Test socket for testing the device under test

Abstract

A test socket is provided for electrically connecting a detection device to a device under test. The test socket includes a housing, a probe, and an insulating component. A through hole is formed in the housing in a vertical direction. The probe is disposed in the through hole in a vertical direction. The probe is configured to be retractable and extendable in the vertical direction and to perform signal transmission in the vertical direction. The insulating component is disposed between the inner surface of the through hole and the outer surface of the probe and is configured to position the probe in the through hole. The insulating component includes a plurality of micropores.

Description

Technical Field

[0001] The present disclosure relates to a test socket that electrically connects a testing device to a device under test and is used in electrical testing of the device under test. Background Art

[0002] In order to test the operating characteristics of a device under test (DUT), a test socket is used in the art. The test socket is provided between a testing device and the DUT to electrically connect the testing device and the DUT. As such a test socket, a probe that is retractable due to pressure applied by the DUT is known.

[0003] Semiconductor devices used in mobile communication devices must be tested for their operating characteristics in high-frequency bands. In test sockets used for high-frequency testing, probes are coaxially positioned within holes formed in the test socket housing to reduce signal loss. As an example, Korean Patent Publication No. 10-1534778 proposes a test socket with coaxial probes.

[0004] To accommodate the fine pitch of the terminals of the device being tested, it is important to form the holes of the housing with a fine pitch. When forming the holes of the housing with a fine pitch, the size of the dielectric body coaxially arranged with the probe must be reduced. However, improvements to dielectrics that achieve reduced size and a low dielectric constant have not yet been developed in the art. Summary of the Invention

[0005] Technical issues

[0006] To achieve coaxial placement of the probe relative to the hole in the housing, a dielectric for coaxial placement of the probe is disposed between the hole in the housing and the probe. To reduce signal loss, it is preferable that the dielectric maintaining the coaxial placement have a low dielectric constant. However, because existing test sockets focus solely on achieving coaxial placement using dielectrics with high dielectric constants, signal loss cannot be minimized. Furthermore, the dielectrics in existing test sockets have limitations in meeting the trend toward finer pitches.

[0007] An embodiment of the present disclosure provides a test socket that can be effectively applied to high-frequency detection and minimize signal loss.An embodiment of the present disclosure provides a test socket in which a dielectric body that holds a coaxial arrangement of probes has a reduced dielectric constant.

[0008] Technical means to solve the problem

[0009] One embodiment of the present disclosure relates to a test socket, which is arranged between a detection device and a device to be detected to electrically connect the detection device to the device to be detected. The test socket according to one embodiment includes a housing, a probe, and an insulating component. A through hole is formed in the housing in a vertical direction. The probe is arranged in the through hole of the housing in a vertical direction. The probe is configured to contract and extend in the vertical direction and perform signal transmission in the vertical direction. The insulating component is arranged between the inner surface of the through hole and the outer surface of the probe and is configured to allow the probe to be located in the through hole. The insulating component includes a plurality of micropores.

[0010] In one embodiment, the plurality of micropores are air pores. The insulating member is made of a resin including the plurality of micropores, and the air pores are formed by a chemical reaction between the liquid resin and a foaming agent.

[0011] In one embodiment, the plurality of micropores are hollow particles. The hollow particles may include a film made of any one of glass, silica, zirconia, ceramics, polymethyl methacrylate, polyethylene rubber, and acrylic resin. The hollow particles may include air contained within the film.

[0012] In one embodiment, the insulating member may include 1 vol % to 50 vol % of the plurality of micropores.

[0013] In one embodiment, the insulating member includes the plurality of micropores and can be made of any one of resin, glass, silicon dioxide, zirconium oxide, and ceramics. The resin can be any one of rubber, polymethyl methacrylate, polyethylene, phenolic resin, epoxy resin, and novolac resin.

[0014] In one embodiment, the insulating member is configured to position the probe coaxially with the through hole in a vertical direction.

[0015] In one embodiment, the insulating member includes: an upper insulating member having an upper mating hole extending coaxially with the central axis of the through-hole and mating with the through-hole; and a lower insulating member having a lower mating hole extending coaxially with the central axis of the through-hole and mating with the through-hole. The probe can be mated to the upper mating hole and the lower mating hole to be positioned coaxially with the through-hole.

[0016] In one embodiment, the probe includes: an upper plunger that contacts a device under test and moves through an upper mating hole; a lower plunger that contacts a detection device and moves through a lower mating hole; a sleeve that supports the upper and lower plungers so that they can move in a vertical direction and fits into the upper and lower mating holes; and an elastic member disposed within the sleeve between the upper and lower plungers. The elastic member is made of a plurality of conductive particles that can electrically contact each other in a vertical direction and an elastic material that holds the plurality of conductive particles in the vertical direction.

