Imaging system

Abstract

A radiation detector (100) comprising an array of pixels (150). A method, the method comprising: a scan with M detector blocks (detector block (i), i = 1,..., M) in a scan direction for a first scan of a scene, wherein during the first scan the M detector blocks are physically arranged in the scan direction in the order of detector blocks (1), (2),..., (M), M being an integer greater than 1; and a scan with the M detector blocks in another scan direction for a second scan of the scene after the first scan, wherein during the second scan the M detector blocks are physically arranged in the scan direction in the order of detector blocks (M), (1), (2),..., (M-1).

Description

[Technical Field]

[0001] This disclosure relates to imaging systems. [Background Technology]

[0002] A radiation detector is a device for measuring the characteristics of radiation. Examples of these characteristics can include the spatial distribution of the intensity, phase, and polarization of the radiation. The radiation can be radiation that has already interacted with an object. For example, the radiation measured by a radiation detector can be radiation that has already penetrated an object. The radiation can be electromagnetic radiation, such as infrared, visible, ultraviolet, X-rays, or gamma rays. The radiation can also be other types, such as alpha and beta rays. Imaging systems can include multiple radiation detectors. [Summary of the Invention]

[0003] This document discloses a method comprising: scanning a scene in a scanning direction using M detector blocks (detector blocks (i), i = 1, ..., M), wherein during the first scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (1), (2), ..., (M), where M is an integer greater than 1; and scanning the scene in the scanning direction using the M detector blocks after the first scan, wherein during the second scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (M), (1), (2), ..., (M-1).

[0004] In one aspect, the method further includes: after the second scan, scanning the scene in the scanning direction with the M detector blocks in the scanning direction for a third scan, wherein during the third scan, the M detector blocks are physically arranged in the scanning direction in the order of the detector blocks (M-1), (M), (1), (2), ..., (M-2), where M>2.

[0005] In one respect, each of the M detector blocks includes a radiation detector.

[0006] On one hand, during each of the first and second scans, the M detector blocks are stationary relative to each other.

[0007] In one respect, during each of the first and second scans, the M detector blocks are uniformly distributed in the scanning direction.

[0008] In one aspect, the first scan includes capturing a first H local images while the M detector blocks move, where H is an integer greater than 1, and the second scan includes capturing a second H local images while the M detector blocks move.

[0009] In one respect, the first H local images can be stitched together, and the second H local images can be stitched together.

[0010] In one aspect, the method further includes: stitching the first H local images to form an image; and stitching the second H local images to form an image.

[0011] In one aspect, the method further includes: moving the detector block (M) along a path after the first scan and before the second scan, wherein at the time point after the first scan and before the second scan, a point on the path is in the shadow of the other detector blocks among the M detector blocks relative to the radiation used for the first scan and the second scan.

[0012] On one hand, the detector block (M) flips twice while moving along the path after the first scan and before the second scan.

[0013] In one aspect, each of the M detector blocks includes a plurality of radiation detectors, the plurality of radiation detectors of each detector block being stationary relative to each other, and the projection of the effective areas of the plurality of radiation detectors of each detector block onto a plane perpendicular to the radiation used in the first scan and the second scan together forming a single region on the plane.

[0014] This paper discloses an imaging system comprising M detector blocks (detector blocks (i), i = 1, ..., M), where M is an integer greater than 1. The M detector blocks are configured to perform a first scan of a scene in a scanning direction, wherein during the first scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (1), (2), ..., (M). Furthermore, the M detector blocks are configured to perform a second scan of the scene in the scanning direction after the first scan, wherein during the second scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (M), (1), (2), ..., (M-1).

[0015] In one aspect, the M detector blocks are configured to perform a third scan of the scene in the scanning direction after the second scan, wherein during the third scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (M-1), (M), (1), (2), ..., (M-2), and M>2.

[0016] In one respect, each of the M detector blocks includes a radiation detector.

[0017] On one hand, during each of the first and second scans, the M detector blocks are stationary relative to each other.

[0018] In one respect, during each of the first and second scans, the M detector blocks are uniformly distributed in the scanning direction.

[0019] In one aspect, during the first scan, the M detector blocks are configured to capture a first H local images while the M detector blocks are moving, where H is an integer greater than 1, and during the second scan, the M detector blocks are configured to capture a second H local images while the M detector blocks are moving.

[0020] In one respect, the first H local images can be stitched together, and the second H local images can be stitched together.

