SIMP-based topological design method and system for heat dissipation structure of power devices

Abstract

The present invention provides a method and system for topological design of heat dissipation structure of power device based on SIMP, wherein the method comprises: obtaining the design area of ​​the design object, and meshing the design area; obtaining the design variables and their initial values, design parameters and constraints, and establishing a mathematical model of thermal conductive materials based on SIMP; establishing a unit thermal conductivity matrix and an overall thermal conductivity matrix of the design object based on the above model; establishing a topological design model of the heat dissipation structure based on the above matrix; calculating the sensitivity of the objective function, and analyzing the sensitivity of the design variables; calculating the objective function based on the sensitivity of the objective function and the design variables; and obtaining the optimal topological structure of the design object when the objective function meets the convergence condition. The present application optimizes the topological structure of the heat dissipation structure of the power device based on the SIMP model in the variable density method, avoids the defects of the traditional design method, is less time-consuming, low-cost, has good numerical stability and feasibility, improves the efficiency of product design, and accelerates the product design cycle.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment thermal design, and in particular to a method and system for topological design of a power device heat dissipation structure based on SIMP. Background Art

[0002] Power devices are key components in electronic devices. They generate a lot of heat, and the quality of their thermal design directly affects the reliability of the system.

[0003] With the development of science and technology and the progress of the times, the power density of electronic devices is becoming higher and higher, and the requirements for heat dissipation performance are becoming higher and higher. The design of traditional heat dissipation structures is generally completed through basic knowledge of heat transfer and engineering practice experience. This method is difficult to achieve the design of complex heat dissipation structures. Traditional structural design methods can no longer meet the high-performance requirements of actual engineering for thermal protection structures. The development of topology optimization design technology has brought a new way to the design of thermal protection structures for electronic equipment. At present, the commonly used topology optimization design methods mainly include: homogenization method, variable density method, variable thickness method, progressive structure optimization method, independent continuous mapping method, etc. In the optimization design of heat dissipation structures, most of the research is on two-dimensional structures, and less on three-dimensional structure optimization design. There are also few studies on the application of variable density methods to the topology optimization design of heat dissipation structures. The variable density method is developed from the homogenization method. It uses the density value in the interval [0, 1] as the design variable, artificially assumes that there is a certain correspondence between the design variable (unit density) and the physical properties of the material (such as allowable stress, elastic modulus, etc.), and uses the density function form of continuous variables to explicitly express this correspondence. The essence of the variable density method is to attach the topological design variables to the unit material, which is beneficial to the optimization algorithm based on continuous variables. The classic interpolation models in the variable density method include: Solid Isotropic Microstructures with Penalization (SIMP) and so on.

[0004] Therefore, how to propose a solution for topological optimization design of power device heat dissipation structure based on SIMP has become an urgent problem to be solved. Summary of the invention

[0005] In order to solve the above technical problems, a first aspect of the present invention proposes a SIMP-based power device heat dissipation structure topology design method.

[0006] The second aspect of the present invention further proposes a power device heat dissipation structure topology design system based on SIMP.

[0007] The third aspect of the present invention further proposes a power device heat dissipation structure topology design system based on SIMP.

[0008] A fourth aspect of the present invention also provides a readable storage medium.

[0009] In view of this, the first aspect of the present invention proposes a topological design method for a heat dissipation structure of a power device based on SIMP, comprising: obtaining a design area of ​​a design object to grid the design area; obtaining design variables and their initial values, design parameters and constraints to establish a mathematical model of a thermally conductive material based on SIMP; performing a topological design of a heat dissipation structure of a power device based on the mathematical model of the thermally conductive material, which specifically comprises: establishing a unit thermal conductivity matrix and an overall thermal conductivity matrix of the design object based on the mathematical model of the thermally conductive material; establishing a topological design model of the heat dissipation structure based on the unit thermal conductivity matrix and the overall thermal conductivity matrix; calculating the sensitivity of an objective function to analyze the sensitivity of the design variables; calculating the objective function based on the sensitivity of the objective function and the sensitivity of the design variables; judging whether the objective function meets the convergence conditions; obtaining optimal design variables when the objective function meets the convergence conditions; and obtaining an optimal topological structure of the design object based on the optimal design variables.

[0010] According to the SIMP-based power device heat dissipation structure topology design method provided by the present invention, the design area of ​​the design object is acquired to divide the area to be structurally designed, and then the design area is grid-divided to divide the design area into individual units, so as to design the heat dissipation structure of the power device based on SIMP. Then the design variables are determined, and the initial values ​​of the design variables are obtained. By assigning initial values ​​to the design variables, subsequent optimization calculations are facilitated. At the same time, the design variables and constraints are obtained to provide a data basis for the establishment of a mathematical model of thermal conductive materials. After the mathematical model of thermal conductive materials is established, the unit thermal conductivity matrix of each unit after grid division is established, and the overall thermal conductivity matrix is ​​established to facilitate the establishment of a heat dissipation structure topology design model based thereon. After the heat dissipation decoupling stock topology design model is established, the sensitivity of the objective function is calculated, wherein the objective function is the temperature variance. After obtaining the sensitivity formula of the objective function, the sensitivity of the design variables is analyzed based on the formula, and then the objective function is calculated based on the above sensitivity, and then whether the objective function converges is judged. If it converges, the optimal design variables are obtained, so that the influence of the changes in the design variables and design parameters on the temperature can be judged according to the sensitivity, and then the values ​​of the design parameters and design variables are selected according to the degree of their influence on the temperature, so as to obtain the heat dissipation optimization structure of the power device. This application optimizes the heat dissipation structure topology of power devices based on the SIMP model in the variable density method, and provides a design method with high optimization efficiency and simple program implementation for the heat dissipation structure design of power devices. This method can avoid the defects brought by traditional empirical design methods, consume less time, reduce costs, have good numerical stability and feasibility, improve the efficiency of product design, and speed up the product design cycle.

[0011] In addition, the SIMP-based power device heat dissipation structure topology design method in the above technical solution provided by the present invention may also have the following additional technical features:

[0012] In the above technical solution, the step of obtaining the design area of ​​the design object to mesh the design area specifically includes: obtaining the design area of ​​the design object; obtaining unit properties, the size and number of boundary units; meshing the design area to divide the design area into individual units; wherein the unit properties include the type of unit, the real constant of the unit, the material properties of the unit, and the coordinates of the unit when it is formed.