[0017] Effects of the Invention

[0018] According to one embodiment of the present invention, an insulating component positions the probe coaxially with the central axis of the through-hole in the housing, and the insulating component is made of an insulating material containing multiple micropores. This insulating component, including micropores, has a lower dielectric constant than an insulating component of the same size made solely of insulating resin. Consequently, the test socket according to one embodiment can reduce signal loss, achieve impedance matching, and be effectively used for high-frequency testing of devices under test.

[0019] In addition, because the insulating component has micropores and a low dielectric constant, the characteristics of the test socket are improved while maintaining the strength and processability of the insulating component without changing the material or size of the insulating component.

[0020] In addition, the insulating member having micro-voids and a low dielectric constant can be formed to have a smaller size than an insulating member made of only an insulating resin material. Therefore, the test socket according to one embodiment can achieve a fine pitch between probes. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 FIG1 is a cross-sectional view schematically showing an example of a test socket according to an embodiment.

[0022] Figure 2 FIG. 1 is a cross-sectional view showing a portion of a test socket according to an embodiment.

[0023] Figure 3 To show Figure 2 A perspective view of a portion of a test socket is shown in FIG.

[0024] Figure 4 FIG1 is a cross-sectional view schematically showing a portion of a probe according to an embodiment, and illustrates an example of a micropore.

[0025] Figure 5 FIG1 is a cross-sectional view schematically showing a portion of a probe according to an embodiment, and shows another example of a micropore.

[0026] Figure 6 FIG. 1 is a cross-sectional view showing a portion of a test socket according to an embodiment, and shows another example of a probe.

[0027] Figure 7 FIG. 1 is a graph showing simulation results of insertion loss of a test socket according to an embodiment.

[0028] Figure 8 is a graph showing simulation results regarding insertion loss of a test socket according to a comparative example.

[0029] Figure 9 FIG. 1 is a graph showing simulation results of reflection loss of a test socket according to an embodiment.

[0030] Figure 10 is a graph showing simulation results regarding reflection loss of a test socket according to a comparative example. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are shown for the purpose of explaining the technical concept of the present invention. The scope of rights according to the present invention is not limited to the embodiments presented below or the detailed description of these embodiments.

[0032] Unless otherwise defined, all technical terms and scientific terms used in the present invention have the meanings commonly understood by those of ordinary skill in the art. All terms used in the present invention are selected for the purpose of more clearly illustrating the present invention, rather than for limiting the scope of rights according to the present invention.

[0033] Expressions such as “including,” “having,” and “having” used in the present invention should be understood as open-ended terms that include the possibility of other embodiments, unless otherwise indicated in the sentence or text including the expression.

[0034] Unless otherwise specified, expressions in the singular form described in the present invention may include plural meanings, and the same applies to expressions in the singular form described in the scope of the patent application.

[0035] Expressions such as “first”, “second”, etc. used in the present invention are used to distinguish a plurality of components from one another, and do not limit the order or importance of the corresponding components.

[0036] In the present invention, when it is mentioned that a certain component is “connected” or “coupled” to another component, the specific component may be directly connected or coupled to the other component, and it should be understood that it may be connected or coupled via another new component.

[0037] The directional designation "upward" as used in the present invention refers to the direction of the test socket relative to the detection device, and the directional designation "downward" refers to the direction opposite to upward. It should be understood that the directional designation "vertical direction" as used in the present invention includes both upward and downward directions, but does not indicate a specific direction between the upward and downward directions.

[0038] The embodiments are described with reference to the examples shown in the accompanying drawings. In the accompanying drawings, identical or corresponding components are given the same reference numerals. In addition, in the following description of the embodiments, repeated descriptions of identical or corresponding components may be omitted. However, even if the description of a component is omitted, it does not mean that the component is not included in a particular embodiment.

[0039] The embodiments described below and the examples shown in the accompanying drawings relate to a test socket that can be used when testing a device under test. The test socket of the embodiments is disposed between a testing device and the device under test and can be used to electrically connect and test the testing device and the device under test. As an example, the test socket of the embodiments can be used for final electrical testing of a semiconductor device during post-processing in the semiconductor device manufacturing process, but the test socket of the embodiments is not limited to this example.

[0040] Figure 1 An example of a test socket according to an embodiment is shown. Figure 1 The test socket, its components, the detection device and the device to be detected are schematically shown. Figure 1 The shapes shown are merely examples chosen for understanding the embodiments.

[0041] Reference Figure 1 According to one embodiment, the test socket 10 can be a sheet-shaped component. When performing electrical testing on the device under test 30, the test socket 10 is disposed between the testing apparatus 20 and the device under test 30. As an example, the test socket 10 can be disposed between the device under test 30 and the testing apparatus 20 to perform high-frequency testing on the device under test 30.

