Driving backplane, preparation method thereof and display device

Abstract

The present disclosure provides a kind of driving backboard and its manufacturing method, display device.Driving backboard includes the driving structure layer being arranged on base, the support structure being arranged on the side of the driving structure layer away from base, the driving structure layer includes the first conductive layer and the second conductive layer, the orthographic projection of support structure on base does not have the overlapping area with the orthographic projection of the first conductive layer and / or second conductive layer on base.The present disclosure is by setting support structure, the orthographic projection of support structure on base does not have the overlapping area with the orthographic projection of the first conductive layer and / or second conductive layer on base, subsequent screen printing and piece process extrusion support structure does not cause the conduction of the first conductive layer and second conductive layer, effectively solve the short circuiting problem of prior art such as bad.

Description

Technical Field

[0001] This article relates to, but is not limited to, the field of display technology, specifically to a driving backplate and its preparation method, and a display device. Background Technology

[0002] Semiconductor light-emitting diode (LED) technology has been developing for nearly thirty years, from its initial use as a solid-state lighting power supply to its application as a backlight source in the display field and then to LED displays, providing a solid foundation for its wider application. Among these developments, with the advancement of chip fabrication and packaging technologies, backlights using microLEDs at the sub-millimeter or even micrometer scale have been widely adopted.

[0003] The main structure of a backlight based on LED technology includes a driving backplate and a control circuit. By finely adjusting the light-emitting diodes on the driving backplate through the control circuit, high dynamic range (HDR) image display can be achieved.

[0004] Currently, there are serious short-circuit problems in the manufacturing of existing drive backplanes, resulting in a low yield rate. Summary of the Invention

[0005] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0006] The technical problem to be solved by this disclosure is to provide a driving backplane and its preparation method, as well as a display device, to solve the short circuit problem existing in the prior art.

[0007] To address the aforementioned technical problems, this disclosure provides a drive backplane, including a drive structure layer disposed on a substrate and a support structure disposed on the side of the drive structure layer away from the substrate. The drive structure layer includes a first conductive layer and a second conductive layer stacked together, and the orthographic projection of the support structure on the substrate does not overlap with the orthographic projection of the first conductive layer and / or the second conductive layer on the substrate.

[0008] In an exemplary embodiment, the support structure includes any one or more of the following: support columns and support dams.

[0009] In an exemplary embodiment, the distance between the surface of the support structure away from the substrate and the surface of the drive structure layer away from the substrate is 10 μm to 50 μm.

[0010] In an exemplary embodiment, the driving structure layer includes: a first insulating layer disposed on the substrate, a first conductive layer disposed on the side of the first insulating layer away from the substrate, a second insulating layer and a third insulating layer covering the first conductive layer, a second conductive layer disposed on the side of the third insulating layer away from the substrate, a fourth insulating layer covering the second conductive layer, and a fifth insulating layer disposed on the side of the fourth insulating layer away from the substrate, wherein the support structure is disposed on the side of the fifth insulating layer away from the substrate.

[0011] In an exemplary embodiment, the fifth insulating layer and the supporting structure are made of the same material.

[0012] In an exemplary embodiment, the pattern of the support structure is complementary to the pattern of the first conductive layer, or the pattern of the support structure is complementary to the pattern of the second conductive layer.

[0013] This disclosure also provides a display device including the aforementioned driving backplate.

[0014] This disclosure also provides a method for preparing a driving backplate, comprising:

[0015] A driving structure layer is formed on a substrate, the driving structure layer comprising a first conductive layer and a second conductive layer stacked thereon;

[0016] A support structure is formed on the driving structure layer, and the orthographic projection of the support structure on the substrate does not overlap with the orthographic projection of the first conductive layer and / or the second conductive layer on the substrate.

[0017] In an exemplary embodiment, a driving structure layer is formed on the substrate, including:

[0018] A first insulating layer and a first conductive layer disposed on the first insulating layer are formed on the substrate;

[0019] A second insulating layer and a third insulating layer are formed to cover the first conductive layer;

[0020] A second conductive layer is formed on the third insulating layer;

[0021] A fourth insulating layer is formed covering the second conductive layer;

[0022] A fifth insulating layer is formed on the fourth insulating layer.

[0023] In an exemplary embodiment,

[0024] Forming a fifth insulating layer on the fourth insulating layer includes: coating a fifth insulating film on the fourth insulating layer and forming the fifth insulating layer by a patterning process using a first ordinary photomask.

[0025] Forming a support structure on the driving structure layer includes: coating a support film on the fifth insulating layer and forming the support structure through a patterning process using a second ordinary photomask.

[0026] In an exemplary embodiment, the second ordinary mask is the same as the mask forming the first conductive layer, such that the pattern of the support structure is complementary to the pattern of the first conductive layer; or, the second ordinary mask is the same as the mask forming the second conductive layer, such that the pattern of the support structure is complementary to the pattern of the second conductive layer.

[0027] In an exemplary embodiment, the formation of the fifth insulating layer on the fourth insulating layer and the formation of the support structure on the driving structure layer are achieved by a patterning process using a gray-tone mask in one step.

[0028] In an exemplary embodiment, the distance between the surface of the support structure away from the substrate and the surface of the drive structure layer away from the substrate is 10 μm to 50 μm.

[0029] The exemplary embodiments disclosed herein provide a driving backplate and its preparation method, as well as a display device. By setting a support structure, the orthographic projection of the support structure on the substrate does not overlap with the orthographic projection of the first conductive layer and / or the second conductive layer on the substrate. Subsequent screen printing and molding processes that squeeze the support structure will not cause the first conductive layer and the second conductive layer to conduct, effectively solving the problems of short circuit failure in the prior art.

[0030] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects will become clear. Attached Figure Description

[0031] The accompanying drawings are used to provide an understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0032] Figure 1 This is a schematic diagram of a drive backplate structure;

[0033] Figure 2 This is a schematic diagram of a planar structure for driving a light-emitting unit in a backplane;

[0034] Figure 3 for Figure 2 Enlarged view of the circuit pads;

[0035] Figure 4 This is a schematic cross-sectional view of the light-emitting unit in the driving backplane, as an exemplary embodiment of this disclosure.

[0036] Figure 5This is a schematic diagram showing the formation of the first conductive layer pattern according to an exemplary embodiment of the present disclosure;

[0037] Figure 6 for Figure 5 Sectional view along the middle AA direction;

[0038] Figure 7 This is a schematic diagram showing the formation of the third insulating layer pattern according to an exemplary embodiment of the present disclosure;

[0039] Figure 8 for Figure 7 Sectional view along the middle AA direction;

[0040] Figure 9 This is a schematic diagram showing the formation of the second conductive layer pattern according to an exemplary embodiment of the present disclosure;

[0041] Figure 10 for Figure 9 Sectional view along the middle AA direction;

[0042] Figure 11 A schematic diagram showing the support structure pattern formed according to an exemplary embodiment of this disclosure;

[0043] Figure 12 for Figure 11 Sectional view along the middle AA direction;

[0044] Figure 13 for Figure 11 Enlarged view of the middle pad area;

[0045] Figure 14a and Figure 14b This is a schematic diagram of the structure of the support column, which is an exemplary embodiment of this disclosure.

[0046] Figure 15a and Figure 15b This is a schematic diagram of the structure supporting the dam, which is an exemplary embodiment of this disclosure.

