Light emitting element package and method of manufacturing the same

Abstract

A simpler light-emitting element package is achieved. The light-emitting element package (1) includes: a plurality of light-emitting elements (10), each having a first electrode (16) and a second electrode (18) and having a light-emitting surface (19a) for emitting light; an optical auxiliary layer (20) in which light-emitting elements are embedded with at least the light-emitting surface exposed; a first wiring layer (30) including wiring that is directly and electrically connected to the first electrode and the second electrode respectively, and the wiring extending on the surface of the optical auxiliary layer opposite to the surface exposed to the light-emitting surface; a first insulating layer (40) provided to cover the first wiring layer and the optical auxiliary layer; a second wiring layer (50) provided on the first insulating layer and electrically connected to the first wiring layer; and a sealing portion (60) that seals the light-emitting elements by covering the light-emitting surface and allows light emitted from the light-emitting surface to pass through.

Description

Technical Field

[0001] This invention relates to the packaging of light-emitting elements and methods for manufacturing the same. Background Technology

[0002] Displays that use tiny LED elements with a planar size (chip size) of less than 200 μm square when viewed from one side in the thickness direction as constituent elements of pixels (subpixels) are generally referred to as mini LED displays when using LED elements with a planar size of 100 μm square to 200 μm square, and as micro LED displays when using LED elements with a planar size of less than 100 μm square.

[0003] Conventionally, for example, in the packaging of light-emitting elements for display devices, a flip-chip ball grid array (FCBGA) is used, in which multiple monolithic LED elements are mounted on a wiring substrate by solder balls (bumps) (see Patent Document 1).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent document 1: Japanese Patent Application Publication No. 2018-129496. Summary of the Invention

[0007] The technical problem that the invention aims to solve

[0008] However, in the aforementioned method of packaging and manufacturing light-emitting elements, it is difficult to further reduce the size of the bumps, thus making it difficult to further reduce, for example, the chip size of the mounted light-emitting element, the size of the electrode pad, and the wiring spacing of the wiring substrate. Furthermore, since mounting is done through bumps, the manufacturing process becomes more complex, which may lead to a decrease in the yield of the light-emitting element package.

[0009] Technical solutions adopted to solve technical problems

[0010] This invention was made in view of the above-mentioned problems. After careful research in order to solve the problems, the inventors discovered that a simpler light-emitting element package can be achieved without using solder balls, thus completing this invention. That is, this invention provides the following [1] to

[10] ;

[0011] [1] A light-emitting element package comprising:

[0012] Multiple light-emitting elements, each having a first electrode and a second electrode, and having a light-emitting surface that emits light;

[0013] An optical auxiliary layer in which the light-emitting element is embedded with at least the light-emitting surface exposed;

[0014] A first wiring layer, the first wiring layer comprising wiring that is directly and electrically connected to the first electrode and / or the second electrode, and wiring that extends on the surface of the optical auxiliary layer opposite to the exposed surface of the light-emitting surface;

[0015] A first insulating layer is provided such that it covers the first wiring layer and the optical auxiliary layer;

[0016] A second wiring layer is disposed on the first insulating layer and electrically connected to the first wiring layer; and a sealing portion is provided to seal the light-emitting element in a manner that covers the light-emitting surface, while allowing light emitted from the light-emitting surface to pass through.

[0017] [2] According to the light-emitting element package described in [1], wherein the light-emitting element is an LED element with a planar dimension of less than 100 μm square when viewed from one side in the thickness direction;

[0018] [3] The light-emitting element package according to [1] or [2], wherein the optical auxiliary layer is a white layer with a reflectivity of more than 90% for incident light with a wavelength of 450 nm;

[0019] [4] The light-emitting element package according to [1] or [2], wherein the optical auxiliary layer is a black layer and the transmittance of the black layer to incident light with a wavelength of 450 nm is less than 5%;

[0020] [5] A light-emitting element package according to any one of [1] to [4], wherein the sealing portion and the optical auxiliary layer comprise a cured product obtained by curing a resin composition;

[0021] [6] The light-emitting element package according to any one of [1] to [5], wherein the curing shrinkage of the cured product obtained by curing the resin composition is less than 0.5%;

[0022] [7] A light-emitting element package according to any one of [1] to [6], wherein the resin composition for forming the optical auxiliary layer comprises an epoxy resin;

[0023] [8] A light-emitting element package according to any one of [1] to [7], wherein the visible light transmittance of the sealing portion is 90% or more;

[0024] [9] A method for manufacturing a light-emitting element package, comprising:

[0025] The process of preparing a support body with an adhesive layer and multiple light-emitting elements having a first electrode and a second electrode and having a light-emitting surface that emits light.

[0026] The process of arranging a plurality of light-emitting elements on the adhesive layer in a manner that contacts the light-emitting surface of the light-emitting element; the process of forming an optical auxiliary layer in which a plurality of light-emitting elements are embedded and which covers the adhesive layer;

[0027] The process of forming a first wiring layer containing wiring on the optical auxiliary layer, wherein the wiring is directly and electrically connected to the first electrode and / or the second electrode, and is wiring that extends on the surface of the optical auxiliary layer opposite to the exposed surface of the light-emitting surface;

[0028] The process of forming a first insulating layer in a manner that covers the first wiring layer and the optical auxiliary layer; and

[0029] The process of forming a second wiring layer disposed on the first insulating layer and electrically connected to the first wiring layer;

[0030]

[10] According to the manufacturing method of the light-emitting element package described in [9], wherein,

[0031] The light-emitting element is an LED element with a planar dimension of less than 100μm square when viewed from one side in the thickness direction.

[0032] The process of forming the first wiring layer and the process of forming the second wiring layer are processes of forming wiring layers by a semi-additive method or a modified semi-additive method.

[0033] The effects of the invention

[0034] According to the light-emitting element package of the present invention, the planar size of the mounted light-emitting element, the size of the electrode pad, and the pitch of the wiring can be further reduced. In addition, the manufacturing method of the light-emitting element package according to the present invention can improve the yield of the light-emitting element package through a simplified process.

[0035] Brief description of the attached diagram

[0036] Figure 1 This is a schematic diagram showing the cut end face of the light-emitting element package of the first embodiment, which is cut in a direction orthogonal to the thickness direction;

[0037] Figure 2 It is used to explain and Figure 1 A schematic diagram of a configuration example related to the second embodiment of the light-emitting element package is also shown;

[0038] Figure 3A This is a schematic diagram illustrating the manufacturing method of a light-emitting element package;

[0039] Figure 3B This is a schematic diagram illustrating the manufacturing method of a light-emitting element package;

[0040] Figure 3C This is a schematic diagram illustrating the manufacturing method of a light-emitting element package;

[0041] Figure 3D This is a schematic diagram illustrating the manufacturing method of a light-emitting element package;

[0042] Figure 3E This is a schematic diagram illustrating the manufacturing method of a light-emitting element package. Detailed Implementation

[0043] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that the drawings are merely simplified illustrations of the shape, size, and arrangement of the constituent elements to the extent that the invention can be understood. Furthermore, the present invention is not limited to the following description, and the constituent elements may be appropriately modified without departing from the spirit of the invention. Moreover, in the drawings used in the following description, the same constituent elements are denoted by the same symbol, and repeated descriptions may sometimes be omitted.

[0044] The light-emitting element package of this embodiment includes: a light-emitting element having a first electrode and a second electrode, and having a light-emitting surface that emits light; an optical auxiliary layer in which the light-emitting element is embedded, with at least the light-emitting surface exposed; a first wiring layer including wiring that is directly and electrically connected to the first electrode and / or the second electrode, and extending on the surface of the optical auxiliary layer opposite to the surface exposed to the light-emitting surface; a first insulating layer provided to cover the first wiring layer and the optical auxiliary layer; a second wiring layer provided on the first insulating layer and electrically connected to the first wiring layer; and a sealing portion that seals the light-emitting element to cover the light-emitting surface, and allows light emitted from the light-emitting surface to pass through. Hereinafter, embodiments of the light-emitting element package, the constituent elements of the light-emitting element package, and a method for manufacturing the light-emitting element package will be specifically described.

[0045] 1. Example of LED package configuration

[0046] (1) First implementation method

[0047] Reference Figure 1 An example of the configuration of the light-emitting element package according to the first embodiment of the present invention will be described.

[0048] Figure 1 This is a schematic diagram showing the cut end face of the light-emitting element package of the first embodiment, which is cut in a direction orthogonal to the thickness direction.

[0049] The constituent elements of the light-emitting element package that can constitute the first embodiment will be described in detail.

[0050] like Figure 1 As shown, the light-emitting element package 1 according to the first embodiment includes a plurality of light-emitting elements 10. The composition of the light-emitting elements 10 is not particularly limited, and any suitable light-emitting element known in the prior art that is available on the market can be used. Examples of light-emitting elements 10 include LED elements whose light-emitting material is an inorganic compound and OLED elements whose light-emitting element is an organic compound.

[0051] Regarding the light-emitting element 10, especially when the light-emitting element package 1 is applied to a display device, it is preferable that the planar size when viewed from one side in the thickness direction is generally 100 μm square or more and 200 μm square or less, and more preferably a mini LED element with a size of 100 μm square or more and 150 μm square or less, or a micro LED element with a size of less than 100 μm square.

[0052] The light-emitting element 10 has a light-emitting surface 19a that emits light. In this configuration example, the shape of the light-emitting surface 19a is quadrilateral (square), but it is not limited to this. Here, the size of the light-emitting surface 19a is approximately the same as the planar size of the light-emitting element 10 when viewed from one side in the thickness direction.

[0053] Figure 1 The diagram illustrates three light-emitting elements 10. Specifically, the light-emitting elements 10 include a first light-emitting element 10a (red), a second light-emitting element 10b (green), and a third light-emitting element 10c (blue). The first light-emitting element 10a, the second light-emitting element 10b, and the third light-emitting element 10c are each equivalent to a so-called sub-pixel. Typically, these three form a group, constituting one pixel.

[0054] In the embodiments of the present invention, it is assumed that the light-emitting element 10 is an LED element. Therefore, an example of the configuration of the light-emitting element 10 as an LED element will be described here.

[0055] like Figure 1 As shown, the light-emitting element 10 includes a first conductive semiconductor layer 12 and a second conductive semiconductor layer 14 bonded to the first conductive semiconductor layer 12. Here, if the first conductive semiconductor layer 12 is an n-type semiconductor layer, the second conductive semiconductor layer 14 is a p-type semiconductor layer. Conversely, if the first conductive semiconductor layer 12 is a p-type semiconductor layer, the second conductive semiconductor layer 14 is an n-type semiconductor layer. In this embodiment, the second conductive semiconductor layer 14 is bonded in such a way that a portion of one surface of the first conductive semiconductor layer 12 is exposed.

[0056] On the opposite side surface to the bonding surface of the second conductive semiconductor layer 14 and the first conductive semiconductor layer 12, a second electrode 18 is provided in a manner that is bonded to the first conductive semiconductor layer 12, and a first electrode 16 is provided on the second conductive semiconductor layer 14 in a manner that is bonded.

[0057] On the opposite surface of the first conductive semiconductor layer 12, opposite to the surface where the second conductive semiconductor layer 14 and the second electrode 18 are bonded, a surface is disposed in such a way that it is bonded to one main surface of the sapphire substrate 19. The other main surface of the sapphire substrate 19, opposite to the main surface where the second conductive semiconductor layer 14 is bonded, is designated as the light-emitting surface 19a. That is, in this configuration example, the light-emitting element 10 is a horizontally structured LED element. However, it is not limited to this; a vertically structured LED element may also be used.

[0058] The light-emitting element package 1 includes an optical auxiliary layer 20. The optical auxiliary layer 20 has functions such as optical correction of light emitted from the light-emitting element 10. The optical auxiliary layer 20 has functions such as improving the contrast or brightness in a display device using the light-emitting element package 1.

[0059] Specific examples of the optical auxiliary layer 20 include: a white layer that can improve contrast by reflecting light emitted from the light-emitting element 10, and a black layer that can improve brightness by absorbing light emitted from the light-emitting element 10.

[0060] In the light-emitting element package 1, the white layer has a reflectivity of at least 80% for incident light with a wavelength of 450nm, which is more preferably at least 85% and even more preferably at least 90%.

[0061] The reflectance of the white layer can be measured using a spectrophotometer. Specifically, firstly, a sheet-like resin composition for forming the white layer is laminated onto a glass cloth substrate epoxy resin double-sided copper-clad laminate (copper foil thickness 18μm, substrate thickness 0.8mm, Panasonic Electric Works Co., Ltd. "R5151ES") using a batch vacuum pressure laminator (MVLP-500, manufactured by Meiki Seisakusho Co., Ltd.). This lamination can be performed as follows: by depressurizing at 13hPa for 30 seconds, followed by pressing at 0.74MPa, 120°C, and 30 seconds.

[0062] Next, the material is cured at 150°C for at least 30 minutes to form a sheet for reflectance measurement. A slice measuring 50mm wide and 50mm long is cut from this sheet. The reflectance spectrum is measured using a fiber optic spectrophotometer (MCPD-7700, model 311C, manufactured by Otsuka Electronics Co., Ltd., external light source unit: MC-2564 halogen lamp (24V, 150W)) equipped with an 80mm integrating sphere (model SRS-99-010). The reflectance at a wavelength of 450nm is then calculated. The reflectance of a white layer can be measured using this method.

[0063] It should be noted that in the above measurements, the distance between the integrating sphere and the reflectivity sheet was set to 0 mm, and barium titanate molded products were used as a reference.

[0064] In the light-emitting element package 1, the transmittance of the black layer to incident light with a wavelength of 450nm is preferably less than 50%, more preferably less than 30%, further preferably less than 10%, and especially preferably less than 5%.

[0065] The transmittance of the black layer can be measured using a spectrophotometer. Specifically, firstly, a resin composition for forming the black layer, which is in sheet form, is laminated onto alkali-free glass (50mm × 50mm, 700μm thick, manufactured by Nippon Electric Glass Co., Ltd., "OA-10G") using a batch vacuum pressure laminator, and then cured to form a sheet for transmittance measurement. This lamination and curing can be performed using the same method as that used in the measurement of the reflectance of the white layer, which has already been described.

[0066] Next, the obtained transmittance measurement sheet is placed in a fiber optic spectrophotometer used for reflectance measurement to measure the transmittance spectrum and calculate the transmittance spectrum of the incident light at 450 nm. The transmittance of the black layer can be measured in this way.

[0067] It should be noted that in the above measurements, the distance between the integrating sphere and the transmittance sheet was set to 0 mm, which can be used with reference to the ambient air.

[0068] The white and black layers may contain, for example, thermosetting resins, photocurable resins, white pigments (white layers), titanium dioxide (white layers), barium sulfate (white layers), black pigments (black layers), carbon black (black layers), and titanium black (black layers) as components. From the viewpoint of heat resistance and micro-wiring processability, the optical auxiliary layer 20, i.e., the white and black layers, preferably contains a cured product obtained by curing a resin composition containing thermosetting resins (e.g., epoxy resins), titanium dioxide (white layers), and carbon black (black layers).

[0069] The following details the components that may be contained in the white and black layers, i.e., the components of the resin compositions used to form the white and black layers.

[0070] 1) Resin composition for forming a white layer

[0071] As a resin composition for forming a white layer, any form is acceptable as long as the reflectance of incident light at a wavelength of 450 nm is 80% or higher. Examples include resin compositions containing (A) an epoxy resin that is liquid or semi-solid at 25°C, (B) a phenoxy resin containing fluorine atoms, (C) a white inorganic oxide, and (D) a curing accelerator.

[0072] The resin composition for forming a white layer may further include, in addition to components (A) to (D), any other components. Examples of such components include, for example, (E) an antioxidant, (F) an ultraviolet absorber, (G) a solid epoxy resin, (H) silica, and (I) other additives.

[0073] <(A) Composition: Epoxy resin that is liquid or semi-solid at 25°C>

[0074] The resin composition for forming a white layer contains, as component (A), an epoxy resin that is liquid or semi-solid at 25°C. By including component (A) in the resin composition for forming a white layer, the melt viscosity can be reduced and the flexibility improved. Component (A) can be used alone or in combination of two or more.

[0075] Here, the determination of whether epoxy resin is in liquid, semi-solid, or solid state can be carried out in accordance with the "Method for Confirmation of Liquid State" in Appendix 2 of the Japanese Ministry of Housing and Urban-Rural Development Ordinance (Ordinance No. 1 of the Ministry of Housing and Urban-Rural Development of Japan, 1989) concerning the testing and properties of hazardous materials.

[0076] Epoxy resins that are liquid or semi-solid at 25°C are preferably epoxy resins having two or more epoxy groups per molecule. Furthermore, epoxy resins preferably have an aromatic structure; when using two or more epoxy resins, it is even more preferable that at least one has an aromatic structure. An aromatic structure refers to a chemical structure generally defined as aromatic, including polycyclic aromatics and aromatic heterocycles. The proportion of epoxy resins having two or more epoxy groups per molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more, relative to 100% by mass of the non-volatile components of the epoxy resin.

[0077] The epoxy resins that are liquid or semi-solid at 25°C are preferably: aromatic epoxy resins such as Glycirol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, and phenolic varnish type epoxy resin; and non-aromatic epoxy resins such as alicyclic epoxy resin with an ester skeleton, cyclohexanediol type epoxy resin, and epoxy resin with a butadiene structure. Aromatic epoxy resins, bisphenol A type epoxy resin, and bisphenol F type epoxy resin are more preferred. Specific examples of liquid and semi-solid epoxy resins include: DIC Corporation's "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resin); Mitsubishi Chemical Corporation's "HP820" (aromatic epoxy resin); and Mitsubishi Chemical Corporation's "828US", "jER828EL" (bisphenol A type epoxy resin), "jER807" (bisphenol F type epoxy resin), and "jER152" (phenolic varnish type epoxy resin). The following epoxy resins are used in the production of Japanese chemical products: "630" and "630LSD" (glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "ED-523T" (Glycirol type epoxy resin (ADEKAGlycirol)), "EP-3980S" (glycidylamine type epoxy resin), and "EP-4088S" (dicyclopentadiene type epoxy resin) manufactured by ADEKA Co., Ltd.; "ZX1059" (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd.; and Nagase. ChemteX Corporation's "EX-721" (glycidyl ester type epoxy resin), Daicel Corporation's "CELLOXIDE 2021P" (alicyclic epoxy resin with ester skeleton) and "PB-3600" (epoxy resin with butadiene structure), Nippon Steel Chemical Materials Co., Ltd.'s "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane), and Sumitomo Chemical Co., Ltd.'s "ELM-100," etc. These can be used individually or in combination.

[0078] The epoxy equivalent of epoxy resins that are liquid or semi-solid at 25°C is preferably 50 g / eq. to 5000 g / eq., more preferably 50 g / eq. to 3000 g / eq., further preferably 80 g / eq. to 2000 g / eq., and even more preferably 110 g / eq. to 1000 g / eq. By ensuring this range, the crosslinking density of the cured product is sufficient, resulting in a cured product with low surface roughness. It should be noted that the epoxy equivalent can be determined according to JIS K7236, corresponding to the mass of resin containing 1 epoxy group equivalent.

[0079] The weight-average molecular weight of epoxy resins that are liquid or semi-solid at 25°C is preferably 100–5000, more preferably 250–3000, and even more preferably 400–1500. Here, the weight-average molecular weight of the epoxy resin is the weight-average molecular weight converted from that of polystyrene as determined by gel permeation chromatography (GPC).

[0080] From the viewpoint of improving embeddability while reducing the minimum melt viscosity, when the non-volatile component in the resin composition is set to 100% by mass, the content of component (A) is preferably 1% by mass or more, more preferably 3% by mass or more, further preferably 5% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, and even more preferably 10% by mass or less. It should be noted that, unless otherwise specified, the content of each component in the resin composition in this invention refers to the value when the non-volatile component in the resin composition is set to 100% by mass.

[0081] <(B) Component: Phenoyl resin containing fluorine atoms>

[0082] The resin composition for forming a white layer contains a phenoxy resin with fluorine atoms as component (B). By including component (B), and particularly utilizing the fluorine atoms in component (B), the reflectivity and heat resistance of the cured resin composition can be improved. As a result, a cured product with improved reflectivity can be obtained. Component (B) can be used alone or in combination of two or more.

