Thermal Conductive Component
The thermal conductivity component addresses the balance of strength and efficiency by using interlocking pillars and connecting elements to enhance vapor flow, improving thermal management in devices like smartphones and vehicle motors.
Patent Information
- Application Number
- CN202210176000.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-02-25
- Filing Date
- 2022-02-25
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2042-02-25
AI Technical Summary
Existing thermally conductive components have shortcomings in ensuring housing strength and improving heat transfer efficiency.
Using a shell with an internal space, a capillary core structure and a working medium arranged in the internal space, and a plurality of pillars and connection parts arranged in the internal space, the pillars and connection parts are connected in a specific way to enhance the strength of the housing and improve the heat transfer efficiency.
The housing strength is ensured and the heat transfer efficiency is improved. The design of the pillars and connections makes the steam flow smoothly and enhances the thermal conductivity.
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Figure CN114980656B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a heat-conducting component. Background Art
[0002] Existing heat-conducting components include a housing, a capillary wick structure, and a working medium. The housing has an internal space inside. The capillary wick structure and the working medium are accommodated in the internal space.
[0003] Moreover, in existing heat-conducting components, the upper surface portion and the lower surface portion of the housing are sometimes connected by a wall-like member.
[0004] The wall-like member is made of, for example, metal and does not allow the vapor of the working medium to pass through. The vapor flows along the wall-like member (for example, see International Publication No. WO2017 / 104819).
[0005] However, in existing heat-conducting components, there is still room for improvement in ensuring the strength of the housing and improving the heat transfer efficiency. Summary of the Invention
[0006] In view of the above circumstances, an object of the present invention is to provide a heat-conducting component capable of simultaneously improving the heat transfer efficiency and ensuring the strength of the housing.
[0007] An exemplary heat-conducting component of the present invention includes: a housing having an internal space; a capillary wick structure disposed in the internal space; a working medium disposed in the internal space; and a plurality of struts disposed in the internal space. The housing has a first metal plate and a second metal plate, and the second metal plate is disposed opposite to the first metal plate in the vertical direction and above the first metal plate. The internal space is formed between the first metal plate and the second metal plate in the vertical direction. The plurality of struts are disposed at intervals in a first direction orthogonal to the vertical direction. A connecting portion is disposed in the internal space, and the connecting portion extends in the first direction and is disposed at intervals in a second direction orthogonal to the vertical direction and the first direction. The connecting portion connects at least any of the plurality of struts adjacent to each other in the first direction. The width of the connecting portion of one strut and one connecting portion in the second direction is smaller than the maximum width of the one strut in the second direction.
[0008] According to the exemplary heat-conducting component of the present invention, it is possible to simultaneously improve the heat transfer efficiency and ensure the strength of the housing. Brief Description of the Drawings
[0009] Figure 1 It is a perspective view of the heat-conducting component of the first embodiment.
[0010] Figure 2It is a side cross-sectional view of the heat-conducting component of the first embodiment.
[0011] Figure 3 It is a top view showing a configuration example of the strut connection structure of the first embodiment.
[0012] Figure 4 It is a perspective view of the strut connection structure.
[0013] Figure 5 It is an exploded perspective view of the cooling device of the second embodiment.
[0014] Figure 6 It is a top view showing a configuration example of the strut connection structure of the second embodiment.
[0015] Figure 7 It is Figure 6 the A-A cross-sectional view in
[0016] Figure 8 It is Figure 6 the B-B cross-sectional view in
[0017] Figure 9 It is a side cross-sectional view of the cooling device of a modified example of the second embodiment.
[0018] Figure 10 It is a top view showing the strut connection structure and the first metal plate in the heat-conducting component of the third embodiment.
[0019] Figure 11 It is an enlarged perspective view of the main part around the protrusion. Detailed Embodiments
[0020] Now, exemplary embodiments of the present invention will be described with reference to the drawings. Additionally, in the drawings, the Z direction represents the up-down direction, Z1 is the upper side, and Z2 is the lower side. The Z direction is also the relative direction of the first metal plate and the second metal plate described later. The X direction refers to the first direction orthogonal to the up-down direction (Z direction), X1 is one side of the first direction, and X2 is the other side of the first direction. The first direction is also the direction of the vapor flow of the working medium described later. The Y direction refers to the second direction orthogonal to the up-down direction (Z direction) and the first direction (X direction), Y1 is one side of the second direction, and Y2 is the other side of the second direction. However, the up-down direction does not limit the orientation when using the heat-conducting component.
[0021] In addition, in this specification, "sintering" refers to a technique of heating metal powder or metal powder body to a temperature lower than the melting point of the metal to sinter the metal particles. Additionally, a "sintered body" refers to an object obtained by sintering.