[0047] Figure 16 This is a schematic diagram of the planar structure of the bonding area in the drive backplane, as an exemplary embodiment of this disclosure;

[0048] Figure 17a , Figure 17b and Figure 17c This is a schematic diagram of a shared mask plate as an exemplary embodiment of the present disclosure.

[0049] Explanation of reference numerals in the attached figures:

[0050] 10—Substrate; 11—First insulating layer; 12—Second insulating layer;

[0051] 13—Third insulating layer; 14—Fourth insulating layer; 15—Fifth insulating layer;

[0052] 16—Supporting structure; 31—First control line; 32—Second control line;

[0053] 33—Drive voltage line; 34—Common voltage line; 41—First connection line;

[0054] 42—Second connecting line; 43—Third connecting line; 44—Fourth connecting line;

[0055] 45—Fifth connecting line; 46—Sixth connecting line; 51—First die-bonding region;

[0056] 52—Second crystal bonding region; 53—Third crystal bonding region; 54—Fourth crystal bonding region;

[0057] 55—Pad area; 71—Lead; 72—Bond pad; Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of this disclosure clearer, embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. Note that the implementation methods can be carried out in many different forms. Those skilled in the art will readily understand that the methods and content can be varied in various forms without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the content described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0059] In the accompanying drawings, the size of the constituent elements, the thickness of the layers, or the area are sometimes exaggerated for clarity. Therefore, one aspect of this disclosure is not necessarily limited to these dimensions, and the shapes and sizes of the components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate ideal examples, and one aspect of this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0060] The ordinal numbers “first,” “second,” and “third” used in this specification are used to avoid confusion among the constituent elements, not to limit their quantity.

[0061] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of each constituent element being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0062] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the specific meaning of these terms in this disclosure based on the specific circumstances.

[0063] In this specification, a transistor is a device that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between the drain electrode (drain electrode terminal, drain region, or drain electrode) and the source electrode (source electrode terminal, source region, or source electrode), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to the region through which current primarily flows.

[0064] In this specification, the first electrode can be the drain electrode and the second electrode can be the source electrode, or vice versa. In cases where transistors with opposite polarities are used or the current direction changes during circuit operation, the functions of the "source electrode" and "drain electrode" may sometimes be interchanged. Therefore, in this specification, the "source electrode" and "drain electrode" can be interchanged.

[0065] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0066] In this specification, "parallel" refers to the state where the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore also includes the state where the angle is greater than or equal to -5° and less than 5°. Similarly, "perpendicular" refers to the state where the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore also includes the state where the angle is greater than or equal to 85° and less than 95°.

[0067] In this specification, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may sometimes be replaced with "conductive film." Similarly, "insulating film" may sometimes be replaced with "insulating layer."

[0068] In this disclosure, “about” means a value that is not strictly limited and allows for process and measurement errors.

[0069] MicroLEDs can include micro light-emitting diodes (Micro LEDs) and mini light-emitting diodes (Mini LEDs). They offer advantages such as small size and high brightness, and can be widely used in backlight modules of display devices. Displays using microLED backlights can achieve contrast levels comparable to organic light-emitting diode (OLED) displays, while retaining the technological advantages of liquid crystal displays (LCDs), thus enhancing image quality and providing users with a superior visual experience. Furthermore, microLED displays are gradually becoming a hot topic in display panels, primarily used in AR / VR, TV, and outdoor displays.

[0070] Currently, micro-LED backlights are typically manufactured by miniaturizing, arraying, and thinning LED chips using microfabrication techniques, and then mass-transferring these chips onto a driver backplane. Typical dimensions (e.g., length) of Micro LEDs can be less than 50 μm, for example, 10 μm to 50 μm. Typical dimensions (e.g., length) of Mini LEDs can be approximately 50 μm to 150 μm, for example, 80 μm to 120 μm. A driver backplane typically includes multiple light-emitting units, each of which may include multiple micro-LEDs arranged in series and a display driver integrated circuit (DDIC), which is connected to a control circuit. The inventors of this application have discovered a serious short-circuit problem in existing driver backplane fabrication processes, partly due to particles generated during the fabrication process. Currently, particles are generated during the fabrication of multiple structural film layers in the driver backplane, and this cannot be completely avoided. Because the height of the particle area is higher than the surrounding area, subsequent screen printing and molding processes that compress the driver backplane can cause damage to the film layer in the particle area. When the film layer is damaged in the overlapping area of ​​two conductive layers, it will cause the two conductive layers to conduct, resulting in a data gate short (DGS) failure, mainly manifested as a bright cross-shaped line. Furthermore, even if the film layer damage does not cause the two conductive layers to conduct, moisture can easily enter at the damaged area, corroding the conductive layers and still posing a risk of short circuit failure.

[0071] Figure 1 This is a schematic diagram of a drive backplate structure. (Example) Figure 1 As shown in the exemplary embodiment, in a plane parallel to the driving backplane, the driving backplane may include a light-emitting area and a bonding area, and the bonding area may be located on one or more sides of the light-emitting area. In the exemplary embodiment, the light-emitting area may include a plurality of regularly arranged light-emitting units P, and the bonding area may include a plurality of leads 71 ​​and bonding pads 72. At least one end of at least one lead 71 is connected to the driving circuit in at least one light-emitting unit P, and the other end is connected to the bonding pad 72. In the exemplary embodiment, the bonding pad 72 is configured to be connected to an external control circuit via a flexible printed circuit (FPC), and the control circuit controls the corresponding light-emitting unit to emit light.

[0072] In an exemplary embodiment, the shape of the light-emitting area can be set as needed. For example, the outline of the light-emitting area can be rectangular, and the shape of the light-emitting unit can also be rectangular, which makes it easier to achieve zoned control of the backlight.

[0073] Figure 2This is a schematic diagram of a planar structure of a light-emitting unit in a driving backplane, illustrating the structure of two light-emitting units in the driving backplane. For example... Figure 2 As shown in the exemplary embodiment, in a plane parallel to the driving backplane, at least one light-emitting unit may include a first control line 31, a second control line 32, a driving voltage line 33, a common voltage line 34, a circuit pad 35, and a plurality of connecting lines. In the exemplary embodiment, the first control line 31 is configured to provide a first signal to the light-emitting unit, which may be an address signal; the second control line 32 is configured to provide a second signal to the light-emitting unit, which may be a duration signal; the driving voltage line 33 is configured to provide a driving voltage signal to the light-emitting unit; the common voltage line 34 is configured to provide a common voltage signal to the light-emitting unit, which may be a ground signal; and the circuit pad 35 is configured to be bonded to the display driver integrated circuit (DDIC). In the exemplary embodiment, the plurality of connecting lines may include a first connecting line 41, a second connecting line 42, a third connecting line 43, a fourth connecting line 44, a fifth connecting line 45, and a sixth connecting line 46.

[0074] Figure 3 for Figure 2 Enlarged view of the circuit pads. (See image below.) Figure 3 As shown, in an exemplary embodiment, the circuit pad 35 may include a first input terminal Di, a second input terminal Pwr, an output terminal Out, and a common voltage terminal Gnd. The first input terminal Di is connected to a first control line 31 and configured to receive a first signal provided by the first control line 31. The first signal, for example, is an address signal, used to select a light-emitting unit at a corresponding address. Among the multiple light-emitting units in the driving backplane, the addresses of different light-emitting units may be the same or different. The address signal may be an 8-bit signal, and the display driver integrated circuit can determine the address to be transmitted by parsing the address signal. The second input terminal Pwr is connected to a second control line 32 and configured to receive a second signal, for example, a carrier signal and a duration signal. The carrier signal can provide power to the display driver integrated circuit, and the duration signal can control the light-emitting duration of the light-emitting unit, thereby controlling its visual brightness. The common voltage terminal Gnd is connected to a common voltage line 34 and configured to receive a common voltage signal. The output terminal Out is configured to output a drive signal and a relay signal. The drive signal can be a drive current used to drive the light-emitting element to emit light. The relay signal can be an address signal provided to other light-emitting units. Other light-emitting units receive the relay signal as an input signal to obtain the address signal.

