Component temperature in detection systems

Abstract

A method is provided for detecting the temperature of a component in a support system for semiconductor processing equipment. The method includes: applying an RFID tag to the component, the RFID tag having a serial number; reading the RFID tag with a reader arranged to read the serial number of the RFID tag and identify the resonant frequency of the RFID tag; and converting the resonant frequency of the RFID tag into the temperature of the RFID tag.

Description

Technical Field

[0001] The present invention relates to a method for detecting the temperature of components of a support system for a process pipeline of a semiconductor processing equipment, a reader for detecting the temperature of components of a support system for a semiconductor processing equipment, a radio frequency identification tag for detecting the temperature of components of a support system for a semiconductor processing equipment, one or more programs, and a machine-readable storage medium. Background Technology

[0002] Piping to and from semiconductor equipment used in various processes and applications can accumulate deposits, which can adversely affect pipeline operation. Such semiconductor equipment can include semiconductor manufacturing equipment. Deposits may accumulate due to condensation at cold spots. Monitoring the temperature at multiple points along the pipeline can help identify cold spots or whether the fluid temperature in the pipeline has dropped below optimal levels, minimizing the formation of condensates or deposits.

[0003] Furthermore, when heating pipelines, for example, to prevent condensation inside, it is important to ensure that the pipeline does not become too hot, exceeding the safe operating temperature of the pipeline contents, pipeline materials, heating elements, and any insulation. Monitoring the temperature at multiple points along the pipeline can help identify hot spots, which may be caused by heater malfunctions or exothermic reactions within the pipeline. Such hot spots can lead to equipment failure. Identification of hot spots can be used to initiate remedial measures, such as shutting down the heater, shutting down the process, or activating quenching.

[0004] Similarly, vacuum pumps and abatement systems used in semiconductor processing equipment can be part of integrated systems used in semiconductor manufacturing. Such systems require power distribution systems to deliver typically high-voltage electricity to the various modules within the system. These integrated systems are becoming increasingly complex and smaller, with increasingly limited access for repair and maintenance activities. Consequently, complex and integrated high-voltage electrical components occupy less space and are migrating to system areas with very limited maintenance access. Faults in the power distribution system can cause costly downtime in the devices it powers, such as semiconductor processing equipment. Early signs of such electrical system failures can be identified by detecting elevated temperatures in components of the power distribution system.

[0005] Typically, electronic temperature sensors are used to monitor the temperature of components such as process pipelines in semiconductor equipment. This can include thermocouples connected to appropriate sensing circuitry. However, each such thermocouple is a relatively expensive device. Furthermore, each thermocouple requires additional wiring and control circuitry, increasing installation costs due to its complexity. These factors make such electrical temperature sensors unsuitable for large-scale deployment. Additionally, the application of insulating and / or heating sheaths to pipelines can interfere with sensor deployment and wiring. In power distribution systems, such wiring must be well insulated and protected from high-voltage components.

[0006] Alternative electronic temperature sensors can be any of the following: thermistors, resistance temperature detectors (RTDs), and infrared sensors. While some of these may be cheaper than thermocouples, they still require additional costs for cumbersome wiring and / or communication circuitry.

[0007] Mechanical switching indicators, such as thermostats or capillary probes, can also be used to detect temperature. However, these typically provide only low-resolution readings and present additional challenges in monitoring and relaying to monitoring devices.

[0008] An improved arrangement is needed for measuring the component temperatures of support systems used in semiconductor processing equipment, such as process pipelines and power distribution systems. Summary of the Invention

[0009] It has been found that radio frequency identification (RFID) tags have a temperature-dependent resonant frequency response. This paper describes a low-cost method for detecting the temperature of components such as pipelines by applying RFID tags along the length of the pipeline itself. A reader with resonant frequency detection capability is able to scan the component and determine the temperature of the RFID tag attached to it. This provides a low-cost way to monitor multiple components within a system, each of which is attached with an RFID tag.

[0010] A method is provided for detecting the temperature of a component in a support system for semiconductor processing equipment, the method comprising: applying an RFID tag having a serial number to a pipeline; reading the RFID tag with a reader arranged to read the serial number of the RFID tag and identify the resonant frequency of the RFID tag; and converting the resonant frequency of the RFID tag into the temperature of the RFID tag.

[0011] Components of a support system for semiconductor processing equipment may include process pipelines for the semiconductor processing equipment. Components of a support system for semiconductor processing equipment may also include a power distribution system for distributing power.

[0012] A method for detecting the temperature of a semiconductor equipment process pipeline is also provided, the method comprising: applying an RFID tag having a serial number to the process pipeline; reading the RFID tag with a reader arranged to read the serial number of the RFID tag and identify the resonant frequency of the RFID tag; and converting the resonant frequency of the RFID tag into the temperature of the RFID tag.

