Heat peak suppression device

Abstract

A heat peak suppression device includes a heat dissipation fin group, a heat sink, a fin array frame, a filling gas, a thermal phase change material and a capillary tube. The heat sink is thermally coupled to the heat dissipation fin group, and has a closed chamber therein. The fin array frame is located in the cold zone of the closed chamber and is fixedly connected to a heat conductive block. The filling gas is located in the cold zone. The thermal phase change material is located in the hot zone of the closed chamber. The capillary tube is located in the cold zone and the hot zone of the closed chamber, and is used to deliver the liquid thermal phase change material to the cold zone of the closed chamber. Through the above structure, the heat peak suppression device can provide a thermal buffer function when a semiconductor element emits high heat energy, effectively suppress the high heat energy, thereby improving the heat dissipation efficiency and reducing the chance of damage to the semiconductor element.

Description

Technical Field

[0001] The invention relates to a heat dissipation device, and in particular to a heat peak suppression device. Background Art

[0002] As cloud services become more and more popular, high-performance semiconductor chips have emerged in the electronics industry. These semiconductor chips are also accompanied by higher and higher heat generation. Therefore, appropriate heat dissipation methods are needed to effectively dissipate the heat.

[0003] Generally speaking, when a semiconductor chip (hereinafter referred to as a device under test, DUT) is debugged, the device under test is electrically connected to perform the debugging operation. However, during the debugging process, a high-performance semiconductor chip will quickly generate a lot of heat energy, and the heat dissipation efficiency of the heat dissipation means is limited, so the device under test may be overheated and damaged, and even affect the debugging results.

[0004] Therefore, how to effectively solve the above-mentioned inconveniences and defects is one of the current important research and development topics, and has also become a goal that needs to be improved in the current related fields. Summary of the invention

[0005] To this end, the present invention proposes a heat peak suppression device to solve the difficulties mentioned in the above prior art.

[0006] One embodiment of the present invention provides a heat peak suppression device. The heat peak suppression device includes a heat sink fin group, a heat sink, a fin array frame, a filling gas, a thermal phase change material and a capillary conduit. The heat sink has a heat conduction block and a closed chamber. The heat conduction block is thermally coupled to the heat sink fin group. The closed chamber is airtightly formed in the heat conduction block and is divided into a hot zone and a cold zone. The thermal phase change material is located in the hot zone of the closed chamber and is used to perform phase conversion between liquid and solid by absorbing and releasing heat energy. The filling gas is located in the cold zone of the closed chamber, and the specific heat capacity of the filling gas is 2000-6000 joules / kilogram·Kelvin (J / (kg·K). The fin array frame is located in the cold zone of the closed chamber and is fixedly connected to the heat conductive block. The capillary tube has a first end and a second end opposite to each other. The first end and the second end are respectively located in the cold zone and the hot zone of the closed chamber. In this way, when the thermal phase change material is converted into a liquid state, the capillary tube delivers the thermal phase change material to the cold zone of the closed chamber.

[0007] According to one or more embodiments of the present invention, in the above-mentioned heat peak suppression device, the capillary conduit has a plurality of capillary channels arranged in parallel with each other, and two opposite ends of each capillary channel face the fin array frame and the thermal phase change material respectively.

[0008] According to one or more embodiments of the present invention, in the above-mentioned heat peak suppression device, there is a gap between the first end of the capillary tube and the fin array frame. When the thermal phase change material is converted into a solid state in the cold zone of the closed chamber, the thermal phase change material falls from the first end of the capillary tube through the gap to the hot zone of the closed chamber.

[0009] According to one or more embodiments of the present invention, in the above-mentioned heat peak suppression device, the heat sink has a guide slope, which is used to guide the thermal phase change material to the second end of the capillary tube.

[0010] According to one or more embodiments of the present invention, in the above-mentioned heat peak suppression device, the cross section of the capillary conduit is a honeycomb porous cross section.

[0011] According to one or more embodiments of the present invention, the heat peak suppression device further comprises a vibrator connected to the heat sink to generate vibration to the heat sink and the capillary tube, wherein the capillary tube is fixedly connected to the inner wall of the closed chamber.

