A method and device for predicting the insulation withstand voltage performance of a PCB board

Abstract

A method and device for predicting the insulation withstand voltage performance of a PCB board. The method includes: importing the design file of the target PCB board; obtaining the PCB board model according to the design file; preprocessing the PCB board model to obtain a preprocessed model; simulating and calculating the near electric field / magnetic field of the PCB board through the preprocessed model to obtain a simulation result; comparing the simulation result with the breakdown field strengths of air and the dielectric to obtain the prediction result of the board insulation withstand voltage performance of the target PCB board, which can effectively predict and evaluate the insulation withstand voltage safety performance of the PCB board in the early stage of the development of high-voltage electrical equipment, locate the positions of the risk points, facilitate various rectification measures such as replacing devices and modifying traces in the subsequent stage, so as to facilitate technicians to accurately and quickly confirm the best rectification plan, and further avoid the risk of device damage and the tediousness of repeated soldering, saving manpower and material resources to the greatest extent.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly, to a method and device for predicting the insulation withstand voltage performance of a PCB board. Background Art

[0002] Electric vehicles and smart home appliances widely used in daily life belong to high-voltage electrical equipment. For such high-voltage electrical equipment, the industry usually has strict requirements for their electrical performance, EMC performance, and safety performance, so that such high-voltage electrical equipment can work safely and stably. Among them, insulation withstand voltage testing of all high-voltage electrical equipment is included in multiple tests that cannot be underestimated.

[0003] As is well known, high-voltage electrical equipment has the characteristics of high working voltage and large output power. The PCB board inside the high-voltage electrical equipment, which is the carrier of the high-voltage circuit and an important part for realizing electrical connection, and the passive and active devices soldered on the PCB board not only determine the electrical performance and EMC performance of the high-voltage electrical equipment, but also determine the electrical safety performance such as insulation withstand voltage of the high-voltage electrical equipment. Therefore, early prediction and evaluation of the insulation performance of the PCB board in high-voltage electrical equipment can detect potential hazards in the insulation withstand voltage safety performance in the early stage of the development of high-voltage electrical equipment, which is not only convenient for modification but also beneficial to improving the overall insulation withstand voltage safety performance of high-voltage electrical equipment.

[0004] Currently, the insulation withstand voltage testing of high-voltage electrical equipment samples or PCB boards that have completed soldering and debugging is mainly evaluated and rectified through physical testing. This requires waiting until the PCB board is produced, welded, debugged, and even the entire high-voltage electrical equipment sample is debugged before the testing can be carried out. It can only intervene in the later stage of product design and development. There are limitations in rectification, and only devices with similar packages can be replaced, and the chips and traces cannot be modified. Secondly, in this testing process, high voltage is likely to damage the chips and surrounding components, posing a risk to testing safety, which prolongs the rectification cycle and makes the process repetitive. In addition, for high-voltage electrical equipment that fails the insulation withstand voltage test, it is also difficult to locate the problem. Usually, it is located through fault phenomena and experience, which takes a long time to solve the problem and is prone to potential hazards. Summary of the Invention

[0005] The purpose of the embodiments of this application is to provide a method and device for predicting the insulation withstand voltage performance of a PCB board, which can effectively predict and evaluate the insulation withstand voltage safety performance of the PCB board in the early stage of the development of high-voltage electrical equipment, and locate the positions of risk points, facilitating various rectification measures such as replacing devices and modifying traces in the follow-up, so that technicians can accurately and quickly confirm the best rectification plan, thereby avoiding the risk of device damage and the tediousness of repeated soldering, and saving the most manpower and material resources to the greatest extent.

[0006] In the first aspect of the embodiments of the present application, a method for predicting the insulation withstand voltage performance of a PCB board is provided, including:

[0007] Import the design file of the target PCB board;

[0008] Obtain the PCB board model according to the design file;

[0009] Preprocess the PCB board model to obtain a preprocessed model;

[0010] Simulate and calculate the near electric field / magnetic field of the PCB board through the preprocessed model to obtain a simulation result;

[0011] Compare the simulation result with the breakdown field strengths of air and the dielectric to obtain the prediction result of the board insulation withstand voltage performance of the target PCB board.

