Test device, test method and simulation module capable of simulating heating of electronic equipment

Abstract

The present invention provides a test device, a test method and a simulation module that can simulate the heating of an electronic device, wherein the test device includes a simulation module, a simulation module, a data acquisition module, a controller and an output module; the simulation module is used to simulate the heating of the electronic components of the electronic device when they are working; the controller is used to calculate the simulation operation parameters according to the simulation operation data, and obtain the simulation correction value of the simulation module according to the simulation operation parameters and the rated parameters of the electronic components, so that the simulation module can be corrected to obtain the corrected simulation operation data. The present invention can effectively solve the situation where the rated power and size of the electronic components are known but the curve relationship of the temperature change over time under the actual working condition is unknown, and the resistance unit can be corrected at any time by using a breadboard, thereby improving the efficiency of circuit adjustment, saving time and economic costs, and combining with the simulation module, the heating of the electronic device can be accurately simulated at a low cost.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component packaging and thermal control, and in particular to a testing device, a testing method and a simulation module capable of simulating heating of electronic equipment. Background Art

[0002] As the size of electronic components in electronic equipment continues to decrease, the operating frequency continues to increase, and they are gradually moving towards integration, the volume power density or area power density of electronic components inside electronic equipment is getting higher and higher, and the heat generated by electronic components is increasing. The resulting excessive temperature will reduce the working stability of electronic components and increase the error rate; at the same time, the thermal stress formed between the module and its external environment will directly affect the electrical properties, operating frequency and mechanical strength of electronic components, and may cause circuit self-oscillation, voltage fluctuations, changes in thermoelectric potential and changes in the transmission delay time of integrated circuits; the above problems will affect the performance of electronic components and further affect the performance of the entire electronic equipment. Therefore, the impact of temperature on electronic equipment cannot be ignored, and thermal analysis and thermal management are particularly important.

[0003] One of the existing experimental research technologies is to build an electronic equipment test device based on the PCBA board inside the electronic equipment to test and verify the structure designed by finite element analysis. The advantage of this technology is that the same PCBA board as the final product can be used for testing, and the test results correspond to the actual domain controller situation one by one, and the test data is highly accurate. However, the implementation of this method requires the use of PCBA boards, which means that electronic components such as chips and resistors need to be purchased, which will lead to problems such as long test cycles and high test costs for each test.

[0004] The second existing experimental research technology is to use a combination of copper blocks and heating tubes to simulate the heating conditions of major electronic components without using a PCBA board. The advantage of this technology is that it does not require the purchase of a large number of electronic components such as chips and resistors, as well as the drawing of circuit diagrams, saving time and economic costs. However, the disadvantage is that the thickness of the copper block used to simulate the heating power of electronic components is at least 6 mm. When the distance between the electronic equipment radiator and the actual PCBA board is small, interference between the copper block and the radiator will occur.

[0005] Existing experimental research technology 3 takes into account factors such as experimental cost and experimental cycle. On the basis of known test methods, a ceramic heater is combined with a programmable control module to simulate the actual working condition of the chip. For details, see the patent: Test method for simulating chip heating power and surface temperature (CN 110673015A). The advantage of this patented technology is that the finite element structure design scheme can be tested and verified without using actual electronic components, in which the output voltage control curve can be loaded to the corresponding ceramic heater through the programmable control module to simulate the working condition of the actual chip; however, the disadvantages of this patented technology are: 1. A programmable control module is required, which is costly; 2. This patented technology is based on the curve relationship between the surface temperature and time of actual electronic components. When there is no corresponding electronic component in the early stage of project development, this technology is no longer applicable. Summary of the invention

[0006] In order to solve the above problems, the present invention proposes a test device, a test method and a simulation module that can simulate the heating of electronic equipment. The test device, the test method and the simulation module can accurately simulate the heating of electronic equipment at low cost when there are at least 50 electronic components and the rated power, size and layout of the electronic components are known but the curve relationship between the surface temperature and time under the actual working conditions is unknown.

