Improved sensor device and method of making and using the same

Abstract

Disclosed herein are devices, methods, and methods of manufacturing devices for facilitating condition monitoring of machinery, thereby allowing for improved efficiency and increased lifespan of machinery while also reducing maintenance. In one embodiment, a device includes a housing assembly and a printed circuit board (PCB) assembly. The housing assembly includes a cap, a base mechanically coupled to the cap, and a support bracket mechanically coupled to the base. The PCB assembly includes a processor, a memory coupled to the processor, a first sensor electrically coupled to the processor, a second sensor electrically coupled to the processor, and a communication interface electrically coupled to the processor. The device, when installed, may be roughly formed into the shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 930,192 (Attorney Docket No. 1101 / 2 PROV), filed on November 4, 2019, and U.S. Provisional Patent Application No. 63 / 058,234 (Attorney Docket No. 1101 / 2 PROV2), filed on July 29, 2020, the entire contents of which are hereby incorporated by reference herein. Technical Field

[0003] The present invention relates generally to sensors and, more particularly, to smart sensors for monitoring machinery. Background Art

[0004] Condition monitoring is a vital tool for preventing failures, improving reliability, and reducing machine maintenance. Such machines can include engines, compressors, turbines, rollers, gearboxes, fans, pumps, electric motors, and more. Specifically, vibration and temperature are two key parameters in condition monitoring. Analyzing vibration and temperature data enables early detection of machine faults. These problems include bearing failure, shaft bending, overspeed, resonance, misalignment, imbalance, and excessive clearance between parts (mechanical looseness).

[0005] As machinery and condition monitoring become more sophisticated, improved methods and devices are needed to collect performance data that can be used to improve efficiency and increase machinery life while also reducing maintenance. Summary of the Invention

[0006] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0007] Disclosed herein are devices, methods, and methods of manufacturing devices for facilitating condition monitoring of machinery, thereby allowing for improved efficiency and increased lifespan of machinery while also reducing maintenance. In one embodiment, a device includes a housing assembly and a printed circuit board (PCB) assembly. The housing assembly includes a cap, a base mechanically coupled to the cap, and a support bracket mechanically coupled to the base. The PCB assembly includes a processor, a memory coupled to the processor, a first sensor electrically coupled to the processor, a second sensor electrically coupled to the processor, and a communication interface electrically coupled to the processor. The device, when installed, may be roughly formed into the shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.

[0008] In some embodiments, the communication interface can be a wireless communication interface, and at least a portion of the cap can be substantially radio frequency (RF) transparent. In certain embodiments, the wireless communication interface can be a Bluetooth® interface. More specifically, the wireless communication interface can be a Bluetooth® Low Energy (BLE) interface.

[0009] In some embodiments, the first sensor may be a vibration sensor and the second sensor may be a temperature sensor. In some embodiments, the vibration sensor may be an acceleration sensor and the temperature sensor may be a thermocouple, a thermistor, or the like.

[0010] In some embodiments, the device may include a battery clip, and the battery clip may be located on the PCB assembly. The PCB assembly may include three rigid sections for component placement, electrically coupled using two flexible PCB interconnects. The device may also include a battery, and the battery may be a lithium battery. The processor and memory may be embedded in the microcontroller / module.

[0011] In some embodiments, the device may include a third sensor. In this embodiment, the first sensor may be a low-sensitivity vibration sensor configured to operate in the sleep state of the device. The first sensor may also be configured to trigger the device to enter an active state. The second sensor may be a temperature sensor, and the third sensor may be a high-sensitivity vibration sensor configured to operate in the active state of the device. In certain embodiments, the third sensor may be a three-axis accelerometer having an x-axis, a y-axis, and a z-axis. The three-axis accelerometer may be positioned so that the z-axis is approximately perpendicular to the mounting surface of the base.

[0012] In some embodiments, the base can be configured to allow the mounting surface to be attached to a machine surface to enable monitoring of machine vibration and machine temperature. The base can also be configured to allow the support bracket to be rotated by a user about a vertical axis of the mounting surface while the PCB assembly and triaxial accelerometer remain fixed relative to the support bracket. In certain embodiments, the base can include threaded mounting studs positioned approximately perpendicular to the mounting surface. In other embodiments, the mounting surface can be magnetic or include an adhesive for coupling to the machine surface.

[0013] In another embodiment, a method for manufacturing a device is disclosed. The method includes mechanically assembling a PCB assembly within a housing assembly. The PCB assembly includes a processor, a memory coupled to the processor, a first sensor electrically coupled to the processor, a second sensor electrically coupled to the processor, and a communication interface electrically coupled to the processor. The housing assembly includes a cap, a base mechanically coupled to the cap, and a support bracket mechanically coupled to the base.

[0014] In another embodiment, a method for monitoring a machine is disclosed. The method includes installing a device on the machine. The device includes a housing assembly and a PCB assembly. The housing assembly includes a cap, a base mechanically coupled to the cap, and a support bracket mechanically coupled to the base. The PCB assembly includes a processor, a memory coupled to the processor, a first sensor electrically coupled to the processor, a second sensor electrically coupled to the processor, and a communication interface electrically coupled to the processor. The method also includes receiving, via the communication interface, first sensor data and second sensor data transmitted by the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A block diagram illustrating an apparatus for installation on a machine for condition monitoring according to an embodiment of the present disclosure is depicted.

