A heat dissipation device and a communication device

Abstract

The present application provides a heat dissipation device and a communication device. The heat dissipation device includes a receiving portion and a radiator assembly. The receiving portion has a receiving cavity for receiving a heat generating device, and the heat generating device is inserted into the receiving cavity along a first direction. The radiator assembly includes a radiator, a bracket, a sliding assembly, and a linkage portion. The bracket is fixed to the receiving portion, and the radiator is connected to the bracket through the sliding assembly. The receiving portion includes opposite first and second side surfaces, and the radiator is located on the first side surface. The sliding assembly includes an inclined slot and a slider. The inclined slot gradually approaches the second side surface of the receiving portion along the first direction. One end of the above-mentioned linkage portion is installed on the radiator, and the other end is located in the receiving cavity. When the heat generating device is inserted into the receiving cavity, the linkage portion is triggered, driving the radiator to move along the first direction. The slider slides relative to the inclined slot, driving the radiator to move closer to the second side surface. When the heat generating device is completely inserted into the receiving portion, the radiator is in contact with the heat generating device. This is beneficial to reducing the contact thermal resistance between the radiator and the heat generating device.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to a heat dissipation device and a communication device. Background Art

[0002] In communication devices, various electronic components are provided. The electronic components include electronic components that generate heat or get hot during operation (hereinafter simply referred to as heat-generating components). In order to ensure the normal operation of the above-mentioned heat-generating components, it is necessary to use a radiator to export the heat generated by the heat-generating components. When using electronic components, some pluggable heat-generating components are often used. For example, optical module components need to be plugged and unplugged in many communication devices and need to be cooled. Another example is that some hard disks also have the need to be plugged and unplugged in a server and also need to be cooled.

[0003] Taking the optical module as an example, in the prior art, a radiator is usually installed above the optical module. Due to the pluggable characteristics of the optical module, the radiator is usually installed by a buckle or an elastic installation such as a spring screw. During the insertion process of the optical module, the optical module needs to overcome the buckling force of the buckle or the spring screw to lift the radiator, and the above buckling force makes the radiator fit with the optical module for heat dissipation. In the prior art, in order to ensure that the optical module can be inserted into the optical cage of the optical module, the buckling force cannot be set too large, otherwise problems such as the optical module cannot be inserted or the optical module is damaged may occur. However, when the buckling force is insufficient, the fitting effect between the radiator and the optical module is poor, resulting in a large contact thermal resistance between the optical module and the radiator, and the heat dissipation effect of the radiator is poor. Summary of the Invention

[0004] This application provides a heat dissipation device and a communication device to reduce the contact thermal resistance between the radiator and the heat-generating component, improve the heat transfer performance between the radiator and the heat-generating component, reduce the difficulty of plugging and unplugging the heat-generating component, and facilitate the plugging and unplugging of the heat-generating component.

[0005] In a first aspect, this application provides a heat dissipation device. The heat dissipation device is used for inserting and mounting a pluggable heat-generating component and dissipating heat from the heat-generating component. Specifically, the heat dissipation device includes a receiving portion and a radiator assembly. Among them, the receiving portion has a receiving cavity for receiving the heat-generating component. The heat-generating component is inserted into the receiving cavity, and the heat-generating component can be fixed to the receiving portion. For the convenience of description, it can be considered that the direction in which the heat-generating component is inserted into the receiving cavity is the first direction.

[0006] The above radiator assembly includes a radiator, a bracket, a sliding assembly, and a linkage portion. Among them, the bracket is fixed to the receiving portion, and the radiator is connected to the bracket through the sliding assembly. The above receiving portion includes a first side surface and a second side surface that are opposite to each other in the second direction. The radiator is located on the first side surface of the receiving portion, and the second side surface is equivalent to the side surface of the receiving portion facing away from the radiator. Among them, the second direction is perpendicular to the first direction. The above sliding assembly includes an inclined slot and a slider, and the inclined slot gradually approaches the second side surface of the receiving portion in the first direction. Therefore, under the guiding action of the inclined slot, when the radiator moves in the first direction, it simultaneously moves in the direction closer to the second side surface, that is, the radiator can move obliquely downward. One end of the above linkage portion is installed on the radiator, and the other end is located in the accommodation cavity. As the heat-generating device is inserted into the accommodation cavity, the heat-generating device can trigger the above linkage portion, causing the linkage portion to drive the radiator to move in the first direction. At this time, the slider slides relative to the inclined slot, thereby driving the radiator to move closer to the second side surface, that is, driving the radiator to move closer to the heat-generating device. When the heat-generating device is completely inserted into the receiving portion, the radiator is in close contact with the heat-generating device. In this solution, when the heat-generating device is not inserted into the receiving portion, the distance between the radiator and the second side surface is relatively large, and may even be greater than the thickness of the heat-generating device in the second direction. It is not easy to generate lateral friction between the heat-generating device and the heat-dissipating device. At this time, the heat-generating device can be inserted into the receiving portion relatively easily. This reduces the difficulty of inserting and removing the heat-generating device and facilitates the user to insert and remove the heat-generating device. When the heat-generating device is completely inserted into the receiving portion, it can make the radiator and the heat-generating device fit closely, which is beneficial to reducing the contact thermal resistance between the radiator and the heat-generating device and improving the heat transfer performance between the radiator and the heat-generating device.

[0007] When specifically setting the above sliding assembly, the inclined slot can be provided on the radiator and the slider can be provided on the bracket; or, in another embodiment, the above inclined slot is provided on the bracket and the slider is provided on the radiator. The present application does not limit the specific setting method of the sliding assembly. In addition, the cross-section of the above slider can be circular, oval, polygonal, etc., and the present application also does not make any restrictions.

[0008] The receiving portion of the heat dissipation device and the bracket can be an integral structure. For example, processes such as sheet metal or injection molding can be used to form an integral frame structure for the receiving portion and the bracket. Or welding, riveting, threaded connection, or snap connection can be used to fixedly connect the receiving portion and the bracket into an integral structure.

[0009] When the above-mentioned heat dissipation device is specifically set, a first reset member can also be set between the heat sink and the bracket. The first reset member has a reset force along the second direction. Specifically, when the heating device is pulled out of the accommodating cavity, the first reset member is used to drive the heat sink to move away from the second side. In this scheme, under the action of the first reset member, the heat sink can move away from the second side when the heating device is pulled out of the accommodating cavity. Specifically, the heat sink is moved along the oblique groove away from the second side, so that when the heating device is plugged in or out, the distance between the heat sink and the second side is larger, so as to reduce the difficulty of plugging in or out of the heating device.

[0010] In another technical solution, the heat dissipation device may further include a second reset member disposed between the heat sink and the bracket. The second reset member has a reset force that deviates from the first direction. Specifically, when the heating device is pulled out of the accommodating cavity, the second reset member is used to drive the heat sink to move in a direction away from the insertion direction of the heating device. In this solution, under the action of the second reset member, when the heating device is pulled out of the accommodating cavity, the heat sink can move in a direction away from the second side surface. Specifically, the heat sink is moved along the oblique groove in a direction away from the second side surface, so that when the heating device is plugged in or out, the distance between the heat sink and the second side surface is larger, so as to reduce the difficulty of plugging in or out of the heating device.