[0083] (B) The weight-average molecular weight of the polystyrene component is preferably in the range of 8,000 to 70,000, more preferably in the range of 10,000 to 60,000, and even more preferably in the range of 20,000 to 60,000.

[0084] The weight-average molecular weight of polystyrene was determined by gel permeation chromatography (GPC). Specifically, the weight-average molecular weight of polystyrene was determined using an LC-9A / RID-6A instrument manufactured by Shimadzu Corporation, with a Shodex K-800P / K-804L / K-804L column manufactured by Showa Denko Corporation, using chloroform or similar as the mobile phase, and the column temperature was set to 40°C. The molecular weight was calculated using a calibration curve of standard polystyrene (the same applies in the following description).

[0085] As component (B), examples include phenoxy resins containing fluorine atoms that have one or more skeletons selected from the following: bisphenol A skeleton, bisphenol F skeleton, bisphenol AF skeleton, bisphenol S skeleton, bisphenol acetylbenzene skeleton, phenolic skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton.

[0086] As component (B), a phenoxy resin having one or more fluorine atoms may be used. Preferably, the backbone of the phenoxy resin contains fluorine atoms. The backbone of the phenoxy resin refers to the repeating units constituting component (B).

[0087] Regarding the number of fluorine atoms contained in the skeleton constituting the phenoxy resin, on average, each skeleton constituting the phenoxy resin preferably contains more than one, more preferably more than two, and even more preferably more than three or five. There is no particular upper limit, and it can be less than ten, etc.

[0088] Examples of phenoxy resins containing fluorine atoms include "YL7876B40", "YL7957B40", "YL7383BH30", and "YL7384BH30" manufactured by Mitsubishi Chemical Corporation.

[0089] From the viewpoint of obtaining a cured product with improved reflectivity, when the non-volatile component in the resin composition is set to 100% by mass, the content of component (B) is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more. The upper limit is preferably 30% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less.

[0090] When the content of component (A) in the resin composition is set to 100% by mass, and the content of component (B) in the resin composition is set to 100% by mass, the ratio of A1 / B1 is preferably 0.1 or more, more preferably 0.3 or more, even more preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, and even more preferably 2 or less. By adjusting A1 / B1 to the aforementioned range, the flexibility can be further improved.

[0091] <(C) Composition: White inorganic oxide>

[0092] The resin composition for forming a white layer contains a white inorganic oxide as component (C). However, component (C) does not include silica. By including component (C) in the resin composition, a cured product with improved reflectivity can be obtained. Here, white inorganic oxide refers to an inorganic oxide with a reflectivity of 90% or more for light with a wavelength of 500 nm.

[0093] Examples of component (C) include alumina, aluminosilicate, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, alumina, titanium oxide, zirconium oxide, magnesium oxide, and barium titanate are preferred, with titanium oxide being particularly preferred. A single white inorganic oxide as component (C) may be used alone or in combination of two or more.

[0094] The titanium oxide used as component (C) can be any of the rutile, anatase, and brookite types. Among these, the rutile type is preferred from the viewpoint of further improving reflectivity. Titanium oxide obtained through methods such as the sulfuric acid process or the chlorination process can also be used.

[0095] Examples of commercially available products containing ingredient (C) include: PX3788 manufactured by Sakai Chemical Co., Ltd.; TIPAQUE CR-50, TIPAQUE CR-57, TIPAQUE CR-80, TIPAQUE CR-90, TIPAQUE CR-93, TIPAQUE CR-95, TIPAQUE CR-97, TIPAQUE CR-60, TIPAQUE CR-63, TIPAQUE CR-67, TIPAQUE CR-58, TIPAQUE CR-85, and TIPAQUE UT771 manufactured by Ishihara Sangyo Co., Ltd.; and Ti-Pure R-100, Ti-Pure R-101, Ti-Pure R-102, Ti-Pure R-103, Ti-Pure R-104, Ti-Pure R-105, and Ti-Pure R-108 manufactured by DuPont. R-900, Ti-Pure R-902, Ti-Pure R-960, Ti-Pure R-706, Ti-Pure R-931, "AHP300" manufactured by Nippon Light Metal Co., Ltd., and "Alunabeads (registered trademark) CB" (e.g., "CB-P05", "CB-A30S") manufactured by Showa Denko Co., Ltd.

[0096] The specific surface area of ​​component (C) is preferably 0.5 m². 2 / g or higher, preferably 1m 2 / g or higher, especially 2m 2 / g or above. There is no particular limit to the upper limit, but 80m is preferred. 2 Below / g, preferably 70m 2 / g or less or 60m 2 / g or less. Specific surface area can be obtained by adsorbing nitrogen gas onto the sample surface using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) according to the BET method, and calculating the specific surface area using the BET multi-point method.

[0097] (C) The average particle size of the component is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, preferably 5 μm or less, more preferably 2 μm or less, and even more preferably 1 μm or less.

[0098] The average particle size of component (C) can be determined by laser diffraction scattering based on the Mie scattering theory. Specifically, a particle size distribution of component (C) can be prepared on a volume basis using a laser diffraction scattering particle size distribution measuring device, and the median particle size can be used as the average particle size for measurement. As a sample for testing, 100 mg of component (C) and 10 g of methyl ethyl ketone can be weighed into a vial and dispersed ultrasonically for 10 minutes. For the sample, a laser diffraction particle size distribution measuring device can be used, employing the blue and red wavelengths of the light source, to measure the volume-based particle size distribution of component (C) in a flow cell manner. The average particle size is calculated based on the obtained particle size distribution as the median particle size. Examples of laser diffraction particle size distribution measuring devices include, for instance, the "LA-960" manufactured by Horiba Manufacturing Co., Ltd.

[0099] From the viewpoint of improving moisture resistance and dispersibility, component (C) is preferably treated with a surface treatment agent. Examples of surface treatment agents include vinyl silane coupling agents, (meth)acrylic acid coupling agents, fluorinated silane coupling agents, aminosilane coupling agents, epoxy silane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, and titanate coupling agents. Among these, aminosilane coupling agents are preferred. Furthermore, a single surface treatment agent or a combination of two or more agents can be used.

[0100] Commercially available surface treatment agents include, for example: KBM1003 (vinyltriethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd.; KBM503 (3-methacryloyloxypropyltriethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd.; KBM403 (3-epoxypropoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd.; KBM803 (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd.; and KBE903 (3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd. Products manufactured by Shin-Etsu Chemical Co., Ltd. include: N-phenyl-3-aminopropyltrimethoxysilane, SZ-31 (hexamethyldisilazane), KBM103 (phenyltrimethoxysilane), KBM-4803 (long-chain epoxy silane coupling agent), and KBM-7103 (3,3,3-trifluoropropyltrimethoxysilane).

[0101] From the viewpoint of improving the dispersibility of white inorganic oxides, the degree of surface treatment by the surface treatment agent is preferably within a specified range. Specifically, it is preferable that 100 parts by mass of white inorganic oxides are surface treated with 0.2 to 5 parts by mass of the surface treatment agent, more preferably with 0.2 to 3 parts by mass of the surface treatment agent, and even more preferably with 0.3 to 2 parts by mass of the surface treatment agent.

[0102] The degree of surface treatment by the surface treatment agent can be evaluated by the carbon content per unit surface area of ​​the white inorganic oxide. From the viewpoint of improving the dispersibility of the white inorganic oxide, the carbon content per unit surface area of ​​the white inorganic oxide is preferably 0.02 mg / m². 2 The above is preferred, ideally 0.1 mg / m². 2 The above, and even better, is 0.2 mg / m². 2 That's all. On the other hand, from the viewpoint of suppressing the increase in melt viscosity of the resin composition and melt viscosity in sheet form, 1 mg / m³ is preferable. 2 The following is preferable: 0.8 mg / m² 2 The following is even better: 0.5 mg / m² 2 the following.

[0103] The carbon content per unit surface area of ​​white inorganic oxides can be determined after cleaning the surface-treated white inorganic oxides with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, sufficient MEK is added to the surface-treated white inorganic oxides as a solvent, and the oxides are ultrasonically cleaned at 25°C for 5 minutes. After removing the supernatant and drying the solid components, the carbon content per unit surface area of ​​the white inorganic oxides can be determined using a carbon analyzer. A suitable carbon analyzer is the "EMIA-320V" manufactured by Horiba Corporation.

[0104] From the viewpoint of obtaining a cured product with improved reflectivity, when the non-volatile component in the resin composition is set to 100% by mass, the content of component (C) is preferably 60% by mass or more, more preferably 65% ​​by mass or more, even more preferably 70% by mass or more, even more preferably 75% by mass or more, preferably 95% by mass or less, more preferably 90% by mass or less, and even more preferably 80% by mass or less.

[0105] When the content of component (C) is set to C1 when the non-volatile component in the resin composition is set to 100% by mass, the B1 / C1 ratio is preferably 0.01 or more, more preferably 0.03 or more, even more preferably 0.05 or more, preferably 1 or less, more preferably 0.5 or less, and even more preferably 0.3 or less.

[0106] Furthermore, (A1+B1) / C1 is preferably above 0.01, more preferably above 0.05, even more preferably above 0.1, preferably below 3, even more preferably below 1, and even more preferably below 0.5.

[0107] <(D) Ingredient: Curing Accelerator>

[0108] The resin composition for forming a white layer contains a curing accelerator as component (D). Component (D) typically has the function of reacting with component (A) to cure the resin composition. Examples of component (D) include phosphorus-based curing accelerators, imidazole-based curing accelerators, amine-based curing accelerators, guanidine-based curing accelerators, and metal-based curing accelerators. From the viewpoint of achieving higher reflectivity, phosphorus-based curing accelerators and imidazole-based curing accelerators are preferred as component (D), and phosphorus-based curing accelerators are even more preferred. Component (D) can be used alone or in combination of two or more.

[0109] From the viewpoint of achieving higher reflectivity, it is preferable for phosphorus-based curing accelerators to include those selected from... One or more of salts and phosphine.

[0110] As Salt, for example: Borate compounds, tetraphenyl Tetraphenylborate, n-butyl Tetraphenylborate, tetrabutyl Decanoate, (4-methylphenyl)triphenyl Thiocyanate, tetraphenyl Thiocyanate, butyltriphenyl Thiocyanate, etc.

[0111] Examples of phosphine species include triphenylphosphine, tricyclohexylphosphine, tributylphosphine, and methyldiphenylphosphine.

[0112] As a phosphorus-based curing accelerator, commercially available products can be used, such as "TBP-DA" manufactured by Hokuko Co., Ltd.

[0113] Examples of imidazole curing accelerators include: 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole Trimethicone, 1-Cyanoethyl-2-phenylimidazolium Trimethicone salt, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-triazine isocyanuric acid adduct, 2-phenylimidazolyl isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazolium, 2-phenyl-4-methyl-5-hydroxymethylimidazolium, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium Imidazole compounds such as chlorides, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole and epoxy resins. Among them, 2-ethyl-4-methylimidazoline and 1-benzyl-2-phenylimidazoline are preferred as imidazole curing accelerators.

[0114] As an imidazole curing accelerator, commercially available products can be used, such as "P200-H50" manufactured by Mitsubishi Chemical Corporation and "1B2PZ-10M" manufactured by Shikoku Kasei Corporation.

[0115] Examples of amine curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo[5.4.0]undecene. Among these, 4-dimethylaminopyridine and 1,8-diazabicyclo[5.4.0]undecene are preferred as amine curing accelerators.

[0116] Examples of guanidine curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]decene-5, 7-methyl-1,5,7-triazabicyclo[4.4.0]decene-5, 1-methylbiguanidine, 1-ethylbiguanidine, 1-n-butylbiguanidine, 1-n-octadecylbiguanidine, 1,1-dimethylbiguanidine, 1,1-diethylbiguanidine, 1-cyclohexylbiguanidine, 1-allylbiguanidine, 1-phenylbiguanidine, and 1-(o-tolyl)biguanidine. Among these, dicyandiamide and 1,5,7-triazabicyclo[4.4.0]decene-5 are preferred as guanidine curing accelerators.

[0117] Examples of organometallic curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) and cobalt(III) acetylacetone, organocopper(II) acetylacetone, organozinc(II) acetylacetone, organoiron(III) acetylacetone, organonickel(II) acetylacetone, and organomanganese(II) acetylacetone. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0118] From the viewpoint of achieving higher reflectivity, when the non-volatile component in the resin composition is set to 100% by mass, the content of component (D) is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, preferably 3% by mass or less, more preferably 1% by mass or less, and even more preferably 0.5% by mass or less.

[0119] <(E) Ingredient: Antioxidants>

[0120] In addition to the components mentioned above, the resin composition for forming the white layer may further contain an antioxidant as component (E) as an optional component.

[0121] Examples of antioxidants that can be classified as component (E) include hindered phenolic antioxidants, phosphorus antioxidants, and sulfur antioxidants. Among these, hindered phenolic antioxidants are preferred as component (E). Antioxidants can be used alone or in combination of two or more.

[0122] Specific examples of component (E) include butylated hydroxytoluene (BHT), pentaerythritol tetra(3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate (“IRGANOX 1010” manufactured by Ciba Japan), 2,2-thiodiethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] (“IRGANOX 1035” manufactured by Ciba Japan), and 1,3,5-tris[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]-1,3,5-triazine-2,4,6(1H,3H,5H)-trione (“IRGANOX 3114” manufactured by Ciba Japan), etc.

[0123] When the non-volatile component in the resin composition is set to 100% by mass, the content of component (E) is preferably 0.01% by mass or more, more preferably 0.02% by mass or more, even more preferably 0.03% by mass or more, preferably 3% by mass or less, more preferably 2% by mass or less, and even more preferably 1% by mass or less.

[0124] <(F) Ingredient: Ultraviolet absorber>

[0125] From the viewpoint of further improving the photostability of the resin composition, the resin composition for forming the white layer may, as an arbitrary component, contain an ultraviolet absorber as component (F).

[0126] Examples of UV absorbers as component (F) include benzophenone-based UV absorbers, benzotriazole-based UV absorbers, and salicylic acid-based UV absorbers. A single UV absorber may be used alone, or two or more may be used in combination.

[0127] Examples of benzophenone-based ultraviolet absorbers include 2-hydroxy-4-octyloxybenzophenone, 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid, 2-hydroxy-4-n-octylbenzophenone, 2-hydroxy-4-n-dodecyloxybenzophenone, bis(5-benzoyl-4-hydroxy-2-methoxyphenyl)methane, 2,2'-dihydroxy-4-methoxybenzophenone, and 2,2'-dihydroxy-4,4'-dimethoxybenzophenone.

[0128] Examples of benzotriazole-based ultraviolet absorbers include 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-[2'-hydroxy-3',5'-bis(α,α-dimethylbenzyl)phenyl]-benzotriazole, 2-(2'-hydroxy-3',5-di-tert-butylphenyl)-benzotriazole, 2-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-3',5'-di-tert-pentyl)benzotriazole, 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole, and 2,2-methylenebis[4-(1,1,3,3-tetramethylbutyl)-6-(2N-benzotriazole-2-yl)phenol].

[0129] Examples of salicylic acid-based ultraviolet absorbers include phenyl salicylate, 4-tert-butylphenyl-2-hydroxybenzoate, phenyl-2-hydroxybenzoate, 2,4-di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate, hexadecyl-3,5-di-tert-butyl-4-hydroxybenzoate, ethylidene-2-cyano-3,3'-diphenylacrylate, 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-5'-methylphenyl)benzotriazole, 2-(2'-hydroxy-3'-tert-butyl-5'-methylphenyl)-5-chlorobenzotriazole, 2-hydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, and 2-hydroxy-4-octoxybenzophenone.

[0130] Commercially available products can be used as component (F). Examples of commercially available products as component (F) include BASF's "Chimassorb 81FL", ADEKA's LA-52 (butane-1,2,3,4-tetracarboxylic acid tetra(1,2,2,6,6-pentamethyl-4-piperidinyl) ester), LA-57 (1,2,3,4-butanetetracarboxylic acid tetra(2,2,6,6-tetramethyl-4-piperidinyl) ester), LA-63P (a mixture of esters of 1,2,3,4-butanetetracarboxylic acid, 1,2,2,6,6-pentamethyl-4-piperidinol, and 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane), and LA-72 (secanoic acid bis(1,2,2,6,6-pentamethyl-4-piperidinyl) ester).

[0131] From the viewpoint of further improving the light stability of the resin composition, when the non-volatile component in the resin composition is set to 100% by mass, the content of component (F) is preferably 0.01% by mass or more, more preferably 0.02% by mass or more, even more preferably 0.03% by mass or more, preferably 1% by mass or less, more preferably 0.5% by mass or less, and even more preferably 0.1% by mass or less.

[0132] <(G) Component: Epoxy resin, solid at 25°C>

[0133] The resin composition for forming the white layer may, as an optional component, further contain an epoxy resin (hereinafter referred to as "solid epoxy resin") that is solid at 25°C as component (G).

[0134] Solid epoxy resins preferably include epoxy resins having two or more epoxy groups per molecule. Furthermore, solid epoxy resins preferably have an aromatic structure; when using two or more epoxy resins, it is more preferable that at least one has an aromatic structure. The proportion of epoxy resins having two or more epoxy groups per molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more, relative to 100% by mass of the non-volatile component of the epoxy resin.

[0135] As solid epoxy resins, preferred are fluorinated epoxy resins such as bisphenol AF type epoxy resin and perfluoroalkyl type epoxy resin, naphthalene-type tetrafunctional epoxy resin, cresol-phenolic varnish type epoxy resin, dicyclopentadiene type epoxy resin, triphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, and tetraphenylethane type epoxy resin, with fluorinated epoxy resins being more preferred. Specific examples of solid epoxy resins include "HP4032H" (naphthalene type epoxy resin), "HP-4700", "HP-4710" (naphthalene type tetrafunctional epoxy resin), "N-690" (cresol-phenolic varnish type epoxy resin), "N-695" (cresol-phenolic varnish type epoxy resin), "HP-7200" (dicyclopentadiene type epoxy resin), and "HP-7200HH" (HP...). -7200H, "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthyl ether type epoxy resin), "EPPN-502H" (triphenol type epoxy resin), "NC7000L" (naphthol phenolic varnish type epoxy resin), "NC3000H", "NC3000" manufactured by Nippon Kayaku Co., Ltd. "NC3000L" and "NC3100" (biphenyl type epoxy resin); "ESN475V" (naphthalene type epoxy resin) and "ESN485" (naphthalene phenolic varnish type epoxy resin) manufactured by Nippon Steel Chemical Materials Co., Ltd.; "YX4000H", "YX4000", "YL6121" (biphenyl type epoxy resin), "YX4000HK" (bis(xylenol) type epoxy resin), and "YX88" manufactured by Mitsubishi Chemical Corporation. 00" (anthracene type epoxy resin), "PG-100" and "CG-500" manufactured by Osaka Gas Chemical Co., Ltd., "YL7760" (bisphenol AF type epoxy resin), "YL7800" (fluorene type epoxy resin), "jER1010" (solid bisphenol A type epoxy resin), "jER1031S" (tetraphenylethane type epoxy resin), "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd., etc.

[0136] The epoxy equivalent and weight-average molecular weight of the solid epoxy resin are the same as those of component (A).

[0137] When the non-volatile component in the resin composition is set to 100% by mass, the content of component (G) is preferably 1% by mass or more, more preferably 2% by mass or more, even more preferably 3% by mass or more, preferably 10% by mass or less, more preferably 8% by mass or less, and even more preferably 5% by mass or less.

[0138] <(H) Composition: Silicon Dioxide>

[0139] The resin composition for forming the white layer may further contain silica as an (H) component as an optional component.

[0140] Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Furthermore, spherical silica is preferred as the (H) component. The specific surface area and average particle size of silica are similar to those of the (C) component. Silica can be used alone or in combination of two or more types.

