A microstructure fabrication device and method based on pulse code control

Abstract

This invention belongs to the field of microstructure water-guided laser processing, specifically a microstructure processing device and method based on pulse code control, comprising: a water-guided laser processing head module, a coupling head, and a pulse control system; the water-guided laser processing head module includes: a pulsed laser, a CCD camera, and a reflector; the CCD camera and the reflector are coaxially arranged from top to bottom; the pulsed laser is located on one side of the reflector, and after being reflected by the reflector, it enters the coupling head, propagates in the water jet formed by the coupling head, and acts on the microstructure to be processed; the reflector is tilted; the pulse control system is located at the bottom of the water-guided laser processing head module, used to block or cut the water jet to stop the water jet from processing the microstructure. This invention can achieve high-frequency reliable switching of an energetic water jet, and is applicable to a wide range of microstructures with high degrees of freedom.

Description

Technical Field

[0001] This invention belongs to the field of microstructure water-conducting laser processing, specifically a microstructure processing device and method based on pulse code control. Background Technology

[0002] Water-guided laser processing technology is a novel laser processing technology with advantages such as high processing quality and no heat-affected zone, making it suitable for high-quality and high-efficiency processing of microstructures. However, microstructure processing requires high-frequency switching of the laser, and the high-power laser's high-frequency switching places extremely high demands on the reliability and stability of water-guided laser processing equipment. Currently, high-frequency switching processing equipment typically uses system control, which not only causes significant damage to the laser but also makes precise control difficult. Therefore, achieving high-frequency reliable switching control of the energy-carrying water beam is of great significance for reducing the difficulty of microstructure water-guided laser processing, improving processing reliability and efficiency, and reducing the cost of water-guided laser processing equipment.

[0003] To reduce the reliability requirements and equipment costs of water-guided laser optical path components due to repeated switching during the processing of microstructures and repetitive structures, a microstructure processing device and method need to be proposed. Summary of the Invention

[0004] The purpose of this invention is to provide a microstructure processing device and method based on pulse code control, so as to overcome the technical problem that it is difficult to achieve reliable switching of the energy-carrying laser beam at repeated high frequencies when processing microstructures with water-guided lasers.

[0005] The technical solution adopted by the present invention to achieve the above objectives is: a microstructure processing device based on pulse code control for processing array-type microstructures, comprising: a water-guided laser processing head module, a coupling head, and a pulse control system;

[0006] The water-guided laser processing head module includes: a pulsed laser, a CCD camera, and a reflector;

[0007] The CCD camera and the reflector are coaxially arranged from top to bottom; the coupling head is located below the reflector of the water-guided laser processing head module.

[0008] The pulsed laser is located on one side of the reflector. After the emitted laser is reflected by the reflector, it enters the coupling head and propagates in the water jet formed by the coupling head, acting on the microstructure to be processed.

[0009] The reflector is tilted; the pulse control system is located at the bottom of the water-guided laser processing head module and is used to block or cut the water jet so that the water jet stops processing the microstructure.

[0010] The coupling head includes: a housing, a focusing lens, a light-transmitting window, and a nozzle. One end of the housing is provided with a laser inlet, and the laser inlet is provided with a focusing lens and a light-transmitting window. The other end of the housing is provided with a nozzle, and the laser is focused at the nozzle by the focusing lens.

[0011] The housing is provided with a pressure equalization ring, which is located between the light-transmitting window and the nozzle. The pressure equalization ring has a through-hole cavity for the laser to pass through. A hydraulic equalization cavity is formed between the outer side of the pressure equalization ring and the housing. Flow-limiting holes are evenly distributed in the ring wall of the pressure equalization ring, and the hydraulic equalization cavity is connected to the through-hole cavity through each flow-limiting hole. The housing is provided with a water inlet hole that is connected to the hydraulic equalization cavity.

[0012] The focusing lens, light-transmitting window, pressure equalizing ring, and nozzle are arranged coaxially.

[0013] The pulse control system includes: a pulse control module, a pulse encoder, a drive motor, and a pulse encoder disk;

[0014] The pulse control module is connected to the pulse encoder and the drive motor. It is used to receive the pulse signal from the pulse encoder and adjust the rotation speed of the drive motor shaft according to the pulse signal to control the movement of the drive motor.

