An integrated micro high and low frequency loudspeaker and its implementation method

Abstract

The present invention discloses an integrated micro high and low frequency loudspeaker, which comprises a bass chassis. Inside the bass chassis, there is a U-shaped iron. Inside above the U-shaped iron, there is a bass magnetic circuit driving structure. Above the bass chassis, there is a bass diaphragm. On the bass diaphragm, there is a bass voice coil. Inside below the U-shaped iron, there is a treble magnetic circuit driving structure. And below the U-shaped iron, there is also connected a treble chassis. On the treble chassis, there is a treble diaphragm. On the treble diaphragm, there is a treble voice coil. The present invention also discloses a method for realizing the integrated micro high and low frequency loudspeaker. The present invention adopts the combination of high and low frequencies, which can take into account both low frequency and high frequency in a limited structural space, increase the frequency bandwidth, and meet the requirements of higher acoustic performance. In the present invention, the magnetic circuit driving structures of the bass part and the treble part share the U-shaped iron. Through the embedded combination, the height space is saved, and the magnetic energy of the magnet is made to be shared, thereby improving the utilization rate of magnetic energy.

Description

Technical Field

[0001] The present invention belongs to the technical field of loudspeakers, and in particular relates to an integrated micro high and low frequency loudspeaker and an implementation method thereof. Background Art

[0002] In recent years, wearable devices have developed rapidly. Due to the requirements of structural size, various wearable appearance structures determine the size of internal units. In addition, according to the application scenarios of wearable devices, the performance requirements of internal components will also tend to vary. For example, the speakers in the temples of smart glasses are long and narrow, and acoustically require a wider bandwidth.

[0003] The existing speakers have the following problems during application:

[0004] 1. In order to obtain higher magnetic energy drive, the length of the voice coil is generally made longer in the single voice coil design. However, due to the narrow and long structure, the voice coil is easily deformed in the width direction, resulting in low yield of finished products or sacrificing acoustic performance to increase the magnetic gap to avoid voice coil deformation.

[0005] 2. The matching long strip magnet (NdFeB) is easy to break during the operation or turnover process;

[0006] 3. The utilization rate of magnetic energy is relatively low;

[0007] 4. The area of a single sound diaphragm is smaller than that of a double-sided sound diaphragm, the utilization rate of the effective vibration area is small, and the acoustic performance is relatively low;

[0008] 5. It cannot meet customers’ needs for a wider frequency band and cannot take into account both high and low frequency acoustic performance;

[0009] 6. Single magnetic circuit drive has poor force balance and is more prone to polarization, especially in the low F0 frequency band. Summary of the Invention

[0010] The present invention aims to provide an integrated micro-woofer / treble speaker to address the problems raised in the above-mentioned background art. The integrated micro-woofer / treble speaker provided by the present invention has the characteristics of being able to take into account both low and high frequencies within a limited structural space, increase the bandwidth, and meet higher acoustic performance requirements.

[0011] Another object of the present invention is to provide a method for realizing an integrated miniature high and low frequency loudspeaker.

[0012] To achieve the above object, the present invention provides the following technical solutions: An integrated micro high and low frequency loudspeaker, including a bass chassis, an inner part of the bass chassis is provided with a U-shaped iron, an inner part above the U-shaped iron is provided with a bass magnetic circuit driving structure, a bass diaphragm is provided above the bass chassis, a bass voice coil corresponding to the bass magnetic circuit driving structure is provided on the bass diaphragm, an inner part below the U-shaped iron is provided with a treble magnetic circuit driving structure, and a treble chassis is further connected below the U-shaped iron, a treble diaphragm is provided on the treble chassis, and a treble voice coil corresponding to the treble magnetic circuit driving structure is provided on the treble diaphragm.

[0013] In order to save height space and make the magnetic energy of the magnet shared, and improve the utilization rate of magnetic energy. Further, a first groove is provided at the middle position below the U-shaped iron, and second grooves are respectively provided at both ends above the U-shaped iron, and the two second grooves are symmetrically arranged on both sides of the first groove.

[0014] In order to generate a magnetic field and interact with the magnetic field generated by the energization of the bass voice coil to drive the vibration of the bass diaphragm. Further, the bass magnetic circuit driving structure includes a bass magnet and a bass washer, wherein the bass magnet is arranged in the second groove, and the bass washer is arranged above the bass magnet.