[0013] A method for detecting the temperature of components in a power distribution system is also provided. The system includes a busbar and a plurality of electrical modules connected to the busbar. The method includes: applying an RFID tag to the component, the RFID tag having a serial number; reading the RFID tag with a reader, the reader being arranged to read the serial number of the RFID tag and identify the resonant frequency of the RFID tag; and converting the resonant frequency of the RFID tag into the temperature of the RFID tag.

[0014] In some implementations, a number of RFID tags will be installed. Accordingly, the method may also include: recording the serial number and installation location of the RFID tag in a database when the RFID tag is applied to the component; and determining the location of the temperature reading by looking up the serial number of the RFID tag in the database when a temperature reading is subsequently obtained.

[0015] Also provided is a reader for detecting the temperature of components in a support system of semiconductor processing equipment, the reader comprising: a transmitter, a receiver, and a processor. The transmitter is arranged to transmit a signal to an RFID tag attached to a process pipeline, the RFID tag having a serial number. The receiver is arranged to receive the serial number of the RFID tag. The reader is also arranged to identify the resonant frequency of the RFID tag. The processor is arranged to convert the resonant frequency of the RFID tag into the temperature of the RFID tag.

[0016] The reader may include a long readout antenna arranged along the length of the component. The long readout antenna may be connected to at least one of the transmitter and the receiver.

[0017] The process pipeline and RFID tag are in thermodynamic equilibrium, which allows the temperature of the component to be determined to be the same as the temperature of the RFID tag.

[0018] Identifying the resonant frequency of an RFID tag can involve transmitting a series of signals at different frequencies to the RFID tag and determining the signal strength of the signal received from the RFID chip for each different frequency signal. This is preferred for passive RFID tags.

[0019] Identifying the resonant frequency of an RFID tag can include detecting the frequency of the signal received from the RFID chip. This is preferred for battery-powered RFID tags (such as active RFID tags) and battery-assisted passive RFID tags.

[0020] Also provided is a radio frequency identification (RFID) tag for detecting the temperature of a component in a support system for semiconductor processing equipment. The RFID tag includes: an antenna arranged to be in thermal communication with the component; a housing; an electrical insulating pad that separates the antenna from the component; and electrical components electrically connected to the antenna and arranged away from the component.

[0021] Also provided is an RFID tag for detecting the temperature of a process pipeline in a semiconductor device, the RFID tag comprising: an antenna arranged to exchange heat with the process pipeline; an electrically insulating pad that isolates the antenna from the process pipeline; and electrical components electrically connected to the antenna and arranged away from the process pipeline.

[0022] Also provided is an RFID tag for detecting the temperature of components in a power distribution system, the RFID tag comprising: an antenna arranged to exchange heat with the component; an electrically insulating pad that isolates the antenna from the component; and an electrical component electrically connected to the antenna and arranged away from the component.

[0023] The antenna, electrical insulating pad, and electrical components can be housed within a housing. The housing can be a polyimide housing. The electrical insulating pad can be a thermally conductive electrical insulator. The electrical insulating pad provides good thermal conductivity between the component and the electrical parts of the RFID tag.

[0024] Electrical components can be isolated from the antenna via communication wires. These electrical components can be located within the tail of the RFID tag.

[0025] Insulating pads can be electrically insulating and thermally conductive. Such pads can be formed from epoxy resin or silicone rubber filled with boron nitride or aluminum nitride. For example, aluminum nitride has a thermal conductivity as high as 285 W / mK, but it is a semiconductor. This is much better than well-known metallic thermal conductors such as copper, which has a thermal conductivity of 385 W / mK.

[0026] RFID tags can be embedded in heating pads used for pipelines, which are arranged to be fixed to exhaust pipelines. The heating pad can be an electrically insulating pad. The electrically insulating pad can be part of the heating pad, which contains a heating element. The heating element may include a heating wire. Antennas and electrical components can be housed in a housing. The housing may be a polyimide housing.

[0027] RFID tags may also include adhesive pads for attaching insulating pads to components. These pads may include thermal tape. For example, 3M® 8810 thermally conductive tape is designed to provide a preferred heat transfer path between heat-generating components and the parts attached to them.

[0028] Radio frequency identification (RFID) tags can be one of the following: passive tags, active tags, or battery-assisted passive tags.

[0029] Radio frequency identification (RFID) tags may include memory for storing serial numbers, which are emitted by the RFID tag when it is queried.

[0030] When installing RFID tags, record the tag's serial number and installation location so that the location of the temperature reading can be determined when a temperature reading is subsequently obtained.