[0021] In one aspect, the imaging system is configured to stitch together the first H local images to form an image, and the imaging system is configured to stitch together the second H local images to form an image.

[0022] In one aspect, after the first scan and before the second scan, the imaging system is configured to move the detector blocks (M) along a path, wherein at the time point after the first scan and before the second scan, points on the path are in the shadow of other detector blocks among the M detector blocks relative to the radiation used for the first and second scans.

[0023] In one aspect, the imaging system is configured to flip the detector block (M) twice while moving it along the path after the first scan and before the second scan.

[0024] In one aspect, each of the M detector blocks includes a plurality of radiation detectors, the plurality of radiation detectors of each detector block being stationary relative to each other, and the projection of the effective areas of the plurality of radiation detectors of each detector block onto a plane perpendicular to the radiation used in the first scan and the second scan together forming a single region on the plane. [Attached Image Description]

[0025] Figure 1 A radiation detector according to an embodiment is illustrated schematically.

[0026] Figure 2A A simplified cross-sectional view of the radiation detector is shown schematically.

[0027] Figure 2B A detailed cross-sectional view of the radiation detector is shown schematically.

[0028] Figure 2C An alternative detailed cross-sectional view of the radiation detector is schematically shown.

[0029] Figure 3 A schematic top view of the package, including the radiation detector and the printed circuit board (PCB), is shown.

[0030] Figure 4 A schematic cross-sectional view of a detector module according to an embodiment is shown, wherein multiple detectors are mounted on the system PCB. Figure 3 Encapsulation.

[0031] Figures 5A to 5D A top view of the detector module in operation according to an embodiment is shown schematically.

[0032] Figures 6A to 6E The operation of the imaging system according to an embodiment is illustrated schematically.

[0033] Figure 7 A flowchart summarizing and outlining the operation of the imaging system according to an embodiment is shown.

[0034] Figures 8A to 8C The operation of the imaging system during a reset according to an embodiment is illustrated schematically.

[0035] Figures 9A to 9B A detector block according to an embodiment is schematically shown.

Detailed Implementation Methods

[0036] As an example, Figure 1 A radiation detector 100 is schematically shown. The radiation detector 100 may include an array of pixels 150 (also referred to as sensing elements 150). This array may be a rectangular array (such as...). Figure 1 (as shown), cellular array, hexagonal array, or any other suitable array. Figure 1 The example of the pixel array 150 has 28 pixels 150 arranged in 4 rows and 7 columns; typically, a pixel array 150 can have any number of pixels 150 arranged in any way.

[0037] Radiation can include particles such as photons (electromagnetic waves) and subatomic particles (e.g., neutrons, protons, electrons, alpha particles, etc.). Each pixel 150 can be configured to detect radiation incident on it and can be configured to measure the characteristics of the incident radiation (e.g., particle energy, wavelength, and frequency). The measurements of pixels 150 of the radiation detector 100 constitute an image of the radiation incident on the pixel. The image can be described as an image of the object or scene from which the incident radiation originates.

[0038] Each pixel 150 can be configured to count the number of radiating particles incident on it over a period of time, with energy falling into multiple energy ranges. All pixels 150 can be configured to count the number of radiating particles incident on them within multiple energy ranges simultaneously over the same period of time. When the incident radiating particles have similar energies, a pixel can simply be configured to count the number of radiating particles incident on it over a period of time without measuring the energy of each individual radiating particle.

[0039] Each pixel 150 may have its own analog-to-digital converter (ADC), configured to digitize an analog signal representing the energy of an incident radiating particle into a digital signal, or to digitize an analog signal representing the total energy of multiple incident radiating particles into a digital signal. Pixels 150 may be configured to operate in parallel. For example, while one pixel 150 is measuring an incident radiating particle, another pixel 150 may be waiting for the radiating particle to arrive. Pixels 150 may not need to be individually addressable.

[0040] The radiation detector 100 described herein can be used in applications such as X-ray telescopes, X-ray mammography, industrial X-ray defect detection, X-ray microscopy or microscopic radiography, X-ray casting inspection, X-ray non-destructive testing, X-ray weld inspection, and X-ray digital subtraction angiography. Using this radiation detector 100 in place of photographic plates, photographic films, PSP plates, X-ray image intensifiers, scintillators, or other semiconductor X-ray detectors may be suitable.