[0012] In the above implementation process, the method can first import the design file of the target PCB board; then obtain the PCB board model according to the design file and preprocess the PCB board model to obtain a preprocessed model; after obtaining the preprocessed model, the method can simulate and calculate the near electric field / magnetic field of the PCB board through the preprocessed model to obtain a simulation result; finally, compare the simulation result with the breakdown field strengths of air and the dielectric to obtain the prediction result of the board insulation withstand voltage performance of the target PCB board. It can be seen that the method can perform simulation calculations based on the model, determine the risk of non-compliance with the insulation withstand voltage according to the simulation calculation results, thereby obtaining the prediction result of the board insulation withstand voltage performance, and further achieving the effect of predicting and evaluating the insulation withstand voltage safety performance of the PCB board in the early stage of the development of high-voltage electrical equipment.

[0013] Further, the preprocessing of the PCB board model to obtain a preprocessed model includes:

[0014] Determine the positions of passive devices, active devices, and external connectors on the PCB board model that only carry nominal values;

[0015] Replace the passive devices with a preset equivalent circuit model to obtain a first processed PCB board model;

[0016] Replace the positions of the active devices with a preset interface circuit to obtain a second processed PCB board model;

[0017] At the positions of the external connectors, short-circuit all the signal pins to obtain a third processed PCB board model;

[0018] Add a high-voltage source as an impact signal at the short-circuited signal pins to obtain a preprocessed model.

[0019] Further, the method further includes:

[0020] Determine whether the predicted result of the board insulation withstand voltage performance exceeds the preset withstand voltage performance limit;

[0021] If so, obtain a device adjustment plan for the target PCB board according to the predicted result of the board insulation withstand voltage performance;

[0022] Output the predicted result of the board insulation withstand voltage performance and the device adjustment plan.

[0023] Further, the obtaining a device adjustment plan for the target PCB board according to the predicted result of the board insulation withstand voltage performance includes:

[0024] Determine the stack-up information, trace information, and device information of the target PCB board according to the design document;

[0025] Determine the target devices around the field strength exceeding the limit in the target PCB board according to the predicted result of the board insulation withstand voltage performance and the device information;

[0026] Obtain a device adjustment plan with high insulation performance for the target device;

[0027] Obtain a trace adjustment plan for the trace spacing and line width of the PCB board;

[0028] Generate a device adjustment plan according to the device adjustment plan with high insulation performance and the trace adjustment plan.

[0029] The second aspect of the embodiments of the present application provides a device for predicting the insulation withstand voltage performance of a PCB board, and the device for predicting the insulation withstand voltage performance of the PCB board includes:

[0030] An import unit, configured to import a design document of a target PCB board;

[0031] A first acquisition unit, configured to obtain a PCB board model according to the design document;

[0032] A preprocessing unit, configured to preprocess the PCB board model to obtain a preprocessed model;

[0033] A simulation unit, configured to simulate and calculate the near electric field / magnetic field of the PCB board through the preprocessed model to obtain a simulation result;

[0034] A comparison unit, configured to compare the simulation result with the breakdown field strengths of air and the dielectric to obtain the predicted result of the board insulation withstand voltage performance of the target PCB board.

[0035] In the above implementation process, the PCB board insulation withstanding voltage performance prediction device can import the design file of the target PCB board through the import unit; obtain the PCB board model according to the design file through the first acquisition unit; preprocess the PCB board model through the preprocessing unit to obtain a preprocessed model; simulate and calculate the near electric field / magnetic field of the PCB board through the simulation unit using the preprocessed model to obtain a simulation result; compare the simulation result with the breakdown field strengths of air and the dielectric through the comparison unit to obtain the prediction result of the board insulation withstanding voltage performance of the target PCB board. It can be seen that this device can perform simulation calculations based on the model, determine the risk of non-compliance with the withstanding voltage based on the simulation calculation results, thereby obtaining the prediction result of the board insulation withstanding voltage performance, and further achieving the effect of predicting and evaluating the insulation withstanding voltage safety performance of the PCB board in the early stage of the development of high-voltage electrical equipment.