[0013] In this technical solution, after obtaining the design area of ​​the design object, the properties of the cells to be meshed are obtained. Specifically, the type of cell, the real constants of the cell, the material properties of the cell, and the coordinates at which the cell is formed are obtained, and then the size and number of the boundary cells are obtained. After obtaining the above data, meshing of the design area is started to facilitate topological optimization of the heat dissipation structure of the power device based on the SIMP model.

[0014] In the above technical solution, after obtaining the design area of ​​the design object to mesh the design area, it also includes: calculating the unit stiffness matrix when the relative density values ​​of all units are set to 1, so as to establish a mathematical model of thermal conductive materials based on SIMP.

[0015] In this technical solution, after meshing the design area, the element stiffness matrix of all elements is calculated, and the relative density values ​​of all elements are set to 1, so as to establish a mathematical model of thermal conductive materials based on SIMP. Among them, the element stiffness matrix (element stiffness matrix) is an important coefficient matrix calculated by the finite element method in computational solid mechanics. In the mechanical analysis of a finite element body, it characterizes the relationship between the force and deformation of the unit body. The finite element method is a commonly used method in computational solid mechanics, and its basic idea is to decouple the research object into several units and analyze them separately. Among them, when calculating the mechanical properties of the unit body, the element stiffness matrix (element stiffness matrix) links the force and deformation, and is a very important coefficient matrix.

[0016] In any of the above technical solutions, before calculating the sensitivity of the objective function to analyze the sensitivity of the design variables, it also includes: taking the temperature variance as the objective function to establish a heat dissipation structure topology design model with uniform temperature distribution.

[0017] In this technical solution, the temperature variance is used as the objective function to establish a topological design model of the heat dissipation structure with uniform temperature distribution, so as to obtain the optimal design variables and parameters according to the degree of influence of changes in design variables and design parameters on the temperature.

[0018] In the above technical solution, the steps of calculating the sensitivity of the objective function to analyze the sensitivity of the design variables specifically include: obtaining the temperature field distribution of the design area based on the unit thermal conductivity matrix and the overall thermal conductivity matrix; calculating the sensitivity of the objective function based on the temperature field distribution; analyzing the sensitivity of the design variables based on the sensitivity of the objective function, so as to judge the degree of influence of the change of the design variables on the temperature field according to the sensitivity of the design variables.

[0019] In this technical solution, the temperature field distribution of the design area is analyzed through the unit thermal conductivity matrix and the overall thermal conductivity matrix, and then the sensitivity of the objective function is calculated in combination with the temperature field distribution. Then, the sensitivity of the design variables is analyzed based on the sensitivity of the objective function, so as to analyze the degree of influence of the changes in the design variables and related parameters on the temperature according to the sensitivity of the design variables, so as to determine the optimal design variables and design parameters according to the degree of influence, and then determine the optimal heat dissipation topology.

[0020] In any of the above technical solutions, the step of calculating the objective function based on the sensitivity of the objective function and the sensitivity of the design variables specifically includes: calculating and updating the design variables using a preset algorithm based on the sensitivity of the objective function and the sensitivity of the design variables; and calculating the objective function based on the updated design variables.

[0021] In this technical solution, the design variables are calculated and updated based on the objective function and the sensitivity of the design variables through a preset algorithm, and the objective function is calculated based on the calculated design variables to facilitate judgment on whether the objective function converges. When the objective function meets the convergence conditions, the optimal design variables are obtained.

[0022] In any of the above technical solutions, the SIMP-based power device heat dissipation structure topology design method also includes: when the objective function does not meet the convergence conditions, re-designing the power device heat dissipation structure topology based on the mathematical model of the thermal conductive material based on the updated design variables.

[0023] In this technical solution, when the objective function does not meet the convergence conditions, the topological design of the heat dissipation structure of the power device will be re-performed based on the optimized updated design variables, and the steps of performing the topological design of the heat dissipation structure of the power device based on the mathematical model of the thermal conductive material will be repeated until the objective function meets the convergence conditions to obtain the heat sink topological optimization structure, thereby completing the topological optimization design of the heat dissipation structure of the power device.

[0024] The second aspect of the present invention provides a power device heat dissipation structure topology design system based on SIMP, including: an acquisition module, used to acquire a design area of ​​a design object to grid the design area, acquire design variables and their initial values, design parameters and constraints, and establish a thermal conductive material mathematical model based on SIMP; a design module, used to perform a power device heat dissipation structure topology design based on the thermal conductive material mathematical model, which specifically includes: establishing a unit thermal conductivity matrix and an overall thermal conductivity matrix of the design object based on the thermal conductive material mathematical model, establishing a heat dissipation structure topology design model based on the unit thermal conductivity matrix and the overall thermal conductivity matrix, calculating the sensitivity of an objective function to analyze the sensitivity of the design variables, calculating the objective function based on the sensitivity of the objective function and the sensitivity of the design variables, judging whether the objective function meets the convergence conditions, obtaining the optimal design variables when the objective function meets the convergence conditions, and obtaining the optimal topology structure of the design object based on the optimal design variables.

[0025] The power device heat dissipation structure topology design system based on SIMP provided by the technical solution of the present invention includes: an acquisition module and a design module. Specifically, the acquisition module is used to acquire the design area of ​​the design object to mesh the design area, acquire the design variables and their initial values, design parameters and constraints, and establish a mathematical model of thermal conductive materials based on SIMP; the design module is used to perform the topology design of the power device heat dissipation structure based on the mathematical model of thermal conductive materials, which specifically includes: establishing a unit thermal conductivity matrix and an overall thermal conductivity matrix of the design object based on the mathematical model of thermal conductive materials, establishing a heat dissipation structure topology design model based on the unit thermal conductivity matrix and the overall thermal conductivity matrix, calculating the sensitivity of the objective function to analyze the sensitivity of the design variables, calculating the objective function based on the sensitivity of the objective function and the sensitivity of the design variables, judging whether the objective function meets the convergence conditions, and obtaining the optimal design variables when the objective function meets the convergence conditions, and obtaining the optimal topology structure of the design object based on the optimal design variables. At the same time, the power device heat dissipation structure topology design system based on SIMP provided according to the technical solution of the present invention is used to implement the steps of the power device heat dissipation structure topology design method based on SIMP provided in the first aspect of the present invention. Therefore, the power device heat dissipation structure topology design system based on SIMP has all the technical effects of the power device heat dissipation structure topology design method based on SIMP, which will not be repeated here.

