A speaker module

Abstract

The present invention provides a speaker module, comprising a shell, a speaker unit installed in a accommodating cavity of the shell, and a heat dissipation bracket; the heat dissipation bracket comprises a main body, a part of the main body is installed in the accommodating cavity, and the other part extends to the outside of the shell, and one end of the main body located on the outside of the shell is provided with an extension part bent and extended upward along the thickness direction of the speaker module, and the extension part abuts against the heat dissipation parts outside the speaker module; the main body is provided with a first cooling channel, the first cooling channel is arranged around the speaker unit, and the extension part is provided with a second cooling channel connected with the first cooling channel, the heat generated by the vibration of the speaker unit can be transferred to the heat dissipation bracket, and transferred to the outside through the cooling liquid in the first cooling channel and the second cooling channel, and the high-temperature cooling liquid in the first cooling channel flows to the second cooling channel under the action of the pressure difference, thereby realizing the circulation of the cooling liquid, so that the heat dissipation bracket has a higher heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of loudspeakers, and in particular to a loudspeaker module. Background Art

[0002] The speaker module of the prior art includes a speaker unit installed in a accommodating cavity and a heat dissipation bracket arranged around the speaker unit. When the speaker unit vibrates during operation, the heat generated by the speaker unit is transferred to the air in the accommodating cavity through the heat dissipation bracket for dissipation. However, this heat dissipation method results in poor heat dissipation efficiency of the speaker module, and there is a risk of damage to the speaker unit due to excessive temperature in the accommodating cavity.

[0003] Therefore, it is necessary to provide a speaker module with high heat dissipation efficiency. Summary of the invention

[0004] The object of the present invention is to provide a speaker module with high heat dissipation efficiency.

[0005] The technical solution of the present invention is as follows: the speaker module includes a shell, a speaker unit installed in a accommodating cavity of the shell, and a heat dissipation bracket; the heat dissipation bracket includes a main body, a part of the main body is installed in the accommodating cavity, and the other part of the main body extends to the outside of the shell, and the main body is provided with an extension portion at one end of the outside of the shell, which is bent and extended upward along the thickness direction of the speaker module, and the extension portion abuts against the heat dissipation parts outside the speaker module; the main body is provided with a first cooling channel, the first cooling channel is arranged around the speaker unit, the extension portion is provided with a second cooling channel connected to the first cooling channel, the second cooling channel extends in a direction away from the speaker unit, and the first cooling channel and the second cooling channel are filled with cooling liquid.

[0006] In a possible design, the plane where the axis of the first cooling channel is located is the first plane, the plane where the axis of the second cooling channel is located is the second plane, and there is a preset angle between the first plane and the second plane.

[0007] In a possible design, the first cooling channel includes: a first channel and a second channel arranged opposite to each other along a first direction, and a third channel extending along the first direction and capable of connecting the first channel and the second channel;

[0008] The second cooling channel includes: a fourth channel extending along the first direction, a fifth channel extending along the third direction capable of connecting the fourth channel with the second channel, and a sixth channel capable of connecting the first channel with the fourth channel;

[0009] The first direction is perpendicular to the third direction.

[0010] In a possible design, the inner diameter of the sixth channel is smaller than the inner diameter of the fifth channel.

[0011] In a possible design, one end of the first channel is provided with a first bending channel extending along the first direction toward the second channel, and a second bending channel extending along the second direction and capable of connecting the first bending channel and the sixth channel;

[0012] A third bending channel extending along the first direction toward the first channel is provided at one end of the second channel, and a fourth bending channel extending along the second direction and capable of connecting the third bending channel and the fifth channel;

[0013] The second direction is perpendicular to both the first direction and the third direction.

[0014] In a possible design, the heat dissipation support is provided with a first through hole penetrating through the side wall of the heat dissipation support along the second direction, and at least a portion of the first through hole is located in the space surrounded by the second cooling channel.

[0015] In a possible design, the heat dissipation bracket includes an upper bracket and a lower bracket, the upper bracket includes a first body and a first extension portion, and the lower bracket includes a second body and a second extension portion;

[0016] The first body and the second body are stacked along the third direction, and the first extension portion and the second extension portion are stacked along the second direction.

[0017] In a possible design, the first body is provided with a first slot, the first extension is provided with a second slot, the second body is provided with a third slot, and the second extension is provided with a fourth slot;

[0018] After the upper bracket is connected to the lower bracket, the first groove and the third groove form a first cooling channel, and the second groove and the fourth groove form a second cooling channel.