[0036] Furthermore, the preprocessing unit includes:

[0037] The first determination subunit is used to determine the positions of passive devices, active devices, and external connectors on the PCB board model that only carry nominal values;

[0038] The replacement subunit is used to replace the passive devices with a preset equivalent circuit model to obtain a first processed PCB board model;

[0039] The substitution subunit is used to replace the positions of the active devices with a preset interface circuit to obtain a second processed PCB board model;

[0040] The short-circuit subunit is used to short-circuit all signal pins at the positions of the external connectors to obtain a third processed PCB board model;

[0041] The addition subunit is used to add a high-voltage source as an impact signal at the short-circuited signal pins to obtain a preprocessed model.

[0042] Furthermore, the PCB board insulation withstanding voltage performance prediction device further includes:

[0043] The judgment unit is used to judge whether the prediction result of the board insulation withstanding voltage performance exceeds a preset withstanding voltage performance limit value;

[0044] The second acquisition unit is further used to obtain a device adjustment plan for the target PCB board according to the prediction result of the board insulation withstanding voltage performance when it is judged that the preset withstanding voltage performance limit value is exceeded;

[0045] The output unit is used to output the prediction result of the board insulation withstanding voltage performance and the device adjustment plan.

[0046] Furthermore, the second acquisition unit includes:

[0047] A second determination subunit, configured to determine the stack-up information, routing information, and device information of the target PCB board according to the design document; and determine the target devices around the field strength exceeding the limit in the target PCB board according to the predicted result of the board insulation withstand voltage performance and the device information.

[0048] An acquisition subunit, configured to acquire a high-insulation performance device adjustment solution for the target device; and acquire a routing adjustment solution for the routing spacing and line width of the PCB board.

[0049] A generation subunit, configured to generate a device adjustment solution according to the high-insulation performance device adjustment solution and the routing adjustment solution.

[0050] In a third aspect of the embodiments of the present application, an electronic device is provided, including a memory and a processor. The memory is used to store a computer program, and the processor runs the computer program to enable the electronic device to execute the PCB board insulation withstand voltage performance prediction method according to any one of the first aspects of the embodiments of the present application.

[0051] In a fourth aspect of the embodiments of the present application, a computer-readable storage medium is provided, which stores computer program instructions. When the computer program instructions are read and run by a processor, the PCB board insulation withstand voltage performance prediction method according to any one of the first aspects of the embodiments of the present application is executed. Description of the Drawings

[0052] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0053] Figure 1 It is a schematic flowchart of a method for predicting the insulation withstand voltage performance of a PCB board provided by an embodiment of the present application;

[0054] Figure 2 It is a schematic structural diagram of a device for predicting the insulation withstand voltage performance of a PCB board provided by an embodiment of the present application. Detailed Embodiments

[0055] Next, the technical solutions in the embodiments of the present application will be described with reference to the drawings in the embodiments of the present application.

[0056] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance.

[0057] Embodiment 1

[0058] Please refer to Figure 1 , Figure 1 which is a schematic flow diagram of a method for predicting the insulation withstand voltage performance of a PCB board provided by an embodiment of this application. Among them, the method for predicting the insulation withstand voltage performance of the PCB board includes:

[0059] S101. Import the design file of the target PCB board.

[0060] In this embodiment, the method can import the PCB board design file, and the PCB board design file includes stack-up, traces, and device information.

[0061] In this embodiment, when the method imports the design file of the PCB board, it is necessary to accurately input the stack-up, traces, and device information that affect the insulation safety performance. Among them, the stack-up information includes the materials and thicknesses of each conductor layer. Among them, the conductor is usually copper, and the thickness is usually 0.5 oz (low-voltage part) and 1 oz (high-voltage part). There are also cases where the thickness of the conductor layer for passing large currents is 1 mm, and the materials and thicknesses of the dielectric layers between each conductor layer. The dielectric is usually FR4, and the thickness is usually in the range of 0.1 mm - 1 mm.

[0062] S102. Obtain the PCB board model according to the design file.

[0063] S103. Determine the positions of passive devices, active devices, and external connectors on the PCB board model that only carry nominal values.

[0064] S104. Replace the passive devices with a preset equivalent circuit model to obtain the first processed PCB board model.

