Antenna device and communication device

Abstract

The present application relates to an antenna device. A ground layer is arranged in an inner layer of a dielectric substrate. A power supply line is arranged in the dielectric substrate. A first antenna element and a second antenna element are supported by the dielectric substrate. The first antenna element and the second antenna element respectively include a first power supply element and a second power supply element connected to the power supply line, and are arranged on the same side when viewed from the ground layer, taking the ground layer as a height reference, with the top of the second antenna element arranged at a higher position than the top of the first antenna element. An antenna device capable of broadband and effective use of space in the housing is provided.

Description

Technical Field

[0001] This invention relates to an antenna device and a communication device equipped with the antenna device. Background Technology

[0002] Figure 2 of Patent Document 1 below discloses an antenna device in which planar antennas and substrate-integrated waveguides are disposed on different layers of a multilayer substrate. According to Figure 2 of Patent Document 1, a ground layer is disposed on the layer below the layer in which multiple planar antennas are disposed.

[0003] Patent Document 1: Japanese Patent No. 5069093

[0004] As mobile terminals continue to become thinner and lighter, there is a growing demand for efficient use of space within the terminal's casing. Furthermore, there is a desire for wider antenna bandwidth. In the antenna device described in Patent Document 1, the distance from the grounding conductor to the multiple planar antennas is the same, making it difficult to achieve wide bandwidth. Summary of the Invention

[0005] The object of this invention is to provide an antenna device capable of broadband operation and efficient use of space within a housing. Another object of this invention is to provide a communication device incorporating this antenna device.

[0006] According to one aspect of the present invention, an antenna device is provided, comprising:

[0007] Dielectric substrate;

[0008] A grounding layer is disposed in the inner layer of the aforementioned dielectric substrate;

[0009] Power supply lines are disposed on the aforementioned dielectric substrate; and

[0010] The first antenna element and the second antenna element are supported on the aforementioned dielectric substrate.

[0011] The first antenna element and the second antenna element mentioned above each include a first power supply element and a second power supply element connected to the power supply line, and are arranged on the same side when viewed from the ground plane. The ground plane is used as a height reference, and the top of the second antenna element is arranged at a position higher than the top of the first antenna element.

[0012] According to another aspect of the present invention, a communication device is provided, comprising:

[0013] The aforementioned antenna device;

[0014] Housing, housing the aforementioned antenna device; and

[0015] A high-frequency integrated circuit element is housed in the aforementioned housing and supplies high-frequency signals to the first power supply element and the second power supply element via the aforementioned power supply lines.

[0016] The first antenna element and the second antenna element are facing the inner surface of the housing. In a direction perpendicular to the grounding layer, the distance from the intersection of the grounding layer and the second antenna element to the inner surface of the housing is longer than the distance from the intersection of the grounding layer and the first antenna element to the inner surface of the housing.

[0017] By using the ground plane as a height reference, the top of the second antenna element is positioned higher than the top of the first antenna element, achieving broadband compared to a structure where the second antenna element is positioned at the same height as the first antenna element. Furthermore, by using the ground plane as a reference and positioning the second antenna element at a relatively high height up to the inner surface of the housing, the space within the housing can be effectively utilized. Attached Figure Description

[0018] Figure 1A This is a cross-sectional view of the antenna device according to the first embodiment. Figure 1B This is a cross-sectional view of a portion of the communication device in the first embodiment.

[0019] Figure 2A It is a three-dimensional view of a simulated model of the antenna device having the structure of the first embodiment. Figure 2B This is a 3D view of the simulation model of the comparative example.

[0020] Figure 3A as well as Figure 3B They represent the terms "to" and "to". Figure 2A as well as Figure 2B The simulation model shown presents a graph illustrating the frequency characteristics of the return loss when the second power supply element is powered.

[0021] Figure 4A as well as Figure 4B These represent the directions Figure 2A as well as Figure 2B The diagram shows the directional characteristics of the simulation model when the second power supply element is supplied with a 40 GHz high-frequency signal.

[0022] Figure 5A as well as Figure 5B These represent the directions Figure 2A as well as Figure 2B The graph shows the pointing characteristics of the simulation model when the first power supply element on the positive side of the y-axis is supplied with a high-frequency signal of 40 GHz.

[0023] Figure 6A This is a cross-sectional view of the antenna device of a modified example of the first embodiment. Figure 6BThis is a cross-sectional view of an antenna device of another variation of the first embodiment. Figure 6C This is a perspective view of an antenna device of another variation of the first embodiment.

[0024] Figure 7 This is a cross-sectional view of the antenna device according to the second embodiment.

[0025] Figure 8 This is a cross-sectional view of the antenna device according to the third embodiment.