[0026] In any of the above technical solutions, the acquisition module is specifically used to: obtain the design area of ​​the design object; obtain unit properties, the size and number of boundary units; grid the design area to divide the design area into individual units; wherein the unit properties include the type of unit, the real constants of the unit, the material properties of the unit, and the coordinates of the unit when it is formed.

[0027] In this technical solution, after obtaining the design area of ​​the design object, the properties of the cells to be meshed are obtained. Specifically, the type of cell, the real constants of the cell, the material properties of the cell, and the coordinates at which the cell is formed are obtained, and then the size and number of the boundary cells are obtained. After obtaining the above data, meshing of the design area is started to facilitate topological optimization of the heat dissipation structure of the power device based on the SIMP model.

[0028] In any of the above technical solutions, the design module is also used to calculate the unit stiffness matrix when the relative density values ​​of all units are set to 1, so as to establish a mathematical model of the thermal conductive material based on SIMP.

[0029] In this technical solution, after meshing the design area, the element stiffness matrix of all elements is calculated, and the relative density values ​​of all elements are set to 1, so as to establish a mathematical model of thermal conductive materials based on SIMP. Among them, the element stiffness matrix (element stiffness matrix) is an important coefficient matrix calculated by the finite element method in computational solid mechanics. In the mechanical analysis of a finite element body, it characterizes the relationship between the force and deformation of the unit body. The finite element method is a commonly used method in computational solid mechanics, and its basic idea is to decouple the research object into several units and analyze them separately. Among them, when calculating the mechanical properties of the unit body, the element stiffness matrix (element stiffness matrix) links the force and deformation, and is a very important coefficient matrix.

[0030] In any of the above technical solutions, the design module is also used to: use the temperature variance as an objective function to establish a heat dissipation structure topology design model with uniform temperature distribution.

[0031] In this technical solution, the temperature variance is used as the objective function to establish a topological design model of the heat dissipation structure with uniform temperature distribution, so as to obtain the optimal design variables and parameters according to the degree of influence of changes in design variables and design parameters on the temperature.

[0032] In any of the above technical solutions, the design module is specifically used to: obtain the temperature field distribution of the design area based on the unit thermal conductivity matrix and the overall thermal conductivity matrix; calculate the sensitivity of the objective function based on the temperature field distribution; analyze the sensitivity of the design variables based on the sensitivity of the objective function, so as to judge the degree of influence of the change of the design variables on the temperature field according to the sensitivity of the design variables.

[0033] In this technical solution, the temperature field distribution of the design area is analyzed through the unit thermal conductivity matrix and the overall thermal conductivity matrix, and then the sensitivity of the objective function is calculated in combination with the temperature field distribution. Then, the sensitivity of the design variables is analyzed based on the sensitivity of the objective function, so as to analyze the degree of influence of the changes in the design variables and related parameters on the temperature according to the sensitivity of the design variables, so as to determine the optimal design variables and design parameters according to the degree of influence, and then determine the optimal heat dissipation topology.

[0034] In any of the above technical solutions, the design module is specifically used to: calculate and update the design variables using a preset algorithm based on the sensitivity of the objective function and the sensitivity of the design variables; and calculate the objective function based on the updated design variables.

[0035] In this technical solution, the design variables are calculated and updated based on the objective function and the sensitivity of the design variables through a preset algorithm, and the objective function is calculated based on the calculated design variables to facilitate judgment on whether the objective function converges. When the objective function meets the convergence conditions, the optimal design variables are obtained.

[0036] In any of the above technical solutions, the design module is also used to: when the objective function does not meet the convergence conditions, re-design the power device heat dissipation structure topology based on the mathematical model of the thermal conductive material based on the updated design variables.

[0037] In this technical solution, when the objective function does not meet the convergence conditions, the topological design of the heat dissipation structure of the power device will be re-performed based on the optimized updated design variables, and the steps of performing the topological design of the heat dissipation structure of the power device based on the mathematical model of the thermal conductive material will be repeated until the objective function meets the convergence conditions to obtain the heat sink topological optimization structure, thereby completing the topological optimization design of the heat dissipation structure of the power device.

[0038] The third aspect of the present invention provides a SIMP-based power device heat dissipation structure topology design system, comprising: a memory, a processor, and a program stored in the memory and executable on the processor, wherein when the program is executed by the processor, the steps specified in the SIMP-based power device heat dissipation structure topology design method of any of the above-mentioned technical solutions are implemented.

[0039] The power device heat dissipation structure topology design system based on SIMP provided by the technical solution of the present invention includes a memory and a processor and a program stored in the memory and executable on the processor, and when the program is executed by the processor, the steps defined by any of the above-mentioned power device heat dissipation structure topology design methods based on SIMP are implemented. At the same time, since the power device heat dissipation structure topology design system based on SIMP of the present application can implement the steps defined by any of the above-mentioned power device heat dissipation structure topology design methods based on SIMP, the power device heat dissipation structure topology design system based on SIMP provided by the technical solution has all the beneficial effects of the power device heat dissipation structure topology design method based on SIMP provided in any of the above-mentioned technical solutions.

[0040] The fourth aspect of the present invention provides a readable storage medium having programs and / or instructions stored thereon, which, when executed by a processor, implement the steps of the SIMP-based power device heat dissipation structure topology design method in any of the above technical solutions.

[0041] The readable storage medium provided by the technical solution of the present invention can implement the steps of the SIMP-based power device heat dissipation structure topology design method in any of the above-mentioned technical solutions when the program and / or instructions stored thereon are executed by the processor. Therefore, it has all the beneficial technical effects of the above-mentioned SIMP-based power device heat dissipation structure topology design method, which will not be repeated here.

