Micro-optical device preparation method and device based on mold pressing

Abstract

The present invention discloses a method and device for preparing a micro-optical device based on mold pressing, comprising: determining a microstructure mold for preparing a micro-optical device, wherein the surface of the microstructure mold has at least one protruding mold structure; based on a preset pressure, controlling the device preparation equipment to press the microstructure mold in a direction perpendicular to a material table onto the surface to be pressed of a compressible optical material placed on the material table, thereby obtaining a target micro-optical device having at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure changes with the degree of pressing of the compressible optical material by the microstructure mold, and the protruding mold structure is embedded one by one with the concave optical structure formed by the pressing. It can be seen that the implementation of the present invention can prepare micro-optical devices using microstructure molds, thereby reducing the preparation cost of micro-optical devices, and determining the optical refractive index as a design variable of the micro-optical device, thereby improving the design freedom of the micro-optical device.

Description

Technical Field

[0001] The present invention relates to the technical field of optical devices, and in particular to a method and device for preparing a micro-optical device based on mold pressing. Background Art

[0002] In industrial production, micro-optical devices achieve the regulation of light properties such as polarization, phase, and amplitude by processing specific micro-sized structures on the surface of optical materials, such as the sub-wavelength size structure on the surface of sub-wavelength micro-optical devices (swMOD, Sub-wavelength Micro Optical Device).

[0003] Existing micro-optical devices can usually be prepared in the following two ways: one is to use lasers or ion beams to remove part of the material on a uniform substrate of a certain thickness by direct writing or photolithography so that the remaining material forms the required micro-sized structure; the other is to add the required micro-sized structure on a thin uniform substrate by 3D printing or embossing. However, practice has found that the processing equipment and processing technology of the existing micro-optical device preparation method are relatively complex, resulting in a high preparation cost of the micro-optical device, and the existing micro-optical device controls the transmission phase through the size of the surface microstructure, resulting in a low degree of design freedom of the micro-optical device.

[0004] It can be seen that how to reduce the preparation cost of micro-optical devices and improve the design freedom of micro-optical devices is particularly important. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a method and device for preparing a micro-optical device based on mold pressing, which can reduce the preparation cost of the micro-optical device and improve the design freedom of the micro-optical device.

[0006] In order to solve the above technical problems, the first aspect of the present invention discloses a method for preparing a micro-optical device based on mold pressing, the method comprising:

[0007] Determining a microstructure mold for preparing a micro-optical device, wherein the surface of the microstructure mold has at least one protruding mold structure, and each of the protruding mold structures is a micro-sized structure;

[0008] Based on a preset pressure, a device preparation equipment for preparing the micro-optical device is controlled to press the microstructure mold onto the surface to be pressed of the compressible optical material placed on the material table in a direction perpendicular to the material table, so as to obtain a target micro-optical device having at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device changes with the degree of pressing of the compressible optical material by the microstructure mold, and the convex mold structure is embedded one by one with the concave optical structure pressed thereby.

[0009] As an optional embodiment, in the first aspect of the present invention, the compressible optical material includes a porous silicon-based compound.

[0010] As an optional embodiment, in the first aspect of the present invention, the protruding mold structure is a first type of protruding mold structure or a second type of protruding mold structure;

[0011] Wherein, the first type of protruding mold structure includes a first main pressing surface and a side surface perpendicular to the first main pressing surface; the second type of protruding mold structure includes a second main pressing surface and a side surface not perpendicular to the second main pressing surface, and the angle between the side surface not perpendicular to the second main pressing surface and the second main pressing surface is greater than 90 degrees and less than 180 degrees;

[0012] For the second type of protruding mold structure, the side surface that is not perpendicular to the second main pressing surface has a pressing effect on the compressible optical material, and the optical refractive index obtained by pressing the compressible optical material by the side surface that is not perpendicular to the second main pressing surface is different from the optical refractive index obtained by pressing the compressible optical material by the second main pressing surface.

[0013] As an optional embodiment, in the first aspect of the present invention, the method further comprises:

[0014] Controlling the device preparation equipment to fill each of the recessed optical structures with a predetermined optical filling material to obtain a first type of pure planar micro-optical device, wherein the material volume of the optical filling material filled in each of the recessed optical structures is equal to the recessed volume of the recessed optical structure; or

[0015] The device preparation equipment is controlled to grind the protruding portion of the target micro-optical device compared to the concave optical structure until the pressed surface of the target micro-optical device is flat, thereby obtaining a second type of pure planar micro-optical device.

[0016] As an optional embodiment, in the first aspect of the present invention, before determining the microstructure mold for preparing the micro-optical device, the method further includes:

[0017] Determining a target combination of preparation parameters corresponding to the preparation of the micro-optical device;

[0018] Wherein, the step of determining a target preparation parameter combination corresponding to the preparation of the micro-optical device includes:

[0019] Determining a current combination of preparation parameters corresponding to the preparation of the micro-optical device;

[0020] Based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, calculate current wavefront phase modulation information corresponding to the current preparation parameter combination;

[0021] Based on the target wavefront phase modulation information at the predetermined wavelength determined in advance, verifying the current wavefront phase modulation information to obtain a verification result;

[0022] When the verification result indicates that the current wavefront phase modulation information is verified to be passed, determining the current preparation parameter combination as a target preparation parameter combination corresponding to the preparation of the micro-optical device;

[0023] When the verification result indicates that the verification of the current wavefront phase modulation information fails, the current preparation parameter combination corresponding to the preparation of the micro-optical device is adjusted, and the operation of calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the target wavefront phase modulation information at a predetermined wavelength determined in advance is re-executed, and the current wavefront phase modulation information is verified to obtain the verification result.

[0024] As an optional implementation manner, in the first aspect of the present invention, the current wavefront phase modulation information is verified based on the target wavefront phase modulation information at the predetermined wavelength to obtain a verification result, including:

[0025] Calculating the difference between the target wavefront phase modulation information at a predetermined wavelength and the current wavefront phase modulation information;

[0026] Determine whether the difference is less than or equal to a preset threshold. If so, determine to verify the current wavefront phase modulation information, and the verification result obtained indicates that the current wavefront phase modulation information is verified. If not, determine to verify the current wavefront phase modulation information, and the verification result obtained indicates that the current wavefront phase modulation information is not verified.

[0027] As an optional implementation, in the first aspect of the present invention, before calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the predetermined wavefront phase calculation algorithm, the method further includes:

[0028] Obtaining an optical refractive index-compression degree correspondence relationship determined based on a plurality of pre-sampled microstructure parameter combinations, wherein the optical refractive index-compression degree correspondence relationship is used to represent a correspondence relationship between an optical refractive index and a compression distance, and the optical refractive index-compression degree correspondence relationship includes an optical refractive index-compression degree relationship curve and / or an optical refractive index-compression degree lookup table;

[0029] The calculating, based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, current wavefront phase modulation information corresponding to the current preparation parameter combination includes:

[0030] Determining the current optical refractive index corresponding to the current preparation parameter combination according to the optical refractive index-compression degree correspondence relationship;

[0031] Based on the current preparation parameter combination, the current optical refractive index and a predetermined wavefront phase calculation algorithm, current wavefront phase modulation information corresponding to the current preparation parameter combination is calculated.