[0026] Figure 9 This is a cross-sectional view of the antenna device according to the fourth embodiment.

[0027] Figure 10A This is a cross-sectional view of the antenna device 50 of the fifth embodiment. Figure 10B , Figure 10C , Figure 10D These are cross-sectional views of the antenna device of the fifth embodiment, which are variations thereof.

[0028] Figure 11 This is a perspective view of the antenna device in the sixth embodiment.

[0029] Figure 12 This is a perspective view of the antenna device of a modified example of the sixth embodiment.

[0030] Figure 13 This is a perspective view of an antenna device of another variation of the sixth embodiment.

[0031] Figure 14 This is a perspective view of an antenna device of another variation of the sixth embodiment. Detailed Implementation

[0032] [First Embodiment]

[0033] Reference Figures 1A to 5B The accompanying drawings illustrate the antenna device and communication device of the first embodiment.

[0034] Figure 1A This is a cross-sectional view of the antenna device 50 according to the first embodiment. An additional member 20 is disposed on one surface of the dielectric substrate 10 (hereinafter referred to as the upper surface). The additional member 20 is fixed to the dielectric substrate 10, for example, by an adhesive. The additional member 20 is formed of the same dielectric material as the dielectric substrate 10. In a top view, the additional member 20 overlaps with a portion of the upper surface of the dielectric substrate 10. That is, there is a region on the upper surface of the dielectric substrate 10 where the additional member 20 is not disposed. The additional member 20 has an upper surface parallel to the upper surface of the dielectric substrate 10.

[0035] A pair of first antenna elements 30 are arranged on the dielectric substrate 10 such that an additional component 20 is sandwiched between them when viewed from above. Each of the first antenna elements 30 is composed of a first power supply element 31 made of a metal film disposed on the upper surface of the dielectric substrate 10. A second antenna element 40 is disposed on the additional component 20. The second antenna element 40 is composed of a second power supply element 41 made of a metal film disposed on the upper surface of the additional component 20.

[0036] A ground layer 11 is disposed within the inner layer of the dielectric substrate 10. Furthermore, a plurality of power supply lines 12 are disposed within the dielectric substrate 10. Each power supply line 12 includes a microstrip line or a three-strip structure stripline and a via conductor extending in the thickness direction of the dielectric substrate 10. Two first power supply elements 31 are respectively connected to the power supply lines 12. High-frequency signals are supplied to the first power supply elements 31 via the power supply lines 12. The two first power supply elements 31 operate as patch antennas with the ground layer 11.

[0037] A power supply line 22, consisting of a via conductor connected to the second power supply element 41, is disposed within the additional component 20. The power supply line 22 is connected to a power supply line 12 disposed on the dielectric substrate 10 via solder 21. High-frequency signals are supplied to the second power supply element 41 via the power supply line 12, solder 21, and power supply line 22. The second power supply element 41 and the ground layer 11 operate as a patch antenna.

[0038] Two first antenna elements 30 are directly supported on the dielectric substrate 10, and a second antenna element 40 is supported on the dielectric substrate 10 via an additional component 20. The first antenna elements 30 and the second antenna element 40 are positioned on the same side (the upper surface side of the dielectric substrate 10) when viewed from the ground layer 11. Using the ground layer 11 as a height reference, the top of the second antenna element 40 is positioned higher than the top of the first antenna element 30. That is, the second power supply element 41 is positioned higher than the first power supply element 31. Therefore, the distance from the ground layer 11 to the second power supply element 41 is larger than the distance from the ground layer 11 to the first power supply element 31.

[0039] Figure 1B This is a cross-sectional view of a portion of the communication device according to the first embodiment. It is housed within the housing 60. Figure 1AThe antenna assembly 50, high-frequency integrated circuit (RFIC) element 51, and baseband integrated circuit (BBIC) element 52 are shown. A portion of the inner surface of the housing 60 includes a cylindrical surface 61 that is curved to become convex towards the outer side of the housing 60. The antenna assembly 50 is supported within the housing 60 with the first antenna element 30 and the second antenna element 40 facing the cylindrical surface 61, and the ground layer 11 is parallel to the generatrix of the cylindrical surface 61. Furthermore, the antenna assembly 50 is supported within the housing 60 with the two first antenna elements 30 and one second antenna element 40 arranged in a direction orthogonal to the generatrix of the cylindrical surface 61 when viewed from above the dielectric substrate 10. The distance L2 from the intersection of the ground layer 11 and the second antenna element 40 to the cylindrical surface 61 is longer than the distance L1 from the intersection of the ground layer 11 and the first antenna element 30 to the cylindrical surface 61.