[0007] The present invention discloses a device for simulating heating of electronic equipment, comprising:

[0008] A simulation module storing a simulation model constructed according to circuit and structural features of an electronic device, and used to obtain simulation operation data of the simulation model;

[0009] A simulation module, at least used to simulate the heating condition of the electronic components of the electronic device when working;

[0010] A data acquisition module, used for acquiring simulation operation data of the simulation module;

[0011] A controller, used to calculate simulated operation parameters according to the simulated operation data, and to obtain simulated correction values ​​of the simulated module according to the simulated operation parameters and rated parameters of electronic components of the electronic device, so that the simulated module can be calibrated to obtain corrected simulated operation data;

[0012] and an output module, which compares the simulation operation data with the corrected simulation operation data and outputs a comparison result.

[0013] The simulation module in the present invention uses simulation software to build a simulation model according to the circuit and structural characteristics of the electronic device, and can also build a simulation model according to the design drawings or semi-finished products of the electronic device. In this way, when there are no corresponding electronic components in the early stage of project development, the known rated power of the electronic components can be used to perform a preliminary heating evaluation; further, the simulation module uses corresponding equipment to simulate the electronic components of the electronic device, and uses a controller to correct the resistance unit, which can more accurately simulate the heating condition of the electronic components; at the same time, the simulation operation data and the corrected simulation operation data are compared to comprehensively evaluate the heating condition of the electronic components, which is used to evaluate whether the circuit and structure of the electronic device are reasonable in terms of heating effect.

[0014] Further, the simulation module specifically includes: a substrate, a heating unit, a breadboard, a resistor unit and a power supply;

[0015] The substrate is used to simulate the circuit board of the electronic device; a board having similar performance to the simulated circuit board, especially a board having similar heat generation and heat dissipation effects, or even the same board, can be selected, but not limited thereto.

[0016] The plurality of heating units connected in parallel and arranged on the substrate are used to simulate the electronic components;

[0017] The breadboard is used to plug in the resistance unit; considering that the number of simulated electronic components is greater than 50, it means that the resistance units are also greater than 50, and when selecting a breadboard, a breadboard with sufficient number of jacks will be selected; the significance of using a breadboard is that the resistance unit connected in series with the heating unit can be replaced at any time, thereby improving the efficiency of testing and circuit adjustment, and saving time and economic costs.

[0018] The same number of resistance units as the heating units is used to limit the circuit current and adjust the actual power of the heating units so that the actual power of the heating units is as close as possible to the rated power of the electronic components, thereby improving the accuracy of the simulation.

[0019] and the power supply device is used to supply power to the heating unit and the resistance unit;

[0020] The overall connection of the simulation module is that the power supply is connected to the breadboard by a power line, the resistance unit is inserted into the breadboard, and each resistance unit is connected in series with a heating unit by a power line, and the heating unit is bonded and fixed on the substrate. There is no electricity between the heating unit and the substrate.

[0021] The resistance unit includes a resistor, the resistance value of the resistor before correction is Rn, and the formula of the resistance value Rn is:

[0022]

[0023] The resistance Ro is the resistance value of the heating unit connected in series with the resistance unit before power is turned on, the voltage U is the simulated voltage U provided by the power supply, and the voltage U is selected according to the simulated electronic device. The rated power P is the heating power of the electronic components corresponding to each heating unit.

[0024] At the same time, the simulation module also includes a device for simulating the working environment of the electronic device, which is used to simulate the actual working environment of the electronic device, including the actual working temperature and space. During the simulation process, it is also tested whether the heating unit interferes with the device for simulating the working environment of the electronic device.

[0025] Meanwhile, the data acquisition module includes: a temperature sensor disposed on each or any of the heating units, for measuring the temperature value Tn of each or any of the heating units; and a sensor for measuring the resistance value, current value and voltage value applied to each of the heating units. By measuring the obtained current value and voltage value, the simulation operation parameters are calculated, including the actual power of the heating unit in the heating state.

[0026] Furthermore, the substrate is made of flame-resistant material and has the same size as the simulated circuit board; and the heating unit is a square ceramic heating plate of the same size as the corresponding electronic component; the reason for choosing the square ceramic heating plate is that its size is the same as the electronic component, and in particular, its thickness is not as thick as the copper block, which can avoid the occurrence of interference.