[0031] Electrically insulating pads can be electrical insulators that provide good thermal conductivity between components and the antenna of an RFID tag. RFID tags may also include thermal insulation layers that separate the electrical components of the RFID tag from the antenna, electrical insulating pads, and components.

[0032] One or more programs are also provided, which are arranged such that, when executed by a computer system or one or more processors, the one or more programs cause the computer system or one or more processors to operate in accordance with the methods described herein.

[0033] A machine-readable storage medium is also provided, which stores the program described herein or at least one of the plurality of programs. Attached Figure Description

[0034] Figure 1 An example component for which the temperature is to be determined is shown;

[0035] Figure 2A , 2B 2C shows an RFID tag used to detect component temperature;

[0036] Figure 3A , 3B The 3C example illustrates the different applications of RFID tags as described in this article;

[0037] Figure 4 A method for detecting component temperature is shown;

[0038] Figure 5 A reader for detecting component temperature is shown;

[0039] Figure 6 This is a schematic diagram of a power distribution system (not to scale), including a temperature detection arrangement as described herein; and

[0040] Figure 7 This is a schematic diagram (not to scale) showing a detailed view of a busbar incorporating multiple RFID tags as described herein.

[0041] All accompanying drawings are for illustrative purposes only and are not drawn to scale. Detailed Implementation

[0042] An RFID tag comprises at least two parts: an integrated circuit for storing and processing information and modulating radio frequency (RF) signals; and an antenna for receiving and transmitting signals. Tag information is stored in non-volatile memory, which is part of the integrated circuit. The reader transmits coded radio signals to query the tag. The RFID tag receives the message and then responds with its unique serial number. Because tags have individual serial numbers, RFID system designs can distinguish and read multiple tags that may be within the range of the RFID reader's antenna simultaneously.

[0043] Radio frequency identification (RFID) tags include an integrated circuit electrically connected to an antenna. This integrated circuit includes a memory component for storing information such as a serial number, and communication circuitry for transmitting and receiving radio signals.

[0044] Radio frequency identification (RFID) tags are powered in different ways. Passive tags include devices that harvest DC power from the incident reader signal to power both the RFID tag and its transmission. Active tags include power supply devices, typically onboard batteries, and periodically transmit their ID signals. Battery-assisted passive tags have a smaller onboard battery but activate the RFID tag when an interrogation signal is received from an RFID reader. Batteries and chips are the electrical components of RFID tags, collectively referred to herein as electrical parts. These electrical parts are those other than the antenna.

[0045] The information stored in RFID tags is typically a unique serial number, which is transmitted by the RFID tag when it is questioned. The serial number is stored in the memory of the chip.

[0046] Figure 1 An example component for determining its temperature is shown. In this example, the component is a process line 110 that carries hot gas from left to right. Such a line is an example of a component used in a support system for semiconductor processing equipment. The hot gas includes vapor that produces condensate deposits 115 in the line 110. In the example shown, condensate pools 115 tend to appear after the second bend in the line 110. Such a line can deliver supply gas to the semiconductor processing equipment or carry used gas away from the semiconductor processing equipment. Such exhaust gases can be treated by an emission reduction system. In this context, "semiconductor processing equipment" refers to equipment suitable for processing semiconductor materials (such as wafers) to produce semiconductor devices (such as transistors, memory, or processors). Another example of a component used in a support system for semiconductor processing equipment is a busbar in a power distribution system.

[0047] Figure 2AAn RFID tag 200 for detecting the temperature of component 210 is shown. Component 210 may be a conduit. Component 210 may be a bus interconnect. RFID tag 200 includes an antenna 220, a polyimide housing 230, and an insulating pad 240. The insulating pad 240 separates the antenna 220 from component 210.

[0048] Antenna 220 is part of the electronic layer of the RFID tag. The electronic layer includes the integrated circuit of the RFID tag. This integrated circuit is not shown separately in Figure 2.

[0049] Figure 2A Additionally, an adhesive pad 250 is shown for attaching the insulating pad 240 to the component 210. The adhesive pad 250 is a thermal adhesive tape, an example being 3M® 8810 thermally conductive transfer tape. This tape is designed to provide a preferred heat transfer path between the heat-generating component and a heat sink or other cooling device, such as a fan, heat sink fin, or heat pipe. The adhesive pad 250 is optional, as the RFID tag 200 can be held in place by other means such as a belt, or it can be incorporated into another part of the component, such as an insulating sleeve. For example, the RFID tag can be embedded in a heating pad arranged to be attached to the component 210.

[0050] The insulating pad 240 is an electrical insulator that improves the operation of the antenna 220 and provides good thermal conductivity between the component 210 and the antenna 220 in the electronic layer of the RFID tag.