[0016] Figure 2A and Figure 2B Depicted are diagrams illustrating an embodiment of the present disclosure for use in the United States (US) market and the Japanese market, respectively. Figure 1 Schematic diagram of the enclosure of the device.

[0017] Figures 3A to 3D Depicts an illustration of an embodiment of the present disclosure for use in the U.S. market. Figure 1 An illustration of a printed circuit board (PCB) assembly of a device.

[0018] Figures 3E to 3G Depicts an example of a device suitable for use in the Japanese market according to an embodiment of the present disclosure. Figure 1 An illustration of the PCB assembly of the device.

[0019] Figure 4A and Figure 4B Depicts an illustration of an embodiment of the present disclosure for use in the U.S. market. Figures 3A to 3D Illustration of the metal support bracket for the PCB assembly.

[0020] Figure 4C and Figure 4D Depicts an example of a device suitable for use in the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G Illustration of the metal support bracket for the PCB assembly.

[0021] Figure 5A and Figure 5B Depicts an illustration of an embodiment of the present disclosure for use in the U.S. market. Figures 3A to 3D Illustration of the battery support of the PCB assembly.

[0022] Figure 5C and Figure 5D Depicts an example of a device suitable for use in the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G Illustration of the battery support of the PCB assembly.

[0023] Figure 6A and Figure 6B Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 2A FIG. 1 is an illustration of the cap of the capsule.

[0024] Figure 6C and Figure 6D Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 2B FIG. 1 is an illustration of the cap of the capsule.

[0025] Figure 7A and Figure 7B Depicts an illustration of an embodiment of the present disclosure for use in the U.S. market. Figure 2A Illustration of the device without the cap of the capsule.

[0026] Figure 7C and Figure 7D Depicts an example of a device suitable for use in the Japanese market according to an embodiment of the present disclosure. Figure 2B Illustration of the device without the cap of the capsule.

[0027] Figure 8A Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 7A and Figure 7B FIG. 1 is an exploded view of the device.

[0028] Figure 8B Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 7C and Figure 7D FIG. 1 is an exploded view of the device.

[0029] Figure 9A Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 2A Illustration of the non-pivoting base of the enclosure.

[0030] Figure 9B Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 2B Illustration of the non-pivoting base of the enclosure.

[0031] Figure 10 Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 2A Illustration of the pivoting base of the capsule.

[0032] Figure 11 Depicted is a diagram illustrating a method for Figure 10 Illustration of the nut, locator and pivot sensor base of the pivot base.

[0033] 12A to 12C Depicted are diagrams illustrating embodiments according to the present disclosure. Figure 11 Illustration of the nut, locator and pivot sensor base.

[0034] 13A to 13D Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figures 3A to 3D Mechanical drawing of the PCB assembly.

[0035] Figure 13E Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figures 3E to 3G Mechanical drawing of the PCB assembly.

[0036] Figure 13F Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figures 3A to 3D Another mechanical diagram of the PCB assembly.

[0037] Figure 13G Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figures 3E to 3G Another mechanical diagram of the PCB assembly.

[0038] Figure 14A Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figures 3A to 3D Mechanical diagram of the battery holder.

[0039] Figure 14B Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figures 3E to 3G Mechanical diagram of the battery holder.

[0040] Figure 14C Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figures 3A to 3D Another mechanical diagram of the battery holder.

[0041] Figure 14D Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figures 3E to 3G Another mechanical diagram of the battery holder.

[0042] Figure 14E Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figures 3A to 3D Another mechanical diagram of the battery holder.

[0043] Figure 14F Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figures 3E to 3G Another mechanical diagram of the battery holder.

[0044] Figure 14G Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figures 3A to 3DAnother mechanical diagram of the battery holder.

[0045] Figure 14H Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figures 3E to 3G Another mechanical diagram of the battery holder.

[0046] Figure 14I Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figures 3A to 3D Another mechanical diagram of the battery holder.

[0047] Figure 14J Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figures 3E to 3G Another mechanical diagram of the battery holder.

[0048] Figure 15A Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 4A and Figure 4B Mechanical diagram of the metal support bracket.

[0049] Figure 15B Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 4C and Figure 4D Mechanical diagram of the metal support bracket.

[0050] Figure 15C Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 4A and Figure 4B Another mechanical diagram of the metal support bracket.

[0051] Figure 15D Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 4C and Figure 4D Another mechanical diagram of the metal support bracket.

[0052] Figure 15E Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 4A and Figure 4B Another mechanical diagram of the metal support bracket.

[0053] Figure 15F Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 4C and Figure 4D Another mechanical diagram of the metal support bracket.

[0054] Figure 15G Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 4A and Figure 4B Another mechanical diagram of the metal support bracket.

[0055] Figure 15H Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 4C and Figure 4D Another mechanical diagram of the metal support bracket.