[0041] Figure 2A The illustration schematically shows an embodiment. Figure 1 A simplified cross-sectional view of the radiation detector 100 along line 2A-2A. More specifically, the radiation detector 100 may include a radiation absorbing layer 110 and an electronic device layer 120 (e.g., an ASIC) for processing or analyzing electrical signals generated in the radiation absorbing layer 110 by incident radiation. The radiation detector 100 may include a scintillator (not shown) or may not include a scintillator. The radiation absorbing layer 110 may contain a semiconductor material, such as silicon, germanium, GaAs, CdTe, CdZnTe, or combinations thereof. The semiconductor material may have a high-quality attenuation coefficient for the radiation of interest.

[0042] Figure 2B The illustration is shown as an example. Figure 1 A detailed cross-sectional view of the radiation detector 100 along line 2A-2A. More specifically, the radiation absorption layer 110 may include one or more diodes (e.g., pin or pn) formed by one or more discrete regions 114 of a first doped region 111 and a second doped region 113. The second doped region 113 may be separated from the first doped region 111 by an optional intrinsic region 112. The discrete regions 114 are separated from each other by either the first doped region 111 or the intrinsic region 112. The first doped region 111 and the second doped region 113 have opposite doping types (e.g., region 111 is p-type and region 113 is n-type, or region 111 is n-type and region 113 is p-type). Figure 2B In the example, the discrete regions 114 of the second doped region 113, together with the first doped region 111 and an optional intrinsic region 112, form a diode. That is, in Figure 2B In the example, the radiation absorption layer of Figure 110 has multiple diodes (more specifically, Figure 2B It shows the relationship with Figure 1 In the array, each row has 7 pixels (150) corresponding to 7 diodes. For simplicity, Figure 2B Only two pixels 150 are marked in the image. Multiple diodes may have an electrode 119A as a common electrode. The first doped region 111 may also have discrete portions.

[0043] Electronics layer 120 may include electronic systems 121 suitable for processing or interpreting signals generated by radiation incident on radiation-absorbing layer 110. Electronic systems 121 may include analog circuitry such as filter networks, amplifiers, integrators, and comparators, or digital circuitry such as microprocessors and memory. Electronic systems 121 may include one or more ADCs. Electronic systems 121 may include components shared by pixels 150 or components dedicated to a single pixel 150. For example, electronic systems 121 may include amplifiers dedicated to each pixel 150 and microprocessors shared across all pixels 150. Electronic systems 121 may be electrically connected to pixels 150 via vias 131. The space between vias may be filled with a filler material 130, which may increase the mechanical stability of the connection between electronics layer 120 and radiation-absorbing layer 110. Other bonding techniques may connect electronics 121 to pixels 150 without using vias 131.

[0044] When radiation from a radiation source (not shown) impacts the radiation-absorbing layer 110 of a diode, the radiation particles can be absorbed and generate one or more charge carriers (e.g., electrons, holes) through various mechanisms. The charge carriers can drift to an electrode of one of the diodes under an electric field. This field can be an external electric field. Electrical contacts 119B can include discrete portions, each in electrical contact with a discrete region 114. The term "electrical contact" is used interchangeably with the term "electrode." In embodiments, charge carriers can drift in various directions such that charge carriers generated by a single radiation particle are substantially not shared by two different discrete regions 114 (here, "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different discrete region 114 compared to the rest). Charge carriers generated by radiation particles incident around a coverage area of ​​one of these discrete regions 114 are substantially not shared with the other of these discrete regions 114. Pixel 150 associated with discrete region 114 can be the space surrounding discrete region 114, in which substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by incident radiating particles flow toward discrete region 114. That is, less than 2%, less than 1%, less than 0.1%, or less than 0.01% of these charge carriers flow through pixel 150.

[0045] Figure 2C The illustration schematically shows an embodiment. Figure 1 An alternative cross-sectional view of the radiation detector 100 along line 2A-2A. More specifically, the radiation absorbing layer 110 may include resistors made of semiconductor materials such as silicon, germanium, GaAs, CdTe, CdZnTe, or combinations thereof, but not diodes. This semiconductor material may have a high-quality attenuation coefficient for the radiation of interest. In an embodiment, Figure 2C The electronic device layer 120 can be similar in structure and function to Figure 2B The electronic device layer 120.