[0032] As an optional embodiment, in the first aspect of the present invention, the method further comprises:

[0033] Detecting whether the target micro-optical device meets the device quality condition, and when the detection result is no, adjusting the pressing control parameters of the device manufacturing equipment and / or the microstructure mold;

[0034] Wherein, the detecting whether the target micro-optical device meets the device quality condition comprises:

[0035] Based on the pressure sensor corresponding to the device preparation equipment, collecting force parameters corresponding to one or more pressed parts of the compressible optical material during the process of the device preparation equipment pressing the microstructure mold onto the compressible optical material, wherein the force parameters include the force magnitude corresponding to each of the pressed parts and / or the force direction corresponding to each of the pressed parts;

[0036] Determining whether the force parameters meet the preset force conditions;

[0037] When it is determined that the force parameter does not satisfy the preset force condition, determining that the target micro-optical device does not satisfy the device quality condition;

[0038] When it is determined that the force parameters meet the preset force conditions, collecting optical quality parameters corresponding to all the recessed optical structures based on the optical sensor corresponding to the device manufacturing equipment;

[0039] Determining whether the optical quality parameter meets a preset optical quality condition;

[0040] When it is determined that the optical quality parameter does not satisfy the preset optical quality condition, it is determined that the target micro-optical device does not satisfy the device quality condition.

[0041] The second aspect of the present invention discloses a micro-optical device manufacturing device based on mold pressing, the device comprising:

[0042] A determination module, used to determine a microstructure mold for preparing a micro-optical device, wherein the surface of the microstructure mold has at least one protruding mold structure, and each of the protruding mold structures is a micro-sized structure;

[0043] The device control module is used to control the device preparation device for preparing the micro-optical device to press the microstructure mold on the surface to be pressed of the compressible optical material placed on the material table in a direction perpendicular to the material table based on a preset pressure, so as to obtain a target micro-optical device with at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device changes with the degree of pressing of the compressible optical material by the microstructure mold, and the convex mold structure is embedded one by one with the concave optical structure pressed thereby.

[0044] As an optional embodiment, in the second aspect of the present invention, the compressible optical material includes a porous silicon-based compound.

[0045] As an optional embodiment, in the second aspect of the present invention, the protruding mold structure is a first type of protruding mold structure or a second type of protruding mold structure;

[0046] Wherein, the first type of protruding mold structure includes a first main pressing surface and a side surface perpendicular to the first main pressing surface; the second type of protruding mold structure includes a second main pressing surface and a side surface not perpendicular to the second main pressing surface, and the angle between the side surface not perpendicular to the second main pressing surface and the second main pressing surface is greater than 90 degrees and less than 180 degrees;

[0047] For the second type of protruding mold structure, the side surface that is not perpendicular to the second main pressing surface has a pressing effect on the compressible optical material, and the optical refractive index obtained by pressing the compressible optical material by the side surface that is not perpendicular to the second main pressing surface is different from the optical refractive index obtained by pressing the compressible optical material by the second main pressing surface.

[0048] As an optional embodiment, in the second aspect of the present invention, the equipment control module is also used to control the device preparation equipment to fill the predetermined optical filling material into each of the recessed optical structures to obtain a first type of pure planar micro-optical device, wherein the material volume of the optical filling material filled in each of the recessed optical structures is equal to the recessed volume of the recessed optical structure; or, control the device preparation equipment to grind the protruding portion of the target micro-optical device compared to the recessed optical structure until the pressed surface of the target micro-optical device is flat, to obtain a second type of pure planar micro-optical device.

[0049] As an optional implementation, in the second aspect of the present invention, the determination module is further used to determine a target preparation parameter combination corresponding to the preparation of the micro-optical device before determining the microstructure mold for preparing the micro-optical device;

[0050] The specific manner in which the determination module determines the target preparation parameter combination corresponding to the preparation of the micro-optical device includes:

[0051] Determining a current combination of preparation parameters corresponding to the preparation of the micro-optical device;

[0052] Based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, calculate current wavefront phase modulation information corresponding to the current preparation parameter combination;

[0053] Based on the target wavefront phase modulation information at the predetermined wavelength determined in advance, verifying the current wavefront phase modulation information to obtain a verification result;

[0054] When the verification result indicates that the current wavefront phase modulation information is verified to be passed, determining the current preparation parameter combination as a target preparation parameter combination corresponding to the preparation of the micro-optical device;

[0055] When the verification result indicates that the verification of the current wavefront phase modulation information fails, the current preparation parameter combination corresponding to the preparation of the micro-optical device is adjusted, and the operation of calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the target wavefront phase modulation information at a predetermined wavelength determined in advance is re-executed, and the current wavefront phase modulation information is verified to obtain the verification result.

[0056] As an optional implementation, in the second aspect of the present invention, the determination module verifies the current wavefront phase modulation information based on the target wavefront phase modulation information at the predetermined wavelength determined in advance, and the specific manner of obtaining the verification result includes:

[0057] Calculating the difference between the target wavefront phase modulation information at a predetermined wavelength and the current wavefront phase modulation information;

[0058] Determine whether the difference is less than or equal to a preset threshold. If so, determine to verify the current wavefront phase modulation information, and the verification result obtained indicates that the current wavefront phase modulation information is verified. If not, determine to verify the current wavefront phase modulation information, and the verification result obtained indicates that the current wavefront phase modulation information is not verified.

[0059] As an optional embodiment, in the second aspect of the present invention, the determination module is further used to obtain an optical refractive index-suppression degree correspondence relationship determined based on a plurality of pre-sampled microstructure parameter combinations before calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a pre-determined wavefront phase calculation algorithm, wherein the optical refractive index-suppression degree correspondence relationship is used to represent the correspondence relationship between the optical refractive index and the compression distance, and the optical refractive index-suppression degree correspondence relationship includes an optical refractive index-suppression degree relationship curve and / or an optical refractive index-suppression degree lookup table;

[0060] The specific manner in which the determination module calculates the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm includes:

[0061] Determining the current optical refractive index corresponding to the current preparation parameter combination according to the optical refractive index-compression degree correspondence relationship;

[0062] Based on the current preparation parameter combination, the current optical refractive index and a predetermined wavefront phase calculation algorithm, current wavefront phase modulation information corresponding to the current preparation parameter combination is calculated.

[0063] As an optional implementation, in the second aspect of the present invention, the device further includes:

[0064] A detection module, used to detect whether the target micro-optical device meets the device quality condition;

[0065] An adjustment module, configured to adjust a pressing control parameter of the device manufacturing equipment and / or the microstructure mold when the detection module detects that the target micro-optical device does not meet the device quality condition;

[0066] The specific manner in which the detection module detects whether the target micro-optical device meets the device quality condition includes:

[0067] Based on the pressure sensor corresponding to the device preparation equipment, collecting force parameters corresponding to one or more pressed parts of the compressible optical material during the process of the device preparation equipment pressing the microstructure mold onto the compressible optical material, wherein the force parameters include the force magnitude corresponding to each of the pressed parts and / or the force direction corresponding to each of the pressed parts;

[0068] Determining whether the force parameters meet the preset force conditions;

[0069] When it is determined that the force parameter does not satisfy the preset force condition, determining that the target micro-optical device does not satisfy the device quality condition;

[0070] When it is determined that the force parameters meet the preset force conditions, collecting optical quality parameters corresponding to all the recessed optical structures based on the optical sensor corresponding to the device manufacturing equipment;

[0071] Determining whether the optical quality parameter meets a preset optical quality condition;

[0072] When it is determined that the optical quality parameter does not satisfy the preset optical quality condition, it is determined that the target micro-optical device does not satisfy the device quality condition.

[0073] The third aspect of the present invention discloses another device for preparing a micro-optical device based on mold pressing, the device comprising:

[0074] A memory storing executable program code;

[0075] a processor coupled to the memory;

[0076] The processor calls the executable program code stored in the memory to execute the method for preparing a micro-optical device based on mold pressing disclosed in the first aspect of the present invention.

[0077] The fourth aspect of the present invention discloses a computer storage medium, wherein the computer storage medium stores computer instructions, and when the computer instructions are called, they are used to execute the method for preparing a micro-optical device based on mold pressing disclosed in the first aspect of the present invention.