[0056] Figure 15I Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 4A and Figure 4B Another mechanical diagram of the metal support bracket.

[0057] Figure 15J Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 4C and Figure 4D Another mechanical diagram of the metal support bracket.

[0058] Figure 16A Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 9A Mechanical diagram of the non-pivoting base.

[0059] Figure 16B Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 9B Mechanical diagram of the non-pivoting base.

[0060] Figure 16C Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 9A Another mechanical diagram of a non-pivoting base.

[0061] Figure 16D Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 9B Another mechanical diagram of a non-pivoting base.

[0062] Figure 16E Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 9A Another mechanical diagram of a non-pivoting base.

[0063] Figure 16F Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 9B Another mechanical diagram of a non-pivoting base.

[0064] Figure 16G Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 9A Another mechanical diagram of a non-pivoting base.

[0065] Figure 16H Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 9B Another mechanical diagram of a non-pivoting base.

[0066] Figure 17A Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 6A and Figure 6B Mechanical diagram of the cap.

[0067] Figure 17B Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 6C and Figure 6D Mechanical diagram of the cap.

[0068] Figure 17C Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 6A and Figure 6B Another mechanical diagram of the cap.

[0069] Figure 17D Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 6C and Figure 6D Another mechanical diagram of the cap.

[0070] Figure 17E Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 6A and Figure 6B Another mechanical diagram of the cap.

[0071] Figure 17F Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 6C and Figure 6D Another mechanical diagram of the cap.

[0072] Figure 17G Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 6A and Figure 6B Another mechanical diagram of the cap.

[0073] Figure 17H Depicted is a diagram illustrating an embodiment of the present disclosure for use in the Japanese market. Figure 6C and Figure 6D Another mechanical diagram of the cap. DETAILED DESCRIPTION

[0074] The presently disclosed subject matter is specifically described to meet statutory requirements. However, the description itself is not intended to limit the scope of this patent. Rather, the inventors have contemplated that the claimed invention may also be embodied in other ways, to include different steps or elements similar to those described herein, in conjunction with other current or future technologies. Furthermore, while the term "step" may be used herein to refer to various aspects of the method employed, the term should not be interpreted as implying any particular order among or between the various steps disclosed herein, unless the order of the steps is explicitly described.

[0075] Condition monitoring for reliability and analysis can integrate improved sensors for vibration and temperature monitoring. Applications include process monitoring for the production of food, pharmaceuticals, consumer goods, including automobiles, paper, aircraft, and other types of equipment and soft goods. Additionally, improved sensor applications can be integrated into the healthcare sector.

[0076] Figure 1 A block diagram 100 is depicted, illustrating an apparatus 102 for installation on a machine for condition monitoring according to an embodiment of the present disclosure. Enclosure 104 houses vibration sensors 106A and 106B; and temperature sensor 108, both electrically coupled to a microcontroller 110. The enclosure also houses a real-time clock 112, a radio frequency (RF) interface 114, and an antenna 116. Real-time clock 112 is electrically coupled to the microcontroller to allow for time stamping of vibration and temperature data. RF interface 114 is electrically coupled to processor 114 and antenna 116 to a communication interface of apparatus 102. A sensor application 118 comprises program instructions stored in memory within microcontroller 110. When executed by microcontroller 110, the program instructions perform steps that facilitate condition monitoring of the machine. Enclosure 104 also houses battery 120. Microcontroller 110 is configured to monitor the current charge and / or remaining battery life.

[0077] In some embodiments, the RF interface 114 may be a Bluetooth® Low Energy (BLE) interface and may comply with the Institute of Electrical and Electronics Engineers (IEEE) 802.15.4 technical standard. For example, the microcontroller 110, the wireless communication interface 114, and the antenna 116 may be integrated into a single PCB module, such as Laird's 451-00001 BL654 series module.

[0078] In other embodiments, microcontroller 110 may be an ultra-low-power microcontroller. For example, microcontroller 110 may be a Renesas® Synergy R7FS1JA783A01CFM microcontroller unit (MCU) or a similar MCU. The R7FS1JA783A01CFM MCU is based on a 48 MHz Arm Cortex-M23 processor core and features 256 kilobytes (KB) of code flash memory, 32 KB of static random access memory (SRAM), and multiple analog-to-digital converters (ADCs) and digital-to-analog converters (DACs).

[0079] Device 102 is configured to operate in a sleep state and an active state. Vibration sensor 106A is a low-sensitivity vibration sensor used to transition device 102 from the sleep state to the active state. Vibration sensor 106B is a high-sensitivity vibration sensor, allowing detailed measurement of the machine to detect problems such as bearing failures, bent shafts, overspeed, resonance, misalignment, imbalance, and excessive clearance between parts (mechanical looseness).

[0080] In certain embodiments ( Figure 1 (not shown), the device 102 may further include an electric field (E-field) sensor and / or a magnetic field (H-field) sensor to measure electric and magnetic fields (EMF). The device 102 may also include a tilt sensor for detecting the orientation and / or tilt of the machine.

[0081] In some embodiments, the enclosure 104 comprises a generally tapered cylinder ( Figure 1 106B and temperature sensor 108.