[0046] When radiation impacts the radiation-absorbing layer 110, which includes resistors but not diodes, it can be absorbed and generate one or more charge carriers through various mechanisms. The radiating particle can generate 10 to 100,000 charge carriers. These charge carriers can drift to electrical contacts 119A and 119B under an electric field. This electric field can be an external electric field. Electrical contact 119B includes discrete portions. In an embodiment, charge carriers can drift in various directions such that charge carriers generated by a single radiating particle are substantially not shared by the two distinct discrete portions of electrical contact 119B (here, "substantially not shared" means that less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow to a different discrete portion compared to the rest of the charge carriers). Charge carriers generated by radiating particles incident on the coverage area of ​​one of these discrete portions of electrical contact 119B are substantially not shared with the other of these discrete portions of electrical contact 119B. Pixels 150 associated with discrete portions of electrical contacts 119B can be the space surrounding the discrete portions, where substantially all (greater than 98%, greater than 99.5%, greater than 99.9%, or greater than 99.99%) of the charge carriers generated by incident radiant particles flow toward the discrete portions of electrical contacts 119B. That is, less than 2%, less than 0.5%, less than 0.1%, or less than 0.01% of these charge carriers flow through a pixel associated with a discrete portion of electrical contact 119B.

[0047] Figure 3 A schematic top view of a package 200 including a radiation detector 100 and a printed circuit board (PCB) 400 is shown. The term "PCB" as used herein is not limited to a particular material. For example, a PCB may include semiconductors. The radiation detector 100 may be mounted to the PCB 400. For clarity, wiring between the detector 100 and the PCB 400 is not shown. The PCB 400 may have one or more radiation detectors 100. The PCB 400 may have an area 405 not covered by the radiation detector 100 (e.g., for accommodating bonding wires 410). The radiation detector 100 may have an effective area 190, which is a pixel 150 (…). Figure 1 The radiation detector 100 may have a peripheral region 195 near its edge. The peripheral region 195 has no pixels 150, and the radiation detector 100 does not detect radiation particles incident on the peripheral region 195.

[0048] Figure 4 A cross-sectional view of a detector module 490 according to an embodiment is schematically shown. The detector module 490 may include components mounted to a system PCB 450. Figure 3One or more packages of 200. As an example, Figure 4 Only two packages 200 are shown. The electrical connection between the PCB 400 and the system PCB 450 can be achieved via bonding wires 410. To accommodate the bonding wires 410 on the PCB 400, the PCB 400 may have an area 405 not covered by the detector 100. To accommodate the bonding wires 410 on the system PCB 450, there may be gaps between the packages 200. The gaps may be approximately 1 mm or greater. The packages 200 on the system PCB 450 cannot detect radiation particles incident on the peripheral area 195, area 405, or gaps.

[0049] The dead zone of a radiation detector (e.g., radiation detector 100) is the region on the radiation-receiving surface of the radiation detector that cannot be detected by the radiation detector. The dead zone of a package (e.g., package 200) is the region on the radiation-receiving surface of the package that cannot be detected by one or more radiation detectors within the package. Figure 3 and Figure 4 In the example shown, the dead zone of package 200 includes peripheral area 195 and area 405. The dead zone (e.g., detector module 490) of a detector module having a set of packages (e.g., packages mounted on the same PCB, packages arranged in the same layer) includes a combination of the dead zones of each package in the set and the gaps between the packages.

[0050] In one embodiment, the detector module 490, including the radiation detector 100, may have a dead zone 488 that cannot detect incident radiation. However, in another embodiment, the detector module 490, having a physically separated effective region 190, can capture localized images of the incident radiation. In another embodiment, these captured localized images are such that they can be stitched together by the detector module 490 to form a single image of the incident radiation.

[0051] Figures 5A to 5D A top view schematically illustrates a detector module 490 in operation according to an embodiment. In this embodiment, the detector module 490 may include two effective regions 190a and 190b (similar to...). Figure 3 and Figure 4 The effective area 190) and the dead area 488. For simplicity, the detector module 490 includes a peripheral area 195 ( Figure 4Other parts, such as [other parts not shown], are also not shown. In an embodiment, the cardboard box 510 enclosing the metal sword 512 can be placed between the detector module 490 and the radiation source (not shown) preceding the page. The cardboard box 510 is located between the detector module 490 and the observer's eye. In the following text, for the sake of generalization, the cardboard box 510 enclosing the metal sword 512 may be referred to as object or scene 510+512.

[0052] In an embodiment, the detector module 490 may operate as follows in capturing images of objects / scenes 510+512. First, as... Figure 5A As shown, the objects / scenes 510+512 can be stationary, and the detector module 490 can be moved relative to the objects / scenes 510+512 to a first image capture position. Then, while the detector module 490 is in the first image capture position, the detector module 490 (specifically, the effective areas 190a and 190b) can be used to capture a local image 520.1 of the objects / scenes 510+512.