[0141] Commercially available products of silicon dioxide include, for example, "UFP-30" manufactured by DENKA Corporation, "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical Materials Co., Ltd., "YC100C", "YA050C", "YA050C-MJE" and "YA010C" manufactured by Yatuma Corporation, "SILFIL NSS-3N", "SILFIL NSS-4N" and "SILFIL NSS-5N" manufactured by Tokuyama Corporation, and "SC2500SQ", "SO-C4", "SO-C2" and "SO-C1" manufactured by Yatuma Corporation.

[0142] From the viewpoint of improving moisture resistance and dispersibility, component (H) is preferably treated with a surface treatment agent. The surface treatment agent is the same as that in component (C).

[0143] When the non-volatile component in the resin composition is set to 100% by mass, the content of component (H) is preferably 10% by mass or more, more preferably 20% by mass or more, even more preferably 25% by mass or more, preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 30% by mass or less.

[0144] <(I) Ingredients: Other additives>

[0145] In addition to the components mentioned above, the resin composition for forming the white layer may further contain other additives as component (I) as optional components. Examples of such additives include resin additives such as thickeners, defoamers, leveling agents, and adhesion promoters. These additives may be used alone or in combination of two or more. Those skilled in the art can appropriately determine the amount of each additive used.

[0146] 2) Resin composition for forming a black layer

[0147] As for the resin composition used to form the black layer, any form is acceptable as long as the transmittance of incident light at a wavelength of 450 nm is 30% or more, and it may include a thermosetting resin. Examples of thermosetting resins include epoxy resins and carboxyl-containing resins. From the viewpoint of improving high-temperature insulation resistance while maintaining various properties through combination with silane coupling agents having glycidyl and hydroxyl groups, it is preferable to use either epoxy resins or carboxyl-containing resins.

[0148] Epoxy resins, as thermosetting resins, are components used to impart heat resistance, and preferably include epoxy compounds having an aromatic backbone. Only one type of epoxy compound with an aromatic backbone may be used, or two or more may be used in combination. Due to their excellent heat resistance, phenolic varnish-type epoxy resins are preferred as epoxy resins. From the viewpoint of further improving the adhesion of the cured product, epoxy resins preferably include epoxy compounds having an alicyclic backbone. Only one type of epoxy compound with an alicyclic backbone may be used, or two or more may be used in combination. Furthermore, modified epoxy resins may be used in combination.

[0149] Examples of epoxy compounds with an aromatic backbone include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, cresol-phenolic varnish type epoxy compounds, phenol-phenolic varnish type epoxy compounds, glycidyl ester type epoxy compounds obtained by reacting a polybasic acid compound with an aromatic backbone with epichlorohydrin, and glycidyl ether type epoxy compounds with an aromatic backbone. From the viewpoint of further improving the strength and heat resistance of the cured product, epoxy compounds with an aromatic backbone are preferably those with a bisphenol backbone or a phenolic backbone.

[0150] The epoxy equivalent of the epoxy compound having an aromatic backbone is preferably 100 or more and 1000 or less. If the epoxy equivalent is 100 or more, the formability of the thermoplastic composition is better. If the epoxy equivalent is 1000 or less, the strength of the cured product can be further improved.

[0151] Specific examples of epoxides with an alicyclic skeleton include 2-(3,4-epoxy)cyclohexyl-5,5-spiro-(3,4-epoxy)cyclohexane-m-dioxane, 3,4-epoxycyclohexenylmethyl-3',4'-epoxycyclohexene carboxylate, dicyclopentadiene dioxide, vinylcyclohexene monoxide, 1,2-epoxy-4-vinylcyclohexane, 1,2:8,9-diepoxylimonene, ε-caprolactone-modified tetra(3,4-epoxycyclohexylmethyl)butanetetracarboxylate, and 1,2-epoxy-4-(2-epoxyethyl)cyclohexane adducts of 2,2-bis(hydroxymethyl)-1-butanol. From the perspective of further improving the heat resistance of the cured product, epoxy compounds with an alicyclic skeleton are preferably 1,2-epoxy-4-(2-epoxyethyl)cyclohexane adducts of 2,2-bis(hydroxymethyl)-1-butanol.

[0152] As epoxides with an alicyclic skeleton, alicyclic epoxides such as CELLOXIDE2021, CELLOXIDE 2021A, CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2000, and CELLOXIDE3000 manufactured by CELLOXIDE Corporation are available. As methacrylates with methylglycidyl groups, such as CYCLOMER A200, CYCLOMER M100, and MGMA, which are (meth)acrylates with epoxy groups, and Silicia manufactured by Dow Chemical Company are also available.

[0153] The amount of epoxy compound incorporated can be adjusted appropriately to achieve moderate curing by heat treatment, without particular limitation. In terms of solid content, the amount of epoxy compound incorporated relative to 100 parts by weight of the resin composition is preferably 5 parts by weight or more and 60 parts by weight or less, more preferably 5 parts by weight or more and 30 parts by weight or less. If the amount of epoxy compound incorporated is within this range, the resin composition can be cured more effectively by heat treatment, further improving the heat resistance of the cured product.

[0154] In carboxyl-containing resins, which are thermosetting resins, the carboxyl group undergoes a thermosetting reaction with the epoxy group. Specific examples of carboxyl-containing resins include the following [1] to [9]:

[0155] [1] A carboxyl-containing copolymer resin obtained by copolymerizing unsaturated carboxylic acids such as (meth)acrylic acid with one or more compounds having unsaturated double bonds.

[0156] [2] For copolymers of "unsaturated carboxylic acids such as (meth)acrylic acid" and "one or more compounds having unsaturated double bonds other than these", a carboxyl-containing resin is obtained by adding compounds having epoxy groups and unsaturated double bonds, such as glycidyl methacrylate or 3,4-epoxycyclohexyl methacrylate, or (meth)acryloyl chloride, with an olefinic unsaturated group as a side group.

[0157] [3] A resin containing carboxyl groups is obtained by reacting a copolymer of a compound having epoxy groups and unsaturated double bonds, such as glycidyl methacrylate or 3,4-epoxycyclohexyl methacrylate, with a compound having unsaturated double bonds, with an unsaturated carboxylic acid such as methacrylate, and then reacting the polybasic anhydride with the generated secondary hydroxyl group.

[0158] [4] A carboxylic acid-containing resin obtained by reacting "a compound having hydroxyl groups and unsaturated double bonds, such as (meth)acrylate" with "a copolymer of anhydrides having unsaturated double bonds, such as maleic anhydride, and other compounds having unsaturated double bonds".

[0159] [5] A carboxyl-containing resin is obtained by reacting a polyfunctional epoxy compound with an unsaturated monocarboxylic acid and then reacting a saturated or unsaturated polycarboxylic acid anhydride with the generated hydroxyl group.

[0160] [6] A carboxyl-containing resin is obtained by reacting a saturated or unsaturated polyacid anhydride with a hydroxyl-containing polymer such as a polyvinyl alcohol derivative, followed by reacting a compound having an epoxy group and an unsaturated double bond in one molecule with the generated carboxylic acid.

[0161] [7] A carboxyl-containing resin obtained by reacting a saturated or unsaturated polyacid anhydride with a polyfunctional epoxy compound, an unsaturated monocarboxylic acid, and a compound having at least one alcohol hydroxyl group and one reactive group other than the alcohol hydroxyl group in one molecule that reacts with an epoxy group.

[0162] [8] A carboxyl-containing resin obtained by reacting a saturated or unsaturated polyacid anhydride with a primary hydroxyl group in a modified oxetane resin obtained by reacting an unsaturated monocarboxylic acid with a polyfunctional oxetane compound having at least two oxetane rings in one molecule.

[0163] [9] For a carboxylic acid-containing resin obtained by reacting an unsaturated monocarboxylic acid with a polyfunctional epoxy resin and then reacting it with a polybasic acid anhydride, a carboxyl-containing resin is obtained by further reacting it with a compound having one oxopropane ring and one or more olefinic unsaturated groups in the molecule.

[0164] As a carboxyl-containing resin, the carboxyl-containing resins of [2], [5], [7] and [9] above are preferred, and from the viewpoint of thermosetting properties and cured film properties, the carboxyl-containing resin of [5] above is even more preferred. Here, (meth)acrylate refers to acrylate, methacrylate and mixtures thereof.

[0165] The acid value of carboxyl-containing resins is preferably in the range of 10–150 mg KOH / g, and more preferably in the range of 30–120 mg KOH / g. If the acid value of the carboxyl-containing resin is above 10 mg KOH / g, the adhesion will be better. Furthermore, if the acid value is below 150 mg KOH / g, the thermal stability of the cured product will be further improved.

[0166] The weight-average molecular weight of carboxyl-containing resins varies depending on the resin's backbone, generally ranging from 1,000 to 30,000, with a preferred range of 5,000 to 20,000. If the weight-average molecular weight of the carboxyl-containing resin is above 1,000, the tack-free properties are further improved, and the hardness of the cured product also increases. Furthermore, if the weight-average molecular weight of the carboxyl-containing resin is below 20,000, a better balance between adhesion and curing properties can be achieved.

[0167] In terms of non-volatile components (solid components), the amount of carboxyl-containing resin incorporated is preferably 25 to 60 parts by weight, and more preferably 25 to 50 parts by weight, relative to 100 parts by weight of the resin composition. When the amount of carboxyl-containing resin incorporated is 25 parts by weight or more, the curability can be further improved; while when it is 50 parts by weight or less, the tackiness can be optimized.

[0168] The silane coupling agent is preferably one of hydroxyl and methoxy groups, and more preferably a silane coupling agent comprising a structure represented by the following formula (I).

[0169] [Chemical Formula 1]

[0170]

[0171] In formula (I), R represents a hydrogen atom or a methyl group, n represents an integer from 1 to 3, and R' represents -(CH2). i -O-(CH2) j - where i and j are independent integers from 1 to 5.

[0172] As a silane coupling agent, it is preferable to be a silane coupling agent in which the i of R' is 1, the j is 3, and the carbon atom on the j side is bonded to Si in formula (I).

[0173] As a silane coupling agent, there are no particular limitations as long as it has at least one of hydroxyl and methoxy groups and has a structure represented by the above formula (I). As a silane coupling agent, commercially available products such as CoatOSil MP 200 (manufactured by Momentive Advanced Materials Co., Ltd., trade name) are available.

[0174] There is no particular limitation on the molecular weight of silane coupling agents. However, it is preferable that the molecular weight of the silane coupling agent is such that its viscosity is 0.003 m. 2 Adjustments should be made for conditions below / s. Furthermore, it is preferable to set the viscosity to 0.001m. 2 Adjust the conditions below / s.

[0175] The amount of silane coupling agent containing glycidyl and hydroxyl groups incorporated, in terms of solid content, is preferably 1 to 20 parts by weight, and more preferably 2 to 15 parts by weight, relative to 100 parts by weight of the resin composition as a whole. When the amount of the silane coupling agent incorporated is 20 parts by weight or less, the printability (coating properties) are good.

[0176] Furthermore, the resin composition used for forming the black layer may also be used in conjunction with other silane coupling agents. There are no particular limitations on other silane coupling agents. Examples of other silane coupling agents generally include epoxy silane coupling agents, amino silane coupling agents, cationic silane coupling agents, vinyl silane coupling agents, acrylic silane coupling agents, mercapto silane coupling agents, and their composite coupling agents.

[0177] As other silane coupling agents, KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-1403, KBM-502, KBM-503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603, and KBE-603 can be obtained. Commercially available products include KBM-903, KBE-903, KBE-9103, KBM-9103, KBM-573, KBM-575, KBM-6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846, KBE-9007 (manufactured by Shin-Etsu Silicones Co., Ltd., trade name), Silquest A-186, Silquest A-187 (manufactured by Momentive Materials Co., Ltd., trade name), etc. These can be used individually or in combination of two or more.

[0178] By using an insulating filler selected from barium sulfate, silica, and talc in the resin composition for forming the black layer, not only can the high-temperature insulation resistance of the cured product be improved, but the surface flatness can also be increased, deformation caused by heating during processing can be suppressed, surface flatness can be maintained, and scratches and microcracks can be effectively prevented. In particular, from the viewpoint of improving surface flatness, the aforementioned insulating filler preferably includes barium sulfate. Furthermore, from the viewpoint of preventing microcracks, it is more preferable to include at least one of talc and silica in addition to barium sulfate.

[0179] Preferably, the average particle size of barium sulfate is 0.05–5.00 μm, that of silica is 0.1–5.0 μm, and that of talc is 0.1–5.0 μm. If the average particle size of the insulating filler is below the upper limit of the above range, the dispersibility and surface flatness are further improved. Furthermore, if the average particle size of the insulating filler is above the lower limit of the above range, the curability and high-temperature resistivity are further improved.

[0180] The total amount of the aforementioned insulating fillers, converted to solids, is preferably 10 to 70 parts by weight relative to 100 parts by weight of the resin composition as a whole; from the viewpoint of improving high-temperature insulation resistance, it is more preferably 10 to 60 parts by weight. Furthermore, commercially available products can be used for barium sulfate, silica, and talc.

[0181] Examples of commercially available barium sulfate products include: Barium sulfate precipitating of #100, #300, SS-50, BARIFINE B-30, BARIFINE B-31, BARIFINE B-32, BARIFINE B-33, BARIFINE B-34, BARIFINE BF-1, BARIFINE BF-10, BARIFINE BF-20, and BARIFINE BF-40 (manufactured by Sakai Chemical Industry Co., Ltd.); surface-treated barium sulfate B-30 and B-34 (manufactured by Sakai Chemical Industry Co., Ltd.); and W-1, W-6, W-10, and C-300 (manufactured by Takehara Chemical Industry Co., Ltd.).

[0182] Examples of commercially available silica products include AEROSIL 50, AEROSIL 200, AEROSIL 380, AEROSIL A300 and other A-series products, RY300 and other RY-series products (manufactured by NIPPON AEROSIL CO.,LTD.), WACKER HDK S13, WACKER HDK V15, WACKER HDK N20 (all manufactured by Asahi Kasei Corporation), "FINESIL B" (trade name, manufactured by Tokuyama Corporation), "FINESIL" (manufactured by Tokuyama Corporation), Snowtex UP, Snowtex OUP (manufactured by Nissan Chemical Industries, Ltd.), Nipsil L-300, Nipsil KQ (manufactured by Nippon Silica Industry Co., Ltd.).

[0183] As talc, commercially available products include LMS-100, LMS-200, LMS-300, LMS-3500, LMS-400, LMP-100, PKP-53, PKP-80, PKP-81 (manufactured by Fuji Talc Industry Co., Ltd.), D-600, D-800, D-1000, P-2, P-3, P-4, P-6, P-8, and SG-95 (manufactured by Nippon Talc Co., Ltd.). These can be used individually or in combination of two or more.

[0184] The black colorant contained in the resin composition for forming the black layer is only required to be a colorant that fully displays black color and does not chemically react with the aforementioned carboxyl-containing resin or epoxy resin. Examples of preferred black colorants include carbon black colorants such as CIPigment Black 6, 7, 9, and 18; graphite colorants such as CIPigment Black 8 and 10; iron oxide colorants such as CIPigment Black 11, 12, and 27, and CIPigment Brown 35; for example, the iron oxide KN-370 manufactured by Toda Industries, Ltd.; the titanium black 13M manufactured by Mitsubishi Materials Corporation; anthraquinone colorants such as CIPigment Black 20; cobalt oxide colorants such as CIPigment Black 13, 25, and 29; copper oxide colorants such as CIPigment Black 15 and 28; manganese colorants such as CIPigment Black 14 and 26; antimony oxide colorants such as CIPigment Black 23; and nickel oxide colorants such as CIPigment Black 30. Colorants of perylene shown in 31 and 32, aniline shown in CIPigment Black 1, and molybdenum sulfide or bismuth sulfide. These colorants can be used alone or in appropriate combinations.

[0185] Carbon black is a particularly good black colorant. Examples of carbon black include carbon black M-40, M-45, M-50, MA-8, and MA-100 manufactured by Mitsubishi Chemical Corporation, and carbon black 1255 manufactured by Columbia Chemical Company.

[0186] If too much black colorant is added, the insulation performance will decrease and the cost will increase; if too little is added, the color or opacity may be insufficient. In terms of solid content, it is preferably 1 to 25 parts by weight, more preferably 2 to 20 parts by weight, relative to 100 parts by weight of the resin composition as a whole.

[0187] From the viewpoint of suppressing deterioration such as cracking, the curing shrinkage rate of the cured product obtained by curing the resin composition used in the optical auxiliary layer 20, i.e., the white layer and the black layer, is preferably 0.5% or less, and more preferably 0.4% or less. The curing shrinkage rate of the cured product can be measured by the following method.

[0188] <Determination of Curing Shrinkage Rate>

[0189] (1-1) Preparation of resin-coated polyimide film

[0190] Using a die-casting machine, a varnish containing either a white or black layer-forming resin composition is coated onto a PET film (Toray Industries Ltd. "LUMIRROR R80", thickness 38 μm, softening point 130°C, hereinafter referred to as "release PET") that has been molded with an alkyd resin release agent (Lintec Corporation "AL-5") to a thickness of 170 μm. The film is then dried at 80°C to 120°C (average 100°C) for 10 minutes to obtain a resin sheet. The resin sheet is then cut into 200 mm square pieces. For the prepared resin sheet slices (200 mm square), a batch vacuum pressure laminator (Nikko-Materials Co., Ltd., 2-stage stacking laminator, CVP700) is used to laminate the resin composition layer to the center of the smooth surface of the polyimide film (UPILEX 25S, Ube Industries, Ltd., 25 μm thick, 240 mm square) on one side. The lamination is performed by reducing the pressure to below 13 hPa for 30 seconds, followed by pressing at 100°C and 0.74 MPa for 30 seconds. This yields a resin-coated polyimide film.

[0191] (1-2) Determination of initial length

[0192] From the obtained resin-coated polyimide film on the demolded PET, four through holes (approximately 6 mm in diameter) are formed by punching at approximately 20 mm intervals from the four corners of the resin composition layer (the formed through holes are temporarily referred to as A, B, C, and D in clockwise order). After peeling off the demolded PET, a non-contact image measuring instrument (Mitutoyo Co., Ltd., Quick Vision, "QVH1X606-PRO III BHU2G") is used to measure the length L between the central axes of each formed through hole. AB L BC L CD L DA L AC L BD ) to be measured.

[0193] (1-3) Thermosetting of the resin composition layer

[0194] The polyimide film with resin, whose initial length has been measured, is placed on a 255mm × 255mm glass cloth substrate epoxy resin double-sided copper-clad laminate (thickness 0.7mm, Panasonic Electric Works Co., Ltd. "R5715ES"). The four sides are fixed with polyimide tape (10mm wide). The resin composition layer is heat-cured at 180°C for 90 minutes to obtain a cured layer.

[0195] (1-4) Determination of thermosetting shrinkage rate

[0196] After heat curing, peel off the polyimide tape and remove the polyimide film with the cured layer from the glass cloth substrate epoxy resin double-sided copper-clad laminate. Then peel the cured layer off the polyimide film. Similarly, use a non-contact image measuring instrument to measure the length L' (L') of the cured material between the central axes of each through hole formed in (1-2). AB L' BC L' CD L' DA L' AC L' BD The measurements were taken.

[0197] The length L between the through hole A and the through hole B can be obtained by the following formula (1). AB The shrinkage rate s1 after curing AB Similarly, find L. BC L CD L DA L AC and L BD The shrinkage rate s1 after curing BC s1 CD s1 DA s1 AC and S1 DA ;

[0198] s1 AB =(L AB -L' AB ) / L AB (1).

[0199] The heat curing shrinkage rate of the cured layer is calculated using the following formula (2);

[0200] Thermosetting shrinkage rate [shrinkage rate in the x and y directions: S1] (%)

[0201] ={(s1) AB +s1 BC +s1 CD +s1 DA +s1 AC +s1 DA ) / 6}×100 (2).

[0202] The thickness of the optical auxiliary layer 20 can be set to any suitable thickness, taking into account the size, and especially the thickness, of the light-emitting element 10. The thickness of the optical auxiliary layer 20 is preferably 5 μm to 100 μm, and more preferably 10 μm to 50 μm.

[0203] The optical auxiliary layer 20 has the light-emitting element 10 embedded in it such that at least the light-emitting surface 19a of the light-emitting element 10 is exposed. A portion of the light-emitting surface 19a may be covered by the optical auxiliary layer 20.

