A chip vision detection mechanism and detection method

Abstract

The present invention discloses a chip vision detection mechanism and a detection method, which relate to the technical field of chip detection. The key points of its technical solution include: a support plate; a camera module carried on the support plate; and further include: a laser bracket connected to the support plate, on which a laser ranging module is provided; and a control module connected to the camera module and the laser ranging module; wherein, the laser ranging module is used to measure the chip in advance and transmit the distance signal to the control module, the control module converts the distance signal into a focal length signal and transmits it to the camera module, and the camera module adjusts the focal length according to the focal length signal. By adding a laser ranging module to measure the chip in advance, when some chips are warped, the camera module can perform adaptive focal length adjustment, thereby improving the clarity of the image and the detection accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and more specifically, it relates to a chip vision detection mechanism and a detection method. Background Art

[0002] In the semiconductor industry, machine vision technology is generally used to automatically detect surface defects of chips.

[0003] A Chinese patent with the authorized announcement number CN214794502U discloses a smart detection system for surface defects of bare chips, which includes a camera, a lens, a lifting bracket, a detection workbench, and a computer. The camera is installed on the lifting bracket and moves up and down through the lifting bracket to adjust the distance between the camera and the bare chip. The lens is a zoom lens and can perform focal length transformation.

[0004] Although the detection system in the above patent can adjust the focal length, as the thickness of the chip gradually decreases, the chip itself will warp. Since the chips are automatically detected in batches, when the focal length remains unchanged, the images of some warped chips will be blurred, affecting the detection accuracy and effect.

[0005] That is, the detection system in the above patent cannot perform adaptive focal length adjustment for some warped chips when applied to batch automatic detection of chips. In the case of blurred images of some chips, the prior art generally corrects the blurred chips through algorithms, but this cannot fundamentally solve the problem of image blurring. Therefore, the first problem to be solved is how to perform adaptive focal length adjustment for some warped chips.

[0006] At the same time, to ensure the detection accuracy, the installation accuracy of the camera is equally important. However, in the above patent, the camera can only move up and down. If the optical axis deflects, it cannot be adjusted, which will affect the photographing effect. And the existing fine adjustment platforms generally can only perform translational adjustment or rotational adjustment and cannot adjust the deflection of the optical axis. Summary of the Invention

[0007] Aiming at the deficiencies of the prior art, one of the purposes of the present invention is to provide a chip vision detection mechanism, which measures the chip in advance by adding a laser ranging module. When some chips are warped, the camera module can perform adaptive focal length adjustment, thereby improving the clarity of the image and the detection accuracy.

[0008] To achieve the above purpose, the present invention provides the following technical solutions:

[0009] A chip vision detection mechanism includes:

[0010] Support plate;

[0011] A camera module carried on the support plate;

[0012] It further includes:

[0013] A laser bracket connected to the support plate, on which a laser ranging module is provided; and,

[0014] A control module connected to the camera module and the laser ranging module;

[0015] Wherein, the laser ranging module is used to measure the chip in advance and transmit the distance signal to the control module, the control module converts the distance signal into a focal length signal and transmits it to the camera module, and the camera module adjusts the focal length according to the focal length signal.

[0016] Further, the laser ranging module includes a point laser ranging module or a line laser ranging module.

[0017] Further, the laser bracket includes a fixing part connected to the support plate and a movable part carrying the laser ranging module. A first rotating shaft is arranged between the fixing part and the movable part, and the movable part can deflect around the first rotating shaft;

[0018] A laser deflection adjustment component and a laser limit fastening component are further arranged between the fixing part and the movable part.

[0019] Further, the fixing part includes a U-shaped third support plate with its opening facing downwards; the movable part includes a fourth support plate passing through the third support plate, and the first rotating shaft is connected between the third support plate and the fourth support plate;

[0020] The laser deflection adjustment component includes a first fine adjustment head installed on the third support plate, the end of the first fine adjustment head contacts the fourth support plate, and a first spring is arranged between the third support plate and the fourth support plate. The first fine adjustment head and the first spring are respectively located on both sides of the first rotating shaft;

[0021] The laser limit fastening component includes a first fastening bolt arranged on the third support plate, and the end of the first fastening bolt contacts the fourth support plate.

