Silicon rod cutting and grinding all-in-one machine and silicon rod cutting and grinding method

Abstract

This application discloses a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. The silicon rod cutting and grinding integrated machine integrates a cutting device and a grinding device. It can use a silicon rod conversion device to orderly and seamlessly convert silicon rods in a horizontally placed manner between various functional areas. The cutting device corresponding to the cutting area performs a cutting operation on the horizontally placed first silicon rod to form a second silicon rod with a rectangular cross-section. The grinding device corresponding to the grinding area performs a grinding operation on the squared second silicon rod, thereby completing the integrated operation of multiple processes such as silicon rod cutting, squared and grinding, improving production efficiency and product processing quality.

Description

Technical Field

[0001] This application relates to the field of silicon workpiece processing technology, and in particular to a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. Background Technology

[0002] Currently, with increasing societal emphasis on and openness to the use of green and renewable energy, the photovoltaic solar power generation field is receiving more and more attention and development. In the photovoltaic power generation field, typical crystalline silicon solar cells are manufactured on high-quality silicon wafers, which are cut from pulled or cast silicon ingots using a multi-wire saw and subsequent processing.

[0003] The existing silicon wafer manufacturing process, taking monocrystalline silicon products as an example, generally includes the following steps: First, a silicon rod cutting machine is used to cut the original long silicon rod into multiple short silicon rods; after cutting, a silicon rod squaring machine is used to square the cut short silicon rods to form silicon rods with (quasi-)rectangular cross-sections; then, each squared silicon rod is ground, chamfered / rounded, etc., to make the surface of the silicon rod achieve the corresponding flatness and dimensional tolerance requirements; finally, a slicing machine is used to slice the silicon rods to obtain silicon wafers.

[0004] However, in general, in related technologies, the operations required for each process (such as cutting and squaring, grinding, chamfering / rounding, etc.) are arranged independently. The corresponding processing equipment is scattered in different production units or production workshops or different production areas of production workshops. The conversion of workpieces to perform different processes requires handling and allocation. Moreover, pre-processing work (such as clamping, alignment, etc.) may be required before each process. Thus, the process is complicated, inefficient, and easily affects the quality of silicon rod processing. More manpower or transfer equipment is required, and there are significant safety hazards. In addition, there are many flow links between the operation equipment of each process, which increases the risk of workpiece damage during workpiece transfer and easily leads to non-production factors causing defects. This reduces the product qualification rate and the unreasonable losses caused by the existing processing methods, which is a major improvement issue faced by various companies. Summary of the Invention

[0005] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to disclose a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method, so as to solve the problems of low efficiency between various processes and poor silicon rod processing effect in the existing related technologies.

[0006] To achieve the above and other related objectives, the first aspect of this application discloses a silicon rod cutting and grinding integrated machine, comprising:

[0007] A base having a silicon rod processing platform; the silicon rod processing platform includes at least one cutting area and at least one grinding area;

[0008] A silicon rod conversion device is provided on the silicon rod processing platform of the machine base, including a conversion body, a plurality of silicon rod clamps provided on the conversion body, and a conversion drive mechanism. The silicon rod clamps are used to hold silicon rods and make the axis of the held silicon rods aligned with the horizontal line. The conversion drive mechanism is used to drive the plurality of silicon rod clamps and the silicon rods they hold to change positions in at least one cutting area and at least one grinding area.

[0009] At least one cutting device, disposed at at least one corresponding cutting area, is used to cut the silicon rod to be cut held by the silicon rod clamp located at the corresponding cutting area in the silicon rod conversion device, so that the silicon rod to be cut, which has a circular cross-section, is transformed into a square-cut silicon rod with a rectangular cross-section after the cutting operation; and

[0010] At least one grinding device is provided at at least one corresponding grinding area for grinding the squared silicon rod held by the silicon rod clamp located at the corresponding grinding area in the silicon rod conversion device.

[0011] In some embodiments of the first aspect of this application, the silicon rod processing platform includes a cutting area and a grinding area, wherein the cutting area is provided with a cutting device and the grinding area is provided with a grinding device.

[0012] In some embodiments of the first aspect of this application, the silicon rod processing platform includes two cutting zones and a grinding zone, wherein each cutting zone is provided with a cutting device and each grinding zone is provided with a grinding device.

[0013] In some embodiments of the first aspect of this application, the silicon rod processing platform includes a cutting area and two grinding areas, wherein each cutting area is provided with a cutting device and each grinding area is provided with a grinding device.

[0014] In some embodiments of the first aspect of this application, the cutting device includes: a cutting mounting structure disposed on the base and corresponding to a cutting area; a cutting unit disposed on the cutting mounting structure; the cutting unit includes a cutting wire frame disposed on the cutting mounting structure, a plurality of cutting wheels disposed on the cutting wire frame, and a cutting wire, the cutting wire being sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw; a cutting travel mechanism for driving the cutting mounting structure and the cutting unit thereon to move along a cutting direction so that at least one cutting wire saw in the cutting unit performs a cutting operation on the silicon rod to be cut at the cutting area; the cutting direction is consistent with the axis of the silicon rod to be cut held by the silicon rod clamp located at the corresponding cutting area in the silicon rod conversion device.

[0015] In some embodiments of the first aspect of this application, the cutting unit includes two parallel wire saws for cutting the silicon rod to be cut held by the silicon rod clamp located at the corresponding cutting area in the silicon rod conversion device to form two parallel side cut surfaces.

[0016] In some embodiments of the first aspect of this application, the cutting device further includes a cutting advance and retreat mechanism for driving the cutting wire frame and the cutting wire saw thereon to move along the cutting advance and retreat direction relative to the cutting mounting structure, the cutting advance and retreat direction being perpendicular to the cutting direction.

[0017] In some embodiments of the first aspect of this application, the cutting device further includes a distance adjustment mechanism for adjusting the cutting position of at least one wire saw in the cutting unit, or changing the cutting groove of the cutting wire wound around the multiple cutting wheels in the cutting unit.

[0018] In some embodiments of the first aspect of this application, the cutting unit includes two intersecting wire saws for cutting a silicon rod held by a silicon rod clamp located at a corresponding cutting zone in the silicon rod conversion device to form two intersecting side cut surfaces.

[0019] In some embodiments of the first aspect of this application, the cutting device further includes a cutting advance and retreat mechanism for driving the cutting wire frame and the cutting wire saws thereon to move along the cutting advance and retreat direction within the cutting mounting structure, so as to adjust the cutting position of the two intersecting cutting wire saws in the cutting unit; the cutting advance and retreat direction is perpendicular to the cutting direction.

[0020] In some embodiments of the first aspect of this application, the silicon rod cutting and grinding integrated machine further includes a take-up and unwinding unit corresponding to the cutting unit.

[0021] In some embodiments of the first aspect of this application, the cutting line is wound around the plurality of cutting wheels to form a closed-loop cutting line that is connected end to end.

[0022] In some embodiments of the first aspect of this application, the silicon rod cutting and grinding integrated machine further includes an edge unloading device for unloading the edge generated after the wire cutting device performs the cutting operation on the silicon rod to be cut held by the silicon rod clamp.

[0023] In some embodiments of the first aspect of this application, the grinding apparatus includes: a grinding wheel mounting structure disposed on the base and corresponding to a grinding area; at least one pair of grinding wheels disposed opposite to each other on the grinding wheel mounting structure; a grinding space formed between the at least one pair of grinding wheels; a grinding wheel traveling mechanism for driving the at least one pair of grinding wheels to move along a grinding direction so that the at least one pair of grinding wheels can perform grinding operations on a squared silicon rod at the grinding area; the grinding direction is consistent with the axis of the squared silicon rod held by the silicon rod clamp located at the corresponding grinding area in the silicon rod conversion device; and a grinding wheel advancing and retreating mechanism for driving at least one of the at least one pair of grinding wheels to move along a grinding advancing and retreating direction on the grinding wheel mounting structure, the grinding advancing and retreating direction being perpendicular to the grinding direction.

[0024] In some embodiments of the first aspect of this application, the grinding tool includes a rough grinding tool, a fine grinding tool, or a combination of a rough grinding tool and a fine grinding tool.

[0025] In some embodiments of the first aspect of this application, the grinding apparatus further includes at least one chamfering / rounding abrasive for chamfering or rounding the squared silicon rod at the grinding area.

[0026] In some embodiments of the first aspect of this application, the chamfering / rounding tool includes a coarse chamfering / rounding tool, a fine chamfering / rounding tool, or a combination of a coarse chamfering / rounding tool and a fine chamfering / rounding tool.

[0027] In some embodiments of the first aspect of this application, the silicon rod processing platform is further provided with a waiting area; the silicon rod cutting and grinding integrated machine further includes a silicon rod transfer device for loading the silicon rod to be processed into the waiting area or unloading the processed silicon rod from the waiting area.

[0028] This application discloses a silicon rod cutting and grinding method in a second aspect, applied in a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform. The silicon rod processing platform is provided with at least one cutting area and at least one grinding area. The silicon rod cutting and grinding integrated machine also includes at least one cutting device, at least one grinding device, and a silicon rod conversion device. The silicon rod cutting and grinding method includes the following steps:

[0029] The silicon ingot conversion device converts the silicon ingot to at least one cutting area, and the at least one cutting device performs a cutting operation on the silicon ingot to be cut at the corresponding cutting area, so that the silicon ingot to be cut with a circular cross-section is transformed into a square-cut silicon ingot with a rectangular cross-section after the cutting operation; and

[0030] The silicon rod conversion device is rotated by a preset angle to convert the squared silicon rod from at least one cutting area to at least one grinding area, and the at least one grinding device performs grinding operations on the squared silicon rod in the corresponding grinding area.

[0031] The silicon rod cutting and grinding integrated machine and method disclosed in this application combine a cutting device and a grinding device. The silicon rod conversion device can convert the silicon rod horizontally between various functional areas in an orderly and seamless manner. The cutting device corresponding to the cutting area cuts the horizontally placed silicon rod to form a silicon rod with a rectangular cross-section. The grinding device corresponding to the grinding area grinds the cut silicon rod, thereby completing the integrated operation of silicon rod cutting, squaring and grinding, improving production efficiency and product processing quality. Attached Figure Description

[0032] The specific features of the invention involved in this application are shown in the appended claims. The features and advantages of the invention can be better understood by referring to the exemplary embodiments and drawings described in detail below. A brief description of the drawings is as follows:

[0033] Figure 1 The diagram shown is a structural schematic of one embodiment of the silicon rod cutting and grinding machine of this application.

[0034] Figure 2 The image shown is a top view of one embodiment of the silicon rod cutting and grinding machine of this application.

[0035] Figure 3 The diagram shows a partial structural schematic of the silicon rod clamp in the silicon rod cutting and grinding machine.

[0036] Figure 4 The diagram shown is a structural schematic of the silicon rod cutting and grinding machine of this application in another embodiment.

[0037] Figure 5 and Figure 6 The diagram shown is a structural schematic of the silicon rod cutting and grinding integrated machine of this application in yet another embodiment.

[0038] Figure 7 The diagram shown is a structural schematic of the silicon rod cutting and grinding machine of this application in another embodiment.

[0039] Figure 8 The image shown is a side view of one embodiment of the chamfering / rounding device of the silicon rod cutting and grinding machine described in this application.

[0040] Figure 9 The image shown is a side view of the chamfering / rounding device of the silicon rod cutting and grinding machine of this application in yet another embodiment. Detailed Implementation

[0041] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0042] In the following description, reference is made to the accompanying drawings, which illustrate several embodiments of the present application. It should be understood that other embodiments may also be used, and changes in mechanical composition, structure, electrical, and operation may be made without departing from the spirit and scope of this disclosure. The following detailed description should not be considered limiting, and the scope of the embodiments of the present application is defined only by the claims of the published patents. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present application. Spatially related terms, such as “upper,” “lower,” “left,” “right,” “below,” “below,” “lower part,” “above,” “upper part,” etc., may be used herein to illustrate the relationship between one element or feature shown in the figures and another element or feature.

[0043] While the terms first, second, etc., are used in some instances herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are used only to distinguish one element or parameter from another. For example, a first direction may be referred to as a second direction, and similarly, a second direction may be referred to as a first direction, without departing from the scope of the various described embodiments.

[0044] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, step, operation, element, component, item, kind, and / or group, but do not preclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are to be interpreted inclusively, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition occur only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

[0045] The relevant processing techniques for silicon rods involve several steps, such as cutting and squaring, grinding, and chamfering.

[0046] Generally, most existing silicon rods are cylindrical in shape. By using a silicon rod squaring device, the silicon rod is cut into a rectangular (or square) cross-section after squaring, and the overall shape of the cut silicon rod is roughly cuboid (or cubic). The rectangular shape includes rectangles with adjacent sides orthogonal or within a predetermined angle, rectangles with rounded corners between adjacent sides, and rectangles with connecting short sides between adjacent sides, etc.

[0047] Taking monocrystalline silicon rods as an example, in some related technologies, the process of forming monocrystalline silicon rods may include: first, using a silicon rod cutting machine to cut the original long silicon rod into multiple short silicon rod segments; after cutting, using a silicon rod squaring machine to square the short silicon rods to form monocrystalline silicon rods with a rectangular cross-section. The specific implementation of using a silicon rod cutting machine to cut the original long silicon rod into multiple short silicon rod segments can be found in patent publications such as CN105856445A, CN105946127A, and CN105196A. The specific implementation of using a silicon rod squaring machine to square the short silicon rods to form monocrystalline silicon rods with a rectangular cross-section can be found in patent publications such as CN105818285A. However, the formation process of monocrystalline silicon rods is not limited to the aforementioned technologies. In optional examples, the formation process of monocrystalline silicon rods may also include: first, using a full silicon rod squaring machine to square the original long silicon rod to form a long monocrystalline silicon rod with a rectangular cross-section; after squaring, using a silicon rod cutting machine to cut the squared long monocrystalline silicon rod to form a short-crystal silicon rod. For a detailed implementation of using a full silicon rod squaring machine to square the original long silicon rod to form a rectangular long monocrystalline silicon rod, please refer to, for example, patent publications such as CN003443A.

[0048] After a cylindrical single-crystal silicon rod is cut into a rectangular shape using a squaring device, a grinding device can be used to perform operations such as grinding, chamfering (or rounding) on ​​the rectangular silicon rod. For specific implementation methods of grinding, chamfering (or rounding) the rectangular silicon rod using the aforementioned grinding device, please refer to, for example, patent publications such as CN105835247A.

[0049] The inventors of this application have discovered that in the relevant processing technology for silicon rods, the processing devices involved, such as cutting and squaring, grinding (e.g., surface grinding, chamfering, etc.), are scattered and arranged independently. The conversion of silicon rods performing different processes requires handling, allocation, and pre-processing, which results in problems such as complicated processes and low efficiency.

[0050] In view of this, the applicant has proposed a silicon rod cutting machine that integrates the cutting device and the grinding device, such as patent publications CN212218917U and CN211492322U. In these technical solutions, the silicon rod to be processed is in a vertical manner, that is, the axis of the silicon rod is aligned with the plumb line.

[0051] In view of this, this application proposes a silicon rod cutting and grinding integrated machine, including a machine base, a silicon rod conversion device, at least one cutting device, and at least one grinding device. The machine base has a silicon rod processing platform, which includes at least one cutting area and at least one grinding area. The silicon rod conversion device includes a conversion body, multiple silicon rod clamps disposed on the conversion body, and a conversion drive mechanism. The silicon rod clamps are used to hold silicon rods and make the axis of the held silicon rods aligned with the horizontal line. The conversion drive mechanism is used to drive the multiple silicon rod clamps and the silicon rods they hold to change positions in the cutting area and the grinding area. The cutting device is used to cut the silicon rods held by the silicon rod clamps located in the corresponding cutting area of ​​the silicon rod conversion device to form silicon rods with a rectangular cross-section. The grinding device is used to grind the silicon rods held by the silicon rod clamps located in the corresponding grinding area of ​​the silicon rod conversion device, thereby completing the integrated operation of multiple processes such as silicon rod cutting, squaring, and grinding, improving production efficiency and product processing quality.

[0052] The silicon rod cutting and grinding integrated machine of this application is used for integrated operation of multiple processes such as cutting, squaring and grinding of silicon rods. In the embodiments, the silicon rod may be, for example, a monocrystalline silicon rod, which is a rod-shaped monocrystalline silicon rod grown from melt using the Czochralski method or the floating zone melting method.

[0053] In the embodiments provided in this application, in order to clarify the definition of direction and the way different structures operate, a three-dimensional space is defined by a first direction, a second direction, and a third direction. The first direction, the second direction, and the third direction are all straight lines and are perpendicular to each other. The first direction and the second direction can form a horizontal plane, and the third direction is a vertical direction that is perpendicular to the horizontal plane. It can also be called a vertical direction, an up-down direction, or a rising-falling direction.

[0054] In any embodiment provided in this application, the end faces of the silicon rod refer to two opposite faces along the length of the silicon rod. For example, for a silicon rod to be cut, its two end faces are circular or near-circular, and the sides of the silicon rod are curved; for a silicon rod that has been cut into a square, its two end faces are rectangular or near-rectangular, and the sides of the silicon rod are the four sides of the silicon rod that are usually rectangular along its length.

[0055] Please see Figure 1 The image shown is a schematic diagram of the silicon rod cutting and grinding integrated machine in one embodiment of this application. Figure 2 The image shown is a top view of one embodiment of the silicon rod cutting and grinding machine of this application.

[0056] The silicon rod cutting and grinding integrated machine of this application is used for cutting and grinding silicon rods with a circular cross-section. The silicon rod can be, for example, a monocrystalline silicon rod or a polycrystalline silicon rod. Taking a monocrystalline silicon rod as an example, the monocrystalline silicon rod is obtained by cutting a raw silicon rod and then squaring it using a silicon rod squaring device. The raw silicon rod is usually a rod-shaped monocrystalline silicon rod grown from a melt using the Czochralski method or the floating zone melting method.

[0057] like Figure 1 and Figure 2 As shown, an embodiment of this application discloses a silicon rod cutting and grinding integrated machine, including: a base 11, a silicon rod conversion device 12, a cutting device 13, and a grinding device 14.

[0058] The base, as the main component of the silicon rod slicing and grinding machine, provides a silicon rod processing platform. In some examples, the base is relatively large in size and weight to provide a large mounting surface and robust overall machine stability. It should be understood that the base can serve as a seat for different structures or components performing processing operations within the silicon rod slicing and grinding machine, and the specific structure of the base can be modified based on different functional or structural requirements. In some examples, the base includes fixing or limiting structures for supporting different components within the silicon rod slicing and grinding machine, such as bases, rods, columns, and frames, all of which are types of bases described in this application.

[0059] Meanwhile, in some examples, the base may be an integral base, while in other examples, the base may include multiple independent bases.

[0060] The machine base has a silicon rod processing platform, which can be divided into multiple functional areas according to the specific work content of the silicon rod processing operation. For example, the silicon rod processing platform includes at least a cutting area and a grinding area. It should be noted that in the examples provided in this application, the functional areas are defined by the travel path and range of the processing device at the functional area. For example, the cutting device of the silicon rod cutting and grinding integrated machine is located at the cutting area, and the range of the cutting area is the range occupied by the cutting device during the cutting and squaring operation; similarly, the grinding device of the silicon rod cutting and grinding integrated machine is located at the grinding area, and the range of the grinding area is the range occupied by the grinding device during the grinding operation. The shape of the silicon rod processing platform can be determined based on the machine base, or it can be determined jointly based on the processing needs of the machine base, the cutting device, and the grinding device. Figure 1 and Figure 2In the illustrated embodiment, the base 11 has a silicon rod processing platform, which includes a cutting area and a grinding area. A cutting device 13 is provided in the cutting area for cutting the silicon rod to be cut into a rectangular cross-section. A grinding device 14 is provided in the grinding area for grinding the already cut silicon rod.

[0061] The silicon rod transfer device is located on the silicon rod processing platform of the machine base and is used to transfer silicon rods. For example, the silicon rod transfer device can be used to change the position of the silicon rod between the cutting area and the grinding area. Figure 1 and Figure 2 In the illustrated embodiment, the silicon rod conversion device 12 further includes a conversion body 121, a plurality of silicon rod clamps 122 disposed on the conversion body 121, and a conversion drive mechanism (not shown in the figures). The clamping center lines of the plurality of silicon rod clamps 122 disposed on the conversion body 121 are aligned with the horizontal line. It should be understood that, under this configuration, the silicon rods clamped by the silicon rod clamps 122 are in a horizontal position.

[0062] The conversion body can be located in the central area of ​​the silicon rod processing platform, and each side of the conversion body can serve as a mounting surface for mounting multiple silicon rod clamps. Figure 1 and Figure 2 In the illustrated embodiment, silicon rod clamps 122 are mounted on each side of the conversion body 121. Specifically, the conversion body can be disc-shaped, annular, square-shaped, or other similar in shape. The number of silicon rod clamps on the conversion body can vary depending on the layout of the silicon rod cutting and grinding machine.

[0063] The conversion body is driven by a conversion drive mechanism to switch the silicon rod clamps mounted on it between different functional areas. This allows the silicon rods held by the clamps to change positions between different functional areas, enabling different processing steps such as cutting and squaring, and grinding. Simultaneously, multiple silicon rod clamps mounted on the conversion body can be positioned in different functional areas. Thus, at the same time, silicon rods held by different clamps can undergo corresponding processing steps in different functional areas. For example, the cutting and grinding devices in the integrated silicon rod cutting and grinding machine can be operating simultaneously, which improves processing efficiency.

[0064] For example, in some embodiments, the silicon rod processing platform may include two functional areas, such as a first functional area and a second functional area. To adapt to these functional areas, the number of silicon rod clamps on the conversion body may be set to two, each clamping at least one silicon rod. Furthermore, the angle between the two silicon rod clamps is consistent with the angular distribution between the two functional areas. Thus, when one silicon rod clamp corresponds to one functional area, the other silicon rod clamp necessarily corresponds to the other functional area. In this way, during assembly line operations, at any given time, when each silicon rod clamp holds at least one silicon rod and the clamp corresponds to a functional area, these silicon rods are located at the corresponding functional area and performing a corresponding processing operation. For example, a first processing operation can be performed on the silicon rod located in the first functional area, and a second processing operation can be performed on the silicon rod located in the second functional area.

[0065] In some embodiments, the silicon rod processing platform may include three functional areas, such as a first functional area, a second functional area, and a third functional area; or two first functional areas and a second functional area; or one first functional area and two second functional areas. To accommodate these functional areas, the number of silicon rod clamps on the conversion body may be set to three, each clamping at least one silicon rod. Furthermore, the angles between any two of the three silicon rod clamps correspond to the angular distribution between any two of the three functional areas. Thus, when one silicon rod clamp corresponds to one functional area, the other two silicon rod clamps necessarily correspond to the other two functional areas. Thus, in the assembly line operation, at any given moment, when each silicon rod clamp holds at least one silicon rod and the silicon rod clamp corresponds to a functional area, these silicon rods are performing a corresponding processing operation at that functional area. For example, a first processing operation can be performed on the silicon rod located in the first functional area, a second processing operation can be performed on the silicon rod located in the second functional area, and a third processing operation can be performed on the silicon rod located in the third functional area; or, a first processing operation can be performed on the silicon rod located in two first functional areas, and a second processing operation can be performed on the silicon rod located in one second functional area; or, a first processing operation can be performed on the silicon rod located in one first functional area, and a second processing operation can be performed on the silicon rod located in two second functional areas. In an optional example, the first, second, and third functional areas on the silicon rod processing platform are distributed at 120° intervals between each pair. Therefore, correspondingly, the three silicon rod clamps on the conversion body are also distributed at 120° intervals between each pair. Of course, the number of silicon rod clamps can be varied according to actual needs and is not limited to this. For example, the number of silicon rod clamps can be determined according to the number of functional areas set up on the silicon rod processing platform.

[0066] In some embodiments, the silicon rod processing platform includes four functional areas, such as: a first functional area, a second functional area, a third functional area, and a fourth functional area; or two first functional areas and two second functional areas; or two first functional areas, a second functional area, and a third functional area; or a first functional area, two second functional areas, and a third functional area. To accommodate these functional areas, the number of silicon rod clamps on the conversion body can be set to four, each clamping at least one silicon rod. Furthermore, the angles between adjacent silicon rod clamps among these four clamps are consistent with the angular distribution between adjacent functional areas of the four functional areas. Thus, when a silicon rod clamp corresponds to a specific functional area, the other three silicon rod clamps necessarily correspond to the other three functional areas respectively. Thus, in the assembly line operation, at any given moment, when each silicon rod fixture holds at least one silicon rod and the fixture corresponds to a functional area, these silicon rods are located at their respective functional areas and performing corresponding processing operations. For example, a first processing operation can be performed on silicon rods located in the first functional area, a second processing operation can be performed on silicon rods located in the second functional area, a third processing operation can be performed on silicon rods located in the third functional area, and a fourth processing operation can be performed on silicon rods located in the fourth functional area; or, a processing operation can be performed on silicon rods located in two first functional areas. The silicon ingots in the four functional areas can undergo a first processing operation, and silicon ingots in two second functional areas can undergo a second processing operation; alternatively, silicon ingots in two first functional areas can undergo a first processing operation, silicon ingots in one second functional area can undergo a second processing operation, and silicon ingots in one third functional area can undergo a third processing operation; or, silicon ingots in one first functional area can undergo a first processing operation, silicon ingots in two second functional areas can undergo a second processing operation, and silicon ingots in one third functional area can undergo a third processing operation. In an optional embodiment, adjacent functional areas on the four functional areas of the silicon ingot processing platform are distributed at 90° intervals, and correspondingly, the four silicon ingot clamps on the transport body are also distributed at 90° intervals in pairs. Of course, the number of silicon ingot clamps can be varied according to actual needs and is not limited thereto; for example, the number of silicon ingot clamps can be determined according to the number of functional areas set on the silicon ingot processing platform.

[0067] In such Figure 1 and Figure 2In the illustrated embodiment, the silicon rod processing platform may include three functional areas, such as a waiting area, a cutting area, and a grinding area. These three functional areas are arranged at 120° intervals between each other; that is, the waiting area is 120° away from the cutting area, the cutting area is 120° away from the grinding area, and the grinding area is 120° away from the waiting area. Correspondingly, the conversion body 121 may be provided with three silicon rod clamps 122, which are arranged at 120° intervals between each other, and each silicon rod clamp 122 can hold at least one silicon rod. In a continuous production line, at any given moment, when one silicon rod clamp corresponds to a certain functional area, the other two silicon rod clamps correspond to the other two functional areas respectively. For example, when the first silicon rod clamp corresponds to the waiting area, the second silicon rod clamp corresponds to the cutting area and the third silicon rod clamp corresponds to the grinding area. In this way, the first silicon rod clamp can be controlled to load a new silicon rod or unload the silicon rod held by the first silicon rod clamp in the waiting area, the silicon rod held by the second silicon rod clamp can be cut in the cutting area, and the silicon rod held by the third silicon rod clamp can be ground in the grinding area.

[0068] The conversion drive mechanism (not shown in the figures) serves as the drive mechanism for changing the functional position of the silicon rod clamps on the conversion body. In some embodiments, the conversion drive mechanism includes a shifting shaft, so that by driving the shifting shaft to rotate by a preset angle, the conversion body and the various silicon rod clamps disposed on it can change positions between various functional areas. In some embodiments, the shifting shaft is located at the geometric center of the conversion body, and the shifting shaft is arranged in the vertical direction.

[0069] The transposition shaft is located in the vertical direction, meaning that during the conversion process, the height of the silicon rod clamps on the conversion body remains unchanged, and the height of the corresponding clamping center line of the silicon rod clamps also remains unchanged. Here, the multiple silicon rod clamps on the conversion body of the silicon rod cutting and grinding machine are configured such that their clamping center lines are located at the same horizontal height. During the controlled rotation of the conversion body, the horizontal height of the clamping center lines of the multiple silicon rod clamps remains unchanged. Thus, when any of the silicon rod clamps loads a silicon rod, adjusting the height of the silicon rod axis to the same predetermined height will align the silicon rod axis with the clamping center line in a third direction (i.e., the vertical direction). The predetermined height is the same horizontal height of the clamping center lines of the multiple silicon rod clamps.

[0070] Understandably, the fact that the clamping center lines of the multiple silicon rod clamps described in this application are at the same horizontal height does not mean that the clamping center lines of the multiple silicon rod clamps are limited to the same precise height range. In some embodiments, when the height difference between the corresponding clamping center lines of the multiple silicon rod clamps on the conversion body is within a preset range, it can be considered that the clamping center lines of the multiple silicon rod clamps are at the same horizontal height. Furthermore, setting the clamping center lines of the multiple silicon rod clamps to be at the same horizontal height is not merely an illustrative example. In other embodiments, the clamping center lines of the multiple silicon rod clamps may also be set to be at different horizontal heights.