[0204] like Figure 1 As shown, in this configuration example, the light-emitting surface 19a is flush with and integral with the first surface 20a of the surface on the side of the light-emitting surface 19a, which serves as the optical auxiliary layer 20. However, the light-emitting surface 19a and the first surface 20a may not be flush with each other, thus creating a height difference.

[0205] The optical auxiliary layer 20 is provided with a first through hole 22 that exposes the first electrode 16 and the second electrode 18 on the side of the second surface 20b.

[0206] A first wiring layer 30 is provided on the second surface 20b, which is the side opposite to the light-emitting surface 19a of the optical auxiliary layer 20. The first wiring layer 30 includes a first wiring portion 32, which consists of multiple wirings extending from the second surface 20b.

[0207] The first wiring layer 30 is disposed in the through hole of the first through hole 22 and is directly electrically connected to the first electrode 16 and the second electrode 18 without using bumps (solder balls).

[0208] A first insulating layer 40 is provided on the second surface 20b of the optical auxiliary layer 20 in such a way as to cover the first wiring layer 30.

[0209] The first insulating layer 40 can be formed using a resin composition through the same forming process, the resin composition being, for example, the same material as the insulating layer, i.e., the stacked layer, of a printed wiring board.

[0210] As the resin composition used to form the first insulating layer 40 (the resin composition for forming the first insulating layer), any suitable resin composition known in the art can be used. The resin composition for forming the first insulating layer, for example, includes (a) an epoxy resin and (b) a curing agent. The resin composition may further include, as needed, additives such as (c) an inorganic filler, (d) a thermoplastic resin, (e) a curing accelerator, (f) a flame retardant, and (g) an organic filler. The components that may be included in the resin composition for forming the first insulating layer will be described below.

[0211] <(a) Component: Epoxy Resin>

[0212] Examples of epoxy resins that can be used as component (a) include bisphenol type epoxy resins, dicyclopentadiene type epoxy resins, triphenol type epoxy resins, naphthol phenolic varnish type epoxy resins, phenol phenolic varnish type epoxy resins, tert-butylcatechol type epoxy resins, naphthol type epoxy resins, naphthol type epoxy resins, anthracene type epoxy resins, glycidylamine type epoxy resins, glycidyl ester type epoxy resins, cresol phenolic varnish type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spirocyclic epoxy resins, cyclohexane type epoxy resins, cyclohexanediethanol type epoxy resins, naphthylene ether type epoxy resins, tris(hydroxymethyl) type epoxy resins, and tetraphenylethane type epoxy resins. Epoxy resins can be used alone or in combination of two or more. Bisphenol-type epoxy resins refer to epoxy resins with a bisphenol structure, such as bisphenol A, bisphenol F, bisphenol S, and bisphenol AF epoxy resins. Biphenyl-type epoxy resins refer to epoxy resins with a biphenyl structure, which can have substituents such as alkyl, alkoxy, and aryl groups. Therefore, bis(xylenol)-type epoxy resins and biphenyl aralkyl-type epoxy resins are also included in the category of biphenyl-type epoxy resins. Epoxy resins can be used alone or in combination of two or more.

[0213] As an epoxy resin, an aromatic epoxy resin is preferred. Here, aromatic epoxy resin refers to an epoxy resin whose molecule contains an aromatic ring. Aromatic resins include not only monocyclic structures such as benzene rings, but also polycyclic aromatic structures such as naphthalene rings and aromatic heterocyclic structures. Preferably, the aromatic epoxy resin is selected from one or more of the following: bisphenol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, naphthyl tetrafunctional epoxy resin, and naphthol type epoxy resin.

[0214] The epoxy resin preferably has two or more epoxy groups per molecule. When the non-volatile component of the epoxy resin is set as 100% by mass, the proportion of epoxy resin having two or more epoxy groups per molecule is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 70% by mass or more.

[0215] Epoxy resins include those that are liquid at 20°C (hereinafter referred to as "liquid epoxy resin") and those that are solid at 20°C (hereinafter referred to as "solid epoxy resin"). The resin composition may contain liquid epoxy resin alone, solid epoxy resin alone, or a combination of liquid and solid epoxy resins. Preferably, the resin composition contains solid epoxy resin, more preferably it contains solid epoxy resin alone, or a combination of liquid and solid epoxy resins.

[0216] As a solid epoxy resin, it is preferable to be a solid epoxy resin having three or more epoxy groups per molecule, and more preferably an aromatic solid epoxy resin having three or more epoxy groups per molecule.

[0217] As solid epoxy resins, the preferred types are biphenyl-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, cresol-phenolic varnish-type epoxy resins, dicyclopentadiene-type epoxy resins, triphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol-type epoxy resins, and tetraphenylethane-type epoxy resins. More preferably, they are dixylenol-type epoxy resins, biphenyl aralkyl-type epoxy resins, naphthylene ether-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, naphthol-type epoxy resins, and bisphenol-type epoxy resins.

[0218] Specific examples of solid epoxy resins include: DIC Corporation's "HP4032H" (naphthalene-type epoxy resin), DIC Corporation's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins), DIC Corporation's "N-690" (cresol phenolic varnish type epoxy resin), DIC Corporation's "N-695" (cresol phenolic varnish type epoxy resin), DIC Corporation's "HP-7200" (dicyclopentadiene type epoxy resin), and DIC Corporation's "HP..." -7200HH, HP-7200H, EXA-7311, EXA-7311-G3, EXA-7311-G4, EXA-7311-G4S, HP6000, HP6000L (naphthyl ether type epoxy resin), EPPN-502H (triphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd., NC7000L (naphthol phenolic varnish type epoxy resin) manufactured by Nippon Kayaku Co., Ltd., NC3000H manufactured by Nippon Kayaku Co., Ltd. “NC3000,” “NC3000L,” and “NC3100” (biphenyl aralkyl type epoxy resin); “ESN475V” (naphthol type epoxy resin) manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.; “ESN485” (naphthol phenolic varnish type epoxy resin) manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.; “YX4000H,” “YX4000,” and “YL6121” (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; “YX4000HK” (bis(xylenol) type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd. The following epoxy resins are available: "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "PG-100" and "CG-500" (bisphenol AF-type epoxy resins) manufactured by Osaka Gas Chemical Co., Ltd.; "YL7760" (bisphenol AF-type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YL7800" (fluorene-type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "jER1010" (solid bisphenol A-type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; and "jER1031S" (tetraphenylethane-type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd. These can be used individually or in combination.

[0219] As a liquid epoxy resin, it is preferable to be a liquid epoxy resin having two or more epoxy groups per molecule, and more preferably an aromatic liquid epoxy resin having two or more epoxy groups per molecule.

[0220] As liquid epoxy resins, bisphenol type epoxy resins, naphthalene type epoxy resins, glycidyl ester type epoxy resins, glycidylamine type epoxy resins, phenolic varnish type epoxy resins, alicyclic epoxy resins with ester skeletons, cyclohexane type epoxy resins, cyclohexanediol type epoxy resins, glycidylamine type epoxy resins, and epoxy resins with butadiene structures are preferred. Glycidylamine type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF type epoxy resins, and naphthalene type epoxy resins are even more preferred.

[0221] Specific examples of liquid epoxy resins include: DIC Corporation's "HP4032", "HP4032D", and "HP4032SS" (naphthalene-type epoxy resin); Mitsubishi Chemical Corporation's "828US", "jER828US", "jER828EL", "825", and "EPIKOTE 828EL" (bisphenol A type epoxy resin); Mitsubishi Chemical Corporation's "jER807" and "1750" (bisphenol F type epoxy resin); Mitsubishi Chemical Corporation's "jER152" (phenolic varnish type epoxy resin); Mitsubishi Chemical Corporation's "630" and "630LSD" (glycidylamine type epoxy resin); Nippon Steel & Sumitomo Metal Chemicals Co., Ltd.'s "ZX1059" (a mixture of bisphenol A and bisphenol F type epoxy resins); and Nagase. ChemteX Corporation's "EX-721" (glycidyl ester type epoxy resin), Daicel Corporation's "CELLOXIDE 2021P" (alicyclic epoxy resin with ester skeleton), Daicel Corporation's "PB-3600" (epoxy resin with butadiene structure), and Nippon Steel & Sumitomo Chemical Co., Ltd.'s "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin), etc. These can be used individually or in combination.

[0222] When using liquid epoxy resin and solid epoxy resin in combination, the mass ratio (liquid epoxy resin: solid epoxy resin) is preferably 1:0.1 to 1:15, more preferably 1:0.5 to 1:10, and particularly preferably 1:1 to 1:8. By keeping the mass ratio of liquid epoxy resin to solid epoxy resin within the aforementioned range, i) moderate adhesion can be achieved when used in the form of an adhesive sheet, ii) sufficient flexibility and improved operability can be obtained when used in the form of an adhesive sheet, and iii) an insulating layer with sufficient tensile strength can be obtained.

[0223] The epoxy equivalent (g / eq.) of the epoxy resin can preferably be set to 50–5000, more preferably 50–3000, even more preferably 80–2000, and particularly preferably 110–1000. By ensuring the epoxy equivalent of the epoxy resin is within the aforementioned range, the crosslinking density of the cured resin composition is sufficient, resulting in an insulating layer with low surface roughness. Furthermore, the epoxy equivalent is the mass of resin containing 1 equivalent of epoxy groups, and can be determined according to JIS K7236.

[0224] The weight-average molecular weight of epoxy resins is preferably 100–5000, more preferably 250–3000, and even more preferably 400–1500. The weight-average molecular weight of epoxy resins and other resins is the weight-average molecular weight converted from that of polystyrene as determined by gel permeation chromatography (GPC).

[0225] From the viewpoint of obtaining an insulating layer exhibiting good mechanical strength and insulation reliability, when the non-volatile component in the resin composition is set at 100% by mass, the epoxy resin content is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 15% by mass or more. The upper limit of the epoxy resin content is preferably 40% by mass or less, more preferably 35% by mass or less, and particularly preferably 30% by mass or less.

[0226] <(b) Ingredients: Curing agent>

[0227] As a curing agent for component (b), there are no particular limitations as long as it has the function of curing epoxy resin. Examples of curing agents include phenolic curing agents, naphthol curing agents, reactive ester curing agents, benzoxazine curing agents, cyanate ester curing agents, and carbodiimide curing agents. A single curing agent may be used, or two or more may be used in combination.

[0228] From the viewpoint of heat resistance and water resistance, phenolic curing agents or naphthol curing agents with a phenolic structure are preferred as curing agents. Furthermore, from the viewpoint of adhesion strength (peel strength) to the conductor layer, nitrogen-containing phenolic curing agents or nitrogen-containing naphthol curing agents are preferred, and phenolic curing agents or naphthol curing agents with a triazine skeleton are even more preferred. Among these, from the viewpoint of further improving heat resistance, water resistance, and adhesion strength to the conductor layer, phenolic varnish resins with a triazine skeleton are preferred. Specific examples of phenolic and naphthol curing agents include: MEH-7700, MEH-7810, and MEH-7851 manufactured by Meiwa Chemical Co., Ltd.; NHN, CBN, and GPH manufactured by Nippon Chemical Co., Ltd.; SN-170, SN-180, SN-190, SN-475, SN-485, SN-495, SN-375, and SN-395 manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.; and LA-7052, LA-7054, LA-3018, LA-1356, and TD2090 manufactured by DIC Corporation.

[0229] As an active ester curing agent, a resin having one or more active ester groups per molecule can be used. Among these, compounds having two or more highly reactive ester groups per molecule, such as phenolic esters, thiophenolic esters, N-hydroxyamine esters, and heterocyclic hydroxyl compounds, are preferred as active ester curing agents. Preferably, the active ester curing agent is a compound obtained through the condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxyl compound and / or a thiol compound. Particularly from the viewpoint of improved heat resistance, an active ester curing agent obtained from a carboxylic acid compound and a hydroxyl compound is preferred, and an active ester curing agent obtained from a carboxylic acid compound and a phenolic compound and / or a naphthol compound is even more preferred. Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenolic or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthol, 1,6-dihydroxynaphthol, 2,6-dihydroxynaphthol, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucinol, pyroglucinol, dicyclopentadiene-type diphenol compounds, and linear phenolic resins. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

[0230] Preferred examples of reactive ester curing agents include reactive ester compounds containing a dicyclopentadiene-type diphenol structure, reactive ester compounds containing a naphthalene structure, reactive ester compounds containing an acetylated derivative of a linear phenolic resin, and reactive ester compounds containing a benzoyl derivative of a linear phenolic resin. More preferably, reactive ester compounds containing a naphthalene structure or reactive ester compounds containing a dicyclopentadiene-type diphenol structure are preferred. "Dicyclopentadiene-type diphenol structure" refers to a divalent structural unit formed from a phenylene-dicyclopentylene-phenylene group.

[0231] Examples of commercially available reactive ester curing agents include reactive ester compounds containing a dicyclopentadiene-type diphenol structure such as "EXB9451", "EXB9460", "EXB9460S", "HPC-8000-65T", "HPC-8000H-65TM", and "EXB-8000L-65TM" (manufactured by DIC Corporation); reactive ester compounds containing a naphthalene structure such as "EXB9416-70BK", "EXB-8100L-65T", and "EXB-8150-65T" (manufactured by DIC Corporation); and those containing the acetyl group of linear phenolic resin. Examples of active ester compounds of phenolic resins include "DC808" (manufactured by Mitsubishi Chemical Corporation); examples of active ester compounds containing benzoyl compounds of linear phenolic resins include "YLH1026" (manufactured by Mitsubishi Chemical Corporation); examples of active ester compounds containing acetyl compounds of linear phenolic resins include "DC808" (manufactured by Mitsubishi Chemical Corporation); and examples of active ester compounds containing benzoyl compounds of linear phenolic resins include "YLH1026" (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), and "YLH1048" (manufactured by Mitsubishi Chemical Corporation).

[0232] Specific examples of benzoxazine curing agents include "JBZ-OD100" (benzoxazine ring equivalent 218), "JBZ-OP100D" (benzoxazine ring equivalent 218), and "ODA-BOZ" (benzoxazine ring equivalent 218) manufactured by JFE Chemical Co., Ltd.; "Pd" (benzoxazine ring equivalent 217) and "Fa" (benzoxazine ring equivalent 217) manufactured by Shikoku Chemical Industry Co., Ltd.; and "HFB2006M" (benzoxazine ring equivalent 432) manufactured by Showa Polymer Co., Ltd.

[0233] Examples of cyanate ester curing agents include difunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate (oligomeric (3-methylene-1,5-phenylene cyanate)), 4,4'-methylene bis(2,6-dimethylphenyl cyanate), 4,4'-ethylene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate-phenyl)propane, 1,1-bis(4-cyanate-phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanate-phenyl-1-(methylethylene))benzene, bis(4-cyanate-phenyl) sulfide, and bis(4-cyanate-phenyl) ether; polyfunctional cyanate resins derived from phenolic varnish resins and cresol varnish resins; and prepolymers obtained by triazineization of some of these cyanate resins. Specific examples of cyanate ester curing agents include "PT30" and "PT60" (both phenolic varnish-type multifunctional cyanate ester resins), "ULL-950S" (multifunctional cyanate ester resin), and "BA230" (a prepolymer of bisphenol A dicyanate that has been partially or completely triazineized to form a trimer).

[0234] Specific examples of carbodiimide curing agents include CARBODILITE (registered trademark) V-03 (carbodiimide equivalent: 216), V-05 (carbodiimide equivalent: 216), V-07 (carbodiimide equivalent: 200), and V-09 (carbodiimide equivalent: 200) manufactured by Nisshinbo Chemical Co., Ltd., and Stabaxol (registered trademark) P (carbodiimide equivalent: 302) manufactured by Rhein Chemicals.

[0235] The ratio of epoxy resin to curing agent (a) is preferably in the range of 1:0.2 to 1:2, more preferably in the range of 1:0.3 to 1:1.5, and even more preferably in the range of 1:0.4 to 1:1.2, based on the ratio of [total number of epoxy groups in the epoxy resin] to [total number of reactive groups in the curing agent]. Here, the reactive groups in the curing agent refer to active hydroxyl groups, active ester groups, etc., which vary depending on the type of curing agent. Furthermore, the total number of epoxy groups in the epoxy resin is the sum of the values ​​obtained by dividing the mass of the solid component of the epoxy resin by the epoxy equivalent for all epoxy resins, and the total number of reactive groups in the curing agent is the sum of the values ​​obtained by dividing the mass of the solid component of each curing agent by the equivalent of the reactive groups for all curing agents. By keeping the ratio of epoxy resin to curing agent within such a range, the heat resistance of the resulting insulating layer is further improved.

[0236] When the resin component in the resin composition for forming the first insulating layer is set to 100% by mass, the content of the curing agent is preferably 5% by mass or more, more preferably 10% by mass or more, and even more preferably 15% by mass or more. The upper limit of the curing agent content is preferably 40% by mass or less, more preferably 35% by mass or less, or 30% by mass or less. In this invention, "resin component" refers to the non-volatile components constituting the resin composition other than the inorganic filler material described later as component (c).

[0237] <(c) Composition: Inorganic filler material>

[0238] The resin composition preferably further includes an inorganic filler as component (c). By including the inorganic filler, an insulating layer with a lower coefficient of linear thermal expansion and a lower dielectric loss tangent can be achieved.

[0239] There are no particular limitations on the materials used for inorganic fillers. Examples of inorganic fillers include silica, alumina, aluminosilicates, glass, cordierite, silicon oxides, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Furthermore, spherical silica is preferred. Inorganic fillers can be used alone or in combination of two or more.

[0240] Commercially available inorganic filler materials include, for example, "UFP-30" manufactured by DENKA Corporation; "SP60-05", "SP507-05", and "SPH516-05" manufactured by Nippon Steel Chemical Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Yatuma Corporation; "SILFIL NSS-3N", "SILFIL NSS-4N", and "SILFIL NSS-5N" manufactured by Tokuyama Corporation; and "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Yatuma Corporation.

[0241] The ideal specific surface area for inorganic filler materials is 1 m². 2 / g or higher, preferably 2m 2 / g or higher, especially 3m 2 / g or above. There is no particular limit to the upper limit, but 60m is preferred. 2 / g or less, preferably 50m 2 / g or less or 40m 2 / g or less. Regarding the specific surface area, it can be calculated by using a specific surface area measuring device ("Macsorb HM-1210" manufactured by Mounttech Co., Ltd.) to adsorb nitrogen onto the sample surface according to the BET method, and then using the BET multi-point method.

[0242] The average particle size of the inorganic filler material is preferably below 4 μm, more preferably below 3 μm, further preferably below 2.5 μm, even more preferably below 2 μm, and particularly preferably below 1 μm, 0.7 μm, or 0.5 μm. The lower limit of the average particle size of the inorganic filler material is preferably above 0.01 μm, more preferably above 0.03 μm, and further preferably above 0.05 μm, 0.07 μm, or 0.1 μm.

[0243] The average particle size of inorganic filler materials can be determined using laser diffraction scattering based on the Mie scattering theory. Specifically, a laser diffraction particle size distribution measuring device can be used to prepare the particle size distribution of the inorganic filler material on a volume basis, and the median particle size can be used as the average particle size for measurement. The sample for testing can be prepared by weighing 100 mg of inorganic filler material and 10 g of methyl ethyl ketone into a vial and dispersing it ultrasonically for 10 minutes. For the sample, a laser diffraction particle size distribution measuring device can be used, employing blue and red light source wavelengths, to measure the volume-based particle size distribution of the inorganic filler material in a flow cell manner. The average particle size is calculated based on the obtained particle size distribution as the median particle size. An example of a laser diffraction particle size distribution measuring device is the "LA-960" manufactured by Horiba Manufacturing Co., Ltd.

