A ceramic package flip chip package laminate structure and assembly method

Abstract

A ceramic shell flip chip packaging laminated structure and assembling method, including flip chip, ceramic shell and substrate, wherein the substrate is arranged at the bottom of the packaging laminated structure, and a plurality of tin balls are welded at the bottom of the substrate; the ceramic shell is arranged on the substrate, the ceramic shell is a rectangular plate structure with a rectangular through slot on one side, the number of the ceramic shell is at least two, and the substrate and the ceramic shell form a laminated structure; the number of the flip chip is consistent with that of the ceramic shell, and the flip chip is fixedly arranged in the rectangular through slot of the ceramic shell. The flip chip laminated structure of the present application can realize laminated arrangement of the flip chip through the structure of the flip chip, the ceramic shell and the substrate, and through the structure of arranging the rectangular through slot at the bottom of the ceramic shell and stacking the plurality of ceramic shells on the substrate and the bottom ceramic shell, so that the flip chip can be laminated, the interconnection use effect of the flip chip is improved, and the use space of the flip chip interconnection is reduced.

Description

Technical Field

[0001] This invention belongs to the field of integrated circuit chip packaging technology, specifically relating to a ceramic housing flip chip packaging stack structure and assembly method. Background Technology

[0002] For flip-chip with bumps, the chip bumps are interconnected with pads on the substrate, and an outer ceramic shell is bonded to the substrate, which can protect the internal flip-chip and form a complete package. However, this structure cannot realize a stacked structure of multiple flip chips, which hinders the interconnection of multiple flip chips and prevents them from fulfilling their interconnection function. In addition, traditional methods of interconnecting multiple flip chips occupy a lot of space and reduce the effectiveness of chip interconnection. Summary of the Invention

[0003] The purpose of this invention is to provide a ceramic-cased flip-chip packaging stack structure and assembly method to solve the problems in the prior art.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A ceramic-cased flip-chip package stack structure includes a flip chip, a ceramic casing, and a substrate, wherein:

[0006] The substrate is disposed at the bottom of the packaging stack structure, and a plurality of solder balls are soldered to the bottom of the substrate;

[0007] The ceramic shell is disposed on the substrate. The ceramic shell is a rectangular plate-shaped structure with a rectangular through groove on one side. There are at least two ceramic shells, including a first ceramic shell and a second ceramic shell. The side of the first ceramic shell with the rectangular through groove is connected to the insulating layer on the substrate disposed on the upper surface of the substrate. The second ceramic shell is disposed above the first ceramic shell. The side of the second ceramic shell with the rectangular through groove is connected to the insulating layer on the ceramic shell disposed on the first ceramic shell.

[0008] The substrate and the ceramic shell form a laminated structure;

[0009] The number of flip chips is consistent with the number of ceramic housings, and each ceramic housing has a flip chip disposed in a rectangular through slot.

[0010] Furthermore, a plurality of metal lines are provided on the upper and lower surfaces of the substrate and on the upper surface of the ceramic shell, and the plurality of metal lines are fixed on the upper and lower surfaces of the substrate and on the upper surface of the ceramic shell that is in contact with the substrate.

[0011] Furthermore, the metal circuit includes metal pads and metal pad connection lines, wherein:

[0012] The metal pad connecting line is disposed between the metal pads, and the metal pads and the metal pad connecting line are integrally formed;

[0013] The metal lines are arranged in multiple rows on the upper surfaces of the substrate and the ceramic shell, and are distributed in an array.

[0014] Furthermore, a plurality of metal bumps are provided inside the insulating layer on the substrate and the insulating layer on the ceramic shell, and the metal bumps are connected to the metal pad connection points on one side of the upper surface of the substrate.

[0015] Furthermore, the metal bumps on the insulating layer of the substrate and the metal bumps on the ceramic shell are fixedly connected by columnar metal phases in the ceramic shell.

[0016] Furthermore, the upper surface of the flip chip is bonded to the bottom of the rectangular through-slot of the ceramic housing using adhesive.

[0017] Furthermore, the lower surface of the flip chip is provided with a plurality of flip chip bumps, which are soldered to a plurality of metal pads on the substrate and the ceramic shell.

