Socket structure

Abstract

This case relates to a socket structure. The socket structure includes a housing, a main body, an outer frame, and a cover. The housing includes multiple sidewalls, a bottom, an opening, and a receiving space. The sidewalls collectively define the opening. The sidewalls and the bottom collectively define the receiving space, wherein the opening communicates with the receiving space. The main body is disposed in the receiving space and includes a circuit board and a connection port. The connection port is disposed on the circuit board. The outer frame includes at least one sheet and a first extension. The sheet surrounds the outer edge of the opening. The first extension extends from the sheet and connects to one of the sidewalls. The cover covers the opening and includes a through-hole. The through-hole is configured to allow a plug to pass through and connect to the connection port.

Description

Technical Field

[0001] This case concerns a socket structure, particularly a socket structure in which a metal frame and a housing are combined. Background Technology

[0002] As a source of power supply, power outlets are indispensable products in daily life. Currently, USB ports are commonly used as the transmission interface for charging electronic devices, hence the growing trend in outlet designs to include USB slots. With consumers demanding faster charging speeds, the required power output has also increased. However, due to limitations in component configuration and size within the outlet structure, USB outlets are prone to localized overheating. To prevent damage to electronic components from high temperatures, the total wattage that USB outlets can currently handle remains difficult to increase further.

[0003] Therefore, it is necessary to develop a socket structure that can solve the above problems in order to address the issues faced by the existing technology. Summary of the Invention

[0004] The main objective of this invention is to provide a socket structure that solves and improves upon the problems and shortcomings of the aforementioned prior art.

[0005] Another objective of this invention is to provide a socket structure that enhances the heat conduction capacity of the socket structure by combining the outer frame and the housing, effectively transferring heat from the inside of the socket structure to the outside to improve heat dissipation and solve the problem of excessive local temperature in the socket structure. This will help increase the total wattage that the socket structure can handle, making it meet the requirements of high power.

[0006] To achieve the aforementioned objectives, this application provides a socket structure. The socket structure includes a housing, a main body, an outer frame, and a cover. The housing includes multiple sidewalls, a bottom, an opening, and an accommodating space. The sidewalls collectively define the opening. The sidewalls and the bottom collectively define the accommodating space, wherein the opening communicates with the accommodating space. The main body is disposed within the accommodating space and includes a circuit board and a connection port. The connection port is disposed on the circuit board. The outer frame includes at least one sheet and a first extension. The sheet surrounds the outer edge of the opening. The first extension extends from the sheet and connects to one of the sidewalls. The cover covers the opening and includes a through-hole. The through-hole is configured to allow a plug to pass through and connect to the connection port. Attached Figure Description

[0007] Figure 1 This is a structural diagram illustrating the socket structure of the first embodiment of this case;

[0008] Figure 2 It is to reveal Figure 1 The exploded view of the socket structure shown is shown.

[0009] Figure 3 It is to reveal Figure 1 The diagram shows a cross-sectional view of the socket structure along the A-A' section.

[0010] Figure 4 This is an exploded view of the socket structure in the second embodiment of this case;

[0011] Figure 5 It is to reveal Figure 4 The diagram shows a cross-sectional view of the socket structure.

[0012] [Symbol Explanation]

[0013] 1: Shell

[0014] 11: Sidewall

[0015] 12: Bottom

[0016] 13: Opening

[0017] 14: Storage space

[0018] 2: Main body

[0019] 21: Circuit board

[0020] 22: Connection Port

[0021] 23: Thermal conductive components

[0022] 3, 3': Outer frame

[0023] 31: Sheet body

[0024] 31a: First piece

[0025] 31b: Second piece

[0026] 32, 32': First extension

[0027] 33, 33': Second extension

[0028] 34: Third Extension

[0029] 35: Positioning hole

[0030] 36: Fixing slot

[0031] 4: Cover

[0032] 41: Perforation

[0033] 5: Insulating outer cover

[0034] A-A': Tangent line

[0035] S: Fastener Detailed Implementation

[0036] Some typical embodiments embodying the features and advantages of this invention will be described in detail in the following description. It should be understood that this invention can have various variations in different forms, all of which do not depart from the scope of this invention, and the descriptions and drawings herein are for illustrative purposes only and not for limiting the invention.

