Heat dissipation film, display module and display device

Abstract

The present disclosure provides a heat dissipation film, a display module and a display device, and relates to the technical field of display. The heat dissipation film comprises a foam adhesive layer and a metal layer stacked on one side of the foam adhesive layer. The orthographic projection of the metal layer on the plane where the foam adhesive layer is located is located within the area where the foam adhesive layer is located, and at least part of the edge of the orthographic projection of the metal layer is located inside the edge of the foam adhesive layer. In the present disclosure, since at least part of the edge of the orthographic projection of the metal layer on the plane where the foam adhesive layer is located is located inside the edge of the foam adhesive layer, that is, the metal layer is designed to be inwardly retracted relative to the foam adhesive layer. Therefore, when cutting, the influence of the feed and retreat of the cutting tool on the bonding effect of the edge of the heat dissipation film can be reduced, thereby improving the yield of the heat dissipation film. In addition, since the influence of the cutting tool on the edge of the heat dissipation film is avoided, when selecting the materials of the layers of the heat dissipation film, as long as the layers can be stably bonded, the selection of the materials of the layers is not limited.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular to a heat dissipation film, a display module and a display device. BACKGROUND

[0002] With the upgrading speed of electronic devices accelerating, electronic devices such as mobile phones and watches with OLED (Organic Light Emitting Diode) display substrates as display components are becoming more and more popular. In these electronic devices, the volume of OLED display substrates is getting smaller and smaller, and the integration and performance requirements are getting higher and higher, so that the heat generated during the operation of OLED display substrates is getting larger and larger. At present, the heat dissipation of OLED display substrates is mainly achieved by attaching a heat dissipation film to the OLED display substrate.

[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0004] The purpose of the present disclosure is to provide a heat dissipation film, a display module and a display device, which can reduce the separation of part of the laminated layers of the heat dissipation film to improve the yield of the heat dissipation film.

[0005] According to one aspect of the present disclosure, a heat dissipation film is provided, comprising:

[0006] a foam adhesive layer;

[0007] a metal layer laminated on one side of the foam adhesive layer, a projection of the metal layer on a plane where the foam adhesive layer is located is located within a region where the foam adhesive layer is located, and at least part of the edges of the projection of the metal layer is located inside the edges of the foam adhesive layer.

[0008] According to any one of the heat dissipation films of the present disclosure, the foam adhesive layer comprises an adhesive layer and a foam layer;

[0009] the foam layer is located between the adhesive layer and the metal layer, a projection of the foam layer on a plane where the adhesive layer is located is located within a region where the adhesive layer is located, and at least part of the edges of the projection of the foam layer is located inside the edges of the adhesive layer;

[0010] a projection of the metal layer on the adhesive layer is located within the projection of the foam layer on the adhesive layer, and at least part of the edges of the projection of the metal layer is located inside the edges of the projection of the foam layer.

[0011] According to any one of the heat dissipation films of the present disclosure, the heat dissipation film further comprises an intermediate laminated layer.

[0012] The intermediate layer is located between the foam adhesive layer and the metal layer. The orthographic projection of the intermediate layer on the plane where the foam adhesive layer is located is located within the foam adhesive layer, and at least a portion of the edge of the orthographic projection of the intermediate layer is located inside the edge of the foam adhesive layer.

[0013] The orthographic projection of the metal layer onto the foam adhesive layer lies within the orthographic projection of the intermediate stack onto the foam adhesive layer, and at least a portion of the edge of the orthographic projection of the metal layer lies inside the edge of the orthographic projection of the intermediate stack.

[0014] According to any of the heat dissipation films described in this disclosure, the intermediate stack includes a plurality of intermediate sub-stacks;

[0015] Two adjacent intermediate sub-stacks include a first intermediate sub-stack closer to the metal layer and a second intermediate sub-stack farther from the metal layer;

[0016] The orthographic projection of the first intermediate sub-layer on the foam adhesive layer is located within the orthographic projection of the second intermediate sub-layer on the foam adhesive layer, and at least a portion of the edge of the orthographic projection of the first intermediate sub-layer is located inside the edge of the orthographic projection of the second intermediate sub-layer.

[0017] According to any of the heat dissipation films described in this disclosure, the heat dissipation film is rectangular, and the four corners of the metal layer have notches.

