Display panel, method for manufacturing display panel, and display device

Abstract

The embodiment of the present application provides a display panel, including a substrate and a driving circuit layer; the driving circuit layer is located on one side of the substrate, the driving circuit layer includes a plurality of driving circuits distributed in an array, the driving circuit includes an active layer, a first insulating layer, a gate metal layer and a source-drain metal layer, the source-drain metal layer includes a source and a drain, the source is connected to the active layer through a first via, and the drain is connected to the active layer through a second via; the driving circuit also includes a hole recombination layer, the hole recombination layer is located on the side of the active layer away from the substrate and is in contact with the active layer, the orthographic projection of the hole recombination layer on the substrate is located between the orthographic projection of the first via and the second via on the substrate, and the hole recombination layer is used to generate photogenerated electrons. The display panel, the manufacturing method of the display panel and the display device provided by the embodiment of the present application can improve the voltage stability and optical stability of the driving circuit in the display panel, and improve the display effect of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a method for manufacturing a display panel, and a display device. Background Art

[0002] TFT (Thin Film Transistor) liquid crystal display panels have the advantages of high brightness, high contrast, strong layering and bright colors, and are widely used in life. Among them, MO-TFT (Metal Oxide TFT) has the advantages of high mobility, good electrical uniformity, transparency to visible light, low preparation temperature and low cost, and is considered to be an ideal active device suitable for driving organic light-emitting diodes (OLED) and high-resolution liquid crystal displays (LCD), and is currently a research hotspot in academia and industry.

[0003] In the related art, during the operation of the MO-TFT display panel, the driving circuit in the MO-TFT display panel is subjected to long-term negative bias and light exposure, which may cause threshold voltage drift in the driving circuit, affecting the voltage stability and optical stability of the driving circuit and the display effect of the display panel. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display panel, a method for manufacturing a display panel, and a display device to improve the voltage stability and optical stability of a driving circuit in the display panel and improve the display effect of the display panel. The specific technical solution is as follows:

[0005] An embodiment of the first aspect of the present application provides a display panel, including a substrate and a driving circuit layer; the driving circuit layer is located on one side of the substrate, the driving circuit layer includes a plurality of driving circuits distributed in an array, the driving circuit includes an active layer, a first insulating layer, a gate metal layer and a source-drain metal layer, the source-drain metal layer includes a source and a drain, the source is connected to the active layer through a first via, and the drain is connected to the active layer through a second via; the driving circuit also includes a hole recombination layer, the hole recombination layer is located on a side of the active layer away from the substrate and is in contact with the active layer, the orthographic projection of the hole recombination layer on the substrate is located between the orthographic projection of the first via and the second via on the substrate, and the hole recombination layer is used to generate photogenerated electrons.

[0006] In some embodiments, the gate metal layer includes a gate, and an orthographic projection of the gate on the base substrate overlaps with an orthographic projection of the hole recombination layer on the base substrate.

[0007] In some embodiments, the material of the active layer includes metal oxide.

[0008] In some embodiments, the material of the hole composite layer includes perylene imide.

[0009] In some embodiments, the driving circuit further includes a second insulating layer, an interlayer dielectric layer and a passivation layer; the second insulating layer is arranged on a side of the gate metal layer away from the substrate; the interlayer dielectric layer is arranged on a side of the second insulating layer away from the substrate; the passivation layer is arranged on a side of the source and drain metal layer away from the substrate.

[0010] In some embodiments, the display panel also includes a light-emitting layer, which is located on a side of the driving circuit layer away from the base substrate, and the light-emitting layer includes a plurality of light-emitting units arranged corresponding to the plurality of driving circuits, and the light-emitting units include an anode layer, an organic light-emitting layer, and a cathode layer arranged in sequence along a side away from the base substrate, and the anode layer is connected to the source or the drain via.

[0011] In some embodiments, the display panel further comprises a liquid crystal layer disposed on a side of the driving circuit layer away from the base substrate, the liquid crystal layer comprises a plurality of liquid crystal units, and the plurality of liquid crystal units are disposed corresponding to the plurality of driving circuits.