[0019] In a possible design, the upper bracket is provided with a mounting hole, the lower bracket is provided with a mounting groove, the mounting hole is opposite to the mounting groove, and a portion of the speaker unit extends into the mounting hole and abuts against the bottom wall of the mounting groove;

[0020] The bottom wall of the installation groove is provided with a second through hole, and a part of the speaker unit is exposed in the accommodating cavity through the second through hole.

[0021] In a possible design, the heat dissipation bracket is made of metal.

[0022] The beneficial effects of the present invention are as follows: a first cooling channel arranged around the speaker unit for containing the cooling liquid and a second cooling channel abutting the middle frame for containing the cooling liquid are arranged inside the heat dissipation bracket. The heat generated by the vibration of the speaker unit can be transferred to the heat dissipation bracket and transferred to the outside through the cooling liquid in the first cooling channel and the second cooling channel. The high-temperature cooling liquid in the first cooling channel flows to the second cooling channel under the action of the pressure difference, thereby realizing the circulation of the cooling liquid, thereby improving the heat dissipation efficiency of the heat dissipation bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of a portion of the structure of a speaker module provided by the present invention in one embodiment;

[0024] Figure 2 for Figure 1 Exploded diagram of

[0025] Figure 3 for Figure 1 Sectional view along line AA;

[0026] Figure 4 for Figure 1 The schematic diagram of the structure after the shell is removed;

[0027] Figure 5 for Figure 1 Sectional view along line BB;

[0028] Figure 6 for Figure 2 Bottom view of the middle upper bracket;

[0029] Figure 7 for Figure 2 A top view of the middle and lower bracket;

[0030] Figure 8 This is a schematic structural diagram of the first cooling channel and the second cooling channel in the speaker module provided by the present invention.

[0031] Reference numerals:

[0032] 1- housing;

[0033] 11-accommodating chamber;

[0034] 12-upper cover;

[0035] 121-opening;

[0036] 13- base;

[0037] 2-speaker unit;

[0038] 3- heat dissipation bracket;

[0039] 31-Ontology part;

[0040] 311-first cooling channel;

[0041] 311a-first channel;

[0042] 311a1-first bending channel;

[0043] 311a2- second bending channel;

[0044] 311a3-Fifth bending channel;

[0045] 311b-second channel;

[0046] 311b1-third bending channel;

[0047] 311b2- the fourth bending channel;

[0048] 311c-Third channel;

[0049] 32- extension;

[0050] 321- second cooling channel;

[0051] 321a-4th channel;

[0052] 321b-5th channel;

[0053] 321c-sixth channel;

[0054] 33-upper bracket;

[0055] 331-First ontology;

[0056] 331a-first groove;

[0057] 332-first extension portion;

[0058] 332a-second groove;

[0059] 333-Mounting hole;

[0060] 334-installation part;

[0061] 34-lower bracket;

[0062] 341-Second body;

[0063] 341a-third channel;

[0064] 342- second extension;

[0065] 342a- fourth channel;

[0066] 343-mounting slot;

[0067] 343a-second through hole;

[0068] 344-installation matching portion;

[0069] 35-first through hole;

[0070] 36-Injection port;

[0071] 4-Connectors.

[0072] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention. DETAILED DESCRIPTION

[0073] The present invention will be further described below in conjunction with the accompanying drawings and implementation modes.

[0074] The present invention provides a speaker module installed in a terminal device (including but not limited to a mobile phone, a computer, etc.), and the specific structure of the speaker module is as follows: Figure 1 and Figure 2 As shown, it includes a housing 1, a speaker unit 2 installed in a receiving cavity 11 of the housing 1, and a heat dissipation bracket 3 arranged around the speaker unit 2. The heat dissipation bracket 3 is made of a metal with good thermal conductivity, including but not limited to copper, copper alloy, etc. For ease of understanding, as Figure 1 As shown, the speaker module provided by the present invention has a first direction X, a second direction Y and a third direction Z, the first direction X is perpendicular to the second direction Y, the first direction X is perpendicular to the third direction Z, and the second direction Y is perpendicular to the third direction Z.

