A control method and system for preventing condensation of a water-cooling field controller

Abstract

The application discloses a kind of water-cooling field controller condensation prevention control method and system, comprising the following steps: obtaining the temperature and humidity inside field controller, to determine the dew environment T of the environment where the field controller is 结露 , according to the internal temperature of chip, the shell temperature T of the field controller is obtained C , the specification temperature T of the chip is obtained, according to the numerical value of T C With T 结露 Size to control heating treatment;When T C >T 结露 , no heating treatment is implemented;When T C ≤T 结露 , heating is implemented to the inside of the field controller.This application further controls the working temperature of chip on the basis of guaranteeing that the shell temperature is in the safe range, ensures that the field controller runs stably.

Description

Technical Field

[0001] This invention relates to the technical field of intelligent temperature control, and more specifically, to a control method and system for preventing condensation in a water-cooled zone controller. Background Technology

[0002] Domain controllers, due to their high integration and heat density, typically employ water cooling solutions for heat dissipation. Their main structural components include: a water-cooled front cover, a PCBA, and a bottom cover. The front and bottom covers are secured together with screws to form a housing (e.g., ...). Figure 1 (As shown). In harsh, humid and hot environments, the high heat dissipation performance of water cooling keeps the overall casing temperature low. When the casing temperature is below the ambient dew point (i.e., condensation temperature), a water film will form on the casing surface. In particular, the water droplets formed by the condensation of the water film on the inner surface of the casing will fall onto the PCBA, causing short circuits in electronic components and failure of the domain controller hardware. Failure of the domain controller for driver assistance functions may also lead to driving safety accidents.

[0003] The conventional solution to the condensation problem is to adjust the water cooling performance by controlling the water cooling parameters to reduce the overall heat dissipation capacity of the machine, thereby increasing the temperature of the machine's casing.

[0004] Currently, the only adjustable water cooling parameter at the vehicle body level is the water flow rate. Changing the water flow rate to increase the outer casing temperature is not very effective and may even have a lag effect. In addition, reducing the water flow rate to increase the outer casing temperature will reduce the overall heat dissipation performance of the unit, which may cause other components to overheat. Summary of the Invention

[0005] The primary objective of this invention is to address the problems existing in the prior art by providing a control method and system for preventing condensation in a water-cooled zone controller. This method avoids condensation problems on the outer casing by identifying and electrically regulating the temperature, making it more precise and efficient in implementation.

[0006] The technical effects to be achieved by this invention are realized through the following technical solutions:

[0007] A control method for preventing condensation in a water-cooled zone controller includes the following steps:

[0008] S1. Obtain the internal temperature and humidity of the domain controller;

[0009] S2. Combine the temperature and humidity data obtained in S1 with the enthalpy-humidity diagram to determine the condensation environment T of the domain controller's location. 结露 ;

[0010] S3. Obtain the internal temperature of the domain controller's chip, and derive the domain controller's casing temperature T based on the internal temperature of the chip. C ;

[0011] S4. Obtain the specified temperature T of the chip;

[0012] S5, Determine T C With T 结露 Based on the magnitude relationship, the heating treatment is controlled according to the judgment result; when T C >T 结露 When T is present, no heat treatment is performed; when T is present, no heat treatment is performed. C ≤T 结露 At that time, heating is applied to the interior of the domain controller.

[0013] Preferably, in step S1, the domain controller is equipped with a temperature sensor and a humidity sensor to monitor the temperature and humidity of the environment in which the domain controller is located.

[0014] Preferably, in step S2, a processing unit is set up inside the domain controller. The processing unit stores an enthalpy-humidity chart table. The temperature and humidity data obtained in step S1 are imported into the processing unit, and the processing unit determines the temperature and humidity data using the enthalpy-humidity chart table. 结露 .

[0015] Preferably, step S3 specifically includes,

[0016] S3-1. The chip is equipped with a core temperature sensor, which is used to obtain the internal temperature T of the chip. j ;

[0017] S3-2. Based on the heat dissipation experiment, the internal temperature T of the chip is obtained. j With respect to the temperature T of the domain controller housing C The average deviation value N;

[0018] S3-3, According to formula T C =T j -N, to obtain the domain controller housing temperature T C .