[0071] In other embodiments, the height of the clamping centerline corresponding to the silicon rod clamp can also be obtained by the control system of the silicon rod cutting and grinding machine. Correspondingly, when loading the silicon rod to be processed, the height of the silicon rod axis is adjusted to the horizontal height corresponding to the silicon rod clamp.

[0072] The silicon rod clamp is used to clamp the two end faces of the silicon rod. Correspondingly, the silicon rod clamp naturally has two opposing clamping parts for contacting the pair of end faces of the silicon rod. The clamping center line is the line connecting the centers of the two contact surfaces at the two ends of the silicon rod corresponding to the two clamping parts. The center of the clamping part is not limited to the geometric center of the contact surface, but can also be a point on the contact surface that is set manually. In some embodiments provided in this application, the silicon rod clamp can also drive the silicon rod to rotate along the silicon rod axis. In this example, the clamping center line is the rotation axis direction of the clamping part. Usually, in actual processing scenarios, in order to keep the position (or height) of the silicon rod axis unchanged when the silicon rod is driven to rotate by the silicon rod clamp, when loading the silicon rod to be processed onto the silicon rod clamp, it is usually necessary to align (i.e., coincide) the clamping center line of the silicon rod clamp with the silicon rod axis.

[0073] As mentioned earlier, the transposition shaft rotates by a preset angle after being controlled, causing the conversion body and its various silicon rod clamps to switch positions between different functional areas. Therefore, the conversion drive mechanism also includes a transposition drive unit for driving the transposition shaft to rotate. The transposition drive unit drives the transposition shaft to rotate by a preset angle to drive the multiple silicon rod clamps to perform conversion actions.

[0074] In some implementations, the shifting drive unit may include a driving gear, a drive source, and a driven gear, wherein the driving gear is shaft-connected to the drive source, and the driven gear meshes with the driving gear and is connected to the shifting shaft. In some implementations, the shifting drive unit may include a drive source directly associated with the shifting shaft. The power source may, for example, be a servo motor.

[0075] In practical applications, the aforementioned shifting drive unit, including a drive gear, a drive source, and a driven gear, will be used as an example for explanation. In some embodiments, the functional areas are arranged linearly in sequence. The drive source drives the drive gear to rotate forward. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft rotate forward by a preset angle. This causes the position of the conversion body and its various silicon rod clamps to switch from the current functional area to an adjacent next functional area or other subsequent functional areas. Alternatively, the drive source can drive the drive gear to rotate in the opposite direction. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft rotate forward by a preset angle. This causes the conversion body and its various silicon rod clamps to switch from the current functional area to an adjacent previous functional area or other previous functional areas. In some embodiments, the functional areas are arranged in a ring in sequence. The drive source drives the drive gear to rotate forward. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft are driven to rotate forward by a preset angle. This causes the position of the conversion body and its various silicon rod clamps to switch from the current functional area to the next adjacent functional area, other subsequent functional areas, other previous functional areas, or the next adjacent functional area. Alternatively, the drive source can drive the drive gear to rotate in the opposite direction. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft are driven to rotate forward by a preset angle. This causes the conversion body and its various silicon rod clamps to switch from the current functional area to the previous adjacent functional area, other previous functional areas, other subsequent functional areas, or the next adjacent functional area.

[0076] exist Figure 1 and Figure 2In the illustrated embodiment, the functional areas are arranged in a ring in sequence. For example, taking the difference between two adjacent functional areas as 120° (or 45°, 60°, 72°, 90°, 150°, 180° or other preset angles), suppose that in one case, in the initial state, a silicon rod clamp in the silicon rod conversion device holds a silicon rod and the silicon rod clamp and the silicon rod it holds corresponds to the first functional area. The drive source drives the drive gear to rotate counterclockwise. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft are driven to rotate clockwise by a preset angle of 120°, so that the silicon rod clamp and the silicon rod it holds in the silicon rod conversion device are transferred from the first functional area to the second functional area. Alternatively, in another scenario, in the initial state, one of the silicon rod clamps in the silicon rod conversion device holds a silicon rod, and this clamp and the held silicon rod correspond to the second functional area. The drive source drives the driving gear to rotate clockwise. Through the meshing of the driving gear and the driven gear, the driven gear and its associated shifting shaft are driven to rotate counterclockwise by a preset angle of 120°, thus transferring that silicon rod clamp and the held silicon rod from the second functional area to the first functional area. The preset angle is not strictly limited; for example, in actual processing scenarios, a certain deviation from 120° is permissible, such as 120° ± 5°, or other angles.

[0077] In actual processing scenarios, to avoid the accumulation of errors after multiple transfers of the conversion body during continuous processing, the clamping center line of the silicon rod fixture should be parallel or approximately parallel to the long side direction of the functional area. The preset angle can also be determined by the direction of the clamping center line of the silicon rod in the current functional area and the long side direction of the next functional area. For example, the preset angle is used to ensure that after the silicon rod fixture is transferred to the next functional area, its clamping center line is parallel or approximately parallel to the long side of the next functional area. The parallelism or approximately parallelism is, for example, an angle of 0° to 5° between the clamping center line of the silicon rod and the long side direction of the functional area.

[0078] In the silicon rod slicing and grinding machine of this application, the clamping center line of the silicon rod clamp is set in the horizontal direction. Here, the shifting shaft is set in the vertical direction. When the conversion body drives the silicon rod clamp to rotate along the shifting shaft, the clamping center line of the silicon rod clamp is still in the horizontal direction (i.e., the clamping center line of the silicon rod clamp is a horizontal line). In addition, when the silicon rod clamp clamps the silicon rod, the axis of the clamped silicon rod is required to be set in the horizontal direction or the deviation from the horizontal line is within a preset range. Therefore, in some embodiments, the clamping center line of the silicon rod clamp coincides with the axis of the silicon rod. Generally, the angle between different functional areas of the silicon rod slicing and grinding machine in the working state is a fixed value. Therefore, when transferring a silicon rod clamp from one functional area to another functional area, the preset angle of rotation of the shifting shaft can be made equal to the angle between the two functional areas.

[0079] As previously described, the silicon rod conversion device includes multiple silicon rod clamps. For example... Figure 1 and Figure 2 In the illustrated embodiment, silicon rod clamps 122 are installed on each side of the conversion body 121 in the silicon rod conversion device 12. The silicon rod clamps 122 are used to hold the silicon rod 100. When the silicon rod 100 is held by the silicon rod clamps 122, the axis of the held silicon rod 100 is a horizontal line. In this embodiment, all the silicon rod clamps are of the same specification, and their structures and working principles are the same. However, this is not a limitation; in other embodiments, the silicon rod clamps may be of different specifications.

[0080] Regarding silicon rod clamps, any silicon rod clamp includes a pair of clamping arms and a clamping arm drive mechanism.

[0081] Please see Figure 3 The image shows a partial structural diagram of the silicon rod clamp in the silicon rod cutting and grinding integrated machine.

[0082] like Figure 3 As shown, the silicon rod clamp includes a pair of clamping arms 1221 and a clamping arm drive mechanism.

[0083] The pair of clamping arms are arranged opposite each other along a horizontal line to clamp the two end faces of the silicon rod, so that the clamped silicon rod is placed horizontally, that is, the length direction of the silicon rod is placed along a horizontal line, and the end faces of the silicon rod are the cross-sections at both ends in the length direction. Figure 3 In the embodiment shown, two of the pair of clamping arms 1221 extend outward from one side of the conversion body, wherein each of the pair of clamping arms is provided with a clamping part 1223, that is, each clamping arm 1221 is provided with a clamping part 1223.

[0084] Of course, the specific structure and orientation of the silicon rod clamp are not limited to... Figure 3The view shown is for illustrative purposes only. For example, the pair of clamping arms of the silicon rod clamp are arranged along a horizontal line, while the clamping arms can be arranged in a vertical direction, or as shown below. Figure 3 As shown, the silicon rod clamp is positioned in a horizontal direction. Understandably, the clamping center line of the silicon rod clamp can be set to a horizontal line to clamp the silicon rod horizontally.

[0085] Please continue reading. Figure 3 The clamping arm drive mechanism can be used to drive at least one of a pair of clamping arms to move along a horizontal line to adjust the clamping distance between the pair of clamping arms. Figure 3 In one embodiment, two of the pair of clamping arms are arranged opposite each other along a horizontal line, and the clamping arm driving mechanism can drive at least one of the pair of clamping arms to move along the horizontal line to adjust the clamping distance between the oppositely arranged pair of clamping arms.

[0086] In the embodiments provided in this application, such as Figure 3 As shown, the clamping arm driving mechanism may include: an opening and closing guide rail and an opening and closing driving unit (not shown), wherein the opening and closing guide rail is arranged on the conversion body along a horizontal line and is used to set a pair of clamping arms, and the opening and closing driving unit is used to drive at least one of the pair of clamping arms to move along the opening and closing guide rail.

[0087] In some embodiments, the clamping arm drive mechanism can drive one of the pair of clamping arms to move closer to the other clamping arm along a horizontal line, reducing the clamping distance between the two clamping arms and thereby clamping the silicon rod located between the two clamping arms. Correspondingly, the clamping arm drive mechanism can drive one of the pair of clamping arms to move away from the other clamping arm along a horizontal line, increasing the clamping distance between the two clamping arms to release the clamped silicon rod.

[0088] Assuming that the first clamping arm of the pair of clamping arms can be driven to move along a horizontal line by a clamping arm drive mechanism, the second clamping arm of the pair of clamping arms can be fixedly mounted on the conversion body by, for example, a clamping arm mounting base or a similar structure.

[0089] In some embodiments, the opening and closing drive unit in the clamping arm drive mechanism may include a lead screw and a drive source, wherein the lead screw is arranged along a horizontal line and associated with a first clamping arm of the pair of clamping arms, and the drive source is associated with the lead screw for driving the lead screw to rotate so that the associated first clamping arm moves along the horizontal line. For example, if the drive source drives the lead screw to rotate in the forward direction, the associated first clamping arm is driven to move closer to the second clamping arm along the horizontal line, reducing the clamping distance between the two clamping arms; or, if the drive source drives the lead screw to rotate in the reverse direction, the associated first clamping arm is driven to move away from the second clamping arm along the horizontal line, increasing the clamping distance between the two clamping arms. The drive source may be, for example, a servo motor. In the above embodiments, the opening and closing drive unit can still adopt other structures. For example, in some other embodiments, the opening and closing drive unit may include a rack, a drive gear, and a drive motor. The rack is arranged along a horizontal line and is associated with the first clamping arm of the pair of clamping arms. The drive gear is controlled by the drive motor and meshes with the rack. Thus, the drive motor drives the drive gear to rotate, causing the rack and its associated first clamping arm to move along the horizontal line. For example, if the drive source drives the drive gear to rotate in the forward direction, the first clamping arm associated with the rack is driven to move closer to the second clamping arm along the horizontal line, reducing the clamping distance between the two clamping arms. Alternatively, if the drive source drives the drive gear to rotate in the reverse direction, the first clamping arm associated with the rack is driven to move away from the second clamping arm along the horizontal line, increasing the clamping distance between the two clamping arms.

[0090] In some embodiments, the clamping arm driving mechanism can drive two of the pair of clamping arms to move towards each other, reducing the clamping distance between the two clamping arms, thereby clamping the silicon rod located between the two clamping arms. Correspondingly, the clamping arm driving mechanism can drive two of the pair of clamping arms to move away from each other, increasing the clamping distance between the two clamping arms to release the clamped silicon rod.

[0091] It is assumed that both of the pair of clamping arms can be driven by a clamping arm drive mechanism to move along a horizontal line.

[0092] In some embodiments, the opening and closing drive unit in the clamping arm drive mechanism may include a bidirectional lead screw and a drive source. The bidirectional lead screw is arranged along a horizontal line and is a left- or right-handed lead screw. It has two sections of threads on its shaft with opposite directions of rotation; one section is a left-handed thread and the other is a right-handed thread. The left-handed thread can be associated with one of the clamping arms in a pair, and the right-handed thread can be associated with the other clamping arm in a pair. The drive source is associated with the bidirectional lead screw and is used to drive the bidirectional lead screw to rotate so that the associated first and second clamping arms move towards each other or away from each other along the horizontal line. For example, if the drive source drives the bidirectional lead screw to rotate in the forward direction, the associated first and second clamping arms will move towards each other (i.e., move closer to each other) along the horizontal line, reducing the clamping distance between the two clamping arms. Alternatively, if the drive source drives the lead screw to rotate in the reverse direction, the associated first and second clamping arms will move away from each other (i.e., move away from each other) along the horizontal line, increasing the clamping distance between the two clamping arms. The drive source may be, for example, a servo motor, located in the middle section of the bidirectional lead screw. In the above embodiment, the clamping arm drive mechanism may still adopt other structures. For example, in some other embodiments, the clamping arm drive mechanism may include: a pair of racks, a drive gear, and a drive motor, wherein the pair of racks are parallel to each other and both are arranged along a horizontal line, one rack of the pair of racks is associated with the first clamping arm of the pair of clamping arms, and the other rack of the pair of racks is associated with the second clamping arm of the pair of clamping arms, the drive gear is located between the pair of racks to mesh with the pair of racks and is controlled by the drive motor, so that the drive motor drives the drive gear to rotate, causing the pair of racks and their associated first and second clamping arms to move towards or away from each other along the horizontal line. For example, if the drive source drives the drive gear to rotate in the forward direction, it will drive the first and second clamping arms associated with the pair of racks to move towards each other along the horizontal line (i.e., move closer to each other), thereby reducing the clamping distance between the two clamping arms. Alternatively, if the drive source drives the drive gear to rotate in the reverse direction, it will drive the first and second clamping arms associated with the pair of racks to move away from each other along the horizontal line (i.e., move further away from each other), thereby increasing the clamping distance between the two clamping arms.

[0093] In some embodiments of this application, the clamping portion of the clamping arm is designed to rotate, such as... Figure 3 As shown, where, Figure 3 The diagram shown is a partial structural schematic of the silicon rod clamp of this application in some embodiments. For example... Figure 3In the illustrated embodiment, any silicon rod clamp includes a clamping part rotation mechanism 1225 for driving the clamping part on the clamping arm of the silicon rod clamp to rotate. In one implementation of this embodiment, driven by the clamping part rotation mechanism, the clamping part of the clamping arm rotates about the silicon rod's axis, causing the clamped silicon rod to rotate accordingly about its axis. In actual processing, by driving the silicon rod to rotate along its axis through the clamping part rotation mechanism, the positional relationship of the clamped silicon rod relative to the cutting or grinding device can be adjusted.

[0094] In some embodiments, the clamping part is a multi-point contact clamping head. It is understood that the contact method between the multi-point contact clamping head and the end face of the silicon rod is not limited to point contact, for example... Figure 3 In the illustrated embodiment, the clamping portion, for example, has multiple protrusions 1227 to contact the end face of the silicon rod, wherein each protrusion 1227 may have surface contact with the end face of the silicon rod. In one implementation, the protrusions of the clamping portion may also be connected to the clamping portion body via springs along a horizontal line, thereby forming multi-point floating contact, allowing the silicon rod clamp to adapt to the flatness of the silicon rod end face when clamping the silicon rod. In some examples, the clamping portion for contacting the end face of the silicon rod may also be connected to the clamping arm via a universal mechanism, such as a ball joint, thereby adapting the clamping portion to clamp silicon rod end faces with different inclinations.

[0095] In some embodiments, the pair of clamping portions of the silicon rod clamp are configured as rigid structures to prevent the clamped silicon rod from being disturbed during cutting and grinding operations, thus affecting the processing accuracy.

[0096] In practical applications, the clamping part rotation mechanism may include a rotatable structure provided on two clamping parts in a pair of clamping arms and a drive source for driving at least one of the two rotatable structures to rotate.

[0097] In some embodiments of this application, the rotatable platform may be configured as a whole hinged together by a hinged device with a locking function, and may rotate along a horizontal axis. The axis of rotation is connected to the rotating mechanism of the clamping part.

[0098] In some embodiments of this application, the clamping portion of the clamping arm can be configured as a rotatable frustum, the circular plane of which contacts the end face of the silicon rod and remains relatively stationary after being pressed against the end face of the silicon rod. The silicon rod clamping portion also includes a locking structure, wherein the clamping arm clamping portion is in a locked state when grinding a selected surface. During the switching between different grinding surfaces, the silicon rod clamping portion rotates around the center of the frustum under the drive of the clamping portion rotation mechanism.

[0099] In some implementations, the clamping part of the clamping arm includes a rotatable frustum and a series of protruding contacts disposed on the frustum. Each contact has a contact plane for contacting the clamped silicon rod. The frustum rotates under the drive of the clamping part's rotating mechanism. Regarding the contacts, in some implementations, the protrusion length of the contacts, i.e., their position on the horizontal line, is adjustable. This allows, during the clamping process, for silicon rods with low end-face flatness, the protrusion length of the contacts can be adjusted according to the end face of the silicon rod, ensuring that the contact surface of each contact is in close contact with the end face of the silicon rod. The protrusion length is the length of the horizontal line from the circular plane of the frustum to the contact plane of the contact.

[0100] In some embodiments of this application, the clamping portion of the silicon rod clamp may be equipped with a pressure sensor to adjust the protrusion length of the contact points based on the detected pressure state. Typically, during the clamping of the silicon rod, a pair of clamping arms of the silicon rod clamp approach each other along a horizontal line under the drive of the clamping arm drive mechanism until the clamping portion contacts the end face of the silicon rod to be clamped. When the clamping portion is provided with multiple contacts and the pressure value detected when some contacts contact the end face of the silicon rod is less than a set value or a set area, the clamping tightness can be changed by adjusting the protrusion length of the contacts (generally in the direction of approaching the end face of the silicon rod). Alternatively, during the clamping of the silicon rod, the clamping arm drive mechanism drives a pair of clamping arms to approach each other facing the two ends of the silicon rod. After the clamping portion contacts the end face of the silicon rod, the pressure sensor detects the degree of clamping of the silicon rod. When the set pressure range is reached, the clamping arm drive mechanism controls the stopping of the opposing movement of the pair of clamping arms.

[0101] The clamping rotation mechanism can be mounted on one of the clamping arms of a pair of clamping arms to drive the clamping parts of the pair of clamping arms to rotate with the clamped silicon rod; or the clamping rotation mechanism can be mounted on each of the pair of clamping arms and coordinately control the two clamping parts of the pair of clamping arms to rotate at the same angle and in the same direction. In some implementations, the drive source in the clamping rotation mechanism can be a drive motor.

[0102] Thus, in this embodiment of the application, the multiple silicon rod clamps configured by the silicon rod conversion device can horizontally clamp the silicon rod and drive the clamped silicon rod to rotate at a predetermined angle with its axis as the pivot, wherein the axis of the silicon rod is a horizontal line.

[0103] The silicon rod is held at both ends by the silicon rod clamp. A conversion drive mechanism in the silicon rod conversion device drives the conversion body to transfer the silicon rod clamp and the held silicon rod to the corresponding functional area. A processing device then performs corresponding processing operations on the silicon rod held by the clamp at that functional area. For example, a cutting device is provided at the cutting area, and a grinding device is provided at the grinding area. The conversion drive mechanism drives the conversion body to transfer the silicon rod clamp and the held silicon rod to the cutting area, where the cutting device performs a cutting operation on the silicon rod to be cut. Alternatively, the conversion drive mechanism drives the conversion body to transfer the silicon rod clamp and the held silicon rod to the grinding area, where the grinding device performs a grinding operation on the squared silicon rod held at the grinding area.

[0104] In actual processing scenarios, the silicon rod clamp holds the silicon rod to be ground horizontally. The conversion body drives the silicon rod clamp to be transferred sequentially to the cutting area and grinding area corresponding to the cutting device and grinding device, so that the cutting device can perform cutting operation on the silicon rod held by the silicon rod clamp at the cutting area and the grinding device can perform grinding operation on the silicon rod held by the silicon rod clamp at the grinding area.

[0105] Understandably, the shape of the conversion body and the positions of the multiple silicon rod clamps on the conversion body determine the angle at which the conversion body needs to be converted when the cutting and grinding devices have completed the cutting and grinding operations on the silicon rods and are about to perform the cutting and grinding operations on the next silicon rod.

[0106] To simplify the equipment layout of the silicon rod cutting and grinding integrated machine of this application, and to simplify the transfer process required for the processing devices (i.e., the cutting device and the grinding device) to perform processing operations, this application also provides the following embodiments:

[0107] exist Figure 1 and Figure 2 In the illustrated embodiment, the silicon rod cutting and grinding integrated machine includes a cutting area, a grinding area, and a waiting area. The silicon rod conversion device includes a conversion body and multiple silicon rod clamps and a conversion drive mechanism disposed on the conversion body. The conversion body has a triangular outline in the horizontal plane, and a silicon rod clamp is provided on each of the three sides of the conversion body outline. If the cutting area, grinding area, and waiting area are distributed at 120° intervals, then the conversion body has an equilateral triangle outline in the horizontal plane. Taking the conversion drive mechanism including a shifting shaft as an example, the rotation center of the conversion body can be set at the geometric center of the equilateral triangle. At any initial moment, the conversion body can overlap with the initial position every 120° rotation in the clockwise or counterclockwise direction.

[0108] In some embodiments where the outline of the conversion body in the horizontal plane is an equilateral triangle, a silicon rod clamp is provided on the outer side of each side of the triangle outline of the conversion body. The angle between two adjacent silicon rod clamps is also consistent with the angle distribution between two adjacent functional areas. The clamping center line of any silicon rod clamp can be parallel to the corresponding side.

[0109] In a specific implementation, for any silicon rod clamp, it is positioned on the outer side of one side of the contour of the conversion body, for example, on a horizontal guide rail, guide groove, or guide post on the outer side of the triangle. Then, the clamping center line of the silicon rod clamp is parallel to the corresponding side.

[0110] In this configuration, when the conversion body is driven to rotate by a preset angle, such as 120°, by the conversion drive mechanism, the silicon rod held by the silicon rod clamp on one side of the conversion body can be changed from corresponding to the previous functional area to corresponding to the next functional area 120° apart. For example, if the silicon rod held by the silicon rod clamp on one side of the conversion body currently corresponds to the waiting area (or cutting area, or grinding area), after the conversion body is driven to rotate forward by the conversion drive mechanism by 120°, the silicon rod held by the silicon rod clamp on one side of the conversion body will correspond to the cutting area (or grinding area, or waiting area). This can also be understood as follows: the silicon rod being processed by the processing device in a certain functional area is changed from the silicon rod clamp held by the silicon rod holder on one side of the conversion body to the silicon rod clamp held by the silicon rod holder on the other side, which is 120° apart. For example, after the cutting device in the cutting area performs a cutting operation on the silicon rod held by the silicon rod clamp on one side of the conversion body, the conversion body is driven to rotate 120° forward by the conversion drive mechanism, and then the cutting device in the cutting area can perform a cutting operation on the silicon rod held by the silicon rod clamp on the other side of the adjacent conversion body. Or, after the grinding device in the grinding area performs a grinding operation on the silicon rod held by the silicon rod clamp on one side of the conversion body, the conversion body is driven to rotate 120° forward by the conversion drive mechanism, and then the grinding device in the grinding area can perform a grinding operation on the silicon rod held by the silicon rod clamp on the other side of the adjacent conversion body.

[0111] In some embodiments, the silicon rod processing platform further includes a waiting area. In the waiting state, the first side of the conversion body contour corresponds to the waiting area, the second side of the conversion body contour corresponds to a first functional area, and the third side of the conversion body contour corresponds to a second functional area. In such... Figure 1 and Figure 2 In the embodiment shown, in the waiting state, the first side corresponds to the waiting area, the second side corresponds to the cutting area, and the third side corresponds to the grinding area.

[0112] Here, the waiting state refers to the state where the clamping center line of a silicon rod clamp on the conversion body is parallel or nearly parallel to the silicon rod placed in the waiting area. In this state, the outline edge of the silicon rod clamp is considered the first edge, the second edge of the conversion body outline corresponds to the cutting area, and the third edge of the conversion body outline corresponds to the grinding area. Thus, the silicon rod clamp on the conversion body can perform loading or unloading operations on the silicon rod in the waiting area, the cutting device can perform cutting operations on the silicon rod in the cutting area, and the grinding device can perform grinding operations on the silicon rod in the grinding area. At the same time, different functional areas are all in operation. Furthermore, by switching the silicon rod clamp between different functional areas via the conversion body, seamless connection of different processing steps can be achieved for the same silicon rod, improving the processing efficiency of the silicon rod cutting and grinding integrated machine.

[0113] In this embodiment of the silicon rod cutting and grinding integrated machine, at least a cutting device and a grinding device are included. Therefore, in some embodiments, the silicon rod processing platform includes a cutting area and a grinding area, wherein the cutting area or grinding area includes one or more areas. For example, the cutting area may include a first cutting area and a second cutting area, and the grinding area may include a first grinding area and a second grinding area. In addition, the silicon rod processing platform may also include a waiting area.

[0114] like Figure 1 and Figure 2 In the embodiment shown, the silicon rod processing platform includes a waiting area, a cutting area, and a grinding area. The number of silicon rod clamps on the conversion body can be set to three. The waiting area, cutting area, and grinding area are distributed at 120° intervals between each other. Therefore, the three silicon rod clamps on the conversion body are also distributed at 120° intervals between each other.

[0115] The silicon rod cutting and grinding integrated machine includes at least one cutting device, which is located in at least one corresponding cutting area and is used to cut the silicon rod to be cut held by the silicon rod clamp located in the corresponding cutting area of ​​the silicon rod conversion device, so as to cut the silicon rod with a circular cross section into a silicon rod with a rectangular cross section.

[0116] In such Figure 1 and Figure 2 In the illustrated embodiment, the cutting device 13 includes a cutting mounting structure 131, a cutting unit 132, and a cutting travel mechanism 133. The cutting mounting structure 131 is mounted on the base 11 and corresponds to the cutting area. The cutting unit 132 is mounted on the cutting mounting structure 131 and includes a cutting wire frame mounted on the cutting mounting structure 131, a plurality of cutting wheels mounted on the cutting wire frame, and a cutting wire, which is sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw.

[0117] The cutting travel mechanism is used to drive the cutting mounting structure and the cutting unit on it to move along the cutting direction so that at least one wire saw in the cutting unit can cut the silicon rod at the cutting area; the cutting direction is consistent with the axis of the silicon rod held by the silicon rod clamp located at the corresponding grinding area in the silicon rod conversion device.

[0118] In some embodiments, the cutting travel mechanism includes a travel guide and a travel drive unit. In such... Figure 1 and Figure 2 In the illustrated embodiment, the cutting travel mechanism 133 includes a travel guide rail 1331 and a travel drive unit 1332. The travel guide rail 1331 is disposed on the base 11 along the long side of the cutting area. The bottom of the cutting mounting structure 131 is provided with a guide groove structure or guide block structure that cooperates with the travel guide rail 1331. The long side of the cutting area is the travel direction of the cutting device 13, i.e., the cutting direction. The travel drive unit 1332 may further include, for example, a lead screw and a drive motor. The lead screw is disposed along the travel guide rail, and the lead screw is associated with the corresponding cutting mounting structure and shaft-connected to the drive motor. The drive motor drives the lead screw to rotate in the forward direction so that the cutting mounting structure associated with the lead screw and the cutting unit thereon move along the travel guide from the first end of the cutting area to the second end of the cutting area. Alternatively, the drive motor drives the lead screw to rotate in the reverse direction so that the cutting mounting structure associated with the lead screw and the cutting unit thereon move along the travel guide from the second end of the cutting area to the first end of the cutting area.

[0119] exist Figure 1 and Figure 2 In the illustrated embodiment, the machine base has a silicon rod processing platform, which includes a waiting area, a cutting area, and a grinding area. Therefore, the machine base is equipped with a cutting device corresponding to the cutting area. Using this cutting device, the silicon rod to be cut, held by the silicon rod clamp at the cutting area, can be cut into a rectangular-shaped silicon rod with a circular cross-section.

[0120] In some implementations, the cutting unit includes four wire saws, with adjacent wire saws perpendicular to each other and opposing wire saws parallel to each other. Specifically, the four wire saws may be, for example, a first wire saw, a second wire saw, a third wire saw, and a fourth wire saw, wherein the first and third wire saws are parallel to each other, the second and fourth wire saws are parallel to each other, and the first and third wire saws are perpendicular to the second and fourth wire saws. As can be seen, the first, second, third, and fourth wire saws cooperate to form a grid-like cutting wire mesh. In specific implementations, in some examples, the first and third wire saws are horizontally (or vertically) positioned, and the second and fourth wire saws are vertically (or horizontally) positioned. Alternatively, in some examples, the first and third wire saws are set at a 45° (or 135°) angle to the horizontal line, and the second and fourth wire saws are set at a 135° (or 45°) angle to the horizontal line. Alternatively, in some examples, the angles of the first and third wire saws, the second and fourth wire saws, to the horizontal line are not limited, as long as the first and third wire saws are perpendicular to the second and fourth wire saws.

