Display panel, preparation method and display device

Abstract

This disclosure provides a display panel, a method for manufacturing the same, and a display device. The display panel includes: a display substrate, an adhesive layer, and a protective film stacked sequentially; wherein the adhesiveness of at least one edge of the adhesive layer perpendicular to the surface of the display substrate near the protective film is less than the adhesiveness of other portions of the adhesive layer. Side contamination of the display panel can be suppressed.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, and more specifically, it describes the design of a display panel, its preparation method, and a display device. Background Technology

[0002] This section is intended to provide background or context for the embodiments set forth in the claims. The description herein is not an admission that it is prior art simply because it is included in this section.

[0003] In related technologies, micro-light-emitting diodes (Micro-LEDs, Mini-LEDs) are transferred onto a glass substrate. Mini-LEDs have chip sizes between 100μm and 200μm. Micro-LEDs are even smaller than Mini-LEDs, typically between 1μm and 100μm. This disclosure collectively refers to both types of light-emitting diodes as micro-light-emitting diodes. Related technologies also involve transferring larger-sized light-emitting diodes onto a substrate to form a display panel. Display panels based on micro-light-emitting diodes offer advantages such as high brightness, high contrast, fast response, and low power consumption. In related technologies, after the micro-light-emitting diode transfer process is completed, the micro-light-emitting diodes are covered with an adhesive material, thereby completing the encapsulation of the micro-light-emitting diode display panel. Summary of the Invention

[0004] This disclosure provides a display panel, a method for manufacturing the panel, and a display device.

[0005] This disclosure provides the following technical solution: a display panel, characterized in that it comprises: a display substrate and an adhesive layer stacked together, the display substrate comprising a substrate and a light-emitting device disposed on the substrate, and the adhesive layer covering the light-emitting device;

[0006] The adhesiveness of at least one edge of the adhesive layer perpendicular to the surface of the display substrate is less than that of the other parts of the adhesive layer.

[0007] In some embodiments, a photosensitive unit is provided on at least one edge of the adhesive layer, configured to reduce the adhesiveness of at least one edge of the adhesive layer under illumination of light of a preset wavelength.

[0008] In some embodiments, at least a portion of the photosensitive unit's orthogonal projection onto the display substrate falls within the area of ​​the display substrate.

[0009] In some embodiments, the size of the photosensitive unit is 5µm to 20µm along a direction parallel to the surface of the display substrate near the protective film.

[0010] In some embodiments, the material of the photosensitive unit includes a photoinitiator.

[0011] In some embodiments, the photoinitiator is incorporated into the adhesive material of the adhesive layer, or the photoinitiator is independent of the adhesive material of the adhesive layer and located on the side of the adhesive material of the adhesive layer.

[0012] In some embodiments, at least one edge of the adhesive layer is flush with the display substrate perpendicular to the display substrate.

[0013] In some embodiments, the adhesive layer includes a black adhesive layer and a transparent adhesive layer stacked along a direction perpendicular to the surface of the display substrate near the protective film.

[0014] In some embodiments, the orthogonal projection of the photosensitive unit on the substrate does not cover the orthogonal projection of the plurality of light-emitting devices on the substrate.

[0015] In some embodiments, the display panel further includes a protective film disposed on the side of the adhesive layer away from the display substrate.

[0016] In some embodiments, the light-emitting device includes a micro light-emitting diode.

[0017] This disclosure provides the following technical solution: a method for manufacturing a display panel, characterized in that it includes:

[0018] A display substrate is provided, the display substrate comprising a substrate and light-emitting devices disposed on the substrate;

[0019] An adhesive layer is formed on the display substrate, and the adhesive layer covers the light-emitting device;

[0020] The adhesiveness of at least one edge of the adhesive layer perpendicular to the surface of the display substrate is less than that of the other parts of the adhesive layer.

[0021] In some embodiments, forming an adhesive layer and a protective film over the display substrate includes the following steps:

[0022] An adhesive layer and a protective film are formed on the display substrate; wherein the orthographic projection of the display substrate onto the protective film covers a portion of the orthographic projection of the adhesive layer onto the protective film and a portion of the protective film;

[0023] The adhesive layer and the protective film are cut such that at least one edge of the remaining adhesive layer is located inside the corresponding edge of the display substrate that is perpendicular to the surface of the display substrate near the protective film.

[0024] A photosensitive unit is formed at at least one edge of the adhesive layer; wherein the photosensitive unit is configured to reduce the adhesiveness of the at least one edge of the adhesive layer when irradiated by light of a preset wavelength.