[0018] According to any of the heat dissipation films described in this disclosure, the corner of the metal layer includes a first sub-notch extending in a row direction and a second sub-notch extending in a column direction, wherein a first end of the first sub-notch communicates with a first end of the second sub-notch.

[0019] According to any of the heat dissipation films described in this disclosure, the corner of the metal layer at the second end of the first sub-notch is an acute angle.

[0020] According to any of the heat dissipation films described in this disclosure, the heat dissipation film further includes a filler layer;

[0021] The filler layer is located on the side of the foam adhesive layer that is close to the metal layer. The orthographic projection of the filler layer on the plane of the foam adhesive layer is located in the area of ​​the foam adhesive layer. The surface of the filler layer away from the foam adhesive layer is at most flush with the surface of the metal layer away from the foam adhesive layer.

[0022] According to any of the heat dissipation films described in this disclosure, the distance between at least a portion of the edge of the orthographic projection of the metal layer and the edge of the foam adhesive layer is greater than or equal to 0.35 mm.

[0023] According to another aspect of this disclosure, a display module is provided, including a display substrate and the heat dissipation film described in one aspect above;

[0024] The display substrate has a display surface and a non-display surface, and the heat dissipation film includes a foam adhesive layer that is bonded to the non-display surface of the display substrate.

[0025] According to another aspect of this disclosure, a display device is provided, including the display module described in the other aspect above.

[0026] The embodiments disclosed herein include at least the following technical effects:

[0027] In this embodiment, since at least a portion of the edge of the metal layer's orthographic projection onto the plane of the foam adhesive layer is located inside the edge of the foam adhesive layer, a recessed design of the metal layer is achieved relative to the foam adhesive layer. This reduces the impact of the cutting tool's entry and exit points on the adhesion of the heat dissipation film edge during cutting, thereby improving the yield of the heat dissipation film. Furthermore, by avoiding the influence of the cutting tool on the heat dissipation film edge, the selection of materials for each layer of the heat dissipation film can be based solely on the ability of each layer to bond firmly, avoiding limitations on the selection of materials for certain layers.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0029] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0030] Figure 1 This is a top view of a heat dissipation film provided in an embodiment of the present disclosure.

[0031] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure along the middle AA'.

[0032] Figure 3 This is a top view of the corner structure of a heat dissipation film provided in an embodiment of this disclosure.

[0033] Figure 4 This is a top view of another corner structure of the heat dissipation film provided in an embodiment of this disclosure.

[0034] Figure 5 This is a top view of another heat dissipation film provided in an embodiment of the present disclosure.

[0035] Figure 6 for Figure 5 A schematic diagram of a cross-sectional structure along the middle AA'.

[0036] Figure 7 This is a cross-sectional structural diagram of a heat dissipation film provided for an embodiment of the present disclosure.

[0037] Figure 8 This is a cross-sectional structural diagram of another heat dissipation film provided in an embodiment of the present disclosure.

[0038] Figure 9 This is a cross-sectional structural diagram of another heat dissipation film provided in this embodiment of the present disclosure.

[0039] Figure 10 This is a cross-sectional structural diagram of another heat dissipation film provided in this embodiment of the present disclosure.

[0040] Figure 11 This is a top view of a structure provided for an embodiment of the present disclosure when the first covering film has not been peeled off.

[0041] Figure 12 This is a top view of the structure after the first covering film has been peeled off, as provided in an embodiment of this disclosure.

[0042] Figure 13 This is a cross-sectional structural diagram of another heat dissipation film provided in this embodiment of the present disclosure.

[0043] Figure 14 This is a cross-sectional structural diagram of another heat dissipation film provided in this embodiment of the present disclosure.

[0044] Figure 15 This is a top view of another heat dissipation film corner structure provided in this embodiment.

[0045] Figure 16 This is a top view of another heat dissipation film corner structure provided in this embodiment.

[0046] Figure 17 This is a top view of another corner structure of the heat dissipation film provided in this embodiment.

[0047] Figure 18 This is a schematic diagram of the structure of a display module provided in an embodiment of the present disclosure.