[0075] like Figure 1 and Figure 2 As shown, the housing 1 includes an upper cover 12 and a base 13 which are arranged relatively along the second direction Y to enclose a receiving cavity 11. The upper cover 12 is provided with an opening 121. When the upper cover 12 is connected to the base 13, a part of the heat dissipation bracket 3 can extend out of the housing 1 through the opening 121. The upper cover 12 and the base 13 are integrally formed or detachably connected. When the upper cover 12 and the base 13 are integrally formed, the stability of the housing 1 structure can be increased; when the upper cover 12 and the base 13 are detachably connected, the installation, maintenance and replacement of the internal parts of the receiving cavity 11 can be facilitated. The present invention does not specifically limit the connection method between the upper cover 12 and the base 13.

[0076] like Figure 1 and Figure 2As shown, the heat dissipation bracket 3 includes a main body 31, a part of which is installed in the accommodating cavity 11, and another part of the main body 31 extends to the outside of the shell 1. The main body 31 is provided with an extension portion 32 that bends and extends upward along the thickness direction of the speaker module (i.e., along the third direction Z) at one end of the outside of the shell 1. The extension portion 32 abuts against the heat dissipation parts (not shown in the figure) outside the speaker module, wherein the heat dissipation parts include but are not limited to the middle frame and shell of the terminal device, and the material of the heat dissipation parts is metal or other materials with good thermal conductivity. In addition, the main body 31 is provided with a first cooling channel 311, and the first cooling channel 311 is arranged around the speaker unit 2. The extension portion 32 is provided with a second cooling channel 321 that is connected to the first cooling channel 311, and the second cooling channel 321 extends along the third direction Z in a direction away from the speaker unit 2.

[0077] In this embodiment, the heat dissipation support 3 is provided with a first cooling channel 311 for containing coolant and arranged around the speaker unit 2, and a second cooling channel 321 for containing coolant and abutting against the heat dissipation parts outside the speaker module. The heat generated by the vibration of the speaker unit 2 can be transferred to the heat dissipation support 3, and transferred to the outside air and the heat dissipation parts through the coolant in the first cooling channel 311 and the second cooling channel 321, so as to reduce the temperature of the speaker unit 2. At the same time, since the extension portion 32 is located outside the accommodating cavity 11 and abuts against the heat dissipation parts, the temperature of the coolant in the second cooling channel 321 is lower than the temperature of the coolant in the first cooling channel 311, so that the pressure in the second cooling channel 321 is lower than the pressure in the first cooling channel 311, and the high-temperature coolant in the first cooling channel 311 flows to the second cooling channel 321 under the action of the pressure difference, thereby realizing the circulation of the coolant, and further improving the heat dissipation efficiency of the heat dissipation support 3.

[0078] Specifically, Figure 2 and Figure 3 As shown, the heat dissipation bracket 3 includes an upper bracket 33 and a lower bracket 34 that are detachably connected or fixedly connected. In the present invention, Figure 3 and Figure 4 As shown, the upper bracket 33 is provided with a mounting portion 334, and the lower bracket 34 is provided with a mounting matching portion 344. The mounting portion 334 and the mounting matching portion 344 are connected by a connecting member 4 to realize a detachable connection between the upper bracket 33 and the lower bracket 34, thereby facilitating the installation and removal of the mounting bracket. The types of the connecting member 4 include but are not limited to screws, threaded rods, positioning columns, etc.

[0079] More specifically, if Figure 4As shown, the upper bracket 33 includes a first body 331 and a first extension portion 332, and the lower bracket 34 includes a second body 341 and a second extension portion 342. The first body 331 and the second body 341 are stacked along the third direction Z, and the first extension portion 332 and the second extension portion 342 are stacked along the second direction Y. After the upper bracket 33 is connected to the lower bracket 34, the first extension portion 332 and the second extension portion 342 are spliced ​​to form the extension portion 32 of the heat dissipation bracket 3, and the first body 331 and the second body 341 are spliced ​​to form the main body 31 of the heat dissipation bracket 3, and the extension portion 32 extends upward along the third direction Z relative to the main body 31, so that the plane where the axis of the first cooling channel 311 is located and the plane where the axis of the second cooling channel 321 is located have a preset angle (the angle includes but is not limited to 90°, 60°, 45°, etc.), so that the second cooling channel 321 can abut against the heat dissipation parts and transfer heat, thereby simplifying the structure of the heat dissipation bracket 3.

[0080] like Figure 5 As shown, the heat dissipation bracket 3 is provided with a first through hole 35, and at least a part of the first through hole 35 is located in the space surrounded by the second cooling channel 321 to increase the contact area between the second cooling channel 321 and the air, thereby improving the heat dissipation efficiency of the heat dissipation bracket 3; at the same time, it can reduce the materials required for the processing of the heat dissipation bracket 3 while ensuring the structural strength of the heat dissipation bracket 3, reduce the processing cost of the heat dissipation bracket 3, and reduce the weight of the heat dissipation bracket 3.