[0022] <1. First Embodiment>
[0023] Figure 1 This is a perspective view of the heat conducting component 1 according to the first embodiment of the present invention. Figure 2 This is a side cross-sectional view of the heat conducting component 1. The heat conducting component 1 is also referred to as a vapor chamber and conveys the heat of the heat generating body H. The heat conducting component 1 is provided, for example, in a smart phone. Alternatively, the heat conducting component 1 may be provided in a traction motor for driving a vehicle wheel. In this case, as an example of the heat generating body H, a power transistor of an inverter included in the above-mentioned traction motor can be cited. The above-mentioned power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor).
[0024] The heat generating body H is disposed in contact with the lower surface of the heat conducting component 1. The heat generated by the heat generating body H is dissipated from the upper surface of the heat conducting component 1. One heat generating body H is disposed at the other end in the first direction on the lower surface of the rectangular parallelepiped-shaped heat conducting component 1.
[0025] <1-1. Structure of the housing>
[0026] The housing 10 has a first metal plate 11 and a second metal plate 12. The second metal plate 12 is disposed opposite to the first metal plate 11 in the vertical direction and is disposed above the first metal plate 11.
[0027] The first metal plate 11 and the second metal plate 12 are formed of a metal having high thermal conductivity such as copper. Alternatively, they may be formed by plating copper on the surface of a metal other than copper. As a metal other than copper, stainless steel can be considered, for example.
[0028] The first metal plate 11 and the second metal plate 12 are rectangular plate-shaped extending in the horizontal direction in plan view. The heat generating body H is in contact with the lower surface of the first metal plate 11. That is, the first metal plate 11 is disposed on the side of the heat generating body H. The second metal plate 12 covers the upper surface of the first metal plate 11. In addition, the first metal plate 11 and the second metal plate 12 of the present embodiment are quadrilateral in plan view, but are not limited thereto. For example, they may be polygonal or circular in plan view.
[0029] The first metal plate 11 has a first side wall portion 11A extending upward from the periphery. The second metal plate 12 has a second side wall portion 12A extending downward from the periphery. The upper surface of the first side wall portion 11A and the lower surface of the second side wall portion 12A are joined by a joining portion 14.
[0030] The internal space 10A is formed by being surrounded by the first metal plate 11 and the second metal plate 12. The internal space 10A is disposed between the first metal plate 11 and the second metal plate 12 in the vertical direction.
[0031] The internal space 10A houses the wick structure 20 and the working medium 15. That is, the heat conducting member 1 includes: a housing 10 having an internal space 10A; a wick structure 20 disposed in the internal space 10A; and a working medium 15 disposed in the internal space 10A.
[0032] The internal space 10A is a closed space and is maintained, for example, in a reduced pressure state where the air pressure is lower than the atmospheric pressure. By making the internal space 10A in a reduced pressure state, the working medium 15 housed in the internal space 10A is likely to evaporate. The working medium 15 is, for example, water, but may also be other liquids such as alcohol.
[0033] The joint portion 14 is located around the wick structure 20 in a plan view. The joining method of the first side wall portion 11A and the second side wall portion 12A is not particularly limited. For example, it may be any joining method such as a method of applying heat and pressure for joining, diffusion joining, joining using a solder, etc.
[0034] In addition, the joint portion 14 may also include a sealing portion. The sealing portion is, for example, a portion where the injection port for injecting the working medium 15 into the housing 10 is sealed by welding during the manufacturing process of the heat conducting member 1.
[0035] <1-2. Structure of the wick structure>
[0036] The wick structure 20 is a plate-like member in a rectangular shape disposed inside the first metal plate 11. The wick structure 20 is composed of a porous sintered body. The liquid working medium 15 is held inside the wick structure 20.
[0037] The wick structure 20 can be formed, for example, as follows. First, a mixed powder containing fine copper particles, a copper body, and a resin is spray-coated on the upper surface of the first metal plate 11. Then, the first metal plate 11 is heated to sinter the mixed powder.
[0038] In addition, in this specification, "coating" means attaching metal powder. In addition to the spray coating method, a paste containing metal powder may also be coated.
[0039] The fine copper particles are particles formed by aggregation or bonding of multiple copper atoms. The particle size of the fine copper particles is 1 μm or more and less than 1 mm. For example, the fine copper particles are porous.
[0040] The copper body is a copper melt in which sub-micro copper particles smaller than the fine copper particles are melted and solidified by sintering. The sub-micro copper particles are particles formed by aggregation or bonding of multiple copper atoms. The particle size of the sub-micro copper particles before melting is 0.1 μm or more and less than 1 μm.
[0041] The resin is a volatile resin that volatilizes at a temperature below the melting point of the copper constituting the fine copper particles and the copper body. As such a volatile resin, for example, cellulose resins such as methyl cellulose and ethyl cellulose, acrylic resins, butyral resins, alkyd resins, epoxy resins, phenolic resins, etc. can be used. Among them, acrylic resins with high thermal decomposability are preferably used.