[0051] The insulating pad 240 is an electrically insulating and thermally conductive pad. The insulating pad 240 increases the spacing between the antenna 220 and the component 210. In some embodiments, the component 210 is made of metal and is therefore conductive. One advantage of the insulating pad 240 is that it improves the radio frequency operation of the antenna 220 when the RFID tag 200 is mounted to the metal component 210.

[0052] Insulating pad 240 is formed of silicone rubber with zinc oxide filler to increase thermal conductivity. Alternatively, insulating pad 240 comprises an epoxy resin filled with boron nitride or aluminum nitride. For example, aluminum nitride has a thermal conductivity up to 285 W / mK, but it is a semiconductor. This is superior to well-known metallic thermal conductors, such as copper with a thermal conductivity of 385 W / mK.

[0053] Figure 2BAn alternative arrangement of the RFID tag 202 for detecting the temperature of component 210 is shown. The RFID tag 202 includes an electrically insulating pad 240, an antenna 222, a thermal insulation pad 260, a connecting wire 270, and an electrical component 224. The antenna 222 and the electrical component 224 are electrically connected via the connecting wire 270. The RFID tag 202 includes a spaced-out antenna and electrical component, such that the antenna exchanges heat with component 210 while the electrical component 224 is thermally isolated from both the antenna 222 and component 210. Therefore, during operation, the electrical component 224 of the RFID tag 202 is typically at a lower temperature than component 210. This can improve the operating temperature range and / or lifespan of the RFID tag 202.

[0054] Figure 2C An alternative arrangement of the RFID tag 204 for detecting the temperature of component 210 is shown. The RFID tag 204 includes an electrically insulating pad 240, an antenna 222, a connecting wire 270, and an electrical component 224. The antenna 222 and the electrical component 224, excluding the antenna 222, are electrically connected via the connecting wire 270. The RFID tag 204 includes a spaced-out antenna and electrical component, such that the antenna heat-exchanges with component 210, while the electrical component 224 is spaced from the antenna 222 by the length of the connecting wire 270. The connecting wire 270 and electrical component 224 may be referred to as the tail of the RFID tag 204. The tail allows the electrical component to be spatially isolated from component 210. In use, the electrical component 224 can be exposed to a lower temperature environment, such as ambient air temperature. Therefore, during operation, the electrical component 224 of the RFID tag 204 tends to be at a lower temperature than component 210. This can improve the operating temperature range and / or lifespan of the RFID tag 204.

[0055] Figure 3A Two RFID tags 300 are shown attached to pipeline 310 at different locations. Figure 3B An RFID tag 300 attached to pipeline 310 is shown, with thermal insulation 380 mounted on the RFID tag 300. Preferably, the thermal insulation additionally covers the RFID tag 300 to ensure accurate temperature readings of pipeline 310. Figure 3C An RFID tag 300 is shown as part of a heating sleeve 390, which is attached to a conduit 310, thereby securing the RFID tag 300 to the conduit 310. To ensure accurate temperature readings, the heating element within the heating sleeve is preferably not installed between the RFID tag and the conduit 310, or on the top of the RFID tag 300 near the polyimide housing 230 and its electronic layers. The conduit 310 may be an exhaust line from a semiconductor processing device.

[0056] When the RFID tag 300 is covered by a protective sleeve, indicators such as markings, color blocks, or stickers can be made on the outer surface of the sleeve to make it easier to locate the installed RFID tag after installation.

[0057] Figure 4 A method 400 for detecting component temperature is shown. Method 400 includes S2, applying an RFID tag 420 to the component, the RFID tag having a serial number; S3, reading the RFID tag 430 with a reader, the reader being arranged to read the serial number of the RFID tag and identify the resonant frequency of the RFID tag; and S4, converting the resonant frequency of the RFID tag 440 into the temperature of the RFID tag.

[0058] A lookup table is used to convert the detected resonant frequency to temperature. The lookup table is built for each RFID tag type, allowing the conversion of the detected resonant frequency into a temperature reading. Alternatively, each RFID tag is calibrated before installation to identify the relationship between temperature and resonant frequency for each specific RFID tag. This information is stored in the lookup table along with the RFID tag's serial number. After installation, when the resonant frequency of the RFID tag is determined along with its serial number, the serial number is used to identify the relationship between the resonant frequency and temperature for that specific RFID tag.

[0059] In some implementations, a number of RFID tags will be installed. Accordingly, the method may further include: when an RFID tag is applied to a component, S1, recording the serial number and installation location of the RFID tag in a database; and when a temperature reading is subsequently obtained, S5, determining the location of the temperature reading by looking up the serial number of the RFID tag in the database.