[0040] BBIC52 performs baseband signal processing. Baseband or intermediate frequency signals are input from BBIC52 to RFIC51. RFIC51 up-converts the baseband or intermediate frequency signals and transmits them via power supply lines 12 and 22. Figure 1A The RFIC51 supplies high-frequency signals to the first power supply element 31 and the second power supply element 41. The RFIC51 also down-converts the high-frequency signals received by the first power supply element 31 and the second power supply element 41, and inputs the down-converted signals to the BBIC52.

[0041] Next, the superior effects of the first embodiment will be explained.

[0042] In the first embodiment, when viewed from the ground layer 11, the second power supply element 41 is positioned higher than the upper surface of the dielectric substrate 10. That is, the distance from the ground layer 11 to the second power supply element 41 is greater than the distance from the ground layer 11 to the upper surface of the dielectric substrate 10. Therefore, compared to a structure in which the second power supply element 41 is positioned at the same height as the first power supply element 31, the operating bandwidth of the second antenna element 40 can be expanded.

[0043] Furthermore, the distance L2 from the intersection of the ground layer 11 and the second antenna element 40 to the cylindrical surface 61 is longer than the distance L1 from the intersection of the ground layer 11 and the first antenna element 30 to the cylindrical surface 61. Even if the second power supply element 41 is disposed on the upper surface of the dielectric substrate 10, the space between the second antenna element 40 and the cylindrical surface 61 is difficult to use for other purposes. Since the space occupied by the additional component 20 and the second antenna element 40 is difficult to use for other purposes, even if the additional component 20 and the second antenna element 40 are disposed within the housing 60, the space for accommodating other components will not be narrowed. In this way, the broadband of the antenna device 50 can be achieved without occupying additional space within the housing 60.

[0044] Next, refer to Figures 2A to 5B The accompanying drawings illustrate the simulations performed to confirm the superior effects of the first embodiment and the results thereof.

[0045] Figure 2A This is a perspective view of a simulated model of the antenna device 50 having the structure of the first embodiment. Figure 2B This is a 3D diagram of the simulation model for the comparative example. Figure 2A The structural elements of the simulation model shown are attached to the antenna device 50 of the first embodiment. Figure 1A The corresponding structural elements are referenced to the same reference numerals in the accompanying drawings.

[0046] The first power supply element 31 and the second power supply element 41 are each square in shape when viewed from above. The centers of one first power supply element 31, the second power supply element 41, and the first power supply element 31 of the other are located sequentially on a straight line when viewed from above. The direction of this straight line is defined as the y-axis direction, and the normal direction of the upper surface of the dielectric substrate 10 is defined as the z-axis direction, forming an xyz orthogonal coordinate system. The edges of the first power supply element 31 and the second power supply element 41 are parallel to the x-axis direction or the y-axis direction.

[0047] The length L of one side of each of the first power supply element 31 and the second power supply element 41 is 1.9 mm, and the distance G between the first power supply element 31 and the second power supply element 41 in the y-axis direction is 5 mm. The distance from the ground layer 11 to the first power supply element 31 is 0.172 mm, and the distance from the ground layer 11 to the second power supply element 41 is 0.39 mm. Power supply points 32y and 42y are respectively arranged slightly inward from the midpoint of the positive edge of the first power supply element 31 and the second power supply element 41 on the y-axis side, and power supply points 32x and 42x are respectively arranged slightly inward from the midpoint of the positive edge of the x-axis side.

[0048] exist Figure 2B In the comparative example shown, the additional component 20 is not configured, and the spacing from the ground plane 11 to the second power supply element 41 is the same as the spacing from the ground plane 11 to the first power supply element 31.

[0049] Figure 3A as well as Figure 3B These represent the directions Figure 2A as well as Figure 2B The simulation model shown has a graph illustrating the frequency characteristics of the return loss of the second power supply element 41 during power supply. The horizontal axis represents frequency in "GHz" and the vertical axis represents return loss in "dB". Figure 3A as well as Figure 3BCurves a and b show the return losses when power is supplied to power supply points 42x and 42y of the second power supply element 41, respectively. As shown by curve c, the return losses when power is supplied to power supply points 32x and 32y of the two first power supply elements 31 are approximately overlapping.

[0050] If the range of return loss below -10dB is defined as the operating frequency band, then the operating frequency band widths when power is supplied to power supply points 42x and 42y of the second power supply element 41 are denoted as FBx and FBy. The operating frequency band widths FBx and FBy of the simulation model of the first embodiment are wider than those of the simulation model of the comparative example. Based on the simulation results, it is confirmed that broadband can be achieved by adopting the structure of the first embodiment. Furthermore, in the simulation, the first power supply element 31 and the second power supply element 41 are supplied separately, but when two first power supply elements 31 and one second power supply element 41 are supplied simultaneously and they are operated as an array antenna, broadband can also be achieved by adopting the structure of the first embodiment.

