A heat dissipation structure for a supercomputing platform

Abstract

The present invention discloses a heat dissipation structure for a supercomputer platform, and relates to the technical field of heat dissipation devices. The present invention includes a printed circuit board and a heat dissipation assembly, and the heat dissipation assembly includes a substrate, the upper surface of the substrate is tightly attached to the lower surface of the printed circuit board, and an "S"-shaped water channel is provided on the lower surface of the substrate; a plurality of ribs arranged in an "S" shape are provided in the "S"-shaped water channel, and the ribs adopt a segmented structure, and the ribs of two adjacent segments are staggered along the direction of water flow. The present invention is achieved by attaching a substrate for heat dissipation to the lower surface of the printed circuit board, and opening an "S"-shaped water channel on the substrate, and cutting straight-line ribs arranged in an "S" shape in the "S"-shaped water channel, and the ribs are arranged in a segmented staggered manner, which increases the turbulence intensity of the fins without increasing the resistance of the flow channel, so that more turbulence is generated in the flow channel, so that the coolant is fully in contact with the water channel, and convective heat exchange occurs with the water channel, taking away more heat.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation devices, and in particular relates to a heat dissipation structure of a supercomputer platform. Background Art

[0002] With the development trend of intelligent automobile industry, intelligent driving technology has become the key research direction of major automobile enterprises. Among them, supercomputer platform (hereinafter referred to as supercomputer platform) has become an indispensable supporting hardware for the development of intelligent driving. As intelligent driving technology is gradually improved, the functions of the controller are increasing. The more running programs are written into the supercomputer platform, the greater the load of the supercomputer platform. The supercomputer platform is very prone to overheating and power reduction, running jams, overheating, aging, damage and failure of components. Therefore, with the continuous improvement of the level of intelligent driving, higher requirements are also placed on the cooling system of the supercomputer platform.

[0003] At present, the cooling system of intelligent driving supercomputer platforms mostly relies on forced air cooling for heat dissipation, but the heat dissipation efficiency of the air cooling structure is low. With the improvement of intelligent driving technology, the forced air cooling system has gradually failed to meet the use needs of automotive supercomputer platforms for heat dissipation. Therefore, industry R&D personnel tend to use water cooling or a mixed cooling method of air cooling and water cooling.

[0004] The existing Chinese utility model patent with publication number CN210008143U discloses "A high-efficiency heat dissipation device of a three-in-one integrated controller for electric vehicles". This electric vehicle heat dissipation device, while adopting natural heat dissipation, is provided with a cooling water channel on the bottom surface of the upper heat dissipation body, a second sealing rubber ring groove is provided at the edge of the cooling water channel, a second sealing rubber ring is provided between the second sealing rubber ring groove and the upper surface of the lower heat dissipation body for sealing the edge of the cooling water channel, and a cooling water channel inlet pipe connected to one end of the cooling water channel and a cooling water channel outlet pipe connected to the other end of the cooling water channel are provided at the bottom of the front end of the upper heat dissipation body. This solution uses water cooling and natural cooling to improve the heat dissipation efficiency.

[0005] However, the heat dissipation water channel of this structure has the following shortcomings: the structure adopts a whole fin structure, the flow resistance of the water channel is small, and the turbulence is less. When the fluid flows through the water channel, it will flow quickly over the heat dissipation surface, resulting in insufficient contact between the fluid and the heat dissipation surface, and poor heat exchange effect. Summary of the invention

[0006] The purpose of the present invention is to provide a heat dissipation structure for a supercomputer platform. A substrate for heat dissipation is attached to the lower surface of a printed circuit board, an "S"-shaped water channel is opened on the substrate, and straight fins arranged in an "S" shape are cut in the "S"-shaped water channel. The fins are arranged in a segmented staggered manner, which increases the turbulence intensity of the fins without increasing the flow channel resistance, so that more turbulence is generated in the flow channel, so that the coolant is in full contact with the water channel, and convective heat exchange occurs with the water channel to take away more heat, thereby solving the problem that the flow resistance of the water flow in the existing heat dissipation water channel is small, the turbulence is small, and when the fluid flows through the water channel, it will quickly flow through the heat dissipation surface, resulting in insufficient contact between the fluid and the heat dissipation surface and poor heat exchange effect.