[0019] Preferably, in step S4, the chip specification temperature T is obtained from the chip's datasheet.

[0020] Preferably, in step S5, a heating module is provided inside the domain controller, and the heating module is electrically connected to the domain controller. Step S5 is divided into...

[0021] S5-1, When T C >T 结露 When the domain controller does not send control commands, the heating module does not work;

[0022] S5-2, When TC ≤T 结露 At that time, the domain controller sends a control command, and the heating module operates until T... C >T 结露 .

[0023] Preferably, step 5-1 is divided into,

[0024] S5-1-1, When T C >T 结露 And T j When T < T, the heating module is operational;

[0025] S5-1-2, When T C >T 结露 And T j When T is greater than or equal to T, reduce the heating parameters of the heating module until T is reached. j <T only started working again.

[0026] In addition, a second objective of this invention is to provide a control system for preventing condensation in a water-cooled domain controller. The system applies the control method for preventing condensation in the water-cooled domain controller. The domain controller includes a water-cooled housing, within which a PCBA circuit board, a temperature sensor, a humidity sensor, a chip, a heating module, and a processing unit are housed.

[0027] The temperature sensor is used to monitor the temperature of the environment in which the domain controller is located;

[0028] The humidity sensor is used to monitor the humidity of the environment in which the domain controller is located;

[0029] The chip has a built-in core temperature sensor, which is used to monitor the internal temperature Tj of the chip.

[0030] The processing unit is used to calculate the condensation environment T of the environment in which the domain controller is located. 结露 The enclosure temperature T of the domain controller C And determine T 结露 With T C The size relationship is used to control the operation of the heating module.

[0031] Preferably, the heating module includes a structural part and an electrical control part, the structural part being located in the cold zone area inside the water-cooled housing, and the electrical control part being integrated on the PCBA circuit board.

[0032] Preferably, the heating module is in the form of a heating wire or a PTC.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0034] This invention incorporates temperature and humidity sensors, a processing unit, and a heating module within a water-cooled domain controller. It identifies the condensation temperature of the environment by focusing on the controller's casing temperature and the heat-generating chips. The casing temperature is calculated, and the difference between the casing temperature and the condensation temperature is compared. The heating module is then electrically adjusted to prevent condensation. During this process, the internal chip temperature is also checked to ensure it does not exceed specifications, allowing for further adjustment of heating parameters. This not only raises the casing temperature to prevent condensation but also avoids excessively high chip temperatures inside the casing, thus protecting the overall performance of the domain controller.

[0035] Compared with conventional water-cooling heat dissipation control technology, this invention has a more precise application location and higher temperature control efficiency. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of a domain controller in the prior art;

[0038] Figure 2 This is a schematic diagram of the method principle in this embodiment;

[0039] Figure 3 This is the enthalpy-humidity diagram used in this embodiment;

[0040] Figure 4 This is the enthalpy-humidity chart used in this embodiment;

[0041] Figure 5 This is a schematic diagram showing the division of the cold and hot zones in this embodiment;

[0042] In the diagram, 1-Domain controller; 2-Water-cooled front cover; 3-Water-cooled bottom cover; 4-Water-cooled outer shell; 5-PCBA circuit board; 6-Heat dissipation boss; 7-Hot zone; 8-Cold zone. Detailed Implementation

[0043] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding the present invention, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0044] Please see Figure 1 as well as Figure 2First, this embodiment provides a control method for preventing condensation in a water-cooled domain controller. The domain controller 1 includes a water-cooled front cover 2 and a water-cooled bottom cover 3. The water-cooled front cover 2 and the water-cooled bottom cover 3 are snapped together to form a water-cooled outer shell 4. A PCBA circuit board 5 and a chip (not shown in the figure) are placed inside the water-cooled outer shell 4. The method includes the following steps:

[0045] S1. Obtain the internal temperature and humidity of domain controller 1;

[0046] S2. Combine the temperature and humidity data obtained in S1 with the enthalpy-humidity diagram to determine the condensation environment T of the environment in which the domain controller 1 is located. 结露 ;

[0047] S3. Obtain the internal temperature of the chip of the domain controller 1, and determine the casing temperature T of the domain controller 1 based on the internal temperature of the chip. C ;

[0048] S4. Obtain the specified temperature T of the chip;

[0049] S5. Determine the relationship between Tc and T. 结露 Based on the magnitude relationship, the heating treatment is controlled according to the judgment result; when T C >T 结露 When T is present, no heat treatment is performed; when T is present, no heat treatment is performed. C ≤T 结露 At that time, heating is applied to the interior of the domain controller 1.

