Light emitting module and electronic device
By using an asymmetric lens in the light emitting module, the second divergence angle is perpendicular to the first sub-conductor, the problem of obvious dark patterns of the asymmetric light emitting device is solved, and the uniformity of light is improved.
Patent Information
- Application Number
- CN202210467717.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-04-29
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2042-04-29
Smart Images

Figure CN114864795B_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of light-emitting semiconductor technology, and in particular, relates to a light-emitting module and an electronic device. Background Art
[0002] At present, there are two common design methods for existing light-emitting devices, especially infrared light-emitting devices. One is a symmetrical light-emitting device with dual light-emitting elements, and the other is an asymmetrical light-emitting device with a single light-emitting element. Compared with symmetrical light-emitting devices, asymmetrical light-emitting devices can use only a single light-emitting element, which can reduce the problem of insufficient uniformity caused by the energy superposition of two light-emitting elements in the overlapping area of the light spot. At the same time, a single light-emitting element is more energy-saving and environmentally friendly, so it is becoming more and more popular among users.
[0003] However, asymmetric light-emitting devices are prone to produce dark lines when emitting light. The reason is that when the light-emitting element is working, the asymmetric lens of the asymmetric light-emitting device easily causes the wiring (layout) lines on the surface of the light-emitting element at the focus to produce more obvious dark lines through the optical projection of the asymmetric lens, and the uniformity is low. Summary of the invention
[0004] The purpose of the present application is to provide a light-emitting module and an electronic device, aiming to solve the problem of obvious dark lines existing in traditional asymmetric light emitters.
[0005] A first aspect of an embodiment of the present application provides a light-emitting module, comprising: a substrate, the substrate comprising a first panel located on one side of the substrate; a light-emitting chip, the light-emitting chip being fixed on the first panel of the substrate, a wire pattern being provided on a light-emitting surface of the light-emitting chip, the wire pattern comprising a plurality of first sub-wires extending in a first direction, the plurality of first sub-wires being arranged in a second direction, the first direction being perpendicular to the second direction; an asymmetric lens, the asymmetric lens being located on the first panel of the substrate and covering the light-emitting chip, the light-emitting surface of the light-emitting chip facing the asymmetric lens, the asymmetric lens having a first divergence angle in the first direction and in its opposite direction and a second divergence angle in the second direction and in its opposite direction, the second divergence angle being greater than the first divergence angle.
[0006] In one embodiment, the asymmetric lens includes an incident surface and an exit surface that are oppositely arranged, the exit surface is curved, the exit surface is convex toward a side opposite to the substrate, and the incident surface is located between the light-emitting chip and the exit surface and is in contact with the light-emitting surface.
[0007] In one embodiment, the degree of the first divergence angle is the minimum degree of the asymmetric lens, and the degree of the second divergence angle is the maximum degree of the asymmetric lens.
[0008] In one embodiment, the asymmetric lens further includes a mounting portion, wherein the mounting portion is disposed between the incident surface and the emitting surface, and the mounting portion is connected to the first plate surface of the substrate.
[0009] In one embodiment, the emission surface is an ellipsoidal surface.
[0010] In one embodiment, the light emitting chip is a light emitting diode chip.
[0011] In one embodiment, the conductor pattern further includes a second sub-conductor extending along the second direction and serially connecting a plurality of the first sub-conductors.
[0012] In one embodiment, the second sub-conductor is located at the same side end point of a plurality of the first sub-conductors.
[0013] In one embodiment, the conductor pattern further includes an electrical contact of the light-emitting chip, and the conductor pattern is electrically connected to the substrate via a connecting wire, and the connecting wire extends along the first direction.
[0014] A second aspect of the embodiments of the present application provides an electronic device, comprising the light emitting module as described above.
[0015] Compared with the prior art, the embodiments of the present application have the following beneficial effects: when the light-emitting chip emits light, the light-emitting chip will generate a corresponding light spot through the asymmetric lens. The expansion direction of the second divergence angle of the asymmetric lens of the present application is perpendicular to the extension direction of the first sub-conductor, which can reduce the dark lines on the light spot formed by the conductor pattern. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A top view of a light emitting module provided in one embodiment of the present application;
[0017] Figure 2 A side view of a light emitting module provided in one embodiment of the present application;
[0018] Figure 3 A grayscale test diagram of a light emitting module in which a conventional first sub-conductor extends in a second direction;
[0019] Figure 4 A grayscale test diagram of the light-emitting module provided in an embodiment of the present application;
[0020] Figure 5 A top view of a light emitting module provided in another embodiment of the present application;
[0021] Figure 6 A side view of a light emitting module provided in another embodiment of the present application;
[0022] Figure 7A top view of a light emitting module provided in a second embodiment of the present application;
[0023] Figure 8 A schematic diagram of an electronic device provided for the third embodiment of the present application.