[0012] According to one or more embodiments of the present invention, in the above-mentioned heat peak suppression device, the vibrator includes an ultrasonic piezoelectric ceramic sheet and a driver. The ultrasonic piezoelectric ceramic sheet is directly connected to the surface of the heat conductive block to generate ultrasonic waves to the capillary conduit. The driver is electrically connected to the ultrasonic piezoelectric ceramic sheet to drive the ultrasonic piezoelectric ceramic sheet to work.

[0013] According to one or more embodiments of the present invention, the above-mentioned heat peak suppression device further includes a temperature detection unit and a temperature switch. The temperature detection unit is located on a side of the heat conductive block opposite to the heat dissipation fin group, and is used to detect the temperature of the heat conductive block. The temperature switch is electrically connected to the vibrator and the temperature detection unit, and is used to activate the vibrator. When the temperature detection unit detects that the temperature of the heat conductive block reaches a threshold value, the temperature switch activates the vibrator in response to the detection result of the temperature detection unit.

[0014] According to one or more embodiments of the present invention, the heat peak suppression device further comprises a heat dissipation fan connected to the heat dissipation fin assembly to guide airflow to the heat dissipation fin assembly.

[0015] According to one or more embodiments of the present invention, in the above-mentioned heat peak suppression device, the filling gas is one of ammonia and helium.

[0016] According to one or more embodiments of the present invention, in the above-mentioned heat peak suppression device, the thermal phase change material is one of paraffin and fatty acid.

[0017] Thus, through the above-described structures of the embodiments, the present invention can provide a thermal buffer function when the semiconductor chip generates high heat energy, thereby effectively suppressing the high heat energy of the semiconductor chip, thereby improving the heat dissipation performance and reducing the chance of the semiconductor chip being damaged due to overheating.

[0018] The above description is only used to illustrate the problems to be solved by the present invention, the technical means to solve the problems, and the effects produced, etc. The specific details of the present invention will be described in detail in the following implementation methods and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:

[0020] Figure 1 A schematic diagram of a heat peak suppression device according to an embodiment of the present invention;

[0021] Figure 2 for Figure 1 Operation diagram of a heat peak suppression device;

[0022] Figure 3 is a schematic diagram of a heat peak suppression device according to an embodiment of the present invention; and

[0023] Figure 4 FIG. 4 is a schematic cross-sectional view of a capillary conduit according to an embodiment of the present invention.

[0024]

Explanation of symbols

[0025] 10, 11: Heat peak suppression device

[0026] 100: cooling fins group

[0027] 110: Fins

[0028] 120: Heat pipe

[0029] 130: Air Gap

[0030] 200: Radiator

[0031] 210: Heat conduction block

[0032] 211: first side wall

[0033] 212: Second side wall

[0034] 213: Outer wall

[0035] 220: Closed chamber

[0036] 221: Hot Zone

[0037] 222: Cold Zone

[0038] 230: Bump

[0039] 240: Gap

[0040] 250: Guide slope

[0041] 260: Bracket

[0042] 300: Fin array rack

[0043] 310:Metal sheet

[0044] 320: Gap

[0045] 400: Filling gas

[0046] 500: Thermal phase change material

[0047] 600: Capillary catheter

[0048] 610: First End

[0049] 620: Second end

[0050] 630: Honeycomb porous section

[0051] 640: Capillary channel

[0052] 700: Cooling fan

[0053] 800: Vibrator

[0054] 810: Ultrasonic piezoelectric ceramics

[0055] 820:Driver

[0056] 830: Temperature detection unit

[0057] 840: Temperature switch

[0058] 900: Heat source

[0059] X, Z: axis DETAILED DESCRIPTION

[0060] The following will disclose multiple embodiments of the present invention with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, those skilled in the art should understand that in some embodiments of the present invention, these practical details are not necessary and therefore should not be used to limit the present invention. In addition, in order to simplify the drawings, some known and commonly used structures and components will be illustrated in a simple schematic manner in the drawings. In addition, for the convenience of readers, the sizes of the components in the drawings are not drawn according to the actual scale.