[0025] In some embodiments, forming an adhesive layer and a protective film over the display substrate includes the following steps:

[0026] An adhesive layer and a protective film are formed on the display substrate; wherein, the orthographic projection of the display substrate on the protective film covers a portion of the orthographic projection of the adhesive layer on the protective film and a portion of the protective film, the adhesive layer is located on the side of the protective film facing the display substrate, at least one edge of the adhesive layer is a photosensitive unit, and at least a portion of the orthographic projection of the photosensitive unit on the display substrate falls within the area of ​​the display substrate;

[0027] The adhesive layer and the protective film are cut such that at least one edge of the remaining adhesive layer is flush with the corresponding edge of the display substrate that is perpendicular to the surface of the display substrate near the protective film.

[0028] This disclosure provides the following technical solution: a display device, including the aforementioned display panel.

[0029] The reduced adhesiveness at the edges of the adhesive layer makes it less likely for dust and dirt to adhere to the sides, thus improving the product's appearance and display. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of a micro-light-emitting diode display panel in related technologies.

[0031] Figure 2 This is a schematic diagram of the structure of a micro-light-emitting diode display panel according to an embodiment of the present disclosure.

[0032] Figure 3 This is a schematic diagram of the structure of a micro-light-emitting diode display panel according to another embodiment of the present disclosure.

[0033] Figure 4 This is a schematic flowchart of a method for fabricating a micro-light-emitting diode display panel according to an embodiment of the present disclosure.

[0034] Figure 5 This is a detailed flowchart illustrating some steps of the fabrication method of the micro-light-emitting diode display panel according to an embodiment of the present disclosure.

[0035] Figures 6a to 6d This is a schematic diagram of an intermediate state of a micro-light-emitting diode display panel during the fabrication process according to an embodiment of this disclosure.

[0036] Figure 7This is a detailed flowchart illustrating some steps of the fabrication method of the micro-light-emitting diode display panel according to an embodiment of the present disclosure.

[0037] Figures 8a to 8d This is a schematic diagram of an intermediate state of a micro-light-emitting diode display panel during the fabrication process, according to another embodiment of this disclosure.

[0038] Among them, 1 is a display substrate; 11 is a substrate; 12 is a light-emitting device; 3 is an adhesive layer; 31 is a black adhesive layer; 32 is a transparent adhesive layer; 33 is a photosensitive unit after being irradiated with light of a preset wavelength; 33' is a photosensitive unit before being irradiated with light of a preset wavelength; and 4 is a protective film. Detailed Implementation

[0039] The present disclosure will be further described below with reference to the embodiments shown in the accompanying drawings.

[0040] Figure 1 This is a schematic diagram of a Mini-LED / Micro-LED display panel in related technologies. The display substrate 1 includes a glass substrate 11 and a light-emitting device 12 (specifically a micro-LED chip) disposed on the glass substrate 11. The light-emitting device 12 is encapsulated by an adhesive layer 3 comprising a black adhesive layer 31 and a transparent adhesive layer 32. A protective film 4 covers the adhesive layer 3.

[0041] The inventors of this disclosure have discovered that because the adhesive layer 3 has exposed and sticky side surfaces, that is, the surface of the adhesive layer 3 perpendicular to the display substrate 1 and close to the protective film 4 is exposed and sticky, these surfaces are prone to adhering to dust and other dirt, thereby affecting the product appearance and display effect.

[0042] In view of this, refer to Figure 2 and Figure 3 The present disclosure provides a display panel, including: a display substrate 1, an adhesive layer 3 and a protective film stacked together;

[0043] The adhesiveness of the adhesive layer 3 is less than that of the other parts of the adhesive layer 3 on at least one side of the surface of the display substrate 1 near the protective film 4 than that of the other parts of the adhesive layer 3.

[0044] In other words, the adhesiveness of the edge area of ​​the adhesive layer 3 is reduced, which makes it less likely for dust and other dirt to adhere to the sides of the adhesive layer 3, thereby improving the product's appearance and display effect.

[0045] In other embodiments, the surface of the adhesive layer 3 facing away from the display substrate 1 is non-adhesive. The protective film 4 is an optional layer structure.

[0046] In other embodiments, the surface of the adhesive layer 3 facing away from the display substrate 1 is adhered to other structures.

[0047] The material of the protective film 4 includes polyethylene terephthalate (PET).