[0065] In this embodiment, the method replaces the passive devices on the PCB board model that only carry nominal values with an equivalent circuit model.

[0066] S105. Replace the positions of the active devices with a preset interface circuit to obtain the second processed PCB board model.

[0067] In this embodiment, the method replaces the positions of the active devices on the PCB board model with an interface circuit.

[0068] S106. At the positions of the external connectors, short-circuit all the signal pins to obtain the third processed PCB board model.

[0069] In this embodiment, at the position of the external connector of the PCB board, all signal pins are short-circuited and a high-voltage source is added as an impact signal.

[0070] S107. Add a high-voltage source as an impact signal at the short-circuited signal pins to obtain a preprocessing model.

[0071] In this embodiment, the method can replace the passive devices with only nominal values on the PCB board with equivalent circuit models, and replace the active devices with interface circuits. Among them, the insulation safety performance is closely related to the leakage current formed between the medium of the PCB board and the devices. Specifically, the equivalent circuit model of the passive device needs to include parasitic resistance, parasitic inductance and parasitic capacitance parts; an interface circuit composed of passive devices needs to be added to the connection pins of the active device.

[0072] S108. Simulate and calculate the near electric field / magnetic field of the PCB board through the preprocessing model to obtain a simulation result.

[0073] In this embodiment, the method simulates and calculates the near electric field / magnetic field of the PCB board.

[0074] S109. Compare the simulation result with the breakdown field strengths of air and the medium to obtain the prediction result of the board insulation withstanding voltage performance of the target PCB board.

[0075] In this embodiment, the prediction result of the board insulation withstanding voltage performance is the comparison result between the simulation result and the breakdown field strengths of air and the medium.

[0076] S110. Determine whether the prediction result of the board insulation withstanding voltage performance exceeds the preset withstanding voltage performance limit. If so, execute steps S111 to S112; if not, end this process.

[0077] In this embodiment, when the method determines whether it exceeds the preset withstanding voltage performance limit by comparing the simulation result with the breakdown field strengths of air and the medium.

[0078] In this embodiment, if it exceeds the preset withstanding voltage performance limit, it indicates that there is a risk of failure in insulation withstanding voltage; if it does not exceed the preset withstanding voltage performance limit, it indicates that there is no risk of failure in insulation withstanding voltage.

[0079] S111. Obtain a device adjustment plan for the target PCB board according to the prediction result of the board insulation withstanding voltage performance.

[0080] As an optional implementation manner, obtaining a device adjustment plan for the target PCB board according to the prediction result of the board insulation withstanding voltage performance includes:

[0081] Determine the stack-up information, trace information and device information of the target PCB board according to the design document;

[0082] Determine the target devices around the field strength exceeding the limit in the target PCB board according to the prediction result of the board insulation withstand voltage performance and the device information;

[0083] Obtain the adjustment scheme for high-insulation-performance devices for the target devices;

[0084] Obtain the routing adjustment scheme for the PCB board routing spacing and line width;

[0085] Generate a device adjustment scheme according to the adjustment scheme for high-insulation-performance devices and the routing adjustment scheme.

[0086] In this embodiment, when the comparison result between the simulation result and the breakdown field strength of air and the dielectric exceeds the preset withstand voltage performance limit, the method can adjust the devices around the field strength exceeding the limit in the PCB board, replace the devices with high insulation performance, or modify the routing spacing and line width of the PCB board at this position, etc., so that the simulation result meets the limit requirements.

[0087] In this embodiment, the above adjustment can be an adjustment made manually or an automatic adjustment made by the method according to preset rules. In either case, the method can generate a device adjustment scheme according to the adjustment result.

[0088] S112. Output the prediction result of the board insulation withstand voltage performance and the device adjustment scheme.

[0089] In this embodiment, the excitation voltage value of the excitation voltage used in the method is the power supply high voltage * 2 + 1000V when the high-voltage power equipment works. Among them, the voltage source can be a DC voltage source or a power frequency AC voltage source, and the method can select DC voltage and 50Hz AC power frequency voltage.