[0050] Specifically, in step S1, a temperature sensor and a humidity sensor are installed inside the water-cooled housing 4 to monitor the temperature and humidity of the environment in which the domain controller 1 is located.

[0051] In step S2, a processing unit is provided inside the water-cooled outer shell 4. The processing unit stores an enthalpy-humidity chart. The temperature and humidity data obtained in step S1 are imported into the processing unit, and the processing unit determines the temperature and humidity using the enthalpy-humidity chart. 结露 .

[0052] Please refer to 3 and Figure 4 The relationships between various parameters of humid air are represented graphically to create an enthalpy-humidity chart, which is very convenient to use. An enthalpy-humidity chart and its table contain a humid air system with a certain mass of dry air, and may also include variations in vapor content; it has one more degree of freedom in state change than a simple compressible system. Taking an ambient temperature of 65°C as an example, different humidity levels correspond to specific dew temperatures. In this embodiment, the monitored temperature and humidity data of the environment where the domain controller 1 is located are imported into the enthalpy-humidity chart table to obtain the dew temperature T under those environmental conditions. 结露 .

[0053] Step S3 specifically includes:

[0054] S3-1. The chip is equipped with a core temperature sensor, which is used to obtain the internal temperature T of the chip. j ;

[0055] S3-2. Based on the heat dissipation experiment, the internal temperature T of the chip is obtained. j With respect to the enclosure temperature T of the domain controller 1 C The average deviation value N;

[0056] S3-3, According to formula T C =T j -N, to obtain the enclosure temperature T of the domain controller 1. C .

[0057] The principle of the heat dissipation experiment is briefly described here, and the process of obtaining the average deviation value N is explained: First, by monitoring several shell temperatures T... C The average shell temperature was obtained. Then, the internal chip temperature T under the same environment is obtained through the core temperature sensor. j The average deviation value The average deviation value N of the domain controller 1 is thus obtained.

[0058] Taking the internal temperature of the water-cooled casing 4 at around 65°C as an example, the stable data of the heat dissipation experiment are shown in Table 1.

[0059] The water cooling heat dissipation experiment, and the final stable data are shown in the table below.

[0060]

[0061] Table 1

[0062] among,

[0063] Average temperature of the cold zone of the casing

[0064] SOC chip internal temperature T j =81℃,

[0065] Average deviation

[0066] After obtaining the average deviation value N of the domain controller 1 itself, the processing unit calculates according to formula T. C =T j -N, combined with the chip's internal temperature T obtained from actual monitoring. j The corresponding shell temperature T is calculated. C For example, when N = 10℃, if the internal temperature of the SOC chip is 98℃, then the casing temperature T...C =98-N=88℃.

[0067] Thus, through internal calculation and analysis, this embodiment has calculated the condensation temperature T of the domain controller 1 in its environment. 结露 and casing temperature T C .

[0068] In step S5, a heating module (not shown in the figure) is provided inside the domain controller 1. The heating module is electrically connected to the domain controller 1. Step S5 is divided into...

[0069] S5-1, When Tc > T 结露 When the domain controller 1 does not send control commands, the heating module does not work;

[0070] S5-2, When Tc≤T 结露 At that time, the domain controller 1 sends a control command, and the heating module operates until T... C >T 结露 .

[0071] By determining the outer casing temperature T C Is it below the condensation temperature T? 结露 The purpose of this method is to determine whether the heating module is working, thereby avoiding the risk of condensation on the outer shell of the water-cooled controller 1, preventing water film from forming on the surface of the water-cooled outer shell 4, and overcoming the risk of short circuit caused by condensation beads dripping from the shell onto the PCBA circuit board 5.