[0018] Furthermore, a protective colloid is filled between the lower surface of the flip chip and the substrate.

[0019] Furthermore, a vertical connecting line is provided between the upper and lower surfaces of the substrate to connect the circuit connection points of the upper and lower surfaces of the substrate, and the vertical connecting line is in contact with the metal pads on the upper and lower surfaces of the substrate.

[0020] An assembly method for a ceramic-cased flip-chip package stack structure includes:

[0021] S1: Metal circuit connection points are provided on the upper and lower surfaces of the substrate;

[0022] S2: An insulating layer is provided on the left and right sides of the upper surface of the substrate, and metal bumps and columnar metal are provided on the insulating layer.

[0023] S3: Solder the solder balls on the bottom surface of the flip chip to the metal pads on the top surface of the substrate, and fill the space between the bottom surface of the chip and the top surface of the substrate with protective colloid.

[0024] S4: A first ceramic shell is disposed above the insulating layer on the prepared substrate;

[0025] S5: A metal pad is provided on the first ceramic shell, and an insulating layer, flip chip and metal bump are provided on the provided metal pad, and columnar metal is provided on the metal bump;

[0026] S6: Fill the upper surface of the chip and the bottom of the rectangular through-slot of the second ceramic shell with adhesive, and solder several solder balls to the bottom of the substrate to complete the assembly of the ceramic shell flip chip packaging stack structure.

[0027] Compared with the prior art, the advantages of the present invention are:

[0028] 1. By using the structure of flip chip, ceramic housing and substrate, and by setting a rectangular through groove at the bottom of the ceramic housing and fixing multiple ceramic housings on the substrate and bottom ceramic housing, flip chips can be stacked, which improves the interconnection effect of flip chips and reduces the space used for flip chip interconnection.

[0029] 2. By setting metal lines on the upper and lower surfaces of the substrate, the chips and bumps located on the upper and lower surfaces of the substrate are connected by the metal lines, so that the flip chip stacked structure can be interconnected with the external structure, thus expanding the application range of stacked flip chips.

[0030] 3. Through the metal lines of metal pads and metal pad connection lines, and the metal lines of metal pads and metal connection lines are distributed in a matrix, the flip chip and the structure interconnected with the flip chip can be interconnected by soldering on the metal pads, thus ensuring the stacked connection of the flip chip.

[0031] 4. The interconnection of stacked chips is further ensured by connecting the stacked chips through the structure of metal bumps and columnar metal.

[0032] 5. By filling the space between the substrate and the flip chip with an alternating protective structure, the flip chip is prevented from coming into contact with the substrate, which could lead to insufficient heat dissipation and overheating that could burn the chip. On the other hand, the chip is better secured, preventing it from shaking and ensuring the safety of using stacked flip chips. Attached Figure Description

[0033] The accompanying drawings, which form part of this specification, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0034] Figure 1 This is a schematic diagram of the overall structure of a ceramic shell flip-chip package stacked structure according to the present invention;

[0035] Figure 2This is a schematic diagram of the ceramic shell flip chip packaging stacked structure substrate and metal pads of the present invention;

[0036] Figure 3 This is a schematic diagram of an insulating layer disposed on a substrate in a ceramic shell flip-chip package stacked structure according to the present invention.

[0037] Figure 4 This is a schematic diagram of a ceramic shell flip chip packaging stacked structure of the present invention, in which metal bumps and metal filling holes are provided on the insulating layer.

[0038] Figure 5 This is a schematic diagram of a ceramic shell flip chip packaging stacked structure of the present invention, in which metal bumps are provided on the insulating layer.

[0039] Figure 6 This is a schematic diagram of a ceramic-cased flip-chip packaging stack structure of the present invention, showing the first layer of a flip chip.

[0040] Figure 7 This is a schematic diagram of a ceramic shell flip-chip packaging stacked structure with columnar metal disposed in the ceramic shell according to the present invention;

[0041] Figure 8 This is a schematic diagram of the ceramic housing flip chip packaging stack structure of the present invention, which is a first layer of flip chip packaged in a ceramic housing.