[0244] From the perspective of improving moisture resistance and dispersibility, inorganic fillers are preferably treated with surface treatment agents. Examples of surface treatment agents include vinyl silane coupling agents, (meth)acrylic acid coupling agents, fluorinated silane coupling agents, amino silane coupling agents, epoxy silane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, and titanate coupling agents. A single surface treatment agent can be used, or two or more can be used in combination. Commercially available surface treatment agents include, for example, KBM1003 (vinyltriethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., KBM503 (3-methacryloyloxypropyltriethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., KBM403 (3-epoxypropoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., KBM803 (3-mercaptopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd., and KBE903 (3-aminopropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Industry Co., Ltd. The following are listed: N-phenyl-3-aminopropyltrimethoxysilane, KBM573 (N-phenyl-3-aminopropyltrimethoxysilane), SZ-31 (hexamethyldisilazane), KBM103 (phenyltrimethoxysilane), KBM-4803 (long-chain epoxy silane coupling agent), and KBM-7103 (3,3,3-trifluoropropyltrimethoxysilane).

[0245] From the perspective of improving the dispersibility of inorganic fillers, the degree of surface treatment by surface treatment agent is preferably within a specified range. Specifically, it is preferable that 100 parts by mass of inorganic filler are surface treated with 0.2 to 5 parts by mass of surface treatment agent, more preferably with 0.2 to 3 parts by mass of surface treatment agent, and even more preferably with 0.3 to 2 parts by mass of surface treatment agent.

[0246] The degree of surface treatment by surface treatment agents can be evaluated by the carbon content per unit surface area of ​​the inorganic filler. From the perspective of improving the dispersibility of inorganic fillers, the preferred carbon content per unit surface area of ​​the inorganic filler is 0.02 mg / m². 2 The above is preferred, ideally 0.1 mg / m². 2 The above, and even better, is 0.2 mg / m². 2 That's all. On the other hand, from the viewpoint of suppressing the increase in melt viscosity of the resin varnish and the melt viscosity in the form of adhesive sheets, 1 mg / m³ is preferable. 2 The following is preferable: 0.8 mg / m² 2 The following is even better: 0.5 mg / m²2 the following.

[0247] The carbon content per unit surface area of ​​inorganic filler materials can be determined after cleaning the surface-treated inorganic filler material with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, sufficient MEK is added as a solvent to the surface-treated inorganic filler material, and ultrasonic cleaning is performed at 25°C for 5 minutes. Then, the supernatant is removed, and the solid components are dried. The carbon content per unit surface area of ​​the inorganic filler material can be determined using a carbon analyzer. The carbon analyzer used is the "EMIA-320V" manufactured by Horiba Corporation.

[0248] From the viewpoint of obtaining an insulating layer with a low coefficient of linear thermal expansion and a low dielectric loss tangent, when the non-volatile component in the resin composition for forming the first insulating layer is set to 100% by mass, the content of inorganic filler material in the resin composition for forming the first insulating layer is preferably 30% by mass or more, more preferably 40% by mass or more, or 50% by mass or more. If a resin composition with an excessively high content of inorganic filler material is used, there is a tendency for the surface undulations of the resulting insulating layer to become larger. However, when using an adhesive sheet to form the first insulating layer, the content of inorganic filler material in the resin composition can be further increased while suppressing the surface undulations of the first insulating layer. For example, the content of inorganic filler material in the resin composition for forming the first insulating layer can be increased to 55% by mass or more, 60% by mass or more, 65% by mass or more, or 70% by mass or more.

[0249] When the non-volatile component in the resin composition for forming the first insulating layer is set to 100% by mass, from the viewpoint of obtaining an insulating layer with sufficient mechanical strength, the upper limit of the content of inorganic filler material in the resin composition for forming the first insulating layer is preferably 95% by mass or less, and more preferably 90% by mass or less.

[0250] <(d) Composition: Thermoplastic resin>

[0251] The resin composition for forming the first insulating layer may include a thermoplastic resin as component (d). Examples of thermoplastic resins include phenoxy resin, polyvinyl acetal resin, polyolefin resin, polyimide resin, polyamide-imide resin, polyether-imide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polyetheretherketone resin, and polyester resin. A single thermoplastic resin may be used, or two or more may be used in combination.

[0252] The weight-average molecular weight of thermoplastic polystyrene is preferably above 8,000, more preferably above 10,000, and even more preferably above 20,000 or 30,000. The upper limit is preferably below 100,000, more preferably below 70,000, and even more preferably below 60,000.

[0253] Examples of phenoxy resins include those having one or more skeletons selected from the following: bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetylphenyl skeleton, phenolic skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. The terminal group of the phenoxy resin can be any functional group selected from phenolic hydroxyl groups, epoxy groups, etc. Phenoxy resins can be used alone or in combination of two or more. Specific examples of phenoxy resins include Mitsubishi Chemical Corporation's "1256" and "4250" (both phenoxy resins containing a bisphenol A backbone), "YX8100" (phenoxy resin containing a bisphenol S backbone) and "YX6954" (phenoxy resin containing a bisphenol acetylbenzene backbone); Nippon Steel Chemical Materials Co., Ltd.'s "FX280" and "FX293"; and Mitsubishi Chemical Corporation's "YL7500BH30", "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290" and "YL7482".

[0254] Examples of polyvinyl alcohol acetal resins include polyvinyl alcohol formal resin and polyvinyl alcohol butyral resin, with polyvinyl alcohol butyral resin being preferred. Specific examples of polyvinyl alcohol acetal resins include "Electrochemical Butyral 4000-2", "Electrochemical Butyral 5000-A", "Electrochemical Butyral 6000-C", and "Electrochemical Butyral 6000-EP" manufactured by Denki Kagaku Kogyo Co., Ltd., and the S-LEC BH series, BX series (e.g., BX-5Z), KS series (e.g., KS-1), BL series, and BM series manufactured by Sekisui Chemicals Co., Ltd.

[0255] Specific examples of polyimide resins include, in addition to “RIKACOATSN20” and “RIKACOAT PN20” manufactured by Shin Nippon Rikka Co., Ltd., linear polyimides (the polyimide described in Japanese Patent Application Publication No. 2006-37083) obtained by reacting difunctional hydroxyl-terminated polybutadiene, diisocyanate compounds and tetrabasic anhydrides, and modified polyimides such as polysiloxane-containing backbones (the polyimides described in Japanese Patent Application Publication Nos. 2002-12667 and 2000-319386, etc.).

[0256] Specific examples of polyamide-imide resins include "VYLOMAXHR11NN" and "VYLOMAXHR16NN" manufactured by Toyobo Co., Ltd., as well as modified polyamide-imides such as "KS9100" and "KS9300" (polyamide-imide containing a polysiloxane backbone) manufactured by Hitachi Chemical Co., Ltd.

[0257] Specific examples of polyethersulfone resins include "PES5003P" manufactured by Sumitomo Chemical Co., Ltd. Specific examples of polyphenylene ether resins include "OPE-2St1200" of low-polyphenylene ether-styrene resin manufactured by Mitsubishi Gas Chemical Co., Ltd. Specific examples of polyetheretherketone resins include "SUMIPLOY K" manufactured by Sumitomo Chemical Co., Ltd. Specific examples of polyetherimide resins include "ULTEM" manufactured by GE Group.

[0258] Specific examples of polysulfone resins include polysulfones “P1700” and “P3500” manufactured by Solvay Performance Polymers Co., Ltd.

[0259] Examples of polyolefin resins include low-density polyethylene, ultra-low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, and other ethylene copolymers, as well as polyolefin elastomers such as polypropylene and ethylene-propylene block copolymers.

[0260] Examples of polyester resins include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polypropylene terephthalate resin, polypropylene naphthalate resin, and polycyclohexyl terephthalate resin.

[0261] As thermoplastic resins, phenoxy resins and polyvinyl acetal resins are particularly preferred, and phenoxy resins with a weight average molecular weight of 30,000 or higher are even more preferred.

[0262] When the non-volatile component in the resin composition for forming the first insulating layer is set to 100% by mass, the content of the thermoplastic resin is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and even more preferably 0.5% by mass or more. The upper limit is preferably 5% by mass or less, more preferably 4% by mass or less, and even more preferably 3% by mass or less.

[0263] <(e) Ingredients: Curing accelerator>

[0264] The resin composition for forming the first insulating layer may further include a curing accelerator as component (e). Examples of curing accelerators include amine curing accelerators, imidazole curing accelerators, guanidine curing accelerators, metal curing accelerators, and peroxide curing accelerators. Among these, amine curing accelerators, imidazole curing accelerators, and peroxide curing accelerators are preferred. A single curing accelerator may be used, or two or more may be used in combination. When using a curing accelerator, if the non-volatile component in the resin composition for forming the first insulating layer is set to 100% by mass, the content of the curing accelerator in the resin composition for forming the first insulating layer is preferably 0.005% by mass to 1% by mass, and more preferably 0.01% by mass to 0.5% by mass.

[0265] <(f) Ingredients: Flame retardant>

[0266] The resin composition for forming the first insulating layer may further include a flame retardant as component (f). Examples of flame retardants include organophosphorus flame retardants, organic nitrogen-containing phosphorus compounds, nitrogen compounds, organosilicon flame retardants, and metal hydroxides. A single flame retardant may be used, or two or more may be used in combination. When a flame retardant is used, the content of the flame retardant in the resin composition for forming the first insulating layer is not particularly limited. When the non-volatile component in the resin composition for forming the first insulating layer is set to 100% by mass, the content of the flame retardant is preferably 0.1% to 15% by mass, and more preferably 0.5% to 10% by mass.

[0267] <(g): Organic filler materials>

[0268] The resin composition for forming the first insulating layer may further include an organic filler material. Any suitable organic filler material that can be used when forming the insulating layer of a printed wiring board can be used as the organic filler material. Examples of organic filler materials include rubber particles, polyamide microparticles, and silicone particles, with rubber particles being preferred.

[0269] As for rubber particles, there are no particular limitations as long as they are microparticles of resin that are chemically cross-linked to exhibit rubber elasticity and are insoluble and infusible in organic solvents. Examples of rubber particles include acrylonitrile-butadiene rubber particles, butadiene rubber particles, and acrylic rubber particles. Specific examples of rubber particles include XER-91 (manufactured by Nippon Synthetic Rubber Co., Ltd.), STAPHYLOID AC3355, AC3816, AC3816N, AC3832, AC4030, AC3364, and IM101 (manufactured by AICA Industries, Ltd.), and PARALOID EXL2655 and EXL2602 (manufactured by Kureha Chemical Industry Co., Ltd.).

[0270] The average particle size of the organic filler material is preferably in the range of 0.005 μm to 1 μm, and more preferably in the range of 0.2 μm to 0.6 μm. The average particle size of the organic filler material can be determined using a dynamic light scattering method. For example, the organic filler material is uniformly dispersed in a suitable organic solvent by means of ultrasound, and the particle size distribution of the organic filler material is prepared on a mass basis using a thick particle size analyzer (Otsuka Electronics Co., Ltd. "FPAR-1000"), and the median particle size is used as the average particle size for measurement. When using an organic filler material, if the non-volatile component in the resin composition for forming the first insulating layer is set to 100% by mass, the content of the organic filler material in the resin composition for forming the first insulating layer is preferably 1% to 10% by mass, and more preferably 2% to 5% by mass.

[0271] <(h) Component: Any other component>

[0272] The resin composition for forming the first insulating layer may, as needed, include component (h) as any other arbitrary component. Examples of other arbitrary components include organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds, as well as resin additives such as thickeners, defoamers, leveling agents, adhesion promoters, and colorants.

[0273] The first insulating layer 40 is provided with a second through hole 42 that exposes a portion of the first wiring portion 32 contained in the first wiring layer 30. The second through hole 42 is provided in such a way that at least a portion of the wiring inside the through hole 22 is exposed, i.e., it communicates with the first through hole 22.

[0274] The first insulating layer 40 is provided with a second wiring layer 50. The second wiring layer 50 includes a plurality of second wiring portions 52.

[0275] The second wiring layer 50 is provided in the through hole of the second through hole 42 (and the connected first through hole 22) for wiring, and is directly electrically connected to the first wiring layer 30 (and the first electrode 16 and the second electrode 18).

[0276] like Figure 1 As shown, in this embodiment, only the first insulating layer 40 is provided. However, the light-emitting element package 1 may have multiple other insulating layers (stacked layers), such as a second insulating layer and a third insulating layer (not shown), formed using the same material as the first insulating layer 40.

[0277] Additionally, other insulating layers (such as the second insulating layer) are provided with other wiring layers (not shown) that are electrically connected to lower wiring layers (such as the first electrode 16, the second electrode 18, the first wiring layer 30, and the second wiring layer 50), as well as other through-holes (such as the third through-hole) that are not shown, for electrically connecting the other wiring layers to the lower wiring layers.

[0278] The light-emitting element package 1 includes a sealing portion 60. The sealing portion 60 is a functional part that allows light emitted from the light-emitting surface 19a of the light-emitting element 10 to pass through. The sealing portion 60 seals the light-emitting element 10 by covering the light-emitting surface 19a. The visible light transmittance of the sealing portion 60 is preferably 80% or more, more preferably 90% or more, and even more preferably 95% or more. Here, visible light transmittance refers to the percentage (%) of light passing through when light with a wavelength of 380 nm to 780 nm is irradiated onto the sealing portion.

[0279] The visible light transmittance of the sealing part 60 can be measured by a spectrophotometer. Specifically, firstly, the resin composition for the sealing part 60 is laminated onto alkali-free glass (50mm×50mm, 700μm thick, manufactured by Nippon Electric Glass Co., Ltd., "OA-10G") using a batch vacuum pressure laminator.

[0280] Next, a sheet for measuring visible light transmittance is formed by curing the resin composition. The lamination and curing conditions of the resin composition can be the same as those for the white layer already described.

[0281] The obtained visible light transmittance measuring sheet is placed on the described fiber optic spectrophotometer to measure the visible light transmittance spectrum. The visible light transmittance spectrum from 380 nm to 780 nm is calculated, thereby allowing the measurement of the visible light transmittance of the sealing part 60. The distance between the integrating sphere and the transmittance sheet is set to 0 mm, and atmospheric conditions can be used as a reference.

[0282] For the sealing portion 60, it can be in any form as long as the described suitable visible light transmittance can be ensured. For example, it is preferable to include a sealing layer 62, or it may consist only of a sealing layer 62, which comprises a cured product obtained by curing a resin composition containing a thermosetting resin, a thermoplastic resin, a curing agent, a curing accelerator, a thermoplastic resin, a coupling agent, and an inorganic filler. From the viewpoint of effectively suppressing deterioration such as cracking, the curing shrinkage of the cured product obtained by curing the resin composition used as the material of the sealing layer 62 is preferably 2.0% or less, and more preferably 1.5% or less. Here, the curing shrinkage rate refers to the proportion of volume shrinkage that occurs during the process of curing the resin composition to form a cured body, and can be measured by the aforementioned curing shrinkage rate measurement method.

[0283] The sealing portion 60 may employ a multi-layered structure. Specifically, it may be configured such that a sealing substrate 64 is further bonded to the sealing layer 62. The sealing substrate 64 may be, for example, a rigid substrate such as a glass substrate, or a flexible substrate formed from polymers such as transparent polyimide, cyclic olefin polymers, and polyethylene terephthalate, and its visible light transmittance is, for example, 80% or more, preferably 85% or more. The visible light transmittance can be measured using the aforementioned visible light transmittance measurement method. Hereinafter, the composition of the resin composition (resin composition for forming the sealing layer) used to form the sealing layer 62 will be described.

[0284] <Thermosetting Resins>

[0285] Examples of thermosetting resins include epoxy resins, cyanate ester resins, phenolic resins, bismaleimide-triazine resins, polyimide resins, acrylic resins, and vinyl benzyl resins. From the perspective of low-temperature curing properties, epoxy resins are preferable as thermosetting resins.

[0286] The epoxy resin is not particularly limited as long as it is an epoxy resin whose refractive index is 1.48 to 1.54 as the cured form of the resin composition for forming the sealing layer. As such an epoxy resin, epoxy resins with an average of two or more epoxy groups per molecule and high visible light transmittance can be used. Examples of such epoxy resins include hydrogenated epoxy resins (e.g., hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, etc.), fluorinated epoxy resins, chain aliphatic epoxy resins, cyclic aliphatic epoxy resins, bisphenol A type epoxy resins, biphenyl type epoxy resins, biphenyl aralkyl type epoxy resins, fluorene type epoxy resins, naphthol type epoxy resins, naphthol type epoxy resins, bisphenol F type epoxy resins, phosphorus-containing epoxy resins, bisphenol S type epoxy resins, and aromatic glycidylamine type epoxy resins (e.g., tetraglycidylamine). Oil-based diaminodiphenylmethane, triglycidyl-p-aminophenol, diglycidyl-toluidine, diglycidyl-aniline, etc.), alicyclic epoxy resins, phenolic varnish-type epoxy resins, alkylphenol type epoxy resins, cresolic varnish-type epoxy resins, bisphenol A varnish-type epoxy resins, epoxy resins with butadiene structures, diglycidyl ethers of bisphenols, diglycidyl ethers of naphthalene glycol, diglycidyl ethers of phenols, and diglycidyl ethers of alcohols, as well as alkyl-substituted forms of these epoxy resins.

[0287] Epoxy resins can be used alone or in combination of two or more. From the viewpoint of reactivity, the epoxy equivalent of the epoxy resin is preferably 50–5000, more preferably 50–3000, further preferably 80–2000, and particularly preferably 100–1500. Here, "epoxy equivalent" refers to the number of grams (g / eq) of resin containing 1 gram equivalent of epoxy groups, and is a value determined according to the method specified in JIS K7236. The weight-average molecular weight of the epoxy resin is preferably below 5000.

[0288] Epoxy resin can be either liquid or solid, or a combination of liquid and solid epoxy resins can be used. Here, "liquid" and "solid," as explained above, refer to the state of the epoxy resin at 25°C (room temperature) and atmospheric pressure (normal pressure). From the viewpoints of coatability, processability, and adhesion, it is preferable that at least 10% by weight of all epoxy resins used are liquid epoxy resins.

[0289] From the viewpoint that the refractive index of the sealing layer 62 is 1.48 to 1.54, the epoxy resin contained in the resin composition for forming the sealing layer is preferably selected from one or more of hydrogenated epoxy resin, fluorinated epoxy resin, chain aliphatic epoxy resin, cyclic aliphatic epoxy resin, and alkylphenol epoxy resin, and more preferably selected from one or more of hydrogenated epoxy resin, fluorinated epoxy resin, chain aliphatic epoxy resin, and cyclic aliphatic epoxy resin. By using such a resin, a sealing layer formed from a cured material with high transparency to visible light can be obtained.

[0290] "Hydrogenated epoxy resin" refers to an epoxy resin obtained by hydrogenating an epoxy resin containing an aromatic ring. The hydrogenation rate of hydrogenated epoxy resin is preferably above 50%, and more preferably above 70%. "Chain aliphatic epoxy resin" refers to an epoxy resin having straight-chain or branched alkyl chains or alkyl ether chains. "Cyclic aliphatic epoxy resin" refers to an epoxy resin with a cyclic aliphatic skeleton, such as a cycloalkane skeleton, within its molecule. "Alkylphenol type epoxy resin" refers to an epoxy resin having a benzene ring skeleton with one or more alkyl groups and one or more hydroxyl groups as substituents, and where the hydroxyl groups are converted to glycidyl ether groups.

[0291] Hydrogenated epoxy resins are preferably hydrogenated bisphenol A type epoxy resin or hydrogenated bisphenol F type epoxy resin. It should be noted that epoxy resins other than the preferred epoxy resins described above may be included in the thermosetting resin, provided that the refractive index of the cured resin composition for forming the sealing layer meets the numerical range specified above, or the refractive index of the thermosetting resin as a whole meets the specific numerical range specified above.

[0292] Examples of hydrogenated bisphenol A type epoxy resins include liquid hydrogenated bisphenol A type epoxy resins (e.g., "YX8000" (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: approx. 205), "DENACOL EX-252" (manufactured by Nagase ChemteX Corporation, epoxy equivalent: approx. 213)) and solid hydrogenated bisphenol A type epoxy resins (e.g., "YX8040" (manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: approx. 1000)).

[0293] As a fluorinated epoxy resin, for example, the fluorinated epoxy resin described in WO2011 / 089947 can be used.