[0012] An embodiment of a second aspect of the present application provides a method for manufacturing a display panel, including:

[0013] Providing a substrate;

[0014] A driving circuit layer is formed on one side of the base substrate, the driving circuit layer includes a plurality of driving circuits distributed in an array, the driving circuit includes an active layer, a first insulating layer, a gate metal layer and a source-drain metal layer, the source-drain metal layer includes a source and a drain, the source is connected to the active layer through a first via, and the drain is connected to the active layer through a second via; the driving circuit also includes a hole recombination layer, the hole recombination layer is in contact with the active layer, the orthographic projection of the hole recombination layer on the base substrate is located between the orthographic projection of the first via and the second via on the base substrate, and the hole recombination layer is used to generate photogenerated electrons.

[0015] In some embodiments, the step of forming the driving circuit layer on one side of the base substrate includes:

[0016] forming the active layer on one side of the base substrate;

[0017] Providing a first mask, and forming a hole recombination layer on a side of the active layer away from the substrate through the first mask;

[0018] Forming a first insulating layer on a side of the hole recombination layer away from the substrate;

[0019] forming a gate metal layer on a side of the first insulating layer away from the base substrate, and patterning the gate metal layer through the first mask to obtain a gate;

[0020] Forming a source-drain metal layer on a side of the gate metal layer away from the substrate;

[0021] A second mask is provided, and the source-drain metal layer is patterned by the second mask to obtain a source electrode and a drain electrode.

[0022] An embodiment of a third aspect of the present application provides a display device, which includes any one of the display panels described above.

[0023] Beneficial effects of the embodiments of the present application:

[0024] In the display panel provided by the embodiment of the present application, the display panel includes a base substrate and a driving circuit layer located on one side of the base substrate, the driving circuit layer includes a plurality of driving circuits distributed in an array, the driving circuit includes an active layer and a hole recombination layer contacting and connected to the active layer, and the driving circuit also includes a source electrode and a drain electrode, the source electrode and the drain electrode are connected to the active layer through a first via hole and a second via hole, respectively. The hole recombination layer is located between the first via hole and the second via hole, the hole recombination layer is arranged correspondingly to the channel region between the source electrode and the drain electrode in the source-drain metal layer, and the hole recombination layer is arranged correspondingly to the electron conductive channel connecting the source electrode and the drain electrode generated during the voltage application process of the active layer. During the operation of the display panel, the hole recombination layer can generate photogenerated electrons under the action of light, and the photogenerated electrons can recombine with holes generated by the active layer under the action of negative bias and light. The recombination of photogenerated electrons and holes can reduce the probability of hole migration in the display panel, and reduce the probability of hole accumulation at the junction of the active layer and the first insulating layer and in the electron conduction channel, thereby reducing the probability of threshold voltage drift caused by a large number of holes in the driving circuit, thereby improving the voltage stability and optical stability of the display panel, and improving the display effect of the display panel.

[0025] Of course, it is not necessary to achieve all the advantages described above at the same time when implementing any product or method of the present application. The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other embodiments can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 A schematic diagram of the structure of a display panel in some embodiments of the present application;

[0028] Figure 2 for Figure 1 A cross-sectional view along the AA direction;

[0029] Figure 3 for Figure 1 Another cross-sectional view along the AA direction;

[0030] Figure 4 for Figure 1 Another cross-sectional view along the AA direction;

[0031] Figure 5 This is a flow chart of a method for manufacturing a display panel in some embodiments of the present application.

[0032] Figure numerals: 100-display panel, 1-substrate, 2-driving circuit layer, 20-driving circuit, 201-active layer, 2011-first via hole, 2012-second via hole, 202-hole recombination layer, 203-first insulating layer, 204-gate metal layer, 2041-gate, 205-second insulating layer, 206-interlayer dielectric layer, 207-source-drain metal layer, 208-passivation layer, 209-planarization layer, 2071-source, 2072-drain, 3-light-emitting layer, 30-light-emitting unit, 301-anode layer, 302-organic light-emitting layer, 303-cathode layer, 4-encapsulation layer, 5-liquid crystal layer, 6-pixel defining layer. DETAILED DESCRIPTION

[0033] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0035] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0036] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0037] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0038] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0039] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0040] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0041] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0042] In the related art, the MO-TFT display panel has excellent display performance. The material of some layer structures of the MO-TFT display panel includes metal oxides or other oxygen-containing compounds. During the operation of the display panel, oxygen atoms (or oxygen ions) in the lattice of some layer structures formed by metal oxides will be separated, resulting in oxygen deficiency, thereby forming oxygen vacancies. Specifically, during the operation of the display panel, the active layer and the gate insulating layer in the driving circuit will be affected by negative bias and light, so that the oxygen vacancies in the active layer are easily converted into holes. The holes are conductive. The holes will migrate under the action of negative bias and accumulate at the junction of the active layer and the first insulating layer, which may cause the driving circuit to have threshold voltage drift and other phenomena, affecting the voltage stability and optical stability of the driving circuit, and affecting the display effect of the display panel.