[0042] In addition, the capillary core structure 20 can also be, for example, a net-like member in which a plurality of metal wire-like members are woven.
[0043] <1-3. Strut connection structure>
[0044] A plurality of struts 31 are arranged in the internal space 10A. That is, the heat-conducting member 1 has a plurality of struts 31 arranged in the internal space 10A. Figure 3 It is a top view showing an arrangement example of the strut connection structures U1 and U2 formed by the struts 31 and the connection portions 32 described later. Figure 4 It is a perspective view of the strut connection structure U1.
[0045] The strut 31 is a columnar member extending in the vertical direction. The strut 31 is cylindrical. However, the strut 31 is not limited to a cylindrical shape and can also be, for example, an elliptical cylindrical shape, a prismatic shape, etc.
[0046] In Figure 3 In the example shown, a group of three struts 31 (the first group) arranged at intervals S1 in the first direction are arranged in three in the second direction. In addition, a group of two struts 31 (the second group) arranged at intervals S2 in the first direction are arranged in two in the second direction. That is, the plurality of struts 31 are arranged at intervals in the first direction. A second group of one strut 31 is arranged between the first groups of struts 31 adjacent in the second direction.
[0047] As Figure 3 shown, when viewed from above, the struts 31 are arranged in a so-called zigzag shape. That is, one strut 31 in the second group is arranged between two struts 31 adjacent in the first direction in the first group adjacent to the second group in the second direction.
[0048] The struts 31 adjacent in the first direction in the first group and the second group of the struts 31 are connected by the connection portion 32. The connection portion 32 is a wall-like member extending along the first direction. As Figure 3 shown, the connection portions 32 are arranged at intervals S3 in the second direction. That is, in the internal space 10A, connection portions 32 extending in the first direction and arranged at intervals in the second direction are arranged.
[0049] In addition, it is also possible to arrange in the internal space 10A Figure 3Struts that are not connected by the connecting portion other than those shown. That is, the connecting portion 32 connects at least any of the struts 31 that are adjacent in the first direction.
[0050] In addition, as Figure 3 shown, the width Wc in the second direction of the connecting portion of one strut 31 and one connecting portion 32 is smaller than the maximum width Wmax in the second direction of the above one strut 31.
[0051] In addition, as Figure 3 shown, the strut connection structure U1 is constituted by the first group of struts 31 and the connecting portion 32 that connects the first group of struts 31. The strut connection structure U2 is constituted by the second group of struts 31 and the connecting portion 32 that connects the second group of struts 31. The strut connection structure U2 is arranged between the strut connection structures U1 that are adjacent in the second direction.
[0052] As Figure 2 shown, the struts 31 and the connecting portion 32 are arranged between the lower surface of the second metal plate 12 and the upper surface of the capillary core structure 20. The first strut connection structure U1 and the second strut connection structure U2 and the second metal plate 12 form a single component. Therefore, the first strut connection structure U1 and the second strut connection structure U2 are formed of the same metal material as the second metal plate 12.
[0053] That is, at least one connecting portion 32 and the second metal plate 12 form a single component. Thereby, the connecting portion 32 can be easily formed by etching or cutting or the like.
[0054] In addition, the lower end surfaces of the first strut connection structure U1 and the second strut connection structure U2 are in contact with the upper surface of the capillary core structure 20. That is, as Figure 2 shown, the lower end surfaces of the struts 31 and the connecting portion 32 are in contact with the upper surface of the capillary core structure 20. In addition, the lower end surfaces of the struts 31 and the connecting portion 32 may also be connected to the upper surface of the capillary core structure 20 by, for example, an adhesive or the like.
[0055] That is, the lower end surface of at least one connecting portion 32 is connected to the upper surface of the capillary core structure 20. Thereby, the length of the connecting portion 32 in the up-down direction can be shortened. Therefore, when the connecting portion 32 is formed by etching or the like, the amount of the base material can be reduced. In addition, the strut 31 may penetrate the capillary core structure 20 and be in contact with the upper surface of the first metal plate 11.
[0056] In addition, as described above, the support 31 and the connecting portion 32 and the second metal plate 12 form a single component, and are respectively solid components. It should be noted that the "solid" component refers to a so-called dense component, which is internally compact and not porous. For example, the "solid" component can be a component without a cavity inside, or a component with one or more macroscopic cavities inside. The vapor or liquid of the working medium 15 described later will not enter the inside of the solid component.
[0057] That is, at least one connecting portion 32 is solid. Thus, the strength of the housing 10 can be further improved. In addition, the support 31 connected in the first direction by at least one connecting portion 32 is solid. Thus, it is easy to form the support 31 and the connecting portion 32 into a single component.