[0121] When the silicon rod is cut into square sections using the four wire saws described above, the silicon rod clamp in the silicon rod conversion device holds the silicon rod to be cut and aligns it with the cutting area. The cutting travel mechanism in the cutting device drives the cutting mounting structure and its cutting unit to move along the cutting direction aligned with the axis of the silicon rod. This causes the cutting wire mesh formed by the four wire saws in the cutting unit to cut the silicon rod during the movement, resulting in a silicon rod with a rectangular cross-section and four edge skins around the silicon rod. Each wire saw forms a side cut and an edge skin on the silicon rod after cutting it.

[0122] In some implementations, the cutting unit includes two parallel wire saws. These two parallel wire saws are used to cut the silicon rod to be cut at the cutting area to form two parallel side cuts. Specifically, in some examples, the two wire saws are horizontally positioned. Alternatively, in some examples, the two wire saws are vertically positioned. Alternatively, in some examples, the angle between the two wire saws and the horizontal line is not limited, as long as the two wire saws are parallel to each other. Thus, these two parallel wire saws cooperate to form a cutting wire mesh in the shape of "=" or "||". In such cases... Figure 1 and Figure 2In the illustrated embodiment, the cutting unit of the cutting device includes two wire saws, which are parallel to each other to form a cutting wire mesh in the shape of "=" or "||".

[0123] When the silicon rod is cut into square sections using the two parallel wire saws described above, the silicon rod clamp in the silicon rod conversion device holds the silicon rod to be cut and corresponds to the cutting area. The cutting travel mechanism in the cutting device drives the cutting mounting structure and its cutting unit to move along the cutting direction consistent with the axis of the silicon rod. The “=" or “||” shaped cutting wire mesh formed by the two parallel wire saws in the cutting unit cuts the silicon rod during the movement, so as to form two opposite parallel side cuts and two edge skins on the silicon rod.

[0124] In order to ensure that the silicon rod can be cut by the two parallel wire saws in the cutting device to finally form a silicon rod with a rectangular cross-section, in the above implementation, after the silicon rod is cut for the first time by the two parallel wire saws in the cutting device to form two opposite parallel side cut surfaces and two edge skins on the silicon rod, it is necessary to subsequently drive the clamping part of the clamping arm in the silicon rod clamp to rotate through the clamping part rotation mechanism in the silicon rod clamp to adjust the cutting position of the silicon rod. In some examples, assuming that the two parallel wire saws in the cutting device are set horizontally or vertically, the clamping part of the clamping arm in the silicon rod clamp is driven to rotate 90° clockwise or counterclockwise by the clamping rotation mechanism in the silicon rod clamp. Then, the cutting travel mechanism in the cutting device drives the cutting mounting structure and the cutting unit on it to move along the cutting direction consistent with the axis of the silicon rod. During the movement, the “=" or “||” shaped cutting wire mesh formed by the two parallel wire saws in the cutting unit performs a second cutting operation on the silicon rod, so as to form two opposite parallel side cut surfaces and two edge skins on the silicon rod. In this way, the silicon rod can be finally cut into a silicon rod with a rectangular cross section, completing the cutting and square cutting operation.

[0125] In some implementations, the cutting unit includes two intersecting wire saws. These two intersecting wire saws are used to cut the silicon rod to be cut at the cutting area to form two intersecting side cuts. Specifically, the two intersecting wire saws intersect at an angle that can be set according to the silicon rod processing requirements. For example, the intersecting angle can be 90°, 80°, 85°, 95°, 100°, or other suitable angles. Taking a 90° intersection angle as an example, the two wire saws at this 90° intersection angle can be referred to as orthogonal. For example, one wire saw may be horizontally positioned while the other is vertically positioned, or one wire saw may be positioned at a 45° (or 135°) angle to the horizontal while the other is positioned at a 135° (or 45°) angle to the horizontal. These two orthogonal wire saws cooperate to form a "+" shaped cutting wire mesh. Please refer to [link / reference]. Figure 4 The image shown is a schematic diagram of the integrated silicon rod cutting and grinding machine of this application in another embodiment. Figure 4 In the embodiment shown, the cutting unit of the cutting device includes two wire saws that intersect each other at an angle of, for example, 90°. That is, one wire saw is set at a 45° angle to the horizontal line and the other wire saw is set at a 135° angle to the horizontal line. The two wire saws are orthogonal to each other to form a cutting wire mesh in the shape of a "+".

[0126] When the silicon rod is cut into square sections using the two intersecting wire saws described above, the silicon rod clamp in the silicon rod conversion device holds the silicon rod to be cut and corresponds to the cutting area. The cutting travel mechanism in the cutting device drives the cutting mounting structure and the cutting unit on it to move along the cutting direction consistent with the axis of the silicon rod. This causes the intersecting wire mesh formed by the two intersecting wire saws in the cutting unit to cut the silicon rod during the movement, so as to form two opposing intersecting side cut surfaces and two edge skins on the silicon rod.

[0127] To ensure that the silicon rod can be cut by the two wire saws in the cutting device to form a silicon rod with a rectangular cross-section, in the above implementation, taking the two wire saws forming a "+" shaped cutting wire mesh as an example, after the silicon rod is cut for the first time using the two orthogonal wire saws in the cutting device to form two opposing orthogonal side cut surfaces and two edge skins on the silicon rod, it is necessary to subsequently drive the clamping part of the clamping arm in the silicon rod clamp to rotate through the clamping part rotation mechanism in the silicon rod clamp to adjust the cutting position of the silicon rod. In some examples, assuming that one of the two orthogonal wire saws in the cutting device is horizontal and the other is vertical, or that one is at a 45° angle to the horizontal and the other is at a 135° angle to the horizontal, the clamping part of the silicon rod clamp is driven to rotate 180° clockwise or counterclockwise by the clamping part rotation mechanism in the silicon rod clamp. Then, the cutting travel mechanism in the cutting device drives the cutting mounting structure and its cutting unit to move along the cutting direction consistent with the axis of the silicon rod. During the movement, the "+" shaped cutting wire mesh formed by the two orthogonal wire saws in the cutting unit performs a second cutting operation on the silicon rod, so as to form two more orthogonal side cuts and two edge skins on the silicon rod. In this way, the silicon rod can be finally cut into a silicon rod with a rectangular cross-section, completing the cutting and squaring operation.

[0128] As previously described, the cutting device includes a cutting mounting structure, a cutting unit, and a cutting travel mechanism.

[0129] The cutting mounting structure is mounted on the machine base and corresponds to the cutting area. In such a case... Figure 1 and Figure 2 The illustrated embodiments or Figure 4 In the illustrated embodiment, a cutting mounting structure 131 (131') is disposed on the base 11 and corresponds to the cutting area, for providing at least one cutting unit 132 (132'). The cutting mounting structure 131 (131') may be, for example, a mounting base, a mounting beam, or a mounting frame constructed from multiple components.

[0130] The cutting unit 132 (132') is disposed on the cutting mounting structure 131 (131'). The cutting unit 132 (132') includes a cutting wire frame disposed on the cutting mounting structure 131 (131'), a plurality of cutting wheels disposed on the cutting wire frame, and cutting wires. The cutting wires are sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw. The cutting unit 132 (132') includes multiple cutting wire saws.

[0131] Taking the cutting unit comprising four wire saws as an example, the cutting unit may include at least eight cutting wheels, which can be combined into two pairs of cutting wheel sets. That is, two cutting wheels form one cutting wheel set, and two cutting wheel sets form a pair of cutting wheel sets. In practical applications, the cutting unit includes two pairs of cutting wheel sets, namely, a first pair of cutting wheel sets and a second pair of cutting wheel sets. Taking a first pair of cutting wheel sets forming two horizontal cutting wire saws and a second pair of cutting wheel sets forming two vertical cutting wire saws as an example, the first pair of cutting wheel sets includes a first cutting wheel set and a second cutting wheel set, which are arranged on the upper and lower sides of the cutting wire frame respectively. The first cutting wheel set is located on the upper side of the cutting wire frame and includes two cutting wheels arranged on the left and right. The second cutting wheel set is located on the lower side of the cutting wire frame and includes two cutting wheels arranged on the left and right. The second pair of cutting wheel sets includes a third cutting wheel set and a fourth cutting wheel set, which are arranged on the left and right sides of the cutting wire frame respectively. The third cutting wheel set is located on the left side of the cutting wire frame and includes two cutting wheels arranged on the top and bottom. The fourth cutting wheel set is located on the right side of the cutting wire frame and includes two cutting wheels arranged on the top and bottom.

[0132] Cutting wires are sequentially wound around the cutting wheels in the cutting unit to form a cutting wire mesh. In practical applications, cutting wires are sequentially wound around eight cutting wheels in the cutting unit to form four cutting wire saws, which constitute a "grid"-shaped cutting wire mesh. In practical applications, the cutting wires are wound around two cutting wheels arranged horizontally in the first cutting wheel group to form the first cutting wire saw; the cutting wires are wound around two cutting wheels arranged horizontally in the second cutting wheel group to form the second cutting wire saw; the cutting wires are wound around two cutting wheels arranged vertically in the third cutting wheel group to form the third cutting wire saw; and the cutting wires are wound around two cutting wheels arranged vertically in the fourth cutting wheel group to form the fourth cutting wire saw. Thus, the first, second, third, and fourth cutting wire saws cooperate to form a "grid"-shaped cutting wire mesh. In some embodiments, two adjacent cutting wire saws are perpendicular to each other, and two opposing cutting wire saws are parallel to each other. Specifically, the first and second wire saws in the first cutting wheel group are parallel to each other, the third and fourth wire saws in the second cutting wheel group are parallel to each other, and the first and second wire saws in the first cutting wheel group are perpendicular to the third and fourth wire saws in the second cutting wheel group.

[0133] In fact, the cutting unit described above can still be modified in other ways. For example, the cutting unit may include two wire saws.

[0134] In some implementations, the cutting unit includes two parallel wire saws. The cutting unit may include at least four cutting wheels, which can be combined into a pair of cutting wheel sets; that is, two cutting wheels form one cutting wheel set, and two cutting wheel sets form a pair of cutting wheel sets. Each cutting wheel set includes two oppositely arranged cutting wheels and cutting segments wound around the two cutting wheels. Two cutting segments belonging to different cutting wheel sets within a pair of cutting wheel sets are parallel to each other. The spacing between the two cutting wheels in each cutting wheel set corresponds to the cross-sectional dimensions of the silicon rod to be cut. For example, the pair of cutting wheel sets includes two cutting wheel sets arranged on the upper and lower sides of a wire frame. One cutting wheel set includes two cutting wheels arranged horizontally, with a horizontal cutting segment wound between them. The other cutting wheel set also includes two cutting wheels arranged horizontally, with a horizontal cutting segment wound between them. The two cutting segments form two parallel wire saws in the horizontal direction. Alternatively, the pair of cutting wheel sets includes two cutting wheel sets arranged on the left and right sides of the wire frame. One cutting wheel set includes two cutting wheels arranged vertically, with a vertical cutting line segment wound between the two cutting wheels. The other cutting wheel set also includes two cutting wheels arranged vertically, with a vertical cutting line segment wound between the two cutting wheels. The two cutting line segments form two parallel cutting lines in the vertical direction.

[0135] In some implementations, the cutting unit includes two intersecting wire saws. The cutting unit may include at least four cutting wheels, which can be combined to form two intersecting cutting wheel sets. For example, the cutting wheel set may consist of two cutting wheels arranged opposite each other along the M-axis forming a first cutting wheel set, and two cutting wheel sets arranged along the N-axis forming another first cutting wheel set, where the M-axis and N-axis intersect. Specifically, the cutting unit includes two intersecting cutting wheel sets, where one cutting wheel set includes two cutting wheels arranged along the M-axis, and the other cutting wheel set includes two cutting wheels arranged along the N-axis. The cutting wires are sequentially wound around the four cutting wheels in the cutting unit to form two intersecting wire saws. Specifically, the cutting wires are wound around the two cutting wheels arranged along the M-axis in one first cutting wheel set to form one wire saw, and the cutting wires are wound around the two cutting wheels arranged along the N-axis in the other first cutting wheel set to form another wire saw. The two wire saws intersect each other, and the angle of intersection can be set according to the silicon rod processing requirements. For example, the intersection angle can be 90°, 80°, 85°, 95°, 100°, or other suitable angles. Taking an intersection angle of 90° as an example, we can refer to the two wire saws with this intersection angle of 90° as orthogonal settings. For example, one wire saw is set horizontally and the other is set vertically, or one wire saw is set at a 45° angle (or 135°) to the horizontal line and the other is set at a 135° angle (or 45°) to the horizontal line. These two orthogonal wire saws work together to form a "+" shaped wire mesh.

[0136] It should be noted that, in some embodiments, when the two intersecting cutting lines in the cutting unit cut the silicon rod, the intersection of the two intersecting cutting lines is located within the cross-section of the silicon rod (including the case where the intersection is located on the circumference of the cross-section), thereby enabling the silicon rod after squaring to obtain the largest possible cross-section (resulting in a larger silicon wafer surface area after subsequent slicing), reducing material loss in subsequent grinding operations (such as grinding and chamfering / rounding), and improving the utilization rate of silicon material.

[0137] The cutting unit may further include transition wheels for guiding the cutting wire. The transition wheels may not be limited to one; they may be mounted on the cutting wire frame. For example, in some embodiments, some transition wheels may be mounted on the cutting wire frame; in some embodiments, some transition wheels may be mounted on the cutting mounting structure; and in some embodiments, some transition wheels may be mounted on the cutting wire frame and some transition wheels may be mounted on the cutting mounting structure.

[0138] In some embodiments, the cutting unit may further include a tension wheel disposed on the cutting wire frame and / or and / or the cutting mounting structure for adjusting the tension of the cutting wire.

[0139] In some embodiments of this application, the cutting device employs a non-enclosed winding structure, and the cutting device further includes a take-up and unwinding unit corresponding to the cutting unit. The take-up and unwinding unit includes at least an unwinding spool and a take-up spool. For example, the first end of the cutting wire is wound around an unwinding spool, the second end is wound around a take-up spool, and the wire is wound between the cutting wheels by means of multiple transition wheels.

[0140] In some embodiments of this application, the cutting device employs a closed winding method, wherein the cutting wire is wound in a loop between each cutting wheel.

[0141] The cutting unit may also include other adjustment mechanisms.

[0142] In some embodiments of this application, the cutting unit in the cutting device includes a cutting wire mesh in the shape of a grid, or in the shape of an "=" or "||". The cutting device further includes a cutting advance / retreat mechanism and a distance adjustment mechanism. The cutting advance / retreat mechanism drives the cutting wire frame and the cutting wire saws on it to move along the cutting advance / retreat direction relative to the cutting mounting structure, the cutting advance / retreat direction being perpendicular to the cutting direction. The distance adjustment mechanism includes mechanisms for adjusting the cutting position of at least one wire saw in the cutting unit, or changing the cutting wire grooves around the multiple cutting wheels in the cutting unit.

[0143] In some implementations, the cutting advance / retreat mechanism may include an advance / retreat guide rail and an advance / retreat drive unit. The advance / retreat guide rail is mounted on the cutting mounting structure, and the cutting wire frame has a guide groove structure or guide block structure that cooperates with the advance / retreat guide rail. The advance / retreat drive unit is used to drive the cutting wire frame and the cutting wire saw on it to move along the cutting advance / retreat direction on the cutting mounting structure via the advance / retreat guide rail. The advance / retreat drive unit may be, for example, a combination of a lead screw and a drive motor, or a telescopic cylinder.

[0144] In some implementations, the cutting advance / retreat mechanism may include a lead screw and a pitch adjustment drive source. The lead screw is associated with one or more cutting wheel sets, and the pitch adjustment drive source is used to drive the lead screw to rotate, thereby changing the position of the cutting wheel in the cutting wheel set associated with the lead screw, thereby adjusting the cutting position of at least one wire saw in the cutting unit, or changing the cutting groove of the cutting wire around the multiple cutting wheels in the cutting unit.

[0145] In some embodiments of this application, the cutting unit in the cutting device includes a cross-cutting wire mesh, for example, a "+" shaped cutting wire mesh. The cutting device then further includes a cutting advance / retreat mechanism. This mechanism drives the cutting wire frame and its attached cutting wire saws to move along the cutting advance / retreat direction within the cutting mounting structure to adjust the cutting position of the two intersecting cutting wire saws in the cutting unit. The cutting advance / retreat direction is perpendicular to the cutting direction.

[0146] In some implementations, the cutting advance / retreat mechanism may include an advance / retreat guide rail and an advance / retreat drive unit. The advance / retreat guide rail is mounted on the cutting mounting structure, and the cutting wire frame has a guide groove structure or guide block structure that cooperates with the advance / retreat guide rail. The advance / retreat drive unit is used to drive the cutting wire frame and the cutting wire saw on it to move along the cutting advance / retreat direction on the cutting mounting structure via the advance / retreat guide rail. The advance / retreat drive unit may be, for example, a combination of a lead screw and a drive motor, or a telescopic cylinder.

[0147] In some embodiments of this application, the silicon rod cutting and grinding integrated machine further includes at least one edge unloading device corresponding to at least one cutting device, used to unload the edge generated after the wire cutting device performs cutting operations on the silicon rod held by the silicon rod fixture.

[0148] In some implementations, the edge removal device may employ an adsorption structure, which may include a suction cup and a displacement mechanism connected to the suction cup. The displacement mechanism drives the suction cup to move and adsorbs the edge to be removed. In practical applications, the cutting device's cutting travel mechanism drives the cutting mounting structure and its cutting units to move along a cutting direction aligned with the silicon rod's axis. This causes the cutting wire mesh formed by four wire saws in the cutting unit to cut the silicon rod during movement. Before the cutting wire mesh passes through the silicon rod (before the edge is fully formed and detached from the silicon rod), the displacement mechanism drives the suction cup to move to the side of the silicon rod, adsorbing the edge to be formed. Once the cutting wire mesh has completely passed through the silicon rod and formed the edge, the edge, being adsorbed by the suction cup, will not slip off the silicon rod or experience sudden relative movement, ensuring no edge chipping occurs. Subsequently, the displacement mechanism again drives the suction cup and the adsorbed edge to move, removing the edge.

[0149] The silicon rod cutting and grinding integrated machine further includes at least one grinding device, which is located in at least one corresponding grinding area and is used to perform grinding operations on the silicon rod held by the silicon rod clamp located in the corresponding grinding area of ​​the silicon rod conversion device.

[0150] In such Figure 1 and Figure 2 The illustrated embodiments or Figure 4In the illustrated embodiment, the silicon rod processing platform is provided with a grinding area, and the silicon rod cutting and grinding integrated machine further includes a grinding device 14, which corresponds to the grinding area. The grinding device 14 includes: a grinding wheel mounting structure 141, at least one pair of grinding wheels 142, a grinding wheel traveling mechanism 143, and a grinding wheel retraction mechanism (not shown in the figure).

[0151] The grinding wheel mounting structure is mounted on the machine base and corresponds to the grinding area, and is used to mount at least one pair of grinding wheels. The length of the grinding area is the span along the long side of the grinding area, which is the direction of travel of the grinding wheel, i.e., the grinding direction.

[0152] In such Figure 1 and Figure 2 The illustrated embodiments or Figure 4 In the illustrated embodiment, the mold mounting structure 141 is located at the edge of the silicon rod processing platform of the base 11 and is used to mount at least one pair of molds 142. The mold mounting structure may be, for example, a mounting base, a mounting beam, or a mounting frame constructed from multiple components.

[0153] The at least one pair of abrasives is disposed on the abrasive mounting structure.

[0154] In some embodiments, the at least one pair of grinding wheels are arranged facing each other vertically on the grinding wheel mounting structure, such that the grinding surfaces of the at least one pair of grinding wheels are located in opposing horizontal planes; that is, the grinding surfaces of two of the at least one pair of grinding wheels are located in a first horizontal plane and a second horizontal plane, respectively, wherein the first horizontal plane and the second horizontal plane are parallel to each other and perpendicular to the plumb line. Figure 1 and Figure 2 The illustrated embodiments or Figure 4 In the embodiment shown, the pair of abrasives 142 are disposed on the abrasive mounting structure 141.

[0155] In some embodiments, the at least one pair of grinding tools are arranged opposite each other on the grinding tool mounting structure in a horizontal direction, such that the grinding surfaces of the at least one pair of grinding tools are located in opposite vertical planes, that is, the grinding surfaces of two of the at least one pair of grinding tools are located in a first vertical plane and a second vertical plane, respectively, wherein the first vertical plane and the second vertical plane are parallel to each other and perpendicular to the horizontal line.

[0156] Regarding the abrasive tool, the abrasive tool includes a coarse grinding tool, a fine grinding tool, or a combination of coarse grinding tools and fine grinding tools. That is, in some embodiments, the abrasive tool includes a coarse grinding tool. In some embodiments, the abrasive tool includes a fine grinding tool. In some embodiments, the abrasive tool includes a combination of coarse grinding tools and fine grinding tools. For example, taking the case where the abrasive tool includes a fine grinding tool, in the silicon rod cutting and grinding integrated machine, after the silicon rod is cut into squares by the preceding cutting device, the side cut surface of the cut silicon rod has a good cutting effect and is relatively smooth. Therefore, the abrasive tool only needs to use the fine grinding tool to perform fine grinding on the squared silicon rod to achieve the silicon rod grinding requirements. Taking the case where the abrasive tool includes a combination of coarse grinding tools and fine grinding tools, the silicon rod can first be coarsely ground using the coarse grinding tool, and then the silicon rod can be finely ground using the fine grinding tool.

[0157] Generally, the abrasive tool may include a grinding wheel and a rotary motor connected to the grinding wheel. Taking the coarse grinding tool as an example, the coarse grinding tool includes a coarse grinding wheel and a rotary motor connected to the coarse grinding wheel. Taking the fine grinding tool as an example, the fine grinding tool includes a fine grinding wheel and a rotary motor connected to the fine grinding wheel.

[0158] The grinding wheel has a certain particle size and roughness. Two grinding wheels arranged opposite each other in the at least one pair of grinding tools provide two symmetrical grinding surfaces for the held silicon rod. In some embodiments, the grinding wheel is circular and hollow in the middle. The grinding wheel is formed by bonding abrasive grains with a binder, creating a surface with abrasive grains that rotates in contact with the surface of the silicon rod to be ground. The grinding wheel has a certain abrasive grain size and density, and also contains pores. The abrasive material of the grinding wheel can be set to abrasive grains with a hardness greater than that of silicon, such as aluminum oxide, silicon carbide, diamond, or cubic boron nitride, depending on the needs of grinding the silicon rod. The rotary motor is connected to the grinding wheel via a rotating shaft and drives the grinding wheel to rotate at a predetermined speed. Comparatively, the abrasive grain size of the fine grinding wheel is smaller than that of the coarse grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than that of the coarse grinding wheel.

[0159] Taking the abrasive tool as an example, which includes a combination of coarse grinding wheels and fine grinding wheels, the abrasive tool may include coarse grinding wheels and fine grinding wheels nested within each other. For example, the coarse grinding wheel is nested within the fine grinding wheel, or the fine grinding wheel is nested within the coarse grinding wheel.

[0160] For example, the abrasive tool includes a grinding head base and a coarse grinding wheel and a fine grinding wheel disposed on the grinding head base. The coarse grinding wheel is nested within the fine grinding wheel, and the fine grinding wheel is larger than the coarse grinding wheel. The fine grinding wheel is circular and hollow in the center (i.e., a ring structure), while the coarse grinding wheel can also be circular or circular and hollow in the center (i.e., a ring structure). The abrasive grain size of the fine grinding wheel is smaller than that of the coarse grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than that of the coarse grinding wheel.

[0161] When the abrasive tool includes a coarse grinding wheel and a fine grinding wheel, it can be used to perform both coarse and fine grinding operations on the silicon rod held by the silicon rod clamp in the silicon rod conversion device. Therefore, at least one of the coarse grinding wheel and the fine grinding wheel is equipped with a telescopic drive mechanism. For example, when the coarse grinding wheel is nested within the fine grinding wheel, the coarse grinding wheel can be equipped with a telescopic drive mechanism. During coarse grinding, the telescopic drive mechanism drives the coarse grinding wheel to extend and protrude beyond the fine grinding wheel, allowing the protruding coarse grinding wheel to perform coarse grinding on the silicon rod. During fine grinding, the telescopic drive mechanism drives the coarse grinding wheel to retract and recess into the fine grinding wheel, allowing the fine grinding wheel to perform fine grinding on the silicon rod. Alternatively, when the coarse grinding wheel is nested within the fine grinding wheel, the fine grinding wheel may be equipped with a telescopic drive mechanism. During coarse grinding, the telescopic drive mechanism drives the fine grinding wheel to retract and recess into the coarse grinding wheel, so as to use the coarse grinding wheel to perform coarse grinding on the silicon rod. During fine grinding, the telescopic drive mechanism drives the fine grinding wheel to extend and protrude from the coarse grinding wheel, so as to use the protruding fine grinding wheel to perform fine grinding on the silicon rod.

[0162] For example, the fine grinding wheel is nested within the coarse grinding wheel, the coarse grinding wheel being larger than the fine grinding wheel. The coarse grinding wheel is circular with a hollow center (i.e., a ring structure), and the fine grinding wheel can also be circular or circular with a hollow center (i.e., a ring structure). The abrasive grain size of the fine grinding wheel is smaller than that of the coarse grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than that of the coarse grinding wheel.

[0163] When the abrasive tool includes a coarse grinding wheel and a fine grinding wheel, it can be used to perform both coarse and fine grinding operations on a silicon rod held by a silicon rod clamp. Therefore, at least one of the coarse grinding wheel and the fine grinding wheel is equipped with a telescopic drive mechanism. For example, when the fine grinding wheel is nested within the coarse grinding wheel, the coarse grinding wheel can be equipped with a telescopic drive mechanism. During coarse grinding, the telescopic drive mechanism drives the coarse grinding wheel to extend and protrude beyond the fine grinding wheel, allowing the protruding coarse grinding wheel to perform coarse grinding on the silicon rod. During fine grinding, the telescopic drive mechanism drives the coarse grinding wheel to retract and retract into the fine grinding wheel, allowing the fine grinding wheel to perform fine grinding on the silicon rod. Alternatively, when the fine grinding wheel is nested within the coarse grinding wheel, the fine grinding wheel may be equipped with a telescopic drive mechanism. During coarse grinding, the telescopic drive mechanism drives the fine grinding wheel to retract and recess into the coarse grinding wheel, so as to use the coarse grinding wheel to perform coarse grinding on the silicon rod. During fine grinding, the telescopic drive mechanism drives the fine grinding wheel to extend and protrude from the coarse grinding wheel, so as to use the protruding fine grinding wheel to perform fine grinding on the silicon rod.

[0164] The grinding wheel traveling mechanism is used to drive the at least one pair of grinding wheels to move along the grinding direction so that the at least one pair of grinding wheels can perform grinding operations on the silicon rod at the grinding area; the grinding direction is consistent with the axis of the silicon rod held by the silicon rod clamp located at the corresponding grinding area in the silicon rod conversion device.

[0165] In some embodiments, the mold traveling mechanism includes a traveling guide and a traveling drive unit. In such... Figure 1 and Figure 2 The illustrated embodiments or Figure 4 In the illustrated embodiment, the grinding wheel traveling mechanism 143 includes a traveling guide rail 1431 and a traveling drive unit 1432. The traveling guide rail 1431 is disposed on the base 11 along the long side direction of the grinding area. The bottom of the grinding wheel mounting structure 141 is provided with a guide groove structure or guide block structure that cooperates with the traveling guide rail 1431. The long side direction of the grinding area is the traveling direction of the grinding device, i.e., the grinding direction. The traveling drive unit 1432 may further include, for example, a lead screw and a drive motor. The lead screw is disposed along the traveling guide rail, and the lead screw is associated with the corresponding grinding wheel mounting structure and shaft-connected to the drive motor. The drive motor drives the lead screw to rotate in the forward direction so that the grinding tool mounting structure associated with the lead screw and the grinding tool thereon move along the travel guide from the first end of the grinding area to the second end of the grinding area; or, the drive motor drives the lead screw to rotate in the reverse direction so that the grinding tool mounting structure associated with the lead screw and the grinding tool thereon move along the travel guide from the second end of the grinding area to the first end of the grinding area.

[0166] The grinding wheel advance / retreat mechanism is used to drive at least one of the at least one pair of grinding wheels to move along the grinding advance / retreat direction relative to the grinding wheel mounting structure, wherein the grinding advance / retreat direction is perpendicular to the grinding direction. In such cases... Figure 1 and Figure 2 The illustrated embodiments or Figure 4 In the illustrated embodiment, the grinding direction is the long side direction of the grinding area, and the grinding advance / retreat direction is a perpendicular line direction to the long side direction. In practice, the grinding advance / retreat direction only needs to lie within a plane perpendicular to the grinding direction; that is, if the grinding advance / retreat direction is the long side direction, it only needs to lie within a vertical plane perpendicular to the long side direction. Therefore, the grinding advance / retreat direction can be a perpendicular line direction, a horizontal line direction, or other directions perpendicular to the long side direction.