[0053] Next, as Figure 5B As shown, in this embodiment, the detector module 490 can be moved to a second image capture position relative to the object / scene 510+512. Then, while the detector module 490 is in the second image capture position, the detector module 490 (specifically, effective areas 190a and 190b) can be used to capture a local image 520.2 of the object / scene 510+512.

[0054] Next, as Figure 5C As shown, in this embodiment, the detector module 490 can be moved to a third image capture position relative to the object / scene 510+512. Then, while the detector module 490 is in the third image capture position, the detector module 490 (specifically, the effective areas 190a and 190b) can be used to capture a local image 520.3 of the object / scene 510+512.

[0055] In the embodiments, the size and shape of the effective regions 190a and 190b, as well as the positions of the first, second, and third image capture locations, allow any local image in local images 520.1, 520.2, and 520.3 to overlap with at least one other local image in local images 520.1, 520.2, and 520.3. For example, the distance 492 between the first and second image capture locations can be close to and less than the width 190w of the effective region 190a; as a result, local image 520.1 overlaps with local image 520.2.

[0056] In the event that any of the local images 520.1, 520.2, and 520.3 overlaps with at least one other local image among the local images 520.1, 520.2, and 520.3, the local images 520.1, 520.2, and 520.3 may be stitched together to form a single image 520 of object / scene 510+512. Figure 5D In an embodiment, partial images 520.1, 520.2, and 520.3 can be stitched together to form a single image 520 of object / scene 510+512. Figure 5D ).

[0057] Figures 6A to 6E The operation of an imaging system 600 according to an embodiment is schematically illustrated. In this embodiment, the imaging system 600 may include three radiation detectors 100.1, 100.2, and 100.3 (or simply 100.1-3), each of which may be similar to radiation detector 100. For simplicity, only the effective regions 190.1, 190.2, and 190.3 (or simply 190.1-3) of the radiation detectors 100.1, 100.2, and 100.3 are shown.

[0058] In this embodiment, the operation of the imaging system 600 can begin with the imaging system 600 performing a first scan of the scene. First, as... Figure 6A As shown, the upper left corners of the effective regions 190.1, 190.2, and 190.3 are located at points A1, B1, and C1, respectively. The effective regions 190.1-3 can capture the first local image of the scene.

[0059] Next, in this embodiment, the radiation detectors 100.1-3 can be moved along the scanning direction 610, so that the upper left corners of the effective regions 190.1, 190.2, and 190.3 are located at points A2, B2, and C2, respectively. As a result of this movement, all effective regions 190.1-3 are moved to the right. The result of this movement is... Figure 6B As shown in [the image]. Figure 6B In the diagram, the dashed line represents the position of the effective area 190.1-3 before the movement. Next, in the embodiment, as... Figure 6B As shown, when the upper left corners of the effective areas 190.1, 190.2, and 190.3 are located at points A2, B2, and C2 respectively, the effective areas 190.1-3 can capture the second local image of the scene, thereby completing the first scan of the scene by the imaging system 600.

[0060] Next, in this embodiment, the imaging system 600 can be first reset as follows. Specifically, radiation detectors 100.1-3 can be moved such that the upper left corners of the effective areas 190.1, 190.2, and 190.3 are located at points B1, C1, and A1, respectively. As a result of the movement, radiation detectors 100.1 and 100.2 move to the right, but radiation detector 100.3 moves from the front of the line of radiation detectors 100.1-3 to the end of the line (i.e., to the left). The result of the movement is... Figure 6C As shown in the image.

[0061] Next, in this embodiment, the operation of the imaging system 600 can continue by the imaging system 600 performing a second scan of the scene. In this embodiment, the second scan can be similar to the first scan. Specifically, firstly, as... Figure 6C As shown, while the upper left corners of the effective areas 190.1, 190.2, and 190.3 are located at points B1, C1, and A1 respectively, the effective areas 190.1-3 can capture a third local image of the scene.

[0062] Next, in this embodiment, the radiation detectors 100.1-3 can be moved along the scanning direction 610, so that the upper left corners of the effective regions 190.1, 190.2, and 190.3 are located at points B2, C2, and A2, respectively. As a result of this movement, all effective regions 190.1-3 are moved to the right. The result of this movement is... Figure 6D As shown in [the image]. Figure 6D In the diagram, the dashed line represents the position of the effective area 190.1-3 before the movement. Next, in the embodiment, as... Figure 6D As shown, when the upper left corners of the effective areas 190.1, 190.2, and 190.3 are located at points B2, C2, and A2 respectively, the effective areas 190.1-3 can capture the fourth local image of the scene, thereby completing the second scan of the scene by the imaging system 600.