[0048] The display substrate 1 includes a substrate 11, a driving circuit layer (not shown) disposed on the substrate 11, and a light-emitting device 12 disposed on the driving circuit layer. The driving circuit layer typically includes transistors and wirings to drive the light-emitting device 12 to emit light. The wirings include, for example, gate lines, data lines, power lines, and ground lines. The transistors are, for example, thin-film transistors (TFTs). This disclosure does not limit the structural details of the display substrate 1, and those skilled in the art can make its own configurations based on existing technology.

[0049] In some embodiments, a photosensitive unit 33 is provided on at least one edge of the adhesive layer 3, configured to reduce the adhesiveness of at least one edge of the adhesive layer 3 under irradiation with light of a preset wavelength. The preset wavelength of light is, for example, ultraviolet light (UV light).

[0050] In some embodiments, the photosensitive unit 33 includes a photoinitiator independent of the adhesive material of the adhesive layer 3. Examples of photoinitiators include: 1173 (2-hydroxy-2-methyl-1-phenylpropanone), 907 (2-methyl-2-(4-morpholino)-1-[4-(methylthio)phenyl]-1-propanone), TPO (2,4,6-trimethylbenzoyl-diphenylphosphine oxide), TPO-L (ethyl 2,4,6-trimethylbenzoylphenylphosphonate), etc. For example, after forming the adhesive material of the adhesive layer 3, the photoinitiator is applied or sprayed onto the edge regions of the adhesive material surface of the adhesive layer 3. Subsequently, the multilayer adhesive material is laminated, or the adhesive material is laminated to the protective film 4. In these embodiments, the photosensitive unit 33 includes one or more layers of adhesive material and a photoinitiator having overlapping regions with the adhesive material.

[0051] In other embodiments, the photoinitiator is incorporated into the adhesive material of the adhesive layer 3. For example, after the adhesive material of the adhesive layer 3 is formed, the photoinitiator is infiltrated into the edge region of the adhesive material of the adhesive layer 3 using a permeation method.

[0052] Under specific light stimulation, the photoinitiator catalyzes the conversion of non-polyester materials in the nearby adhesive material into polyester, thereby reducing the adhesion of the edge region of the adhesive layer 3.

[0053] In other embodiments, the photosensitive unit 33 is independent of the adhesive layer in the adhesive layer 3. For example, the photosensitive unit 33 is a UV adhesive coated on the side surface of the adhesive layer in the adhesive layer 3. The UV adhesive itself is cured by ultraviolet light, thereby reducing the tackiness at the side surface of the adhesive layer 3.

[0054] In other embodiments, at least one edge of the adhesive layer 3 is allowed to air dry to reduce its stickiness. At least one edge of the adhesive layer 3 is formed, for example, by a fluorinating agent.

[0055] In some embodiments, reference Figure 2 and Figure 3 At least some of the photosensitive units 33 are projected onto the display substrate 1 and fall within the area of ​​the display substrate 1.

[0056] exist Figure 2 In the embodiment shown, the orthographic projection of the protective film 4 on the display substrate 1 covers the orthographic projection of the photosensitive unit 33 on the display substrate 1.

[0057] In some variations, the orthographic projection of the photosensitive unit 33 onto the display substrate 1 exceeds the orthographic projection of the protective film 4 onto the display substrate 1.

[0058] exist Figure 3 In the embodiment shown, the orthographic projection of the protective film 4 on the display substrate 1 does not overlap with the orthographic projection of the photosensitive unit 33 on the display substrate 1.

[0059] In some embodiments, the size of the photosensitive unit 33 is 5µm to 20µm along a direction parallel to the surface of the display substrate 1 near the protective film 4.

[0060] If the size of the photosensitive unit 33 is too small along the direction parallel to the surface of the display substrate 1 near the protective film 4, its effect on reducing contamination on the side of the adhesive layer 3 will be insufficient. If the size of the photosensitive unit 33 is too large along the direction parallel to the surface of the display substrate 1 near the protective film 4, it will increase the size of the display panel.

[0061] In some embodiments, reference Figure 2 and Figure 3 At least one edge of the adhesive layer 3 is flush with the corresponding edge of the display substrate 1, which is perpendicular to the surface of the display substrate 1 near the protective film 4. This helps to reduce the size of the display panel layer. When this display panel is used as a splicing display panel, the seam size can be reduced.

[0062] In some embodiments, reference Figure 2 and Figure 3 The adhesive layer 3 includes a transparent adhesive layer 32 and a black adhesive layer 31 stacked along a direction perpendicular to the surface of the display substrate 1 near the protective film 4.