[0061] Figure 1 FIG. 1 is a schematic diagram of a heat peak suppression device 10 according to an embodiment of the present invention. Figure 1As shown, the heat peak suppression device 10 includes a heat dissipation fin group 100, a heat sink 200, a fin array frame 300, a filling gas 400, a thermal phase change material 500 and a capillary tube 600. The heat sink 200 has a heat conductive block 210 and a closed chamber 220. The heat conductive block 210 is thermally coupled to the heat dissipation fin group 100. More specifically, the heat conductive block 210 has a first side wall 211 and a second side wall 212 opposite to each other, the first side wall 211 of the heat conductive block 210 is directly connected to the heat dissipation fin group 100, and the second side wall 212 of the heat conductive block 210 is directly connected to a heat source 900 (for example, a semiconductor element). The closed chamber 220 is located inside the heat conductive block 210, and the closed chamber 220 is divided into a cold zone 222 and a hot zone 221 along a gravity direction (such as the Z axis), and the cold zone 222 and the hot zone 221 are connected to each other, and there is no obvious dividing line between the cold zone 222 and the hot zone 221. It should be understood that the hot zone 221 is closer to the heat source 900 than the cold zone 222, and the cold zone 222 is closer to the heat sink fin group 100, so the temperature of the cold zone 222 is lower than the temperature of the hot zone 221. The thermal phase change material 500 is located in the hot zone 221 of the closed chamber 220, and is used to perform phase conversion between liquid and solid by absorbing and releasing heat energy. Most of the solid thermal phase change material 500 is located in the hot zone 221 of the closed chamber 220. Most of the filling gas 400 is located in the cold zone 222 of the closed chamber 220, and the fin array frame 300 is located in the cold zone 222 of the closed chamber 220 and fixedly connected to the inner wall of the heat conductive block 210. The capillary tube 600 is placed in the closed chamber 220 and is arranged in the closed chamber 220 along the gravity direction (such as the Z axis). The closed chamber 220 is formed airtightly in the heat conductive block 210. In other words, the filling gas 400 in the closed chamber 220 cannot overflow from the closed chamber 220 to the outside of the heat conductive block 210.

[0062] In this embodiment, the material of the heat conductive block 210 is metal or alloy, such as copper or aluminum. However, the present invention is not limited to this. In other embodiments, the material of the heat conductive block 210 may also be a non-metal with high thermal conductivity. In this way, the heat conductive block 210 can quickly conduct the heat energy of the semiconductor element to the heat sink fin group 100, and then quickly take the heat away from the semiconductor element. A protrusion 230 is provided on the inner wall of the closed chamber 220 close to the heat source 900. The protrusion 230 is integrally formed with the heat conductive block 210 and has the same material as the heat conductive block 210. The thermal phase change material 500 is directly placed on the top surface of the protrusion 230, so that the thermal phase change material 500 can directly absorb the heat energy of the heat source 900 from the protrusion 230.

[0063] In this embodiment, for example but not limited thereto, the thermal conductivity of the filling gas 400 is between 0.11 and 0.998 W / (m·°C), which means that the thermal conductivity ratio of the filling gas 400 to the atmospheric air is between 5 and 7. For example but not limited thereto, the filling gas 400 is ammonia or helium. The thermal conductivity of helium is 0.11680 W / (m·°C), which means that the thermal conductivity ratio of the helium to the atmospheric air is 6.18. In addition, the specific heat capacity of the filling gas 400 is 2000 to 6000 J / (kg·K). For example, the specific heat capacity of helium is 5190 J / (kg·K). The specific heat capacity of ammonia is 2055 J / (kg·K). It should be understood that a person with ordinary knowledge in the technical field of the present invention may consider choosing to use ammonia or helium as the above-mentioned filling gas 400.

