Display panel, display device, and method for manufacturing display panel

Abstract

The application provides a display panel, a display device and a preparation method of the display panel. The display panel comprises an array substrate, a light-emitting device layer and a light path adjusting structure. The array substrate comprises a first through hole penetrating the array substrate in a thickness direction of the array substrate. The light-emitting device layer is arranged on one side of the array substrate. The light-emitting device layer comprises a second through hole penetrating the light-emitting device layer in the thickness direction and communicating with the first through hole. The light path adjusting structure is arranged on a side of the light-emitting device layer away from the array substrate. The light path adjusting structure comprises a light reflection part. The light-emitting device layer comprises a first light-emitting unit. Light emitted by the first light-emitting unit is reflected by the light reflection part into the first through hole and then exits to a side of the array substrate away from the light-emitting device layer through the second through hole. The embodiment of the application greatly simplifies the internal structure of the display panel and reduces the thickness of the display panel.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] In public places such as digital signage, point-of-sale (POS) systems, information window displays, and exhibition halls, display devices are typically installed to display advertisements. In such scenarios, it is often necessary for people on both sides of the display device to be able to see the displayed image simultaneously, thus leading to the development of display devices capable of dual-sided display. Summary of the Invention

[0003] This application provides a display panel, a display device, and a method for manufacturing the display panel, which can simplify the structure of the display panel used to achieve double-sided display and reduce its thickness.

[0004] In a first aspect, embodiments of this application provide a display panel, including an array substrate, a light-emitting device layer, and a light path adjustment structure. The array substrate includes a first through-hole penetrating through the array substrate in its thickness direction. The light-emitting device layer is disposed on one side of the array substrate, and the light-emitting device layer includes a second through-hole penetrating through the light-emitting device layer in its thickness direction and communicating with the first through-hole. The light path adjustment structure is disposed on the side of the light-emitting device layer opposite to the array substrate, and the light path adjustment structure includes a light-reflecting portion.

[0005] The light-emitting device layer includes a first light-emitting unit. Light emitted by the first light-emitting unit is reflected by a light-reflecting part and enters into a first through hole, and then exits through a second through hole to the side of the array substrate away from the light-emitting device layer.

[0006] In some embodiments, the optical path adjustment structure further includes a receiving cavity formed by the light reflecting part, the receiving cavity being connected to the first through hole, the light reflecting part including an inner wall facing the receiving cavity, the light emitted by the first light-emitting unit propagating in the receiving cavity and entering the first through hole through reflection by the inner wall.

[0007] In some embodiments, the inner wall includes a first inner sidewall and a second inner sidewall disposed opposite to each other in a first direction. At least part of the light emitted by the light-emitting device layer is reflected by the first inner sidewall to the second inner sidewall and then reflected by the second inner sidewall into the first through hole. The first direction intersects the thickness direction.

[0008] In some embodiments, the first direction is parallel to the plane of the array substrate.

[0009] In some embodiments, the inner wall includes a third inner sidewall and a fourth inner sidewall disposed opposite to each other in the second direction. Light emitted by the first light-emitting unit is reflected by the third inner sidewall to the fourth inner sidewall and then reflected by the fourth inner sidewall into the first through hole. The second direction is parallel to the plane of the array substrate and intersects with the first direction.

[0010] In some embodiments, the optical path adjustment structure further includes a light-transmitting support portion disposed within the receiving cavity.

[0011] In some embodiments, the light-transmitting support portion has a first support surface and a second support surface in a first direction, and the first inner sidewall and the second inner sidewall are respectively attached to the first support surface and the second support surface.

[0012] In some embodiments, the orthogonal projection of the light-transmitting support portion onto the light-emitting device layer covers the second through-hole.

[0013] In some embodiments, the first inner sidewall and the second inner sidewall are symmetrically distributed.

[0014] In some embodiments, the first inner sidewall has a first included angle with the first direction, and the first included angle is 45°.

[0015] In some embodiments, the receiving cavity has an opening on the side away from the light-emitting device layer, and the light-emitting device layer includes a second light-emitting unit, wherein light emitted by at least a portion of the second light-emitting unit exits through the opening to the side of the light-emitting device layer away from the array substrate.

[0016] In some embodiments, the orthogonal projection of the opening onto the light-emitting device layer at least partially overlaps with the second light-emitting unit.

[0017] In some embodiments, the optical path adjustment structure includes a plurality of optical reflective parts, which are arranged at intervals in a first direction and / or a second direction, the first direction and the second direction intersect, and are all parallel to the plane of the array substrate.

[0018] In some embodiments, the array substrate has a first region and a second region, and the orthographic projection of the light-reflecting portion on the array substrate overlaps with the first region; a first light-emitting unit is disposed in the first region, and a second light-emitting unit is disposed in the second region.