[0015] The drive motor is slidably mounted on the bottom surface of the water-guided laser processing head module so that the drive motor can slide radially along the center direction of the coupling head, and the axis of rotation of the drive motor is perpendicular to the horizontal plane.

[0016] The pulse encoder is located inside the drive motor and is mounted on the rotating shaft of the drive motor.

[0017] The center point of the pulse encoder disk is fixedly connected to the rotating shaft of the drive motor. When the drive motor rotates, it drives the pulse encoder disk to rotate.

[0018] The pulse encoder disk is disc-shaped, and with the connection point between the pulse encoder disk and the rotating shaft of the drive motor as the center, a multi-ring array of through slots is provided along the circumference.

[0019] The spacing between any two adjacent rings of the through-slot array is equal.

[0020] The through-slot ring array has 3 to 5 rings;

[0021] The spacing between any two adjacent slots in each ring of the slotted annular array is equal;

[0022] The spacing L1 between two adjacent through slots in the through-slot annular array is:

[0023] L1 / (w1*R1)=L3 / V1

[0024] The length L2 of the circular array is:

[0025] L2 / (w1*R1)=L4 / V1

[0026] Where L3 is the machining length on the microstructure, L4 is the unmachined length on the microstructure, V1 is the movement speed of the water-guided laser machining head, w1 is the rotational angular velocity of the pulse encoder disk, and R1 is the distance of the current through-slot annular array relative to the rotation axis.

[0027] The distance between the pulse encoder disk and the workpiece to be processed is 1 to 10 mm.

[0028] The microstructure is characterized by having multiple repeating structures.

[0029] The repeating structure includes pit-like structures and protrusions, wherein the pit-like structure is at least one of rectangular pits, circular pits, and irregularly shaped pits;

[0030] The arrangement of repeating structures includes rectangular, circular, and hexagonal arrays.

[0031] The pulse control system includes: a pulse air knife actuator and a pulse control module connected thereto;

[0032] The pulse air knife actuator is an air knife mechanism equipped with a pulse signal receiver, used to form a uniform air curtain at the air outlet, cut off the water jet, and block the propagation and processing capability of the water-guided laser jet.

[0033] The pulse control module is a gas path solenoid valve, which is used to open and close the gas path according to the pulse control signal, thereby controlling the processing capability of water-guided laser jet.

[0034] The gas forming the air curtain at the outlet of the pulse air knife actuator includes any one of air, nitrogen, argon, and carbon dioxide; the air pressure at the outlet of the pulse air knife actuator is 1 MPa.

[0035] A microstructure fabrication method based on pulse code control includes the following steps:

[0036] 1) Select the pulse encoder disk method or the pulse air knife actuator method according to the microstructure to be processed (4). When the pulse encoder disk method is selected, calculate the required water-guided laser on / off time ratio according to the rotation speed of the microstructure to be processed (4) and the pulse encoder disk (5), and make the pulse encoder disk (5); 2) Start processing. When the pulse encoder disk (5) is selected, when the laser water beam (3) reaches the workpiece removal area, the laser water beam (3) passes through the corresponding through groove area of ​​the encoder disk to achieve material removal; when the laser water beam (3) reaches the non-removal area of ​​the workpiece, the laser water beam (3) is blocked by the pulse encoder disk (5) or cut off by the pulse air knife actuator (10), and the laser water beam (3) stops removing material. When the pulse air knife actuator (10) is selected, when the laser water jet (3) reaches the workpiece removal area, the pulse air knife actuator (10) stops blowing air, and the laser water jet (3) removes the material; when the laser water jet (3) reaches the non-removal area of ​​the workpiece, the pulse air knife actuator (10) blows air to block the laser water jet (3). Repeat this step until the microstructure is processed.

[0037] Step 1) specifically refers to:

[0038] When the microstructure to be processed is a rectangular repeating structure arranged in a rectangular layout, the pulse encoder disk method is selected for processing. At this time, the water-guided laser processing head moves in a reciprocating serpentine path until the entire processing area is scanned.

[0039] The pulse encoder disk is made according to the length L1 that does not need to be processed, the length L2 that needs to be processed on the microstructure to be processed during the scanning process, and the rotation speed W1 of the pulse encoder disk.