[0027] The square ceramic heating plate is fixedly bonded to the substrate by means of a thermally conductive adhesive, and the fixing position corresponds to the position where the corresponding electronic component is fixed on the circuit board;

[0028] The present invention also provides a simulation module for simulating heating conditions of an electronic device, and the simulation module is the simulation module described above.

[0029] The present invention also discloses a testing method based on the simulated electronic equipment heating testing device, comprising the following steps:

[0030] S1: constructing a simulation model according to circuit and structural characteristics of an electronic device, and obtaining simulation operation data of the simulation model;

[0031] S2: After the simulation module is powered on for a predetermined time, the simulation operation data of the simulation module is obtained; wherein the simulation module is the simulation module as described in claim 2; because the resistance value of the heating unit will increase with the increase of temperature after power-on, it is necessary to wait until the simulation module runs for a predetermined time, when the temperature fluctuation of the heating unit is within a preset range, and then measure the voltage value and current value of each heating unit, so as to achieve an accurate calculation effect.

[0032] S3: Calculating simulation operation parameters according to the simulation operation data, and obtaining simulation correction values ​​of the simulation module according to the simulation operation parameters and rated parameters of electronic components of the electronic device, and correcting the simulation module;

[0033] S4: Compare the simulation operation data with the corrected simulation operation data, and output a comparison result.

[0034] Furthermore, the method for obtaining the simulation correction value in step S3 is specifically as follows:

[0035] S31: Calculate the actual power Pn of the nth heating unit, the formula is:

[0036] Pn=Un*In; wherein n is a natural number not equal to 0, Un is the voltage value across the heating unit, and In is the current value flowing through the heating unit;

[0037] S32: Compare the actual power Pn of the nth heating unit with the rated power P of the electronic component it simulates to obtain a power difference ΔP; if ΔP is less than a preset value, proceed to step S33; otherwise, n is incremented by 1 and proceed to step S31; the ΔP formula is:

[0038] ΔP=Pn-P;

[0039] This is because after power-on, the resistance values ​​of the heating unit and the resistance unit will increase as the temperature rises, and the internal resistance of the power supply and the small resistance of the connecting wire must also be considered when power is on, so the resistance value of the heating unit will be greater than the resistance value Ro measured before power-on, further resulting in a gap between the actual power Pn of the heating unit and the rated power P;

[0040] S33 calculates the analog correction value Rn' of the resistor connected in series with the nth heating unit. If the calculation of all the analog correction values ​​Rn' is completed, the corresponding resistor unit is corrected according to the analog correction value Rn'; otherwise, n is incremented by 1 and the process goes to step S31; the formula of the analog correction value Rn' is:

[0041]

[0042] The significance of adopting the above formula is that Un / In is used to accurately characterize the resistance of the heating unit when powered on, and (In*Rn+Un) is used to accurately characterize the total voltage value of the heating unit and the resistance unit, that is, the influence of temperature on the resistance of the heating unit is taken into account, and the influence of the internal resistance of the DC power supply and the resistance of the connecting wire in the circuit after power-on is eliminated, so as to more accurately calculate the analog correction value Rn.

[0043] The present invention also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the above-mentioned test method is implemented.

[0044] The present invention provides a test device, a test method and a simulation module capable of simulating heating of an electronic device, wherein the test device comprises a simulation module storing a simulation model constructed according to the circuit and structural characteristics of an electronic device, and used for obtaining simulation operation data of the simulation model; a simulation module at least used for simulating the heating condition of the electronic components of the electronic device when working; a data acquisition module used for obtaining the simulation operation data of the simulation module; a controller used for calculating simulation operation parameters according to the simulation operation data, and obtaining simulation correction values ​​of the simulation module according to the simulation operation parameters and the rated parameters of the electronic components of the electronic device, so that the simulation module can be corrected to obtain the corrected simulation operation data; and an output module comparing the simulation operation data with the corrected simulation operation data, and outputting the comparison result.

