Bonding pad structure and its design method, display device

Abstract

This application relates to the field of pad bonding technology and proposes a design method for a pad bonding structure, comprising: setting the pad bonding structure to satisfy a first condition: P = W1 + S1 = W2 + S2, where P is the center distance between pads, W1 and W2 are the widths of the first and second pads respectively, and S1 and S2 are the spacing between the first and second pads respectively; setting the pad bonding structure to satisfy a second condition: Min(S1, S2) ≥ L1 ≥ X * Min(S1, S2) ≥ L2, where X is a preset coefficient, L1 is the spacing between the second pad and the adjacent first pad, and L2 is the minimum spacing between the second pad and the adjacent first pad required by the ACF adhesive; obtaining the range of the width of the first pad and the range of the width of the second pad based on the first and second conditions; the above design method can solve the problem of bonding misalignment. This application also proposes a pad bonding structure and a display device.

Description

Technical Field

[0001] This application relates to the field of display panels, and more particularly to a bonding pad structure and its design method, and a display device. Background Technology

[0002] Currently, the panel industry generally uses bonding technology to achieve electrical physical connection. This involves using anisotropic conductive film (ACF) to connect the panel and the adapter board through thermoforming. The panel can be a display panel or a touch panel, and the adapter board can be an integrated circuit chip (IC), a flexible printed circuit (FPC), or a printed circuit board (PCB).

[0003] As the panel industry trends towards ultra-narrow bezels / borderless designs and high-resolution displays, arranging more leads within limited space necessitates compressing the pad pitch as much as possible. Under the previous irregular design, bonding misalignment was highly likely to occur, which can easily lead to short circuits and reduced product yield. Summary of the Invention

[0004] This application provides a bonding pad structure and its design method, as well as a display device, which can solve the problem of bonding misalignment.

[0005] An embodiment of the first aspect of this application proposes a design method for a bonding pad structure, the bonding pad structure comprising a plurality of first pads arranged in sequence, a plurality of second pads arranged in sequence, and ACF adhesive disposed between the first pads and the corresponding second pads, the design method comprising:

[0006] The bonding pad structure is set to satisfy the first condition: P = W1 + S1 = W2 + S2, where P is the center distance between pads, W1 and W2 are the widths of the first pad and the second pad, respectively, and S1 and S2 are the spacing between the first pad and the second pad, respectively.

[0007] The bonding pad structure is set to satisfy the second condition: Min(S1, S2)≥L1≥X*Min(S1, S2)≥L2, where X is a preset coefficient, L1 is the distance between the second pad and the adjacent first pad, and L2 is the minimum distance between the second pad and the adjacent first pad required by the ACF adhesive.

[0008] The center distance between the pads, the overlap height between the first pad and the second pad, the minimum overlap area and minimum spacing required by the ACF adhesive are obtained, and the range of the width of the first pad and the range of the width of the second pad are obtained based on the first condition and the second condition.

[0009] In some embodiments, the bonding pad structure also satisfies a third condition: A = H * {Min(W1, W2) - [Max(S1, S2) - L1]}, and H * Min(W1, W2) ≥ A, where A is the overlap area between the first pad and the second pad;

[0010] The ranges of the first pad width and the second pad width are obtained based on the first condition and the second condition, including:

[0011] The width of the first pad is set to be greater than or equal to the width of the second pad;

[0012] Based on the first condition and the second condition, calculate the minimum and maximum values ​​of the width of the first pad;

[0013] Based on the third condition and the minimum width of the first pad, calculate the maximum width of the second pad;

[0014] Based on the overlap height between the first pad and the second pad and the minimum overlap area required by the ACF adhesive, calculate the minimum width of the second pad.

[0015] In some embodiments, calculating the minimum and maximum values ​​of the width of the first pad based on the first condition and the second condition includes:

[0016] Based on the first condition and the second condition, the fourth condition is obtained: L1≥X*(P-W1);

[0017] Calculate the minimum width of the first pad based on the fourth condition;

[0018] The minimum value of the first pad spacing is obtained based on the second condition, and the maximum value of the first pad width is calculated based on the first condition.

