Method for manufacturing a two-color temperature partition light source

Abstract

The present invention relates to the technical field of light sources, and discloses a method for manufacturing a two-color temperature partitioned light source, including the following manufacturing steps: 1) Provide a substrate with a low color temperature light area and a high color temperature light area; fix chips at the bottoms of the low color temperature light area and the high color temperature light area respectively; 2) Wire bond on the substrate, set a dam on the substrate to cover the circuit structure; set isolation bars in the light emitting area; 3) Dispense glue in the low color temperature light area, and the low color temperature fluorescent glue covers the light emitting chips in the low color temperature light area; 4) Dispense glue in the high color temperature light area, and fill the high color temperature fluorescent glue in the high color temperature light area; The method for manufacturing a two-color temperature partitioned light source provided by the present invention separates the low color temperature light area from the high color temperature light area by setting isolation bars in the light emitting area. During the process of dispensing the low color temperature fluorescent glue and the high color temperature fluorescent glue, the low color temperature fluorescent glue and the high color temperature fluorescent glue will not be mixed, improving the quality of the two-color temperature partitioned light source, and the preparation process is also simple.

Description

Technical Field

[0001] This invention patent relates to the technical field of light sources. Specifically, it relates to a method for manufacturing a two-color temperature partitioned light source. Background Art

[0002] A light source is a light-emitting component in various lamps, including a substrate and light-emitting chips disposed on the substrate. The light-emitting chips are electrically connected to the substrate, and then a fluorescent glue is dotted on the substrate. The fluorescent glue wraps the multiple light-emitting chips, and the light emitted by the light-emitting chips is transmitted through the fluorescent glue.

[0003] A dam is convexly provided on the substrate. The dam surrounds and forms a light-emitting area on the substrate. A light-emitting chip is disposed at the bottom of the light-emitting area, and then the fluorescent glue is dotted in the light-emitting area. The light emitted by the light-emitting chip will be transmitted through the fluorescent glue. The light emitted by the light source is bluish and is cold light. If the emitted light is yellowish, it is warm light. Due to its functional characteristics and light-emitting principle, the light color of the light-emitting chip is cold. Thus, the cold light emitted by the light-emitting chip can be converted into warm light through the transmission of the fluorescent glue covering the light-emitting chip.

[0004] In the prior art, when the light source needs to achieve two-color temperature adjustment, it is necessary to dot the fluorescent glue of the two color temperatures in the light-emitting area, so that the light emitted by the light-emitting chips covered by different fluorescent glues can achieve different color temperatures, generally low-color-temperature fluorescent glue and high-color-temperature fluorescent glue.

[0005] However, in the process of manufacturing a two-color temperature partitioned light source, the low-color-temperature fluorescent glue and the high-color-temperature fluorescent glue are often easily mixed during the dotting process, resulting in poor quality of the two-color temperature partitioned light source and a complex manufacturing process. Summary of the Invention

[0006] The present invention provides a method for manufacturing a two-color temperature partitioned light source, aiming to solve the problem that in the prior art, there is a mixture of low-color-temperature fluorescent glue and high-color-temperature fluorescent glue in the manufacturing of the two-color temperature partitioned light source.

[0007] The present invention is implemented as follows. The method for manufacturing a two-color temperature partitioned light source includes the following manufacturing steps:

[0008] 1). Provide a substrate, which has a light-emitting area and a circuit structure thereon; the light-emitting area has a low-color-temperature light area and a high-color-temperature light area that are isolated from each other; respectively die-bond on the bottoms of the low-color-temperature light area and the high-color-temperature light area, and dispose the light-emitting chips at the bottoms of the low-color-temperature light area and the high-color-temperature light area respectively;

[0009] 2), wire bonding is performed on the substrate to electrically connect the light-emitting chip to the circuit structure; a dam is provided on the substrate, and the dam surrounds the outer periphery of the light-emitting area and covers the circuit structure; an isolation bar is provided in the light-emitting area, and the isolation bar separates and arranges the low-color-temperature light area from the high-color-temperature light area;

[0010] 3), dispense glue in the low-color-temperature light area, fill the low-color-temperature fluorescent glue in the low-color-temperature light area, and the low-color-temperature fluorescent glue covers the light-emitting chip in the low-color-temperature light area; place the substrate after dispensing in an oven and bake until the low-color-temperature fluorescent glue is dried;

[0011] 4), dispense glue in the high-color-temperature light area, fill the high-color-temperature fluorescent glue in the high-color-temperature light area, and the high-color-temperature fluorescent glue covers the light-emitting chip in the high-color-temperature light area, and the high-color-temperature fluorescent glue and the low-color-temperature fluorescent glue are separated by the isolation bar; place the substrate after dispensing in an oven and bake until the high-color-temperature fluorescent glue is dried to form a two-color-temperature partitioned light source.