[0022] Further, a camera fine adjustment platform for carrying the camera module is arranged on the support plate, and the camera fine adjustment platform is used to adjust the deflection of the camera module.

[0023] Further, the camera fine adjustment platform includes a rotating shaft, a camera deflection adjustment component and a camera limit fastening component that cooperate with each other. The camera deflection adjustment component includes a fine adjustment head and a spring respectively arranged on both sides of the rotating shaft.

[0024] Further, the camera fine-tuning platform includes a fixed support, an X-axis deflection seat, a Y-axis deflection seat, and a Z-axis deflection seat that are connected in sequence;

[0025] A second rotating shaft arranged along the X-axis direction, a first camera deflection adjustment component, and a first camera limit fastening component are provided between the fixed support and the X-axis deflection seat;

[0026] A third rotating shaft arranged along the Y-axis direction, a second camera deflection adjustment component, and a second camera limit fastening component are provided between the X-axis deflection seat and the Y-axis deflection seat;

[0027] A fourth rotating shaft arranged along the Z-axis direction, a third camera deflection adjustment component, and a third camera limit fastening component are provided between the Y-axis deflection seat and the Z-axis deflection seat.

[0028] Aiming at the deficiencies of the prior art, another object of the present invention is to provide a detection method. To achieve the above object, the present invention provides the following technical solutions:

[0029] A detection method using the above chip vision detection mechanism. When the chip vision detection mechanism moves, the chip is measured in advance by the laser ranging module, and the distance signal is transmitted to the control module. The control module converts the distance signal into a focal length signal and transmits it to the camera module. The camera module adjusts the focal length during the movement according to the focal length signal. When the camera module moves to the shooting position above the chip, the chip can be photographed according to the corresponding focal length.

[0030] Further, the camera module can simultaneously photograph a group of chips. The laser ranging module is a line laser ranging module, and the line laser ranging module can simultaneously photograph two groups of chips arranged side by side;

[0031] When the chip vision detection mechanism moves forward, the two groups of chips arranged side by side are measured in advance by the laser ranging module, and the two groups of distance signals are transmitted to the control module. The control module converts the two groups of distance signals into two groups of focal length signals and transmits them to the camera module;

[0032] The camera module adjusts the focal length during the forward movement according to one group of focal length signals. When the camera module moves to the shooting position above this group of chips, it can be photographed according to the corresponding focal length;

[0033] Then the camera module adjusts the focal length during the backward movement according to the other group of focal length signals. When the camera module moves to the shooting position above this group of chips, it can be photographed according to the corresponding focal length.

[0034] Further, the laser ranging module measures a single position of the chip or the entire chip.

[0035] In summary, the present invention has the following beneficial effects:

[0036] 1. By adding a laser ranging module to measure the chip in advance, when some chips are warped, the camera module can perform adaptive focal length adjustment, thereby improving the clarity of the image and the detection accuracy;

[0037] 2. The laser deflection adjustment component is used to deflect and adjust the laser ranging module to reduce the influence of the machining tolerance and assembly tolerance of the parts on the installation accuracy of the laser ranging module, thereby improving the measurement accuracy of the line laser ranging module;

[0038] 3. The camera fine-tuning platform can be used to deflect and adjust the optical axis of the camera module to reduce the influence of the machining error and assembly error of the parts on the installation accuracy of the camera module, thereby improving the clarity of the captured image and further improving the detection accuracy. Description of the Drawings

[0039] Figure 1 Schematic diagram of the overall structure of a chip vision detection mechanism in Embodiment 1 Figure 1 ;