[0090] For example, this method can import the PCB board design file completed by EDA software design, and accurately set the stack-up, routing, and device information of the PCB board, such as the material and thickness of the wire, and the material and thickness of the dielectric layer. After that, all the passive devices on the PCB board are replaced with equivalent circuit models with parasitic capacitance, parasitic inductance, and parasitic resistance, and an interface circuit composed of passive devices is added to the pin positions of the active devices. According to the requirements in the test outline, at the position of the external connector of the PCB board, that is, the test withstand voltage injection position, all signal pins are short-circuited and a high voltage source is added as an impact signal. Then, the near electric field of the PCB board is simulated and calculated, and the simulation result is compared with the electric field breakdown field strength of air and the dielectric. When the field strength value is exceeded, it indicates that there is a risk of failing the insulation withstand voltage. Generally, the breakdown field strength of air is 3e6V / m, and the breakdown field strength of FR4 is 14e6V / m. When the above comparison result exceeds the limit value, the user can adjust the devices around the field strength exceeding the limit value in the PCB board, replace the devices with high insulation performance, or modify the routing pitch and line width of the PCB board at this position, so that it can meet the requirements below the limit value and complete the rectification.

[0091] In this embodiment, the execution subject of this method can be a computing device such as a computer or a server, and no limitation is made in this embodiment.

[0092] In this embodiment, the execution subject of this method can also be a smart device such as a smart phone or a tablet computer, and no limitation is made in this embodiment.

[0093] It can be seen that implementing the PCB board insulation withstand voltage performance prediction method described in this embodiment can be suitable for evaluating and predicting the insulation safety performance of high-voltage electrical equipment in the early stage of development; at the same time, only using the PCB board layout design file in the high-voltage electrical equipment and the specification sheet of the devices soldered on it, the insulation withstand voltage can be predicted, and there is no risk of damaging the devices or test safety, so that the safety performance of the product insulation withstand voltage can be truly designed and predicted in the early stage of product development. In addition, this method can not only quickly predict the results during the rectification process of the insulation withstand voltage performance of high-voltage electrical equipment, but also provide a visual result graph to accurately locate the position of the risk point of exceeding the insulation withstand voltage standard, so as to provide a good theoretical basis for rectification. Finally, it is more convenient and fast to replace devices and modify routing in the PCB board electronic design file of this method, which is suitable for quickly simulating and analyzing the influence degree of different rectification measures on the insulation withstand voltage performance, and can provide a variety of effective and low-cost rectification schemes when obtaining the simulation results, so that this method has good feasibility and practicability.

[0094] Embodiment 2

[0095] Please refer to Figure 2 , Figure 2The structural schematic diagram of a device for predicting the insulation withstand voltage performance of a PCB provided by an embodiment of the present application. As Figure 2 shown, the device for predicting the insulation withstand voltage performance of the PCB includes:

[0096] An import unit 210, configured to import the design file of the target PCB;

[0097] A first acquisition unit 220, configured to obtain a PCB model according to the design file;

[0098] A preprocessing unit 230, configured to preprocess the PCB model to obtain a preprocessed model;

[0099] A simulation unit 240, configured to simulate and calculate the near electric field / magnetic field of the PCB through the preprocessed model to obtain a simulation result;

[0100] A comparison unit 250, configured to compare the simulation result with the breakdown field strengths of air and the dielectric to obtain the prediction result of the board insulation withstand voltage performance of the target PCB.

[0101] As an optional implementation manner, the preprocessing unit 230 includes:

[0102] A first determination subunit 231, configured to determine the positions of passive devices, active devices, and external connectors on the PCB model that only carry nominal values;

[0103] A replacement subunit 232, configured to replace the passive devices with a preset equivalent circuit model to obtain a first processed PCB model;

[0104] A substitution subunit 233, configured to replace the positions of the active devices with a preset interface circuit to obtain a second processed PCB model;

[0105] A short-circuit subunit 234, configured to short-circuit all signal pins at the position of the external connector to obtain a third processed PCB model;

[0106] An addition subunit 235, configured to add a high-voltage source as an impact signal at the short-circuited signal pins to obtain a preprocessed model.