[0058] Since the support 31 and the connecting portion 32 having such a structure support the second metal plate 12 above the capillary core structure body 20, the thickness of the housing 10 in the vertical direction is kept constant. Thus, it is possible to suppress the narrowing of the internal space 10A due to the deformation of the housing 10 in the vertical direction.
[0059] <1-4. Operation of the heat conducting component>
[0060] In Figure 2 , the flow of the vapor generated by the vaporization of the working medium 15 is shown by the black arrow in the heat conducting component 1, and the flow of the liquid working medium 15 is shown by the hollow arrow in the heat conducting component 1.
[0061] In the heat conducting component 1 having the above structure, when the temperature of the first metal plate 11 rises due to the heat generated by the heating element H, the liquid working medium 15 contained in the capillary core structure body 20 vaporizes.
[0062] The working medium 15 that has vaporized flows in the internal space 10A toward the first direction side as the cooling side. The vapor of the flowing working medium 15 is cooled by the second metal plate 12 on the first direction side of the internal space 10A and liquefies. The liquefied working medium 15 returns to the other side of the first direction (heating element H side) by means of the capillary phenomenon with the help of the capillary core structure body 20.
[0063] At this time, a part of the vaporized working medium 15 liquefies when it comes into contact with the second metal plate 12, the support 31 or the connecting portion 32 during the flow toward the first direction side. The liquefied working medium 15 moves downward along the outer surface of the support 31 or the connecting portion 32 and is absorbed by the capillary core structure body 20. Or, the liquefied working medium 15 drips from the second metal plate 12 onto the capillary core structure body 20 and is absorbed by the capillary core structure body 20.
[0064] As described above, the working medium 15 moves while undergoing a change in state, thereby continuously transporting heat from the heating element H side to the cooling side.
[0065] At this time, the vapor of the working medium 15 flows along the connecting portion 32 between the pillar connection structures U1 and U2 adjacent in the second direction (see Figure 3 ). Thus, compared with the structure without the connecting portion, the vapor can be transported smoothly. Therefore, the strength of the housing 10 can be ensured by increasing the width of the pillar 31 at the maximum width Wmax, and the heat transfer efficiency of the heat conducting component 1 can be improved.
[0066] In addition, as Figure 3 shown, the connecting portion 32 is disposed adjacent to at least one of the second direction side and the second direction opposite side of one pillar 31. Thus, as Figure 3 shown, the pillar 31 can be arranged in a zigzag shape. Therefore, the vapor of the working medium 15 flows in the region between the pillar 31 and the connecting portion 32 in the second direction, and thus the flow of the vapor can be prevented from being obstructed.
[0067] In addition, it may be a structure in which the vapor of the working medium 15 flows between the pillars 31 adjacent in the second direction.
[0068] In addition, the connecting portion 32 may be bent in the second direction. However, in this case, in order not to obstruct the flow of the vapor of the working medium 15, when viewed from the first direction, the connecting portion 32 needs not to protrude toward the second direction side more than the second direction side end of the pillar 31 and not to protrude toward the second direction opposite side more than the second direction opposite side end of the pillar 31. That is, when viewed from the first direction, the connecting portion 32 needs to be disposed between the second direction side end and the second direction opposite side end of the pillar 31.
[0069] <2. Second Embodiment>
[0070] Next, a second embodiment of the present invention will be described.
[0071] <2-1. Structure of Cooling Device>
[0072] Figure 5 is an exploded perspective view of the cooling device 5 according to the second embodiment of the present invention.
[0073] The cooling device 5 cools a plurality of heating elements HA to HC arranged in the first direction (length direction) (see Figure 7A device for cooling (etc.). The heating elements HA to HC are, for example, power transistors of an inverter provided in a traction motor for driving a vehicle wheel. The power transistor is, for example, an IGBT (Insulated Gate Bipolar Transistor). In this case, the cooling device 5 is mounted on the traction motor. In addition, the number of heating elements may also be more than three.
[0074] The cooling device 5 includes a heat conducting member 1, a housing member 2, a plate 3, and heat radiating members 4A to 4C.
[0075] The housing member 2 is formed in a plate shape extending in the first direction and the second direction with the vertical direction as the thickness direction, and is formed of, for example, aluminum alloy. In Figure 5 this example, the length of the housing member 2 in the first direction is longer than the length of the housing member 2 in the second direction. The housing member 2 has a housing recess 2A recessed downward from the upper surface. The upper surfaces of the heating elements HA to HC are in contact with the lower surface of the housing member 2.
[0076] The heat conducting member 1 is also referred to as a heat pipe in the same manner as in the first embodiment. The heat conducting member 1 is housed in the housing recess 2A. The heat conducting member 1 has a housing 10. Details of the heat conducting member 1 will be described later.
