tactile effect device

Abstract

A device includes a substrate layer having a first side and a second side. The second side of the substrate layer may include at least one recess. The device also includes a touch interface surface on the first side of the substrate layer. The device also includes at least one piezoelectric transducer on the second side of the substrate layer, the at least one piezoelectric transducer including a support plate and a piezoelectric element. The at least one piezoelectric transducer is aligned with the at least one recess of the substrate layer. The device also includes a printed circuit board (PCB) layer electrically coupled to the piezoelectric element of the piezoelectric transducer. The device can function as a touchpad.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and more particularly, to an electronic device for sensing and / or for providing haptic effects. Background Art

[0002] In various applications, haptic effects provided by haptic effect elements such as piezoelectric transducers can be utilized to provide a tactile sensation to a user. For example, in a touch-based user interface, such as in a portable computer trackpad, a clicking sensation can be provided to a user without significantly moving the touched surface. Summary of the Invention

[0003] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0004] An object is to provide an electronic device for sensing and / or for providing tactile effects. The aforementioned and other objects are achieved by the features of the independent claims. Further embodiments are apparent from the dependent claims, the description and the drawings.

[0005] According to a first aspect, a device includes: a substrate layer having a first side and a second side, wherein the second side of the substrate layer includes at least one recess; a touch interface surface on the first side of the substrate layer; at least one piezoelectric transducer on the second side of the substrate layer, the at least one piezoelectric transducer including a support plate and a piezoelectric element, wherein the at least one piezoelectric transducer is aligned with the at least one recess of the substrate layer; and a printed circuit board (PCB) layer electrically coupled to the piezoelectric element of the piezoelectric transducer. For example, the device can be thinner because the recess can be implemented in the substrate layer.

[0006] In an implementation form of the first aspect, the device further comprises a touch interface layer having a first side and a second side, wherein the substrate layer is positioned on the second side of the touch interface layer, the first side of the substrate layer faces the touch interface layer, and the touch interface surface is located on the first side of the touch interface layer. For example, the device can be more robust because the touch interface layer can protect other layers of the device.

[0007] In a further implementation of the first aspect, the device further comprises a support structure and at least one support element aligned with the at least one piezoelectric transducer, wherein the at least one piezoelectric transducer is supported by the support structure via the at least one support element. For example, the device can more efficiently deliver haptic effects to the touch interface surface.

[0008] In a further implementation of the first aspect, the at least one supporting element comprises an adhesive.For example, the device can be manufactured more efficiently.

[0009] In a further embodiment of the first aspect, the support structure comprises at least one protrusion on the side facing the PCB layer aligned with the at least one support element. For example, the device can be more robust because the protrusion can prevent excessive bending of the piezoelectric element.

[0010] In a further implementation of the first aspect, the substrate layer includes conductive traces and electronic components coupled to the conductive traces, and the PCB layer includes conductive traces electrically coupled to the conductive traces of the substrate layer. For example, the device can be thinner because the electronic components can be placed on the substrate layer, and signals to / from the piezoelectric transducer can be sent through the PCB layer.

[0011] In a further embodiment of the first aspect, the support plate and / or the piezoelectric element of at least one piezoelectric transducer are electrically coupled to the PCB layer via a conductive adhesive element. For example, the device can be thinner because signals to / from the piezoelectric element and support plate can be transmitted through the PCB layer.

[0012] In a further implementation of the first aspect, the conductive adhesive element comprises conductive glue.For example, the device can be thinner because the signals to / from the piezoelectric element and the support plate can be sent through the PCB layer.

[0013] In a further embodiment of the first aspect, the piezoelectric element of the at least one piezoelectric transducer is electrically coupled to the PCB layer via a solder joint, the support plate of the at least one piezoelectric transducer is electrically coupled to the PCB layer via a solder joint, and / or the PCB layer is electrically coupled to the substrate layer via a solder joint. For example, the device can be manufactured more efficiently because the solder joints can be manufactured using, for example, hot bar soldering.

[0014] In a further embodiment of the first aspect, the support plate of at least one piezoelectric transducer is electrically coupled to the substrate layer or to the PCB layer. For example, the device can transmit a signal to the substrate via the substrate layer or the PCB layer.

[0015] In a further embodiment of the first aspect, the second side of the substrate layer comprises at least one electrical contact, and wherein the support plate of the at least one piezoelectric transducer is electrically coupled to the at least one electrical contact. For example, the device can transmit a signal through the substrate layer to the support plate.

[0016] In a further implementation form of the first aspect, the substrate layer includes a capacitive touch detection layer. For example, the device can use the capacitive touch detection layer to detect touches on the touch interface surface.

[0017] In a further implementation of the first aspect, the device further comprises a second PCB layer on the second side of the touch interface layer and on the first side of the substrate layer. For example, the device can be thinner because electronic components can be attached to the second PCB layer.