[0107] As an optional implementation manner, the device for predicting the insulation withstand voltage performance of the PCB further includes:

[0108] A judgment unit 260, configured to judge whether the prediction result of the board insulation withstand voltage performance exceeds a preset withstand voltage performance limit;

[0109] A second acquisition unit 270, further configured to obtain a device adjustment scheme for the target PCB according to the prediction result of the board insulation withstand voltage performance when it is judged that the preset withstand voltage performance limit is exceeded;

[0110] An output unit 280 for outputting the prediction result of the board insulation withstand voltage performance and the device adjustment scheme.

[0111] As an alternative implementation, the second acquisition unit 270 includes:

[0112] A second determination subunit 271 for determining the stack-up information, trace information, and device information of the target PCB board according to the design document; and determining the target devices around the field strength exceeding the limit in the target PCB board according to the prediction result of the board insulation withstand voltage performance and the device information;

[0113] An acquisition subunit 272 for acquiring the device adjustment scheme for high-insulation-performance devices for the target devices; and acquiring the trace adjustment scheme for the trace pitch and line width of the PCB board;

[0114] A generation subunit 273 for generating a device adjustment scheme according to the device adjustment scheme for high-insulation-performance devices and the trace adjustment scheme.

[0115] In the embodiments of the present application, the explanation of the PCB board insulation withstand voltage performance prediction device may refer to the description in Embodiment 1, and will not be elaborated herein.

[0116] It can be seen that implementing the PCB board insulation withstand voltage performance prediction device described in this embodiment can be suitable for evaluating and predicting the insulation safety performance of high-voltage electrical equipment in the early stage of development; at the same time, only using the PCB board layout design document in the high-voltage electrical equipment and the specification of the devices soldered on it, insulation withstand voltage prediction can be carried out, and there is no risk of damaging the devices or testing safety, thus truly achieving the pre-design and prediction of the insulation withstand voltage safety performance of the product in the early stage of product development. In addition, this method can not only quickly predict the results during the rectification process of the insulation withstand voltage performance of high-voltage electrical equipment, but also provide a visual result graph to accurately locate the position of the risk point of exceeding the insulation withstand voltage standard, thereby providing a good theoretical basis for rectification. Finally, it is more convenient and fast to replace devices and modify traces in the PCB board electronic design document in this method, which is suitable for quickly simulating the influence degree of different rectification measures on the insulation withstand voltage performance, and can provide a variety of effective and low-cost rectification schemes when obtaining the simulation results, so that this method has good feasibility and practicability.

[0117] The embodiments of the present application provide an electronic device, including a memory and a processor, the memory is used for storing a computer program, and the processor runs the computer program to enable the electronic device to execute the PCB board insulation withstand voltage performance prediction method in Embodiment 1 of the present application.

[0118] An embodiment of the present application provides a computer-readable storage medium storing computer program instructions. When the computer program instructions are read and run by a processor, the method for predicting the insulation withstand voltage performance of the PCB board in Embodiment 1 of the present application is executed.

[0119] In several embodiments provided by the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architectures, functions, and operations of devices, methods, and computer program products according to multiple embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order from that marked in the accompanying drawings. For example, two consecutive blocks can actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, as well as the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0120] In addition, in each embodiment of the present application, the various functional modules can be integrated together to form an independent part, or each module can exist separately, or two or more modules can be integrated to form an independent part.

[0121] If the function is implemented in the form of a software functional module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store program codes.

[0122] The above are only embodiments of the present application and are not intended to limit the protection scope of the present application. For those skilled in the art, various modifications and changes can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application. It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0123] As described above, this is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, and all should be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

[0124] It should be noted that in this text, relative terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

Claims

1. A method for predicting the insulation withstand voltage performance of a PCB board, characterized in that, Including: Importing the design file of the target PCB board; Obtaining the PCB board model according to the design file; Determining the positions of passive devices, active devices and external connectors with only nominal values on the PCB board model; Replacing the passive devices with a preset equivalent circuit model to obtain a first processed PCB board model; Replacing the positions of the active devices with a preset interface circuit to obtain a second processed PCB board model; Short-circuiting all signal pins at the positions of the external connectors to obtain a third processed PCB board model; Adding a high-voltage source as an impact signal at the short-circuited signal pins to obtain a preprocessed model; Simulating and calculating the near electric field / magnetic field of the PCB board through the preprocessed model to obtain a simulation result; Comparing the simulation result with the breakdown field strengths of air and the dielectric to obtain the prediction result of the board insulation withstand voltage performance of the target PCB board.