[0012] Further, in the preparation step 1), before die bonding in the high-color-temperature light area and the low-color-temperature light area, the substrate is dehumidified.

[0013] Further, during the process of die bonding in the high-color-temperature light area and the low-color-temperature light area, the light-emitting chips are respectively fixed at the bottoms of the high-color-temperature light area and the low-color-temperature light area by glue.

[0014] Further, in the preparation step 2), before wire bonding, the substrate is subjected to plasma cleaning.

[0015] Further, after the preparation step 4), the two-color-temperature partitioned light source is subjected to splitting treatment in a splitter.

[0016] Further, after the preparation step 4), the split two-color-temperature partitioned light source is placed in a taping machine for taping treatment.

[0017] Further, after the preparation step 4), the taped two-color-temperature partitioned light source is placed on a tester for lighting test, and the qualified two-color-temperature partitioned light source is stored in the warehouse, and the unqualified two-color-temperature partitioned light source is collected in a waste bin.

[0018] Further, in the preparation step 3), after dispensing glue in the low-color-temperature light area, before baking in the oven, the substrate is fixed on the rotating disk of a rotating machine, the rotating machine has a rotating shaft, and a connecting shaft is connected to the rotating shaft; the connecting shaft is perpendicular to the rotating shaft, the inner end of the connecting shaft is connected to the rotating shaft, the outer end of the connecting shaft is connected to the rotating disk, and the light-emitting area of the low-color-temperature light area faces the rotating shaft;

[0019] The rotating shaft rotates, drives the rotating disk to make a longitudinal circular rotation through the connecting shaft, and drives the low-color-temperature fluorescent glue to settle on the light-emitting chip in the low-color-temperature light area under the action of centrifugal force.

[0020] Further, in the preparation step 4), after dispensing glue in the high-color-temperature light area and before baking in the oven, fix the substrate on the rotating disk of the rotating machine; the rotating shaft rotates, drives the rotating disk to make a longitudinal circular rotation through the connecting shaft, and drives the high-color-temperature fluorescent glue to settle on the light-emitting chip in the high-color-temperature light area under the action of centrifugal force.

[0021] Further, the light-emitting area is formed on the front surface of the substrate. After dispensing glue on the substrate, fix the back surfaces of multiple substrates on the flat plate, and multiple substrates are arranged at intervals in a dot matrix on the flat plate; the rotating disk has an outer side surface arranged away from the rotating shaft, and multiple grooves with open outer sides are provided on the outer side surface of the rotating disk, and multiple grooves are arranged at intervals in a dot matrix, and elastic columns protrude from the bottom of the grooves;

[0022] Abut the flat plate against the outer side surface of the rotating disk, embed the surrounding plates of multiple substrates into the grooves through the open outer sides, the substrates are exposed on the rotating outer side surface, the outer ends of the elastic columns abut against the low-color-temperature fluorescent glue and the high-color-temperature fluorescent glue, an isolation groove is provided in the middle of the outer end of the elastic column, the isolation strip is arranged opposite to the isolation groove and has a gap with the bottom of the isolation groove; an annular groove is provided in the middle of the elastic column, and the annular groove surrounds the outer circumference of the elastic column;

[0023] In the preparation step 3) and the preparation step 4), during the rotation of the rotating shaft, it rotates at a variable speed.

[0024] Compared with the prior art, the method for manufacturing a two-color-temperature partitioned light source provided by the present invention separates the low-color-temperature light area from the high-color-temperature light area by arranging an isolation strip in the light-emitting area. In this way, during the process of dispensing the low-color-temperature fluorescent glue and the high-color-temperature fluorescent glue, the low-color-temperature fluorescent glue and the high-color-temperature fluorescent glue will not be mixed, improving the quality of the two-color-temperature partitioned light source, and the preparation process is also simple. Description of the Drawings

[0025] Figure 1 is a schematic flow chart of the method for manufacturing a two-color-temperature partitioned light source provided by the present invention;

[0026] Figure 2 is a top view schematic diagram of the method for manufacturing a two-color-temperature partitioned light source provided by the present invention;

[0027] Figure 3 is a schematic connection diagram of the rotating shaft and the rotating disk provided by the present invention;

[0028] Figure 4It is a sectional view showing the cooperation between the elastic column and the substrate provided by the present invention. Detailed implementation manners

[0029] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0030] The implementation of the present invention will be described in detail below with reference to specific embodiments.