[0018] In a further implementation form of the first aspect, the second side of the substrate layer comprises an electrical connector for electrically coupling the device to a second device. For example, the device may only require a single electrical connector.

[0019] It should be understood that the above-mentioned embodiments of the first aspect can be used in combination with each other. Several embodiments can be combined to form further embodiments.

[0020] According to a second aspect, a touch panel comprises the device according to the first aspect.

[0021] Many of the additional features will be more readily appreciated as they become better understood by reference to the following detailed description considered in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In the following, exemplary embodiments are described in more detail with reference to the accompanying figures and drawings, in which:

[0023] Figure 1 illustrates a cross-sectional view of an apparatus according to an embodiment;

[0024] Figure 2 illustrates a cross-sectional view of a device further comprising a touch interface layer according to an embodiment;

[0025] Figure 3 illustrates a cross-sectional view of an apparatus further comprising a carrier structure according to an embodiment;

[0026] Figure 4 illustrates a cross-sectional view of a device further comprising an isolation layer according to an embodiment;

[0027] Figure 5 illustrates a cross-sectional view of a device further comprising a press-in nut according to an embodiment;

[0028] Figure 6 illustrates a cross-sectional view of a device further comprising electrical contacts on a substrate layer according to an embodiment;

[0029] Figure 7 illustrates a cross-sectional view of a device according to an embodiment wherein a support plate of a piezoelectric transducer is electrically coupled to a substrate layer;

[0030] Figure 8 illustrates a cross-sectional view of an apparatus according to an embodiment, wherein the support structure includes a protrusion;

[0031] Figure 9illustrates a cross-sectional view of a device further comprising a second PCB layer according to an embodiment;

[0032] Figure 10 illustrates a cross-sectional view of an apparatus further comprising an electrical connector according to an embodiment;

[0033] Figure 11 illustrates a cross-sectional view of a device further comprising an electronic component according to an embodiment;

[0034] Figure 12 FIG2 illustrates a schematic diagram of PCB layers according to an embodiment;

[0035] Figure 13 FIG2 illustrates a schematic diagram of a PCB layer according to another embodiment;

[0036] Figure 14 FIG2 illustrates a schematic diagram of a PCB layer according to another embodiment;

[0037] Figure 15 A schematic diagram illustrating a portable computer according to an embodiment; and

[0038] Figure 16 A schematic diagram illustrating a connection between a device and a second device according to an embodiment is illustrated.

[0039] Hereinafter, the same reference numerals are used to designate the same components in the drawings. DETAILED DESCRIPTION

[0040] In the following description, reference is made to the accompanying drawings, which form a part of this disclosure and in which are shown by way of illustration specific aspects in which the present disclosure may be placed. It will be understood that other aspects may be utilized and structural or logical changes may be made without departing from the scope of this disclosure. Therefore, the following detailed description should not be construed in a limiting sense, as the scope of the present disclosure is defined by the appended claims.

[0041] For example, it should be understood that the disclosure in conjunction with the described method may also apply to a corresponding device or system configured to perform the method, and vice versa. For example, if a specific method step is described, the corresponding device may include a unit that performs the described method step, even if the unit is not explicitly described or illustrated in the figure. On the other hand, for example, if a specific device is described based on a functional unit, the corresponding method may include steps that perform the described function, even if such steps are not explicitly described or illustrated in the figure. In addition, it should be understood that the features of the various exemplary aspects described herein may be combined with each other unless otherwise specifically stated.

[0042] Figure 1 A cross-sectional view of an apparatus 100 according to an embodiment is illustrated.

[0043] Apparatus 100 may also be referred to as an apparatus for providing a haptic effect, an apparatus for providing haptic feedback, or the like.

[0044] In this document, the side of a layer may also be referred to as the face or surface of the layer. For example, the first side of a layer may also be referred to as the first face or first surface of the layer.

[0045] Herein, when referring to a first side and a second side of a layer, the first side may be opposite the second side.

[0046] The cross-sectional geometries and / or dimensions presented in the embodiments herein are exemplary only and may not reflect the actual geometries and / or dimensions of the parts / layers / components presented. The thickness of a layer may be less than one millimeter, while the lateral dimensions of a layer may be multiple centimeters. Therefore, for purposes of clarity of presentation, dimensions are generally not to scale.

[0047] The device 100 may include a substrate layer 102 having a first side and a second side. The second side of the substrate layer 102 may include at least one recess 103.

[0048] The recess may refer to a portion on the surface of the substrate layer 102 that is recessed compared to the rest of the surface.

[0049] The depression 103 may also be referred to as a cavity, an indentation, a groove, a dimple, or the like.

[0050] The substrate layer 102 may also be referred to as a printed circuit board (PCB), a PCB layer, a printed circuit board assembly (PCBA), a PCBA layer, or the like.

[0051] The substrate layer 102 may comprise, for example, a dielectric composite material. The composite material may comprise a matrix, such as an epoxy resin, and reinforcements, such as woven or sometimes non-woven glass fibers. Fillers may be added to the resin.