2. The method for predicting the insulation withstand voltage performance of a PCB board according to claim 1, wherein The method further includes: Judging whether the prediction result of the board insulation withstand voltage performance exceeds a preset withstand voltage performance limit value; If so, obtaining a device adjustment scheme for the target PCB board according to the prediction result of the board insulation withstand voltage performance; Outputting the prediction result of the board insulation withstand voltage performance and the device adjustment scheme.

3. The method for predicting the insulation withstand voltage performance of the PCB board according to claim 2, wherein The obtaining a device adjustment scheme for the target PCB board according to the prediction result of the board insulation withstand voltage performance includes: Determining the stack-up information, trace information and device information of the target PCB board according to the design file; Determining the target devices around the field strength exceeding the limit value in the target PCB board according to the prediction result of the board insulation withstand voltage performance and the device information; Obtaining a high-insulation performance device adjustment scheme for the target devices; Obtaining a trace adjustment scheme for the trace pitch and line width of the PCB board; Generating a device adjustment scheme according to the high-insulation performance device adjustment scheme and the trace adjustment scheme.

4. A device for predicting the insulation withstand voltage performance of a PCB board, characterized in that, The PCB board insulation withstand voltage performance prediction device includes: An import unit for importing the design file of the target PCB board; A first acquisition unit for obtaining the PCB board model according to the design file; A preprocessing unit for preprocessing the PCB board model to obtain a preprocessed model; A simulation unit for simulating and calculating the near electric field / magnetic field of the PCB board through the preprocessed model to obtain a simulation result; A comparison unit for comparing the simulation result with the breakdown field strengths of air and the dielectric to obtain the prediction result of the board insulation withstand voltage performance of the target PCB board; Wherein, the preprocessing unit includes: A first determination subunit for determining the positions of passive devices, active devices and external connectors with only nominal values on the PCB board model; A replacement subunit for replacing the passive devices with a preset equivalent circuit model to obtain a first processed PCB board model; A replacement subunit for replacing the positions of the active devices with a preset interface circuit to obtain a second processed PCB board model; A short-circuiting subunit for short-circuiting all signal pins at the positions of the external connectors to obtain a third processed PCB board model; An adding subunit for adding a high-voltage source as an impact signal at the short-circuited signal pins to obtain a preprocessed model.

5. The PCB board insulation withstand voltage performance prediction device according to claim 4, characterized in that The PCB board insulation withstand voltage performance prediction device further includes: a judgment unit, configured to judge whether the predicted result of the board insulation withstand voltage performance exceeds a preset withstand voltage performance limit value; a second acquisition unit, further configured to, when it is judged that the preset withstand voltage performance limit value is exceeded, acquire a device adjustment scheme for the target PCB board according to the predicted result of the board insulation withstand voltage performance; an output unit, configured to output the predicted result of the board insulation withstand voltage performance and the device adjustment scheme.

6. The PCB board insulation withstanding voltage performance prediction device according to claim 5, characterized in that, The second acquisition unit includes: a second determination subunit, configured to determine the stack-up information, trace information, and device information of the target PCB board according to the design document; and determine the target devices around the field strength exceeding the limit in the target PCB board according to the predicted result of the board insulation withstand voltage performance and the device information; an acquisition subunit, configured to acquire a high-insulation performance device adjustment scheme for the target device; and acquire a trace adjustment scheme for the trace pitch and line width of the PCB board; a generation subunit, configured to generate a device adjustment scheme according to the high-insulation performance device adjustment scheme and the trace adjustment scheme.

7. An electronic device, characterized in that, The electronic device includes a memory and a processor, the memory is used to store a computer program, and the processor runs the computer program to enable the electronic device to execute the PCB board insulation withstand voltage performance prediction method according to any one of claims 1 to 3.

8. A readable storage medium, characterized in that, Computer program instructions are stored in the readable storage medium, and when the computer program instructions are read and run by a processor, the PCB board insulation withstand voltage performance prediction method according to any one of claims 1 to 3 is executed.

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