[0077] The plate 3 is a metal plate formed of, for example, aluminum alloy, and is disposed above the housing member 2 and fixed to the housing member 2. The plate 3 covers the heat conducting member 1 from above and is in contact with the upper surface of the housing 10. The plate 3 is in contact with the upper surface of the housing member 2. In addition, the plate 3 does not necessarily have to be provided.
[0078] The heat radiating members 4A to 4C are members for dissipating the heat of the heating elements HA to HC respectively, and are also referred to as radiators. The heat radiating members 4A to 4C are arranged in order from the other side in the first direction to the one side in the first direction. The heat radiating members 4A to 4C are disposed above the plate 3.
[0079] The heat radiating members 4A to 4C each have a plate-shaped base 41 and a plurality of heat radiating fins 42, and are formed of, for example, aluminum alloy. The plurality of heat radiating fins 42 project downward from the lower surface of the base 41 and are formed in a plate shape extending along the first direction. The plurality of heat radiating fins 42 are arranged in the second direction. A gap extending in the first direction is formed between the adjacent heat radiating fins 42 in the second direction.
[0080] The lower end portions of the heat radiating fins 42 are in contact with the upper surface of the plate 3. In addition, in the case where the plate 3 is not provided, the lower end portions of the heat radiating fins 42 are in contact with the upper surface of the heat conducting member 1. In addition, it may also be a structure in which the heat radiating fins 42 are sandwiched in the vertical direction by the base 41 and another base below the base 41. In this case, the lower base is in contact with the plate 3.
[0081] In addition, the heat sink 42 may be a single component with the base 41 or a component different from the base 41.
[0082] <2-2. Structure of the heat conducting component>
[0083] Next, the structure of the heat conducting component 1 included in the cooling device 5 will be described. Here, the differences from the heat conducting component 1 of the first embodiment will be mainly described.
[0084] Figure 6 It is a top view of the pillar connection structures U1 and U2 housed in the internal space 10A of the housing 10. The pillar connection structure U1 is composed of a solid pillar 31 and a solid connection part 32 as in the first embodiment. As a difference from the first embodiment, the pillar connection structure U2 is composed of a pillar 33 and a connection part 34 connecting the pillar 33. The pillar 33 and the connection part 34 are composed of a porous sintered body.
[0085] Figure 7 is Figure 6 The A-A cross-sectional view in. That is, Figure 7 is a side cross-sectional view cut at the position of the pillar connection structure U1. As Figure 7 shown, the solid pillar connection structure U1 connects the first metal plate 11 and the second metal plate 12. That is, the pillar 31 and the connection part 32 connect the first metal plate 11 and the second metal plate 12. The upper and lower end faces of each of the pillar 31 and the connection part 32 are joined to the lower surface of the second metal plate 12 and the upper surface of the first metal plate 11 using solder. In addition to joining using solder, they may also be joined to the first metal plate 11 and the second metal plate 12 by welding or the like. In addition, the pillar 31 and the connection part 32 may also form a single component with one of the first metal plate 11 and the second metal plate 12.
[0086] That is, at least one connection part 32 connects the first metal plate 11 and the second metal plate 12 in the vertical direction. Thereby, the strength of the housing 10 can be further improved.
[0087] Figure 8 is Figure 6 The B-B cross-sectional view in. That is, Figure 8 is a side cross-sectional view cut at the position of the pillar connection structure U2. As Figure 8 shown, the pillar connection structure U2 composed of a porous sintered body connects the capillary core structure 21 housed in the first metal plate 11 and the capillary core structure 22 housed in the second metal plate 12 in the vertical direction. The upper and lower end faces of each of the pillar 33 and the connection part 34 are in contact with the lower surface of the second metal plate 12 and the upper surface of the first metal plate 11. The capillary core structures 21, 22, the pillar 33, and the connection part 34 form a single capillary core structure 20.
[0088] That is to say, at least one connecting portion 34 is part of the capillary core structure 20. Thus, as described later, the working medium 15 in which the vapor is cooled and liquefied can be efficiently transported to the capillary core structure 21 side housed in the first metal plate 11 through the connecting portion 34. In addition, the support columns 33 connected in the first direction by at least one connecting portion 34 are part of the capillary core structure 20. Thus, it is easy to form a single component from the support columns 33 and the connecting portion 34.
[0089] <2-3. Operation of the cooling device>
[0090] Here, in Figure 7 and Figure 8 the flow of the cooling medium F is illustrated. The cooling medium F flows sequentially from the other side (upstream side) in the first direction to one side (downstream side) in the first direction in the heat dissipation members 4A to 4C. The cooling medium F flows between adjacent heat dissipation fins 42 in the heat dissipation members 4A to 4C. The cooling medium F is a liquid such as water, but it can also be a gas such as air.