[0060] Figure 5 A reader 500 for detecting component temperature is shown. The reader includes a transmitter 510, a receiver 515, and a processor 520. The transmitter 510 is arranged to transmit a signal to an RFID tag attached to the component, the RFID tag having a serial number. The receiver 515 is arranged to receive the serial number of the RFID tag. The processor 520 is arranged to use the receiver 515 to identify the resonant frequency of the RFID tag. The processor 520 is also arranged to convert the resonant frequency of the RFID tag into the temperature of the RFID tag.

[0061] The reader 500 additionally includes a user interface 540. The user interface 540 allows a user to input commands to the reader 500 and allows the reader 500 to display information to the user. The user interface 540 may be a touchscreen interface. The processor 520 may be arranged to receive commands that, when executed, cause the processor 520 to perform the methods described above. The commands may be stored in memory 525.

[0062] With numerous RFID tags installed, the reader 500 is configured to record the serial number and installation location of each RFID tag in the database 530. When a temperature reading is subsequently obtained, the processor 520 determines the location of that temperature reading by looking up the serial number of the RFID tag in the database 530.

[0063] Generally, the component and the RFID tag are in thermodynamic equilibrium, which allows the temperature of the component to be determined to be the same as the temperature of the RFID tag.

[0064] Identifying the resonant frequency of an RFID tag can involve transmitting a series of signals at different frequencies to the RFID tag and determining the signal strength of the signal received from the RFID chip for each different frequency signal. This is preferred for passive RFID tags.

[0065] Identifying the resonant frequency of an RFID tag can include detecting the frequency of the signal received from the RFID chip. This is preferred for battery-powered RFID tags, such as active RFID tags and battery-assisted passive RFID tags.

[0066] When installing RFID tags, the tag's serial number and installation location are recorded so that the location of the temperature reading can be determined when it is subsequently obtained. This information is preferably stored in a database. The database can be stored in the reader device.

[0067] The reader device can be a handheld device with a built-in transmitter and receiver for interrogating RFID tags. Such a reader device is well-suited for passive RFID tags, which require relatively strong signals to be emitted and a relatively close receiver to detect their emission.

[0068] The reader device can be a centrally located device with multiple external antennas directed to query RFID tags in sub-locations of the facility. For example, a factory floor can be divided into multiple zones, each with its own antenna for querying RFID tags within that zone. The centrally located reader device can then sequentially query each zone to determine temperature readings from multiple RFID tags within it.

[0069] The reader device may include at least one long read-in antenna device connected to at least one of a transmitter and a receiver. The long read-in antenna device may include a read antenna comprising a leaky coaxial cable. This antenna is capable of reading multiple RFID tags along its length. The long read-in antenna device is positioned near one or more RFID tags along the monitored exhaust duct.

[0070] Using an antenna along the length of a single exhaust line allows for isolated readouts at system-specific or line-specific microcircuits. Readouts in this manner enable rapid identification of problem areas. This arrangement also allows for response to thermal events in the processing equipment feeding the exhaust line, ensuring the safety of personnel and equipment during processing.

[0071] One or more programs are also provided, which are arranged such that, when executed by a computer system or one or more processors, the one or more programs cause the computer system or one or more processors to operate in accordance with the methods described herein.

[0072] A machine-readable storage medium is also provided, which stores the program described herein or at least one of the plurality of programs.

[0073] In the above example, temperature measurements were performed on the pipeline. This invention can also be applied to power distribution systems, including but not limited to busbars. A method is also provided for detecting thermal offset in components of power distribution systems for semiconductor processing equipment, vacuum pumps and emission reduction systems, and compressor systems for hydrocarbon processing.

[0074] Figure 6 This is a schematic diagram (not to scale) of a power distribution system 600, including a fault detection arrangement as presented herein. System 600 includes a busbar 610; multiple electrical modules 630; multiple interconnecting elements 640; and multiple RFID tags 660 as described herein.

[0075] Multiple electrical modules 630 are connected to bus 610 via corresponding multiple interconnecting elements 640, wherein bus 610, interconnecting elements 640 and electrical modules 630 include multiple components.

[0076] Busbar 610 receives power from a power source and distributes that power to multiple modules 630. Interconnecting components 640 provide electrical connections between each module 630 and busbar 640. Busbars provide a space-efficient power distribution system for complex electrical equipment and are typically used where compact solutions are required.

[0077] For example, semiconductor manufacturing facilities use vacuum and emission reduction systems to provide vacuum for certain processes, such as etching or deposition. This vacuum is typically maintained at pressures on the order of millibars. Any gases generated during semiconductor processing pass through the emission reduction system. In such a facility, each pump can consume more than one kilowatt (kW) of power, each module 630 may include one or more pumps, and multiple modules 630 (e.g., ten or more) may be connected to bus 610. Thus, bus 610 can be expected to carry tens of kilowatts of power in a relatively small physical space. Bus 610 typically delivers power as three voltage phases and therefore includes at least three electrical conductors, each of which may be a copper rod or cable. The common voltage for three-phase power supply devices is 480 volts.