[0040] Figure 2 Schematic diagram of the overall structure of a chip vision detection mechanism in Embodiment 1 Figure 2 ;

[0041] Figure 3 Schematic diagram of the structure of the laser bracket in Embodiment 1 Figure 1 ;

[0042] Figure 4 Schematic diagram of the structure of the laser bracket in Embodiment 1 Figure 2 ;

[0043] Figure 5 Schematic diagram of the structure of the camera fine-tuning platform in Embodiment 1 Figure 1 ;

[0044] Figure 6 Schematic diagram of the structure of the camera fine-tuning platform in Embodiment 1 Figure 2 ;

[0045] Figure 7 Schematic diagram of the structure of the chip carrier in Embodiment 2.

[0046] In the figure: 1, support plate; 2, camera fine-tuning platform; 21, fixed support; 211, first vertical plate; 212, first vertical side plate; 213, first shaft hole; 214, first adjustment hole; 215, first spring hole; 22, X-axis deflection seat; 221, second vertical plate; 222, horizontal side plate; 223, second shaft hole; 224, first fastening hole; 225, second spring hole; 226, fourth shaft hole; 227, second adjustment hole; 23, Y-axis deflection seat; 231, third vertical plate; 232, second vertical side plate; 233, third shaft hole; 234, second fastening hole; 235, sixth shaft hole; 236, third fastening hole; 24, Z-axis deflection seat; 241, fifth shaft hole; 242, third adjustment hole; 243, third spring hole; 25, adapter plate; 26, second fine-tuning head; 27, third fine-tuning head; 28, fourth fine-tuning head; 3, camera module; 4, laser bracket; 41, first support plate; 42, second support plate; 43, third support plate; 44, fourth support plate; 45, fifth support plate; 46, first rotating shaft; 47, first fine-tuning head; 48, first spring; 49, first fastening bolt; 5, laser ranging module; 6, chip carrier board; 61, chip slot. Specific Embodiment

[0047] The present invention will be further described in detail below with reference to the accompanying drawings.

[0048] This specific embodiment is only an explanation of the present invention and is not a limitation thereof. After reading this specification, those skilled in the art can make modifications to this embodiment without creative contributions as needed, but as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

[0049] Embodiment 1:

[0050] A chip vision detection mechanism, referring to Figures 1 to 6, which includes a support plate 1, a camera module 3 is arranged on the support plate 1, the support plate 1 is connected with a laser bracket 4, a laser ranging module 5 is arranged on the laser bracket 4, and the camera module 3 and the laser ranging module 5 are connected with a control module (not shown in the attached drawings); wherein, the laser ranging module 5 is used to measure the chip in advance and transmit the distance signal to the control module, the control module converts the distance signal into a focal length signal and transmits it to the camera module 3, and the camera module 3 adjusts the focal length according to the focal length signal; before the measurement, the height and focal length of the camera module 3 will be preset. On this basis, in this embodiment, by adding a laser ranging module 5 to measure the chip in advance, when some chips are warped, the camera module 3 can perform adaptive focal length adjustment, so as to improve the clarity of the image and the detection accuracy; in this embodiment, the laser bracket 4 is directly connected to the support plate 1. In other alternative embodiments, the connection position of the laser bracket 4 and the support plate 1 can be adjusted as needed. For example, the support plate 1 and the laser bracket 4 are respectively installed on a bracket, which is not limited here, as long as the relative position of the laser bracket 4 and the support plate 1 remains unchanged.

[0051] Referring to Figure 1 and Figure 2 , the laser ranging module 5 includes a dot laser ranging module or a line laser ranging module; the dot laser ranging module measures the chips one by one, and the line laser ranging module measures multiple chips at the same time; the dot laser ranging module has the advantage of accurate measurement, but using one dot laser ranging module will increase the moving stroke and affect the detection efficiency. If dot laser ranging modules are arranged on both sides of the camera module 3, the cost will be relatively high; preferably, in this embodiment, the laser ranging module 5 is a line laser ranging module, so as to take into account the detection efficiency while improving the detection accuracy.