[0042] Additional aspects and advantages of the present invention will become apparent from the following description or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0044] Figure 1 It is a flow chart of a method for designing a topology of a power device heat dissipation structure based on SIMP according to an embodiment of the present invention;

[0045] Figure 2 is a block diagram of a power device heat dissipation structure topology design system based on SIMP according to an embodiment of the present invention;

[0046] Figure 3 is a block diagram of a power device heat dissipation structure topology design system based on SIMP according to an embodiment of the present invention;

[0047] Figure 4 It is a flow chart of a method for topological design of a power device heat dissipation structure based on SIMP according to another embodiment of the present invention.

[0048] in, Figure 2 and Figure 3 The corresponding relationship between the reference numerals and the component names is as follows:

[0049] 200 is a power device heat dissipation structure topology design system based on SIMP, 202 is an acquisition module, 204 is a design module, 300 is a power device heat dissipation structure topology design system based on SIMP, 302 is a memory, and 304 is a processor. DETAILED DESCRIPTION

[0050] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0051] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0052] Refer to the following Figures 1 to 4 The present invention describes a method and system for topological design of a power device heat dissipation structure based on SIMP in some embodiments of the present invention.

[0053] In view of this, the first embodiment of the present invention proposes a method for designing a topology of a power device heat dissipation structure based on SIMP, such as Figure 1 As shown, including:

[0054] S102, obtaining a design area of ​​the design object to divide the design area into grids;

[0055] S104, obtaining design variables and their initial values, design parameters and constraints, so as to establish a mathematical model of thermal conductive materials based on SIMP;

[0056] S106, performing topological design of heat dissipation structure of power device based on mathematical model of thermal conductive material.

[0057] Specifically include:

[0058] S1061, establish the unit thermal conductivity matrix and the overall thermal conductivity matrix of the design object based on the mathematical model of thermal conductive materials;

[0059] S1062, establishing a heat dissipation structure topology design model based on the unit thermal conductivity matrix and the overall thermal conductivity matrix;

[0060] S1063, calculating the sensitivity of the objective function to analyze the sensitivity of the design variables;

[0061] S1064, calculating the objective function based on the sensitivity of the objective function and the sensitivity of the design variables;

[0062] S1065, judging whether the objective function meets the convergence condition;

[0063] S1066, when the objective function meets the convergence condition, the optimal design variables are obtained;

[0064] S1067, obtaining an optimal topological structure of the design object based on the optimal design variables.

[0065] According to the SIMP-based power device heat dissipation structure topology design method provided in this embodiment, the design area of ​​the design object is acquired to divide the area to be structurally designed, and then the design area is grid-divided to divide the design area into individual units, so as to design the heat dissipation structure of the power device based on SIMP. Then the design variables are determined, and the initial values ​​of the design variables are obtained. By assigning initial values ​​to the design variables, subsequent optimization calculations are facilitated. At the same time, the design variables and constraints are obtained to provide a data basis for the establishment of a mathematical model of thermal conductive materials. After the mathematical model of thermal conductive materials is established, the unit thermal conductivity matrix of each unit after grid division is established, and the overall thermal conductivity matrix is ​​established to facilitate the establishment of a heat dissipation structure topology design model based thereon. After the heat dissipation decoupling stock topology design model is established, the sensitivity of the objective function is calculated, wherein the objective function is the temperature variance. After obtaining the sensitivity formula of the objective function, the sensitivity of the design variables is analyzed based on the formula, and then the objective function is calculated based on the above sensitivity, and then whether the objective function converges is judged. If it converges, the optimal design variables are obtained, so that the influence of the changes in the design variables and design parameters on the temperature can be judged according to the sensitivity, and then the values ​​of the design parameters and design variables are selected according to the degree of their influence on the temperature, so as to obtain the heat dissipation optimization structure of the power device. This application optimizes the heat dissipation structure topology of power devices based on the SIMP model in the variable density method, and provides a design method with high optimization efficiency and simple program implementation for the heat dissipation structure design of power devices. This method can avoid the defects brought by traditional empirical design methods, consume less time, reduce costs, have good numerical stability and feasibility, improve the efficiency of product design, and speed up the product design cycle.

[0066] In the above embodiment, the step of obtaining the design area of ​​the design object to mesh the design area specifically includes: obtaining the design area of ​​the design object; obtaining cell properties, the size and number of boundary cells; meshing the design area to divide the design area into individual cells; wherein the cell properties include the type of cell, the real constant of the cell, the material properties of the cell, and the coordinates at which the cell is formed.

[0067] In this embodiment, after obtaining the design area of ​​the design object, the properties of the cells to be meshed are obtained. Specifically, the type of cell, the real constants of the cell, the material properties of the cell, and the coordinates at which the cell is formed are obtained, and then the size and number of the boundary cells are obtained. After obtaining the above data, meshing of the design area is started to facilitate topological optimization of the heat dissipation structure of the power device based on the SIMP model.

[0068] In the above embodiment, after obtaining the design area of ​​the design object to mesh the design area, the method further includes: calculating the unit stiffness matrix when the relative density values ​​of all units are set to 1, so as to establish a mathematical model of thermal conductive material based on SIMP.

[0069] In this embodiment, after meshing the design area, the element stiffness matrix of all elements is calculated, and the relative density values ​​of all elements are set to 1, so as to establish a mathematical model of thermal conductive materials based on SIMP. Among them, the element stiffness matrix (element stiffness matrix) is an important coefficient matrix calculated by the finite element method in computational solid mechanics. In the mechanical analysis of a finite element body, the force and deformation relationship of the unit body is characterized. The finite element method is a commonly used method in computational solid mechanics, and its basic idea is to decouple the research object into several units and analyze them separately. Among them, when calculating the mechanical properties of the unit body, the element stiffness matrix (element stiffness matrix) links force and deformation, and is a very important coefficient matrix.

[0070] In any of the above embodiments, before calculating the sensitivity of the objective function to analyze the sensitivity of the design variables, the method further includes: taking the temperature variance as the objective function to establish a heat dissipation structure topology design model with uniform temperature distribution.

[0071] In this embodiment, the temperature variance is used as the objective function to establish a heat dissipation structure topology design model with uniform temperature distribution, thereby facilitating obtaining the optimal design variables and parameters according to the degree of influence of changes in design variables and design parameters on the temperature.