[0019] In some embodiments, the allowable offset value between the first pad and the second pad satisfies a fifth condition:

[0020] Y=1 / 2|W1-W2|+[Min(S1, S2)-L1];

[0021] After obtaining the range of the width of the first pad and the range of the width of the second pad, the design method further includes:

[0022] Based on the range of the width of the first pad, the range of the width of the second pad, and the fifth condition, calculate the maximum value of the allowable offset value, and obtain the values ​​of the width of the first pad and the width of the second pad when the allowable offset value is at its maximum value.

[0023] In some embodiments, the preset coefficient is 1 / 2.

[0024] An embodiment of the second aspect of this application provides a bonding pad structure, including a plurality of first pads arranged in sequence and a plurality of second pads arranged in sequence, and ACF adhesive disposed between the first pads and the corresponding second pads, wherein the bonding pad structure satisfies:

[0025] First condition: P = W1 + S1 = W2 + S2, where P is the center distance between pads, W1 and W2 are the widths of the first and second pads respectively, and S1 and S2 are the spacing between the first and second pads respectively.

[0026] Second condition: Min(S1, S2)≥L1≥X*Min(S1, S2)≥L2, where X is a preset coefficient, L1 is the distance between the second pad and the adjacent first pad, and L2 is the minimum distance between the second pad and the adjacent first pad required by the ACF adhesive.

[0027] In some embodiments, the bonding pad structure also satisfies a third condition: A = H * {Min(W1, W2) - [Max(S1, S2) - L1]}, while H * Min(W1, W2) ≥ A;

[0028] Where A is the overlap area between the first pad and the second pad.

[0029] In some embodiments, the allowable offset value between the first pad and the second pad satisfies the fifth condition: Y = 1 / 2|W1-W2|+[Min(S1,S2)-L1].

[0030] In some embodiments, the preset coefficient is 1 / 2.

[0031] An embodiment of the third aspect of this application provides a display device including the bonding pad structure described in the second aspect.

[0032] The above-described method for designing bonded pad structures ensures equal center-to-center distances between the first and second pads by setting a first condition. It then defines the relationship between the spacing between the first and second pads and the minimum spacing between the second pad and its adjacent first pad as required by the ACF adhesive properties by setting a second condition. Next, by obtaining the center-to-center distance, the overlap height between the first and second pads, the minimum overlap area required by the ACF adhesive, and the minimum spacing, the range of the widths of the first and second pads is obtained based on the first and second conditions. Thus, the dimensions of the first and second pads can be designed according to the requirements of the ACF material, optimizing the allowable offset values ​​while meeting the ACF property requirements, and minimizing offset and short-circuit problems.

[0033] The bonding pad structure provided in this application satisfies the first and second conditions mentioned above and is designed according to the characteristics of ACF adhesive. While meeting the characteristics of ACF adhesive, it can improve the allowable deviation value in engineering to the optimal state and minimize deviation and short circuit problems. The bonding pad structure and the display device having the bonding pad structure have a high product yield. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of a bonding pad structure provided in an embodiment of this application;

[0036] Figure 2 yes Figure 1 A schematic diagram of the structure of multiple first pads in the bonding pad structure shown;

[0037] Figure 3 This is one of the flowcharts of a design method for bonding pads provided in the embodiments of this application;

[0038] Figure 4 This is a second flowchart of a design method for bonding pads provided in an embodiment of this application;

[0039] The markings in the diagram mean:

[0040] 100, Bonding pad structure; 10, First pad; 20, Second pad. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0042] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly or indirectly attached to that other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are for descriptive convenience only, not indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the patent. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0043] To illustrate the technical solutions described in this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0044] The first aspect of this application proposes a design method for bonding pad structures. Please refer to... Figure 1 The bonding pad structure 100 includes a plurality of first pads 10 arranged in sequence, a plurality of second pads 20 arranged in sequence, and ACF adhesive (not shown) disposed between the first pads 10 and the corresponding second pads 20. One of the first pads 10 and the second pads 20 is an donor material pad, and the other is a recipient material pad. The recipient material pad is bonded to the donor material pad by ACF adhesive.