[0167] In the following description, the grinding direction is the long side direction of the grinding area and the grinding advance and retreat direction is a perpendicular line direction that is perpendicular to the long side direction.

[0168] The grinding wheel advance / retract mechanism controls at least one of the at least one pair of grinding wheels to move along the grinding advance / retract direction within the grinding wheel mounting structure, thereby adjusting the relative distance between two of the at least one pair of grinding wheels in the direction of the vertical axis, and thus controlling the feed rate during the grinding process, which determines the grinding amount. Additionally, when the silicon rod clamp in the silicon rod conversion device holds the silicon rod, the at least one pair of grinding wheels moves up and down along the direction of the vertical axis under the control of the grinding wheel advance / retract mechanism.

[0169] For example, each pair of grinding wheels is equipped with a grinding wheel advance / retreat mechanism. In one embodiment, the grinding wheel advance / retreat mechanism includes an advance / retreat guide rail and an advance / retreat drive unit. The advance / retreat guide rail is disposed on the grinding wheel mounting structure along the vertical direction. The bottom of the grinding wheel is provided with a guide groove structure or guide block structure along the vertical direction that cooperates with the advance / retreat guide rail. The advance / retreat drive unit may further include, for example, a lead screw and a drive motor. The lead screw is disposed along the advance / retreat guide rail, and the lead screw is associated with the corresponding grinding wheel and shaft-connected to the drive motor.

[0170] In some embodiments of this application, one of the at least one pair of grinding tools is equipped with a lead screw and a drive motor. The lead screw is arranged along the vertical direction and associated with the grinding tool. Thus, the drive motor drives the lead screw to rotate forward, causing the grinding tool associated with the lead screw to move along the feed guide towards the opposite grinding tool to reduce the grinding distance between the two grinding tools (or adjust the grinding feed). Alternatively, the drive motor drives the lead screw to rotate in the opposite direction, causing the grinding tool associated with the lead screw to move along the feed guide away from the opposite grinding tool to increase the grinding distance between the two grinding tools.

[0171] In some embodiments of this application, each of the at least one pair of grinding wheels is equipped with a lead screw and a drive motor. For each grinding wheel, the lead screw is arranged along the vertical direction and associated with the grinding wheel. Thus, the drive motor drives the lead screw to rotate forward, causing the grinding wheel associated with the lead screw to move along the feed guide towards the other grinding wheel arranged opposite to it, thereby reducing the grinding distance between the two grinding wheels (or adjusting the grinding feed). Alternatively, the drive motor drives the lead screw to rotate in the opposite direction, causing the grinding wheel associated with the lead screw to move along the feed guide away from the other grinding wheel arranged opposite to it, thereby increasing the grinding distance between the two grinding wheels.

[0172] In some embodiments of this application, two of the at least one pair of grinding tools share a lead screw and a drive motor. The lead screw may be, for example, a bidirectional lead screw, which is arranged along the plumb line. The bidirectional lead screw has two sections of threads with opposite directions of rotation on its shaft, which are respectively associated with the two grinding tools. The drive motor is associated with the bidirectional lead screw and drives the bidirectional lead screw to rotate, causing the two grinding tools associated with the bidirectional lead screw to move towards or away from each other along the feed guide based on a certain cooperative relationship. For example, if the drive motor drives the bidirectional lead screw to rotate in the forward direction, it drives the two associated grinding tools to move towards each other along the plumb line (i.e., move closer to each other), reducing the grinding distance between the two grinding tools (or adjusting the grinding feed). Alternatively, if the drive motor drives the lead screw to rotate in the reverse direction, it drives the two associated grinding tools to move away from each other along the plumb line (i.e., move away from each other), increasing the grinding distance between the two grinding tools.

[0173] When the grinding device is used to grind a silicon rod held by a silicon rod clamp in a silicon rod conversion device located in the grinding area, the grinding wheel advance / retract mechanism of the grinding device drives the grinding wheels of at least one pair of grinding wheels to move along the vertical direction to determine the feed amount for grinding the grinding surface or edge of the silicon rod. The grinding wheel travel mechanism drives the at least one pair of grinding wheels to move along the grinding direction (the long side direction of the grinding area) until they have passed through the entire silicon rod. If necessary, the grinding wheel travel mechanism can also drive the at least one pair of grinding wheels to reciprocate along the grinding direction to ensure sufficient grinding along the length of the silicon rod. Simultaneously, the grinding wheel advance / retract mechanism drives the at least one pair of oppositely arranged grinding wheels to move in the vertical direction to determine the feed amount for grinding the grinding surface or edge of the silicon rod. Figure 1 and Figure 2 The illustrated embodiments or Figure 4 In the illustrated embodiment, at least one pair of grinding tools in the grinding apparatus are arranged opposite each other along the vertical line, and the grinding surfaces of the at least one pair of grinding tools are located in opposite horizontal planes, wherein the horizontal planes are perpendicular to the vertical line. When grinding the silicon rod, the feed amount is adjusted by driving at least one of the at least one pair of grinding tools to move up and down along the vertical line through the grinding tool advance and retract mechanism, so as to grind the upper and lower sides of the silicon rod along the vertical line.

[0174] As mentioned above, the grinding surface of the grinding wheel in the abrasive tool is typically annular. In a working scenario, when the abrasive tool is used for grinding operations, the abrasive tool mounting structure and the abrasive tool mounted thereon can be moved to adjust the position of the silicon rod relative to the grinding wheel in the abrasive tool, thereby determining the contact chord length between the silicon rod and the grinding surface of the grinding wheel. By increasing the contact length between the edge of the silicon rod and the abrasive tool, the grinding efficiency can be effectively improved and the wear of the grinding wheel in the abrasive tool can be reduced.

[0175] In some embodiments, the grinding apparatus includes an abrasive and a chamfering / rounding abrasive, wherein the chamfering / rounding abrasive is used to chamfer or round the silicon rod at the grinding area.

[0176] The grinding apparatus may include a grinding wheel mounting structure, at least one pair of grinding wheels, and a chamfering / rounding grinding wheel. The at least one pair of grinding wheels are disposed opposite each other on the grinding wheel mounting structure for grinding a pre-cut, squared silicon rod located in the grinding area. In some embodiments, the grinding wheel includes a fine grinding wheel. In some embodiments, the grinding wheel includes a combination of a coarse grinding wheel and a fine grinding wheel. The grinding wheel includes a coarse grinding wheel and a rotary motor connected to the coarse grinding wheel, and the fine grinding wheel includes a fine grinding wheel and a rotary motor connected to the fine grinding wheel.

[0177] The chamfering / rounding abrasive tool is mounted on the abrasive tool mounting structure and is used to chamfer or round the edges of a squared silicon rod. The chamfering / rounding abrasive tool can move with the abrasive. In some embodiments, the chamfering / rounding abrasive tool may include a chamfering / rounding grinding wheel and a rotary motor connected to the chamfering / rounding grinding wheel. The grinding surfaces of the at least one pair of abrasive tools are located in opposing horizontal planes; that is, the grinding surfaces of two of the at least one pair of abrasive tools are located in a first horizontal plane and a second horizontal plane, respectively.

[0178] The molds have been described above and will not be repeated here.

[0179] Regarding the chamfering / rounding abrasive, the chamfering / rounding abrasive is mounted on the abrasive mounting structure, and the grinding surface of the chamfering / rounding abrasive is located in the vertical plane or in the horizontal plane.

[0180] In some embodiments, the chamfering / rounding grinding tool can be moved along the grinding direction by the aforementioned grinding tool traveling mechanism. The chamfering / rounding grinding tool can also be moved along the chamfering / rounding advance and retreat direction by the chamfering / rounding advance and retreat mechanism, wherein the chamfering / rounding advance and retreat direction is perpendicular to the grinding surface of the chamfering / rounding grinding tool.

[0181] In practical applications, the chamfering / rounding grinding tool can be driven to move along the chamfering / rounding forward and backward direction to contact the edge of the silicon rod. The silicon rod can be driven to rotate along its axis using a silicon rod clamp to contact the edge of the silicon rod and achieve rounding. Alternatively, the silicon rod can be driven to rotate along its axis by a preset angle to contact the edge of the silicon rod to contact the chamfering / rounding grinding tool, or the chamfering / rounding grinding tool can be driven to move forward and backward to contact the edge of the silicon rod, thereby achieving chamfering or rounding.

[0182] Furthermore, the axis of the chamfering / rounding grinding wheel is offset from the axis of the silicon rod. The offset between the axis of the chamfering / rounding grinding wheel (which serves as the chamfering / rounding abrasive) and the axis of the squared silicon rod (i.e., the clamping center of the silicon rod clamp in the silicon rod transfer device) allows the chordal edge of the chamfering / rounding grinding wheel to contact the squared silicon rod, maximizing the contact area and improving the efficiency of chamfering or rounding.

[0183] In some embodiments of this application, the grinding apparatus may further include a cooling device for cooling the at least one pair of grinding wheels, reducing damage to the silicon rod surface layer during grinding, and improving the grinding efficiency and service life of the grinding wheels. In one implementation of this embodiment, the cooling device includes a cooling water pipe, a guide groove, and a guide hole. In some embodiments, a protective cover for a rotating motor that allows cooling water to enter the grinding wheel is provided on the outer circumference of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The guide groove is provided on the protective cover as the contact point between the protective cover and the cooling water pipe, and the guide hole is provided in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to a cooling water source. The cooling water drawn through the cooling water pipe to the guide groove and guide hole on the surface of the grinding wheel is guided to reach the grinding surface of the grinding wheel and the silicon rod being ground for cooling. During grinding, the cooling water in the guide hole enters the interior of the grinding wheel by centrifugal force due to the rotation of the grinding wheel for sufficient cooling.

[0184] In some embodiments of this application, the silicon rod cutting and grinding integrated machine may further include a cleaning device. The cleaning device may be mounted on a machine base and is used to clean the silicon rod. Generally, after the silicon rod undergoes the aforementioned cutting and grinding operations, cutting debris generated during the process adheres to the surface of the silicon rod. Therefore, it is necessary to clean the silicon rod when necessary. Generally, the cleaning device includes a cleaning brush head and a cleaning fluid spraying device that cooperates with the cleaning brush head. During cleaning, the cleaning fluid spraying device sprays cleaning fluid onto the silicon rod, while a motor drives the cleaning brush head to act on the silicon rod, completing the cleaning operation. In practical applications, the cleaning fluid may be, for example, pure water, and the cleaning brush head may be, for example, a rotary brush head.

[0185] It should be noted that the above is merely an illustrative example and is not intended to limit the scope of protection of this application. For example, in the description of the grinding operation as a grinding device, the grinding operation of the silicon rod is performed first and then the chamfering / rounding operation of the silicon rod is performed. However, this is not a limitation. In other embodiments, it is also feasible to perform the chamfering / rounding operation of the silicon rod first and then the grinding operation of the silicon rod, and it should still fall within the scope of protection of this application.

[0186] Subsequently, after the silicon ingot undergoes grinding in the grinding device, the silicon ingot transfer device moves it from the grinding area to the waiting area and unloads it from the waiting area of ​​the silicon ingot processing platform. Of course, before unloading the silicon ingot, if necessary, a detection device can inspect the processed silicon ingot in the waiting area. For example, a flatness detector can be used to check the flatness of the silicon ingot. Using a flatness detector, on the one hand, the flatness of the silicon ingot can be checked to verify whether it meets product requirements after each processing operation, thus determining the effectiveness of each processing operation; on the other hand, the flatness of the silicon ingot can also indirectly obtain the wear condition of the processing components in each processing device, facilitating real-time calibration or correction, or even repair or replacement.

[0187] The waiting area is used as a location for loading silicon rods to be processed and waiting for subsequent processing operations, and for unloading silicon rods after processing. To improve the efficiency of silicon rod loading and unloading, the silicon rod cutting and grinding integrated machine of this application also includes a silicon rod transfer device corresponding to the waiting area.

[0188] The silicon rod transfer device is used to load the silicon rod to be processed into the waiting area or to unload the processed silicon rod from the waiting area.

[0189] by Figure 1 and Figure 2 Implementation examples or Figure 4 For example, in the embodiment of the silicon rod cutting and grinding integrated machine, there is a cutting area and a cutting device corresponding to the cutting area, a grinding area and a grinding device corresponding to the grinding area. Therefore, the silicon rod transfer device is used to load the silicon rod to be cut into the waiting area for subsequent cutting and squaring operations by the cutting device in the cutting area, or to unload the silicon rod that has been ground by the grinding device in the grinding area in the waiting area.

[0190] like Figure 1 and Figure 2 or Figure 4 As shown, the silicon rod transfer device 15 includes a silicon rod bearing structure and a position adjustment structure.

[0191] The silicon rod support structure is used to support silicon rods to be cut. The silicon rod support structure includes a support base and a loading component disposed on the support base, wherein the loading component supports the silicon rod to be cut. In other embodiments, the support base may be an integral, for example, plate-like structure, such as a rectangular support plate. Pillow strips may be provided on the rectangular support plate to protect the supported silicon rod. These pillow strips may be made of a flexible material, such as rubber, acrylic, or plastic.

[0192] Regarding the loading components, the loading components may include a first loading component and a second loading component for supporting the silicon rod to be cut. The first loading component and the second loading component are disposed opposite to each other on opposite sides of the width of the support base. In some embodiments, the first loading component and the second loading component are roller assemblies arranged along the length direction of the support base, the roller assembly including a plurality of rollers arranged in sequence, the axles of the plurality of rollers being arranged along the width direction of the support base. The distance between the first loading component and the second loading component is smaller than the diameter of the silicon rod with a circular cross-section to be processed but larger than the side length of the silicon rod with a roughly rectangular cross-section already processed.

[0193] The position adjustment structure is used to adjust the position of the silicon rod support structure.

[0194] In some embodiments, the position adjustment structure includes a vertical lifting mechanism, a first horizontal moving mechanism, and a second horizontal moving mechanism, wherein the first horizontal direction and the second horizontal direction are orthogonal. The vertical lifting mechanism drives the silicon rod support structure and the silicon rod it carries to move vertically up and down. In some embodiments, the vertical lifting mechanism may include a vertical lifting guide rail and a lifting drive source. The first horizontal moving mechanism drives the silicon rod support structure and the silicon rod it carries to move along a first direction. In some embodiments, the first horizontal moving mechanism may include a first direction guide rail and a first direction drive source. The second horizontal moving mechanism drives the silicon rod support structure and the silicon rod it carries to move along a second direction. In some embodiments, the second horizontal moving mechanism may include a second direction guide rail and a second direction drive source.

[0195] In some embodiments, the position adjustment structure includes a vertical lifting mechanism, a horizontal advancing / retreating mechanism, and a rotation mechanism, wherein the horizontal advancing / retreating direction is orthogonal to the long side direction of the waiting area. The vertical lifting mechanism drives the silicon rod support structure and the silicon rod it carries to move vertically up and down. In some embodiments, the vertical lifting mechanism may include a vertical lifting guide rail and a lifting drive source. The horizontal advancing / retreating mechanism drives the silicon rod support structure and the silicon rod it carries to move horizontally forward and backward. In some embodiments, the horizontal advancing / retreating mechanism may include a horizontal advancing / retreating direction guide rail and an advancing / retreating drive unit. The rotation mechanism drives the silicon rod support structure and the silicon rod it carries to rotate along a rotation axis. In some embodiments, the rotation mechanism may include a rotation axis and a rotation drive source.

[0196] The silicon rod transfer device disclosed in this application may further include a centering adjustment mechanism, which can adjust the position of the silicon rod carried by the silicon rod support structure so that the axis of the silicon rod corresponds to a predetermined center line.

[0197] As mentioned above, the alignment operation specifically refers to ensuring that the centerline of the silicon rod is aligned with the clamping centerline of the silicon rod clamp in the silicon rod conversion device; that is, the centerline of the silicon rod coincides with the clamping centerline of the silicon rod clamp in the silicon rod conversion device. In one implementation, all silicon rod clamps in the silicon rod conversion device are identical, and the clamping centerlines of all silicon rod clamps are consistent in the direction of the perpendicular bisector. In another implementation, the silicon rod clamps in the silicon rod conversion device are not identical, and the clamping centerlines of all silicon rod clamps are inconsistent in the direction of the perpendicular bisector.

[0198] In practical applications, taking one silicon rod clamp as an example, the clamping center line of the silicon rod clamp can be predetermined, and a predetermined center line can be determined based on the clamping center line of the silicon rod clamp, wherein the predetermined center line is consistent with the clamping center line of the silicon rod clamp. Therefore, the centering adjustment mechanism is used to adjust the position of the silicon rod to be ground so that its axis corresponds with the predetermined center line.

[0199] Regarding the centering adjustment mechanism, in one embodiment of this application, the centering adjustment mechanism includes a vertical adjustment mechanism and a horizontal adjustment mechanism, which are respectively used to drive the silicon rod support structure and the silicon rod it supports to move vertically and horizontally relative to each other so that the axis of the silicon rod is aligned with a predetermined center line.

[0200] The vertical adjustment mechanism can be achieved through a signed vertical lifting mechanism. The vertical lifting mechanism has been described above, so it will not be repeated here.

[0201] The horizontal adjustment mechanism may include a clamping mechanism, which adjusts the position of the silicon rod located within the clamping mechanism on a horizontal plane. In some implementations, the clamping mechanism may include two clamps arranged laterally along the length of the waiting area. Each clamp includes two clamping members arranged front-to-back along the width of the waiting area. At least one of the clamping members can be moved along the width of the waiting area by a clamping drive unit. The clamping drive unit may include a clamping guide rail and a clamping drive source. The clamping guide rail is arranged along the width of the waiting area, and the clamping drive source can drive at least one clamping member of the clamp to move along the width of the waiting area. For example, when the clamping drive source drives at least one clamping member of the clamp along the width of the waiting area, thereby moving the silicon rod located between the two clamping members until the two clamping members of the same clamp are fully clamped, the clamped silicon rod is then adjusted to the correct position, and the axis of the silicon rod is aligned with a predetermined center line.

[0202] As mentioned above, the centering adjustment mechanism may further include a height detector for detecting the position information of the axis of the silicon rod supported by the silicon rod bearing structure in the direction of the plumb line. In one implementation, the height detector may be, for example, a contact sensor or a distance sensor. Taking a contact sensor as an example, the contact sensor has a probe for contacting the side of the silicon rod (e.g., the top surface of the silicon rod). In some embodiments, the probe of the contact sensor may also be provided with a telescopic spring, which can retract under the action of the telescopic spring when the probe contacts the silicon rod, thereby protecting the probe and preventing it from being damaged by contact or pressure.

[0203] As can be seen from the above, by using the height detector, the height of the silicon rod can be obtained by multi-point detection on the top surface of the silicon rod, and then the position information of the axis of the silicon rod in the direction of the plumb line can be obtained, so as to facilitate subsequent adjustment by the centering adjustment mechanism.

[0204] In practical applications, when using the aforementioned silicon rod transfer device, the specific operation process can be roughly as follows: the silicon rod support structure is located at a predetermined initial position, and the silicon rod to be processed is placed on the first loading component and the second loading component of the silicon rod support structure; the silicon rod supported by the silicon rod support structure is adjusted using the position adjustment structure so that the silicon rod is transferred to the waiting area, and at the same time, the axis of the silicon rod is aligned vertically with the clamping center of the silicon rod clamp; the silicon rod is clamped using the clamping mechanism, which serves as a horizontal adjustment mechanism in the centering adjustment mechanism, so that the axis of the silicon rod is aligned horizontally with the clamping center of the silicon rod clamp, thus completing the centering operation of the silicon rod; the two end faces of the silicon rod are clamped using the silicon rod clamp.

[0205] The silicon rod transfer device disclosed in this application includes a silicon rod bearing structure and a position adjustment structure. It can achieve the centering operation of the silicon rod in the loading process of transferring the silicon rod to be processed to the waiting area, so that the axis of the silicon rod is on the same straight line as the clamping center line of the silicon rod clamp. Taking the silicon rod cutting and grinding integrated machine in the aforementioned embodiment of this application as an example, the silicon rod transfer device disclosed in this application can transfer the silicon rod to be processed from the loading area to the waiting area, so that the axis of the silicon rod is on the same straight line as the clamping center line of the silicon rod clamp at the waiting area, which is beneficial to the subsequent silicon rod processing operation. Compared with related technologies, it has the advantages of simple structure, convenient operation, accurate centering and high efficiency.

[0206] In one embodiment of this application, the silicon rod transfer device can not only load and unload silicon rods in the waiting area, but also enable the silicon rods loaded in the waiting area to complete a centering operation before grinding. Specifically, the centering operation involves aligning the axis of the silicon rod with the clamping center line of the silicon rod clamp in the silicon rod transfer device.

[0207] Here, an embodiment of the silicon rod cutting and grinding integrated machine disclosed in this application integrates a cutting device and a grinding device. The silicon rod conversion device can switch the positions of the horizontally clamped silicon rods in a cutting area and a grinding area, so that the cutting device can perform cutting and squaring operations on the silicon rods and the grinding device can perform grinding operations on the silicon rods. This completes the integrated operation of multiple processes such as cutting, squaring and grinding of silicon rods. At the same time, the cutting device and the grinding device in the silicon rod cutting and grinding integrated machine can be in working state, improving the silicon rod processing efficiency and the quality of product processing, and improving economic benefits.

[0208] This application discloses a silicon rod cutting and grinding method, applied in a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform. The silicon rod processing platform is provided with at least one cutting area and at least one grinding area. The silicon rod cutting and grinding integrated machine also includes at least one cutting device, at least one grinding device, and a silicon rod conversion device. The silicon rod conversion device includes multiple silicon rod clamps. The silicon rod clamps are used to hold silicon rods and make the axis of the held silicon rods aligned with the horizontal line.

[0209] The silicon rod cutting and grinding method disclosed in this application may include the following steps:

[0210] The silicon rod conversion device converts the silicon rod to be cut to at least one cutting area, and the at least one cutting device performs a cutting operation on the silicon rod to be cut in the corresponding cutting area to form a silicon rod with a rectangular cross-section.

[0211] The silicon rod conversion device is rotated by a preset angle to convert the squared silicon rod from at least one cutting area to at least one grinding area, and the at least one grinding device performs grinding operations on the developed silicon rod in the corresponding grinding area.

[0212] The silicon rod cutting and grinding method disclosed in this application is applied to the aforementioned integrated silicon rod cutting and grinding machine. When performing silicon rod cutting and grinding operations, the silicon rod conversion device transfers the silicon rod horizontally between various processing devices in an orderly and seamless manner, and at least one cutting device cuts the silicon rod to form a silicon rod with a square cross-section. At least one grinding device grinds the squared silicon rod, thereby completing the integrated operation of multiple processes such as silicon rod cutting and grinding, improving silicon rod processing efficiency and product processing quality, and increasing economic benefits.

[0213] In some embodiments, such as Figure 1 and Figure 2 or such Figure 4As shown, the silicon rod cutting and grinding integrated machine includes a base with a silicon rod processing platform. The silicon rod processing platform has a waiting area, a cutting area, and a grinding area. The integrated machine also includes a silicon rod conversion device, a cutting device, and a grinding device. The waiting area, cutting area, and grinding area of ​​the silicon rod processing platform are arranged sequentially, with adjacent functional areas at 120° intervals. In this embodiment, the direction following the order of the waiting area, cutting area, and grinding area is defined as the positive direction.

[0214] When using Figure 1 and Figure 2 The illustrated embodiment or Figure 4 When the silicon rod cutting and grinding integrated machine in the illustrated embodiment performs silicon rod processing operations, the specific process can be roughly as follows:

[0215] The first silicon rod is placed in the silicon rod transfer device.

[0216] The first silicon rod is transferred to the waiting area by the silicon rod transfer device, and the first silicon rod is clamped by the silicon rod clamp in the waiting area to complete the loading. The axis of the first silicon rod and the clamping center line of the silicon rod clamp are on the same straight line.

[0217] The silicon rod conversion device rotates by a preset angle to drive each silicon rod clamp on the conversion body and the silicon rod it holds to the corresponding processing area. For example, the silicon rod conversion device can be rotated 120° forward to convert the silicon rod clamp originally located in the waiting area and the first silicon rod it holds to the cutting area.

[0218] The first silicon rod, held by the silicon rod clamp located in the cutting zone of the silicon rod conversion device, is cut and squared by the cutting device.

[0219] In some implementations, the cutting device includes a grid of cutting wires in the shape of a "well". The cutting device is driven by a cutting travel mechanism to move the cutting mounting structure and the cutting unit thereon along a cutting direction consistent with the axis of the first silicon rod. The grid of cutting wires formed by four cutting wires in the cutting unit cuts the first silicon rod during the movement, so that the first silicon rod is cut to form a first silicon rod with a rectangular cross-section and four edge skins around the first silicon rod. Each cutting wire saw forms a side cut and an edge skin on the first silicon rod after cutting it, thus forming a first silicon rod with a rectangular cross-section.

[0220] In some implementations, the cutting device includes a cutting wire mesh in the shape of "=" or "||". A cutting travel mechanism in the cutting device drives the cutting mounting structure and its cutting units to move along a cutting direction aligned with the axis of the first silicon rod. During this movement, the "=" or "||" shaped cutting wire mesh formed by two parallel cutting wire saws in the cutting unit cuts the first silicon rod, forming two opposing parallel side cuts and two edge skins on the first silicon rod. A clamping part rotation mechanism in the silicon rod clamp drives the clamping part of the clamping arm in the silicon rod clamp to rotate 90° clockwise or counterclockwise. Then, the cutting travel mechanism in the cutting device drives the cutting mounting structure and its cutting units to move along a cutting direction aligned with the axis of the first silicon rod. During this movement, the "=" or "||" shaped cutting wire mesh formed by two parallel cutting wire saws in the cutting unit performs a second cutting operation on the first silicon rod, forming two more opposing parallel side cuts and two edge skins on the first silicon rod, resulting in a first silicon rod with a rectangular cross-section.

[0221] In some implementations, the cutting device includes a cross-cutting wire mesh. A cutting travel mechanism in the cutting device drives the cutting mounting structure and its cutting units to move along a cutting direction aligned with the axis of the first silicon rod. During this movement, the cross-cutting wire mesh formed by two cross-cutting wire saws in the cutting unit cuts the first silicon rod, forming two opposing intersecting side cuts and two edge skins on the first silicon rod. A clamping part rotation mechanism in the silicon rod clamp drives the clamping arm in the silicon rod clamp to rotate 180° clockwise or counterclockwise. Then, the cutting travel mechanism in the cutting device drives the cutting mounting structure and its cutting units to move along a cutting direction aligned with the axis of the first silicon rod. During this movement, the cross-cutting wire mesh formed by two cross-cutting wire saws in the cutting unit performs a second cutting operation on the first silicon rod, forming two more opposing intersecting side cuts and two edge skins on the first silicon rod, resulting in a first silicon rod with a roughly rectangular cross-section.

[0222] At the same time, the silicon rod transfer device transfers the second silicon rod to the waiting area, where the silicon rod clamp holds the second silicon rod to complete the loading.

[0223] After the first silicon rod is cut and squared, the silicon rod conversion device rotates by a preset angle to drive each silicon rod clamp and the silicon rod it holds to the corresponding processing area. For example, the silicon rod conversion device can continue to rotate forward by 120° to convert the silicon rod clamp and the first silicon rod it holds, which were originally located in the cutting area, to the grinding area, and to convert the silicon rod clamp and the second silicon rod it holds, which were originally located in the waiting area, to the cutting area.

[0224] The grinding device grinds the first squared silicon rod held by the silicon rod clamp located in the grinding area of ​​the silicon rod conversion device. At the same time, the cutting device cuts the second silicon rod to be cut held by the silicon rod clamp located in the cutting area of ​​the silicon rod conversion device. The silicon rod transfer device transfers the third silicon rod to the waiting area so that the silicon rod clamp in the waiting area can hold the third silicon rod to complete the loading.

[0225] After the first silicon rod completes the grinding process, the silicon rod conversion device rotates by a preset angle to drive each silicon rod clamp and its clamped silicon rod to the corresponding processing area. For example, the silicon rod conversion device can rotate 240° in the reverse direction (or continue to rotate 120° in the forward direction) to transfer the silicon rod clamp and its clamped first silicon rod originally located in the grinding area to the waiting area, transfer the silicon rod clamp and its clamped second silicon rod originally located in the cutting area to the grinding area, and transfer the silicon rod clamp and its clamped third silicon rod originally located in the waiting area to the cutting area.

[0226] The first silicon rod, after grinding, is unloaded from the waiting area by the silicon rod transfer device, and the fourth silicon rod is loaded and transferred to the waiting area, where it is held by the silicon rod clamp to complete the loading. Simultaneously, the grinding device grinds the second silicon rod, which is held by the silicon rod clamp in the grinding area of ​​the silicon rod conversion device, and the cutting device cuts the third silicon rod, which is held by the silicon rod clamp in the cutting area of ​​the silicon rod conversion device, into square pieces.