[0040] When the microstructure to be processed is of other types, a pulse air knife actuator is selected. The processing method is to process each of the required single repeating structures one by one. After the processing of a single microstructure is completed, the pulse air knife actuator blocks the water jet by venting air. The water-guided laser processing head module moves to the next repeating structure, the pulse air knife actuator stops venting air, and the processing of the next repeating structure begins.

[0041] The present invention has the following beneficial effects and advantages:

[0042] 1. This invention can achieve high-frequency reliable switching of energy-carrying water jets, and is applicable to a wide range of microstructures with high degree of freedom.

[0043] 2. The pulse encoder disk and pulse actuator in this invention can be replaced with a pulse air knife actuator to adapt to extremely narrow processing spaces, and can also realize high-frequency reliable switching of energy-carrying water jets.

[0044] 3. This invention can effectively improve the reliability and processing efficiency of water-guided laser technology in microstructure processing, which is conducive to the large-scale application of water-guided laser technology in microstructure processing.

[0045] 4. The coupling head of this invention has a pressure equalization ring inside the housing, and the pressure and flow of high-pressure water are evenly distributed by the pressure equalization ring, thereby solving the problem that the uneven water pressure and flow near the nozzle affects the stable length of the water jet, and improving the processing accuracy and efficiency of water-guided laser processing.

[0046] 5. The ratio of the total cross-sectional area of ​​each flow-limiting hole on the equalizing ring of the coupling head of the present invention to the cross-sectional area of ​​the water pressure pipeline flow channel of the shell is less than 1. The pressure and flow rate of the pressurized water are evenly distributed using a simple structure, which is convenient to process and easy to implement. Attached Figure Description

[0047] Figure 1 A schematic diagram of an array microstructure fabrication device based on coded pulse control provided in an embodiment of the present invention;

[0048] Among them, 1 is the water-guided laser processing head module, 2 is the coupling head, 3 is the water jet, 4 is the microstructure, 5 is the pulse encoder disk, 6 is the pulse control system, 7 is the pulse control module, 8 is the slot spacing, 9 is the slot, and 10 is the pulse air knife actuator.

[0049] Figure 2 A schematic diagram of a typical pulse encoder disk provided in an embodiment of the present invention;

[0050] Figure 3 A schematic diagram of another array microstructure fabrication device based on coded pulse control provided in an embodiment of the present invention;

[0051] Figure 4 This is a typical micro-pit structure array applicable to Embodiment 1 of the present invention;

[0052] Figure 5 This is a typical micro-pit structure array applicable to Embodiment 2 of the present invention;

[0053] Figure 6 This is a schematic diagram of the coupling head of the present invention;

[0054] Among them, 201 is the shell, 202 is the laser, 203 is the focusing lens, 204 is the light-transmitting window, 205 is the pressure equalizing ring, 206 is the hydraulic equalization chamber, 207 is the flow limiting hole, 208 is the through hole chamber, 209 is the laser water jet, 210 is the nozzle, 211 is the nozzle seat, and 212 is the water inlet. Detailed Implementation

[0055] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0056] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0057] like Figure 1 , Figure 3 As shown, the array microstructure processing device based on coded pulse control provided by the present invention includes: a water-guided laser processing head module 1, a coupling head 2, and a pulse control system;

[0058] The water-guided laser processing head module 1 includes a pulsed laser, a CCD camera, and a reflector. The water-guided laser processing head module 1 is connected to the motion mechanism of the processing equipment and the coupling head 2. The water-guided laser processing head module 1 and the coupling head 2 can generate a water jet 3 carrying laser energy for microstructure processing 4.

[0059] The CCD camera and the reflector are coaxially arranged from top to bottom; the coupling head 2 is located below the reflector of the water-guided laser processing head module 1;

[0060] The pulsed laser is located on one side of the reflector. After the emitted laser is reflected by the reflector, it enters the coupling head 2. After propagating in the water jet 3 formed by the coupling head 2, it acts on the microstructure 4 to be processed.

[0061] The reflector is tilted; the pulse control system is located at the bottom of the water-guided laser processing head module 1, and is used to block or cut the water jet 3 so that the water jet 3 stops processing the microstructure 4.