[0051] Figure 4A as well as Figure 4B They represent the terms "to" and "to". Figure 2A as well as Figure 2B The graph shown illustrates the directional characteristics of the simulation model when the second power supply element 41 supplies a high-frequency signal of 40 GHz. The horizontal axis represents the tilt angle from the z-axis in degrees, and the vertical axis represents the relative antenna gain with the maximum gain set to 0 dB (DirTotal / Max). Figure 4A as well as Figure 4B The solid and dashed lines in the diagram represent the pointing characteristics on the xz and yz planes, respectively.

[0052] In the simulation model of the embodiment ( Figure 2A In ) such as Figure 4A As shown, the 3dB beamwidths in the x and y directions are approximately 83° and 101°, respectively. In contrast, in the comparative example's simulation model ( Figure 2B In ) such as Figure 4B As shown, the 3dB beamwidths in the x and y directions are approximately 82° and 93°, respectively.

[0053] Figure 5A as well as Figure 5B These represent the directions Figure 2A as well as Figure 2B The diagram shows the directional characteristics of the simulation model when the first power supply element 31, on the positive side of the y-axis, supplies a high-frequency signal of 40 GHz. The horizontal axis represents the tilt angle from the z-axis in degrees, and the vertical axis represents the relative antenna gain with the maximum gain set to 0 dB (DirTotal / Max). Figure 5A as well as Figure 5B The solid and dashed lines in the diagram represent the pointing characteristics on the xz and yz planes, respectively.

[0054] In the simulation model of the embodiment ( Figure 2A In ) such as Figure 5A As shown, the 3dB beamwidths in the x and y directions are approximately 92° and 135°, respectively. In contrast, in the comparative example's simulation model ( Figure 2B In ) such as Figure 5B As shown, the 3dB beamwidths in the x and y directions are approximately 79° and 78°, respectively.

[0055] according to Figures 4A to 5B The simulation results shown in the accompanying drawings confirm that the coverage area is expanded by employing the structure of the antenna device 50 of the first embodiment. The simulations described above illustrate the directional characteristics when one of the two first power supply elements 31 and one second power supply element 41 is powered. However, even when both first power supply elements 31 and one second power supply element 41 are powered simultaneously to operate as an array antenna, the coverage area can still be expanded.

[0056] Next, a variation of the first embodiment will be described.

[0057] In the first embodiment, RFIC51 ( Figure 1B The RFIC51 is housed within the housing 60, but its specific location is not mentioned. The RFIC51 is mounted on the dielectric substrate 10. Figure 1B The back side is sufficient. Here, the back side refers to the side opposite to the side supporting the first antenna element 30 and the second antenna element 40 when viewed from the ground layer 11. RFIC 51 and the power supply lines 12 disposed on the inner layer of the dielectric substrate 10 Figure 1A Connection. A connector is mounted on the back of the dielectric substrate 10, and the connector is connected to the BBIC52 using a coaxial cable.

[0058] Next, refer to Figures 6A to 6C The accompanying drawings illustrate other variations of the antenna device of the first embodiment.

[0059] Figure 6A This is a cross-sectional view of the antenna device 50 of a modified example of the first embodiment. In the first embodiment, a second antenna element 40 is configured. Figure 1A However, in this modified example, two second antenna elements 40 are configured. The two second antenna elements 40 are supported by a shared additional component 20. The two first antenna elements 30 and the two second antenna elements 40 are arranged in a straight line when viewed from above. Alternatively, three or more first antenna elements 30 and second antenna elements 40 may be configured separately.

[0060] Figure 6B This is a cross-sectional view of the antenna device 50, which is a further variation of the first embodiment. In this variation, additional components 70 are further disposed on the additional component 20. A third antenna element 71 is supported on the additional component 70. The third antenna element 71 includes a third power supply element 72 disposed on the upper surface of the additional component 70. Thus, in this variation, the antenna device 50 has a three-level structure. Alternatively, the antenna device 50 may have a stepped structure with four or more levels.

[0061] Figure 6C This is a perspective view of an antenna device 50 according to another variation of the first embodiment. In the first embodiment, two first antenna elements 30 and one second antenna element 40 are arranged in a straight line when viewed from above. In contrast, in this variation, the plurality of first antenna elements 30 and the plurality of second antenna elements 40 are arranged in a two-dimensional shape, such as a matrix. For example, the plurality of second antenna elements 40 form a column, and columns of first antenna elements 30 are arranged on both sides of the column.

[0062] In both variations, with ground plane 11 as the reference, the second power supply element 41 is always positioned higher than the first power supply element 31. Figure 6B In the illustrated variation, the third power supply element 72 is further positioned higher than the second power supply element 41. Therefore, in these variations, as in the first embodiment, broadband can be achieved. The choice of which variation of the antenna device to use depends on the required antenna characteristics and the shape of the inner surface of the housing.