[0227] Here, an embodiment of the silicon rod cutting and grinding method disclosed in this application is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a base, a silicon rod conversion device, a cutting device, and a grinding device. The base has a silicon rod processing platform, which includes a cutting area and a grinding area. When processing the silicon rod, the silicon rod conversion device rotates by a preset angle to convert the silicon rod to the cutting area. The cutting device then performs a squaring operation on the silicon rod to be cut in the corresponding cutting area to form a silicon rod with a rectangular cross-section. The silicon rod conversion device then rotates by a preset angle to convert the squared silicon rod from the cutting area to the grinding area. The grinding device then performs a grinding operation on the squared silicon rod in the grinding area. This completes the integrated operation of multiple processes such as silicon rod cutting and grinding, and allows both the cutting device and the grinding device in the silicon rod cutting and grinding integrated machine to be in working condition at the same time, improving silicon rod processing efficiency and product processing quality, and increasing economic benefits.

[0228] Please see Figure 5 and Figure 6 The image shown is a structural schematic diagram of the silicon rod cutting and grinding integrated machine of this application in yet another embodiment.

[0229] The silicon rod cutting and grinding integrated machine of this application is used for cutting and grinding silicon rods with a circular cross-section. The silicon rod can be, for example, a monocrystalline silicon rod or a polycrystalline silicon rod. Taking a monocrystalline silicon rod as an example, the monocrystalline silicon rod is obtained by cutting a raw silicon rod and then squaring it using a silicon rod squaring device. The raw silicon rod is usually a rod-shaped monocrystalline silicon rod grown from a melt using the Czochralski method or the floating zone melting method.

[0230] like Figure 5 and Figure 6 As shown, another embodiment of this application discloses a silicon rod cutting and grinding integrated machine, including: a base 21, a silicon rod conversion device 22, a first cutting device 23, a second cutting device 24, and a grinding device 25.

[0231] The base, as the main component of the silicon rod cutting and grinding integrated machine, provides a silicon rod processing platform. In some examples, the base is relatively large in size and weight to provide a large mounting surface and robust overall machine stability. It should be understood that the base can serve as a seat for different structures or components performing processing operations within the silicon rod cutting and grinding integrated machine, and the specific structure of the base can be modified based on different functional or structural requirements. In some examples, the base includes fixing or limiting structures for supporting different components within the silicon rod cutting and grinding integrated machine, such as a base, rod, column, or frame, all of which are types of bases described in this application.

[0232] Meanwhile, in some examples, the base may be an integral base, while in other examples, the base may include multiple independent bases.

[0233] The machine base has a silicon rod processing platform, which can be divided into multiple functional areas according to the specific work content of the silicon rod processing operation. For example, the silicon rod processing platform includes at least a cutting area and a grinding area. It should be noted that in the examples provided in this application, the functional areas are defined by the travel path and range of the processing device at the functional area. For example, the cutting device of the silicon rod cutting and grinding integrated machine is located at the cutting area, and the range of the cutting area is the range occupied by the cutting device during the cutting and squaring operation; similarly, the grinding device of the silicon rod cutting and grinding integrated machine is located at the grinding area, and the range of the grinding area is the range occupied by the grinding device during the grinding operation. The shape of the silicon rod processing platform can be determined based on the machine base, or it can be determined jointly based on the processing needs of the machine base, the cutting device, and the grinding device. Figure 5 and Figure 6In the illustrated embodiment, the base 21 has a silicon rod processing platform with two cutting zones and one grinding zone. The two cutting zones can be referred to as the first cutting zone and the second cutting zone, and are arranged sequentially as follows: A first cutting device 23 is provided in the first cutting zone to perform a first cutting operation on the silicon rod located therein; a second cutting device 24 is provided to perform a second cutting operation on the silicon rod located in the second cutting zone. Through the first and second cutting operations, a silicon rod with a circular cross-section can be cut into a silicon rod with a roughly rectangular cross-section. A grinding device 25 is provided in the grinding zone to perform a grinding operation on the silicon rod located therein.

[0234] The silicon rod transfer device is located on the silicon rod processing platform of the machine base and is used to transfer silicon rods. For example, the silicon rod transfer device can be used to change the position of the silicon rod between the cutting area and the grinding area. Figure 5 and Figure 6 In the illustrated embodiment, the silicon rod conversion device 22 further includes a conversion body 221, a plurality of silicon rod clamps 222 disposed on the conversion body 221, and a conversion drive mechanism (not shown in the figures). The clamping center lines of the plurality of silicon rod clamps 222 disposed on the conversion body 221 are aligned with the horizontal line. It should be understood that, under this configuration, the silicon rods clamped by the silicon rod clamps 222 are in a horizontal position.

[0235] The conversion body can be located in the central area of ​​the silicon rod processing platform, and each side of the conversion body can serve as a mounting surface for mounting multiple silicon rod clamps. Figure 5 and Figure 6 In the illustrated embodiment, silicon rod clamps 222 are mounted on each side of the conversion body 221. Specifically, the conversion body can be disc-shaped, annular, square-shaped, or other similar in shape. The number of silicon rod clamps on the conversion body can vary depending on the layout of the silicon rod cutting and grinding machine.

[0236] The conversion body is driven by a conversion drive mechanism to switch the silicon rod clamps mounted on it between different functional areas. This allows the silicon rods held by the clamps to change positions between different functional areas, enabling different processing steps such as cutting and squaring, and grinding. Simultaneously, multiple silicon rod clamps mounted on the conversion body can be positioned in different functional areas. Thus, at the same time, silicon rods held by different clamps can undergo corresponding processing steps in different functional areas. For example, the cutting and grinding devices in the integrated silicon rod cutting and grinding machine can be operating simultaneously, which improves processing efficiency.

[0237] For example, in some embodiments, the silicon rod processing platform may include two functional areas, such as a first functional area and a second functional area. To adapt to these functional areas, the number of silicon rod clamps on the conversion body may be set to two, each clamping at least one silicon rod. Furthermore, the angle between the two silicon rod clamps is consistent with the angular distribution between the two functional areas. Thus, when one silicon rod clamp corresponds to one functional area, the other silicon rod clamp necessarily corresponds to the other functional area. In this way, during assembly line operations, at any given time, when each silicon rod clamp holds at least one silicon rod and the clamp corresponds to a functional area, these silicon rods are located at the corresponding functional area and performing a corresponding processing operation. For example, a first processing operation can be performed on the silicon rod located in the first functional area, and a second processing operation can be performed on the silicon rod located in the second functional area.

[0238] In some embodiments, the silicon rod processing platform may include three functional areas, such as a first functional area, a second functional area, and a third functional area; or two first functional areas and a second functional area; or one first functional area and two second functional areas. To accommodate these functional areas, the number of silicon rod clamps on the conversion body may be set to three, each clamping at least one silicon rod. Furthermore, the angles between any two of the three silicon rod clamps correspond to the angular distribution between any two of the three functional areas. Thus, when one silicon rod clamp corresponds to one functional area, the other two silicon rod clamps necessarily correspond to the other two functional areas. Thus, in the assembly line operation, at any given moment, when each silicon rod clamp holds at least one silicon rod and the silicon rod clamp corresponds to a functional area, these silicon rods are performing a corresponding processing operation at that functional area. For example, a first processing operation can be performed on the silicon rod located in the first functional area, a second processing operation can be performed on the silicon rod located in the second functional area, and a third processing operation can be performed on the silicon rod located in the third functional area; or, a first processing operation can be performed on the silicon rod located in two first functional areas, and a second processing operation can be performed on the silicon rod located in one second functional area; or, a first processing operation can be performed on the silicon rod located in one first functional area, and a second processing operation can be performed on the silicon rod located in two second functional areas. In an optional example, the first, second, and third functional areas on the silicon rod processing platform are distributed at 120° intervals between each pair. Therefore, correspondingly, the three silicon rod clamps on the conversion body are also distributed at 120° intervals between each pair. Of course, the number of silicon rod clamps can be varied according to actual needs and is not limited to this. For example, the number of silicon rod clamps can be determined according to the number of functional areas set up on the silicon rod processing platform.

[0239] In some embodiments, the silicon rod processing platform includes four functional areas, such as: a first functional area, a second functional area, a third functional area, and a fourth functional area; or two first functional areas and two second functional areas; or two first functional areas, a second functional area, and a third functional area; or a first functional area, two second functional areas, and a third functional area. To accommodate these functional areas, the number of silicon rod clamps on the conversion body can be set to four, each clamping at least one silicon rod. Furthermore, the angles between adjacent silicon rod clamps among these four clamps are consistent with the angular distribution between adjacent functional areas of the four functional areas. Thus, when a silicon rod clamp corresponds to a specific functional area, the other three silicon rod clamps necessarily correspond to the other three functional areas respectively. Thus, in the assembly line operation, at any given moment, when each silicon rod fixture holds at least one silicon rod and the fixture corresponds to a functional area, these silicon rods are located at their respective functional areas and performing corresponding processing operations. For example, a first processing operation can be performed on silicon rods located in the first functional area, a second processing operation can be performed on silicon rods located in the second functional area, a third processing operation can be performed on silicon rods located in the third functional area, and a fourth processing operation can be performed on silicon rods located in the fourth functional area; or, a processing operation can be performed on silicon rods located in two first functional areas. The silicon ingots in the four functional areas can undergo a first processing operation, and silicon ingots in two second functional areas can undergo a second processing operation; alternatively, silicon ingots in two first functional areas can undergo a first processing operation, silicon ingots in one second functional area can undergo a second processing operation, and silicon ingots in one third functional area can undergo a third processing operation; or, silicon ingots in one first functional area can undergo a first processing operation, silicon ingots in two second functional areas can undergo a second processing operation, and silicon ingots in one third functional area can undergo a third processing operation. In an optional embodiment, adjacent functional areas on the four functional areas of the silicon ingot processing platform are distributed at 90° intervals, and correspondingly, the four silicon ingot clamps on the transport body are also distributed at 90° intervals in pairs. Of course, the number of silicon ingot clamps can be varied according to actual needs and is not limited thereto; for example, the number of silicon ingot clamps can be determined according to the number of functional areas set on the silicon ingot processing platform.

[0240] In such Figure 5 and Figure 6In the illustrated embodiment, the silicon rod processing platform may include four functional areas, such as a waiting area, a first cutting area, a second cutting area, and a grinding area. These four functional areas are arranged at 90° intervals between each other; that is, the waiting area is 90° away from the first cutting area, the first cutting area is 90° away from the second cutting area, the second cutting area is 90° away from the grinding area, and the grinding area is 90° away from the waiting area. Correspondingly, four silicon rod clamps 222 may be provided on the conversion body 221, with adjacent silicon rod clamps 222 arranged at 90° intervals. Each silicon rod clamp 222 can hold at least one silicon rod. In a continuous production line, at any given moment, when one silicon rod clamp corresponds to a certain functional area, the other three silicon rod clamps correspond to the other three functional areas respectively. For example, when the first silicon rod clamp corresponds to the waiting area, the second silicon rod clamp corresponds to the first cutting area, the third silicon rod clamp corresponds to the second cutting area, and the fourth silicon rod clamp corresponds to the grinding area. In this way, the first silicon rod clamp can be controlled to load a new silicon rod or unload the silicon rod held by the first silicon rod clamp in the waiting area. The first cutting operation is performed on the silicon rod held by the second silicon rod clamp in the first cutting area. The second cutting operation is performed on the silicon rod held by the third silicon rod clamp in the second cutting area. The grinding operation is performed on the silicon rod held by the fourth silicon rod clamp in the grinding area.

[0241] The conversion drive mechanism (not shown in the figures) serves as the drive mechanism for changing the functional position of the silicon rod clamps on the conversion body. In some embodiments, the conversion drive mechanism includes a shifting shaft, so that by driving the shifting shaft to rotate by a preset angle, the conversion body and the various silicon rod clamps disposed on it can change positions between various functional areas. In some embodiments, the shifting shaft is located at the geometric center of the conversion body, and the shifting shaft is arranged in the vertical direction.

[0242] The transposition shaft is located in the vertical direction, meaning that during the conversion process, the height of the silicon rod clamps on the conversion body remains unchanged, and the height of the corresponding clamping center line of the silicon rod clamps also remains unchanged. Here, the multiple silicon rod clamps on the conversion body of the silicon rod cutting and grinding machine are configured such that their clamping center lines are located at the same horizontal height. During the controlled rotation of the conversion body, the horizontal height of the clamping center lines of the multiple silicon rod clamps remains unchanged. Thus, when any of the silicon rod clamps loads a silicon rod, adjusting the height of the silicon rod axis to the same predetermined height will align the silicon rod axis with the clamping center line in a third direction (i.e., the vertical direction). The predetermined height is the same horizontal height of the clamping center lines of the multiple silicon rod clamps.

[0243] Understandably, the fact that the clamping center lines of the multiple silicon rod clamps described in this application are at the same horizontal height does not mean that the clamping center lines of the multiple silicon rod clamps are limited to the same precise height range. In some embodiments, when the height difference between the corresponding clamping center lines of the multiple silicon rod clamps on the conversion body is within a preset range, it can be considered that the clamping center lines of the multiple silicon rod clamps are at the same horizontal height. Furthermore, setting the clamping center lines of the multiple silicon rod clamps to be at the same horizontal height is not merely an illustrative example. In other embodiments, the clamping center lines of the multiple silicon rod clamps may also be set to be at different horizontal heights.

[0244] In other embodiments, the height of the clamping centerline corresponding to the silicon rod clamp can also be obtained by the control system of the silicon rod cutting and grinding machine. Correspondingly, when loading the silicon rod to be processed, the height of the silicon rod axis is adjusted to the horizontal height corresponding to the silicon rod clamp.

[0245] The silicon rod clamp is used to clamp the two end faces of the silicon rod. Correspondingly, the silicon rod clamp naturally has two opposing clamping parts for contacting the pair of end faces of the silicon rod. The clamping center line is the line connecting the centers of the two contact surfaces at the two ends of the silicon rod corresponding to the two clamping parts. The center of the clamping part is not limited to the geometric center of the contact surface, but can also be a point on the contact surface that is set manually. In some embodiments provided in this application, the silicon rod clamp can also drive the silicon rod to rotate along the silicon rod axis. In this example, the clamping center line is the rotation axis direction of the clamping part. Usually, in actual processing scenarios, in order to keep the position (or height) of the silicon rod axis unchanged when the silicon rod is driven to rotate by the silicon rod clamp, when loading the silicon rod to be processed onto the silicon rod clamp, it is usually necessary to align (i.e., coincide) the clamping center line of the silicon rod clamp with the silicon rod axis.

[0246] As mentioned earlier, the transposition shaft rotates by a preset angle after being controlled, causing the conversion body and its various silicon rod clamps to switch positions between different functional areas. Therefore, the conversion drive mechanism also includes a transposition drive unit for driving the transposition shaft to rotate. The transposition drive unit drives the transposition shaft to rotate by a preset angle to drive the multiple silicon rod clamps to perform conversion actions.

[0247] In some implementations, the shifting drive unit may include a driving gear, a drive source, and a driven gear, wherein the driving gear is shaft-connected to the drive source, and the driven gear meshes with the driving gear and is connected to the shifting shaft. In some implementations, the shifting drive unit may include a drive source directly associated with the shifting shaft. The power source may, for example, be a servo motor.

[0248] In practical applications, the aforementioned shifting drive unit, including a drive gear, a drive source, and a driven gear, will be used as an example for explanation. In some embodiments, the functional areas are arranged linearly in sequence. The drive source drives the drive gear to rotate forward. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft rotate forward by a preset angle. This causes the position of the conversion body and its various silicon rod clamps to switch from the current functional area to an adjacent next functional area or other subsequent functional areas. Alternatively, the drive source can drive the drive gear to rotate in the opposite direction. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft rotate forward by a preset angle. This causes the conversion body and its various silicon rod clamps to switch from the current functional area to an adjacent previous functional area or other previous functional areas. In some embodiments, the functional areas are arranged in a ring in sequence. The drive source drives the drive gear to rotate forward. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft are driven to rotate forward by a preset angle. This causes the position of the conversion body and its various silicon rod clamps to switch from the current functional area to the next adjacent functional area, other subsequent functional areas, other previous functional areas, or the next adjacent functional area. Alternatively, the drive source can drive the drive gear to rotate in the opposite direction. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft are driven to rotate forward by a preset angle. This causes the conversion body and its various silicon rod clamps to switch from the current functional area to the previous adjacent functional area, other previous functional areas, other subsequent functional areas, or the next adjacent functional area.

[0249] exist Figure 5 and Figure 6In the illustrated embodiment, the functional areas are arranged in a ring in sequence. For example, taking two adjacent functional areas as being 90° apart (or 45°, 60°, 72°, 120°, 150°, 180° or other preset angles), suppose that in one case, in the initial state, a silicon rod clamp in the silicon rod conversion device holds a silicon rod and the silicon rod clamp and the silicon rod it holds corresponds to the first functional area. The drive source drives the drive gear to rotate in the reverse direction. Through the meshing of the drive gear and the driven gear, the driven gear and its associated shifting shaft are driven to rotate forward by a preset angle of 90°, so that the silicon rod clamp and the silicon rod it holds in the silicon rod conversion device are transferred from the first functional area to the second functional area. Alternatively, in another scenario, in the initial state, one of the silicon rod clamps in the silicon rod conversion device holds a silicon rod, and this clamp and the held silicon rod correspond to the second functional area. The drive source drives the driving gear to rotate forward. Through the meshing of the driving gear and the driven gear, the driven gear and its associated shifting shaft are driven to rotate in the opposite direction by a preset angle of 90°. This transfers the silicon rod clamp and the held silicon rod from the second functional area to the first functional area. The preset angle is not strictly limited; for example, besides the aforementioned 90°, in actual processing scenarios, the preset angle can deviate from 90° to a certain extent. For example, the preset angle can be 90° ± 3°, or other angles.

[0250] In actual processing scenarios, to avoid the accumulation of errors after multiple transfers of the conversion body during continuous processing, the clamping center line of the silicon rod fixture should be parallel or approximately parallel to the long side direction of the functional area. The preset angle can also be determined by the direction of the clamping center line of the silicon rod in the current functional area and the long side direction of the next functional area. For example, the preset angle is used to ensure that after the silicon rod fixture is transferred to the next functional area, its clamping center line is parallel or approximately parallel to the long side of the next functional area. The parallelism or approximately parallelism is, for example, an angle of 0° to 5° between the clamping center line of the silicon rod and the long side direction of the functional area.

[0251] In the silicon rod slicing and grinding machine of this application, the clamping center line of the silicon rod clamp is set in the horizontal direction. Here, the shifting shaft is set in the vertical direction. When the conversion body drives the silicon rod clamp to rotate along the shifting shaft, the clamping center line of the silicon rod clamp is still in the horizontal direction (i.e., the clamping center line of the silicon rod clamp is a horizontal line). In addition, when the silicon rod clamp clamps the silicon rod, the axis of the clamped silicon rod is required to be set in the horizontal direction or the deviation from the horizontal line is within a preset range. Therefore, in some embodiments, the clamping center line of the silicon rod clamp coincides with the axis of the silicon rod. Generally, the angle between different functional areas of the silicon rod slicing and grinding machine in the working state is a fixed value. Therefore, when transferring a silicon rod clamp from one functional area to another functional area, the preset angle of rotation of the shifting shaft can be made equal to the angle between the two functional areas.

[0252] As previously mentioned, the silicon rod conversion device includes multiple silicon rod clamps. For example, in Figure 5 and Figure 6 In the illustrated embodiment, silicon rod clamps 222 are installed on each side of the conversion body 221 in the silicon rod conversion device 22. The silicon rod clamps 222 are used to hold the silicon rods, wherein the axis of the held silicon rod is a horizontal line when the silicon rod is held by the clamps 222. In this embodiment, all the silicon rod clamps are of the same specification, and their structures and working principles are the same. However, this is not a limitation; in other embodiments, the silicon rod clamps may be of different specifications.

[0253] Regarding silicon rod clamps, any silicon rod clamp includes a pair of clamping arms and a clamping arm drive mechanism.

[0254] The pair of clamping arms are arranged opposite each other along a horizontal line to clamp the two end faces of the silicon rod, so that the clamped silicon rod is placed horizontally, that is, the length direction of the silicon rod is placed along the horizontal line, and the end faces of the silicon rod are the cross-sections at both ends in the length direction. Two of the clamping arms extend outward from one side of the conversion body, and each of the clamping arms has a clamping part, that is, each clamping arm has a clamping part.

[0255] Of course, the specific structure and orientation of the silicon rod clamp are not limited to this. For example, a pair of clamping arms of the silicon rod clamp are set along a horizontal line, while the clamping arms can be set in a vertical direction or in a horizontal direction. Understandably, the clamping center line of the silicon rod clamp can be set as a horizontal line to clamp the silicon rod horizontally.

[0256] The clamping arm drive mechanism can be used to drive at least one of the clamping arms in a pair to move along a horizontal line to adjust the clamping distance between the pair of clamping arms. Two of the clamping arms in the pair are arranged opposite each other along a horizontal line, and the clamping arm drive mechanism can drive at least one of the clamping arms in the pair to move along the horizontal line to adjust the clamping distance between the oppositely arranged pair of clamping arms.

[0257] In the embodiments provided in this application, the clamping arm driving mechanism may include: an opening and closing guide rail and an opening and closing driving unit (not shown), wherein the opening and closing guide rail is disposed on the conversion body along a horizontal line and is used to set a pair of clamping arms, and the opening and closing driving unit is used to drive at least one of the pair of clamping arms to move along the opening and closing guide rail.

[0258] In some embodiments, the clamping arm drive mechanism can drive one of the pair of clamping arms to move closer to the other clamping arm along a horizontal line, reducing the clamping distance between the two clamping arms and thereby clamping the silicon rod located between the two clamping arms. Correspondingly, the clamping arm drive mechanism can drive one of the pair of clamping arms to move away from the other clamping arm along a horizontal line, increasing the clamping distance between the two clamping arms to release the clamped silicon rod.

[0259] Assuming that the first clamping arm of the pair of clamping arms can be driven to move along a horizontal line by a clamping arm drive mechanism, the second clamping arm of the pair of clamping arms can be fixedly mounted on the conversion body by, for example, a clamping arm mounting base or a similar structure.

[0260] In some embodiments, the opening and closing drive unit in the clamping arm drive mechanism may include a lead screw and a drive source, wherein the lead screw is arranged along a horizontal line and associated with a first clamping arm of the pair of clamping arms, and the drive source is associated with the lead screw for driving the lead screw to rotate so that the associated first clamping arm moves along the horizontal line. For example, if the drive source drives the lead screw to rotate in the forward direction, the associated first clamping arm is driven to move closer to the second clamping arm along the horizontal line, reducing the clamping distance between the two clamping arms; or, if the drive source drives the lead screw to rotate in the reverse direction, the associated first clamping arm is driven to move away from the second clamping arm along the horizontal line, increasing the clamping distance between the two clamping arms. The drive source may be, for example, a servo motor. In the above embodiments, the opening and closing drive unit can still adopt other structures. For example, in some other embodiments, the opening and closing drive unit may include a rack, a drive gear, and a drive motor. The rack is arranged along a horizontal line and is associated with the first clamping arm of the pair of clamping arms. The drive gear is controlled by the drive motor and meshes with the rack. Thus, the drive motor drives the drive gear to rotate, causing the rack and its associated first clamping arm to move along the horizontal line. For example, if the drive source drives the drive gear to rotate in the forward direction, the first clamping arm associated with the rack is driven to move closer to the second clamping arm along the horizontal line, reducing the clamping distance between the two clamping arms. Alternatively, if the drive source drives the drive gear to rotate in the reverse direction, the first clamping arm associated with the rack is driven to move away from the second clamping arm along the horizontal line, increasing the clamping distance between the two clamping arms.

[0261] In some embodiments, the clamping arm driving mechanism can drive two of the pair of clamping arms to move towards each other, reducing the clamping distance between the two clamping arms, thereby clamping the silicon rod located between the two clamping arms. Correspondingly, the clamping arm driving mechanism can drive two of the pair of clamping arms to move away from each other, increasing the clamping distance between the two clamping arms to release the clamped silicon rod.

[0262] It is assumed that both of the pair of clamping arms can be driven by a clamping arm drive mechanism to move along a horizontal line.

[0263] In some embodiments, the opening and closing drive unit in the clamping arm drive mechanism may include a bidirectional lead screw and a drive source. The bidirectional lead screw is arranged along a horizontal line and is a left- or right-handed lead screw. It has two sections of threads on its shaft with opposite directions of rotation; one section is a left-handed thread and the other is a right-handed thread. The left-handed thread can be associated with one of the clamping arms in a pair, and the right-handed thread can be associated with the other clamping arm in a pair. The drive source is associated with the bidirectional lead screw and is used to drive the bidirectional lead screw to rotate so that the associated first and second clamping arms move towards each other or away from each other along the horizontal line. For example, if the drive source drives the bidirectional lead screw to rotate in the forward direction, the associated first and second clamping arms will move towards each other (i.e., move closer to each other) along the horizontal line, reducing the clamping distance between the two clamping arms. Alternatively, if the drive source drives the lead screw to rotate in the reverse direction, the associated first and second clamping arms will move away from each other (i.e., move away from each other) along the horizontal line, increasing the clamping distance between the two clamping arms. The drive source may be, for example, a servo motor, located in the middle section of the bidirectional lead screw. In the above embodiment, the clamping arm drive mechanism may still adopt other structures. For example, in some other embodiments, the clamping arm drive mechanism may include: a pair of racks, a drive gear, and a drive motor, wherein the pair of racks are parallel to each other and both are arranged along a horizontal line, one rack of the pair of racks is associated with the first clamping arm of the pair of clamping arms, and the other rack of the pair of racks is associated with the second clamping arm of the pair of clamping arms, the drive gear is located between the pair of racks to mesh with the pair of racks and is controlled by the drive motor, so that the drive motor drives the drive gear to rotate, causing the pair of racks and their associated first and second clamping arms to move towards or away from each other along the horizontal line. For example, if the drive source drives the drive gear to rotate in the forward direction, it will drive the first and second clamping arms associated with the pair of racks to move towards each other along the horizontal line (i.e., move closer to each other), thereby reducing the clamping distance between the two clamping arms. Alternatively, if the drive source drives the drive gear to rotate in the reverse direction, it will drive the first and second clamping arms associated with the pair of racks to move away from each other along the horizontal line (i.e., move further away from each other), thereby increasing the clamping distance between the two clamping arms.

[0264] In some embodiments of this application, the clamping portion of the clamping arm is designed to rotate. For example, any silicon rod clamp further includes a clamping portion rotation mechanism for driving the clamping portion on the clamping arm of the silicon rod clamp to rotate. In one implementation of this embodiment, the clamping portion of the clamping arm rotates about the silicon rod's axis of rotation under the drive of the clamping portion rotation mechanism, causing the clamped silicon rod to rotate accordingly about its axis of rotation. In actual processing, by driving the silicon rod to rotate along its axis through the clamping portion rotation mechanism, the positional relationship of the clamped silicon rod relative to the cutting or grinding device can be adjusted.

[0265] In some embodiments, the clamping part is a multi-point contact clamping head. Understandably, the contact method between the multi-point contact clamping head and the silicon rod end face is not limited to point contact. The clamping part, for example, has multiple protrusions to contact the silicon rod end face, wherein each protrusion can have surface contact with the silicon rod end face. In one implementation, the protrusions of the clamping part can also be connected to the clamping part body via a spring along a horizontal line, thereby forming a multi-point floating contact, allowing the silicon rod clamp to adapt to the flatness of the silicon rod end face when clamping the silicon rod. In some examples, the clamping part for contacting the silicon rod end face can also be connected to a clamping arm via a universal mechanism, such as a ball joint, thereby adapting the clamping part to clamp silicon rod end faces with different inclinations.

[0266] In some embodiments, the pair of clamping portions of the silicon rod clamp are configured as rigid structures to prevent the clamped silicon rod from being disturbed during cutting and grinding operations, thus affecting the processing accuracy.

[0267] In practical applications, the clamping part rotation mechanism may include a rotatable structure provided on two clamping parts in a pair of clamping arms and a drive source for driving at least one of the two rotatable structures to rotate.

[0268] In some embodiments of this application, the rotatable platform may be configured as a whole hinged together by a hinged device with a locking function, and may rotate along a horizontal axis. The axis of rotation is connected to the rotating mechanism of the clamping part.

[0269] In some embodiments of this application, the clamping portion of the clamping arm can be configured as a rotatable frustum, the circular plane of which contacts the end face of the silicon rod and remains relatively stationary after being pressed against the end face of the silicon rod. The silicon rod clamping portion also includes a locking structure, wherein the clamping arm clamping portion is in a locked state when grinding a selected surface. During the switching between different grinding surfaces, the silicon rod clamping portion rotates around the center of the frustum under the drive of the clamping portion rotation mechanism.