[0042] The device under test 30 may be a semiconductor device in which a semiconductor IC chip and a plurality of terminals are encapsulated into a hexahedron shape using a resin material. As an example, the device under test 30 may be a semiconductor device used in a mobile communication device, but is not limited thereto. The device under test 30 has a plurality of terminals 31 on its lower side.

[0043] The detection device 20 can detect various operational characteristics of the device under test 30. The detection device 20 may include a board on which the detection is performed, and the board may include a detection circuit 21 for detecting the device under test 30. The detection circuit 21 has a plurality of terminals 22 electrically connected to the terminals 31 of the device under test via the test socket 10. The terminals 22 of the detection device 20 can transmit electrical test signals and receive response signals.

[0044] The test socket 10 can be configured to contact the terminals 22 of the detection device 20 via the socket guide 40. When testing the device 30 to be tested, the test socket 10 electrically connects the terminals 31 of the device to be tested and the corresponding terminals 22 of the detection device in the vertical direction VD, and the detection device 20 performs the detection of the device 30 to be tested via the test socket 10. The socket guide 40 is detachably mounted to the detection device 20. The socket guide 40 accommodates the device 30 to be tested, which is transported to the detection device 20 manually or by transport equipment, and aligns the device 30 to be tested relative to the test socket 10.

[0045] Reference Figure 1 According to one embodiment, a test socket 10 includes a housing 110, at least one probe 120, and at least one insulating member 130. The housing 110 constitutes the main body of the test socket, in which the probe 120 is positioned in the vertical direction VD. The housing 110 can be attached to the socket guide 40. The probe 120 is configured to transmit signals in the vertical direction VD. The probe 120 can contact the terminal 31 of the device under test 30 at its upper end and contact the terminal 22 of the testing device 20 at its lower end. The probe 120 is configured to be retractable and extendable in the vertical direction VD. The insulating member 130 allows the probe 120 to be positioned in the vertical direction VD within the housing 110.

[0046] To test the device under test 30, a pressure force P is applied to the test socket 10 by a mechanical device or manually through the device under test 30. As the terminal 31 of the device under test is pressed downward by the pressure force P, the upper end of the probe 120 contracts, shortening its length in the vertical direction. As the pressure force P is applied to the test socket 10, the probe 120 is pressed in the vertical direction, contacting the terminal 31 of the device under test and the terminal 22 of the testing device. When the pressure force P is removed from the test socket 10, the probe 120 extends to its original length in the vertical direction.

[0047] The test socket 10 may include a plurality of probes 120. The plurality of probes 120 may be arranged in a matrix form in the housing 110 and spaced apart in the horizontal direction HD by the housing 110.

[0048] To illustrate the test socket according to one embodiment, reference Figures 2 to 6 . Figures 2 to 6 The shapes of the components of the test socket are schematically shown. Figures 2 to 6 The shapes shown are merely examples chosen for understanding the embodiments. Figure 2 is a cross-sectional view showing a portion of a test socket according to an embodiment of the present application, and Figure 3 It shows Figure 2 A perspective view of a portion of a test socket is shown. Figure 4 and Figure 5FIG. 1 is a cross-sectional view schematically illustrating a portion of a probe of a test socket according to an embodiment. Figure 6 FIG. 1 is a cross-sectional view schematically illustrating another example of a probe of a test socket according to an embodiment.

[0049] Reference Figure 2 and Figure 3 According to an embodiment, the test socket 10 includes: a housing 110 ; a probe 120 disposed in the housing 110 and configured to perform signal transmission in a vertical direction VD; and an insulating member 130 for positioning the probe 120 in the housing 110 .

[0050] The housing 110 constitutes the main body of the test socket and may have a hexahedral shape. The housing 110 may be made of a metal material such as aluminum, but the material constituting the housing is not limited thereto. The probe 120 is disposed in the housing 110 and is held in the vertical direction VD by the housing 110. In order to dispose the probe 120 in the housing 110, a through hole 111 is formed in the housing 110 in the vertical direction. The through hole 111 penetrates the housing 110 in the vertical direction VD. That is, the through hole 111 is vertically perforated in the housing from the lower surface of the housing 110 to the upper surface of the housing 110.

[0051] In one embodiment, the housing 110 includes an upper housing 112 and a lower housing 113 coupled in the vertical direction VD. An upper through-hole 114 is formed in the upper housing 112 in the vertical direction VD, and a lower through-hole 115 is formed in the lower housing 113 in the vertical direction VD. When the upper housing 112 and the lower housing 113 are coupled, the upper through-hole 114 and the lower through-hole 115 form a through-hole 111 that penetrates the housing 110 in the vertical direction VD.