[0063] In the first embodiment, the surface of the housing 60 opposite the antenna device 50 is a cylindrical surface 61. Figure 1B However, the inner surface of the housing 60 can also be a surface other than a cylinder. For example, it can be a curved surface that curves outward, or a stepped surface along these curved surfaces.

[0064] [Second Embodiment]

[0065] Next, refer to Figure 7 The antenna device of the second embodiment will be described below. Hereinafter, the antenna device of the first embodiment (…) Figure 1A Explanation of identical structures is omitted.

[0066] Figure 7 This is a cross-sectional view of the antenna device 50 according to the second embodiment. In the first embodiment ( Figure 1AIn the first embodiment, the additional component 20 and the dielectric substrate 10 are formed of the same dielectric material. In contrast, in the second embodiment, the additional component 20 and the dielectric substrate 10 are formed of materials with different dielectric constants. The dielectric constant of the additional component 20 is lower than that of the dielectric substrate 10. For example, both the additional component 20 and the dielectric substrate 10 are formed of glass epoxy resin, and the glass content of the additional component 20 is lower than that of the dielectric substrate 10.

[0067] Next, the superior effects of the second embodiment will be explained.

[0068] If the dielectric constant of the additional component 20 is low, the wavelength shortening effect is smaller, and the size of the second power supply element 41 increases under the condition of the same resonant frequency. As a result, the antenna gain is improved. Furthermore, if the size of the second power supply element 41 is increased, the Q of the resonator decreases, resulting in a wider operating bandwidth.

[0069] [Third Embodiment]

[0070] Next, refer to Figure 8 The antenna device of the third embodiment will be described below. Hereinafter, the antenna device of the first embodiment (…) Figure 1A Explanation of identical structures is omitted.

[0071] Figure 8 This is a cross-sectional view of the antenna device 50 according to the third embodiment. In the first embodiment, the second antenna element 40 is composed of a second power supply element 41 disposed on the upper surface of the additional member 20. In contrast, in the third embodiment, the second antenna element 40 includes a second power supply element 41 and at least one non-power supply element 43. The second power supply element 41 is disposed on the upper surface of the dielectric substrate 10. The non-power supply element 43 is disposed on the upper surface or inner layer of the additional member 20. The non-power supply element 43 is electromagnetically coupled to the second power supply element 41, and the second power supply element 41, the non-power supply element 43, and the ground layer 11 operate as a stacked patch antenna.

[0072] In the third embodiment, the first power supply element 31 and the second power supply element 41 are arranged at the same position in the height direction with the ground layer 11 as the height reference. However, as in the first embodiment, the top of the second antenna element 40, that is, the upper surface of the non-power supply element 43 arranged on the upper surface of the additional member 20, is arranged at a higher position than the top of the first antenna element 30.

[0073] Next, the superior effects of the third embodiment will be explained. In the third embodiment, no power supply element 43 is loaded on the second power supply element 41, thus enabling broadband operation. Furthermore, the coverage area can be expanded.

[0074] [Fourth Embodiment]

[0075] Next, refer to Figure 9 The antenna device of the fourth embodiment will be described below. Hereinafter, the antenna device compared to the first embodiment (…) Figure 1A Explanation of identical structures is omitted.

[0076] Figure 9 This is a cross-sectional view of the antenna device 50 according to the fourth embodiment. In top view, a stepped aberration surface 20S, formed by the side surface of the additional member 20, is disposed between the first antenna element 30 and the second antenna element 40. Using the stepped aberration surface 20S as a boundary, the area where the second antenna element 40 is disposed is higher than the area where the first antenna element 30 is disposed. A reflective member 23 made of metal, such as copper, is mounted on the stepped aberration surface 20S.

[0077] Next, the superior effects of the fourth embodiment will be explained.

[0078] A portion of the electromagnetic waves radiated from the first power supply element 31 is reflected by the reflecting member 23. As a result, the coverage area can be amplified in the direction in which the reflecting member 23 is oriented.

[0079] Next, a variation of the fourth embodiment will be described.

[0080] In the fourth embodiment, the reflector 23 is made of metal, but it may also be made of other materials that reflect the radio waves in the operating frequency band of the antenna device 50.

[0081] [Fifth Embodiment]

[0082] Next, refer to Figure 10A The antenna device of the fifth embodiment will be described below. Hereinafter, the antenna device of the first embodiment (…) Figure 1A Explanation of identical structures is omitted.