[0045] The beneficial effect of the present invention is that it can effectively solve the problem that the electronic component manufacturer only provides the rated power and size of the electronic component but does not provide the curve relationship between the temperature change and time under the actual working condition of the electronic component, and the resistance unit can be corrected at any time by using a breadboard, which greatly improves the efficiency of circuit adjustment, saves time and economic costs, and at the same time combines with the simulation module to accurately simulate the heating of electronic equipment at a low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0047] Figure 1 It is a structural schematic diagram of a device for simulating heating of electronic equipment according to the present invention;

[0048] Figure 2 It is an electrical connection diagram of a heating device for simulating electronic equipment according to the present invention;

[0049] Figure 3 The present invention is a flowchart of a method for simulating heating of an electronic device. DETAILED DESCRIPTION

[0050] The specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0051] A testing device capable of simulating heating of electronic equipment comprises a simulation module, a simulation module, a data acquisition module, a controller and an output module.

[0052] Among them, the simulation module stores a simulation model constructed according to the circuit and structural characteristics of an electronic device, which is used to obtain the simulation operation data of the simulation model. The simulation module uses simulation software to construct a simulation model according to the circuit and structural characteristics of the electronic device, and can also construct a simulation model according to the design drawings or semi-finished products of the electronic device. In this way, in the early stage of project development, when there are no corresponding electronic components in kind, the known rated power of the electronic components can be used for preliminary heat evaluation; commonly used thermal simulation software is FloTHERM, ICEPAK and FIoEFD. In this embodiment, ICEPAK is selected as the simulation software. The simulated electronic device can be various PCB circuit boards, and in this embodiment, it is a vehicle-mounted domain controller. Among them, the electronic components in the simulation model are constructed according to the size of the electronic components to be simulated, and the rated power is applied to the electronic components in the simulation model. The rated power can be 0.15W, 0.25W, 0.5W, etc. The commonly used electronic components in this embodiment are 0.15W and 0.5W; the overall size of the simulation model can be 300mm×200mm×60mm, and the specific size is simulated according to actual needs; the simulation module obtains the simulated temperature value T1 of the electronic components by running the simulation model.

[0053] The simulation module is at least used to simulate the heating conditions of the electronic components of the electronic device when they are working, and specifically includes: a substrate, a heating unit, a breadboard, a resistor unit and a power supply.

[0054] Among them, the substrate is used to simulate the circuit board of the electronic device; a plate with similar performance to the simulated circuit board can be selected, especially a plate with similar heat generation and heat dissipation effects, or even the same plate; the substrate is made of flame-retardant material, and FR4 board is selected in this embodiment. The FR4 epoxy glass fiber board (epoxy board) is mainly made of imported semi-cured sheet, and its colors are white, yellow, and green. It still has high mechanical strength at 150°C, good electrical properties in dry and wet states, and is flame retardant. It is widely used in insulating structural parts in electrical, electronic and other industries.

[0055] The FR4 board selected in this embodiment has the same length, width and thickness as the PCB board of the electronic device. The PCB board of the electronic device simulated in this embodiment is 294mm×181mm×1.6mm, and the FR4 board is consistent with it.

[0056] Among them, the multiple parallel-connected heating units arranged on the substrate are used to simulate the electronic components; the heating unit is a square ceramic heating plate of the same size as the corresponding electronic components; the square ceramic heating plate is fixedly bonded to the substrate by thermal conductive adhesive, and the fixed position corresponds to the position where the corresponding electronic components are fixed on the circuit board; in this embodiment, the square ceramic heating plate is generally selected to have a thickness of 1 to 2 mm, which is much smaller than the thickness of the simulated copper block of 6 mm, and can avoid the square ceramic heating plate from interfering with the device simulating the working environment of the electronic equipment. At the same time, after power-on, the resistance value of the heating unit will increase with the increase of temperature. This characteristic is one of the reasons why the controller needs to be calibrated.