[0072] In the above embodiment, the steps of calculating the sensitivity of the objective function to analyze the sensitivity of the design variables specifically include: obtaining the temperature field distribution of the design area based on the unit thermal conductivity matrix and the overall thermal conductivity matrix; calculating the sensitivity of the objective function based on the temperature field distribution; analyzing the sensitivity of the design variables based on the sensitivity of the objective function, so as to judge the degree of influence of the change of the design variables on the temperature field according to the sensitivity of the design variables.

[0073] In this embodiment, the temperature field distribution of the design area is analyzed through the unit thermal conductivity matrix and the overall thermal conductivity matrix, and then the sensitivity of the objective function is calculated in combination with the temperature field distribution. Then, the sensitivity of the design variables is analyzed based on the sensitivity of the objective function, so as to analyze the degree of influence of changes in design variables and related parameters on the temperature according to the sensitivity of the design variables, so as to determine the optimal design variables and design parameters according to the degree of influence, and then determine the optimal heat dissipation topology.

[0074] In any of the above embodiments, the step of calculating the objective function based on the sensitivity of the objective function and the sensitivity of the design variables specifically includes: calculating and updating the design variables using a preset algorithm based on the sensitivity of the objective function and the sensitivity of the design variables; and calculating the objective function based on the updated design variables.

[0075] In this embodiment, the design variables are calculated and updated based on the objective function and the sensitivity of the design variables through a preset algorithm, and the objective function is calculated based on the calculated design variables to facilitate judgment on whether the objective function converges. When the objective function meets the convergence conditions, the optimal design variables are obtained.

[0076] In any of the above embodiments, the SIMP-based power device heat dissipation structure topology design method further includes: when the objective function does not meet the convergence condition, re-designing the power device heat dissipation structure topology based on the thermal conductive material mathematical model based on the updated design variables.

[0077] In this embodiment, when the objective function does not meet the convergence conditions, the topological design of the heat dissipation structure of the power device will be re-performed based on the optimized updated design variables, and the steps of performing the topological design of the heat dissipation structure of the power device based on the mathematical model of the thermal conductive material will be repeated until the objective function meets the convergence conditions to obtain the heat sink topology optimization structure, thereby completing the topological optimization design of the heat dissipation structure of the power device.

[0078] The second aspect of the present invention provides a power device heat dissipation structure topology design system 200 based on SIMP, such as Figure 2As shown, it includes: an acquisition module 202, which is used to acquire a design area of ​​a design object to grid the design area, acquire design variables and their initial values, design parameters and constraints, and establish a mathematical model of thermal conductive materials based on SIMP; a design module 204, which is used to perform a topological design of a heat dissipation structure of a power device based on the mathematical model of thermal conductive materials, which specifically includes: establishing a unit thermal conductivity matrix and an overall thermal conductivity matrix of the design object based on the mathematical model of thermal conductive materials, establishing a topological design model of the heat dissipation structure based on the unit thermal conductivity matrix and the overall thermal conductivity matrix, calculating the sensitivity of the objective function to analyze the sensitivity of the design variables, calculating the objective function based on the sensitivity of the objective function and the sensitivity of the design variables, judging whether the objective function meets the convergence conditions, and obtaining the optimal design variables when the objective function meets the convergence conditions, and obtaining the optimal topological structure of the design object based on the optimal design variables.

[0079] The power device heat dissipation structure topology design system based on SIMP provided in an embodiment of the present invention includes: an acquisition module 202 and a design module 204. Specifically, the acquisition module 202 is used to acquire the design area of ​​the design object to mesh the design area, acquire the design variables and their initial values, design parameters and constraints, and establish a thermal conductive material mathematical model based on SIMP; the design module 204 is used to perform the topology design of the power device heat dissipation structure based on the thermal conductive material mathematical model, which specifically includes: establishing a unit thermal conductivity matrix and an overall thermal conductivity matrix of the design object based on the thermal conductive material mathematical model, establishing a heat dissipation structure topology design model based on the unit thermal conductivity matrix and the overall thermal conductivity matrix, calculating the sensitivity of the objective function to analyze the sensitivity of the design variables, calculating the objective function based on the sensitivity of the objective function and the sensitivity of the design variables, judging whether the objective function meets the convergence condition, obtaining the optimal design variable when the objective function meets the convergence condition, and obtaining the optimal topology structure of the design object based on the optimal design variable. At the same time, the power device heat dissipation structure topology design system based on SIMP provided according to an embodiment of the present invention is used to implement the steps of the power device heat dissipation structure topology design method based on SIMP provided in the first aspect of the present invention. Therefore, the power device heat dissipation structure topology design system based on SIMP has all the technical effects of the power device heat dissipation structure topology design method based on SIMP, which will not be repeated here.

[0080] In any of the above embodiments, the acquisition module is specifically used to: acquire the design area of ​​the design object; acquire unit properties, the size and number of boundary units; grid the design area to divide the design area into individual units; wherein the unit properties include the type of unit, the real constant of the unit, the material properties of the unit, and the coordinates at which the unit is formed.

[0081] In this embodiment, after obtaining the design area of ​​the design object, the properties of the cells to be meshed are obtained. Specifically, the type of cell, the real constants of the cell, the material properties of the cell, and the coordinates at which the cell is formed are obtained, and then the size and number of the boundary cells are obtained. After obtaining the above data, meshing of the design area is started to facilitate topological optimization of the heat dissipation structure of the power device based on the SIMP model.

[0082] In any of the above embodiments, the design module is further used to: calculate the unit stiffness matrix when the relative density values ​​of all units are set to 1, so as to establish a mathematical model of the thermal conductive material based on SIMP.

[0083] In this embodiment, after meshing the design area, the element stiffness matrix of all elements is calculated, and the relative density values ​​of all elements are set to 1, so as to establish a mathematical model of thermal conductive materials based on SIMP. Among them, the element stiffness matrix (element stiffness matrix) is an important coefficient matrix calculated by the finite element method in computational solid mechanics. In the mechanical analysis of a finite element body, the force and deformation relationship of the unit body is characterized. The finite element method is a commonly used method in computational solid mechanics, and its basic idea is to decouple the research object into several units and analyze them separately. Among them, when calculating the mechanical properties of the unit body, the element stiffness matrix (element stiffness matrix) links force and deformation, and is a very important coefficient matrix.