[0011] In a specific embodiment, the heat dissipation device may only be provided with a first reset member or a second reset member, or may be provided with both a first reset member and a second reset member. The first reset member may be an elastic structure such as a spring, an elastic strip or a reed, or may be a driving structure such as a lever that needs to be configured with a driving device, and the present application does not make any limitation thereto. Similarly, the second reset member may also be an elastic structure such as a spring, an elastic strip or a reed, or may be a driving structure such as a lever that needs to be configured with a driving device, and the present application does not make any limitation thereto.

[0012] In another technical solution, the second reset member may be an elastic heat-conducting strip. One end of the elastic heat-conducting strip is connected to the heat sink, and the other end is connected to the bracket. The elastic heat-conducting strip can conduct the heat of the heat sink to improve the heat dissipation effect.

[0013] In order to further improve the heat dissipation effect of the heat dissipation device, the bracket connected to the elastic heat-conducting strip is the heat-conducting part of the bracket. Then the heat can be further conducted to the heat-conducting part to further increase the heat dissipation area and improve the heat dissipation effect of the heat dissipation device.

[0014] The surface where the heat sink and the heating device are attached also has a flexible heat-conducting layer. The flexible heat-conducting layer has a certain flexibility and can be filled between the heat sink and the heating device more tightly. This makes the thermal connection between the heat sink and the heating device better, reduces thermal resistance, and further improves the heat dissipation effect of the heat sink on the heating device.

[0015] In addition, the position where the above-mentioned radiator is attached to the heat-generating device has heat-conducting protrusions. When the heat-generating device is completely inserted into the accommodating cavity, the heat-conducting protrusions are attached to the heat-generating device. This solution can reduce the probability of structural interference and is beneficial to improving the integration of the heat dissipation device.

[0016] When specifically setting the sliding components, the above-mentioned heat dissipation device may include multiple groups of sliding components. The multiple groups of sliding components are symmetrically arranged on both sides of the radiator, and the symmetry axes of the multiple groups of sliding components are parallel to the first direction. In this solution, the setting of the multiple groups of sliding components can make the sliding process of the radiator relatively stable.

[0017] The specific structure of the above-mentioned linkage part is not limited. In a specific technical solution, the linkage part can be a fixed protrusion. The fixed protrusion is fixed on the surface of the radiator facing the direction of the second side surface. The fixed protrusion extends into the interior of the accommodating cavity. When the heat-generating device is inserted into the accommodating part, the heat-generating device abuts against the fixed protrusion, thereby driving the fixed protrusion to move in the first direction. Furthermore, it drives the radiator to move towards the heat-generating device, so that the radiator abuts against the heat-generating device.

[0018] The above-mentioned fixed protrusion can be fixedly installed on the radiator, for example, connected and fixed by welding, riveting or clamping, etc. Or, the fixed protrusion and the radiator can also be an integral structure, which is beneficial to simplifying the structure of the radiator assembly and the assembly process of the heat dissipation device.

[0019] The above-mentioned heat-generating device has an abutting part that abuts against the fixed protrusion, which is located at the end of the heat-generating device facing the first direction. When the heat-generating device is completely inserted into the accommodating cavity, the abutting part abuts against the fixed protrusion. This solution can protect the heat-generating device and prevent the fixed protrusion from damaging the above-mentioned heat-generating device to ensure the service life of the heat-generating device. For example, the above-mentioned abutting part has a structure such as a steel sheet or a steel block.

[0020] The specific number of the accommodating parts in the above-mentioned heat dissipation device is not limited. For example, the heat dissipation device may include at least two accommodating parts. Among the at least two accommodating parts, some accommodating parts may be correspondingly provided with radiator assemblies, and some accommodating parts may not be provided with radiator assemblies. Or each accommodating part may be correspondingly provided with a radiator assembly. This application does not make any restrictions and can be specifically selected according to the actual use scenario of the heat dissipation device.

[0021] When specifically setting the above-mentioned at least two accommodating parts, the above-mentioned at least two accommodating parts may be arranged in a row along the third direction, the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction. Or, the above-mentioned at least two accommodating parts may be stacked along the second direction. At this time, a heat dissipation component can be arranged in the area between the accommodating parts. Of course, it is also possible to make each accommodating part be correspondingly provided with a radiator assembly.

[0022] In the technical solution of this application, the specific arrangement of at least two accommodating parts and the setting of the corresponding heat sink assembly can be selected according to the actual product requirements, and this application does not make any restrictions.

[0023] When the heat dissipation device includes at least two accommodating parts, the adjacent accommodating parts are fixed into an integral structure. That is to say, the above-mentioned at least two accommodating parts can be designed as an integral structure. Here, the integral structure can refer to an integrally formed structure, or can be connected into an integral structure by means such as welding, clamping or threaded connection, and this application does not make any restrictions. The distance between the accommodating parts in this solution is small, which is beneficial to improving the integration of the heat dissipation device and is also beneficial to improving the overall strength of the heat dissipation device. The heat dissipation device is not prone to problems such as deformation.

[0024] Of course, in other embodiments, the accommodating parts can be separated. That is, the positions of the accommodating parts can be set according to the positions of the actual heat generating devices.

[0025] When the heat dissipation device includes at least two heat sink assemblies, the brackets of at least two heat sink assemblies can be an integral structure, so as to improve the integrity of the heat dissipation device and simplify the assembly process of the heat dissipation device. Or, the adjacent parts of the brackets of at least two heat sink assemblies can be an integral structure. For example, when the bracket includes two side plates opposite to each other in the third direction, the heat sink is located between the two side plates, and the adjacent side plates of the adjacent two heat sinks are an integral structure, which is convenient for simplifying the structure of the heat dissipation device. Or, when the bracket further includes a tail bracket, the tail brackets of each heat dissipation component can be an integral structure.

[0026] In addition, when the above-mentioned at least two accommodating parts are arranged in a row in the third direction, the bracket includes side plates located on both sides of the heat sink in the third direction, and the two side plates of the adjacent two heat sinks are fixedly connected to the accommodating part by a buckle. It can be considered that the accommodating part has a fixing part, and the side plate is fixed to the above-mentioned fixing part by using the buckle, and then the heat sink assembly is fixedly installed on the accommodating part.

[0027] In a second aspect, this application also provides a communication device, which includes a heat generating device and the heat dissipation device in any of the above technical solutions. The above-mentioned heat generating device is inserted into the accommodating part of the heat dissipation device. In this solution, the heat dissipation effect of the heat generating device is better, which is beneficial to improving the working effect and service life of the heat generating device. In addition, the process of inserting and removing the heat generating device is also relatively easy.

