Portable electronic device, mobile phone, and electronic device

Abstract

The present disclosure relates to a portable electronic device, a mobile phone, and an electronic device. The present invention discloses a portable electronic device, which may include: a touch-sensitive display; a housing that at least partially encloses the touch-sensitive display, the housing defining an audio port along one side of the housing, the audio port defining a partially enclosed volume; and an acoustic module positioned within the housing and including: an audio housing that defines a first channel and a second channel; a microphone that is operatively coupled to the partially enclosed volume of the audio port through the first channel; a pressure sensor that is operatively coupled to the partially enclosed volume of the audio port through the second channel; and an acoustic mesh positioned between an end of the second channel and the audio port.

Description

[0001] Cross - Reference to Related Applications

[0002] This application is a non - provisional patent application of and claims the benefit of U.S. Provisional Patent Application No. 63 / 155,693, filed on Mar. 2, 2021, entitled "Handheld Electronic Device", U.S. Provisional Patent Application No. 63 / 170,327, filed on Apr. 2, 2021, entitled "Handheld Electronic Device", and U.S. Provisional Patent Application No. 63 / 208,477, filed on Jun. 8, 2021, entitled "Handheld Electronic Device", the disclosures of which are hereby incorporated by reference in their entireties. Technical Field

[0003] The subject matter of the present disclosure generally relates to handheld electronic devices and, more particularly, to mobile phones. Background Art

[0004] Modern consumer electronic devices come in a variety of shapes and forms and have a variety of uses and functions. For example, a smart phone provides a user with various ways to interact with others outside the telephone communication range. Such devices may include many systems that facilitate such interactions. For example, a smart phone may include a touch - sensitive display for providing graphical output and for receiving touch inputs, a wireless communication system for connecting to other devices to send and receive voice and data content, a camera for capturing photos and videos, etc. However, integrating these subsystems into a compact and reliable product that can withstand daily use presents a variety of technical challenges. The systems and techniques described herein can address most of these challenges while providing a device with many different functions. Summary of the Invention

[0005] The present invention discloses a portable electronic device, which may include: a touch - sensitive display; a housing that at least partially encloses the touch - sensitive display, the housing defining an audio port along one side of the housing, the audio port defining a partially enclosed volume; and an acoustic module positioned within the housing and including: an audio housing that defines a first channel and a second channel; a microphone that is operatively coupled through the first channel to the partially enclosed volume of the audio port; a pressure sensor that is operatively coupled through the second channel to the partially enclosed volume of the audio port; and an acoustic mesh positioned between an end of the second channel and the audio port.

[0006] The acoustic module may include a first gasket having a first acoustic hole and a first pressure hole, and a second gasket having a second acoustic hole and a second pressure hole. An acoustic mesh may be positioned between the first gasket and the second gasket, and the acoustic mesh may cover the first pressure hole and the second pressure hole. The acoustic mesh may include a polymer mesh capable of allowing air to pass through. The acoustic mesh may have an acoustic impedance between 100 Rayl and 700 Rayl. The acoustic mesh may have a thickness between 40 microns and 100 microns. The acoustic mesh may not cover the end of the first channel.

[0007] The acoustic module may further include a barometric ventilation system configured to equalize an internal pressure within the housing and an external pressure outside the housing, and the barometric ventilation system may be operably coupled to a ventilation port through a third channel.

[0008] The mobile phone may include a housing that defines a microphone port and a speaker port along a side surface of the housing and a receiver port along a front surface of the housing. The mobile phone may further include a display positioned within the housing and an internal module positioned within the housing. The internal module may include: a microphone that is operably coupled to the microphone port through a first channel; a pressure sensor that is operably coupled to the microphone port through a second channel; and an acoustic mesh that is positioned at an end of the second channel and is configured to reduce acoustic interference between the first channel and the second channel.

[0009] The internal module may include a housing positioned below the display, the pressure sensor and the microphone may be positioned within the housing, and the internal module may include a gasket positioned between the housing and an inner surface of the housing. The gasket may be the first gasket of a pair of gaskets, and the acoustic mesh may be positioned between the pair of gaskets. The housing may define a recess, the gasket may be at least partially positioned within the recess, and the acoustic mesh may be positioned between the gasket and the housing. The gasket may define a first hole positioned at an end of the first channel and a second hole positioned at an end of the second channel, and the acoustic mesh may cover the second hole and not cover the first hole.

[0010] The housing may define a charging port configured to receive a charging connector, and the charging port may be positioned between the microphone port and the speaker port along the side surface of the housing.

[0011] The electronic device may include a housing that includes: a housing member that defines a set of side surfaces of the electronic device, the housing member defining an audio port in the side surfaces of the set of side surfaces; and a front cover that defines a front surface of the electronic device. The electronic device may further include an internal module and a display positioned under the front cover, the internal module being positioned within the housing, under the display and including: a microphone configured to detect an audio input at the audio port via a first channel; a pressure sensor configured to measure an external pressure at the audio port via a second channel; and a barrier that separates the first channel from the second channel. The barrier may be formed of a diaphragm capable of breathing and waterproofing. The barrier may be formed of a polymer mesh capable of breathing, and the polymer mesh capable of breathing may have a thickness between 40 microns and 100 microns. The barrier may have an acoustic impedance between 150 Rayl and 300 Rayl.

[0012] The first channel may extend from the microphone to the audio port, the second channel may extend from the pressure sensor to the audio port, and the barrier may be positioned between an end of the second channel and the audio port.

[0013] The first channel may define a first end near the microphone and a second end near the audio port, the second channel may define a first end near the pressure sensor and a second end near the microphone, and the barrier may be positioned at the second end of the second channel.

[0014] The audio port may be a first audio port, the housing may define a second audio port in the side surface, and the electronic device may include a speaker module operatively coupled to the second audio port. Description of the Drawings

[0015] The present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0016] Figures 1A to 1B An example electronic device is shown;

[0017] Figures 1C to 1D Another exemplary electronic device is shown;

[0018] Figure 2 An exploded view of the exemplary electronic device is shown;

[0019] Figure 3 An exploded view of the exemplary electronic device is shown;

[0020] Figures 4A to 4B A part of the exemplary electronic device is shown;

[0021] Figure 4CShows a partial exploded view of an exemplary electronic device;

[0022] Figure 5 Shows an exemplary cover structure for a speaker port of an exemplary electronic device;

[0023] Figures 6A to 6B Shows a partial cross-sectional view of a speaker configuration for an exemplary electronic device;

[0024] Figure 6C Shows a partial cross-sectional view of another exemplary speaker configuration for an exemplary electronic device;

[0025] Figure 7A Shows a partial cross-sectional view of a microphone configuration for an exemplary electronic device;

[0026] Figure 7B Shows a partial cross-sectional view of another microphone configuration for an exemplary electronic device;

[0027] Figure 7C Shows Figure 7B exploded view of the microphone configuration;

[0028] Figures 8A to 8C Shows a partial view of an exemplary electronic device, showing an exemplary speaker port configuration;

[0029] Figure 9A Shows a partial view of an exemplary forward sensor area of an exemplary electronic device;

[0030] Figure 9B Shows a partial cross-sectional view of an exemplary device, showing a portion of the forward sensor area of an exemplary electronic device;

[0031] Figure 9C Shows a partial view of an exemplary forward sensor area of another exemplary electronic device;

[0032] Figures 9D to 9F Shows a partial cross-sectional view of the forward sensor area of an exemplary electronic device;

[0033] Figure 9G Shows an exemplary front camera of an exemplary electronic device;

[0034] Figure 9H Shows an exploded view of a portion of the forward sensor area of an exemplary electronic device;

[0035] Figures 10A to 10C Shows a partial cross-sectional view of an exemplary electronic device, showing an exemplary combined flood illuminator and point projector configuration;

[0036] Figure 11AA partial cross-sectional view of an exemplary electronic device is shown, showing an exemplary ambient light sensor;

[0037] Figures 11B to 11C A portion of an exemplary electronic device is shown, showing the operation of an exemplary ambient light sensor;

[0038] Figures 12A to 12B An exemplary electrode pattern on an exemplary electronic device is shown;

[0039] Figures 13A to 13C A partial cross-sectional view of an exemplary electronic device is shown, showing an exemplary display potting configuration;

[0040] Figure 13D A partial view of an exemplary electronic device is shown, showing an exemplary display potting configuration;

[0041] Figure 13E A partial cross-sectional view of an exemplary electronic device is shown, showing an exemplary display potting configuration;

[0042] Figure 13F A partial cross-sectional view of an exemplary electronic device is shown, showing an exemplary cover potting configuration;

[0043] Figures 13G to 13L A partial cross-sectional view of an exemplary cover of an electronic device is shown;

[0044] Figure 13M A partial cross-sectional view of an exemplary electronic device is shown, showing an exemplary adhesive for attaching a display to a cover;

[0045] Figure 13N A partial cross-sectional view of an exemplary electronic device is shown, showing an exemplary configuration for mounting a top module to a housing;

[0046] Figure 14A A partial view of an exemplary electronic device is shown;

[0047] Figures 14B to 14D An exemplary side-emitting antenna window for an electronic device is shown;

[0048] Figure 15 An exemplary antenna feed portion and ground point for an electronic device are shown;

[0049] Figure 16A A partial view of a housing member for an electronic device is shown;

[0050] Figure 16B A partial cross-sectional view of a housing of an electronic device including Figure 16A a housing member is shown;

[0051] Figure 16C Shows a partial view of a housing member for an electronic device;

[0052] Figure 16D Shows a partial cross-sectional view of the housing of an electronic device including a housing member; Figure 16C ;

[0053] Figure 16E Shows a partial cross-sectional view of the housing of an electronic device including a housing member; Figure 16A and Figure 16C ;

[0054] Figure 17A Shows a part of an electronic device, showing an exemplary arrangement of a camera module in an exemplary electronic device;

[0055] Figures 17B to 17C Shows a Figure 17A camera module;

[0056] Figure 17D Shows a part of an exemplary electronic device with the camera module removed;

[0057] Figures 17E to 17F Shows a spring member used with the camera module of an electronic device;

[0058] Figure 17G Shows a part of an electronic device, showing an exemplary arrangement of components in the device;

[0059] Figure 17H Shows a partial cross-sectional view of an exemplary mounting configuration of a shield for an electronic device;

[0060] Figure 17I Shows a partial cross-sectional view of an exemplary mounting configuration for attaching a component to an electronic device;

[0061] Figure 18A Shows a partial cross-sectional view of an exemplary electronic device, showing an exemplary depth sensor configuration;

[0062] Figure 18B Shows a partial cross-sectional view of an exemplary electronic device, showing another exemplary depth sensor configuration;

[0063] Figure 18C Shows a partial cross-sectional view of an exemplary electronic device, showing another exemplary depth sensor configuration;

[0064] Figure 19A Shows a partial cross-sectional view of an exemplary electronic device, showing an exemplary rear camera configuration;

[0065] Figure 19BA partial cross-sectional view of an exemplary electronic device is shown, showing an exemplary arrangement of window decoration in the rear cover of the electronic device;

[0066] Figure 19C A partial cross-sectional view of an exemplary electronic device is shown, showing another exemplary arrangement of window decoration in the rear cover of the electronic device;

[0067] Figure 20A An exemplary flash module of an electronic device is shown;

[0068] Figure 20B Shows Figure 20A A partial cross-sectional view of the flash module;

[0069] Figure 20C A partial cross-sectional view of another exemplary flash module is shown;

[0070] Figures 20D to 20G A partial cross-sectional view of an exemplary flash module for an electronic device is shown;

[0071] Figure 21A An exemplary logic board for an electronic device is shown;

[0072] Figure 21B Shows Figure 21A A partial cross-sectional view of the logic board;

[0073] Figure 21C A partial cross-sectional view of another exemplary logic board is shown;

[0074] Figure 21D A partial cross-sectional view of another exemplary logic board is shown;

[0075] Figure 21E A partial view of an exemplary fastening configuration for a logic board is shown;

[0076] Figure 21F Shows Figure 21A A partial cross-sectional view of the logic board, showing Figure 21E The fastening configuration shown;

[0077] Figures 21G to 21I Another exemplary logic board is shown;

[0078] Figure 22A A part of the electronic device is shown, where the battery is shown separated from the housing;

[0079] Figure 22B An exemplary adhesive configuration for attaching the battery to the housing of the electronic device is shown;

[0080] Figure 22CShows a partial cross-sectional view of an adhesive stack for attaching a battery to a housing of an electronic device;

[0081] Figures 22D to 22F Shows an exemplary adhesive configuration for attaching a battery to a housing of an electronic device;

[0082] Figures 22G to 22H Shows an exemplary battery mounting structure for attaching a battery to an electronic device;

[0083] Figure 23A Shows a partial view of an electronic device, showing an exemplary arrangement of a sensor module relative to a housing member;

[0084] Figures 23B to 23G Shows an exemplary configuration of a sensor module having a plurality of sensing components sharing a common volume; and

[0085] Figure 24 Shows a schematic diagram of an exemplary electronic device. DETAILED DESCRIPTION

[0086] Reference will now be made specifically to representative embodiments shown in the drawings. It should be understood that the following description is not intended to limit the embodiments to one preferred embodiment. Instead, it is intended to cover alternative forms, modifications, and equivalents that may be included within the spirit and scope of the described embodiments as defined by the appended claims.

[0087] A mobile phone as described herein may include complex and sophisticated components and systems that facilitate a variety of functions. For example, a mobile phone according to the present disclosure may include a touch-sensitive display and / or a force-sensitive display, a plurality of cameras (including both a front-facing camera and a rear-facing camera), a GPS system, a haptic actuator, a wireless charging system, and all of the necessary computing components and software for operating these (and other) systems and otherwise providing the functionality of the mobile phone.

[0088] Figure 1A and Figure 1B Shows an exemplary electronic device 100 embodied as a mobile phone. Figure 1A Shows the front of device 100, while Figure 1B Shows the back of the device. Although device 100 is a mobile phone, the concepts presented herein may be applicable to any suitable electronic device, including portable electronic devices, wearable devices (e.g., watches), laptop computers, handheld gaming devices, tablet computers, computing peripherals (e.g., mice, touchpads, keyboards), or any other device. Accordingly, any reference to an "electronic device" encompasses any and all of the foregoing.

[0089] The electronic device 100 includes a cover member 102 (e.g., a front cover member), such as glass, glass ceramic, ceramic, plastic, sapphire, or other substantially transparent materials, components, or assemblies attached to a housing 104 (which may include a housing structure defined by one or more housing members). The cover member 102 may be positioned above the display 103. The cover member 102 may be formed of glass (e.g., chemically strengthened glass), sapphire, ceramic, glass ceramic, plastic, or another suitable material. The cover member 102 may be formed as a single piece or an integral sheet. The cover member 102 may also be formed as a composite of multiple layers of different materials, coatings, and other elements.

[0090] The display 103 may be at least partially positioned within the internal volume of the housing 104. The display 103 may be coupled to the cover member 102, such as via an adhesive or other coupling scheme. The display 103 may include a liquid crystal display (LCD), a light-emitting diode, an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, an organic electro-luminescent (EL) display, an electrophoretic ink display, etc. The display 103 may be configured to display a graphical output, such as a graphical user interface that a user can view and interact with. The device 100 may also include an ambient light sensor that may determine an attribute of the ambient light conditions surrounding the device 100. Exemplary ambient light sensors are described herein with respect to Figures 11A to 11C the device 100 may use information from the ambient light sensor to change, modify, adjust, or otherwise control the display 103 (e.g., by changing the hue, brightness, saturation, or other optical aspects of the display based on information from the ambient light sensor).

[0091] The display 103 may include one or more touch sensing systems and / or force sensing systems or be associated with one or more touch sensing systems and / or force sensing systems. In some cases, components of the touch sensing system and / or force sensing system are integrated with the display stack. For example, electrode layers of the touch sensor and / or force sensor may be provided in a stack that includes display components (and optionally attached to the cover member 102 or visible at least through the cover member). The touch sensing system and / or force sensing system may use any suitable type of sensing technology, including capacitive sensors, resistive sensors, surface acoustic wave sensors, piezoelectric sensors, strain gauges, etc. The outer or external surface of the cover member 102 may define an input surface of the device (e.g., a touch-sensitive input surface and / or a force-sensitive input surface). Although both a touch sensing system and a force sensing system may be included, in some cases, the device 100 includes a touch sensing system and does not include a force sensing system.

[0092] Device 100 may also include a front camera 106. The front camera 106 may be positioned below the cover 102 or otherwise covered and / or protected by the cover. The front camera 106 may have any suitable operating parameters. For example, the front camera 106 may include a 12-megapixel sensor (with a pixel size of 1 micron) and a field of view of 80° to 90°. The front camera 106 may have a fixed focal length optical element with an f-number of f / 2.2. Other types of cameras may also be used for the front camera 106, such as an autofocus camera.

[0093] The front camera 106 may be positioned in the front sensor area 111. The front sensor area 111 may be positioned in a notch-like area at the front of the device 100. In some cases, as described herein, the front sensor area 111 may be positioned in or defined by a recessed area of the display 103 (e.g., an area not occupied by the display or the visually active portion of the display). In some cases, the front sensor area 111 includes a mask or other visually opaque component or treatment that defines an opening for the sensor. In some cases, one or more of the sensors in the front sensor area 111 or other devices (e.g., the front camera 106) are aligned with holes formed through one or more layers of the display 103 to provide optical access to the sensors. The front sensor area 111 may include components such as a flood illuminator module, a proximity sensor module, an infrared light projector, an infrared image capture device, and the front camera 106.

[0094] Device 100 may also include one or more buttons (e.g., button 120 and Figure 1B button 116 therein), switches (e.g., switch 118, Figure 1B ) and / or other physical input systems. Such input systems may be used to control the power state (e.g., button 120), change the speaker volume (e.g., button 116), switch between "ringing" mode and "silent" mode, etc. (e.g., switch 118).

[0095] Device 100 may also include a speaker port 110 to provide audio output to a user (such as to the user's ear) during a voice call. In the context of a mobile phone, the speaker port 110 may also be referred to as a receiver, a receiver port, or an earpiece. Device 100 may also include a charging port 112 (e.g., a connector for receiving a power cable for providing power to device 100 and charging the battery of device 100). Device 100 may also include an audio opening 114. The audio opening 114 may allow sound from an internal speaker system (e.g., Figure 2The sound output by the speaker system 224) exits the housing 104. The device 100 may also include one or more microphones. In some cases, the microphone(s) within the housing 104 may be acoustically coupled to the surrounding environment through the audio opening 114.

[0096] The housing 104 may be a multi-piece housing. For example, the housing 104 may be formed by a plurality of housing members 124, 125, 126, 127, 128, and 130 that are structurally coupled together via one or more joint structures 122 (e.g., 122-1 to 122-6). The housing members 124, 125, 126, 127, 128, and 130 together with the joint structures 122 may define a ribbon-like housing structure that defines four sidewalls of the device 100 (and thus four outer side surfaces). Thus, both the housing members and the joint structures define portions of the outer surface of the device 100.

[0097] The housing members 124, 125, 126, 127, 128, and 130 may be formed of a conductive material (e.g., a metal such as aluminum, stainless steel, etc.), and the joint structures 122 may be formed of one or more polymeric materials (e.g., a glass-reinforced polymer). The joint structures 122 may include two or more molded elements that may be formed of different materials. For example, an inner molded element may be formed of a first material (e.g., a polymeric material), and an outer molded element may be formed of a second material different from the first material (e.g., a different polymeric material). These materials may have different properties that may be selected based on the different functions of the inner and outer molded elements. For example, the inner molded element may be configured to form a primary structural connection between the housing members and may have a higher mechanical strength and / or toughness than the outer molded element. On the other hand, the outer molded element may be configured to have a particular appearance, surface finish, chemical resistance, waterproof function, etc., and its composition may be selected to prioritize those functions over mechanical strength.

[0098] In some cases, one or more (or portions thereof) of the housing members 124, 125, 126, 127, 128, and 130 are configured to operate as an antenna (e.g., a member configured to transmit and / or receive electromagnetic waves to facilitate wireless communication with other computers and / or devices). To facilitate using the housing member as an antenna, a feeder line and a ground line may be conductively coupled to the housing member to couple the housing member to other antennas and / or communication circuits. FIG. 11, described in more detail below, shows exemplary antenna feeder lines and ground lines for an exemplary device. Additionally, the joint structure 122 may be substantially non-conductive to provide suitable separation and / or electrical isolation between the housing members (which may be used to tune the radiating portion, reduce capacitive coupling between the radiating portion and other structures, etc.). In addition to the housing members 124, 125, 126, 127, 128, and 130, the device 100 may also include various internal antenna elements configured to transmit and receive wireless communication signals through various regions of the housing 104. As Figure 1A shown, the device 100 may include an antenna window 129 that allows radio frequency communication signals to be transmitted through a corresponding region of the housing 104.

[0099] The joint structure 122 may be mechanically interlocked with the housing members to structurally couple the housing members and form a structural housing assembly. More details regarding the joint structure 122 and its mechanical integration with the housing members are provided herein.

[0100] The outer surfaces of the housing members 124, 125, 126, 127, 128, and 130 may have substantially the same color, surface texture, and overall appearance as the outer surface of the joint structure 122. In some cases, the outer surfaces of the housing members 124, 125, 126, 127, 128, and 130 and the outer surface of the joint structure 122 are subjected to at least one common finishing process, such as abrasive blasting, machining, polishing, grinding, etc. Thus, the outer surfaces of the housing members and the joint structure may have the same or similar surface finishes (e.g., surface texture, roughness, pattern, etc.). In some cases, the outer surfaces of the housing members and the joint structure may be subjected to a two-stage sandblasting method to produce a target surface finish.

[0101] Figure 1A An exemplary coordinate system 101 is also included that may define the orientation of the reference device 100 (or other electronic devices described herein). The coordinate system 101 defines a positive x-direction, a positive y-direction, and a positive z-direction. Unless otherwise specified, references herein to the positive x, y, or z direction will be understood to generally refer to the coordinate system 101 and its relationship to Figure 1A the device 100 therein. The negative x, y, and z directions will be understood to be opposite to the positive x, y, and z directions shown in the coordinate system Figure 1A therein.

[0102] Figure 1B Shows the back side of device 100. Device 100 may include a back cover or rear cover 132 coupled to housing 104 and defining at least a portion of the outer rear surface of device 100. Rear cover 132 may include a substrate formed of glass, but other suitable materials (e.g., plastic, sapphire, ceramic, glass-ceramic, etc.) may alternatively be used. Rear cover 132 may include one or more decorative layers on the outer or inner surface of the substrate. For example, one or more opaque layers may be applied to (or otherwise positioned along) the inner surface of the substrate to provide a particular appearance to the back side of device 100. The opaque layer may include a sheet, ink, dye, or a combination of these (or other) layers, materials, etc. In some cases, the opaque layer has a color that substantially matches the color of housing 104 (e.g., the outer surfaces of the housing members and joint structures). Device 100 may include a wireless charging system, whereby device 100 may be powered and / or its battery recharged by inductive (or other electromagnetic) coupling between a charger and the wireless charging system within device 100. In such cases, rear cover 132 may be formed of a material (e.g., glass) that permits and / or facilitates wireless coupling between the charger and the wireless charging system.

[0103] Device 100 may further include a sensor array 134, which may include various types of sensors, including one or more rear cameras, depth sensing devices, flashlights, microphones, etc. Sensor array 134 may be at least partially defined by a protrusion 137 extending from the rear of device 100. Protrusion 137 may define a portion of the outer rear surface of device 100 and may at least partially define a raised sensor array region of sensor array 134. In some cases, protrusion 137 may be formed by attaching a piece of material (e.g., glass) to another piece of material (e.g., glass). In other cases, rear cover 132 may include a monolithic structure, and protrusion 137 may be part of the monolithic structure. For example, rear cover 132 may include a monolithic glass structure (or glass-ceramic structure) defining protrusion 137 and the surrounding area. In such cases, protrusion 137 may be a region of increased thickness of the monolithic structure, or it may be molded into a monolithic structure of substantially uniform thickness (e.g., and may correspond to a recessed region along the inner side of the monolithic structure).

[0104] The device may also include one or more rearward devices as part of the sensor array, which may include an ambient light sensor (ALS), a microphone, and / or a depth sensing device configured to estimate the distance between device 100 and a separate object or target. The sensor array 134 may also include a plurality of cameras, such as a first camera 138 and a second camera 139. The first camera 138 may include an ultra-wide-angle camera having a 12-megapixel sensor and a wide field of view (e.g., 120° FOV) optical stack with an f-number of f / 2.4; the second camera 139 may include a wide-angle camera having a 12-megapixel sensor and an f-number of f / 1.6. In some cases, the sensor array 134 may include a telephoto lens (e.g., in addition to, or instead of, one of the first camera 138 and the second camera 139) having a 12-megapixel sensor with a 3x optical zoom optical stack with an f-number in the range of f / 2.0 to f / 2.8. One or more of the cameras of the sensor array 134 (e.g., cameras 138, 139) may also include optical image stabilization, whereby the lens moves dynamically relative to a fixed structure within device 100 to reduce the impact of "camera shake" on the images captured by the camera. These cameras may also perform optical image stabilization by moving the image sensor relative to a fixed lens or optical component. One or more of these cameras may include an autofocus function, where one or more lens elements (and / or sensors) may move to focus an image on the sensor.

[0105] As Figure 1B shown, the cameras of the sensor array 134 may be positioned diagonally relative to the protrusion 137 (e.g., the raised sensor array). For example, a first hole may extend through the rear cover 132 at a location near the first corner region of the sensor array 134, and the first camera 138 may be at least partially positioned in the first hole, and a second hole may extend through the rear cover 132 at a location near the second corner region that is diagonal to the first corner region of the sensor array 134, and the second camera 139 may be at least partially positioned in the second hole. Thus, the first hole and the second hole and thus the first camera and the second camera may be positioned along a diagonal path from the first corner to the second corner of the sensor array 134.

[0106] The second camera 139 may have an image sensor with a pixel size between approximately 1.5 microns and approximately 2.0 microns, and the first camera 138 may have an image sensor with a pixel size between approximately 0.8 microns and approximately 1.4 microns. If a camera with a telephoto lens is provided, it may have an image sensor with a pixel size between approximately 0.8 microns and approximately 1.4 microns.

[0107] The sensor array 134, along with associated processors and software, can provide several image capture features. For example, the sensor array 134 can be configured to capture a full-resolution video clip of a specific duration whenever the user captures a still image. As used herein, capturing a full-resolution image (e.g., a video image or a still image) can refer to capturing an image using the entire or substantially the entire pixel of an image sensor, or otherwise capturing an image using the maximum resolution of the camera (regardless of whether the maximum resolution is limited by hardware or software).

[0108] The captured video clip can be associated with the still image. In some cases, the user may be able to select individual frames from the video clip as representative still images associated with the video clip. Thus, when the user takes a snapshot of a scene, the camera will actually record a short video clip (e.g., 1 second, 2 seconds, etc.), and the user can select an exact frame from the video to be used as the captured still image (in addition to simply viewing the video clip as a video).

[0109] The camera of the sensor array 134 can also have or provide a high dynamic range (HDR) mode, in which the camera captures an image with a dynamic luminance range greater than the luminance range captured when the camera is not in the HDR mode. In some cases, the sensor array 134 automatically determines whether to capture an image in the HDR mode or the non-HDR mode. Such determination can be based on various factors, such as the ambient light of the scene, the detected luminance range, the hue, or other optical parameters in the scene, etc. The HDR image can be generated by capturing multiple images, each using a different exposure or other image capture parameters, and generating a composite image from the multiple captured images.

[0110] The sensor array 134 can also include or be configured to operate in an object detection mode, in which the user can select (and / or the device 100 can automatically identify) objects within the scene to facilitate processing, displaying, or capturing those objects in a different manner from other parts of the scene. For example, the user can select (or the device 100 can automatically identify) the face of a person in the scene, and the device 100 can focus on the face of the person while selectively blurring the parts of the scene other than the face of the person. It is worth noting that features such as the HDR mode and the object detection mode can be set for a single camera (e.g., a single lens and sensor).

[0111] The sensor array may include a flash 136 configured to illuminate a scene to facilitate capturing an image with the sensor array 134. The flash 136 may include one or more light sources, such as one or more light-emitting diodes (e.g., 1, 2, 3, 4, or more LEDs). In combination with the sensor array 134 or other systems of the device 100, the flash 136 may adjust the color temperature of the light emitted by the light source so as to match or otherwise adapt to the color temperature within the scene being captured. The device 100 may also be configured to operate the flash 136 of the sensor array 134 and the shutter (e.g., the shutter of one or more of the cameras 138, 139) to avoid the consequences of flash "bleeding". For example, the device 100 may avoid capturing an exposure during a moment when the flash 136 is in a non-illuminated or low-illuminated state (e.g., caused by discontinuous or pulsed operation of the LEDs).

[0112] The sensor array 134 may further include a microphone 135. The microphone 135 may be acoustically coupled to the external environment through a hole defined in the rear cover of the device 100 (e.g., through a portion of the rear cover that defines the protrusion 137).

[0113] Figure 1C and Figure 1D Another exemplary electronic device 140 embodied as a mobile phone is shown. The electronic device 140 may have many external components that are the same as or similar to those of the electronic device 100. Thus, the description and details of such components (e.g., display, buttons, switches, housing, cover, charging port, connector structure, etc.) from Figure 1A and Figure 1B also apply equally to the corresponding components shown in Figure 1C and Figure 1D .