[0270] In some implementations, the clamping part of the clamping arm includes a rotatable frustum and a series of protruding contacts disposed on the frustum. Each contact has a contact plane for contacting the clamped silicon rod. The frustum rotates under the drive of the clamping part's rotating mechanism. Regarding the contacts, in some implementations, the protrusion length of the contacts, i.e., their position on the horizontal line, is adjustable. This allows, during the clamping process, for silicon rods with low end-face flatness, the protrusion length of the contacts can be adjusted according to the end face of the silicon rod, ensuring that the contact surface of each contact is in close contact with the end face of the silicon rod. The protrusion length is the length of the horizontal line from the circular plane of the frustum to the contact plane of the contact.

[0271] In some embodiments of this application, the clamping portion of the silicon rod clamp may be equipped with a pressure sensor to adjust the protrusion length of the contact points based on the detected pressure state. Typically, during the clamping of the silicon rod, a pair of clamping arms of the silicon rod clamp approach each other along a horizontal line under the drive of the clamping arm drive mechanism until the clamping portion contacts the end face of the silicon rod to be clamped. When the clamping portion is provided with multiple contacts and the pressure value detected when some contacts contact the end face of the silicon rod is less than a set value or a set area, the clamping tightness can be changed by adjusting the protrusion length of the contacts (generally in the direction of approaching the end face of the silicon rod). Alternatively, during the clamping of the silicon rod, the clamping arm drive mechanism drives a pair of clamping arms to approach each other facing the two ends of the silicon rod. After the clamping portion contacts the end face of the silicon rod, the pressure sensor detects the degree of clamping of the silicon rod. When the set pressure range is reached, the clamping arm drive mechanism controls the stopping of the opposing movement of the pair of clamping arms.

[0272] The clamping rotation mechanism can be mounted on one of the clamping arms of a pair of clamping arms to drive the clamping parts of the pair of clamping arms to rotate with the clamped silicon rod; or the clamping rotation mechanism can be mounted on each of the pair of clamping arms and coordinately control the two clamping parts of the pair of clamping arms to rotate at the same angle and in the same direction. In some implementations, the drive source in the clamping rotation mechanism can be a drive motor.

[0273] Thus, in this embodiment of the application, the multiple silicon rod clamps configured by the silicon rod conversion device can horizontally clamp the silicon rod and drive the clamped silicon rod to rotate at a predetermined angle with its axis as the pivot, wherein the axis of the silicon rod is a horizontal line.

[0274] The silicon rod is held at both ends by the silicon rod clamp. A conversion drive mechanism in the silicon rod conversion device drives the conversion body to transfer the silicon rod clamp and the held silicon rod to the corresponding functional area. A processing device then performs corresponding processing operations on the silicon rod held by the clamp at that functional area. For example, a cutting device is provided at the cutting area, and a grinding device is provided at the grinding area. The conversion drive mechanism drives the conversion body to transfer the silicon rod clamp and the held silicon rod to the cutting area, where the cutting device performs a cutting operation on the silicon rod held at that cutting area. Alternatively, the conversion drive mechanism drives the conversion body to transfer the silicon rod clamp and the held silicon rod to the grinding area, where the grinding device performs a grinding operation on the silicon rod held at that grinding area.

[0275] In actual processing scenarios, the silicon rod clamp holds the silicon rod to be ground horizontally. The conversion body drives the silicon rod clamp to be transferred sequentially to the cutting area and grinding area corresponding to the cutting device and grinding device, so that the cutting device can perform cutting operation on the silicon rod held by the silicon rod clamp at the cutting area and the grinding device can perform grinding operation on the silicon rod held by the silicon rod clamp at the grinding area.

[0276] Understandably, the shape of the conversion body and the positions of the multiple silicon rod clamps on the conversion body determine the angle at which the conversion body needs to be converted when the cutting and grinding devices have completed the cutting and grinding operations on the silicon rods and are about to perform the cutting and grinding operations on the next silicon rod.

[0277] To simplify the equipment layout of the silicon rod cutting and grinding integrated machine of this application, and to simplify the transfer process required for the processing devices (i.e., the cutting device and the grinding device) to perform processing operations, this application also provides the following embodiments:

[0278] exist Figure 5 and Figure 6 In the illustrated embodiment, the silicon rod cutting and grinding integrated machine includes a first cutting area, a second cutting area, a grinding area, and a waiting area. The silicon rod conversion device includes a conversion body and multiple silicon rod clamps and a conversion drive mechanism disposed on the conversion body. The conversion body has a rectangular outline (e.g., a square or rectangular shape) in the horizontal plane, and a silicon rod clamp is provided on each of the four sides of the conversion body outline. If two adjacent functional areas in the first cutting area, second cutting area, grinding area, and waiting area are distributed at 90° intervals, then the conversion body has a square outline in the horizontal plane. Taking the conversion drive mechanism including a shifting shaft as an example, the rotation center of the conversion body can be set at the geometric center of the square. At any initial moment, the conversion body can overlap with the initial position every 90° rotation in the clockwise or counterclockwise direction.

[0279] In some embodiments where the outline of the conversion body in the horizontal plane is square, a silicon rod clamp is provided on the outer side of each side of the square outline of the conversion body. The angle between two adjacent silicon rod clamps is consistent with the angle distribution between two adjacent functional areas. The clamping center line of any silicon rod clamp can be parallel to the corresponding side.

[0280] In a specific implementation, for any silicon rod clamp, it is set on the outer side of one side of the contour of the conversion body, for example, on a horizontal guide rail, guide groove or guide post on the outer side of the square, then the clamping center line of the silicon rod clamp is parallel to the corresponding side.

[0281] In this configuration, when the conversion body is driven to rotate by a preset angle, such as 90°, by the conversion drive mechanism, the silicon rod held by the silicon rod clamp on one side of the conversion body can be changed from corresponding to the previous functional area to corresponding to the next functional area 90° apart. For example, if the silicon rod held by the silicon rod clamp on one side of the conversion body currently corresponds to the waiting area (or the first cutting area, the second cutting area, or the grinding area), after the conversion body is driven to rotate forward by the conversion drive mechanism by 90°, the silicon rod held by the silicon rod clamp on one side of the conversion body will correspond to the first cutting area (or change from the first cutting area to the second cutting area, from the second cutting area to the grinding area, or from the grinding area to the waiting area). This can also be understood as follows: the silicon rod being processed by the processing device in a certain functional area is changed from being held by a silicon rod clamp on one side of the conversion body to being held by a silicon rod clamp located on the other side at a 90° interval. For example, after the first cutting device in the first cutting area performs a first cutting operation on the first silicon rod held by the first silicon rod clamp on one side of the conversion body, the conversion body is driven to rotate 90° forward by the conversion drive mechanism. The first cutting device in the first cutting area can then perform a first cutting operation on the second silicon rod held by the second silicon rod clamp on the other side of the adjacent conversion body. The second cutting device in the second cutting area performs a first cutting operation on the conversion body... The first silicon rod held by the first silicon rod clamp on the outer side of the first edge is subjected to a second cutting operation. After the second cutting operation of the first silicon rod and the first cutting operation of the second silicon rod are completed, the conversion body is driven by the conversion drive mechanism to rotate 90° forward. The first cutting device at the first cutting area can then perform a first cutting operation on the third silicon rod held by the third silicon rod clamp on the outer side of the adjacent side of the conversion body. The second cutting device at the second cutting area performs a second cutting operation on the second silicon rod held by the second silicon rod clamp on the outer side of the other side of the conversion body. The grinding device at the grinding area performs a grinding operation on the first silicon rod held by the first silicon rod clamp on the outer side of one side of the conversion body.

[0282] In some embodiments, the silicon rod processing platform further includes a waiting area. In the waiting state, the first side of the conversion body contour corresponds to the waiting area, the second side of the conversion body contour corresponds to the first functional area, the third side of the conversion body contour corresponds to the second functional area, and the fourth side of the conversion body contour corresponds to the third functional area. In such... Figure 5 and Figure 6 In the embodiment shown, in the waiting state, the first side corresponds to the waiting area, the second side corresponds to the first cutting area, the third side corresponds to the second cutting area, and the fourth side corresponds to the grinding area.

[0283] Here, the waiting state refers to the state where the clamping center line of a silicon rod clamp on the conversion body is parallel or approximately parallel to the silicon rod placed in the waiting area. In this state, the outline edge of the silicon rod clamp is considered the first edge, the second edge of the conversion body outline corresponds to the first cutting area, the third edge of the conversion body outline corresponds to the second cutting area, and the fourth edge of the conversion body outline corresponds to the grinding area. Thus, the silicon rod clamp on the conversion body can perform loading or unloading operations on the silicon rod in the waiting area, the first cutting device can perform a first cutting operation on the silicon rod in the first cutting area, the second cutting device can perform a second cutting operation on the silicon rod in the second cutting area, and the grinding device can perform a grinding operation on the silicon rod in the grinding area. At the same time, different functional areas are all in operation. Simultaneously, by switching the silicon rod clamp between different functional areas via the conversion body, seamless connection of different processing steps can be achieved for the same silicon rod, improving the processing efficiency of the silicon rod cutting and grinding integrated machine.

[0284] In this embodiment of the silicon rod cutting and grinding integrated machine, at least a cutting device and a grinding device are included. Therefore, in some embodiments, the silicon rod processing platform includes a cutting area and a grinding area, wherein the cutting area or grinding area includes one or more areas. For example, the cutting area may include a first cutting area and a second cutting area, and the grinding area may include a first grinding area and a second grinding area. In addition, the silicon rod processing platform may also include a waiting area.

[0285] like Figure 5 and Figure 6 In the embodiment shown, the silicon rod processing platform includes a waiting area, a first cutting area, a second cutting area, and a grinding area. The number of silicon rod clamps on the conversion body can be set to four. The waiting area, the first cutting area, the second cutting area, and the grinding area are arranged in sequence and are distributed at 90° between adjacent functional areas. Therefore, the four silicon rod clamps on the conversion body are also distributed at 90° between adjacent silicon rod clamps.

[0286] The silicon rod cutting and grinding integrated machine includes at least one cutting device, which is located in at least one corresponding cutting area and is used to cut the silicon rod to be cut held by the silicon rod clamp located in the corresponding cutting area of ​​the silicon rod conversion device, so as to cut the silicon rod with a circular cross section into a silicon rod with a rectangular cross section.

[0287] In such Figure 5 and Figure 6 In the embodiment shown, the silicon rod cutting and grinding machine includes a first cutting device 23 and a second cutting device 24.

[0288] The first cutting device 23 includes a first cutting mounting structure 231, a first cutting unit 232, and a first cutting travel mechanism 233. The first cutting mounting structure 231 is mounted on the base 21 and corresponds to the first cutting area. The first cutting unit 232 is mounted on the first cutting mounting structure 231 and includes a first cutting wire frame mounted on the first cutting mounting structure 231, a plurality of first cutting wheels mounted on the first cutting wire frame, and a first cutting wire. The first cutting wire is sequentially wound around the plurality of first cutting wheels to form at least one first cutting wire saw.

[0289] The cutting travel mechanism is used to drive the cutting mounting structure and the cutting unit on it to move along the cutting direction so that at least one wire saw in the cutting unit can cut the silicon rod at the cutting area; the cutting direction is consistent with the axis of the silicon rod held by the silicon rod clamp located at the corresponding grinding area in the silicon rod conversion device.

[0290] In some embodiments, the first cutting travel mechanism includes a first travel guide rail and a first travel drive unit. In such... Figure 5 and Figure 6 In the illustrated embodiment, the first cutting travel mechanism 233 includes a first travel guide rail and a first travel drive unit. The first travel guide rail is disposed on the base 21 along the long side of the cutting area. The bottom of the first cutting mounting structure 231 is provided with a guide groove structure or guide block structure that cooperates with the first travel guide rail. The long side of the first cutting area is the travel direction of the cutting device, i.e., the cutting direction. The travel drive unit may further include, for example, a lead screw and a drive motor. The lead screw is disposed along the first travel guide rail, associated with the corresponding first cutting mounting structure, and shaft-connected to the drive motor. The drive motor drives the lead screw to rotate forward so that the first cutting mounting structure associated with the lead screw and the first cutting unit thereon move along the first travel guide rail from the first end of the cutting area to the second end of the cutting area. Alternatively, the drive motor drives the lead screw to rotate in the reverse direction so that the first cutting mounting structure associated with the lead screw and the first cutting unit thereon move along the first travel guide rail from the second end of the first cutting area to the first end of the first cutting area.

[0291] The second cutting device 24 includes a second cutting mounting structure 241, a second cutting unit 242, and a second cutting travel mechanism 243. The second cutting mounting structure 241 is mounted on the base 21 and corresponds to the second cutting area. The second cutting unit 242 is mounted on the second cutting mounting structure 241 and includes a second cutting wire frame mounted on the second cutting mounting structure 241, a plurality of second cutting wheels mounted on the second cutting wire frame, and a second cutting wire, which is sequentially wound around the plurality of second cutting wheels to form at least one second cutting wire saw.

[0292] The cutting travel mechanism is used to drive the cutting mounting structure and the cutting unit on it to move along the cutting direction so that at least one wire saw in the cutting unit can cut the silicon rod at the cutting area; the cutting direction is consistent with the axis of the silicon rod held by the silicon rod clamp located at the corresponding grinding area in the silicon rod conversion device.

[0293] In some embodiments, the second cutting travel mechanism includes a second travel guide and a second travel drive unit. In such... Figure 5 and Figure 6 In the illustrated embodiment, the second cutting travel mechanism 243 includes a second travel guide rail and a second travel drive unit. The second travel guide rail is disposed on the base 21 along the long side of the cutting area. The bottom of the second cutting mounting structure 241 is provided with a guide groove structure or guide block structure that cooperates with the second travel guide rail. The long side of the second cutting area is the travel direction of the cutting device, i.e., the cutting direction. The travel drive unit may further include, for example, a lead screw and a drive motor. The lead screw is disposed along the second travel guide rail, associated with the corresponding second cutting mounting structure, and shaft-connected to the drive motor. The drive motor drives the lead screw to rotate forward so that the second cutting mounting structure associated with the lead screw and the second cutting unit thereon move along the second travel guide rail from the first end of the cutting area to the second end of the cutting area. Alternatively, the drive motor drives the lead screw to rotate in the reverse direction so that the second cutting mounting structure associated with the lead screw and the second cutting unit thereon move along the second travel guide rail from the second end of the second cutting area to the first end of the second cutting area.

[0294] exist Figure 5 and Figure 6In the illustrated embodiment, the machine base has a silicon rod processing platform. The silicon rod processing platform has a waiting area, two cutting areas, and a grinding area. Therefore, the machine base has two cutting devices corresponding to the two cutting areas. In the following description of this embodiment, the two cutting areas can be referred to as the first cutting area and the second cutting area, respectively. The cutting device corresponding to the first cutting area is called the first cutting device, and the cutting device corresponding to the second cutting area is called the second cutting device. The first cutting device performs a first cutting operation on the silicon rod held by the silicon rod clamp at the first cutting area, and the second cutting device performs a second cutting operation on the silicon rod held by the silicon rod clamp at the second cutting area, so as to cut the silicon rod with a circular cross-section into a silicon rod with a roughly rectangular cross-section.

[0295] In some implementations, the first cutting unit in the first cutting device includes two first wire saws, which are parallel to each other. These two parallel wire saws are used to cut the silicon rod to be cut at the first cutting area to form two parallel side cuts. Specifically, in some examples, the two first wire saws are horizontally positioned. Alternatively, in some examples, the two first wire saws are vertically positioned. Alternatively, in some examples, the angle between the two first wire saws and the horizontal line is not limited, as long as the two first wire saws are parallel to each other. Thus, these two parallel first wire saws cooperate to form a first cutting wire mesh in the shape of "=" or "||". Similarly, the second cutting unit in the second cutting device includes two second wire saws, which are parallel to each other. These parallel second wire saws are used to cut the silicon rod to be cut at the second cutting area to form two parallel side cuts. Specifically, in some examples, the two second wire saws are horizontally positioned. Alternatively, in some examples, the two second wire saws are vertically positioned. Alternatively, in some examples, the angle between the two second cutting wire saws and the horizontal line is not limited; it is only necessary to ensure that the two second cutting wire saws are parallel to each other. In this way, the two parallel second cutting wire saws cooperate to form a second cutting wire mesh in the shape of "=" or "||".

[0296] Assuming that the first cutting wire mesh in the first cutting device and the second cutting wire mesh in the second cutting device are arranged in the same direction, that is, the first cutting wire mesh in the first cutting device is in the shape of "=" and the second cutting wire mesh in the second cutting device is in the shape of "=", or the first cutting wire mesh in the first cutting device is in the shape of "||" and the second cutting wire mesh in the second cutting device is in the shape of "||", then, when the silicon rod is cut into squares using two parallel cutting wire saws in the above implementation, the silicon rod to be cut is held by the silicon rod clamp in the silicon rod conversion device and corresponds to the first cutting area. The first cutting travel mechanism in the first cutting device at the first cutting area drives the first cutting mounting structure and the first cutting unit on it to move along the cutting direction consistent with the axis of the silicon rod. This causes the "=" (or "||") shaped first cutting wire mesh formed by two parallel first cutting wire saws in the first cutting unit to perform the first cutting operation on the silicon rod during the movement, so as to form two opposite parallel side cut surfaces and two edge skins on the silicon rod. Next, after completing the first cutting operation of the silicon rod, the silicon rod conversion device is rotated 90° forward to change the silicon rod clamp and the silicon rod it holds from the first cutting area to the second cutting area. Then, the clamping part of the clamping arm in the silicon rod clamp is driven to rotate 90° clockwise or counterclockwise by the clamping part rotation mechanism in the silicon rod clamp to adjust the cutting position of the silicon rod. Afterwards, the second cutting travel mechanism in the second cutting device at the second cutting area drives the cutting mounting structure and its second cutting unit to move along a cutting direction consistent with the axis of the silicon rod. This causes the "=" (or "||") shaped second cutting wire mesh formed by two parallel second cutting wire saws in the second cutting unit to perform a second cutting operation on the silicon rod during the movement, forming two opposing parallel side cuts and two edge skins on the silicon rod. In this way, the silicon rod can finally be cut into a silicon rod with a roughly rectangular cross-section, completing the squaring operation.

[0297] Assuming the first cutting wire mesh in the first cutting device and the second cutting wire mesh in the second cutting device are orthogonally arranged, that is, the first cutting wire mesh in the first cutting device is in the shape of "=" and the second cutting wire mesh in the second cutting device is in the shape of "||", or the first cutting wire mesh in the first cutting device is in the shape of "||" and the second cutting wire mesh in the second cutting device is in the shape of "=", then, when the silicon rod is cut into squares using two parallel cutting wire saws in the above implementation, the silicon rod to be cut is held by the silicon rod clamp in the silicon rod conversion device and corresponds to the first cutting area. The first cutting travel mechanism in the first cutting device at the first cutting area drives the first cutting mounting structure and the first cutting unit on it to move along the cutting direction consistent with the axis of the silicon rod. This causes the "=" (or "||") shaped first cutting wire mesh formed by the two parallel first cutting wire saws in the first cutting unit to perform the first cutting operation on the silicon rod during the movement, so as to form two opposing parallel side cut surfaces and two edge skins on the silicon rod. Next, after completing the first cutting operation of the silicon rod, the silicon rod conversion device rotates 90° forward, changing the silicon rod clamp and the silicon rod it holds from the first cutting area to the second cutting area. Then, the second cutting travel mechanism in the second cutting device at the second cutting area drives the second cutting mounting structure and its second cutting unit to move along a cutting direction aligned with the silicon rod's axis. This causes the "||" (or "=") shaped second cutting wire mesh formed by two parallel second cutting wire saws in the second cutting unit to perform a second cutting operation on the silicon rod during movement, forming two opposing parallel side cuts and two edge skins on the silicon rod. In this way, the silicon rod can ultimately be cut into a silicon rod with a roughly rectangular cross-section, completing the squaring operation.

[0298] In some implementations, the first cutting unit of the first cutting device includes two first wire saws that intersect each other. The intersecting first wire saws are used to cut the silicon rod to be cut at the first cutting area to form two intersecting side cut surfaces. The second cutting unit of the second cutting device includes two second wire saws that intersect each other. The intersecting second wire saws are used to cut the silicon rod to be cut at the second cutting area to form two intersecting side cut surfaces.

[0299] In practical implementation, the two wire saws intersect each other, and the intersection angle can be set according to the silicon rod processing requirements. For example, the intersection angle can be 90°, 80°, 85°, 95°, 100°, or other suitable angles. In some examples, taking a 90° intersection angle between the two wire saws as an example, we can refer to the two wire saws at this 90° intersection angle as orthogonal settings. For example, one wire saw is horizontally set and the other is vertically set, or one wire saw is set at a 45° (or 135°) angle to the horizontal line and the other is set at a 135° (or 45°) angle to the horizontal line. These two orthogonal wire saws cooperate to form a "+" shaped cutting wire mesh. That is, the two orthogonal first wire saws in the first cutting device cooperate to form a "+" shaped first cutting wire mesh, and the two orthogonal second wire saws in the second cutting device cooperate to form a "+" shaped second cutting wire mesh.

[0300] Taking the example of two orthogonal wire saws, when using the two orthogonal wire saws described above to cut a silicon rod, the silicon rod clamp in the silicon rod conversion device holds the silicon rod to be cut and aligns it with the first cutting zone. The first cutting travel mechanism in the first cutting device drives the first cutting mounting structure and its first cutting unit to move along a cutting direction consistent with the axis of the silicon rod. This causes the "+" shaped first cutting wire mesh formed by the two orthogonal first wire saws in the first cutting unit to cut the silicon rod during the movement, forming two opposing orthogonal side cuts and two edge skins on the silicon rod. After completing the first cutting operation, the silicon rod conversion device is rotated 90° forward to change the silicon rod clamp and the silicon rod it holds from the first cutting zone to the second cutting zone. Furthermore, the clamping part of the clamping arm in the silicon rod clamp is driven to rotate 180° clockwise or counterclockwise by the clamping part rotation mechanism in the silicon rod clamp to adjust the cutting position of the silicon rod. Subsequently, the second cutting device at the second cutting location drives the second cutting mounting structure and its second cutting unit to move along a cutting direction aligned with the silicon rod's axis. This causes the "+"-shaped second cutting wire mesh formed by two parallel second cutting wire saws in the second cutting unit to cut the silicon rod during the movement, creating two intersecting side cuts and two edge skins on the silicon rod. In this way, the silicon rod can ultimately be cut into a rectangular cross-section, completing the squaring operation.

[0301] As mentioned earlier, in such Figure 5 and Figure 6In the illustrated embodiment, the first cutting mounting structure in the first cutting device corresponds to the first cutting area, and the second cutting mounting structure in the second cutting device corresponds to the second cutting area. In the following description, only one cutting device will be used as an example.

[0302] The cutting device includes a cutting mounting structure, a cutting unit, and a cutting travel mechanism.

[0303] The cutting and mounting structure is mounted on the machine base and corresponds to the cutting area. The cutting and mounting structure, mounted on the machine base and corresponding to the cutting area, is used to install at least one cutting unit. The cutting and mounting structure may be, for example, a mounting base, a mounting beam, or a mounting frame constructed from multiple components.

[0304] The cutting unit is disposed on the cutting mounting structure. The cutting unit includes a cutting wire frame disposed on the cutting mounting structure, a plurality of cutting wheels disposed on the cutting wire frame, and cutting wires. The cutting wires are sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw. The cutting unit includes two cutting wire saws.

[0305] In some implementations, the cutting unit includes two parallel wire saws. The cutting unit may include at least four cutting wheels, which can be combined into a pair of cutting wheel sets; that is, two cutting wheels form one cutting wheel set, and two cutting wheel sets form a pair of cutting wheel sets. Each cutting wheel set includes two oppositely arranged cutting wheels and cutting segments wound around the two cutting wheels. Two cutting segments belonging to different cutting wheel sets within a pair of cutting wheel sets are parallel to each other. The spacing between the two cutting wheels in each cutting wheel set corresponds to the cross-sectional dimensions of the silicon rod to be cut. For example, the pair of cutting wheel sets includes two cutting wheel sets arranged on the upper and lower sides of a wire frame. One cutting wheel set includes two cutting wheels arranged horizontally, with a horizontal cutting segment wound between them. The other cutting wheel set also includes two cutting wheels arranged horizontally, with a horizontal cutting segment wound between them. The two cutting segments form two parallel wire saws in the horizontal direction. Alternatively, the pair of cutting wheel sets includes two cutting wheel sets arranged on the left and right sides of the wire frame. One cutting wheel set includes two cutting wheels arranged vertically, with a vertical cutting line segment wound between the two cutting wheels. The other cutting wheel set also includes two cutting wheels arranged vertically, with a vertical cutting line segment wound between the two cutting wheels. The two cutting line segments form two parallel cutting lines in the vertical direction.

[0306] In some implementations, the cutting unit includes two intersecting wire saws. The cutting unit may include at least four cutting wheels, which can be combined to form two intersecting cutting wheel sets. For example, the cutting wheel set may consist of two cutting wheels arranged opposite each other along the M-axis forming a first cutting wheel set, and two cutting wheel sets arranged along the N-axis forming another first cutting wheel set, where the M-axis and N-axis intersect. Specifically, the cutting unit includes two intersecting cutting wheel sets, where one cutting wheel set includes two cutting wheels arranged along the M-axis, and the other cutting wheel set includes two cutting wheels arranged along the N-axis. The cutting wires are sequentially wound around the four cutting wheels in the cutting unit to form two intersecting wire saws. Specifically, the cutting wires are wound around the two cutting wheels arranged along the M-axis in one first cutting wheel set to form one wire saw, and the cutting wires are wound around the two cutting wheels arranged along the N-axis in the other first cutting wheel set to form another wire saw. The two wire saws intersect each other, and the angle of intersection can be set according to the silicon rod processing requirements. For example, the intersection angle can be 90°, 80°, 85°, 95°, 100°, or other suitable angles. Taking an intersection angle of 90° as an example, we can refer to the two wire saws with this intersection angle of 90° as orthogonal settings. For example, one wire saw is set horizontally and the other is set vertically, or one wire saw is set at a 45° angle (or 135°) to the horizontal line and the other is set at a 135° angle (or 45°) to the horizontal line. These two orthogonal wire saws work together to form a "+" shaped wire mesh.

[0307] It should be noted that, in some embodiments, when the two intersecting cutting lines in the cutting unit cut the silicon rod, the intersection of the two intersecting cutting lines is located within the cross-section of the silicon rod (including the case where the intersection is located on the circumference of the cross-section), thereby enabling the silicon rod after squaring to obtain the largest possible cross-section (resulting in a larger silicon wafer surface area after subsequent slicing), reducing material loss in subsequent grinding operations (such as grinding and chamfering / rounding), and improving the utilization rate of silicon material.

[0308] The cutting unit may further include transition wheels for guiding the cutting wire. The transition wheels may not be limited to one; they may be mounted on the cutting wire frame. For example, in some embodiments, some transition wheels may be mounted on the cutting wire frame; in some embodiments, some transition wheels may be mounted on the cutting mounting structure; and in some embodiments, some transition wheels may be mounted on the cutting wire frame and some transition wheels may be mounted on the cutting mounting structure.

[0309] In some embodiments, the cutting unit may further include a tension wheel disposed on the cutting wire frame and / or and / or the cutting mounting structure for adjusting the tension of the cutting wire.

[0310] In some embodiments of this application, the cutting device employs a non-enclosed winding structure, and the cutting device further includes a take-up and unwinding unit corresponding to the cutting unit. The take-up and unwinding unit includes at least an unwinding spool and a take-up spool. For example, the first end of the cutting wire is wound around an unwinding spool, the second end is wound around a take-up spool, and the wire is wound between the cutting wheels by means of multiple transition wheels.

[0311] In some embodiments of this application, the cutting device employs a closed winding method, wherein the cutting wire is wound in a loop between each cutting wheel.

[0312] The cutting unit may also include other adjustment mechanisms.

[0313] In some embodiments of this application, the cutting unit in the cutting device includes a cutting wire mesh in the shape of "=" or "||", and the cutting device further includes a cutting advance / retreat mechanism and a distance adjustment mechanism. The cutting advance / retreat mechanism drives the cutting wire frame and the cutting wire saws on it to move along the cutting advance / retreat direction relative to the cutting mounting structure, the cutting advance / retreat direction being perpendicular to the cutting direction. The distance adjustment mechanism includes a cutting wire groove for adjusting the cutting position of at least one wire saw in the cutting unit, or for changing the cutting wire grooves around the multiple cutting wheels in the cutting unit.

[0314] In some implementations, the cutting advance / retreat mechanism may include an advance / retreat guide rail and an advance / retreat drive unit. The advance / retreat guide rail is mounted on the cutting mounting structure, and the cutting wire frame has a guide groove structure or guide block structure that cooperates with the advance / retreat guide rail. The advance / retreat drive unit is used to drive the cutting wire frame and the cutting wire saw on it to move along the cutting advance / retreat direction on the cutting mounting structure via the advance / retreat guide rail. The advance / retreat drive unit may be, for example, a combination of a lead screw and a drive motor, or a telescopic cylinder.