[0052] Referring to Figures 1 to 4 , preferably, in this embodiment, the laser bracket 4 includes a fixed part connected to the support plate 1 and a movable part carrying the laser ranging module 5. A first rotating shaft 46 is arranged between the fixed part and the movable part, and the movable part can deflect around the first rotating shaft 46; a laser deflection adjustment component and a laser limit fastening component are also arranged between the fixed part and the movable part; in this embodiment, the laser deflection adjustment component is used to deflect and adjust the laser ranging module 5 to reduce the influence of the machining tolerance and assembly tolerance of the parts on the installation accuracy of the laser ranging module 5, so as to improve the measurement accuracy of the line laser ranging module.

[0053] Referring to Figures 1 to 4, specifically, in this embodiment, the fixed part sequentially connects the first support plate 41, the second support plate 42, and the third support plate 43, where the first support plate 41 is connected to the support plate 1; in this embodiment, the third support plate 43 is U-shaped and has an opening facing downward; the movable part includes a fourth support plate 44 passing through the third support plate 43, and fifth support plates 45 are respectively arranged at both ends of the fourth support plate 44, and the laser ranging module 5 is installed between the two fifth support plates 45; the first rotating shaft 46 is connected between the third support plate 43 and the fourth support plate 44. Specifically, in this embodiment, the first rotating shaft 46 passes through both the third support plate 43 and the fourth support plate 44 at the same time, and the fourth support plate 44 can deflect around the first rotating shaft 46; the laser deflection adjustment component includes a first fine adjustment head 47 installed on the top wall of the third support plate 43, and the end of the first fine adjustment head 47 contacts the top wall of the fourth support plate 44. A first spring 48 is arranged between the inner top wall of the third support plate 43 and the top wall of the fourth support plate 44, and the first fine adjustment head 47 and the first spring 48 are respectively located on both sides of the first rotating shaft 46; there is a gap between the inner top wall of the third support plate 43 and the top wall of the fourth support plate 44, providing an amount of movement for the deflection of the fourth support plate 44; the laser limit fastening component includes a first fastening bolt 49 arranged on the third support plate 43, and the end of the first fastening bolt 49 contacts the fourth support plate 44; specifically, in this embodiment, a plurality of first fastening bolts 49 are arranged on the third support plate 43, so as to improve the fastening stability; in this embodiment, the elastic force of the first spring 48 can be used to achieve pre-positioning during the adjustment process, which is convenient for adjustment, and has a simple structure, low production cost, and is easy to produce; preferably, a relief groove cooperating with the first fine adjustment head 47 is opened on the top wall of the fourth support plate 44, so as to facilitate assembly; counterbores cooperating with the first spring 48 are separately opened on the top wall of the fourth support plate 44 and the inner top wall of the third support plate 43, so as to improve the stability of the first spring 48; of course, in other alternative embodiments, the first spring 48 can also be replaced with another first fine adjustment head 47, which is not limited here.

[0054] Refer to Figure 1 , Figure 5 and Figure 6 , preferably, in this embodiment, a camera fine adjustment platform 2 for carrying the camera module 3 is arranged on the support plate 1, and the camera fine adjustment platform 2 is used to adjust the deflection of the camera module 3; in this embodiment, the camera fine adjustment platform 2 can be used to adjust the optical axis of the camera module 3 to reduce the influence of part processing errors and assembly errors on the installation accuracy of the camera module 3, thereby improving the clarity of the captured image and further improving the detection accuracy; specifically, in this embodiment, the camera fine adjustment platform 2 includes a rotating shaft, a camera deflection adjustment component, and a camera limit fastening component that cooperate with each other. The camera deflection adjustment component includes fine adjustment heads and springs respectively arranged on both sides of the rotating shaft.