[0057] Thermally conductive adhesive is a high-end thermally conductive compound, which is synthesized from a variety of materials. There are many common types of thermally conductive adhesives on the market: thermally conductive silicone, epoxy resin AB glue, acrylic thermally conductive adhesive and polyurethane thermally conductive adhesive. Thermally conductive adhesive can be widely applied to the contact surface between the heating element (power tube, thyristor, electric heating pile, etc.) and the heat dissipation facilities (heat sink, heat dissipation strip, housing, etc.) in various electronic products and electrical equipment, and plays the role of heat transfer medium and has moisture-proof, dust-proof, corrosion-proof, shock-proof and other properties. The thermally conductive silicone selected in this embodiment is a silicone that is made of organic silicone as the main body, and is mixed with polymer materials such as fillers and thermally conductive materials. It has good thermal conductivity and electrical insulation properties and is widely used in electronic components. Thermally conductive silicone is used to bond transformers, transistors and other heating elements to printed circuit board assemblies or radiators. It is suitable for surface coating or overall potting of various microwave devices such as microwave communications, microwave transmission equipment, microwave dedicated power supplies, and voltage-stabilized power supplies. This type of silicon material provides excellent thermal conductivity for electronic components that generate heat.

[0058] Wherein, the breadboard is used to plug in the resistance unit; the breadboard has many small jacks on the board, which is specially designed and manufactured for the solderless experiment of the electronic circuit. Since various electronic components can be inserted or unplugged at will according to the needs, soldering is eliminated, the assembly time of the circuit is saved, and the components can be reused, so it is very suitable for the assembly, debugging and training of the electronic circuit. The breadboard is divided into a solderless breadboard, a combination breadboard and a combination breadboard. Considering that the number of simulated electronic components is greater than 50, it means that the resistance unit is also greater than 50. When selecting a breadboard, a breadboard with a sufficient number of jacks will be selected; in this embodiment, a combination breadboard is selected according to the needs, because the advantages of the combination breadboard are that the power supply can be easily turned on and off, the area is large, large-scale experiments can be carried out, and the activity is high and the use is wide, but the disadvantage is that the volume is large and relatively heavy, and it is not suitable for carrying. The advantage of using a breadboard is that the resistance unit connected in series with the heating unit can be replaced at any time, which greatly improves the efficiency of the test and circuit adjustment, and saves time and economic costs.

[0059] Among them, the resistor units, which are the same in number as the heating units, are used to limit the circuit current and adjust the actual power of the heating units; the resistance value of the resistor unit is generally related to the temperature, material, length, and cross-sectional area. The physical quantity that measures the influence of temperature on the resistance is the temperature coefficient, which is defined as the percentage change in the resistance value when the temperature rises by 1°C. The role of the resistor in the present invention is to make the actual power of the heating unit as close as possible to the rated power of the electronic components, thereby improving the accuracy of the simulation. In this embodiment, a metal film resistor is selected.

[0060] The resistance unit includes a resistor, the resistance value of the resistor before correction is Rn, and the formula of the resistance value Rn is:

[0061]

[0062] The resistance Ro is the resistance value of the heating unit connected in series with the resistance unit before power is turned on, the voltage U is the analog voltage U provided by the power supply, and the rated power P is the heating power of the electronic components corresponding to each of the heating units.

[0063] In this embodiment, because the number of the square ceramic heating plates is greater than 50, this embodiment selects some of the square ceramic heating plates for detailed description, and the calculation results are shown in Table 1.

[0064] Table 1 Resistance value of the first resistance unit Rn

[0065]

[0066] The power supply is used to supply power to the heating unit and the resistance unit; the power supply can be an AC power supply or a DC power supply. In this embodiment, a DC power supply is used, which is suitable for the simulated electronic device selected in this embodiment: the vehicle domain controller. The DC power supply can provide a constant voltage of 0 to 18V, and a 12V DC voltage is used in this embodiment.

[0067] like Figure 1 and Figure 2 As shown, the power supply is connected to the breadboard by a power line, the resistance unit is inserted into the breadboard, and each resistance unit is connected in series with a heating unit by a power line, and the heating unit is bonded and fixed on the substrate;

[0068] The simulation module also includes a device for simulating the working environment of the electronic device, which is used to simulate the actual working environment of the electronic device, and can be a thermostat or other environmental simulator. The device for simulating the working environment of the electronic device is an important means to improve the quality of electronic equipment and ensure the reliability of the product in harsh environments. In this embodiment, the front and rear cover samples of the vehicle-mounted domain controller radiator provide an actual vehicle-mounted domain controller working temperature of 85°C, and can test whether the square ceramic heating plate will interfere with the front and rear cover samples of the vehicle-mounted domain controller radiator.