[0043] In order to improve the voltage stability and optical stability of the display panel and improve the display effect of the display panel, the embodiment of the present application provides a display panel, a method for manufacturing a display panel and a display device. The display panel, the method for manufacturing a display panel and the display device provided in the embodiment of the present application will be described in detail with reference to the accompanying drawings. Among them, the display panel can be an LCD (Liquid Crystal Display), an electroluminescent display panel or a photoluminescent display panel. In the case where the display panel is an electroluminescent display panel, the electroluminescent display panel can be an OLED (Organic Light-Emitting Diode) or a QLED (Quantum Dot Light Emitting Diodes). In the case where the display panel is a photoluminescent display panel, the photoluminescent display panel can be a quantum dot photoluminescent display panel.

[0044] The embodiment of the first aspect of the present application provides a display panel 100, such as Figures 1 to 4 As shown, it includes a base substrate 1 and a driving circuit layer 2; the driving circuit layer 2 is located on one side of the base substrate 1, and the driving circuit layer 2 includes a plurality of driving circuits 20 distributed in an array, the driving circuit 20 includes an active layer 201, a first insulating layer 203, a gate metal layer 204 and a source-drain metal layer 207, the source-drain metal layer 207 includes a source 2071 and a drain 2072, the source 2071 is connected to the active layer 201 through a first via 2011, and the drain 2072 is connected to the active layer 201 through a second via 2012; the driving circuit 20 also includes a hole recombination layer 202, the hole recombination layer 202 is located on a side of the active layer 201 away from the base substrate 1 and is in contact with the active layer 201, the orthographic projection of the hole recombination layer 202 on the base substrate 1 is located between the orthographic projections of the first via 2011 and the second via 2012 on the base substrate 1, and the hole recombination layer 202 is used to generate photogenerated electrons.

[0045] In the embodiment of the present application, the driving circuit 20 may be a top gate structure, and the display panel 100 may be a bottom gate structure or a double gate structure, which is not specifically limited in the present application. Figure 3 and Figure 4 As shown, taking the display panel 100 as a top gate structure as an example, the driving circuit 20 includes an active layer 201, a first insulating layer 203, a gate metal layer 204 and a source-drain metal layer 207 which are sequentially arranged in a direction away from the base substrate 1. The hole recombination layer 202 is located between the active layer 201 and the first insulating layer 203 and is in contact with the active layer 201.

[0046] In the embodiment of the present application, the materials of the gate metal layer 204 and the source-drain metal layer 207 may include metal materials such as copper, aluminum, silver, or alloy materials containing the above metal materials. The material of the first insulating layer 203 may include inorganic insulating materials such as silicon oxide, silicon nitride, silicon oxynitride, or may include organic insulating materials such as polyimide, polyphthalimide, polyphthalamide, acrylic resin, benzocyclobutene or phenolic resin. The source 2071 and the drain 2072 may include a copper layer and a molybdenum-niobium layer, and the molybdenum-niobium layer has a protective effect on the copper layer, which can reduce the probability of the copper layer being corroded.