[0082] Figure 2A Depicted is a diagram 200 illustrating a system suitable for use in the United States (US) market according to an embodiment of the present disclosure. Figure 1 The enclosure includes a cap 202 and a base 204. Figure 2B Depicted is a diagram 210 illustrating a device suitable for use in the Japanese market according to an embodiment of the present disclosure. Figure 1 The enclosure includes a cap 212 and a base 214. Throughout the remainder of this disclosure, a given illustration will be labeled as either a US market version or a Japanese market version when specific to a given market.

[0083] Figures 3A to 3D Depicted are diagrams 300, 310, 320, and 330 illustrating a system suitable for use in the U.S. market according to an embodiment of the present disclosure. Figure 1 Different views of the printed circuit board (PCB) assembly of a device. Figures 3E to 3G Depicted are diagrams 340, 350, and 360 illustrating a system suitable for use in the Japanese market according to an embodiment of the present disclosure. Figure 1Different views of the PCB assembly of the device. Each PCB assembly (US and Japanese market versions) secures and electrically couples vibration sensors 106A and 106B; temperature sensor 108; microcontroller 110; real-time clock 112; RF interface 114; and antenna 116. Each PCB assembly also provides a battery holder for battery 120. The holder is made of standard spring steel.

[0084] Each PCB assembly (i.e., a single assembly) includes a three-layer printed circuit board having three rigid sections for component placement that are electrically coupled using two flexible PCB interconnects. Specifically, the arrangement is cascaded into a first rigid section (i.e., a lower horizontal section), a first flexible PCB interconnect, a second rigid section (i.e., a vertical section), a second flexible PCB interconnect, and a third rigid section (i.e., an upper horizontal section). The two flexible PCB interconnects allow for reduced vibrations between the rigid sections. This arrangement allows the microcontroller 110, which includes a memory, an RF interface 114, and an antenna 116 (e.g., a Bluetooth module), to be mounted on the third rigid section and physically farthest from the machine being monitored. Additionally, this allows the communication interface 114 and the antenna 116 to achieve an optimal line-of-sight RF transmission path. The third rigid section also includes a light emitting diode (LED) and a switch ( Figure 1 The LED is a multi-color LED used to indicate different states of the device 102. The switch is used to read data from the flash memory ( Figure 1 (not shown) removes power, thereby reducing overall power consumption and extending battery life.

[0085] Vibration sensors 106A and 106B and temperature sensor 108 are mounted on the first rigid section (i.e., the bottom section) and physically closest to the machine. This arrangement allows for optimal monitoring of the machine. A copper feedthrough on the first rigid section, which allows for metallic heat transfer, extends from the stainless steel base and provides a direct metallic contact path to the bottom of temperature sensor 108. This allows for faster response to temperature changes and more accurate readings of the machine's surface temperature.

[0086] Vibration sensor 106B is a precision three-axis microelectromechanical system (MEMS) accelerometer. Using two screws located on opposite sides of vibration sensor 106B, vibration sensor 106B is positioned approximately centered on the first rigid section plate. This arrangement positions vibration sensor 106B directly above the ¼-28 mounting studs on the base, which secure vibration sensor 106B to the machine (via the housing). This creates a direct mechanical transmission path for vibrations to travel from the machine surface upward, through the ¼-28 mounting studs, into the stainless steel structure of the base, and into the first rigid section where vibration sensor 106B is mounted.

[0087] Vibration sensor 106A is an ultra-low-power MEMS accelerometer and is mounted next to vibration sensor 106B. Vibration sensor 106A is designed to continuously monitor for sudden, large increases in vibration. If it sees a significant increase in vibration, it will wake up vibration sensor 106B along with RF interface 114. This simulates continuous monitoring. In this way, device 102 is essentially always on and can capture sudden increases in vibration above a programmable range. The reason for these two different accelerometers is that they have different levels of accuracy and dynamic range.

[0088] The first rigid section also includes a voltage regulator and a power switch for the regulator ( Figure 1 not shown).

[0089] The battery 120 is mounted to the second rigid section and suspended away from the first rigid section. This reduces its impact on vibration measurements and facilitates the user's ability to replace it when needed. The battery 120 is a 1 / 2AA lithium battery. The battery 120 and the device 102 are generally configured for an operating environment of -55 to +85 degrees Celsius. The second rigid section also includes a real-time clock 112 and a level shifter ( Figure 1 not shown).

[0090] In other embodiments, the second rigid section can be adjusted in size and shape to hold one or more button cells. The one or more button cells can include models AG1, AG3, AG4, AG10, AG12, AG13, etc. In still other embodiments, the second rigid section can be adjusted in size and shape to hold other battery types and form factors as needed.

[0091] Figure 4A and Figure 4B Depicted are diagrams 400 and 410 illustrating a schematic diagram of a system for use in the United States market according to an embodiment of the present disclosure. Figures 3A to 3D Two views (front and back) of the metal support bracket for the PCB assembly. Figure 4C and Figure 4D Depicted are diagrams 420 and 430 illustrating a schematic diagram of a device suitable for use in the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G Two views (front and back) of the metal support brackets for the PCB assemblies. These metal support brackets are used to secure the PCB assemblies to their corresponding bases.