[0048] Figure label:

[0049] 10. Heat dissipation film; 20. Pixel panel; 30. Polarizing film; 40. Transparent adhesive film; 50. Transparent cover plate;

[0050] 11. Foam adhesive layer; 12. Metal layer; 13. Intermediate layer; 14. Release film; 15. Filler layer;

[0051] 111. Adhesive layer; 112. Foam layer;

[0052] 121. Gap; 122. First sub-gap; 123. Second sub-gap;

[0053] 131. First intermediate sub-layer; 132. Second intermediate sub-layer;

[0054] 141. Filler membrane; 142. Covering membrane;

[0055] 1421. First covering film; 1422. Second covering film. Detailed Implementation

[0056] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0057] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0058] The terms “a,” “one,” “the,” “the,” and “at least one” are used to indicate the presence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0059] The heat dissipation film 10 typically comprises multiple layers, which are bonded together to ensure the overall performance of the heat dissipation film 10. During the manufacturing process of the heat dissipation film 10, the layers are bonded over a large area before being cut to obtain the heat dissipation film 10 for bonding to the display substrate. During the cutting process, the advance and retraction of the cutting tool can affect the bonding effect at the edges of the heat dissipation film 10 (i.e., some layers separate at the edges of the heat dissipation film 10), reducing the yield of the heat dissipation film 10.

[0060] This disclosure provides a heat dissipation film 10. For example... Figure 1 or Figure 2 As shown, the heat dissipation film 10 includes a foam adhesive layer 11 and a metal layer 12; the metal layer 12 is stacked on one side of the foam adhesive layer 11, the orthographic projection of the metal layer 12 on the plane of the foam adhesive layer 11 is located in the area of ​​the foam adhesive layer 11, and at least a portion of the edge of the orthographic projection of the metal layer 12 is located inside the edge of the foam adhesive layer 11.

[0061] Since at least a portion of the edge of the metal layer 12 projected onto the plane of the foam adhesive layer 11 is located inside the edge of the foam adhesive layer 11, i.e., the metal layer 12 is designed to be recessed relative to the foam adhesive layer 11, the impact of the cutting tool's entry and exit on the adhesion of the heat dissipation film 10 edge can be reduced during cutting, thereby improving the yield of the heat dissipation film 10. Furthermore, since the influence of the cutting tool on the edge of the heat dissipation film 10 is avoided, the selection of materials for each layer of the heat dissipation film 10 only needs to ensure stable adhesion, avoiding limitations on the selection of materials for some layers.

[0062] When manufacturing the heat dissipation film 10, a large area of ​​the metal layer 12 can be pre-cut according to the inward edge and inward amount of the metal layer 12. Then, the cut large area of ​​the metal layer 12 is bonded to a large area of ​​the foam adhesive layer 11. The bonded large area of ​​the heat dissipation film 10 is then cut to obtain the heat dissipation film 10 described in this embodiment.

[0063] The heat dissipation film 10 can be a rectangular structure, a circular structure, or other shapes. The heat dissipation film 10 is used to bond to the non-display surface of the display substrate through the foam adhesive layer 11. The heat dissipation film 10 not only serves to dissipate heat from the display substrate, but also to improve the strength and electromagnetic shielding performance of the display substrate.

[0064] The metal layer 12 can be made of a metal with good thermal conductivity, such as copper. The inward-recessed edge region of the metal layer 12 relative to the foam adhesive layer 11 can be determined based on the specific structure of the heat dissipation film 10 and the area that is easily affected by the cutting tool during cutting.

[0065] For example, the heat dissipation film 10 has a rectangular structure, and the inwardly recessed edge of the metal layer 12 may include, for instance, a rectangular structure.Figure 1 The edges of the four corners of the metal layer 12 shown are, in other words, as shown in the figure. Figure 1 Each of the four corners of the metal layer 12 has a notch 121. The inward-curving edge of the metal layer 12 can be an arc-shaped edge at the corner, meaning the corner of the metal layer 12 has a rounded notch 121; or it can be an L-shaped edge at the corner, meaning the corner of the metal layer 12 has an L-shaped notch 121. Of course, the inward-curving edge of the metal layer 12 can also include the entire edge of the metal layer 12. This embodiment of the present disclosure does not limit this, as long as it avoids affecting the adhesion of the stacked layers at the edge of the heat dissipation film 10 during cutting.

[0066] Continuing with the example, the heat dissipation film 10 has a circular structure, and the inward-shrinking edge of the metal layer 12 can include the entire edge of the metal layer 12.