[0083] Figure 10A This is a cross-sectional view of the antenna device 50 according to the fifth embodiment. In the first embodiment ( Figure 1A In the first embodiment, the additional component 20 is disposed at the center of the upper surface of the dielectric substrate 10. In contrast, in the fifth embodiment, two additional components 20 are disposed near both ends of the upper surface of the dielectric substrate 10. A first power supply element 31 constituting the first antenna element 30 is disposed in the region between the two additional components 20 on the upper surface of the dielectric substrate 10. Second power supply elements 41 constituting the second antenna element 40 are disposed on each of the two additional components 20.

[0084] Next, the superior effects of the fifth embodiment will be explained.

[0085] Similar to the first embodiment, in the antenna device of the fifth embodiment, when the ground layer 11 is used as a height reference, the second power supply element 41 is positioned higher than the upper surface of the dielectric substrate 10. Therefore, compared to the case where all power supply elements are positioned on the upper surface of the dielectric substrate 10, the operating bandwidth can be expanded. Furthermore, when a protrusion is formed on the inner surface of the housing, by arranging the antenna device with the first power supply element 31 facing the protrusion, the second power supply element 41 can be brought closer to the area surrounding the protrusion on the inner surface of the housing. This allows for efficient utilization of the space within the housing. Moreover, in the fifth embodiment, walls made of dielectric material exist on both sides of the central first power supply element 31. Due to the influence of these walls, a sharper directivity can be achieved.

[0086] Next, refer to Figure 10B , Figure 10C ,as well as Figure 10D The antenna device of the fifth embodiment will be described. In the first embodiment ( Figure 1A ), and variations of the first embodiment ( Figure 6A , Figure 6B Fifth embodiment () Figure 10A In the first embodiment, the height distribution of the multiple power supply elements is symmetrical about the central direction of the arrangement of the power supply elements. In contrast, in the modified fifth embodiment described below, the height distribution of the multiple power supply elements is asymmetrical. Figure 10B , Figure 10C ,as well as Figure 10D These are cross-sectional views of the antenna device of the fifth embodiment, which are variations thereof.

[0087] exist Figure 10B In the illustrated variation, a first-layer additional member 20 is disposed in a region of the upper surface of the dielectric substrate 10, and a second-layer additional member 70 is disposed in a region of the upper surface of the additional member 20. The additional members 20 and 70 are configured to be biased towards one side of the upper surface of the dielectric substrate 10 (in...). Figure 10B (The middle is the right side). A three-tiered stepped upper surface (equivalent to the treads of a staircase) is formed by the dielectric substrate 10 and two additional components 20 and 70.

[0088] A first power supply element 31 constituting the first antenna element 30, a second power supply element 41 constituting the second antenna element 40, and a third power supply element 72 constituting the third antenna element 71 are respectively disposed on three upper surfaces at different heights. Viewed from above, the first power supply element 31, the second power supply element 41, and the third power supply element 72 are arranged in a row. In this modified example, due to the influence of the dielectric material wall present on one side of the first power supply element 31 and the second power supply element 41, the direction of the main beam can be tilted relative to the normal direction of the upper surface of the dielectric substrate 10.

[0089] exist Figure 10C In the illustrated variation, when viewed from above, a plurality of first power supply elements 31 and a second power supply element 41 are arranged in a row, with the second power supply element 41 positioned at the end of the row. That is, using the ground layer 11 as a height reference, the second power supply element 41 at the end of the row of power supply elements is positioned higher than the other first power supply elements 31. In this variation, due to the influence of the dielectric material wall present on one side of the central first power supply element 31, the direction of the main beam of the central first power supply element 31 is tilted relative to the upper surface of the dielectric substrate 10. The directions of the main beams of the other first power supply element 31 and second power supply element 41 are approximately perpendicular to the upper surface of the dielectric substrate 10. Therefore, an effect of increased directivity of the antenna device 50 can be achieved.

[0090] exist Figure 10D In the modified example shown, when viewed from above, a plurality of second power supply elements 41 and a first power supply element 31 are arranged in a row, with the first power supply element 31 positioned at the end of the row. That is, using the ground layer 11 as a height reference, the first power supply element 31 at the end of the plurality of power supply elements arranged in a row is positioned lower than the other second power supply elements 41. In this modified example, with... Figure 10C The modified example shown is the same, and the effect of increasing the directivity of the antenna device 50 can be obtained.

[0091] exist Figure 1B In the first embodiment shown, the inner surface of the side portion of the housing 60 is curved outwards, and the shape of the inner surface is approximately symmetrical in the thickness direction of the internal space of the housing 60. Conversely, in the case where the curvature is asymmetrical about the thickness direction of the internal space, depending on the shape of the inner surface of the housing, such as... Figure 10B , Figure 10C as well as Figure 10D As shown in the modified examples, an antenna device with an asymmetrical height distribution of multiple power supply components can be used. The choice of which modified antenna device to use depends on the shape of the inner surface of the housing. Similar to the fifth embodiment, these modified antenna devices can expand the operating bandwidth.