[0078] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0079] In an embodiment of the present invention, a microstructure mold for preparing a micro-optical device is determined, wherein the surface of the microstructure mold has at least one protruding mold structure, and each protruding mold structure is a micro-sized structure; based on a preset pressure, a device preparation equipment for preparing the micro-optical device is controlled to press the microstructure mold on the surface to be pressed of a compressible optical material placed on the material table in a direction perpendicular to a material discharge table, so as to obtain a target micro-optical device having at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device changes with the degree of compression of the compressible optical material by the microstructure mold, and the protruding mold structure is embedded one by one with the concave optical structure formed by the compression thereof. It can be seen that the implementation of the present invention can press the microstructure mold onto a compressible optical material whose optical refractive index changes with the degree of pressing, thereby obtaining a micro-optical device with multiple recessed optical structures on the surface, which reduces the complexity and difficulty of preparing the micro-optical device and is conducive to batch replication of the micro-optical device through the microstructure mold, thereby reducing the preparation cost of the micro-optical device. In addition, the refractive index of the optical material and the size of the micro-optical device can be determined as design variables of the micro-optical device, thereby improving the design freedom of the micro-optical device. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0081] Figure 1 It is a schematic flow chart of a method for preparing a micro-optical device based on mold pressing disclosed in an embodiment of the present invention;

[0082] Figure 2 It is a schematic flow chart of another method for preparing a micro-optical device based on mold pressing disclosed in an embodiment of the present invention;

[0083] Figure 3 It is a schematic flow chart of another method for preparing a micro-optical device based on mold pressing disclosed in an embodiment of the present invention;

[0084] Figure 4 It is a device preparation equipment disclosed in an embodiment of the present invention;

[0085] Figure 5 is a target preparation parameter combination disclosed in an embodiment of the present invention;

[0086] Figure 6 It is a structural schematic diagram of a micro-optical device preparation device based on mold pressing disclosed in an embodiment of the present invention;

[0087] Figure 7 It is a schematic structural diagram of another micro-optical device preparation device based on mold pressing disclosed in an embodiment of the present invention;

[0088] Figure 8 It is a schematic structural diagram of another device for preparing a micro-optical device based on mold pressing disclosed in an embodiment of the present invention. DETAILED DESCRIPTION

[0089] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0090] The terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish different objects rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, device, product or end including a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units inherent to these processes, methods, products or ends.

[0091] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0092] The present invention discloses a method and device for preparing a micro-optical device based on mold pressing, which can press a microstructure mold onto a compressible optical material whose optical refractive index changes with the degree of pressing, thereby obtaining a micro-optical device having a plurality of concave optical structures on the surface, thereby reducing the complexity and difficulty of preparing the micro-optical device, and facilitating batch replication of the micro-optical device through the microstructure mold, thereby reducing the preparation cost of the micro-optical device, and furthermore, can determine the refractive index of the optical material and the size of the micro-optical device as design variables of the micro-optical device, thereby improving the design freedom of the micro-optical device. The following are detailed descriptions respectively.

[0093] Embodiment 1

[0094] See also Figure 1 , Figure 1 1 is a schematic flow chart of a method for preparing a micro-optical device based on mold pressing disclosed in an embodiment of the present invention. Figure 1 The described method for preparing a micro-optical device based on mold pressing can be applied to any micro-optical device preparation process, such as a micro-optical device based on sub-wavelength characteristics, and the present invention is not limited thereto. Figure 1 As shown, the method for preparing a micro-optical device based on mold pressing may include the following operations:

[0095] 101. Determine the microstructure mold used to prepare micro-optical devices.

[0096] In an embodiment of the present invention, the microstructure mold surface has at least one protruding mold structure, and each protruding mold structure is a micro-size structure, such as a micro-nano structure with a structural size less than 100 nm. Optionally, the micro-size structure can be a sub-wavelength size structure, that is, a structure with a structural size smaller than the working wavelength of the micro-optical device. Further optionally, when the microstructure mold surface has at least two protruding mold structures, the structures of each two protruding mold structures can be the same or different, which is not limited by the embodiment of the present invention.

[0097] 102. Based on a preset pressure, control a device preparation apparatus for preparing a micro-optical device to press a microstructure mold onto a surface to be pressed of a compressible optical material placed on the material table in a direction perpendicular to the material table, so as to obtain a target micro-optical device having at least one concave optical structure on the surface.

[0098] In the embodiment of the present invention, the optical refractive index corresponding to the concave optical structure on the target micro-optical device can change with the degree of compression of the compressible optical material by the microstructure mold, and the protruding mold structure is embedded in the concave optical structure formed by the microstructure mold. When the protruding mold structure is a sub-wavelength size structure, the target micro-optical device is a micro-optical device based on sub-wavelength characteristics.

[0099] In the embodiment of the present invention, preferably, the direction perpendicular to the unloading table can be a vertical direction, that is, the compressible optical material can be placed horizontally on the unloading table. This can reduce the self-gravity of the protruding mold structure and / or the device preparation equipment, which may cause the deviation of the pressing direction during the pressing process and the occurrence of unbalanced force on the pressed part of the surface of the compressible optical material.

[0100] In an embodiment of the present invention, optionally, the compressible optical material may include porous silicon-based compounds, such as porous silicon nitride, porous silicon dioxide, etc., which can improve the strength, toughness, heat resistance, corrosion resistance, oxidation resistance, light transmittance and thermal shock resistance of the micro-optical device, improve the compressibility of the compressible optical material, and reduce the dielectric loss of the micro-optical device.

[0101] In the embodiment of the present invention, optionally, Figure 3 As shown in (a), the bottom of the compressible optical material for pressing opposite to the surface to be pressed may be embedded with a base layer, wherein the material corresponding to the base layer may include a substrate material or a coating material. Further, optionally, the optical refractive index n of the compressible material 1 The optical refractive index n of the material corresponding to the base layer 2 They can be equal or unequal.

[0102] In the embodiment of the present invention, optionally, Figure 3 As shown in (b), the protruding mold structure can be a first type of protruding mold structure or a second type of protruding mold structure; wherein the first type of protruding mold structure includes a first main pressing surface and a side perpendicular to the first main pressing surface; the second type of protruding mold structure includes a second main pressing surface and a side not perpendicular to the second main pressing surface, and the angle between the side not perpendicular to the second main pressing surface and the second main pressing surface is greater than 90 degrees and less than 180 degrees; for the second type of protruding mold structure, the side not perpendicular to the second main pressing surface has a pressing effect on the compressible optical material, and the optical refractive index obtained by pressing the compressible optical material by the side not perpendicular to the second main pressing surface is different from the optical refractive index obtained by pressing the compressible optical material by the second main pressing surface. It should be noted that the "first protruding mold structure" and the "second protruding mold structure" are only used to distinguish between two different protruding mold structures. It can be seen that in this way, different types of protruding mold structures can be used to press the compressible optical material according to actual needs, thereby improving the diversity and flexibility of the optical refractive index of the internal structure of the micro-optical device, and further improving the design freedom of the micro-optical device.