[0047] In the present application embodiment, Figure 2 As shown, the display panel 100 includes a base substrate 1 and a driving circuit layer 2 located on one side of the base substrate 1, the driving circuit layer 2 includes a plurality of driving circuits 20 distributed in an array, the driving circuit 20 includes an active layer 201 and a hole recombination layer 202 in contact with the active layer 201, and the driving circuit 20 also includes a source electrode 2071 and a drain electrode 2072, the source electrode 2071 and the drain electrode 2072 are respectively connected to the active layer 201 through a first via hole 2011 and a second via hole 2012. The hole recombination layer 202 is located between the first via hole 2011 and the second via hole 2012, the hole recombination layer 202 is arranged correspondingly to the channel region between the source electrode 2071 and the drain electrode 2072 in the source-drain metal layer 207, and the hole recombination layer 202 is arranged correspondingly to the electron conductive channel connecting the source electrode 2071 and the drain electrode 2072 generated during the voltage application process of the active layer 201. During the operation of the display panel 100, the hole recombination layer 202 can generate photogenerated electrons under the action of light, and the photogenerated electrons can recombine with holes generated by the active layer 201 under the action of negative bias and light. The recombination of photogenerated electrons and holes can reduce the probability of holes migrating in the display panel 100, and reduce the probability of holes accumulating at the junction of the active layer 201 and the first insulating layer 203 and in the electron conductive channel, thereby reducing the probability of threshold voltage drift caused by a large number of holes in the driving circuit 20, thereby improving the voltage stability and optical stability of the display panel 100, and improving the display effect of the display panel 100.

[0048] Furthermore, the substrate 1 may be a rigid substrate, such as a glass substrate, etc. The substrate 1 may also be a flexible substrate, such as a polyimide substrate, etc., which is not limited in the present application.

[0049] In some embodiments, Figure 2 , Figure 3 and Figure 4As shown, the gate metal layer 204 includes a gate 2041, and the orthographic projection of the gate 2041 on the base substrate 1 overlaps with the orthographic projection of the hole composite layer 202 on the base substrate 1. In the manufacturing process of the display panel 100, the gate 2041 and the hole composite layer 202 can be formed by patterning using the same mask plate, which can simplify the manufacturing process of the display panel 100, reduce the complexity of the manufacturing process of the display panel 100, and reduce the manufacturing cost.

[0050] In some embodiments, the material of the active layer 201 includes metal oxide.

[0051] In the embodiment of the present application, the material of the active layer 201 includes metal oxides, such as zinc oxide, etc., which can improve the electron mobility of the active layer 201 and increase the conductivity of the active layer 201. Further, the material of the active layer 201 includes transparent metal oxides, such as indium tin oxide, indium zinc oxide, indium gallium zinc oxide, etc. Transparent metal oxides have good conductivity and light transmittance, can improve the electron mobility of the display panel 100 and the transmittance of the display panel 100, and further improve the display effect of the display panel 100.

[0052] In some embodiments, the material of the hole recombination layer 202 includes perylene imide. The perylene imide material can generate photogenerated electrons under the action of light, and the photogenerated electrons can recombine with holes at the interface between the active layer 201 and the first insulating layer 203, which can improve the voltage stability and optical stability of the display panel 100 and improve the display effect of the display panel 100. The imide group of perylene imide has a strong electron-withdrawing effect, so that perylene imide has a higher electron affinity, which can further improve the voltage stability of the display panel 100 and improve the display effect of the display panel 100.

[0053] Furthermore, the material of the hole composite layer 202 can also be other photosensitive materials that can generate photogenerated electrons under light, such as perylene imide derivatives. Perylene imide derivatives have excellent optical stability and electrochemical stability, which can further improve the display effect of the display panel 100. Perylene imide and its derivatives also have the advantages of being able to be prepared in large quantities, low production cost, and being designable at the molecular level, which can reduce the production cost of the display panel 100.

[0054] In some embodiments, Figure 3 and Figure 4 As shown, the driving circuit 20 also includes a second insulating layer 205, an interlayer dielectric layer 206 and a passivation layer 208; the second insulating layer 205 is arranged on the side of the gate metal layer 204 away from the base substrate 1; the interlayer dielectric layer 206 is arranged on the side of the second insulating layer 205 away from the base substrate 1; the passivation layer 208 is arranged on the side of the source and drain metal layer 207 away from the base substrate 1.

[0055] In the embodiment of the present application, the passivation layer 208 is used to protect other layer structures below and slow down the corrosion rate of layer structures such as the source and drain metal layer 207. The display panel 100 also includes a planarization layer 209 arranged above the passivation layer 208. The planarization layer 209 is used to improve the flatness of the surface of the driving circuit 20 away from the substrate 1, so as to facilitate the production of subsequent film layers. Optionally, the materials of the planarization layer, the passivation layer 208 and the second insulating layer 205 may include inorganic insulating materials such as silicon oxide, silicon nitride, silicon oxynitride, etc. Optionally, the material of the second insulating layer 205 may also include organic insulating materials such as polyimide, polyimide, polyphthalamide, acrylic resin, benzocyclobutene or phenolic resin.