[0028] In a specific embodiment, the specific type of the above-mentioned heat generating device is not restricted in this application. For example, the above-mentioned heat generating device includes any type such as an optical module, a chip, a circuit module or a board card module. Description of the Drawings

[0029] Figure 1It is a schematic diagram of a partial structure of a communication device in an embodiment of the present application;

[0030] Figure 2 It is a schematic side view of a heat dissipation device in an embodiment of the present application;

[0031] Figure 3 It is the first schematic side view of the heat dissipation device in the working state in an embodiment of the present application;

[0032] Figure 4 It is the first schematic top view of the heat dissipation device in the working state in an embodiment of the present application;

[0033] Figure 5 It is the second schematic side view of the heat dissipation device in the working state in an embodiment of the present application;

[0034] Figure 6 It is the second schematic top view of the heat dissipation device in the working state in an embodiment of the present application;

[0035] Figure 7 It is the third schematic top view of the heat dissipation device in the working state in an embodiment of the present application;

[0036] Figure 8 It is the third schematic side view of the heat dissipation device in the working state in an embodiment of the present application;

[0037] Figure 9 It is the fourth schematic side view of the heat dissipation device in the working state in an embodiment of the present application;

[0038] Figure 10 It is the fifth schematic side view of the heat dissipation device in the working state in an embodiment of the present application;

[0039] Figure 11 It is the rear view schematic diagram of the radiator device in an embodiment of the present application. Description of the drawings:

[0041] 1 - housing; 2 - heat generating device;

[0042] 3 - heat dissipation device; 31 - accommodating part;

[0043] 311 - first side; 312 - second side;

[0044] 32 - radiator assembly; 321 - radiator;

[0045] 3211 - flexible heat conducting layer; 3212 - heat conducting protrusion;

[0046] 3213 - liquid inlet; 3214 - liquid outlet;

[0047] 322 - Bracket; 3221 - Bracket body;

[0048] 3222 - Tailstock; 3223 - Side plate;

[0049] 323 - Sliding component; 3231 - Oblique groove;

[0050] 3232 - Slide block; 324 - Linkage part;

[0051] 325 - First reset member; 326 - Second reset member;

[0052] 327 - Elastic strip; 4 - Circuit board;

[0053] 5 - Buckle. Detailed implementation manner

[0054] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit this application. As used in the specification and appended claims of this application, the singular forms "a", "one kind", "", "the above", "the" and "this" are also intended to include expressions such as "one or more", unless there is a clear indication to the contrary in the context.

[0055] Reference to "one embodiment" or "specific embodiment" etc. described in this specification means that specific features, structures or characteristics described in connection with that embodiment are included in one or more embodiments of this application. The terms "include", "comprise", "have" and their variants all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0056] In communication devices, more and more attention has been paid to the heat dissipation of pluggable heat - generating devices. There are a wide variety of existing pluggable heat - generating devices, including optical modules, chips, circuit modules, board - card modules, etc. However, traditional heat - dissipation devices for these pluggable heat - generating devices still have problems such as large thermal resistance, poor heat - dissipation effect or inconvenient plugging and unplugging, and cannot meet the requirements. In view of the same or similar problems existing in the heat dissipation of these heat - generating devices, for the convenience of description, the heat - dissipation problems of existing heat - generating devices will be described in detail mainly taking optical modules as an example below. It should be understood that other relevant or similar heat - generating devices that need heat dissipation also have the same or similar problems.

[0057] At present, in network communication services, an optical module is an integrated module that converts optical signals and electrical signals into each other, plays an important role in the process of optical fiber communication, and is very widely used. When the optical module is used in optical fiber communication, a large amount of heat will be generated. To ensure the normal operation of the optical module, the heat generated by the optical module needs to be exported and dissipated in time. With the development of communication technology, the communication speed is increased, the density of service ports is increased, and the optical module also continuously improves the communication rate. Moreover, the optical module occupies less space, the power consumption of the optical module is continuously increased, and the heat generated by the optical module is increased. Therefore, the requirements for heat dissipation of the optical module are getting higher and higher, and it is particularly important to solve the heat dissipation problem of high-power optical modules in a small space.

[0058] In the prior art, for the heat dissipation method of high-power pluggable heating devices, most of them are to tightly fit the radiator and the metal shell of the heating device through a buckle. At the fitting position (dry contact position) of the radiator and the heating device, due to the flatness tolerance, manufacturing roughness, etc. on the outer surfaces of both, the fitting is not a tight fit. Microscopically, it is a local point contact between the contacting metals, there are gaps on the contact surface, and there is a large amount of air in the gaps, resulting in problems such as large thermal resistance, poor heat conduction, and weak heat dissipation ability between the radiator and the heating device. In addition, there is also a phenomenon that the contact pressure between the existing radiator and the heating device is unstable or uncontrollable, resulting in poor contact between the two and affecting the heat dissipation performance.

[0059] In view of this, the technical solution of the embodiment of the present application provides a heat dissipation device and a communication device including the heat dissipation device, in order to reduce the contact thermal resistance between the radiator and the heating device, improve the heat transfer performance between the radiator and the heating device, reduce the plugging and unplugging difficulty, and facilitate the plugging and unplugging of the heating device.

[0060] The heat dissipation device of the present application and the communication device including the heat dissipation device will be further described in detail below through specific embodiments and in conjunction with the drawings. It should be noted that the same reference numerals in the embodiments of the present application represent the same component or the same part. For the same parts in the embodiments of the present application, only one of the parts or components may be marked with a reference numeral in the figure. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0061] Figure 1 It is a partial structural schematic diagram of a communication device in an embodiment of the present application. As Figure 1As shown, the communication device includes a housing 1, a heat generating device 2, and a heat dissipation device 3. The heat generating device 2 and the heat dissipation device 3 are disposed in the housing 1. Of course, the heat generating device 2 and the heat dissipation device 3 are not necessarily directly connected. For example, the heat dissipation device 3 can be fixed to a circuit board 4, and the heat generating device 2 is plugged into the heat dissipation device 3, so that the heat generating device 2 is electrically connected to the heat dissipation device 3. The heat generating device 2 and the heat dissipation device 3 can be disposed in the housing 1 through the circuit board 4. The heat dissipation device 3 includes a receiving portion 31 for receiving the heat generating device 2, and the heat generating device 2 is inserted into the receiving portion 31 of the heat dissipation device 3. Thus, the radiator 321 of the heat dissipation device 3 dissipates heat from the heat generating device 2 to ensure the normal operation of the heat generating device 2.

[0062] It should be noted that in the technical solution of this application, the specific type of the communication device is not limited in this application, and any device capable of signal transmission can be called a communication device. For example, the communication device may include a computing device (such as a server), a network device (such as a switch), a storage device (such as a storage array), or a vehicle-mounted device (such as a vehicle-mounted speaker, a vehicle-mounted navigator, etc.). As long as the communication device has a pluggable heat generating device, it is within the protection scope of the technical solution of this application.