[0103] In the embodiment of the present invention, further optionally, when the device manufacturing equipment presses the microstructure mold onto the compressible optical material, the main pressing surface of the protruding mold structure is parallel to the surface to be pressed of the compressible optical material, wherein the main pressing surface includes the first main pressing surface or the second main pressing surface. Figure 3 As shown in (c), for the first type of protruding mold structure, the side surface perpendicular to the first main pressing surface does not produce a pressing effect on the compressible optical material, and the optical refractive index obtained by pressing the compressible optical material on the first main pressing surface is a fixed refractive index n 3 and is different from the refractive index n of the uncompressed portion of the compressible optical material 1 , thereby forming a target micro-optical device with a step-wise change in optical refractive index; for the second type of protruding mold structure, the optical refractive index obtained by pressing the compressible optical material on the second main pressing surface is a fixed refractive index n 3 and is different from the refractive index n of the uncompressed portion of the compressible optical material 1The optical refractive index obtained by pressing the compressible optical material on the side surface that is not perpendicular to the second main pressing surface is a gradient refractive index n 4 , and, for the concave structure obtained by pressing the side surface that is not perpendicular to the second main pressing surface in the concave optical structure, the refractive index n of the end thereof connected to the concave portion obtained by pressing the compressible optical material by the second main pressing surface 4 With n 3 The refractive index n of the end of the compressible optical material that is connected to the uncompressed non-concave part is equal to 4 With n 1 equal, thereby forming a target micro-optical structure with a gradually changing optical refractive index.

[0104] In an embodiment of the present invention, further optionally, each protruding mold structure may include a plurality of first main pressing surfaces and / or a plurality of second main pressing surfaces with different degrees of pressing on the compressible optical material, thereby improving the diversity and design freedom of the micro-optical device.

[0105] In the embodiment of the present invention, optionally, Figure 4 As shown, the device preparation equipment may include an optical sensor, a pressure sensor, a high-precision XYZ mechanism, a motor and a driver, an operation control platform, and a light source, wherein the loading and unloading platform is used to control the loading operation of the compressible optical material to be pressed and the unloading operation of the target micro-optical device obtained after pressing, the motor and the driver can be used to press the microstructure mold onto the compressible optical material, the pressure sensor can be used to detect the force parameters of each part of the microstructure mold during the pressing process, the light source and the optical sensor can be used to detect the optical quality parameters of the target micro-optical device obtained after pressing, and the high-precision XYZ mechanism can be used to control the three-dimensional space accuracy in the above-mentioned loading operation, pressing operation, force detection operation, and optical quality detection operation. It can be seen that this can improve the accuracy and reliability of the pressing of micro-optical devices.

[0106] It can be seen that the implementation of the embodiment of the present invention can press the microstructure mold onto a compressible optical material whose optical refractive index changes with the degree of pressing, thereby obtaining a micro-optical device with multiple recessed optical structures on the surface, which reduces the complexity and difficulty of preparing the micro-optical device and is conducive to batch replication of the micro-optical device through the microstructure mold, thereby reducing the preparation cost of the micro-optical device. In addition, the refractive index of the optical material and the size of the micro-optical device can be determined as design variables of the micro-optical device, thereby improving the design freedom of the micro-optical device.

[0107] In an optional embodiment, if Figure 3 As shown in (d) and (e), the method may further include:

[0108] Controlling the device preparation equipment to fill each recessed optical structure with a predetermined optical filling material to obtain a first type of pure planar micro-optical device, wherein the material volume of the optical filling material filled in each recessed optical structure is equal to the recessed volume of the recessed optical structure; or,

[0109] The device preparation equipment is controlled to grind the protruding portion of the target micro-optical device compared to the concave optical structure until the pressed surface of the target micro-optical device is flat, thereby obtaining a second type of pure planar micro-optical device.

[0110] In the embodiment of the present invention, optionally, the optical refractive index n of the optical filling material is 5 The refractive index n of the compressed and uncompressed part of the compressible optical material 1 And the optical refractive index n obtained by pressing the compressible optical material on the main pressing surface 3 They are not equal. Further optionally, the optical filling material may include PDMS (Polydimethylsiloxane) polymer.

[0111] It can be seen that the implementation of this optional embodiment can fill the concave optical structure with an optical filling material or grind the protruding part of the surface of the micro-optical device to obtain a pure planar micro-optical device, thereby reducing the occurrence of device damage due to the microstructure on the surface of the micro-optical device and reducing the impact of environmental conditions such as dust on the working performance of the micro-optical device.

[0112] In another optional embodiment, the method may further include:

[0113] Detecting whether the target micro-optical device meets the device quality conditions, and when the detection result is no, adjusting the pressing control parameters of the device manufacturing equipment and / or the microstructure mold;

[0114] Wherein, detecting whether the target micro-optical device meets the device quality condition may include:

[0115] Based on the pressure sensor corresponding to the device preparation equipment, collecting force parameters corresponding to one or more pressed parts of the compressible optical material in the process of the device preparation equipment pressing the microstructure mold on the compressible optical material, wherein the force parameters include the force magnitude corresponding to each pressed part and / or the force direction corresponding to each pressed part;

[0116] Determine whether the force parameters meet the preset force conditions;

[0117] When it is determined that the force parameter does not meet the preset force condition, it is determined that the target micro-optical device does not meet the device quality condition;

[0118] When it is determined that the stress parameters meet the preset stress conditions, optical quality parameters corresponding to all the recessed optical structures are collected based on the optical sensor corresponding to the device manufacturing equipment;

[0119] Determining whether the optical quality parameters meet the preset optical quality conditions;

[0120] When it is determined that the optical quality parameter does not meet the preset optical quality condition, it is determined that the target micro-optical device does not meet the device quality condition.

[0121] It can be seen that the implementation of this optional embodiment can detect the quality of micro-optical devices in combination with pressure sensors and optical sensors during the preparation of microstructure devices. If there are quality problems, the pressing control parameters of the device preparation equipment and the microstructure mold are adjusted in time, thereby reducing unnecessary preparation costs caused by untimely discovery of quality problems, improving the intelligence of micro-optical device preparation and processing, and thus improving the yield rate of micro-optical devices.

[0122] In this optional embodiment, optionally, the pressure sensor can be a distributed pressure sensor, and the pressure sensor can be placed on the back side of the microstructure mold relative to the surface where the protruding mold is located and / or the back side of the compressible optical material relative to the surface to be pressed. Further optionally, when the pressure sensor is placed on the back side of the microstructure mold, the force parameters corresponding to each pressed part of the compressible optical material include the back pressure parameters corresponding to the protruding mold structure used to press the pressed part collected by the pressure sensor, and the back pressure parameters corresponding to each protruding mold structure may include the pressure parameters assigned to the part corresponding to the protruding mold structure on the back side of the microstructure mold during the process of the device preparation equipment pressing the microstructure mold onto the compressible optical material. This can reduce the situation where the actual force parameters of each pressed part of the compressible optical material are not uniform due to the inconsistent structural type of the protruding mold structure, thereby reducing the occurrence of low detection accuracy.

[0123] In this optional embodiment, as an optional implementation, judging whether the force parameter meets the preset force condition may include:

[0124] Determining whether the force parameters meet the preset force magnitude condition, and when it is determined that the force parameters do not meet the preset force magnitude condition, determining that the force parameters do not meet the preset force condition;

[0125] When it is determined that the force parameter satisfies the preset force magnitude condition, it is determined whether the force parameter satisfies the preset force direction condition; when it is determined that the force parameter does not satisfy the preset force direction condition, it is determined that the force parameter does not satisfy the preset force condition;

[0126] Wherein, judging whether the force parameters meet the preset force magnitude conditions may include:

[0127] Determine whether the force magnitudes corresponding to each pressed part are all preset force magnitudes. When it is determined that the force magnitudes corresponding to each pressed part are all preset force magnitudes, determine that the force parameters meet the preset force magnitude conditions. Otherwise, determine that the force parameters do not meet the preset force magnitude conditions; or,

[0128] Determine whether the difference between the force magnitude corresponding to each pressed part and the preset force magnitude is less than a first preset threshold value, and when it is determined that the difference between the force magnitude corresponding to each pressed part and the preset force magnitude is less than the first preset threshold value, determine that the force parameter meets the preset force magnitude condition; otherwise, determine that the force parameter does not meet the preset force magnitude condition;

[0129] And, judging whether the force parameters meet the preset force direction conditions may include:

[0130] Determine whether the force direction corresponding to each pressed part is perpendicular to the direction of the unloading platform. When it is determined that the force direction corresponding to each pressed part is perpendicular to the direction of the unloading platform, determine that the force parameter meets the preset force direction condition. Otherwise, determine that the force parameter does not meet the preset force direction condition; or,

[0131] Determine whether the angular difference between the force direction corresponding to each pressed part and the direction perpendicular to the unloading table is less than the second preset threshold. When it is determined that the angular difference between the force direction corresponding to each pressed part and the direction perpendicular to the unloading table is less than the second preset threshold, it is determined that the force parameters meet the preset force direction conditions. Otherwise, it is determined that the force parameters do not meet the preset force direction conditions.