[0078] Faults in a power distribution system can be detected by elevated operating temperatures in any component of the system. Such components may include interconnect elements 640. Elevated operating temperatures in a component are typically caused by increased resistance. Components may be power semiconductor devices, such as integrated gate bipolar transistors (IGBTs), or screws in a clamping housing that holds two conductors together. Increased resistance may be caused by degradation of the power semiconductor device or loosening of the screw connection in a clamping device, such as connecting two conductors together. In the case of power semiconductor devices, elevated operating temperatures accelerate aging or wear. Similarly, elevated operating temperatures in loose physical connections can cause them to loosen further as the connection undergoes thermal cycling between hot and relatively cold operating and non-operating modes. In either case, elevated operating temperatures in a component indicate a potential future failure of that component.

[0079] Traditional monitoring techniques for power distribution systems use a combination of electrical temperature sensors, such as high-voltage insulated infrared sensors and conventional thermocouples. These sensors are located in designated locations that allow for the measurement of critical components of the power distribution system.

[0080] Thermal monitoring of electrical systems, such as power distribution systems, provides real-time temperature data, enabling operators to maximize load efficiency and balance thermal stresses that could lead to catastrophic failures. Over time, hot spots can form on switchgear contacts, busbars, and critical connection points. These hot spots can slowly erode, causing increased resistance. If left unchecked, even a small increase in resistance can quickly spiral out of control, as higher resistance heats the conductors, which in turn generates even higher resistance.

[0081] For example, the problems with this type of traditional monitoring technology include:

[0082] a. The excessive size of each sensor is detrimental to the compactness of the electrical system and the requirement to reduce space.

[0083] b. Infrared sensors must typically be located approximately 20mm away from the component being measured; they will not function if mounted directly on the component. This often increases the space required for the monitoring technology.

[0084] c. Dust buildup and contamination can affect the calibration of infrared sensors.

[0085] d. Each sensor mounting bracket requires a large amount of space.

[0086] e. Variations in the test materials and surface treatments of the monitored component, such as the same component type from different manufacturing batches, can affect its emissivity and the accuracy of infrared measurements.

[0087] f. Each sensor typically requires individual wiring, leading to excessive wiring space requirements; infrared sensors and thermocouples are electrical sensors and generally require their own electrical wiring. Multiple individual sensors result in significant wiring complexity and control infrastructure.

[0088] g. Electrical sensors require conductive wiring that must be electrically isolated from any high-voltage components, such as busbars. This wiring often needs to be reinforced to ensure safe operation in the high-voltage environment of a power distribution system.

[0089] Large electrical systems often have numerous bolted connections. However, traditional temperature monitoring technologies are limited in the number of connections that can be monitored in real time, primarily due to the aforementioned issues. Because of these limitations, the monitoring provides only limited confidence in the information available to reduce operating costs by enabling extended maintenance intervals and less visual inspection.

[0090] The above problems tend to be solved by, for example Figure 6 The system 600 shown achieves this by applying multiple RFID tags 660. Each RFID tag 660 has a unique serial number and is applied to a component of the power distribution system.

[0091] Figure 7 This is a schematic diagram (not to scale) showing a detailed view of a power distribution system 700, which includes a busbar 710 incorporating multiple RFID tags 760. Interconnecting elements 740 for two modules are shown mounted to the busbar 710. Nine RFID tags 760 are mounted to each set of interconnecting elements 740 at nine measurement points. At each measurement point, the RFID tag 760 is connected to a component of the interconnecting element 740.

[0092] The connection between the RFID tag 760 and components such as the interconnecting element 740 can be provided, for example, by adhesive, tape, cable ties, or mechanical clamps. Depending on practical considerations and limitations, such as available space and component shape, different connections may be used for different components. For example, the mounting solution for each RFID tag 760 cable might be a simple adhesive pad attached directly to the busbar. Typically, each RFID tag 760 is held close to and in contact with the component to be monitored. The above arrangement provides an improved temperature detection arrangement that can be applied to support systems for semiconductor processing equipment.