[0294] Examples of chain-like aliphatic epoxy resins include polyglycerol polyglycidyl ether (e.g., "DENACOLEX-512", "DENACOL EX-521", manufactured by Nagase ChemteX Co., Ltd.), pentaerythritol polyglycidyl ether (e.g., "DENACOL EX-411", manufactured by Nagase ChemteX Co., Ltd.), diglycerol polyglycidyl ether (e.g., "DENACOLEX-421", manufactured by Nagase ChemteX Co., Ltd.), glycerol polyglycidyl ether (e.g., "DENACOL EX-313", "DENACOL EX-314", manufactured by Nagase ChemteX Co., Ltd.), trimethylolpropane polyglycidyl ether (e.g., "DENACOL EX-321", manufactured by Nagase ChemteX Co., Ltd.), neopentyl glycol diglycidyl ether (e.g., "DENACOLEX-211", manufactured by Nagase ChemteX Co., Ltd.), and Nagase ChemteX Co., Ltd. (Manufactured by ChemteX Co., Ltd.) 1,6-Hexanediol diglycidyl ether (e.g., "DENACOL EX-212", manufactured by Nagase ChemteX Co., Ltd.), ethylene glycol diglycidyl ether (e.g., "DENACOL EX-810", "DENACOL EX-811", manufactured by Nagase ChemteX Co., Ltd.), diethylene glycol diglycidyl ether (e.g., "DENACOLEX-850", "DENACOL EX-851", manufactured by Nagase ChemteX Co., Ltd.), polyethylene glycol diglycidyl ether (e.g., "DENACOL EX-821", "DENACOL EX-830", "DENACOL EX-832", "DENACOL EX-841", "DENACOLEX-861", manufactured by Nagase ChemteX Co., Ltd.), propylene glycol diglycidyl ether (e.g., "DENACOL EX-911", manufactured by Nagase ChemteX Co., Ltd.). (manufactured by ChemteX Corporation), polypropylene glycol diglycidyl ether (e.g., "DENACOL EX-941", "DENACOL EX-920", "DENACOL EX-931", manufactured by Nagase ChemteX Corporation).

[0295] An example of a cyclic aliphatic epoxy resin is "EHPE-3150" manufactured by Daicel Corporation.

[0296] Examples of alkylphenol type epoxy resins include "HP-820" manufactured by DIC Corporation, "YDC-1312" manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd., and "EX-146" manufactured by Nagase ChemteX Co., Ltd.

[0297] In one embodiment, the thermosetting resin preferably has a refractive index of 1.48 to 1.54 and includes epoxy resins containing aromatic rings within the molecule (aromatic ring-containing epoxy resins). The refractive index of the thermosetting resin can be measured, for example, using the critical angle method, prism coupling method, or spectroelliptic photometry. If an epoxy resin containing an aromatic ring structure within the molecule is used, there is a tendency for any one or all of the following to be increased: the reactivity of the resin composition, the glass transition temperature of the cured product, and the adhesion. Therefore, this is preferred. Examples of such thermosetting resins include alkylphenol type epoxy resins and fluorinated aromatic type epoxy resins.

[0298] In another embodiment, the thermosetting resin preferably comprises an epoxy resin (a1) with a refractive index of 1.48 to 1.54 (hereinafter referred to as "resin (a1)") and an epoxy resin (a2) containing an aromatic ring (hereinafter referred to as "resin (a2)"). Resin (a1) may be one type or two or more types. Similarly, resin (a2) may be one type or two or more types.

[0299] Using epoxy resins containing aromatic rings can tend to increase reactivity and any or all of the glass transition temperature and adhesion of the cured product. However, in the case of epoxy resins containing aromatic rings, there is a tendency for the refractive index to increase. Therefore, generally speaking, there are few epoxy resins containing aromatic rings that meet the refractive index of 1.48 to 1.54. Therefore, if resins (a1) and (a2) are used in combination, a suitable refractive index and improved reactivity of the resin composition, as well as improved glass transition temperature and adhesion of the cured product can be achieved.

[0300] The total content of resin (a1) and resin (a2) is not particularly limited, provided that the above-mentioned effects can be achieved. The total content of resin (a1) and resin (a2) relative to the thermosetting resin as a whole is preferably 60-100% by mass, more preferably 70-100% by mass, even more preferably 80-100% by mass, particularly preferably 90-100% by mass, and most preferably 100% by mass.

[0301] As for the resin (a1), there are no particular limitations as long as it is an epoxy resin with a refractive index of 1.48 to 1.54. Epoxy resins with the above refractive index generally do not contain aromatic ring structures. The resin (a1) is preferably selected from one or more of hydrogenated epoxy resins, fluorinated epoxy resins, chain aliphatic epoxy resins, cyclic aliphatic epoxy resins, and alkylphenol epoxy resins.

[0302] As for resin (a2), there are no particular limitations as long as it is an epoxy resin containing an aromatic ring. From the viewpoint of improved reactivity, glass transition temperature of the cured product, and adhesion, resin (a2) is preferably selected from one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenolic varnish type epoxy resin, biphenyl aralkyl type epoxy resin, fluorene type epoxy resin, and fluorinated aromatic type epoxy resin. Epoxy resins containing aromatic rings with a refractive index of 1.48 to 1.54 can also be used as resin (a2).

[0303] Here, "biphenyl aryl epoxy resin" refers to an epoxy resin having a main chain incorporating a phenolic structure and a divalent biphenyl structure. "Fluorene epoxy resin" refers to an epoxy resin having a fluorene backbone. "Fluorotropic epoxy resin" refers to a fluorinated epoxy resin containing an aromatic ring. For example, the fluorinated aromatic epoxy resin described in WO2011 / 089947 may be used.

[0304] In the form of resins (a1) and (a2), resin (a1) is preferably a hydrogenated epoxy resin, a fluorinated epoxy resin, a cyclic aliphatic epoxy resin, or an alkylphenol epoxy resin; more preferably, it is selected from one or more of hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, and fluorinated epoxy resin; particularly preferably, it is selected from one or more of hydrogenated bisphenol A type epoxy resin and hydrogenated bisphenol F type epoxy resin; most preferably, it is hydrogenated bisphenol A type epoxy resin. Furthermore, in the aforementioned form, resin (a2) is preferably selected from one or more of bisphenol type epoxy resin and fluorinated aromatic epoxy resin; more preferably, it is a bisphenol type epoxy resin; and even more preferably, it is selected from one or more of bisphenol A type epoxy resin and bisphenol F type epoxy resin.

[0305] In the form of resin (a1) and resin (a2), the amount of resin (a2) relative to the total amount of resin (a1) and resin (a2) is preferably 0.5 to 40% by mass, more preferably 1 to 35% by mass, and even more preferably 2 to 30% by mass.

[0306] Examples of bisphenol A type epoxy resins include "828EL", "1001" and "1004AF" manufactured by Mitsubishi Chemical Corporation, "840" and "850-S" manufactured by DIC Corporation, and "YD-128" manufactured by Nippon Steel Chemical Materials Co., Ltd. Furthermore, examples of mixtures of liquid bisphenol A type epoxy resin and liquid bisphenol F type epoxy resin include "ZX-1059" (epoxy equivalent: approximately 165) manufactured by Nippon Steel Chemical Materials Co., Ltd.

[0307] Examples of bisphenol F type epoxy resins include "807" manufactured by Mitsubishi Chemical Corporation, "830" manufactured by DIC Corporation, and "YDF-170" manufactured by Nippon Steel Chemical Materials Co., Ltd.

[0308] Examples of phenolic varnish-type epoxy resins include "N-730A", "N-740", "N-770" and "N-775" manufactured by DIC Corporation, and "152" and "154" manufactured by Mitsubishi Chemical Corporation.

[0309] Examples of biphenyl aryl epoxy resins include "NC-3000", "NC-3000L" and "NC-3100" manufactured by Nippon Kayaku Co., Ltd.

[0310] Examples of fluorene-type epoxy resins include "OGSOL PG-100", "CG-500EG-200" and "EG-280" manufactured by Osaka Gas Chemical Co., Ltd.

[0311] The amount of thermosetting resin relative to the non-volatile components is preferably 10-95% by mass, more preferably 20-90% by mass, and even more preferably 30-85% by mass.

[0312] The amount of epoxy resin relative to the non-volatile components is preferably 10-95% by mass, more preferably 20-90% by mass, and even more preferably 30-85% by mass.

[0313] <Curing agents and curing accelerators>

[0314] The resin composition for forming the sealing layer contains a curing agent. That is, the sealing layer is a cured product obtained by curing the resin composition for forming the sealing layer. The curing agent is not particularly limited as long as it has the function of curing the resin composition for forming the sealing layer. From the viewpoint of suppressing thermal degradation of the sealed object during the curing process, it is preferable to use a curing agent that can cure the resin composition for forming the sealing layer at a temperature of 140°C or below (preferably 120°C or below). Only one type of curing agent may be used, or two or more may be used together.

[0315] Examples of curing agents that are particularly suitable as curing agents for thermosetting epoxy resins include, for example, ionic liquids, acid anhydride compounds, imidazole compounds, tertiary amine compounds, dimethylurea compounds, amine adduct compounds, organic acid dihydrazide compounds, organophosphorus compounds, dicyandiamine compounds, primary or secondary amine compounds.

[0316] The curing agent is preferably selected from one or more of ionic liquids, acid anhydride compounds, imidazole compounds, tertiary amine compounds, dimethylurea compounds, and amine adduct compounds, and more preferably from one or more of ionic liquids, acid anhydride compounds, imidazole compounds, tertiary amine compounds, and dimethylurea compounds.

[0317] As a curing agent, an ionic liquid that can cure thermosetting resins (especially epoxy resins) at temperatures below 140°C (preferably below 120°C) is preferred; that is, a salt that can melt in a temperature range below 140°C (preferably below 120°C) and has the curing effect of thermosetting resins (especially epoxy resins). Ideally, the ionic liquid should be used in a state of uniform dissolution in the thermosetting resin (especially epoxy resin).

[0318] Examples of cations constituting the ionic liquid that serves as the curing agent in this invention include, for example, ammonium cations such as imidazolium ion, piperidinium ion, pyrroloinium ion, pyrazolium ion, guanidinium ion, and pyridinium ion, and tetraalkyl cations. Cations (e.g., tetrabutyl) Ion, Tributylhexyl (ions, etc.) Sulfonium-like cations, such as triethylsulfonium ion.

[0319] Examples of anions constituting ionic liquids as curing agents include: halide anions such as fluoride, chloride, bromide, and iodide ions; alkyl sulfate anions such as methanesulfonate ions; fluoride-containing compound anions such as trifluoromethanesulfonate ions, hexafluorophosphonate ions, trifluorotris(pentafluoroethyl)phosphonate ions, bis(trifluoromethanesulfonyl)imide ions, trifluoroacetate ions, and tetrafluoroborate ions; and phenolic ions. Phenolic anions such as 2-methoxyphenol ion and 2,6-di-tert-butylphenol ion; acidic amino acid ions such as aspartic acid ion and glutamic acid ion; neutral amino acid ions such as glycine ion, alanine ion, and phenylalanine ion; N-acyl amino acid ions such as N-benzoylalanine ion, N-acetylphenylalanine ion, and N-acetylglycine ion; carboxylic acid anions such as formate ion, acetate ion, decanoate ion, 2-pyrrolidone-5-carboxylate ion, α-lipoic acid ion, lactate ion, tartrate ion, hippurate ion, N-methylhippurate ion, and benzoate ion.

[0320] Of the above, ammonium cations are preferred as cations. Cation-like ions, preferably imidazolium ions, Ions. More specifically, imidazolium ions include 1-ethyl-3-methylimidazolium ions, 1-butyl-3-methylimidazolium ions, and 1-propyl-3-methylimidazolium ions.

[0321] Furthermore, as an anion, it is preferable to be a phenolic anion, an N-acyl amino acid ion, or a carboxylic acid anion, and more preferably an N-acyl amino acid ion or a carboxylic acid anion.

[0322] Specific examples of phenolic anions include 2,6-di-tert-butylphenol ion. Furthermore, specific examples of carboxylic acid anions include acetate ion, decanoate ion, 2-pyrrolidone-5-carboxylate ion, formate ion, α-lipoate ion, lactate ion, tartrate ion, hippurate ion, and N-methylhippurate ion, with acetate ion, 2-pyrrolidone-5-carboxylate ion, formate ion, lactate ion, tartrate ion, hippurate ion, and N-methylhippurate ion being preferred, and acetate ion, decanoate ion, N-methylhippurate ion, and formate ion being even more preferred. In addition, specific examples of N-acyl amino acid ions include N-benzoylalanine ion, N-acetylphenylalanine ion, aspartic acid ion, glycine ion, and N-acetylglycine ion, among which N-benzoylalanine ion, N-acetylphenylalanine ion, and N-acetylglycine ion are preferred, and N-acetylglycine ion is even more preferred.

[0323] As a specific ionic liquid, preferably, for example, 1-butyl-3-methylimidazolium lactate, tetrabutyl... -2-pyrrolidone-5-carboxylate, tetrabutyl Acetate, tetrabutyl Decanoate, Tetrabutyl Trifluoroacetate, tetrabutyl α-Lactobionate, Tetrabutyl Formate Salt, tetrabutyl Lactate, bis(tetrabutyl) tartarate Salt, tetrabutyl hippurate Salt, N-methylhippuric acid tetrabutyl Salt, benzoyl-DL-alanine tetrabutyl Salt, N-acetylphenylalanine tetrabutyl Salt, 2,6-di-tert-butylphenol tetrabutyl Salt, L-aspartic acid monotetrabutyl Salt, glycine tetrabutyl Salt, N-acetylglycine tetrabutyl Salts, 1-ethyl-3-methylimidazolium lactate, 1-ethyl-3-methylimidazolium acetate, 1-ethyl-3-methylimidazolium formic acid, 1-ethyl-3-methylimidazolium hippurate, 1-ethyl-3-methylimidazolium N-methylhippurate, bis(1-ethyl-3-methylimidazolium) tartrate, 1-ethyl-3-methylimidazolium N-acetylglycine, preferably tetrabutyl Decanoate, N-acetylglycine tetrabutyl Salts, 1-ethyl-3-methylimidazolium acetate, 1-ethyl-3-methylimidazolium formic acid, 1-ethyl-3-methylimidazolium hippurate, and 1-ethyl-3-methylimidazolium N-methylhippurate.

[0324] Examples of methods for synthesizing the aforementioned ionic liquids include reacting NaBF4, NaPF6, CF3SO3Na, or LiN(SO2CF3)2 with alkylimidazolium, alkylpyridinium, alkylammonium, and alkyl... Anion exchange methods involve reacting precursors composed of cations (such as ions) and anions (containing halogens); ester-ester methods introduce alkyl groups by reacting amines with esters, while simultaneously making organic acid residues the balancing anions; and neutralization methods involve neutralizing amines with organic acids to obtain salts. However, these methods are not limited to these. In neutralization methods based on anions, cations, and solvents, anions and cations are used in equal amounts, and the solvent in the resulting reaction solution is removed by distillation. The solution can be used directly or further concentrated by injecting an organic solvent (methanol, toluene, ethyl acetate, acetone, etc.).

[0325] Examples of anhydride compounds used as curing agents include tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, and dodecenylsuccinic anhydride. Specific examples of anhydride compounds include RIKACID TH, TH-1A, HH, MH, MH-700, and MH-700G (all manufactured by Shin Nippon Rikka Co., Ltd.).

[0326] Examples of imidazole compounds used as curing agents and curing accelerators include: 1H-imidazolium, 2-methylimidazolium, 2-phenyl-4-methylimidazolium, 2-ethyl-4-methylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 2-undecylimidazolium, 1-cyanoethyl-2-undecylimidazolium, 1-cyanoethyl-2-undecylimidazolium ontyltriazine, 2,4-diamino-6-(2'-undecylimidazolyl-(1'))-ethyl-triazine, 2-phenyl-4,5-bis(hydroxymethyl)- Imidazoles include 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-phenylimidazole, 2-dodecylimidazole, 2-heptadecanylimidazole, 1,2-dimethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino-6-(2'-methylimidazolyl-(1')-ethyl-triazine, and 2,4-diamino-6-(2'-methylimidazolyl-(1'))-ethyl-triazine isocyanuric acid adducts. Specific examples of imidazole compounds include Curezol. 2MZ, 2P4MZ, 2E4MZ, 2E4MZ-CN, C11Z, C11Z-CN, C11Z-CNS, C11Z-A, 2PHZ, 1B2MZ, 1B2PZ, 2PZ, C17Z, 1.2DMZ, 2P4MHZ-PW, 2MZ-A, 2MA-OK (all manufactured by Shikoku Chemical Industry Co., Ltd.)

[0327] In addition to containing a curing agent, the resin composition for forming the sealing layer may also contain a curing accelerator for purposes such as adjusting the curing time. Only one curing accelerator may be used, or two or more may be used in combination. Examples of curing accelerators particularly suitable for use as thermosetting resins include epoxy resins. Examples of curing accelerators include imidazole compounds, tertiary amine compounds, dimethylurea compounds, and amine adduct compounds. Preferably, the curing accelerator is selected from one or more imidazole compounds, tertiary amine compounds, and dimethylurea compounds.

[0328] Specific examples of tertiary amine compounds used as curing agents and curing accelerators include: DBN (1,5-diazabicyclo[4.3.0]non-5-ene), DBU (1,8-diazabicyclo[5.4.0]undec-7-ene), 2-ethylhexanoate of DBU, phenol salt of DBU, p-toluenesulfonate of DBU, U-CAT SA 102 (manufactured by San-Apro Corporation: octanoate of DBU), DBU formate and other DBU-organic acid salts, tris(dimethylaminomethyl)phenol (TAP), etc.

[0329] Specific examples of dimethylurea compounds used as curing agents and curing accelerators include aromatic dimethylureas such as DCMU (3-(3,4-dichlorophenyl)-1,1-dimethylurea) and U-CAT3512T (manufactured by San-Apro Corporation), and aliphatic dimethylureas such as U-CAT3503N (manufactured by San-Apro Corporation). From the perspective of curability, aromatic dimethylureas are preferred.

[0330] Regarding amine adduct compounds used as curing agents and curing accelerators, examples include epoxy adduct compounds obtained by stopping the addition reaction of a tertiary amine to an epoxy resin midway through the process. Specific examples of amine adduct compounds include AJICURE PN-23, AJICURE MY-24, AJICURE PN-D, AJICURE MY-D, AJICURE PN-H, AJICURE MY-H, AJICURE PN-31, AJICURE PN-40, and AJICURE PN-40J (all manufactured by Ajinomoto Fine-Techno Co., Inc.).

[0331] Specific examples of organic acid dihydrazide compounds used as curing agents include AJICURE VDH-J, AJICURE UDH, and AJICURE LDH (all manufactured by Ajinomoto Fine Chemicals Co., Ltd.).

[0332] Examples of organophosphorus compounds used as curing agents and curing accelerators include triphenylphosphine and tetraphenylphosphine. Tetra-p-Tolylborate, Tetraphenyl Tetraphenylborate, tri-tert-butyl Tetraphenylborate, (4-methylphenyl)triphenyl Thiocyanate, tetraphenyl Thiocyanate, butyltriphenyl Thiocyanate, triphenylphosphine triphenylborane. Specific examples of organophosphorus compounds include TPP, TPP-MK, TPP-K, TTBuP-K, TPP-SCN, and TPP-S (manufactured by Hokuko Chemical Industry Co., Ltd.).

[0333] Regarding dicyandiamine compounds used as curing agents, dicyandiamine can be cited as an example. Specific examples of dicyandiamine compounds include DICY7 and DICY15 (both manufactured by Mitsubishi Chemical Corporation), which are dicyandiamine micronized products.

[0334] Examples of primary and secondary amine compounds used as curing agents include: aliphatic amines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, trimethylhexamethylenediamine, 2-methylpentamethylenediamine, 1,3-diaminomethylcyclohexane, dipropylenediamine, diethylaminopropylamine, bis(4-aminocyclohexyl)methane, norbornenediamine, and 1,2-diaminocyclohexane; alicyclic amines such as N-aminoethylpiperazine and 1,4-bis(3-aminopropyl)piperazine; and aromatic amines such as diaminodiphenylmethane, m-phenylenediamine, m-phenylenediamine, m-phenylenediamine, diaminodiphenylmethane, diaminodiphenyl sulfone, and diethyltoluenediamine. A specific example of a primary or secondary amine compound is KAYAHARDA-A (manufactured by Nippon Kayaku Co., Ltd.: 4,4'-diamino-3,3'-dimethyldiphenylmethane).