[0019] The array substrate includes a first driving circuit and a second driving circuit. The first driving circuit is electrically connected to a first light-emitting unit in a first region, and the second driving circuit is electrically connected to a second light-emitting unit in a second region.

[0020] In some embodiments, at least one of the first through hole and the second through hole is provided with a filter portion;

[0021] In some embodiments, the orthographic projection of the first via onto the array substrate overlaps with that of the second via.

[0022] Secondly, embodiments of this application provide a display device, including the display panel in any of the foregoing embodiments.

[0023] Thirdly, embodiments of this application provide a method for manufacturing a display panel, comprising:

[0024] An array substrate and a first through-hole penetrating the array substrate in the thickness direction are formed;

[0025] A light-emitting device layer is formed on one side of the array substrate, and a second through-hole is formed in the thickness direction, penetrating the light-emitting device layer. The first through-hole is connected to the second through-hole.

[0026] A light-transmitting support portion is formed on the side of the light-emitting device layer away from the array substrate. In the direction away from the light-emitting device layer, the length of the light-transmitting support portion gradually decreases in the first direction, which is parallel to the plane of the array substrate.

[0027] Reflective material is provided on the two outer surfaces of the light-transmitting support part along the first direction to form a light-reflecting part.

[0028] This application provides a display panel, a display device, and a method for manufacturing the display panel. By adding a light path adjustment structure and providing interconnected second and first through holes on the light-emitting device layer and the array substrate, the light emitted by the second light-emitting unit can be reflected by the light-reflecting part of the light path adjustment structure and its propagation path can be changed. The light then exits through the first through hole to the side of the array substrate opposite to the light-emitting device layer, achieving a back-side light emission effect. Compared with existing double-sided display panels, the display panel of this application only requires one light-emitting device layer to achieve double-sided display, thus greatly simplifying the internal structure of the display panel, reducing its thickness, lowering the manufacturing difficulty, and facilitating large-scale production. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0031] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of AA;

[0032] Figure 3 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0033] Figure 4 yes Figure 1 Schematic diagram of the cross-sectional structure of BB;

[0034] Figure 5 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0035] Figure 6 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0036] Figure 7 This is a schematic diagram of the structure of an array substrate in a display panel provided in an embodiment of this application;

[0037] Figure 8 This is a cross-sectional structural diagram of another display panel provided in an embodiment of this application;

[0038] Figure 9 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0039] Figure 10 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application;

[0040] Figures 11a to 11d This is a schematic diagram of the process structure of a method for manufacturing a display panel provided in an embodiment of this application.

[0041] Marker explanation:

[0042] 1. Array substrate; 11. First through-hole; 12. First driver chip; 13. Second driver chip;

[0043] 2. Light-emitting device layer; 21. First light-emitting unit; 22. Second light-emitting unit; 23. Second through-hole;

[0044] 3. Optical path adjustment structure; 31. Light reflecting part; 311. Inner wall; 311a. First inner sidewall; 311b. Second inner sidewall; 311c. Third inner sidewall; 311d. Fourth inner sidewall; 32. Receiving cavity; 33. Light-transmitting support part; 331. First support surface; 332. Second support surface; 333. Third support surface; 334. Fourth support surface; 34. Opening;

[0045] 4. Filter section;

[0046] A1, Area 1; A2, Area 2;

[0047] X, first direction; Y, second direction; Z, thickness direction. Detailed Implementation

[0048] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0050] With societal progress, people's demands for display devices have increased, leading to the development of display panels capable of double-sided display. However, in existing technologies, it is typically necessary to simultaneously arrange two light-emitting device layers and other symmetrically distributed functional film layers on both sides of the substrate to achieve double-sided display. This type of display panel has a relatively complex structure, which can easily result in excessive thickness and a complicated manufacturing process, making it unsuitable for large-scale production and use.

[0051] To solve the above problems, firstly, please refer to [the relevant information]. Figure 1 and Figure 2 This application provides a display panel including an array substrate 1, a light-emitting device layer 2, and a light path adjustment structure 3. The array substrate 1 includes a first through-hole 11 penetrating the array substrate 1 in its thickness direction Z. The light-emitting device layer 2 is disposed on one side of the array substrate 1, and includes a second through-hole 23 penetrating the light-emitting device layer 2 in the thickness direction Z and communicating with the first through-hole 11. The light path adjustment structure 3 is disposed on the side of the light-emitting device layer 2 facing away from the array substrate 1, and includes a light-reflecting portion 31.