[0063] Specifically, the heat generating device 2 is a pluggable or plug-and-play heat generating device 2. The heat generating device 2 can be inserted into the receiving portion 31 of the heat dissipation device 3 and can be pulled out from the receiving portion 31. The specific structure of the heat dissipation device 3 will be described in detail below in conjunction with the drawings and will not be elaborated here for the time being. Through the unique setting of the heat dissipation device 3, the communication device can improve the heat dissipation effect of the heat generating device 2, meet the heat dissipation requirements of the heat generating device 2, and is relatively convenient and labor-saving to plug and unplug, facilitating the plugging and unplugging of the heat generating device 2.

[0064] It should be pointed out that in the embodiments of this application, the specific positions of the heat dissipation device 3 and the heat generating device 2 in the communication device or their connections with other devices are not limited, so they will not be described in detail here. In addition, those skilled in the art understand that in order to provide the required functions to users, the communication device may include several devices arranged inside the device, and this application does not impose special restrictions on this either. Those skilled in the art can adjust the positions or specific structures of each device according to actual needs.

[0065] In specific embodiments, the type of the above-mentioned heating device 2 is not limited and can be any heating electronic device. That is, the above-mentioned heat dissipation device 3 can adapt to the heat dissipation of different heating devices 2, with good product versatility and can meet the heat dissipation optimization problems of different modules. In addition, the heat dissipation device 3 can also meet the heat dissipation requirements of different-sized modules without affecting the versatility of the heat dissipation structure, and only need to reasonably adjust the size of the heat dissipation device 3. Specifically, in some embodiments, the heating device 2 can be a heat-generating device such as an optical module, a chip (also called a chip card), a board module (also called a board), or a circuit module. The heat dissipation device 3 in the technical solution of the present application can alleviate the problems existing in existing various types of heating devices 2, such as large thermal resistance during heat dissipation, poor heat dissipation effect, or large insertion and extraction resistance and inconvenient insertion and extraction.

[0066] By using the heat dissipation device 3 provided in the embodiments of the present application, it is not necessary to improve the specific structure of the heating device 2, that is, it can alleviate the problems existing in some existing pluggable heating devices 2, such as large thermal resistance during heat dissipation, poor heat dissipation effect, or large insertion and extraction resistance and inconvenient insertion and extraction. Moreover, the heat dissipation device 3 has good versatility and strong flexibility, and can be applied to the heat dissipation requirements of different modules without affecting the versatility of the heat dissipation structure.

[0067] It should be noted that the heating device 2 shown in the drawings of the embodiments of the present application can be an optical module, but is not limited thereto. The structural principle of the heat dissipation device 3 can also be implemented in any other type of properly arranged heating device 2 such as a chip, a board, or a circuit module. The heat dissipation device 3 and the heating device 2 will be described in detail below with reference to the drawings. Those skilled in the art will understand that the principle of the present invention can be applied to any properly arranged heating device 2. In addition, for the sake of clarity and conciseness, the description of well-known functions and structures may be omitted.

[0068] Figure 2 It is a schematic structural diagram of a heat dissipation device in an embodiment of the present application. Figure 3 It is the first side structural diagram of the heat dissipation device in the use state in an embodiment of the present application. As Figure 2 and Figure 3 shown, the embodiments of the present application provide a heat dissipation device 3 for dissipating heat from the heating device 2, and is particularly suitable for dissipating heat from a pluggable heating device 2. The heat dissipation device 3 includes a receiving portion 31 and a radiator assembly 32. Among them, the receiving portion 31 includes a receiving cavity for receiving the above-mentioned heating device 2, and the heating device 2 is inserted into the receiving cavity along the first direction X. That is to say, the first direction X mentioned in the embodiments of the present application is the insertion direction of the heating device 2. The above-mentioned receiving portion 31 can specifically be a structure such as a card slot, a slot, a receiving groove, or an optical cage, and the present application does not make any restrictions.

[0069] As Figure 3As shown, the radiator assembly 32 includes a radiator 321, a bracket 322, a sliding assembly 323, and a linkage portion 324. Among them, the radiator 321 is slidably connected to the bracket 322 through the sliding assembly 323, and the bracket 322 is fixed to the accommodating portion 31, so that the radiator 321 can dissipate heat from the heat-generating device 2. The accommodating portion 31 includes a first side surface 311 and a second side surface 312 that are opposite to each other in the second direction Y. The radiator 321 is located on the first side surface 311, and the second direction Y is perpendicular to the first direction X. It should be noted that the first side surface 311 and the second side surface 312 are not necessarily specific structures, but mainly refer to the positional relationship here. That is, along the second direction Y, the side of the accommodating portion 31 facing the radiator 321 is the first side surface 311, and the side away from the radiator 321 is the second side surface 312. The heat-generating device 2 can be located between the first side surface 311 and the second side surface 312. As Figure 3 In the state shown, the second side surface 312 can be understood as the bottom surface of the accommodating portion 31, and the first side surface 311 can be understood as the top surface of the accommodating portion 31. Specifically, the sliding assembly 323 includes an inclined slot 3231 and a slider 3232. The slider 3232 is adapted to and slidably connected to the inclined slot 3231. That is, the slider 3232 can slide relative to the inclined slot 3231 within the inclined slot 3231, driving the radiator 321 to move relative to the bracket 322 along the extension direction of the inclined slot 3231. When specifically setting the inclined slot 3231, along the first direction X, the inclined slot 3231 gradually approaches the second side surface 312. That is to say, the inclined slot 3231 slopes downward along the insertion direction of the heat-generating device 2. Then, when the slider 3232 slides in the inclined slot 3231 in the first direction X, the radiator 321 can be moved toward the second side surface 312, gradually approaching the heat-generating device 2 located inside the accommodating portion 31.

[0070] One end of the linkage portion 324 of the radiator assembly 32 is installed on the radiator 321, and the other end is located in the accommodating cavity. When the heat-generating device 2 is inserted into the accommodating cavity, the linkage portion 324 will be triggered. Then, the linkage portion 324 drives the radiator 321 to move in the first direction X, causing the slider 3232 and the inclined slot 3231 of the sliding assembly 323 to slide relative to each other. Driving the radiator 321 to move toward the second side surface 312, and the radiator 321 gradually approaches the heat-generating device 2 located in the accommodating portion 31. By reasonably setting the structure and size of the linkage portion 324, it can be made that when the heat-generating device 2 is completely inserted into the accommodating portion 31, the radiator 321 is in contact with the heat-generating device 2.