[0052] The probe 120 is disposed in the through hole 111 of the housing in the vertical direction VD. The probe 120 is configured to be able to shrink and extend in the vertical direction VD. The probe 120 held by the housing 110 electrically connects the detection device and the device to be detected and performs signal transmission between them.

[0053] The probe 120 includes an upper plunger 121 disposed on the upper side; a lower plunger 122 disposed on the lower side; a barrel 123 that supports and retains the upper and lower plungers 121, 122 so that they can move in the vertical direction VD; and an elastic member 124 disposed within the barrel 123 between the upper and lower plungers 121, 122. The upper plunger 121 contacts the device being tested. The lower plunger 122 contacts the detection device. The barrel 123 may be cylindrical, with the upper and lower plungers 121, 122 partially inserted into the cylindrical space of the barrel 123. The elastic member 124 is disposed within the interior space of the barrel 123. The elastic member 124 is located between the upper plunger 121 and the lower plunger 122 and applies elastic force to the upper plunger 121 and the lower plunger 122 in the vertical direction VD. As an example, Figure 2 The elastic member 124 shown may be a compression coil spring. The upper and lower plungers 121, 122, and sleeve 123 are made of a conductive metal material. The probe 120 is an assembly composed of the upper and lower plungers 121, 122, sleeve 123, and elastic member 124. Such a probe 120 is referred to in the art as a contact probe or pogo pin.

[0054] The pressure applied downward by the device being tested (refer to Figure 1 Under the pressure P shown, the upper plunger 121 and the lower plunger 122 are pushed into the interior of the sleeve 123 by the elastic force of the elastic member 124. Therefore, the probe 120 can retract in the vertical direction. When the pressure is removed, the upper plunger 121 and the lower plunger 122 return to their original positions due to the elastic force of the elastic member. Therefore, the probe 120 can extend in the vertical direction VD. Thus, due to the above-mentioned pressure applied to the device being tested, the probe 120 can retract in the vertical direction. Furthermore, when the above-mentioned pressure is removed, the probe 120 can extend to its original state.

[0055] The upper plunger 121 is connected to the terminal of the device to be tested (see Figure 1 The lower plunger 122 contacts the terminal of the detection device (see Figure 1The sleeve 123 is in conductive contact with the upper plunger 121 and the lower plunger 122. Thus, the probe 120 can be used as a medium to vertically transmit signals between the terminal 22 of the testing device corresponding to a probe 120 and the terminal 31 of the device under test. Thus, the test signal of the testing device can be transmitted from the terminal 22 of the testing device to the terminal 31 of the device under test via the probe 120, and the response signal of the device under test can be transmitted from the terminal 31 of the device under test to the terminal 22 of the testing device via the probe 120.

[0056] The probe 120 is disposed in the through-hole 111 in the vertical direction VD via an insulating member 130. The insulating member 130 is configured to position the probe 120 in the through-hole 111. The insulating member 130 is disposed between the inner surface of the through-hole 111 and the outer surface of the probe 120. The insulating member 130 insulates the probe 120 from the housing 110 and is made of an insulating material.

[0057] Probe 120 is positioned within housing 110 so as to be coaxial with the central axis CA of through-hole 111 in the vertical direction VD. The coaxial arrangement of probe 120 is facilitated by insulating member 130. Insulating member 130 positions probe 120 within through-hole 111 so that the central axis CA of through-hole 111 coincides with the central axis of probe 120. Insulating member 130 is configured so that probe 120 is coaxial with through-hole 111 in the vertical direction VD. Insulating member 130 is formed in an annular shape. Thus, insulating member 130 is positioned between the inner surface of through-hole 111 and the outer surface of probe 120, with a portion of probe 120 extending through insulating member 130 in the vertical direction VD.

[0058] In one embodiment, the insulating component 130 includes an upper insulating component 131 and a lower insulating component 132 that can be matched with the through hole 111 of the housing.

[0059] The upper insulating member 131 is disposed within the upper housing 112 and engages with the upper through-hole 114 near its upper end. The upper insulating member 131 has an upper engagement hole 133 extending therethrough, coaxially with the central axis CA of the through-hole 111. With the upper end of the sleeve 123 engaged with the upper engagement hole 133 in the vertical direction VD, the upper plunger 121 extending through the upper engagement hole 133, and the upper end of the upper plunger 121 protruding upward, the upper portion of the probe 120 engages with the upper insulating member 131. When the probe contacts a terminal of the device under test, the upper plunger 121 can move through the upper engagement hole 133 into the interior of the sleeve 123. The upper end surface of the upper insulating member 131 can be located at the same height as the upper surface of the upper housing 112, or it can have a vertical height difference relative to the upper surface of the upper housing 112.

