosensitive element 11 is not a limitation of the present invention.

[0121] In this way, the filter 30B is arranged on the photosensitive element 11, so in the camera module, it is not necessary to install the filter 30B on the packaging body 13, and in this way, the distance between the filter 30B and the photosensitive element 11 is reduced, thereby shortening the back focal length of the camera module, so that the height of the camera module can be further reduced.

[0122] In the process of manufacturing the photosensitive component 10, the filter 30B can be attached to the photosensitive element 11 before the photosensitive element 11 and the window circuit board 12 are integrally packaged, so that the photosensitive element 11 is shielded by the photosensitive element 11, especially the photosensitive area 1111 of the photosensitive element 11, so that in the process of integral packaging, the photosensitive element 11 is shielded and protected by the filter 30B to prevent the packaging material of the package body 13 from contaminating the photosensitive element 11, thereby improving the imaging quality. Of course, in other embodiments of the present invention, the filter 30B can also be set after the package body 13 is formed to reduce the back focal length of the camera module. It should be understood by those skilled in the art that the setting order of the filter 30B is not a limitation of the present invention.

[0123] like Fig.13 As shown, a modified embodiment of the photosensitive component 10 of the camera module according to the third preferred embodiment of the present invention. Different from the above-mentioned embodiment, in this embodiment, the photosensitive element 11 includes a filter 30B, the filter 30B is attached to the photosensitive element 11, and the outer edge of the filter 30B is integrally encapsulated by the encapsulation body 13. In other words, the photosensitive element 11, the window circuit board 12 and the filter 30B are all integrally encapsulated by the encapsulation body 13, so as to fix the filter element. When manufacturing such a photosensitive component 10, it is necessary to overlap the filter 30B on the photosensitive element 11 before forming the encapsulation body 13. The filter 30B can be fixed by gluing or by integral encapsulation without gluing.

[0124] like Fig.14 , is a camera module according to a fourth preferred embodiment of the present invention. Different from the above embodiments, the photosensitive component 10 includes a package body 13C, and the package body 13C includes a bracket part 131C and a lens part 132C. The bracket part 131C is used to install the filter 30, and the lens part 132C is used to install the lens 20.

[0125] Further, the exterior of the lens portion 132C integrally extends upward along the bracket portion 131C, and a stepped structure is formed inside. The bracket portion 131C includes a first support platform 1311C, and the filter 30 is mounted on the first support platform 1311C. The lens portion 132C includes a second support platform 1321C, and the lens 20 is mounted on the second support platform 1321C, that is, the first support platform 1311C and the second support platform 1321C form a two-step structure.

[0126] The lens head extends integrally to provide a stable installation environment for the lens 20. According to this embodiment of the present invention, the depth of the lens head can be determined according to the height of the lens 20 to stably install the lens 20 and improve the accuracy of the camera module.

[0127] In this way, an installation environment is provided for the lens 20 to form a camera module with a certain focus, and a flat and stable installation environment can be provided for the lens 20 by means of a molded integrated packaging method.

[0128] Furthermore, in this embodiment, the interior of the lens head is flat, suitable for installing a threadless lens 20 .

[0129] like Fig.15 , is a modified implementation of the camera module according to the fourth preferred embodiment of the present invention. Different from the above preferred embodiments, in this implementation, the interior of the lens portion 132C has a threaded structure 1322C, suitable for installing a threaded lens. Of course, in other implementations, the interior of the lens portion can also be other different structures to facilitate the installation of different types of lenses.

[0130] like Fig.16 FIG. 2 is a cross-sectional view of a camera module according to a fifth preferred embodiment of the present invention. Different from the above preferred embodiments, the photosensitive component 10 includes a substrate 16 , and the substrate 16 is disposed below the photosensitive element 11 .