[0045] Figure 2 Multiple first pads 10 are shown. Please refer to... Figure 2 P1 is the center distance between pads, that is, the center distance between two adjacent first pads 10; S1 is the spacing between first pads, that is, the spacing between two adjacent first pads 10; W1 is the width of the first pad, that is, the length of the first pad 10 in the width direction.

[0046] Since the first pad 10 and the second pad 20 are bonded together by ACF adhesive, and the characteristics of ACF adhesive impose requirements on the minimum overlap area and minimum spacing of the donor material pad and the recipient material pad, this application designs the bonding pad structure 100 based on the characteristics of ACF. This can improve the engineering capability (the allowable deviation value in engineering) to the best state while meeting the characteristics of ACF, and minimize the deviation and short circuit problems.

[0047] Please refer to Figure 1 and Figure 3 The design methods for bonding pad structures include:

[0048] Step S10: Set the bonding pad structure 100 to satisfy the first condition: P = W1 + S1 = W2 + S2.

[0049] Where P is the center distance between pads, W1 and W2 are the widths of the first pad and the second pad, respectively, and S1 and S2 are the spacing between the first pad and the second pad, respectively.

[0050] Figure 1 In this context, P1 represents the center-to-center distance of the first pad 10, P1 = W1 + S; P2 represents the center-to-center distance of the second pad 20, P2 = W2 + S. The pad bonding structure 100 requires P1 to equal P2, thus satisfying the first condition mentioned above. It can be understood that multiple first pads 10 have the same first pad width W1, and multiple second pads 20 have the same second pad width W2.

[0051] By setting a first condition, it can be ensured that multiple first pads 10 and multiple second pads 20 have equal pad center distances, thereby ensuring that each first pad 10 can be attached to the corresponding second pad 20, and avoiding the gradual increase in the misalignment between the first pad 10 and the second pad 20 as the number of pads increases, which would cause some pads to fail to bond.

[0052] Step S20: Set the bonding pad structure 100 to meet the second condition:

[0053] Min(S1, S2)≥L1≥X*Min(S1, S2)≥L2.

[0054] Wherein, X is a preset coefficient and is set according to engineering requirements. In one embodiment, X = 1 / 2, but it is not limited to this. It can be understood that X < 1; L1 is the distance between the second pad 20 and the adjacent first pad 10, and L2 is the minimum distance between the second pad 20 and the adjacent first pad 10 required by the ACF adhesive.

[0055] It is important to note that, such as Figure 1 As shown, the second pad 20 adjacent to the first pad 10 refers to another second pad 20 located on the side of the second pad 20 bonded to the first pad 10 along the arrangement direction of the first pad 10. The spacing between the first pad 10 and the adjacent second pad 20 is affected by the bonding process offset. Figure 1 The L1 marked in the figure is the distance between the first pad 10 and the adjacent second pad 20. The L2 (not marked) is the minimum distance between the first pad 10 and the adjacent second pad 20 required by the characteristics of ACF adhesive. If the distance between the first pad 10 and the adjacent second pad 20 is less than this distance, the bonding will fail.

[0056] The second condition described above defines the relationship between the first pad spacing, the second pad spacing, and the minimum spacing between the second pad 20 required by the ACF adhesive and the adjacent first pad 10. According to the first condition, if W1≥W2, then S1≤S2; in this case, the second condition is: S1≥L1≥X*S1≥L2.

[0057] By setting a second condition, the design of the bonding pad structure 100 is limited to meet the minimum spacing requirements of ACF adhesive for acceptor material pads and donor material pads.