[0132] It can be seen that the implementation of this optional implementation method can successively detect whether the force magnitude and force direction of the pressed part meet the preset force magnitude conditions and the preset force direction conditions, thereby improving the flexibility, accuracy and reliability of force parameter detection.

[0133] In this optional embodiment, optionally, when it is determined that the optical quality parameter does not meet the preset optical quality condition, the method may further include: recording device information of the target micro-optical device according to the force parameter and the optical quality parameter to classify the device quality of the target micro-optical device. This can improve the efficiency and convenience of quality classification of micro-optical devices.

[0134] Embodiment 2

[0135] See also Figure 2 , Figure 2 FIG. 1 is a flow chart of another method for preparing a micro-optical device based on mold pressing disclosed in an embodiment of the present invention. Figure 2The described method for preparing a micro-optical device based on mold pressing can be applied to any micro-optical device preparation process, such as a micro-optical device based on sub-wavelength characteristics, and the present invention is not limited thereto. Figure 2 As shown, the method for preparing a micro-optical device based on mold pressing may include the following operations:

[0136] 201. Determine a target preparation parameter combination corresponding to the preparation of a micro-optical device.

[0137] In the embodiment of the present invention, optionally, Figure 5 As shown, the target preparation parameter combination may include the size parameters of the microstructure mold, the pressing control parameters of the device preparation equipment, and the size parameters of the compressible optical material. Further optionally, when the microstructure mold includes a first convex mold structure or a second convex mold structure, the size parameters of the microstructure mold may include the width b of the main pressing surface of each convex mold structure of the microstructure mold and the distance w between the main pressing surfaces of every two convex mold structures, the main pressing surface includes a first main pressing surface or a second main pressing surface, and, when the convex mold structure of the microstructure mold includes a second type of convex mold structure, the size parameters of the microstructure mold may also include the angle θ between the second main pressing surface of the second type of convex mold structure and the side surface non-perpendicular to the second main pressing surface or the projection width u of the side surface non-perpendicular to the second main pressing surface relative to the plane where the second main pressing surface is located, the pressing control parameters of the device preparation equipment may include the compression distance d of each convex mold structure on the compressible optical material, the size parameters of the compressible optical material may include the thickness h of the compressible optical material, and further optionally, the size parameters of the compressible optical material may also include the porosity of the compressible optical material.

[0138] As an optional implementation, determining a target preparation parameter combination corresponding to preparing a micro-optical device may include:

[0139] Determining a current combination of preparation parameters corresponding to the preparation of the micro-optical device;

[0140] Based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, calculate the current wavefront phase modulation information corresponding to the current preparation parameter combination;

[0141] Based on the target wavefront phase modulation information at the predetermined wavelength, the current wavefront phase modulation information is verified to obtain a verification result;

[0142] When the verification result indicates that the current wavefront phase modulation information is verified, the current preparation parameter combination is determined as a target preparation parameter combination corresponding to the preparation of the micro-optical device;

[0143] When the verification result indicates that the verification of the current wavefront phase modulation information fails, the current preparation parameter combination corresponding to the preparation of the micro-optical device is adjusted, and the above-mentioned operation of calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the predetermined wavefront phase calculation algorithm is re-executed, and the operation of verifying the current wavefront phase modulation information and obtaining the verification result is performed based on the target wavefront phase modulation information at the predetermined wavelength determined in advance.

[0144] It can be seen that the implementation of this optional implementation method can verify the current wavefront phase modulation information corresponding to the current preparation parameter combination for preparing the micro-optical device according to the target wavefront phase modulation information actually required, and readjust the current preparation parameter combination when the verification fails, thereby improving the matching degree between the preparation parameter combination for preparing the micro-optical device and the actual needs, thereby improving the accuracy and reliability of the micro-optical device preparation.

[0145] In this optional implementation, optionally, based on the target wavefront phase modulation information at the predetermined wavelength determined in advance, verifying the current wavefront phase modulation information to obtain the verification result may include:

[0146] Calculating the difference between the target wavefront phase modulation information at a predetermined wavelength and the current wavefront phase modulation information;

[0147] Determine whether the difference is less than or equal to a preset threshold. If so, determine to verify the current wavefront phase modulation information, and the verification result indicates that the current wavefront phase modulation information has been verified. If not, determine to verify the current wavefront phase modulation information, and the verification result indicates that the current wavefront phase modulation information has not been verified.

[0148] In this optional implementation manner, further optionally, the difference degree may include a distance value between the target wavefront phase modulation information and the current wavefront phase modulation information.

[0149] It can be seen that implementing this optional implementation can also verify the current wavefront phase modulation information based on the difference between the target wavefront phase modulation information and the current wavefront phase modulation information, thereby improving the accuracy of the verification and further improving the accuracy of the determined target preparation parameter combination.

[0150] In this optional implementation, optionally, before calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the predetermined wavefront phase calculation algorithm, the method may further include:

[0151] Obtaining an optical refractive index-compression degree correspondence relationship determined based on a plurality of pre-sampled microstructure parameter combinations, where the optical refractive index-compression degree correspondence relationship is used to represent a correspondence relationship between an optical refractive index and a compression distance, and the optical refractive index-compression degree correspondence relationship includes an optical refractive index-compression degree relationship curve and / or an optical refractive index-compression degree lookup table;

[0152] Calculating current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm may include:

[0153] According to the corresponding relationship between the optical refractive index and the degree of compression, the current optical refractive index corresponding to the current combination of preparation parameters is determined;

[0154] Based on the current preparation parameter combination, the current optical refractive index and a predetermined wavefront phase calculation algorithm, current wavefront phase modulation information corresponding to the current preparation parameter combination is calculated.

[0155] It can be seen that this optional implementation can also determine the current optical refractive index corresponding to the current preparation parameter combination based on the optical refractive index-suppression degree correspondence determined by several pre-sampled microstructure parameter combinations, and then calculate the current wavefront phase modulation information corresponding to the current preparation parameter combination, thereby improving the accuracy and efficiency of calculating the current wavefront phase modulation information.

[0156] In this optional embodiment, optionally, the current optical refractive index corresponding to the current preparation parameter combination includes a fixed refractive index n obtained by pressing the simulated compressible optical material corresponding to the current preparation parameter combination by the main pressing surface of the simulated microstructure mold corresponding to the current preparation parameter combination. 3 , further optionally, if the current preparation parameter combination indicates that the protruding mold structure of the simulated microstructure mold includes a second type of protruding mold structure, the current optical refractive index also includes the gradient refractive index n obtained by simulating the compressible optical material by pressing the second type of protruding mold structure of the simulated microstructure mold non-perpendicular to the second main pressing surface 4 ; Further optionally, the optical refractive index-suppression degree correspondence may include n 3 The corresponding first-class correspondence and n 4 The corresponding second type of correspondence, where the first type of correspondence is n 3 =g(n 1 ,h,d), the second type of correspondence n 4 =g(n 1 ,h,d,u) and / or n 4 =g(n 1,h,d,θ); further optionally, the optical refractive index-suppression degree relationship curve can be determined by fitting according to the corresponding relationship between the optical refractive index of several pre-sampled microstructure parameter combinations and several pre-sampled compression degrees, and the optical refractive index-suppression degree lookup table can be determined according to the optical refractive index-suppression degree relationship curve, or according to the corresponding relationship between the optical refractive index of several pre-sampled microstructure parameter combinations and several pre-sampled compression degrees.