[0114] Although Figure 1B the device 100 in Figure 1D is shown as including a sensor array 134 having two cameras, the device 140 shown in Figure 3 includes a sensor array 141 that includes three cameras (e.g., as shown in Figure 1B and as described herein). The sensor array 141 may be located in a sensor array area defined by a protrusion 151 in the rear cover of the device 140. The protrusion 151 may have the same or similar construction as the protrusion 137 in

[0115] The first camera 142 may include a 12-megapixel sensor and a telephoto lens with 3x optical zoom and an aperture number of f / 2.8; the second camera 144 may include a 12-megapixel sensor and a wide-angle lens with an aperture number of f / 1.5; and the third camera 146 may include a 12-megapixel sensor and an ultra-wide-angle camera with a wide field of view (e.g., 120° FOV) and an aperture number of f / 1.8. One or more of the cameras in the sensor array 141 may also include optical image stabilization, whereby the lens moves dynamically relative to a fixed structure within the device 100 to reduce the impact of "camera shake" on the images captured by the camera. These cameras may also perform optical image stabilization by moving the image sensor relative to a fixed lens or optical component.

[0116] The first camera 142 may include an image sensor with a pixel size between approximately 0.8 micrometers and 1.4 micrometers. The second camera 144 may include an image sensor with a pixel size between approximately 1.6 micrometers and 2.3 micrometers. The third camera 146 may include an image sensor with a pixel size between approximately 0.8 micrometers and 1.4 micrometers.

[0117] For example, a wide-angle camera with a 12-megapixel sensor and an aperture number of f / 1.6 may have an image sensor with a pixel size between approximately 1.5 micrometers and 2.0 micrometers; an ultra-wide-angle camera with a 12-megapixel sensor and a wide field of view (e.g., 120° FOV) optical stack with an aperture number of f / 2.4 may have an image sensor with a pixel size between approximately 0.8 micrometers and 1.4 micrometers; and a telephoto lens with a 12-megapixel sensor with a 3x optical zoom optical stack with an aperture number in the range of f / 2.0 to f / 2.8 may have an image sensor with a pixel size between approximately 0.8 micrometers and 1.4 micrometers. One or more of these cameras may include an autofocus function, where one or more lens elements (and / or sensors) may move to focus an image on the sensor.

[0118] The sensor array 141 may also include a depth sensing device 149 configured to estimate the distance between the device and a separate object or target. The depth sensing device 149 may use lasers and time-of-flight calculations or other types of depth sensing components or techniques to estimate the distance between the device and a separate object or target.

[0119] The device 140 may also include a flash 148 configured to illuminate a scene to facilitate image capture with the cameras of the sensor array 141. The flash 148 is configured to illuminate the scene to facilitate image capture with the sensor array 141. The flash 148 may include one or more light sources, such as one or more light-emitting diodes (e.g., 1, 2, 3, 4, or more LEDs).

[0120] The sensor array 141 may also include a microphone 150. The microphone 150 may be acoustically coupled to the external environment through a hole defined in the rear cover of the device 140 (e.g., through a portion of the rear cover that defines a protrusion 151).

[0121] Other details regarding the sensor array, each camera, and / or flash of the sensor array described with respect to the device 100 may apply to the sensor array, each camera, and / or flash of the device 140, and such details will not be repeated herein to avoid redundancy.

[0122] Figure 2 A exploded view of an exemplary electronic device is shown. Specifically, Figure 2 An exploded view of the device 200 is shown, which shows various components of the device 200 and exemplary arrangements and configurations of these components. The descriptions of the various components and elements of Figure 1A and Figure 1B the device 100 may also apply to Figure 2 the device 200 shown. For clarity, redundant descriptions of some components are not repeated herein.

[0123] As Figure 2 shown, the device 200 includes a cover 202 (e.g., a front cover), which may be formed of glass, ceramic, or other transparent substrate. In this example, the cover 202 may be formed of glass or glass-ceramic material. The glass-ceramic material may include an amorphous phase and a crystalline or non-amorphous phase of one or more materials and may be formulated to improve the strength or other properties of the cover 202. In some cases, the cover 202 may include a sheet of chemically strengthened glass or glass-ceramic or an optical processing element having one or more coatings, the one or more coatings including an anti-reflection (AR) coating, an oleophobic coating, or other types of coatings. In some cases, the cover 202 includes a sheet of material having a thickness less than 1 mm. In some cases, the sheet of material is less than 0.80 mm. In some cases, the sheet of material is about 0.60 mm or thinner. An ion exchange process may be used to chemically strengthen the cover 202 to form a compressive stress layer along the outer surface of the cover 202.

[0124] The cover 202 extends over substantially the entire front surface of the device and may be positioned within an opening defined by the housing 210. As described in more detail below, the edges or sides of the cover 202 may be surrounded by a protective flange or lip of the housing 210, with no gap member between the edge of the cover 202 and the corresponding flange of the housing 210. This configuration may allow an impact or force applied to the housing 210 to be transmitted to the cover 202 without directly transmitting shear stress through the display 203 or the frame 204.

[0125] AsFigure 2 As shown, the display 203 is attached to the inner surface of the cover 202. The display 203 may include a borderless organic light-emitting diode (OLED) display that measures 13.7 cm (5.4 inches) diagonally. The perimeter or non-active area of the display 203 can be reduced to allow for a very thin device border around the active area of the display 203. In some cases, the display 203 allows for a border area of 1.5 mm or thinner. In some cases, the display 203 allows for a border area of 1 mm or thinner. In one exemplary embodiment, the border area is approximately 0.9 mm. The display 203 may have a relatively high pixel density of approximately 450 pixels per inch (PPI) or greater. In some cases, the display 203 has a pixel density of approximately 475 PPI. The display 203 may have an integrated (on-cell) touch sensing system. For example, an electrode array integrated into the OLED display can be time and / or frequency multiplexed to provide both display and touch sensing functionality. The electrodes can be configured to detect touch locations, gesture inputs, multi-touch inputs, or other types of touch inputs along the outer surface of the cover 202. In some cases, the display 203 includes another type of display element, such as a liquid crystal display (LCD) that does not have an integrated touch sensing system. That is, the device 200 may include one or more touch and / or force sensing layers positioned between the display 203 and the cover 202.

[0126] The display 203 (also referred to as the display stack) may include an always-on display (AOD) function. For example, the display 203 may be configured to allow a subset of designated areas or pixels to be displayed when the device 200 is powered on, such that graphical content is visible to the user even when the device 200 is in a low power or sleep mode. This may allow for the display of time, date, battery status, recent notifications, and other graphical content in a low power or sleep mode. This graphical content may be referred to as persistent or always-on graphical output. Although some battery power may be consumed when displaying persistent or always-on graphical output, the power consumption is generally less than the power consumption during normal or full-power operation of the display 203. This function can be enabled by operating only a subset of the display pixels and / or by operating at a reduced resolution in order to reduce the power consumption of the display 203.

[0127] As Figure 2As shown, the device 200 may further include a frame member 204 (also simply referred to as the frame 204), which is positioned below the cover 202 and extends around at least one outer perimeter of the display 203. The perimeter of the frame 204 may be attached to the lower surface or the inner surface of the cover 202. A portion of the frame 204 may extend below the display 203 and may attach the cover 202 to the housing 210. Since the display 203 is attached to the lower surface or the inner surface of the cover 202, the frame 204 may also be described as attaching both the display 203 and the cover 202 to the housing 210. The frame 204 may be formed of a polymer material, a metal material, or a combination of polymer and metal materials. The frame 204 may support elements of the display stack, provide anchor points for flexible circuits, and / or be used to mount other components and device elements. In some cases, the frame 204 includes one or more metal or conductive elements that provide shielding between device components, such as between the display stack (including the display component and the touch sensor component) and other components such as the haptic actuator 222, the speaker system 224, etc.

[0128] The cover 202, the display stack 203, and the frame member 204 may be part of the top module 201 of the device 200. The top module 201 may be assembled as a subassembly, which may then be attached to the housing member. For example, as described herein, the display 203 may be attached (e.g., via a transparent adhesive) to the cover 202, and the frame member 204 may be attached (e.g., via an adhesive) around the perimeter of the display stack 203 to the cover. The top module 201 may then be attached to the housing member of the device 200 by mounting and adhering the frame member 204 to a boss defined by the housing member.

[0129] Device 200 also includes a speaker module 250 configured to output sound via a speaker port. The speaker port may be located in and / or at least partially defined by a recess 251 of the cover 202. As described herein, a decorative piece may be at least partially located in the recess 251 to facilitate sound output while also inhibiting debris, liquid, or other materials or contaminants from entering the device 200. Output from the speaker module 250 may pass through an acoustic path at least partially defined by the speaker module 250 itself and the decorative piece. In some cases, a portion of the acoustic path (e.g., between the speaker module 250 and the decorative piece) is defined by the housing 210 and / or a molded material coupled to the housing 210. For example, a molded material (e.g., a fiber-reinforced polymer) may be molded against a metallic portion of the housing 210 (e.g., the housing member 213 described herein). The molded material may also form one or more joint structures that also structurally join the housing members together (e.g., the joint structure 218). A channel (e.g., a tubular tunnel) may be defined through the molded material to more generally acoustically couple the speaker module 250 to the decorative piece and / or the recess 251, thereby guiding sound from the speaker module 250 to the exterior of the device 200. In some cases, a portion of the channel extending through the molded material is defined by the housing member itself, as referenced herein Figures 6A to 6B as described.

[0130] As Figure 2 shown, device 200 also includes one or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along a front surface of the device. In this example, device 200 includes a front camera 206 that includes a high-resolution camera sensor. The front camera 206 may have a 12-megapixel resolution sensor with an optical element providing a fixed focus and an 85° field of view. Device 200 also includes a face recognition sensor 252 that includes an infrared light projector and an infrared light sensor configured to sense an array or area of depth points along a user's face. The array of depth points may be characterized as a unique feature or biometric identifier that may be used to identify the user and unlock the device 200 or authorize functions on the device 200, such as purchasing software applications or using payment functions provided by the device 200.

[0131] Device 200 may also include one or more other sensors or components. For example, device 200 may include a front light illuminator element for providing flash or illumination for the front camera 206. Device 200 may also include an ambient light sensor (ALS) for detecting ambient light conditions for setting exposure aspects of the front camera 206 and / or for controlling the operation of the display.

[0132] Figure 2 Also shown are one or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device. As Figure 2 shown, these elements can be part of the sensor array 260. In this example, the sensor array 260 includes a first camera 261 having a 12-megapixel image sensor and a wide-angle lens with an f-number of f / 1.6. The first camera 261 also includes a dual-photodiode sensor with an APS+ sensor format. The sensor array 260 also includes a second camera 262 having a 12-megapixel image sensor and an ultra-wide-angle lens (120° FOV) with an f-number of f / 2.4. The sensor array 260 also includes a light illuminator that can be used as a flash or auxiliary light source for photography (e.g., a flashlight). The sensor array 260 is also characterized by an integrated base design that minimizes space while providing the precise alignment required for multiple high-resolution cameras. In some cases, the sensor array 260 also includes a microphone, an ambient light sensor, a depth sensor, and / or other sensors suitable for sensing along the rear surface of the device 200.

[0133] As Figure 2 shown, the cameras 261 and 262 can be aligned with the camera covers 263 and 264, respectively. The covers 263, 264 can be formed of glass, glass-ceramic, or sapphire material and can provide a transparent window through which the cameras 261, 262 can capture photographic images. In other cases, the covers 263, 264 are optical lenses that filter, magnify, or otherwise condition the light received by the respective cameras 261, 262. Other sensing or emitting elements of the sensor array 260 can transmit and / or receive signals through areas of the rear cover 272 or through separate covers coupled to the rear cover 272. As Figure 2 shown, the covers 263, 264 can extend beyond the outer surface of the cover 272 and can define recesses along the inner side of the cover 272 such that the lenses or other elements of the cameras 261 and 262 can extend into the respective recesses. In this way, the device 200 can accommodate larger lenses or other elements of the cameras 261, 262 compared to what could be accommodated without the recesses.

[0134] Device 200 also includes a battery 230. The battery 230 provides power to the device 200 and its various systems and components. The battery 230 may include a 4.45V lithium-ion battery encapsulated in a foil or other encapsulation element (e.g., a pouch). The battery 230 may be attached to the device 200 (e.g., attached to the base 219) using one or more adhesives and / or other attachment techniques. In one example, the battery 230 may be attached to the base 219 or another structure of the device 200 using two layers of adhesive, where the first adhesive adheres to the battery 230 and the second adhesive, and the second adhesive bonds to the first adhesive and the base 219 (or other structure of the device 200). The first adhesive and the second adhesive may have different properties, such as different stiffnesses (e.g., Young's modulus), different adhesive characteristics, etc. For example, in some cases, the first adhesive is configured to (e.g., with a bond strength above a threshold) adhere to the material of the battery 230, while the second adhesive is configured to (e.g., with a bond strength above a threshold) adhere to the base 219 or other structure of the device. In such cases, the first adhesive may not form a strong enough bond with the base 219, and the second adhesive may not form a strong enough bond with the battery 230, but the first adhesive and the second adhesive may form a strong enough bond with each other. Thus, by using two different adhesives (e.g., in the described layered configuration) to ultimately attach the battery 230 to the base 219, the overall strength and / or security of the attachment may be greater than in the case of using a single adhesive.

[0135] The battery 230 may be recharged via a charging port 232 (e.g., from a power cord inserted into the charging port 232 through a charging access opening 226) and / or via a wireless charging system 240. The battery 230 may be coupled to the charging port 232 and / or the wireless charging system 240 via a battery control circuit that controls the power supplied to the battery and the power supplied by the battery to the device 200. The battery 230 may include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0136] The charging system 240 may include a coil inductively coupled to an output coil or a transmission coil of a wireless charger. The coil may provide current to the device 200 to charge the battery 230 and / or power the device. In this example, the charging system 240 includes a coil assembly 242 that includes a multi-turn wound conductive wire or other conduit configured to generate current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. The coil assembly 242 also includes or is associated with an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may assist in positioning the device 200 relative to the separate wireless charging device or other accessory. In some embodiments, the magnet array also assists in radially positioning, orienting, or "rotating" the device 200 relative to the separate wireless charging device or other accessory. For example, the magnet array may include a plurality of magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic coupling to the separate charging device in a particular orientation or a set of discrete orientations to assist in positioning the device 200 relative to the separate charging device or other accessory. This functionality may be described as self-aligning or self-positioning wireless charging. As Figure 2 shown, the device 200 also includes a magnetic reference 244 for assisting in positioning the separate wireless charging device or accessory. In one example, the magnetic reference 244 is adapted to magnetically couple to a cable or power cord of the separate wireless charging device or other accessory. By coupling to the cable or power cord, the rotational alignment of the device 200 and the separate wireless charging device or other accessory may be maintained relative to an absolute position or a single position. Additionally, by magnetically coupling the cable or power cord to the rear surface of the device 200, the charging device or other accessory may be more firmly coupled to the device 200.

[0137] In some embodiments, the wireless charging system 240 includes an antenna or other element for detecting the presence of the charging device or other accessory. In some cases, the charging system includes a near field communication (NFC) antenna adapted to receive and / or transmit wireless communication between the device 200 and the wireless charger or other accessory. In some cases, the device 200 is adapted to perform wireless communication to detect or sense the presence of the wireless charger or other accessory without using a dedicated NFC antenna. The communication may also include information about the state of the device, the amount of power held by the battery 230, and / or control signals for increasing charging, decreasing charging, starting charging, and / or stopping charging for wireless charging operations.

[0138] Device 200 may also include a speaker system 224. The speaker system 224 may be positioned within the device 200 such that the respective port 235 is aligned with or otherwise proximate to the audio output of the speaker system 224. Thus, the sound output by the speaker system 224 exits the housing 210 via the respective port 235. The speaker system 224 may include a speaker positioned within a housing that defines a speaker volume (e.g., an empty space in front of or behind the speaker diaphragm). The speaker volume may be used to tune the audio output from the speaker and optionally mitigate destructive interference of the sound generated by the speaker. The speaker system 224 may include a left speaker and a right speaker that are respectively aligned with the left port 225 and the right port 235 to produce stereo sound.

[0139] Device 200 may also include a haptic actuator 222. The haptic actuator 222 may include a movable mass and an actuation system configured to move the mass to produce a haptic output. The actuation system may include one or more coils and one or more magnets (e.g., permanent magnets and / or electromagnets) that interact to produce motion. The magnet(s) may be or include recycled magnetic material. As described herein, the haptic actuator 222 may have a profile or housing shape that facilitates physical integration with the battery 230 and other components of the device 200 to minimize space and / or maximize the size of the battery.

[0140] When the coil is energized, the coil may cause the mass to move, which results in a force being applied to the device 200. The motion of the mass may be configured to cause a vibration, pulse, tap, or other haptic output detectable via the outer surface of the device 200. The haptic actuator 222 may be configured to move the mass linearly, but other movements (e.g., rotational) are also contemplated. As an alternative or supplement to the haptic actuator 222, other types of haptic actuators may be used.

[0141] Device 200 also includes a logic board 220 (also referred to herein as a circuit board assembly). The logic board 220 may include a substrate and a processor, memory, and other circuit elements coupled to the substrate. The logic board 220 may include a plurality of circuit substrates that are stacked and coupled together to maximize the area available for electronic components and circuits in a compact form factor. The logic board 220 may include means for a subscriber identity module (SIM). The logic board 220 may include electrical contacts and / or a SIM tray assembly for receiving a physical SIM card, and / or the logic board 220 may include means for an eSIM. The logic board 220 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0142] The logic board 220 may also include a wireless communication circuit that may be coupled to the housing members 211, 212, 213, 214, 215, or 216 (or portions thereof) and / or otherwise use these housing members (or portions thereof) as radiating members to provide wireless communication. The logic board 220 may also include components such as an accelerometer, a gyroscope, a near-field communication circuit and / or antenna, a compass, etc. In some embodiments, the logic board 220 may include a magnetometer adapted to detect and / or locate an accessory. For example, the magnetometer may be adapted to detect a magnetic (or non-magnetic) signal generated by an accessory of the device 200 or another device. The output of the magnetometer may include a direction output that may be used to display a direction marker or other navigation guidance on the display 203 to guide the user towards the location of the accessory or another device.

[0143] The device 200 may also include one or more pressure transducers that may be operable to detect changes in external pressure to determine changes in altitude. The pressure sensors may be disposed outside the water-sealed interior volume of the housing 210 and / or located within the water-sealed interior volume. The output of the pressure sensors may be used to track the number of steps climbed, the location of a multi-story structure (e.g., floor), the movement performed during an activity, in order to estimate physical exertion or calories burned or other relative movement of the device 200.

[0144] The logic board 220 may also include global positioning system (GPS) electronics that may be used to determine the position of the device 200 relative to one or more satellites (e.g., global navigation satellite system (GNSS)) in order to estimate the absolute position of the device 200. In some embodiments, the GPS electronics are operable to utilize dual bands. For example, the GPS electronics may use L1 (L1C), L2 (L2C), L5, L1+L5, and other GPS signal bands to estimate the position of the device 200.

[0145] The housing 210 may also include a base 219 that may be attached to the housing 210. The base 219 may be formed of metal and may serve as a structural mounting point for components of the device 200. The base 219 may define an opening corresponding to the size of the coil assembly 242 of the wireless charging system 240 such that the base 219 does not shield the wireless coil assembly 242 or otherwise adversely affect the inductive coupling between the coil of the charging system 240 and an external wireless charger or accessory.

[0146] As Figure 2As shown, the housing may include a cover 272 (e.g., a rear cover or a back cover) that may define substantially the entire rear surface of the device 200. The cover 272 may be formed from a glass (or glass-ceramic) substrate having a portion with a thickness less than 1 mm. In some cases, the sheet substrate has a portion less than 0.80 mm. In some cases, the glass substrate has a portion about 0.60 mm or thinner. The cover 272 may have a uniform thickness, or in some cases, may have a thickened or raised portion around the camera covers 263, 264. The cover 272 may be machined (e.g., ground) into a final shape before being polished and / or textured to provide a desired surface finish. The texture may be specifically configured to provide a matte appearance while also resisting the accumulation of skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of the cover 272 to provide a desired optical effect and final color to the device 200.

[0147] Similar to that described above with respect to the cover 202, the cover 272 may be at least partially positioned within an opening defined in the housing 210. Also similar to that described above with respect to the cover 202, the edge or sides of the cover 272 may be surrounded by a protective flange or lip of the housing 210, with no gap member between the edge of the cover 272 and the corresponding flange of the housing 210. An ion exchange process is typically used to chemically strengthen the cover 272 to form a compressive stress layer along the outer surface of the cover 272.

[0148] As described above, the housing 210 may include housing members 211, 212, 213, 214, 215, and 216 that are structurally joined together via a joint structure 218. The joint structure 218 (e.g., the material of the joint structure) may extend over the inner surfaces of the housing members. More specifically, a portion of the joint structure 218 may contact, cover, encapsulate, and / or engage a retention feature extending from the inner surface of the housing member.

[0149] The housing members 211, 212, 213, 214, 215, and 216 may also be referred to herein as housing segments and may be formed of aluminum, stainless steel, or other metal or metal alloy materials. As described herein, the housing members 211, 212, 213, 214, 215, and 216 may provide a robust and impact-resistant sidewall for the device 200. In the present example, the housing members 211, 212, 213, 214, 215, and 216 define a flat sidewall that extends around the perimeter of the device 200. The flat sidewall may include edges with rounded corners or chamfers that define the upper and lower edges of the sidewall of the housing 210. The housing members 211, 212, 213, 214, 215, and 216 may each have a flange portion or lip that extends around and at least partially covers the respective sides of the front cover 202 and the rear cover 272. There may be no gap material or element between the flange portion or lip and the respective side surfaces of the front cover 202 and the rear cover 272. This may allow forces or impacts applied to the housing 210 to be transferred to the front cover 202 and the rear cover 272 without affecting the display or other internal structural elements, which may improve the drop performance of the device 200.

[0150] As Figure 2 shown, the device 200 includes a plurality of antennas that may be adapted to wirelessly communicate using a 5G communication protocol. Specifically, the device 200 may include a (side-emitting) antenna array 282 that is configured to transmit and receive wireless communication signals through an antenna window 283 or waveguide formed along or otherwise integrated with the sidewall of the housing 210. The side-emitting antenna array 282 may be coupled to the logic board 220 via a flexible circuit element or other conductive connection, as described herein. The device 200 may also include a rear antenna module 284 that may include one or more (rear-emitting) antenna arrays that are configured to transmit and receive wireless communication signals through the cover 272. The antenna module 284 may be attached to the back surface or bottom surface of the logic board 220.

[0151] The antenna module 284 may include a plurality of antenna arrays. For example, the antenna module 284 may include one or more millimeter-wave antenna arrays. In the case where the antenna module 284 includes a plurality of millimeter-wave antenna arrays (each antenna array may include one or more radiating elements), the plurality of millimeter-wave antenna arrays may be configured to operate according to a diversity scheme (e.g., spatial diversity, pattern diversity, polarization diversity, etc.). The antenna module 284 may also include one or more ultra-wideband antennas.

[0152] Each of these antenna arrays (e.g., the millimeter-wave arrays of antenna array 284 and antenna module 282) may be adapted for millimeter-wave 5G communication and may be adapted to receive signals using beamforming or other techniques or in conjunction with beamforming or other techniques depending on usage. Device 200 may also include multiple antennas for performing multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more of the housing members 211, 212, 213, 214, 215, and 216 may be adapted to function as an antenna for a MIMO wireless communication scheme (or other wireless communication scheme).

[0153] Figure 3 A decomposition diagram of an exemplary electronic device is shown. Specifically, Figure 3 A decomposition diagram of device 300 is shown, which shows the various components of device 300 and an exemplary arrangement and configuration of these components. The descriptions of the various components and elements of Figure 1A and Figure 1B device 100 may also apply to Figure 3 device 300 shown. For clarity, redundant descriptions of some components are not repeated herein.

[0154] As Figure 3 shown, device 300 includes a cover 302 (e.g., a front cover), which may be formed of glass, ceramic, or other transparent substrate. In this example, cover 302 may be formed of glass or glass-ceramic material. The glass-ceramic material may include an amorphous phase and a crystalline or non-amorphous phase of one or more materials and may be formulated to improve the strength or other properties of cover 302. In some cases, cover 302 may include a sheet of chemically strengthened material or an optical processing element having one or more coatings, the one or more coatings including an anti-reflection (AR) coating, an oleophobic coating, or other types of coatings. In some cases, cover 302 includes a sheet of material having a thickness of less than 1 mm. In some cases, the sheet of material is less than 0.80 mm. In some cases, the sheet of material is about 0.60 mm or thinner. An ion exchange process may be used to chemically strengthen cover 302 to form a compressive stress layer along the outer surface of cover 302.

[0155] The cover 302 extends over substantially the entire front surface of the device and can be positioned within an opening defined by the housing 310. As described in more detail below, the edges or sides of the cover 302 can be surrounded by a protective flange or lip of the housing 310, with no gap member between the edge of the cover 302 and the corresponding flange of the housing 310. This configuration can allow an impact or force applied to the housing 310 to be transferred to the cover 302 without directly transmitting shear stress through the display 303 or the frame 304.

[0156] As Figure 3 shown, the display 303 is coupled to the inner surface of the cover 302. The display 303 can include a borderless organic light emitting diode (OLED) display that measures 16.97 cm (6.68 inches) corner to corner. The perimeter or non-active area of the display 303 can be reduced to allow for a very thin device border around the active area of the display 303. In some cases, the display 303 allows for a border area of 1.5 mm or less. In some cases, the display 303 allows for a border area of 1 mm or less. In one exemplary implementation, the border area is approximately 0.9 mm. The display 303 can have a relatively high pixel density of approximately 450 pixels per inch (PPI) or greater. In some cases, the display 303 has a pixel density of approximately 458 PPI. The display 303 can have an on-cell touch sensing system. For example, an electrode array integrated into the OLED display can be time and / or frequency multiplexed to provide both display and touch sensing functionality. The electrodes can be configured to detect touch locations, gesture inputs, multi-touch inputs, or other types of touch inputs along the outer surface of the cover 302. In some cases, the display 303 includes another type of display element, such as a liquid crystal display (LCD) that does not have an integrated touch sensing system. That is, the device 300 can include one or more touch and / or force sensing layers positioned between the display 303 and the cover 302.

[0157] The display 303 may include an Always-On Display (AOD) function. For example, the display 303 may be configured to allow a subset of designated areas or pixels to be displayed when the device 300 is powered on, such that graphical content is visible to the user even when the device 300 is in a low-power or sleep mode. This may allow the time, date, battery status, recent notifications, and other graphical content to be displayed in the low-power or sleep mode. This graphical content may be referred to as persistent or always-on graphical output. Although some battery power may be consumed when displaying the persistent or always-on graphical output, the power consumption is generally less than that during normal or full-power operation of the display 303. This function may be enabled by operating only a subset of the display pixels and / or operating at a reduced resolution in order to reduce the power consumption of the display 303.

[0158] As Figure 3 shown, the device 300 may further include a frame 304, which is positioned below the cover 302 and extends around the outer perimeter of the display 303. The perimeter of the frame 304 may be attached to the lower surface or the inner surface of the cover 302. A portion of the frame 304 may extend below the display 303 and may attach the cover 302 to the housing 310. Since the display 303 is attached to the lower surface or the inner surface of the cover 302, the frame 304 may also be described as attaching both the display 303 and the cover 302 to the housing 310. The frame 304 may be formed of a polymer material, a metal material, or a combination of polymer and metal materials. The frame 304 may support the elements of the display stack, provide anchor points for flexible circuits, and / or be used to mount other components and device elements. In some cases, the frame 304 includes one or more metal or conductive elements that provide shielding between device components, such as between the display stack (including display components and touch sensor components) and other components such as the haptic actuator 322, the speaker system 324, etc.

[0159] The cover 302, the display or display stack 303, and the frame member 304 may be part of the top module 301 of the device 300. The top module 301 may be assembled as a subassembly, which may then be attached to the housing member. For example, as described herein, the display 303 may be attached to the cover 302 (e.g., via a transparent adhesive), and the frame member 304 may be attached to the cover around the perimeter of the display stack 303 (e.g., via an adhesive). The top module 301 may then be attached to the housing member of the device 300 by mounting and adhering the frame member 304 to a boss defined by the housing member.

[0160] Device 300 also includes a speaker module 350 configured to output sound via a speaker port. The speaker port may be located in and / or at least partially defined by a recess 351 of the cover 302. As described herein, a decorative member may be at least partially located in the recess 351 to facilitate sound output while also inhibiting debris, liquid, or other materials or contaminants from entering the device 300. Output from the speaker module 350 may pass through an acoustic path at least partially defined by the speaker module 350 itself and the decorative member. In some cases, a portion of the acoustic path (e.g., between the speaker module 350 and the decorative member) is defined by the housing 310 and / or a molded material coupled to the housing 310. For example, a molded material (e.g., a fiber-reinforced polymer) may be molded against a metallic portion of the housing 310 (e.g., the housing member 313 described herein). The molded material may also form one or more joint structures that also structurally join the housing members together (e.g., the joint structure 318). The port may be defined through the molded material to more generally acoustically couple the speaker module 350 to the decorative member and / or the recess 351, thereby directing sound from the speaker module 350 to the exterior of the device 300. In some cases, a portion of the port extending through the molded material is defined by the housing member itself, as referenced herein Figures 6A to 6B described.