[0024] Description of the above drawings: 100, substrate; 110, first board surface; 120, second board surface; 200, light-emitting chip; 210, light-emitting surface; 220, first sub-conductor; 230, second sub-conductor; 240, electrical contact; 250, connecting wire; 300, asymmetric lens; 310, incident surface; 320, emitting surface; 340, mounting portion; 40, power supply; 50, control module; 60, light-emitting module. DETAILED DESCRIPTION
[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.
[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.
[0027] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0029] Figure 1 A top view of a light emitting module provided in the first embodiment of the present application is shown. For the sake of convenience, only the part related to the present embodiment is shown, which is described in detail as follows:
[0030] like Figure 1 , Figure 2 As shown, a light emitting module includes: a substrate 100, a light emitting chip 200 and an asymmetric lens 300.
[0031] The substrate 100 includes a first panel 110 and a second panel 120 located on opposite sides of the substrate 100. The second panel 120 has a plurality of electrical contacts for connecting and fixing the light-emitting module with other devices and circuits. The light-emitting chip 200 is fixed on the first panel 110 of the substrate 100. The light-emitting surface 210 of the light-emitting chip 200 is provided with a conductor pattern. The conductor pattern includes an electrical contact 240 of the light-emitting chip 200 for receiving a driving voltage of the light-emitting chip 200. The conductor pattern includes a plurality of first sub-conductors 220 extending in a first direction. The plurality of first sub-conductors 220 may be metal conductive wirings. The plurality of first sub-conductors 220 are arranged in a second direction. The first direction is perpendicular to the second direction. The plurality of first sub-conductors 220 are spaced equally from each other. The plurality of first sub-conductors 220 are used to evenly distribute the driving voltage on the light-emitting surface 210 of the light-emitting chip 200. The asymmetric lens 300 is located on the first board surface 110 of the substrate 100 and covers the light-emitting chip 200 for packaging the light-emitting chip 200. The light-emitting surface 210 of the light-emitting chip 200 faces the asymmetric lens 300. The asymmetric lens 300 has a first divergence angle in the first direction and the opposite direction and a second divergence angle in the second direction and the opposite direction. The second divergence angle is greater than the first divergence angle.
[0032] It should be noted that the light emitting surface 210 of the light emitting chip 200 can emit corresponding light and generate corresponding light spots through the asymmetric lens 300 when powered on. Figure 3 As shown, a number of first sub-conductors on the surface of the light-emitting chip of the conventional light-emitting module will form relatively large dark lines on the light spot generated by the light-emitting module through the asymmetric lens when the light-emitting chip emits light.
[0033] like Figure 4 As shown, in the design of the light-emitting module of the present embodiment, when the second direction corresponding to the second divergence angle of the asymmetric lens 300 is perpendicular to the first direction in which the first sub-conductor 220 extends, and the second divergence angle is greater than the first divergence angle, the dark pattern imaging caused by the several first sub-conductors 220 of the light-emitting chip 200 is smaller, the interference to the final light-emitting effect is smaller, and the uniformity of the illumination is higher.
[0034] like Figure 1 , Figure 2 As shown, in this embodiment, the asymmetric lens 300 includes an incident surface 310 and an exit surface 320 that are relatively arranged. The exit surface 320 is curved and protrudes toward the side opposite to the substrate 100. The incident surface 310 is located between the light-emitting chip 200 and the exit surface 320 and is in contact with the light-emitting surface 210.
[0035] Specifically, the material of the asymmetric lens 300 can be transparent or silica gel / glass with a certain degree of haze, and the emitting surface 320 of the asymmetric lens 300 can be either a smooth surface or an atomized surface after atomization. This embodiment does not limit the material of the asymmetric lens 300 and the emitting surface 320.
[0036] In this embodiment, the degree of the first divergence angle is the minimum degree of the asymmetric lens 300, and the degree of the second divergence angle is the maximum degree of the asymmetric lens 300. That is, the first divergence angle is the narrow angle of the asymmetric lens 300, and the second divergence angle is the wide angle of the asymmetric lens 300. At this time, the dark pattern caused by the first sub-conductor 220 is the smallest, and the uniformity of the light of the light-emitting module is the highest.
[0037] Specifically, the second divergence angle (wide angle) has a value range of 30 to 160 degrees, and the first divergence angle (narrow angle) has a value range of 20 to 100 degrees. In this embodiment, the second divergence angle may be 45 degrees, and the first divergence angle may be 25 degrees.