[0063] The transparent adhesive layer 32 is, for example, an optically clear adhesive (OCA). The black adhesive layer 31 is, for example, an optically black adhesive (Optically Black Adhesive).

[0064] Typically, optical black glue is coated in the gaps between the aforementioned micro-LEDs and on the surface of the micro-LEDs, so that the optical black glue is in contact with the sides and surfaces of each micro-LED. This allows the black glue to improve the contrast of the display substrate and to encapsulate and protect each micro-LED.

[0065] When the micro LED is not emitting light, the black adhesive layer 31 can absorb ambient light that shines into the display substrate, thereby reducing the black state brightness of the display substrate and improving the contrast of the display.

[0066] The transparent adhesive layer 32 generally serves a protective function. The materials of the transparent adhesive layer 32 can include, but are not limited to, materials with good transparency such as silicone, acrylic, and epoxy resin.

[0067] In practice, the light adjustment layers (i.e., encapsulation film layers such as black glue and transparent glue) can be fabricated in stages above the light-emitting diode 102; or the light adjustment layers can be fabricated as composite film layers stacked together, and then the composite film layer can be directly bonded to the side of the display substrate with the light-emitting diode 102.

[0068] In these embodiments, the light emission direction of the display panel is from the adhesive layer 3 to the display substrate 1.

[0069] In other embodiments, the adhesive layer 3 includes a transparent adhesive layer 32 but excludes the black adhesive layer 31. In these embodiments, the light emission direction of the display panel is from the display substrate 1 toward the adhesive layer 3.

[0070] In other embodiments, the adhesive layer 2 includes a black adhesive layer 31 and other colored adhesive layers. The black adhesive layer 31 covers the light-emitting devices 12 and fills the gaps between the light-emitting devices 12. The black adhesive layer 31 can be replaced with adhesive layers of other colors. Other colored adhesive layers are, for example, gray, white, etc.

[0071] In some embodiments, reference Figure 2 and Figure 3 The display substrate 1 includes a substrate 11 and a plurality of light-emitting devices 12 disposed on the substrate 11; wherein the orthogonal projection of the photosensitive unit 33 on the substrate 11 does not cover the orthogonal projection of the plurality of light-emitting devices 12 on the substrate 11.

[0072] The substrate 11 is, for example, a glass substrate. The light-emitting device 12 is, for example, a micro-LED chip (Mini-LED or Micro-LED). Existing packaging methods for micro-LEDs include molding, lamination, inkjet printing, etc. The micro-LED is transferred from the initial substrate to the substrate 11 through a transfer process.

[0073] Based on the same inventive concept, and referring to Figure 4 The embodiments of this disclosure also provide a method for manufacturing a display panel, including the following steps.

[0074] Step 101: Provide a display substrate 1, which includes a substrate 11 and a light-emitting device 12 disposed on the substrate 11.

[0075] The display substrate 1 also includes a driving circuit layer (not shown) for driving the light-emitting device 12. The driving circuit layer typically includes transistors and traces to drive the light-emitting device 12 to emit light. Traces include, for example, gate lines, data lines, power lines, and ground lines. Transistors are, for example, thin-film transistors (TFTs). Pads for receiving micro-light-emitting diodes are formed above the driving circuit layer. This disclosure does not limit the structural details of the display substrate 1; those skilled in the art can make modifications based on existing technology.

[0076] The light-emitting device 12 is, for example, a micro-light-emitting diode chip. After the micro-light-emitting diode chip is fabricated, it is transferred from the initial substrate to the substrate 11 using a transfer process. The micro-light-emitting diodes form an array, thereby enabling the display substrate to display images.

[0077] In some embodiments, the micro-LED is controlled to dip into solder, and then the solder-dipped micro-LED is fixed to a pad on a display substrate by the solder. In the embodiments of this disclosure, the cathode and anode of the micro-LED chip are both formed on the same side surface of the micro-LED chip.

[0078] Step 102: An adhesive layer 3 is formed on the display substrate 1, and the adhesive layer 3 covers the light-emitting device 12.

[0079] The adhesiveness of at least one edge of the adhesive layer 3 perpendicular to the surface of the display substrate 1 is less than that of the other parts of the adhesive layer 3.

[0080] The reduced adhesiveness at the edges of the adhesive layer 3 makes it less likely for dust and dirt to adhere to the sides of the adhesive layer 3, thereby improving the product's appearance and display effect.