[0161] As Figure 3 shown, device 300 also includes one or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the front surface of the device. In this example, device 300 includes a front camera 306 that includes a high-resolution camera sensor. The front camera 306 may have a 12-megapixel resolution sensor with an optical element providing a fixed focus and an 85° field of view. The front camera 306 may have an f / 2.2 aperture number. Device 300 also includes a face recognition sensor 352 that includes an infrared light projector and an infrared light sensor configured to sense an array or area of depth points along a user's face. The array of depth points may be characterized as a unique feature or biometric that may be used to identify the user and unlock the device 300 or authorize functions on the device 300, such as purchasing software applications or using payment functions provided by the device 300.

[0162] Device 300 may also include one or more other sensors or components. For example, device 300 may include a front light illuminator element for providing flash or illumination for the front camera 306. Device 300 may also include an ambient light sensor (ALS) for detecting ambient light conditions for setting exposure aspects of the front camera 306 and / or for controlling the operation of the display.

[0163] Figure 3 One or more cameras, light emitters, and / or sensing elements configured to transmit signals, receive signals, or otherwise operate along the rear surface of the device are also shown. As Figure 3 shown, these elements can be integrated in the sensor array 360. In this example, the sensor array 360 includes a first camera 361 having a 12-megapixel image sensor and a wide-angle lens with an aperture number of f / 1.6. The first camera 361 may also include a sensor-shift mechanism that allows for image stabilization and / or optical focusing. In some cases, the image sensor moves relative to one or more fixed elements of the optical lens assembly. The sensor array 360 also includes a second camera 362 having a 12-megapixel image sensor and an ultra-wide-angle lens (120° FOV) with an aperture number of f / 2.2. The sensor array 360 may also include a third camera 363 having a 12-megapixel image sensor and a telephoto optical lens assembly that provides 2.5x optical zoom. The third camera 363 may also have an aperture number of f / 2.4.

[0164] The sensor array 360 also includes a light illuminator that can be used as a flash or auxiliary light source for photography (e.g., a flashlight). The sensor array 360 is also characterized by an integrated base design that minimizes space while providing the precise alignment required for multiple high-resolution cameras. In some cases, the sensor array 360 also includes a microphone, an ambient light sensor, and other sensors suitable for sensing along the rear surface of the device 300.

[0165] The sensor array 360 may also include a depth sensor 365 capable of estimating the distance to an object located behind the device 300. The depth sensor module 365 may include an optical sensor that uses time-of-flight or other optical effects to measure the distance between the device 300 and an external object. The depth sensor 365 may include one or more optical emitters suitable for emitting one or more light beams that can be used to estimate the distance. In some cases, the one or more light beams are coherent light beams having a substantially uniform wavelength / frequency. The coherent light source can facilitate depth measurement using time-of-flight, phase shift, or other optical effects. In some cases, the depth sensor 365 uses sound output, radio output, or other types of output that can be used to measure the distance between the device 300 and one or more external objects. The depth sensor 365 can be positioned near a window 371 (e.g., an area of the rear cover 372 or other component that covers the sensor array 360), through which the depth sensor 365 can send and / or receive signals (e.g., laser, infrared light, visible light, etc.).

[0166] AsFigure 3 As shown, cameras 361, 362, and 363 can be aligned with camera covers 366, 367, and 368 respectively. Covers 366, 367, and 368 can be formed of glass or sapphire material and can provide transparent windows through which cameras 361, 362, and 363 can capture photographic images. In other cases, covers 366, 367, and 368 are optical lenses that filter, magnify, or otherwise condition the light received by corresponding cameras 361, 362, and 363. Other sensing or emitting elements of sensor array 360 can transmit and / or receive signals through regions of rear cover 372 or through separate covers (e.g., 369) coupled to rear cover 372. As Figure 3 shown, covers 366, 367, and 368 can extend beyond the outer surface of cover 372 and can define recesses along the inner side of cover 372 such that the lenses or other elements of cameras 361, 362, and 363 can extend into the corresponding recesses. In this way, device 300 can accommodate larger lenses or other elements of cameras 361, 362, and 363 compared to the lenses or other elements that might be accommodated in the absence of the recesses.

[0167] Device 300 also includes a battery 330. Battery 330 provides power to device 300 and its various systems and components. Battery 330 can include a 4.40V lithium-ion battery encapsulated in a foil or other encapsulating element. Battery 330 can include a wound electrode configuration, sometimes referred to as a "jelly roll" or a folded electrode configuration. Battery 330 can be recharged via charging port 332 (e.g., from a power cord inserted into charging port 332 through charging access opening 326) and / or via wireless charging system 340. Battery 330 can be coupled to charging port 332 and / or wireless charging system 340 via a battery control circuit that controls the power provided to the battery and the power provided by the battery to device 300. Battery 330 can include one or more lithium-ion battery cells or any other suitable type of rechargeable battery element.

[0168] The wireless charging system 340 may include a coil inductively coupled to an output or transmission coil of a wireless charger. The coil may provide current to device 300 to charge battery 330 and / or power the device. In this example, wireless charging system 340 includes coil assembly 342, which includes a multi-turn conductive wire or other conduit configured to generate current (charging current) in response to being placed in an inductive charging electromagnetic field generated by a separate wireless charging device or accessory. Coil assembly 342 also includes an array of magnetic elements arranged in a circular or radial pattern. The magnetic elements may assist in positioning device 300 relative to a separate wireless charging device or other accessory. In some embodiments, the magnet array also assists in radially positioning, orienting, or "rotating" device 300 relative to a separate wireless charging device or other accessory. For example, the magnet array may include a plurality of magnetic elements having alternating magnetic polarities arranged in a radial pattern. The magnetic elements may be arranged to provide magnetic coupling to a separate charging device in a particular orientation or a set of discrete orientations to assist in positioning device 300 relative to a separate charging device or other accessory. This functionality may be described as self-aligning or self-positioning wireless charging. As Figure 3 shown, device 300 also includes a magnetic reference 344 for assisting in positioning a separate wireless charging device or accessory. In one example, magnetic reference 344 is adapted to magnetically couple to a cable or power cord of a separate wireless charging device or other accessory. By coupling to the cable or power cord, the rotational alignment of device 300 and a separate wireless charging device or other accessory may be maintained relative to an absolute or single position. Additionally, by magnetically coupling the cable or power cord to the rear surface of device 300, the charging device or other accessory may be more securely coupled to device 300.

[0169] In some embodiments, wireless charging system 340 includes an antenna or other element for detecting the presence of a charging device or other accessory. In some cases, the charging system includes a near field communication (NFC) antenna adapted to receive and / or transmit wireless communication between device 300 and a wireless charger or other accessory. In some cases, device 300 is adapted to perform wireless communication to detect or sense the presence of a wireless charger or other accessory without using a dedicated NFC antenna. The communication may also include information about the state of the device, the amount of charge held by battery 330, and / or control signals for increasing charging, decreasing charging, starting charging, and / or stopping charging for wireless charging operations.

[0170] Device 300 may also include a speaker system 324. The speaker system 324 may be positioned in device 300 such that a respective port 325 is aligned with or otherwise proximate to the audio output of the speaker system 324. Thus, the sound output by the speaker system 324 exits the housing 310 via the respective port 325. The speaker system 324 may include a speaker positioned in a housing that defines a speaker volume (e.g., an empty space in front of or behind the speaker diaphragm). The speaker volume may be used to tune the audio output from the speaker and optionally reduce destructive interference of the sound generated by the speaker. The speaker system 324 may include a left speaker and a right speaker that are respectively aligned with the left and right ports 325 to produce stereo sound.

[0171] Device 300 may also include a haptic actuator 322. The haptic actuator 322 may include a movable mass and an actuation system configured to move the mass to produce a haptic output. The actuation system may include one or more coils and one or more magnets (e.g., permanent magnets and / or electromagnets) that interact to produce motion. The magnet may be or may include recycled magnetic material. As described herein, the haptic actuator 322 may have a profile or housing shape that facilitates physical integration with the battery 330 and other components of device 300 to minimize space and / or maximize the size of the battery.

[0172] When the coil is energized, the coil may cause the mass to move, which results in a force being applied to device 300. The movement of the mass may be configured to cause a vibration, pulse, tap, or other haptic output detectable via the outer surface of device 300. The haptic actuator 322 may be configured to move the mass linearly, but other movements (e.g., rotational) are also contemplated. As an alternative or supplement to the haptic actuator 322, other types of haptic actuators may be used.

[0173] Device 300 also includes a logic board 320 (also referred to herein as a circuit board assembly). The logic board 320 may include a substrate and a processor, memory, and other circuit elements coupled to the substrate. The logic board 320 may include a plurality of circuit substrates that are stacked and coupled together to maximize the area available for electronic components and circuits in a compact form factor. The logic board 320 may include means for a subscriber identity module (SIM). The logic board 320 may include electrical contacts and / or a SIM tray assembly for receiving a physical SIM card, and / or the logic board 320 may include means for an eSIM. The logic board 320 may be fully or partially encapsulated to reduce the chance of damage due to the ingress of water or other fluids.

[0174] Logic board 320 may also include a wireless communication circuit, which may be coupled to housing members 311, 312, 313, 314, 315, or 316 (or portions thereof) and / or otherwise use these housing members (or portions thereof) as radiating members or structures to provide wireless communication. Logic board 320 may also include components such as an accelerometer, a gyroscope, a near field communication circuit and / or antenna, a compass, etc. In some specific embodiments, logic board 320 may include a magnetometer adapted to detect and / or locate an accessory. For example, the magnetometer may be adapted to detect a magnetic (or non-magnetic) signal generated by an accessory of device 300 or another device. The output of the magnetometer may include a direction output, which may be used to display a direction marker or other navigation guidance on display 303 to guide the user towards the location of the accessory or another device.

[0175] Device 300 may also include one or more pressure transducers, which may be operable to detect changes in external pressure to determine changes in altitude. The pressure sensors may be disposed outside the water-sealed internal volume of housing 310 and / or located within the water-sealed internal volume. The output of the pressure sensors may be used to track the steps climbed, the location of a multi-story structure (e.g., floor), the movement performed during an activity, in order to estimate physical exertion or calories burned or other relative movement of device 300.

[0176] Logic board 320 may also include global positioning system (GPS) electronics, which may be used to determine the position of device 300 relative to one or more satellites (e.g., global navigation satellite system (GNSS)) in order to estimate the absolute position of device 300. In some specific embodiments, the GPS electronics are operable to utilize dual bands. For example, the GPS electronics may use L1 (L1C), L2 (L2C), L5, L1+L5, and other GPS signal bands to estimate the position of device 300.

[0177] Housing 310 may also include a base 319 attachable to housing 310. Base 319 may be formed of metal and may serve as a structural mounting point for components of device 300. Base 319 may define an opening corresponding to the size of coil assembly 342 of wireless charging system 340 such that base 319 does not shield the wireless coil assembly 342 or otherwise adversely affect the inductive coupling between the coil of wireless charging system 340 and an external wireless charger or accessory.

[0178] As Figure 3As shown, the housing may include a cover 372 (e.g., a rear cover or a back cover) that may define substantially the entire rear surface of the device 300. The cover 372 may be formed of glass, glass ceramic, or other materials having portions with a thickness less than 1 mm. In some cases, the substrate has portions less than 0.80 mm. In some cases, the substrate has portions about 0.60 mm or thinner. The cover 372 may have a uniform thickness, or in some cases, may have thickened or raised portions around the camera covers 366, 367, 368. The cover 372 may be machined (e.g., ground) into a final shape before being polished and / or textured to provide a desired surface finish. The texture may be specifically configured to provide a matte appearance while also resisting the accumulation of skin, lint, or other debris. A series of decorative layers may be formed along the inner surface of the cover 372 to provide a desired optical effect and final color for the device 300.

[0179] Similar to that described above with respect to the cover 302, the cover 372 may be at least partially positioned within an opening defined in the housing 310. Also similar to that described above with respect to the cover 302, the edge or sides of the cover 372 may be surrounded by a protective flange or lip of the housing 310, with no gap member between the edge of the cover 372 and the corresponding flange of the housing 310. An ion exchange process may be used to chemically strengthen the cover 372 to form a compressive stress layer along the outer surface of the cover 372. In some cases, the (rear) cover 372 is formed of the same or similar material as the (front) cover 302.

[0180] As described above, the housing 310 may include housing members 311, 312, 313, 314, 315, and 316 that are structurally joined together via a joint structure 318. The joint structure 318 (e.g., the material of the joint structure) may extend above the inner surface of the housing members. More specifically, a portion of the joint structure 318 may contact, cover, encapsulate, and / or engage a retaining feature that extends from the inner surface of the housing member.

[0181] The housing members 311, 312, 313, 314, 315, and 316 may also be referred to herein as housing segments and may be formed of aluminum, stainless steel, or other metal or metal alloy materials. As described herein, the housing members 311, 312, 313, 314, 315, and 316 may provide a robust and impact-resistant sidewall for the device 300. In the present example, the housing members 311, 312, 313, 314, 315, and 316 define a flat sidewall that extends around the perimeter of the device 300. The flat sidewall may include edges with rounded or chamfered corners that define the upper and lower edges of the sidewall of the housing 310. The housing members 311, 312, 313, 314, 315, and 316 may each have a flange portion or lip that extends around and at least partially covers a respective side of the front cover 302 and the rear cover 372. There may be no gap material or elements between the flange portion or lip and the respective side surfaces of the front cover 302 and the rear cover 372. This may allow forces or impacts applied to the housing 310 to be transferred to the front cover 302 and the rear cover 372 without affecting the display or other internal structural elements, which may improve the drop performance of the device 300.

[0182] As Figure 3 shown, the device 300 includes a plurality of antennas that may be adapted to communicate wirelessly using a 5G communication protocol. Specifically, the device 300 may include a (side-emitting) antenna array 382 that is configured to transmit and receive wireless communication signals through an antenna window 383 or waveguide formed along or otherwise integrated with the sidewall of the housing 310. The side-emitting antenna array 382 may be coupled to the logic board 320 via a flexible circuit element or other conductive connection, as described herein. The device 300 may also include a rear antenna module 384 that may include one or more (rear-emitting) antenna arrays that are configured to transmit and receive wireless communication signals through the cover 372. The antenna module 384 may be attached to the back surface or bottom surface of the logic board 320.

[0183] The antenna module 384 may include a plurality of antenna arrays. For example, the antenna module 384 may include one or more millimeter-wave antenna arrays. In the case where the antenna module 384 includes a plurality of millimeter-wave antenna arrays (each antenna array may include one or more radiating elements), the plurality of millimeter-wave antenna arrays may be configured to operate according to a diversity scheme (e.g., spatial diversity, pattern diversity, polarization diversity, etc.). The antenna module 384 may also include one or more ultra-wideband antennas.

[0184] Each of these antenna arrays (e.g., the millimeter wave arrays of antenna array 384 and antenna module 382) may be adapted for millimeter wave 5G communication and may be adapted to receive signals using beamforming or other techniques or in conjunction with beamforming or other techniques depending on usage. Device 300 may also include multiple antennas for performing multiple-input multiple-output (MIMO) wireless communication schemes, including 4G, 4G LTE, and / or 5G MIMO communication protocols. As described herein, one or more of the housing members 311, 312, 313, 314, 315, and 316 may be adapted to function as an antenna for a MIMO wireless communication scheme (or other wireless communication scheme).

[0185] Figures 4A to 4B A partial view of an exemplary electronic device 400 is shown. Figures 4A to 4B The portion shown in may correspond to Figure 1A region 4-4 in, but the same or similar regions may exist on other exemplary devices described herein. Electronic device 400 may correspond to or be an implementation of electronic device 100, 200, or 300 or any other device described herein. Figures 4A to 4B An exemplary configuration of a speaker port 401 and a forward sensor region is shown.

[0186] Device 400 includes a cover 402 and a housing member 404, the cover may correspond to or be an implementation of other covers described herein, such as cover 102, 202, 302, the housing member may correspond to or be an implementation of other housing members described herein, such as housing member 127, 213, 313, and the housing member may define at least a portion of four side surfaces of the device. As Figure 4C shown, cover 402 may define a front surface 432, a rear surface 434, and a peripheral side surface 436 extending from front surface 432 to rear surface 434. Peripheral side surface 436 is at least partially surrounded by a wall 407 of housing 404 ( Figure 4C ).

[0187] Cover 402 defines a notch 406 along an edge of cover 402. Notch 406 (also referred to as a recess or cutout) may be along the top edge of cover 402 to define a space between the edge of cover 402 and housing member 404, and this space defines the top side of device 400. The space between the edge of cover 402 and housing member 404 may be referred to as a speaker port opening. A first side of the speaker port opening may be defined by wall 407 of the housing member, and a second side of the speaker port opening may be defined by notch 406 of front cover 402. Notch 406 may define at least three sides of the speaker port opening, including a third side and a fourth side of the speaker port opening, as Figures 4A to 4C shown.

[0188] The notch 406 can at least partially define the acoustic path of the device. For example, sound from a speaker located within the device can pass through the space defined by the notch (e.g., between the peripheral side surface of the cover 402 and the wall of the housing 404). Since the speaker port 401 is close to the top of the device, the speaker port 401 is ultimately disposed at an area of the device 400 that can be held against a user's ear during a phone call or other use.

[0189] The device 400 can include a speaker port cover structure 405 (also referred to as an acoustic port cover). The speaker port cover structure 405 can be at least partially located within the recess 406 and positioned between the edge portion of the cover 402 (in which the recess 406 is defined) and the housing member 404. The speaker port cover structure 405 can include a decorative member 408 and a mesh member 410. The decorative member 408 can be adjacent to the edge of the cover 402 and adjacent to the housing member 404. The front surface of the decorative member 408 can be flush with the front outer surface 432 of the cover 402. In some cases, there is no gap member or material between the decorative member 408 and the cover 402 or between the decorative member 408 and the housing member 404. As described herein, the speaker port cover structure 405 provides a cover over a portion of the acoustic path in the device 400 that directs sound from the speaker module to the speaker port 401. In some cases, the speaker port cover structure 405 also covers the acoustic path coupled to a microphone within the device, as described in more detail herein.

[0190] The mesh member 410 can be configured to allow sound to pass through while inhibiting dust, liquid, or other contaminants from entering the device 400. The mesh member 410 can be a metal mesh sheet, a polymer mesh sheet, etc. The mesh member 410 can be a one-piece structure having holes or gaps formed therethrough (e.g., a perforated or molded polymer sheet), or it can be formed from multiple individual members (e.g., a woven fabric or a metal mesh). In some cases, the area between about 30% and about 40% of the mesh member 410 can be open (e.g., the openings or perforations defined by the mesh can constitute the area between about 30% and about 40% of the mesh member 410). In this way, sound can pass through the mesh member 410 without excessive attenuation or other acoustic impacts.

[0191] Figures 4A to 4BAn exemplary arrangement of components in the forward sensor array 411 that can be at least partially surrounded by the active area 415 of the display is also shown. The forward sensor array 411 includes a forward camera 412, a proximity sensor 414, a combined flood illuminator and dot projector 416 (e.g., for projecting flood illumination and dot patterns onto an object such as a user's face), and an infrared light sensor 418 (e.g., for capturing an image of the object illuminated by the flood illuminator and dot projector). Each of the components in the forward sensor array 411 can be positioned beneath the cover 402 and can transmit and / or receive light through the cover 402. In some cases, the area of the cover 402 above a particular component of the forward sensor array 411 has a mask that is visually opaque but transparent to a particular wavelength of light utilized by the underlying sensor. For example, in some embodiments, the combined flood illuminator and dot projector 416 and the infrared light sensor 418 are covered with a visually opaque infrared-transparent coating or material.

[0192] The forward sensor array 411 can be located in a portion of the inactive display area on the front side of the device. For example, the lines shown surrounding the forward camera 412, the proximity sensor 414, the combined flood illuminator and dot projector 416, and the infrared light sensor 418 can indicate the boundary between the active area 415 of the display and an area that does not include the display or is not configured to produce a graphical output. The forward sensor array 411 can include a visually opaque mask, ink, coating, or other material.

[0193] Figure 4B Another view of the device 400 is shown, showing additional details of the forward sensor array 411 and the speaker port 401. In some cases, the speaker port 401, and more specifically the trim 408 and the mesh member 410, can be positioned outside of the glue line 426. The glue line 426 can adhere the cover 402 (and / or top module) of the device to the underlying structure (e.g., the housing member 404) and can define a seal that inhibits the entry of dust, liquid, or other contaminants or debris into the device. Since the speaker port 401 is outside of the glue line 426, other seals and sealing techniques can be used to inhibit the entry of dust, liquid, or other contaminants or debris into the device via the speaker port 401.

[0194] As described above, the speaker port cover structure 405 can provide acoustic access for both the speaker module and the microphone. In some cases, a separator 424 can be positioned within the speaker port cover structure 405 (as shown in more detail with respect to Figure 4C to increase the acoustic separation and / or isolation between the acoustic paths to the microphone and to the speaker. As Figure 4BAs shown, the region 422 of the speaker port cover structure 405 may correspond to the acoustic path of the microphone (e.g., the acoustic input path), and the region 420 of the speaker port cover structure 405 may correspond to the acoustic path of the speaker (e.g., the acoustic output path). The separator 424 may be a piece of metal, plastic, or any other suitable material.

[0195] Figure 4C A partial exploded view of the device 400 is shown, showing additional details of the integration of the speaker port cover structure 405 with the cover 402, the housing member 404, and other device components. Figure 4C The mesh member 410 is shown separated from the trim piece 408. The mesh member 410 may be coupled to the trim piece 408 via adhesives, welds, brackets, fasteners, interference fits, latch structures, etc. The separator 424 may also be fixed in the cavity of the trim piece 408 (e.g., below the mesh member 410). The separator 424 may be fixed to the trim piece 408 via welding, adhesives, fasteners, interference fits, latch structures, etc. The separator 424 may provide a barrier between the acoustic path to the microphone and the acoustic path to the speaker.

[0196] After the trim piece 408, the mesh member 410, and optionally the separator 424 are assembled together, the trim piece 408 may be attached to the cover 402 via the adhesive member 430. The adhesive member 430 (e.g., liquid adhesive, adhesive foam, pressure-sensitive adhesive (“PSA”), heat-sensitive adhesive (“HSA”), etc.) may adhere to the top side of the flange 428 of the trim piece 408 and the bottom side of the cover 402. After the trim piece 408 is adhered to the cover 402 via the adhesive member 430, the cover 402 together with other top module components such as the display may be attached to the frame member 427 via the adhesive 426. The trim piece 408, and specifically the flange 428, may be captured between the bottom side of the cover 402 and the frame member 427. Additionally, the adhesive 426 may contact and / or at least partially surround the bottom side of the flange 428 and other surfaces of the trim piece 408, thereby contributing to the strength and stability of the trim piece 408 in the device.

[0197] Figure 5An exemplary cover structure 510 for use in a speaker port is shown, as described herein. The cover structure 510 defines a flange 514 and a recessed region 512. The recessed region 512 may include holes, which may be defined by a mesh member such as mesh member 410, or may be defined as holes through the material of the cover structure 510 itself (e.g., by laser forming, drilling, or otherwise forming holes through the wall structure of the cover structure 510). The recessed region may be recessed relative to a frame region 513 surrounding the recessed region. In some cases, the recessed region corresponds to a thinned region of the cover structure 510. For example, the thickness between the top (outer) surface and the bottom (inner) surface of the recessed region may be less than the thickness between the top (outer) surface and the bottom (inner) surface of the frame region 513. In cases where the recessed region is part of the cover structure 510 itself, the recessed region may have a minimum thickness between about 20 micrometers and about 40 micrometers (e.g., 25 micrometers, 30 micrometers, 35 micrometers, etc.). The recessed region 512 may have a width dimension (e.g., dimension 515). The dimension 515 may be about 0.4 mm, about 0.5 mm, about 0.6 mm, about 0.7 mm, or any other suitable dimension. The recessed region may be surrounded by the frame region 513, as described above. The thickness of the frame region 513 may be between about 0.3 mm and about 0.6 mm. The holes in the mesh and / or holes defined through the cover structure 510 may have a diameter (or other opening size) between about 90 micrometers and about 110 micrometers (e.g., about 90 micrometers, about 100 micrometers, about 105 micrometers, about 110 micrometers, etc.). The webs defining the holes (e.g., the material of the cover structure located between the holes) may have a minimum thickness between about 20 micrometers and about 40 micrometers (e.g., 25 micrometers, 30 micrometers, 35 micrometers, etc.).

[0198] Figure 5 An exemplary pattern of the holes is shown. In other examples, the single-piece cover structure may have holes of different patterns and / or holes of different sizes or shapes (e.g., square holes, pentagonal holes, etc.). For example, the first corner of the perforated region (e.g., near the top side of the device) may have a first minimum (e.g., minimum) radius of curvature, while the second corner (e.g., towards the bottom side of the device) has a second minimum radius of curvature different from the first minimum radius of curvature. The same radius of curvature may be mirrored on the opposite side of the perforated region. Thus, the perforated region exhibits asymmetry about a horizontal axis (e.g., at Figure 4Bfrom left to right). In some cases, the frame region of the cover structure also exhibits a similar asymmetry about the horizontal axis, as defined by the top corner of the frame region, which has a minimum radius of curvature less than the bottom corner of the frame region. The lowest (e.g., minimum) thickness of the frame region (e.g., the distance between the perforated region and the outer perimeter of the cover structure) can be between about 0.2 mm and about 0.3 mm. In some cases, the lowest thickness of the frame region (e.g., the distance between the perforated region and the outer perimeter of the cover structure) can be between about 0.05 mm and about 0.2 mm.

[0199] In some cases, the perforated region can have corners with substantially equal radii of curvature. For example, the first corner of the perforated region (e.g., near the top side of the device) can have a first minimum radius of curvature, and the second corner (e.g., towards the bottom side of the device) has a second minimum radius of curvature that is the same as the first minimum radius of curvature. The same radius of curvature can be mirrored on the opposite sides of the perforated region. Thus, the perforated region is symmetric about the horizontal axis (e.g., in Figure 4B from left to right). In some cases, the frame region exhibits asymmetry about the horizontal axis, or it can be substantially symmetric (e.g., having four corners with substantially the same radius of curvature).

[0200] The corners of the perforated region and the frame region as described above can have a constant radius of curvature (e.g., they can define a portion of a circle) or a variable radius of curvature (e.g., they can define a non-circular spline).

[0201] Figure 6A A partial cross-sectional view of device 400 is shown, showing the acoustic path through the device and reaching (and passing through) speaker port 401. Device 400 includes speaker module 620, which can correspond to or be an embodiment of speaker module 250, 350, or any other speaker module described herein. Device 400 also includes cover 402, display 610, frame member 611 coupled to the inner surface of front cover 402, and rear cover 604. Speaker module 620 can be positioned below the active area of display 610 (e.g., the area of display 610 configured to display graphical output to the user).

[0202] The rear cover 604 is attached to the housing structure via an adhesive 608. The housing structure may be formed by or include a housing member 404 and a molded member 607. The molded member 607 may be a polymeric material (e.g., a fiber-reinforced polymer) molded against the housing member 404 and / or other housing members and / or components of the device 400. In some cases, the molded member 607 is integral with one or more joint structures and / or engagement elements of the device 400 (e.g., joint structures 122, 218, 318, engagement elements 1416, 1418, 1420, 1422, 1424, and 1426, or any other joint structure / engagement element described herein). Thus, the molded member 607 may define at least a portion of the outer surface of the housing structure and may define a portion of the acoustic path, as described herein.

[0203] The speaker module 620 may be coupled to the molded member 607. For example, a portion of the speaker module 620 may be inserted into a hole defined by the molded member 607. Figure 6A A portion of the speaker module 620 positioned within the hole of the molded member 607 is shown, where a seal member 632 (attached to the speaker module 620) forms a seal between the speaker module 620 and the surface of the hole. The seal member 632 may form a seal between the acoustic path (e.g., defined by path portions 628, 630, and 634) and other regions within the device 400. Specifically, in some cases, water, liquid, or contaminants cannot be prevented from entering the acoustic path through the speaker port 401. Thus, the seal between the speaker module 620 and the molded member 607 may help prevent any water, liquid, or other contaminants that have entered the acoustic path from escaping into other regions of the device 400 and may also help prevent acoustic losses when sound travels through the acoustic path. A barrier 622 (e.g., a mesh or other material that allows sound to pass through) may be positioned within the speaker module 620 and between the speaker driver 624 and the speaker port 401. The barrier 622 may help inhibit liquid or contaminants from contacting or accumulating on the speaker driver 624. The speaker driver 624 may be or may include a speaker diaphragm and may generate sound that is directed through the acoustic path to the speaker port 401. More specifically, sound from the speaker driver 624 may pass through a first path portion 628, a second path portion 630, and a third path portion 634 and may ultimately pass through the speaker port 401 (e.g., through a mesh member 410 or through other holes or openings provided in the speaker port 401).

[0204] As described above, the acoustic path can be defined by path portions 628, 630, and 634. The first path portion 628 can be defined by the speaker module 620, which can extend from the speaker driver 624 to the second path portion and can be configured to direct sound from the speaker driver 624 to the speaker port opening. At least a portion of the first path portion 628 can extend below the active area of the display 610. At least a portion of the first path portion 628 can extend below the forward sensor array 411( Figures 4A to 4B ). The second path portion 630 can be defined by the molded member 607. In some cases, the second path portion 630 is formed as a result of the molding process of the molded member 607, while in some cases, it is formed after the molding process (e.g., it is drilled or otherwise machined after the molded member 607 is molded and cured against the housing member 404). The third path portion 634 can be defined by the housing member 404. More specifically, at least one side or surface of the third path portion 634 can be defined by the housing member 404. In some cases, the other side or surface of the third path portion 634 (e.g., the opposite side or surface of the third path portion 634) can be defined by another component or structure of the device 400, such as the frame member 611 of the top module (e.g., the frame member attached to the cover 402 and used to couple the cover 402 to the molded member 607 and / or other device components or structures).