[0071] In the technical solution of the present application, the heat dissipation device 3 can guide the movement of the radiator 321 through the inclined groove 3231. The setting of the linkage part 324 enables the radiator 321 to move along with the insertion movement of the heat generating device 2. During the insertion of the radiator 321, the radiator 321 is driven to move by the linkage part 324, and the radiator 321 moves obliquely downward under the guidance of the inclined groove 3231. That is to say, when the heat generating device 2 is just inserted into the accommodating part 31, there is a certain gap (or the friction force is small) between the radiator 321 and the heat generating device 2. As the heat generating device 2 is inserted, the gap between the radiator 321 and the heat generating device 2 becomes smaller and smaller until the radiator 321 contacts the heat generating device 2. Therefore, compared with the prior art, this solution can reduce the sliding friction force between the heat generating device 2 and the radiator 321 during the movement, making the insertion and extraction more labor-saving and convenient. In addition, this solution does not need to consider the problem that the heat generating device 2 cannot be inserted into the accommodating part 31, or the heat generating device 2 is damaged due to a large friction force during the insertion process. The radiator 321 can be made to move obliquely downward as the heat generating device 2 is inserted. With the cooperation of the sliding component 323 and the linkage part 324, the radiator 321 and the heat generating device 2 are pressed together with a large pressure. The surfaces of the radiator 321 and the heat generating device 2 are in close contact or tight contact or close touch, thereby reducing the contact thermal resistance between the radiator 321 and the heat generating device 2, improving the heat transfer performance between the radiator 321 and the heat generating device 2, enhancing the heat dissipation capacity, and improving the heat dissipation effect of the heat generating device 2.

[0072] Thus, through the cooperative setting of the above-mentioned bracket 322, sliding component 323 and linkage part 324, the heat dissipation device 3 can make the surfaces of the radiator 321 and the heat generating device 2 in close contact. This effectively reduces the contact thermal resistance between the radiator 321 and the heat generating device 2, improves the heat transfer performance between the radiator 321 and the heat generating device 2, and dissipates heat from the heat generating device 2 more effectively. Moreover, during the insertion and extraction of the heat generating device 2, there is no sliding friction movement at the heat conduction joint surface between the radiator 321 and the heat generating device 2, the insertion and extraction are smooth and labor-saving, and the contact pressure is stable and controllable.

[0073] When specifically setting the sliding component 323, in one embodiment, the above-mentioned inclined groove 3231 can be provided on the radiator 321, and the slider 3232 can be provided on the bracket 322. Or, in another embodiment, the inclined groove 3231 can also be provided on the bracket 322, and the slider 3232 can be provided on the radiator 321. In short, one of the inclined groove 3231 and the slider 3232 is provided on the radiator 321, and the other is provided on the bracket 322. Through the sliding connection between the inclined groove 3231 and the slider 3232 of the sliding component 323, the radiator 321 can be moved obliquely. The present application does not limit the specific setting positions of the inclined groove 3231 and the slider 3232.

[0074] Please continue to refer to Figure 3 In addition, the above heat dissipation device 3 may further include a first reset member 325. The first reset member 325 is disposed between the heat sink 321 and the bracket 322. When the heat generating device 2 is pulled out of the receiving cavity, the first reset member 325 is used to drive the heat sink 321 to move away from the second side surface 312. That is to say, the first reset member 325 can provide a force to the heat sink 321 in the direction away from the second side surface 312 along the second direction Y. The first reset member 325 can drive the heat sink 321 to move away from the heat generating device 2 along the second direction Y, so that the slider 3232 and the inclined groove 3231 slide relative to each other. When the heat generating device 2 is not inserted into the receiving portion 31, there is a certain distance between the heat sink 321 and the second side surface 312, so that the heat generating device 2 can be smoothly inserted into the receiving portion 31. When the heat generating device 2 is pulled out of the receiving portion 31, the first reset member 325 drives the heat sink 321 to separate from the heat generating device 2, so that the heat generating device 2 can be smoothly pulled out of the receiving portion 31.

[0075] In a specific embodiment, the above first reset member 325 may be an elastic member such as a spring. When the heat generating device 2 is completely inserted into the receiving portion 31, the elastic member is in an energy storage state; when the heat generating device 2 is pulled out of the receiving portion 31, the elastic member releases energy and drives the heat generating device 2 to move away from the second side surface 312. The structure of the first reset member 325 in this solution is relatively simple. Of course, in other embodiments, the above first reset member 325 may also be a structure such as a lever, which will not be listed one by one here.

[0076] In addition, please continue to refer to Figure 3 In addition, the above heat dissipation device 3 may further include a second reset member 326. The second reset member 326 is disposed between the heat sink 321 and the bracket 322. When the heat generating device 2 is pulled out of the receiving cavity, the second reset member 326 is used to drive the heat sink 321 to move away from the first direction X. That is to say, the second reset member 326 can provide a force to the heat sink 321 along the direction in which the heat generating device 2 is pulled out. The second reset member 326 drives the heat sink 321 to move in the direction in which the heat generating device 2 is pulled out, so that the slider 3232 and the inclined groove 3231 slide relative to each other. When the heat generating device 2 is not inserted into the receiving portion 31, there is a certain distance between the heat sink 321 and the second side surface 312, so that the heat generating device 2 can be smoothly inserted into the receiving portion 31. When the heat generating device 2 is pulled out of the receiving portion 31, the second reset member 326 drives the heat sink 321 to separate from the heat generating device 2, so that the heat generating device 2 can be smoothly pulled out of the receiving portion 31.

[0077] In a specific embodiment, the above-mentioned bracket 322 includes a bracket body 3221 and a tail bracket 3222. Among them, the sliding assembly 323 is connected between the above-mentioned bracket body 3221 and the radiator 321. The second reset member 326 is connected between the radiator 321 and the tail bracket 3222, and this application does not make any restrictions. Specifically, the above-mentioned tail bracket 3222 and the bracket body 3221 can be an integral structure; or the above-mentioned tail bracket 3222 can be fixedly connected to the bracket body 3221. For example, Figure 2 In the illustrated embodiment, the tail bracket 3222 is fixedly connected to the bracket body 3221. For example, welding, riveting, clamping, or threaded connection can be used to fixedly connect the tail bracket 3222 to the bracket body 3221; alternatively, the above-mentioned tail bracket 3222 and the bracket body 3221 can be a split structure, and the tail bracket 3222 can be fixed to the receiving portion 31. Of course, welding, riveting, clamping, or threaded connection can also be used to fixedly connect the tail bracket 3222 to the bracket body 3221.

[0078] In a specific embodiment, the above-mentioned second reset member 326 can be an elastic member such as a reed. When the heating device 2 is completely inserted into the receiving portion 31, the elastic member is in an energy storage state; when the heating device 2 is pulled out of the receiving portion 31, the elastic member releases energy and drives the heating device 2 to move in a direction away from the second side surface 312. The structure of the second reset member 326 in this solution is relatively simple. In other embodiments, the above-mentioned second reset member 326 can also be a structure such as a lever, which will not be listed one by one here.