[0052] The thickness of the substrate layer 102 may be, for example, in the range of 0.1 to 2 mm or any sub-range therein, such as 0.2 to 1 mm, 0.4 to 1 mm, or 0.5 to 0.8 mm.

[0053] The depth of the recess 103 may be, for example, in the range of 10 to 1000 micrometers (μm) or any sub-range therein, such as 10 to 500 μm, 10 to 200 μm, or 200 to 500 μm.

[0054] The device 100 may also include a touch interface surface 120 on the first side of the substrate layer 102 .

[0055] Touch interface surface 120 may be at least partially unobstructed. A user may touch the unobstructed portion of touch interface surface 120, and device 100 may detect the touch through touch interface surface 120 and / or provide haptic effects / feedback to the user.

[0056] In a typical usage scenario of device 100, touch interface surface 120 may face upwards. This may be the case, for example, when device 100 is an embodiment of a portable computer touchpad.

[0057] The touch interface surface 120 may correspond to, for example, a first side of the substrate layer 102 . Figure 1 An example of this is illustrated in the embodiment of Alternatively, the device 100 may include one or more layers on the first side of the substrate layer 102 and the touch interface surface 120 may correspond to the surface of such layers.

[0058] Touch interface surface 120 may also be referred to as a touch interface, touch surface, or the like.

[0059] The substrate layer 102 may include a capacitive touch detection layer that may be configured to detect a touch on the touch interface surface 120 .

[0060] The device 100 may further include at least one piezoelectric transducer 104 on the second side of the substrate layer 102, the at least one piezoelectric transducer 104 including a support plate 105 and a piezoelectric element 106. The at least one piezoelectric transducer 104 may be aligned with the at least one recess 103 of the substrate layer 102.

[0061] The support plate 105 may be mechanically coupled to the second side of the substrate layer 102. The support plate 105 may be in contact with the second side of the substrate layer 102. For example, the support plate 105 may cover the at least one recess 103.

[0062] The support plate 105 may include a conductive material. The support plate 105 may include, for example, a metal such as copper and / or zinc, or a metal alloy such as brass, steel, or stainless steel.

[0063] The piezoelectric element 106 may include a piezoelectric material. When a voltage is applied to the piezoelectric element 106, a strain may be induced in the piezoelectric element 106. Thus, by applying a voltage between the support plate 105 and the opposing sides of the piezoelectric element 106, a tactile effect may be generated.

[0064] The piezoelectric element 106 may be adhered to the support plate 105 by adhesive and / or glue.

[0065] The at least one piezoelectric transducer 104 may also include electrodes on the piezoelectric element 106. The piezoelectric element 106 may be electrically coupled to other elements of the device 100 via the electrodes. The electrodes may include, for example, screen-printed silver or other conductive material.

[0066] The at least one piezoelectric transducer 104 may also be referred to as a haptic element, a haptic feedback element, a tactile feedback element, a piezo actuator, a piezoelectric actuator, or the like.

[0067] While at least one piezoelectric transducer 104 can be configured to provide a haptic effect when a voltage is applied across piezoelectric element 106, at least one piezoelectric transducer 104 can also be used to detect touches on, for example, touch interface surface 120. When a force is applied to touch interface surface 120, stress can be induced in piezoelectric element 106, and the stress can induce a voltage across piezoelectric element 106. This voltage can be detected.

[0068] If substrate layer 102 includes a capacitive touch detection layer, both the capacitive touch detection layer and the at least one piezoelectric transducer 104 can be used to detect a touch. In addition, the at least one piezoelectric transducer 104 can be used to detect the amount of force applied to touch interface surface 120. Thus, a user can use the location of the touch and the amount of force applied to control touch device 100 and / or a device in which device 100 is implemented.

[0069] In this document, when two components are aligned, this may indicate that the components are aligned with each other in the plane of the relevant layers. Thus, the components are aligned when viewed from a first side or from a second side. The components may also be referred to as overlapping or at least partially overlapping.

[0070] The support plate 105 may contact the edge of the recess 103. Thus, when the haptic actuator 104 provides a haptic effect, the central area of ​​the support plate 105 may bend into the recess 103. The depth of the recess 103 may be configured to stop the piezoelectric element 106 from overbending.

[0071] The thickness of the at least one piezoelectric transducer 104 may be, for example, in the range of 100 micrometers (μm) to 1 mm, or any sub-range therein, such as 100 to 800 μm, 100 to 500 μm, or 100 to 300 μm.

[0072] The apparatus 100 may further include a printed circuit board (PCB) layer 107 electrically coupled to the piezoelectric element 106 of the at least one piezoelectric transducer 104 .

[0073] The PCB layer 107 may include, for example, a flexible circuit layer, a flexible printed circuit (FPC) layer, a conductive foil layer, or a printed electronics layer.

[0074] The PCB layer 107 may also be electrically coupled to the support plate 105 of the at least one piezoelectric transducer 104 .