[0205] Figure 6B A partial cross-sectional view of the device 400 is shown, showing the speaker module 620 detached from the molded member 607, and showing the manner in which the speaker module 620 can be coupled to and sealed against the molded member 607.

[0206] The speaker module 620 can be coupled to the molded member 607 by translation indicated by arrow 648. This translation can be substantially horizontal (as shown), which can correspond to the lateral translation of the speaker module 620 in the positive y direction (e.g., toward the housing member 404, which can correspond to, for example Figure 2 the housing member 213 in).

[0207] When the speaker module 620 is inserted into the hole defined in the molded member 607, the end surface 646 of the speaker module can contact the surface 644 of the molded member 607. The contact between the end surface 646 and the surface 644 can be used as a reference for defining the y position of the speaker module 620 in the device. Even if the end surface 646 does not contact the surface 644, the end surface 646 and the surface 644 can together define the maximum y position of the speaker module 620 in the device and can help suppress the free movement of the speaker module 620.

[0208] Similarly, the molded member 607 can define a bore having a sealing surface 640, and the sealing member 632 contacts the bore to seal the acoustic path. The sealing member 632 (which can be a polymeric material such as rubber, silicone (e.g., molded liquid silicone rubber), foam, etc.) can deform against the sealing surface 640 to define a seal. The speaker module 620 can also define a flange portion 633 that acts as a hard stop between the speaker module 620 and the molded member 607. The flange portion 633 can define the maximum z-position of the speaker module 620 within the system and / or inhibit movement of the speaker module 620 in the z-direction. Figure 6B The vertical position or vertical direction in Figure 6B can be referred to as the z-position or z-direction (e.g., the direction extending generally perpendicularly from the rear cover of the device to the front cover). In some cases, the flange portion 633 can prevent the speaker module 620 from being forced too far down or up (e.g., in the positive z-direction or negative z-direction) due to forces resulting from deflection and / or deformation of the sealing member 632. The flange portion 633 can extend above the interface between the sealing member 632 and the speaker module 620 such that the flange portion 633 acts as a hard stop in the z-direction before the sealing member 632 reaches maximum deformation or deflection. For example, a force that would tend to move the speaker module 620 in the z-direction or misalign it will cause the flange portion 633 to interfere with the molded member 607 or other structure, thereby inhibiting further movement of the speaker module 620 and defining the limit of its position in the z-direction (e.g., rather than allowing the force to continue deforming the sealing member 632 and creating a greater degree of misalignment).

[0209] Figure 6C Another exemplary speaker module 650 and molded member 655 that can be used in a device as described herein are shown. As Figure 6C shown, the end face of the speaker module 650 can be coupled to the corresponding face of the molded member 655 such that the outlet of the speaker module 650 is in communication with a bore in the molded member 655 to direct sound through an acoustic path defined by the molded member 655. A sealing member 652 can be positioned between the end face of the speaker module 650 and the corresponding face of the molded member 655 to provide an acoustic and / or environmental (e.g., liquid, debris) seal. The sealing member 652 can be a compliant material (e.g., foam, elastomeric gasket). In some cases, the sealing member 652 is or includes an adhesive such as an adhesive film, PSA, HSA, etc. The speaker module 650 can be secured to the device using fasteners, brackets, etc., and in cases where the sealing member 652 is or includes an adhesive, the speaker module 650 can be secured at least in part by the adhesive.

[0210] As described above, the speaker port 401 can provide acoustic access to both the internal speaker and the internal microphone. In some cases, the device can include one or more structures configured to provide an acoustic separation between the acoustic paths of the speaker and the microphone. An exemplary structure is the separator 424 positioned within the speaker port cover structure ( Figure 4B , Figure 4C ). Figure 7A A partial cross-sectional view of the device 400 is shown, showing the acoustic path through the speaker port 401 to the microphone module 700. Figure 7A An exemplary guiding member 714 (or simply guide 714) is shown that can define a portion of the acoustic path from the speaker port 401 to the microphone module 700.

[0211] Specifically, the microphone module 700 can be coupled to the underside and / or top module of the cover 402. In some cases, as shown, the microphone module 700 is coupled to a substrate 702, which in turn is coupled to a portion of the frame member 706 or other components of the top module (e.g., via an adhesive 704). The substrate 702 can define a hole 712 that allows the microphone module 700 to be acoustically coupled to the acoustic path defined as passing through the frame member 706. A diaphragm 713 can be positioned above the hole 712 (e.g., covering the hole) to inhibit water and / or other contaminants from passing through while allowing sound to pass through. One or more additional diaphragms can also be incorporated into the microphone module 700. The diaphragms (including the diaphragm 713) can be meshes, screens, foams, etc., and can be formed of any suitable material such as polymers, metals, etc.

[0212] The frame member 706 can define a first path portion 710 of the acoustic path to direct sound from the speaker port 401 to the microphone module 700. The frame member 706 can correspond to or be an implementation of the frame member 204, 304, 611, or any other of the described frame members. In other cases, the frame member 706 is a separate component coupled to the cover 402 and / or a separate frame or structural component of the device.

[0213] The guide 714 can be positioned at the end of the first path portion 710 and can define a second path portion 708 of the acoustic path. The guide 714 can be formed of a compliant material such as an elastomer and can seal against the frame member 706 (e.g., be in close contact with the frame member 706) to help define the acoustic path and inhibit acoustic interference between the acoustic path and other areas of the device. In other words, the guide 714 can seal against the frame member 706 to more generally provide acoustic isolation to the acoustic path and the microphone module 700.

[0214] The guide member 714 may define a corner or turning portion of the acoustic path leading to the microphone, and a portion of the guide member 714 may extend at least partially into a cavity at least partially defined by the trim piece 408. For example, in a particular implementation including a separator such as separator 424, the cavity in the trim piece 408 may be defined by the trim piece 408 on three sides and by the separator on the fourth side. A portion of the guide member 714 (e.g., the topmost portion of the guide member as shown in Figure 7A ) may extend into the cavity such that sound entering through the mesh member 410 is directed along the acoustic path to the microphone and such that sound from other sources (e.g., the speaker module) is inhibited from entering the acoustic path. Generally speaking, the separator 424 may define two separate cavities or volumes along the underside of the speaker port cover structure, and the guide member 714 may extend into one of those cavities or volumes while the speaker module is in acoustic communication with the other cavity or volume. This may provide a measure of acoustic isolation between the speaker and the microphone.

[0215] Figure 7B A partial cross-sectional view of the device 400 is shown, showing the acoustic path through the speaker port 401 to another exemplary microphone module 720. As Figure 7B shown and similar to Figure 7A , the microphone module 720 may be coupled to the underside and / or top module of the cover 402. In some cases, as shown, the microphone module 720 is coupled to a substrate 722, which in turn is coupled to a mounting plate 724. The mounting plate 724 defines a base portion 725 and a waveguide 726 extending from the base portion 725. The waveguide 726 extends into a hole formed in the frame member 706 (or other component of the top module) and defines a portion of the acoustic path that is defined as extending from the speaker port 401 to the microphone module 720. More specifically, the acoustic path may be defined at least in part by the guide member 714, a channel defined through the frame member 706, and the waveguide 726.

[0216] A sealing member 727, such as an O-ring, can define a seal between the waveguide member 726 and the frame member 706 (or any other component into which the waveguide member 726 extends). The interface between the waveguide member 726 and the hole helps to align the microphone module 720 with the frame member 706. In addition, the sealing member 727 also helps to form an acoustic seal and an environmental seal between the acoustic path defined through the frame member 706 and the microphone module 720. For example, the sealing member 727 can inhibit water or other contaminants that may enter the acoustic path (e.g., through the speaker port 401) from escaping the acoustic path and entering other internal areas of the device. Due to the friction between the sealing member 727 and the surface of the hole in the frame member 706 (optionally assisted by the compression of the sealing member 727 between the frame member 706 and the waveguide member 726), the sealing member 727 can also provide a holding force. The sealing member 727 can be held by a lip, channel, and / or groove defined by the waveguide member 726, as Figure 7B shown.

[0217] In some cases, the mounting plate 724 is adhered to the frame member 706. In the case of using an adhesive, it can be positioned between the base portion 725 and the frame member 706 and adhered to the base portion and the frame member. Alternatively or in addition, the mounting plate 724 (and thus the microphone module 720 and the substrate 722) can be fixed to the frame member 706 using brackets, shrouds, fasteners, etc. In some cases, the friction with respect to the sealing member 727 is sufficient to hold the mounting plate 724 to the frame member 706.

[0218] The substrate 722 to which the microphone module 720 can be soldered, adhered, or otherwise fixed can be fixed to the mounting plate 724 via an adhesive 728 (e.g., PSA, HSA, adhesive foam, etc.). The substrate 722 can be a circuit board (e.g., a rigid or flexible circuit board) and can include conductive traces that interconnect the microphone module 720 with other circuits of the device.

[0219] The diaphragm 729 can be positioned above the hole in the substrate 722 (e.g., covering the hole) to inhibit water and / or other contaminants from entering the microphone module 720 while allowing sound to pass through. The diaphragm 729 can be a mesh, screen, foam, etc., and can be formed of any suitable material such as a polymer, metal, etc. The diaphragm 729 can be positioned in place using a compliant stack 730, which can include one or more layers of adhesive, foam, and / or other materials. The compliant stack 730 can be adhered or be adhered to both the base portion 725 of the mounting plate 724 and the substrate 722.

[0220] Figure 7C Shown is Figure 7B an exploded view of the microphone subassembly shown, showing additional details of the components of the microphone subassembly. AsFigure 7B As shown, the sealing member 727 can be positioned around the waveguide member 726, which defines a lip (as shown), groove, slot, or other retaining feature for holding the sealing member 727 in place on the waveguide member 726. The base portion 725 of the mounting plate 724 is fixed to the substrate 722 (e.g., a circuit board and / or a circuit board assembly) via an adhesive 728 (e.g., HSA, PSA, adhesive foam, etc.). The adhesive 728 can define a hole in which the diaphragm 729 and the compliant stack 730 can be positioned. As described above, the diaphragm 729 can be positioned above the hole 731, which extends through the substrate 722 and provides acoustic access to the microphone module 720. In some cases, the surface defining the hole 731 is considered to be part of the acoustic path extending from the speaker port 401 to the microphone module 720.

[0221] The microphone module 720 can include conductive pads 732 that are conductively coupled (e.g., soldered) to corresponding conductive pads on the substrate 722 to facilitate communication coupling between the microphone module 720 and other circuits. The microphone module 720 also includes a microphone sensor element 733. As Figure 7C shown, the microphone sensor element 733 is positioned close to the hole 731, but in other cases, it can be positioned elsewhere in the microphone module 720.

[0222] Figure 8A Shown Figure 7A Another view of the guide 714 is shown, showing how the guide 714 can be integrated with the cover 402 and the frame 706. Specifically, the guide 714 can be positioned under the trim 408 and against the frame member 706 in the area where the first path portion through the frame member 706 ends. As shown, an adhesive 800 (e.g., PSA, HSA, adhesive foam, etc.) can adhere the guide 714 to the frame member 706.

[0223] Figures 8B to 8C Other exemplary configurations of guides and / or acoustic separators that can be used to acoustically isolate the speaker from the microphone are shown. Figure 8B The cover 810 is shown separated from the frame member 811. The frame member 811 (which can be an embodiment of the frame member 706) defines an output port 809 at the end of the acoustic path portion defined by the frame member 811. Optionally, before the frame member 811 is attached to the cover 810, the microphone can be coupled to the frame member 811 along the bottom surface of the frame member (as Figure 7A shown). The guide 814 can be attached to the frame member 811 using an adhesive 816. The guide 814 can be similar to Figure 7AThe manner of the middle guide member 714 defines a pipe orifice portion that extends into a recess defined under the decorative member 812. The guide member 814 can be attached to the frame member 811 before the frame member 811 is coupled to the cover member 810.

[0224] Figure 8C An acoustic isolation structure 824 is shown that can be positioned under the decorative member 822. The acoustic isolation structure 824 can include a first channel 826 for delivering sound to a microphone module and a second channel 828 for delivering sound to a speaker module. The first channel 826 and the second channel 828 can respectively define portions of the acoustic paths to the microphone module and the speaker module. The acoustic isolation structure can be adhered or otherwise attached to the cover member 820 and / or the frame member 821, and can be attached after the frame member 821 is coupled to the cover member 820.

[0225] Figure 9A A portion of the device 900 is shown. The device 900 can correspond to or be an implementation of the device 100, 140, 200, 300, or any other device described herein. The device 900 is shown without a cover member and / or a display such that the internal components of the device 900 are visible. Figure 9A The housing 904 and the frame member 906 of the top module (or a representation of where the frame member will be located) are shown.

[0226] Figure 9A The forward sensor region 901 is generally shown. Except for the ambient light sensor 922, the components of the forward sensor region 901 can be outside the active region of the display. The forward sensor region 901 (which can also be referred to as a notch due to the way it extends downward into the display region) can have a width 903 that is less than about 60%, less than about 50%, or less than about 40% of the width of the display region 902. In some cases, one or more of the components in the forward sensor region 901 provide multiple functions, thereby allowing the width of the forward sensor region 901 to be minimized or reduced. In some cases, the width 903 of the forward sensor region 901 is about 30 millimeters or less.

[0227] The device 900 includes a forward camera 908, a proximity sensor 912, a combined flood illuminator and dot projector 918 (e.g., a biometric sensor module), and an infrared light sensor (or camera) 920 in the forward sensor region 901. The device 900 also includes an ambient light sensor 922 positioned within the active display region 902 of the device 900. Figure 9A An exemplary positioning of the microphone module 910 is also shown, which can be attached to the underside of the frame member 906. As described herein, the microphone module 910 can communicate with an acoustic guide member 914 in the speaker port of the device 900.

[0228] A combined flood illuminator and dot projector 918 (which may correspond to or be an embodiment of the combined flood illuminator and dot projector 416) may be or may include a biometric sensor module. The combined flood illuminator and dot projector 918 may project an infrared light flood illumination of an object, as well as a pattern of infrared dots or light points. An infrared light sensor (or camera 920) may use the projected flood illumination and dot pattern to capture an image of the object (e.g., a user's face). The image captured by the sensor 920 may be used to authenticate the user, as described above. Additionally, by combining the flood illuminator and the dot projector into a single module, valuable space may be saved in the front sensor area 901, thereby allowing for a larger active display area to be provided.

[0229] Figure 9B A partial cross-sectional view of the device 900 taken along line 9B-9B in Figure 9A is shown, illustrating an exemplary configuration of the front camera 908. The front camera 908 may include a lens assembly 923 and an image sensor 924, both of which are contained within a housing 921. The camera 908 may be an autofocus camera, where the lens assembly 923 is configured to extend, contract, or otherwise change the length or position within the housing 921 to focus an image on the image sensor 924. In such cases, the front surface of the lens assembly 923 may be configured to move vertically as indicated by arrow 928.

[0230] In the case where the front surface of the lens assembly 923 moves towards and / or away from the cover 929 (e.g., the front cover of the device 900), it may not be feasible to directly mount the lens assembly 923 to the inner surface of the cover 929. Therefore, Figure 9B an exemplary configuration for mounting the autofocus camera to the inner side of the cover 929 is shown. For example, the housing 921 may be coupled to a mounting bracket 925 (e.g., via an adhesive, welding, soldering, brazing, fasteners, etc.). The mounting bracket 925 may be attached to the inner surface of the cover 929, such as via an adhesive 927, fasteners, etc. The mounting bracket 925 may have a height that provides sufficient clearance between the lens assembly 923 and the inner surface of the cover 929 to facilitate the necessary movement of the front portion of the lens assembly 923 (indicated by arrow 928).

[0231] The mounting bracket 925 and the adhesive 927 may extend completely around the perimeter of the lens assembly. In this way, the mounting bracket 925 and the adhesive 927 inhibit dust or other contaminants from entering the housing 921, and prevent light from the display 926 (or other light sources) from entering the lens assembly 923 and potentially adversely affecting the image captured by the camera or otherwise interfering with the operation of the camera.

[0232] Although Figure 9BAn autofocus camera is shown, but the same or a similar configuration can also be used for a fixed-focus camera. In such cases, the lens assembly may not be configured to move vertically, but may be held at a fixed length and / or position within the housing.

[0233] Figure 9A Exemplary device 900 is shown, where components of the front sensor area are positioned in a "notch" area outside the active area of the display. In such cases, the display may define a notch-shaped recess or shape to accommodate the front sensor area, such that the display stack is not positioned between the sensor and the cover (e.g., the sensor is not covered by the display). In other exemplary devices, in addition to or instead of the "notch", the display defines one or more additional holes, openings, or interrupted portions to accommodate one or more components of the front sensor area. For example, Figure 9C and Figure 9D Exemplary electronic device 930 is shown, where front camera 932 is positioned below a hole formed through display stack 934. Display stack 934 may also define a profile area or notch where other components of the front sensor area (e.g., microphone module, flood and dot projectors, infrared light sensors, etc.) may be positioned.

[0234] In some cases, the area 933 of display stack 934 that extends around (or partially around) front camera 932 is an active part of the display. For example, area 933 may produce a graphical output. In other cases, area 933 is an inactive area of display stack 934 (e.g., this area of the display stack may not be capable of producing a graphical output, or it may be capable of producing a graphical output but is configured to remain inactive). In the case where area 933 is an inactive area of the display, paint, ink, dye, mask, layer, etc. may be positioned on top of the display in this area such that area 933 has a visual appearance that matches the other areas of the front sensor area.

[0235] Boundary 931 may extend around camera 932 to visually indicate that camera 932 is within the front sensor area and to provide vertical symmetry to the front sensor area. In such cases, Figure 9C the boundaries shown above and to the right of camera 932 in may not exist. Boundary 931 can be paint, ink, dye, or other structure or material.

[0236] Figure 9D shows Figure 9CPartial cross-sectional view of device 930, showing an exemplary configuration of camera 932 and display stack 934. Camera 932 (which can be an autofocus or fixed-focus camera) can include a lens assembly 937 and an image sensor 938, both of which are contained within a housing 939. Camera 932 can also include a shield 936 attached to the housing 939 and the display stack 934 (e.g., using an adhesive 940). The shield 936 and the adhesive 940 can extend completely around the perimeter of the lens assembly. In this way, the shield 936 and the adhesive 940 inhibit dust or other contaminants from entering the housing 939. Additionally, the shield 936 extends almost completely to (and optionally contacts) the inner surface of the cover 935 (which can be an embodiment of cover 102, or any other front cover described herein), thereby shielding the lens assembly 937 from light emitted from the sides of the display 934, which otherwise could enter the lens assembly 937 and potentially adversely affect the image captured by the camera or otherwise interfere with the operation of the camera.

[0237] Figure 9D shows camera 932 positioned in a hole in display stack 934 such that the display stack surrounds a wall portion of shield 936 (as shown by display stack 934 having portions on both the left and right sides of shield 936). The same or a similar shield configuration can also be used in embodiments where camera 932 is not positioned in a hole in display stack 934. In such embodiments, the portion of display stack 934 shown on the Figure 9D left side may be absent and / or it may be replaced by different structural components.

[0238] Figure 9EA partial cross-sectional view showing another exemplary configuration of a front-facing camera is presented. Camera 942 (which can be an autofocus or fixed-focus camera) can include a lens assembly 941 and an image sensor 951, both of which are contained within a housing 943. Camera 942 can also include a shield 944 that is attached to the housing 943 and optionally attached to the display stack 946 (e.g., using an adhesive 945) and optionally attached to the frame or other components of the top module of the device. In some cases, the shield 944 is not attached to the display stack 946. Camera 942 also includes a ring member 947 that is attached to the shield 944 (e.g., via an adhesive 945) and attached to the inner surface of a cover 949 (which can be an embodiment of the cover 102 or any other front cover described herein). The ring member 947 can extend completely around the perimeter of the lens assembly and can be adhered to the inner surface of the cover 949 via an adhesive 948 (e.g., PSA, HSA, adhesive foam, etc.). In this way, the ring member 947 and the adhesive 948 inhibit dust or other contaminants from entering the housing 943. Additionally, because the ring member 947 adheres to or otherwise contacts the inner surface of the cover 949, the ring member 947 shields the lens assembly 941 from light emitted from the sides of the display 946, which otherwise could enter the lens assembly 941 and potentially adversely affect the image captured by the camera or otherwise interfere with the operation of the camera. Figure 9E The configuration of the camera in Figure 9C can be implemented in a device having a hole through its display stack to accommodate the camera (as Figure 9A shown), or in a device where the camera is positioned outside the outer perimeter of the display (as

[0239] Figure 9F shown). In the former case, the component 950 can represent a part of the display stack 958, while in the latter case, the component 950 can represent the frame or other components of the top module of the device.

[0240] As Figure 9FAs shown, the shield 956 does not contact the cover 961 or otherwise extend sufficiently towards the cover to shield the lens assembly 953 from light that may leak from the edge of the display stack 958. Accordingly, a shield 959 may be applied to the edge of the display stack 958. The shield 959 may be paint, ink, dye, film, or other material or component that is opaque or otherwise blocks or reduces light from leaving the display stack 958 through the edge. In some cases, any edge of the display stack 958 near an optical device (such as a lens assembly, image sensor, light sensor, etc.) may include a shield similar to the shield 959 along that edge.

[0241] Figure 9F The configuration of the camera in [device name] can be implemented in a device having a hole through its display stack to accommodate the camera (as Figure 9C shown), or in a device where the camera is positioned outside the outer perimeter of the display (as Figure 9A shown). In the former case, the component 960 may represent a part of the display stack 958, while in the latter case, the component 960 may represent the frame or other component of the top module of the device. In the case where the component 960 represents a part of the display stack 958, the edge of the part of the display stack that is exposed to the camera 952 may include a shield similar to the shield 959. In such cases, the shield 959 may be a single integral component extending along the continuous edge of the display stack, such as a film, paint, ink, dye, etc.

[0242] Figure 9B and Figures 9D to 9F show exemplary lens configurations including mitigation for preventing or limiting the operational impact of light contaminants (e.g., dust) on the camera. For example, Figure 9B describes a mounting bracket attached to the inner surface of the cover to seal the camera; Figure 9D describes a shield extending around the perimeter of the lens assembly to block light; Figure 9E describes a ring member 947 attached to the inner surface of the cover to seal the camera; and Figure 9F describes paint or other coatings applied to the edge of the display stack to reduce or prevent light leakage.

[0243] The camera may also or alternatively be at least partially encapsulated by a curable material to help prevent or limit light leakage and other contamination. Figure 9G shows a portion of a device having a forward-facing camera, showing the camera (such as Figures 9A to 9FHow any of the cameras shown or described (e.g., front camera 962, which can be an embodiment of camera 908, 932, 942, 952, or any other front camera described herein) can be at least partially encapsulated. Specifically, the front camera 962 can be positioned in the front sensor region of the device. The camera 962 can be positioned in a gap or space between a frame member 964 (which can be a polymer, metal, laminate, or other member or component of the top module) and a display stack 963. The frame member 964 and / or the display stack 963 can define a curve or profile to at least partially surround or frame the camera 962. A gap 969 can be defined between the camera 962 and the frame member 964 and the display stack 963.

[0244] The camera 962 can be attached to or otherwise positioned near the inner surface of the cover. Figure 9G The device is shown with the cover removed for illustrative purposes, but it should be understood that the cover can be positioned over the camera 962, the display stack 963, and the frame member 964 (e.g., as if the cover were placed directly on the page).

[0245] To at least partially encapsulate the camera 962, a curable material can be introduced into the spaces (e.g., spaces 968 and 967) between the display stack 963 and the frame member 964 and into the gap 969. The curable material can be introduced through one or more holes (e.g., holes 965, 966) formed in a back component of the top module such as a plate (e.g., metal plate 1314, Figure 13A )). The curable material can flow along the inner surface of the cover, through spaces 967 and 968, and into the gap 969. In some cases, one of the holes 965, 966 serves as an injection port, while the other serves as an exhaust (or vacuum) port to help suck the curable material into the desired location. The curable material can at least partially surround the camera and can abut (and optionally adhere to) the housing, shield, ring member, or other components of the camera, as well as contact (and optionally adhere to) the inner surface of the cover and any other components with which it comes into contact. The curable material can then be cured to form a seal around the camera 962. As described above, the cured material can help seal the camera 962 against light and contaminants. The curable material can be an epoxy resin, glue, thermosetting polymer, etc.

[0246] Figure 9H A partial exploded view of the device is shown, illustrating an exemplary technique for aligning and / or securing the front camera 972 to the top module. Figure 9HShows a cover 970 and a frame member 978 that define a camera aperture 976. The frame member 978 can be an assembly including multiple components or materials and can be configured to be attached to the cover 970 and provide structural rigidity to the top module and attach the top module to other components of the device. The frame member 978 can include other apertures, openings, features, etc. to accommodate or attach to other top module components (including, for example, components of a forward sensor array), but for simplicity, Figure 9H only the camera aperture 976 is shown in

[0247] The camera 972 can be attached to the frame member 978 via an adhesive, fasteners, brackets, or any other suitable technique. The lens assembly, shroud, or other parts of the camera 972 can extend through the aperture 976 in the frame member 978 and can be attached to or otherwise near the inner surface of the cover 970, as shown and described with respect to Figure 9B and Figures 9D to 9F The frame member 978 can include either or both of an alignment ring 974 or alignment pins 975. The alignment ring 974 can be attached to the frame member 978 such that the aperture through the alignment ring 974 is positioned appropriately relative to the aperture 976. The camera 972 can be attached to or otherwise fixed against the alignment ring 974. The alignment ring 974 can be configured to contact the camera 972 and position the camera 972 in a fixed position relative to the alignment ring 974, thereby establishing and fixing the position of the camera 972 in the device. For example, the shroud or other cylindrical part of the camera 972 can contact the inner surface of the aperture through the alignment ring 974 to establish and fix the relative position of the camera 972 and the frame member 978 (at least within the plane parallel to the cover 970). Alternatively or in addition, the frame member 978 can include alignment pins 975 that project from the frame member 978. The camera 972 can define an alignment pin receiver 973 (e.g., a blind hole formed in the camera 972) into which the alignment pins 975 extend. When the camera 972 is assembled to the frame member 978, the interface between the alignment pins 975 and the alignment pin receiver 973 establishes and fixes the relative position of the camera 972 and the frame member 978 (at least within the plane parallel to the cover 970).

[0248] Figure 10A Shows a partial cross-sectional view of the device 900 as viewed along line 10A-10A in Figure 9A An exemplary arrangement of a combined flood illuminator and point projector 918 and an infrared light sensor 920 is shown below the cover 1000 (e.g., corresponding to the cover 102 or any other cover described herein). Figure 10A

[0249] ​The infrared light sensor 920 may include a lens assembly 1012 (also referred to as the second lens) and a light receiver, such as sensor element 1018. The lens assembly 1012 may include one or more lens elements and may focus an image onto the light receiver (e.g., sensor element 1018) to capture an object illuminated by the flood and / or dot pattern projected by the combined flood illuminator and dot projector 918. In some cases, the infrared light sensor 920 generates a depth map of a user's face (or other object) based on the way the user's face reflects the dot pattern. The sensor element 1018 may be coupled to a substrate 1016, and the lens assembly 1012, sensor element 1018, and substrate 1016 may all be contained within a housing 1014. The housing 1014 may also contain components of the combined flood illuminator and dot projector 918.

[0250] The combination of the flood illuminator and dot projector 918 includes a lens assembly 1002 (also referred to as the first lens), a dot pattern light source 1004 (also referred to as the first light source and / or light emitter), and a flood illumination light source 1006 (also referred to as the second light source and / or light emitter). The lens assembly 1002 may include one or more lens elements. The dot pattern light source 1004 may generate and / or emit a pattern of light (e.g., a pattern of dots or dots of infrared light) that can be projected onto an object through the lens assembly 1002. The dot pattern may be a grid of discrete light points or a set of discrete light points in another arrangement.

[0251] The dot pattern light source 1004 may be positioned relative to the optical axis 1007 of the lens assembly 1002 such that the dots are substantially in focus and / or the dot pattern remains a pattern of discrete dots or infrared light dots. In some cases, the dot pattern light source 1004 is aligned with the optical axis 1007 of the lens assembly 1002 or otherwise positioned below the central region of the lens assembly 1002, as Figure 10A shown. In some cases, the dot pattern light source 1004 includes a plurality of discrete light generating elements. In other cases, a pattern or mask is provided above one or more light generating elements to generate a pattern of dots.

[0252] The flood illumination light source 1006 may be configured to generate a more uniform flood (compared to the dot pattern of the dot pattern light source 1004). To generate the flood, the flood illumination light source 1006 may be offset from the optical axis 1007 of the lens assembly 1002 such that it is positioned below the peripheral region of the lens assembly 1002 (e.g., the region surrounding the perimeter of the lens assembly 1002 and the region surrounding the central region of the lens assembly 1002). For example, as Figure 10A shown, the flood illumination light source 1006 may be offset from the optical axis 1007 by a distance 1010. In some cases, the flood illumination light source 1006 may also be positioned at a different height relative to the lens assembly 1002 than the dot pattern light source 1004. For example, asFigures 10A to 10C As shown, the flood illumination light source 1006 can be closer to the lens assembly 1002 (e.g., it can be mounted on the spacer 1005 or otherwise positioned closer to the lens assembly 1002). In other cases, the flood illumination light source can be positioned below the dot pattern light source 1004 (e.g., further away from the lens assembly 1002). The positioning of the dot pattern light source 1004 and the flood illumination light source 1006 can be related to the focal plane of the lens assembly 1002. For example, in some cases, the dot pattern light source 1004 is positioned at or in the focal plane of the lens assembly 1002, and the flood illumination light source 1006 is offset from the focal plane of the lens assembly 1002 (e.g., not within it). In other cases, the dot pattern light source 1004 and the flood illumination light source 1006 are offset from the focal plane of the lens assembly 1002 by different distances.