[0060] The lower insulating member 132 is disposed within the lower housing 113 and engages with the lower through-hole 115 near its lower end. The lower insulating member 132 has a lower engagement hole 134 extending therethrough, coaxially with the central axis CA of the through-hole 111. With the lower end of the sleeve 123 engaged with the lower engagement hole 134 in the vertical direction VD, and the lower plunger 122 extending through the lower engagement hole 134 and protruding downward, the lower portion of the probe 120 engages with the lower insulating member 132. When the terminal of the detection device contacts the probe, the lower plunger 122 can move through the lower engagement hole 133 into the interior of the sleeve 123.

[0061] The central axes of the upper fitting hole 133 and the lower fitting hole 134 are coaxial with the central axis CA of the through hole 111 of the housing 110. The probe 120 is fitted into the upper fitting hole 133 and the lower fitting hole 134 in the vertical direction VD. The probe 120 is placed in the through hole 111 while being supported by the upper insulating member 131 and the lower insulating member 132, and is positioned coaxially with the central axis CA of the through hole 111.

[0062] The upper fitting hole 133 is formed so that the upper end of the sleeve 123 fits therein and the upper plunger 121 is inserted therein with a certain clearance therefrom. The lower fitting hole 134 is formed so that the lower end of the sleeve 123 fits therein and the lower plunger 122 is inserted therein with a certain clearance therefrom. The upper insulating component 131 can fit into the upper through-hole 114 from bottom to top, while the lower insulating component 132 can fit into the lower through-hole 115 from top to bottom. The lower end of the upper insulating component 131 has a flange 135, while the upper end of the lower insulating component 132 has a flange 135. The upper through-hole 114 and the lower through-hole 115 have stepped portions 116 corresponding to the flanges 135, with which the flanges 135 can fit.

[0063] As an example, the test socket 10 can be assembled and manufactured by combining the upper shell 112 and the lower shell 113. The upper insulating component 131 is set in the upper through hole 114 of the upper shell 112, and the upper end of the probe 120 can be inserted into the upper matching hole 133 of the upper insulating component 131. Therefore, the upper end of the probe 120 can be temporarily assembled to the upper shell 112. Then, the lower insulating component 132 can be set in the lower through hole 115 of the lower shell 113. Thereafter, in order to insert the lower end of the probe 120 into the lower matching hole 134 of the lower insulating component 132, the upper shell 112 and the lower shell 113 can be combined in the vertical direction VD. Therefore, the test socket 10 is assembled and manufactured while the probe 120 is set to be coaxial with the central axis CA of the through hole 111 of the shell 110.

[0064] The insulating component 130 positions the probe 120 in the through hole 111 in a coaxial manner with the central axis of the through hole, and acts as a dielectric in the signal transmission of the probe 120. According to a test socket of one embodiment, the insulating component 130 is not only made of an insulating material, but also is constructed to have a low dielectric constant. The insulating material constituting the upper insulating component 131 and the lower insulating component 132 as insulating components can be any one of resin, glass, silicon dioxide, zirconium oxide and ceramic. In addition, the resin constituting the insulating component can be any one of rubber, polymethyl methacrylate, polyethylene, phenolic resin, epoxy resin and novolac, but is not limited thereto.

[0065] In through-hole 111 of housing 110, upper insulating member 131, lower insulating member 132, and probe 120 are arranged coaxially with central axis CA of through-hole 111. This coaxial arrangement reduces signal loss through probe 120 during high-frequency testing of the device under test. Furthermore, housing 110 eliminates leakage current generated during signal transmission from probe 120.

[0066] In the signal transmission of the probe 120, the dielectric constant of the upper insulating part and the lower insulating part has an impact on reducing signal loss. The lower the dielectric constant of the upper insulating part and the lower insulating part, the more the signal loss can be greatly reduced. In addition, the lower the dielectric constant of the upper insulating part and the lower insulating part, the better the impedance of the probe 120 can be matched with the impedance of the device being tested and the impedance of the detection circuit of the detection device. The upper insulating part and the lower insulating part are processed into a specific shape and size for positioning the probe 120 in a coaxial arrangement. Therefore, while maintaining the machinability of the upper insulating part and the lower insulating part, the upper insulating part and the lower insulating part having a lower dielectric constant will be beneficial to reducing signal loss and impedance matching.

[0067] According to one embodiment, the insulating component 130 of the test socket 10 can be made of the above-mentioned insulating material and have a porous structure to have a low dielectric constant. That is, the upper insulating component 131 and the lower insulating component 132 are made of an insulating material with a porous structure. The upper insulating component 131 and the lower insulating component 132 are formed into a shape and size with a coaxial arrangement for a probe, and include multiple micropores (micropores) in order to reduce the dielectric constant. Like this, the upper insulating component 131 and the lower insulating component 132 include multiple micropores and are made of the above-mentioned insulating material. The upper insulating component 131 and the lower insulating component 132 including micropores have a lower dielectric constant compared to the insulating component without micropores, which can further reduce the signal loss in the signal transmission of the probe 120. Although such micropores may be included in the upper insulating member 131 and the lower insulating member 132 in the form of gaspores or hollow particles, the form of the micropores is not limited to gaspores or hollow particles.