[0091] In addition, in Figure 7 and Figure 8 the flow of the vapor generated by the vaporization of the working medium 15 is shown by the black arrows in the heat conduction member 1, and the flow of the liquid working medium 15 is shown by the hollow arrows in the heat conduction member 1.
[0092] In the heat conduction member 1 having the above structure, due to the heat generated by the heating element HC located on the side closest to one side in the first direction, that is, the most downstream side in the flow direction of the cooling medium F, the temperature of the portion near the heating element HC in the heat conduction member 1 rises. Then, the liquid working medium 15 contained in the portion near the heating element HC of the capillary core structure 21 vaporizes. A part of the vapor generated by vaporization is liquefied by dissipating heat to the cooling medium F through the heat dissipation fins 42 of the heat dissipation member 4C, but another part moves to the other side in the first direction (upstream side in the flow direction of the cooling medium F) in the space 10A.
[0093] The vapor that has moved below the heat dissipation member 4B is partially liquefied by the heat dissipation of the fins 42 of the heat dissipation member 4B. Another part of the vapor further moves to the other side in the first direction. The vapor that has moved below the heat dissipation member 4A is liquefied by the heat dissipation of the fins 42 of the heat dissipation member 4A.
[0094] A part of the working medium 15 vaporized by the heat generated from the heating element HC is cooled and liquefied on the lower surface of the capillary structure 22 housed in the second metal plate 12. The liquefied working medium 15 is absorbed by the capillary structure 22 and transported to the side of the capillary structure 21 housed in the first metal plate 11 through the support columns 33 or the connecting part 34. The transported working medium 15 flows back inside the capillary structure 21 toward one side in the first direction.
[0095] In addition, a part of the vapor generated by vaporizing the working medium 15 due to the heat generated from the heating element HB is liquefied by the heat dissipation of the heat dissipation component 4B, and another part moves to the other side in the first direction and is liquefied by the heat dissipation of the heat dissipation component 4A. In addition, the vapor generated by vaporizing the working medium 15 due to the heat generated from the heating element HA is liquefied by the heat dissipation of the heat dissipation component 4A.
[0096] The cooling medium F absorbs heat from the heat sink 42 in the order of the heat dissipation components 4A and 4B. Therefore, the temperature becomes higher toward the downstream side, and the cooling performance of the cooling medium F for the heating element HC on the most downstream side is reduced. However, as described above, since the heat of the heating element HC is transported to the upstream side through the heat conduction member 1, the reduction in the cooling performance of the heating element HC can be suppressed.
[0097] In the present embodiment, when the vapor of the working medium 15 flows to the other side in the first direction (the upstream side of the flow of the cooling medium F), the vapor flows along the connecting parts 32 and 34 between the support column connection structures U1 and U2 (refer to Figure 6 ) adjacent in the second direction. Thereby, the vapor can flow smoothly, and the heat transfer efficiency can be improved. Therefore, the strength of the housing 10 can be ensured by the support columns 31 and 33, and the heat transfer efficiency can be improved.
[0098] <2-4. Modified Example>
[0099] Figure 9 It is a side cross-sectional view of the cooling device 5 which is a modified example of the second embodiment. Figure 9 It is a view cut at the part of the support column connection structure U1 of the heat conduction member 1, and is a view corresponding to Figure 7 corresponding.
[0100] In Figure 9 In the shown modified example, the vertical width of the connecting part 32 as a solid member is made larger than that in the above second embodiment ( Figure 7)Short. More specifically, a gap SP1 is provided between the lower end surface of the connecting portion 32 and the upper surface of the first metal plate 11, and a gap SP2 is provided between the upper end surface of the connecting portion 32 and the lower surface of the second metal plate 12. A part of the wick structure body 21 accommodated in the first metal plate 11 is disposed in the gap SP1. A part of the wick structure body 22 accommodated in the second metal plate 12 is disposed in the gap SP2.
[0101] In other words, a set of struts 31 connected in the first direction by at least one connecting portion 32 connect the first metal plate 11 and the second metal plate 12 in the vertical direction. The lower end of the at least one connecting portion 32 is located above the lower end of the set of struts 31. The wick structure body 21 accommodated in the first metal plate 11 is disposed below the at least one connecting portion 32. Thereby, it is possible to suppress a reduction in the amount of the wick structure body 21 due to the arrangement of the solid connecting portion 32.
[0102] In addition, the upper end of the at least one connecting portion 32 is located below the upper end of the set of struts 31. The wick structure body 22 accommodated in the second metal plate 12 is disposed above the at least one connecting portion 32. Thereby, it is possible to suppress a reduction in the amount of the wick structure body 22 due to the arrangement of the solid connecting portion 32.