[0253] By positioning the flood illumination light source 1006 away from the optical axis 1007 (and optionally closer to or further away from the lens assembly 1002 than the dot pattern light source 1004), even if the light emitted by the flood illumination light source 1006 is from one or more point light sources, the light emitted by the flood illumination light source 1006 may be blurred or otherwise projected in a diffuse pattern. More specifically, light passing through the lens assembly 1002 at a distance from the optical axis (e.g., near the outer perimeter of the lens element in the lens assembly 1002) may not appear focused but may be blurred and / or diffuse, thereby creating a flood-like illumination pattern. In some cases, when the device is held within a specific distance from the user's face (e.g., between about 6 inches and about 4 feet, or any other suitable distance range), the illumination pattern (as projected by the lens assembly 1002) generated by the flood illumination light source 1006 can substantially evenly illuminate the user's face with infrared light flood. In this way, the infrared light sensor 920 can capture an image (e.g., an infrared image) of the user's face for purposes such as authentication. More specifically, the infrared light flood is reflected by the user's face to generate an image of the user's face via the light sensor 920 (and more specifically, the sensor element 1018).

[0254] Figure 10B A dot pattern illumination light source 1004 that projects a dot pattern through the lens assembly 1002 is shown, as shown by the illumination pattern 1020. For example, the central region of the lens assembly 1002 can focus the pattern of light emitted by the dot pattern illumination light source 1004 onto an object.

[0255] Figure 10C A flood illumination light source 1006 is shown that projects a diffuse flood-like illumination pattern along an off-axis path through the lens assembly 1002, as shown by the illumination pattern 1022. While Figure 10B and Figure 10CEach shows only one illumination pattern, but it should be understood that the two illumination patterns can be generated simultaneously. In some cases, the illumination patterns are generated in an alternating pattern such that each illumination pattern impinges on the object for a period of time while the other illumination pattern does not impinge on the object.

[0256] In some cases, the flood illumination light source 1006 includes a plurality of light-emitting elements, such as an array of light-emitting elements positioned in a radial array, where each light-emitting element is offset from the optical axis 1007. Both the flood illumination light source 1006 and the dot pattern illumination light source 1004 can be or can include one or more infrared laser light sources, such as vertical-cavity surface-emitting laser (“VCSEL”) modules, or any other suitable light-generating elements. As described above, the VCSEL module can generate light in the infrared spectrum. In some cases, the light generated by the flood illumination light source 1006 and the dot pattern illumination light source 1004 is generally invisible to the human eye.

[0257] Figure 11A A partial cross-sectional view of the device 900 as viewed along Figure 9A line 11A-11A in is shown, and an exemplary configuration of the ambient light sensor 922 is shown. The ambient light sensor 922 can include a light sensor module having a light-sensing element 1110 and a light-transmissive cover element 1112 (e.g., glass, polymer, sapphire, or other light-transmissive material) in a housing 1114. The light-transmissive cover element 1112 (e.g., a diffuser sheet) can be configured to diffuse light to produce more uniform illumination on the light-sensing element 1110. The light-sensing element 1110 can be a photosensitive system or component and can detect various characteristics of light, including intensity, color, color temperature, etc.

[0258] The housing 1114 can be attached to a bracket 1108, which in turn can be attached to a layer 1104 (e.g., a display layer) below the display component 1102. The bracket 1108 can be attached to the layer 1104, for example, via an adhesive. The layer 1104 can be part of a display stack that includes both the layer 1104 and the display component 1102, or it can be a separate component. The display component 1102 can include one or more display layers that produce a graphical output visible through the cover 1100, and one or more electrode layers that provide touch and / or force-sensing functionality. As described in more detail with respect to Figures 11B to 11C and Figures 12A to 12B the ambient light sensor 922 can be configured to detect ambient light (e.g., light external to the device) through the display 1102 and the cover 1100.

[0259] Layer 1104 can be an opaque mask layer that defines aperture 1105. Aperture 1105 can define the minimum aperture in an optical system that includes ambient light sensor 922 and can thus be a limiting factor in the amount and angle of light that can enter ambient light sensor 922. The area of aperture 1105 can be smaller than the area of light sensing element 1110.

[0260] Layer 1104 can be formed of any suitable material, such as metal (e.g., metal sheet or metal foil), polymer, ink, etc. In some cases, the position of aperture 1105 is tightly controlled relative to display component 1102 such that aperture 1105 is aligned with a known set of pixels defined by display component 1102. Thus, as described below, the device can specifically compensate for light generated by pixels above and / or near aperture 1105. By forming an aperture in layer 1104 that is part of a display stack, high precision can be achieved between the position of aperture 1105 and the intended pixels. In contrast, if the light limiting aperture of the system is positioned in ambient light sensor 922, the alignment accuracy between ambient light sensor 922 and aperture 1105 will depend on the accuracy of ambient light sensor 922 to the components of the display stack, which can be lower than the accuracy achievable by forming an aperture in a layer of the display stack itself. Additionally, because layer 1104 is part of the display stack, it can be securely held to other layers of the display stack, such as via an adhesive (e.g., an adhesive that extends along the entire or substantially the entire area of the display stack between layer 1104 and an adjacent layer of the display stack). This coupling between layer 1104 and the adjacent layers of the display stack provides a stable, long-lasting alignment between aperture 1105 and the pixels above and / or near aperture 1105. Additionally, by forming the minimum aperture (e.g., aperture 1105) in a layer of the display stack, rather than a separate component that can be loosened or otherwise more likely to shift relative to the display stack, the alignment between apertures 1105 can remain stable during extended use.

[0261] In some cases, ambient light sensor 922 is positioned near the edge or boundary of the active area of the display stack to reduce the amount of light from the display that can enter the ambient light sensor. For example, ambient light sensor 922 (and more specifically aperture 1105) can be positioned at a distance of about 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, or any other suitable distance (e.g., in Figure 11A from left to right) from the edge of the active area of the display. Aperture 1105 can have dimensions between about 0.25 mm and about 0.75 mm in the y direction of the device (in Figure 11A from left to right) and can have dimensions between about 5.0 mm and about 7.0 mm in the x direction of the device (in Figure 11A the page of

[0262] Figures 11B to 11CA partial front view of device 900 is shown, illustrating an exemplary operation of ambient light sensor 922. As described above, ambient light sensor 922 detects and / or senses ambient light (e.g., the color, color temperature, intensity, or other properties of light in the environment external to device 900) through the display stack and through one or more electrode layers on or integrated with the display stack. However, the display stack emits light to produce a graphical output. Since ambient light sensor 922 detects light conditions through the display, light from the display can interfere with or prevent an accurate reading of the ambient light conditions. Thus, ambient light sensor 922 can be configured to capture measurements during a time period when the pixels above ambient light sensor 922 are not illuminated. Specifically, when producing a graphical output, the display can produce a vertical blanking interval 1122, which is a horizontal region of the display where the pixels are not illuminated or producing light. Vertical blanking interval 1122 scrolls vertically along the display area (e.g., from the top of the display to the bottom of the display). Accordingly, ambient light sensor 922 can be configured to capture measurements or samples during a duration that includes the time when vertical blanking interval 1122 is positioned above ambient light sensor 922. Although this discussion refers to vertical blanking interval 1122 by way of example, other types of blanking intervals can also be used, including regions of inactive pixels included in a frame of the graphical output solely for the purpose of providing an inactive area for ambient light sensing.

[0263] Figure 11B Device 900 is shown, where display 1102 produces a graphical output 1120 and a vertical blanking interval 1122 that moves downward as shown by arrow 1124. At this point in time, vertical blanking interval 1122 is not positioned above ambient light sensor 922. Instead, the display pixels above ambient light sensor 922 are active and / or producing light (e.g., to output graphical output 1120). Thus, during this time period, ambient light sensor 922 can be in an inactive state or otherwise not capturing or using ambient light measurements.

[0264] Figure 11CDevice 900 is shown with the vertical blanking interval 1122 positioned directly above the ambient light sensor 922. When the vertical blanking interval 1122 is positioned above the ambient light sensor 922, the ambient light sensor 922 can capture a measurement during that time (or otherwise activate or use the readings captured during that time). In some cases, the sensing window of the ambient light sensor 922 (e.g., the time during which the ambient light sensor 922 is actively measuring or using the measurement of the light passing through the display) is larger than the vertical blanking interval 1122. For example, the sensing window can start and / or end when at least some of the pixels in the pixels above the ambient light sensor 922 are active. In some cases, the time that the vertical blanking interval 1122 is above the ambient light sensor 922 is greater than about 70% (or greater than about 80%, greater than about 85%, or any other suitable value) of the sensing window of the ambient light sensor 922. Device 900 can synchronize the operation of the ambient light sensor with the timing and / or position of the vertical blanking interval 1122 to allow the capture of ambient light measurements at an appropriate time. The operation of the ambient light sensor 922 can be intermittent such that it only actively captures measurements during the sensing window and is inactive at other times. In other cases, the operation of the ambient light sensor 922 captures measurements more continuously, but device 900 and / or the ambient light sensor 922 only use the values captured during the sensing window.

[0265] In some cases, device 900 also compensates for the light emitted by the display in the area surrounding the ambient light sensor 922. For example, even when a measurement is captured through the vertical blanking interval 1122, light from nearby active pixels (e.g., a subset of the pixels of the display) may be incident on the ambient light sensor 922 or otherwise detectable by the ambient light sensor, resulting in an inaccurate measurement of the ambient light conditions. Thus, for the ambient light measurement captured during a particular sensing window, device 900 and / or the ambient light sensor 922 can subtract or otherwise modify the light measurement at least in part based on the light emitted by the pixels in the area 1125 surrounding the ambient light sensor 922. Area 1125 can correspond to an n×m grid of pixels and can be positioned above the ambient light sensor 922 (optionally centered above the ambient light sensor 922). In some cases, the pixel grid is a 256×256 pixel grid centered on the center of the aperture 1105, but other sizes and alignments are possible depending on, for example, the size of the ambient light sensor, the size of the pixels, the position of the ambient light sensor relative to the active area of the display, the extent to which light from nearby pixels can be detected by the ambient light sensor, etc. The size of area 1125 can be larger than the aperture 1105. Thus, area 1125 includes a first subset of pixels positioned above the aperture 1105 and a second subset of pixels positioned away from the aperture 1105.

[0266] Using the foregoing techniques, the ambient light sensor 922 receives light that passes through the front cover 1100 and through the display 1102 (e.g., the display layer of the display 1102), and generates an output corresponding to the received ambient light when the blanking interval is positioned over the ambient light sensor 922. The device can then determine the ambient light value at least in part based on the output. The device can change the display parameters of the display stack at least in part based on the ambient light value. For example, the device can change the brightness, color temperature, etc., or determine whether to activate or deactivate the entire display (e.g., turn the display on or off).

[0267] As described above, the ambient light sensor 922 can also capture ambient light measurements through one or more electrode layers on or integrated with the display stack. These electrode layers can be used for any of a variety of purposes, such as touch sensing, force sensing, display functions, etc. Although the electrodes may appear transparent to the naked eye, they can interfere with the light sensing function of the ambient light sensor 922 (e.g., by blocking, obscuring, attenuating, or otherwise interfering with the ambient light detected by the ambient light sensor 922). Figures 12A to 12B An exemplary arrangement of electrodes on the electrode layer is shown to reduce or eliminate the impact of the electrodes on the ambient light sensing function.

[0268] Figure 12A Corresponding to Figure 9A region 12-12 in, an exemplary electrode pattern above the ambient light sensor 922 is shown. Specifically, Figure 12A it is shown how the electrodes can be co-located in the region above the ambient light sensor 922. For example, electrodes such as electrodes 1200-1 and 1202-1 in the region outside the ambient light sensor 922 can be set apart from each other, and electrodes such as electrodes 1200-2 and 1202-2 along the portion 1204 of the display corresponding to or including the ambient light sensor 922 are co-located (e.g., stacked or overlapped with each other). As Figure 12A shown, the electrodes in the portion 1204 of the display are co-located along the entire length of the display (e.g., from the top to the bottom of the display). In a particular implementation where the electrodes are alternatively or also horizontally or in different directions, the electrodes extending above the ambient light sensor 922 can also be co-located along the entire display. In some cases, all of the electrodes in the display are co-located in the manner shown in portion 1204.

[0269] Figure 12BAn example is shown where electrodes positioned above ambient light sensor 922 are co - located with each other where they are above ambient light sensor 922, but are separately disposed from each other in other regions of the display. For example, in the case where electrodes 1200 - 3 and 1202 - 3 are positioned above ambient light sensor 922, they are co - located, but they project separately in regions outside ambient light sensor 922 such that they are separately disposed.

[0270] Electrodes 1200 - n and 1202 - n can be positioned on different substrates or on the same substrate. In some cases, electrode 1200 - n is positioned on the top surface of the substrate, and electrode 1202 - n is positioned on the bottom surface of the same substrate. In some cases, electrodes 1200 - n and 1202 - n are located on the same surface of the same substrate. In some cases, electrodes 1200 - n and 1202 - n are each located on different substrates.

[0271] Although Figures 12A to 12B Two sets of electrodes are shown, but there can be more sets of electrodes than shown. Additionally, for illustrative purposes, electrodes 1200 - n and 1202 - n are shown as different electrodes, but in a particular implementation, they can be different electrodes within a single set of other identical electrodes. As described above, the electrodes can provide various different types of functions, including touch and / or force sensing (e.g., capacitive sensing, resistive sensing, etc.), display functions, etc. The electrodes can be formed of any suitable material, such as indium tin oxide (ITO), transparent conductive oxide (TCO), conductive polymer, nanowire layer (e.g., silver nanowires), etc.

[0272] Figure 13A A partial cross - sectional view of an exemplary electronic device 1300 is shown as viewed along Figure 1A line 13A - 13A. Electronic device 1300 can correspond to or be an implementation of electronic device 100, 140, 200, 300, or any other device described herein.

[0273] Device 1300 can include a housing member 1302, which can correspond to or be an implementation of housing member 130. Housing member 1302 can also represent other housing members of the devices described herein, such as housing members 124, 125, 126, 127, and 128. Housing member 1302 can define an outer side surface 1303 of device 1300. Device 1300 can also include a cover 1304, which can correspond to or be Figures 1A to 1BAn embodiment of the cover 102 (or any other cover described herein). The cover 1304 may define the front external surface 1306 of the device 1300, and the front external surface may be planar. In some cases, the cover 1304 defines a chamfer 1305 that extends around the perimeter of the flat front external surface 1306 and extends between the edge of the front external surface 1306 and the edge of the side surface 1307 of the cover 1304. The device 1300 may also include a rear cover 1309, which may correspond to or be an embodiment of the rear cover 132 (or any other rear cover described herein).

[0274] The cover 1304 may be positioned above the display stack 1308, which may correspond to or be an embodiment of the display 103 (or any other display described herein). Figure 1A The display stack 1308 may be coupled to the cover 1304 via an adhesive 1310 along the inner surface of the cover 1304, and the adhesive may be a transparent adhesive. The adhesive 1310 may have a thickness, such as about 100 microns, 200 microns, about 300 microns, about 400 microns, etc.

[0275] The display stack 1308 may include display elements 1312 that may be configured to generate a graphical output. The display elements 1312 may be OLED displays and may include multiple layers and / or other components that facilitate the generation of a graphical output, including, for example, a substrate, an anode, a cathode, one or more organic layers, an emission layer, an adhesive, etc. In some cases, the display elements 1312 may include an integrated (on-cell) touch sensing system, as described above. For example, an electrode array integrated into an OLED display may be time and / or frequency multiplexed to provide both display and touch sensing functions. In other cases, separate touch and / or force sensing systems may be included above or below the display elements 1312 (each display element may include, for example, a capacitive electrode layer, a compliant layer, etc.). Although OLED displays are described, the display elements may be any suitable type of display, such as LCD displays, active-matrix organic light-emitting diode (AMOLED) displays, organic electroluminescent (EL) displays, electrophoretic ink displays, etc.

[0276] The display stack 1308 may include various electrically active layers and components that need to be electrically interconnected to other electronic components, processors, circuit elements, etc. Since such layers (e.g., the anode layer and the cathode layer of an OLED display) may be sandwiched between other layers of the display stack 1308, the flexible circuit element 1322 (e.g., a flexible circuit board) may be wound around the sides of the display stack 1308 (forming a loop) to electrically couple the electrically active layers of the display stack 1308 to more accessible circuit elements 1320 of the display stack 1308. More specifically, the flexible circuit element 1322 may include conductive traces that interconnect electronic components (e.g., the cathode layer and the anode layer, electrode layers of a touch and / or force sensor, an on-cell touch sensing layer, etc.) within the display element 1312 to other electrical traces, connectors, processors, or other electronic components mounted on the circuit element 1320. The circuit element 1320 may be a rigid or flexible circuit board. In some cases, a first encapsulation structure (e.g., epoxy resin, foam, or other material or component) may be provided in the loop region 1316 between the side of the display stack 1308 and the flexible circuit element 1322 to help provide structure for the flexible circuit element 1322 and to help prevent the flexible circuit element 1322 from deforming due to shock or other damage. In some cases, a first encapsulation structure 1317 (also referred to as potting material) may be disposed inside the loop region 1316 to help provide structure for the flexible circuit element 1322 at the loop region 1316 and to help prevent the flexible circuit element 1322 from deforming due to dropping, shock, etc. For example, if the drop point of the device 1300 is on the housing member 1302, the housing member 1302 may force the frame member 1324 against the loop region 1316 of the flexible circuit element 1322. The first encapsulation structure 1317 may help prevent such shock from causing the flexible circuit element 1322 to break, squeeze, bend, deform, or otherwise be damaged at the loop region 1316.

[0277] In some cases, in addition to or instead of providing the first encapsulation structure 1317 in the loop region 1316, a second encapsulation structure 1340 may be provided in the region 1357 between the frame member 1324 and the loop 1335 of the flexible circuit element 1322. The loop 1335 may define a convex outer surface and a concave inner surface, as Figure 13A shown. The second encapsulation structure 1340 may be epoxy resin, foam, or other material or component, and may be integral with the first encapsulation structure 1317 (e.g., they may both be formed during a single injection process of a single curable material), or it may be different from the first encapsulation structure 1317 (e.g., the first encapsulation structure and the second encapsulation structure may be introduced separately, such as in two subsequent injection operations).

[0278] The second encapsulation structure 1340 can provide several beneficial effects. For example, the second encapsulation structure 1340 can strengthen the loop 1335 of the flexible circuit element 1322. More specifically, the second encapsulation structure 1340 can reduce the likelihood that the flexible circuit element 1322 will deform or otherwise be damaged due to shock or other types of impact events. The second encapsulation structure 1340 can also improve the bond strength between the cover 1304, the display stack 1308, and the frame member 1324. For example, the second encapsulation structure 1340 can have adhesive properties such that the second encapsulation structure 1340 adheres to the flexible circuit element 1322, the cover 1304, and the frame member 1324, thereby bonding these components together through an adhesive joint. The physical shape of the frame member 1324 and the loop 1335 of the flexible circuit element 1322 can also provide a mechanical interlock for holding the frame member 1324 and the display stack 1308 to the cover 1304. For example, the frame member 1324 defines a flange portion 1329 that forms an undercut area filled and / or joined by the second encapsulation structure 1340. Similarly, the second encapsulation structure 1340 wraps under the loop 1335 to engage the flexible circuit element and, more generally, the display stack 1308. Due to the way the second encapsulation structure 1340 engages these components, the adhesion between the second encapsulation structure 1340 and the cover 1304 helps hold the frame member 1324 and the display stack 1308 to the cover 1304.

[0279] In some cases, the additional attachment security provided by the second encapsulation structure 1340 can facilitate attaching the frame member 1324 to the cover 1304 using less adhesive 1326 and thus allow a thinner adhesive layer 1310, which ultimately reduces the overall thickness of the display stack and can provide more space inside the device for other components (e.g., a battery), and / or allow the device to be manufactured thinner. More specifically, the increased attachment strength provided by the second encapsulation structure 1340 can facilitate the adhesive 1326 using a smaller glue area, and thus the flange portion 1329 can extend a smaller distance toward the display (e.g., it is shorter in the left-to-right direction, as Figure 13A shown). By making the flange portion 1329 smaller in this direction, the display stack can be placed closer to the cover 1304 while the loop 1335 does not contact or get too close to the flange portion 1329, thereby allowing a thinner adhesive layer 1310 to be formed between the display element 1312 and the cover 1304.

[0280] The encapsulation structure can also provide an environmental seal that supplements the seal provided by the adhesive 1326. For example, if impact or other damage compromises the adhesion between the adhesive 1326 and the cover 1304 and / or the frame member 1324, the first encapsulation structure and the second encapsulation structure can continue to inhibit or prevent liquid or other contaminants from reaching and damaging the display stack or other sensitive components of the device.

[0281] In addition to the display element 1312 and the touch and / or force sensing components, the display stack 1308 can include other components, such as a support layer and a shielding layer, as well as an adhesive layer for holding the various components of the display stack 1308 together. For example, the display stack 1308 can include a first metal plate 1314 that supports the display element 1312 and imparts structural support, rigidity, and flatness to the display element 1312. The first metal plate 1314 can have the same or substantially the same forward area as the display element 1312 (e.g., the forward area of the first metal plate 1314 can be greater than 90% of the forward area of the display element 1312). The display stack can also include a second metal plate 1318 that supports the circuit element 1320. The second metal plate 1318 can have a forward area smaller than that of the first metal plate 1314 and can have dimensions similar to those of the circuit element 1320. The forward areas of both the circuit element 1320 and the second metal plate 1318 can be less than 50% of the forward area of the display element 1312, and optionally less than 30% of the forward area of the display element 1312.

[0282] The display stack 1308 can also include other layers and components. For example, the display stack 1308 can include an adhesive between the various layers and elements in the display stack 1308. More specifically, the display stack 1308 can include an adhesive between the display element 1312 and the first metal plate 1314, an adhesive between the first metal plate 1314 and the second metal plate 1318, and an adhesive between the second metal plate 1318 and the circuit element 1320. Of course, other layers, sheets, substrates, adhesives, and / or other components can also be included in the display stack 1308.

[0283] The cover 1304 may be attached to the frame member 1324. The frame member 1324 may be formed of or include a polymeric material and may extend around all or substantially all of the perimeter of the cover 1304. The frame member 1324 may at least partially encapsulate and / or otherwise couple to the backplate 1328. The backplate 1328 may be formed of or include metal, ceramic, plastic, or any other suitable material. The backplate 1328 may provide shielding and structural support for the device and may protect the display stack 1308 by forming at least a partially enclosed area in which the display stack 1308 is positioned. The backplate 1328 may be at least partially encapsulated within the frame member 1324, or it may be attached to the frame member 1324 in any other suitable manner.

[0284] The frame member 1324 may be attached to the housing member 1302. For example, the frame member 1324 may be attached to a boss 1323 or other feature defined by the housing member, such as Figure 13A shown. The boss 1323 may extend from the inner side of the housing member 1302. The boss 1323 may be part of a monolithic structure of the housing member 1302 (e.g., the housing member may be molded, machined, or otherwise formed from a single piece of material to define the boss 1323 as well as other features and / or surfaces of the housing member 1302). The frame member 1324 may be attached to the housing member 1302 via an adhesive 1325 that may be positioned between and in contact with the boss 1323 and the frame member 1324. The adhesive 1325 may be any suitable adhesive, including a pressure-sensitive adhesive (PSA), a heat-sensitive adhesive (HSA), an adhesive film, an epoxy, etc. In some cases, the boss or other feature to which the frame member 1324 is attached serves as a reference surface for the frame member 1324. Thus, the alignment (e.g., flush) of the front outer surface 1306 of the cover 1304 with the upper portion 1332 (e.g., the front outer surface) of the housing member 1302 may be defined or established by the position of the boss (relative to the upper portion 1332) and the position of the bottom surface of the frame member 1324 (relative to the front outer surface 1306 of the cover 1304).

[0285] The cover member 1304 can be attached to the frame member 1324 via an adhesive 1326. The frame member 1324 can define a recessed area 1327 (which defines an adhesive surface), and the adhesive 1326 can be placed in the recessed area 1327. The recessed area 1327 can provide a channel-like volume for the adhesive 1326 while also allowing the flange portion 1329 of the frame member 1324 to contact the underside of the cover member 1304. The direct contact between the flange portion 1329 of the frame member 1324 and the cover member 1304 can provide a rigid connection between the cover member 1304 and the frame member 1324 and can ensure that forces applied to the cover member 1304 are transmitted to the structural frame member 1324. Although the recessed area 1327 is defined by a single flange portion 1329 (e.g., on the right side of the recessed area 1327), other configurations are possible, such as a recessed area defined by two flange portions or other sidewall-like features (e.g., a channel defined by two walls).

[0286] The housing member 1302 can be specifically configured to allow for a tight coupling between it and a component including the cover member 1304, the display stack 1308, and the frame member 1324. Specifically, the housing member 1302 can define a recessed area 1330 (also simply referred to as a recess) along an inner surface of the housing member 1302 that is adjacent to or in proximity to the frame member 1324. The recessed area 1330 can be formed into the housing member 1302 in any suitable manner. For example, the recessed area 1330 can be machined into the housing member 1302, or the housing member 1302 can be molded or cast, and the recessed area 1330 can be formed as part of the casting or molding process.

[0287] The recessed area 1330 can correspond to a portion of the housing member 1302 that is thinner than other portions of the housing member 1302. For example, the housing member 1302 can define an upper portion 1332 and a lower portion 1334 that have a greater thickness (in the left-to-right direction as shown) than the portion of the housing member 1302 that defines the recessed area 1330. Figure 13A shown.

[0288] The recessed area 1330 can be configured such that the inner surface of the housing member 1302 directly opposite the frame member 1324 is set at a target distance from the frame member 1324. The target distance can be selected such that the deformation or deflection of the housing member 1302 along the side wall (e.g., due to the device 1300 dropping or otherwise experiencing predictable misuse or damage) does not touch the frame member 1324 and / or the display stack 1308. More specifically, the recessed area 1330 allows the device 1300 to accommodate a certain amount of deformation of the side wall of the housing member 1302 without the housing member 1302 contacting the frame member 1324. For example, the inner surface of the recessed area 1330 can be spaced apart from the outer peripheral surface 1331 of the frame member 1324 by about 0.3 mm, 0.5 mm, 0.7 mm, 1.0 mm, or any other suitable distance. In some cases, the distance between the inner surface of the recessed area 1330 and the outer surface of the frame member 1324 is greater than the housing deformation resulting from standard tests such as a side impact test (e.g., where the device 1300 is dropped from a specific height (e.g., 1 m, 2 m, or 3 m) onto a specific surface (e.g., the edge of a triangular prism)).

[0289] In some cases, the height of the recessed area 1330 (e.g., in the vertical direction as shown Figure 13A ), and optionally the combined height of the recessed area 1330 and the additional recessed area 1336) is equal to or greater than the height of the frame member 1324. Thus, the recessed area 1330 (optionally and the additional recessed area 1336) is large enough such that the frame member 1324 can at least partially extend into the recessed area 1330 during an impact or drop event (e.g., an event that causes the housing member 1302 to deform or deflect), without the frame member 1324 contacting the housing member 1302. This can help prevent damage to the frame-cover interface and help prevent (e.g., by preventing or reducing the magnitude of the force exerted by the housing member 1302 on the frame member 1324 during an impact, drop, etc.) the cover 1304 from separating from the frame member 1324. In some cases, the height of the recessed area 1330 (and optionally the recessed area 1330 combined with the additional recessed area 1336) extends from the boss 1323 to a height or position at or above the bottom surface of the cover 1304.

[0290] In some cases, the distance between the inner surface of the recessed region 1330 and the outer surface of the frame member 1324 is greater than the distance between the side surface 1307 of the cover member 1304 and the inner side surface 1333. Thus, for example, deformation or deflection of the housing member 1302 towards the cover member 1304 and the frame member 1324 can cause the side surface 1307 of the cover member 1304 to contact the inner side surface 1333 of the frame member 1324 before the housing member 1302 (and specifically the inner surface of the recessed region 1330) contacts the frame member 1324. Therefore, by forming the recessed region 1330 (which creates a greater distance between the housing member 1302 and the frame member 1324 than between the housing member 1302 and the cover member 1304), the risk of contact between the housing member 1302 and the frame member 1324 during deformation or deflection of the housing member 1302 can be reduced.

[0291] The side surface 1307 of the cover member 1304 can be adjacent to (or adjacent to without a gap member as described herein) the inner side surface 1333 of the housing member 1302. In some cases, there is no gap member or other material between the side surface 1307 of the cover member 1304 and the inner side surface 1333 of the housing member 1302. This configuration provides several structural and aesthetic advantages. For example, the absence of a bezel or other gap member or material between these surfaces provides a clean, frameless appearance to the front of the device 1300. Specifically, the forward surface of the device 1300 can be defined only by the upper portion 1332 of the housing member 1302 and the front outer surface 1306 of the cover member 1304. Although the side surface 1307 of the cover member 1304 can be adjacent to the inner side surface 1333 of the housing member 1302, in some cases, there can be an air gap between these surfaces. In some cases, an adhesive or sealing material can be positioned between the side surface 1307 of the cover member 1304 and the inner side surface 1333 of the housing member 1302. In such cases, the adhesive or sealing material can be the only material between these surfaces, can contact both surfaces, and can have a thickness less than about 0.5 mm, 0.3 mm, 0.1 mm, 0.05 mm or any other suitable thickness.