[0042] Figure 9 This is a schematic diagram of a ceramic housing flip chip packaging stack structure of the present invention, wherein metal pads are provided on the first ceramic housing;

[0043] Figure 10 This is a schematic diagram of the metal pad distribution structure of a ceramic shell flip chip package stacked structure according to the present invention;

[0044] Figure 11 This is a schematic diagram of a ceramic shell flip-chip packaging stacked structure of the present invention, in which an insulating layer and metal bumps are provided on the ceramic shell.

[0045] Figure 12 This is a schematic diagram of a ceramic shell flip chip packaging stack structure with a second flip chip layer according to the present invention;

[0046] Figure 13 This is a schematic diagram of a ceramic shell encapsulating a second flip chip in a ceramic shell flip chip packaging stack structure of the present invention;

[0047] Figure 14 This is a schematic diagram of a ceramic shell flip chip packaging stacked structure of the present invention, in which solder balls are disposed on the bottom substrate;

[0048] Figure 15 This is a flowchart of a ceramic-cased flip-chip packaging stack-up structure assembly method according to the present invention.

[0049] Wherein: 1-substrate; 2-flip chip; 3-protective colloid; 4-metal bump; 5-pillar metal; 6-ceramic shell; 7-insulator on substrate; 8-adhesive; 9-insulator on ceramic shell; 10-metal pad; 11-metal filler hole; 12-flip chip bump; 13-solder ball; 14-metal pad connection line. Detailed Implementation

[0050] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0051] The following detailed description is exemplary and intended to provide further detailed explanation of the invention. Unless otherwise specified, all technical terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this invention is for describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention.

[0052] Example 1:

[0053] like Figure 1 As shown, a ceramic shell 6 flip chip 2 packaging stack structure of the present invention includes a substrate 1 and at least two ceramic shells 6. The substrate 1 is disposed at the bottom of the ceramic shell flip chip packaging stack structure of the present invention. Two ceramic shells 6 are disposed sequentially on the top of the substrate 1. The ceramic shells 6 are rectangular structures, wherein a through groove in the horizontal direction is provided at the center of one end face of the rectangular structure. The two ceramic shells 6 include a first ceramic shell and a second ceramic shell. The first ceramic shell and the second ceramic shell have the same structure and shape. The first ceramic shell is disposed on the substrate 1 and fixedly connected to the substrate 1. The second ceramic shell is disposed on the upper surface of the first ceramic shell and fixedly connected to the upper surface of the first ceramic shell. An insulating layer 7 is disposed at the contact position between the substrate 1 and the first ceramic shell, and an insulating layer 9 is disposed at the contact position between the first ceramic shell and the second ceramic shell. That is, the side of the first ceramic shell with a rectangular through groove is connected to the insulating layer 7 on the substrate 1; the second ceramic shell is disposed above the first ceramic shell, and the side of the second ceramic shell with a rectangular through groove is connected to the insulating layer 9 on the ceramic shell disposed on the first ceramic shell.

[0054] More specifically, such as Figure 10As shown, several metal lines are provided on the upper and lower surfaces of the substrate and the upper surface of the ceramic shell. The several metal lines are fixed on the upper and lower surfaces of the substrate and the upper surface of the ceramic shell in contact with the substrate. Among them, the metal lines include metal pads 10 and metal pad connecting lines. The metal sheet and the metal pad connecting lines are integrally formed.

[0055] More specifically, a plurality of metal pads 10 are provided on the upper and lower surfaces of the substrate 1 and on the upper surface of the ceramic shell fixed to the upper and lower surfaces of the substrate and in contact with the substrate. The plurality of metal pads 10 are fixedly connected to the upper and lower surfaces of the substrate 1 and are connected by metal pad connecting lines 14 to form an interconnected pattern. The plurality of metal pads 10 are distributed in multiple rows evenly, and the metal pads 10 in each row are evenly arranged in an array. Specifically, the metal pads 10 on the upper surface and the lower surface of the substrate 1 are connected by metal pad connecting lines 14, so that the metal pads 10 on the substrate 1 and the metal pads 10 below the substrate 1 can communicate with each other.

[0056] Preferably, the metal pad is square or rectangular; it can also be circular or elliptical.