[0103] <3. Third Embodiment>
[0104] Next, a third embodiment of the present invention will be described. Figure 10 It is a top view showing a strut connection structure and the first metal plate 11 in the heat conductive member of the third embodiment.
[0105] In Figure 10 In the structure shown, the first to fourth strut connection structures U11 to U14 are respectively constituted by solid struts 31 and solid connecting portions 32. The second strut connection structure U12 is disposed adjacent to the other side in the second direction of the first strut connection structure U11. The third strut connection structure U13 is disposed adjacent to one side in the second direction of the first strut connection structure U11. The fourth strut connection structure U14 is disposed adjacent to the other side in the second direction of the second strut connection structure U12.
[0106] In Figure 10 In the structure shown, a flow path for the vapor of the working medium 15 is formed between the struts 31 adjacent in the second direction, but the struts 31 may be arranged in a zigzag shape as in the first embodiment. Alternatively, a part of the strut connection structure may be formed of a sintered body as in the second embodiment.
[0107] In addition, in Figure 10In the structure shown, the center line C passes through the center position in the second direction of a plurality of heating elements H arranged in the first direction below the first metal plate 11. Additionally, the heating element H may also be one. The center line C is located between the first pillar connection structure U11 and the second pillar connection structure U12. The second-direction interval SA between the first pillar connection structure U11 and the second pillar connection structure U12 is greater than the second-direction interval SB between the first pillar connection structure U11 and the third pillar connection structure U13, and is greater than the second-direction interval SC between the second pillar connection structure U12 and the fourth pillar connection structure U14.
[0108] In other words, a structure in which the pillars 31 arranged at one end in the first direction are connected to the pillars 31 arranged at the other end in the first direction through the connecting portion 32 is used as the pillar connection structure. The center line C is arranged between the first pillar connection structure U11 and the second pillar connection structure U12 adjacent to the other side in the second direction of the first pillar connection structure U11. When observed in the up-down direction, the center line C passes through the center position in the second direction of at least one heating element H arranged below the first metal plate 11 and extends in the first direction. The second-direction interval SA between the first pillar connection structure U11 and the second pillar connection structure U12 is wider than the second-direction interval SB between the first pillar connection structure U11 and the third pillar connection structure U13 adjacent to the first pillar connection structure U11 on the first side in the second direction. The second-direction interval SA between the first pillar connection structure U11 and the second pillar connection structure U12 is wider than the second-direction interval SC between the second pillar connection structure U12 and the fourth pillar connection structure U14 adjacent to the second pillar connection structure on the other side in the second direction. Thus, the flow rate of the vapor of the working medium 15 flowing between the first pillar connection structure U11 and the second pillar connection structure U12 can be increased, and the cooling efficiency of the central portion of the heating element H that is prone to heat generation can be improved.
[0109] In addition, in Figure 10 a protruding piece 111 extending to the other side in the first direction from the outer edge extending in the second direction on the other side in the first direction of the first metal plate 11 is illustrated. Here, Figure 11 is an enlarged perspective view of the main part around the protruding portion T.
[0110] The protruding portion T is composed of the protruding piece 111 and a protruding piece 121 extending to the other side in the first direction from the outer edge extending in the second direction on the other side in the first direction of the second metal plate 12. The protruding piece 111 and the protruding piece 121 overlap in the up-down direction. A communication portion 60 is formed in the wall portion 12W extending in the up-down direction and in the second direction from the protruding piece 121 to the second metal plate 12.
[0111] In the case where the liquid working medium 15 is injected into the internal space 10A of the housing 10, the working medium 15 is injected into the internal space 10A from the outside via the communication part 60 that communicates the outside of the housing 10 with the internal space 10A. And, after the injection, by flattening a part of the communication part 60 to become Figure 11 the state where the working medium 15 does not leak to the outside. Alternatively, the entire communication part 60 may be flattened.
[0112] In this way, the housing 10 has the protruding part T that protrudes in the first direction from the outer edge extending in the second direction of the first metal plate 11 and the outer edge extending in the second direction of the second metal plate 12. Thus, in the case where the protruding part T is used as the water injection port, the working medium 15 can flow along the connecting part 32, and it is easy to make the working medium 15 cover a relatively large range of the internal space 10A.
[0113] In addition, as Figure 10 shown, the protruding piece 111 is arranged between the first pillar connection structure U11 and the second pillar connection structure U12. That is, when viewed from the up-down direction, the protruding part T is arranged between the connecting parts 32 adjacent in the second direction. Thus, it is easy to inject the working medium 15 into the area between the specific connecting parts 32.
[0114] <4. Other>
[0115] The above has described the embodiments of the present invention. In addition, the scope of the present invention is not limited to the above embodiments. The present invention can be implemented by making various changes to the above embodiments without departing from the gist of the invention. In addition, the matters described in the above embodiments can be appropriately combined arbitrarily without causing contradictions.