[0031] In the drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and cannot be understood as a limitation of this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.

[0032] Please refer to Figures 1 to 4 as shown, which is a preferred embodiment provided by the present invention.

[0033] A method for manufacturing a two-color temperature partition light source includes the following manufacturing steps:

[0034] 1), Provide a substrate 100, on which there are a light-emitting area and a circuit structure; the light-emitting area has a low-color-temperature light area 102 and a high-color-temperature light area 103 arranged separately; die-bonding is respectively carried out at the bottoms of the low-color-temperature light area 102 and the high-color-temperature light area 103, and the light-emitting chips 104 are respectively arranged at the bottoms of the low-color-temperature light area 102 and the high-color-temperature light area 103;

[0035] 2), Wire bonding is carried out on the substrate 100 to electrically connect the light-emitting chips 104 with the circuit structure; a dam 101 is arranged on the substrate 100, and the dam 101 surrounds the outer periphery of the light-emitting area and covers the circuit structure; an isolation strip 105 is arranged in the light-emitting area, and the isolation strip 105 separates the low-color-temperature light area 102 from the high-color-temperature light area 103;

[0036] 3), Glue is applied at the midpoint of the low-color-temperature light area 102, and the low-color-temperature fluorescent glue 301 is filled in the low-color-temperature light area 102, and the low-color-temperature fluorescent glue 301 covers the light-emitting chips 104 in the low-color-temperature light area 102; the substrate 100 after glue application is placed in an oven for baking until the low-color-temperature fluorescent glue 301 is dried;

[0037] 4), Apply glue at the midpoint of the high color temperature light area 103, fill the high color temperature fluorescent glue 302 in the high color temperature light area 103, the high color temperature fluorescent glue 302 covers the light-emitting chip 104 in the high color temperature light area 103, and the high color temperature fluorescent glue 302 and the low color temperature fluorescent glue 301 are separated by a separator 105; Place the glued substrate 100 in an oven and bake until the high color temperature fluorescent glue 302 is dried to form a two-color temperature partitioned light source.

[0038] In the method for manufacturing the two-color temperature partitioned light source provided above, by setting a separator 105 in the light-emitting area, the low color temperature light area 102 and the high color temperature light area 103 are separated. In this way, during the process of applying the low color temperature fluorescent glue 301 and the high color temperature fluorescent glue 302, the low color temperature fluorescent glue 301 and the high color temperature fluorescent glue 302 will not be mixed, improving the quality of the two-color temperature partitioned light source, and the manufacturing process is also simple.

[0039] In preparation step 1), before die bonding in the high color temperature light area 103 and the low color temperature light area 102, the substrate 100 is dehumidified to keep the substrate 100 in a dry state.

[0040] During the process of die bonding in the high color temperature light area 103 and the low color temperature light area 102, the light-emitting chips 104 are respectively fixed at the bottoms of the high color temperature light area 103 and the low color temperature light area 102 using glue. In this way, the light-emitting chips 104 can be firmly fixed at the bottoms of the low color temperature light area 102 and the high color temperature light area 103.

[0041] In preparation step 2), before wire bonding, the substrate 100 is subjected to plasma cleaning.

[0042] After preparation step 4), the two-color temperature partitioned light source is subjected to spectral splitting treatment in a spectrometer.

[0043] After preparation step 4), the spectrally split two-color temperature partitioned light source is placed in a taping machine for taping treatment.

[0044] After preparation step 4), the taped two-color temperature partitioned light source is placed on a testing machine for lighting test, and the qualified two-color temperature partitioned light sources are stored in the warehouse, and the unqualified two-color temperature partitioned light sources are collected in a waste bin.

[0045] In preparation step 3), after the low color temperature light area 102 is glued, before baking in the oven, the substrate 100 is fixed on the rotating disk 202 of a rotating machine. The rotating machine has a rotating shaft 200, and a connecting shaft 201 is connected to the rotating shaft 200; The connecting shaft 201 is perpendicularly arranged with respect to the rotating shaft 200. The inner end of the connecting shaft 201 is connected to the rotating shaft 200, the outer end of the connecting shaft 201 is connected to the rotating disk 202, and the light-emitting area of the low color temperature light area 102 faces the rotating shaft 200;

[0046] The rotating shaft 200 rotates, driving the rotating disk 202 to make longitudinal circular rotation through the connecting shaft 201 , driving the low color temperature fluorescent glue 301 to settle on the light emitting chip 104 in the low color temperature light area 102 under the action of centrifugal force.