[0007] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0008] The present invention is a heat dissipation structure of a supercomputer platform, including a printed circuit board and a heat dissipation assembly, wherein an upper cover for protecting the printed circuit board is fixedly connected above the printed circuit board. The heat dissipation assembly includes a substrate, wherein the upper surface of the substrate is in close contact with the lower surface of the printed circuit board, an "S"-shaped water channel is provided on the lower surface of the substrate, and a lower cover covering the "S"-shaped water channel is fixedly connected to the lower surface of the substrate. The "S"-shaped water channel includes a water inlet and a water outlet, and a throttling port is provided at one end of the "S"-shaped water channel close to the water outlet; a plurality of fins arranged in an "S" shape are provided in the "S"-shaped water channel, and the fins adopt a segmented structure, and the fins of two adjacent segments are staggered along the direction of water flow.

[0009] As a preferred technical solution of the present invention, a mounting groove adapted to the printed circuit board is provided on the upper surface of the substrate, and the printed circuit board is fixedly connected to the mounting groove.

[0010] As a preferred technical solution of the present invention, a plurality of heat pipes are evenly fixed on the bottom surface of the mounting groove, and the heat pipes are fixedly fitted to the lower surface of the printed circuit board, so that the concentrated heat source is rapidly diffused into a surface heat source distributed on the entire substrate surface, thereby reducing the heat flux density, improving the heat transfer efficiency, and achieving the effect of significantly reducing the temperature of the heat source.

[0011] As a preferred technical solution of the present invention, a plurality of heat pipe grooves adapted to the heat pipe are opened on the bottom surface of the installation groove, and the heat pipe is fixedly connected to the heat pipe groove; the back side of the heat pipe groove extends into the "S"-shaped water channel, thereby increasing the contact area between the heat pipe and the water channel and further improving the heat exchange efficiency.

[0012] As a preferred technical solution of the present invention, a heat dissipation boss is provided on the bottom surface of the mounting groove, and the heat dissipation boss is bonded to the heat dissipation chip below the printed circuit board to achieve fixed-point heat dissipation for the key heat dissipation parts of the printed circuit board.

[0013] As a preferred technical solution of the present invention, the heat dissipation boss is bonded to the heat dissipation chip below the printed circuit board by means of thermally conductive silicone.

[0014] As a preferred technical solution of the present invention, the "S"-shaped water channel includes a plurality of partition ribs, a first side rib and a second side rib. The partition rib is provided with a bent portion at the end away from the side rib, the first side rib is provided with a first protrusion, and the second side rib is provided with a second protrusion. The second protrusion is arranged opposite to the bent portion of the partition rib near the water outlet to form a throttling port; the bent portions of the plurality of partition ribs are arranged in the same direction, and the first protrusion is arranged in the same direction as the bent portion. A throttling port is designed at the water outlet of the "S"-shaped water channel so that a certain amount of water flow can be gathered in the water channel, which is convenient for generating more turbulence in the water channel, so that the coolant is in full contact with the water channel and takes away more heat.

[0015] As a preferred technical solution of the present invention, the fins adopt a straight-line fin structure with a trapezoidal cross section, which has small flow resistance and simple shape.

[0016] As a preferred technical solution of the present invention, the "S"-shaped water channel is manufactured by cutting, which has mature manufacturing technology and low processing cost.

[0017] The present invention has the following beneficial effects:

[0018] 1. The present invention provides an "S"-shaped water channel by attaching a substrate for heat dissipation to the lower surface of the printed circuit board, and cutting in-line fins arranged in an "S" shape in the "S"-shaped water channel. The fins are arranged in a staggered manner in sections, which improves the turbulence intensity of the fins without increasing the flow channel resistance, generates more turbulence in the flow channel, promotes full contact between the coolant and the water channel, and performs convective heat exchange with the water channel to take away more heat.

[0019] 2. The present invention evenly fixes a number of heat pipes on the upper surface of the substrate, and the heat pipes are fixedly attached to the lower surface of the printed circuit board, so that the concentrated heat source is rapidly diffused into a surface heat source distributed on the entire surface of the substrate, thereby reducing the heat flux density, improving the heat transfer efficiency, and achieving the effect of significantly reducing the temperature of the heat source.