[0037] Please see Figure 1 , Figure 2 and Figure 3 . Figure 1 This is a structural diagram illustrating the socket structure of the first embodiment of this case. Figure 2 It is to reveal Figure 1 The exploded view of the socket structure shown. Figure 3 It is to reveal Figure 1 The diagram shows a cross-sectional view of the socket structure along line A-A'. As shown, the socket structure includes a housing 1, a main body 2, an outer frame 3, and a cover 4. The housing 1 includes multiple sidewalls 11, a bottom 12, an opening 13, and a receiving space 14. The sidewalls 11 collectively define the opening 13. The sidewalls 11 and the bottom 12 collectively define the receiving space 14, wherein the opening 13 communicates with the receiving space 14. The main body 2 is disposed in the receiving space 14 and includes a circuit board 21 and a connection port 22. The connection port 22 is disposed on the circuit board 21. The outer frame 3 includes at least one piece 31 and a first extension 32. The piece 31 surrounds the outer edge of the opening 13. The first extension 32 extends from the piece 31 and connects to one of the sidewalls 11. The cover 4 covers the opening 13 and includes a through hole 41. The through hole 41 is configured to allow a plug (not shown) to pass through and connect to the connection port 22. In this embodiment, the plug is a USB plug, and the connection port 22 is a USB connection port. The outer frame 3 is made of metal, which can improve the heat conduction capacity of the socket structure to conduct heat from the inside of the socket structure to the outside and improve the problem of excessive local temperature, but it is not limited to this.

[0038] In this embodiment, the shell 1 is generally cuboid, that is, it includes four sidewalls 11, and the four sidewalls 11 together define a square opening 13. In this embodiment, the thickness of the sidewalls 11 and the bottom 12 is between 1.0 mm and 3.0 mm, but is not limited thereto. The cover 4 is connected to the inner surfaces of the four sidewalls 11 to cover the opening 13. In this embodiment, the outer frame 3 may be made of, for example but not limited to, a metal sheet with a thickness between 0.5 mm and 2.0 mm, and includes a first piece 31a and a second piece 31b. The first piece 31a is U-shaped and together with the second piece 31b surrounds the outer edge of the opening 13, but is not limited thereto. In some embodiments, the first piece 31a and the second piece 31b may be integrally formed.

[0039] In this embodiment, the first extension 32 extends from one side of the first sheet 31a, and may extend, for example, but not limited to, from the side of the first sheet 31a opposite to the second sheet 31b. In this embodiment, the outer frame 3 also includes a second extension 33. The second extension 33 is connected to the first extension 32 and together with the first extension 32 forms an L-shaped structure. In this embodiment, the first extension 32 and the second extension 33 are respectively embedded in the side wall 11 and bottom 12 of the housing 1 by injection molding technology. In this embodiment, the outer frame 3 also includes a plurality of positioning holes 35. The positioning holes 35 are provided on the first extension 32 and the second extension 33 to allow material of the housing 1 to flow through during the injection molding process, so as to facilitate the positioning of the first extension 32 and the second extension 33 in the housing 1. In this embodiment, the diameter of the positioning hole 35 is between 0.5 mm and 1.0 mm, but is not limited thereto. In this way, the outer frame 3 can be combined with the housing 1, which can improve the heat conduction capacity of the housing 1 while reducing the steps of subsequent installation of the socket structure, thereby reducing the assembly cost.

[0040] In this embodiment, the outer frame 3 further includes a plurality of third extensions 34. The third extensions 34 extend from the first sheet 31a and the second sheet 31b and are connected to the sidewall 11 of the housing 1. In this embodiment, the third extensions 34 may be embedded in the sidewall 11, for example, but not limited to, through an injection molding technique, to make the outer frame 3 more securely connected and fixed to the housing 1. In this embodiment, the first sheet 31a has four third extensions 34, that is, each side except the side where the first extension 32 is provided has two third extensions 34, and the second sheet 31b has two third extensions 34, but this is not a limitation.

[0041] Please see Figure 4 and Figure 5 . Figure 4 This is an exploded view of the socket structure in the second embodiment of this case. Figure 5 It is to reveal Figure 4 The diagram shows a cross-sectional view of the socket structure. The main difference between the first and second embodiments of this case lies in the way the outer frame 3' is joined to the housing 1; therefore, the structural features of the main body 2 and the cover 4 will not be described in detail here. In this embodiment, the first extension 32' and the second extension 33' are respectively attached to the surface of the side wall 11 and the surface of the bottom 12, and the third extension 34 is also embedded in the side wall 11 of the housing 1, but this is not a limitation. In some embodiments, the third extension 34 is attached to the surface of the side wall 11. In this embodiment, the positioning hole 35 is only provided on the second extension 33', but this is not a limitation.