[0075] like Figure 2As shown, in an exemplary embodiment, the first end of the first connecting line 41 is connected to the driving voltage line 33 through a via, and the second end of the first connecting line 41 extends to the first die-bonding region 51, where a first terminal is formed. The first end of the second connecting line 42 is disposed within the first die-bonding region 51, where a second terminal is formed. The first terminal and the second terminal of the first die-bonding region 51 are spaced apart from each other, and the first terminal and the second terminal are configured to connect to the two electrodes of the subsequently transferred first light-emitting diode, thereby connecting the first light-emitting diode to the driving backplane. In the exemplary embodiment, the die-bonding region refers to the region where the electrodes in the light-emitting diode are fixed.

[0076] In an exemplary embodiment, the second end of the second connecting line 42 extends into the second die-bonding region 52, and a first terminal is formed in the second die-bonding region 52. The first end of the third connecting line 43 is disposed within the second die-bonding region 52, and a second terminal is formed in the second die-bonding region 52. The first terminal and the second terminal in the second die-bonding region 52 are spaced apart from each other, and the first terminal and the second terminal are configured to connect to the two electrodes of the subsequently transferred second light-emitting diode, thereby realizing the connection between the second light-emitting diode and the driving backplane.

[0077] In an exemplary embodiment, the second end of the third connecting line 43 extends to the third die-bonding region 53, and a first terminal is formed in the third die-bonding region 53. The first end of the fourth connecting line 44 is disposed within the third die-bonding region 53, and a second terminal is formed in the third die-bonding region 53. The first terminal and the second terminal of the third die-bonding region 53 are spaced apart from each other, and the first terminal and the second terminal are configured to connect to the two electrodes of the subsequently transferred third light-emitting diode, thereby realizing the connection between the third light-emitting diode and the driving backplane.

[0078] In an exemplary embodiment, the second end of the fourth connecting line 44 extends to the fourth die-bonding region 54, where a first terminal is formed. The first end of the fifth connecting line 45 is disposed within the fourth die-bonding region 54, where a second terminal is formed. The first terminal and the second terminal of the fourth die-bonding region 54 are spaced apart from each other, and the first terminal and the second terminal are configured to connect to the two electrodes of the subsequently transferred fourth light-emitting diode, thereby connecting the fourth light-emitting diode to the driving backplane.

[0079] In an exemplary embodiment, the second end of the fifth connecting line 45 extends to the area where the circuit pad 35 is located and is connected to the output terminal Out in the circuit pad 35. Thus, four LEDs connected in series can be installed through multiple connecting lines in one light-emitting unit. In an exemplary embodiment, the number of LEDs installed in one light-emitting unit can be multiple, such as 5, 6, 8, etc., and the arrangement of multiple light-emitting units can be arbitrary; this disclosure does not limit the specific arrangement.

[0080] In an exemplary embodiment, the sixth connection line 46 serves as an address transfer line, configured to transmit a first signal. For example, the driving backplane may include M*N groups of light-emitting units arranged in M ​​rows and N columns. Each group includes multiple light-emitting units, which are numbered sequentially according to their row and column positions. Only the first input terminal Di of the circuit pad 35 in the light-emitting unit numbered 1 is connected to the first control line 31 via a connection line. The first input terminals Di of the other light-emitting units receive a relay signal output from the output terminal Out of the previous light-emitting unit as the first input signal. For example, the first input terminal Di of the circuit pad 35 in the light-emitting unit numbered n is connected to the output terminal Out of the circuit pad 35 in the light-emitting unit numbered n-1 via the sixth connection line 46, and the first input terminal Di of the light-emitting unit numbered n receives the relay signal output from the output terminal Out of the light-emitting unit numbered n-1 as the first signal. Similarly, the output terminal Out of the circuit pad 35 in the light-emitting unit numbered n is connected to the first input terminal Di of the circuit pad 35 in the light-emitting unit numbered n+1 via the sixth connection line 46. In this way, for a group of light-emitting units, only one first signal (address signal) needs to be provided through a connection line, so that all light-emitting units in the group can obtain their own address signals, which greatly reduces the number of signal lines, saves wiring space, and simplifies the control method.

[0081] In an exemplary embodiment, the light-emitting unit can employ a two-stage driving method. During the first stage, the light-emitting unit can output a relay signal through the output terminal Out based on a first signal received at the first input terminal Di and a second signal received at the second input terminal Pwr. During the second stage, the light-emitting unit provides a driving signal to a plurality of sequentially connected light-emitting diodes (LEDs) through the output terminal Out. For example, during the first stage, the output terminal Out outputs a relay signal, which is provided to other light-emitting units to provide them with address signals. During the second stage, the output terminal Out outputs a driving signal, which is provided to the plurality of sequentially connected LEDs, causing the LEDs to emit light during the second stage. In an exemplary embodiment, the first stage and the second stage are different stages, and the first stage may precede the second stage. For example, the first stage may be consecutive to the second stage, with the end of the first stage being the start of the second stage. Alternatively, there may be other stages between the first and second stages. These other stages can be used to implement other required functions, or they may simply be used to separate the first and second stages to prevent interference between the signals from the output terminal Out during the first and second stages.

[0082] In an exemplary embodiment, the number and arrangement of light-emitting unit groups on the driving backplane, the number and arrangement of multiple light-emitting units within a light-emitting unit group, and the number and arrangement of multiple light-emitting diodes within a light-emitting unit can be set according to actual conditions, and this disclosure does not limit them.

[0083] An exemplary embodiment of this disclosure may include a drive backplane that may be disposed on a substrate and a support structure disposed on the side of the drive structure layer away from the substrate. The drive structure layer includes a first conductive layer and a second conductive layer stacked together. The orthographic projection of the support structure on the substrate does not overlap with the orthographic projection of the first conductive layer and / or the second conductive layer on the substrate. Figure 4 This is a schematic cross-sectional view of the light-emitting unit in the driving backplane of an exemplary embodiment of this disclosure. Figure 2 A sectional view along the AA direction. (e.g.) Figure 2 and Figure 4 As shown, in an exemplary embodiment, in a plane perpendicular to the drive backplate, the drive backplate may include a substrate 10, a first insulating layer 11 disposed on the substrate 10, a first conductive layer disposed on the first insulating layer 11, a second insulating layer 12 disposed on the first conductive layer, a third insulating layer 13 disposed on the second insulating layer 12, a second conductive layer disposed on the third insulating layer 13, a fourth insulating layer 14 disposed on the second conductive layer, a fifth insulating layer 15 disposed on the fourth insulating layer 14, and a support structure 16 disposed on the fifth insulating layer 15. In an exemplary embodiment, the first insulating layer 11, the first conductive layer, the second insulating layer 12, the third insulating layer 13, the second conductive layer, the fourth insulating layer 14, and the fifth insulating layer 15 constitute the drive structure layer disclosed herein.