[0020] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0022] Figure 1 An exploded schematic diagram of a heat dissipation structure of a supercomputer platform of the present invention;

[0023] Figure 2 It is a structural schematic diagram of the "S"-shaped waterway of the present invention;

[0024] Figure 3 A cross-sectional view of a heat dissipation structure of a supercomputing platform of the present invention;

[0025] Figure 4 It is an exploded diagram of the second embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the upper surface of the substrate in the second embodiment of the present invention;

[0027] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0028] 1-upper cover, 2-printed circuit board, 3-substrate, 301-heat pipe groove, 302-heat dissipation boss, 303-mounting groove, 4-lower cover, 5-"S" type water channel, 501-water inlet, 502-water outlet, 503-rib, 504-partitioning rib, 5041-bending portion, 505-first side rib, 5051-first protrusion, 506-second side rib, 5061-second protrusion, 6-heat pipe. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "all around" and the like indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0031] See also Figure 1As shown, the present invention is a supercomputer platform heat dissipation structure, which uses water cooling to cool the printed circuit board 2, and optimizes the structure of the cooling water channel, which increases the turbulence intensity in the water channel without increasing the flow channel resistance, so that more turbulence is generated in the flow channel, promotes full contact between the coolant and the water channel, and conducts convection heat exchange with the water channel to take away more heat. The design purpose of this heat dissipation structure is to meet the heat dissipation needs of supercomputer platforms caused by the development of intelligent driving technology in the automotive field.

[0032] Embodiment 1

[0033] See also Figure 1-Figure 2 As shown, in order to increase the heat dissipation effect of the printed circuit board 2, this embodiment is provided with a water-cooled heat dissipation component below the printed circuit board, and the heat dissipation component includes a substrate 3. During installation, thermal conductive silicone is applied to the upper surface of the substrate 3, and the printed circuit board 2 is placed in the mounting groove 303 on the upper surface of the substrate 3, so that the lower surface of the printed circuit board 2 is closely attached to the upper surface of the substrate 3. Then, the upper cover 1 is fixed to the upper surface of the printed circuit board, and the upper cover 1 is used to protect the printed circuit board 2 from collision damage. At this point, the upper part of the substrate 3 is fixed.

[0034] An "S"-shaped water channel 5 is opened on the lower surface of the substrate 3, and then a lower cover 4 is welded to the lower surface of the substrate 3 by stir friction welding, so that the "S"-shaped water channel 5 forms a sealing structure, and the bottom of the substrate is fixed.

[0035] The "S"-shaped water channel 5 is provided with a water inlet 501 and a water outlet 502. There are three partition ribs 504 and side ribs in the "S"-shaped water channel 5. The side ribs and the three partition ribs 504 form the "S"-shaped water channel. The side ribs include a first side rib 505 and a second side rib 506. The three partition ribs 504 have a bent portion 5041 at the end away from the side ribs. The first side rib 505 has a first protrusion 5051, and the second side rib 506 has a second protrusion 5061. The second protrusion 5061 is arranged opposite to the bent portion 5041 of the partition rib 504 near the water outlet 502 to form a throttling port. The throttling port allows a certain amount of water flow to be gathered in the water channel, which is convenient for generating more turbulence in the water channel, so that the coolant is fully in contact with the water channel and takes away more heat. The bending parts 5041 of the three partition ribs 504 are all cut in the same direction, and the first protrusion 5051 is also cut in the same direction as the bending part 5041 to adapt to the design of the throttling port without changing the water flow of the rest of the "S"-shaped water channel 5.

[0036] Several ribs 503 arranged in an "S" shape are cut and processed in the direction of water flow in the "S"-shaped water channel 5. The ribs 503 adopt a segmented structure, and the ribs 503 of two adjacent sections are arranged alternately along the direction of water flow, that is, the water flow outlet formed by the upper section of ribs 503 is directly opposite to the lower section of ribs 503. The arrangement of the ribs 503 in this way increases the turbulence intensity of the ribs 503 without increasing the resistance of the flow channel, so that more turbulence is generated in the flow channel, which promotes full contact between the coolant and the water channel, and convective heat exchange occurs with the water channel to take away more heat. At the same time, the ribs 503 adopt a straight-line fin structure with a trapezoidal cross section, which is convenient for chip cutting, has a small structural flow resistance, a simple shape, mature processing and manufacturing technology, and a low processing cost.