[0079] Figure 4 This is the first top view structural schematic diagram of the heat dissipation device in the use state of the embodiment of the present application. Figure 5 This is the second side view structural schematic diagram of the heat dissipation device in the use state of the embodiment of the present application, as Figure 4 and Figure 5As shown, in the embodiment of the present application, the heat dissipation device 3 may further include an elastic strip 327. As a reset member, one end of the elastic strip 327 is connected to the radiator 321, and the other end is connected to the bracket 322. The elastic strip 327 can provide a force to the radiator 321 along the extension direction of the inclined slot 3231. Specifically, it can be understood as a force obliquely upward, causing the slider 3232 to slide relative to the inclined slot 3231. The above elastic strip 327 can directly reset the radiator 321 to the position obliquely upward, that is, the position where the slider 3232 abuts against the upper direction of the inclined slot 3231. The reset force of the elastic strip 327 extends along the direction of the inclined slot 3231, thereby reducing the friction between the slider 3232 and the inclined slot 3231, reducing the wear of the slider 3232 and the inclined slot 3231, and improving the service life of the sliding assembly 323. The elastic strip 327 can have a certain distance between the radiator 321 and the second side surface 312 when the heat generating device 2 is not inserted into the accommodating portion 31, so that the heat generating device 2 can be smoothly inserted into the accommodating portion 31. When the heat generating device 2 is pulled out from the accommodating portion 31, the elastic strip 327 drives the radiator 321 to separate from the heat generating device 2, enabling the heat generating device 2 to be smoothly pulled out from the accommodating portion 31.

[0080] Specifically, the above elastic strip 327 can be an elastic heat conducting strip. One end of the elastic heat conducting strip is connected to the radiator 321, and the other end is connected to the bracket 322. In this solution, the connection between the elastic heat conducting strip and the radiator 321 can dissipate the heat of the radiator 321 to improve the heat dissipation effect of the radiator 321.

[0081] In a specific embodiment, please continue to refer to Figure 4 and Figure 5 , one end of the above elastic heat conducting strip is connected to the surface of the radiator 321, and the other end is connected to the tail frame 3222 of the bracket 322. The above tail frame 3222 can also be a heat conducting tail frame 3222, that is, the other end of the elastic heat conducting strip is connected to the heat conducting portion of the bracket 322. Thus, the heat of the radiator 321 can be transferred to the heat conducting tail frame 3222 of the bracket 322 through the elastic heat conducting strip, further increasing the heat dissipation area and improving the heat dissipation effect of the radiator 321.

[0082] In order to improve the heat transfer efficiency between the radiator 321 and the heat generating device 2, reduce the thermal resistance, and enhance the heat dissipation capacity. At least the surface of the radiator 321 that is in contact with the heat generating device 2 has a flexible heat conducting layer 3211. The flexible heat conducting layer 3211 can be fixed to the surface of the radiator 321 by means of adhesion. The flexible heat conducting layer 3211 can make the radiator 321 and the heat generating device 2 fit closely, thus facilitating heat transfer.

[0083] The above flexible heat-conducting layer 3211 is provided on the heat sink 321. During the insertion and extraction process of the heat-generating device 2, if there is a large lateral friction force between the heat-generating device 2 and the heat sink 321, it is easy to puncture or wear the flexible heat-conducting layer 3211. And it is easy to cause the flexible heat-conducting layer 3211 to wrinkle, reducing the fitting effect between the heat sink 321 and the heat-generating device 2. In addition, if the normal pressure between the heat sink 321 and the heat-generating device 2 is small, the filling property of the flexible heat-conducting layer 3211 is poor and the heat-conducting ability is limited, and its flexible effect still cannot be fully exerted. In addition, the friction coefficient of the above flexible heat-conducting layer 3211 is large, the friction resistance during the insertion and extraction movement of the heat-generating device 2 is large, the insertion and extraction force of the heat-generating device 2 is large, and the insertion and extraction are relatively laborious. However, adopting the technical solution of the present application, the heat sink 321 will move towards the heat-generating device 2 only when the heat-generating device 2 is inserted, so that the heat sink 321 contacts the heat-generating device 2. Then, during the insertion process of the heat-generating device 2, it is not easy to generate too large a lateral friction force between the heat sink 321 and the heat-generating device 2. That is, it is not easy to generate a lateral friction force between the heat sink 321 and the flexible heat-conducting layer 3211, reducing the probability of wear of the flexible heat-conducting layer 3211 and facilitating the insertion of the heat-generating device 2 into the accommodating portion 31. In addition, when the heat-generating device 2 is completely inserted into the accommodating portion 31 of the heat dissipation device 3, the normal pressure between the heat sink 321 and the heat-generating device 2 can be large. It can make the filling property of the flexible heat-conducting layer 3211 better and the heat-conducting ability better, and can further reduce the thermal resistance and improve the heat dissipation effect.

[0084] Please refer to Figure 5 , the heat sink 321 further has a heat-conducting protrusion 3212. When the heat-generating device 2 is completely inserted into the accommodating cavity, the heat-conducting protrusion 3212 is in contact with the heat-generating device 2. In this solution, specifically, the heat-conducting protrusion 3212 can be in contact with the heat-generating part of the heat-generating device 2, so as to dissipate the heat generated by the heat-generating device 2. The setting of the heat-conducting protrusion 3212 reduces the structural interference between the heat sink 321 and the accommodating portion 31 and is beneficial to increasing the heat dissipation area of the heat sink 321.

[0085] In order to make the heat-conducting protrusion 3212 contact the heat-generating device 2, the first side surface 311 of the accommodating portion 31 further has an opening. So as to facilitate the heat-conducting protrusion 3212 to extend into the above opening, so that the heat-conducting protrusion 3212 contacts the heat-generating device 2. When specifically setting the above opening, the area of the opening is made larger than the area of the heat-conducting protrusion 3212, so as to facilitate the heat sink 321 to move along the first direction X.

[0086] Please continue to refer to Figure 5, when specifically setting the linkage part 324 of the heat dissipation device 3, the above-mentioned linkage part 324 can be a fixed protrusion. This fixed protrusion is fixed on the surface of the radiator 321 facing the second side 312. When the radiator 321 has a heat-conducting protrusion 3212, the height of the fixed protrusion is greater than the height of the heat-conducting protrusion 3212. When the heat-generating device 2 is inserted into the above-mentioned accommodating part 31, the end of the heat-generating device 2 facing the first direction X can abut against the fixed protrusion to drive the radiator 321 to move in the first direction X. In this solution, the structural reliability of the fixed protrusion is relatively high. When the heat-generating device 2 is completely inserted into the accommodating part 31, the heat-generating device 2 can provide a large force to the radiator 321 through the fixed protrusion, so that the radiator 321 and the heat-generating device 2 are more closely attached. In addition, the structure of the linkage part 324 of this solution is relatively simple, which is convenient for manufacturing and assembling the radiator assembly 32.

[0087] In a specific embodiment, the above-mentioned fixed protrusion and the radiator 321 can be an integral structure. Thereby, the connection reliability between the fixed protrusion and the radiator 321 can be improved, and the structure of the radiator assembly 32 can be simplified.