[0084] In an exemplary embodiment, the first conductive layer may include a first control line 31, a second control line 32, a driving voltage line 33, and a common voltage line 34.

[0085] In an exemplary embodiment, the second conductive layer may include a first connecting line 41, a second connecting line 42, a third connecting line 43, a fourth connecting line 44, a fifth connecting line 45, a sixth connecting line 46, a first input terminal Di, a second input terminal Pwr, an output terminal Out, and a common voltage terminal Gnd.

[0086] In an exemplary embodiment, a first via is provided on the second insulating layer 12 and the third insulating layer 13, and the first connecting line 41 in the second conductive layer 22 is connected to the driving voltage line 33 of the first conductive layer 21 through the first via.

[0087] In an exemplary embodiment, the first insulating layer 11, the second insulating layer 12, and the fourth insulating layer 14 are inorganic insulating layers, which can be any one or more of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON). They can be single-layer, multi-layer, or composite layers. The first insulating layer is called a buffer layer, the second insulating layer is called a gate insulating (GI) layer, and the fourth insulating layer is called a passivation (PVX) layer. The third insulating layer 13 and the fifth insulating layer 15 are organic insulating layers, which can be made of organic materials, such as resin. The first conductive layer 21 and the second conductive layer 22 can be made of metallic materials, such as any one or more of copper (Cu), aluminum (Al), titanium (Ti), molybdenum (Mo), chromium (Cr), and tungsten (W), or alloys of the above metals, such as aluminum-neodymium alloy (AlNd) or molybdenum-niobium alloy (MoNb). They can be single-layer structures or multi-layer composite structures, such as MoNb / Cu / MoNb.

[0088] In an exemplary embodiment, the orthographic projection of the support structure 16 on the substrate and the orthographic projection of the first conductive layer on the substrate do not overlap.

[0089] In an exemplary embodiment, the orthographic projection of the support structure 16 on the substrate and the orthographic projection of the second conductive layer on the substrate do not overlap.

[0090] In an exemplary embodiment, the orthographic projection of the support structure 16 on the substrate does not overlap with the orthographic projection of the first conductive layer 21 on the substrate and the orthographic projection of the second conductive layer on the substrate.

[0091] In an exemplary embodiment, the support structure 16 may be made of organic materials, such as resin.

[0092] In an exemplary embodiment, the support structure 16 and the fifth insulating layer 15 are formed respectively by two patterning processes using a common photomask.

[0093] In an exemplary embodiment, the support structure 16 and the fifth insulating layer 15 are formed simultaneously by a patterning process using a gray-toned mask.

[0094] In an exemplary embodiment, the distance between the surface of the support structure 16 away from the substrate and the surface of the fifth insulating layer 15 away from the substrate can be approximately 10 μm to 50 μm.

[0095] In an exemplary embodiment, the support structure 16 may be any one or more of the following: support columns and support dams.

[0096] In an exemplary embodiment, the support structure 16 can adopt different structures at different locations on the driving backplate. For example, in the area where the light-emitting unit is located, the support structure 16 can adopt a support column structure, and in the area between adjacent light-emitting units, the support structure 16 can adopt a support dam structure. In an exemplary embodiment, the support structure 16 can adopt different shapes at different locations on the driving backplate. For example, in the area where the light-emitting diode is located, the support structure 16 can adopt a support column with a circular or elliptical planar shape, and in the area outside the light-emitting diode, the support structure 16 can adopt a support column with a rectangular or polygonal planar shape. In an exemplary embodiment, the support structure 16 can adopt different sizes at different locations on the driving backplate. For example, in the light-emitting area, the support structure 16 can adopt a support dam with a larger width, and in the bonding area, the support structure 16 can adopt a support dam with a smaller width. In an exemplary embodiment, the structure, shape, size, etc. of the support structure 16 on the driving backplate can be set according to actual needs, and this disclosure does not limit it.

[0097] The following description uses the fabrication process of a drive backplane as an example. The "patterning process" described in this disclosure includes, for metallic, inorganic, or transparent conductive materials, processes such as photoresist coating, mask exposure, development, etching, and photoresist stripping; for organic materials, it includes processes such as organic material coating, mask exposure, and development. Deposition can be performed using any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed using any one or more of spraying, spin coating, and inkjet printing; etching can be performed using any one or more of dry etching and wet etching. This disclosure does not limit the methods used. A "thin film" refers to a thin film made of a material on a substrate using deposition, coating, or other processes. If the "thin film" does not require a patterning process during the entire fabrication process, it can also be called a "layer." If the "thin film" requires a patterning process during the entire fabrication process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern." The phrase "A and B are arranged in the same layer" in this disclosure means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer is the dimension of the film layer in the direction perpendicular to the drive backplate. In the exemplary embodiments of this disclosure, "the orthographic projection of A includes the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary range of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0098] In an exemplary embodiment, the fabrication process of the drive backplane may include the following operations.

[0099] (1) Forming a first conductive layer pattern. In an exemplary embodiment, forming the first conductive layer may include: sequentially depositing a first insulating film and a first metal film on a substrate, patterning the first metal film using a patterning process to form a first insulating layer 11 disposed on the substrate 10, and a first conductive layer pattern disposed on the first insulating layer 11. The first conductive layer pattern includes at least a first control line 31, a second control line 32, a driving voltage line 33, and a common voltage line 34, such as... Figure 5 and Figure 6 As shown, Figure 6 for Figure 5 Sectional view along the AA direction.

[0100] In an exemplary embodiment, the driving voltage line 33, the common voltage line 34, the second control line 32, and the first control line 31 can be sequentially arranged along the first direction X and extend along the second direction Y. The first control line 31, the second control line 32, the driving voltage line 33, and the common voltage line 34 can be straight lines of equal width. The width of the common voltage line 34 can be greater than the width of the driving voltage line 33, and the width of the driving voltage line 33 can be greater than the width of the first control line 31 and the second control line 32. The width is the dimension of the first direction X.

[0101] In an exemplary embodiment, a bump is provided on the side of the second control line 32 near the common voltage line 34. The bump can be used to connect to the second input terminal Pwr of the subsequently formed circuit pad through a via.

[0102] In an exemplary embodiment, the deposition of the first insulating film can be performed using chemical vapor deposition (CVD), and the deposition of the first metal film can be performed using magnetron sputtering.

[0103] In an exemplary embodiment, the first conductive layer can be a multilayer composite structure, including a first sublayer (the bottom layer near the substrate), a second bottom layer (middle layer), and a third sublayer (the top layer away from the substrate). The first sublayer can be made of molybdenum-niobium alloy MoNb to improve adhesion, the second sublayer can be made of copper Cu to reduce resistance, and the third sublayer can be made of MoNb to prevent oxidation, forming a stacked structure of MoNb / Cu / MoNb.

[0104] In an exemplary embodiment, the overall thickness of the first conductive layer can be approximately 1.5 μm to 7 μm. According to the law of resistance, the larger the cross-sectional area of ​​the trace, the smaller the resistance; therefore, a thicker first conductive layer can reduce resistance and improve electrical performance.

[0105] In an exemplary embodiment, the thickness of the first sublayer can be approximately to For example The thickness of the third sublayer can be approximately [missing information]. to For example

[0106] In an exemplary embodiment, the process can also be carried out as follows: First, a first insulating film is deposited on the substrate to form a first insulating layer disposed on the substrate. Then, a first sublayer is prepared on the first insulating layer as a seed layer to improve the grain nucleation density. Next, a second sublayer is electroplated on the first sublayer using an electroplating process. Finally, a third sublayer is prepared on the second sublayer as an anti-oxidation layer. The first sublayer can be made of MoNiTi, the second sublayer can be made of copper (Cu), and the third sublayer can be made of MoNiTi.