[0093] For example, one of the significant cost increases associated with heating pipes is the hardware required to obtain temperature indications and the number of acquisition points needed. This paper presents a cost-effective method for detecting temperature by embedding RFID tags in the heater construction or by applying RFID tags along the length of the pipe itself. The heater controller is arranged with a UHF RFID reader that detects a resonant frequency that sweeps across the entire line. The serial number of each RFID tag is then identified, and the corresponding temperature is determined based on the resonant frequency. This provides a cost-effective method for monitoring the entire line, enabling alarm systems to be established for exothermic events, line-length continuity of temperature, and other analyses. By associating setpoints with a range of resonant frequencies, the sweep range can also be narrowed, and the time to obtain all temperatures can be accelerated. For example, each RFID tag can initially be swept at the resonant frequency, with the expected temperature expected at its location. Therefore, the RFID tags described in this paper can be installed in each heater along the line, effectively making each heater a readable temperature point, greatly improving indication, control, and other application-based inputs.

[0094] Compared to traditional technologies, using the described system offers several key advantages:

[0095] a. RFID tags can be directly mounted to components such as busbars and critical connections, thereby maximizing the flexibility of sensor placement and minimizing the space requirements for accommodating sensors and fixtures.

[0096] b. Radio measurements are unaffected by factors other than the temperature of the component being measured (such as the component's surface finish or material).

[0097] c. The exact sensor location can be selected during installation, without being affected by limitations such as the wiring length of electrical sensors.

[0098] d. The space savings of using RFID tags compared to wired sensors allow for the use of far more temperature measurement locations in power distribution systems, and even redundant measurements can be performed using two spatially separated fiber Bragg gratings on different RFID tags, each assigned to measure the temperature of a single critical component.

[0099] e. RFID tags are housed in electrically isolated enclosures, eliminating the need for conductive wiring back to the control unit. RFID tags do not require insulated wires or additional isolation from electrical components, meaning that there are fewer restrictions on sensor placement within the power distribution system compared to sensors with electrical wiring.

[0100] Therefore, the systems and methods described herein offer design flexibility, meaning that thermal monitoring can be performed on many additional components that were previously not considered critical. The aforementioned thermal monitoring systems and methods tend to allow for fundamental changes to the maintenance regime of power distribution systems such as those described herein. Because the temperature of a much larger number of components can be monitored, system operators can ensure that the electrical system is in optimal operating condition, and that any fault will be quickly detected as a temperature rise in a specific component as it begins to develop. This assurance allows system operators to reduce the amount of preventative maintenance and operate the system with longer maintenance intervals. Consequently, the systems and methods described herein reduce downtime and lower costs. Furthermore, the described systems and methods can be implemented with small space requirements, which is important in systems requiring space-efficient power transmission in the form of busbars.

[0101] Vacuum pumps and emission reduction systems for semiconductor processing equipment are also provided, which may include power distribution systems as described herein.

[0102] A compressor system for hydrocarbon processing is also provided, which may include a power distribution system as described herein.

[0103] The RFID tags described herein are designed to operate at temperatures up to 260°C, therefore a polyimide film is used to encapsulate the electronic components. In some embodiments, operation up to 200°C is acceptable, in which case the polyimide housing can be replaced with silicone rubber. In other embodiments, materials other than polyimide and silicone rubber are used for the RFID tag housing. Any electrically insulating material suitable for the expected temperature of the exhaust line and allowing radio frequency to penetrate the housing and reach the RFID tag's antenna can be used.

[0104] Using the characteristics of RFID tags and temperature-related resonant frequency drift is a low-cost method to monitor the temperature of components such as process pipelines or power distribution systems without the need for expensive analytical chips, wires, and sensing devices.

[0105] An apparatus for detecting component temperature, for implementing the above arrangement, and for performing the method steps described herein can be provided by configuring or adapting any suitable device, such as one or more computers or other processing devices or processors, and / or by providing additional modules. This apparatus may include a computer, computer network, or one or more processors for implementing instructions and using data, including instructions and data in the form of computer programs or multiple computer programs stored in or on a machine-readable storage medium such as computer memory, computer disk, ROM, PROM, etc., or any combination of these or other storage media. Additional modules may include a UHF antenna suitable for interrogating RFID tags described herein.

[0106] It should be noted that Figure 4 Some process steps depicted in the flowchart and described above may be omitted, or these process steps may be replaced with those presented above. Figure 4 The order shown differs from the order of execution. Furthermore, although all process steps are depicted as discrete time-sequential steps for convenience and ease of understanding, some process steps can actually be executed simultaneously or at least overlap in time to some extent.

[0107] It should be noted that the above embodiments are illustrative and not limiting of the invention, and those skilled in the art will be able to devise many alternative embodiments without departing from the scope of the appended claims. The word "comprising" does not exclude the presence of elements or steps other than those listed in the claims, and "a" or "an" does not exclude a plurality, and a single processor or other unit may perform the functions of a plurality of units set forth in the claims. Any reference numerals in the claims should not be construed as limiting their scope.