[0052] The light-emitting device layer 2 includes a first light-emitting unit 21. The light emitted by the first light-emitting unit 21 is reflected by the light-reflecting part 31 and enters the first through hole 11, and then exits through the second through hole 23 to the side of the array substrate 1 away from the light-emitting device layer 2.

[0053] The display panel includes an array substrate 1 and a light-emitting device layer 2 stacked together. The array substrate 1 has driving circuitry and pixel circuitry, and is electrically connected to the light-emitting device layer 2. The light-emitting device layer 2 includes a plurality of light-emitting units for emitting different colors. Exemplarily, the plurality of light-emitting units include red light-emitting units that can emit red light, green light-emitting units that can emit green light, and blue light-emitting units that can emit blue light. The pixel circuitry on the array substrate 1 is electrically connected to the light-emitting units to control the light-emitting units to emit light or turn off.

[0054] The optical path adjustment structure 3 is located on the side of the light-emitting device layer 2 facing away from the array substrate 1. The optical path adjustment structure 3 is used to control the propagation path of the light emitted by the light-emitting unit. Specifically, the optical path adjustment structure includes a light-reflecting part 31. The light emitted by the first light-emitting unit 21 is reflected towards the surface of the array substrate 1 by the light-reflecting part 31, changing the propagation path. At least a portion of the light emitted by the first light-emitting unit 21 enters the second through-hole 23, passes through the second through-hole 23 into the first through-hole 11, and finally exits from the first through-hole 11 to the side of the array substrate 1 facing away from the light-emitting device layer 2. The first through-hole 11 and the second through-hole 23 can be formed along the thickness direction Z, or they can be formed at an angle relative to the thickness direction Z. Optionally, both the first through-hole 11 and the second through-hole 23 extend along the thickness direction Z, and the second through-hole 23 is directly opposite the first through-hole 11, and they have the same aperture.

[0055] It should be noted that the first light-emitting unit 21 may include only one light-emitting unit or may include multiple light-emitting units. This application embodiment does not limit this. Optionally, the light-reflecting part 31 covers the first light-emitting unit 21 on the orthogonal projection of the light-emitting device layer 2. The light emitted vertically from the first light-emitting unit 21 can be reflected by the light-reflecting part 31 and emitted from the back of the display panel, thereby achieving a back-lighting effect.

[0056] In addition to the array substrate 1, the light-emitting device layer 2, and the light path adjustment structure 3, the display panel may also include other functional film layers, which are not limited in this embodiment. Exemplarily, the display panel also includes a substrate, which is a transparent substrate, so that the light emitted by the first light-emitting unit 21 can pass through the substrate to achieve back-emitting display.

[0057] In addition to the first light-emitting unit 21 for achieving back-side light emission, the light-emitting device layer 2 also includes a second light-emitting unit 22 for achieving front-side light emission. The first light-emitting unit 21 and the second light-emitting unit 22 are staggered. The specific location of the second light-emitting unit 22 is not limited in this embodiment.

[0058] This embodiment of the application adds a light path adjustment structure 3 and provides interconnected second through-holes 23 and first through-holes 11 on the light-emitting device layer 2 and the array substrate 1. This allows the light emitted by the first light-emitting unit 21 to be reflected by the light-reflecting part 31 of the light path adjustment structure 3, changing its propagation path, and then exiting through the first through-hole 11 to the side of the array substrate 1 opposite to the light-emitting device layer 2, achieving a back-side light emission effect. Compared with existing double-sided display panels, the display panel of this embodiment only requires one light-emitting device layer 2 to achieve double-sided display, thus greatly simplifying the internal structure of the display panel, reducing its thickness, lowering the manufacturing difficulty, and facilitating large-scale production.

[0059] It should be noted that the material of the light-reflecting part 31 is not limited in this embodiment, as long as the light-reflecting part 31 can reflect light. For example, the light-reflecting part 31 includes metallic silver, which achieves the reflective effect, and indium tin oxide is attached to both sides of the metallic silver to prevent it from oxidizing and deteriorating.

[0060] In some embodiments, the optical path adjustment structure 3 includes a light reflecting part 31 and a receiving cavity 32 formed by the light reflecting part 31, the receiving cavity 32 being connected to the first through hole 11. The light reflecting part 31 includes an inner wall 311 facing the receiving cavity 32, the light emitted by the first light-emitting unit 21 propagates within the receiving cavity 32 and is reflected by the inner wall 311 into the first through hole 11.

[0061] The light emitted by the first light-emitting unit 21 in the light-emitting device layer 2 enters the receiving cavity 32 and propagates to the inner wall 311 of the light-reflecting part 31. Then, the propagation path is changed in the receiving cavity 32 by the reflection of the inner wall 311.