[0062] The coupling head 2 includes: a housing, a focusing lens, a light-transmitting window, and a nozzle. One end of the housing is provided with a laser inlet, and the laser inlet is provided with a focusing lens and a light-transmitting window. The other end of the housing is provided with a nozzle, and the laser is focused at the nozzle by the focusing lens.

[0063] like Figure 6The diagram shows the structure of the coupling head of the present invention, including a housing 201, an equalizing ring 205, a focusing lens 203, a light-transmitting window 204, and a nozzle 210. One end of the housing 201 has an inlet, and the focusing lens 203 and the light-transmitting window 204 are sequentially arranged within the inlet along the transmission direction of the laser 202. The other end of the housing 201 has a nozzle 210, and the laser 202 is focused onto the nozzle 210 by the focusing lens 203. The equalizing ring 205 is located inside the housing 201 and is positioned between the light-transmitting window 204 and the nozzle. Between 210, the equalizing ring 205 has a through cavity 208 for the laser 202 to pass through. The ring wall of the equalizing ring 205 has a groove along the circumferential direction, and the groove and the housing 201 form a hydraulic equalization cavity 206. Multiple flow limiting holes 207 are evenly distributed along the circumferential direction in the ring wall of the equalizing ring 205, and the hydraulic equalization cavity 206 is connected to the through cavity 208 through each flow limiting hole 7. The housing 201 has a water inlet hole 212 that is connected to the hydraulic equalization cavity 206, and the water inlet hole 212 is connected to the pressurized water pipeline.

[0064] The ratio of the total cross-sectional area of ​​each flow-limiting hole 207 to the cross-sectional area of ​​the water flow channel (pressure water pipeline) on the shell 201 is less than 1, so as to play the role of flow restriction and pressure distribution. In this embodiment, the diameter of the flow-limiting hole 7 is in the range of 0.2 to 3 mm, and the number is 6 to 20.

[0065] like Figure 6 As shown, the laser water jet 209 exiting end of the housing 201 is provided with a nozzle seat 211, the nozzle 210 is installed in the nozzle seat 211, and the nozzle seat 211 is provided with a laser water jet 209 outlet in the shape of a flared horn.

[0066] The focusing lens 203, the light transmission window 204, the pressure equalizing ring 205 and the nozzle 210 are arranged coaxially. The light transmission window 204 allows the laser to pass through and seals the pressurized water in the through-hole cavity 208.

[0067] The working principle of the coupling head is as follows:

[0068] When the coupling head 2 is working, the laser 202 enters the housing 201 and passes sequentially through the focusing lens 203, the light-transmitting window 204, and the nozzle 210. High-pressure water flows in through the inlet hole 212 and into the hydraulic equalization chamber 206 outside the equalizing ring 205. It then flows through the flow-limiting holes 207 into the through-hole cavity 208 within the equalizing ring 205. The high-pressure water in the through-hole cavity 208 is ejected from the nozzle 210. The laser 202 is focused by the focusing lens 203 onto the nozzle 210 and propagates along... The high-pressure water jet is continuously reflected to form a laser water jet 209 for workpiece processing. The ratio of the total cross-sectional area of ​​each flow-limiting hole 207 to the cross-sectional area of ​​the water pressure pipeline in the shell 201 is less than 1, which can play the role of flow restriction and pressure distribution. This makes the high-pressure water in the through hole cavity 208 hydraulically stable and circumferentially uniform, so that the pressure and flow rate of the pressurized water are evenly distributed before entering the nozzle 210, and finally forming a stable laser water jet 209, which improves the processing accuracy and processing efficiency of water-guided laser processing.

[0069] The pulse control system includes: a pulse control module, a pulse encoder, a drive motor, and a pulse encoder disk;

[0070] The pulse control module is connected to the pulse encoder and the drive motor. It is used to receive the pulse signal from the pulse encoder and adjust the rotation speed of the drive motor shaft according to the pulse signal to control the movement of the drive motor.

[0071] The drive motor is slidably mounted on the bottom surface of the water-guided laser processing head module 1 so that the drive motor can slide radially along the center direction of the coupling head, and the axis of rotation of the drive motor is perpendicular to the horizontal plane;

[0072] The pulse encoder is located inside the drive motor and is mounted on the rotating shaft of the drive motor;

[0073] The center point of the pulse encoder disk 5 is fixedly connected to the rotating shaft of the drive motor. When the drive motor rotates, it drives the pulse encoder disk to rotate.