[0057] More specifically, the ceramic shell is a rectangular plate structure with a rectangular through-slot on one side, that is, the ceramic shell 6 is a flat n-shaped structure with a rectangular through-slot on one end face after being fully cut vertically. The side of the first ceramic shell 6 with the rectangular through-slot is disposed on the substrate 1, that is, the direction of the n-shaped opening is in contact with the upper surface of the first ceramic shell 6. An insulating layer is disposed on the substrate 1 at the contact point between the substrate 1 and the first ceramic shell 6, and a number of metal bumps 4 are disposed at intervals in the insulating layer. The method of manufacturing the metal bumps 4, taking the metal bumps on the substrate as an example, is as follows: first, an insulating layer is prepared on the substrate 1 by coating, then metal holes, that is, metal filling holes 11, are obtained in the insulating layer by developing and etching, and finally, metal bumps 4 are obtained in the metal filling holes 11 by electroplating. The material of the metal bumps 4 can be tin.

[0058] Furthermore, the method for manufacturing the metal bumps 4 on the first ceramic shell is the same as the method for manufacturing the metal bumps on the substrate.

[0059] More specifically, the insulating layer 7 on the substrate is divided into two sections on both the substrate 1 and the first ceramic shell. The two sections of the insulating layer 7 are respectively disposed on the upper surface of the substrate 1. The length of each section of the insulating layer 7 is preferably the same as the length of the ceramic shell at both ends of the horizontal through groove at the bottom of the ceramic shell 6. The outer end face of the insulating layer 7 is flush with the outer end face of the substrate 1, and the inner end face is flush with the inner end face of the substrate 1.

[0060] More specifically, the side of the second ceramic shell with a rectangular through groove at the bottom is disposed on the upper surface of the first ceramic shell 6, and an insulating layer 9 on the ceramic shell is disposed between the upper surfaces of the second ceramic shell and the first ceramic shell. The size of the insulating layer 9 on the ceramic shell is the same as the size of the insulating layer 7 on the substrate. Several metal bumps 4 identical to those on the insulating layer 7 on the substrate 1 are disposed in the insulating layer 9 on the ceramic shell. Each metal bump 4 is connected to a metal pad 10 disposed thereon, and a vertical ceramic shell columnar metal 5 is disposed on each metal bump 4 of the ceramic shell 6. The other side of each ceramic columnar metal 5 corresponding to the ceramic shell 6 is connected to another metal bump 4 or another metal pad 10. This arrangement enables the flip chips 2 in the stacked ceramic shell 6 to be interconnected through the ceramic columnar metal 5 and the metal bumps 4.

[0061] More specifically, the lower surface of the flip chip 2 is provided with a plurality of flip chip bumps 12, which are soldered to a plurality of metal pads 10 on the substrate 1 and the ceramic shell 6. The number of flip chips 2 is consistent with the number of ceramic shells 6, and one flip chip 2 is provided in the rectangular through-slot of each ceramic shell 6. That is, the flip chip 2 is disposed in the n-shaped ceramic shell 6 with the rectangular through-slot, the upper surface of the flip chip 2 is bonded to the bottom center of the rectangular through-slot of the ceramic shell 6 by adhesive 8, and the lower surface of the flip chip 2 is connected to the metal pads 10 on the substrate 1 or the ceramic shell 6 by solder balls 13; so that the flip chip 2 can form a stacked structure and interconnect the chips through the metal pads 10, metal bumps 4 and columnar metal 5 in the ceramic. Furthermore, the lower surface of the chip and the metal pads 10 are filled with a protective colloid 3, which on the one hand avoids unnecessary contact between the chip bumps and causes chip damage, and on the other hand makes the chip more stable.

[0062] Furthermore, a plurality of solder balls 13 are provided at the bottom of the substrate 1, and the plurality of solder balls 13 are respectively soldered to the metal pads 10 at the bottom of the substrate 1.

[0063] Preferably, the length of the substrate 1 is the same as the dimensions of the first ceramic shell 6 and the second ceramic shell 6, such that the edges of the first ceramic shell 6, the second ceramic shell 6, and the substrate 1 are on the same plane.

[0064] More specifically, the ceramic shell flip chip packaging structure of the present invention includes, but is not limited to, stacking a first ceramic shell and a second ceramic shell on a substrate 1. Multilayer packaging stacked structures are all within the scope of protection of the present invention.