[0062] Based on this, the array substrate 1 in this application example includes a first through-hole 11, and the light-emitting device layer 2 includes a second through-hole 23. The first through-hole 11, the second through-hole 23, and the receiving cavity 32 are interconnected. The light reflected by the inner wall 311 changes its propagation path, thereby entering the second through-hole 23 and the first through-hole 11 in sequence, and finally exiting from the first through-hole 11 to the side of the array substrate 1 opposite to the light-emitting device layer 2, achieving a back-side light emission effect. Optionally, the orthographic projection of the receiving cavity 32 onto the light-emitting device layer 2 covers the second through-hole 23, and the orthographic projection of the second through-hole 23 onto the light-emitting device layer 2 at least partially overlaps with the first through-hole 11.

[0063] The embodiments of this application do not limit the number of light-reflecting portions 31, the first through-hole 11, and the second through-hole 23. Exemplarily, the number of receiving cavities 32 formed by the light-reflecting portions 31 is the same as the number of the first through-hole 11 and the second through-hole 23, and the corresponding receiving cavities 32, the first through-hole 11, and the second through-hole 23 are interconnected.

[0064] In some embodiments, please refer to Figure 2 and Figure 3 The inner wall 311 includes a first inner sidewall 311a and a second inner sidewall 311b disposed opposite each other in the first direction X. At least part of the light emitted by the light-emitting device layer 2 is reflected by the first inner sidewall 311a to the second inner sidewall 311b, and then reflected by the second inner sidewall 311b into the first through hole 11. The first direction X intersects the thickness direction Z.

[0065] The first inner sidewall 311a and the second inner sidewall 311b are disposed opposite to each other in the first direction X, and the first inner sidewall 311a and the second inner sidewall 311b can be arranged as follows: Figure 2 As shown, the connection is integrated into one unit; it can also be set up as follows: Figure 3 As shown, there are two independent structures. The first direction X is the direction that intersects with the thickness direction Z. For example, the first direction X is parallel to the plane where the array substrate 1 is located, where the array substrate 1 can be any surface of the array in the thickness direction Z. The first direction X is perpendicular to the thickness direction Z.

[0066] After the light emitted by the first light-emitting unit 21 enters the receiving cavity 32, it first reaches the position of the first inner sidewall 311a, and changes its propagation path by reflection through the first inner sidewall 311a. Then it reaches the position of the second inner sidewall 311b, and changes its propagation path again by reflection through the second inner sidewall 311b, thus entering the first through hole 11. Finally, it exits through the first through hole 11 to the side of the array substrate 1 away from the light-emitting device layer 2, realizing the back-side light-emitting effect.

[0067] Therefore, by changing the angle between the first inner sidewall 311a and the second inner sidewall 311b and the first direction X, and by adjusting the relative positional relationship between the first inner sidewall 311a, the second inner sidewall 311b and the second through hole 23, the propagation path of the light emitted by the first light-emitting unit 21 can be precisely controlled, so that a specific image can be displayed on the back of the display panel.

[0068] In some embodiments, please refer to Figure 4 The inner wall 311 includes a third inner sidewall 311c and a fourth inner sidewall 311d disposed opposite each other in the second direction Y. The light emitted by the first light-emitting unit 21 is reflected by the third inner sidewall 311c to the fourth inner sidewall 311d, and then reflected by the fourth inner sidewall 311d into the first through hole 11. The second direction Y is parallel to the plane of the array substrate 1 and intersects with the first direction X.

[0069] The second direction Y intersects with the first direction X. For example, the first direction X, the second direction Y, and the thickness direction Z are set perpendicular to each other.

[0070] The inner wall 311 has a first inner sidewall 311a and a second inner sidewall 311b opposite each other in the first direction X, and a third inner sidewall 311c and a fourth inner sidewall 311d opposite each other in the second direction Y. The light emitted by the first light-emitting unit 21 can enter the first through hole 11 through reflection from the first inner sidewall 311a and the second inner sidewall 311b, and can also enter the first through hole 11 through reflection from the third inner sidewall 311c and the fourth inner sidewall 311d.

[0071] Similar to the first inner sidewall 311a and the second inner sidewall 311b, the third inner sidewall 311c and the fourth inner sidewall 311d can also be connected as one unit, or they can be two independent and unconnected structures. This application embodiment does not impose any limitations on this. Furthermore, the third inner sidewall 311c and the fourth inner sidewall 311d can be connected to the adjacent first inner sidewall 311a and the second inner sidewall 311b.