[0068] Figure 4 and Figure 5 Examples of micropores are shown respectively. Figure 4 and Figure 5 The shapes of the micropores shown are merely examples chosen for the purpose of understanding the embodiments.

[0069] In a test socket of an embodiment, the insulating member that positions the probe in the through hole in a coaxial manner with the central axis of the through hole may be made of an insulating material including a plurality of micropores. The insulating material may be the above-mentioned resin, and the plurality of micropores may be air pores. Figure 4 The upper insulating member 131 and the lower insulating member 132 include a plurality of pores 136 as the micropores. The pores 136 are irregularly distributed throughout the insulating resin constituting the upper insulating member 131 and the lower insulating member 132.

[0070] The air pores 136 can be formed by a chemical reaction between the liquid resin constituting the insulating component and the foaming agent. The foaming agent can be added to the liquid resin used to mold the upper insulating component 131 and the lower insulating component 132 when molding the upper insulating component 131 and the lower insulating component 132. The upper insulating component and the lower insulating component 131, 132 can be molded by injecting the above-mentioned liquid resin into a molding mold, and the above-mentioned foaming agent can be added to the liquid resin. During the molding process of the upper insulating component and the lower insulating component, the above-mentioned foaming agent chemically reacts with the liquid resin to generate gas. The generated gas pushes the liquid resin away in the liquid resin. Therefore, the generated gas partially depletes the liquid resin during the molding process of the upper insulating component and the lower insulating component 131, 132, so that a plurality of air pores 136 of various sizes can be formed throughout the upper insulating component 131 and the lower insulating component 132. As another example, a resin workpiece including air holes may be prepared, and such a workpiece may be processed into an insulating component.

[0071] The plurality of pores 136 may be filled with gas. As an example, the plurality of pores 136 may be filled with gas generated during the process of forming the pores 136. Alternatively, the pores 136 may be filled with air or a vacuum.

[0072] In the test socket according to one embodiment, the insulating component can be made of the above-mentioned insulating material and include a plurality of micropores, which can be hollow particles. Figure 5 , the upper insulating part 131 and the lower insulating part 132 include a plurality of hollow particles 137 as the above-mentioned micropores. The hollow particles 137 are irregularly distributed throughout the insulating material constituting the upper insulating part 131 and the lower insulating part 132. As an example, the size of the hollow particles 137 may be about 10 μm to about 30 μm, but is not limited thereto. The hollow particles 137 may be added to the liquid insulating material used to mold the upper insulating part 131 and the lower insulating part 132 when molding the upper insulating part 131 and the lower insulating part 132. The upper insulating part 131 and the lower insulating part 132 may be molded by injecting the above-mentioned liquid material into a molding mold, and the hollow particles 137 may be added to the liquid material. As another example, a workpiece of the above-mentioned insulating material including hollow particles may also be prepared, and such a workpiece may be processed into an insulating part.

[0073] The hollow particles 137 may include a gas 138 and a membrane (shell) 139 containing the gas. The membrane 139 may have any shape capable of containing the gas 138 therein. As an example, the membrane 139 may be in the shape of a sphere, but is not limited thereto. The membrane 139 may be made of the same substance as the insulating material constituting the upper insulating part 131 and the lower insulating part 132, or a different substance. As an example, the membrane 139 may be made of any one of glass, silica, zirconium oxide, ceramic, polymethyl methacrylate, polyethylene rubber, and acrylic resin. The gas 138 contained inside the membrane 139 may be air. As an example, when the upper insulating part and the lower insulating part are made of epoxy resin, the dielectric constant of the epoxy resin may be approximately 3.6. The dielectric constant of the air contained in the hollow particles may be approximately 1. Therefore, the upper insulating part and the lower insulating part made of a resin material containing hollow particles may exhibit a low dielectric constant. There is no particular limitation on the gas 138 contained in the film 139. As another example, the interior of the film 139 may be a vacuum.

[0074] When the volume of the insulating part is taken as 100%, the insulating part may include a plurality of micropores (pores 136 or hollow particles 137) of 1 vol% to 50 vol%. That is, when the volume of the upper insulating part and the lower insulating part is taken as 100%, a plurality of micropores (pores 136 or hollow particles 137) are contained in the upper insulating part 131 and the lower insulating part 132 at a ratio of 1 vol% to 50 vol%. By appropriately selecting the content rate of micropores (pores or hollow particles), the dielectric constant of the insulating part can be adjusted. When the content rate of pores or hollow particles is too small, the effect of reducing the dielectric constant of the insulating part will become smaller. When the content rate of pores or hollow particles exceeds 50 vol%, the workability related to the molding of the insulating part will decrease, and the durability of the insulating part will deteriorate.