[0107] In an exemplary embodiment, the substrate may be a rigid substrate or a flexible substrate. The rigid substrate may be glass or the like, and the flexible substrate may be polyimide (PI) or the like.

[0108] (2) Forming patterns for the second and third insulating layers. In an exemplary embodiment, forming patterns for the second and third insulating layers may include: depositing a second insulating film on a substrate on which the aforementioned pattern is formed to form a second insulating layer 12 pattern covering the first conductive layer pattern; then coating a third insulating film to form a third insulating layer 13 on the second insulating layer 12; and patterning the second insulating layer 12 and the third insulating layer 13 using a patterning process to form a plurality of via patterns. The plurality of vias may include at least: a first via V1, a second via V2, and a third via V3, such as... Figure 7 and Figure 8 As shown, Figure 8 for Figure 7 Sectional view along the AA direction.

[0109] In an exemplary embodiment, the third insulating layer 13 and the second insulating layer 12 within the first via V1 are removed, exposing the surface of the drive voltage line 33. The first via V1 is configured to allow the subsequently formed first connection line 41 to connect to the drive voltage line 33 through the via. The third insulating layer 13 and the second insulating layer 12 within the second via V2 are removed, exposing the surface of the bump in the second control line 32. The second via V2 is configured to allow the subsequently formed second input terminal Pwr to connect to the second control line 32 through the via. The third insulating layer 13 and the second insulating layer 12 within the third via V3 are removed, exposing the surface of the common voltage line 34. The third via V3 is configured to allow the subsequently formed common voltage terminal Gnd to connect to the common voltage line 34 through the via.

[0110] (3) Forming a second conductive layer pattern. In an exemplary embodiment, forming a second conductive layer pattern may include: depositing a second metal thin film on the substrate on which the aforementioned pattern is formed, patterning the second metal thin film using a patterning process, and forming a second conductive layer pattern on the third insulating layer 13. The second conductive layer pattern includes at least a first connecting line 41, a second connecting line 42, a third connecting line 43, a fourth connecting line 44, a fifth connecting line 45, a sixth connecting line 46, a first input terminal Di, a second input terminal Pwr, an output terminal Out, and a common voltage terminal Gnd, such as... Figure 9 and Figure 10 As shown, Figure 10 for Figure 9 Sectional view along the AA direction.

[0111] In an exemplary embodiment, the fifth connection line 45 and the output terminal Out are an integral structure that are interconnected. The first input terminal Di, the second input terminal Pwr, the output terminal Out, and the common voltage terminal Gnd located in the pad area 55 constitute a circuit pad, which is configured to connect to the display driver integrated circuit DDIC.

[0112] In an exemplary embodiment, the first end of the first connection line 41 is located in the region where the driving voltage line 33 is located, and is connected to the driving voltage line 33 through the first via V1. The second end of the first connection line 41 extends along the first direction X to the first die bonding region 51.

[0113] In an exemplary embodiment, the first end of the second connecting line 42 is located in the first die-bonding region 51 and is disposed opposite to the second end of the first connecting line 41, and the second end of the second connecting line 42 extends to the second die-bonding region 52 in the opposite direction of the second direction Y.

[0114] In an exemplary embodiment, the first end of the third connecting line 43 is located in the second die-bonding region 52 and is disposed opposite to the second end of the second connecting line 42, and the second end of the third connecting line 43 extends along the first direction X to the third die-bonding region 53.

[0115] In an exemplary embodiment, the first end of the fourth connecting line 44 is located in the third die-bonding region 53 and is disposed opposite to the second end of the third connecting line 43, and the second end of the fourth connecting line 44 extends along the second direction Y to the fourth die-bonding region 54.

[0116] In an exemplary embodiment, the first end of the fifth connection line 45 is located in the fourth die bonding region 54 and is disposed opposite to the second end of the fourth connection line 44. The second end of the fifth connection line 45 extends along the second direction Y to the pad region 55 and forms an output terminal Out in the pad region 55.

[0117] In an exemplary embodiment, the second end of the first connecting line 41 and the first end of the second connecting line 42, which are disposed opposite to each other in the first die-bonding region 51, form two electrode terminals for fixing the first light-emitting diode that will be subsequently transferred. The second end of the first connecting line 41 can serve as a cathode terminal and be connected to the cathode (N pole) of the first light-emitting diode, and the first end of the second connecting line 42 can serve as an anode terminal and be connected to the anode (P pole) of the first light-emitting diode.

[0118] In an exemplary embodiment, the second end of the second connecting line 42 and the first end of the third connecting line 43, which are disposed opposite to each other in the second die-bonding region 52, form two electrode terminals for fixing the second light-emitting diode that will be subsequently transferred. The second end of the second connecting line 42 can serve as a cathode terminal and be connected to the cathode (N-pole) of the second light-emitting diode. The first end of the third connecting line 43 can serve as an anode terminal and be connected to the anode (P-pole) of the second light-emitting diode.

[0119] In an exemplary embodiment, the second end of the third connecting line 43 and the first end of the fourth connecting line 44, which are disposed opposite to each other in the third die-bonding region 53, form two electrode terminals for fixing the third light-emitting diode that will be subsequently transferred. The second end of the third connecting line 43 can serve as a cathode terminal and be connected to the cathode (N-pole) of the third light-emitting diode. The first end of the fourth connecting line 44 can serve as an anode terminal and be connected to the anode (P-pole) of the third light-emitting diode.

[0120] In an exemplary embodiment, the second end of the fourth connecting line 44 and the first end of the fifth connecting line 45, which are disposed opposite to each other in the fourth die-bonding region 54, form two electrode terminals for fixing the fourth light-emitting diode that will be subsequently transferred. The second end of the fourth connecting line 44 can serve as a cathode terminal and be connected to the cathode (N-pole) of the fourth light-emitting diode. The first end of the fifth connecting line 45 can serve as an anode terminal and be connected to the anode (P-pole) of the fourth light-emitting diode.

[0121] In an exemplary embodiment, the cathode terminals in the first die-bonding region 51 to the fourth die-bonding region 54 can all be located on the side opposite to the second direction Y of the anode terminal, or the cathode terminals in the first die-bonding region 51 to the fourth die-bonding region 54 can all be located on the side of the second direction Y of the anode terminal. Vertical mounting of the light-emitting diodes can improve the display effect.

[0122] In an exemplary embodiment, the sixth connection line 46 may include a first end 46-1, a broken line segment, and a second end 46-2 connected sequentially. The first end 46-1 of the sixth connection line 46 of this light-emitting unit (number n) is located in the pad area 55, and an output terminal Out is formed in the pad area 55; that is, the first end 46-1 and the output terminal Out are an integral structure interconnected. The first end 46-1 of this light-emitting unit is connected to the second end of the sixth connection line of the next light-emitting unit (number n+1) via the broken line segment. The second end 46-2 of the sixth connection line 46 of this light-emitting unit (number n) is located in the pad area 55, and a first input terminal Di is formed in the pad area 55; that is, the second end 46-2 and the first input terminal Di are an integral structure interconnected. The second end 46-2 of this light-emitting unit is connected to the first end of the sixth connection line of the previous light-emitting unit (number n-1) via the broken line segment.