[0292] The proximity between the side surface 1307 of the cover member 1304 and the inner side surface 1333 of the housing member 1302 can define a load path through the upper portion 1332 of the housing member 1302 and into the cover member 1304. For example, a force applied to the outer side surface 1303 of the housing member 1302 can be directed into the cover member 1304 at the interface between the side surface 1307 of the cover member 1304 and the inner side surface 1333 of the housing member 1302. (In the case where the inner side surface 1333 abuts the side surface 1307 of the cover member 1304, the load can be directly transferred or directed into the cover member 1304, while in the case where there is an air gap between the inner side surface 1333 and the side surface 1307 of the cover member 1304, the force can initially cause the gap to close such that the inner side surface 1333 contacts the side surface 1307.) The rigidity and structural integrity of the cover member 1304 can help prevent or reduce deformation of the housing member 1302 during a drop or other impact event on the outer side surface 1303, thereby protecting the internal components of the device 1300 from damage caused by contact with the housing member 1302. By defining a load path through the cover member 1304 and by configuring the housing member 1302 to include a recessed region 1330, the device 1300 can be designed to omit the frame member 1324 from the load path during many impact events (e.g., when the device 1300 is dropped). For example, as Figure 6A shown, the recessed region 1330 ensures that the frame member 1324 is spaced a suitable distance from the housing member 1302. Additionally, no portion of the frame member 1324 is between the housing member 1302 and the cover member 1304. Thus, the frame member 1324 can be positioned such that even if the housing member 1302 undergoes shock, deformation, deflection, or other damage (up to a certain amount of deformation or deflection), the frame member does not contact the housing member 1302 or is not impacted by the housing member.

[0293] In some cases, the rear cover member 1309 interfaces with the lower portion 1334 of the housing member 1302 because the lower portion 1334 can contact the side surface of the rear cover member 1309, thereby defining a load path through the lower portion 1334 and into the rear cover member 1309.

[0294] In some cases, the housing member 1302 may include an additional recessed area 1336. The additional recessed area 1336 may be configured such that the housing member 1302 in this area is configured to be at a distance from components in the display stack 1308, touch and / or force sensing components, antennas, or other electronic components of the device 1300. Specifically, since the housing member 1302 may be formed of metal, the metal may be capacitively coupled to other electronic components. By increasing the distance between the metal of the housing member 1302 and the electronic components, the capacitive coupling may be reduced to an acceptable level. Thus, the additional recessed area 1336 may be configured such that the distance between the additional recessed area 1336 and another electronic component is greater than about 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, or any other suitable distance. In some cases, the recessed area 1330 may be recessed more than the additional recessed area 1336 (and thus corresponds to a thinner portion of the housing member 1302).

[0295] Figure 13B Another exemplary embodiment of the device 1300 is shown, showing another configuration of the second encapsulation structure. For simplicity, Figure 13B the housing member 1302 and the rear cover 1309 are omitted. As Figure 13B shown, the second encapsulation structure 1358 does not fill the entire area 1357. Instead, the second encapsulation structure 1358 is positioned in the corner area where the flange portion 1329 of the frame member 1324 meets the cover 1304. Thus, the second encapsulation structure 1358 contacts and adheres to both the frame member 1324 and the cover 1304, thereby contributing to the bond strength between these components. This particular implementation also provides an air gap between the loop 1335 and the frame member 1324.

[0296] Figure 13C Another exemplary embodiment of the device 1300 is shown, showing another configuration of the second encapsulation structure. For simplicity, Figure 13C the housing member 1302 and the rear cover 1309 are omitted. As Figure 13CAs shown, the second encapsulation structure 1343 extends around a portion of the loop 1335, and the compliant member 1342 is positioned between the flexible circuit element 1322 (or other components of the display stack 1308) and the backplane 1328. The compliant member 1342 can be less rigid than the second encapsulation structure 1343 (e.g., more flexible and / or compressible). The compliant member 1342 can absorb energy from impacts, squeezes, or other force events that might tend to push the flexible circuit element 1322 and the backplane 1328 together, thereby reducing the amount or intensity of the force that ultimately contacts the flexible circuit element 1322. The compliant member 1342 can be a compliant polymer, foam, elastomer, silicone, or any other suitable material. In some cases, the compliant member 1342 is an adhesive and adheres to the flexible circuit element 1322 and / or the backplane 1328. In some cases, the compliant member 1342 is adhered to the flexible circuit element 1322 and / or the backplane 1328 with a separate adhesive (e.g., PSA, HSA, adhesive film, liquid adhesive, etc.).

[0297] Figure 13D As shown Figures 13A to 13C A portion of the electronic device shown, showing the location of the encapsulation structure and another view of how potting material is introduced into the area around the loop 1335 of the flexible circuit element 1322 to form the encapsulation structure. Figure 13D The frame member 1324 and the backplane 1328 are generally shown, with the cover 1304 and the display stack 1308 removed. The dashed line shows an exemplary position of the loop 1335 of the display in the case where the display stack 1308 and the cover 1304 are attached. Additionally, although Figure 13D the cover and the display are shown removed, in some embodiments, the potting material is introduced with those components attached to the frame member 1324.

[0298] In some cases, the potting material 1360 (which may correspond to or result in the first encapsulation structure and / or the second encapsulation structure described above) can be introduced into the area 1357 via the injection port 1362. The potting material can be understood to be introduced into the injection port 1362 by an injection device behind the frame member 1324 in a direction out of the page. In other words, as Figures 13A to 13C shown, the frame member 1324 will be flipped during the injection process. Figure 13D As shown

[0299] The potting material 1360 can be a curable polymer (such as an epoxy resin), which can be introduced in a liquid or other flowable state and then allowed to cure. While introducing the potting material, the vent port 1361 can allow air to escape from the area 1357 ( Figure 13A) Escape. In some cases, a vacuum or negative pressure is applied to the exhaust port 1361 to assist the potting material 1360 in flowing into the desired location. Since the loop 1335 of the flexible circuit element 1322 can be open at its ends, the potting material can flow into the loop region 1316( Figure 13A ) while the potting material 1360 is introduced through the injection port 1362.

[0300] The barrier structures 1363, 1364, 1365, 1366, and 1367 can define the walls of a volume in which the potting material 1360 is located. The barrier structures can be positioned between the display stack and the backplane 1328, or between the cover 1304 and the backplane 1328, or between any other suitable components or structures (and can contact them and / or be sandwiched by them). The barrier structures can include adhesives, foams, glues, structural portions of frame members, etc., and can have other functions in addition to serving as a barrier for the potting material 1360. For example, the barrier structure 1363 can correspond to the frame member 1324 and the adhesive 1326, and the barrier structures 1364 and 1356 can correspond to the bonding structures (e.g., adhesive foams) for coupling the frame member 1324 and / or the backplane 1328 to the cover and / or the display stack. The barrier structures 1366 and 1367 can correspond to adhesives that bridge the gaps between the barrier structures 1364 and 1365 and / or between other components of the device.

[0301] In some specific embodiments, the barrier structures (such as the barrier structures 1363 and 1364) define a channel section that extends along the corner region 1347 of the frame member 1324. During the injection process, the potting material 1360 can travel along the corner region 1347 within the channel section and at least partially extend along the sides of the frame member 1324 (e.g., along the long sides of the device and / or the display). In some cases, a portion of the barrier structure 1363 and / or 1364 (or a different component or material) can define an optional barrier 1371 that blocks the channel section or otherwise defines the blind end of the channel section, thereby restricting the flow path of the potting material 1360 during its introduction and ultimately helping to define the shape of the structure that results when the potting material 1360 hardens or cures.

[0302] Figures 13A to 13CAn exemplary device configuration including a frame member 1324 is shown. The frame member is attached to a cover (and optionally coupled to a backplane 1328), and attached to a housing member (e.g., via an adhesive 1325) to secure the top module to the housing and / or other components of the device. The frame member 1324 can be formed of or include plastic, metal, and / or other materials, and can be formed separately from other components of the top module (e.g., the cover, display stack, etc.), and then assembled with these components to form the top module. Figure 13E An exemplary implementation of device 1300 is shown, where a molded frame member 1370 is used instead of frame member 1324. More specifically, after attaching the display stack 1308 to the cover 1304, the molded frame member 1370 can be formed by molding a moldable material in place and allowing the material to cure or otherwise harden to define the molded frame member 1370. For example, the display stack 1308 can be attached to the cover 1304 to form a subassembly. Then the subassembly can be placed in a mold that defines at least a portion of the shape of the molded frame member 1370, and a moldable material (e.g., a polymer, reinforced polymer, thermoplastic polymer, thermosetting polymer, epoxy resin, etc.) can be introduced into the mold. The material flows against the cover 1304 and the display stack 1308 (including against and around the loop 1335), and can adhere or bond to those components via mechanical or chemical bonding (or both). The material is allowed to cure or otherwise harden to form the molded frame member 1370, and the subassembly having the molded frame member 1370 is removed from the mold. Optionally, the backplane is also incorporated into the mold and at least partially encapsulated within the molded frame member 1370. Then the top module can be attached to the housing member 1302 by attaching the molded frame member 1370 to the housing member 1302 with an adhesive 1325 (or via any other attachment technique).

[0303] Figure 13E Also shown is a loop area 1316 that has been filled with potting material 1317. In some cases, the potting material 1317 is part of the molded frame member 1370. For example, when the moldable material used to form the molded frame member 1370 is introduced into the mold, the material can also flow into the loop area 1316, thereby defining a unitary (monolithic) structure that serves as the molded frame member and potting in the loop area 1316. In some cases, the potting material 1317 is a material separate from the material of the molded frame member 1370, and is introduced into the loop area 1316 separately from the material forming the molded frame member 1370 (e.g., before or after the molded frame member 1370 is in place).

[0304] The molded frame member 1370 can provide many advantages and benefits by combining the functions of a frame member and a potting material into a single component that can be manufactured in a single operation. For example, the molded frame member 1370 can perform the structural functions of a separate frame member, including providing structural rigidity to the top module and providing structural attachment members to secure the cover 1304 to the housing member 1302 (or any other suitable structural component of the device). Additionally, the molded frame member 1370 can self - adhere to the cover 1304 during the molding operation, thus reducing assembly operations and time compared to a frame member that is manufactured separately and then must be attached to the cover 1304. Additionally, the molded frame member 1370 can perform the same stabilizing function on the loop 1335 as the potting material 1340 ( Figure 13A ) or 1343 ( Figure 13C ), without the need for an additional potting operation (such as the case where potting material is introduced after the frame member is formed and attached).

[0305] Although Figure 13E only a portion of the molded frame member 1370 positioned near the loop 1335 of the display is shown, the molded frame member 1370 can extend around the entire perimeter of the top module, effectively defining a frame along all four sides of the inner surface of the cover 1304 and optionally at least partially encapsulating the display stack along multiple sides of the display stack. In some cases, the molded frame member 1370 extends around less than the entire perimeter of the top module.

[0306] Figure 13E The other components, features, or other details of the device 1300 shown are the same as or similar to those shown and described with respect to Figures 13A to 13C , and those descriptions apply equally to Figure 13E the components, features, or other details shown.

[0307] Figure 13F Another exemplary configuration of the device is shown, which can enable the use of a thinner adhesive to attach the display stack to the cover. For example, Figure 13F a partial cross - section of a device having a cover 1378 is shown, which has a thinned outer region 1380. Except for the thinned outer region 1380, the cover 1378 can be the same as or similar to the cover 1304, and for the sake of brevity, these details are not repeated here. The cover 1378 can be attached to the frame member 1374 via an adhesive 1376 positioned in a recessed area 1375 (which defines a bonding surface) of the frame member 1374. The frame member 1374, the adhesive 1376, and the recessed area 1375 can be the same as or similar to the frame member 1324, the adhesive 1326, and the recessed area 1327, and for the sake of brevity, these details are not repeated here.

[0308] The thinned outer region 1380 may extend along one or more edges of the cover member 1378. For example, the thinned outer region 1380 may extend along one edge of the cover member 1378, and specifically, along the edge of the cover member 1378 near the flexible circuit element 1373 of the display stack 1382. In some cases, the thinned outer region 1380 may extend along two, three, or four sides of the cover member 1378. For example, in the case of a substantially rectangular cover member, the thinned outer region 1380 may extend around the entire outer perimeter of the cover member 1378 (e.g., the thinned outer region 1380 may extend around the display region of the cover member 1378, where the display region corresponds to the central region of the cover member 1378 through which the display is visible and / or generates a graphical output). The display stack 1382 and the flexible circuit element 1373 may be the same as or similar to the display stack 1308 and the flexible circuit element 1322, and for the sake of brevity, these details are not repeated here.

[0309] The thinned outer region 1380 may facilitate the use of a thinner adhesive (e.g., an optically clear or transparent adhesive) layer 1383 to attach the display stack 1382 to the cover member 1378. More specifically, the thinned outer region 1380 may allow the flange portion 1379 (similar to Figure 13A the flange portion 1329) to be positioned further towards the outer surface of the cover member 1378 (e.g., higher in the vertical direction, as Figure 13F shown), such that the display stack 1382 and thus the flexible circuit element 1373 can also be positioned further towards the outer surface of the cover member 1378 without causing the flexible circuit element 1373 to contact or otherwise interfere with the flange portion 1379. Thus, the thickness of the adhesive 1383 can be made thinner (e.g., relative to the adhesive 1310), resulting in an overall height of the display stack 1382 and the cover member 1378 that is less than the height of a device that does not include a cover member with a thinned outer region (e.g., the overall height may be less than Figure 13A the overall height 1359 in

[0310] The thinned outer region 1380 of the cover 1378 may have a thickness 1381 of about 400 microns, and the main portion of the cover 1378 (e.g., the portion to which the display stack 1382 is attached and that includes the graphical active area of the device) may have a thickness of about 600 microns. In some cases, the thinned outer region 1380 is thinner than the main portion of the cover 1378 by about 100 microns, about 200 microns, or about 300 microns. The thickness 1381 may be between about 375 microns and about 425 microns, and the thickness of the main portion may be between about 575 microns and about 625 microns.

[0311] The cover 1378 may define a transition region extending from the thinned outer region 1380 to the main portion of the cover 1378. For example, as Figure 13F shown, the transition region defines a curved portion of the bottom surface of the cover 1378 that extends from the thinned outer region 1380 to the main portion of the cover 1378. The transition region (e.g., the surface of the transition region) may have a continuous curve (as shown), or may have another shape or configuration. For example, the transition surface may be fully or partially flat and may resemble a chamfered surface. Figures 13G to 13L Other exemplary shapes of the thinned outer region of the cover are shown.

[0312] Figures 13G to 13L Exemplary configurations for the thinned outer region of the cover are shown. For example, Figure 13G shown is a cover having a thinned outer region 1380-G, similar to Figure 13F the thinned outer region shown. In this example, the thinned outer region 1380-G includes or is defined by: a flat region 1384-G at the outer portion of the thinned outer region 1380-G and a curved region 1385-G that extends from the flat region 1384-G to a corner or edge 1386-G. The corner or edge 1386-G may represent the edge where the main portion 1389-G of the cover (e.g., the flat surface to which the display stack is attached) intersects the curved region and may present as a discontinuous or distinct vertex. The curved region 1385-G may define a concave surface shape, while the corner or edge 1386-G may define a sharp convex feature. In the case where a cover including the thinned outer region 1380-G is attached to a frame member, as Figure 13F shown, the adhesive may be positioned alone on the flat region 1384-G, alone on the curved region 1385-G, or on at least a portion of both the flat region and the curved region. Additionally, the frame member (or other component) may contact the cover on the flat region 1384-G and / or the curved region 1385-G.

[0313] Figure 13HShows a cover with a thinned outer region 1380-H. In this example, the thinned outer region 1380-H includes or is defined by: a flat region 1384-H at the outer portion of the thinned outer region 1380-H and a first curved region 1385-H extending from the flat region 1384-H to a second curved region 1386-H. Compared to the corner 1386-G (which may appear as a distinct vertex or edge), the second curved region 1386-H defines a curved profile. The first curved region 1385-H may define a curved concave surface shape, and the second curved region 1386-H may define a curved convex surface shape. In some cases, the absolute values of the radii of curvature of the first and second curved regions are the same, while in other cases, they are different from each other. The two curved regions that define the transition between the main portion 1389-H of the cover and the thinned outer region can help eliminate sharp features (or other features) that can act as stress concentration features, thereby increasing the strength of the cover provided to resist fracture or other damage. In the case where the cover including the thinned outer region 1380-H is attached to a frame member, as Figure 13F shown, the adhesive can be positioned on the surface of either (or both) the flat region 1384-H and / or the curved regions 1385-H, 1386-H. Additionally, the frame member (or other component) can contact the cover on the surface of either (or both) the flat region 1384-H and / or the curved regions 1385-H, 1386-H.

[0314] Figure 13I Shows a cover with a thinned outer region 1380-I. In this example, the thinned outer region 1380-I includes or is defined by: a flat region 1384-I at the outer portion of the thinned outer region 1380-I and a stepped region 1385-I that defines a discontinuous transition from the thinned outer region 1380-I to the main portion 1389-I of the cover. The stepped region 1385-I can define two substantially 90-degree corners, resulting in a stepped surface that is substantially perpendicular to the surface of the flat region 1384-I and the main portion 1389-I of the cover (and the outer surface of the cover), as Figure 13I shown. In other examples, the corners and thus the stepped surface can have different angles. For example, the corner between the flat region 1384-I and the stepped surface can be approximately 80 degrees, and the corner between the stepped surface and the main portion 1389-I of the cover can be approximately 100 degrees, resulting in a stepped surface that is approximately 80 degrees relative to the flat region 1384-I (and the outer surface of the cover). In the case where the cover including the thinned outer region 1380-I is attached to a frame member, as Figure 13FAs shown, the adhesive can be positioned on the surface of the flat region 1384-I and / or on the stepped surface of the stepped region 1385-I. Additionally, the frame member (or other component) can contact the cover on the surface of the flat region 1384-I and / or on the stepped surface of the stepped region 1385-I.

[0315] Figure 13J A cover having a thinned outer region 1380-J is shown. In this example, the thinned outer region 1380-J includes a curved transition region 1387-J extending from the main portion 1389-J of the cover to the outer peripheral edge of the thinned outer region 1380-J or defined by the curved transition region. The curved transition region 1387-J can define a continuous concave curved profile, which can meet the main portion 1389-J of the cover at a corner or edge 1319-J. More specifically, the corner or edge 1319-J can represent the edge where the main portion 1389-J of the cover (e.g., showing the flat surface to which the laminate is attached) meets the curved transition region 1387-J, and can appear as a discontinuous or distinct vertex. The curved transition region 1387-J can have a constant radius of curvature (e.g., which defines a part of a circle) or a variable radius of curvature (e.g., which can define a non-circular spline). In the case where the cover including the thinned outer region 1380-J is attached to the frame member, as Figure 13F shown, the adhesive can be positioned on the surface of the curved transition region 1387-J. Additionally, the frame member (or other component) can contact the cover on the surface of the curved transition region 1387-J.

[0316] Figure 13K A cover having a thinned outer region 1380-K is shown. In this example, the thinned outer region 1380-K includes a flat transition region 1387-K extending from the main portion 1389-K of the cover to the outer peripheral edge of the thinned outer region 1380-K or defined by the flat transition region. The flat transition region 1387-K can define a substantially flat surface, which can meet the main portion 1389-K of the cover at a corner or edge 1319-K. More specifically, the corner or edge 1319-K can represent the edge where the main portion 1389-K of the cover (e.g., showing the flat surface to which the laminate is attached) meets the flat transition region 1387-K, and can appear as a discontinuous or distinct vertex. In the case where the cover including the thinned outer region 1380-K is attached to the frame member, as Figure 13F shown, the adhesive can be positioned on the surface of the flat transition region 1387-K. Additionally, the frame member (or other component) can contact the cover on the surface of the flat transition region 1387-K.

[0317] Figure 13LA cover having a thinned outer region 1380-L is shown, where the thinned outer region is inserted from the outer peripheral edge of the cover. More specifically, the thinned outer region 1380-L includes or is defined by a recess 1390 formed between a main portion 1389-L of the cover and a peripheral ridge 1388. The thickness of the cover at the main portion 1389-L and at the peripheral ridge 1388 (e.g., the thickness corresponding to the thickest dimension at these locations) may be equal, or they may be different. In the case where the cover including the thinned outer region 1380-L is attached to a frame member, as Figure 13F shown, an adhesive may be positioned on the surface of the peripheral ridge 1388 and / or the recess 1390. Additionally, the frame member (or other component) may contact the cover on the surface of the peripheral ridge 1388 and / or the recess 1390.

[0318] As described above, Figures 13F to 13L the reduced-thickness region of the cover shown in Figures 13F to 13L may allow the display stack to be positioned closer to the inner surface of the cover, such as by allowing a thinner adhesive or other layer to be used between the display stack and the cover. In some cases, the specific thicknesses of the thinned region and the main region of the cover may depend at least in part on the target thickness of the adhesive layer between the display stack and the cover, or other dimensions and / or other shapes or configurations of the display stack. In each of the covers shown in Figures 13G to 13L the thickness 1399 of the thinned outer region may be about 400 microns, and the thickness of the main portion of the cover (e.g., the portion to which the display stack is attached and which includes the graphical active area of the device) may have a thickness of about 600 microns. In some cases, the thickness 1399 of the thinned outer region may be about 100 microns, about 200 microns, or about 300 microns thinner than the main portion of the cover. The thickness 1399 may be between about 375 microns and about 425 microns, and the thickness of the main portion may be between about 575 microns and about 625 microns. In some cases, the thickness 1399 may be about 10%, about 20%, about 30%, about 40%, or about 50% thinner than the thickness of the main portion of the cover. The thickness 1399 may correspond to the thickness dimension of the cover measured between the thinnest portions of the thinned outer region, as Figures 13G to 13L shown.

[0319] Figures 13F to 13LThe coverings shown can be formed in various ways. For example, the covering (including the thinned outer region 1380) can be formed by molding (e.g., heating glass or another transparent material and applying a mold or press to produce the desired shape), machining (e.g., grinding, sanding, or otherwise removing material from a sheet to form the desired shape), and / or additive manufacturing (e.g., adhering, bonding, or otherwise attaching a first glass sheet to a second glass sheet to form the desired shape). Combinations of these processes can also be used to form the covering and produce the thinned outer region.

[0320] Figure 13M An exemplary covering and frame member configuration is shown, where an adhesive 1321 that attaches the display stack 1392 to the bottom or inner surface of the covering 1304 defines an angled ramp surface 1391 that deflects a portion of the display stack 1392 downward (e.g., away from the front covering) to help prevent or reduce the risk of contact between the display stack and the frame member 1324. The angled ramp surface 1391 can be configured to deflect a loop 1337 of a flexible circuit element of the display stack and a portion of a delaminated region 1339 of the display stack 1392 (optionally including an active area of a display configured to produce a graphical output). The angled ramp surface 1391 can be integral with the remainder of the adhesive layer that attaches the display stack 1392 to the covering 1304 (e.g., the angled ramp surface 1391 can be a thickened region of the adhesive 1321). In some cases, the adhesive 1321 is an optically clear liquid adhesive (LOCA) that is dispensed onto the covering 1304 and / or the display stack 1392 to define a portion (e.g., region 1393) of substantially uniform thickness that is positioned above the active area of the display and the angled ramp surface 1391.

[0321] The angled ramp surface 1391 is configured to deflect the loop 1337 and a portion of the delaminated region 1339 of the display stack 1392 away from the covering 1304 (e.g., deflect downward as Figure 13M shown). The angled ramp surface 1391 can have a curved or flat surface (e.g., the surface that contacts the display stack 1392), and can have a maximum thickness between about 100 microns and about 200 microns.

[0322] Figure 13N Another exemplary configuration for attaching the covering and the display stack to the housing member 1302 is shown. In Figure 13NIn the example shown, the display stack 1396 is shown attached to the inner surface of the cover 1304 via an adhesive 1394 (e.g., an optically clear adhesive). The mounting plate 1397 is attached to the display stack 1396 via an adhesive 1395 and / or other attachment techniques (e.g., fasteners, brackets, etc.). The mounting plate 1397 is attached to the housing member 1302 to secure the cover 1304 and the display stack 1396 (also referred to as the top module) to the housing member 1302. More specifically, the mounting plate 1397 may be attached to the boss 1323 of the housing member 1302 via an adhesive 1398 (e.g., HSA, TSA, adhesive foam, epoxy, etc.). In some cases, the attachment between the mounting plate 1397 and the boss 1323 using the adhesive 1398 may be the only attachment between the top module and the housing member 1302. In other cases, the top module is further secured to the housing member 1302 in other ways, such as with fasteners (e.g., screws, bolts, rivets), interlocking features, latching features, brackets, etc.

[0323] The boss 1323 may be part of a single integral structure that also defines the sidewall of the housing member 1302. For example, the housing member 1302 may be formed of metal, plastic, etc., and may define the sidewall of the housing as well as the boss 1323. In other cases, the boss 1323 may be a separate component that is attached to or otherwise integrated with the portion of the housing member 1302 that defines the sidewall. For example, the boss 1323 may be part of a polymeric material (e.g., fiber-reinforced polymer) molded against a metal housing structure. Other configurations and constructions of the boss 1323 are also contemplated.

[0324] Figure 13N The configuration shown (where the mounting plate 1397 is used to attach the top module to the housing member 1302) allows the top module to be attached to the housing member 1302 without a frame member (e.g., without Figures 13A to 13C , Figure 13F and Figure 13M the frame member 1324 shown). The absence of a frame member may provide a greater gap between the display loop and / or other parts of the display stack 1396 and other components of the device (e.g., the housing member 1302). Alternatively, the display loop may be positioned closer to the housing member 1302, which may facilitate a larger active area of the display screen, a smaller device, or both. Additionally, by omitting the frame member, the display stack 1396 may be positioned closer to the inner surface of the cover 1304 because no part of the frame member (e.g., no flange) interferes with or otherwise limits the vertical positioning of the display stack 1396 relative to the cover 1304. More generally, as Figure 13N shown, removing the frame member may result in a more space-efficient device in the x, y, and / or z directions.

[0325] Although Figure 13N Only a portion of mounting plate 1397 and housing member 1302 near the loop of display stack 1396 is shown, but the same or similar configuration of housing 1302 (including bosses 1323), mounting plate 1397, and adhesive 1398 can extend around the entire perimeter of the top module, thereby effectively defining an adhesive mounting area along all four sides of the device. In some cases, mounting plate 1397 and adhesive 1398 extend around less than the entire perimeter of the top module.

[0326] As described above, the devices as described herein can include one or more sets of antennas, the one or more sets of antennas including elements configured to communicate via 5G wireless protocols (including millimeter wave and / or 6 GHz communication signals). Figure 14A A portion of electronic device 1400 is shown, with components removed to better illustrate an exemplary set of antennas for 5G wireless communication. 5G communication can be implemented using a variety of different communication protocols. For example, 5G communication can use communication protocols that utilize frequency bands below 6 GHz (also referred to as sub-6 GHz spectrum). As another example, 5G communication can use communication protocols that utilize frequency bands above 24 GHz (also referred to as millimeter wave spectrum). Additionally, the specific frequency bands for any given 5G implementation can vary from other implementations. For example, different wireless communication providers can use different frequency bands within the millimeter wave spectrum (e.g., one provider can use a frequency of approximately 28 GHz to implement a 5G communication network, while another provider can use a frequency of approximately 39 GHz to implement). The specific set of antennas implemented in the devices as described herein can be configured to allow communication via one or more of the frequency bands in which 5G communication is implemented.

[0327] Figure 14A The device 1400 therein includes at least two sets of antennas, each set of antennas being configured to operate using different communication protocols to provide 5G communication. For example, the first set of antennas includes multiple antennas that communicate via the sub-6 GHz spectrum, and the second set of antennas includes multiple antennas that communicate via the millimeter wave spectrum.

[0328] As described above, a housing member of a device such as a mobile phone can be adapted to function as an antenna. In device 1400, for example, housing 1450 can include housing members 1401, 1403, 1405, 1407, 1409, and 1411. These housing members can be formed of metal or another electrically conductive material and can be electrically coupled to a communication circuit (described in more detail herein) so that portions of the housing members transmit and / or receive wireless communications. Housing members 1401, 1403, 1405, 1407, 1409, and 1411 can be coupled together with joining elements 1416, 1418, 1420, 1422, 1424, and 1426 to form the housing members into a single structural housing component. For simplicity, joining elements 1416, 1418, 1420, 1422, 1424, and 1426 are shown as separate components, but some of the joining elements can be continuous (e.g., joining elements 1416 and 1418 can be part of a continuous molded polymer structure).