[0335] The amount of curing agent relative to the total amount of non-volatile components is preferably 0.1 to 40% by mass, more preferably 0.5 to 38% by mass, and even more preferably 1 to 35% by mass. If the amount is less than 0.1% by mass, sufficient curing may not be achieved; if the amount is more than 40% by mass, storage stability may be compromised. It should be noted that when using ionic liquids as curing agents, from the viewpoint of moisture barrier properties of the cured product, the amount of ionic liquid relative to the total amount of non-volatile components of the resin composition is preferably 0.1 to 20% by mass, more preferably 0.5 to 18% by mass, and even more preferably 1 to 15% by mass.

[0336] When a curing accelerator is included, its amount relative to the total amount of non-volatile components in the resin composition is preferably 0.05 to 10% by mass, more preferably 0.1 to 8% by mass, and even more preferably 0.5 to 5% by mass. If the amount is less than 0.05% by mass, there is a tendency for curing to be slower and for the heat curing time to be longer; if it exceeds 10% by mass, there is a tendency for the storage stability of the resin composition to decrease.

[0337] It is preferable to use a combination of curing agent and curing accelerator. The combination of curing agent and curing accelerator is preferably selected from two or more of the following: ionic liquids, acid anhydride compounds, imidazole compounds, tertiary amine compounds, dimethylurea compounds, and amine adduct compounds.

[0338] <Thermoplastic Resins>

[0339] From the viewpoint of imparting flexibility to the sealing layer and improving the coatability of the varnish used to form the adhesive sheet for the sealing layer (preventing coating depressions), the resin composition can be further incorporated with a thermoplastic resin. Examples of thermoplastic resins include phenoxy resins, polyvinyl acetal resins, polyimide resins, polyamide-imide resins, polyethersulfone resins, polysulfone resins, polyester resins, polystyrene resins, (meth)acrylic polymers, ethylene resins, propylene resins, butene resins, and isobutylene resins. Only one of these thermoplastic resins may be used, or two or more may be used in combination. Furthermore, it can be a homopolymer, or a copolymer such as a random copolymer or a block copolymer. From the viewpoint of imparting excellent physical properties (e.g., adhesion) to the sealing layer, the thermoplastic resin preferably contains anhydride groups or glycidyl groups.

[0340] From the perspectives of imparting flexibility to the sealing layer and the coatability of the varnish when forming the adhesive sheet (preventing coating depressions), the weight-average molecular weight of thermoplastic resins is preferably 500 or higher, and more preferably 700 or higher. If this weight-average molecular weight is too high, there is a tendency for the compatibility between thermoplastic resins and thermosetting resins (especially epoxy resins) to decrease. Therefore, this weight-average molecular weight is preferably 1,000,000 or lower, and more preferably 800,000 or lower.

[0341] The thermoplastic resin is not particularly limited as long as it is a thermoplastic resin that causes the cured resin composition for forming the sealing layer to have a refractive index of 1.48 to 1.54. The refractive index of the thermoplastic resin is preferably 1.40 to 1.70, and more preferably 1.40 to 1.65. When using multiple thermoplastic resins, it is preferable that the overall refractive index of the mixture of thermoplastic resins is within the above range.

[0342] As a thermoplastic resin, phenoxy resin is preferred, as it has good compatibility with thermosetting resins (especially epoxy resins) and can have a beneficial effect on improving the moisture barrier properties of the cured resin composition for sealing layer formation.

[0343] Phenoxy resins can also have epoxy groups, just like epoxy resins. The weight-average molecular weight of phenoxy resins is preferably 10,000 to 500,000, and more preferably 20,000 to 300,000.

[0344] Preferred phenoxy resins include those comprising one or more skeletons selected from the groups of bisphenol A, bisphenol F, bisphenol S, bisphenol acetylphenyl, phenolic, biphenyl, fluorene, dicyclopentadiene, and norbornene. One or more phenoxy resins may be used.

[0345] Commercially available phenoxy resins include, for example, YX7200B35 (manufactured by Mitsubishi Chemical Corporation: phenoxy resin containing a biphenyl backbone), 1256 (manufactured by Mitsubishi Chemical Corporation: phenoxy resin containing a bisphenol A backbone), and YX6954BH35 (manufactured by Mitsubishi Chemical Corporation: phenoxy resin containing a bisphenol acetylphenyl backbone).

[0346] The content of thermoplastic resin relative to the non-volatile components is preferably 0.1-60% by mass, more preferably 3-60% by mass, and even more preferably 5-50% by mass.

[0347] <Coupled Agent>

[0348] The resin composition for forming the sealing layer may contain a coupling agent. Examples of coupling agents include silane coupling agents, aluminate coupling agents, and titanate coupling agents. Examples of silane coupling agents include: epoxy-based silane coupling agents such as 3-epoxypropoxypropyltrimethoxysilane, 3-epoxypropoxypropyltriethoxysilane, 3-epoxypropoxypropyl(dimethoxy)methylsilane, and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; mercapto-based silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, and 11-mercaptoundecyltrimethoxysilane; and thiol-based silane coupling agents such as 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, and N-(2-aminoethyl)-3-aminopropyltrimethoxysilane. Amino silane coupling agents such as (-aminoethyl)-3-aminopropyldimethoxymethylsilane, urea silane coupling agents such as 3-ureopropyltriethoxysilane, vinyl silane coupling agents such as vinyltrimethoxysilane, vinyltriethoxysilane and vinylmethyldiethoxysilane, styrene silane coupling agents such as p-styrenetrimethoxysilane, acrylate silane coupling agents such as 3-acryloyloxypropyltrimethoxysilane and 3-methacryloyloxypropyltrimethoxysilane, isocyanate silane coupling agents such as 3-isocyanate-propyltrimethoxysilane, sulfide silane coupling agents such as bis(triethoxysilylpropyl)disulfide and bis(triethoxysilylpropyl)tetrasulfide, phenyltrimethoxysilane, methacryloyloxypropyltrimethoxysilane, imidazole silane, and triazine silane. Among these, vinyl silane coupling agents and epoxy silane coupling agents are preferred, with epoxy silane coupling agents being particularly preferred. Examples of aluminate coupling agents include alkyl aluminum diisopropyl acetoacetate (e.g., PLENACT AL-M, manufactured by Ajinomoto Fine Chemicals Co., Ltd.). Specific examples of titanate coupling agents include PLENACT TTS, PLENACT 46B, PLENACT 55, PLENACT 41B, PLENACT 38S, PLENACT 138S, PLENACT 238S, PLENACT 338X, PLENACT 44, and PLENACT 9SA (all manufactured by Ajinomoto Fine Chemicals Co., Ltd.). One or more coupling agents may be used.

[0349] The amount of coupling agent relative to the non-volatile components is preferably 0-15% by mass, and more preferably 0.5-10% by mass.

[0350] <Inorganic filler materials>

[0351] From the viewpoints of moisture barrier properties of the cured material and the coatability of the varnish when forming the adhesive sheet (preventing coating depressions), the resin composition for forming the sealing layer can contain inorganic fillers. Examples of such inorganic fillers include talc, silica, alumina, barium sulfate, clay, mica, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, boron nitride, aluminum borate, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium dioxide, zirconium oxide, barium zirconate, calcium zirconate, silicates, semi-calcined hydrotalcite, calcined hydrotalcite, and uncalcined hydrotalcite. One or more inorganic fillers can be used. It should be noted that the primary particle size of the inorganic filler is preferably 5 μm or less, more preferably 3 μm or less. For example, inorganic fillers with a primary particle size of 0.001 to 3 μm, preferably 0.005 to 2 μm, can be used.

[0352] The particle morphology of inorganic fillers is not particularly limited; inorganic fillers with linear or branched shapes, such as near-spherical, cuboid, plate-like, or fibrous forms, can be used. Preferred inorganic fillers include talc, silica, zeolite, titanium dioxide, alumina, zirconium oxide, silicates, mica, magnesium hydroxide, and aluminum hydroxide, with talc and silica being more preferred, and talc being particularly desirable. As for silica, amorphous silica, fused silica, crystalline silica, synthetic silica, wet-process silica, dry-process silica, and colloidal silica (water-dispersible, solvent-dispersible, fumed silica, etc.) are preferred. From the viewpoint of minimizing precipitation and sedimentation and facilitating resin integration, solvent-dispersible colloidal silica (organosilicon sol) is particularly preferred.

[0353] Inorganic filler materials can be commercially available. Examples of talc include "FG-15" (average particle size 1.4 μm), "D-1000" (average particle size 1.0 μm), and "D-600" (average particle size 0.6 μm) manufactured by Nippon Talc Co., Ltd. Examples of commercially available spherical fused silica include the "ADMAFINE series" of spherical (true spherical) silica manufactured by Yaduma Co., Ltd. ("SO-C2; average particle size 0.5 μm", "SC2500-SQ; average particle size 0.5 μm, silane coupling treatment", etc.). Examples of pyrolytic silica include the "AEROSIL series" manufactured by NIPPON AEROSIL Co., Ltd. ("A-200: primary particle size 5–40 nm", etc.). Examples of organic solvent-dispersible colloidal silica include "MEK-EC-2130Y" (amorphous silica with a particle size of 10-15 nm, 30% by mass of non-volatile components, MEK solvent) manufactured by Nissan Chemical Industries, Ltd.; "PGM-AC-2140Y" (silica with a particle size of 10-15 nm, 40% by mass of non-volatile components, PGM (propylene glycol monomethyl ether) solvent) manufactured by Nissan Chemical Industries, Ltd.; "MIBK-ST" (silica with a particle size of 10-15 nm, 30% by mass of non-volatile components, MIBK (methyl isobutyl ketone) solvent) manufactured by Nissan Chemical Industries, Ltd.; and colloidal silica sol "PL-2L-MEK" (silica with a particle size of 15-20 nm, 20% by mass of non-volatile components, MEK (methyl ethyl ketone) solvent) manufactured by Fuso Chemical Industries, Ltd.

[0354] <Other Additives>

[0355] Within the scope of the effects of this invention, the resin composition for forming the sealing layer may further contain other additives different from the components described above. Examples of such other additives include organic fillers such as rubber particles, silicone powder, nylon powder, and fluoropolymer powder; thickeners such as Orben and Benton; defoamers or leveling agents of silicone, fluorine, or polymeric types; and adhesion promoters such as triazole compounds, thiazole compounds, triazine compounds, and porphyrin compounds.

[0356] (2) Second implementation method

[0357] Reference Figure 2 An example of the configuration of the light-emitting element package according to the second embodiment of the present invention will be described.

[0358] Figure 2 It means and Figure 1 A schematic diagram of the cut end face of the light-emitting element package of the second embodiment is also shown.

[0359] like Figure 2 As shown, the light-emitting element package 1 of the second embodiment includes a color filter (color converter) 70, and further includes a light-emitting element 10 corresponding to the color filter 70, which is different from the light-emitting element package 1 of the first embodiment.

[0360] In the following description, the light-emitting element 10 and the color filter 70 according to the second embodiment will be described. However, detailed descriptions of configurations that are the same as those in the first embodiment will be omitted.

[0361] like Figure 2 As shown, the three light-emitting elements 10 (first light-emitting element 10a, second light-emitting element 10b and third light-emitting element 10c) included in the light-emitting element package 1 of the second embodiment are all light-emitting elements with substantially the same emission wavelength.

[0362] The emission wavelength of the plurality of light-emitting elements 10 in the second embodiment is not particularly limited, provided that the color filter 70 used can function.

[0363] Examples of light-emitting wavelengths for the light-emitting element 10 in the second embodiment include white light with peaks in the ranges of 420nm–480nm (blue), 490nm–550nm (green), 630nm–690nm (red), 460nm–470nm, and 570nm–580nm. Preferably, the light-emitting wavelength of the light-emitting element 10 in the second embodiment is white.

[0364] In this configuration example, the color filter 70 is disposed in such a way that it is sandwiched between the sealing layer 60 and the sealing substrate 64, and is integrally formed as a sealing part 60.

[0365] The color filter 70 can be made of any suitable material known in the prior art, such as a primary color filter, using the light-emitting surface 19a of the self-emitting element 10.

[0366] Furthermore, as the color filter 70, a complementary color filter that can be thinner than the primary color filter described above can also be used. As the complementary color filter, for example, a combination of three types (yellow, cyan, magenta), three types (yellow, cyan, clear), three types (yellow, clear, magenta), and three types (clear, cyan, magenta) can be used.

[0367] The color filter 70 can be assembled into the light-emitting element package 1 using any suitable method known in the prior art, in a manner corresponding to the selected color filter 70. The color filter 70 can also be disposed, for example, on a sealing substrate 64 disposed on the sealing layer 60.

[0368] 2. Manufacturing method of light-emitting element packaging

[0369] Reference Figure 3A , Figure 3B , Figure 3C , Figure 3D and Figure 3E The manufacturing method of the light-emitting element package 1 according to the embodiments of the present invention will be described.

[0370] Figure 3A , Figure 3B , Figure 3C , Figure 3D and Figure 3E This is a schematic diagram illustrating the manufacturing method of a light-emitting element package.

[0371] Hereinafter, the manufacturing method of the light-emitting element package 1 according to the first embodiment described herein will be explained.

[0372] The manufacturing method of the light-emitting element package 1 includes a process (process (1)) of preparing a support body provided with an adhesive layer and a plurality of light-emitting elements having a first electrode and a second electrode and having a light-emitting surface that emits light.

[0373] The process of arranging multiple light-emitting elements on the adhesive layer in a manner that makes contact with the light-emitting surface of the light-emitting element (process (2));

[0374] The process of forming an optical auxiliary layer with multiple light-emitting elements embedded and covered by an adhesive layer (process (3));

[0375] The process of forming a first wiring layer containing wiring on an optical auxiliary layer, wherein the wiring is directly and electrically connected to a first electrode and / or a second electrode, and is a wiring extending on the surface of the optical auxiliary layer opposite to the surface exposed by the light-emitting surface (process (4));

[0376] The process of forming a first insulating layer by covering a first wiring layer and an optical auxiliary layer (process 5); and

[0377] The process of forming a second wiring layer disposed on the first insulating layer and electrically connected to the first wiring layer (process (6)). Hereinafter, the various processes that may be included in the manufacturing method of the light-emitting element package of this embodiment will be specifically described.

[0378] -Step (1)- <Step of preparing a support body with an adhesive layer and multiple light-emitting elements having a first electrode and a second electrode and having a light-emitting surface that emits light>

[0379] like Figure 3A As shown, firstly, an adhesive layer (resin composition layer) 62X, an adhesive sheet 60X serving as a laminated structure comprising a support 64X to which the adhesive layer 62X is laminated, and a plurality of light-emitting elements 10 are prepared. The visible light transmittance of the adhesive layer 62X is preferably 90% or higher. Since the support 64X serves as a sealing substrate 64 for the sealing portion 60 without removing the support 64X, the visible light transmittance of the support 64X is preferably 90% or higher.

[0380] In the light-emitting element package 1 manufactured by the manufacturing method of the light-emitting element package of this embodiment, the adhesive layer 62X becomes the sealing layer 62, and the support 64X can be selected as a substrate that can function as a sealing substrate 64.

[0381] Therefore, the suitable materials for the adhesive layer 62X and the support 64X have been explained as for the sealing layer 62 and the sealing substrate 64, respectively, and the specific structure of the light-emitting element 10 has also been explained as for the present invention, so detailed descriptions of them are omitted.

[0382] Here, a method for manufacturing an adhesive sheet 60X comprising a support 64X and an adhesive layer 62X bonded thereto as a resin composition layer will be described.

[0383] The adhesive sheet 60X of this embodiment includes a support 64X and a resin composition layer bonded to the support.

[0384] When the support 64X functions as a sealing substrate 64 after the manufacturing process of the light-emitting element package 1 is completed, the sealing substrate 64 described can be used as the support 64X.

[0385] Furthermore, after forming the sealing portion 60, and following operations such as peeling off the support 64X, a sealing substrate 64 can be provided separately, any suitable support known in the prior art can be used. If the light-emitting element package 1 does not have a sealing substrate 64, the support 64X can also be peeled off and removed.

[0386] The adhesive sheet 60X can be manufactured, for example, by preparing a resin varnish obtained by dissolving a resin composition in an organic solvent, applying the resin varnish to the support 64X using a die coater or the like, and then drying it to form a resin composition layer.

[0387] Examples of organic solvents used include ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetates such as ethyl acetate, butyl acetate, acetic acid solvents, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as solvents and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; and amide solvents such as dimethylformamide, dimethylacetamide (DMAc), and N-methylpyrrolidone. One organic solvent may be used alone, or two or more may be used in combination.

[0388] -Step (2)- <Step of arranging multiple light-emitting elements on the adhesive layer in a manner that makes contact with the light-emitting surface of the light-emitting element>

[0389] As shown in Figure 3(B), the adhesive layer 62X side of the adhesive sheet 60X prepared in the above process (1) is positioned at a specified position, and a specified number of light-emitting elements 10 (first light-emitting element 10a, second light-emitting element 10b and third light-emitting element 10c) corresponding to the purpose are arranged in such a way that they contact the light-emitting surface 19a of the light-emitting element 10.

[0390] When the light-emitting element 10 is disposed on the adhesive layer 62X, the light-emitting surface 19a of the light-emitting element 10 and the surface of the adhesive layer 62X are disposed such that the light-emitting surface 19a and the surface of the adhesive layer 62X are flush with each other, that is, the light-emitting surface 19a and the surface of the adhesive layer 62X are flush and integral. However, the light-emitting surface 19a may also be disposed such that it is embedded within the thickness of the adhesive layer 62X to form a height difference. In other words, the light-emitting element 10 may be disposed such that at least the light-emitting surface 19a is embedded within the thickness of the adhesive layer 62X.

[0391] -Step (3)- <Step of forming an optical auxiliary layer in which multiple light-emitting elements are embedded and covered by an adhesive layer> Next, an optical auxiliary layer 20 is formed on the adhesive sheet 60X in which the light-emitting elements 10 are disposed, in which multiple light-emitting elements 10 are embedded and covered by an adhesive layer 62X. Specifically, an adhesive sheet having a support and a resin composition layer containing the described components for forming the optical auxiliary layer 20 is prepared, and the adhesive sheet is laminated in such a way that the light-emitting elements 10 are embedded in the resin composition layer and bonded to the adhesive layer 62X.

[0392] Then, the stacked resin composition layers are cured to form the optical auxiliary layer 20, and in order to improve the adhesion between the adhesive layer 62X and the light-emitting element 10, a heat treatment such as a heat pressing process is performed.

[0393] Specifically, the process can be performed through the following steps: Step (3A) preparing an adhesive sheet for forming an optical auxiliary layer, including a support body and a resin composition layer formed from a resin composition for forming an optical auxiliary layer 20 bonded to the support body; Step (3B) laminating the adhesive sheet in a manner that bonds it to the adhesive layer 62X; Step (3C) curing the resin composition layer for forming the optical auxiliary layer and the adhesive layer 62X. It should be noted that, regarding the lamination and curing steps, the following steps can also be used: before performing the lamination step, a step of curing the adhesive layer 62X is performed to form a sealing layer 62; the adhesive sheet is then laminated onto the formed sealing layer 62, and the resin composition layer is cured to form the optical auxiliary layer 20. Steps (3A) to (3C) will be described below.

[0394] Process (3A)

[0395] First, prepare the adhesive sheet. Regarding the adhesive sheet prepared in step (3A), namely the support and the resin composition layer formed by the resin composition for forming the optical auxiliary layer laminated on the support, the materials described can be used and formed in the same way as the adhesive sheet 60X described.

[0396] Process (3B)

[0397] As shown in Figure 3(C), in step (3B), the adhesive sheet is laminated in such a way that the light-emitting element 10 is embedded in the resin composition layer and bonded to the adhesive layer 62X.