[0015] In order to generate a magnetic field and interact with the magnetic field generated by the energization of the treble voice coil to drive the vibration of the treble diaphragm. Further, the treble magnetic circuit driving structure includes a treble magnet and a treble washer, wherein the treble magnet is arranged in the first groove, and the treble washer is arranged at the bottom of the treble magnet.

[0016] In order to connect with an external audio signal. Further, it further includes a bass pad, the bass pad is arranged on the bass chassis, and the bass voice coil is welded on the bass pad.

[0017] In order to filter the high frequency of the bass part. Further, a chip inductor is provided on the bass pad.

[0018] In order to connect with an external audio signal. Further, it further includes a treble pad, the treble pad is arranged on the treble chassis, and the treble voice coil is welded on the treble pad.

[0019] In order to filter the low frequency of the treble part and avoid the noise and abnormal sound caused by the large amplitude of the low frequency in the treble part. Further, a chip capacitor is provided on the treble pad.

[0020] In order to perfectly synchronously input the audio signal into the high and low frequency parts. Further, the bass pad and the treble pad are connected in parallel.

[0021] In the present invention, further, a method for implementing the above-mentioned integrated micro high and low frequency loudspeaker includes the following steps:

[0022] (1). There is a first groove in the middle position below the U-shaped iron, and second grooves are respectively provided at both ends above the U-shaped iron. The two second grooves are symmetrically arranged on both sides of the first groove;

[0023] (2). The U-shaped iron is arranged inside the bass speaker frame. Bass magnetic circuit driving structures are respectively arranged inside the two second grooves. Two bass voice coils are arranged at positions corresponding to the bass magnetic circuit driving structures on the bass speaker membrane. The leads of the two bass voice coils are welded through bass pads to form a series or parallel connection;

[0024] (3). A high - frequency magnetic circuit driving structure is arranged inside the first groove. The high - frequency speaker membrane is installed at the bottom of the U-shaped iron through a high - frequency speaker frame. A high - frequency voice coil is arranged at a position corresponding to the high - frequency magnetic circuit driving structure on the high - frequency speaker membrane. The lead of the high - frequency voice coil is welded to the high - frequency pad;

[0025] (4). The bass pad and the high - frequency pad are connected in parallel.

[0026] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0027] 1. The present invention adopts a combination of high and low frequencies, which can balance low - frequency and high - frequency in a limited structural space, increase the frequency bandwidth, and meet higher acoustic performance requirements;

[0028] 2. The magnetic circuit driving structures of the bass part and the high - frequency part of the present invention share the U-shaped iron. Through an embedded combination, the height space is saved, and the magnetic energy of the magnet is shared. The magnets of the bass and the high - frequency are mutually the main and auxiliary magnetic structures, improving the utilization rate of magnetic energy;

[0029] 3. The bass part of the present invention adopts a double - voice - coil and double - magnetic - circuit drive, which can not only make greater use of magnetic energy performance, but also avoid the hidden dangers that the long strip magnet is easy to break and the voice coil is easy to deform under a narrow and long structure, and can also balance the vibration in the low - frequency band;

[0030] 4. The high - frequency part of the present invention adopts a single - voice - coil and single - magnetic drive, and a small speaker membrane structure, which is beneficial to avoiding the splitting vibration that is likely to occur in the high - frequency range and improving the high - frequency ductility;

[0031] 5. The bass part of the present invention can choose to perform low - pass filtering or not, and can be flexibly adjusted according to the application scenario;

[0032] 6. The present invention performs high - pass filtering on the low - frequency of the high - frequency part through a patch capacitor, which can avoid the noise and abnormal sound caused by the large low - frequency amplitude in the high - frequency part;

[0033] 7. The bass voice coil and the high - frequency voice coil of the present invention are connected in parallel through their respective pads, and the audio signal is perfectly synchronously input into the high - and low - frequency parts. Description of the Drawings

[0034] Figure 1Explosion structure diagram of the present invention;

[0035] Figure 2 Cross-sectional structure diagram of the present invention;

[0036] Figure 3 Structure diagram of the U-shaped iron of the present invention;

[0037] Figure 4 Structure diagram of another embodiment of the U-shaped iron of the present invention;

[0038] Figure 5 Structure diagram of the bass chassis of the present invention;

[0039] Figure 6 Cross-sectional structure diagram of the present invention after being assembled with the box body.