[0067] Taking the L-shaped notch 121 at the corner of metal layer 12 as an example, such as Figure 3 or Figure 4 As shown, the corner of the metal layer 12 includes a first sub-notch 122 extending in the row direction and a second sub-notch 123 extending in the column direction, with the first end of the first sub-notch 122 communicating with the first end of the second sub-notch 123. Thus, by extending the first sub-notch 122 and the second sub-notch 123, the inward-curving area of ​​the edge of the metal layer 12 can be increased, thereby further reducing the influence area of ​​the cutting tool on the edge of the heat dissipation film 10 when cutting it, thereby further ensuring the yield of the heat dissipation film 10.

[0068] The extension lengths of the first sub-notch 122 and the second sub-notch 123 can be determined based on the structure of the heat dissipation film 10 and the area of ​​influence that the cutting tool may have on the edge of the heat dissipation film 10 during cutting. The edges of the metal layer 12 at the second end of the first sub-notch 122 and at the second end of the second sub-notch 123 can be straight, serrated, or arc-shaped; this embodiment does not limit the specific type of edge. Taking the example where the edges of the metal layer 12 at the second end of the first sub-notch 122 and at the second end of the second sub-notch 123 are both straight, the corners of the edges of the metal layer 12 at the second end of the first sub-notch 122 and at the second end of the second sub-notch 123 can be obtuse, right, or acute angles. For example, as... Figure 3 As shown, the corner O of the edge of the metal layer 12 at the second end of the first sub-notch 122 is an obtuse angle; as Figure 4 As shown, the corner O of the edge of the metal layer 12 at the second end of the first sub-notch 122 is an acute angle.

[0069] Furthermore, the edge structure of the metal layer 12 at the second end of the first sub-notch 122 and the edge structure at the second end of the second sub-notch 123 may be the same or different; and the corners of the edges of the metal layer 12 at the second end of the first sub-notch 122 and the corners of the edges at the second end of the second sub-notch 123 may be the same or different.

[0070] In the embodiments of this disclosure, such as Figure 1 , Figure 2 , Figure 5 or Figure 6 As shown, the foam adhesive layer 11 includes an adhesive layer 111 and a foam layer 112, with the foam layer 112 located between the adhesive layer 111 and the metal layer 12.

[0071] In this configuration, the adhesive layer 111 and the foam layer 112 can be an integral structure, in which case there will be no separation between the adhesive layer 111 and the foam layer 112. Figure 1 or Figure 2 As shown, the edges of adhesive layer 111 and foam layer 112 are aligned. Of course, adhesive layer 111 and foam layer 112 can also be bonded together to obtain foam adhesive layer 11. However, in the case of bonding, there is a layer separation between adhesive layer 111 and foam layer 112, as shown below. Figure 5 or Figure 6 As shown, the orthographic projection of the foam layer 112 onto the plane of the adhesive layer 111 is located within the area of ​​the adhesive layer 111, and at least a portion of the edge of the orthographic projection of the foam layer 112 is located inside the edge of the adhesive layer 111.

[0072] In this way, the foam layer 112 can be designed to be recessed relative to the adhesive layer 111, thereby reducing the impact of the cutting tool's entry and exit on the adhesion effect of the heat dissipation film 10 during cutting, and thus improving the yield of the heat dissipation film 10.

[0073] The recessed design of the foam layer 112 relative to the adhesive layer 111 can be specifically referred to in the recessed design of the metal layer 12 relative to the foam adhesive layer 11 described in the above embodiments, and will not be repeated in this disclosure. For example, for the rectangular heat dissipation film 10, the foam layer 112 is recessed at the four corners relative to the adhesive layer 111.

[0074] In addition, the edge of the metal layer 12 may be flush with the edge of the foam layer 112, or the orthographic projection of the metal layer 12 on the adhesive layer 111 may be located within the orthographic projection of the foam layer 112 on the adhesive layer 111, and at least a portion of the edge of the orthographic projection of the metal layer 12 may be located inside the edge of the orthographic projection of the foam layer 112.

[0075] Thus, by using the inward-recessed design of the metal layer 12 relative to the foam layer 112, the impact of the tool's entry and exit on the adhesion effect of the heat dissipation film 10 edge is further reduced, thereby improving the yield of the heat dissipation film 10.

[0076] The recessed design of the metal layer 12 relative to the foam layer 112 can be specifically referred to in the above-described embodiment, where the metal layer 12 is recessed relative to the foam adhesive layer 11. This embodiment will not elaborate further. For example, for a rectangular heat dissipation film 10, the foam layer 112 is recessed at its four corners relative to the adhesive layer 111.