[0131] Furthermore, the height of the bottom of the substrate 16 is substantially consistent with the height of the bottom surface 1212 of the circuit board body 121, so that the bottom of the photosensitive component 10 remains flat. In other words, the substrate 16 fills the remaining space of the window 122 below the photosensitive element 11, so that when the thickness of the photosensitive element 11 is less than the thickness of the circuit board body 121, and the photosensitive element 11 is arranged at a position close to the top surface 1211 of the circuit board body 121, the bottom of the photosensitive component 10 can still remain flat without an obvious step structure.

[0132] The substrate 16 can enhance the structural strength and heat dissipation performance of the photosensitive component 10. In one embodiment, the substrate 16 can be a metal plate or a plastic plate. In another embodiment, the substrate 16 can be a film layer attached to the lower surface 112 of the photosensitive element 11 to protect the photosensitive element 11 and enhance the heat dissipation performance and structural strength of the photosensitive element. For example but not limited to, the film layer is a metal coating.

[0133] The substrate 16 may be connected to the circuit board body 121 by bonding, or may be connected to the photosensitive element 11 by bonding.

[0134] Of course, in other embodiments, the substrate 16 can be disposed below the circuit board body 121. For example, when the thickness of the photosensitive element 11 is greater than the thickness of the circuit board body 121, the substrate 16 can be used to make up for the height difference between the photosensitive element 11 and the circuit board body 121, thereby keeping the bottom of the photosensitive component 10 flat.

[0135] like Fig.17 As shown, it is a variant implementation of the photosensitive component of the camera module according to the fifth preferred embodiment of the present invention. Different from the above-mentioned implementation, the window circuit board 12 includes a substrate 16D, and the substrate 16D is accommodated in the window 122 of the window circuit board 12. The substrate 16D has a groove-shaped structure, and the photosensitive element 11 is accommodated in the substrate 16D. In other words, the substrate 16D is a mounting position for the photosensitive element 11, so that the photosensitive element 11 is flush with the upper surface of the circuit board body 121, and the lower surface of the substrate 16D is substantially consistent with the bottom surface of the circuit board body 121, so that the bottom of the photosensitive component 10 is flat.

[0136] like Fig.18 , is a camera module according to the sixth preferred embodiment of the present invention. Different from the above embodiments, the circuit board body 121 of the window circuit board 12 has at least one reinforcement hole 1213, and the package body 13 extends into the reinforcement hole 1213, thereby enhancing the structural strength of the circuit board body 121. The number and depth of the reinforcement holes 1213 can be arranged as needed and set at the position of the window circuit board 12 where no circuit is set.

[0137] In this embodiment, the reinforcement hole 1213 is a concave hole, that is, the two sides of the circuit board body 121 are not connected through the reinforcement hole 1213 .

[0138] Fig.19 This is a modified embodiment of the photosensitive component 10 of the camera module according to the sixth preferred embodiment of the present invention. Different from the above embodiments, the circuit board body 121 of the window circuit board 12 has at least one reinforcement hole 1213E, the package body 13 extends into the reinforcement hole 1213E, and the reinforcement hole 1213E is a through hole. In other words, the two sides of the circuit board body 121 can be connected through the reinforcement hole 1213E.

[0139] Furthermore, the encapsulation body 13 extends to the bottom of the circuit board body 121 and the photosensitive element 11 through the reinforcement hole 1213E, thereby forming an encapsulation layer 133E at the bottom of the photosensitive component 10. The encapsulation layer 133E enhances the structural strength of the photosensitive component 10.

[0140] That is to say, in this embodiment, the encapsulation body 13 is not only disposed on the upper part of the circuit board body 121 and the photosensitive element 11, but is also integrally disposed on the photosensitive element 11 and the lower part of the photosensitive element 11. Of course, in other embodiments, the encapsulation layer 133E may be disposed only under the circuit board body 121, but not under the photosensitive element 11.