[0092] [Sixth Embodiment]

[0093] Next, refer to Figures 11-14 The accompanying drawings illustrate the antenna device of the sixth embodiment and its modifications. Hereinafter, the antenna device of the first embodiment (…) Figure 1A Explanation of identical structures is omitted. Figure 11 This is a perspective view of the antenna device 50 according to the sixth embodiment. Figure 12 , Figure 13 as well as Figure 14These are perspective views of the antenna device 50, a variation of the sixth embodiment. In the sixth embodiment and its variations, multiple power supply elements are arranged in a two-dimensional manner.

[0094] In the antenna device 50 of the sixth embodiment ( Figure 11 In this embodiment, an additional member 20 is disposed in the inner portion of the upper surface of the dielectric substrate 10, away from the edge. A plurality of (e.g., three) second power supply elements 41 are disposed on the upper surface of the additional member 20. In the region inside the edge of the dielectric substrate 10 and outside the edge of the additional member 20, a plurality of (e.g., twelve) first power supply elements 31 are arranged to surround the additional member 20 when viewed from above. That is, when viewed from above, the power supply elements in the inner portion are disposed at a higher position compared to the power supply elements in the peripheral region of the upper surface of the dielectric substrate 10.

[0095] exist Figure 12 In the modified antenna device 50 shown, an annular additional member 20 is arranged along the edge of the upper surface of the dielectric substrate 10. The additional member 20 is not arranged inside the upper surface of the dielectric substrate 10. A plurality of second power supply elements 41 are arranged on the upper surface of the additional member 20. A plurality of first power supply elements 31 are arranged in the area surrounded by the annular additional member 20 on the upper surface of the dielectric substrate 10. That is, when viewed from above, the power supply elements in the peripheral area are arranged at a higher position than the power supply elements inside the upper surface of the dielectric substrate 10.

[0096] exist Figure 13 In the modified antenna device 50 shown, a first-layer additional member 20 is disposed on a portion of the upper surface of the rectangular dielectric substrate 10 when viewed from above; a second-layer additional member 70 is disposed on a portion of the upper surface of the additional member 20; and a third-layer additional member 80 is disposed on a portion of the upper surface of the additional member 70. When viewed from above, the edges of each of the additional members 20, 70, and 80 are approximately aligned with one edge of the dielectric substrate 10, forming a stepped upper surface that descends from that edge toward the opposite edge.

[0097] Multiple first power supply elements 31, multiple second power supply elements 41, multiple third power supply elements 72, and multiple fourth power supply elements 82 are respectively disposed on the upper surfaces of the dielectric substrate 10, the additional component 20 of the first layer, the additional component 70 of the second layer, and the additional component 80 of the third layer. The first power supply elements 31, 41, 72, and 82 respectively constitute the first antenna element 30, the second antenna element 40, the third antenna element 71, and the fourth antenna element 81. When the ground layer 11 is used as a height reference, the height of the power supply elements increases in a direction parallel to one edge of the dielectric substrate 10 when viewed from above.

[0098] exist Figure 14 In the modified antenna device 50 shown, the rectangular dielectric substrate 10, the first-layer additional member 20, and the second-layer additional member 70 have roughly the same vertex when viewed from above. Multiple first power supply elements 31 are disposed in an L-shaped area (equivalent to the tread of a step) on the upper surface of the dielectric substrate 10 where the first-layer additional member 20 is not located. Multiple second power supply elements 41 are disposed in an L-shaped area on the upper surface of the additional member 20 where the second-layer additional member 70 is not located. A third power supply element 72 is disposed on the upper surface of the second-layer additional member 70. With the ground layer 11 as a height reference, the height of the power supply elements increases towards one vertex of the dielectric substrate 10 when viewed from above.

[0099] Next, the superior effects of the sixth embodiment and its modifications will be explained.

[0100] As described above, in the sixth embodiment and its variations, multiple power supply elements at different heights from the ground layer 11 are arranged in a two-dimensional configuration. By adjusting the shape of the regions at different heights according to the concave-convex shape of the inner surface of the housing, various housings can be flexibly accommodated. Furthermore, it is also possible to obtain an effect such as a change in the directivity of the antenna device 50 by arranging the multiple power supply elements at different heights in a two-dimensional configuration.