[0315] In some implementations, the cutting advance / retreat mechanism may include a lead screw and a pitch adjustment drive source. The lead screw is associated with one or more cutting wheel sets, and the pitch adjustment drive source is used to drive the lead screw to rotate, thereby changing the position of the cutting wheel in the cutting wheel set associated with the lead screw, thereby adjusting the cutting position of at least one wire saw in the cutting unit, or changing the cutting groove of the cutting wire around the multiple cutting wheels in the cutting unit.

[0316] In some embodiments of this application, the cutting unit in the cutting device includes a cross-cutting wire mesh, for example, a "+" shaped cutting wire mesh. The cutting device then further includes a cutting advance / retreat mechanism. This mechanism drives the cutting wire frame and its attached cutting wire saws to move along the cutting advance / retreat direction within the cutting mounting structure to adjust the cutting position of the two intersecting cutting wire saws in the cutting unit. The cutting advance / retreat direction is perpendicular to the cutting direction.

[0317] In some implementations, the cutting advance / retreat mechanism may include an advance / retreat guide rail and an advance / retreat drive unit. The advance / retreat guide rail is mounted on the cutting mounting structure, and the cutting wire frame has a guide groove structure or guide block structure that cooperates with the advance / retreat guide rail. The advance / retreat drive unit is used to drive the cutting wire frame and the cutting wire saw on it to move along the cutting advance / retreat direction on the cutting mounting structure via the advance / retreat guide rail. The advance / retreat drive unit may be, for example, a combination of a lead screw and a drive motor, or a telescopic cylinder.

[0318] In some embodiments of this application, the silicon rod cutting and grinding integrated machine further includes at least one edge unloading device corresponding to at least one cutting device, used to unload the edge generated after the wire cutting device performs cutting operations on the silicon rod held by the silicon rod fixture.

[0319] In some implementations, the edge removal device may employ an adsorption structure, which may include a suction cup and a displacement mechanism connected to the suction cup. The displacement mechanism drives the suction cup to move and adsorbs the edge to be removed. In practical applications, the cutting device's cutting travel mechanism drives the cutting mounting structure and its cutting units to move along a cutting direction aligned with the silicon rod's axis. This causes the cutting wire mesh formed by four wire saws in the cutting unit to cut the silicon rod during movement. Before the cutting wire mesh passes through the silicon rod (before the edge is fully formed and detached from the silicon rod), the displacement mechanism drives the suction cup to move to the side of the silicon rod, adsorbing the edge to be formed. Once the cutting wire mesh has completely passed through the silicon rod and formed the edge, the edge, being adsorbed by the suction cup, will not slip off the silicon rod or experience sudden relative movement, ensuring no edge chipping occurs. Subsequently, the displacement mechanism again drives the suction cup and the adsorbed edge to move, removing the edge.

[0320] The silicon rod cutting and grinding integrated machine further includes at least one grinding device, which is located in at least one corresponding grinding area and is used to perform grinding operations on the silicon rod held by the silicon rod clamp located in the corresponding grinding area of ​​the silicon rod conversion device.

[0321] In such Figure 5 and Figure 6 In the embodiment shown, the silicon rod processing platform is provided with a grinding area, and the silicon rod cutting and grinding integrated machine further includes a grinding device 25, which corresponds to the grinding area.

[0322] The grinding apparatus 25 includes: a grinding wheel mounting structure 251, at least one pair of grinding wheels 252, a grinding wheel traveling mechanism 253, and a grinding wheel retraction mechanism (not shown in the figure).

[0323] The grinding wheel mounting structure is mounted on the machine base and corresponds to the grinding area, and is used to mount at least one pair of grinding wheels. The length of the grinding area is the span along the long side of the grinding area, which is the direction of travel of the grinding wheel, i.e., the grinding direction.

[0324] In such Figure 5 and Figure 6 In the illustrated embodiment, the mold mounting structure 251 is located at the edge of the silicon rod processing platform of the base 21, and is used to mount at least one pair of molds 252. The mold mounting structure can be, for example, a mounting base, a mounting beam, or a mounting frame constructed from multiple components.

[0325] The at least one pair of abrasives is disposed on the abrasive mounting structure.

[0326] In some embodiments, the at least one pair of grinding wheels are arranged facing each other vertically on the grinding wheel mounting structure, such that the grinding surfaces of the at least one pair of grinding wheels are located in opposing horizontal planes; that is, the grinding surfaces of two of the at least one pair of grinding wheels are located in a first horizontal plane and a second horizontal plane, respectively, wherein the first horizontal plane and the second horizontal plane are parallel to each other and perpendicular to the plumb line. Figure 5 and Figure 6 In the embodiment shown, the pair of grinding wheels 252 are disposed on the grinding wheel mounting structure 251.

[0327] In some embodiments, the at least one pair of grinding tools are arranged opposite each other on the grinding tool mounting structure in a horizontal direction, such that the grinding surfaces of the at least one pair of grinding tools are located in opposite vertical planes, that is, the grinding surfaces of two of the at least one pair of grinding tools are located in a first vertical plane and a second vertical plane, respectively, wherein the first vertical plane and the second vertical plane are parallel to each other and perpendicular to the horizontal line.

[0328] Regarding the abrasive tool, the abrasive tool includes a coarse grinding tool, a fine grinding tool, or a combination of coarse grinding tools and fine grinding tools. That is, in some embodiments, the abrasive tool includes a coarse grinding tool. In some embodiments, the abrasive tool includes a fine grinding tool. In some embodiments, the abrasive tool includes a combination of coarse grinding tools and fine grinding tools. For example, taking the case where the abrasive tool includes a fine grinding tool, in the silicon rod cutting and grinding integrated machine, after the silicon rod is cut into squares by the preceding cutting device, the side cut surface of the cut silicon rod has a good cutting effect and is relatively smooth. Therefore, the abrasive tool only needs to use the fine grinding tool to perform fine grinding on the squared silicon rod to achieve the silicon rod grinding requirements. Taking the case where the abrasive tool includes a combination of coarse grinding tools and fine grinding tools, the silicon rod can first be coarsely ground using the coarse grinding tool, and then the silicon rod can be finely ground using the fine grinding tool.

[0329] Generally, the abrasive tool may include a grinding wheel and a rotary motor connected to the grinding wheel. Taking the coarse grinding tool as an example, the coarse grinding tool includes a coarse grinding wheel and a rotary motor connected to the coarse grinding wheel. Taking the fine grinding tool as an example, the fine grinding tool includes a fine grinding wheel and a rotary motor connected to the fine grinding wheel.

[0330] The grinding wheel has a certain particle size and roughness. Two grinding wheels arranged opposite each other in the at least one pair of grinding tools provide two symmetrical grinding surfaces for the held silicon rod. In some embodiments, the grinding wheel is circular and hollow in the middle. The grinding wheel is formed by bonding abrasive grains with a binder, creating a surface with abrasive grains that rotates in contact with the surface of the silicon rod to be ground. The grinding wheel has a certain abrasive grain size and density, and also contains pores. The abrasive material of the grinding wheel can be set to abrasive grains with a hardness greater than that of silicon, such as aluminum oxide, silicon carbide, diamond, or cubic boron nitride, depending on the needs of grinding the silicon rod. The rotary motor is connected to the grinding wheel via a rotating shaft and drives the grinding wheel to rotate at a predetermined speed. Comparatively, the abrasive grain size of the fine grinding wheel is smaller than that of the coarse grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than that of the coarse grinding wheel.

[0331] Taking the abrasive tool as an example, which includes a combination of coarse grinding wheels and fine grinding wheels, the abrasive tool may include coarse grinding wheels and fine grinding wheels nested within each other. For example, the coarse grinding wheel is nested within the fine grinding wheel, or the fine grinding wheel is nested within the coarse grinding wheel.

[0332] For example, the abrasive tool includes a grinding head base and a coarse grinding wheel and a fine grinding wheel disposed on the grinding head base. The coarse grinding wheel is nested within the fine grinding wheel, and the fine grinding wheel is larger than the coarse grinding wheel. The fine grinding wheel is circular and hollow in the center (i.e., a ring structure), while the coarse grinding wheel can also be circular or circular and hollow in the center (i.e., a ring structure). The abrasive grain size of the fine grinding wheel is smaller than that of the coarse grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than that of the coarse grinding wheel.

[0333] When the abrasive tool includes a coarse grinding wheel and a fine grinding wheel, it can be used to perform both coarse and fine grinding operations on the silicon rod held by the silicon rod clamp in the silicon rod conversion device. Therefore, at least one of the coarse grinding wheel and the fine grinding wheel is equipped with a telescopic drive mechanism. For example, when the coarse grinding wheel is nested within the fine grinding wheel, the coarse grinding wheel can be equipped with a telescopic drive mechanism. During coarse grinding, the telescopic drive mechanism drives the coarse grinding wheel to extend and protrude beyond the fine grinding wheel, allowing the protruding coarse grinding wheel to perform coarse grinding on the silicon rod. During fine grinding, the telescopic drive mechanism drives the coarse grinding wheel to retract and recess into the fine grinding wheel, allowing the fine grinding wheel to perform fine grinding on the silicon rod. Alternatively, when the coarse grinding wheel is nested within the fine grinding wheel, the fine grinding wheel may be equipped with a telescopic drive mechanism. During coarse grinding, the telescopic drive mechanism drives the fine grinding wheel to retract and recess into the coarse grinding wheel, so as to use the coarse grinding wheel to perform coarse grinding on the silicon rod. During fine grinding, the telescopic drive mechanism drives the fine grinding wheel to extend and protrude from the coarse grinding wheel, so as to use the protruding fine grinding wheel to perform fine grinding on the silicon rod.

[0334] For example, the fine grinding wheel is nested within the coarse grinding wheel, the coarse grinding wheel being larger than the fine grinding wheel. The coarse grinding wheel is circular with a hollow center (i.e., a ring structure), and the fine grinding wheel can also be circular or circular with a hollow center (i.e., a ring structure). The abrasive grain size of the fine grinding wheel is smaller than that of the coarse grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than that of the coarse grinding wheel.

[0335] When the abrasive tool includes a coarse grinding wheel and a fine grinding wheel, it can be used to perform both coarse and fine grinding operations on a silicon rod held by a silicon rod clamp. Therefore, at least one of the coarse grinding wheel and the fine grinding wheel is equipped with a telescopic drive mechanism. For example, when the fine grinding wheel is nested within the coarse grinding wheel, the coarse grinding wheel can be equipped with a telescopic drive mechanism. During coarse grinding, the telescopic drive mechanism drives the coarse grinding wheel to extend and protrude beyond the fine grinding wheel, allowing the protruding coarse grinding wheel to perform coarse grinding on the silicon rod. During fine grinding, the telescopic drive mechanism drives the coarse grinding wheel to retract and retract into the fine grinding wheel, allowing the fine grinding wheel to perform fine grinding on the silicon rod. Alternatively, when the fine grinding wheel is nested within the coarse grinding wheel, the fine grinding wheel may be equipped with a telescopic drive mechanism. During coarse grinding, the telescopic drive mechanism drives the fine grinding wheel to retract and recess into the coarse grinding wheel, so as to use the coarse grinding wheel to perform coarse grinding on the silicon rod. During fine grinding, the telescopic drive mechanism drives the fine grinding wheel to extend and protrude from the coarse grinding wheel, so as to use the protruding fine grinding wheel to perform fine grinding on the silicon rod.

[0336] The grinding wheel traveling mechanism is used to drive the at least one pair of grinding wheels to move along the grinding direction so that the at least one pair of grinding wheels can perform grinding operations on the silicon rod at the grinding area; the grinding direction is consistent with the axis of the silicon rod held by the silicon rod clamp located at the corresponding grinding area in the silicon rod conversion device.

[0337] In some embodiments, the mold traveling mechanism includes a traveling guide and a traveling drive unit. In such... Figure 5 and Figure 6 In the illustrated embodiment, the grinding wheel traveling mechanism 253 includes a traveling guide rail and a traveling drive unit. The traveling guide rail is disposed on the base 21 along the long side of the grinding area. The bottom of the grinding wheel mounting structure 251 is provided with a guide groove structure or guide block structure that cooperates with the traveling guide rail. The long side of the grinding area is the traveling direction of the grinding device, i.e., the grinding direction. The traveling drive unit may further include, for example, a lead screw and a drive motor. The lead screw is disposed along the traveling guide rail, associated with the corresponding grinding wheel mounting structure, and shaft-connected to the drive motor. The drive motor drives the lead screw to rotate forward so that the grinding wheel mounting structure associated with the lead screw and the grinding wheel on it move along the traveling guide rail from the first end of the grinding area to the second end of the grinding area. Alternatively, the drive motor drives the lead screw to rotate in the reverse direction so that the grinding wheel mounting structure associated with the lead screw and the grinding wheel on it move along the traveling guide rail from the second end of the grinding area to the first end of the grinding area.

[0338] The grinding wheel advance / retreat mechanism is used to drive at least one of the at least one pair of grinding wheels to move along the grinding advance / retreat direction relative to the grinding wheel mounting structure, wherein the grinding advance / retreat direction is perpendicular to the grinding direction. In such cases... Figure 5 and Figure 6 In the illustrated embodiment, the grinding direction is the long side direction of the grinding area, and the grinding advance / retreat direction is a perpendicular line direction to the long side direction. In practice, the grinding advance / retreat direction only needs to lie within a plane perpendicular to the grinding direction; that is, if the grinding advance / retreat direction is the long side direction, it only needs to lie within a vertical plane perpendicular to the long side direction. Therefore, the grinding advance / retreat direction can be a perpendicular line direction, a horizontal line direction, or other directions perpendicular to the long side direction.

[0339] In the following description, the grinding direction is the long side direction of the grinding area and the grinding advance and retreat direction is a perpendicular line direction that is perpendicular to the long side direction.

[0340] The grinding wheel advance / retract mechanism controls at least one of the at least one pair of grinding wheels to move along the grinding advance / retract direction within the grinding wheel mounting structure, thereby adjusting the relative distance between two of the at least one pair of grinding wheels in the direction of the vertical axis, and thus controlling the feed rate during the grinding process, which determines the grinding amount. Additionally, when the silicon rod clamp in the silicon rod conversion device holds the silicon rod, the at least one pair of grinding wheels moves up and down along the direction of the vertical axis under the control of the grinding wheel advance / retract mechanism.

[0341] For example, each pair of grinding wheels is equipped with a grinding wheel advance / retreat mechanism. In one embodiment, the grinding wheel advance / retreat mechanism includes an advance / retreat guide rail and an advance / retreat drive unit. The advance / retreat guide rail is disposed on the grinding wheel mounting structure along the vertical direction. The bottom of the grinding wheel is provided with a guide groove structure or guide block structure along the vertical direction that cooperates with the advance / retreat guide rail. The advance / retreat drive unit may further include, for example, a lead screw and a drive motor. The lead screw is disposed along the advance / retreat guide rail, and the lead screw is associated with the corresponding grinding wheel and shaft-connected to the drive motor.

[0342] In some embodiments of this application, one of the at least one pair of grinding tools is equipped with a lead screw and a drive motor. The lead screw is arranged along the vertical direction and associated with the grinding tool. Thus, the drive motor drives the lead screw to rotate forward, causing the grinding tool associated with the lead screw to move along the feed guide towards the opposite grinding tool to reduce the grinding distance between the two grinding tools (or adjust the grinding feed). Alternatively, the drive motor drives the lead screw to rotate in the opposite direction, causing the grinding tool associated with the lead screw to move along the feed guide away from the opposite grinding tool to increase the grinding distance between the two grinding tools.

[0343] In some embodiments of this application, each of the at least one pair of grinding wheels is equipped with a lead screw and a drive motor. For each grinding wheel, the lead screw is arranged along the vertical direction and associated with the grinding wheel. Thus, the drive motor drives the lead screw to rotate forward, causing the grinding wheel associated with the lead screw to move along the feed guide towards the other grinding wheel arranged opposite to it, thereby reducing the grinding distance between the two grinding wheels (or adjusting the grinding feed). Alternatively, the drive motor drives the lead screw to rotate in the opposite direction, causing the grinding wheel associated with the lead screw to move along the feed guide away from the other grinding wheel arranged opposite to it, thereby increasing the grinding distance between the two grinding wheels.

[0344] In some embodiments of this application, two of the at least one pair of grinding tools share a lead screw and a drive motor. The lead screw may be, for example, a bidirectional lead screw, which is arranged along the plumb line. The bidirectional lead screw has two sections of threads with opposite directions of rotation on its shaft, which are respectively associated with the two grinding tools. The drive motor is associated with the bidirectional lead screw and drives the bidirectional lead screw to rotate, causing the two grinding tools associated with the bidirectional lead screw to move towards or away from each other along the feed guide based on a certain cooperative relationship. For example, if the drive motor drives the bidirectional lead screw to rotate in the forward direction, it drives the two associated grinding tools to move towards each other along the plumb line (i.e., move closer to each other), reducing the grinding distance between the two grinding tools (or adjusting the grinding feed). Alternatively, if the drive motor drives the lead screw to rotate in the reverse direction, it drives the two associated grinding tools to move away from each other along the plumb line (i.e., move away from each other), increasing the grinding distance between the two grinding tools.

[0345] When the grinding device is used to grind a silicon rod held by a silicon rod clamp in a silicon rod conversion device located in the grinding area, the grinding wheel advance / retract mechanism of the grinding device drives the grinding wheels of at least one pair of grinding wheels to move along the vertical direction to determine the feed amount for grinding the grinding surface or edge of the silicon rod. The grinding wheel travel mechanism drives the at least one pair of grinding wheels to move along the grinding direction (the long side direction of the grinding area) until they have passed through the entire silicon rod. If necessary, the grinding wheel travel mechanism can also drive the at least one pair of grinding wheels to reciprocate along the grinding direction to ensure sufficient grinding along the length of the silicon rod. Simultaneously, the grinding wheel advance / retract mechanism drives the at least one pair of oppositely arranged grinding wheels to move in the vertical direction to determine the feed amount for grinding the grinding surface or edge of the silicon rod. Figure 5 and Figure 6In the illustrated embodiment, at least one pair of grinding tools in the grinding apparatus are arranged opposite each other along the vertical line. The grinding surfaces of the at least one pair of grinding tools 33 are located in opposite horizontal planes, wherein the horizontal planes are perpendicular to the vertical line. When grinding the silicon rod, the feed amount is adjusted by driving at least one of the at least one pair of grinding tools to move up and down along the vertical line through the grinding tool advance and retract mechanism, so as to grind the upper and lower sides of the silicon rod along the vertical line.

[0346] As mentioned earlier, the grinding surface of the grinding wheel in the abrasive tool is typically annular. In a working scenario, when the abrasive tool is used for grinding operations, the abrasive tool mounting structure and the abrasive tool mounted thereon can be moved to adjust the position of the silicon rod relative to the grinding wheel in the abrasive tool, thereby determining the contact chord length between the silicon rod and the grinding surface of the grinding wheel. By increasing the contact length between the edge of the silicon rod and the abrasive tool, the grinding efficiency can be effectively improved and the wear of the grinding wheel in the abrasive tool can be reduced.

[0347] In some embodiments, the grinding apparatus includes an abrasive and a chamfering / rounding abrasive, wherein the chamfering / rounding abrasive is used to chamfer or round the silicon rod at the grinding area.

[0348] The grinding apparatus may include a grinding wheel mounting structure, at least one pair of grinding wheels, and a chamfering / rounding grinding wheel. The at least one pair of grinding wheels are disposed opposite each other on the grinding wheel mounting structure for grinding a pre-cut, squared silicon rod located in the grinding area. In some embodiments, the grinding wheel includes a fine grinding wheel. In some embodiments, the grinding wheel includes a combination of a coarse grinding wheel and a fine grinding wheel. The grinding wheel includes a coarse grinding wheel and a rotary motor connected to the coarse grinding wheel, and the fine grinding wheel includes a fine grinding wheel and a rotary motor connected to the fine grinding wheel.

[0349] The chamfering / rounding abrasive tool is mounted on the abrasive tool mounting structure and is used to chamfer or round the edges of a squared silicon rod. The chamfering / rounding abrasive tool can move with the abrasive. In some embodiments, the chamfering / rounding abrasive tool may include a chamfering / rounding grinding wheel and a rotary motor connected to the chamfering / rounding grinding wheel. The grinding surfaces of the at least one pair of abrasive tools are located in opposing horizontal planes; that is, the grinding surfaces of two of the at least one pair of abrasive tools are located in a first horizontal plane and a second horizontal plane, respectively.

[0350] The molds have been described above and will not be repeated here.

[0351] Regarding the chamfering / rounding abrasive, the chamfering / rounding abrasive is mounted on the abrasive mounting structure, and the grinding surface of the chamfering / rounding abrasive is located in the vertical plane or in the horizontal plane.

[0352] In some embodiments, the chamfering / rounding grinding tool can be moved along the grinding direction by the aforementioned grinding tool traveling mechanism. The chamfering / rounding grinding tool can also be moved along the chamfering / rounding advance and retreat direction by the chamfering / rounding advance and retreat mechanism, wherein the chamfering / rounding advance and retreat direction is perpendicular to the grinding surface of the chamfering / rounding grinding tool.

[0353] In practical applications, the chamfering / rounding grinding tool can be driven to move along the chamfering / rounding forward and backward direction to contact the edge of the silicon rod. The silicon rod can be driven to rotate along its axis using a silicon rod clamp to contact the edge of the silicon rod and achieve rounding. Alternatively, the silicon rod can be driven to rotate along its axis by a preset angle to contact the edge of the silicon rod to contact the chamfering / rounding grinding tool, or the chamfering / rounding grinding tool can be driven to move forward and backward to contact the edge of the silicon rod, thereby achieving chamfering or rounding.

[0354] Furthermore, the axis of the chamfering / rounding grinding wheel is offset from the axis of the silicon rod. The offset between the axis of the chamfering / rounding grinding wheel (which serves as the chamfering / rounding abrasive) and the axis of the squared silicon rod (i.e., the clamping center of the silicon rod clamp in the silicon rod transfer device) allows the chordal edge of the chamfering / rounding grinding wheel to contact the squared silicon rod, maximizing the contact area and improving the efficiency of chamfering or rounding.

[0355] In some embodiments of this application, the grinding apparatus may further include a cooling device for cooling the at least one pair of grinding wheels, reducing damage to the silicon rod surface layer during grinding, and improving the grinding efficiency and service life of the grinding wheels. In one implementation of this embodiment, the cooling device includes a cooling water pipe, a guide groove, and a guide hole. In some embodiments, a protective cover for a rotating motor that allows cooling water to enter the grinding wheel is provided on the outer circumference of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The guide groove is provided on the protective cover as the contact point between the protective cover and the cooling water pipe, and the guide hole is provided in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to a cooling water source. The cooling water drawn through the cooling water pipe to the guide groove and guide hole on the surface of the grinding wheel is guided to reach the grinding surface of the grinding wheel and the silicon rod being ground for cooling. During grinding, the cooling water in the guide hole enters the interior of the grinding wheel by centrifugal force due to the rotation of the grinding wheel for sufficient cooling.

[0356] In some embodiments of this application, the silicon rod cutting and grinding integrated machine may further include a cleaning device. The cleaning device may be mounted on a machine base and is used to clean the silicon rod. Generally, after the silicon rod undergoes the aforementioned cutting and grinding operations, cutting debris generated during the process adheres to the surface of the silicon rod. Therefore, it is necessary to clean the silicon rod when necessary. Generally, the cleaning device includes a cleaning brush head and a cleaning fluid spraying device that cooperates with the cleaning brush head. During cleaning, the cleaning fluid spraying device sprays cleaning fluid onto the silicon rod, while a motor drives the cleaning brush head to act on the silicon rod, completing the cleaning operation. In practical applications, the cleaning fluid may be, for example, pure water, and the cleaning brush head may be, for example, a rotary brush head.

[0357] It should be noted that the above is merely an illustrative example and is not intended to limit the scope of protection of this application. For example, in the description of the grinding operation as a grinding device, the grinding operation of the silicon rod is performed first and then the chamfering / rounding operation of the silicon rod is performed. However, this is not a limitation. In other embodiments, it is also feasible to perform the chamfering / rounding operation of the silicon rod first and then the grinding operation of the silicon rod, and it should still fall within the scope of protection of this application.

[0358] Subsequently, after the silicon ingot undergoes grinding in the grinding device, the silicon ingot transfer device moves it from the grinding area to the waiting area and unloads it from the waiting area of ​​the silicon ingot processing platform. Of course, before unloading the silicon ingot, if necessary, a detection device can inspect the processed silicon ingot in the waiting area. For example, a flatness detector can be used to check the flatness of the silicon ingot. Using a flatness detector, on the one hand, the flatness of the silicon ingot can be checked to verify whether it meets product requirements after each processing operation, thus determining the effectiveness of each processing operation; on the other hand, the flatness of the silicon ingot can also indirectly obtain the wear condition of the processing components in each processing device, facilitating real-time calibration or correction, or even repair or replacement.

[0359] The waiting area is used as a location for loading silicon rods to be processed and waiting for subsequent processing operations, and for unloading silicon rods after processing. To improve the efficiency of silicon rod loading and unloading, the silicon rod cutting and grinding integrated machine of this application also includes a silicon rod transfer device corresponding to the waiting area.

[0360] The silicon rod transfer device is used to load the silicon rod to be processed into the waiting area or to unload the processed silicon rod from the waiting area.

[0361] by Figure 5 and Figure 6For example, in the embodiment of the silicon rod cutting and grinding integrated machine, there is a cutting area and a cutting device corresponding to the cutting area, a grinding area and a grinding device corresponding to the grinding area. Therefore, the silicon rod transfer device is used to load the silicon rod to be cut into the waiting area for subsequent cutting and squaring operations by the cutting device in the cutting area, or to unload the silicon rod that has been ground by the grinding device in the grinding area in the waiting area.

[0362] like Figure 5 and Figure 6 As shown, the silicon rod transfer device 26 includes a silicon rod support structure and a position adjustment structure.

[0363] The silicon rod support structure is used to support silicon rods to be cut. The silicon rod support structure includes a support base and a loading component disposed on the support base, wherein the loading component supports the silicon rod to be cut. In other embodiments, the support base may be an integral, for example, plate-like structure, such as a rectangular support plate. Pillow strips may be provided on the rectangular support plate to protect the supported silicon rod. These pillow strips may be made of a flexible material, such as rubber, acrylic, or plastic.

[0364] Regarding the loading components, the loading components may include a first loading component and a second loading component for supporting the silicon rod to be cut. The first loading component and the second loading component are disposed opposite to each other on opposite sides of the width of the support base. In some embodiments, the first loading component and the second loading component are roller assemblies arranged along the length direction of the support base, the roller assembly including a plurality of rollers arranged in sequence, the axles of the plurality of rollers being arranged along the width direction of the support base. The distance between the first loading component and the second loading component is smaller than the diameter of the silicon rod with a circular cross-section to be processed but larger than the side length of the silicon rod with a roughly rectangular cross-section already processed.

[0365] The position adjustment structure is used to adjust the position of the silicon rod support structure.

[0366] In some embodiments, the position adjustment structure includes a vertical lifting mechanism, a first horizontal moving mechanism, and a second horizontal moving mechanism, wherein the first horizontal direction and the second horizontal direction are orthogonal. The vertical lifting mechanism drives the silicon rod support structure and the silicon rod it carries to move vertically up and down. In some embodiments, the vertical lifting mechanism may include a vertical lifting guide rail and a lifting drive source. The first horizontal moving mechanism drives the silicon rod support structure and the silicon rod it carries to move along a first direction. In some embodiments, the first horizontal moving mechanism may include a first direction guide rail and a first direction drive source. The second horizontal moving mechanism drives the silicon rod support structure and the silicon rod it carries to move along a second direction. In some embodiments, the second horizontal moving mechanism may include a second direction guide rail and a second direction drive source.

[0367] In some embodiments, the position adjustment structure includes a vertical lifting mechanism, a horizontal advancing / retreating mechanism, and a rotation mechanism, wherein the horizontal advancing / retreating direction is orthogonal to the long side direction of the waiting area. The vertical lifting mechanism drives the silicon rod support structure and the silicon rod it carries to move vertically up and down. In some embodiments, the vertical lifting mechanism may include a vertical lifting guide rail and a lifting drive source. The horizontal advancing / retreating mechanism drives the silicon rod support structure and the silicon rod it carries to move horizontally forward and backward. In some embodiments, the horizontal advancing / retreating mechanism may include a horizontal advancing / retreating direction guide rail and an advancing / retreating drive unit. The rotation mechanism drives the silicon rod support structure and the silicon rod it carries to rotate along a rotation axis. In some embodiments, the rotation mechanism may include a rotation axis and a rotation drive source.

[0368] The silicon rod transfer device disclosed in this application may further include a centering adjustment mechanism, which can adjust the position of the silicon rod carried by the silicon rod support structure so that the axis of the silicon rod corresponds to a predetermined center line.