[0074] The pulse encoder disk 5 has several through slots 9 with varying spacing and length distributed along its circumference. The rotation of the pulse encoder disk enables high-frequency control of the on / off state of the energy-carrying water jet. The pulse actuator 6 can control the pulse encoder disk 5 to rotate at a fixed or varying speed, thereby determining the on / off duration and interval of the energy-carrying water jet. The pulse actuator 6 is mounted on the water-guided laser processing head module 1, and its distance from the central axis of the coupling head 2 can be adjusted. The control module 7 is connected to the pulse actuator 6 via a data cable, enabling control of the pulse signals of the pulse actuator 6.

[0075] The pulse encoder disk 5 is disc-shaped, and with the connection point between the pulse encoder disk and the rotating shaft of the drive motor as the center, a multi-ring array of through slots is provided along the circumference;

[0076] The spacing between any two adjacent rings of the through-slot array is equal.

[0077] The through-slot ring array has 3 to 5 rings;

[0078] In each ring of the slotted annular array, the spacing between any two adjacent slots 9 is equal;

[0079] The spacing L1 between two adjacent through slots 9 in the through-slot annular array is:

[0080] L1 / (w1*R1)=L3 / V1

[0081] The length L2 of the circular array is:

[0082] L2 / (w1*R1)=L4 / V1

[0083] Where L3 is the processing length on microstructure 4, L4 is the unprocessed length on microstructure 4, V1 is the movement speed of the water-guided laser processing head, w1 is the rotational angular velocity of the pulse encoder disk, and R1 is the distance of the current through-slot annular array relative to the rotation axis.

[0084] The distance between the pulse encoder disk and the workpiece to be processed is 1 to 10 mm.

[0085] The pulse control system 6 can move radially along the coupling head 2, and the range of movement can move the water-guided laser beam 3 from the innermost ring of the pulse encoder disk 5 to the outermost ring of the pulse encoder disk 5.

[0086] The speed of the pulse control system 6 is controlled by the pulse control module 7, with a maximum speed of 7 r / s.

[0087] like Figure 4 or Figure 5 As shown, the microstructure is a rectangular pit-like structure in the microstructure of the present invention, and the microstructure has multiple repeating structures;

[0088] The repeating structure includes pit-like structures and protrusions, wherein the pit-like structure is at least one of rectangular pits, circular pits, and irregularly shaped pits;

[0089] The arrangement of repeating structures includes rectangular, circular, and hexagonal arrays.

[0090] The pulse control system includes: a pulse air knife actuator 10 and a pulse control module connected thereto;

[0091] The pulse air knife actuator 10 is an air knife mechanism with a pulse signal receiver, used to form a uniform air curtain at the air outlet, cut off the water jet 3, and block the propagation and processing capability of the water-guided laser jet.

[0092] The pulse control module is a pneumatic solenoid valve, which is used to open and close the pneumatic path according to the pulse control signal, thereby controlling the processing capability of water-guided laser jet.

[0093] The gas forming the air curtain at the outlet of the pulse air knife actuator 10 includes any one of air, nitrogen, argon, and carbon dioxide; the air pressure at the outlet of the pulse air knife actuator 10 is 1 MPa.

[0094] A microstructure fabrication method based on pulse code control includes the following steps:

[0095] 1) Select either the pulse encoder disk method or the pulse air knife actuator method based on the microstructure to be processed (4). When selecting the pulse encoder disk method, calculate the required water-guided laser on / off time ratio based on the rotation speed of the microstructure to be processed (4) and the pulse encoder disk (5), and then fabricate the pulse encoder disk (5); calculate the required water-guided laser on / off time ratio based on the rotation speed of the microstructure to be processed and the pulse encoder disk, and then fabricate the pulse encoder disk.