[0040] In the figure: 1, bass diaphragm; 2, bass pad; 3, bass voice coil; 4, bass chassis; 41, sound outlet hole; 5, U-shaped iron; 51, first groove; 52, second groove; 53, through groove; 54, baffle; 6, high-frequency magnet; 7, high-frequency washer; 8, high-frequency voice coil; 9, high-frequency pad; 10, high-frequency diaphragm; 11, high-frequency chassis; 12, low-frequency magnet; 13, low-frequency washer; 14, upper cover of the box body; 15, lower cover of the box body. Detailed implementation manners

[0041] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0042] Embodiment 1

[0043] Please refer to Figures 1-6 , the present invention provides the following technical solutions: An integrated micro high and low frequency loudspeaker, including a bass chassis 4, a U-shaped iron 5 is adhesively bonded inside the bass chassis 4, a bass magnetic circuit driving structure is provided inside above the U-shaped iron 5, a bass diaphragm 1 is adhesively bonded above the bass chassis 4, a bass voice coil 3 corresponding to the bass magnetic circuit driving structure is provided on the bass diaphragm 1, a high-frequency magnetic circuit driving structure is provided inside below the U-shaped iron 5, and a high-frequency chassis 11 is further adhesively bonded below the U-shaped iron 5, a high-frequency diaphragm 10 is adhesively bonded on the high-frequency chassis 11, and a high-frequency voice coil 8 corresponding to the high-frequency magnetic circuit driving structure is provided on the high-frequency diaphragm 10.

[0044] By adopting the above technical solutions, by using the combination of high and low frequencies, it is possible to balance low frequencies and high frequencies in a limited structural space, increase the frequency bandwidth, and meet higher acoustic performance requirements.

[0045] Specifically, a first groove 51 is provided at the middle position below the U-shaped iron 5, and second grooves 52 are provided at both ends above the U-shaped iron 5. The two second grooves 52 are symmetrically arranged on both sides of the first groove 51. The first groove 51 is used to accommodate the high-frequency magnetic circuit driving structure, and the second grooves 52 are used to accommodate the low-frequency magnetic circuit driving structure. There are two low-frequency voice coils 3 in total, and the two low-frequency voice coils 3 are connected in series or in parallel. In this embodiment, parallel connection is preferably used.

[0046] By adopting the above technical solution, the magnetic circuit driving structures of the low-frequency part and the high-frequency part share the U-shaped iron 5. Through embedded combination, the height space is saved, and the magnetic energy of the magnet is shared, improving the utilization rate of magnetic energy.

[0047] The low-frequency part adopts a double voice coil and double magnetic circuit drive, which can not only make greater use of the magnetic energy performance, but also avoid the hidden dangers of the long strip magnet being easily broken and the voice coil being easily deformed under the narrow and long structure, and can also balance the vibration in the low-frequency band.

[0048] The high-frequency part adopts a single voice coil and single magnetic drive, and a small diaphragm structure, which is beneficial to avoiding the splitting vibration that easily occurs at high frequencies and improving the high-frequency ductility.

[0049] Specifically, the low-frequency magnetic circuit driving structure includes a low-frequency magnet 12 and a low-frequency washer 13. Among them, the low-frequency magnet 12 is bonded in the second groove 52, and the low-frequency washer 13 is bonded above the low-frequency magnet 12.

[0050] By adopting the above technical solution, it is used to generate a magnetic field, which interacts with the magnetic field generated by the energization of the low-frequency voice coil 3 to drive the low-frequency diaphragm 1 to vibrate.

[0051] Specifically, the high-frequency magnetic circuit driving structure includes a high-frequency magnet 6 and a high-frequency washer 7. Among them, the high-frequency magnet 6 is arranged in the first groove 51, and the high-frequency washer 7 is arranged at the bottom of the high-frequency magnet 6.

[0052] By adopting the above technical solution, it is used to generate a magnetic field, which interacts with the magnetic field generated by the energization of the high-frequency voice coil 8 to drive the high-frequency diaphragm 10 to vibrate.