[0081] In some embodiments, the surface of the adhesive layer 3 facing away from the display substrate 1 is non-adhesive. In these embodiments, the protective film 4 is an optional layer structure.

[0082] In some embodiments, the surface of the adhesive layer 3 facing away from the display substrate 1 is adhered to another structure. For example, a touch function layer is provided on the surface of the adhesive layer 3 facing away from the display substrate 1. In other embodiments, a touch function layer is provided on the surface of the display substrate 1 facing away from the adhesive layer 3.

[0083] In some embodiments, reference Figure 5 An adhesive layer 3 is formed on the display substrate 1, including the following steps.

[0084] Step 1021: An adhesive layer 3 and a protective film 4 are formed on the display substrate 1; wherein, the orthographic projection of the display substrate 1 on the protective film 4 covers part of the orthographic projection of the adhesive layer 3 on the protective film 4 and part of the protective film 4.

[0085] Specifically, refer to Figure 6a and Figure 6b The adhesive layer 3 is bonded to the protective film 4, and then the adhesive layer 3 is pressed toward the surface of the display substrate 1 to be encapsulated (the surface on which the light-emitting device 12 is formed). The material of the protective film 4 includes polyethylene terephthalate (PET).

[0086] Step 1022: Cut the adhesive layer 3 and the protective film 4 so that at least one edge of the remaining adhesive layer 3 is located inside the corresponding side edge of the display substrate 1 that is perpendicular to the surface of the display substrate 1 near the protective film 4.

[0087] refer to Figure 6c The portions of the adhesive layer 3 and the protective film 4 that extend beyond the display substrate 1 can be removed using a laser cutting process. After cutting, the corresponding edge of the display substrate 1 is exposed.

[0088] Step 1023: A photosensitive unit 33' is formed on at least one edge of the adhesive layer 3; wherein the photosensitive unit 33' is configured to reduce the adhesiveness of at least one edge of the adhesive layer 3 under the illumination of light of a preset wavelength.

[0089] refer to Figure 6d Photosensitive unit 33' is coated on at least one edge of adhesive layer 3, and then photosensitive unit 33' is illuminated to reduce its adhesiveness.

[0090] In other embodiments, reference is made to... Figure 7 An adhesive layer 3 is formed on the display substrate 1, including the following steps.

[0091] Step 1021a: An adhesive layer 3 and a protective film 4 are formed above the display substrate 1; wherein, the orthographic projection of the display substrate 1 on the protective film 4 covers part of the orthographic projection of the adhesive layer 3 on the protective film 4 and part of the protective film 4, the adhesive layer 3 is located on the side of the protective film 4 facing the display substrate 1, at least one edge of the adhesive layer 3 is a photosensitive unit 33', and at least part of the orthographic projection of the photosensitive unit 3'3 on the display substrate 1 falls within the range of the display substrate 1.

[0092] Specifically, refer to Figure 8a and Figure 8bThe adhesive layer 3 is bonded to the protective film 4, and then the adhesive layer 3 is pressed toward the surface of the display substrate 1 to be encapsulated (the surface on which the light-emitting device 12 is formed). The edge region of the adhesive layer 3 is formed by photosensitive units 33'.

[0093] Step 1022a, Reference Figure 8c The adhesive layer 3 and the protective film 4 are cut so that at least one edge of the remaining adhesive layer 3 is flush with the corresponding edge of the display substrate 1 that is perpendicular to the surface of the display substrate 1 near the protective film 4.

[0094] In subsequent steps, refer to Figure 8d The photosensitive unit 33' can be illuminated (e.g., by UV light) to reduce its viscosity.

[0095] In some embodiments, the photosensitive unit 33 is formed of a photoinitiator, which is independent of the adhesive material of the adhesive layer 3. Examples of photoinitiators include: 1173 (2-hydroxy-2-methyl-1-phenylpropanone), 907 (2-methyl-2-(4-morpholino)-1-[4-(methylthio)phenyl]-1-propanone), TPO (2,4,6-trimethylbenzoyl-diphenylphosphine oxide), TPO-L (ethyl 2,4,6-trimethylbenzoylphenylphosphonate), etc. For example, after forming the adhesive material of the adhesive layer 3, the photoinitiator is applied or sprayed onto the edge regions of the adhesive material surface of the adhesive layer 3. Subsequently, the multilayer adhesive material is laminated, or the adhesive material is laminated with the protective film 4.

[0096] In other embodiments, the photoinitiator is incorporated into the adhesive material of the adhesive layer 3. For example, after the adhesive material of the adhesive layer 3 is formed, the photoinitiator is infiltrated into the edge region of the adhesive material of the adhesive layer 3 using a permeation method.