[0096] 2) Start processing. When the pulse encoder disk (5) is selected, when the laser water jet (3) reaches the workpiece removal area, the laser water jet (3) passes through the corresponding through-slot area of ​​the encoder disk to remove material. When the laser water jet (3) reaches the non-removal area of ​​the workpiece, the laser water jet (3) is blocked by the pulse encoder disk (5) or cut off by the pulse air knife actuator (10), and the laser water jet (3) stops removing material. When the pulse air knife actuator (10) is selected, when the laser water jet (3) reaches the workpiece removal area, the pulse air knife actuator (10) does not emit air, and the laser water jet (3) removes material. When the laser water jet (3) reaches the non-removal area of ​​the workpiece, the pulse air knife actuator (10) emits air to block the laser water jet (3). Repeat this step until the processing of the microstructure 4 is completed.

[0097] Step 1) specifically involves:

[0098] When the microstructure to be processed is a rectangular repeating structure arranged in a rectangular layout, the pulse encoder disk method is selected for processing. At this time, the water-guided laser processing head moves in a reciprocating serpentine path until the entire processing area is scanned.

[0099] The pulse encoder disk 5 is manufactured based on the length L1 that does not need to be processed, the length L2 that needs to be processed on the microstructure 4 to be processed during the scanning process, and the rotation speed W1 of the pulse encoder disk 5.

[0100] When the microstructure to be processed is of other types, the pulse air knife actuator 10 is selected. The processing method is to process each of the required single repeating structures one by one. After the processing of a single microstructure 4 is completed, the pulse air knife actuator 10 blocks the water jet 3 by venting air. The water-guided laser processing head module 1 moves to the next repeating structure, the pulse air knife actuator 10 stops venting air, and the processing of the next repeating structure begins.

[0101] The present invention can adopt different layout structures depending on the size of the available space near the coupling head.

[0102] Example 1:

[0103] like Figure 1 , Figure 2 As shown, in this embodiment, a pulse encoder disk 5 and a pulse control system are used to realize the on / off control of the energy-carrying water-guided laser beam. When targeting... Figure 4 In the microstructure shown, the pulse encoder disk 5 has three concentric slots 9. The ratio of the circumferential width of the slots to the spacing between the slots 9 is 1:3, 2:1, and 3:1, respectively, corresponding to the on-off time ratios when the water-guided laser beam processes the microstructure. During microstructure processing, the motion mechanism drives the water-guided laser processing head module to perform horizontal line-by-line scanning according to the shape of the microstructure 4 to be processed. The pulse control module 7 adjusts the rotation speed of the pulse encoder disk according to the on-off time ratio of the microstructure to achieve microstructure processing.

[0104] The working principle of this embodiment is as follows:

[0105] In this embodiment, when targeting Figure 5 In the microstructure shown, the pulse encoder disk 5 and the pulse actuator 6 work together to control the flow and disconnection of the water-guided laser beam. The pulse encoder disk 5 is fabricated based on the length L1 that does not need to be processed, the length L2 that needs to be processed, and the rotation speed W1 of the pulse encoder disk 5 during the scanning process. The water-guided laser processing equipment processes the microstructure 4 by horizontal line-by-line scanning. Before processing, the pattern on the pulse encoder disk is determined according to the on / off ratio during scanning. During processing, the pulse actuator, under the control of the control module 7, drives the pulse encoder disk 5 to rotate, achieving high-frequency and reliable on / off switching of the water-guided laser beam, thus completing the processing of the microstructure.

[0106] Example 2:

[0107] like Figure 3As shown, in this embodiment, a pulsed air knife actuator 10 is used to control the on / off state of the energy-carrying water-guided laser beam. The pulsed air knife actuator 10 is connected to the air compressor pipeline and can eject high-speed airflow under the control of the control module 7 to disrupt the light-guiding ability of the water jet, thereby achieving high-frequency and reliable on / off control of the water-guided laser beam. During the processing, the motion mechanism drives the water-guided laser processing head module to process each micro-pit sequentially according to the morphology of the microstructure 4 to be processed. During the interval between processing each micro-pit, the pulsed air knife actuator 10 ejects high-speed gas to shut off the water-guided laser beam. The control module 7 cooperates with the motion mechanism of the water-guided laser processing equipment to control the on / off state of the water-guided laser jet according to whether the processing of a single microstructure is completed, ultimately realizing the processing of the microstructure.