[0053] Specifically, it further includes a low-frequency pad 2. The low-frequency pad 2 is embedded and injection-molded inside and on the surface of the low-frequency chassis 4, and the lead wire of the low-frequency voice coil 3 is welded to the low-frequency pad 2.

[0054] By adopting the above technical solution, the low-frequency voice coil 3 is connected to an external audio signal through the low-frequency pad 2.

[0055] Specifically, it further includes a high-frequency pad 9. The high-frequency pad 9 is embedded and injection-molded inside and on the surface of the high-frequency chassis 11, and the lead wire of the high-frequency voice coil 8 is welded to the high-frequency pad 9.

[0056] By adopting the above technical solution, the treble voice coil 8 is connected to an external audio signal through the treble pad 9.

[0057] Embodiment 2

[0058] The difference between this embodiment and Embodiment 1 is that specifically, a chip inductor is provided on the bass pad 2, and the chip inductor is connected in series with the bass pad 2.

[0059] By adopting the above technical solution, the chip inductor performs low-pass filtering on the high-frequency part of the bass, which can filter out the interference signals in the high-frequency part and make the acoustic frequency response curve of the high-frequency part relatively flat.

[0060] Specifically, a chip capacitor is provided on the treble pad 9, and the chip capacitor is connected in series with the treble pad 9.

[0061] By adopting the above technical solution, the chip capacitor performs high-pass filtering on the low-frequency part of the treble, which can avoid the noise and abnormal sound caused by the large amplitude of the low-frequency (invalid) part in the treble.

[0062] Embodiment 3

[0063] The difference between this embodiment and Embodiment 1 is that specifically, the bass voice coil 3 and the treble voice coil 8 are connected in parallel through their respective pads. <U+

[0064] By adopting the above technical solution, the audio signal is perfectly synchronously input into the bass and treble parts.

[0065] Embodiment 4

[0066] The difference between this embodiment and Embodiment 1 is that specifically, symmetrical baffles 54 are provided on both sides of the first groove 51.

[0067] By adopting the above technical solution, the magnetic performance can be increased through the setting of the baffle 54. [[ID=D+

[0068] Embodiment 5

[0069] The difference between this embodiment and Embodiment 1 is that specifically, through holes 53 are provided at the four corners of the first groove 51 and the second groove 52, and sound holes 41 are provided at both ends of the bass chassis 4.

[0070] By adopting the above technical solution, a rear cavity is formed between the upper cover 14 and the lower cover 15 of the box body. The treble and bass share the rear cavity, and the rear cavity emits sound through both sides of the long axis. The assembly method of the whole machine is fully considered. The back of the double sound membranes emits sound through both sides of the long axis, which matches the characteristic of the longer dimension of the long side of the whole machine and is beneficial to the assembly of the speaker unit with the box body in the whole machine.

[0071] Specifically, a mounting step is formed between the surface of the treble diaphragm 10 and the U-shaped iron 5.

[0072] By adopting the above technical solution, it is beneficial to the sealing of the rear cavity on the whole machine and reduces the assembly difficulty of the product. The high-frequency structure is assembled into the cavity structure of the whole machine by the part of the high-frequency basin frame protruding from the U-shaped iron, and is sealed by gluing or foam, achieving the effect of isolating the common rear cavity from the high-frequency front cavity.

[0073] Embodiment 6

[0074] Furthermore, a method for realizing an integrated micro high-low frequency loudspeaker according to the present invention includes the following steps:

[0075] (1). A first groove 51 is provided at the middle position below the U-shaped iron 5, and second grooves 52 are respectively provided at both ends above the U-shaped iron 5, and the two second grooves 52 are symmetrically arranged on both sides of the first groove 51;

[0076] (2). The U-shaped iron 5 is arranged inside the low-frequency basin frame 4, and low-frequency magnetic circuit driving structures are respectively arranged inside the two second grooves 52, and two low-frequency voice coils 3 are arranged on the low-frequency diaphragm 1 at positions corresponding to the low-frequency magnetic circuit driving structures, and the leads of the two low-frequency voice coils 3 are welded through the low-frequency pads 2 to form a series or parallel connection;

[0077] (3). A high-frequency magnetic circuit driving structure is arranged inside the first groove 51, the high-frequency diaphragm 10 is installed at the bottom of the U-shaped iron 5 through the high-frequency basin frame 11, the high-frequency voice coil 8 is arranged on the high-frequency diaphragm 10 at a position corresponding to the high-frequency magnetic circuit driving structure, and the lead of the high-frequency voice coil 8 is welded to the high-frequency pad 9;

[0078] (4). The low-frequency pad 2 and the high-frequency pad 9 are connected in parallel.