[0056] In some embodiments, Figure 3 As shown, the display panel 100 also includes a light-emitting layer 3, which is located on the side of the driving circuit layer 2 away from the base substrate 1. The light-emitting layer 3 includes a plurality of light-emitting units 30 arranged corresponding to the driving circuit 20. The light-emitting unit 30 includes an anode layer 301, an organic light-emitting layer 302 and a cathode layer 303 arranged in sequence along a side away from the base substrate 1. The anode layer 301 is connected to the source 2071 or the drain 2072 through a via.

[0057] In the present application embodiment, Figure 3 As shown, the display panel 100 can be an organic light-emitting display panel, and the driving circuit 20 is used to drive the organic light-emitting layer 302 in the light-emitting unit 30 to emit light. Among them, the organic light-emitting layer 302 can be formed by evaporation, and the organic light-emitting layer 302 may include a hole transport layer and an electron transport layer arranged in a stacked manner. The anode layer 301 can be electrically connected to the pixel electrode or used as a pixel electrode, and the cathode layer 303 can be electrically connected to the common electrode or used as a common electrode. Optionally, the materials of the anode layer 301 and the cathode layer 303 may include transparent metal oxides, such as indium zinc oxide (IZO), indium tin oxide (ITO), etc. Optionally, the materials of the anode layer 301 and the cathode layer 303 may also include metal materials such as copper, aluminum, silver, or alloy materials containing the above-mentioned metal materials, etc., which can be set according to actual needs, and this application is not limited to this.

[0058] Further, such as Figure 3 As shown, the display panel 100 also includes a pixel defining layer 6, the anode layer 301 and the organic light-emitting layer 302 of each light-emitting unit 30 can be separated by the pixel defining layer 6, and the cathode layer 303 of each light-emitting unit 30 or the cathode layers 303 of some light-emitting units 30 can be connected as a whole so as to have the same electric potential.

[0059] Further, such as Figure 3As shown, the planarization layer 209 is provided with a via hole, which penetrates the passivation layer 208 and the planarization layer 209. The anode layer 301 is arranged above the planarization layer 209, and the anode layer 301 can be connected to the source 2071 or the drain 2072 of the source-drain metal layer 207 through the via hole on the planarization layer 209.

[0060] Further, such as Figure 3 As shown, the display panel 100 also includes an encapsulation layer 4, which is located on the side of the light-emitting layer 3 away from the base substrate 1 and covers the light-emitting layer 3 and the driving circuit layer 2. The encapsulation layer 4 can be a thin film encapsulation layer 4. The encapsulation layer 4 is used to encapsulate the light-emitting layer 3 to reduce the probability of failure of the light-emitting unit 30 and the underlying layer structure due to impurities such as water and oxygen entering the light-emitting layer 3. The material of the encapsulation layer 4 also includes silicon oxide, silicon oxynitride and silicon nitride. Furthermore, the encapsulation layer 4 can be a single-layer structure, and the encapsulation layer 4 can also be a multi-layer structure. When the encapsulation layer 4 is a multi-layer structure, the encapsulation layer 4 can include a first inorganic encapsulation layer 4, an organic encapsulation layer 4 and a second inorganic encapsulation layer 4 stacked in sequence to further enhance the encapsulation effect of the encapsulation layer 4.

[0061] In some embodiments, Figure 4 As shown, the display panel 100 further includes a liquid crystal layer 5 disposed on a side of the driving circuit layer 2 away from the base substrate 1 . The liquid crystal layer 5 includes a plurality of liquid crystal cells, and the plurality of liquid crystal cells are disposed correspondingly to the plurality of driving circuits 20 .

[0062] In the present application embodiment, Figure 4 As shown, the display panel 100 may be a thin film transistor liquid crystal display panel. The thin film transistor liquid crystal display panel includes the above-mentioned base substrate 1, and a plurality of driving circuits 20, an anode layer 301, a cathode layer 303 and a liquid crystal layer 5 located on one side of the base substrate 1. The liquid crystal layer 5 includes a plurality of liquid crystal cells, and the driving circuit layer 2 includes a plurality of driving circuits 20 arranged in one-to-one correspondence with the plurality of liquid crystal cells, and each driving circuit 20 is used to drive the liquid crystal molecules in the corresponding liquid crystal cell to undergo directional deflection.