[0042] In this embodiment, the socket structure further includes an insulating outer cover 5. The insulating outer cover 5 covers the side wall 11, bottom 12, first extension 32', and second extension 33' to achieve insulation. In this embodiment, the socket structure also includes four fasteners S. The outer frame 3' also includes four fixing slots 36. The fixing slots 36 are respectively provided on each side of the first piece 31a and the second piece 31b. The fasteners S pass through the fixing slots 36 of the outer frame 3' and connect to the insulating outer cover 5, thereby enabling the outer frame 3' and the housing 1 to be connected and fixed to the insulating outer cover 5.

[0043] In the first and second embodiments of this invention, the socket structure further includes a sealing layer (not shown). The sealing layer is filled between the bottom 12 of the housing 1 and the bottom surface of the circuit board 21 to further improve the heat conduction capability of the socket structure. Furthermore, the main body 2 may also include a heat-conducting element 23, such as, but not limited to, a plate-like structure. The heat-conducting element 23 is connected to the circuit board 21 and extends from the circuit board 21 towards the bottom 12 of the housing 1. In other words, the extension direction of the heat-conducting element 23 is parallel to the extension direction of the first extensions 32, 32' of the outer frames 3, 3', but is not limited thereto. In some embodiments, the heat-conducting element 23 is in direct contact with the first extensions 32, 32'. In other embodiments, the sealing layer may be filled between the heat-conducting element 23 and the first extensions 32, 32' of the outer frames 3, 3'. In this way, the heat generated by the connection port 22 of the main body 2 can be fully conducted to the outer frames 3, 3' and the housing 1 through the heat-conducting element 23, achieving the effect of further improving heat dissipation.

[0044] In summary, this invention provides a socket structure in which the outer frame and housing can be securely joined together through the first, second, and third extensions of the outer frame, effectively improving the heat dissipation of the socket structure and preventing the problem of excessively high local temperatures. Furthermore, it reduces the number of steps required to install the socket structure, thereby lowering assembly costs.

[0045] This case may be modified in various ways by those skilled in the art, but none of them shall fall outside the scope of protection sought by the appended claims.

Claims

1. A socket structure, characterized in that, Include: A housing includes multiple sidewalls, a bottom, an opening, and a receiving space, wherein the multiple sidewalls together define the opening, the multiple sidewalls and the bottom together define the receiving space, and the opening communicates with the receiving space. A main body is disposed in the accommodating space and includes a circuit board and a connection port, wherein the connection port is disposed on the circuit board; An outer frame includes at least one piece and a first extension, wherein the at least one piece surrounds the outer edge of the opening, and the first extension extends from the at least one piece and is connected to one of the plurality of sidewalls. as well as A cover that covers the opening and includes a perforation designed to allow a plug to pass through and connect to the connection port; The outer frame also includes a second extension, which is connected to the first extension and to the bottom of the housing. The first extension and the second extension are respectively embedded in one of the plurality of side walls and the bottom.

2. The socket structure as described in claim 1, characterized in that, The first extension and the second extension are respectively embedded in one of the plurality of sidewalls and the bottom through an injection molding technique.

3. The socket structure as described in claim 1, characterized in that, The outer frame also includes a plurality of positioning holes, which are disposed in at least one of the first extension and the second extension.

4. The socket structure as described in claim 1, characterized in that, The outer frame also includes a plurality of third extensions that extend from the at least one piece and are connected to the plurality of sidewalls.

5. The socket structure as described in claim 4, characterized in that, The third extension is embedded in the plurality of sidewalls using an injection molding technique.

6. The socket structure as described in claim 1, characterized in that, The outer frame includes a first piece and a second piece, wherein the first piece is U-shaped and together with the second piece surrounds the outer edge of the opening, wherein the first extension extends from one side of the first piece.

7. The socket structure as described in claim 1, characterized in that, It also includes an insulating cover, wherein the first extension is attached to the surface of one of the plurality of sidewalls, and the insulating cover covers the plurality of sidewalls, the bottom and the first extension.

8. The socket structure as described in claim 1, characterized in that, The plug is a USB plug, and the connection port is a USB connection port.

9. The socket structure as described in claim 1, characterized in that, The outer frame is made of metal.

10. The socket structure as described in claim 1, characterized in that, It also includes an adhesive layer that fills the space between the bottom of the housing and the bottom surface of the circuit board.

11. The socket structure as described in claim 1, characterized in that, The main body also includes a heat-conducting component connected to the circuit board and extending from the circuit board to the bottom of the housing.

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