[0065] Example 2:

[0066] An assembly method for a ceramic-cased flip-chip package stacked structure, such as Figure 15 As shown, it includes:

[0067] S1: Metal circuit connection points are provided on the upper and lower surfaces of substrate 1;

[0068] S2: An insulating layer is provided on the left and right sides of the upper surface of the substrate 1, and metal bumps 4 and columnar metal 5 are provided on the insulating layer.

[0069] S3: Solder the solder balls 13 on the bottom surface of the flip chip 2 to the metal pads 10 on the upper surface of the substrate 1, and fill the space between the lower surface of the chip and the upper surface of the substrate 1 with protective colloid 3.

[0070] S4: A first ceramic shell 6 is disposed above the insulating layer on the prepared substrate 1;

[0071] S5: A metal pad 10 is provided on the first ceramic shell 6, and an insulating layer 9, a bump chip and a metal bump 4 are provided on the provided metal pad 10, and a columnar metal 5 is provided on the metal bump 4.

[0072] S6: Fill the top surface of the chip and the bottom of the rectangular through-slot of the second ceramic housing 6 with adhesive to complete the assembly of the flip chip 2 package stack structure of the ceramic housing 6.

[0073] More specifically, such as Figure 2 As shown, this is a structure in which metal pads are provided on substrate 1. The metal pads on substrate 1 are preferably copper metal pads. Figure 3 , Figure 4 , Figure 5 The specific process for fabricating metal bumps 4 on substrate 1 is as follows: First, an insulating layer is prepared on substrate 1 by coating, such as... Figure 3 As shown, metal holes are then obtained in the insulating layer through development and etching, as follows. Figure 4 As shown, metal bump 4 is finally obtained in the hole by electroplating, as... Figure 5 As shown; furthermore, the metal bump 4 can be made of tin.

[0074] The bumped flip chip 2 was soldered to the corresponding metal pads 10 on the substrate 1 carrier using flip-chip reflow soldering, and resin colloid was filled under the bumped chip using dispensing. The result is as follows. Figure 6 As shown.

[0075] Figure 7 This is a schematic diagram of a ceramic housing containing columnar metal in a flip-chip package stacked structure. The ceramic housing 6 contains columnar metal 5, which can be made of tin. Figure 7 The ceramic shell 6 is interconnected with the tin bumps on the substrate 1 carrier by thermoforming, thereby obtaining... Figure 8 The package structure shown contains a single chip, and is configured such that the ceramic housing 6 can protect the internal components of the entire package.

[0076] Figure 9 , Figure 11 The process for fabricating metal pads 10 and metal bumps 4 on a ceramic housing 6, where the metal pads 10 are made of copper and the metal bumps 4 are made of tin, is as follows: First, a copper layer is prepared on the surface of the ceramic housing 6 by metal sputtering. Then, the metal pads 10 are obtained by exposure, development, and etching, as shown in Figure 11. Finally, the metal pads 10 are fabricated on the ceramic housing 6 using... Figure 5 The same process is used to prepare metallic tin bumps, resulting in... Figure 11 The structure shown.

[0077] Furthermore, such as Figure 10 The diagram shown is a schematic diagram of a ceramic shell flip chip package stacked structure in which metal pads and metal pad connection lines are distributed in a multi-row array. The arrangement of metal pads includes, but is not limited to, an array distribution structure. Arrangements according to certain rules, such as in rows or columns, are all within the scope of protection of this invention.

[0078] More specifically, the bumped flip chip 2 is soldered to the corresponding metal pad 10 of the ceramic housing 6 using a flip-chip reflow soldering method, and resin colloid is filled under the bumped chip using a dispensing method, resulting in the following... Figure 12 As shown.

[0079] To be more specific, will be with Figure 7 The second ceramic shell, which has the same structure as shown, is interconnected with the tin bumps on the ceramic shell 6 by thermoforming, thereby obtaining... Figure 13 The stacked package structure shown contains two bump chips. The bump chips can be interconnected through the metal pads 10 on the ceramic shell 6 and the columnar metal 5 in the ceramic shell 6. On the surface of the upper ceramic shell 6, the interconnection of multiple flip chip bumps can be further realized by preparing metal pads 10 and bumps. Figure 14 The process of preparing solder balls 13 on the back side of the package substrate 1 carrier is such that the solder balls 13 are used for interconnection between the package and external circuitry.