[0037] Embodiment 2

[0038] Based on the first embodiment, the second embodiment is different in that:

[0039] See also Figure 3-Figure 5 As shown, three heat pipe grooves 301 are evenly pressed on the bottom surface of the installation groove 303 on the upper surface of the substrate 3, and the back of the heat pipe groove 301 is pressed into the "S"-shaped water channel 5. The heat pipe 6 is fixed in the heat pipe groove 301, so that the heat pipe 6 is closely attached to the lower surface of the printed circuit board 2. The heat pipe 6 allows the concentrated heat source to quickly diffuse into a surface heat source distributed on the entire surface of the substrate 3, thereby reducing the heat flux density, improving the heat transfer efficiency, and achieving the effect of significantly reducing the temperature of the heat source.

[0040] The bottom surface of the mounting groove 303 is also provided with a heat dissipation boss 302 through a die, and the heat dissipation boss 302 is bonded to the heat dissipation chip below the printed circuit board 2 through thermally conductive silicone, so as to achieve targeted heat dissipation at the key heat dissipation locations of the printed circuit board 2.

[0041] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0042] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A supercomputing platform heat dissipation structure, characterized in that: include: A printed circuit board (2), wherein an upper cover (1) for protecting the printed circuit board (2) is fixedly connected above the printed circuit board (2); A heat dissipation component, the heat dissipation component comprising a substrate (3), the upper surface of the substrate (3) being in close contact with the lower surface of the printed circuit board (2), the lower surface of the substrate (3) being provided with an "S"-shaped water channel (5), and the lower surface of the substrate (3) being fixedly connected with a lower cover (4) covering the "S"-shaped water channel (301); The "S"-shaped water channel (5) comprises a water inlet (501) and a water outlet (502), and a throttling port is provided at one end of the "S"-shaped water channel (5) close to the water outlet (502); a plurality of fins (503) arranged in an "S" shape are provided in the "S"-shaped water channel (5), and the fins (503) are of a segmented structure, and the fins (503) of two adjacent segments are staggered along the water flow direction; The "S"-shaped water channel (5) includes a plurality of partition ribs (504), a first side rib (505) and a second side rib (506); A plurality of the partition ribs (504) are provided with a bending portion (5041) at one end away from the side ribs, the first side ribs (505) are provided with a first protrusion (5051), and the second side ribs (506) are provided with a second protrusion (5061); The second protrusion (5061) and the bent portion (5041) of the partition rib (504) near the water outlet (502) are arranged opposite to each other to form a throttling port; the bent portions (5041) of the partition ribs (504) are arranged in the same direction, and the first protrusion (5051) and the bent portion (5041) are arranged in the same direction; The fins (503) are in a straight-line fin structure with a trapezoidal cross section; The "S"-shaped water channel (5) is manufactured by cutting.

2. A supercomputer platform heat dissipation structure according to claim 1, characterized in that: The upper surface of the base plate (3) is provided with a mounting groove (303) adapted to the printed circuit board (2), and the printed circuit board (2) is fixedly connected to the mounting groove (303).

3. A supercomputer platform heat dissipation structure according to claim 2, characterized in that: A plurality of heat pipes (6) are evenly fixed on the bottom surface of the installation groove (303), and the heat pipes (6) are fixedly fitted to the bottom surface of the printed circuit board (2).

4. The supercomputer platform heat dissipation structure according to claim 3, characterized in that: The bottom surface of the installation groove (303) is provided with a plurality of heat pipe grooves (301) adapted to the heat pipe (6); the heat pipe (6) is fixedly connected to the heat pipe groove (301); and the back surface of the heat pipe groove (301) extends into the "S"-shaped water channel (5).

5. The supercomputer platform heat dissipation structure according to claim 2, characterized in that: The bottom surface of the mounting groove (303) is provided with a heat dissipation boss (302), and the heat dissipation boss (302) is bonded to the heat dissipation chip below the printed circuit board (2).

6. The supercomputer platform heat dissipation structure according to claim 5, characterized in that: The heat dissipation boss (302) is bonded to the heat dissipation chip below the printed circuit board (2) via heat-conductive silicone.

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