[0075] Figure 4 The upper insulating member and the lower insulating member are shown to include air holes. Figure 5 It is shown that the upper insulating part and the lower insulating part include hollow particles. As another example, one of the upper insulating part and the lower insulating part may include pores, and the other one may include hollow particles.

[0076] According to a test socket of one embodiment, the upper insulating component 131 and the lower insulating component 132 include a plurality of micropores (pores 136 or hollow particles 137). Therefore, compared to an insulating component without the aforementioned micropores and made solely of an insulating resin material and having an outer diameter identical to that of the upper and lower insulating components, the upper and lower insulating components 131 and 132 can have a lower dielectric constant, further reducing signal loss during signal transmission from the probe 120. Furthermore, because the impedance of the probe 120 matches the impedance of the device under test and the impedance of the detection circuit, signal loss due to impedance mismatch does not occur. Therefore, the test socket according to one embodiment can be effectively used for high-frequency inspection of the device under test.

[0077] By adding the above-mentioned foaming agent or the above-mentioned hollow particles to the material for forming the upper insulating part and the lower insulating part, micropores can be formed in the upper insulating part and the lower insulating part. Therefore, while maintaining the machinability of the upper insulating part and the lower insulating part, the dielectric constant of the upper insulating part and the lower insulating part can be reduced without changing the material and size of the upper insulating part and the lower insulating part. In addition, by adjusting the volume ratio or size of the pores or hollow particles included in the upper insulating part and the lower insulating part, the characteristic value of the test seat of one embodiment can be controlled. In addition, the upper insulating part and the lower insulating part having a lower dielectric constant due to the micropores can be formed to have a smaller outer diameter, which can further reduce the spacing distance between the probes 120 (i.e., the spacing between the probes). Therefore, the test seat of one embodiment can be constructed so that the spacing between the probes 120 is further reduced. In addition, instead of the insulating component without the above-mentioned micropores, the upper insulating component and the lower insulating component according to one embodiment can be easily applied to the test socket, and while maintaining the strength and workability of the insulating component, the test socket can be easily given excellent signal transmission capability.

[0078] The columnar structure that can conduct electricity in the vertical direction and can also shrink and expand in the vertical direction can be used as the elastic component of the probe. Figure 6 The probe 120 is disposed in a sleeve 123 and includes an elastic member 125 for applying elastic force to the upper plunger 121 and the lower plunger 122 . Figure 6 The illustrated elastic member 125 is columnar and is disposed between the upper plunger 121 and the lower plunger 122. The upper end of the elastic member 125 contacts the lower end of the upper plunger 121, and the lower end contacts the upper end of the lower plunger 122. The elastic member 125 is made of a plurality of conductive particles 126 that are electrically contactable in the vertical direction VD, and an elastic material 127 that holds the plurality of conductive particles 126 in the vertical direction VD.

[0079] The plurality of conductive particles 126 are made of a metal material capable of conducting electricity. The conductive particles 126 are irregularly distributed from the upper end to the lower end of the elastic member 125. The conductive particles 126 are conductively contactable in the vertical direction VD and are assembled along the vertical direction VD (for example, in a columnar shape). The conductive particles 126 that are conductively contactable in the vertical direction VD act as a conductor for performing signal transmission between the upper plunger 121 and the lower plunger 122. In order to gather the conductive particles 126 in a columnar shape, the elastic material 127 holds the conductive particles 126 in the vertical direction VD. The elastic material 127 can be filled between the conductive particles 126. The elastic material 127 and the conductive particles 126 are formed into one body to constitute the elastic member 125. The elastic material 127 includes silicone rubber.

[0080] Due to the elastic restoring force of the elastic material 127, the elastic member 125 can contract in the vertical direction VD or expand to its original state before contraction. For example, when testing a device under test, the elastic member 125 can contract in the vertical direction VD due to the pressure applied by the upper plunger 121. When the pressure is removed, the elastic member 125 expands to its original state due to the elastic restoring force of the elastic material 127.

[0081] The improved performance of the test socket of an embodiment can be verified using software for simulating high frequency electromagnetic fields. Figures 7 to 10 A graph showing simulation results performed using software for simulating high-frequency electromagnetic fields is shown. The above simulations were performed in a test socket according to an embodiment and a test socket according to a comparative example. Figures 7 to 10 In the graph shown, the horizontal axis represents frequency in GHz, and the vertical axis has decibels (dB). Regarding the simulations described above, the upper and lower insulating components of the test socket of one embodiment were made of an epoxy resin with a dielectric constant of 3.6 and included the aforementioned hollow particles. The upper and lower insulating components of the test socket of the comparative example were also made of an epoxy resin with a dielectric constant of 3.6, but did not contain any of the aforementioned hollow particles or pores.