[0081] like Figure 6 and Figure 7 As shown, the upper bracket 33 is provided with a mounting hole 333 penetrating the first body 331 along the third direction Z, and the lower bracket 34 is provided with a mounting groove 343. The mounting hole 333 and the mounting groove 343 are opposite to each other, and a part of the speaker unit 2 extends into the mounting hole 333 and abuts against the bottom wall of the mounting groove 343, so as to simplify the connection method between the speaker unit 2 and the heat dissipation bracket 3, thereby simplifying the structure of the speaker unit 2 and the heat dissipation bracket 3. The connection method between the speaker unit 2 and the bottom wall of the mounting groove 343 includes but is not limited to bonding, welding, etc. In addition, as Figure 7 As shown, the bottom wall of the mounting groove 343 is provided with a second through hole 343a, and a portion of the speaker unit 2 is exposed in the accommodating cavity 11 through the second through hole 343a, thereby increasing the contact area between the speaker unit 2 and the air. If the heat dissipation bracket 3 fails to work normally, the speaker unit 2 can also dissipate heat through the air in the accommodating cavity 11, thereby increasing the heat dissipation path of the speaker unit 2, thereby increasing the heat dissipation efficiency and heat dissipation stability of the speaker module.

[0082] In addition, if Figure 6 and Figure 7As shown, the first body 331 of the upper bracket 33 is provided with a first groove 331a, the first extension portion 332 is provided with a second groove 332a, the second body 341 of the lower bracket 34 is provided with a third groove 341a, and the second extension portion 342 is provided with a fourth groove 342a. After the upper bracket 33 is connected to the lower bracket 34, the first groove 331a and the third groove 341a form a first cooling channel 311, and the second groove 332a and the fourth groove 342a form a second cooling channel 321, so as to facilitate the processing of the first cooling channel 311 and the second cooling channel 321, thereby reducing the steps required for processing the heat dissipation bracket 3, and further reducing the processing cost of the heat dissipation bracket 3.

[0083] The specific structures of the first cooling channel 311 and the second cooling channel 321 are as follows: Figure 8 As shown (taking the top view of the upper bracket 33 as an example), the first cooling channel 311 includes: a first channel 311a and a second channel 311b arranged opposite to each other along the first direction X, and a third channel 311c extending along the first direction X and capable of connecting the first channel 311a with the second channel 311b. The first channel 311a, the second channel 311b and the third channel 311c surround the speaker unit 2; the second cooling channel 321 includes: a fourth channel 321a extending along the first direction X, a fifth channel 321b extending along the third direction Z and capable of connecting the fourth channel 321a with the second channel 311b, and a sixth channel 321c capable of connecting the first channel 311a with the fourth channel 321a. Among them, the inner diameter of the sixth channel 321c is smaller than the inner diameter of the fifth channel 321b, so that the pressure in the sixth channel 321c is greater than the pressure in the fifth channel 321b, so that the coolant has a preset flow trajectory, that is, the first channel 311a-sixth channel 321c-fourth channel 321a-fifth channel 321b-second channel 311b-third channel 311c-first channel 311a, so that the coolant has a stable flow trajectory in the heat dissipation bracket 3, reducing the risk of the coolant flowing in the opposite direction and blocking the first cooling channel 311 or the second cooling channel 321, thereby improving the stability of the coolant flow, and then improving the working stability of the heat dissipation bracket 3.

[0084] More specifically, if Figure 8As shown, one end of the first channel 311a is provided with a first bent channel 311a1 extending in the first direction X towards the direction close to the second channel 311b, and one end of the second channel 311b is provided with a third bent channel 311b1 extending in the first direction X towards the direction close to the first channel 311a, so as to increase the contact area between the first cooling channel 311 and the speaker unit 2, thereby further improving the heat dissipation efficiency of the heat dissipation bracket 3; the first channel 311a is also provided with a second bent channel 311a2 extending in the second direction Y and a third bent channel 311a3 extending in the first direction X towards the direction away from the second channel 311b. The fifth bending channel 311a3, the first bending channel 311a1 and the sixth channel 321c are connected through the second bending channel 311a2 and the fifth bending channel 311a3, and the second channel 311b is also provided with a fourth bending channel 311b2 which is bent and extended along the second direction Y and can connect the third bending channel 311b1 and the fifth channel 321b, so as to facilitate the connection between the second cooling channel 321 and the first cooling channel 311, thereby simplifying the structure of the second cooling channel 321 and the first cooling channel 311, and further reducing the processing cost of the second cooling channel 321 and the first cooling channel 311.