[0084] In any of the above embodiments, the design module is further used to: use the temperature variance as an objective function to establish a heat dissipation structure topology design model with uniform temperature distribution.

[0085] In this embodiment, the temperature variance is used as the objective function to establish a heat dissipation structure topology design model with uniform temperature distribution, thereby facilitating obtaining the optimal design variables and parameters according to the degree of influence of changes in design variables and design parameters on the temperature.

[0086] In any of the above embodiments, the design module is specifically used to: obtain the temperature field distribution of the design area based on the unit thermal conductivity matrix and the overall thermal conductivity matrix; calculate the sensitivity of the objective function based on the temperature field distribution; analyze the sensitivity of the design variables based on the sensitivity of the objective function, so as to judge the degree of influence of the change of the design variables on the temperature field according to the sensitivity of the design variables.

[0087] In this embodiment, the temperature field distribution of the design area is analyzed through the unit thermal conductivity matrix and the overall thermal conductivity matrix, and then the sensitivity of the objective function is calculated in combination with the temperature field distribution. Then, the sensitivity of the design variables is analyzed based on the sensitivity of the objective function, so as to analyze the degree of influence of changes in design variables and related parameters on the temperature according to the sensitivity of the design variables, so as to determine the optimal design variables and design parameters according to the degree of influence, and then determine the optimal heat dissipation topology.

[0088] In any of the above embodiments, the design module is further specifically used to: calculate and update the design variables using a preset algorithm based on the sensitivity of the objective function and the sensitivity of the design variables; and calculate the objective function based on the updated design variables.

[0089] In this embodiment, the design variables are calculated and updated based on the objective function and the sensitivity of the design variables through a preset algorithm, and the objective function is calculated based on the calculated design variables to facilitate judgment on whether the objective function converges. When the objective function meets the convergence conditions, the optimal design variables are obtained.

[0090] In any of the above embodiments, the design module is further used to: when the objective function does not meet the convergence condition, re-design the power device heat dissipation structure topology based on the thermal conductive material mathematical model based on the updated design variables.

[0091] In this embodiment, when the objective function does not meet the convergence conditions, the topological design of the heat dissipation structure of the power device will be re-performed based on the optimized updated design variables, and the steps of performing the topological design of the heat dissipation structure of the power device based on the mathematical model of the thermal conductive material will be repeated until the objective function meets the convergence conditions to obtain the heat sink topology optimization structure, thereby completing the topological optimization design of the heat dissipation structure of the power device.

[0092] The third aspect of the present invention provides a power device heat dissipation structure topology design system 300 based on SIMP, such as Figure 3 As shown, it includes: a memory 302, a processor 304, and a program stored in the memory 302 and executable on the processor 304. When the program is executed by the processor 304, the steps defined in the SIMP-based power device heat dissipation structure topology design method of any of the above embodiments are implemented.

[0093] According to an embodiment of the present invention, a power device heat dissipation structure topology design system based on SIMP is provided, including a memory and a processor and a program stored in the memory and executable on the processor, and when the program is executed by the processor, the steps defined by any of the above-mentioned power device heat dissipation structure topology design methods based on SIMP are implemented. At the same time, since the power device heat dissipation structure topology design system based on SIMP of the present application can implement the steps defined by any of the above-mentioned power device heat dissipation structure topology design methods based on SIMP, the power device heat dissipation structure topology design system based on SIMP provided in this embodiment has all the beneficial effects of the power device heat dissipation structure topology design method based on SIMP provided in any of the above-mentioned embodiments.

[0094] The fourth aspect of the present invention provides a readable storage medium having programs and / or instructions stored thereon, which, when executed by a processor, implement the steps of the SIMP-based power device heat dissipation structure topology design method in any of the above-mentioned embodiments.

[0095] The readable storage medium provided according to an embodiment of the present invention can implement the steps of the SIMP-based power device heat dissipation structure topology design method in any of the above-mentioned embodiments when the program and / or instructions stored thereon are executed by a processor. Therefore, it has all the beneficial technical effects of the above-mentioned SIMP-based power device heat dissipation structure topology design method, which will not be repeated here.

[0096] The following is a further introduction to the SIMP-based power device heat dissipation structure topology design method provided by the present application in conjunction with a specific embodiment.

[0097] This embodiment provides a method for topological design of heat dissipation structure of power device based on SIMP, the purpose of which is to propose a method for topological optimization design of heat dissipation structure based on SIMP for heat dissipation problem of power device, specifically, to optimize the topological design of heat dissipation structure of power device by using SIMP, and to propose a method for topological optimization design of heat dissipation structure of power device, by taking target variance as objective function, establishing mathematical model of topological optimization of heat dissipation structure, and obtaining optimal topological design structure of power device. This method can avoid the defects of traditional empirical design method, consume less time, and lower cost, and the topological optimization design of heat dissipation structure using SIMP method has good numerical stability and feasibility. Figure 4 As shown, it mainly includes the following steps:

[0098] S402, define the design area, non-design area, constraints, loads, etc.

[0099] Specifically, according to the actual heat dissipation design requirements, a three-dimensional design domain is defined. In order to facilitate the calculation of the design domain, a rectangular area (two-dimensional) or a cube (three-dimensional) is selected. The scale of the entire design domain can be adjusted by changing the number of units and the unit scale. The design domain is initially set to a three-dimensional rectangular parallelepiped size of 300mm×100mm×80mm. The relative density of units in the design area can change with the iteration process, while the relative unit density in the non-design area can only be a fixed value of 0 or 1, where 0 represents a blank area (no solid elastic material) and 1 represents a solid area (filled with solid elastic material).

[0100] S404, meshing the design area, and calculating the element stiffness matrix when the relative density values ​​of all elements are set to 1.

[0101] Specifically, the design area is meshed, and the unit stiffness matrix is ​​calculated when the relative density value of all units is set to 1. When meshing, it is necessary to first set the unit properties, including the unit type, the unit real constant, the unit material properties and the coordinate system in which the unit is formed. Then set the mesh control, define the size and number of the object boundary units, and finally perform meshing.

[0102] S406, selecting initial values ​​of design variables and optimization parameters, presetting the relative density value of each unit in the design area, and giving constraint conditions.