[0038] In another embodiment, the second divergence angle may be 150 degrees, and the first divergence angle may be 90 degrees.
[0039] In another embodiment, the emitting surface 320 of the asymmetric lens 300 may be a curved surface, such as an ellipsoidal surface. The cross-sectional profile of the emitting surface 320 is an ellipse, the major axis of the ellipsoidal surface falls in the second direction, and the minor axis of the ellipsoidal surface falls in the first direction.
[0040] like Figure 5 , Figure 6 As shown, in another embodiment, the incident surface 310 may be a curved surface, such as a spherical surface, and the cross-sectional profile of the incident surface 310 is circular. The incident surface 310 is concave toward the exit surface 320 to form a cavity between the asymmetric lens 300 and the substrate 100, and the cavity is used to place the light-emitting chip 200.
[0041] like Figure 1 , Figure 2 As shown, in this embodiment, the asymmetric lens 300 also includes a mounting portion 340, which is disposed between the incident surface 310 and the exit surface 320, and the mounting portion 340 is connected to the first plate surface 110 of the substrate 100, that is, the asymmetric lens 300 can be fixed on the first plate surface 110 through the mounting portion 340.
[0042] Specifically, the mounting portion 340 and the substrate 100 may be bonded together by an adhesive.
[0043] In this embodiment, the light-emitting chip 200 is a light-emitting diode (LED) chip. Further, the light-emitting chip 200 can be an infrared light-emitting chip or a visible light light-emitting chip, and this embodiment does not limit the type of the light-emitting chip 200.
[0044] like Figure 1 , Figure 2 As shown, in this embodiment, the conductor pattern further includes a second sub-conductor 230, which may also be a metal conductive wiring. The second sub-conductor 230 extends in the second direction and connects in series a plurality of first sub-conductors 220. The second sub-conductor 230 electrically connects a plurality of first sub-conductors 220. Since there is usually only one second sub-conductor 230, even if the second sub-conductor 230 extends in the second direction, the dark pattern caused by the second sub-conductor 230 is small.
[0045] like Figure 1 , Figure 2 As shown, in this embodiment, the second sub-conductor 230 is connected in series to the same side endpoints of a plurality of first sub-conductors 220, and the conductor pattern further includes an electrical contact 240, which is electrically connected to the substrate 100 via a connecting conductor 250. The connecting conductor 250 electrically connects the light emitting chip 200 to the substrate 100, and specifically, the electrical contact 240 is disposed at the midpoint of the second sub-conductor 230. The second sub-conductor 230 is located at the same side endpoints of a plurality of first sub-conductors 220, and this design can minimize the area of the light emitting surface 210 of the light emitting chip 200 blocked by the connecting conductor 250.
[0046] like Figure 1 , Figure 2 As shown, in this embodiment, the connecting wire 250 extends in the first direction. Since the opaque connecting wire 250 will also cause dark lines to be formed on the light spot generated by the light emitting module, extending the connecting wire 250 in the first direction can also reduce the size of the dark lines formed by the connecting wire 250.
[0047] Figure 7 A top view of a light emitting module provided in a second embodiment of the present application is shown. For ease of description, only the part related to this embodiment is shown, which is described in detail as follows:
[0048] like Figure 2 , Figure 7 As shown, this embodiment is based on the first embodiment, a light emitting module includes: a substrate 100 , a light emitting chip 200 and an asymmetric lens 300 .
[0049] The substrate 100 includes a first panel 110 and a second panel 120 located on opposite sides of the substrate 100. The second panel 120 is used to connect and fix the light-emitting module with other devices and circuits. The light-emitting chip 200 is fixed on the first panel 110 of the substrate 100. The light-emitting surface 210 of the light-emitting chip 200 is provided with a conductor pattern. The conductor pattern includes a plurality of first sub-conductors 220 extending in a first direction. The plurality of first sub-conductors 220 may be metal conductive wirings. The plurality of first sub-conductors 220 are arranged in a second direction, and the first direction is perpendicular to the second direction. The asymmetric lens 300 is arranged on the first panel 110 of the substrate 100 and covers the light-emitting chip 200, so as to encapsulate the light-emitting chip 200. The light-emitting surface 210 of the light-emitting chip 200 faces the asymmetric lens 300. The asymmetric lens 300 has a first divergence angle in the first direction and the opposite direction thereof and a second divergence angle in the second direction and the opposite direction thereof. The second divergence angle is greater than the first divergence angle.