[0088] To cooperate with the above-mentioned fixed protrusion, the end of the heat-generating device 2 facing the first direction X has an abutting part. When the heat-generating device 2 is completely inserted into the accommodating cavity, the abutting part abuts against the fixed protrusion, thereby driving the radiator 321 to abut against the heat-generating device 2. Specifically, the strength of the above-mentioned abutting part is relatively high and can withstand a large pressure. To protect the heat-generating device 2 and prevent the heat-generating device 2 from being damaged when it abuts against the fixed protrusion.

[0089] Please refer to Figure 4 , the bracket 322 of the radiator assembly 32 includes two side plates 3223 arranged opposite to each other along the third direction Z. This third direction Z is perpendicular to the first direction X and the second direction Y. The radiator 321 is located between the above two side plates 3223, and the sliding assembly 323 is arranged between the side wall of the radiator 321 and the side plate 3223. Thereby, the radiator 321 can move relative to the bracket 322. This solution is convenient for the heat-generating device 2 to be inserted into or pulled out of the accommodating part 31, does not affect the movement of the heat-generating device 2 or the radiator 321, is convenient for the arrangement of the sliding assembly 323, and has a compact structure and reasonable design.

[0090] Please continue to refer to Figure 4 , the heat dissipation device 3 can include multiple groups of sliding assemblies 323. These multiple groups of sliding assemblies 323 are symmetrically arranged on both sides of the radiator 321, and the symmetry axis M of the multiple groups of sliding assemblies 323 is parallel to the first direction X. In this embodiment, the cooperation of multiple sliding assemblies 323 can improve the movement reliability of the heat dissipation device 3. In addition, the parallel effect of the fitting surface between the radiator 321 and the heat-generating device 2 can be maintained, and the fitting reliability between the radiator 321 and the heat-generating device 2 can be improved to improve the heat dissipation effect of the radiator 321.

[0091] There is no limitation on the connection manner between the above-mentioned bracket 322 and the accommodating part 31. The above-mentioned bracket 322 and the accommodating part 31 can be an integral structure, that is to say, the bracket 322 and the accommodating part 31 can be understood as two parts of a component. Specifically, the above-mentioned bracket 322 can be a part of the accommodating part 31. For example, integration can be achieved by means of die insert injection molding, etc. In this way, the structural design is simple, the connection is stable and reliable, the integrity of the heat dissipation device can be improved, and it helps to improve the overall strength. Or, the above-mentioned bracket 322 and the accommodating part 31 can be a split structure, that is to say, the bracket 322 and the accommodating part 31 are respectively independent components. Then the two are connected into a component. For example, clamping connection, threaded connection, riveting, screw connection or welding, etc. can be adopted. Exemplarily, the bracket 322 can be clamped onto the accommodating part 31 by means of a buckle, or riveted onto the accommodating part 31, or the sheet metal is bent and pressed onto the accommodating part 31. In this way, it is convenient to process and manufacture the bracket 322 and the accommodating part 31 respectively, which is beneficial to reducing the manufacturing difficulty, the connection is reliable, and the operation is convenient. It should be understood that the embodiments of the present application do not limit the connection manner between the bracket 322 and the accommodating part 31, including but not limited to the several connection manners listed above, and will not be enumerated one by one here.

[0092] In a specific embodiment, there is no limitation on the specific structure and type of the radiator 321 in the above-mentioned radiator assembly 32. For example, the above-mentioned radiator 321 can be a solid radiator 321 or an injection-molded metal radiator, etc. Figure 6 This is the second top view structural schematic diagram of the heat dissipation device in the use state of the embodiment of the present application. As Figure 6 shown in the embodiment, the above-mentioned radiator 321 can also be a liquid-cooled radiator. The liquid-cooled radiator has a liquid inlet 3213 and a liquid outlet 3214. The coolant enters the cavity inside the liquid-cooled radiator from the liquid inlet 3213, and after heat exchange, flows out of the liquid-cooled radiator from the liquid outlet 3214 to realize the circulation of the coolant. When specifically setting the above-mentioned liquid-cooled radiator, structures such as the bracket 322 need to avoid the liquid inlet 3213 and the liquid outlet 3214 of the liquid-cooled radiator.

[0093] Figure 7 This is the third top view structural schematic diagram of the heat dissipation device in the use state of the embodiment of the present application. Figure 8 This is the third side view structural schematic diagram of the heat dissipation device in the use state of the embodiment of the present application. As Figure 7 - 8 shown, the heat dissipation device 3 includes at least two accommodating parts 31 and at least one radiator assembly 32. The heat dissipation device 3 in this solution is mainly applicable to a heating device 2 with a plurality of plug connectors, or an electronic device with a plurality of heating devices 2, or a situation where there are a plurality of heating devices 2 and the heating devices 2 are arranged densely, which is beneficial to improving the integration degree of the device and realizing the miniaturization of the device.

[0094] In a specific embodiment, the number of the heat sink assemblies 32 may be less than the number of the accommodating portions 31. Among them, in the accommodating portion 31 without the heat sink assembly 32, devices that do not easily generate heat may be accommodated, or a common heat sink may be configured, which is not limited in this application. In another embodiment, as Figure 7 - 8 shown, each accommodating portion 31 may be provided with a heat sink assembly 32, so that the heat sink assembly 32 can accommodate more heat-generating devices 2 and has a better heat dissipation effect.

[0095] In a specific embodiment, the arrangement manner of at least two accommodating portions 31 in the heat dissipation device 3 is not limited. For example, in one embodiment, as Figure 7 - 8 shown, the above at least two accommodating portions 31 are arranged side by side along the third direction Z. Figure 9 This is the fourth side view structural schematic diagram of the heat dissipation device in the use state of the embodiment of the present application. Figure 10 This is the fifth side view structural schematic diagram of the heat dissipation device in the use state of the embodiment of the present application. As Figure 9 - 10 shown, in another embodiment, at least two accommodating portions 31 are stacked along the second direction Y, and the heat sink assembly 32 is arranged between any two adjacent accommodating portions 31. Figure 11 This is the rear view structural schematic diagram of the heat sink device in the embodiment of the present application. Please refer to Figure 11 , in other embodiments, the accommodating portions 31 may be arranged side by side along the third direction Z and stacked along the second direction Y at the same time. The setting manner of the accommodating portions 31 of each heat dissipation device 3 is not limited, and the user can select a suitable arrangement manner of the accommodating portions 31 according to the actual product requirements.

[0096] In a specific embodiment, please refer to Figure 7 and Figure 9 , the accommodating portions 31 of the heat dissipation device 3 may be fixed into an integral structure. Specifically, it may be an integrally formed structure, that is, the plurality of accommodating portions 31 are integrally formed. Alternatively, the above accommodating portions 31 may also adopt riveting, welding or threaded connection and other methods to realize fixed connection. This solution is beneficial to improving the integrity of the heat dissipation device 3, and the reliability of the overall structure is better. It is not easy to deform or damage.

[0097] In addition, the bracket 322 of the above heat sink assembly 32 may also be an integral structure. Of course, the above bracket 322 may be an integrally formed structure, such as a sheet metal part. Alternatively, the above bracket 322 may also be fixed into an integral structure, such as by using riveting, welding or threaded connection and other methods to realize fixed connection. This solution is beneficial to improving the integrity of the heat dissipation device 3, and the reliability of the overall structure is better. It is not easy to deform or damage.