[0103] Specifically, the fin density ρ and the direction angle θ are selected as design variables, and the initial values ​​are set. The fin length L, fin width W, number of fins N and fin spacing K are the optimization parameters, that is, the design parameters. In order to reduce the number of iterations and avoid local optimality, an intermediate value is selected as the initial value of the density x, and 0 is selected as the initial value of the direction angle θ. Define the boundary conditions according to the specific practical problems to be solved. The fin material is selected as aluminum alloy, with a thermal conductivity of 228.6W / (m·k) and a material density of 2.73×10 3 Kg / m 3 , the convection mode is set to natural convection, and the convection heat transfer coefficient is set to 10W / (m 2 ·k).

[0104] S408, establishing a mathematical model of thermal conductive material according to the SIMP method.

[0105] Specifically, a mathematical model of thermal conductive materials is established based on the SIMP method, and the functional relationship between the thermal conductivity and density of the material is: λ(x)=ρ(x) p λ0, after the angle variable is introduced, the functional relationship between thermal conductivity and density becomes: λ(x,θ)=ρ(x) pλ0(θ). According to the idea of ​​variable density, the structure is discretized into finite elements. The commonly used interpolation model in the variable density method is mainly the density penalty model. The material properties inside the discrete element are defined as constants, and the design variables are defined as the relative density of the discrete element. The fin unit thermal conductivity matrix and the overall thermal conductivity matrix model are established:

[0106] k e (x e ,θ)=x e p k p (θ)

[0107] where x e is the y material pseudo-density of any unit in the structure, k e (x e , θ) is the corresponding thermal conductivity, and p is the penalty factor. It imposes a limited penalty on the intermediate density unit to minimize the number of intermediate density units and make the structural unit density as close to 0 or 1 as possible. This function indicates that there is only one thermal conductivity k in the region. p of materials, and the rest are empty materials.

[0108] S410, establishing a unit thermal conductivity matrix and an overall thermal conductivity matrix of a power device heat dissipation structure, taking uniform temperature distribution in a design domain as a goal, taking temperature variance as an objective function, and establishing a heat dissipation structure topology optimization model.

[0109] Specifically, the design domain is divided into a finite element grid with N units, and the discrete mathematical model is:

[0110] find X={x1,x2,...,x n}∈R n

[0111] min C(x,θ)

[0112]

[0113] stKT=Q

[0114]

[0115] x min ≤x e ≤1, 1≤e≤N

[0116] In the formula, X represents the pseudo-unit density, k e (θ e ) means according to θ e The thermal conductivity matrix of the e-th unit after rotation, N is the number of units in the design domain; T is the node temperature array; t eis the temperature of the e-th unit, K is the heat conduction matrix; Q is the node heat load array; V e is the volume of unit e; V is the volume of the entire structure; φ f is the volume fraction of a given high thermal conductivity material.

[0117] In order to avoid singularities in the heat transfer matrix during the solution of the finite element equations, the element density is lowered to a small value x min , x min =0.001.

[0118] In order to select a steady-state heat conduction topology optimization model with the goal of uniform temperature distribution in the design domain, the temperature variance is used as the objective function in the design process, and the corresponding heat dissipation structure topology optimization model is established:

[0119]

[0120]

[0121]

[0122] In the formula is the average node temperature, T i is the temperature of the ith node, and the subscript A represents the temperature variance.

[0123] S412, through finite element analysis, according to the distribution of the temperature field in the design domain, the sensitivity of the objective function is calculated, and the sensitivity analysis of the design variables is performed.

[0124] Specifically, the sensitivity of the objective function is calculated and the sensitivity analysis of the design variables is performed. Based on the existing research on topology optimization of heat dissipation weak structures, the sensitivity analysis of the objective function is performed:

[0125]

[0126] The sensitivity analysis of the objective function is simplified to obtain the sensitivity calculation formula of the objective function:

[0127]

[0128] The adjoint method is used to find the objective function f in the topology optimization model of the heat dissipation structure. A Sensitivity to any design variable ρ:

[0129]

[0130] Where λ is the introduced adjoint matrix, which represents the adjoint matrix with dimension N (total number of degrees of freedom) and can take any value.

[0131] S414: Use an optimization algorithm to update and optimize the design variables.

[0132] Specifically, the optimization criterion method is used for optimization iteration and updating of design variables. Since the design variables are affected by the Lagrange multipliers of the volume constraints, the density variables are updated first, and then the temperature gradient at the center of each unit is calculated and the angle variables are updated.

[0133] S416, calculating the temperature variance objective function.

[0134] Specifically, calculate the temperature variance objective function, and calculate the overall objective function value based on the objective function value of each unit. For the objective function containing the direction angle:

[0135]

[0136] Taking partial derivative of θ, the objective function is as follows:

[0137]

[0138] Based on the angle optimization criterion algorithm of the temperature gradient, in order to maximize the heat flow through the unit, the direction of the material must be consistent with the direction of the temperature gradient. According to the heat flow formula: When the material orientation angle coincides with the temperature field gradient direction, the heat dissipation effect is best, that is:

[0139] S418, determine whether the function converges, if "yes", go to step S420; if "no", return to S410.

[0140] S420, obtaining the heat sink topology optimization structure, and completing the topology optimization design of the heat dissipation structure of the power device.

[0141] Specifically, after obtaining the optimal material orientation angle, the material model of the heat dissipation structure is derived according to the structural topology optimization material model: K = K (λ x ,λ y , θ), λx, λy and θ represent the thermal conductivity and direction angle of the material respectively. The topological optimization structure of the heat sink is obtained, and a visual image is generated according to the updated design variables (x, θ), completing the topological optimization design of the heat dissipation structure of the power device.

[0142] The present invention first defines a design domain according to the design requirements of the heat dissipation structure, meshes the design domain, initially tests the design variables and constraints, then establishes a mathematical model of the thermal conductive material according to the SIMP method, establishes a unit thermal conductivity matrix and an overall thermal conductivity matrix of the heat dissipation structure of the power device, calculates the sensitivity of the objective function, performs sensitivity analysis on the design variables, then calculates the temperature variance objective function, determines whether the function converges, and finally determines the heat sink topology optimization structure to complete the topology optimization design of the heat dissipation structure of the power device.