[0064] The thermal phase change material 500 (PCM) stores its latent heat when its phase changes. Therefore, the phase change of the thermal phase change material 500 can be solid-liquid, liquid-gas or solid-liquid. For example, the thermal phase change material 500 is paraffin or fatty acid. However, the present invention is not limited to this. The thermal phase change material 500 takes paraffin as an example. Paraffin is a high specific heat material with a specific heat of 2200 (J / Kg.K). When paraffin is solid, it needs to absorb a large amount of heat energy before it can be converted into a liquid state to serve as a buffer heat absorption pool during a thermal plateau period. Because the melting point of paraffin is 64°C, when the heat energy of the heat source 900 has not reached 64°C, the heat energy of the heat source 900 can be directly transferred to the heat sink fin group 100 through the heat conductive block 210. On the contrary, when the heat energy of the heat source 900 reaches 64°C, the paraffin begins to absorb heat energy so as to gradually convert it into a liquid state to handle the heat energy during the thermal plateau period.

[0065] The capillary tube 600 spans the cold zone 222 and the hot zone 221 of the closed chamber 220. More specifically, the capillary tube 600 has a first end 610 and a second end 620 opposite to each other. The first end 610 and the second end 620 of the capillary tube 600 are respectively located in the cold zone 222 and the hot zone 221 of the closed chamber 220. Further, but the present invention is not limited thereto, the capillary tube 600 is bent, so that the first end 610 of the capillary tube 600 extends in a horizontal direction (such as the X-axis) and faces the fin array frame 300, and is separated from the fin array frame 300 by a specific gap 240, and the second end 620 of the capillary tube 600 extends in a horizontal direction (such as the X-axis) and faces the thermal phase change material 500. In this embodiment, since the inner wall of the capillary tube 600 is provided with a capillary (not shown in the figure), the capillary tube 600 can transport the liquid thermal phase change material 500. For example, the capillary conduit 600 is an aluminum tube or a copper tube. However, the present invention is not limited thereto.

[0066] More specifically, the heat sink fin assembly 100 includes a plurality of fin members 110 and heat pipes 120. However, the present invention is not limited thereto. These fin members 110 are parallel to each other and spaced apart along the direction of gravity (such as the Z axis), and these heat pipes 120 are parallel to each other and spaced apart along the horizontal direction (such as the X axis). The long axis direction of each heat pipe 120 is parallel to the direction of gravity (such as the Z axis), and each heat pipe 120 passes through all the fin members 110 and is thermally connected to the heat conductive block 210. In addition, the heat conductive block 210 also has a plurality of brackets 260, which are respectively located on the outer side walls 213 of the heat conductive block 210 and are obliquely connected to one of the heat pipes 120 to increase the path for transferring heat energy.

[0067] The fin array frame 300 is composed of a plurality of metal sheets 310 in an array manner, and there is a gap 320 between any two adjacent metal sheets 310. The gaps 320 of the fin array frame 300 accommodate part of the filling gas 400, so that heat energy can be transferred to the heat dissipation fin assembly 100 through the filling gas 400 and the metal sheets 310.

[0068] Furthermore, the heat peak suppression device 10 further includes a heat dissipation fan 700. The heat dissipation fan 700 is connected to the heat dissipation fin assembly 100 to guide airflow to the heat dissipation fin assembly 100. More specifically, in this embodiment, the heat dissipation fan 700 is placed on the same side of the heat dissipation fin assembly 100, and can generate or guide airflow into the air gap 130 between the fin member 110 and the heat pipe 120, thereby taking heat away from the heat dissipation fin assembly 100.

[0069] Figure 2 for Figure 1 The operation diagram of the heat peak suppression device 10 is shown in FIG. Figure 2As shown, when the heat source 900 starts to generate heat energy and the heat energy of the heat source 900 has not yet reached a threshold value (for example, 64°C), the heat energy of the heat source 900 can be directly transferred to the heat sink fin group 100 through the heat conductive block 210, and then be taken away from the heat sink fin group 100. At this time, the thermal phase change material 500 is still in a solid state.