[0092] Figure 5A and Figure 5B Depicted are diagrams 500 and 510 illustrating a schematic diagram of a system suitable for use in the United States market according to an embodiment of the present disclosure. Figures 3A to 3D Two views (front and back) of the PCB assembly for the battery support. Figure 5Cand Figure 5D Depicted are diagrams 520 and 530 illustrating a schematic diagram of a device suitable for use in the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G Two views (front and back) of the battery supports of the PCB assembly. Each battery support is used to isolate the battery 120 from the cap and better secure the battery 120 in the battery holder when the cap is installed.

[0093] Figure 6A and Figure 6B Depicted are diagrams 600 and 610 illustrating a schematic diagram of a system for the U.S. market according to an embodiment of the present disclosure. Figure 2A Isometric views (top and bottom) of the cap of the capsule. Figure 6C and Figure 6D Depicted are diagrams 620 and 630 illustrating a schematic diagram of a system for the Japanese market according to an embodiment of the present disclosure. Figure 2B Isometric views (top and bottom) of the caps of the enclosure. These caps can be molded from a plastic material including polycarbonate (PC) or acrylonitrile butadiene styrene (ABS). These caps can be Shinkawa blue in color.

[0094] Figure 7A and Figure 7B Depicted are diagrams 700 and 710 illustrating a schematic diagram of a system for use in the United States market according to an embodiment of the present disclosure. Figure 2A The encapsulated device (including the PCB assembly with the battery and without the cap). Figure 7C and Figure 7D Depicted are diagrams 720 and 730 illustrating a schematic diagram of a device suitable for use in the Japanese market according to an embodiment of the present disclosure. Figure 2B The device is a packaged device (including a PCB assembly with a battery and no cap). These PCB assemblies also include a support bracket and a base. As shown, these PCB assemblies surround the battery 120 to reduce the overall volume (including height and diameter) compared to existing sensor solutions.

[0095] Figure 8A Depicted is a diagram 800 illustrating a schematic diagram of a U.S. market according to an embodiment of the present disclosure. Figure 7A and Figure 7B Exploded view of the device. Figure 8B Depicted is a diagram 810 illustrating a schematic diagram for the Japanese market according to an embodiment of the present disclosure. Figure 7C and Figure 7D Exploded views of the devices are shown. These exploded views include the base, cap, PCB assembly, support bracket, battery holder, and battery 120 of each device. In some embodiments, the base is a non-pivoting base. In some embodiments, the base of each device may include an annular gasket (not shown in FIG. 8 ) to secure the cap to the base.

[0096] Figure 9A Depicted is a diagram 900 illustrating a schematic diagram of a U.S. market according to an embodiment of the present disclosure. Figure 2A The non-pivoting base of the enclosure. Figure 9B Depicted is a diagram 910 illustrating a schematic diagram for the Japanese market according to an embodiment of the present disclosure. Figure 2B The non-pivoting base of the enclosure includes a non-pivoting base. Each non-pivoting base includes an axis marking relative to vibration sensor 106A and / or vibration sensor 106B. The axis marking can be a rectangular cutout or a fixed ring groove. Each non-pivoting base also includes a threaded (¼-28) mounting stud. In other embodiments, each non-pivoting base can be adapted to be mounted to the machine using epoxy, magnets, glue, etc. Each non-pivoting base also includes type 316 stainless steel.

[0097] Figure 10 Depicted is a diagram illustrating an embodiment of the present disclosure for use in the U.S. market. Figure 2A FIG1000 illustrates a pivoting base for the housing of the device 102. The pivoting base includes axis markings relative to vibration sensor 106A and / or vibration sensor 106B. The pivoting base is comprised of a nut, a locator, and a pivoting sensor base. The nut secures the support bracket and PCB assembly. The locator secures the measurement point position on the machine once the device 102 is installed. The pivoting sensor base allows the support bracket and PCB assembly to be rotated for alignment. Figure 11 A diagram 1100 is depicted, which further illustrates a method for Figure 10 The nut of the pivot base, the positioner and the pivot sensor base.

[0098] 12A to 12C Depicted are diagrams 1200, 1210, and 1220, which respectively illustrate a Figure 11 A view of the nut, locator, and pivot sensor base. Each component is comprised of Type 316 stainless steel. In other embodiments, the pivot base may be adapted to be mounted to the machine using epoxy, magnets, glue, etc. 13A to 13D Depicted are mechanical diagrams 1300, 1310, 1320, and 1330 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figures 3A to 3D Various views of a PCB assembly. Figure 13E Depicted is a mechanical diagram 1340 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G view of the PCB assembly. Figure 13F Another mechanical diagram 1350 is depicted, illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figures 3A to 3D PCB components. Figure 13GAnother mechanical diagram 1360 is depicted, illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G 13a to 13g depict mechanical views of the PCB assembly, including the battery holder as previously shown in FIG3a to 3g. Dimensions are presented in inches. FIG13a depicts a first view of a mechanical view of the PCB assembly and battery holder.