[0055] Refer to Figure 1 , Figure 5 andFigure 6 , preferably, in this embodiment, the camera fine-tuning platform 2 includes a fixed support 21, an X-axis deflection seat 22, a Y-axis deflection seat 23, and a Z-axis deflection seat 24 connected in sequence. In this embodiment, the X-axis and the Y-axis form a vertical plane, and the X-axis and the Z-axis form a horizontal plane; the fixed support 21 is connected to the support plate 1, and a transfer plate 25 connected to the camera module 3 is provided on the Z-axis deflection seat 24; a second rotating shaft (not shown in the drawing) arranged along the X-axis direction, a first camera deflection adjustment assembly, and a first camera limit fastening assembly are provided between the fixed support 21 and the X-axis deflection seat 22; a third rotating shaft (not shown in the drawing) arranged along the Y-axis direction, a second camera deflection adjustment assembly, and a second camera limit fastening assembly are provided between the X-axis deflection seat 22 and the Y-axis deflection seat 23; a fourth rotating shaft (not shown in the drawing) arranged along the Z-axis direction, a third camera deflection adjustment assembly, and a third camera limit fastening assembly are provided between the Y-axis deflection seat 23 and the Z-axis deflection seat 24; in this embodiment, the camera fine-tuning platform 2 can provide three mutually perpendicular deflection adjustment directions for the camera module 3, which is beneficial to improving the position accuracy of the camera module 3 and the shooting effect; of course, in other alternative embodiments, the camera fine-tuning platform 2 can also provide only one or two deflection adjustment directions, which is not limited herein.

[0056] Refer to Figure 1 , Figure 5 and Figure 6, specifically, in this embodiment, the fixed support 21 includes a first vertical plate 211, on which two first vertical side plates 212 are symmetrically arranged. The X-axis deflection seat 22 is located between the two first vertical side plates 212; the X-axis deflection seat 22 includes a second vertical plate 221, on which two horizontal side plates 222 are symmetrically arranged. The Y-axis deflection seat 23 is located between the two horizontal side plates 222; the Y-axis deflection seat 23 includes a third vertical plate 231, on which two second vertical side plates 232 are symmetrically arranged. The Z-axis deflection seat 24 is located between the two second vertical side plates 232; first shaft holes 213 and second shaft holes 223 that cooperate with the second rotating shaft are respectively formed in the side walls of the first vertical side plate 212 and the second vertical plate 221. The first camera limit fastening assembly includes a plurality of second fastening bolts (not shown in the drawings). A first adjustment hole 214 that cooperates with the second fastening bolts is formed in the first vertical side plate 212, and a first fastening hole 224 that cooperates with the second fastening bolts is formed in the side wall of the second vertical plate 221; the first camera deflection adjustment assembly includes a second fine adjustment head 26 mounted on one of the horizontal side plates 222, and a second spring (not shown in the drawings) disposed between the first vertical plate 211 and the second vertical plate 221. A first spring hole 215 that cooperates with the second spring is formed in the first vertical plate 211; fourth shaft holes 226 and third shaft holes 233 that cooperate with the third rotating shaft are respectively formed in the horizontal side plate 222 and the third vertical plate 231. The second camera limit fastening assembly includes a plurality of third fastening bolts (not shown in the drawings). A second adjustment hole 227 that cooperates with the third fastening bolts is formed in the horizontal side plate 222, and a second fastening hole 234 that cooperates with the third fastening bolts is formed in the third vertical plate 231; the second camera deflection adjustment assembly includes a third fine adjustment head 27 mounted on the third vertical plate 231, and a third spring (not shown in the drawings) disposed between the second vertical plate 221 and the third vertical plate 231. A second spring hole 225 that cooperates with the third spring is formed in the second vertical plate 221; fifth shaft holes 241 and sixth shaft holes 235 that cooperate with the fourth rotating shaft are respectively formed in the Z-axis deflection seat 24 and the third vertical plate 231. The third camera limit fastening assembly includes a plurality of fourth fastening bolts (not shown in the drawings). A third adjustment hole 242 that cooperates with the fourth fastening bolts is formed in the Z-axis deflection seat 24, and a third fastening hole 236 that cooperates with the fourth fastening bolts is formed in the third vertical plate 231; the third camera deflection adjustment assembly includes a fourth fine adjustment head 28 mounted on one of the second vertical side plates 232, and a fourth spring (not shown in the drawings) disposed between the second vertical side plate 232 and the Z-axis deflection seat 24. A third spring hole 243 that cooperates with the fourth spring is formed in the Z-axis deflection seat 24; the camera fine adjustment platform 2 in this embodiment has the advantages of simple structure, convenient adjustment, and convenient production and processing.