[0063] Next, in this embodiment, a second reset of the imaging system 600 can be performed. In this embodiment, the second reset can be similar to the first reset. Specifically, radiation detectors 100.1-3 can be moved such that the upper left corners of the effective areas 190.1, 190.2, and 190.3 are located at points C1, A1, and B1, respectively. As a result of the movement, radiation detectors 100.3 and 100.1 move to the right, but radiation detector 100.2 moves from the front of the line of radiation detectors 100.1-3 to the end of the line (i.e., to the left). The result of the movement is... Figure 6E As shown in the image.

[0064] Next, in the embodiment, further scans and resets, similar to the first scan and the first reset, can be performed to obtain more local images of the scene. For example, it can be done according to... Figure 6EThe third scan is performed using radiation detectors 100.1-3 in the order shown (i.e., in the order of radiation detectors 100.2, 100.3, and 100.1 in the scan direction 610). After the third scan, a third reset can be performed, resulting in the radiation detectors 100.1-3 being physically arranged in the order of radiation detectors 100.1, 100.2, and 100.3 in the scan direction 610 (e.g., ...). Figure 6A (As shown). In fact, as a result of the third reset, radiation detector 100.1 moved from the front of the line of radiation detector 100.1-3 to the end of the line.

[0065] Figure 7 A flowchart 700 summarizing and generalizing the operation of the imaging system 600 according to an embodiment is shown. In step 710, a first scan of the scene can be performed using M detector blocks (detector blocks (i), i = 1, ..., M) in the scanning direction, wherein during the first scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (1), (2), ..., (M), where M is an integer greater than 1.

[0066] For example, refer to Figures 6A to 6B Each of the M detector blocks can include a radiation detector 100. In the first scan, three radiation detectors 100.1-3 (i.e., M=3) are used in the scanning direction 610, wherein the three radiation detectors 100.1-3 are physically arranged in the scanning direction 610 in the order of radiation detectors 100.1, 100.2 and 100.3 during the first scan.

[0067] In step 720, after the first scan, a second scan of the scene can be performed using M detector blocks in the scanning direction, wherein during the second scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (M), (1), (2), ..., (M-1). In the example above, refer to... Figures 6C to 6D After the first scan, three detector blocks are used in the second scan in the scanning direction 610, wherein during the second scan, three radiation detectors 100.1-3 are physically arranged in the scanning direction 610 in the order of radiation detectors 100.3, 100.1 and 100.2.

[0068] In the embodiments, reference is made to Figures 6A to 6E During each scan (e.g., the first scan, the second scan, etc.), the three radiation detectors 100.1-3 can remain stationary relative to each other. As a result, the three straight line segments A1-A2, B1-B2, and C1-C2 have the same length. Typically, the reference... Figure 7 In an embodiment, during each scan, the M detector blocks may be stationary relative to each other.

[0069] In the embodiments, reference is made to Figures 6A to 6E During each scan (e.g., the first scan, the second scan, etc.), the three radiation detectors 100.1-3 can be uniformly distributed along the scanning direction 610. As a result, the two straight line segments A1-B1 and B1-C1 have the same length, and the two straight line segments A2-B2 and B2-C2 have the same length. Typically, referring to... Figure 7 In this embodiment, during each scan, the M detector blocks can be uniformly distributed in the scanning direction.

[0070] In the above embodiments, in the first scan ( Figures 6A to 6B In the second scan, the effective region 190.1-3 captures first and second local images while the radiation detector 100.1-3 remains stationary (i.e., does not move). Figures 6A to 6B In the effective region 190.1-3, the third and fourth local images are captured while the radiation detector 100.1-3 is stationary (i.e., does not move).

[0071] In an alternative embodiment, the effective region 190.1-3 can capture these local images while the radiation detector 100.1-3 moves. For an example of this alternative embodiment, see [reference needed]. Figure 6B While moving through points A2, B2, and C2 at the upper left corners of the effective areas 190.1, 190.2, and 190.3 respectively, the effective areas 190.1-3 can capture a second local image.