[0101] exist Figure 11 as well as Figure 12 In the sixth embodiment and its variations shown, the multiple power supply elements 31 and 41 are arranged in a matrix of three rows and five columns when viewed from above. However, they can also be arranged in a matrix with other numbers of rows and columns. For example, they can also be arranged in a matrix of three rows and three columns, three rows and four columns, etc. Figure 13 In the variation shown, when the direction of the slope of the stepped upper surface is set as the row direction, the multiple power supply elements 31, 41, 72, and 82 are arranged in a three-row, five-column matrix. However, they can also be arranged in matrices with other numbers of rows and columns. For example, they can also be arranged in a three-row, three-column, or three-row, four-column matrix. Figure 14 In the variation shown, the multiple power supply elements 31, 41, and 72 are arranged in a three-row, three-column matrix when viewed from above, but they can also be arranged in a matrix with other numbers of rows and columns. For example, they can also be arranged in a two-row, three-column, or two-row, four-column matrix.

[0102] The above embodiments are illustrative examples, and of course, parts of the structures shown in different embodiments can be replaced or combined. The same effects resulting from the same structures in multiple embodiments are not mentioned sequentially for each embodiment. Furthermore, the present invention is not limited to the above embodiments. For example, those skilled in the art will recognize that various changes, improvements, combinations, etc., can be made.

[0103] Explanation of reference numerals in the attached figures

[0104] 10…Dielectric substrate, 11…Ground layer, 12…Power supply line, 20…Additional component, 20S…Stepped differential surface, 21…Power supply line, 22…Solder, 23…Reflector component, 30…First antenna element, 31…First power supply conductor, 32x, 32y…Power supply points, 40…Second antenna element, 41…Second power supply element, 42x, 42y…Power supply points, 43…No power supply element, 50…Antenna assembly, 51…High-frequency integrated circuit element (RFIC), 52…Baseband integrated circuit element (BBIC), 60…Housing, 61…Cylinder, 70…Additional component, 71…Third antenna element, 72…Third power supply element, 80…Additional component, 81…Fourth antenna element, 82…Fourth power supply element.

Claims

1. An antenna device, wherein, have: Dielectric substrate; A grounding layer is disposed in the inner layer of the aforementioned dielectric substrate; A power supply line is disposed on the aforementioned dielectric substrate; as well as The first antenna element and the second antenna element are supported on the aforementioned dielectric substrate. The aforementioned first antenna element and the aforementioned second antenna element each include a first power supply element and a second power supply element connected to the aforementioned power supply line, and are arranged on the same side when viewed from the aforementioned ground plane. Using the aforementioned ground plane as a height reference, the top of the aforementioned second antenna element is arranged at a position higher than the top of the aforementioned first antenna element. The first power supply element and the ground plane together form a patch antenna, and the second power supply element and the ground plane together form a patch antenna. The first antenna element and the second antenna element constitute an array antenna. The aforementioned dielectric substrate has a flat upper surface, and an additional component with a dielectric constant lower than that of the dielectric substrate is disposed on the upper surface of the dielectric substrate. At least a portion of the aforementioned second antenna element is supported on the aforementioned dielectric substrate via the aforementioned additional component. When viewed from above, the aforementioned additional component is smaller than the aforementioned dielectric substrate.

2. The antenna device according to claim 1, wherein, The second power supply element is positioned higher than the first power supply element.

3. The antenna device according to claim 1, wherein, The aforementioned second antenna element includes a non-powered element disposed at a position higher than the aforementioned first power supply element, and the non-powered element is electromagnetically coupled to the aforementioned second power supply element.

4. The antenna device according to claim 2, wherein, The aforementioned second antenna element includes a non-powered element disposed at a position higher than the aforementioned first power supply element, and the non-powered element is electromagnetically coupled to the aforementioned second power supply element.

5. The antenna device according to any one of claims 1 to 4, wherein, When viewed from above, a stepped differential surface is provided between the first antenna element and the second antenna element. Regarding this stepped differential surface, the area on which the second antenna element is disposed is higher than the area on which the first antenna element is disposed. A reflective component for reflecting radio waves is installed on the stepped differential surface.

6. A communication device, wherein, have: The antenna device according to any one of claims 1 to 5; Housing, housing the aforementioned antenna device; and A high-frequency integrated circuit element is housed in the aforementioned housing and supplies high-frequency signals to the first power supply element and the second power supply element via the aforementioned power supply lines. The first antenna element and the second antenna element are positioned opposite the inner surface of the housing.

7. The communication device according to claim 6, wherein, In a direction perpendicular to the grounding layer, the distance from the intersection of the grounding layer and the second antenna element to the inner surface of the housing is longer than the distance from the intersection of the grounding layer and the first antenna element to the inner surface of the housing.

8. The communication device according to claim 7, wherein, A portion of the inner surface of the aforementioned shell is formed by a cylindrical surface that is bent to become convex towards the outer side of the aforementioned shell. The first antenna element and the second antenna element are positioned opposite the cylindrical surface of the housing.

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