[0069] The data acquisition module is used to obtain the simulation operation data of the simulation module; specifically, it includes: a temperature sensor set on each or any of the heating units, used to measure the temperature value Tn of each or any of the heating units; and a sensor used to measure the resistance value, current value and voltage value applied to each of the heating units. By measuring the obtained current value and voltage value, the heating power of the heating unit in the heating state is calculated, and it is also used to calculate the simulation operation parameters.

[0070] A temperature sensor refers to a sensor that can sense temperature and convert it into a usable output signal. Temperature sensors are the core part of temperature measuring instruments and come in a wide variety of varieties. According to the measurement method, they can be divided into two categories: contact and non-contact. According to the sensor material and electronic component characteristics, they can be divided into two categories: thermal resistors and thermocouples. In this embodiment, the temperature sensor uses a thermocouple sensor, and a thermocouple wire is bonded above a square ceramic heating plate with high heat generation, high rated power, and large volume to measure the real-time temperature of the square ceramic heating plate.

[0071] Commonly used voltage sensors can be roughly divided into several main types according to their different working mechanisms and application scopes: voltage transformers, Hall voltage sensors, and optical fiber voltage sensors. Current sensors can be mainly divided into shunts, electromagnetic current transformers, electronic current transformers, etc. according to different measurement principles; Hall voltage sensors and Hall current sensors are used in this embodiment.

[0072] The controller is used to calculate the simulated operation parameters according to the simulated operation data, and obtain the simulated correction value of the simulated module according to the simulated operation parameters and the rated parameters of the electronic components of the electronic device, so that the simulated module can be calibrated to obtain the corrected simulated operation data.

[0073] The output module compares the simulation operation data with the corrected simulation operation data and outputs the comparison result. The output module compares the simulation operation data with the average value of at least two sets of simulation operation data provided by the corrected simulation module and outputs the comparison result to evaluate the heat dissipation of electronic components of the electronic device.

[0074] The present invention also provides a simulation module for simulating heating conditions of an electronic device, and the simulation module is the simulation module described above.

[0075] like Figure 3 As shown, the present invention also discloses a testing method based on a testing device capable of simulating heating of electronic equipment, comprising the following steps:

[0076] S1: constructing a simulation model according to the circuit and structural characteristics of an electronic device, and obtaining simulation operation data of the simulation model; the simulation operation data refers to the simulation temperature value T1 of the electronic components.

[0077] S2: After the simulation module is powered on for a predetermined time, the simulation operation data of the simulation module is obtained; wherein the simulation module is the above-mentioned simulation module; because the resistance values ​​of the heating unit and the resistance unit will increase with the temperature after power-on, it is necessary to wait until the simulation module runs for a predetermined time and the temperature fluctuation of the heating unit is within a preset range, and then measure the voltage value and current value of each heating unit, so as to achieve the effect of accurate measurement and calculation.

[0078] The predetermined time may be 3, 4 or 5 hours, but is not limited thereto. In this embodiment, after the simulation module has run for 4 hours, when the temperature fluctuation of the heating unit is within plus or minus 3 degrees Celsius, the voltage Un and current In of each heating unit are measured.

[0079] S3: Calculating simulation operation parameters according to the simulation operation data, and obtaining simulation correction values ​​of the simulation module according to the simulation operation parameters and rated parameters of electronic components of the electronic device, and correcting the simulation module;

[0080] Furthermore, the method for obtaining the simulation correction value is specifically as follows:

[0081] S31: Calculate the actual power Pn of the nth heating unit, the formula is:

[0082] Pn=Un*IN; wherein n is a natural number not equal to 0; Un is the voltage value across the heating unit, and In is the current value flowing through the heating unit.