[0057] Embodiment 2:

[0058] A detection method for the chip vision detection mechanism in Application Embodiment 1, referring to Figure 1 and Figure 7 , when the chip vision detection mechanism moves, it measures the chip in advance through the laser ranging module 5 and transmits the distance signal to the control module. The control module converts the distance signal into a focal length signal and transmits it to the camera module 3. The camera module 3 adjusts the focal length during the movement according to the focal length signal. When the camera module 3 moves to the shooting position above the chip, it can shoot the chip according to the corresponding focal length, thereby improving the clarity of the image and the detection accuracy. Of course, in other alternative embodiments, the chip can also be controlled to move, which is not limited herein.

[0059] Referring to Figure 1 and Figure 7 , preferably, in this embodiment, the camera module 3 can shoot a group of chips at the same time. The laser ranging module 5 is a line laser ranging module, and the line laser ranging module can shoot two groups of chips arranged side by side at the same time. When the chip vision detection mechanism moves forward, it measures the two groups of chips arranged side by side in advance through the laser ranging module 5 and transmits the two groups of distance signals to the control module. The control module converts the two groups of distance signals into two groups of focal length signals and transmits them to the camera module. The camera module 3 adjusts the focal length during the forward movement according to one group of focal length signals. When the camera module 3 moves to the shooting position above this group of chips, it can shoot according to the corresponding focal length. Then the camera module 3 adjusts the focal length during the backward movement according to the other group of focal length signals. When the camera module 3 moves to the shooting position above this group of chips, it can shoot according to the corresponding focal length. By adopting the above method, the movement path of the detection mechanism can be optimized and the detection efficiency can be improved.

[0060] Referring to Figure 1 and Figure 7 , specifically, this embodiment further includes a chip carrier 6. A plurality of chip slots 61 arranged in rows and columns are provided on the chip carrier 6. The chips to be detected are placed in the chip slots 61. For example, the camera module 3 can shoot 5 rows of chips at the same time, and the laser ranging module 5 can measure 10 rows of chips at the same time. When taking pictures and detecting multiple chips on the chip carrier 6, the movement path of the detection mechanism is serpentine, which is beneficial to reducing the travel of the movement path and improving the detection efficiency.

[0061] Referring to Figure 1 and Figure 7, the laser ranging module 5 can measure a single position of the chip or measure the entire chip; in this embodiment, the camera module 3 uses the flying shooting technology to take pictures of the chip. When the camera module 3 moves to the shooting position above the chip, it takes pictures, and when the laser ranging module 5 moves to the shooting position in advance, it measures the chip, that is, measures a single position of the chip, which is beneficial to improving the detection efficiency; measuring the entire chip, that is, the laser ranging module 5 continuously measures when passing above the chip to obtain the overall data of the chip, and then takes the average value as the distance signal and transmits it to the control module, which is beneficial to improving the focal length adjustment accuracy of the camera module 3 and further improving the detection accuracy; measuring the entire chip, the measured data can also be used to analyze the flatness of the chip.