[0079] In summary, the present invention adopts a high-low frequency combination method, which can take into account low frequency and high frequency in a limited structural space, increase the frequency bandwidth, and meet higher acoustic performance requirements; the magnetic circuit driving structures of the low-frequency part and the high-frequency part of the present invention share the U-shaped iron 5, and through an embedded combination, the height space is saved, and the magnetic energy of the magnet is shared. The magnets of the low-frequency and high-frequency parts are mutually the main and auxiliary magnetic structures, improving the utilization rate of magnetic energy; the low-frequency part of the present invention adopts a double voice coil and double magnetic circuit drive, which can not only make greater use of the magnetic energy performance, but also avoid the hidden dangers of the long strip magnet being easily broken and the voice coil being easily deformed in a narrow and long structure, and can also take into account the vibration balance in the low-frequency band; the high-frequency part of the present invention adopts a single voice coil and single magnetic drive, and a small diaphragm structure, which is beneficial to avoiding the splitting vibration that easily occurs in the high frequency and improving the high-frequency ductility; the low-frequency part of the present invention can choose to do low-pass filtering or not do filtering, and can be flexibly adjusted according to the application scenario; the present invention uses a patch capacitor to perform high-pass filtering on the low frequency of the high-frequency part, which can avoid the noise and abnormal sound caused by the large low-frequency amplitude in the high-frequency part; the low-frequency voice coil 3 and the high-frequency voice coil 8 of the present invention are connected in parallel through their respective pads, and the audio signal is perfectly synchronously input into the high-low frequency parts.

[0080] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art will appreciate that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated miniature high and low frequency loudspeaker, characterized by: The woofer comprises a bass basin frame, a U-iron is provided inside the woofer basin frame, a bass magnetic circuit driving structure is provided inside the upper portion of the U-iron, a bass diaphragm is provided above the woofer basin frame, a bass voice coil corresponding to the bass magnetic circuit driving structure is provided on the bass diaphragm, a treble magnetic circuit driving structure is provided inside the lower portion of the U-iron, and a treble basin frame is further connected below the U-iron, a treble diaphragm is provided on the treble basin frame, and a treble voice coil corresponding to the treble magnetic circuit driving structure is provided on the treble diaphragm; A first groove is provided in the middle position below the U iron, and a second groove is provided at both ends above the U iron. The two second grooves are symmetrically arranged on both sides of the first groove. The bass magnetic circuit driving structure includes a bass magnet and a bass washer. The bass magnet is arranged in the second groove, and the bass washer is arranged above the bass magnet. The bass part adopts a dual voice coil and dual magnetic circuit drive; symmetrical baffles are provided on both sides of the first groove; A bass magnetic circuit driving structure is respectively arranged inside the two second grooves, and two bass voice coils are arranged on the bass sound membrane at positions corresponding to the bass magnetic circuit driving structures.

2. The integrated micro high and low frequency loudspeaker according to claim 1, characterized in that: The tweeter magnetic circuit driving structure includes a tweeter magnet and a tweeter washer, wherein the tweeter magnet is arranged in the first groove and the tweeter washer is arranged at the bottom of the tweeter magnet.

3. The integrated micro high and low frequency loudspeaker according to claim 1, characterized in that: The utility model also comprises a bass soldering pad, which is arranged on the bass basin frame, and the bass voice coil is welded on the bass soldering pad.

4. The integrated micro high and low frequency loudspeaker according to claim 3, characterized in that: A chip inductor is provided on the bass pad.

5. The integrated micro high and low frequency loudspeaker according to claim 3, characterized in that: The utility model also comprises a treble soldering pad, which is arranged on the treble basin frame, and the treble voice coil is welded on the treble soldering pad.

6. The integrated micro high and low frequency loudspeaker according to claim 5, characterized in that: A chip capacitor is provided on the tweeter pad.

7. The integrated micro high and low frequency loudspeaker according to claim 5, characterized in that: The bass pad is connected in parallel with the treble pad.

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