[0075] The support plate 105 and / or the piezoelectric element 106 of the at least one piezoelectric transducer 104 may be electrically coupled to the PCB layer 107 via the conductive adhesive element 110 .

[0076] The PCB layer 107 may include conductive traces. The support plate 105 and / or the piezoelectric element 106 of the at least one piezoelectric transducer 104 may be electrically coupled to the conductive traces of the PCB layer 107 via the conductive adhesive element 113.

[0077] The conductive adhesive elements 110, 113 may include conductive tape, such as anisotropic conductive film (ACF) and / or conductive glue, such as silver glue. The conductive glue may also be referred to as conductive glue.

[0078] The thickness of the conductive adhesive element 110 may be in the range of 10 to 500 μm or any sub-range therein, such as 10 to 300 μm, 20 to 200 μm, or 100 to 300 μm.

[0079] The diameter of the conductive adhesive element 110 can be in the range of 1 to 100 mm or any sub-range therein, such as 1 to 50 mm, 2 to 20 mm, or 1 to 10 mm.

[0080] PCB layer 107 may also be referred to as a flexible printed circuit (FPC), an FPC layer, a flexible circuit layer, or the like.

[0081] The PCB layer 107 may include, for example, a flexible plastic substrate such as polyimide, polyetheretherketone, or transparent conductive polyester.

[0082] PCB layer 107 may include conductive traces. The conductive traces may be electrically coupled to piezoelectric element 106 and / or support plate 105 of at least one piezoelectric transducer 104. Thus, PCB layer 107 may carry electrical signals for driving at least one piezoelectric transducer 104 and / or signals from at least one piezoelectric transducer 104 for detecting touch.

[0083] The thickness of the PCB layer 107 may be in the range of 10 to 500 μm or any sub-range therein, such as 10 to 300 μm, 50 to 300 μm, or 50 to 200 μm.

[0084] In this context, a layer may refer to a structure whose lateral dimensions are substantially greater than its thickness. In this sense, a layer may be considered a thin structure.

[0085] The device 100 may also include an adhesive layer 111 between the substrate layer 102 and the PCB layer 107. The adhesive layer 111 may not be a uniform layer. Instead, for example, Figure 1 As shown in the embodiment of FIG, the adhesive layer 111 may only be present in some areas between the substrate layer 102 and the PCB layer 107.

[0086] The substrate layer 102 can be electrically coupled to the PCB layer 107 via electrical connectors 112. The electrical connectors 112 can include, for example, an anisotropic conductive film (ACF) connector or a solder joint. The solder joint can be made using, for example, hot bar soldering.

[0087] The piezoelectric element 106 of the at least one piezoelectric transducer 104 may be electrically coupled to the PCB layer 107 via a solder joint.

[0088] The support plate 105 of the at least one piezoelectric transducer 104 may be electrically coupled to the PCB layer 107 via a solder joint.

[0089] The PCB layer 107 may be electrically coupled to the substrate layer 102 via solder joints.

[0090] The solder joints disclosed herein can be fabricated using, for example, soldering or reflow soldering.

[0091] It should be understood that for the purpose of clarity, Figure 1 Some reference numerals are omitted in the drawings and other figures. Figure 1 Two piezoelectric transducers 104 are illustrated in the embodiment of FIG. 1 , but only one of the two piezoelectric transducers 104 is provided with a reference number.

[0092] Figure 2 A cross-sectional view of a device further comprising a touch interface layer 101 is illustrated according to an embodiment.

[0093] According to an embodiment, device 100 includes a touch interface layer 101 having a first side and a second side. Substrate layer 102 can be positioned on the second side of touch interface layer 101, and the first side of substrate layer 102 can face touch interface layer 101. Touch interface surface 120 can be on the first side of touch interface layer 101.

[0094] Touch interface surface 120 may correspond to a first side of touch interface layer 101 .

[0095] The touch interface layer 101 may include, for example, glass or plastic.

[0096] One side of touch interface layer 101 may be at least partially unobstructed. A second side of touch interface layer 101 may face substrate layer 102, and a first side of touch interface layer 101 may be at least partially unobstructed. A user may touch the unobstructed portion of touch interface layer 101, and device 100 may detect the touch through touch interface layer 101 and / or provide tactile effects / feedback to the user.

[0097] In a typical usage scenario of device 100, the first side of touch interface layer 101 may face upward, while the second side of touch interface layer 101 may face downward. This may be the case, for example, when device 100 is an embodiment in a touchpad of a portable computer.

[0098] Touch interface layer 101 may also be referred to as a top layer, a touch layer, or the like.

[0099] The thickness of the touch interface layer 101 can be, for example, in the range of 0.1 millimeters (mm) to 3 mm, or any sub-range therein, such as 0.2 to 2 mm, 0.3 to 1 mm, or 0.3 mm to 0.7 mm.