[0157] In this optional implementation, the wavefront phase calculation algorithm may include a wavefront phase modulation information calculation formula and an electromagnetic field calculation algorithm. Further, the electromagnetic field calculation algorithm may be one of a finite difference time domain method, a finite element method, and a moment method. If the current preparation parameters indicate that the protruding mold structure of the simulated microstructure mold only includes the first type of protruding mold structure and the target micro-optical device to be prepared does not need to be filled with optical filling material, the wavefront phase modulation information calculation formula may be: If the current preparation parameters indicate that the protruding mold structure of the simulated microstructure mold only includes the first type of protruding mold structure and the target micro-optical device to be prepared needs to be filled with optical filling material, the wavefront phase modulation information calculation formula can be If the current preparation parameters indicate that the protruding mold structure of the simulated microstructure mold includes the second type of protruding mold structure and the target micro-optical device to be prepared does not need to be filled with optical filling material, the wavefront phase modulation information calculation formula can be or If the current preparation parameters indicate that the protruding mold structure of the simulated microstructure mold includes the second type of protruding mold structure and the target micro-optical device to be prepared needs to be filled with optical filling material, the wavefront phase modulation information calculation formula can be or Where k is a constant, λ is the preset wavelength, and n 5 is the optical refractive index of the optical filling material.

[0158] It should be noted that, in other optional embodiments, not only can the current preparation parameter combination corresponding to the preparation of the micro-optical device be verified based on the target wavefront phase modulation information at a predetermined wavelength as described in the optional embodiment, but the current preparation parameter combination can also be verified based on any one of the target wavefront polarization modulation information and the target wavefront amplitude modulation information at a predetermined wavelength, and the embodiments of the present invention are not limited thereto.

[0159] 202. Determine a microstructure mold for preparing a micro-optical device.

[0160] As an optional implementation, determining the microstructure mold for preparing the micro-optical device may include: determining the microstructure mold for preparing the micro-optical device according to the target preparation parameter combination, which can improve the accuracy of the determined microstructure mold.

[0161] 203. Based on a preset pressure, control a device preparation apparatus for preparing a micro-optical device to press the microstructure mold onto a surface to be pressed of a compressible optical material placed on the material table in a direction perpendicular to the material table, so as to obtain a target micro-optical device having at least one concave optical structure on the surface.

[0162] In the embodiment of the present invention, for other descriptions of step 202-step 203, please refer to the detailed description of step 101-step 102 in the first embodiment, and the embodiment of the present invention will not be repeated.

[0163] It can be seen that the implementation of the embodiment of the present invention can press the microstructure mold onto a compressible optical material whose optical refractive index changes with the degree of pressing, thereby obtaining a micro-optical device with multiple recessed optical structures on the surface, which reduces the complexity and difficulty of preparing the micro-optical device, and is conducive to batch replication of micro-optical devices through microstructure molds, thereby reducing the preparation cost of the micro-optical device. It can also determine the refractive index of the optical material and the size of the micro-optical device as design variables of the micro-optical device, thereby improving the design freedom of the micro-optical device. In addition, it can also improve the accuracy and reliability of the preparation of the micro-optical device by determining the target preparation parameter combination for preparing the micro-optical device before preparing the micro-optical device.

[0164] Embodiment 3

[0165] See also Figure 6 , Figure 6 Schematic diagram of a micro-optical device manufacturing device based on mold pressing disclosed in an embodiment of the present invention. Figure 6 The described micro-optical device manufacturing apparatus based on mold pressing can be applied to any micro-optical device manufacturing process, such as micro-optical devices based on sub-wavelength characteristics, and the embodiments of the present invention are not limited thereto. Figure 6 As shown, the micro-optical device preparation device based on mold pressing may include:

[0166] A determination module 301 is used to determine a microstructure mold for preparing a micro-optical device, wherein the surface of the microstructure mold has at least one protruding mold structure, and each protruding mold structure is a micro-sized structure;

[0167] The device control module 302 is used to control the device preparation device for preparing the micro-optical device to press the microstructure mold on the surface to be pressed of the compressible optical material placed on the material table in a direction perpendicular to the material table based on a preset pressure, so as to obtain a target micro-optical device with at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device changes with the degree of pressing of the compressible optical material by the microstructure mold, and the protruding mold structure is embedded one by one with the concave optical structure pressed thereby.

[0168] It can be seen that the implementation Figure 6 The described device can press a microstructure mold onto a compressible optical material whose optical refractive index changes with the degree of pressing, thereby obtaining a micro-optical device with multiple recessed optical structures on the surface, thereby reducing the complexity and difficulty of preparing the micro-optical device, and facilitating batch replication of the micro-optical device through the microstructure mold, thereby reducing the preparation cost of the micro-optical device. In addition, the refractive index of the optical material and the size of the micro-optical device can be determined as design variables of the micro-optical device, thereby improving the design freedom of the micro-optical device.

[0169] In an optional embodiment, if Figure 6 As shown, the compressible optical material comprises a porous silicon-based compound.

[0170] It can be seen that the implementation Figure 6 The described device is also capable of using porous silicon-based compounds as compressible optical materials, which is beneficial to improving the strength, toughness, heat resistance, corrosion resistance, oxidation resistance, light transmittance and thermal shock resistance of micro-optical devices, and improving the compressibility of compressible optical materials, as well as reducing the dielectric loss of micro-optical devices.

[0171] In another optional embodiment, Figure 6 As shown, the protruding mold structure is a first type of protruding mold structure or a second type of protruding mold structure;

[0172] Among them, the first type of protruding mold structure includes a first main pressing surface and a side surface perpendicular to the first main pressing surface; the second type of protruding mold structure includes a second main pressing surface and a side surface not perpendicular to the second main pressing surface, and the angle between the side surface not perpendicular to the second main pressing surface and the second main pressing surface is greater than 90 degrees and less than 180 degrees;

[0173] For the second type of protruding mold structure, the side surface that is not perpendicular to the second main pressing surface has a pressing effect on the compressible optical material, and the optical refractive index obtained by pressing the compressible optical material by the side surface that is not perpendicular to the second main pressing surface is different from the optical refractive index obtained by pressing the compressible optical material by the second main pressing surface.

[0174] It can be seen that the implementation Figure 6The described device can also use different types of protruding mold structures to press the compressible optical material according to actual needs, thereby improving the diversity and flexibility of the optical refractive index of the internal structure of the micro-optical device and further improving the design freedom of the micro-optical device.

[0175] In yet another optional embodiment, Figure 6 As shown, the device control module 302 is also used to control the device preparation device to fill the predetermined optical filling material into each recessed optical structure to obtain a first type of pure planar micro-optical device, wherein the material volume of the optical filling material filled in each recessed optical structure is equal to the recessed volume of the recessed optical structure; or, control the device preparation device to grind the protruding portion of the target micro-optical device compared to the recessed optical structure until the pressed surface of the target micro-optical device is flat, to obtain a second type of pure planar micro-optical device.

[0176] It can be seen that implementation Figure 6 The described device can also fill the concave optical structure or polish the protruding part of the surface of the micro-optical device with an optical filling material to obtain a pure flat micro-optical device, thereby reducing the occurrence of device damage due to the microstructure on the surface of the micro-optical device and reducing the impact of environmental conditions such as dust on the working performance of the micro-optical device.