[0097] Under specific light stimulation, the photoinitiator catalyzes the conversion of non-polyester materials in the nearby adhesive material into polyester, thereby reducing the adhesion of the edge region of the adhesive layer 3.

[0098] Based on the same inventive concept, embodiments of this disclosure also provide a display device, including the aforementioned display panel.

[0099] In this disclosure, a display device is a device or product with display functionality. Examples of display devices include display modules, monitors, tablet computers, mobile phones, electronic billboards, etc.

[0100] The various embodiments in this disclosure are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0101] The scope of protection of this disclosure is not limited to the embodiments described above. Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its scope and spirit. If such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, then the intent of this disclosure also includes such modifications and variations.

Claims

1. A display panel, characterized by, The display substrate and the adhesive layer are arranged in a stack, the display substrate comprises a substrate and light emitting devices arranged on the substrate, and the adhesive layer covers the light emitting devices; at least one side edge of the adhesive layer is provided with a light-sensitive unit configured to reduce the adhesion of the at least one side edge of the adhesive layer under irradiation of light of a preset wavelength; the orthographic projection of the light-sensitive unit on the substrate does not cover the orthographic projection of the light emitting devices on the substrate; wherein the adhesion of at least one side edge of the adhesive layer perpendicular to the surface of the display substrate is less than the adhesion of other parts of the adhesive layer. The orthographic projection of at least part of the light-sensitive unit on the display substrate falls within the range of the display substrate.

2. The display panel of claim 1, wherein, The size of the light-sensitive unit in the direction parallel to the surface of the adhesive layer close to the display substrate is 5-20 um.

3. The display panel of claim 1, wherein, The material of the light-sensitive unit comprises a photoinitiator.

4. The display panel of claim 1, wherein, The photoinitiator is incorporated in the adhesive material of the adhesive layer, or the photoinitiator is independent of the adhesive material of the adhesive layer and located on the side of the adhesive material of the adhesive layer.

5. The display panel of claim 4, wherein, The at least one side edge of the adhesive layer is flush with the display substrate.

6. The display panel of claim 1, wherein, The adhesive layer comprises a black adhesive layer and a transparent adhesive layer arranged in a stack in the direction perpendicular to the display substrate.

7. The display panel of claim 1, wherein, The display panel further comprises a protective film arranged on the side of the adhesive layer away from the display substrate.

8. The display panel of claim 1, wherein, The display substrate is provided, which comprises a substrate and light emitting devices arranged on the substrate; 9. A method for manufacturing a display panel, characterized by, An adhesive layer is formed above the display substrate, which covers the light emitting devices; A light-sensitive unit is formed at at least one side edge of the adhesive layer, which is configured to reduce the adhesion of the at least one side edge of the adhesive layer under irradiation of light of a preset wavelength; the orthographic projection of the light-sensitive unit on the substrate does not cover the orthographic projection of the light emitting devices on the substrate; wherein the adhesion of at least one side edge of the adhesive layer perpendicular to the surface of the display substrate is less than the adhesion of other parts of the adhesive layer. The adhesive layer is formed above the display substrate, comprising the following steps: An adhesive layer and a protective film are formed above the display substrate; wherein the orthographic projection of the display substrate on the protective film covers part of the orthographic projection of the adhesive layer on the protective film and part of the protective film; 10. The preparation method according to claim 9, characterized in that, The adhesive layer and the protective film are cut, so that the at least one side edge of the remaining adhesive layer is located inside the corresponding side edge of the display substrate perpendicular to the surface of the display substrate close to the protective film. The adhesive layer is formed above the display substrate, comprising the following steps: An adhesive layer and a protective film are formed above the display substrate; wherein the orthographic projection of the display substrate on the protective film covers part of the orthographic projection of the adhesive layer on the protective film and part of the protective film, the adhesive layer is located on the side of the protective film facing the display substrate, and at least one side edge of the adhesive layer is a light-sensitive unit, and the orthographic projection of at least part of the light-sensitive unit on the display substrate falls within the range of the display substrate.

11. The preparation method according to claim 9, characterized in that, ​ ​ The adhesive layer and the protective film are cut so that the at least one side edge of the remaining adhesive layer is flush with a corresponding side edge of a surface of the protective film that is perpendicular to the display substrate.

12. A display device, characterized by comprising: A display panel comprising the display panel according to any one of claims 1 to 8.

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