[0100] Device 100 may also include an adhesive layer 114 between touch interface layer 101 and substrate layer 102. Adhesive layer 114 may be on the second side of touch interface layer 101 and on the first side of substrate layer 102. For example, adhesive layer 114 may have a thickness in the range of 10 to 200 μm, or in any sub-range therein, such as 10 to 100 μm, 20 to 100 μm, or 30 to 80 μm.

[0101] Figure 3 A cross-sectional view of the apparatus 100 further comprising a carrier structure 108 is illustrated according to an embodiment.

[0102] According to an embodiment, the device 100 further comprises a carrier structure 108 and at least one support element 109 aligned with the at least one piezoelectric transducer 104. The at least one piezoelectric transducer 104 may be supported by the carrier structure 108 via the at least one support element 109.

[0103] The carrying structure 108 may comprise, for example, a so-called C-cover of a laptop computer. The C-cover may refer to the surface / side of the laptop computer, in which the touchpad and keyboard are mounted.

[0104] Carrying structure 108 may be mechanically coupled to piezoelectric element 106 of at least one piezoelectric transducer 104 via at least one support element 109 .

[0105] Carrying structure 108 may support piezoelectric element 106 of at least one piezoelectric transducer 104 via at least one supporting element 109 .

[0106] PCB layer 107 may have a first side and a second side. At least one piezoelectric transducer may be on the first side of PCB layer 107. At least one support element 109 may be on the second side of PCB layer 107. At least one support element 109 may be on the second side of PCB layer 107. Support structure 108 may be on the second side of PCB layer 107.

[0107] The thickness of the at least one support element 109 may be in the range of 10 μm to 5 mm or any sub-range therein, such as 10 μm to 2 mm, 50 μm to 1 mm, or 100 to 300 μm.

[0108] The diameter of the at least one support element 109 may be in the range of 1 to 100 mm or any sub-range therein, such as 1 to 50 mm, 2 to 20 mm, or 1 to 10 mm.

[0109] This structure may be referred to as a "floating" structure. Figure 3 Since the at least one piezoelectric transducer 104 is supported by the at least one support element 109 , the transfer of tactile effects from the piezoelectric transducer 104 to the touch interface surface 120 may be improved.

[0110] The support structure 108 may be a layer structure or a substantially planar structure. Figure 3 As shown in the embodiment of FIG, the carrier structure 108 can be formed as a container in which other layers and components disclosed herein can be placed.

[0111] According to an embodiment, the at least one supporting element 109 comprises an adhesive. The at least one supporting element 109 may also be referred to as an adhesive point, a reinforcement, a supporting structure or the like. Alternatively or additionally, the at least one supporting element 109 may comprise a rigid structure.

[0112] Figure 4 A cross-sectional view of the device 100 further comprising an isolation layer 301 is illustrated according to an embodiment.

[0113] The device 100 may further include an isolation layer 301. The isolation layer may be positioned between the PCB layer 107 and the carrier structure 108. The device 100 may further include an adhesive layer 302 between the isolation layer 301 and the carrier structure 108.

[0114] If at least one supporting element 109 is implemented as an adhesive dot, the adhesive dot alone may be difficult to assemble to the PCB layer 107. Therefore, the adhesive dot can be assembled to the carrier structure 108. The isolation layer 301 can then be a single part as a single module, which includes the adhesive dot.

[0115] The thickness of the isolation layer 301 may be in the range of 10 to 200 μm or any sub-range therein, such as 10 to 100 μm, 10 to 50 μm, or 20 to 50 μm.

[0116] The thickness of adhesive layer 302 may be in the range of 10 to 200 μm or any sub-range therein, such as 10 to 100 μm, 20 to 100 μm, or 30 to 80 μm.

[0117] Figure 5 A cross-sectional view of the device 100 further comprising a press-in nut 402 is illustrated according to an embodiment.

[0118] PCB layer 107 may also include a sheet layer 401 and a press nut 402. Screws / bolts 403 may be screwed into press nut 402 through carrier structure 108. Thus, the layers of device 100 may be easily attached to and detached from carrier structure 108.

[0119] The thickness of the press nut 402 may be in the range of 0.5 to 50 mm or any sub-range therein, such as 1 to 20 mm, 1 to 10 mm, or 1 to 5 mm.

[0120] The diameter of the press nut 402 may be in the range of 1 to 50 mm or any sub-range therein, such as 1 to 20 mm, 2 to 10 mm, or 2 to 7 mm.

[0121] Figure 6 Illustrated is a cross-sectional view of the device 100 further comprising an electrical contact 501 on the substrate layer 102 according to an embodiment.

[0122] The support plate 105 of the at least one piezoelectric transducer 104 can be electrically coupled to the substrate layer 102. In this way, electrical signals can be carried to / from the support plate 105 through the substrate layer 102. The substrate layer 102 can include conductive traces for carrying signals to / from the support plate 105. As a result, the structure of the PCB layer 107 can be simplified.