[0077] In this embodiment, the heat dissipation film 10 includes, in addition to the foam adhesive layer 11 and the metal layer 12, additional components to improve the heat dissipation effect of the heat dissipation film 10, such as... Figure 7 or Figure 8 As shown, the heat dissipation film 10 also includes an intermediate stack 13, which is located between the foam adhesive layer 11 and the metal layer 12.

[0078] In some embodiments, the edge of the intermediate stack 13 is aligned with the edge of the metal layer 12. Considering the case where the heat dissipation film 10 includes a foam adhesive layer 11 and a metal sheet, since the edge of the intermediate stack 13 is aligned with the edge of the metal layer 12, the design of the intermediate stack 13 will not affect the adhesion effect of the tool on the edge of the heat dissipation film 10 during tool entry and exit.

[0079] In other implementations, such as Figure 7 or Figure 8 As shown, the orthographic projection of the intermediate layer 13 onto the plane of the foam adhesive layer 11 is located within the foam adhesive layer 11, and at least a portion of the edge of the orthographic projection of the intermediate layer 13 is located inside the edge of the foam adhesive layer 11; the orthographic projection of the metal layer 12 onto the foam adhesive layer 11 is located within the orthographic projection of the intermediate layer 13 onto the foam adhesive layer 11, and at least a portion of the edge of the orthographic projection of the metal layer 12 is located inside the edge of the orthographic projection of the intermediate layer 13.

[0080] In this way, the inward-recessed design of the intermediate layer 13 relative to the foam adhesive layer 11 and the inward-recessed design of the metal layer 12 relative to the intermediate layer 13 can be achieved. This reduces the impact of the cutting tool's entry and exit on the adhesion effect of the heat dissipation film 10 during cutting, thereby ensuring the yield of the heat dissipation film 10.

[0081] The intermediate layer 13 can be a single layer, for example, the intermediate layer 13 can be a graphite layer or an insulating layer; of course, the intermediate layer 13 can also be a multilayer layer, for example, the intermediate layer 13 includes both a graphite layer and an insulating layer.

[0082] In the case where the intermediate layer 13 is a single layer, the inward design of the intermediate layer 13 relative to the foam adhesive layer 11 can refer to the inward design of the metal layer 12 relative to the foam adhesive layer 11 described in the above embodiments. This disclosure will not elaborate further on this aspect.

[0083] In cases where the intermediate stack 13 includes multiple stacks, in some embodiments, such as... Figure 7 As shown, the intermediate stack 13 includes multiple intermediate sub-stacks, and the edges of the multiple intermediate sub-stacks are aligned, that is, there is no indentation design between the multiple intermediate sub-stacks.

[0084] In other embodiments, such as Figure 8 As shown, two adjacent intermediate sub-layers include a first intermediate sub-layer 131 closer to the metal layer 12 and a second intermediate sub-layer 132 farther from the metal layer 12; the orthographic projection of the first intermediate sub-layer 131 on the foam adhesive layer 11 is located within the orthographic projection of the second intermediate sub-layer 132 on the foam adhesive layer 11, and at least a portion of the edge of the orthographic projection of the first intermediate sub-layer 131 is located inside the edge of the orthographic projection of the second intermediate sub-layer 132.

[0085] In this way, the first intermediate sub-layer 131 and the metal layer 12 can be designed to be recessed relative to the second intermediate sub-layer 132, thereby reducing the impact of the cutting tool's entry and exit on the adhesion effect of the heat dissipation film 10 during cutting, thus ensuring the yield of the heat dissipation film 10.

[0086] In some implementations, such as Figure 9 or Figure 10 As shown, the heat dissipation film 10 also includes a release protective film 14, which includes a filler film 141 and a cover film 142.

[0087] Taking the heat dissipation film 10, which includes a foam adhesive layer 11 and a metal layer 12, as an example, Figure 9 or Figure 10 As shown, the filler film 141 is located on the side of the foam adhesive layer 11 close to the metal layer 12, and the orthographic projection of the filler film 141 on the foam adhesive layer 11 is outside the orthographic projection of the metal layer 12 on the foam adhesive layer 11; the cover film 142 is located on the side of the metal layer 12 away from the foam adhesive layer 11, and the orthographic projections of the filler film 141 and the metal layer 12 on the foam adhesive layer 11 are both within the orthographic projection of the cover film 142 on the foam adhesive layer 11.