[0108] The working principle of this embodiment is as follows:

[0109] In this embodiment, a pulsed air knife actuator 10 is used to control the on / off state of the energy-carrying water-guided laser beam. When the microstructure to be processed is of other types, the pulsed air knife actuator 10 is selected. The processing method is to process each of the required single repeating structures one by one. After the processing of a single microstructure 4 is completed, the pulsed air knife actuator 10 blocks the water jet 3 by emitting air. The water-guided laser processing head module 1 moves to the next repeating structure, the pulsed air knife actuator 10 stops emitting air, and the processing of the next repeating structure begins.

[0110] The pulse air knife actuator 10 is connected to an air compressor pipeline with a pressure of 7 Bar and is controlled by the control module 7. Before processing, the output signal interval of the control module 7 is defined according to the processing time of each micro-pit on the microstructure 4 to be processed and the movement interval between the starting points of each micro-pit processing. During processing, the motion mechanism drives the water-guided laser processing head module 1 to process each micro-pit sequentially according to the morphology of the microstructure 4 to be processed. After the processing of a single micro-pit is completed, the control module 7 commands the pulse air knife actuator 10 to eject high-speed gas and shut off the water-guided laser beam. After the motion mechanism moves to the starting position of the next micro-pit processing, the pulse air knife actuator 10 stops ejecting high-speed gas. The control module 7 cooperates with the motion mechanism of the water-guided laser processing equipment to control the on / off of the water-guided laser jet according to whether the processing of a single microstructure is completed, ultimately realizing the processing of the microstructure.

[0111] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A microstructure fabrication device based on pulse code control, used for fabricating array-type microstructures (4), characterized in that, include: Water-guided laser processing head module (1), coupling head (2), and pulse control system; The water-guided laser processing head module (1) includes: a pulsed laser, a CCD camera, and a reflector; The CCD camera and the reflector are coaxially arranged from top to bottom; the coupling head (2) is located below the reflector of the water-guided laser processing head module (1); The pulsed laser is located on one side of the reflector. After the emitted laser is reflected by the reflector, it enters the coupling head (2). After propagating in the water jet (3) formed by the coupling head (2), it acts on the microstructure (4) to be processed. The reflector is tilted; the pulse control system is located at the bottom of the water-guided laser processing head module (1) and is used to block or cut the water jet (3) so that the water jet (3) stops processing the microstructure (4); The pulse control system includes: a pulse control module, a pulse encoder, a drive motor, and a pulse encoder disk (5). The pulse control module is connected to the pulse encoder and the drive motor. It is used to receive the pulse signal from the pulse encoder and adjust the rotation speed of the drive motor shaft according to the pulse signal to control the movement of the drive motor. The drive motor is slidably mounted on the bottom surface of the water-guided laser processing head module (1) so that the drive motor can slide radially along the center direction of the coupling head, and the axis of the rotation shaft of the drive motor is perpendicular to the horizontal plane; The pulse encoder is located inside the drive motor and is mounted on the rotating shaft of the drive motor. The center point of the pulse encoder disk (5) is fixedly connected to the rotating shaft of the drive motor. When the drive motor rotates, it drives the pulse encoder disk (5) to rotate. The pulse encoder disk (5) is a disc, and a multi-ring through-slot array is provided around the connection point between the pulse encoder disk (5) and the rotating shaft of the drive motor. The spacing between any two adjacent rings of through slotted annulus is equal. The through-slot ring array has 3 to 5 rings; The spacing between any two adjacent through slots (9) in each ring of the through slotted annular array is equal; The distance L1 between two adjacent through slots (9) in the through-slot annular array is: L1 / (w1*R1)=L3 / V1 The length L2 of the circular array is: L2 / (w1*R1)=L4 / V1 Where L3 is the processing length on the microstructure (4), L4 is the unprocessed length on the microstructure (4), V1 is the movement speed of the water-guided laser processing head, w1 is the rotational angular velocity of the pulse encoder disk (5), and R1 is the distance of the current through-slot ring array relative to the rotation axis.