[0072] Similarly, for another example of this alternative embodiment, see reference to Figure 6C While moving through points A1, B1, and C1 respectively at the upper left corners of effective regions 190.3, 190.1, and 190.2, effective region 190.1-3 can capture a third local image. Typically, referring to... Figure 7 In the flowchart 700, in an embodiment, for each scan, M detector blocks can capture H local images while the M detector blocks are moving (H=2 in the example above).

[0073] In the embodiments, reference is made to Figures 6A to 6E For each scan (e.g., the first scan, the second scan, etc.), two captured partial images can be stitched together. Multiple images of a scene can be stitched together if and only if, for any two points A and B of the scene whose images lie on multiple images, there exists a line connecting A and B such that each point of that line has its image on all of these multiple images. For example, the first and second partial images can be stitched together. As another example, the third and fourth partial images can be stitched together. Typically, refer to... Figure 7In the flowchart 700, in an embodiment, for each scan, H local images captured by M detector blocks can be stitched together.

[0074] In the embodiments, reference is made to Figures 6A to 6E For each scan (e.g., first scan, second scan, etc.), two captured local images can be stitched together by the imaging system 600 to form an image. For example, the first and second local images can be stitched together to form an image. As another example, the third and fourth local images can be stitched together to form an image. Typically, refer to... Figure 7 In the flowchart 700, in an embodiment, for each scan, H local images captured by M detector blocks can be stitched together to form an image.

[0075] In the embodiments, reference is made to Figures 6A to 6E In the first scan ( Figures 6A to 6B After that, and the second scan ( Figures 6C to 6D During the first reset that occurs prior to this, radiation detector 100.3 may move along a path from the front of the line of radiation detectors 100.1-3 to the end of that line, wherein at the point in time during the first reset, a point on that path is in the shadow of the other radiation detectors 100.1 and 100.2M relative to the radiation used for scanning. In an embodiment, radiation detector 100.3 may flip twice during its movement along the path during the first reset.

[0076] Specifically, referring to as Figure 6B Side view Figure 8A In an embodiment, at the end of the first scan, all radiation-absorbing layers 110 of the radiation detector 100.1-3 can be oriented towards the radiation 810 used for scanning. In other words, particles of radiation 810 collide with the radiation-absorbing layers 110 of the radiation detector 100.1-3 before impacting the electronics layer 120 of the radiation detector 100.1-3.

[0077] Next, in an embodiment, during a first reset after the first scan and before the second scan, radiation detectors 100.1 and 100.2 may move to the right, and radiation detector 100.3 may move along path 820 from the front of the line of radiation detectors 100.1-3 to the end of the line. In an embodiment, refer to... Figure 8B At a point in time during the first reset, point 820p on path 820 may be in the shadow of radiation detectors 100.1 and 100.2 relative to radiation 810.

[0078] In an embodiment, during the first reset, as the radiation detector 100.1-3 moves from the front of the line to the end of the line, the radiation detector 100.3 can be flipped (i.e., its electronics layer 120 faces the radiation 810), as... Figure 8BAs shown. In an embodiment, during the first reset, the radiation detector 100.3 can be flipped again, thereby enabling the following... Figure 8C (that is) Figure 6C As shown in the side view, at the start of the second scan, all radiation-absorbing layers 110 of radiation detectors 100.1-3 are facing radiation 810. In other words, radiation detectors 100.3 flip twice during the first reset. This double-flipping motion is similar to the movement of steps on moving walkways commonly used in airports.

[0079] In the above embodiments, reference is made to Figure 7 Each of the M detector blocks includes a radiation detector 100. Alternatively, each of the M detector blocks may include multiple radiation detectors 100.

[0080] Figure 9A A detector block 900 according to an embodiment is schematically shown. For example, detector block 900 may include four radiation detectors 100a, 100b, 100c, and 100d (or simply 100a-d) arranged on two detector modules 490.1 and 490.2, which may be similar to detector module 490. Figure 4 In one embodiment, the four radiation detectors 100a-d may be stationary relative to each other. In another embodiment, two detector modules 490.1 and 490.2 may be formed on two separate substrates that can be joined together to form a detector block 900.

[0081] In an embodiment, the effective areas 190a, 190b, 190c, and 190d of the individual radiation detectors 100a, 100b, 100c, and 100d of the detector block 900, projected onto a plane perpendicular to the radiation 810 used for scanning, collectively form a single region on that plane. Figure 9B (in the direction of radiation 810) Figure 9A In the view (of the plane), the plane can be a page, and as... Figure 9B As shown, the projections of effective areas 190a, 190b, 190c, and 190d onto the page form a single region. This single region can be considered as the effective region of the detector block 900 capable of detecting incident radiation.