[0082] Figure 7 and Figure 8 The figure shows simulation results on insertion loss, which refers to the degree of signal loss during signal transmission. Figure 7 shows a curve corresponding to a test socket of an embodiment, and Figure 8 A curve corresponding to the test socket of the comparative example is shown. Figure 7 and Figure 8 In the graph shown, a curve close to 0dB indicates less signal loss. Figure 7 and Figure 8The comparison of the test socket of the embodiment can confirm that the test socket of the embodiment has smaller signal loss in the high frequency range of 0 GHz to 50 GHZ than the test socket of the comparative example.

[0083] Figure 9 and Figure 10 The figure shows the simulation results of return loss, which refers to the degree of signal reflection during signal transmission. Figure 9 shows a curve corresponding to a test socket of an embodiment, Figure 10 A curve of a test socket corresponding to a comparative example is shown. Figure 9 and Figure 10 In the graph shown, the curve close to 0dB indicates a large signal reflection. Figure 9 and Figure 10 A comparison of the test sockets of one embodiment demonstrates less signal reflection in the high-frequency range of 20 GHz to 40 GHz compared to the test sockets of the comparative example. Therefore, the test socket of one embodiment, in which the upper and lower insulating members include multiple air holes or multiple hollow particles, exhibits reduced reflection loss, particularly in the high-frequency range of 20 GHz to 40 GHz, where high-frequency testing is performed.

[0084] In addition, according to Figures 7 to 10 The graph of the simulation results shows that the upper insulating member and the lower insulating member of the test socket according to one embodiment have dielectric constants reduced by about 10%.

[0085] Although the technical concept of the present invention has been described through the examples shown in the above embodiments and the accompanying drawings, it should be understood that various substitutions, modifications and changes may be made without departing from the technical concept and scope of the present invention as can be understood by those skilled in the art. In addition, such substitutions, modifications and changes should be considered to be within the scope of the appended patent claims.

Claims

1. A test socket for detecting electrical connection between a device and a device under test, comprising: a housing, wherein a through hole is formed in a vertical direction; a probe disposed in the through hole in the vertical direction, the probe being configured to contract and extend in the vertical direction and perform signal transmission in the vertical direction; as well as an insulating member disposed between an inner surface of the through-hole and an outer surface of the probe, the insulating member being configured such that the probe is positioned coaxially with the through-hole in a vertical direction, and comprising a plurality of micropores, The probes include: an upper plunger, contacting the device to be detected and capable of conducting electricity; a lower plunger in contact with the detection device and capable of conducting electricity; a sleeve that is in conductive contact with the upper plunger and the lower plunger, supports the upper plunger and the lower plunger so as to be movable in the vertical direction, and is fitted into the insulating member; and an elastic member disposed within the sleeve between the upper plunger and the lower plunger, and The insulating member includes 1 vol % to 50 vol % of the plurality of micropores. The test socket according to claim 1 , wherein the plurality of micropores are air holes.

3. The test socket according to claim 2, wherein the insulating member is made of a resin including the plurality of micropores, and the pores are formed by a chemical reaction between the liquid resin and a foaming agent. The test socket according to claim 1 , wherein the plurality of micropores are hollow particles. 5 . The test socket according to claim 4 , wherein the hollow particles comprise a film made of any one of glass, silicon dioxide, zirconium oxide, ceramics, polymethyl methacrylate, polyethylene rubber, and acrylic resin.

6. The test socket of claim 5, wherein the hollow particles include air contained within the membrane.

7. The test socket according to claim 1, wherein the insulating member is made of any one of resin, glass, silicon dioxide, zirconium oxide, and ceramics, and includes the plurality of micropores.

8. The test socket according to claim 7, wherein the resin is any one of rubber, polymethyl methacrylate, polyethylene, phenolic resin, epoxy resin, and novolac resin.

9. The test socket of claim 1 , wherein the insulating member comprises: an upper insulating member having an upper fitting hole penetrating coaxially with a central axis of the through hole and fitted into the through hole; as well as a lower insulating member having a lower fitting hole penetrating coaxially with a central axis of the through hole and fitted into the through hole; The probe is fitted into the upper fitting hole and the lower fitting hole and is positioned coaxially with the through hole.

10. The test socket of claim 9, wherein the upper plunger moves through the upper fitting hole, the lower plunger moves through the lower fitting hole, and the sleeve is fitted into the upper fitting hole and the lower fitting hole. 11 . The test socket according to claim 10 , wherein the elastic member is made of a plurality of conductive particles that can be conductively contacted in the vertical direction and an elastic material that holds the plurality of conductive particles in the vertical direction.

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