[0098] In another embodiment, the bracket 322 of the radiator assembly 32 and the receiving portion 31 can also be an integral structure, which improves the reliability of the overall structure and is conducive to simplifying the assembly process of the heat dissipation device 3.

[0099] Please continue to refer to Figure 7 , the bracket 322 of the radiator assembly 32 includes side plates 3223 located on both sides of the radiator 321 along the third direction Z. The two side plates 3223 of adjacent radiator assemblies 32 are fixedly connected by a buckle 5. In addition, it can be considered that there are side walls between adjacent receiving portions 31, and the two side plates 3223 are fixedly connected to the side walls by the buckle 5, so that the radiator assembly 32 is fixedly installed on the receiving portion 31.

[0100] Figure 8 In the embodiment shown, the at least two receiving portions 31 can be independent of each other and are respectively assembled on the circuit board 4 or the connection board. The brackets 322 of the radiator assemblies 32 corresponding to each receiving portion 31 are respectively fixed to the receiving portion 31.

[0101] Figure 7 Or Figure 8 As shown, when the heat dissipation device 3 includes at least two radiator assemblies 32, the adjacent components of the bracket of the radiator assembly 32 can be an integral structure. Of course, the bracket of the radiator assembly 32 can be an integrally formed structure, or can be fixedly connected into an integral structure. For example Figure 7 In the embodiment shown, the two side plates 3223 of adjacent radiator assemblies 32 can be an integral structure, which is convenient for installing the radiator assembly 32 and the receiving portion 31. In addition, in combination with Figure 7 - 8 , the adjacent tail frames 3222 of the radiator assembly 32 are an integral structure. Specifically, all the tail frames 3222 of the radiator assemblies 32 can be an integral structure. This solution is convenient for improving the integrity of the heat dissipation device 3 and reducing the installation process of the heat dissipation device 3.

[0102] Please refer to Figure 9 , in a specific embodiment, when at least two receiving portions 31 are stacked along the second direction Y, the radiator assembly 32 can be provided only between any two adjacent receiving portions 31. The uppermost receiving portion 31 is not provided with a radiator assembly 32, or the radiator assembly 32 is provided in other ways. Figure 10 In the embodiment shown, one radiator assembly 32 can be provided corresponding to each receiving portion 31, that is, the uppermost receiving portion 31 is also provided with a radiator assembly 32.

[0103] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these changes and modifications.

Claims

1. A heat dissipation device, characterized in that, Comprising: A receiving part having a receiving cavity for receiving a heating device, the heating device being inserted into the receiving cavity along a first direction; A radiator assembly including a radiator, a bracket, a sliding assembly, and a linkage part, the bracket being fixed to the receiving part, the radiator being slidably connected to the bracket through the sliding assembly, the sliding assembly including a matching inclined slot and a slider, the inclined slot being provided on the radiator and the slider being provided on the bracket, or the inclined slot being provided on the bracket and the slider being provided on the radiator; one end of the linkage part is mounted on the radiator and the other end is located in the receiving cavity; the receiving cavity includes a first side surface and a second side surface opposite to each other in a second direction, the radiator is located on the first side surface, and along the first direction, the inclined slot gradually approaches the second side surface; the second direction is perpendicular to the first direction; When the heating device is inserted into the receiving cavity, it triggers the linkage part to drive the radiator to move along the first direction, the slider and the inclined slot slide relative to each other, driving the radiator to move closer to the second side surface; when the heating device is completely inserted into the receiving part, the radiator is in contact with the heating device; A second reset member is further provided between the radiator and the bracket, and when the heating device is pulled out of the receiving cavity, the second reset member is used to drive the radiator to move in a direction away from the first direction; The second reset member is an elastic heat-conducting strip, one end of the elastic heat-conducting strip is connected to the radiator, and the other end is connected to the bracket; The other end of the elastic heat-conducting strip is connected to the heat-conducting part of the bracket.

2. The heat dissipation device according to claim 1, wherein A first reset member is provided between the radiator and the bracket, and when the heating device is pulled out of the receiving cavity, the first reset member is used to drive the radiator to move away from the second side surface; 3. The heat dissipation device according to claim 1 or 2, characterized in that, At least the surface of the radiator in contact with the heating device has a flexible heat-conducting layer.

4. The heat dissipation device according to any one of claims 1 to 3, characterized in that, The radiator has heat-conducting protrusions, and when the heating device is completely inserted into the receiving cavity, the heat-conducting protrusions are in contact with the heating device.

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that, Multiple groups of the sliding assemblies are included, and the multiple groups of the sliding assemblies are symmetrically arranged on both sides of the radiator, and the symmetry axes of the multiple groups of the sliding assemblies are parallel to the first direction.

6. The heat dissipation device according to any one of claims 1 to 5, characterized in that, The linkage part is a fixed protrusion, and the fixed protrusion is fixed to the surface of the radiator facing the second side surface direction.

7. The heat dissipation device according to claim 6, wherein The fixed protrusion and the radiator are of an integral structure.

8. The heat dissipation device according to claim 6 or 7, characterized in that, The end of the heating device facing the first direction has an abutting part, and when the heating device is completely inserted into the receiving cavity, the abutting part abuts against the fixed protrusion.

9. The heat dissipation device according to any one of claims 1 to 8, characterized in that Including at least two of the receiving parts and at least one of the radiator assemblies.

10. The heat dissipation device according to claim 9, wherein One radiator assembly is provided for each of the receiving parts.

11. The heat dissipation device according to claim 9 or 10, characterized in that, At least two of the receiving parts are arranged side by side in a third direction, the third direction is perpendicular to the first direction, and the third direction is perpendicular to the second direction.

12. The heat dissipation device according to claim 11, wherein, The bracket includes side plates on both sides of the radiator in the third direction, and the side plates of two adjacent radiators are fixedly connected to the receiving part by buckles.

13. The heat dissipation device according to claim 9 or 10, characterized in that, At least two of the accommodating parts are stacked along the second direction, and the radiator assembly is disposed between any two adjacent accommodating parts.

14. The heat dissipation device according to any one of claims 9 to 13, characterized in that, The adjacent accommodating parts are fixed into an integral structure.

15. The heat dissipation device according to any one of claims 9 to 14, characterized in that, The brackets of at least two of the radiator assemblies are of an integral structure.

16. The heat dissipation device according to any one of claims 9 to 15, characterized in that, The adjacent parts of the brackets of at least two of the radiator assemblies are of an integral structure.

17. A communication device, characterized in that, It includes a heat generating device and the heat dissipation device according to any one of claims 1-16, and the heat generating device is inserted into the accommodating part of the heat dissipation device.

18. The communication device according to claim 17, characterized in that, The heat generating device includes an optical module, a chip, a circuit module or a board card module.

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