[0080] As is known from common technical knowledge, this invention can be implemented through other embodiments that do not depart from its spirit or essential characteristics. Therefore, the disclosed embodiments described above are merely illustrative in all respects and are not the only ones. All modifications within the scope of this invention or its equivalents are included in this invention.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A ceramic package flip-chip package stack-up structure, characterized by, It includes a flip chip (2), a ceramic housing (6), and a substrate (1), wherein: The substrate (1) is disposed at the bottom of the encapsulation stack structure, and a plurality of solder balls (13) are soldered to the bottom of the substrate (1). The ceramic shell (6) is disposed on the substrate (1). The ceramic shell (6) is a rectangular plate structure with a rectangular through groove on one side. There are at least two ceramic shells (6), including a first ceramic shell and a second ceramic shell. The side of the first ceramic shell with the rectangular through groove is connected to the substrate insulating layer (7) disposed on the upper surface of the substrate (1). The second ceramic shell is disposed above the first ceramic shell. The side of the second ceramic shell with the rectangular through groove is connected to the ceramic shell insulating layer (9) disposed on the first ceramic shell. The substrate (1) and the ceramic shell (6) form a laminated structure; The number of flip chips (2) is consistent with the number of ceramic shells (6), and each ceramic shell (6) has a flip chip (2) in its rectangular through slot. The upper and lower surfaces of the substrate (1) and the upper surface of the ceramic shell (6) are provided with a plurality of metal lines, which are fixed to the upper and lower surfaces of the substrate (1) and the upper surface of the ceramic shell (6) in contact with the substrate (1). The metal circuit includes metal pads (10) and metal pad connection lines (14), wherein: The metal pad connection line (14) is disposed between the metal pads (10), and the metal pads (10) and the metal pad connection line (14) are integrally formed; The metal lines are arranged in multiple rows on the upper surfaces of the substrate (1) and the ceramic shell (6), and are distributed in an array. The insulating layer (7) on the substrate and the insulating layer (9) on the ceramic shell are provided with a plurality of metal bumps (4). The metal bumps (4) are connected to the metal pads (10) on one side of the upper surface of the substrate (1). The metal bumps (4) on the insulating layer of the substrate (1) and the metal bumps (4) on the ceramic shell are fixedly connected by columnar metal (5) in the ceramic shell. The upper surface of the flip chip (2) is bonded to the bottom of the rectangular through-slot of the ceramic housing (6) by adhesive (8); The lower surface of the flip chip (2) is provided with a plurality of flip chip bumps (12), and the plurality of flip chip bumps (12) are soldered to a plurality of metal pads (10) on the substrate (1) and the ceramic shell (6). A protective colloid (3) is filled between the lower surface of the flip chip (2) and the substrate (1). A vertical connecting line is provided between the upper and lower surfaces of the substrate (1) to connect the line connection points of the upper and lower surfaces of the substrate (1). The vertical connecting line is in contact with the metal pads (10) on the upper surface and the lower surface of the substrate (1).

2. The method of claim 1, wherein the ceramic package flip-chip package laminate structure is assembled by the steps of: include: S1: Metal circuit connection points are provided on the upper and lower surfaces of the substrate (1); S2: An insulating layer (7) is provided on the left and right sides of the upper surface of the substrate (1), and metal bumps (4) and columnar metal (5) are provided on the insulating layer. S3: Solder the solder ball (13) on the bottom surface of the flip chip (2) to the metal pad (10) on the upper surface of the substrate (1), and fill the space between the lower surface of the chip and the upper surface of the substrate (1) with protective colloid (3). S4: A first ceramic shell (6) is disposed above the insulating layer (7) on the prepared substrate; S5: A metal pad (10) is provided on the first ceramic shell (6), and an insulating layer (9), a flip chip (2) and a metal bump (4) are provided on the provided metal pad (10), and a columnar metal (5) is provided on the metal bump (4). S6: Fill the bottom of the rectangular through-slot of the chip and the second ceramic shell (6) with adhesive, and solder several solder balls (13) to the bottom of the substrate (1) to complete the assembly of the ceramic shell flip chip packaging stack structure.

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