[0058] Step S30: Obtain the center distance between the pads, the overlap height between the first pad 10 and the second pad 20, the minimum overlap area and minimum spacing required by the ACF adhesive, and obtain the range of the width of the first pad and the width of the second pad based on the first and second conditions.

[0059] like Figure 1 As shown, the shaded area defined by the dashed line represents the overlap area between the first pad 10 and the second pad 20. The overlap area A between the first pad 10 and the second pad 20 depends on the overlap height H and overlap width. The allowable deviation value Y refers to the lateral deviation; the longitudinal deviation is more leniently controlled and is temporarily ignored here. The overlap height is calculated based on a fixed value H. Therefore, with the pad center distance, the overlap height between the first pad 10 and the second pad 20, and the minimum overlap area and minimum spacing required by the ACF adhesive as known conditions, and based on the first condition, the second condition, and geometric relationships, the range of the width of the first pad and the range of the width of the second pad can be obtained.

[0060] Furthermore, based on the first condition, the range of the first pad spacing and the second pad spacing can be obtained, thus completing the design of the first pad 10 and the second pad 20.

[0061] The design method of the aforementioned pad bonding structure 100 ensures that the first pad 10 and the second pad 20 have equal center-to-center distances by setting a first condition. It then defines the relationship between the first pad spacing, the second pad spacing, and the minimum spacing between the second pad 20 and the adjacent first pad 10 as required by the ACF adhesive properties by setting a second condition. Next, by obtaining the center-to-center distance, the overlap height between the first pad 10 and the second pad 20, the minimum overlap area required by the ACF adhesive, and the minimum spacing, the range of the first pad width and the second pad width is obtained based on the first and second conditions. Thus, the aforementioned pad bonding structure 100 can be designed to meet the requirements of the ACF material, optimizing the allowable deviation value in engineering while minimizing deviation and short-circuit problems.

[0062] Please refer to Figures 1 to 4 In one embodiment, the bonding pad structure 100 also satisfies a third condition: A = H * {Min(W1, W2) - [Max(S1, S2) - L1]}, and H * Min(W1, W2) ≥ A, where A is the overlap area between the first pad 10 and the second pad 20. Figure 1 The shaded area in the image.

[0063] Step S30, which obtains the range of the first pad width and the range of the second pad width based on the first and second conditions, includes:

[0064] Step S31: Set the width of the first pad to be greater than or equal to the width of the second pad.

[0065] Assume W1≥W2, then S1≤S2. In this case, the second condition is: S1≥L1≥X*S1≥L2.

[0066] Optionally, the first pad 10 is a recipient material pad and the second pad 20 is a donor material pad. Typically, the width of the recipient material pad is greater than or equal to the width of the donor material pad. Of course, in other embodiments, the width of the second pad may also be greater than or equal to the width of the first pad.

[0067] Step S32: Calculate the minimum and maximum widths of the first pad based on the first and second conditions.

[0068] Specifically, firstly, based on the first and second conditions, we obtain the fourth condition: L1≥X*(P-W1).

[0069] Secondly, the minimum width of the first pad is calculated based on the fourth condition. In the fourth condition, L1 is taken as the minimum spacing value required by the ACF adhesive, and only W1 is unknown. Thus, the minimum width W1 of the first pad can be obtained through the fourth condition.

[0070] Next, the minimum value of the first spacing is obtained according to the second condition, and the maximum value of the first pad width is calculated according to the first condition. The second condition stipulates that S1≥L1, where L1 is the minimum spacing value required by the ACF adhesive, thus obtaining the minimum value of the first pad spacing, and then obtaining the maximum value of the first pad width according to the first condition.

[0071] Step S33: Based on the third condition and the minimum width of the first pad, calculate the maximum width of the second pad.

[0072] Since W1≥W2 is set, according to the third condition, we get A=H*{Min(W1,W2)-[Max(S1,S2)-L1]}=H*(W1+W2+LP). Therefore, based on the third condition and the minimum width of the first pad, the maximum width of the second pad can be calculated.