[0072] After the light emitted by part of the first light-emitting unit 21 enters the receiving cavity 32, it first reaches the position of the third inner sidewall 311c, and changes the propagation path by reflection through the third inner sidewall 311c. Then it reaches the position of the fourth inner sidewall 311d, and changes the propagation path again by reflection through the fourth inner sidewall 311d, so that it enters the first through hole 11 and finally exits through the first through hole 11 to the side of the array substrate 1 away from the light-emitting device layer 2, thus achieving the back-side light-emitting effect.

[0073] Based on the first inner sidewall 311a and the second inner sidewall 311b, this application embodiment adds a third inner sidewall 311c and a fourth inner sidewall 311d, so that more light emitted by the first light-emitting unit 21 can enter the first through hole 11, thereby improving the brightness and display effect when the back of the display panel is displayed.

[0074] In some embodiments, please refer to Figure 5 The optical path adjustment structure 3 also includes a light-transmitting support 33 disposed within the receiving cavity 32.

[0075] The light-transmitting support portion 33 is filled within the receiving cavity 32 and primarily serves to support the light-reflecting portion 31. Simultaneously, the light-transmitting support portion 33 is supported by a transparent material, allowing light emitted from the light-emitting unit to move within it, thereby achieving propagation within the receiving cavity 32. For example, the light-transmitting support portion 33 can be made of an inorganic transparent material such as silicon nitride.

[0076] In some alternative embodiments, the length of the light-transmitting support portion 33 gradually decreases in the direction away from the light-emitting device layer 2 in the first direction X. Exemplarily, the length of the light-transmitting support portion 33 decreases linearly or in a gradient manner in the first direction X. This design allows the light-reflecting portion 31 to better overlap the outer peripheral surface of the light-transmitting support portion 33, enabling the light-transmitting support portion 33 to provide a certain supporting force for the light-reflecting portion 31 and improving the reliability of the support.

[0077] During the fabrication process, after the light-emitting device layer 2 is encapsulated, a light-transmitting support portion 33 of a specific size and shape can be formed by a coating process such as chemical vapor deposition (CVD). Optionally, the light-transmitting support portion 33 is a trapezoidal structure.

[0078] In some embodiments, such as Figure 5 As shown, the light-transmitting support portion 33 has a first support surface 331 and a second support surface 332 in the first direction X, and the first inner sidewall 311a and the second inner sidewall 311b are respectively attached to the first support surface 331 and the second support surface 332.

[0079] The first support surface 331 and the second support surface 332 are used to adhere to the first inner sidewall 311a and the second inner sidewall 311b, respectively. During fabrication, after the light-transmitting support portion 33 is fabricated, a light-reflecting portion 31 can be formed on the first support surface 331 and the second support surface 332 through processes such as physical vapor deposition (PVD). This allows the first inner sidewall 311a and the second inner sidewall 311b to be completely adhered to the first support surface 331 and the second support surface 332, respectively. Furthermore, by controlling the angle between the first support surface 331 and the second support surface 332 and the first direction X, the angle between the first inner sidewall 311a and the second inner sidewall 311b and the first direction X can be adjusted, reducing the fabrication difficulty of the light-reflecting portion 31.

[0080] Similarly, in some embodiments, please refer to Figure 6 The light-transmitting support portion 33 has a third support surface 333 and a fourth support surface 334 in the second direction Y, and the third inner sidewall 311c and the fourth inner sidewall 311d are respectively attached to the third support surface 333 and the fourth support surface 334.

[0081] In some embodiments, the light-transmitting support portion 33 covers the second through hole 23 in the orthogonal projection of the light-emitting device layer 2.

[0082] The light-transmitting support portion 33 fills the receiving cavity 32, and the location of the light-transmitting support portion 33 is the location of the receiving cavity 32. Therefore, the orthogonal projection of the light-emitting device layer 2 onto the light-transmitting support portion 33 covers the second through hole 23, that is, the orthogonal projection of the receiving cavity 32 onto the light-emitting device layer 2 covers the second through hole 23.

[0083] As described above, the light emitted from the light-emitting device layer 2 for achieving back-side light emission needs to pass through the receiving cavity 32 and enter the second through hole 23 and the first through hole 11. Therefore, in this embodiment, the light-transmitting support portion 33 is projected onto the light-emitting device layer 2 to cover the second through hole 23, so that the receiving cavity 32 and the second through hole 23 are completely connected. This allows the light emitted from the first light-emitting unit 21 to more easily enter the first through hole 11, improving the back-side light emission effect.

[0084] In some embodiments, the first inner sidewall 311a and the second inner sidewall 311b are symmetrically distributed. This helps to simplify the structure of the light-reflecting part 31 and reduce its fabrication difficulty.

[0085] In some embodiments, such as Figure 5 As shown, the first inner sidewall 311a has a first included angle α with the first direction X, and the first included angle α is 45°.