[0329] The joining elements can mechanically and / or structurally couple the housing members together and provide electrical isolation between adjacent housing members to facilitate use of the housing members as radiating antennas. More specifically, with respect to the mechanical coupling, the joining elements can be firmly attached to adjacent housing members (e.g., via mechanical interlocking between the joining elements and the housing members and / or via an adhesive or chemical bonding between the joining elements and the housing members). With respect to the electrical isolation function, the joining elements can provide the necessary electrical isolation between the antenna and another electrically conductive component (e.g., another electrically conductive housing member that serves as either an antenna or a non-radiating structural member) to reduce attenuation of the antenna performance (e.g., due to capacitive coupling between the antenna and another electrically conductive component). The joining elements can be formed of and / or include a non-conductive material and / or a dielectric material, such as a polymer, fiber-reinforced nylon, epoxy resin, etc. Thus, the joining elements can be referred to herein as non-conductive joining elements.

[0330] The joining element can be formed by a molding process. For example, the housing members can be placed in a mold or otherwise held in a fixed position relative to each other such that a gap is defined between adjacent housing members. Then one or more polymeric materials can be injected into the gap (and optionally engaged with retention structures and / or interlocking features defined in the housing members) such that the polymeric material at least partially fills the gap and is allowed to cure or otherwise harden to form the joining element. In some cases, the joining element can be formed from a plurality of different materials. For example, an internal portion of the joining element can be formed from a first material (e.g., a polymeric material), and an external portion of the joining element (e.g., the portion that defines the outer surface of the housing) can be formed from a second material different from the first material. These materials can have different properties, which can be selected based on the different functions of the internal and external portions of the joining element. For example, the internal element can be configured to form a primary structural connection between the housing members and can have a higher mechanical strength and / or toughness than the external material. On the other hand, the external material can be configured to have a particular appearance, surface finish, chemical resistance, waterproof function, etc., and its composition can be selected to prioritize those functions over mechanical strength. The joining element can be formed from a fiber-reinforced polymer, an epoxy resin, or any other suitable material.

[0331] In device 1400, at least three sections of the housing are adapted to be used as antennas for communicating via the sub-6 GHz spectrum. More specifically, the housing members can be adapted to be used as antennas by conductively coupling a ground wire and a feed wire to specific locations on the housing members (which are conductive and can be formed of or include metal). The specific locations of the ground wire and the feed wire on the housing members can partially define a specific wavelength for tuning the antenna.

[0332] Device 1400 includes an exemplary configuration of a first set of antennas for communicating via the sub-6 GHz spectrum. The first set of antennas includes a first sub-6 GHz antenna 1402, a second sub-6 GHz antenna 1404, a third sub-6 GHz antenna 1406, and a fourth sub-6 GHz antenna 1408. In this exemplary configuration, the first sub-6 GHz antenna 1402, the second sub-6 GHz antenna 1404, and the third sub-6 GHz antenna 1406 are defined by sections of the housing members, while the fourth sub-6 GHz antenna 1408 is a conductive trace (e.g., on a circuit board) or other radiating element positioned within the device. The four antennas of the first set of antennas can be configured to operate according to a 4x4 MIMO (multiple-input, multiple-output) scheme.

[0333] The antennas defined by sections of the housing members can be structurally and functionally similar to each other. Thus, to avoid redundancy, only the first sub-6 GHz antenna 1402 will be described in detail. However, it should be understood that this description applies equally to the second sub-6 GHz antenna 1404 and the third sub-6 GHz antenna 1406.

[0334] The first sub-6 GHz antenna 1402 may be defined by a portion of the housing member 1401, and more specifically, by a portion of the housing member 1401 near the engagement element 1416. To transmit and receive electromagnetic signals from the first sub-6 GHz antenna 1402, a ground wire and a feed wire may be conductively coupled to the housing member 1401. For example, the ground wire may be conductively coupled to location 1412, and the feed wire may be conductively coupled to location 1410.

[0335] The portion of the housing member 1401 that serves as the first sub-6 GHz antenna 1402 may define structural features 1413 and 1414. These features may extend from the inner side of the housing member 1401 and toward the interior volume of the device 1400. The features 1413, 1414 may have several functions, including defining the physical mounting locations of the ground wire and the feed wire, and defining an interlock feature with which the material of the engagement element engages and / or is encapsulated together to form a structural coupling between the housing members. Although the features 1413, 1414 are Figure 14A shown in as not being encapsulated by or otherwise engaged with the material of the engagement element 1416, it should be understood that in some cases, the material of the engagement element 1416 contacts, engages, and / or at least partially encapsulates the feature 1413 and / or the feature 1414. Additionally, although such features are shown only on the housing members 1401 and 1407, other housing members may include similar features near the engagement element.

[0336] As described above, the second sub-6 GHz antenna 1404 and the third sub-6 GHz antenna 1406 may have the same or similar structure as the first sub-6 GHz antenna 1402. In some cases, the first sub-6 GHz antenna, the second sub-6 GHz antenna, and the third sub-6 GHz antenna are each configured to communicate via different frequency bands. Therefore, the exact shape, length, or other physical characteristics of each of these antennas may be different from one another.

[0337] As described above, the fourth sub-6 GHz antenna 1408, which is part of the first group of antennas operating according to a 4×4 MIMO scheme, is a conductive trace or other radiating element positioned within the device. However, in some cases, a portion of the first housing member 1401 near the engagement element 1426 may be configured to serve as the fourth sub-6 GHz antenna. In such a case, the first housing member 1401 may include structural features similar to those of the first sub-6 GHz antenna 1402 (e.g., features 1413, 1414), and the ground wire and the feed wire may be similarly coupled to this region of the first housing member 1401 to facilitate the transmission and reception of electromagnetic signals.

[0338] While the sub-6 GHz antennas 1402, 1404, 1406, and 1408 can be used to communicate via the sub-6 GHz spectrum, device 1400 may also (or alternatively) include antennas for communicating via the millimeter wave spectrum. Device 1400 may include, for example, a first millimeter wave antenna 1432 and a second millimeter wave antenna 1434. Compared to antennas in other spectrums, millimeter wave antennas can be more directional and more susceptible to attenuation due to blockage. For example, regarding attenuation, if a user places his or her hand on a millimeter wave antenna, communication via that antenna may suffer a halt or complete cessation. Regarding directionality, if a millimeter wave antenna is pointed more than a certain angle away from a cellular tower, the antenna may stop being able to communicate effectively with that cellular tower. To mitigate these effects, the device may include multiple millimeter wave antennas that are strategically positioned to enable wireless communication in a plurality of different positions, locations, orientations, etc. For example, in device 1400, the first millimeter wave antenna 1432 may be configured as a rear-emitting antenna (e.g., it mainly transmits and receives electromagnetic signals in a direction perpendicular to the rear surface of the device). The second millimeter wave antenna 1434 may be configured as a side-emitting antenna (e.g., it mainly transmits and receives electromagnetic signals in a direction perpendicular to the side surface of the device). It should be understood that a directional millimeter wave antenna does not need to be directly oriented towards another antenna for communication, but can tolerate a slight misalignment (e.g., + / - 15 degrees, + / - 30 degrees, or another value).

[0339] Return Figure 14A , the first (rear-emitting) millimeter wave antenna 1432 may be coupled to a logic board 1436 (which may be an implementation of logic board 220, 320, or any other logic board described herein). In some cases, the first millimeter wave antenna 1432 (which may be or include a passive antenna board) is directly surface-mounted to the logic board 1436. The first millimeter wave antenna 1432 may include antenna arrays for two different frequencies (e.g., 28 GHz and 39 GHz, but other frequencies are also possible). Each antenna array may include four antenna elements, and each antenna element may have two different polarizations. By including two (or more, such as four) different antenna arrays, rather than using the same antenna elements for two different frequency bands, the first millimeter wave antenna 1432 may have a larger total bandwidth than an antenna that uses the same antenna elements to communicate on two (or more) frequency bands. The larger bandwidth of the first millimeter wave antenna 1432 may allow for greater tolerance in positioning the antenna 1432 in device 1400 while still providing sufficient antenna performance. Additionally, the multi-millimeter wave antenna array of the first millimeter wave antenna 1432 can be used in a diversity configuration to improve wireless communication functionality and reliability.

[0340] Device 1400 may also include antenna circuitry in a system-in-package (SiP) component 1438. The SiP component 1438 (referred to herein as SiP 1438) may include components such as one or more processors, memory, an analog-to-digital converter, filters, amplifiers, power control circuitry, and the like. SiP 1438 may be coupled to logic board 1436 and may be positioned above first millimeter-wave antenna 1432. Antenna elements in first millimeter-wave antenna 1432 may be conductively coupled to SiP 1438 such that SiP 1438 may process signals received via first millimeter-wave antenna 1432 and such that first millimeter-wave antenna 1432 transmits signals.

[0341] Figure 14B A partial cross-sectional view of device 1400 as viewed along line 14B-14B in Figure 14A is shown. The cross-sectional view illustrates exemplary details of second (side-emitting) millimeter-wave antenna 1434 of device 1400. Side-emitting antenna 1434 (also referred to as an antenna module) is fixed to the interior of housing 1450 of device 1400 ( Figure 14A ) (e.g., fixed to housing member 1407) and is configured to transmit and receive electromagnetic signals through one or more openings 1457 in a sidewall of housing member 1409. Openings 1457 may extend through the sidewall of housing member 1409 and may at least partially define an antenna window for side-emitting antenna 1434.

[0342] Side-emitting antenna 1434 includes antenna array 1466, which includes a plurality of directional antenna elements. Antenna array 1466 may include antenna elements for two different frequencies (e.g., 28 GHz and 39 GHz, although other frequencies are possible). For example, two antenna elements may be provided for each frequency, and each antenna element may have two different polarizations. Of course, other configurations of antenna elements are possible. For example, antenna array 1466 may include four antenna elements for each frequency.

[0343] Antenna array 1466 may include or be coupled to antenna circuitry in a SiP component. The SiP component may include components such as one or more processors, memory, an analog-to-digital converter, filters, amplifiers, power control circuitry, and the like. The SiP may be conductively coupled to logic board 1436 (e.g., via a flexible circuit element). Antenna elements in antenna array 1466 may be conductively coupled to the SiP such that the SiP may process signals received via antenna array 1466 and such that antenna array 1466 transmits signals.

[0344] The sidewall of the housing member 1409 can be configured to act as a waveguide for guiding electromagnetic signals in and out of the antenna array 1466. The waveguide can be defined by a channel or hole 1459 that passes through the sidewall of the housing member 1409. The channel 1459 can be partially defined by walls that extend from the outer side surface of the sidewall of the housing member 1409 to the inner surface of the housing member 1409. As shown, these walls are angled such that the opening 1459 on the outer side surface is offset from the opening on the inner surface of the housing. More specifically, the center of the opening in the outer side surface of the sidewall can be vertically offset from the center of the opening in the inner side of the housing member 1409.

[0345] The vertical offset of the openings defines (relative to Figure 14B the orientation shown) a channel that is generally non - horizontally aligned, which allows the internal components of the side - emitting antenna 1434 to be offset from the central axis of the device 1400 while also allowing the opening 1457 in the outer side surface to be vertically centered in the outer side surface. For example, the height 1452 of the housing member 1409 above the opening 1457 can be the same as the height 1454 of the housing member 1409 below the opening 1457. By aligning the opening 1457 with the middle of the side surface (e.g., the middle in the vertical direction), the structural integrity (e.g., stiffness, strength, etc.) of the housing member 1409 can be higher than in the case where the opening 1457 is vertically offset from the center of the side surface (e.g., because the amount of housing material above the opening 1457 will be different from the amount below, resulting in one side being weaker than the other). Additionally, the centering of the opening 1457 provides an overall symmetric and balanced appearance to the device 1400.

[0346] The side - emitting antenna 1434 can include a cover element 1462 (also referred to as an insert) within a portion of the channel 1459. The insert 1462 can be an insert of plastic, glass, or other material (e.g., a non - conductive material) and can be adhered to the antenna array 1466 via an adhesive. The insert 1462 can be placed into the channel 1459 or can be formed in place, for example, by injecting a polymer material into the channel 1459 and allowing the polymer material to cure or otherwise harden.

[0347] Device 1400 may also include a cover element 1456 that is positioned within a channel 1459 and defines a portion of the outer side surface of device 1400 (e.g., in combination with the outer side surface of housing member 1409). The cover element 1456 may be formed of glass, sapphire, glass-ceramic, plastic, or any other suitable material (e.g., a non-conductive material). The thickness of the cover element 1456 may be determined at least in part based on the material used and the effect of the material (and dimensions) on electromagnetic signals passing through the channel 1459. For example, to achieve the same or similar electromagnetic performance, the thickness of the cover element 1456 may be greater when formed of glass than when formed of sapphire. If the cover element 1456 is formed of sapphire, a spacer layer (e.g., plastic, epoxy resin, or other suitable material) may be included between the cover element 1456 and an adhesive (e.g., adhesive 1460) that secures the cover to device 1400.

[0348] The cover element 1456 may include a mask layer 1458 that may be applied to the back surface or the front surface of the cover element 1456. As shown, the mask layer 1458 is applied to the back surface of the cover element 1456. The mask layer 1458 may be an ink, dye, film, paint, coating, or other material and may be visible through the cover element 1456. The mask layer 1458 may be opaque. The mask layer 1458 may also be a single layer or may include multiple sub-layers. The cover element 1456 may be secured to the housing member 1409 via an adhesive 1460. The adhesive 1460 may also adhere the cover element 1456 to an insert 1462. The outer surface of the cover element 1456 may be substantially flush with an adjacent surface of the housing member 1409 (e.g., a surface defining heights 1452, 1454).

[0349] The side-emitting antenna 1434 may also include a dielectric cap 1464. The dielectric cap 1464 may be positioned over the antenna array 1466 and optionally conductively coupled to the antenna array. In some cases, the dielectric cap 1464 may be considered part of the antenna array 1466. The shape and material of the dielectric cap 1464 (e.g., the dielectric properties of the material) may contribute to the bandwidth of the side-emitting antenna 1434. For example, the bandwidth of the side-emitting antenna 1434 having the dielectric cap 1464 may be greater than the bandwidth of a side-emitting antenna without the dielectric cap 1464.

[0350] Figure 14C A portion of the side-emitting antenna 1434 separated from device 1400 is shown, and Figure 14D is shown Figure 14C a partial cross-sectional view of this portion of the side-emitting antenna 1434 shown. As Figure 14C and Figure 14DAs shown, the dielectric cap 1464 may include a loading block feature 1470. The loading block feature 1470 may be conductively coupled to an antenna element 1478 in the side-emitting antenna 1434, as Figure 14D shown. For example, a via or other conductive conduit 1472 in a circuit board 1471 or other substrate may conductively couple the loading block feature 1470 to the antenna element 1478. The loading block feature 1470 may at least partially define the radiation pattern of the corresponding antenna element 1478 to which they are coupled.

[0351] The dielectric cover 1464 and the integral loading block feature 1470 may be formed of epoxy resin or other suitable moldable material. For example, the dielectric cap 1464 may be formed by molding epoxy resin against the antenna array 1466. The epoxy resin used to form the dielectric cap 1464 may have a dielectric constant between about 4 and about 6.

[0352] The side-emitting antenna 1434 may also include a cap member 1474 that at least partially encapsulates the antenna element 1478, and a potting material 1476 in the antenna array 1466 that at least partially encapsulates the antenna element 1478.

[0353] As described above, portions of the metal or conductive housing of the device may be used as antenna elements to transmit and receive wireless signals. More specifically, portions of the metal or conductive housing may be used as radiation elements of the antenna. For example, Figure 14A an exemplary device 1400 is shown that uses a metal housing member to define an antenna element for the sub-6 GHz spectrum. In addition to the sub-6 GHz antenna described with respect to Figure 14A the metal housing member may also be used to define antenna elements for other frequencies and / or protocols. Figure 15 is a schematic view of a portion of a housing 1500 formed of a plurality of conductive housing members joined together using a bonding element. Figure 15 Also schematically represented are exemplary connection points on the housing members at which feed lines and / or ground lines may be conductively coupled to the housing members to carry electromagnetic signals from the housing members to other antenna circuits (and from the antenna circuits to the housing members).

[0354] As Figure 15As shown, the housing 1500 may include a first housing member 1502 that defines a portion of a first side surface 1542, a first corner surface 1550, and a portion of a second side surface 1544. The first housing member 1502 is structurally coupled to a second housing member 1504 via a first engagement element 1514. As described above, engagement elements such as engagement element 1514 may be formed of a polymeric material (e.g., fiber-reinforced polymer) that structurally engages the housing members while also providing sufficient electrical isolation between the housing members to allow the housing members to act as antenna elements.

[0355] The housing 1500 further includes a second housing member 1504 that defines a portion of the second side surface 1544 and is structurally coupled to a third housing member 1506 via a second engagement element 1516. The third housing member 1506 defines a portion of the second side surface 1544 and a portion of a second corner surface 1552.

[0356] The third housing member 1506 also defines a portion of a third side surface 1546 of the housing and is structurally connected to a fourth housing member 1508 via a third engagement element 1518. The fourth housing member 1508 also defines a portion of the third side surface 1546, a third corner surface 1554, and a portion of a fourth side surface 1548.

[0357] The fourth housing member 1508 is coupled to a fifth housing member 1510 via a fourth engagement element 1520. The fifth housing member 1510 defines a portion of the fourth side surface 1548 and is coupled to a sixth housing member 1512 via a fifth engagement element 1522. The sixth housing member 1512 defines a portion of the fourth side surface 1548, a fourth corner surface 1556, and a portion of the first side surface 1542. The sixth housing member 1512 is structurally connected to the first housing member 1502 via a sixth engagement element 1525.

[0358] Each of the engagement elements of the housing 1500 may define a portion of the outer surface of the housing 1500. Thus, the outer side surface of the housing 1500 may be defined entirely or substantially entirely by the housing members and the engagement elements.

[0359] To operate as an antenna element, the housing members of the housing 1500 may be conductively coupled to an antenna circuit, an electrical ground plane, etc. The specific locations of the connection points on the housing members, as well as the dimensions and shapes of the housing members, may at least partially define the parameters of the antenna element. Exemplary antenna parameters may include resonant frequency, range, radiation pattern, efficiency, bandwidth, directivity, gain, etc.

[0360] Figure 15Exemplary locations of connection points of the feeder line and the ground line to the housing member are shown. For example, the feeder line and the ground line may be conductively coupled to the first housing member 1502 at connection points 1524-1 and 1524-2, thus facilitating wireless communication via the first housing member 1502.

[0361] The feeder line and the ground line may be conductively coupled to the second housing member 1504 at connection points 1528-1 and 1528-2 and optionally at connection points 1526-1 and 1526-2. A portion of the second housing member 1504 that is at or near between connection points 1526-1 and 1526-2 may act as one antenna element, and a portion of the second housing member 1504 that is at or near between connection points 1528-1 and 1528-2 may act as another independent antenna element (e.g., although defined by the same housing member 1502, this other antenna element may transmit and receive electromagnetic signals independently of the antenna element located between connection points 1526-1 and 1526-2). Although Figure 15 connection points 1526-1 and 1526-2 are shown, in some specific implementations such as in Figure 14A device 1400, these connection points may be omitted, which uses conductive elements on the circuit board in the corner of the device as antenna elements instead of using the housing member.

[0362] The feeder line and the ground line may be conductively coupled to the third housing member 1506 at connection points 1530-1 and 1530-2, and conductively coupled to the fourth housing member 1508 at connection points 1532-1 and 1532-2 and connection points 1534-1 and 1534-2. The fourth housing member 1508 may define different antenna element configurations according to which feeder lines and ground lines are used at a given time. For example, in a first mode, connection points 1532-1 and 1532-2 are used such that the fourth housing member 1508 is configured to communicate via a first communication protocol (or frequency), and in a second mode, connection points 1534-1 and 1534-2 are used such that the fourth housing member 1508 is configured to communicate via a second communication protocol (of a frequency) different from the first communication protocol.

[0363] The feeder line and the ground line can be conductively coupled to the fifth housing member 1510 at connection points 1536-1, 1536-2 and at connection points 1538-1, 1538-2. Similar to the configuration of the second housing member 1504, the portion of the fifth housing member 1510 that is at or near the connection points between 1536-1 and 1536-2 can act as one antenna element, and the portion of the fifth housing member 1510 that is at or near the connection points between 1538-1 and 1538-2 can act as another independent antenna element (e.g., although defined by the same housing member 1510, this other antenna element can transmit and receive electromagnetic signals independently of the antenna element located between connection points 1536-1 and 1536-2). The feeder line and the ground line can also be conductively coupled to the sixth housing member 1512 at connection points 1540-1, 1540-2.

[0364] As described above, the housing members of the device housing described herein can be used to form multiple sets of antennas, where each set of antennas communicates via a different communication protocol or frequency band. For example, the housing can define multiple antennas in a first MIMO antenna array or set (e.g., for a 4G communication protocol) and multiple antennas in a second MIMO antenna array (e.g., for a 5G communication protocol). In one non-limiting exemplary configuration, the antenna elements defined by connection points 1524, 1530, 1532, 1534, and 1540 can be configured to operate as part of a first MIMO antenna array (e.g., for a 4G communication protocol), while the antenna elements defined by connection points 1526 (if provided), 1528, 1536, and 1538 can be configured to operate as part of a second MIMO antenna array (e.g., for a 5G communication protocol). For any given set of antennas, it is not necessary for all the antenna elements in the set to be housing members. For example, the second MIMO antenna array or set can use an internal antenna (e.g., antenna 1408, Figure 14A ) as one of the antennas in a 4×4 MIMO array.

[0365] As described above, the conductive housing members that can act as antennas or antenna systems' radiating structures can be structurally coupled together via joining elements. The joining elements can be formed of a polymer material or other dielectric material, and the joining elements can provide sufficient electrical isolation between the housing members to facilitate using the housing members as the radiating structures of the antennas. In some cases, the joining elements include one, two, or more molded elements that are molded into the gap between the housing members and engage with the housing members. Since the joining elements hold the housing members together structurally, a strong engagement between the joining elements and the housing members is preferably achieved. Thus, the housing members can include or define structures and / or features for the joining elements to engage with in order to hold the joining elements to the housing members and thereby hold the housing members together.

[0366] Figure 16A An exemplary housing member 1600 is shown that includes features with which a mating element can mate. Figure 16A The portion of the housing member shown can generally correspond to Figure 14A region 16A - 16A in

[0367] The housing member 1600 can be formed of or include a conductive material, such as stainless steel, aluminum, a metal alloy, etc., and can be conductively coupled to an antenna circuit (e.g., via a feeder line and / or a ground line, as described above) to act as a radiation structure of the device. Figure 16A The portion of the housing member 1600 shown can abut and / or mate with a mating element, as Figure 16B shown.

[0368] The housing member 1600 defines a first interlocking feature 1602 that extends inwardly (e.g., toward the interior of the device) from a sidewall 1601 defined by the housing member 1600. The first interlocking feature 1602 can extend from an inner side 1605 of the housing member 1600, where the inner side 1605 is opposite an outer side 1603.

[0369] The sidewall 1601 can define an outer surface of the device, of which the housing member 1600 is a part. The first interlocking feature 1602 can define a first hole 1604 and one or more second holes 1606. When a moldable material is injected against or otherwise molded around the housing member 1600 to form a mating element, the moldable material can at least partially surround and / or encapsulate the first interlocking feature 1602 and can flow into and optionally through the first hole 1604 and the second holes 1606. By at least partially encapsulating the interlocking feature 1602 and flowing into and / or through the first hole 1604 and the second holes 1606, the mating element can be structurally interlocked with the housing member 1600, thereby firmly holding the mating element to the housing member 1600.

[0370] The housing member 1600 can also define a second interlocking feature, such as a recess 1610, which can be a recessed portion, chamber, or other similar feature that is recessed relative to an end surface 1608 of the housing member 1600. The end surface 1608 of the housing member 1600 can be the portion of the housing member 1600 that extends closest to another housing member, to which the housing member 1600 is coupled via a mating element. The end surface 1608 can be offset from an end surface 1609 defined by the first interlocking feature 1602. More specifically, the end surface 1609 can be recessed relative to the end surface 1608 (e.g., in a direction perpendicular to the end surfaces 1608, 1609).

[0371] The recess 1610 may have a depth between about 100 microns and about 1000 microns, and may have a width between about 100 microns and about 400 microns (e.g., the left-to-right dimension as shown in Figure 16A ), and a length between about 750 microns and about 3000 microns (e.g., the top-to-bottom dimension as shown in Figure 16A ). In some cases, the housing member 1600 may also define holes along the end surface 1608 and / or the end surface 1609. The holes may be formed on the end surface 1608 and / or 1609, and may also be formed on the surface of the recess 1610. The holes may be a different structure from the recess 1610. For example, the recess 1610 may have a length dimension greater than about 1000 microns and a width dimension greater than about 100 microns, while the holes may have a length and / or width dimension less than about 10 microns. Similarly, the recess 1610 may have a depth greater than about 100 microns, while the holes may have a depth less than about 10 microns. In some cases, the holes are formed by chemical etching, sandblasting, laser, or plasma etching, etc. The material of the engaging element may extend or flow into the holes during the formation of the engaging element, and engage and / or interlock with the holes to fix the engaging element to the housing member 1600. In some cases, the holes are formed after the recess 1610 is formed, such that the holes are present on the surface of the recess 1610. In other cases, the holes are formed before the recess 1610 is formed, such that the surface of the recess 1610 is free of holes, or has a different surface morphology and / or topography from the end surface on which the holes are formed (e.g., the end surface 1608 may have holes by chemical etching, while the recess 1610 may have machine marks of a machining process). In some cases, the maximum dimension (e.g., length, width, depth) of the holes is at least one order of magnitude smaller than the maximum dimension (e.g., length, width, depth) of the recess 1610.

[0372] The housing member 1600 may define a flange portion 1607 that is adjacent to and / or extends along the peripheral side of the top module (which may include a cover member, a display, a touch sensing component, etc.). In some cases, a second interlocking feature 1610 (e.g., a recess, as shown) is positioned in the flange portion 1607, thereby enhancing the portion of the joint along the side of the top module. More specifically, the flange portion 1607 may define a cantilever that extends away from the first interlocking feature 1602, and the second interlocking feature 1610 may provide a complementary interlocking engagement with the engaging element to help prevent or limit the separation or disengagement of the flange portion 1607 from the engaging element (e.g., Figure 16B the engaging element 1612). The flange may be in a certain direction (e.g., Figure 16Ain the vertical direction, which may extend parallel to the outer side surface defined by the housing member 1600 and / or perpendicular to the front surface defined by the covering member of the device), and the second interlocking feature 1610 may be an elongated recess or channel having a longitudinal axis that extends parallel to the outer side surface of the housing member (e.g., in the same direction as extending from the first interlocking feature 1602 along the flange).

[0373] When the moldable material flows into place (e.g., between the housing member 1600 and another housing member) to form the joining element, the moldable material may flow into the recess 1610 and at least partially fill the recess, thereby forming a corresponding protrusion in the moldable material. When the moldable material subsequently cures or otherwise hardens, the protrusion of the joining element and the recess 1610 interlock with each other. The interlock between the recess 1610 and the protrusion may help prevent the separation of the joining element and the housing member 1600. Additionally, the position of the recess 1610 relative to the outer surface defined by the side wall 1601 may contribute to improving the structural rigidity of the joint and help maintain the alignment (and mechanical coupling) between the housing member 1600, the joining element, and the adjacent housing member in the case of a drop or other impact event. For example, while the first interlocking feature 1602 may provide basic structural strength to the interface between the joining element and the housing member 1600, its position is more inward (e.g., relatively closer to the inner volume of the housing) than the recess 1610. In contrast, the more outwardly positioned recess 1610 (e.g., relatively closer to the outer surface of the housing member 1600) may improve the strength and stability of the alignment between the outer surface of the housing member and the joining element.

[0374] Figure 16B is a partial cross-sectional view of the housing member 1600 (joined to another housing member 1616 via the joining element 1612) as observed along line 16B-16B in Figure 16A . (Although Figure 16A the joining element and the housing member 1616 are not shown, if such components exist, then Figure 16B represents the view as observed along line 16B-16B.) The joining element 1612 may be positioned between and in contact with the end surface 1608 of the housing member 1600 and the corresponding end surface 1617 of the housing member 1616. The joining element 1612 may also extend into the recess 1610 of the housing member 1600 and the recess 1614 defined by the housing member 1616 and interlock with the two recesses. In addition to the mechanical interlock between the joining element 1612 and the recesses 1610, 1614 (and / or other retaining structures and / or interlocking features), the moldable material of the joining element 1612 may form a chemical bond or other adhesive joint with the materials of the housing members 1600, 1616.

[0375] The outer surfaces of the engagement element 1612 and the housing members 1600, 1616 can define a smooth and continuous outer surface 1613 of the housing. For example, any gaps, seams, or other interruptions along the outer surface 1613 of the housing, located between the engagement element 1612 and the housing members 1600, 1616, may be undetectable by touch and / or the naked eye. For example, sliding a fingernail along the outer surface 1613 may not catch on a seam between the engagement element 1612 and the housing members 1600, 1616. In some cases, any gaps, seams, or other interruptions between the engagement element 1612 and the housing members 1600, 1616 can be less than about 200 microns, less than about 100 microns, less than about 50 microns, less than about 20 microns, or less than about 10 microns (in depth, length, offset, and / or other dimensions). The interlock between the engagement element 1612 and the recesses 1610, 1614 can help prevent or inhibit relative movement between the housing members 1600, 1616 and the engagement element 1612, such as relative movement of these components in the vertical direction (as Figure 16B oriented in). Thus, the recesses 1610, 1614 can help maintain a substantially seamless texture and appearance between the engagement element 1612 and the housing members 1600, 1616.