[0072] Additionally, to address the condensation issue inside the casing, a heat dissipation protrusion 6 is designed between the water-cooled casing 4 and the chip for heat dissipation purposes. The area enclosed by the heat dissipation protrusion 6 is called the hot zone 7, where the heat density and temperature are both high. The area outside the hot zone 7, where most of the heat is conducted through the heat dissipation protrusion 6 and preferentially dissipated through the water flow, has a lower temperature and is called the cold zone 8. The distribution diagram is shown below. Figure 5 As shown. The heating module in this embodiment includes a structural section and an electrical control section. The structural section is located in the cold zone area within the water-cooled housing 4, while the electrical control section is integrated onto the PCBA circuit board 5. Therefore, the housing temperature T... C It actually refers to the temperature of the cold zone of the outer casing.

[0073] In addition, the heat generated by the chip will cause changes in the casing temperature. If the internal temperature of the domain controller 1 is increased solely based on the cold zone temperature of the casing, it will lead to overheating of the chip and cause more serious performance problems.

[0074] In addition, the present invention also monitors the internal temperature of the chip, and ensures that the temperature of the water-cooled casing and the chip are both within a reasonable range, so as to avoid the water-cooled casing from becoming too cold and the chip from becoming too hot.

[0075] Specifically, in step S4, the chip specification temperature T is obtained from the chip's datasheet.

[0076] Step 5-1 is divided into,

[0077] S5-1-1, When T C >T 结露 And T j When T < T, the heating module is operational;

[0078] S5-1-2, When T C >T 结露 And T j When T is greater than or equal to T, reduce the heating parameters of the heating module until T is reached. j <T only started working again.

[0079] In other words, when the temperature of the cold zone of the outer casing is T C Greater than the condensation temperature T 结露 That is, assuming there is no risk of condensation on the outer casing, if the internal temperature T of the chip... j If the temperature drops below the chip's specified value T, the heating module is activated to prevent condensation in the chip area and the resulting water droplets. If the temperature of the cold area of ​​the casing is T... C Greater than the condensation temperature T 结露 And the internal temperature T of the chip j If the temperature has already exceeded the chip's specified value T, gradually reduce the heating power of the heating module until the chip's internal temperature T is reached. j The temperature is only raised again when it falls below the chip's specified value T. This setting, while ensuring the casing temperature remains within a safe range, also further controls the chip's operating temperature, ensuring the stable operation of the domain controller.

[0080] Secondly, this embodiment also provides a control system for preventing condensation in a water-cooled domain controller. The system applies the control method for preventing condensation in the water-cooled domain controller. The domain controller 1 includes a water-cooled housing 4, and the water-cooled housing 4 houses the PCBA circuit board 5, a temperature sensor, a humidity sensor, a chip, a heating module, and a processing unit.

[0081] The temperature sensor is used to monitor the temperature of the environment in which the domain controller is located;

[0082] The humidity sensor is used to monitor the humidity of the environment in which the domain controller is located;

[0083] The chip has a built-in core temperature sensor, which is used to monitor the internal temperature T of the chip. j ;

[0084] The processing unit is used to calculate the condensation environment T of the environment in which the domain controller 1 is located. 结露 The enclosure temperature T of the domain controller C And determine T 结露 With T C The size relationship is used to control the operation of the heating module.

[0085] In this embodiment, the heating module can be selected from, but is not limited to, heating wire, PTC, etc., and the heating module and the cold area of ​​the outer shell can be connected by means of adhesive bonding, screw fixing, etc.

[0086] Compared with conventional water-cooling heat dissipation control technology, this invention can proactively and efficiently solve the condensation problem without affecting the heat dissipation performance of the main components in the domain controller. It has a more precise location of action, higher temperature control efficiency, and effectively prevents the failure of electronic components.

[0087] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and these variations still fall within the protection scope of the present invention.