[0123] The second side of substrate layer 102 may include at least one electrical contact 501. Support plate 105 of at least one piezoelectric transducer 104 may be electrically coupled to at least one electrical contact 501. Substrate layer 102 may include conductive traces for carrying signals to / from support plate 105, and the conductive traces may be electrically coupled to at least one electrical contact 501. Electrical contact 501 may include a contact pad.

[0124] Figure 7 A cross-sectional view of a device 100 is shown, wherein a support plate 105 of at least one piezoelectric transducer 104 is electrically coupled to a substrate layer 102 , according to an embodiment.

[0125] The support plate 105 of the at least one piezoelectric transducer 104 can be electrically coupled to the substrate layer 102 via an electrical connector 601. The electrical connector 601 can include, for example, a conductive adhesive such as silver glue, or a solder joint. The solder joint can be made using, for example, hot rod soldering.

[0126] Figure 8 A cross-sectional view of the device 100 is shown according to an embodiment, wherein the carrier structure 108 comprises a protrusion 701 .

[0127] The carrier structure 108 may include at least one protrusion 701 on a side facing the PCB layer 107 aligned with the at least one supporting element 109 .

[0128] The protrusion 701 may also be referred to as a projection, a protruding element, a protruding element, or the like.

[0129] The at least one protrusion 701 may be produced by milling the carrier structure 108 , for example.

[0130] The at least one protrusion 701 may serve as a so-called "front stop".

[0131] At least one support element 109 can be relatively small and tall. Therefore, if a significant force is applied to touch interface surface 101, at least one support element 109 may deform at least one piezoelectric transducer 104. The at least one support element 109 should be of the necessary height to ensure that PCB layer 107 does not contact support structure 108 when relatively high pressure is applied between two or more support elements 109, as this could cause the entire stack to bend. Therefore, sufficient height may be required in the areas between piezoelectric transducers 104. A positive stop can prevent excessive bending of the stack at the location of the at least one piezoelectric transducer 104, while ensuring sufficient bending of the entire stack at locations outside of the at least one piezoelectric transducer 104. Therefore, at least one protrusion 701 can be similar in size to or larger than the at least one piezoelectric transducer 104.

[0132] Figure 9 A cross-sectional view of the apparatus 100 further comprising a second PCB layer 802 is illustrated according to an embodiment.

[0133] Device 100 may further include a second PCB layer 802 on the second side of touch interface layer 101 and on the first side of substrate layer 102 .

[0134] The second PCB layer 802 may include, for example, a flexible circuit layer, a flexible printed circuit (FPC) layer, a conductive foil layer, or a printed electronics layer.

[0135] The second PCB layer 802 may have a first side surface and a second side surface. The first side surface of the second PCB layer 802 may face the touch interface layer 101 , and the second side surface of the second PCB layer 802 may face the substrate layer 102 .

[0136] Apparatus 100 may further include an adhesive layer 801 between second PCB layer 802 and touch interface layer 101 .

[0137] Second PCB layer 802 may include conductive traces electrically coupled to conductive traces of substrate layer 102 and / or PCB layer 107 .

[0138] Second PCB layer 802 may include electronic components 902. Electronic components 902 may be electrically coupled to conductive traces in second PCB layer 802.

[0139] Electronic component 902 may be on the second side of second PCB layer 802 .

[0140] The substrate layer 102 and / or the PCB layer 107 may include through-holes for the electronic components 902 .

[0141] Since electronic component 902 may have a predetermined height, how thin device 100 can be may be limited by that height. Figure 9 By placing the electronic components 902 on the second PCB layer 802 , the device 100 can be made thinner as shown in the embodiment of FIG.

[0142] The electronic components 902 may include, for example, an analog front end (AFE), a system on a chip (SoC), a field programmable gate array (FPGA), a controller chip, and / or other surface mount technology (SMT) components.

[0143] According to an embodiment, the second PCB layer 802 includes an electrical connector 901 for electrically coupling the device 100 to a second device.

[0144] Electrical connector 901 may carry electrical signals from outside of device 100 to second PCB layer 802 and carry signals from second PCB layer 802 to outside of device 100 .

[0145] Because second PCB layer 802 may be electrically coupled to substrate layer 102 and / or to PCB layer 107 , signals from and / or to PCB layer 107 / substrate layer 102 may be carried by electrical connector 901 through second PCB layer 802 .

[0146] PCB layer 107 , adhesive layer 111 , substrate layer 102 , adhesive layer 114 and / or carrier structure 108 may include through-holes for electrical connector 901 .

[0147] Figure 10 A cross-sectional view of the apparatus 100 further comprising an electrical connector 901 is illustrated according to an embodiment.

[0148] According to an embodiment, the second side of the substrate layer 101 includes an electrical connector 901 for electrically coupling the device 100 to a second device.

[0149] The electrical connector 901 may carry electrical signals from outside the device 100 to the substrate layer 102 and carry signals from the substrate layer 102 to outside the device 100 .