[0047] After the low color temperature fluorescent glue 301 is applied, the low color temperature fluorescent glue 301 may not completely abut against the light emitting chip 104, which will affect the quality of the light source. By fixing the substrate 100 after the adhesive is applied on the rotating disk 202, and arranging the light emitting area toward the rotating shaft 200, when the rotating shaft 200 rotates, the low color temperature fluorescent glue 301 is subjected to the centrifugal force and will be firmly settled on the light emitting chip 104.

[0048] In this embodiment, in the preparation step 4), after the high color temperature light zone 103 is glued, before being baked in the oven, the substrate 100 is fixed on the rotating disk 202 of the rotating machine; the rotating shaft 200 rotates, and the rotating disk 202 is driven to make a longitudinal circular rotation through the connecting shaft 201, driving the high color temperature fluorescent glue 302 to be subjected to the centrifugal force and settle on the light-emitting chip 104 of the high color temperature light zone 103.

[0049] In this way, consistent with the above principle, the high color temperature fluorescent glue 302 is subjected to the centrifugal force and then settles on the light emitting chip 104 in the high color temperature light emitting area.

[0050] In this embodiment, the light-emitting area is formed on the front side of the substrate 100. After the substrate 100 is glued, the back sides of the plurality of substrates 100 are fixed on the flat plate, and the plurality of substrates 100 are arranged in a lattice shape at intervals on the flat plate; the rotating disk 202 has an outer side arranged away from the rotating shaft 200, and a plurality of grooves 303 with outer openings are provided on the outer side surface of the rotating disk 202, and the plurality of grooves 303 are arranged in a lattice shape at intervals, and an elastic column 400 is protruding from the bottom of the groove 303;

[0051] The flat plate is abutted against the outer side of the rotating disk 202, and the enclosures of multiple substrates 100 are embedded in the grooves 303 through the outer openings. The substrates 100 are exposed on the rotating outer side. The outer ends of the elastic columns 400 are abutted against the low color temperature fluorescent glue 301 and the high color temperature fluorescent glue 302. An isolation groove 402 is provided in the middle of the outer end of the elastic column 400. The isolation strip 105 is arranged opposite to the isolation groove 402 and has a gap with the bottom of the isolation groove 402. The middle of the elastic column 400 has an annular groove 401, which is arranged around the outer periphery of the elastic column 400. In preparation steps 3) and 4), the rotating shaft 200 rotates at a variable speed during the rotation process.

[0052] After the dam 101 of the substrate 100 is embedded in the groove 303, the light-emitting area is arranged facing the rotating shaft 200. When the rotating shaft 200 rotates, the low-color-temperature fluorescent glue 301 or the high-color-temperature fluorescent glue 302 is affected by the centrifugal force and will settle on the light-emitting chip 104.

[0053] By providing the elastic columns 400, during the rotation of the rotating shaft 200, the elastic columns 400 are affected by the centrifugal force and will elongate towards the light-emitting area, thereby increasing the pressing force on the low-color-temperature fluorescent glue 301 and the high-color-temperature fluorescent glue 302, and can further press down the low-color-temperature fluorescent glue 301 and the high-color-temperature fluorescent glue 302, so that the low-color-temperature fluorescent glue 301 and the high-color-temperature fluorescent glue 302 settle on the light-emitting chip 104.

[0054] An annular groove 401 is provided in the middle of the elastic column 400, so that it is convenient for the elastic column 400 to elongate or shorten and deform.

[0055] During the rotation of the rotating shaft 200, it rotates at a variable speed. In this way, as the rotating shaft 200 rotates, the elastic column 400 will form a dynamic process of telescopic deformation, so that the low-color-temperature fluorescent glue 301 and the high-color-temperature fluorescent glue 302 can be in a dynamic hammering state, which can make the low-color-temperature fluorescent glue 301 and the high-color-temperature fluorescent glue 302 settle more stably on the light-emitting chip 104, and can make the surfaces of the low-color-temperature fluorescent glue 301 and the high-color-temperature fluorescent glue 302 flat.