[0085] In addition, the heat dissipation bracket 3 is provided with a liquid injection port 36, and the first cooling channel 311 and the second cooling channel 321 can be connected to the outside through the liquid injection port 36, so as to inject coolant into the first cooling channel 311 and the second cooling channel 321. The present invention does not specifically limit the specific position, shape, size, etc. of the liquid injection port 36. Figure 8 As shown, the liquid injection port 36 is communicated with the fifth bending channel 311a3 and is located at an end of the fifth bending channel 311a3 away from the second bending channel 311a2.

[0086] The above description is only an implementation mode of the present invention. It should be pointed out that, for ordinary technicians in this field, improvements can be made without departing from the creative concept of the present invention, but these all belong to the protection scope of the present invention.

Claims

1. A speaker module, characterized in that, the speaker module includes: a housing provided with a receiving cavity; a speaker unit mounted in the receiving cavity; a heat dissipation bracket, the heat dissipation bracket includes a body portion, a part of the body portion is mounted in the receiving cavity, another part of the body portion extends to the outside of the housing, one end of the body portion located outside the housing is provided with an extension portion bent and extending upward along the thickness direction of the speaker module, and the extension portion abuts against a heat dissipation part outside the speaker module; the body portion is provided with a first cooling channel, the first cooling channel is wound around the speaker unit, the extension portion is provided with a second cooling channel communicated with the first cooling channel, the second cooling channel extends away from the speaker unit along the thickness direction of the speaker module, and the first cooling channel and the second cooling channel are filled with a coolant; the first cooling channel includes: a first channel and a second channel oppositely arranged along a first direction, and a third channel extending along the first direction and capable of communicating the first channel and the second channel; the second cooling channel includes: a fourth channel extending along the first direction, a fifth channel extending along a third direction and capable of communicating the fourth channel and the second channel, and a sixth channel capable of communicating the first channel and the fourth channel; the inner diameter size of the sixth channel is smaller than the inner diameter size of the fifth channel.

2. The speaker module according to claim 1, characterized in that, a plane where an axis of the first cooling channel is located is a first plane, a plane where an axis of the second cooling channel is located is a second plane, and a preset included angle exists between the first plane and the second plane.

3. The speaker module according to claim 2, characterized in that, the first direction is perpendicular to the third direction.

4. The speaker module according to claim 3, characterized in that, one end of the first channel is provided with a first bent channel extending along the first direction towards the second channel, and a second bent channel extending along a second direction and capable of communicating the first bent channel and the sixth channel; one end of the second channel is provided with a third bent channel extending along the first direction towards the first channel, and a fourth bent channel extending along the second direction and capable of communicating the third bent channel and the fifth channel; the second direction is perpendicular to both the first direction and the third direction.

5. The speaker module according to claim 1, characterized in that, the heat dissipation bracket is provided with a first through hole penetrating through a side wall of the heat dissipation bracket along the second direction, and at least part of the first through hole is located in a space surrounded by the second cooling channel.

6. The speaker module according to claim 1, characterized in that, the heat dissipation bracket includes an upper bracket and a lower bracket, the upper bracket includes a first body and a first extension portion, and the lower bracket includes a second body and a second extension portion; The first body and the second body are stacked along a third direction, and the first extension portion and the second extension portion are stacked along a second direction.

7. The speaker module according to claim 6, It is characterized in that The first body is provided with a first slot, the first extension is provided with a second slot, the second body is provided with a third slot, and the second extension is provided with a fourth slot; After the upper bracket is connected to the lower bracket, the first groove and the third groove form the first cooling channel, and the second groove and the fourth groove form the second cooling channel.

8. The speaker module according to claim 6, It is characterized in that The upper bracket is provided with a mounting hole, and the lower bracket is provided with a mounting groove, the mounting hole is opposite to the mounting groove, and a part of the speaker unit extends into the mounting hole and abuts against the bottom wall of the mounting groove; The bottom wall of the mounting groove is provided with a second through hole, and a part of the speaker unit is exposed in the accommodating cavity through the second through hole.

9. The speaker module according to any one of claims 1 to 8, It is characterized in that The heat dissipation bracket is made of metal.

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