[0369] As mentioned above, the alignment operation specifically refers to ensuring that the centerline of the silicon rod is aligned with the clamping centerline of the silicon rod clamp in the silicon rod conversion device; that is, the centerline of the silicon rod coincides with the clamping centerline of the silicon rod clamp in the silicon rod conversion device. In one implementation, all silicon rod clamps in the silicon rod conversion device are identical, and the clamping centerlines of all silicon rod clamps are consistent in the direction of the perpendicular bisector. In another implementation, the silicon rod clamps in the silicon rod conversion device are not identical, and the clamping centerlines of all silicon rod clamps are inconsistent in the direction of the perpendicular bisector.

[0370] In practical applications, taking one silicon rod clamp as an example, the clamping center line of the silicon rod clamp can be predetermined, and a predetermined center line can be determined based on the clamping center line of the silicon rod clamp, wherein the predetermined center line is consistent with the clamping center line of the silicon rod clamp. Therefore, the centering adjustment mechanism is used to adjust the position of the silicon rod to be ground so that its axis corresponds with the predetermined center line.

[0371] Regarding the centering adjustment mechanism, in one embodiment of this application, the centering adjustment mechanism includes a vertical adjustment mechanism and a horizontal adjustment mechanism, which are respectively used to drive the silicon rod support structure and the silicon rod it supports to move vertically and horizontally relative to each other so that the axis of the silicon rod is aligned with a predetermined center line.

[0372] The vertical adjustment mechanism can be achieved through a signed vertical lifting mechanism. The vertical lifting mechanism has been described above, so it will not be repeated here.

[0373] The horizontal adjustment mechanism may include a clamping mechanism, which adjusts the position of the silicon rod located within the clamping mechanism on a horizontal plane. In some implementations, the clamping mechanism may include two clamps arranged laterally along the length of the waiting area. Each clamp includes two clamping members arranged front-to-back along the width of the waiting area. At least one of the clamping members can be moved along the width of the waiting area by a clamping drive unit. The clamping drive unit may include a clamping guide rail and a clamping drive source. The clamping guide rail is arranged along the width of the waiting area, and the clamping drive source can drive at least one clamping member of the clamp to move along the width of the waiting area. For example, when the clamping drive source drives at least one clamping member of the clamp along the width of the waiting area, thereby moving the silicon rod located between the two clamping members until the two clamping members of the same clamp are fully clamped, the clamped silicon rod is then adjusted to the correct position, and the axis of the silicon rod is aligned with a predetermined center line.

[0374] As mentioned above, the centering adjustment mechanism may further include a height detector for detecting the position information of the axis of the silicon rod supported by the silicon rod bearing structure in the direction of the plumb line. In one implementation, the height detector may be, for example, a contact sensor or a distance sensor. Taking a contact sensor as an example, the contact sensor has a probe for contacting the side of the silicon rod (e.g., the top surface of the silicon rod). In some embodiments, the probe of the contact sensor may also be provided with a telescopic spring, which can retract under the action of the telescopic spring when the probe contacts the silicon rod, thereby protecting the probe and preventing it from being damaged by contact or pressure.

[0375] As can be seen from the above, by using the height detector, the height of the silicon rod can be obtained by multi-point detection on the top surface of the silicon rod, and then the position information of the axis of the silicon rod in the direction of the plumb line can be obtained, so as to facilitate subsequent adjustment by the centering adjustment mechanism.

[0376] In practical applications, when using the aforementioned silicon rod transfer device, the specific operation process can be roughly as follows: the silicon rod support structure is located at a predetermined initial position, and the silicon rod to be processed is placed on the first loading component and the second loading component of the silicon rod support structure; the silicon rod supported by the silicon rod support structure is adjusted using the position adjustment structure so that the silicon rod is transferred to the waiting area, and at the same time, the axis of the silicon rod is aligned vertically with the clamping center of the silicon rod clamp; the silicon rod is clamped using the clamping mechanism, which serves as a horizontal adjustment mechanism in the centering adjustment mechanism, so that the axis of the silicon rod is aligned horizontally with the clamping center of the silicon rod clamp, thus completing the centering operation of the silicon rod; the two end faces of the silicon rod are clamped using the silicon rod clamp.

[0377] The silicon rod transfer device disclosed in this application includes a silicon rod bearing structure and a position adjustment structure. It can achieve the centering operation of the silicon rod in the loading process of transferring the silicon rod to be processed to the waiting area, so that the axis of the silicon rod is on the same straight line as the clamping center line of the silicon rod clamp. Taking the silicon rod cutting and grinding integrated machine in the aforementioned embodiment of this application as an example, the silicon rod transfer device disclosed in this application can transfer the silicon rod to be processed from the loading area to the waiting area, so that the axis of the silicon rod is on the same straight line as the clamping center line of the silicon rod clamp at the waiting area, which is beneficial to the subsequent silicon rod processing operation. Compared with related technologies, it has the advantages of simple structure, convenient operation, accurate centering and high efficiency.

[0378] In one embodiment of this application, the silicon rod transfer device can not only load and unload silicon rods in the waiting area, but also enable the silicon rods loaded in the waiting area to complete a centering operation before grinding. Specifically, the centering operation involves aligning the axis of the silicon rod with the clamping center line of the silicon rod clamp in the silicon rod transfer device.

[0379] Here, another embodiment of this application discloses a silicon rod cutting and grinding integrated machine, which integrates two cutting devices and one grinding device. The silicon rod conversion device can switch the positions of the horizontally clamped silicon rods between two cutting areas and one grinding area, so that the two cutting devices can perform squaring operations on the silicon rods and the grinding device can perform grinding operations on the silicon rods. This allows the cutting devices and grinding devices in the silicon rod cutting and grinding integrated machine to be in working state at the same time, completing the silicon rod cutting, squaring and grinding operations in an integrated operation, improving silicon rod processing efficiency and product processing quality, and improving economic benefits.

[0380] When using the above Figure 5 and Figure 6 When the silicon rod cutting and grinding integrated machine in the illustrated embodiment performs silicon rod processing operations, the specific process can be roughly as follows:

[0381] The first silicon rod is placed in the silicon rod transfer device.

[0382] Next, the silicon rod transfer device moves the first silicon rod to the waiting area, where a silicon rod clamp holds the first silicon rod to complete the loading. The axis of the first silicon rod is collinear with the clamping center line of the silicon rod clamp.

[0383] Next, the silicon rod conversion device rotates by a preset angle to drive each silicon rod clamp on the conversion body and the silicon rod it holds to the corresponding processing area. For example, the silicon rod conversion device can be rotated 90° forward to convert the silicon rod clamp originally located in the waiting area and the first silicon rod it holds to the first cutting area.

[0384] Next, the first cutting device performs a first cutting operation on the first silicon rod held by the silicon rod clamp located in the first cutting area of ​​the silicon rod conversion device.

[0385] In some implementations, the first cutting device includes a cutting wire mesh in the shape of "=" or "||". The first cutting travel mechanism in the first cutting device drives the first cutting mounting structure and the first cutting unit on it to move along a cutting direction consistent with the axis of the first silicon rod. This causes the "=" or "||" shaped first cutting wire mesh formed by two parallel first cutting wire saws in the first cutting unit to cut the first silicon rod during the movement, so as to form two opposing parallel side cuts and two edge skins on the first silicon rod.

[0386] In some implementations, the first cutting device includes a cross-shaped first cutting wire mesh. The first cutting travel mechanism in the first cutting device drives the first cutting mounting structure and the first cutting unit thereon to move along a cutting direction consistent with the axis of the first silicon rod. This causes the cross-shaped first cutting wire mesh formed by two cross-shaped first cutting wire saws in the first cutting unit to cut the first silicon rod during the movement, so as to form two opposing intersecting side cuts and two edge skins on the first silicon rod.

[0387] At the same time, the silicon rod transfer device transfers the second silicon rod to the waiting area, where the silicon rod clamp holds the second silicon rod to complete the loading.

[0388] Next, the silicon rod conversion device rotates by a preset angle to drive each silicon rod clamp on the conversion body and the silicon rod it holds to the corresponding processing area. For example, the silicon rod conversion device can be rotated 90° forward to convert the silicon rod clamp originally located in the first cutting area and the first silicon rod it holds to the second cutting area, and to transfer the silicon rod clamp originally located in the waiting area and the second silicon rod it holds to the first cutting area.

[0389] Next, the second cutting device performs a second cutting operation on the first silicon rod held by the silicon rod clamp located in the second cutting area of ​​the silicon rod conversion device, and the first cutting device performs a first cutting operation on the second silicon rod held by the silicon rod clamp located in the first cutting area of ​​the silicon rod conversion device.

[0390] In some implementations, the second cutting device includes a second cutting wire mesh in the shape of "=" or "||". The clamping part of the silicon rod clamp is driven to rotate 90° clockwise or counterclockwise by the clamping part rotation mechanism in the silicon rod clamp. Then, the second cutting travel mechanism in the second cutting device drives the second cutting mounting structure and the second cutting unit on it to move along the cutting direction consistent with the axis of the second silicon rod. During the movement, the "=" or "||" shaped second cutting wire mesh formed by two parallel second cutting wire saws in the second cutting unit performs a second cutting operation on the first silicon rod, so as to form two opposite parallel side cut surfaces and two edge skins on the second silicon rod, and cut to form a second silicon rod with a rectangular cross-section.

[0391] In some implementations, the second cutting device includes a second intersecting cutting wire mesh. The clamping part of the silicon rod clamp is driven to rotate 180° clockwise or counterclockwise by a clamping part rotation mechanism in the silicon rod clamp. Then, the second cutting travel mechanism in the second cutting device drives the second cutting mounting structure and the second cutting unit on it to move along a cutting direction consistent with the axis of the second silicon rod. During the movement, the intersecting second cutting wire mesh formed by two intersecting second cutting wire saws in the second cutting unit performs a second cutting operation on the second silicon rod, so as to form two opposing intersecting side cut surfaces and two edge skins on the second silicon rod, and cut to form a second silicon rod with a rectangular cross section.

[0392] Regarding the first cutting operation performed by the first cutting device on the second silicon rod held by the silicon rod clamp located in the first cutting area of ​​the silicon rod conversion device, please refer to the aforementioned description of the first silicon rod performing the first cutting operation in the first cutting area, which will not be repeated here.

[0393] At the same time, the silicon rod transfer device transfers the third silicon rod to the waiting area, where the silicon rod clamp holds the third silicon rod to complete the loading.

[0394] Next, after the first silicon rod has completed the squaring operation, the silicon rod conversion device rotates by a preset angle to drive each silicon rod clamp and the silicon rod it holds to the corresponding processing area. For example, the silicon rod conversion device can continue to rotate forward by 90° to transfer the silicon rod clamp and the first silicon rod it holds, which was originally located in the second cutting area, to the grinding area; transfer the silicon rod clamp and the second silicon rod it holds, which was originally located in the first cutting area, to the second cutting area; and transfer the silicon rod clamp and the third silicon rod it holds, which was originally located in the waiting area, to the first cutting area.

[0395] Next, the grinding device grinds the first squared silicon rod held by the silicon rod clamp located in the grinding area of ​​the silicon rod conversion device. At the same time, the second cutting device performs a second cutting operation on the second silicon rod held by the silicon rod clamp located in the second cutting area of ​​the silicon rod conversion device. The first cutting device performs a first cutting operation on the third silicon rod held by the silicon rod clamp located in the first cutting area of ​​the silicon rod conversion device. Finally, the silicon rod transfer device transfers the fourth silicon rod to the waiting area so that the silicon rod clamp in the waiting area can hold the fourth silicon rod to complete the loading.

[0396] The grinding operation of the first silicon rod may include: driving the grinding wheel mounting structure and at least one pair of grinding wheels on it to move along a grinding direction consistent with the axis of the first silicon rod through the grinding wheel traveling mechanism in the grinding device, so that the at least one pair of grinding wheels grinds the first silicon rod during the movement.

[0397] Regarding the second cutting operation performed by the second cutting device on the second silicon rod and the first cutting operation performed by the first cutting device on the third silicon rod, please refer to the aforementioned description of the second cutting operation performed by the first silicon rod in the second cutting area and the first cutting operation performed in the first cutting area, which will not be repeated here.

[0398] After the first silicon rod completes the grinding process, the silicon rod conversion device rotates by a preset angle to drive each silicon rod clamp and its clamped silicon rod to the corresponding processing area. For example, the silicon rod conversion device can rotate 270° in the reverse direction (or continue to rotate 90° in the forward direction) to convert the silicon rod clamp and its clamped first silicon rod originally located in the grinding area to the waiting area, the silicon rod clamp and its clamped second silicon rod originally located in the second cutting area to the grinding area, the silicon rod clamp and its clamped third silicon rod originally located in the first cutting area to the second cutting area, and the silicon rod clamp and its clamped fourth silicon rod originally located in the waiting area to the first cutting area.

[0399] The first silicon rod, after grinding, is unloaded from the waiting area by the silicon rod transfer device, and the fifth silicon rod is loaded and transferred to the waiting area. The fifth silicon rod is then held by the silicon rod clamp in the waiting area to complete the loading. At the same time, the grinding device grinds the second silicon rod, which has been squared and is held by the silicon rod clamp in the grinding area of ​​the silicon rod conversion device. The second cutting device performs a second cutting operation on the third silicon rod, which is held by the silicon rod clamp in the second cutting area of ​​the silicon rod conversion device. The first cutting device performs a first cutting operation on the fourth silicon rod, which is held by the silicon rod clamp in the first cutting area of ​​the silicon rod conversion device.

[0400] Here, another embodiment of the silicon rod cutting and grinding method disclosed in this application is applied to a silicon rod cutting and grinding integrated machine. The silicon rod cutting and grinding integrated machine includes a base, a silicon rod conversion device, two cutting devices, and a grinding device. The base has a silicon rod processing platform, which includes two cutting areas and one grinding area. When processing the silicon rod, the silicon rod conversion device is rotated by a preset angle to convert the silicon rod from the waiting area to the first cutting area. The first cutting device performs a first cutting operation on the silicon rod in the corresponding first cutting area. The silicon rod conversion device is rotated by a preset angle to convert the silicon rod from the first cutting area to the first cutting area. The silicon rod is moved to the second cutting zone, where the second cutting device performs a second cutting operation, forming a silicon rod with a rectangular cross-section. The silicon rod conversion device is then rotated by a preset angle to transfer the squared silicon rod from the second cutting zone to the grinding zone, where the grinding device performs a grinding operation on the silicon rod. This completes the integrated operation of multiple processes, including silicon rod cutting and grinding, and allows both the cutting and grinding devices in the silicon rod cutting and grinding machine to be in operation at the same time, improving silicon rod processing efficiency and product processing quality, and enhancing economic benefits.

[0401] Please see Figure 7 The image shown is a structural schematic diagram of the silicon rod cutting and grinding integrated machine of this application in another embodiment.

[0402] The silicon rod cutting and grinding integrated machine of this application is used to cut and grind silicon rods with a circular cross-section.

[0403] like Figure 7 As shown, another embodiment of this application discloses a silicon rod cutting and grinding integrated machine, including: a base 31, a silicon rod conversion device 32, a cutting device 33, a first grinding device 34, and a second grinding device 35.

[0404] The base, as the main component of the silicon rod cutting and grinding integrated machine, is used to provide a silicon rod processing platform. In some examples, the base includes fixing or limiting structures for supporting different components in the silicon rod cutting and grinding integrated machine, such as a base, rod, column, frame, etc., all of which are the bases described in this application.

[0405] Meanwhile, in some examples, the base may be an integral base, while in other examples, the base may include multiple independent bases.

[0406] The machine base has a silicon rod processing platform, which can be divided into multiple functional areas according to the specific work content of the silicon rod processing operation. For example, the silicon rod processing platform includes at least a cutting area and a grinding area. It should be noted that in the examples provided in this application, the functional areas are defined by the travel path and range of the processing device at the functional area. For example, the cutting device of the silicon rod cutting and grinding integrated machine is located at the cutting area, and the range of the cutting area is the range occupied by the cutting device during the cutting and squaring operation; similarly, the grinding device of the silicon rod cutting and grinding integrated machine is located at the grinding area, and the range of the grinding area is the range occupied by the grinding device during the grinding operation. The shape of the silicon rod processing platform can be determined based on the machine base, or it can be determined jointly based on the processing needs of the machine base, the cutting device, and the grinding device. Figure 7 In the illustrated embodiment, the base 31 has a silicon rod processing platform, which includes a cutting area and two grinding areas. These two grinding areas can be referred to as the first grinding area and the second grinding area, respectively, and are arranged sequentially. A cutting device 33 is provided in the cutting area to perform a squaring operation on the silicon rod located there, cutting a circular silicon rod into a rectangular silicon rod. A first grinding device 34 is provided in the first grinding area to perform a first grinding operation on the silicon rod located there. A second grinding device 35 is provided in the second grinding area to perform a second grinding operation on the silicon rod located there.

[0407] The silicon rod transfer device is located on the silicon rod processing platform of the machine base and is used to transfer silicon rods. For example, the silicon rod transfer device can be used to change the position of the silicon rod between the cutting area and the grinding area. Figure 7 In the illustrated embodiment, the silicon rod conversion device 32 further includes a conversion body 321, a plurality of silicon rod clamps 322 disposed on the conversion body 321, and a conversion drive mechanism (not shown in the figures). The clamping center lines of the plurality of silicon rod clamps 322 disposed on the conversion body 321 are aligned with the horizontal line. It should be understood that, under this configuration, the silicon rods clamped by the silicon rod clamps 322 are in a horizontal position.

[0408] The conversion body can be located in the central area of ​​the silicon rod processing platform, and each side of the conversion body can serve as a mounting surface for mounting multiple silicon rod clamps. Figure 7In the illustrated embodiment, silicon rod clamps 322 are mounted on each side of the conversion body 321. Specifically, the conversion body can be disc-shaped, annular, square-shaped, or other similar in shape. The number of silicon rod clamps on the conversion body can vary depending on the layout of the silicon rod cutting and grinding machine.

[0409] The conversion body is driven by a conversion drive mechanism to switch the silicon rod clamps mounted on it between different functional areas. This allows the silicon rods held by the clamps to change positions between different functional areas, enabling different processing steps such as cutting and squaring, and grinding. Simultaneously, multiple silicon rod clamps mounted on the conversion body can be positioned in different functional areas. Thus, at the same time, silicon rods held by different clamps can undergo corresponding processing steps in different functional areas. For example, the cutting and grinding devices in the integrated silicon rod cutting and grinding machine can be operating simultaneously, which improves processing efficiency.

[0410] For example, in some embodiments, the silicon rod processing platform may include two functional areas, such as a first functional area and a second functional area. To adapt to these functional areas, the number of silicon rod clamps on the conversion body may be set to two, each clamping at least one silicon rod. Furthermore, the angle between the two silicon rod clamps is consistent with the angular distribution between the two functional areas. Thus, when one silicon rod clamp corresponds to one functional area, the other silicon rod clamp necessarily corresponds to the other functional area. In this way, during assembly line operations, at any given time, when each silicon rod clamp holds at least one silicon rod and the clamp corresponds to a functional area, these silicon rods are located at the corresponding functional area and performing a corresponding processing operation. For example, a first processing operation can be performed on the silicon rod located in the first functional area, and a second processing operation can be performed on the silicon rod located in the second functional area.

[0411] In some embodiments, the silicon rod processing platform may include three functional areas, such as a first functional area, a second functional area, and a third functional area; or two first functional areas and a second functional area; or one first functional area and two second functional areas. To accommodate these functional areas, the number of silicon rod clamps on the conversion body may be set to three, each clamping at least one silicon rod. Furthermore, the angles between any two of the three silicon rod clamps correspond to the angular distribution between any two of the three functional areas. Thus, when one silicon rod clamp corresponds to one functional area, the other two silicon rod clamps necessarily correspond to the other two functional areas. Thus, in the assembly line operation, at any given moment, when each silicon rod clamp holds at least one silicon rod and the silicon rod clamp corresponds to a functional area, these silicon rods are performing a corresponding processing operation at that functional area. For example, a first processing operation can be performed on the silicon rod located in the first functional area, a second processing operation can be performed on the silicon rod located in the second functional area, and a third processing operation can be performed on the silicon rod located in the third functional area; or, a first processing operation can be performed on the silicon rod located in two first functional areas, and a second processing operation can be performed on the silicon rod located in one second functional area; or, a first processing operation can be performed on the silicon rod located in one first functional area, and a second processing operation can be performed on the silicon rod located in two second functional areas. In an optional example, the first, second, and third functional areas on the silicon rod processing platform are distributed at 120° intervals between each pair. Therefore, correspondingly, the three silicon rod clamps on the conversion body are also distributed at 120° intervals between each pair. Of course, the number of silicon rod clamps can be varied according to actual needs and is not limited to this. For example, the number of silicon rod clamps can be determined according to the number of functional areas set up on the silicon rod processing platform.

[0412] In some embodiments, the silicon rod processing platform includes four functional areas, such as: a first functional area, a second functional area, a third functional area, and a fourth functional area; or two first functional areas and two second functional areas; or two first functional areas, a second functional area, and a third functional area; or a first functional area, two second functional areas, and a third funct...

Claims

1. A silicon rod cutting and grinding integrated machine, characterized in that, include: A base having a silicon rod processing platform; the silicon rod processing platform includes at least one cutting area and at least one grinding area; A silicon rod conversion device is provided on the silicon rod processing platform of the machine base, including a conversion body, a plurality of silicon rod clamps provided on the conversion body, and a conversion drive mechanism. The silicon rod clamps are used to hold silicon rods and make the axis of the held silicon rods aligned with the horizontal line. The conversion drive mechanism includes a vertically arranged shifting shaft for driving the conversion body to rotate around the shifting shaft, so that the plurality of silicon rod clamps and the silicon rods they hold can change positions in at least one cutting area and at least one grinding area. At least one cutting device is provided at at least one corresponding cutting area. The number of cutting devices is the same as the number of cutting areas. The cutting device is used to cut the silicon rod to be cut held by the silicon rod clamp located at the corresponding cutting area in the silicon rod conversion device, so that the silicon rod to be cut with a circular cross-section is formed into a square silicon rod with a rectangular cross-section after the cutting operation. as well as At least one grinding device is provided at a corresponding at least one grinding area, the number of grinding devices is the same as the number of grinding areas, and the grinding device is used to perform grinding operations on the squared silicon rod held by the silicon rod clamp located at the corresponding grinding area in the silicon rod conversion device. The cutting device includes: a cutting mounting structure mounted on the base and corresponding to the cutting area; a cutting unit mounted on the cutting mounting structure; the cutting unit includes a cutting wire frame mounted on the cutting mounting structure, a plurality of cutting wheels mounted on the cutting wire frame, and a cutting wire, the cutting wire being sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw; and a cutting travel mechanism for driving the cutting mounting structure and the cutting unit thereon to move along the cutting direction so that at least one cutting wire saw in the cutting unit performs a cutting operation on the silicon rod to be cut at the cutting area; the cutting direction is consistent with the axis of the silicon rod to be cut held by the silicon rod clamp located at the corresponding cutting area in the silicon rod conversion device.

2. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that, The silicon rod processing platform includes a cutting area and a grinding area, wherein the cutting area is provided with a cutting device and the grinding area is provided with a grinding device.

3. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that, The silicon rod processing platform includes two cutting zones and one grinding zone, wherein each cutting zone is provided with a cutting device and each grinding zone is provided with a grinding device.

4. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that, The silicon rod processing platform includes a cutting area and two grinding areas, wherein each cutting area is equipped with a cutting device and each grinding area is equipped with a grinding device.

5. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that, The cutting unit includes two parallel wire saws, which are used to cut the silicon rod to be cut held by the silicon rod clamp located at the corresponding cutting area in the silicon rod conversion device to form two parallel side cut surfaces.

6. The silicon rod cutting and grinding integrated machine according to claim 5, characterized in that, The cutting device further includes a cutting advance and retreat mechanism for driving the cutting wire frame and the cutting wire saw on it to move along the cutting advance and retreat direction relative to the cutting mounting structure, wherein the cutting advance and retreat direction is perpendicular to the cutting direction.

7. The silicon rod cutting and grinding integrated machine according to claim 5, characterized in that, The cutting device also includes a distance adjustment mechanism for adjusting the cutting position of at least one wire saw in the cutting unit, or changing the cutting groove of the cutting line around the multiple cutting wheels in the cutting unit.

8. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that, The cutting unit includes two intersecting wire saws, which are used to cut the silicon rod to be cut held by the silicon rod clamp located at the corresponding cutting area in the silicon rod conversion device to form two intersecting side cut surfaces.

9. The silicon rod cutting and grinding integrated machine according to claim 8, characterized in that, The cutting device further includes a cutting advance and retreat mechanism for driving the cutting wire frame and the cutting wire saws on it to move along the cutting advance and retreat direction to the cutting mounting structure, so as to adjust the cutting position of the two intersecting cutting wire saws in the cutting unit; the cutting advance and retreat direction is perpendicular to the cutting direction.

10. The silicon rod cutting and grinding integrated machine according to claim 5 or 8, characterized in that, Also includes: The take-up and undo unit corresponding to the cutting unit.

11. The silicon rod cutting and grinding integrated machine according to claim 5 or 8, characterized in that, The cutting line is wound around the plurality of cutting wheels to form a closed loop cutting line with the beginning and end connected.

12. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that, It also includes an edge unloading device for unloading the edge material generated after the wire cutting device performs the cutting operation on the silicon rod to be cut held by the silicon rod clamp.

13. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that, The grinding apparatus includes: A grinding wheel mounting structure is provided on the machine base and corresponds to the grinding area; At least one pair of grinding wheels are disposed opposite to each other on the grinding wheel mounting structure; a grinding space is formed between the at least one pair of grinding wheels; A grinding wheel traveling mechanism is used to drive the at least one pair of grinding wheels to move along the grinding direction so that the at least one pair of grinding wheels can perform grinding operations on the squared silicon rod at the grinding area; the grinding direction is consistent with the axis of the squared silicon rod held by the silicon rod clamp located at the corresponding grinding area in the silicon rod conversion device; and A grinding wheel advance / retreat mechanism is used to drive at least one of the at least one pair of grinding wheels to move along the grinding advance / retreat direction to the grinding wheel mounting structure, wherein the grinding advance / retreat direction is perpendicular to the grinding direction.

14. The silicon rod cutting and grinding integrated machine according to claim 13, characterized in that, The grinding tools include rough grinding tools, fine grinding tools, or a combination of rough grinding tools and fine grinding tools.

15. The silicon rod cutting and grinding integrated machine according to claim 13, characterized in that, The grinding apparatus also includes at least one chamfering / rounding abrasive tool for chamfering or rounding the squared silicon rod in the grinding area.

16. The silicon rod cutting and grinding integrated machine according to claim 15, characterized in that, The chamfering / rounding abrasive includes coarse chamfering / rounding abrasive, fine chamfering / rounding abrasive, or a combination of coarse chamfering / rounding abrasive and fine chamfering / rounding abrasive.

17. The silicon rod cutting and grinding integrated machine according to claim 1, characterized in that, The silicon rod processing platform is also provided with a waiting area; the silicon rod cutting and grinding integrated machine also includes a silicon rod transfer device, which is used to load the silicon rod to be processed into the waiting area or to unload the processed silicon rod from the waiting area.

18. A method for cutting and grinding silicon rods, characterized in that, An integrated silicon rod cutting and grinding machine is used in this application. The machine includes a base with a silicon rod processing platform. The processing platform has at least one cutting area and at least one grinding area. The machine also includes at least one cutting device corresponding to each cutting area, at least one grinding device corresponding to each grinding area, and a silicon rod conversion device. The conversion device includes a conversion body, multiple silicon rod clamps mounted on the conversion body, and a conversion drive mechanism. The clamps hold the silicon rods and align their axis with a horizontal line. The drive mechanism includes a vertically arranged shifting shaft for driving the conversion body and the clamps around the shaft. The cutting device includes a cutting mounting structure, a cutting unit, and a cutting travel mechanism. The silicon rod cutting and grinding method includes the following steps: The silicon ingot conversion device converts the silicon ingot to at least one cutting zone, and the at least one cutting device performs a cutting operation on the silicon ingot to be cut at the corresponding cutting zone, so that the silicon ingot to be cut with a circular cross-section is transformed into a silicon ingot with a rectangular or rectangular cross-section after the cutting operation; wherein, the at least one cutting device performs a cutting operation on the silicon ingot to be cut at the corresponding cutting zone, which includes: driving the cutting mounting structure and the cutting unit on it in the at least one cutting device to move along the cutting direction so that at least one wire saw in the cutting unit performs a cutting operation on the silicon ingot to be cut at the cutting zone, the cutting direction being consistent with the axis of the silicon ingot to be cut held by the silicon ingot clamp located at the corresponding cutting zone in the silicon ingot conversion device; and The silicon rod conversion device is rotated by a preset angle to convert the squared silicon rod from at least one cutting area to at least one grinding area, and the at least one grinding device performs grinding operations on the squared silicon rod in the corresponding grinding area.

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