[0088] Thus, the design of the filler film 141 and the cover film 142 not only protects the heat dissipation film 10, but also increases the contact area between the roller and the heat dissipation film 10 when the heat dissipation film 10 is pressed onto the display substrate by the roller, thereby ensuring the bonding effect between the heat dissipation film 10 and the display substrate and avoiding the phenomenon of incomplete bonding in local areas.

[0089] The filler film 141 and the cover film 142 are made of the same material. For example, both the filler film 141 and the cover film 142 are made of PET. The filler film 141 and the cover film 142 can be a one-piece design. Of course, in order to simplify the manufacturing process of the release protective film 14, the filler film 141 and the cover film 142 can also be bonded together.

[0090] Optionally, the filler film 141 covers the area of ​​the foam adhesive layer 11 not covered by the metal layer 12. The surface of the filler film 141 facing away from the foam adhesive layer 11 is flush with the surface of the metal layer 12 facing away from the foam adhesive layer 11. The edges of the cover film 142 are at least aligned with the edges of the foam adhesive layer 11 to ensure that the entire area of ​​the heat dissipation film 10 can be rolled during roller pressing, and the entire area of ​​the heat dissipation film 10 is subjected to uniform force.

[0091] Furthermore, after the heat dissipation film 10 is bonded to the non-display surface of the display substrate, the cover film 142 and the filler film 141 can be peeled off. In some embodiments, adhesive can be applied to the area corresponding to the peeled filler film 141 to further improve the adhesion effect of the edges of each stacked layer in the recessed design, thereby extending the service life of the heat dissipation film 10. The adhesive application operation can be specifically explained in the following embodiments.

[0092] When peeling off the cover film 142, to avoid damage to the metal layer 12 caused by foreign objects after the entire cover film 142 is peeled off, only the area of ​​the cover film 142 corresponding to the filling film 141 can be peeled off. At this time, as... Figure 11 and Figure 12 As shown, the cover film 142 includes a first cover film 1421 and a second cover film 1422. The first cover film 1421 is used to cover the filler film 141, and the second cover film 1422 is used to cover the metal layer 12, so that when applying adhesive to the area corresponding to the filler film 141, only the first cover film 1421 and the filler film 141 need to be peeled off.

[0093] It should be noted that, for the case where the heat dissipation film 10 also includes an intermediate stack 13, the structure of the filling film 141 can be adjusted so that the filling film 141 simultaneously covers the area of ​​the foam adhesive layer 11 not covered by the intermediate stack 13, and the area of ​​the intermediate stack 13 not covered by the metal layer 12. For other structures, please refer to the above description which only includes the foam adhesive layer 11 and the metal layer 12, which will not be repeated in this disclosure.

[0094] In some embodiments, the heat dissipation film 10 comprises multiple layers. Due to the different physical properties of each layer, some layers may separate after prolonged use. To further prevent this separation, such as... Figure 13 or Figure 14 As shown, the heat dissipation film 10 also includes a filler layer 15.

[0095] Taking the heat dissipation film 10, which includes a foam adhesive layer 11 and a metal layer 12, as an example, Figure 13 or Figure 14 As shown, the filler layer 15 is located on the side of the foam adhesive layer 11 closest to the metal layer 12. The orthographic projection of the filler layer 15 onto the plane of the foam adhesive layer 11 lies within the area of ​​the foam adhesive layer 11, and the surface of the filler layer 15 facing away from the foam adhesive layer 11 is at most flush with the surface of the metal layer 12 facing away from the foam adhesive layer 11. Thus, the design of the filler layer 15 further improves the adhesion effect of the recessed design's laminated edges, thereby extending the service life of the heat dissipation film 10.

[0096] Since the surface of the filler layer 15 away from the foam adhesive layer 11 is at most flush with the surface of the metal layer 12 away from the foam adhesive layer 11, that is, the filler layer 15 covers the area of ​​the foam adhesive layer 11 that is not covered by the metal layer 12, and the thickness of the filler layer 15 is less than or equal to the thickness of the metal layer 12.