Claims

1. A chip vision detection mechanism, comprising: A support plate; A camera module carried on the support plate; It is characterized in that it further comprises: A laser bracket connected to the support plate, on which a laser ranging module is provided; and, A control module connected to the camera module and the laser ranging module; Wherein, the laser ranging module is used to measure the chip in advance and transmit the distance signal to the control module, the control module converts the distance signal into a focal length signal and transmits it to the camera module, and the camera module adjusts the focal length according to the focal length signal; The laser ranging module includes a dot laser ranging module or a line laser ranging module; The laser bracket includes a fixed part connected to the support plate and a movable part carrying the laser ranging module. A first rotating shaft is arranged between the fixed part and the movable part, and the movable part can deflect around the first rotating shaft; A laser deflection adjustment component and a laser limit fastening component are further arranged between the fixed part and the movable part; The fixed part includes a U-shaped third support plate with the opening facing downwards; the movable part includes a fourth support plate passing through the third support plate, and the first rotating shaft is connected between the third support plate and the fourth support plate; The laser deflection adjustment component includes a first fine adjustment head installed on the third support plate, the end of the first fine adjustment head contacts the fourth support plate, and a first spring is arranged between the third support plate and the fourth support plate. The first fine adjustment head and the first spring are respectively located on both sides of the first rotating shaft; The laser limit fastening component includes a first fastening bolt arranged on the third support plate, and the end of the first fastening bolt contacts the fourth support plate.

2. The chip vision detection mechanism according to claim 1, wherein: A camera fine adjustment platform for carrying the camera module is arranged on the support plate, and the camera fine adjustment platform is used to adjust the deflection of the camera module.

3. The chip vision detection mechanism according to claim 2, characterized in that: The camera fine adjustment platform includes a rotating shaft, a camera deflection adjustment component and a camera limit fastening component that cooperate with each other. The camera deflection adjustment component includes a fine adjustment head and a spring respectively arranged on both sides of the rotating shaft.

4. The chip vision detection mechanism according to claim 3, wherein: The camera fine adjustment platform includes a fixed support, an X-axis deflection seat, a Y-axis deflection seat and a Z-axis deflection seat connected in sequence; A second rotating shaft arranged along the X-axis direction, a first camera deflection adjustment component and a first camera limit fastening component are arranged between the fixed support and the X-axis deflection seat; A third rotating shaft arranged along the Y-axis direction, a second camera deflection adjustment component and a second camera limit fastening component are arranged between the X-axis deflection seat and the Y-axis deflection seat; A fourth rotating shaft arranged along the Z-axis direction, a third camera deflection adjustment component and a third camera limit fastening component are arranged between the Y-axis deflection seat and the Z-axis deflection seat.

5. A detection method using the chip vision detection mechanism according to any one of claims 1-4, characterized in that: When the chip vision detection mechanism moves, the chip is measured in advance by the laser ranging module, and the distance signal is transmitted to the control module. The control module converts the distance signal into a focal length signal and transmits it to the camera module. The camera module adjusts the focal length during the movement according to the focal length signal. When the camera module moves to the shooting position above the chip, the chip can be shot according to the corresponding focal length.

6. The detection method according to claim 5, wherein: The camera module can simultaneously take pictures of a group of chips. The laser ranging module is a line laser ranging module, and the line laser ranging module can simultaneously take pictures of two groups of chips arranged side by side; When the chip vision detection mechanism moves forward, it measures the two groups of chips arranged side by side in advance through the laser ranging module, and transmits the two distance signals to the control module. The control module converts the two distance signals into two focal length signals and transmits them to the camera module; The camera module adjusts the focal length during the forward movement according to one of the two focal length signals. When the camera module moves to the shooting position above this group of chips, it can take pictures according to the corresponding focal length; Then the camera module adjusts the focal length during the backward movement according to the other group of focal length signals. When the camera module moves to the shooting position above this group of chips, it can take pictures according to the corresponding focal length.

7. The detection method according to claim 5, characterized in that: The laser ranging module measures a single position of the chip or measures the whole chip.

Images