[0063] The second aspect of the present application provides a method for manufacturing a display panel 100, such as Figure 5 As shown, including:

[0064] Step S501, providing a substrate;

[0065] Step S502, forming a driving circuit layer on one side of the substrate, the driving circuit layer including a plurality of driving circuits distributed in an array, the driving circuit including an active layer, a first insulating layer, a gate metal layer and a source-drain metal layer, the source-drain metal layer including a source and a drain, the source being connected to the active layer through a first via, and the drain being connected to the active layer through a second via; the driving circuit also includes a hole recombination layer, the hole recombination layer being in contact with the active layer, the orthographic projection of the hole recombination layer on the substrate being located between the orthographic projection of the first via and the second via on the substrate, and the hole recombination layer being used to generate photogenerated electrons.

[0066] In the display panel 100 provided in the embodiment of the present application, the display panel 100 includes a base substrate 1 and a driving circuit layer 2 located on one side of the base substrate 1, the driving circuit layer 2 includes a plurality of driving circuits 20 distributed in an array, the driving circuit 20 includes an active layer 201 and a hole recombination layer 202 in contact with the active layer 201, and the driving circuit 20 also includes a source electrode 2071 and a drain electrode 2072, the source electrode 2071 and the drain electrode 2072 are respectively connected to the active layer 201 through a first via hole 2011 and a second via hole 2012. The hole recombination layer 202 is located between the first via hole 2011 and the second via hole 2012, the hole recombination layer 202 is arranged correspondingly to the channel region between the source electrode 2071 and the drain electrode 2072 in the source-drain metal layer 207, and the hole recombination layer 202 is arranged correspondingly to the electron conductive channel connecting the source electrode 2071 and the drain electrode 2072 generated during the voltage application process of the active layer 201. During the operation of the display panel 100, the hole recombination layer 202 can generate photogenerated electrons under the action of light, and the photogenerated electrons can recombine with holes generated by the active layer 201 under the action of negative bias and light. The recombination of photogenerated electrons and holes can reduce the probability of holes migrating in the display panel 100, and reduce the probability of holes accumulating at the junction of the active layer 201 and the first insulating layer 203 and in the electron conductive channel, thereby reducing the probability of threshold voltage drift caused by a large number of holes in the driving circuit 20, thereby improving the voltage stability and optical stability of the display panel 100, and improving the display effect of the display panel 100.

[0067] In some embodiments, the step of forming the driving circuit layer 2 on one side of the base substrate 1 includes:

[0068] Step 1: forming an active layer 201 on one side of the base substrate 1;

[0069] Step 2: providing a first mask, and forming a hole recombination layer 202 on a side of the active layer 201 away from the substrate 1 through the first mask;

[0070] Step 3, forming a first insulating layer 203 on a side of the hole recombination layer 202 away from the base substrate 1;

[0071] Step 4: forming a gate metal layer 204 on a side of the first insulating layer 203 away from the base substrate 1, and patterning the gate metal layer 204 through a first mask to obtain a gate 2041;

[0072] Step 5, forming a source-drain metal layer 207 on a side of the gate metal layer 204 away from the base substrate 1;

[0073] Step six: provide a second mask, and pattern the source-drain metal layer 207 through the second mask to obtain a source electrode 2071 and a drain electrode 2072 .

[0074] In the present application embodiment, Figure 2 As shown, the gate 2041 and the hole composite layer 202 can be made by using the first mask. The gate 2041 and the hole composite layer 202 are made by using the same mask, which can simplify the manufacturing process of the display panel 100, reduce the complexity of the manufacturing process of the display panel 100, and reduce the manufacturing cost. Of course, the gate 2041 and the hole composite layer 202 can also be made by two different masks, which is not limited in this application.

[0075] In the embodiment of the present application, step 4 can be refined as follows: forming a gate metal layer 204 on the first insulating layer 203, exposing and developing the gate metal layer 204 using a first mask to transfer the pattern of the first mask to the gate metal layer 204, and then etching the gate metal layer 204 after exposure and development to form a gate 2041. Step 6 can be refined as follows: providing a second mask, exposing and developing the source-drain metal layer 207 through the second mask to transfer the pattern of the second mask to the source-drain metal layer 207, and then etching the source-drain metal layer 207 after exposure and development to form a source electrode 2071 and a drain electrode 2072.