[0108] Explanation of reference numerals in the attached figures

[0109] 110 Process Pipeline

[0110] 115 Sediments

[0111] 200 RFID tags

[0112] 202 RFID tags

[0113] 204 RFID tags

[0114] 210 components

[0115] 220 antenna

[0116] 222 antenna

[0117] 224 Electrical Components

[0118] 230 Polyimide shell

[0119] 240 Electrical Insulation Mat

[0120] 250 rubber pads

[0121] 260 heat insulation pad

[0122] 270 connecting cable

[0123] 300 RFID tags

[0124] 310 pipeline

[0125] 380 Heating Sheath

[0126] 390 Heating Sheath

[0127] 510 transmitter

[0128] 515 receiver

[0129] 520 processor

[0130] 525 memory

[0131] 530 Database

[0132] 540 User Interface

[0133] 600 power distribution system

[0134] 610 busbar

[0135] 630 Electrical Module

[0136] 640 interconnect components

[0137] 660 RFID tags

[0138] 700 power distribution system

[0139] 710 busbar

[0140] 740 interconnect components

[0141] 760 RFID tags

Claims

1. A method for detecting the temperature of a process pipeline (110; 310) in a semiconductor processing equipment, the method comprising: Apply RFID tags to process pipeline (420) (110; 310), RFID tags (200; 202; 204； 300) has a serial number; The reader (500) reads (430) the RFID tags (200; 202; 204; 300), and the reader (500) is arranged to read the serial number of the RFID tags (200; 202; 204; 300) and identify the resonant frequency of the RFID tags (200; 202; 204; 300); as well as The resonant frequency of the RFID tag (200; 202; 204; 300) is converted to the resonant frequency of the RFID tag (200; 202; 300) at (440) frequency. Temperatures of 204 and 300 degrees Celsius. The method further includes: When RFID tags (200; 202; 204; 300) are applied to process pipelines (110; 310), the serial number and installation location of the RFID tags (200; 202; 204; 300) are recorded (410) in the database; and When a temperature reading is subsequently obtained, the location of that temperature reading is determined (450) by looking up the serial number of the RFID tag (200; 202; 204; 300) in the database. The radio frequency identification tag (200; 202; 204; 300) includes an antenna (220; 222) that is in thermal exchange with the process pipeline (110; 310), and the resonant frequency drift of the antenna (220; 222) caused by the thermal exchange between the process pipeline (110; 310) and the antenna (220; 222) is used to determine the temperature of the process pipeline (110; 310), and the resonant frequency range of the antenna (220; 222) is associated with a specific set point.

2. The method of claim 1, wherein the temperature of the process pipeline (110; 310) is determined to be the same as the temperature of the radio frequency identification tag (200; 202; 204; 300).

3. A process pipeline of a semiconductor processing apparatus, comprising radio frequency identification tags (200; 202; ...) for detecting the temperature of the process pipeline (110; 310). 204； 300), the RFID tag (200; 202; 204; 300) include: Antenna (220; 222) is in heat exchange with the process pipeline (110; 310); An electrical insulating pad (240) separates the antenna (220; 222) from the process lines (110; 310); and A memory is used to store the serial number, which is transmitted by the RFID tag (200; 202; 204; 300) when it is interrogated. The resonant frequency drift of the antenna (220; 222) caused by heat exchange between the process pipeline (110; 310) and the antenna (220; 222) is used to determine the temperature of the process pipeline (110; 310) and the resonant frequency range of the antenna (220; 222) is associated with a specific set point.

4. The process pipeline according to claim 3, wherein the radio frequency identification tag (200; 202; 204； 300) also includes: an electrical component (224) that includes the memory and is electrically coupled to and connected to the antenna (220; 222) and the antenna (220; 222) Separate.

5. The process pipeline according to claim 4 further includes a heat insulation layer (260) that separates the electrical components (224) of the radio frequency identification tags (200; 202; 204; 300) from the antenna (220; 222), the electrical insulating pad (240), and the process pipeline (110; 310).

6. The process pipeline according to claim 4 or 5, wherein the antenna (220; 222) and electrical components (224) are housed in a housing (230).

7. The process line according to any one of claims 3 to 5, further comprising a rubber pad (250) for attaching an electrical insulating pad (240) to the process line (110; 310).

8. The process pipeline according to any one of claims 3 to 5, wherein the electrical insulating pad (240) is an electrical insulator and a thermally conductive material.

9. The process pipeline according to any one of claims 3 to 5, wherein the radio frequency identification tag (200; 202; 204; 300) is one of the following: Passive tags, Active tags, and Battery-assisted passive label.

10. A computer program product comprising one or more programs arranged to cause the computer system or one or more processors to operate according to any one of claims 1 to 2 when executed by the computer system or the one or more processors.

11. A machine-readable storage medium storing one or more programs of the computer program product according to claim 10.

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