[0116] The present invention can be used, for example, for cooling various heating elements.
Claims
1. A heat-conducting component, comprising: A housing having an internal space; A capillary core structure disposed in the internal space; A working medium disposed in the internal space; And A plurality of struts disposed in the internal space, The housing includes: A first metal plate; and A second metal plate, which is disposed opposite to the first metal plate in the vertical direction and above the first metal plate, Characterized in that The internal space is formed between the first metal plate and the second metal plate in the vertical direction, A plurality of strut connection structures are disposed in the internal space, Each of the strut connection structures has: A group of the struts disposed at intervals in a first direction orthogonal to the vertical direction; and A connecting portion extending in the first direction, the connecting portion connecting at least any adjacent struts in the first direction of a group of the struts, The plurality of strut connection structures are arranged at intervals in a second direction orthogonal to the vertical direction and the first direction, In each of the strut connection structures, the width of the connection portion of one of the struts and one of the connecting portions in the second direction is smaller than the maximum width of the one of the struts in the second direction. When viewed from the first direction, one of the connecting portions is disposed between one end of the one of the struts in the second direction and the other end in the second direction.
2. The heat-conducting component according to claim 1, characterized in that The connecting portion of at least one of the strut connection structures and the second metal plate form a single component.
3. The heat-conducting component according to claim 2, characterized in that The lower end surface of the connecting portion of at least one of the strut connection structures is connected to the upper surface of the capillary core structure disposed on the upper surface of the first metal plate.
4. The heat-conducting component according to claim 1 or 2, characterized in that The connecting portion of at least one of the strut connection structures connects the first metal plate and the second metal plate in the vertical direction.
5. The heat-conducting component according to claim 1, characterized in that The connecting portion of at least one of the strut connection structures is solid.
6. The heat-conducting component according to claim 5, characterized in that In at least one of the strut connection structures, the struts connected in the first direction by the connecting portion are solid.
7. The heat-conducting component according to claim 5 or 6, characterized in that In at least one of the strut connection structures, A group of the struts connected in the first direction by the connecting portion connect the first metal plate and the second metal plate in the vertical direction, The lower end of the connecting portion is located at a position above the lower ends of a group of the struts, The capillary core structure received in the first metal plate is disposed below the connecting portion.
8. The heat-conducting component according to claim 5 or 6, characterized in that In at least one of the strut connection structures, A group of the struts connected in the first direction by the connecting portion connect the first metal plate and the second metal plate in the vertical direction, The upper end of the connecting portion is located at a position lower than the upper ends of a set of the struts. The wick structure body accommodated in the second metal plate is disposed above the connecting portion.
9. The heat conducting component according to any one of claims 1 to 3, wherein the connecting portion of at least one of the strut connection structures is a part of the wick structure body.
10. The heat conducting component according to claim 9, wherein in at least one of the strut connection structures, the struts connected by the connecting portion in a first direction are a part of the wick structure body.
11. The heat conducting component according to any one of claims 1 to 3, wherein the plurality of strut connection structures include an adjacent one of the strut connection structures and another one of the strut connection structures, the connecting portion of one of the strut connection structures is disposed adjacent to at least one side of a second direction side and a second direction other side of a strut of another one of the strut connection structures, the width of the connecting portion of one of the strut connection structures in a second direction is smaller than the maximum width of the strut of one of the strut connection structures in the second direction.
12. The heat conducting component according to any one of claims 1 to 3, wherein in the strut connection structure, the struts disposed at one end in a first direction and the struts disposed at the other end in the first direction are connected by the connecting portion, a center line is disposed between the first strut connection structure and a second strut connection structure adjacent to the other side in a second direction of the first strut connection structure, and the center line passes through the center position in a second direction of at least one heating element disposed below the first metal plate and extends in a first direction when viewed from the up-down direction, the second direction interval between the first strut connection structure and the second strut connection structure is wider than the second direction interval between the first strut connection structure and a third strut connection structure adjacent to the one side in a second direction of the first strut connection structure, the second direction interval between the first strut connection structure and the second strut connection structure is wider than the second direction interval between the second strut connection structure and a fourth strut connection structure adjacent to the other side in a second direction of the second strut connection structure.
13. The heat conducting component according to any one of claims 1 to 3, wherein the housing has a protruding portion that protrudes in a first direction from an outer edge extending in a second direction of the first metal plate and an outer edge extending in a second direction of the second metal plate, for injecting a working medium into the internal space from the outside.
14. The heat conducting component according to claim 13, wherein when viewed from a first direction, the protruding portion is disposed between the connecting portions of the strut connection structures adjacent in a second direction.
Citation Information
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