[0070] On the contrary, when the heat energy of the heat source 900 rises to the threshold value (e.g., 64° C.), the thermal phase change material 500 gradually changes to a liquid state because it begins to absorb heat energy, so that the thermal phase change material 500 accumulates into a heat absorption pool in the hot zone 221. Then, due to the capillary phenomenon, the liquid 501 of the thermal phase change material 500 begins to penetrate into the capillary tube 600 from the second end 620 of the capillary tube 600, and is guided to the first end 610 of the capillary tube 600 in the capillary tube 600.

[0071] Thus, through the heat dissipation effect of the filling gas 400 and the fin array frame 300 in the cold zone 222, the thermal phase change material 500 begins to release heat and cool to be converted into a solid thermal phase change material 500. Then, the thermal phase change material 500 is pushed out of the first end 610 of the capillary tube 600 and begins to fall from the gap 240 to the hot zone 221 of the closed chamber 220, thereby returning to the thermal phase change material 500 in the hot zone 221.

[0072] Figure 3 FIG. 1 is a schematic diagram of a heat peak suppression device 11 according to an embodiment of the present invention. Figure 3 As shown, Figure 3 The heat peak suppression device 11 and Figure 1 The heat peak suppression device 10 is substantially the same as the heat peak suppression device 11, except that the heat peak suppression device 11 further includes a vibrator 800. The vibrator 800 is connected to the heat sink 200 to generate vibrations to the heat sink 200 and the capillary tube 600, wherein the capillary tube 600 is fixedly connected to the inner wall of the closed chamber 220. Thus, while the thermal phase change material 500 is transported in the capillary tube 600, the vibration of the capillary tube 600 by the vibrator 800 can accelerate the rate of the capillary phenomenon, thereby improving the heat dissipation efficiency.

[0073] For example, but not limited to this, the vibrator 800 includes an ultrasonic piezoelectric ceramic piece 810 and a driver 820. The ultrasonic piezoelectric ceramic piece 810 is directly connected to the surface of the heat conductive block 210 to generate ultrasonic waves to the capillary tube 600. The driver 820 is electrically connected to the ultrasonic piezoelectric ceramic piece 810 to drive the ultrasonic piezoelectric ceramic piece 810 to work. In this way, since the ultrasonic wave oscillates the liquid thermal phase change material 500, countless tiny vacuum bubbles will be generated, and they will be continuously generated and collapsed. The shock wave generated by the collapse will drive the liquid to diffuse outward, thereby accelerating the above-mentioned heat dissipation cycle.

[0074] In this embodiment, the heat peak suppression device 11 further includes a temperature detection unit 830 and a temperature switch 840. The temperature detection unit 830 is located on a side of the heat conductive block 210 opposite to the heat dissipation fin assembly 100 (i.e., the second side wall 212), and is used to detect the temperature of the heat conductive block 210 (i.e., the heat source 900). The temperature switch 840 is electrically connected to the vibrator 800 and the temperature detection unit 830, and is used to activate the vibrator 800. In this way, when the temperature detection unit 830 detects that the temperature of the heat conductive block 210 (i.e., the heat source 900) has not reached a threshold value (e.g., 64° C.), the temperature switch 840 does not activate or turns off the vibrator 800 in response to the detection result of the temperature detection unit 830; on the contrary, when the temperature in the closed chamber 220 reaches a threshold value (e.g., 64° C.), the temperature switch 840 activates the vibrator 800 in response to the detection result of the temperature detection unit 830.

[0075] Furthermore, in this embodiment, the heat sink 200 further has a guiding slope 250, which is used to guide the thermal phase change material 500 to the second end 620 of the capillary tube 600. More specifically, the guiding slope 250 is located on the second side wall 212 opposite to the protrusion 230. However, the present invention is not limited thereto, and as long as the thermal phase change material 500 can be guided to the second end 620 of the capillary tube 600, the present invention is not limited to the guiding slope 250 being located on the inner wall of the closed chamber 220 corresponding to the hot zone 221.