[0398] This lamination process can be performed, for example, by heating and pressing while the resin composition layer of the adhesive sheet is bonded to the adhesive layer 62X. Examples of heating and pressing components include heated metal plates (SUS end plates, etc.) and metal rollers (SUS rollers). It should be noted that the heating and pressing component is not pressed directly into contact with the adhesive sheet, but rather pressed through an elastic material such as heat-resistant rubber.

[0399] The lamination process can be carried out, for example, by vacuum lamination. The heating and pressing temperatures, and other conditions in vacuum lamination can be adjusted to suit the materials of the support and the resin composition.

[0400] The lamination process can be performed using commercially available vacuum laminators. Examples of commercially available vacuum laminators include the vacuum pressure laminator manufactured by Meiki Manufacturing Co., Ltd., and the vacuum dressing device manufactured by Nikko-Materials Co., Ltd.

[0401] After the lamination process, a smoothing treatment can be performed, for example, by pressing the adhesive sheet again with a heated pressing member, to make the resin composition layer smoother. The conditions for the smoothing treatment can be the same as those for the lamination process. The smoothing treatment can be performed using a commercially available vacuum laminator as described above, and can be carried out continuously with the lamination process.

[0402] Process (3C)

[0403] Next, a process is performed to cure the resin composition layer for forming the optical auxiliary layer and the adhesive layer 62X.

[0404] There are no particular limitations on the curing conditions for the resin composition layer for forming the optical auxiliary layer and the adhesive layer 62X. The curing conditions can be any suitable conditions depending on the materials selected for the resin composition.

[0405] Before curing the resin composition layer for forming the optical auxiliary layer and the adhesive layer 62X, a preheating treatment can be performed at a temperature lower than that described in the curing conditions. For example, before the heat treatment for curing, preheating can be performed at a temperature of 50°C or higher and lower than 120°C (preferably 60°C or higher and lower than 115°C, more preferably 70°C or higher and lower than 110°C) for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes).

[0406] After the curing process is completed, the support for forming the optical auxiliary layer can be peeled off. Alternatively, the support for forming the optical auxiliary layer may not be removed at this stage, but may be peeled off after the formation of the first through-hole 22, as described later.

[0407] Through the above processes, the support 64X is used as the sealing substrate 64, the adhesive layer 62X is used as the sealing layer 62, and is used as the optical auxiliary layer 20.

[0408] -Step (4)- <Step of forming a first wiring layer containing wiring on the optical auxiliary layer, wherein the wiring is directly and electrically connected to the first electrode and / or the second electrode, and is wiring extending on the surface of the optical auxiliary layer opposite to the exposed surface of the light-emitting surface>

[0409] As shown in Figure 3(C), firstly, by performing an opening process on the optical auxiliary layer 20, a number of first through holes 22 corresponding to the required number are formed in a specified area. The first through holes 22 open onto the second surface 20b and are typically openings that expose at least a portion of the first electrode 16 and / or the second electrode 18 of the light-emitting element 10.

[0410] It should be noted that the first through-hole 22 for electrical connection with the second wiring portion 52 included in the second wiring layer 50 may not be formed in this stage. That is, only the first through-hole 22 for electrical connection with the first wiring portion 32 included in the first wiring layer 30 can be formed in this process, and the first through-hole 22 communicating with the second through-hole 42 described later can be formed simultaneously with the formation of the second through-hole 42.

[0411] Regarding the hole-making process, it can be carried out using methods such as drill bits, lasers, plasma, sandblasting, etc., according to the composition of the resin composition used to form the optical auxiliary layer 20 as described above. These methods can also be combined as needed. Among these methods, it is preferable to perform the hole-making process using lasers such as carbon dioxide lasers, UV lasers, and excimer lasers.

[0412] Regarding laser-based hole-making conditions (e.g., laser wavelength, pulse number, pulse width, output power), there are no particular limitations as long as a through hole with a good through hole shape can be formed, and general processing conditions can be adopted according to the specifications of the laser processing machine used.

[0413] The shape of the profile of the first through hole 22 when viewed from one side in the thickness direction is not particularly limited. The shape of the profile is generally circular (approximately circular).

[0414] Next, a first wiring layer 30 containing a plurality of first wiring portions 32 is formed on the optical auxiliary layer 20 on which the first through hole 22 is formed. The first wiring portions 32 are wirings that are directly and electrically connected to the first electrode 16 and / or the second electrode 18, and the plurality of first wiring portions 32 extend on the second surface 20b of the optical auxiliary layer 20 on the opposite side of the first surface 20a exposed by the light-emitting surface 19a of the light-emitting element 10.

[0415] When the first wiring layer 30 is formed, a process of roughening the second surface 20b can then be performed.

[0416] The roughening process is a process of roughening the second surface 20b. There are no particular limitations on the steps and conditions of the roughening process; for example, known steps and conditions commonly used when forming the insulating layer of a printed wiring board can be used.

[0417] Specifically, for example, the insulation layer can be roughened by sequentially performing a swelling treatment using a swelling solution, a roughening treatment using an oxidizing agent, and a neutralization treatment using a neutralizing solution.

[0418] There are no particular limitations on the swelling solution. Examples of swelling solutions include alkaline solutions and surfactant solutions, with alkaline solutions being preferred. Sodium hydroxide solution and potassium hydroxide solution are particularly suitable as alkaline solutions.

[0419] Commercially available swelling solutions include, for example, "Swelling Dip Securiganth P" and "Swelling Dip Securiganth SBU" manufactured by Ammet Japan Co., Ltd.

[0420] There are no particular limitations on the swelling treatment using a swelling solution. For example, the swelling treatment can be carried out by immersing the optical auxiliary layer 20 in a swelling solution at 30°C to 90°C for 1 to 20 minutes.

[0421] From the viewpoint of controlling swelling to an appropriate level, it is preferable to immerse the sample in a swelling solution at 40°C to 80°C for 5 to 15 minutes.

[0422] The oxidizing agent is not particularly limited. Examples of oxidizing agents include, for instance, an alkaline permanganate solution obtained by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment using an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersion in an oxidizing agent solution heated to 60°C to 80°C for 10 to 30 minutes. Furthermore, the concentration of permanganate in the alkaline permanganate solution is preferably 5% to 10% by mass.

[0423] Commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate CompactCP" and "Dosing solution Securiganth P" manufactured by Ammet Japan Co., Ltd.

[0424] The neutralizing solution is preferably an acidic aqueous solution. Commercially available examples include "Reduction Solution Securiganth P" manufactured by Ammet Japan Co., Ltd. Treatment with the neutralizing solution can be performed by immersing the roughened surface treated with an oxidizing agent in a neutralizing solution at 30°C to 80°C for 5 to 30 minutes. From an operational perspective, it is preferable to immerse the roughened object treated with an oxidizing agent in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes.

[0425] Next, as shown in FIG3(C), a first wiring layer 30 comprising a plurality of first wiring portions 32 is formed on the second surface 20b. Since finer wiring can be formed, the process of forming the first wiring layer 30 is preferably a process of forming the wiring layer by a semi-additive method or a modified semi-additive method.

[0426] Here, the semi-additive process (SAP) refers to a method in which an electroless metal seed layer is first formed, followed by the formation of a wiring pattern through electrolytic metal plating, and then the exposed electroless metal seed layer is removed by etching to form the wiring. The modified semi-additive process (MSAP) refers to a method in which a metal seed layer is formed using an extremely thin metal foil, a wiring pattern is formed, and then the exposed metal seed layer is removed by flash etching to form the wiring. The formation process of the first wiring layer 30 will be described below.

[0427] The conductor material constituting the first wiring layer 30 is not particularly limited. In a preferred embodiment, the conductor material comprises one or more metals selected from gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer can be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above-mentioned metals (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). From the viewpoint of the versatility, cost, and ease of pattern formation of the first wiring layer 30, the conductor material is preferably a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium alloy, copper-nickel alloy, or copper-titanium alloy. More preferably, it is a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of nickel-chromium alloy. Even more preferably, it is a single metal layer of copper.

[0428] The first wiring layer 30 can be a single-layer structure or a multi-layer structure formed by stacking two or more single metal layers or alloy layers of different kinds of metals or alloys. When the first wiring layer 30 is a multi-layer structure, the layer in contact with the optical auxiliary layer 20 is preferably a single metal layer of chromium, zinc or titanium or an alloy layer of nickel-chromium alloy.

[0429] The thickness of the first wiring layer 30 can be any suitable thickness, taking into account desired electrical characteristics, etc. From the viewpoint of thinness, the thickness of the first wiring layer 30 is preferably 30 μm or less, more preferably 20 μm or less, 15 μm or less, or 10 μm or less. There is no particular limitation on the lower limit of the thickness, but it is preferably 1 μm or more, more preferably 2 μm or more, or 3 μm or more.

[0430] The wiring spacing of the first wiring section 32 included in the first wiring layer 30 is not particularly limited. The wiring spacing can be any suitable wiring spacing corresponding to the design.

[0431] Through the above processes, the first wiring layer 30 is formed. It should be noted that, through this process, wiring within the through-holes that electrically and directly connect the first wiring layer 30 to the wiring structure located at a lower layer, such as the first electrode 16 and / or the second electrode 18 of the light-emitting element 10, is also formed within the first through-hole 22.

[0432] -Step (5)- <Step of forming the first insulating layer by covering the first wiring layer and the optical auxiliary layer>

[0433] like Figure 3D As shown, step (5) is specifically performed in the following manner: Step (5A) prepares an adhesive sheet for forming a first insulating layer, which includes a support body and a resin composition layer formed of a resin composition for forming a first insulating layer bonded to the support body; Step (5B) laminates the adhesive sheet in a manner that it is bonded to the resin composition layer; Step (5C) cures the resin composition layer to form the first insulating layer 40. Hereinafter, steps (5A) to (5C) will be described. It should be noted that the first insulating layer 40 can be formed in the same way as the optical auxiliary layer 20 already described. Therefore, repeated descriptions will be omitted.

[0434] Process (5A)

[0435] The adhesive sheet can be prepared using the suitable materials described, in the same manner as the described optical auxiliary layer 20.

[0436] Process (5B)

[0437] As shown in Figure 3(D), firstly, a process is performed in which the adhesive sheet is laminated in such a way that a first wiring layer 30 containing a plurality of first wiring portions 32 is embedded in a resin composition layer and is bonded to the second surface 20b of the optical auxiliary layer.

[0438] This lamination process can be performed, for example, by heating and pressing while the resin composition layer of the adhesive sheet is bonded to the second surface 20b of the optical auxiliary layer 20, in the same way as the formation process of the optical auxiliary layer 20.

[0439] A smoothing treatment can be performed after the lamination process, for example, by pressing the adhesive sheet again with a heated pressing member to make the resin composition layer smoother.

[0440] Process (5C)

[0441] Next, a first insulating layer 40 is formed by curing the resin composition layer. The curing conditions of the resin composition layer can be any suitable conditions depending on the materials selected for the resin composition.

[0442] The resin composition layer used to form the first insulating layer 40 may be preheated at a temperature lower than that described in the curing conditions before curing.

[0443] After the curing process is completed, the support used to form the first insulating layer 40 can be peeled off. Alternatively, the support can be left in place at this stage and peeled off after the formation of the second through hole 42, which will be described later.

[0444] Through the above processes, the first insulating layer 40 is formed.

[0445] Step (6) <Step of forming a second wiring layer disposed on the first insulating layer and electrically connected to the first wiring layer (and the first electrode and / or the second electrode)>

[0446] As shown in Figure 3(E), firstly, by performing an opening process on the first insulating layer 40, a number of second through holes 42 corresponding to the required number are formed in a specified area. The second through holes 42 open onto the exposed surface of the first insulating layer 40, typically an opening that exposes at least a portion of the first wiring portion 32 contained in the first wiring layer 30. If the first through holes 22 reaching the first electrode 16 and / or the second electrode 18 of the light-emitting element 10 are not formed, this process can form second through holes 42 that expose a portion of the first electrode 16 and / or the second electrode 18 (communicating with the first through hole 22).

[0447] The hole-making process is preferably performed using a laser such as a carbon dioxide laser, a UV laser, or an excimer laser, similar to the first through hole 22, based on the composition of the resin composition used to form the first insulating layer 40 as described above.

[0448] The shape of the outline of the second through hole 42 when viewed from one side in the thickness direction is usually circular (approximately circular). However, it is not limited to this.

[0449] Next, a second wiring layer 50 comprising a plurality of second wiring portions 52 is formed on the first insulating layer 40 on which the second through hole 42 is formed, similar to the first wiring layer 30 described above. The second wiring portions 52 are wirings that are directly and electrically connected to the first wiring layer 30, the first electrode and / or the second electrode, and the plurality of second wiring portions 52 extend on the surface of the first insulating layer 40.

[0450] When forming the second wiring layer 50, the same process as forming the first wiring layer 30 is performed, and a process of roughening the surface of the first insulating layer 40 can then be performed.

[0451] As shown in FIG3(E), a second wiring layer 50 comprising a plurality of second wiring portions 52 is then formed on the surface of the first insulating layer 40. For the process of forming the second wiring layer 50, since finer wiring can be formed, it is preferable to form the wiring layer by using a semi-additive method or a modified semi-additive method using copper as the wiring material, similar to the process of forming the first wiring layer 30.

[0452] The wiring spacing of the second wiring section 52 included in the second wiring layer 50 is not particularly limited. The wiring spacing can be any suitable wiring spacing corresponding to the design, or it can be a wiring spacing different from the wiring spacing of the first wiring layer 30.

[0453] Thus, the second wiring layer 50 is formed. It should be noted that, through this process, wiring within a through-hole that directly and electrically connects the second wiring layer 50, the first wiring layer 30, and the first electrode 16 and / or the second electrode 18 of the light-emitting element 10, which are located in a lower layer, can also be formed in the second through-hole 42 (and the first through-hole 22 connected thereto).

[0454] By repeating the described process of forming the first insulating layer 40, the second through-hole 42, and the second wiring layer 50 one or more times, a further multilayer wiring structure can be formed.

[0455] Through the above processes, the light-emitting element package 1 of this embodiment can be manufactured.

[0456] According to the manufacturing method of the light-emitting element package 1 of this embodiment, the package carrying the light-emitting element can be manufactured efficiently in a simple process without the use of solder balls or the like, resulting in a further improvement in the yield of the light-emitting element package 1. Furthermore, as described above, a fine wiring structure including a first insulating layer 40, a second via 42, and a first wiring layer 30 can be implemented after the light-emitting element 10 is configured. Therefore, flexible design changes to the wiring structure are possible, and various wiring structures can be accommodated even when multiple light-emitting elements 10 are configured.

[0457] Explanation of symbols

[0458] 1. Light-emitting element packaging

[0459] 10 Light-emitting elements

[0460] 10a First light-emitting element

[0461] 10b Second light-emitting element

[0462] 10c Third light-emitting element

[0463] 12 First conductivity type semiconductor layer

[0464] 14 Second conductivity type semiconductor layer

[0465] 16 First Electrode

[0466] 18 Second Electrode

[0467] 19 Sapphire substrate

[0468] 19a Luminous surface

[0469] 20. Optical auxiliary layers (black layer, white layer)

[0470] 20a First Surface

[0471] 20b Second Surface

[0472] 22 First through hole

[0473] 30 First wiring layer

[0474] 32 First Wiring Department

[0475] 40 First Insulation Layer

[0476] 42 Second through hole

[0477] 50 Second wiring layer

[0478] 52 Second Wiring Department

[0479] 60 Sealing part

[0480] 60X Adhesive Sheet

[0481] 62 Sealing layer

[0482] 62X Adhesive Layer

[0483] 64 sealed base plate

[0484] 64X Support

[0485] 70 Color Filter.

Claims

1. A light-emitting element package, comprising: Multiple light-emitting elements, each having a first electrode and a second electrode, and having a light-emitting surface that emits light; An optical auxiliary layer in which the light-emitting element is embedded with at least the light-emitting surface exposed; A first wiring layer comprising wiring that is directly and electrically connected to either or both of the first electrode and the second electrode, and that extends on the surface of the optical auxiliary layer opposite to the exposed surface of the light-emitting surface; A first insulating layer is provided such that it covers the first wiring layer and the optical auxiliary layer; A second wiring layer is disposed on the first insulating layer and is electrically connected to the first wiring layer; as well as A sealing portion that seals the light-emitting element by covering the light-emitting surface, while allowing light emitted from the light-emitting surface to pass through. The optical auxiliary layer is a black layer and contains a cured product obtained by curing a resin composition. The resin composition, in terms of solid content, comprises, relative to 100 parts by weight of the resin composition, the following: 10 to 70 parts by weight of at least one insulating filler selected from barium sulfate, silica and talc; 5-60 parts by weight of epoxy compound; 1-20 parts by weight of a silane coupling agent having glycidyl and hydroxyl groups; as well as 1-25 parts by weight of black colorant The cured product obtained by curing the resin composition has a curing shrinkage of less than 0.5%.

2. The light-emitting element package according to claim 1, wherein, The light-emitting element is an LED element with a planar dimension of more than 100 μm square and less than 200 μm square when viewed from one side in the thickness direction.

3. The light-emitting element package according to claim 1, wherein, The light-emitting element is a mini LED element with a planar size of more than 100μm square and less than 150μm square.

4. The light-emitting element package according to claim 1, wherein, The light-emitting element is a microLED element with a planar dimension of less than 100μm square.

5. The light-emitting element package according to claim 1, wherein, The black layer, used as an optical auxiliary layer, has a transmittance of less than 50% for incident light at a wavelength of 450 nm.

6. The light-emitting element package according to claim 5, wherein, The transmittance is below 30%.

7. The light-emitting element package according to claim 5, wherein, The transmittance is less than 10%.

8. The light-emitting element package according to claim 5, wherein, The transmittance is less than 5%.

9. The light-emitting element package according to claim 1, wherein, The sealing portion comprises a cured product obtained by curing a resin composition.

10. The light-emitting element package according to claim 1, wherein, The curing shrinkage is less than 0.4%.

11. The light-emitting element package according to claim 1, wherein, The visible light transmittance of the sealing part is over 80%.

12. The light-emitting element package according to claim 11, wherein, The visible light transmittance is above 90%.

13. The light-emitting element package according to claim 11, wherein, The visible light transmittance is above 95%.

14. A method for manufacturing a light-emitting element package, comprising: The process of preparing a support body with an adhesive layer and multiple light-emitting elements having a first electrode and a second electrode and having a light-emitting surface that emits light. A process of arranging a plurality of light-emitting elements on the adhesive layer in such a way that they are in contact with the light-emitting surface of the light-emitting element; The process of forming an optical auxiliary layer in which multiple light-emitting elements are embedded and covered by the adhesive layer, wherein the optical auxiliary layer is a black layer and comprises a cured product obtained by curing a resin composition, wherein the resin composition, in terms of solid content, comprises, relative to 100 parts by weight of the resin composition: 10 to 70 parts by weight of at least one insulating filler selected from barium sulfate, silica and talc; 5 to 60 parts by weight of an epoxy compound; and 1 to 20 parts by weight of a silane coupling agent having glycidyl and hydroxyl groups; The cured product obtained by curing the resin composition with 1 to 25 parts by weight of black colorant has a curing shrinkage of less than 0.5%. The process of forming a first wiring layer containing wiring on the optical auxiliary layer, wherein the wiring is directly and electrically connected to either or both of the first electrode and the second electrode, and is wiring that extends on the surface of the optical auxiliary layer opposite to the exposed surface of the light-emitting surface; The process of forming a first insulating layer in a manner that covers the first wiring layer and the optical auxiliary layer; as well as The process of forming a second wiring layer disposed on the first insulating layer and electrically connected to the first wiring layer.

15. The method for manufacturing a light-emitting element package according to claim 14, wherein, The light-emitting element is an LED element with a planar dimension of more than 100 μm square and less than 200 μm square when viewed from one side in the thickness direction. The process of forming the first wiring layer and the process of forming the second wiring layer are processes of forming wiring layers by a semi-additive method or a modified semi-additive method.

16. The method for manufacturing a light-emitting element package according to claim 15, wherein, The light-emitting element is a mini LED element with a planar size of more than 100μm square and less than 150μm square.

17. The method for manufacturing a light-emitting element package according to claim 15, wherein, The light-emitting element is a microLED element with a planar dimension of less than 100μm square.

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