[0099] Figure 14A Depicted is a mechanical diagram 1400 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figures 3A to 3D First view of the battery holder. Figure 14B Depicted is a mechanical diagram 1410 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G First view of the battery holder. Figure 14C Another mechanical diagram 1420 is depicted, which illustrates a machine for the U.S. market according to an embodiment of the present disclosure. Figures 3A to 3D Second view of the battery holder. Figure 14D Another mechanical diagram 1430 is depicted, which is a diagram illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G Second view of the battery holder. Figure 14E Another mechanical diagram 1440 is depicted, which is a diagram illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figures 3A to 3D A third view of the battery holder. Figure 14F Another mechanical diagram 1450 is depicted, illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G A third view of the battery holder. Figure 14G Another mechanical diagram 1460 is depicted illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figures 3A to 3D Fourth view of the battery holder. Figure 14H Another mechanical diagram 1470 is depicted, illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G Fourth view of the battery holder. Figure 14I Another mechanical diagram 1480 is depicted, illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figures 3A to 3D Fifth view of the battery holder. Figure 14J Another mechanical diagram 1490 is depicted, illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figures 3E to 3G Fifth view of the battery holders. Dimensions are presented in inches and millimeters (where applicable). Each battery holder includes a shoulder that secures the battery in space relative to the base and reduces vibration stress on the battery holder. (See Figure 14E and Figure 14G ). Each battery holder also includes ribs that help press into the battery holder and tighten the PCB assembly for better vibration response. (See Figure 14Iand Figure 14J ).

[0100] Figure 15A Depicted is a mechanical diagram 1500 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 4A and Figure 4B First view of the metal support bracket. Figure 15B Depicted is a mechanical diagram 1510 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 4C and Figure 4D First view of the metal support bracket. Figure 15C Another mechanical diagram 1520 is depicted illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 4A and Figure 4B Second view of the metal support bracket. Figure 15D Another mechanical diagram 1530 is depicted, illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 4C and Figure 4D Second view of the metal support bracket. Figure 15E Another mechanical diagram 1540 is depicted, illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 4A and Figure 4B A third view of the metal support bracket. Figure 15F Another mechanical diagram 1550 is depicted, illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 4C and Figure 4D A third view of the metal support bracket. Figure 15G Another mechanical diagram 1560 is depicted, illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 4A and Figure 4B Fourth view of the metal support bracket. Figure 15H Another mechanical diagram 1570 is depicted, illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 4C and Figure 4D Fourth view of the metal support bracket. Figure 15I Another mechanical diagram 1580 is depicted, illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 4A and Figure 4B Fifth view of the metal support bracket. Figure 15J Another mechanical diagram 1590 is depicted, illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 4C and Figure 4D Fifth view of the metal support bracket. Dimensions are presented in inches and millimeters where applicable.

[0101] Figure 16A Depicted is a mechanical diagram 1600 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 9A First view of the non-pivoting base. Figure 16B Depicted is a mechanical diagram 1610 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 9B First view of the non-pivoting base. Figure 16C Depicted is a mechanical diagram 1620 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 9A A second view of the non-pivoting base. Figure 16D Depicted is a mechanical diagram 1630 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 9B A second view of the non-pivoting base. Figure 16E Depicted is a mechanical diagram 1640 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 9A A third view of the non-pivoting base. Figure 16F Depicted is a mechanical diagram 1650 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 9B A third view of the non-pivoting base. Figure 16G Depicted is a mechanical diagram 1660 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 9A Fourth view of the non-pivoting base. Figure 16H Depicted is a mechanical diagram 1670 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 9B Fourth view of the non-pivoting base. Dimensions are presented in inches and millimeters where applicable.

[0102] The US and Japanese market versions use different fastener styles. The US market version has two screw locations near the center of the part, which helps position and hold the sensing components close to the center of the part and is used only to attach the PCB to the hexagonal base. The Japanese market version positions the screws farther away from these components and uses an equidistant four-position design. All four screws in the Japanese market design utilize metal support brackets to clamp the PCB in, so none are specifically used to position the PCB to the hexagonal base.

[0103] Figure 17A Depicted is a mechanical diagram 1700 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 6A and Figure 6B First view of the cap. Figure 17B Depicted is a mechanical diagram 1710 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 6C and Figure 6D First view of the cap. Figure 17C Depicted is a mechanical diagram 1720 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 6A and Figure 6B Second view of the cap. Figure 17D Depicted is a mechanical diagram 1730 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 6C and Figure 6D Second view of the cap. Figure 17E Depicted is a mechanical diagram 1740 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 6A and Figure 6B Third view of the hat. Figure 17F Depicted is a mechanical diagram 1750 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 6C and Figure 6D Third view of the hat. Figure 17G Depicted is a mechanical diagram 1760 illustrating a machine for the U.S. market according to an embodiment of the present disclosure. Figure 6A and Figure 6B Fourth view of the hat. Figure 17H Depicted is a mechanical diagram 1770 illustrating a machine for the Japanese market according to an embodiment of the present disclosure. Figure 6C and Figure 6D Fourth view of the cap. Dimensions are presented in inches and millimeters (where applicable).