[0141] like Fig. 20 As shown, it is a camera module according to the seventh preferred embodiment of the present invention. Different from the above preferred embodiments, the photosensitive component 10 includes a back plate 17, and the back plate 17 is arranged at the bottom of the circuit board body 121 to enhance the structural strength of the circuit board body 121, so that the bottom of the photosensitive component 10 is flat. In one embodiment, the back plate 17 can be a metal plate, so as to enhance the structural strength of the photosensitive component 10 while increasing the heat dissipation performance of the photosensitive component 10. In another embodiment, the back plate 17 can be a film layer, which is attached to the lower surface 112 of the photosensitive element 11 and the bottom surface 1212 of the circuit board 121, so as to protect the photosensitive element 11 and the circuit board body 121, and enhance the heat dissipation performance and structural strength of the photosensitive element. By way of example but not limitation, the film layer is a metal coating.

[0142] like Fig.21 The eighth preferred embodiment of the camera module according to the present invention is shown in FIG. Different from the above embodiments, the camera module includes a bracket 50 , the bracket 50 is mounted on the package body 13 , and the filter 30 is mounted on the bracket 50 .

[0143] Furthermore, the bracket 50 may form a bent structure, so that one end is suitable for being installed on the packaging body 13 , and the other end is suitable for supporting the filter 30 .

[0144] The bracket 50 can extend inward and downward, thereby reducing the distance between the filter 30 and the photosensitive element 11 and reducing the back focal length of the camera module.

[0145] In this embodiment, the bracket 50 is used to provide a mounting position for the optical filter 30, rather than directly providing the mounting position for the optical filter 30 through the package body 13. It is worth mentioning that the structure of the bracket 50 shown in the figure is only for illustration and is not a limitation of the present invention. Since the optical filter 30 has a relatively low structural strength, a relatively large mounting position is required during installation. By using the bracket 50 with a relatively high structural strength, the width requirement for the mounting position of the integrated package portion can be reduced.

[0146] The support 50 may be a closed ring or frame-shaped structure when viewed from above, and may also be selectively disposed on one or more sides of the packaging body 13 or the filter 30 .

[0147] like Fig. 22 , is a camera module according to the ninth preferred embodiment of the present invention. Different from the above embodiments, the camera module is an array camera module, and the array camera module includes two photosensitive components 10, two lenses 20, two drivers 40 and two filters 30.

[0148] It is worth mentioning that, in order to facilitate the disclosure of the present invention, in this embodiment of the present invention, a dual-camera module consisting of two lenses 20 is taken as an example for explanation, while in other embodiments of the present invention, the number of the lenses 20 can be more, such as three or more. Those skilled in the art should understand that the number of the lenses 20 and the number of corresponding components, such as the number of drivers 40, brackets 50, and filters 30 are not limitations of the present invention.

[0149] More specifically, in this embodiment of the present invention, the window circuit boards 12 of the two photosensitive components 10 are connected in one piece so as to form an array structure. The two packaging bodies 13 can be an integrated structure, that is, two square window structures are formed at one time so as to provide light paths for the two lenses 20 respectively.

[0150] The present invention discloses a plurality of embodiments and different implementation modes. During the description process, in order to facilitate a concise and clear description, only some distinguishing features are described in each embodiment and implementation mode. However, in the specific implementation process, different features in different embodiments and implementation modes can be combined as needed to form different camera modules or photosensitive components 10. Those skilled in the art should understand that the camera module and the photosensitive component 10 are not limited to the contents disclosed in a single embodiment or implementation mode.

[0151] Reference Fig.23 According to the above preferred embodiment of the present invention, the present invention provides a method 1000 for manufacturing a photosensitive component 10, and the steps of the method 1000 for manufacturing the photosensitive component 10 are as follows:

[0152] 1100: Dispose at least one photosensitive element 11 in a window 122 of a window circuit board 12;

[0153] 1200: electrically connecting the photosensitive element 11 and the window circuit board 12; and

[0154] 1300: forming a package body 13 integrally combined with the photosensitive element and the window circuit board 12, and making the package body 13 form a light window 131 opposite to the photosensitive element.

[0155] In the step 1100 , the window 122 may be a groove or a through hole.