[0097] When a filler layer 15 is provided on the side of the foam adhesive layer 11 facing the metal layer 12, due to limitations in the adhesive application process, to prevent the applied adhesive from overflowing along the edge of the foam adhesive layer 11 and / or flowing onto the surface of the metal layer 12 away from the foam adhesive layer 11, at least a portion of the edge of the metal layer 12 has a certain amount of inward reduction. That is, in some embodiments, the distance between at least a portion of the orthographic projection edge of the metal layer 12 and the edge of the foam adhesive layer 11 is greater than or equal to 0.35 mm. In other words, when the distance between at least a portion of the orthographic projection edge of the metal layer 12 and the edge of the foam adhesive layer 11 is greater than or equal to 0.35 mm, the heat dissipation film 10 includes a filler layer 15 located on the side of the foam adhesive layer 11 closer to the metal layer 12. Of course, with improvements in the adhesive application process, this distance can be further reduced; that is, the aforementioned distance value of 0.35 mm is only an example and is not limiting.

[0098] For the case where a filler layer 15 is provided on the side of the foam adhesive layer 11 facing the metal layer 12, for example, such as Figure 15As shown, the heat dissipation film 10 includes a foam adhesive layer 11 and a metal layer 12. The indentation of the corner edge of the metal layer 12 relative to the corner edge of the foam adhesive layer 11 is greater than or equal to 1 mm. When the filler layer 15 is formed on the foam adhesive layer 11, the distance d1 from the adhesive application point to the edge of the foam adhesive layer 11 is greater than or equal to 0.5 mm, and the distance d2 from the adhesive application point to the edge of the metal layer 12 is less than or equal to 0.5 mm. Continuing with the example, as... Figure 16 As shown, the heat dissipation film 10 includes an adhesive layer 111, a foam layer 112, and a metal layer 12. The inward reduction of the corner edge of the metal layer 12 compared to the corner edge of the foam layer 112, and the inward reduction of the corner edge of the foam layer 112 compared to the corner edge of the adhesive layer 111, are both greater than or equal to 0.96 mm. In this case, the distance d1 from the adhesive application point on the adhesive layer 111 to the edge of the adhesive layer 111 is greater than or equal to 0.5 mm, and the distance d1 from the adhesive application point on the foam layer 112 to the edge of the metal layer 12 is less than or equal to 0.5 mm. Continuing with the example, as... Figure 17 As shown, the adhesive layer 111, foam layer 112, intermediate layer 13, and metal layer 12 are included. The inward reduction of the corner edge of the metal layer 12 compared to the corner edge of the intermediate layer 13, and the inward reduction of the corner edge of the foam layer 112 compared to the corner edge of the adhesive layer 111 are both greater than or equal to 0.96 mm. The edge of the intermediate layer 13 is aligned with the edge of the foam layer 112. At this time, due to the relatively thick thickness of the foam layer 112 and the intermediate layer 13, the distance d1 from the adhesive application point on the adhesive layer 111 to the edge of the adhesive layer 111 is greater than or equal to 0.6 mm, and the distance d2 from the adhesive application point on the foam layer 112 to the edge of the metal layer 12 is less than or equal to 0.6 mm.

[0099] It should be noted that when applying adhesive to the foam adhesive layer 11, considering the case where the corner O at the end of the notch 121 of the metal layer 13 is an acute or obtuse angle, compared to the case where the corner O is an obtuse angle, when the corner O is an acute angle, it is easier for the adhesive to flow back at the end of the notch 121, thereby reducing the probability of adhesive overflowing the edge of the foam adhesive layer 11.

[0100] Furthermore, such as Figure 13 or Figure 14 As shown, the heat dissipation film 10 also includes a release protective film 14, which is located on the side of the metal layer 12 away from the foam adhesive layer 11. The orthographic projection of the filler layer 15 on the foam adhesive layer 11 and the orthographic projection of the metal layer 12 on the foam adhesive layer 11 are both located within the orthographic projection of the release protective film 14 on the foam adhesive layer 11.

[0101] Thus, the release film 14 not only protects the heat dissipation film 10, but also increases the contact area between the rollers and the heat dissipation film 10 when the heat dissipation film 10 is pressed onto the display substrate by the rollers, thereby ensuring the adhesion between the heat dissipation film 10 and the display substrate and avoiding the phenomenon of incomplete adhesion in some areas. The material of the release film 14 can be PET.

[0102] This disclosure provides a display module. The display module includes a display substrate and a heat dissipation film 10 as described in the above embodiments. The display substrate has a display surface and a non-display surface, and the heat dissipation film 10 includes a foam adhesive layer 11 attached to the non-display surface of the display substrate.

[0103] The heat dissipation film 10 described in the above embodiments can ensure a certain yield rate and extend the service life. Thus, for display modules using the heat dissipation film 10, effective heat dissipation of the display substrate can be achieved, thereby ensuring the display effect of the display module.