[0150] Because PCB layer 107 can be electrically coupled to substrate layer 102, signals from and / or to PCB layer 107 can be carried by electrical connector 901 through substrate layer 102. Therefore, only one electrical connector 901 may be needed to carry signals to / from components in substrate layer 102 and in PCB layer 107.

[0151] PCB layer 107 , adhesive layer 111 and / or carrier structure 108 may include through-holes for electrical connector 901 .

[0152] Figure 11 A cross-sectional view of an apparatus 100 further comprising electronic components 1001 , 1002 according to an embodiment is illustrated.

[0153] The substrate layer 102 may include conductive traces and electronic components 1001 coupled to the conductive traces.

[0154] The PCB layer 107 may include conductive traces electrically coupled to the conductive traces of the substrate layer 102 .

[0155] The conductive traces of the PCB layer 107 may be electrically coupled to the piezoelectric element 106 and / or the support plate 105 of the at least one piezoelectric transducer 104 .

[0156] PCB layer 107 may include electronic components 1002. Electronic components 1002 may be electrically coupled to conductive traces in PCB layer 107.

[0157] The electronic components 1001 , 1002 may include, for example, an analog front end (AFE), a system on a chip (SoC), a field programmable gate array (FPGA), a controller chip, and / or other surface mount technology (SMT) components.

[0158] Figure 12 A schematic diagram of the PCB layer 107 according to an embodiment is shown.

[0159] The apparatus 100 may comprise, for example, Figure 12 The PCB layer 107 may include eight piezoelectric transducers 104 in the embodiment shown. Figure 12 The unified PCB shown in the embodiment.

[0160] Figure 13 A schematic diagram of the PCB layer 107 according to another embodiment is shown.

[0161] The apparatus 100 may comprise, for example, Figure 13 In the embodiment shown there are six piezoelectric transducers 104 .

[0162] PCB layer 107 may include multiple PCBs that are not uniform. Figure 13 In the embodiment of FIG. 5 , the PCB layer 107 includes two PCBs and each PCB is electrically coupled to three piezoelectric transducers 104 .

[0163] Using fewer piezoelectric transducers 104 may save manufacturing costs for device 100 because fewer piezoelectric transducers 104 may be needed and less material may be needed for PCB layer 107. This may also make assembly of device 100 easier.

[0164] Figure 14 A schematic diagram of the PCB layer 107 according to another embodiment is shown.

[0165] Material costs can be reduced by shaping the PCB layer 107 in a manner that requires less material. Examples of such shaping are Figure 14 This can also make assembly of the device 100 easier.

[0166] Figure 15 A schematic diagram of a portable computer 1400 according to an embodiment is illustrated.

[0167] The portable computer 1400 may include a touchpad 1401. The portable computer 1400 may also include a keyboard 1402, a screen 1403, and a housing 1404. The portable computer 1400 may also include a touchpad 1401. Figure 15 Various other components are depicted in the embodiments.

[0168] According to an embodiment, the touch panel 1401 includes the device 100. The touch panel 1401 may also be referred to as a touch pad or the like. A user may operate the portable computer 1400 using the touch panel 1401.

[0169] Figure 16 A schematic diagram illustrating a connection between the device 100 and a second device 1500 according to an embodiment is illustrated.

[0170] The second device 1500 may correspond to, for example Figure 15 The portable computer 1400 or any other electronic device of the embodiments presented in FIG.

[0171] The second device 1500 may be electrically coupled to the device 100 via, for example, the connector 901 .

[0172] Second device 1500 may include, for example, a controller 1501. Controller 1501 may control device 100. Second device 1500 may also include an analog front end (AFE). Second device 1500 may also include a processor 1503. Second device 1500 may also include a memory 1503. Processor 1503 may be coupled to device 100 via, for example, controller 1501 and / or AFE 1502.

[0173] Memory 1504 may include program code, such as a driver, that, when executed on the processor, causes second device 1500 to interface with device 100. Interfacing with device 100 may include, for example, sending signals that cause a piezoelectric transducer in device 100 to provide a haptic effect to a user and / or receiving signals from device 100 corresponding to a user touching a touch interface of device 100.

[0174] Alternatively, some components, such as the controller 1501 and / or the AFE 1502 may be included in the apparatus 100 .

[0175] At least some embodiments disclosed herein may simplify the structure of the device 100 by integrating different subassemblies into one. Surface mount technology (SMT) components may be integrated into the substrate layer 102 .

[0176] At least some embodiments disclosed herein may render components of device 100 less fragile during shipping and / or manufacturing.

[0177] At least some embodiments disclosed herein may make device 100 thinner.

[0178] At least some embodiments disclosed herein can provide better touch sensitivity and / or greater tactile effects in the corners of touch interface surface 120. In conventional structures, when pressing in the corners of a touchpad, the structure may bend over support element 109. In at least some embodiments, force transfer to piezoelectric transducer 104 can be improved.