Claims

1. A control method of preventing condensation of a water-cooling field controller, characterized by, The method comprises the following steps: S1, obtaining the temperature and humidity inside the domain controller; S2, combining the temperature and humidity obtained in S1 with the psychrometric chart to determine the dew environment Tdew of the environment where the domain controller is located; S3, obtaining the internal temperature of the chip of the domain controller, and obtaining the shell temperature TC of the domain controller according to the internal temperature of the chip; S4, obtaining the specification temperature T of the chip; S5, judging the size relationship between TC and Tdew, and controlling the heating treatment according to the judgment result; when TC>Tdew, no heating treatment is implemented; when TC≤Tdew, heating is implemented inside the domain controller; The step S3 specifically comprises, S3-1, the chip is internally provided with a core temperature sensor, and the internal temperature Tj of the chip is obtained by means of the core temperature sensor; S3-2, according to the heat dissipation experiment, the average deviation value N between the internal temperature Tj of the chip and the shell temperature TC of the domain controller is obtained; S3-3, the shell temperature TC of the domain controller is obtained according to the formula TC=Tj-N; In the step S5, the heating module is arranged inside the domain controller, and the heating module is electrically connected with the domain controller, and the step S5 comprises, S5-1, when TC>Tdew, the domain controller does not send a control instruction, and the heating module does not work; S5-2, when TC≤Tdew, the domain controller sends a control instruction, and the heating module works until TC>Tdew; Wherein, the step 5-1 comprises, S5-1-1, when TC>Tdew and Tj In the step S1, the temperature sensor and the humidity sensor are arranged inside the domain controller, and are respectively used for monitoring the temperature and humidity of the environment where the domain controller is located.

2. The control method of claim 1, wherein In the step S2, a processing unit is arranged inside the domain controller, the processing unit stores a psychrometric chart table, the temperature and humidity data obtained in the step S1 are input into the processing unit, and the processing unit determines the Tdew through the psychrometric chart table.

3. The control method of claim 1, wherein In the step S4, the chip specification temperature T is obtained from the specification book of the chip.

4. The control method of claim 1, wherein The system applies the control method for preventing condensation of the water-cooled domain controller, the domain controller comprises a water-cooled shell, and the water-cooled shell is arranged with a PCBA circuit board, a temperature sensor, a humidity sensor, a chip, a heating module and a processing unit, wherein, 5. A control system for preventing condensation of a water-cooled field controller, characterized by, The temperature sensor is used for monitoring the temperature of the environment where the domain controller is located; The humidity sensor is used for monitoring the humidity of the environment where the domain controller is located; The chip is internally provided with a core temperature sensor, and the core temperature sensor is used for monitoring the internal temperature Tj of the chip; The processing unit is used for controlling the work of the heating module, and specifically comprises the following steps: S1, obtaining the temperature and humidity inside the domain controller; ​ S2, combine the temperature and humidity data obtained in S1 with the psychrometric chart to determine the dew environment Tdew of the environment in which the domain controller is located; S3, obtain the internal temperature Tj of the chip of the domain controller, and derive the shell temperature TC of the domain controller according to the internal temperature of the chip; S4, obtain the specification temperature T of the chip; S5, determine the size relationship between TC and Tdew, and control the heating treatment according to the determination result; when TC>Tdew, no heating treatment is implemented; when TC≤Tdew, heating is implemented on the inside of the domain controller; The step S3 specifically comprises, S3-1, obtain the internal temperature Tj of the chip through the core temperature sensor; S3-2, derive the average deviation value N between the internal temperature Tj of the chip and the shell temperature TC of the domain controller according to the heat dissipation experiment; S3-3, derive the shell temperature TC of the domain controller according to the formula TC=Tj-N; In the step S5, the heating module is electrically connected with the domain controller, and the step S5 comprises, S5-1, when TC>Tdew, the domain controller does not send a control instruction, and the heating module does not work; S5-2, when TC≤Tdew, the domain controller sends a control instruction, and the heating module works until TC>Tdew; Wherein, the step 5-1 comprises, S5-1-1, when TC>Tdew and Tj S5-1-2, when TC>Tdew and Tj≥T, the heating parameter of the heating module is reduced until Tj 6. The control system for preventing condensation of a water-cooling field controller according to claim 5, wherein The heating module comprises a block structure part and an electrical control part, the structure part is arranged in the cold region of the water-cooled shell, and the electrical control part is integrated on the PCBA circuit board.

7. The control system for preventing condensation of a water-cooling field controller according to claim 6, wherein The heating module adopts the form of heating wire or PTC.

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