[0086] Normally, most of the light emitted by the first light-emitting unit 21 will be emitted vertically to the first inner wall 311a. However, by setting the first included angle α to 45°, the propagation path of most of the light emitted by the first light-emitting unit 21 can be deflected by 90°, so that it can continue to propagate along the first direction X to the second inner wall 311b.

[0087] Since the second inner sidewall 311b is symmetrically distributed with the first inner sidewall 311a, the second inner sidewall 311b has a second included angle β with the first direction X, which is 135°. The light rays propagating along the first direction X are reflected by the second inner sidewall 311b and deflected by 90° after reaching the second inner sidewall 311b, thus entering the second through hole 23 perpendicularly.

[0088] In this embodiment, by controlling the first included angle α to be 45° and the second included angle β to be 135°, most of the light emitted by the first light-emitting unit 21 can be reflected by the first inner sidewall 311a and the second inner sidewall 311b, thereby achieving a 180° deflection of the light path, thus precisely controlling the propagation path of the light, and enabling the light to be emitted vertically from the back of the display panel, achieving a back-emitting light effect.

[0089] In some embodiments, such as Figure 5 As shown, the receiving cavity 32 has an opening 34 on the side opposite to the light-emitting device layer 2. At least a portion of the light emitted by the second light-emitting unit 22 exits through the opening 34 to the side of the light-emitting device layer 2 opposite to the array substrate 1.

[0090] At least a portion of the light emitted by the second light-emitting unit 22 can exit through the opening 34, thereby achieving a front-side light emission effect for the display panel. As described above, the second through-hole 23 is used to achieve a back-side light emission effect, while the opening 34 is used to achieve a front-side light emission effect, in order to avoid crosstalk between the light emitted from the front and the light emitted from the back. Optionally, the orthographic projection of the opening 34 onto the light-emitting device layer 2 is misaligned with the second through-hole 23, thereby improving the reliability of the double-sided display.

[0091] In some embodiments, the orthographic projection of the opening 4 onto the light-emitting device layer 2 at least partially overlaps with the second light-emitting unit 22. This design allows at least a portion of the light emitted by the second light-emitting unit 22 to exit the opening 34 perpendicularly, thereby achieving a frontal light-emitting effect.

[0092] In some embodiments, such as Figure 5 and Figure 6 As shown, the optical path adjustment structure 3 includes a plurality of light reflecting parts 31, which are arranged at intervals in the first direction X and / or the second direction Y.

[0093] Multiple light reflectors 31 are arranged at intervals, that is, there are gaps between adjacent light reflectors 31. At least some of the second light-emitting units 22 can be disposed between adjacent light reflectors 31 and emit light away from the display panel through the gaps between adjacent light reflectors 31, thereby achieving front light emission and improving the brightness and display effect of front light emission.

[0094] In some alternative embodiments, there are multiple receiving cavities 32, which are distributed in a manner such that at least some of the second light-emitting units 22 are located between adjacent receiving cavities 32. In this embodiment, the light emitted by the second light-emitting units 22 located between adjacent receiving cavities 32 can be directly emitted to achieve a frontal light-emitting effect without needing to be emitted through the opening 32.

[0095] In summary, in this embodiment, some of the second light-emitting units 22 are located at the opening 34, and the light emitted by the light-emitting units 22 is emitted through the opening 34 to achieve a front-facing display effect. Other second light-emitting units 22 are located between adjacent receiving cavities 32 and emit light directly away from the display panel, achieving a front-facing display effect.

[0096] In some embodiments, please refer to Figure 5 and Figure 7The array substrate 1 includes a first region A1 and a second region A2. The orthographic projection of the light-reflecting portion 31 onto the array substrate 1 overlaps with the first region A1. A first light-emitting unit 21 is disposed in the first region A1, and a second light-emitting unit 22 is disposed in the second region A2. The array substrate 1 includes a first driving circuit and a second driving circuit. The first driving circuit is electrically connected to the first light-emitting unit 21 in the first region A1, and the second driving circuit is electrically connected to the second light-emitting unit 22 in the second region A2. Figure 8 The first region A1 is shown as a dashed line.