[0076] An embodiment of a third aspect of the present application provides a display device, and the display device includes any one of the display panels 100 described above.

[0077] In the embodiment of the present application, the display device includes the display panel 100 in any of the above embodiments. The display device includes but is not limited to a mobile phone, a tablet computer, a monitor, a television, a picture screen, an advertising screen, an electronic paper, etc. Since the display device includes the above display panel 100, the display device has all the advantages of the above display panel 100.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A display panel, characterized in that: include: substrate substrate; A driving circuit layer, the driving circuit layer is located on one side of the substrate, the driving circuit layer includes a plurality of driving circuits distributed in an array, the driving circuit includes an active layer, a first insulating layer, a gate metal layer and a source-drain metal layer, the source-drain metal layer includes a source electrode and a drain electrode, the source electrode is connected to the active layer through a first via hole, and the drain electrode is connected to the active layer through a second via hole; The driving circuit also includes a hole recombination layer, which is located on a side of the active layer away from the substrate and is in contact with the active layer. The orthographic projection of the hole recombination layer on the substrate is located between the orthographic projections of the first via hole and the second via hole on the substrate, and the hole recombination layer is used to generate photogenerated electrons.

2. The display panel according to claim 1, characterized in that: The gate metal layer includes a gate, and an orthographic projection of the gate on the base substrate overlaps with an orthographic projection of the hole recombination layer on the base substrate.

3. The display panel according to claim 1, characterized in that: The material of the active layer includes metal oxide.

4. The display panel according to claim 1, characterized in that: The material of the hole composite layer includes perylene imide.

5. The display panel according to any one of claims 1 to 4, characterized in that: The driving circuit further includes: A second insulating layer, the second insulating layer is disposed on a side of the gate metal layer away from the base substrate; an interlayer dielectric layer, the interlayer dielectric layer being arranged on a side of the second insulating layer away from the base substrate; A passivation layer is disposed on a side of the source / drain metal layer away from the substrate.

6. The display panel according to any one of claims 1 to 4, characterized in that: The display panel also includes a light-emitting layer, which is located on a side of the driving circuit layer away from the base substrate. The light-emitting layer includes a plurality of light-emitting units arranged corresponding to the plurality of driving circuits. The light-emitting units include an anode layer, an organic light-emitting layer and a cathode layer arranged in sequence along a side away from the base substrate. The anode layer is connected to the source or drain via.

7. The display panel according to any one of claims 1 to 4, characterized in that: The display panel further comprises a liquid crystal layer disposed on a side of the driving circuit layer away from the base substrate, the liquid crystal layer comprises a plurality of liquid crystal units, and the plurality of liquid crystal units are disposed correspondingly to the plurality of driving circuits.

8. A method for manufacturing a display panel, characterized in that: include: Providing a substrate; A driving circuit layer is formed on one side of the base substrate, the driving circuit layer includes a plurality of driving circuits distributed in an array, the driving circuit includes an active layer, a first insulating layer, a gate metal layer and a source-drain metal layer, the source-drain metal layer includes a source and a drain, the source is connected to the active layer through a first via, and the drain is connected to the active layer through a second via; the driving circuit also includes a hole recombination layer, the hole recombination layer is in contact with the active layer, the orthographic projection of the hole recombination layer on the base substrate is located between the orthographic projection of the first via and the second via on the base substrate, and the hole recombination layer is used to generate photogenerated electrons.

9. The manufacturing method according to claim 8, characterized in that: The step of forming the driving circuit layer on one side of the base substrate comprises: forming the active layer on one side of the base substrate; Providing a first mask, and forming a hole recombination layer on a side of the active layer away from the substrate through the first mask; Forming a first insulating layer on a side of the hole recombination layer away from the substrate; forming a gate metal layer on a side of the first insulating layer away from the base substrate, and patterning the gate metal layer through the first mask to obtain a gate; Forming a source-drain metal layer on a side of the gate metal layer away from the substrate; A second mask is provided, and the source-drain metal layer is patterned by the second mask to obtain a source electrode and a drain electrode.

10. A display device, characterized in that: The display device comprises the display panel according to any one of claims 1 to 7.

Images