[0177] In yet another optional embodiment, Figure 6 As shown, the determination module 301 is also used to determine a target preparation parameter combination corresponding to the preparation of the micro-optical device before determining the microstructure mold for preparing the micro-optical device;

[0178] The specific manner in which the determination module 301 determines the target preparation parameter combination corresponding to the preparation of the micro-optical device may include:

[0179] Determining a current combination of preparation parameters corresponding to the preparation of the micro-optical device;

[0180] Based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, calculate the current wavefront phase modulation information corresponding to the current preparation parameter combination;

[0181] Based on the target wavefront phase modulation information at the predetermined wavelength, the current wavefront phase modulation information is verified to obtain a verification result;

[0182] When the verification result indicates that the current wavefront phase modulation information is verified, the current preparation parameter combination is determined as a target preparation parameter combination corresponding to the preparation of the micro-optical device;

[0183] When the verification result indicates that the verification of the current wavefront phase modulation information fails, the current preparation parameter combination corresponding to the preparation of the micro-optical device is adjusted, and the above-mentioned operation of calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the predetermined wavefront phase calculation algorithm is re-executed, and the operation of verifying the current wavefront phase modulation information and obtaining the verification result is performed based on the target wavefront phase modulation information at the predetermined wavelength determined in advance.

[0184] It can be seen that implementation Figure 6 The described device can also improve the accuracy and reliability of micro-optical device preparation by determining a target preparation parameter combination for preparing the micro-optical device before preparing the micro-optical device, and verify the current wavefront phase modulation information corresponding to the current preparation parameter combination for preparing the micro-optical device according to the target wavefront phase modulation information actually required, and readjust the current preparation parameter combination when the verification fails, and determine the current preparation parameter combination as the target preparation parameter combination when the verification passes, thereby improving the degree of matching between the target preparation parameter combination for preparing the micro-optical device and the actual needs, and further improving the accuracy and reliability of micro-optical device preparation.

[0185] In yet another optional embodiment, Figure 6 As shown, the determination module 301 verifies the current wavefront phase modulation information based on the target wavefront phase modulation information at the predetermined wavelength determined in advance, and the specific manner of obtaining the verification result may include:

[0186] Calculating the difference between the target wavefront phase modulation information at a predetermined wavelength and the current wavefront phase modulation information;

[0187] Determine whether the difference is less than or equal to a preset threshold. If so, determine to verify the current wavefront phase modulation information, and the verification result indicates that the current wavefront phase modulation information has been verified. If not, determine to verify the current wavefront phase modulation information, and the verification result indicates that the current wavefront phase modulation information has not been verified.

[0188] It can be seen that implementation Figure 6 The described device can also verify the current wavefront phase modulation information based on the difference between the target wavefront phase modulation information and the current wavefront phase modulation information, thereby improving the accuracy of the verification and further improving the accuracy of the determined target preparation parameter combination.

[0189] In yet another optional embodiment, Figure 6As shown, the determination module 301 is also used to obtain an optical refractive index-suppression degree correspondence relationship determined based on a plurality of pre-sampled microstructure parameter combinations before calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the pre-determined wavefront phase calculation algorithm, the optical refractive index-suppression degree correspondence relationship is used to represent the correspondence between the optical refractive index and the compression distance, and the optical refractive index-suppression degree correspondence relationship may include an optical refractive index-suppression degree relationship curve and / or an optical refractive index-suppression degree lookup table;

[0190] The specific manner in which the determination module 301 calculates the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the predetermined wavefront phase calculation algorithm may include:

[0191] According to the corresponding relationship between the optical refractive index and the degree of compression, the current optical refractive index corresponding to the current combination of preparation parameters is determined;

[0192] Based on the current preparation parameter combination, the current optical refractive index and a predetermined wavefront phase calculation algorithm, current wavefront phase modulation information corresponding to the current preparation parameter combination is calculated.

[0193] It can be seen that implementation Figure 6 The described device can also determine the current optical refractive index corresponding to the current preparation parameter combination based on the optical refractive index-suppression degree correspondence determined by several pre-sampled microstructure parameter combinations, and then calculate the current wavefront phase modulation information corresponding to the current preparation parameter combination, thereby improving the accuracy and efficiency of calculating the current wavefront phase modulation information.

[0194] In yet another optional embodiment, Figure 7 As shown, the device may also include:

[0195] A detection module 303 is used to detect whether the target micro-optical device meets the device quality condition;

[0196] An adjustment module 304 is used to adjust the pressing control parameters of the device manufacturing equipment and / or the microstructure mold when the detection module 303 detects that the target micro-optical device does not meet the device quality condition;

[0197] The specific manner in which the detection module 303 detects whether the target micro-optical device meets the device quality condition may include:

[0198] Based on the pressure sensor corresponding to the device preparation equipment, collecting force parameters corresponding to one or more pressed parts of the compressible optical material in the process of the device preparation equipment pressing the microstructure mold on the compressible optical material, wherein the force parameters include the force magnitude corresponding to each pressed part and / or the force direction corresponding to each pressed part;

[0199] Determine whether the force parameters meet the preset force conditions;

[0200] When it is determined that the force parameter does not meet the preset force condition, it is determined that the target micro-optical device does not meet the device quality condition;

[0201] When it is determined that the stress parameters meet the preset stress conditions, optical quality parameters corresponding to all the recessed optical structures are collected based on the optical sensor corresponding to the device manufacturing equipment;

[0202] Determining whether the optical quality parameters meet the preset optical quality conditions;

[0203] When it is determined that the optical quality parameter does not meet the preset optical quality condition, it is determined that the target micro-optical device does not meet the device quality condition.

[0204] It can be seen that implementation Figure 7 The described device can detect the quality of micro-optical devices in combination with pressure sensors and optical sensors during the preparation process of micro-structure devices. If quality problems exist, the pressing control parameters of the device preparation equipment and the micro-structure mold can be adjusted in time, thereby reducing unnecessary preparation costs caused by untimely discovery of quality problems, improving the intelligence of micro-optical device preparation and processing, and thus improving the yield rate of micro-optical devices.

[0205] Embodiment 4

[0206] See also Figure 8 , Figure 8 FIG. 1 is a schematic diagram of another micro-optical device manufacturing device based on mold pressing disclosed in an embodiment of the present invention. Figure 8 As shown, the micro-optical device preparation device based on mold pressing may include:

[0207] A memory 401 storing executable program codes;

[0208] a processor 402 coupled to the memory 401;

[0209] The processor 402 calls the executable program code stored in the memory 401 to execute the steps in the method for preparing a micro-optical device based on mold pressing described in the first embodiment of the present invention or the second embodiment of the present invention.

[0210] Embodiment 5

[0211] An embodiment of the present invention discloses a computer storage medium storing computer instructions. When the computer instructions are called, they are used to execute the steps in the method for preparing a micro-optical device based on mold pressing described in Embodiment 1 or Embodiment 2 of the present invention.

[0212] Embodiment 6

[0213] An embodiment of the present invention discloses a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to enable a computer to execute the steps in the method for preparing a micro-optical device based on mold pressing described in Embodiment 1 or Embodiment 2.

[0214] The device embodiments described above are only illustrative, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, i.e., they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Those of ordinary skill in the art may understand and implement it without creative work.

[0215] Through the specific description of the above embodiments, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on such an understanding, the above technical solution can be essentially or partly contributed to the prior art in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, and the storage medium includes a read-only memory (ROM), a random access memory (RAM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), a one-time programmable read-only memory (OTPROM), an electronically erasable rewritable read-only memory (EEPROM), a compact disc (CD-ROM) or other optical disc storage, magnetic disk storage, magnetic tape storage, or any other computer-readable medium that can be used to carry or store data.