[0179] At least some embodiments disclosed herein may reduce the number of connectors required for the device 100. The PCB layer 107 may not require a separate connector because connectivity may be achieved through the substrate layer 102.

[0180] Any range or device value given herein may be expanded or changed without losing the effect sought. In addition, any embodiment may be combined with another embodiment unless expressly prohibited.

[0181] Although the subject matter has been described in language specific to structural features and / or acts, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as examples of implementing the claims, and other equivalent features and acts are intended to fall within the scope of the claims.

[0182] It should be understood that the benefits and advantages described above may relate to one embodiment or may relate to several embodiments. The embodiments are not limited to embodiments that solve any or all of the problems described or have any or all of the benefits and advantages described. It should also be understood that reference to "an" item may refer to one or more of these items.

[0183] As used herein, the term "comprising" means including the identified methods, blocks or elements, but such blocks or elements do not comprise an exclusive list and the method or apparatus may contain additional blocks or elements.

[0184] It should be understood that the above description is given only as an example and that various modifications may be made by those skilled in the art. The above description, examples, and data provide a complete description of the structure and use of the exemplary embodiments. Although various embodiments have been described above with a certain degree of particularity or with reference to one or more individual embodiments, those skilled in the art may make various changes to the disclosed embodiments without departing from the spirit or scope of this specification.

Claims

1. A device (100) for providing a tactile effect, comprising: A substrate layer (102) having a first side and a second side, wherein the second side of the substrate layer (102) comprises at least one recess (103); a touch interface surface (120) on the first side of the substrate layer (102); at least one piezoelectric transducer (104) on the second side of the substrate layer (102), the at least one piezoelectric transducer (104) comprising a support plate (105) and a piezoelectric element (106), wherein the at least one piezoelectric transducer (104) is aligned with the at least one recess (103) of the substrate layer (102) in the plane of the substrate layer (102); and a printed circuit board PCB layer (107) electrically coupled to the piezoelectric element (106) of the piezoelectric transducer (104); The support plate (105) is in contact with the second side surface of the substrate layer (102), and the piezoelectric element (106) and the substrate layer (102) are located on opposite sides of the support plate (105).

2. The device (100) according to claim 1 further comprises a touch interface layer (101) having a first side and a second side, wherein the substrate layer (102) is positioned on the second side of the touch interface layer (101), the first side of the substrate layer (102) faces the touch interface layer (101), and the touch interface surface (120) is located on the first side of the touch interface layer (101).

3. The device (100) according to claim 1, further comprising a carrier structure (108) and at least one support element (109) aligned with the at least one piezoelectric transducer (104), wherein the at least one piezoelectric transducer (104) is supported by the carrier structure (108) via the at least one support element (109).

4. The device (100) according to claim 3, wherein the at least one supporting element (109) comprises an adhesive.

5. The device (100) according to claim 3 or claim 4, wherein the carrying structure (108) comprises at least one protrusion (701) on a side facing the PCB layer (107) aligned with the at least one supporting element (109).

6. The apparatus (100) of claim 1 or claim 2, wherein the substrate layer (102) comprises conductive traces and electronic components (1001) coupled to the conductive traces, and wherein the PCB layer (107) comprises conductive traces electrically coupled to the conductive traces of the substrate layer (102).

7. The device (100) of claim 1, wherein the support plate (105) and / or the piezoelectric element (106) of the at least one piezoelectric transducer (104) are electrically coupled to the PCB layer (107) via a conductive adhesive element (110, 113).

8. The device (100) of claim 7, wherein the conductive adhesive element (110, 113) comprises a conductive glue.

9. The device (100) according to claim 1 or claim 2, wherein the piezoelectric element (106) of the at least one piezoelectric transducer (104) is electrically coupled to the PCB layer (107) via a solder joint, the support plate (105) of the at least one piezoelectric transducer (104) is electrically coupled to the PCB layer (107) via a solder joint, and / or the PCB layer (107) is electrically coupled to the substrate layer (102) via a solder joint.

10. The device (100) of claim 1 or claim 2, wherein the support plate (105) of the at least one piezoelectric transducer (104) is electrically coupled to the substrate layer (102) or to the PCB layer (107).

11. The device (100) of claim 1 or claim 2, wherein the second side of the substrate layer (102) comprises at least one electrical contact (501), and wherein the support plate (105) of the at least one piezoelectric transducer (104) is electrically coupled to the at least one electrical contact (501).

12. The apparatus (100) of claim 1 or claim 2, wherein the substrate layer (102) comprises a capacitive touch detection layer.

13. The device (100) according to claim 2, further comprising a second PCB layer (801) on the second side of the touch interface layer (101) and on the first side of the substrate layer (102).

14. The device (100) of claim 1 or claim 2, wherein the second side of the substrate layer (102) comprises an electrical connector (901) for electrically coupling the device (100) to a second device (1500).

15. A touch panel (1401), comprising the device (100) according to claim 1 or claim 2.

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