[0073] Step S34: Based on the overlap height of the first pad 10 and the second pad 20 and the minimum overlap area required by the ACF adhesive, calculate the minimum width of the second pad.

[0074] Specifically, based on H*W2≥A, we can obtain W2≥A / H, and then calculate the minimum value of the second pad width.

[0075] Through the above steps, the minimum and maximum values ​​of the first pad width and the second pad width are obtained, thus obtaining the range of the first pad width and the second pad width. Correspondingly, based on the first condition, the range of the first pad spacing and the second pad spacing are obtained. Of course, the steps for calculating the range of the first pad width and the second pad width are not limited to this, as long as the above first to third conditions are met.

[0076] In some embodiments, the allowable offset value between the first pad 10 and the second pad 20 satisfies the fifth condition: Y = 1 / 2|W1-W2|+[Min(S1,S2)-L1], where Y is the allowable offset value between the first pad 10 and the second pad 20. In other embodiments, the 1 / 2 in the fifth condition can also be adjusted according to engineering requirements.

[0077] After obtaining the range of the first pad width and the range of the second pad width in step S30, the design method of the bonding pad structure further includes: calculating the maximum value of the allowable offset value based on the range of the first pad width, the range of the second pad width and the fifth condition, and obtaining the values ​​of the first pad width and the second pad width when the allowable offset value is at its maximum value.

[0078] For example, by obtaining the following values ​​through step S230: 200≤W1≤250um, 50≤W2≤100um, then Y≤100um. Therefore, the maximum allowable offset value is 100um. Furthermore, when W1=200um and W2=100um, Y=100um can be satisfied.

[0079] By adopting the above technical solution, the design method provided in this application can calculate the theoretical maximum offset value in engineering based on the requirements of ACF material, and obtain the optimal values ​​of the first pad 10 and the second pad 20 while achieving the theoretical maximum offset value. Thus, the above design method improves process freedom and effectively avoids offset and short circuit phenomena in the bonding process.

[0080] In some embodiments, the preset coefficient X is 1 / 2, that is, the second condition is:

[0081] Min(S1, S2)≥L1≥1 / 2Min(S1, S2)≥L2.

[0082] Furthermore, let W1≥W2, and the second condition be: S1≥L1≥1 / 2*S1≥L2.

[0083] The fifth condition is:

[0084] Y=1 / 2|W1-W2|+[Min(S1, S2)-L1]=PL-1 / 2(W1+W2).

[0085] The minimum overlap area required for ACF adhesive is A, the minimum spacing is L2, the center distance between pads is P, and the overlap height is H.

[0086] Based on this, the following examples illustrate the above design method.

[0087] In one embodiment, A ≥ 150000 μm 2 , L2≥50um; P=300um, H=1500um.

[0088] According to the second condition, the bonding pad structure 100 needs to satisfy: L≥1 / 2(P-W1), and according to the third condition, the bonding pad structure 100 needs to satisfy:

[0089] A=H*{W2-[(P-W1)-L]}=H*(W1+W2+LP).

[0090] In step S230, A is set to 100000um. 2 L = 50um.

[0091] Based on the above condition L≥1 / 2P-W1), we get W1≥200um;

[0092] Based on the above condition A=H*(W1+W2+LP), we get W1+W2≤300um, then W2≤100um;

[0093] Based on the second condition, S1≥L2, we get S≥50um, then W1≤250;

[0094] According to the third condition, H*W2≥100000, W2≥50um.

[0095] Thus, the width range of the first pad is: 200≤W1≤250um, and the width range of the second pad is: 50≤W2≤100um.

[0096] When 200≤W1≤250um and 50≤W2≤100um, Y≤100um can be satisfied. Generally, taking W1=200um and W2=100um, Y=100um can be satisfied.

[0097] In another embodiment, A ≥ 150000 μm2 , L≥50um; P=300um, H=1500um.

[0098] In step S230, A is set to 150000um. 2 L2 = 50um.