[0123] In an exemplary embodiment, the second input terminal Pwr and the common voltage terminal Gnd are both located in the pad area 55. The second input terminal Pwr is connected to the second control line 32 through the second via V2, and the common voltage terminal Gnd is connected to the common voltage line 34 through the third via V3.

[0124] In an exemplary embodiment, the second conductive layer can be a single-layer structure or a multi-layer structure. For example, a single-layer structure can be made of copper, and its thickness can be approximately [thickness value missing]. For example, multilayer structures can be constructed using stacked MoNb / Cu / CuNi. In the MoNb / Cu / CuNi stacked structure, using a molybdenum-niobium alloy MoNb as the bottom layer can improve adhesion. The thickness of the molybdenum-niobium alloy MoNb can be approximately [missing information]. to For example Using a copper-nickel alloy (CuNi) for the top layer can provide both oxidation resistance and strong crystal bonding. The thickness of the CuNi alloy can be approximately [missing information]. to In exemplary embodiments, the top layer may also be made of nickel (Ni) or indium tin oxide (ITO), which is not limited herein.

[0125] (4) Forming a fifth insulating layer and a support structure pattern. In an exemplary embodiment, forming a fifth insulating layer and a support structure pattern may include: depositing a fourth insulating film on a substrate on which the aforementioned pattern is formed to form a fourth insulating layer 14 pattern covering the second conductive layer pattern; then coating a fifth insulating film; patterning the fifth insulating film using a patterning process; forming a fifth insulating layer 15 pattern on the fourth insulating layer 14; forming a support structure 16 on the fifth insulating layer 15; and forming a plurality of via patterns on the fourth insulating layer 14 and the fifth insulating layer 15. The plurality of vias may include: a plurality of fourth vias V4, a plurality of fifth vias V5, a sixth via V6, a seventh via V7, an eighth via V8, and a ninth via V9, such as... Figure 11 , Figure 12 and Figure 13 As shown, Figure 12 for Figure 11 Sectional view along the AA direction. Figure 13 for Figure 11 Enlarged view of the middle pad area.

[0126] In an exemplary embodiment, the first insulating layer, the first conductive layer, the second insulating layer, the third insulating layer, the second conductive layer, the fourth insulating layer, and the fifth insulating layer formed above constitute the driving structure layer of this disclosure.

[0127] In an exemplary embodiment, the distance H between the surface of the support structure 16 away from the substrate and the surface of the fifth insulating layer 15 away from the substrate can be approximately 10 μm to 50 μm.

[0128] In an exemplary embodiment, multiple fourth vias V4 are respectively located in the regions where the cathode terminals are located in the first die-bonding regions 51 to the fourth die-bonding regions 54. The fifth insulating layer 15 and the fourth insulating layer 14 within the fourth vias V4 are removed, exposing the surface of the cathode terminals. Multiple fifth vias V5 are respectively located in the regions where the anode terminals are located in the first die-bonding regions 51 to the fourth die-bonding regions 54. The fifth insulating layer 15 and the fourth insulating layer 14 within the fifth vias V5 are removed, exposing the surface of the anode terminals. In the subsequent transfer of the light-emitting diode, the two electrode terminals of the light-emitting diode are fixedly connected to the cathode terminal and the anode terminal through the fourth vias V4 and the fifth vias V5, respectively.

[0129] In an exemplary embodiment, the sixth via V6 is located in the area of ​​the first input terminal Di in the pad region 55. The fifth insulating layer 15 and the fourth insulating layer 14 within the sixth via V6 are removed, exposing the surface of the first input terminal Di. The seventh via V7 is located in the area of ​​the second input terminal Pwr in the pad region 55. The fifth insulating layer 15 and the fourth insulating layer 14 within the seventh via V7 are removed, exposing the surface of the second input terminal Pwr. The eighth via V8 is located in the area of ​​the output terminal Out in the pad region 55. The fifth insulating layer 15 and the fourth insulating layer 14 within the eighth via V8 are removed, exposing the surface of the output terminal Out. The ninth via V9 is located in the area of ​​the common voltage terminal Gnd in the pad region 55. The fifth insulating layer 15 and the fourth insulating layer 14 within the ninth via V9 are removed, exposing the surface of the common voltage terminal Gnd. When installing the display driver integrated circuit DDIC, the four pins of the display driver integrated circuit DDIC are fixedly connected to the first input terminal Di, the second input terminal Pwr, the output terminal Out, and the common voltage terminal Gnd through the sixth via V6, the seventh via V7, the eighth via V8, and the ninth via V9, respectively.

[0130] In an exemplary embodiment, the support structure 16 may be any one or more of the following: a plurality of support columns and / or a plurality of support dams.

[0131] Figure 14a and Figure 14b This is a schematic diagram of the structure of a support column in an exemplary embodiment of the present disclosure. In an exemplary embodiment, the support column may be a columnar body, and the planar shape of the columnar body may be rectangular, such as... Figure 14a As shown, or it could be circular, such as Figure 14b As shown.

[0132] Figure 15a and Figure 15b This is a schematic diagram of the structure of a supporting dam, as shown in an exemplary embodiment of this disclosure. In an exemplary embodiment, the supporting dam may be a strip-shaped structure extending in one direction, such as... Figure 15a As shown, or it could be a planar body extending along two directions, such as Figure 15b As shown.

[0133] In an exemplary embodiment, since the support pillars and support dams are configured to prevent the particles from being squeezed during subsequent screen printing and molding processes, and to prevent the film layer from being damaged due to the particles being squeezed, the height of the support pillars and support dams can be set to be greater than the size of the particles. Considering that the size of the particles generated in the manufacturing process is about less than 10 μm, the height of the support pillars in this disclosure can be about 10 μm to 50 μm.

[0134] In an exemplary embodiment, since the support columns and support dams are configured to provide support, the larger the area of ​​the support columns and support dams, the better the support effect. In an exemplary embodiment, the support columns and support dams can be disposed in the gap region where the first conductive layer and the second conductive layer are not disposed. To improve the support effect, the width of the support columns and support dams can be set to be greater than the width of the corresponding gap region. Considering that the minimum width of the corresponding gap region is approximately 10 μm, the present disclosure specifies that the width of the support columns can be approximately 10 μm to 100 μm, and the width of the support dams can be approximately 100 μm to 1000 μm.

[0135] In an exemplary embodiment, the support structure can be an isolated structure, a polygonal structure, or a closed ring structure in a plane parallel to the drive backplate. For example, multiple support columns or support dams can be spaced apart, each support column or support dam being an isolated structure. Alternatively, multiple support dams can be connected sequentially to form a polygonal structure. Yet another example is that multiple support dams can be connected sequentially to form a ring, creating a closed ring structure.

[0136] In an exemplary embodiment, the cross-sectional shape of the support column in a plane parallel to the drive backplate may include any one or more of the following: triangular, rectangular, polygonal, circular, and elliptical. In a plane perpendicular to the drive backplate, the cross-sectional shape of the support column may include any one or more of the following: triangular, rectangular, and trapezoidal.

[0137] In one exemplary embodiment, the orthographic projection of the support structure 16 on the substrate and the orthographic projection of the second conductive layer on the substrate do not overlap.

[0138] In another exemplary embodiment, the orthographic projection of the support structure 16 on the substrate and the orthographic projection of the first conductive layer on the substrate do not overlap.