[0104] Returning to the performance criteria, the vibration sensor 106B of the device 102 (US and Japanese market versions) is configured to measure acceleration and velocity in each of the three axes. Acceleration is measured in mm / s 2 Measurements are taken as peak and root mean square (RMS). Velocity is measured in mm / s as peak and RMS. During the measurement interval, a waveform is captured for each of the three axes. A Fast Fourier Transform (FFT) is extracted from the waveform. For a given frequency band, the resolution can be 800, 1600, or 3200 lines. Up to six programmable frequency bands are supported. Device 102 then calculates the root sum square (RSS) of the frequency band for transmission over the RF interface.

[0105] Device 102 is also configured to use vibration sensor 106B to take vibration measurements according to a timed, programmed schedule. The interval between measurements is user-programmable. In certain embodiments, this schedule can range from once an hour to once a day. However, if vibration sensor 10A senses high vibration during an interval when no measurements are being taken, device 102 will wake up and take a measurement. This measurement may ultimately be just an overall value, or it may also include spectral and / or waveform measurements. During this event, temperature is also measured. Device 102 then advertises that it has measurements to upload via RF interface 114. If a hub (or other aggregation device) responds to the advertisement, the data is uploaded. If device 102 does not receive a response to the advertisement, it stores the data in internal flash memory for upload at another time. The flash memory on device 102 can store up to 300 measurements (100 per axis). If the measurement is a timed measurement and there is no response to the advertisement, the measurement is also stored in internal memory. If during an advertisement period the hub (or other aggregation device) is contacted and stored data is available, the stored data is sent up in first-in-first-out (FIFO) order until all data, including the most recent measurements, has been uploaded.

[0106] Typical battery life predictions for sensors have been specified in terms of days, weeks, and / or months. This specification gives users false expectations. The reason for this is that actual battery life is directly affected by: (1) the number of measurements performed and transmitted; (2) the temperature of the environment and / or machine (i.e., the battery self-discharge rate is different for different temperatures); and (3) the time the sensor device is active versus asleep. However, device 102 is specified in terms of the number of measurement cycles. Measuring all three axes requires three measurement cycles. In some embodiments, battery 120 is rated for a minimum of 1500 measurement cycles when fully charged. In other embodiments, battery 120 is rated for a minimum of 1800 measurement cycles when fully charged.

[0107] In summary, the aforementioned apparatus 102 provides numerous improvements to sensor technology for condition monitoring. For example, the PCB assembly (i.e., a single component) positions the communication interface 114 and antenna 116 on the third rigid section (i.e., the upper horizontal section) at the highest point of the optimal line-of-sight RF transmission path and furthest from the monitored machinery.

[0108] Additionally, the PCB assembly provides a direct mechanical transmission path to vibration sensor 106B (e.g., a precision tri-axial MEMS accelerometer). The first rigid section (i.e., the lower horizontal section) positions vibration sensor 106B directly above the ¼-28 mounting studs. The first rigid section is mounted directly to the stainless steel base using two screws located on opposite sides of vibration sensor 106B. This arrangement provides optimal vibration transmission for condition monitoring of the machine.

[0109] Temperature transfer from the machine to the temperature sensor 108 via the ¼-28 mounting studs and stainless steel base is further optimized using a copper feedthrough in the first rigid section of the PCB assembly. This arrangement eliminates the need to machine the stainless steel base to directly position the temperature sensor 108 there. Machining the base and positioning the temperature sensor directly thereto could cause warping of the first rigid section of the PCB assembly. This warping could also reduce vibration transfer to the vibration sensor 106B and lower the overall sensitivity of the vibration measurement.

[0110] Other improvements include using a lower-power, lower-sensitivity accelerometer (i.e., vibration sensor 106A) to allow device 102 to operate in sleep mode and wake up in response to larger vibrations for more accurate measurements, including using the wider frequency range of vibration sensor 106B (e.g., a precision three-axis MEMS accelerometer). The wake-up mode then activates communication interface 114 and antenna 116 for data transmission. This dual-accelerometer arrangement allows for continuous vibration monitoring while maintaining low power consumption.

[0111] Additionally, device 102 utilizes non-volatile flash memory. This allows data to be stored while powered down until a transmission opportunity arises via communication interface 114. For example, device 102 may be out of range of the sensor aggregation hub and / or network while data is being recorded. Once device 102 is within range of the hub and / or network, the data can be transferred. Non-volatile flash memory also allows the battery to fail and subsequently be replaced without losing any recorded data.

[0112] Additional features and improvements include the ability to remotely program the device 102 for specific types of measurements, including vibration spectrum ranges, temperature ranges, trigger levels, alarm reporting, and the like.

[0113] The device 102 complies with the International Electrotechnical Commission (IEC) 60529 standard, including an IP66 rating, which includes protection against dust ingress and protection against powerful water jets. The device 102 also complies with the National Fire Protection Association (NFPA) Publication 70, National Electrical Code® (NEC) Articles 500 through 506 for Class 1, Division 2, Groups A, B, C, and D.