[0082] While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for illustrative purposes and are not intended to be limiting, wherein the true scope and spirit are indicated by the following claims.

Claims

1. An imaging method, comprising: Using M detector blocks (i), i=1, ..., M, a first scan is performed on the scene in the scanning direction, wherein during the first scan, the M detector blocks are physically arranged in the scanning direction in the order of the detector blocks (1), (2), ..., (M), and M is an integer greater than 1; as well as After the first scan, the scene is scanned a second time using the M detector blocks in the scanning direction, wherein during the second scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (M), (1), (2), ..., (M-1). The detector block (M) is flipped twice while moving along a path after the first scan and before the second scan.

2. The method according to claim 1, further comprising, after the second scan, scanning the scene in the scanning direction using the M detector blocks, a third scan is performed. During the third scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (M-1), (M), (1), (2), ..., (M-2), and... Where M>2.

3. The method according to claim 1, wherein, Each of the M detector blocks includes a radiation detector.

4. The method according to claim 1, in, During each of the first and second scans, the M detector blocks remain stationary relative to each other.

5. The method according to claim 4, in, During each of the first and second scans, the M detector blocks are uniformly distributed along the scanning direction.

6. The method according to claim 1, in, The first scan includes capturing first H local images while the M detector blocks move, where H is an integer greater than 1. The second scan includes capturing a second H local images while the M detector blocks are moving.

7. The method according to claim 6, in, The first H local images can be stitched together, and The second H local images can be stitched together.

8. The method according to claim 7, further comprising: The first H local images are stitched together to form an image; and The second H local images are stitched together to form an image.

9. The method according to claim 1, wherein, At the time point after the first scan and before the second scan, the points on the path are in the shadow of the other detector blocks among the M detector blocks relative to the radiation used for the first and second scans.

10. The method according to claim 1, in, Each of the M detector blocks includes multiple radiation detectors. In this configuration, the multiple radiation detectors in each detector block are stationary relative to each other, and The effective areas of the multiple radiation detectors in each detector block are projected onto a plane perpendicular to the radiation used in the first and second scans, which together form a single region on the plane.

11. An imaging system comprising M detector blocks (i), i = 1, ..., M, where M is an integer greater than 1. in, The M detector blocks are configured to perform a first scan of the scene in a scanning direction, wherein during the first scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (1), (2), ..., (M), and The M detector blocks are configured to perform a second scan of the scene in the scanning direction after the first scan, wherein during the second scan, the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (M), (1), (2), ..., (M-1). The imaging system is configured to flip the detector block (M) twice while moving it along a path after the first scan and before the second scan.

12. The imaging system according to claim 11, in, The M detector blocks are configured to perform a third scan of the scene in the scanning direction after the second scan, wherein during the third scan the M detector blocks are physically arranged in the scanning direction in the order of detector blocks (M-1), (M), (1), (2), ..., (M-2), and wherein M>2.

13. The imaging system according to claim 11, wherein, Each of the M detector blocks includes a radiation detector.

14. The imaging system according to claim 11, in, During each of the first and second scans, the M detector blocks remain stationary relative to each other.

15. The imaging system according to claim 14, in, During each of the first and second scans, the M detector blocks are uniformly distributed along the scanning direction.

16. The imaging system according to claim 11, in, During the first scan, the M detector blocks are configured to capture first H local images while the M detector blocks are moving, where H is an integer greater than 1. During the second scan, the M detector blocks are configured to capture a second H local images while the M detector blocks are moving.

17. The imaging system according to claim 16, in, The first H local images can be stitched together, and The second H local images can be stitched together.

18. The imaging system according to claim 17, in, The imaging system is configured to stitch together the first H local images to form an image, and The imaging system is configured to stitch together the second H local images to form an image.

19. The imaging system according to claim 11, in, At the time point after the first scan and before the second scan, the points on the path are in the shadow of the other detector blocks among the M detector blocks relative to the radiation used for the first and second scans.

20. The imaging system according to claim 11, in, Each of the M detector blocks includes multiple radiation detectors. In this configuration, the multiple radiation detectors in each detector block are stationary relative to each other, and The effective areas of the multiple radiation detectors in each detector block are projected onto a plane perpendicular to the radiation used in the first and second scans, which together form a single region on the plane.

Images