[0104] For example, such as Figure 18 As shown, the display module includes a heat dissipation film 10, and a pixel panel 20, a polarizer 30, a transparent adhesive film 40 (e.g., a thermosetting optical transparent adhesive film TOCA) and a transparent cover plate 50 (e.g., a glass cover plate) sequentially stacked on a foam adhesive layer 11 of the heat dissipation film 10.

[0105] This disclosure also provides a display device, which includes the display module described in the above embodiments. The display device can be a mobile phone, laptop computer, tablet computer, television, monitor, digital photo frame, navigator, touch screen all-in-one machine, or other device with display function.

[0106] The heat dissipation film 10 manufactured in conjunction with the above embodiments can ensure the display effect of the display module, and thus ensure the display effect of the display device using the display module.

[0107] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A heat dissipation film, characterized in that, include: Foam adhesive layer; A metal layer is stacked on one side of the foam adhesive layer, wherein the orthographic projection of the metal layer on the plane of the foam adhesive layer is located within the area of ​​the foam adhesive layer, and at least a portion of the edge of the orthographic projection of the metal layer is located inside the edge of the foam adhesive layer. The heat dissipation film is rectangular, and the inwardly recessed edge of the metal layer includes the edges of the four corners, and the side edges of the metal layer are flush with the edges of the foam adhesive layer; each of the four corners of the metal layer has a notch; the corner of the metal layer includes a first sub-notch extending in the row direction and a second sub-notch extending in the column direction, and the first end of the first sub-notch is connected to the first end of the second sub-notch; The metal layer has an acute angle at the second end of the first sub-notch. The heat dissipation film also includes a filler layer. The filler layer is located on the side of the foam adhesive layer close to the metal layer. The orthographic projection of the filler layer on the plane of the foam adhesive layer is located in the area of ​​the foam adhesive layer. The surface of the filler layer away from the foam adhesive layer is at most flush with the surface of the metal layer away from the foam adhesive layer.

2. The heat dissipation film as described in claim 1, characterized in that, The foam adhesive layer includes an adhesive layer and a foam layer; The foam layer is located between the adhesive layer and the metal layer. The orthographic projection of the foam layer on the plane where the adhesive layer is located is located within the area where the adhesive layer is located, and at least a portion of the edge of the orthographic projection of the foam layer is located inside the edge of the adhesive layer. The orthographic projection of the metal layer on the adhesive layer lies within the orthographic projection of the foam layer on the adhesive layer, and at least a portion of the edge of the orthographic projection of the metal layer lies inside the edge of the orthographic projection of the foam layer.

3. The heat dissipation film as described in claim 1 or 2, characterized in that, The heat dissipation film also includes an intermediate layer; The intermediate layer is located between the foam adhesive layer and the metal layer. The orthographic projection of the intermediate layer on the plane where the foam adhesive layer is located is located within the foam adhesive layer, and at least a portion of the edge of the orthographic projection of the intermediate layer is located inside the edge of the foam adhesive layer. The orthographic projection of the metal layer onto the foam adhesive layer lies within the orthographic projection of the intermediate stack onto the foam adhesive layer, and at least a portion of the edge of the orthographic projection of the metal layer lies inside the edge of the orthographic projection of the intermediate stack.

4. The heat dissipation film as described in claim 3, characterized in that, The intermediate stack includes multiple intermediate sub-stacks; Two adjacent intermediate sub-stacks include a first intermediate sub-stack closer to the metal layer and a second intermediate sub-stack farther from the metal layer; The orthographic projection of the first intermediate sub-layer on the foam adhesive layer is located within the orthographic projection of the second intermediate sub-layer on the foam adhesive layer, and at least a portion of the edge of the orthographic projection of the first intermediate sub-layer is located inside the edge of the orthographic projection of the second intermediate sub-layer.

5. The heat dissipation film as described in claim 1, characterized in that, The distance between at least a portion of the edge of the orthographic projection of the metal layer and the edge of the foam adhesive layer is greater than or equal to 0.35 mm.

6. A display module, characterized in that, Includes a display substrate and a heat dissipation film as described in any one of claims 1-5 above; The display substrate has a display surface and a non-display surface, and the heat dissipation film includes a foam adhesive layer that is bonded to the non-display surface of the display substrate.

7. A display device, characterized in that, Includes the display module described in claim 6 above.

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