[0099] Based on the above condition L≥1 / 2(P-W1), we get W1≥200um;

[0100] Based on the above condition A=H*(W1+W2+LP), we get W1+W2≤350um, then W2≤150um;

[0101] Based on the second condition, S1≥L2, we get S1≥50um, W1≤250;

[0102] According to the third condition, H*W2≥100000, W2≥50um.

[0103] That is, when 200≤W1≤250um and 50≤W2≤100um, Y≤100um can be satisfied. Generally, taking W1=200um and W2=100um, Y=100um can be satisfied.

[0104] A second aspect of this application provides a bonding pad structure 100, including a plurality of first pads 10 arranged in sequence and a plurality of second pads 20 arranged in sequence, and ACF adhesive disposed between the first pads 10 and the corresponding second pads 20.

[0105] The bonding pad structure 100 satisfies the first and second conditions.

[0106] The first condition is: P = W1 + S1 = W2 + S2, where P is the center distance between pads, W1 and W2 are the widths of the first and second pads respectively, and S1 and S2 are the spacing between the first and second pads respectively.

[0107] The second condition is: Min(S1, S2)≥L1≥X*Min(S1, S2)≥L2, where X is a preset coefficient, L1 is the distance between the second pad 20 and the adjacent first pad 10, and L2 is the minimum distance between the second pad 20 and the adjacent first pad 10 required by the ACF adhesive.

[0108] The bonding pad structure 100 provided in this application is designed and manufactured according to the design method of the bonding pad structure 100 provided in the first aspect. The bonding pad structure 100 satisfies the first and second conditions mentioned above and is designed according to the characteristic requirements of ACF adhesive. Under the condition of satisfying the ACF characteristic requirements, the allowable deviation value in engineering can be improved to the optimal state, and the deviation and short circuit problems can be reduced to the minimum.

[0109] In some embodiments, the bonding pad structure 100 also satisfies a third condition:

[0110] A = H * {Min(W1, W2) - [Max(S1, S2) - L1]}, and simultaneously

[0111] H*Min(W1, W2)≥A; where A is the overlap area between the first pad 10 and the second pad 20.

[0112] Thus, the bonding pad structure 100 can meet the ACF characteristic requirements for minimum overlap area and reduce bonding misalignment.

[0113] The allowable offset value between the first pad 10 and the second pad 20 satisfies the fifth condition:

[0114] Y=1 / 2|W1-W2|+[Min(S1, S2)-L1].

[0115] By adopting the above technical solution, the bonding pad structure 100 provided in this application can obtain the maximum allowable offset value, which improves the degree of freedom of the bonding process and reduces the difficulty of bonding.

[0116] In some embodiments, the preset coefficient is 1 / 2. That is, the second condition is: Min(S1, S2) ≥ L1 ≥ X*Min(S1, S2) ≥ L2. By setting the preset coefficient to 1 / 2, the bonding pad structure 100 can be adapted to engineering requirements and is easier to manufacture.

[0117] It's understandable that the preset coefficients are engineering requirements and can be adjusted based on process capabilities and needs.

[0118] The bonding pad structure 100 provided in this application is applicable to COG (chip on glass), COF (chip on film), FOG (film on glass), FOB (film on board) and other bonding processes in the panel industry.

[0119] A third aspect of this application provides a display device including a bonding pad structure 100 as described in the second aspect.

[0120] Optionally, the first pad 10 in the bonding pad structure 100 is disposed on the recipient material and the second pad 20 is disposed on the donor material. For example, the recipient material is a display panel or a touch panel, and the donor material is an IC, FPC or PCB, but is not limited thereto.

[0121] The aforementioned display device includes a bonding pad structure 100, which can reduce misalignment and short circuit problems and improve product yield.