[0139] In yet another exemplary embodiment, the orthographic projection of the support structure 16 on the substrate does not overlap with the orthographic projection of the first conductive layer 21 on the substrate or the orthographic projection of the second conductive layer on the substrate.

[0140] In an exemplary embodiment, the support structure 16 may be made of organic materials, such as resin.

[0141] In an exemplary embodiment, the formation of the fifth insulating layer and the support structure pattern can be achieved using a single grayscale mask process. For example, the single grayscale mask process may include: after coating the fifth insulating film, exposing the fifth insulating film using a grayscale mask, developing it to form a fully exposed area, a partially exposed area, and an unexposed area; removing the fifth insulating film in the fully exposed area to expose the fourth insulating layer 14; removing a portion of the thickness of the fifth insulating film in the partially exposed area, leaving a first thickness; retaining the fifth insulating film in the unexposed area; and having a second thickness in the partially exposed area, where the first thickness is less than the second thickness. Then, the fourth insulating layer 14 within the organic vias is etched using a dry etching process, forming multiple via patterns in the fully exposed area, a fifth insulating layer pattern in the partially exposed area, and a support structure pattern in the unexposed area. Since a single grayscale mask is used to form multiple vias and the support structure, the number of masking operations is reduced, the process time is shortened, and production costs are effectively reduced.

[0142] This completes the fabrication of the driving backplane of the exemplary embodiment of this disclosure. The driving backplane includes a first insulating layer, a first conductive layer, a second insulating layer, a third insulating layer, a second conductive layer, a fourth insulating layer, a fifth insulating layer, and a support structure stacked on a substrate. The first conductive layer may include a first control line 31, a second control line 32, a driving voltage line 33, and a common voltage line 34. The second conductive layer 22 may include a first connecting line 41 to a sixth connecting line 46, a first input terminal Di, a second input terminal Pwr, an output terminal Out, and a common voltage terminal Gnd.

[0143] Figure 16 This is a schematic diagram of the planar structure of the bonding region in the drive backplane, as shown in an exemplary embodiment of this disclosure. Figure 16 As shown, in a plane parallel to the driving backplate, the driving backplate may include a light-emitting area and a bonding area. The bonding area may be located on one side of the light-emitting area. The light-emitting area includes multiple regularly arranged light-emitting units. The bonding area may include multiple leads 71 ​​and bonding pads 72. The multiple leads 71 ​​may include leads that are integrally structured and connected to the first control line 31 in the light-emitting area, leads that are integrally structured and connected to the second control line 32 in the light-emitting area, leads that are integrally structured and connected to the driving voltage line 33 in the light-emitting area, and leads that are integrally structured and connected to the common voltage line 34 in the light-emitting area. The ends of the multiple leads away from the light-emitting area are connected to the bonding pads 72.

[0144] In an exemplary embodiment, the bonding area may further include multiple connecting lines 36, which are configured to connect to corresponding leads via corresponding vias. For example, the connecting lines 36 can connect leads transmitting the same signal. In an exemplary embodiment, the multiple leads 71 ​​of the bonding area are disposed in a first conductive layer, co-layered with the first conductive layer of the light-emitting area, and formed simultaneously by the same patterning process. The connecting lines 36 are disposed in a second conductive layer, co-layered with the second conductive layer of the light-emitting area, and formed simultaneously by the same patterning process.

[0145] In an exemplary embodiment, Figure 16 The blank area is the region where neither the first conductive layer nor the second conductive layer exists. The support structure can be placed in the blank area without overlapping with either the first or second conductive layer. In this way, the orthographic projection of the support structure on the substrate does not overlap with the orthographic projections of the first and second conductive layers on the substrate.

[0146] In an exemplary embodiment, the formation of the fifth insulating layer and the support structure pattern can be achieved using a double-mask process. For example, this double-mask process may include: after coating the fifth insulating film, exposing the fifth insulating film using a first ordinary mask, developing it, and then etching the fourth insulating layer to form multiple via patterns. Then, a sixth insulating film (support film) is coated, exposed using a second ordinary mask, and developed to form the support structure pattern. The fifth and sixth insulating films can be made of the same material or different materials. Alternatively, the sixth insulating film can be omitted, and the fifth insulating film can be directly exposed using the second ordinary mask.

[0147] In an exemplary embodiment, the second ordinary mask can be shared with the mask patterned in the first conductive layer. Figure 17a , Figure 17b and Figure 17c This is a schematic diagram of a common photomask in an exemplary embodiment of the present disclosure. In an exemplary embodiment, in the process of patterning the first conductive layer using the first conductive layer photomask, a positive photoresist can be used. A positive photoresist is a photoresist that can be removed from the exposed area after exposure and development, forming the pattern of the first conductive layer 20, such as... Figure 17a As shown. In the subsequent patterning process to form the support structure, the fifth or sixth insulating film can be an organic material with negative photoresist properties. The first conductive layer mask is still used to expose the fifth or sixth insulating film. After development, the unexposed areas of the film are removed to form the support structure 16 pattern, as shown. Figure 17bAs shown. Thus, the first conductive layer pattern and the support structure pattern formed using the same first conductive layer mask are complementary patterns. That is, areas on the driving backplate with the first conductive layer pattern do not have the support structure pattern, and areas on the driving backplate with the support structure pattern do not have the first conductive layer pattern. The orthographic projection of the areas on the driving backplate without the first conductive layer pattern onto the substrate overlaps with the orthographic projection of the support structure pattern onto the substrate, and vice versa. Figure 17c As shown, the support structure formed by this process has no overlapping area between its orthographic projection on the substrate and the orthographic projection of the first conductive layer on the substrate. Since the same mask is used to form both the first conductive layer and the support structure, not only is the cost of mask fabrication reduced, but the time required to change masks is also shortened, effectively lowering production costs.

[0148] In an exemplary embodiment, the process of forming the first conductive layer may employ a negative photoresist, and the process of forming the support structure may employ an organic material with positive photoresist properties.

[0149] In an exemplary embodiment, the second ordinary mask can be shared with the second conductive layer patterned mask, and the second conductive layer pattern formed using the same second conductive layer mask is a complementary pattern to the support structure pattern.

[0150] As can be seen from the structure and fabrication process of the drive backplate described above, the drive backplate provided in the exemplary embodiments of this disclosure, by setting a support structure, ensures that the orthographic projection of the support structure on the substrate does not overlap with the orthographic projection of the first conductive layer and / or the second conductive layer on the substrate. Subsequent screen printing and molding processes, by pressing the support structure, will not cause the first and second conductive layers to conduct, effectively solving the short-circuit problems existing in the prior art. Furthermore, since the orthographic projection of the support structure on the substrate does not overlap with the orthographic projection of the first conductive layer and / or the second conductive layer on the substrate, even if there is film damage in the area where the support structure is located, allowing moisture to enter, the moisture will not corrode the conductive layer, effectively reducing the risk of short circuits. The fabrication process of the drive backplate in the exemplary embodiments of this disclosure is well compatible with existing fabrication processes, is simple to implement, easy to carry out, has high production efficiency, low production cost, and high yield.

[0151] This exemplary embodiment also provides a method for fabricating a drive backplane, used to fabricate the drive backplane of the aforementioned exemplary embodiment. In an exemplary embodiment, the method for fabricating the drive backplane may include:

[0152] A driving structure layer is formed on a substrate, the driving structure layer comprising a first conductive layer and a second conductive layer stacked thereon;

[0153] A support structure is formed on the driving structure layer, and the orthographic projection of the support structure on the substrate does not overlap with the orthographic projection of the first conductive layer and / or the second conductive layer on the substrate.