[0083] S32: Compare the actual power Pn of the nth heating unit with the rated power P of the electronic component it simulates to obtain a power difference ΔP; if ΔP is less than a preset value, proceed to step S33; otherwise, n is incremented by 1 and proceed to step S31; the ΔP formula is:

[0084] ΔP=Pn-P;

[0085] The preset value can be set to a specific numerical value, or a percentage of the rated power P, or a certain range of values, but is not limited thereto. It needs to be set in combination with the characteristics of the simulated electronic components to help accurately obtain the simulation correction value.

[0086] In this embodiment, the preset value of ΔP is set to -0.005W. For specific ΔP data, see Table 2.

[0087] Table 2 Comparison of actual power and rated power of various ceramic heating plates

[0088]

[0089] After calculation, only the ΔP of the heating unit numbered A41 is greater than the preset value, so the resistance Rn corresponding to the heating unit numbered A41 does not need to be calibrated, and the resistances of other heating units need to be calibrated.

[0090] This is because after power-on, the resistance values ​​of the heating unit and the resistance unit will increase as the temperature rises, and the internal resistance of the power supply and the small resistance of the connecting wire must also be considered when power is on. Therefore, the resistance value of the heating unit will be greater than the resistance value Ro measured before power-on, further resulting in a gap ΔP between the actual power Pn of the heating unit and the rated power P;

[0091] S33: Calculate the analog correction value Rn' of the resistor unit connected in series with the nth heating unit. If the calculation of all the analog correction values ​​Rn' is completed, calibrate the corresponding resistor unit according to the analog correction value Rn'; otherwise, n is incremented by 1 and the process goes to step S31; the formula of the analog correction value Rn' is:

[0092]

[0093] The significance of adopting the above formula is that Un / In is used to accurately characterize the resistance of the heating unit Tn when powered on, and (In*Rn+Un) is used to accurately characterize the total voltage value of the heating unit and the resistance unit, that is, the influence of temperature on the resistance of the heating unit is taken into account, and the influence of the internal resistance of the DC power supply and the resistance of the connecting wire in the circuit after power-on is eliminated, so as to more accurately calculate the analog correction value Rn.

[0094] The corresponding resistance unit is calibrated by the analog correction value Rn'; in this embodiment, the correction is performed by plugging and unplugging, and the resistance corresponding to the heating unit numbered in Table 3, whose resistance value before correction is Rn, is replaced by a resistance with the analog correction value Rn'.

[0095] The correction makes the corrected actual power Pn' of the heating unit closer to the rated power P, reducing the test error. The corrected power difference ΔP' is within the preset range and can be verified if necessary. The actual power Pn' is calculated by measuring the corrected voltage Un' and current In' of each heating unit; the specific verification data is shown in Table 3.

[0096] Table 3 Comparison of actual power and rated power of each ceramic heater after correction

[0097]

[0098] After verification, it is known that the ΔP′ of the above numbered heating units is greater than the preset value. The calibration has compensated the actual power Pn′ of the heating unit. Among them, the ΔP′ of the A34 heating unit after compensation is about 43% of the rated power P. The deviation is too large, indicating that there is a problem in the calibration process and it is necessary to recalibrate.

[0099] S4: Compare the simulation operation data with the corrected simulation operation data, and output a comparison result.

[0100] After the simulation module is calibrated and runs for a predetermined time, at least two groups of temperature measurement values ​​of the temperature detection unit are obtained, and an average value of the temperature measurement values ​​is calculated as the heating test data of the domain controller to be tested.

[0101] In this embodiment, after the simulation module to be calibrated runs for 4 hours, 5 groups of temperature measurement values ​​of the temperature detection unit are obtained to obtain an average value T2.

[0102] Compare the simulated temperature value T1 with the average temperature T2 of the simulated operation, output a comparative analysis report, comprehensively evaluate the heating conditions of electronic components, and further evaluate whether the circuit and structure of the electronic equipment are reasonable in terms of heating effect.

[0103] The present invention also provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the above-mentioned test method is implemented.