2. The microstructure fabrication device based on pulse code control according to claim 1, characterized in that, The coupling head (2) includes: a housing (201), a focusing lens (203), a light-transmitting window (204), and a nozzle (210). One end of the housing (201) is provided with a laser inlet, and the laser inlet is provided with a focusing lens (203) and a light-transmitting window (204). The other end of the housing (201) is provided with a nozzle (210), and the laser (202) is focused at the nozzle (210) by the focusing lens (203). The housing (201) is provided with a pressure equalization ring (205), and the pressure equalization ring (205) is located between the light-transmitting window (204) and the nozzle (210). The pressure equalization ring (205) is provided with a through-hole cavity (208) for the laser (202) to pass through. A hydraulic equalization cavity (206) is formed between the outer side of the pressure equalization ring (205) and the housing (201). Flow-limiting holes (207) are evenly distributed in the ring wall of the pressure equalization ring (205), and the hydraulic equalization cavity (206) is connected to the through-hole cavity (208) through each flow-limiting hole (207). The housing (201) is provided with a water inlet hole (212) that is connected to the hydraulic equalization cavity (206). The focusing lens (203), the light-transmitting window (204), the equalizing ring (205), and the nozzle (210) are arranged coaxially.

3. The microstructure fabrication device based on pulse code control according to claim 1, characterized in that, The distance between the pulse encoder disk (5) and the workpiece to be processed is 1 to 10 mm.

4. The microstructure fabrication device based on pulse code control according to claim 1, characterized in that, The microstructure is characterized by having multiple repeating structures. The repeating structure includes pit-like structures and protrusions, wherein the pit-like structure is at least one of rectangular pits, circular pits, and irregularly shaped pits; The arrangement of repeating structures includes rectangular, circular, and hexagonal arrays.

5. The microstructure fabrication device based on pulse code control according to claim 1, characterized in that, The pulse control system includes: a pulse air knife actuator (10) and a pulse control module connected thereto; The pulse air knife actuator (10) is an air knife mechanism with a pulse signal receiving function, used to form a uniform air curtain at the air outlet, cut off the water jet (3), and block the propagation and processing capability of the water-guided laser jet; The pulse control module is a gas path solenoid valve, which is used to open and close the gas path according to the pulse control signal, thereby controlling the processing capability of water-guided laser jet. The gas forming the air curtain at the outlet of the pulse air knife actuator (10) includes any one of air, nitrogen, argon, and carbon dioxide; the air pressure at the outlet of the pulse air knife actuator (10) is 1 MPa.

6. The processing method of a microstructure processing device based on pulse code control according to claim 5, characterized in that, Includes the following steps: 1) Select the pulse encoder disk (5) or the pulse air knife actuator according to the microstructure to be processed (4); when the pulse encoder disk (5) is selected, calculate the required water guide laser on / off time ratio according to the microstructure to be processed (4) and the rotation speed of the pulse encoder disk (5), and make the pulse encoder disk (5). 2) When processing begins, when the pulse encoder disk (5) is selected, when the water jet (3) reaches the workpiece removal area, the water jet (3) passes through the corresponding through groove area of ​​the encoder disk to remove the material; when the water jet (3) reaches the non-removal area of ​​the workpiece, the water jet (3) is blocked by the pulse encoder disk (5) and the water jet (3) stops removing the material. When the pulse air knife actuator (10) is selected, when the water jet (3) reaches the workpiece removal area, the pulse air knife actuator (10) does not produce air, and the water jet (3) removes the material; when the water jet (3) reaches the non-removal area of ​​the workpiece, the pulse air knife actuator (10) produces air to block the water jet (3); repeat this step until the microstructure (4) is processed.

7. The processing method of a microstructure processing device based on pulse code control according to claim 6, characterized in that, Step 1) specifically refers to: When the microstructure to be processed is a rectangular repeating structure arranged in a rectangular layout, the pulse encoder disk (5) is selected for processing. At this time, the water-guided laser processing head moves in a reciprocating serpentine path until the scanning of the entire processing area is completed. The pulse encoder disk (5) is made according to the length L1 that does not need to be processed, the length L2 that needs to be processed on the microstructure (4) to be processed during the scanning process, and the rotation speed W1 of the pulse encoder disk (5). When the microstructure to be processed is of other types, the pulse air knife actuator (10) is selected. The processing method is to process each of the required single repeating structures one by one. After the processing of a single microstructure (4) is completed, the pulse air knife actuator (10) blocks the water jet (3) by venting air. The water-guided laser processing head module (1) moves to the next repeating structure. The pulse air knife actuator (10) stops venting air and begins processing of the next repeating structure.

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