[0056] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. Method for manufacturing a two-color temperature partitioned light source, characterized in that, It includes the following manufacturing steps: 1). Provide a substrate, on which there are a light-emitting area and a circuit structure; the light-emitting area has a low-color-temperature light area and a high-color-temperature light area arranged separately and isolated from each other; fix chips on the bottoms of the low-color-temperature light area and the high-color-temperature light area respectively, and arrange light-emitting chips on the bottoms of the low-color-temperature light area and the high-color-temperature light area respectively. 2). Wire bond on the substrate to electrically connect the light-emitting chips with the circuit structure; set a dam on the substrate, the dam encloses the periphery of the light-emitting area and covers the circuit structure; set a separator in the light-emitting area, and the separator arranges the low-color-temperature light area and the high-color-temperature light area separately and isolated from each other. 3). Dispense glue in the low-color-temperature light area, fill the low-color-temperature fluorescent glue in the low-color-temperature light area, and the low-color-temperature fluorescent glue covers the light-emitting chips in the low-color-temperature light area; place the substrate after dispensing glue in an oven and bake until the low-color-temperature fluorescent glue is dried. 4). Dispense glue in the high-color-temperature light area, fill the high-color-temperature fluorescent glue in the high-color-temperature light area, and the high-color-temperature fluorescent glue covers the light-emitting chips in the high-color-temperature light area, and the high-color-temperature fluorescent glue and the low-color-temperature fluorescent glue are separated by the separator; place the substrate after dispensing glue in an oven and bake until the high-color-temperature fluorescent glue is dried to form a two-color-temperature partitioned light source. In the manufacturing step 3), after dispensing glue in the low-color-temperature light area and before baking in the oven, fix the substrate on the rotating disk of a rotating machine, the rotating machine has a rotating shaft, and a connecting shaft is connected to the rotating shaft; the connecting shaft is perpendicular to the rotating shaft, the inner end of the connecting shaft is connected to the rotating shaft, the outer end of the connecting shaft is connected to the rotating disk, and the light-emitting area of the low-color-temperature light area faces the rotating shaft. The rotating shaft rotates, drives the rotating disk to make a longitudinal circular rotation through the connecting shaft, and drives the low-color-temperature fluorescent glue to settle on the light-emitting chips in the low-color-temperature light area under the action of centrifugal force. In the manufacturing step 4), after dispensing glue in the high-color-temperature light area and before baking in the oven, fix the substrate on the rotating disk of a rotating machine; the rotating shaft rotates, drives the rotating disk to make a longitudinal circular rotation through the connecting shaft, and drives the high-color-temperature fluorescent glue to settle on the light-emitting chips in the high-color-temperature light area under the action of centrifugal force. The light-emitting area is formed on the front surface of the substrate. After dispensing glue on the substrate, fix the backs of multiple substrates on a flat plate, and multiple substrates are arranged at intervals in a dot matrix on the flat plate; the rotating disk has an outer side surface arranged away from the rotating shaft, and a plurality of grooves with outer openings are provided on the outer side surface of the rotating disk, the plurality of grooves are arranged at intervals in a dot matrix, and elastic columns protrude from the bottoms of the grooves. Press the flat plate against the outer side surface of the rotating disk. The dams of multiple substrates are embedded in the grooves through the outer openings, and the substrates are exposed on the outer side surface of the rotation. The outer ends of the elastic columns are pressed against the low-color-temperature fluorescent glue and the high-color-temperature fluorescent glue. An isolation groove is provided in the middle of the outer ends of the elastic columns. The isolation strip is arranged opposite to the isolation groove and has a gap with the bottom of the isolation groove. A circular groove is provided in the middle of the elastic column, and the circular groove is arranged around the outer circumference of the elastic column. In the manufacturing step 3) and the manufacturing step 4), during the rotation of the rotating shaft, it rotates at a variable speed.

2. The method for manufacturing a two-color temperature partitioned light source according to claim 1, wherein, In the manufacturing step 1), before die bonding in the high-color-temperature light area and the low-color-temperature light area, the substrate is dehumidified.

3. The method for manufacturing a two-color temperature partitioned light source according to claim 1, wherein, During the die bonding process in the high-color-temperature light area and the low-color-temperature light area, the light-emitting chips are respectively fixed at the bottoms of the high-color-temperature light area and the low-color-temperature light area by glue.

4. The method for manufacturing a two-color temperature partitioned light source according to claim 1, wherein, In the manufacturing step 2), before wire bonding, the substrate is subjected to plasma cleaning.

5. The method for manufacturing a two-color temperature partitioned light source according to claim 1, wherein, After the manufacturing step 4), the two-color-temperature partitioned light source is subjected to splitting treatment in a splitter.

6. The method for manufacturing a two-color temperature partitioned light source according to claim 5, wherein, After the manufacturing step 4), the split two-color-temperature partitioned light source is placed in a taping machine for taping treatment.

7. The method for manufacturing a two-color temperature partitioned light source according to claim 6, wherein After the manufacturing step 4), the taped two-color-temperature partitioned light source is placed on a testing machine for lighting test. The qualified two-color-temperature partitioned light sources are stored in the warehouse, and the unqualified two-color-temperature partitioned light sources are collected in a waste bin.

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