[0076] Figure 4 FIG. 6 is a cross-sectional view of a capillary conduit 600 according to an embodiment of the present invention. Figure 4 As shown, the cross section of the capillary tube 600 is a honeycomb porous cross section 630. More specifically, the capillary tube 600 has a plurality of capillary channels 640 arranged in parallel with each other. Two opposite ends of each capillary channel 640 face the thermal phase change material 500 in the hot zone 221 and the fin array frame 300 in the cold zone 222 ( Figure 1 ), and the cross section of each capillary channel 640 is hexagonal. However, the present invention is not limited to the shape of the cross section.

[0077] Thus, through the above-described structures of the embodiments, the present invention can provide a thermal buffer function when the semiconductor chip generates high heat energy, thereby effectively suppressing the high heat energy of the semiconductor chip, thereby improving the heat dissipation performance and reducing the chance of the semiconductor chip being damaged due to overheating.

[0078] Finally, the above disclosed embodiments are not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all of them can be protected by the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope defined in the attached claims.

Claims

1. A heat peak suppression device, characterized in that: include: a heat sink fin assembly; A heat sink having a heat conducting block and a closed chamber, wherein the heat conducting block is thermally coupled to the heat dissipation fin set, and the closed chamber is formed in the heat conducting block and is divided into a hot zone and a cold zone; A thermal phase change material, located in the hot zone of the closed chamber, for performing phase transition between liquid and solid by absorbing and releasing heat energy; a filling gas located in the cold zone of the closed chamber, wherein the filling gas has a specific heat capacity of 2000 to 6000 joules per kilogram Kelvin (J / (kg·K)); a fin array frame, located in the cold zone of the closed chamber and fixedly connected to the heat conducting block; and a capillary tube having a first end and a second end opposite to each other, the first end and the second end being respectively located in the cold zone and the hot zone of the closed chamber, When the thermal phase change material is converted into a liquid state, the capillary conduit delivers the thermal phase change material to the cold zone of the closed chamber.

2. The heat peak suppression device according to claim 1, characterized in that: The capillary conduit has a plurality of capillary channels arranged in parallel with each other, and two opposite ends of each capillary channel face the fin array frame and the thermal phase change material respectively.

3. The heat peak suppression device according to claim 1, characterized in that: There is a gap between the first end of the capillary tube and the fin array frame. When the thermal phase change material is converted into a solid state in the cold zone of the closed chamber, the thermal phase change material falls from the first end of the capillary tube through the gap to the hot zone of the closed chamber.

4. The heat peak suppression device according to claim 1, characterized in that: The heat sink has a guide slope, and the guide slope is used to guide the thermal phase change material to the second end of the capillary tube.

5. The heat peak suppression device according to claim 1, characterized in that: The cross section of the capillary conduit is a honeycomb porous cross section.

6. The heat peak suppression device according to claim 1, characterized in that: Also includes: A vibrator is connected to the heat sink to generate vibration to the heat sink and the capillary tube, wherein the capillary tube is fixedly connected to the inner wall of the closed chamber.

7. The heat peak suppression device according to claim 6, characterized in that: The vibrator contains: an ultrasonic piezoelectric ceramic sheet directly connected to the surface of the heat conductive block for generating ultrasonic waves to the capillary conduit; and A driver is electrically connected to the ultrasonic piezoelectric ceramic sheet to drive the ultrasonic piezoelectric ceramic sheet to work.

8. The heat peak suppression device according to claim 6, characterized in that: Also includes: a temperature detection unit, located on a side of the heat-conducting block opposite to the heat-dissipating fin assembly, for detecting the temperature of the heat-conducting block; and a temperature switch electrically connected to the vibrator and the temperature detection unit to activate the vibrator, When the temperature detection unit detects that the temperature of the heat-conducting block reaches a threshold value, the temperature switch activates the vibrator according to the detection result of the temperature detection unit.

9. The heat peak suppression device according to claim 1, characterized in that: Also includes: A heat dissipation fan is connected to the heat dissipation fin group to guide air flow to the heat dissipation fin group.

10. The heat peak suppression device according to claim 1, characterized in that: The filling gas is one of ammonia and helium.

11. The heat peak suppression device according to claim 1, characterized in that: The thermal phase change material is one of paraffin and fatty acid.

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