[0114] Although the embodiments have been described in conjunction with the preferred embodiments of the various drawings, it is to be understood that other similar embodiments may be used, or modifications and additions may be made to the described embodiments in order to perform the same functions without departing therefrom. Therefore, the disclosed embodiments should not be limited to any single embodiment, but rather should be interpreted in breadth and scope according to the appended claims.

Claims

1. A sensor device comprising: a capsule assembly comprising a cap, a base mechanically coupled to the cap, and a support bracket mechanically coupled to the base; as well as A printed circuit board assembly comprising a first rigid section mounted to the base, a second rigid section electrically coupled to the first rigid section using a first flexible printed circuit board interconnect, a third rigid section electrically coupled to the second rigid section using a second flexible printed circuit board interconnect, a processor, a memory electrically coupled to the processor, a first sensor electrically coupled to the processor, a second sensor electrically coupled to the processor, and a communication interface electrically coupled to the processor, wherein the second rigid section includes a battery clip configured to secure a battery, and wherein the first rigid section, the second rigid section, and the third rigid section are configured to surround the battery.

2. The sensor device according to claim 1, wherein The communication interface is a wireless communication interface, and at least a portion of the cap is substantially radio frequency transparent.

3. The sensor device according to claim 2, wherein: The sensor assembly, when installed, generally forms the shape of a tapered cylinder having a maximum height of 2.1 inches and a maximum diameter of 1.2 inches.

4. The sensor device according to claim 3, wherein The wireless communication interface is a Bluetooth® low energy interface.

5. The sensor device according to claim 1, wherein The first sensor is a vibration sensor. The sensor device according to claim 5 , wherein: The vibration sensor is an acceleration sensor.

7. The sensor device according to claim 1, wherein The second sensor is a temperature sensor.

8. The sensor device according to claim 7, wherein The temperature sensor includes at least one of a thermocouple or a thermistor.

9. The sensor device of claim 1, further comprising the battery.

10. The sensor device according to claim 9, wherein The battery is a lithium battery.

11. The sensor device according to claim 1, wherein The processor and the memory are embedded in a microcontroller.

12. The sensor device according to claim 1, further comprising a third sensor, wherein: The first sensor is a low-sensitivity vibration sensor configured to operate in a sleep state of the sensor device and further configured to trigger the sensor device to enter an active state; The second sensor is a temperature sensor; as well as The third sensor is a high-sensitivity vibration sensor configured to operate in the active state of the sensor device.

13. The sensor device according to claim 12, wherein: The third sensor is a three-axis acceleration sensor having an x-axis, a y-axis, and a z-axis; and The three-axis acceleration sensor is positioned so that the z-axis is approximately perpendicular to the mounting surface of the base.

14. The sensor device according to claim 13, wherein: The base is configured to allow the mounting surface to be attached to a machine surface to allow monitoring of machine vibration and machine temperature; The base is configured to allow the support bracket to be rotated by a user about an axis vertical to the mounting surface; and The printed circuit board assembly and the triaxial acceleration sensor are fixed relative to the support bracket.

15. The sensor device according to claim 14, wherein The base includes a threaded mounting stud positioned approximately perpendicular to the mounting surface.

16. A method of manufacturing a sensor device, the method comprising: mechanically assembling a printed circuit board assembly, the printed circuit board assembly comprising a first rigid section, a second rigid section electrically coupled to the first rigid section using a first flexible printed circuit board interconnect, a third rigid section electrically coupled to the second rigid section using a second flexible printed circuit board interconnect, a processor, a memory electrically coupled to the processor, a first sensor electrically coupled to the processor, a second sensor electrically coupled to the processor, and a communication interface electrically coupled to the processor, wherein the second rigid section comprises a battery clip configured to secure a battery, and wherein the first rigid section, the second rigid section, and the third rigid section are configured to surround the battery; and mechanically assembling the printed circuit board assembly within an enclosure comprising a cap, a base mechanically coupled to the cap, and a mount mechanically coupled to the base, Wherein, the first rigid section is mounted to the base.

17. A method of using a sensor device, the method comprising: mounting a sensor device on a machine, the sensor device comprising a housing assembly, a printed circuit board assembly, and a battery, the housing assembly comprising a cap, a base mechanically coupled to the cap, and a support bracket mechanically coupled to the base, the printed circuit board assembly comprising a first rigid section mounted to the base, a second rigid section electrically coupled to the first rigid section using a first flexible printed circuit board interconnect, a third rigid section electrically coupled to the second rigid section using a second flexible printed circuit board interconnect, a processor, a memory coupled to the processor, a first sensor coupled to the processor, a second sensor coupled to the processor, and a communication interface coupled to the processor, wherein the second rigid section comprises a battery clip configured to secure the battery, and wherein the first rigid section, the second rigid section, and the third rigid section are configured to surround the battery; and First sensor data and second sensor data transmitted via the communication interface are received.

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