[0154] In an exemplary embodiment, forming a driving structure layer on a substrate may include:

[0155] A first insulating layer and a first conductive layer disposed on the first insulating layer are formed on the substrate;

[0156] A second insulating layer and a third insulating layer are formed to cover the first conductive layer;

[0157] A second conductive layer is formed on the third insulating layer;

[0158] A fourth insulating layer is formed covering the second conductive layer;

[0159] A fifth insulating layer is formed on the fourth insulating layer.

[0160] In an exemplary embodiment, forming a fifth insulating layer on the fourth insulating layer includes: coating a fifth insulating film on the fourth insulating layer and forming the fifth insulating layer by a patterning process using a first ordinary photomask; forming a support structure on the driving structure layer includes: coating a support film on the fifth insulating layer and forming the support structure by a patterning process using a second ordinary photomask.

[0161] In an exemplary embodiment, the second ordinary mask is the same as the mask forming the first conductive layer, such that the pattern of the support structure is complementary to the pattern of the first conductive layer; or, the second ordinary mask is the same as the mask forming the second conductive layer, such that the pattern of the support structure is complementary to the pattern of the second conductive layer.

[0162] In an exemplary embodiment, the formation of the fifth insulating layer on the fourth insulating layer and the formation of the support structure on the driving structure layer are achieved by a patterning process using a gray-tone mask in one step.

[0163] In an exemplary embodiment, the distance between the surface of the support structure away from the substrate and the surface of the drive structure layer away from the substrate is 10 μm to 50 μm.

[0164] The specific details of the method for preparing the drive backplate disclosed herein have been described in detail in the aforementioned drive backplate preparation process, and will not be repeated here.

[0165] This disclosure also provides a display device including the driving backplane of the aforementioned exemplary embodiments.

[0166] While the embodiments disclosed herein are as described above, the content is merely for the purpose of facilitating understanding of this disclosure and is not intended to limit the invention. Any person skilled in the art may make any modifications and changes to the form and details of the implementation without departing from the spirit and scope of this disclosure; however, the patent protection scope of this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A drive backplane, characterized in that, The device includes a driving structure layer disposed on a substrate and a support structure disposed on the side of the driving structure layer away from the substrate. The driving structure layer includes a first conductive layer and a second conductive layer stacked together. The orthographic projection of the support structure on the substrate does not overlap with the orthographic projection of the first conductive layer and / or the second conductive layer on the substrate. The distance between the surface of the support structure away from the substrate and the surface of the driving structure layer away from the substrate is 10 μm to 50 μm to avoid damage to the film layer caused by particle compression. The pattern of the support structure is complementary to the pattern of the first conductive layer, or the pattern of the support structure is complementary to the pattern of the second conductive layer. The first conductive layer includes a first control line, a second control line, a driving voltage line, and a common voltage line. The second conductive layer includes a first connecting line and a circuit pad. The first control line, the second control line, and the common voltage line are all connected to the circuit pad. The driving voltage line is connected to the first connecting line. In a plane parallel to the driving backplane, the driving backplane includes a light-emitting area and a bonding area. The bonding area is located on one side of the light-emitting area. The light-emitting area includes multiple light-emitting units. The bonding area includes multiple leads and bonding pads. The multiple leads include leads that are integrally structured and connected to the first control line in the light-emitting area, leads that are integrally structured and connected to the second control line in the light-emitting area, leads that are integrally structured and connected to the driving voltage line in the light-emitting area, and leads that are integrally structured and connected to the common voltage line in the light-emitting area. The ends of the multiple leads on the side away from the light-emitting area are connected to the bonding pads.

2. The drive backplane according to claim 1, characterized in that, The supporting structure includes any one or more of the following: supporting columns and supporting dams.

3. The drive backplane according to claim 1, characterized in that, The driving structure layer includes: a first insulating layer disposed on the substrate, a first conductive layer disposed on the side of the first insulating layer away from the substrate, a second insulating layer and a third insulating layer covering the first conductive layer, a second conductive layer disposed on the side of the third insulating layer away from the substrate, a fourth insulating layer covering the second conductive layer, and a fifth insulating layer disposed on the side of the fourth insulating layer away from the substrate, and the support structure is disposed on the side of the fifth insulating layer away from the substrate.

4. The drive backplane according to claim 3, characterized in that, The fifth insulating layer is made of the same material as the supporting structure.

5. A display device, characterized in that, Includes the drive backplate as described in any one of claims 1 to 4.

6. A method for preparing a drive backplate, characterized in that, include: A driving structure layer is formed on a substrate, the driving structure layer including a first conductive layer and a second conductive layer stacked thereon; the first conductive layer includes a first control line, a second control line, a driving voltage line and a common voltage line, the second conductive layer includes a first connecting line and a circuit pad, the first control line, the second control line and the common voltage line are all connected to the circuit pad, and the driving voltage line is connected to the first connecting line; A support structure is formed on the driving structure layer, and the orthographic projection of the support structure on the substrate does not overlap with the orthographic projection of the first conductive layer and / or the second conductive layer on the substrate. The pattern of the support structure is complementary to the pattern of the first conductive layer, or the pattern of the support structure is complementary to the pattern of the second conductive layer; the distance between the surface of the support structure away from the substrate and the surface of the driving structure layer away from the substrate is 10 μm to 50 μm to avoid the film layer being damaged by the extrusion of particles; In a plane parallel to the driving backplane, the driving backplane includes a light-emitting area and a bonding area. The bonding area is located on one side of the light-emitting area. The light-emitting area includes multiple light-emitting units. The bonding area includes multiple leads and bonding pads. The multiple leads include leads that are integrally structured and connected to the first control line in the light-emitting area, leads that are integrally structured and connected to the second control line in the light-emitting area, leads that are integrally structured and connected to the driving voltage line in the light-emitting area, and leads that are integrally structured and connected to the common voltage line in the light-emitting area. The ends of the multiple leads on the side away from the light-emitting area are connected to the bonding pads.

7. The preparation method according to claim 6, characterized in that, A driving structure layer is formed on the substrate, including: A first insulating layer and a first conductive layer disposed on the first insulating layer are formed on the substrate; A second insulating layer and a third insulating layer are formed to cover the first conductive layer; A second conductive layer is formed on the third insulating layer; A fourth insulating layer is formed covering the second conductive layer; A fifth insulating layer is formed on the fourth insulating layer.

8. The preparation method according to claim 7, characterized in that, Forming a fifth insulating layer on the fourth insulating layer includes: coating a fifth insulating film on the fourth insulating layer and forming the fifth insulating layer by a patterning process using a first ordinary photomask. Forming a support structure on the driving structure layer includes: coating a support film on the fifth insulating layer and forming the support structure through a patterning process using a second ordinary photomask.

9. The preparation method according to claim 8, characterized in that, The second ordinary photomask is the same as the photomask forming the first conductive layer, such that the pattern of the support structure is complementary to the pattern of the first conductive layer; or, the second ordinary photomask is the same as the photomask forming the second conductive layer, such that the pattern of the support structure is complementary to the pattern of the second conductive layer.

10. The preparation method according to claim 7, characterized in that, The fifth insulating layer is formed on the fourth insulating layer and the support structure is formed on the driving structure layer by a patterning process using a gray-tone mask.

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