[0376] Figure 16C Another exemplary housing member 1620 is shown that includes features with which the engagement element can engage. The housing member 1620 can be formed of or include a conductive material, such as stainless steel, aluminum, a metal alloy, etc., and can be conductively coupled to an antenna circuit (e.g., via a feeder line and / or a ground line, as described above) to act as a radiation structure of the device. Figure 16C The portion of the housing member 1620 shown can abut and / or engage the engagement element, as Figure 16D shown.

[0377] The housing member 1620 defines a first interlock feature 1622 that extends inward (e.g., toward the interior of the device) from a sidewall 1621 defined by the housing member 1620. The first interlock feature 1622 can extend from the inner side of the housing member 1620 (e.g., similar to the inner side 1605, Figure 16A ), where the inner side is opposite the outer side (e.g., similar to the outer side 1603, Figure 16A ).

[0378] The side wall 1621 can define an outer surface of the device, and the housing member 1620 is part of the device. The first interlocking feature 1622 can define a first hole 1624 and one or more second holes 1626. When a moldable material is injected against or otherwise molded around the housing member 1620 to form a joining element, the moldable material can at least partially surround and / or encapsulate the first interlocking feature 1622 and can flow into and optionally through the first hole 1624 and the second holes 1626. By at least partially encapsulating the interlocking feature 1622 and flowing into and / or through the first hole 1624 and the second holes 1626, the joining element can be structurally interlocked with the housing member 1620, thereby firmly holding the joining element to the housing member 1620.

[0379] The housing member 1620 can further define a protruding feature 1630, which can be a post, a pin, or any other suitable shape or configuration that protrudes or extends from an end surface 1628 of the housing member 1620. The end surface 1628 of the housing member 1620 can be the portion of the housing member 1620 that extends to be closest to another housing member, other than the protruding feature 1630, and the housing member 1620 is coupled to the other housing member via a joining element.

[0380] The protruding feature 1630 can operate in a manner similar to the Figures 16A to 16B recess 1610 therein. For example, when the moldable material flows into place (e.g., between the housing member 1620 and another housing member) to form a joining element, the moldable material can flow around the protruding feature 1630 to at least partially encapsulate the protruding feature 1630. When the moldable material subsequently cures or otherwise hardens, the protruding feature 1630 and the recess in the moldable material formed around the protruding feature 1630 are interlocked with each other. The interlock between the protruding feature 1630 and the moldable material can help prevent separation of the joining element and the housing member 1620. In addition, the position of the protruding feature 1630 relative to the outer surface defined by the side wall 1621 can help improve the structural rigidity of the joint and help maintain alignment (and mechanical coupling) between the housing member 1620, the joining element, and the adjacent housing member in the event of a drop or other impact event. For example, while the first interlocking feature 1622 can provide basic structural strength to the interface between the joining element and the housing member 1620, its position is more inward (e.g., relatively closer to the inner volume of the housing) than the protruding feature 1630. In contrast, the more outwardly positioned protruding feature 1630 (e.g., relatively closer to the outer surface of the housing member 1620) can improve the strength and stability of the alignment between the outer surface of the housing member and the joining element.

[0381] In some cases, the housing member 1620 may also define holes along the end surface 1628 and / or the end surface 1629. The holes may be formed in the end surface 1628 and / or 1629, and may also be formed in the surface of the protruding feature 1630. The holes may be a different structure from the protruding feature 1630. For example, the protruding feature 1630 protrudes a distance greater than about 100 microns, and may have length and width dimensions greater than about 100 microns, while the holes may have depth, length, and / or width dimensions less than about 10 microns. In some cases, the holes are formed by chemical etching, sandblasting, laser, or plasma etching, etc. The material of the joining element may extend or flow into the holes during the formation of the joining element, and engage and / or interlock with the holes to fix the joining element to the housing member 1620. In some cases, the holes are formed after the protruding feature 1630 is formed, such that the holes are present on the surface of the protruding feature 1630. In other cases, the surface of the protruding feature 1630 does not contain holes, or has a different surface morphology and / or topography from the end surface on which the holes are formed. In some cases, the maximum dimension (e.g., length, width, depth) of the holes is at least one order of magnitude smaller than the maximum dimension (e.g., length, width, depth) of the protruding feature 1630.

[0382] Figure 16D is a partial cross-sectional view of the housing member 1620 (joined to another housing member 1625 via the joining element 1632) as observed along line 16D-16D in Figure 16C . (Although Figure 16C the joining element 1632 and the housing member 1625 are not shown, if such components exist, then Figure 16D represents the view as observed along line 16D-16D.) The joining element 1632 may be positioned between and in contact with the housing members 1620, 1625. The joining element 1632 may also at least partially (and optionally completely) encapsulate the protruding feature 1630. As visible in Figure 16D , the protruding feature 1630 may extend and / or be adjacent to two offset surfaces. For example, with respect to the housing member 1620, the two offset surfaces include the end surface 1628 and an additional end surface 1629. The protruding feature 1630 may extend a first distance from the end surface 1628, and a second (greater) distance from the additional end surface 1629. Similar structures may be used on the housing member 1625 (e.g., a protruding feature 1636 that extends a first distance from the end surface 1638 and a second (greater) distance from the additional end surface 1634). Thus, as Figure 16DAs shown, the end surfaces 1628, 1638 may be closer together than the additional end surfaces 1629, 1634 (and the ends of the protruding features 1630, 1636 may be the closest parts of the housing members 1620, 1625 together). In addition to the mechanical interlock between the engaging element 1632 and the protruding features 1630, 1636 (and any other retaining structures and / or interlocking features), the moldable material of the engaging element 1632 may form a chemical bond or other adhesive joint with the materials of the housing members 1620, 1625.

[0383] The outer surfaces of the engaging element 1632 and the housing members 1620, 1625 may define a smooth and continuous outer surface 1623 of the housing. For example, any gaps, seams, or other interruptions located between the engaging element 1632 and the housing members 1620, 1625 along the outer surface 1623 of the housing may be undetectable by touch and / or the naked eye. For example, sliding a fingernail along the outer surface 1623 may not catch on the seam between the engaging element 1632 and the housing members 1620, 1625. In some cases, any gaps, seams, or other interruptions between the engaging element 1632 and the housing members 1620, 1625 may be less than about 200 microns, less than about 100 microns, less than about 50 microns, less than about 20 microns, or less than about 10 microns (in terms of depth, length, offset, and / or other dimensions). The interlock between the engaging element 1632 and the housing members 1620, 1625 may help prevent or inhibit relative movement between the housing members 1620, 1625 and the engaging element 1632, such as relative movement of these components in the vertical direction (as Figure 16D oriented). Thus, the protruding features 1630, 1636 may help maintain a substantially seamless texture and appearance between the engaging element 1632 and the housing members 1620, 1625.

[0384] In some cases, different types of structures may be used to enhance or otherwise increase the strength and / or structural integrity of the coupling between the housing member and the engaging element. For example, Figure 16E An exemplary cross-sectional view of a housing is shown that includes an engaging element 1643 and a first housing member 1640 that defines a protruding feature 1644 (as Figures 16C to 16D shown) and a second housing member 1645 that defines a recess 1649 (as Figures 16A to 16BThe second housing member 1641 (as shown). The use of the protruding feature 1644 and the recess 1649 can help increase the average or overall distance between the closest parts of the first housing member 1640 and the second housing member 1641. Specifically, since one or both of the housing members 1640, 1641 can be used as a radiating component of the antenna system, it may be desirable to increase the distance between the housing members to reduce capacitive coupling or other electromagnetic effects caused by the proximity of the two conductive components. By positioning the recess opposite the protrusion, the structural benefits of the protrusion (and the recess) can be achieved while also providing a greater distance between the closest surfaces of the housing members 1640, 1641 (e.g., compared to a configuration with two protruding features).

[0385] Figure 17A An exemplary arrangement of cameras in the rear sensor array of the device 1700 is shown. Figure 17A May correspond to a corner of the device (e.g., device 100, 200), where the cover and the display (and optionally other components) are removed to show the arrangement of the cameras. The device 1700 may include a first camera module 1702 (which may be an implementation of the first camera 138 in Figure 1B and / or the first camera 261 in Figure 2 or otherwise correspond to the first camera) and a second camera module 1704 (which may be an implementation of the second camera 139 in Figure 1B and / or the second camera 262 in Figure 2 or otherwise correspond to the second camera). The first camera module 1702 and the second camera module 1704 may include camera housings. Figure 17A Any camera shown (or elsewhere in this document) may include an image stabilization system that helps maintain a clear image (e.g., reduces the impact of camera shake on the image) by sensing the movement of the device and moving one or more components of the camera in a way that at least partially compensates for (and / or counteracts) the movement of the device.

[0386] Device 1700 may also include a bracket member 1706 (also referred to herein as a camera carriage), to which the first camera module 1702 and the second camera module 1704 may be coupled. The bracket member (or camera bracket) 1706 may define a first corresponding camera portion 1780 and a second corresponding camera portion 1781 or receivers, to which the first corresponding camera module and the second corresponding camera module may be coupled. The first camera portion 1780 and the second camera portion 1781 may be positioned along a diagonal path defined from a first corner region to a second corner region of the rearward sensor array. Each camera portion may define an opening for an optical component (e.g., a lens) of its corresponding camera module. The camera portion (e.g., the receiver) may be defined by a flange or a sidewall that at least partially surrounds the camera module. The bracket member 1706 may be configured to fix the relative positions of the camera module and the depth sensor module.

[0387] In modern consumer electronic devices such as mobile phones, internal space is very precious, and a space-saving component arrangement can have a significant positive impact on various aspects of the device. For example, a space-saving or compact component arrangement can free up internal space, which can be used to increase the size and capacity of the battery, or can be used to make the device smaller, thinner, and / or lighter. Figure 17A An exemplary configuration of a camera module that reduces the overall footprint of the camera module in the system is shown. Specifically, the first camera module 1702 (e.g., the camera housing of the first camera module) defines a recess 1708 at a corner of the module. For example, instead of a convex corner, one of the corners of the first camera module 1702 is a concave shape (e.g., the recess 1708). This configuration allows a corner of the second camera module 1704 (e.g., a corner of the housing of the second camera module) to extend into the recess 1708, thereby allowing the first camera module 1702 and the second camera module 1704 to be positioned closer together than would be possible if the first camera module 1702 had conventional convex corners.

[0388] In some cases, the first camera module 1702 may have a generally quadrilateral shape with three convex corners and one concave corner. In some cases, the first camera module 1702 has a parallelogram shape with three convex corners and one concave corner.

[0389] Figure 17AA first camera module 1702 defining a concave corner and a portion (e.g., a convex corner of the second camera module 1704) of a second camera module 1704 positioned within the concave corner of the first camera module 1702 are shown. In other specific implementations, the second camera module 1704 may define a concave corner and a convex corner of the first camera module 1702 may be positioned within the concave corner of the first camera module. In some cases, portions of other components or structures of the electronic device are positioned within the concave corner of the camera module, such as fasteners, mounting posts, batteries, housing members, circuit boards, etc. The device 1700 may also include a frame member 1710 to which a bracket member 1706 may be attached. The frame member 1710 may define a wall structure 1731( Figure 17D ), which in turn defines a container region 1723( Figure 17D ). As described herein, one or more cameras (which may be mounted to the bracket member 1706) may be positioned within the container region 1723.

[0390] Figure 17B The first camera module 1702, the second camera module 1704, and the bracket member 1706 removed from the device 1700 are shown. The bracket member 1706 may be a structural component that defines the positions of the first camera module 1702 and the second camera module 1704 relative to each other. The bracket member 1706 may serve as a rigid structure to prevent or inhibit the first camera module 1702 and the second camera module 1704 from moving, twisting, or shifting relative to each other during use or misuse of the device 1700. Thus, the bracket member 1706 may have a structural configuration that contributes to the rigidity, stiffness, and / or strength of the bracket member 1706. For example, the bracket member 1706 may define a web portion 1716 (or web 1716) and an outer wall 1714 (also referred to as a rigid wall) along one side of the first camera portion 1780 and along one side of the second camera portion 1781. As Figure 17C shown, the web 1716 is similar to a plate having a thickness, and the rigid wall 1714 extends from the web 1716 along at least one side of the web 1716. Thus, the rigid wall 1714 defines a T-shaped flange extending from opposite sides of the web 1716. This configuration increases the area moment of inertia of the bracket member 1706, thereby increasing its resistance to torsion, bending, flexure, or other deflections or deformations. The web 1716 may also define a hole 1713 through which mounting posts and / or fasteners may extend to more generally secure components (including the optional bracket member 1706 itself) to the frame member 1710 and / or the device.

[0391] The web 1716 and the rigid wall 1714 may define a recessed area of the support member 1706. In some cases, one or more device components may be positioned in the recessed area defined by these features. For example, a flexible circuit element 1711 that conductively couples the first camera module 1702 to another component (e.g., a logic board, a processor, etc.) Figure 17A ) may be positioned in the recessed area. In such cases, the recessed area, and more specifically the rigid wall 1714, may protect the flexible circuit element 1711.

[0392] Figure 17C The opposite sides of the support member 1706 and the first camera module 1702 and the second camera module 1704 are shown. As shown, the first lens 1718 of the first camera module 1702 and the second lens 1720 of the second camera module 1704 may extend through the support member 1706 and beyond the bottom surface 1721 of the support member 1706. The lenses 1718, 1720 may extend into corresponding openings in the frame member 1710 and may be positioned adjacent to the camera covers of the device 1700 (e.g., camera covers 263, 264, Figure 2 ). The first lens 1718 may have a first field of view, and the second lens 1720 may have a second field of view different from the first field of view.

[0393] Figure 17D The frame member 1710 fixed to the housing of the device 1700 is shown, with the support member 1706 and the first camera module 1702 and the second camera module 1704 removed. The frame member 1710 may define openings 1724 and 1728 into which the lenses of the first camera module 1702 and the second camera module 1704 may extend. The openings 1724, 1728 may be aligned with camera covers such as Figure 2 covers 263, 264 therein. The frame member 1710 may define mounting posts 1729. The mounting posts 1729 may extend through openings in the support member 1706 and may receive fasteners (e.g., a cover plate or cover extending over the camera module, the support member 1706, etc.) that secure one or more components to the frame member 1710.

[0394] The frame member 1710 also defines a wall structure 1731 that extends around all or at least a portion of the outer perimeter of the frame member 1710 (and at least partially around the perimeter of the support member 1706 when the support member 1706 is positioned within the container region 1723). Biasing springs 1730, 1732 may be coupled to the wall structure 1731 to provide a biasing force on the support member 1706 and to help hold the support member 1706 (and thus the first camera module 1702 and the second camera module 1704) in a target position. For example, the first biasing spring 1730 may apply a biasing force on the support member 1706 that tends to push the support member 1706 in the positive y direction (e.g., toward the top of the device), while the second biasing spring 1732 may apply a biasing force that tends to push the support member 1706 in the positive x direction (e.g., toward the lateral side of the device). These biasing forces may ultimately force the support member 1706 against the wall structure 1731 and help hold the support member 1706 in that position during use (or misuse) of the device. Additionally, the biasing springs 1730, 1732 may provide compliance to the support member 1706 such that an impact force or other force acting on the device may cause the support member 1706 to be forced against the biasing springs 1730, 1732. Because the biasing springs 1730, 1732 are flexible and / or compliant, they can absorb some energy and allow the support member 1706 to move slightly rather than the support member 1706 itself absorbing all of the shock and / or energy, etc. that could damage the camera module and cause misalignment of the camera module and / or the support member 1706.

[0395] Figure 17E and Figure 17F A detailed view of the frame member 1710 and the biasing spring 1730 is shown, corresponding to Figure 17D region 17E - 17E in. The biasing spring 1730 may include a beam member that defines an attachment region 1735, where the beam is attached to the wall structure 1731 (e.g., via welding, adhesives, fasteners, rivets, thermal rivets, brazing, soldering, etc.). The beam may also define a compliant portion 1734 that extends from the attachment region 1735 and that may be curved, and a contact region 1736 that extends from the compliant portion 1734. The contact region 1736 may contact the support member 1706 and may apply the biasing force generated by the biasing spring 1730 to the support member 1706.

[0396] When the support member 1706 is positioned within the frame member 1710, the compliant portion 1734 may deflect and / or deform (e.g., toward the wall structure 1731). The compliant portion 1734 may have a curvature that is generally convex toward the wall structure 1731. The convex curvature of the compliant portion 1734 may provide a dynamic pivot position along the compliant portion 1734. For example, as Figure 17EAs shown, when the bracket member 1706 is not yet installed, the fulcrum position 1737 of the compliance portion 1734 (e.g., the position where the compliance portion 1734 contacts and / or bends against the wall structure 1731) is close to the attachment region 1735. As Figure 17F shown, when the bracket member is installed, the fulcrum position 1739 is further towards the distal end of the biasing spring 1730 (e.g., towards the contact region 1736). If the bracket member 1706 is forced towards the wall structure 1731 (e.g., due to the device dropping onto a hard surface), the compliance portion 1734 can deflect further towards the wall structure 1731, causing the fulcrum position to move even further outwards towards the distal end of the biasing spring 1730. The dynamic fulcrum position can also correspond to different or varying spring rates of the biasing spring 1730. For example, as the fulcrum position moves outwards, the spring rate of the biasing spring can increase or otherwise change according to the deflection, resulting in a greater resistance to further deformation or deflection. In some cases, although the fulcrum position moves, the spring rate can also remain substantially constant. In some cases, the spring rate can vary in a non-linear manner as the fulcrum position moves outwards. Specific spring rates and / or spring rate variations (e.g., caused by the dynamic fulcrum position) can be selected to produce a desired force or movement curve for the bracket member 1706.

[0397] Although Figures 17D to 17F the biasing springs are shown as each having two compliance portions, other examples can have only a single compliance portion (e.g., the biasing spring can have one "wing" instead of two "wings" as shown). Additionally, although Figures 17E to 17F the biasing spring 1730 is described, the discussion equally applies to the biasing spring 1732. The biasing springs 1730, 1732 can be formed from any suitable material, such as metals (e.g., aluminum, steel, titanium), polymers, fiber-reinforced polymers (e.g., carbon fiber), and / or composite materials. The biasing springs 1730, 1732 can be a single monolithic member (e.g., a one-piece piece of metal), or they can be formed from multiple components.

[0398] Figure 17G An exemplary arrangement of several components within the device 1700 is shown, including several shields positioned above the components of the device 1700. For example, the camera shield 1748 can be positioned above the first camera module 1702 and the second camera module 1704 of the device 1700. In examples where the device includes more or fewer cameras, the same or similar camera shield 1748 can be used. Figure 17G Also shown is a logic board shield 1749 positioned above at least a portion of the main logic board 1750. Figure 17GAlso shown is a speaker module 1760, which can be an implementation of speaker module 250, 350, or any other speaker module described herein. The speaker module 1760 can include a shield that at least partially covers the speaker module 1760.

[0399] The shield can be formed of metal, plastic, carbon fiber, or any other material. The shield can be configured to protect the underlying components from physical damage due to contact with other components (e.g., the top module), as well as provide electromagnetic shielding between the components. The shield can be attached to the device in various ways. In some cases, for example, the shield can be attached to the device via fasteners such as screws or bolts.

[0400] Figure 17H Shown along Figure 17G is a partial cross-sectional view of the device 1700 taken along line 17H-17H, showing an exemplary configuration of the camera shield 1748. As described above, the shield can act as a physical barrier between components of the device. For example, the camera shield 1748 acts as a barrier between the camera module and the top module, and can help prevent the camera and the top module from contacting each other and potentially being damaged during a drop, impact, or other forceful event. Some shields can be designed to have physical compliance or flexibility to help dissipate or reduce the energy from an impact. Figure 17H Shown is an exemplary configuration for securing the camera shield 1748 to the device while also providing physical compliance to the camera shield 1748. The camera shield 1748 can have a wrapped section such that the camera shield 1748 has two layers. More specifically, the camera shield 1748 can define a top portion 1775, a loop portion 1763, and a lower portion 1774. The top portion 1775 can define a clearance hole 1762 to provide a passage for a fastener 1766 (e.g., a screw, bolt, etc.) to pass through to reach a fastening hole 1765 defined as passing through the lower portion 1774. The fastener 1766 can capture a portion of the lower portion 1774 between the flange of the fastener 1766 and the top surface of the mounting post 1767 to secure the camera shield 1748 to the device. The mounting post 1767 can be attached to a substrate 1764, which can be a frame, substrate, plate, or other structure of the device.

[0401] The multi-stage configuration of the camera shield 1748 (more specifically, the loop portion 1763) can provide physical compliance to the camera shield 1748. For example, the loop portion 1763 can act as a spring or other compliant structure that bends when a force is applied to the top portion 1775 (e.g., by components of the top module), thereby allowing the top portion 1775 to move relative to the lower portion 1774. The bending or flexing of the loop portion 1763 can absorb and / or dissipate the energy associated with an impact, or otherwise reduce the magnitude of the impact load or other forces caused by contact with the camera shield 1748.

[0402] Parameters of the loop portion 1763, such as spring constant, stiffness, etc., can be defined by the material and / or dimensions of the loop portion 1763. For example, the thickness of the loop portion can be selective to provide a specific spring constant to the camera shield 1748. The thickness of the loop portion 1763 can be constant, or it can vary along the length of the loop portion 1763. The thickness of the loop portion 1763 can be the same as or different from the thicknesses of the top portion 1775 and the bottom portion 1774.

[0403] Figure 17I A partial cross-sectional view of the device 1700 observed along Figure 17G the line 17I-17I in Figure 17G is shown, showing an exemplary configuration for mounting the logic board shield 1749 and the speaker module 1760 ( Figure 17I ) to the device. As Figure 21B shown, both the logic board shield 1749 (or the mounting tabs of the logic board itself, such as the tab portion 2108,

[0404] Compliant member 1773 can be attached to mounting tab 1776. Compliant member 1773 can be formed of a polymer such as silicone, rubber, etc., and can be compressed or otherwise captured between mounting post 1772 and main fastener 1769, thereby applying a corresponding compressive force on mounting tab 1776 to fix and substantially fix speaker module 1760. Compliant member 1773 can help suppress the transmission of vibrations, oscillations, or other physical forces from speaker module 1760 through mounting post 1772 to other components of device 1700. More specifically, speaker module 1760 is configured to output sounds such as music, notification sounds (e.g., ringtones), voice output for a phone call, audio tracks for video or movie, etc. Thus, speaker module 1760 (and more specifically, the diaphragm of speaker module 1760) vibrates to produce sound. These vibrations can be harmful to other components of the device. For example, the vibrations can cause other components such as fasteners, electrical connectors, etc. to loosen and potentially become detached. The vibrations can also contribute to the weakening of adhesive joints or cause unwanted friction between components in the device. Thus, compliant member 1773 can help reduce the impact (e.g., amount, amplitude, frequency, etc.) of vibrations from speaker module 1760 on mounting post 1772 and / or main fastener 1769, and thus reduce the transmission of vibrations to other components of device 1700 (e.g., via tab portion 2108 of the logic board or other mounting tabs to the logic board). The specific properties of the compliant member such as durometer value, vibration damping characteristics, etc. can be selected based on parameters of the expected vibrations from speaker module 1760 (e.g., amplitude and / or frequency of the expected vibrations).

[0405] As Figure 17I shown, both speaker module 1760 and logic board shield 1749 can be fixed to the device using a single fastening assembly. Main fastener 1769 can define a threaded post portion 1771 that threads into mounting post 1772, and a threaded hole portion 1770 into which threaded fastener 1768 (e.g., screw, bolt, etc.) threads. Logic board cover 1749 can be captured between fastener 1768 and main fastener 1769. As described above, compliant member 1773 can help suppress the transmission of vibrations from speaker module 1760 to logic board shield 1749.

[0406] Return Figure 17A, device 1700 may include a barrier wall 1740 (or wall 1740) positioned between the battery 1741 of device 1700 and the cameras (including the first camera module 1702 and the second camera module 1704). The wall 1740 may be configured to prevent or inhibit any potential movement of the battery 1741 from damaging the cameras and / or the flexible circuit elements that connect the cameras to other circuits of the device. The wall 1740 may be formed of metal, polymer, carbon fiber, etc., and may be attached to the housing member or other components of device 1700 (e.g., via adhesives, welding, fasteners, etc.). In some cases, portions of the flexible circuit elements 1711 and 1745 are routed between the wall 1740 and the cameras. These portions of the flexible circuit elements 1711 and 1745 may be coupled to a connector 1746, which may be physically and electrically coupled to a corresponding connector on another component of device 1700 (such as the main logic board, e...

Claims

1. A portable electronic device, comprising: A touch-sensitive display; A housing that at least partially encloses the touch-sensitive display, the housing defining: A shared audio port defined by a first through-hole along one side of the housing; And A second through-hole along the one side of the housing; And An acoustic module positioned within the housing and comprising: An audio housing that defines: A first channel; A second channel that is fluidly isolated from the first channel within the audio housing, the second channel being longer than the first channel; A third channel that is fluidly isolated from the first channel and the second channel within the audio housing; and A mounting surface that defines: A first opening of the first channel; A second opening of the second channel; A third opening of the third channel, the mounting surface being sealed against the inner surface of the housing such that the first channel and the second channel lead to the first through-hole, and the third channel leads to the second through-hole; A microphone that is operatively coupled to the first through-hole through the first channel; A pressure sensor that is operatively coupled to the first through-hole through the second channel; An air pressure ventilation system that is operatively coupled to the second through-hole through the third channel and is configured to equalize the internal pressure within the housing with the external pressure outside the housing; and An acoustic mesh positioned at the second opening of the second channel.

2. The portable electronic device according to claim 1, wherein: The acoustic module comprises: A first gasket having first acoustic holes and first pressure holes; and A second gasket having second acoustic holes and second pressure holes; The acoustic mesh is positioned between the first gasket and the second gasket; and The acoustic mesh covers the first pressure holes and the second pressure holes.

3. The portable electronic device according to claim 1, wherein, The acoustic mesh comprises a polymer mesh that is breathable.

4. The portable electronic device according to claim 1, wherein, The acoustic mesh has an acoustic impedance between 100 Rayl and 700 Rayl.

5. The portable electronic device according to claim 1, wherein, The acoustic mesh has a thickness between 40 microns and 100 microns.

6. The portable electronic device according to claim 1, wherein, The acoustic mesh does not cover the first opening of the first channel.

7. A mobile phone, comprising: A housing that defines a microphone port, an exhaust port, and a speaker port along a side surface of the housing and a receiver port along a front surface of the housing; A display positioned within the housing; And An internal module positioned within the housing and comprising: A housing that defines a mounting surface, the mounting surface defining a first opening, a second opening, and a third opening; A microphone positioned within the housing and operatively coupled to the microphone port through a first channel that extends from the first opening in the mounting surface to the microphone; A pressure sensor, the pressure sensor being positioned within the housing and being operatively coupled to the microphone port via a second channel that extends from a second opening in the mounting surface to the pressure sensor, the second channel being fluidly isolated from the first channel within the internal module; An air pressure ventilation system configured to equalize an internal pressure within the housing with an external pressure outside the housing and being operatively coupled to the exhaust port via a third channel that is fluidly isolated from the first channel and the second channel within the internal module, the third channel extending from a third opening in the mounting surface to the air pressure ventilation system; and An acoustic mesh that covers the second opening of the second channel and is configured to reduce acoustic interference between the first channel and the second channel.

8. The mobile phone according to claim 7, wherein: The internal module includes a gasket positioned between an inner surface of the housing and the housing.

9. The mobile phone according to claim 8, wherein: The gasket is a first gasket of a pair of gaskets; and The acoustic mesh is positioned between the pair of gaskets.

10. The mobile phone according to claim 8, wherein: The housing defines a recess in the mounting surface; The gasket is at least partially positioned within the recess; and The acoustic mesh is positioned between the gasket and the housing.

11. The mobile phone according to claim 8, wherein: The gasket defines a first hole positioned at a first opening in the mounting surface and a second hole positioned at a second opening in the mounting surface; and The acoustic mesh covers the second hole and does not cover the first hole.

12. The mobile phone according to claim 7, wherein: The housing defines a charging port configured to receive a charging connector; and The charging port is positioned between the microphone port and the speaker port along a side surface of the housing.

13. An electronic device, comprising: A housing, the housing including: A housing member that defines a set of side surfaces of the electronic device, the housing member defining a first through hole in a side surface of the set of side surfaces and a second through hole in the side surface; and A front cover that defines a front surface of the electronic device; A display positioned below the front cover; and An internal module positioned within the housing, below the display and including: A microphone configured to detect an audio input at the first through hole via a first channel that extends from the microphone to the first through hole; A pressure sensor configured to measure an external pressure at the first through hole via a second channel that extends from the pressure sensor to the first through hole and is fluidly isolated from the first channel within the internal module; A pneumatic ventilation system configured to equalize an internal pressure within the housing with an external pressure at the second through-hole via a third channel, the third channel extending from the pneumatic ventilation system to the second through-hole and being fluidly isolated from the first channel and the second channel within the internal module; and a baffle positioned between an end of the second channel and the first through-hole and separating the first channel from the second channel.

14. The electronic device according to claim 13, wherein, The baffle is formed of a breathable and waterproof diaphragm.

15. The electronic device according to claim 13, wherein: the baffle is formed of a breathable polymer mesh; and the breathable polymer mesh has a thickness between 40 micrometers and 100 micrometers.

16. The electronic device according to claim 13, wherein, The baffle has an acoustic impedance between 150 Rayl and 300 Rayl.

17. The electronic device according to claim 13, wherein: the first through-hole is a first audio port; the housing defines a second audio port in the side surface; and the electronic device includes a speaker module operatively coupled to the second audio port.

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