[0097] The first driving circuit is connected to the first driving chip 12 and is used to transmit the driving signal emitted by the first driving chip 12. The second driving circuit is connected to the second chip 13 and is used to transmit the driving signal emitted by the second driving chip 13. The first driving circuit is electrically connected to the first light-emitting unit 21 and is used to control the first light-emitting unit 21 to emit light, so as to achieve back-side illumination. The second driving circuit is electrically connected to the second light-emitting unit 22 and is used to control the second light-emitting unit 22 to emit light, so as to achieve front-side illumination. In order to precisely control the double-sided display screen so that the front and back of the display panel can display different screens respectively, this embodiment of the application provides two control terminals: the first driving chip 12 and the second driving chip 13. The first driving chip 12 is electrically connected to the first light-emitting unit 21 in the first region A1 to control the first light-emitting unit 21 to emit light or turn off the screen, thereby displaying a specific screen on the back of the display panel. The second driving chip 13 is electrically connected to the second light-emitting unit 22 in the second region A2 to control the second light-emitting unit 22 to emit light or turn off the screen, thereby displaying a specific screen on the front of the display panel.

[0098] In some embodiments, please refer to Figure 8 At least one of the first through-hole 11 and the second through-hole 23 is provided with a filter portion 4. The filter portion 4 is used to adjust the light, thereby achieving a better display effect. In this embodiment of the application, at least one of the first through-hole 11 and the second through-hole 23 is provided with a filter portion 4. While improving the display effect, it is not necessary to add other filter film layers on the back of the display panel, thereby further reducing the thickness of the display panel. Optionally, both the first through-hole 11 and the second through-hole 23 are provided with a filter portion 4.

[0099] In some embodiments, the orthographic projection of the first through-hole 11 onto the array substrate 1 overlaps with the second through-hole 23. During fabrication, after the array substrate 1 and the light-emitting device layer 2 are fabricated, a hole-drilling process can be performed on both the array substrate 1 and the light-emitting device layer 2 to form through-holes. The through-holes include the first through-hole 11 located on the array substrate 1 and the second through-hole 23 located on the light-emitting device layer 2. Then, a filter material can be filled into the through-holes, thereby simultaneously forming a filter portion 4 within the first through-hole 11 and the second through-hole 23.

[0100] Secondly, please refer to Figure 9 This application provides a display device, including a display panel from any of the foregoing embodiments.

[0101] It should be noted that the display device provided in this application embodiment has the beneficial effects of the display panel provided in this application embodiment. For details, please refer to the specific descriptions of the display panel and array substrate 1 in the above embodiments. This embodiment will not repeat them here.

[0102] Thirdly, please refer to Figure 10 This application provides a method for manufacturing a display panel, including:

[0103] S100: Forming an array substrate and a first through-hole penetrating the array substrate in the thickness direction.

[0104] Please see Figure 11a In step S100, the first through hole 11 completely penetrates the array substrate 1, and the presence of the first through hole 11 is used to realize the back light emission of the display panel.

[0105] S110: A light-emitting device layer is formed on one side of the array substrate, and a second through-hole is formed in the thickness direction, penetrating the light-emitting device layer, wherein the first through-hole and the second through-hole are connected.

[0106] Please see Figure 11b In step S110, the second through hole 23 completely penetrates the light-emitting device layer 2. Similar to the first through hole 11, the second through hole 23 is also used to realize the back light emission of the display panel. Therefore, the first through hole 11 and the second through hole 23 are connected.

[0107] In other embodiments, the first through-hole 11 and the second through-hole 23 can also be formed simultaneously, and this application does not limit this. Specifically, during fabrication, after the array substrate 1 and the light-emitting device layer 2 are fabricated, the array substrate 1 and the light-emitting device layer 2 can be simultaneously perforated to form through-holes, which include the first through-hole 11 located on the array substrate 1 and the second through-hole 23 located on the light-emitting device layer 2.

[0108] S120: A light-transmitting support portion is formed on the side of the light-emitting device layer away from the array substrate, and the length of the light-transmitting support portion gradually decreases in the direction away from the light-emitting device layer in the first direction.

[0109] Please see Figure 11c In step S120, the first direction X is parallel to the plane of the array substrate 1, and the light-transmitting support 33 is made of a transparent material, allowing light to propagate within it. For example, the light-transmitting support 33 can be made of an inorganic transparent material such as silicon nitride.

[0110] During the fabrication process, a light-transmitting support portion 33 of a specific size and shape can be formed by a coating process such as chemical vapor deposition (CVD). Optionally, the light-transmitting support portion 33 is a trapezoidal structure.

[0111] S130: A reflective material is provided on the two outer surfaces of the light-transmitting support along the first direction to form a light-reflecting part.

[0112] Please see Figure 11d In step S130, a light-reflecting portion 31 is formed on the light-transmitting support portion 33. The light-reflecting portion 31 can reflect light, and some light rays can change their propagation path through reflection by the light-reflecting portion 31, and exit through the first through-hole 11 and the second through-hole 23 to the side of the array substrate 1 opposite to the light-emitting device layer 2, thereby realizing a back-side light-emitting display. For example, the light-reflecting portion 31 includes metallic silver, which achieves the reflective effect. Indium tin oxide is attached to both sides of the metallic silver to prevent oxidation and deterioration. During fabrication, it can be formed by processes such as physical vapor deposition (PVD) after the light-transmitting support portion 33 is prepared.