[0104] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. A test method for simulating heating of electronic equipment, characterized in that: The test method includes a test device capable of simulating heating of an electronic device, the test device comprising: A simulation module storing a simulation model constructed according to circuit and structural features of an electronic device, and used to obtain simulation operation data of the simulation model; A simulation module, at least used to simulate the heating condition of the electronic components of the electronic device when working; A data acquisition module, used for acquiring simulation operation data of the simulation module; A controller, configured to calculate simulated operation parameters according to the simulated operation data, and to obtain simulated correction values ​​of the simulated module according to the simulated operation parameters and rated parameters of electronic components of the electronic device, so that the simulated module is calibrated to obtain corrected simulated operation data; An output module compares the simulation operation data with the corrected simulation operation data and outputs a comparison result; Wherein, the simulation module includes: A substrate, used to simulate a circuit board of the electronic device; A plurality of parallel-connected heating units disposed on the substrate, for simulating the electronic components; A breadboard, the same number of resistor units as the heating units, used to limit the circuit current and adjust the actual power of the heating units; and, a power supply for supplying power to the heating unit and the resistance unit; Wherein, the power supply is connected to the breadboard by a power line, the resistance unit is inserted into the breadboard, and each resistance unit is connected in series with a heating unit by a power line, and the heating unit is bonded and fixed on the substrate; The resistor unit includes a resistor, and the resistance value of the resistor before correction is R n , the resistance value R n The formula is: Wherein, the resistance R0 is the resistance value of the heating unit connected in series with the resistance unit before being powered on, the voltage U is the simulated voltage U provided by the power supply, and the rated power P is the heating power of the simulated electronic components corresponding to each of the heating units; Wherein, the testing method comprises the following steps: S1: constructing a simulation model according to circuit and structural characteristics of an electronic device, and obtaining simulation operation data of the simulation model; S2: After a predetermined time from when the simulation module is powered on, obtaining simulation operation data of the simulation module; S3: Calculating simulation operation parameters according to the simulation operation data, and obtaining simulation correction values ​​of the simulation module according to the simulation operation parameters and rated parameters of electronic components of the electronic device, and correcting the simulation module; S4: comparing the simulation operation data with the corrected simulation operation data, and outputting a comparison result; The method for obtaining the simulation correction value in step S3 is specifically as follows: S31: Calculate the actual power Pn of the nth heating unit, the formula is: Pn=Un*In; wherein n is a natural number not equal to 0, Un is the voltage value across the heating unit, and In is the current value flowing through the heating unit; S32: Compare the actual power Pn of the nth heating unit with the rated power P of the electronic component it simulates to obtain a power difference ΔP; if ΔP is less than a preset value, proceed to step S33; otherwise, n is incremented by 1 and proceed to step S31; The ΔP formula is: ΔP=Pn-P; S33: Calculate the analog correction value Rn' of the resistor unit connected in series with the nth heating unit. If the calculation of all the analog correction values ​​Rn' is completed, calibrate the corresponding resistor unit according to the analog correction value Rn'; otherwise, n is incremented by 1 and the process goes to step S31; the formula of the analog correction value Rn' is: In the step S4, at least two groups of simulation operation data of the simulation module after correction are obtained, and the average value of the at least two groups of simulation operation data is compared with the simulation operation data to obtain the comparison result.

2. The test method for simulating heating of electronic equipment according to claim 1, characterized in that: The simulation module also includes a device for simulating the working environment of the electronic device, which is used to simulate the actual working environment of the electronic device.

3. The test method capable of simulating heating of electronic equipment according to claim 1, characterized in that: The data acquisition module comprises: a temperature sensor disposed on each or any of the heating units, for measuring a temperature value Tn of each or any of the heating units; and A sensor is used to measure the resistance value, current value and voltage value applied to each heating unit.

4. The test method capable of simulating heating of electronic equipment according to claim 1, characterized in that: The substrate is made of flame-resistant material and has the same size as the simulated circuit board; The heating unit is a square ceramic heating plate of the same size as the corresponding electronic component; and The square ceramic heating plate is fixedly bonded to the substrate by means of a heat-conducting adhesive, and the fixing position corresponds to the position where the corresponding electronic component is fixed on the circuit board.

5. A computer-readable storage medium, characterized in that: A computer program is stored thereon, and when the computer program is executed by a processor, the testing method as claimed in claim 1 is implemented.

Images