[0122] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A design method for a bonding pad structure, the bonding pad structure comprising a plurality of first pads arranged in sequence, a plurality of second pads arranged in sequence, and ACF adhesive disposed between the first pads and corresponding second pads, characterized in that, The design method includes: The bonding pad structure is set to satisfy the first condition: P = W1 + S1 = W2 + S2, where P is the center distance between pads, W1 and W2 are the widths of the first pad and the second pad, respectively, and S1 and S2 are the spacing between the first pad and the second pad, respectively. The bonding pad structure is set to satisfy the second condition: Min(S1, S2)≥L1≥X*Min(S1, S2)≥L2, where X is a preset coefficient, L1 is the distance between the second pad and the adjacent first pad, and L2 is the minimum distance between the second pad and the adjacent first pad required by the ACF adhesive. The bonding pad structure satisfies the third condition: A = H * {Min(W1, W2) - [Max(S1, S2) - L1]}, and H * Min(W1, W2) ≥ A, where A is the overlap area between the first pad and the second pad; Obtain the center distance between the pads, the overlap height between the first pad and the second pad, the minimum overlap area and minimum spacing required by the ACF adhesive, and obtain the range of the width of the first pad and the range of the width of the second pad based on the first condition and the second condition. The process of obtaining the range of the width of the first pad and the range of the width of the second pad based on the first and second conditions includes: setting the width of the first pad to be greater than or equal to the width of the second pad; calculating the minimum and maximum values ​​of the width of the first pad based on the first and second conditions; calculating the maximum value of the width of the second pad based on the third condition and the minimum value of the width of the first pad; and calculating the minimum value of the width of the second pad based on the overlap height between the first and second pads and the minimum overlap area required by the ACF adhesive. Based on the first condition and the second condition, the minimum and maximum values ​​of the width of the first pad are calculated, including: obtaining a fourth condition based on the first condition and the second condition: L1≥X*(P-W1); calculating the minimum value of the width of the first pad based on the fourth condition; obtaining the minimum value of the spacing between the first pads based on the second condition, and calculating the maximum value of the width of the first pad based on the first condition.

2. The design method of the bonding pad structure as described in claim 1, characterized in that, The allowable offset between the first pad and the second pad satisfies the fifth condition: Y=1 / 2|W1-W2|+[Min(S1, S2)-L1]; After obtaining the range of the first pad width and the range of the second pad width, the design method further includes: Based on the range of the width of the first pad, the range of the width of the second pad, and the fifth condition, calculate the maximum value of the allowable offset value, and obtain the values ​​of the width of the first pad and the width of the second pad when the allowable offset value is at its maximum value.

3. The design method for the bonding pad structure as described in claim 1, characterized in that, The preset coefficient is 1 / 2.

4. A bonding pad structure, comprising a plurality of first pads arranged in sequence and a plurality of second pads arranged in sequence, and ACF adhesive disposed between the first pads and the corresponding second pads, characterized in that: The bonding pad structure is obtained according to the design method of the bonding pad structure according to any one of claims 1-3, and the bonding pad structure satisfies: First condition: P = W1 + S1 = W2 + S2, where P is the center distance between pads, W1 and W2 are the widths of the first and second pads respectively, and S1 and S2 are the spacing between the first and second pads respectively. Second condition: Min(S1, S2)≥L1≥X*Min(S1, S2)≥L2, where X is a preset coefficient, L1 is the distance between the second pad and the adjacent first pad, and L2 is the minimum distance between the second pad and the adjacent first pad required by the ACF adhesive.

5. The bonding pad structure as described in claim 4, characterized in that, The bonding pad structure also satisfies a third condition: A = H * {Min(W1, W2) - [Max(S1, S2) - L1]}, and simultaneously H*Min(W1, W2)≥A; Where A is the overlap area between the first pad and the second pad.

6. The bonding pad structure as described in claim 4, characterized in that, The allowable offset value between the first pad and the second pad satisfies the fifth condition: Y = 1 / 2|W1-W2|+[Min(S1,S2)-L1].

7. The bonding pad structure as described in claim 4, characterized in that, The preset coefficient is 1 / 2.

8. A display device comprising a bonding pad structure as described in any one of claims 4-7.

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