[0050] like Figure 2 , Figure 7 As shown, in this embodiment, the asymmetric lens 300 includes an incident surface 310 and an exit surface 320 that are relatively arranged. The exit surface 320 is a curved surface, for example, an ellipsoidal surface. The exit surface 320 protrudes toward the side opposite to the substrate 100. The incident surface 310 is located between the light-emitting chip 200 and the exit surface 320 and is in contact with the light-emitting surface 210.
[0051] In this embodiment, the first divergence angle is the minimum degree of the asymmetric lens 300, and the second divergence angle is the maximum degree of the asymmetric lens 300. In other words, the first divergence angle is the narrow angle of the asymmetric lens 300, and the second divergence angle is the wide angle of the asymmetric lens 300.
[0052] like Figure 2 , Figure 7 As shown, in this embodiment, the conductor pattern further includes a second sub-conductor 230 , which extends along the second direction and connects a plurality of first sub-conductors 220 in series. Specifically, the second sub-conductor 230 is connected in the middle of the plurality of first sub-conductors 220 .
[0053] like Figure 2 , Figure 7 As shown, in this embodiment, the connecting wire 250 extends in the first direction. Different from the first embodiment, in this embodiment, two electrical contacts 240 are arranged on the second sub-conductor 230, and the two electrical contacts 240 are electrically connected to the substrate 100 through the corresponding connecting wire 250. The second sub-conductor 230 is arranged in the middle of a plurality of first sub-conductors 220 and two electrical contacts 240 are arranged on the second sub-conductor 230, so that the driving voltage can be more evenly distributed on the light emitting surface 210 of the light emitting chip 200.
[0054] Figure 8 The schematic diagram of the electronic device provided in the third embodiment of the present application is shown. For the convenience of explanation, only the part related to the present embodiment is shown, which is described in detail as follows:
[0055] An electronic device, which may be an infrared camera, comprises a power supply 40, a control module 50 and a light emitting module 60 as in any of the above embodiments.
[0056] The power supply 40 is electrically connected to the control module 50 to supply power to the control module 50 .
[0057] The control module 50 is connected to a plurality of light-emitting modules 60 respectively, and can light up each light-emitting module 60 respectively. The control module 50 can be a control chip, MCU (Microcontroller Unit) or the like.
[0058] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into a processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.
[0059] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0060] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.
Claims
1. A light emitting module, characterized in that: include: A substrate, the substrate comprising a first panel surface located at one side of the substrate; A light-emitting chip, wherein the light-emitting chip is fixed on the first surface of the substrate, and a conductor pattern is provided on the light-emitting surface of the light-emitting chip, wherein the conductor pattern includes a plurality of first sub-conductors extending in a first direction, and the plurality of first sub-conductors are arranged in a second direction, and the first direction is perpendicular to the second direction; An asymmetric lens is located on the first surface of the substrate and covers the light-emitting chip. The light-emitting surface of the light-emitting chip faces the asymmetric lens. The asymmetric lens has a first divergence angle in the first direction and its opposite direction and a second divergence angle in the second direction and its opposite direction. The second divergence angle is greater than the first divergence angle.
2. The light emitting module according to claim 1, characterized in that: The asymmetric lens comprises an incident surface and an exit surface which are arranged opposite to each other. The exit surface is curved and protrudes toward a side opposite to the substrate. The incident surface is located between the light emitting chip and the exit surface and is in contact with the light emitting surface.
3. The light emitting module according to claim 2, characterized in that: The degree of the first divergence angle is the minimum degree of the asymmetric lens, and the degree of the second divergence angle is the maximum degree of the asymmetric lens.
4. The light emitting module according to claim 2 or 3, characterized in that: The asymmetric lens further includes a mounting portion, which is disposed between the incident surface and the emitting surface, and is connected to the first plate surface of the substrate.
5. The light emitting module according to claim 4, characterized in that: The emission surface is an ellipsoidal surface.
6. The light emitting module according to claim 1, characterized in that: The light emitting chip is a light emitting diode chip.
7. The light emitting module according to claim 1, characterized in that: The conductor pattern further includes a second sub-conductor extending along the second direction and connecting a plurality of the first sub-conductors in series.
8. The light emitting module according to claim 7, characterized in that: The second sub-conductor is located at the same side end point of the plurality of first sub-conductors.
9. The light emitting module according to claim 1, characterized in that: The conductor pattern also includes electrical contacts of the light-emitting chip. The conductor pattern is electrically connected to the substrate via connecting wires, and the connecting wires extend along the first direction.
10. An electronic device, characterized in that: The invention comprises a light emitting module as claimed in any one of claims 1 to 9.
Citation Information
Patent Citations
LED device for backlight module
CN201616453U
Lens module
CN208794065U
Semiconductor light-emitting element array and lighting fixture for vehicle
JP2014116392A