[0113] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0114] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. A display panel, characterized in that, include: An array substrate, the array substrate including a first through-hole penetrating the array substrate in its own thickness direction; A light-emitting device layer is disposed on one side of the array substrate, and the light-emitting device layer includes a second through hole that penetrates the light-emitting device layer in the thickness direction and communicates with the first through hole; An optical path adjustment structure is disposed on the side of the light-emitting device layer away from the array substrate. The optical path adjustment structure includes a light-reflecting part and a receiving cavity formed by the light-reflecting part. The receiving cavity is connected to the first through hole. The light-emitting device layer includes a first light-emitting unit. The light-reflecting part projects onto the light-emitting device layer and covers the first light-emitting unit. The light-reflecting part includes an inner wall facing the receiving cavity. The inner wall includes a first inner sidewall and a second inner sidewall disposed opposite to each other in a first direction. Light emitted vertically from the first light-emitting unit is reflected by the first inner sidewall to the second inner sidewall, and then reflected by the second inner sidewall into the second through hole. The light then exits through the first through hole to the side of the array substrate away from the light-emitting device layer. The first direction intersects with the thickness direction.

2. The display panel according to claim 1, characterized in that, The first direction is parallel to the plane where the array substrate is located.

3. The display panel according to claim 1, characterized in that, The inner wall includes a third inner sidewall and a fourth inner sidewall disposed opposite to each other in the second direction. The light emitted by the first light-emitting unit is reflected by the third inner sidewall to the fourth inner sidewall, and then reflected by the fourth inner sidewall into the first through hole. The second direction is parallel to the plane of the array substrate and intersects with the first direction.

4. The display panel according to claim 1, characterized in that, The optical path adjustment structure also includes a light-transmitting support portion disposed within the receiving cavity.

5. The display panel according to claim 4, characterized in that, The light-transmitting support portion has a first support surface and a second support surface in the first direction, and the first inner sidewall and the second inner sidewall are respectively attached to the first support surface and the second support surface.

6. The display panel according to claim 4, characterized in that, The light-transmitting support portion covers the second through hole in the orthogonal projection of the light-emitting device layer.

7. The display panel according to claim 1, characterized in that, The receiving cavity has an opening on the side away from the light-emitting device layer. The light-emitting device layer includes a second light-emitting unit, and at least a portion of the light emitted by the second light-emitting unit is emitted through the opening to the side of the light-emitting device layer away from the array substrate.

8. The display panel according to claim 7, characterized in that, The orthographic projection of the opening on the light-emitting device layer at least partially overlaps with the second light-emitting unit.

9. The display panel according to claim 7, characterized in that, The plurality of light-reflecting portions are arranged at intervals in a first direction and / or a second direction, the first direction and the second direction intersect, and are all parallel to the plane of the array substrate.

10. The display panel according to claim 7, characterized in that, The array substrate has a first region and a second region, and the orthographic projection of the light-reflecting part on the array substrate overlaps with the first region; the first light-emitting unit is disposed in the first region, and the second light-emitting unit is disposed in the second region; The array substrate includes a first driving circuit and a second driving circuit, wherein the first driving circuit is electrically connected to the first light-emitting unit and the second driving circuit is electrically connected to the second light-emitting unit.

11. The display panel according to claim 1, characterized in that, At least one of the first through hole and the second through hole is provided with a filter part.

12. The display panel according to claim 11, characterized in that, The first through-hole's orthographic projection onto the array substrate overlaps with the second through-hole.

13. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 12.

14. A method for manufacturing a display panel, characterized in that, include: An array substrate and a first through-hole penetrating the array substrate in the thickness direction are formed; A light-emitting device layer is formed on one side of the array substrate, and a second through-hole is formed in the thickness direction through the light-emitting device layer. The first through-hole communicates with the second through-hole, and the light-emitting device layer includes a first light-emitting unit. A light-transmitting support portion is formed on the side of the light-emitting device layer away from the array substrate. In the direction away from the light-emitting device layer, the length of the light-transmitting support portion gradually decreases in a first direction, which is parallel to the plane of the array substrate. Reflective material is disposed on two outer surfaces of the light-transmitting support portion along the first direction to form a light-reflecting portion. The orthogonal projection of the light-emitting device layer covers the first light-emitting unit. The light emitted vertically from the first light-emitting unit is configured to be reflected sequentially through the two outer surfaces into the second through hole, and then emitted through the first through hole to the side of the array substrate away from the light-emitting device layer.

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