[0156] The step 1100 may further include the steps of: forming a window circuit board 12 having at least one window 122;

[0157] In step 1100, the photosensitive element 11 may be disposed on a side close to the upper surface of the window circuit board 12, so that the photosensitive element 11 is flush with the top surface of the window circuit board 12. The photosensitive element 11 may also be disposed on a side close to the lower surface of the window circuit board 12, so that the photosensitive element 11 is flush with the bottom surface of the window circuit board 12. It is understood that the above-mentioned method of substantially flushing the top surface and the bottom surface is only used as an example, and does not limit the present invention.

[0158] In step 1200, the photosensitive element 11 and the window circuit board 12 are electrically connected through at least one electrical connection element 14. One end of the connection line is connected to the photosensitive element 11, and the other end is connected to the top surface of the window circuit board 12.

[0159] In the step 1300 , the photosensitive element 11 , the electrical connection element 14 , and the electronic components 123 protruding from the window circuit board 12 are integrally packaged.

[0160] The method 1000 may further include step 1400: attaching a filter 30 to the photosensitive element 11. The step 1400 may be performed before the step 1300 or after the step 1300. The attaching method may be bonding.

[0161] The method 1000 may further include step 1500 : opening at least one reinforcement hole 1213 on the main body of the window circuit board 12 .

[0162] The method 1000 may further include step 1600 : attaching a back plate 17 to the bottom of the window circuit board 12 .

[0163] In one implementation, in step 1300, the photosensitive element and the window circuit board are in contact with each other, and the packaging body integrally connects the photosensitive element and the window circuit board.

[0164] In another embodiment, in step 1300, the photosensitive element and the window circuit board are spaced apart, and the packaging body is integrally connected and filled between the photosensitive element and the window circuit board to reinforce the photosensitive element and the window circuit board.

[0165] In another embodiment, in step 1300, the photosensitive element and the window circuit board are in indirect contact via a medium, and the package integrally connects the photosensitive element, the medium, and the window circuit board. For example, the photosensitive element and the window circuit board are in indirect contact by first curing at least a portion of the area around the non-photosensitive area of ​​the photosensitive element with glue.

[0166] The integrated packaging method is a molding method, such as using an injection molding machine to adopt insert molding or compression molding technology.

[0167] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A photosensitive component, characterized in that: include: At least one photosensitive element, which includes a barrier; at least one package; a substrate; and At least one window circuit board, wherein the window circuit board includes a circuit board body, and the circuit board body has at least one window, the photosensitive element is arranged in the window, wherein the substrate is arranged below the photosensitive element, wherein the photosensitive element and the window circuit board are integrally packaged by the packaging body, wherein the barrier is arranged at the position where the packaging body and the photosensitive element are connected, and is used to prevent the packaging body from affecting the inner area of ​​the photosensitive element, wherein the barrier is in an annular or frame-shaped structure, and is arranged on the photosensitive element, and the height of the bottom of the substrate is consistent with the height of the bottom surface of the circuit board body, so that the bottom of the photosensitive component remains flat.

2. The photosensitive component according to claim 1, characterized in that: The substrate is in a groove shape, the substrate is arranged in the window, and the photosensitive element is accommodated in the substrate.

3. The photosensitive component according to claim 2, characterized in that: The photosensitive element is flush with the upper surface of the circuit board body.

4. The photosensitive component according to any one of claims 1 to 3, wherein the window is a through hole, and the photosensitive element is disposed in the through hole.

5. The photosensitive component according to any one of claims 1 to 3, characterized in that: The window is a groove, and the photosensitive element is arranged in the groove.

6. The photosensitive component according to any one of claims 1 to 3, characterized in that: The substrate is connected to the circuit board body by bonding.

7. The photosensitive component according to any one of claims 1 to 3, characterized in that: The substrate is connected to the photosensitive element by bonding.

8. The photosensitive component according to any one of claims 1 to 3, characterized in that: The substrate is a film layer attached to the lower surface of the photosensitive element.

9. A camera module, characterized in that: include: At least one photosensitive component according to any one of claims 1 to 8; and At least one lens; the lens is located in the light sensing path of the light sensing element.

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