[0216] Finally, it should be noted that the method and apparatus for preparing a micro-optical device based on mold pressing disclosed in the embodiments of the present invention only disclose the preferred embodiments of the present invention, which are only used to illustrate the technical solution of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, it should be understood by those skilled in the art that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features therein can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for preparing a micro-optical device based on mold pressing, characterized in that: The method comprises: Determining a microstructure mold for preparing a micro-optical device, wherein the surface of the microstructure mold has at least one protruding mold structure, and each of the protruding mold structures is a micro-sized structure; Based on a preset pressure, the device preparation equipment for preparing the micro-optical device is controlled to press the microstructure mold on the surface to be pressed of the compressible optical material placed on the material table in a direction perpendicular to the material table, so as to obtain a target micro-optical device having at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device changes with the degree of pressing of the compressible optical material by the microstructure mold, and the convex mold structure is embedded one by one with the concave optical structure pressed thereby; Before determining the microstructure mold for preparing the micro-optical device, the method further includes: Determining a target combination of preparation parameters corresponding to the preparation of the micro-optical device; Wherein, the step of determining a target preparation parameter combination corresponding to the preparation of the micro-optical device includes: Determining a current combination of preparation parameters corresponding to the preparation of the micro-optical device; Based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, calculate current wavefront phase modulation information corresponding to the current preparation parameter combination; Based on the target wavefront phase modulation information at the predetermined wavelength determined in advance, verifying the current wavefront phase modulation information to obtain a verification result; When the verification result indicates that the current wavefront phase modulation information is verified to be passed, determining the current preparation parameter combination as a target preparation parameter combination corresponding to the preparation of the micro-optical device; When the verification result indicates that the verification of the current wavefront phase modulation information fails, the current preparation parameter combination corresponding to the preparation of the micro-optical device is adjusted, and the operation of calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and the target wavefront phase modulation information at a predetermined wavelength determined in advance is re-executed, and the current wavefront phase modulation information is verified to obtain the verification result.

2. The method for preparing a micro-optical device based on mold pressing according to claim 1, characterized in that: The compressible optical material includes a porous silicon-based compound.

3. The method for preparing a micro-optical device based on mold pressing according to claim 1 or 2, characterized in that: The protruding mold structure is a first type of protruding mold structure or a second type of protruding mold structure; Wherein, the first type of protruding mold structure includes a first main pressing surface and a side surface perpendicular to the first main pressing surface; the second type of protruding mold structure includes a second main pressing surface and a side surface not perpendicular to the second main pressing surface, and the angle between the side surface not perpendicular to the second main pressing surface and the second main pressing surface is greater than 90 degrees and less than 180 degrees; For the second type of protruding mold structure, the side surface that is not perpendicular to the second main pressing surface has a pressing effect on the compressible optical material, and the optical refractive index obtained by pressing the compressible optical material by the side surface that is not perpendicular to the second main pressing surface is different from the optical refractive index obtained by pressing the compressible optical material by the second main pressing surface.

4. The method for preparing a micro-optical device based on mold pressing according to claim 3, characterized in that: The method further comprises: Controlling the device preparation equipment to fill each of the recessed optical structures with a predetermined optical filling material to obtain a first type of pure planar micro-optical device, wherein the material volume of the optical filling material filled in each of the recessed optical structures is equal to the recessed volume of the recessed optical structure; or The device preparation equipment is controlled to grind the protruding portion of the target micro-optical device compared to the concave optical structure until the pressed surface of the target micro-optical device is flat, thereby obtaining a second type of pure planar micro-optical device.

5. The method for preparing a micro-optical device based on mold pressing according to any one of claims 1, 2 and 4, characterized in that: The step of verifying the current wavefront phase modulation information based on the target wavefront phase modulation information at the predetermined wavelength to obtain a verification result includes: Calculating the difference between the target wavefront phase modulation information at a predetermined wavelength and the current wavefront phase modulation information; Determine whether the difference is less than or equal to a preset threshold. If so, determine to verify the current wavefront phase modulation information, and the verification result obtained indicates that the current wavefront phase modulation information is verified. If not, determine to verify the current wavefront phase modulation information, and the verification result obtained indicates that the current wavefront phase modulation information is not verified.

6. The method for preparing a micro-optical device based on mold pressing according to any one of claims 1, 2 and 4, characterized in that: Before calculating the current wavefront phase modulation information corresponding to the current preparation parameter combination based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, the method further includes: Obtaining an optical refractive index-compression degree correspondence relationship determined based on a plurality of pre-sampled microstructure parameter combinations, wherein the optical refractive index-compression degree correspondence relationship is used to represent a correspondence relationship between an optical refractive index and a compression distance, and the optical refractive index-compression degree correspondence relationship includes an optical refractive index-compression degree relationship curve and / or an optical refractive index-compression degree lookup table; The calculating, based on the current preparation parameter combination and a predetermined wavefront phase calculation algorithm, current wavefront phase modulation information corresponding to the current preparation parameter combination includes: Determining the current optical refractive index corresponding to the current preparation parameter combination according to the optical refractive index-compression degree correspondence relationship; Based on the current preparation parameter combination, the current optical refractive index and a predetermined wavefront phase calculation algorithm, current wavefront phase modulation information corresponding to the current preparation parameter combination is calculated.

7. The method for preparing a micro-optical device based on mold pressing according to any one of claims 1, 2 and 4, characterized in that: The method further comprises: Detecting whether the target micro-optical device meets the device quality condition, and when the detection result is no, adjusting the pressing control parameters of the device preparation equipment and / or the microstructure mold; Wherein, the detecting whether the target micro-optical device meets the device quality condition comprises: Based on the pressure sensor corresponding to the device preparation equipment, collecting force parameters corresponding to one or more pressed parts of the compressible optical material during the process of the device preparation equipment pressing the microstructure mold onto the compressible optical material, wherein the force parameters include the force magnitude corresponding to each of the pressed parts and / or the force direction corresponding to each of the pressed parts; Determining whether the force parameters meet the preset force conditions; When it is determined that the force parameter does not satisfy the preset force condition, determining that the target micro-optical device does not satisfy the device quality condition; When it is determined that the force parameters meet the preset force conditions, collecting optical quality parameters corresponding to all the recessed optical structures based on the optical sensor corresponding to the device manufacturing equipment; Determining whether the optical quality parameter meets a preset optical quality condition; When it is determined that the optical quality parameter does not satisfy the preset optical quality condition, it is determined that the target micro-optical device does not satisfy the device quality condition.

8. A micro-optical device manufacturing device based on mold pressing, characterized in that: The device is used to perform the method for preparing a micro-optical device based on mold pressing according to any one of claims 1 to 7, and the device comprises: A determination module, used to determine a microstructure mold for preparing a micro-optical device, wherein the surface of the microstructure mold has at least one protruding mold structure, and each of the protruding mold structures is a micro-sized structure; The device control module is used to control the device preparation device for preparing the micro-optical device to press the microstructure mold on the surface to be pressed of the compressible optical material placed on the material table in a direction perpendicular to the material table based on a preset pressure, so as to obtain a target micro-optical device with at least one concave optical structure on the surface, wherein the optical refractive index corresponding to the concave optical structure on the target micro-optical device changes with the degree of pressing of the compressible optical material by the microstructure mold, and the convex mold structure is embedded one by one with the concave optical structure pressed thereby.

9. A micro-optical device manufacturing device based on mold pressing, characterized in that: The device comprises: A memory storing executable program code; a processor coupled to the memory; The processor calls the executable program code stored in the memory to execute the method for preparing a micro-optical device based on mold pressing according to any one of claims 1 to 7.

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