[0143] The present invention has the following advantages:

[0144] 1. Based on the SIMP model in the variable density method, the present invention proposes a topological optimization design method for the heat dissipation structure of a power device, providing a design method with high optimization efficiency and simple program implementation for the heat dissipation structure design of the power device. The method can avoid the defects brought by the traditional empirical design method, consumes less time, has lower cost, has good numerical stability and feasibility, improves the efficiency of product design, and speeds up the product design cycle.

[0145] 2. The present invention uses the SIMP method to optimize the structural topology design so as to achieve the best heat dissipation effect of the structure, and can be applied to the heat dissipation structure design of power devices with large power and high heat dissipation performance requirements.

[0146] 3. The present invention can perform topological optimization design on the heat dissipation structure of general power devices according to design requirements. The method concept is easy to understand and simple to implement. By rationally optimizing the heat dissipation structure, not only the thermal conductivity efficiency can be improved, but also the utilization rate of thermal conductive materials can be increased and the cost can be reduced.

[0147] In this specification, the term "plurality" means two or more than two, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0148] In the description of this specification, the description of the terms "one embodiment", "some embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0149] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for topological design of heat dissipation structure of power device based on SIMP, characterized in that: include: Acquire a design area of ​​the design object to perform grid division on the design area; Obtain design variables and their initial values, design parameters and constraints to establish a mathematical model of thermal conductive materials based on SIMP; The topological design of the heat dissipation structure of the power device is performed based on the mathematical model of the thermal conductive material, which specifically includes: Establishing a unit thermal conductivity matrix and an overall thermal conductivity matrix of the design object based on the thermal conductive material mathematical model; Establishing a heat dissipation structure topology design model based on the unit heat conduction matrix and the overall heat conduction matrix; Calculating the sensitivity of the objective function to analyze the sensitivity of the design variables; calculating an objective function based on the sensitivity of the objective function and the sensitivity of the design variables; Determining whether the objective function meets the convergence condition; When the objective function meets the convergence condition, the optimal design variables are obtained; Obtaining an optimal topological structure of the design object based on the optimal design variables; Before calculating the sensitivity of the objective function to analyze the sensitivity of the design variables, the method further includes: The temperature variance is used as the objective function to establish a heat dissipation structure topology design model with uniform temperature distribution; The step of calculating the sensitivity of the objective function to analyze the sensitivity of the design variables specifically includes: Obtaining the temperature field distribution of the design area based on the unit thermal conductivity matrix and the overall thermal conductivity matrix; Calculating the sensitivity of the objective function based on the temperature field distribution; Analyzing the sensitivity of the design variable based on the sensitivity of the objective function, so as to determine the influence of the change of the design variable on the temperature field according to the sensitivity of the design variable; The step of calculating the objective function based on the sensitivity of the objective function and the sensitivity of the design variables specifically includes: Based on the sensitivity of the objective function and the sensitivity of the design variables, a preset algorithm is used to calculate and update the design variables; The objective function is calculated based on the updated design variables.

2. The method for designing a power device heat dissipation structure topology based on SIMP according to claim 1, characterized in that: The step of obtaining a design area of ​​the design object to divide the design area into grids specifically includes: Get the design area of ​​the design object; Get cell properties, size and number of boundary cells; Performing grid division on the design area to divide the design area into various units; The unit attributes include the unit type, the unit real constant, the unit material properties, and the coordinates of the unit when it is formed.

3. The method for designing a power device heat dissipation structure topology based on SIMP according to claim 2, characterized in that: After obtaining the design area of ​​the design object to divide the design area into grids, the method further includes: The element stiffness matrix is ​​calculated when the relative density value of all elements is set to 1, so as to establish a mathematical model of thermal conductive materials based on SIMP.

4. The method for designing a power device heat dissipation structure topology based on SIMP according to claim 1, characterized in that: Also includes: When the objective function does not meet the convergence condition, the topology design of the heat dissipation structure of the power device is re-performed based on the mathematical model of the thermal conductive material based on the updated design variables.

5. A power device heat dissipation structure topology design system based on SIMP, characterized in that: include: An acquisition module is used to acquire a design area of ​​a design object, to mesh the design area, to acquire design variables and their initial values, design parameters and constraints, to establish a mathematical model of a thermal conductive material based on SIMP; A design module, for performing a topological design of a heat dissipation structure of a power device based on the mathematical model of the thermal conductive material, which specifically includes: establishing a unit thermal conductivity matrix and an overall thermal conductivity matrix of the design object based on the mathematical model of the thermal conductive material, establishing a topological design model of the heat dissipation structure based on the unit thermal conductivity matrix and the overall thermal conductivity matrix, calculating the sensitivity of an objective function to analyze the sensitivity of the design variables, calculating an objective function based on the sensitivity of the objective function and the sensitivity of the design variables, judging whether the objective function meets a convergence condition, obtaining an optimal design variable when the objective function meets the convergence condition, and obtaining an optimal topological structure of the design object based on the optimal design variable; The design module is also used to: use the temperature variance as the objective function to establish a heat dissipation structure topology design model with uniform temperature distribution; The design module is specifically used to: obtain the temperature field distribution of the design area based on the unit thermal conductivity matrix and the overall thermal conductivity matrix; calculate the sensitivity of the objective function based on the temperature field distribution; analyze the sensitivity of the design variable based on the sensitivity of the objective function, so as to judge the influence of the change of the design variable on the temperature field according to the sensitivity of the design variable; The design module is also specifically used for: calculating and updating the design variables using a preset algorithm based on the sensitivity of the objective function and the sensitivity of the design variables; and calculating the objective function based on the updated design variables.

6. A power device heat dissipation structure topology design system based on SIMP, characterized in that: include: A memory, a processor, and a program stored in the memory and executable on the processor, wherein when the program is executed by the processor, the steps defined in the method for topological design of a power device heat dissipation structure based on SIMP as described in any one of claims 1 to 4 are implemented.

7. A readable storage medium, characterized in that: Programs and / or instructions are stored thereon, and when the programs and / or the instructions are executed by the processor, the steps of the method for designing a topology of a power device heat dissipation structure based on SIMP as described in any one of claims 1 to 4 are implemented.

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