LED package assembly, vehicle headlamp system, and method of making an LED package assembly

Abstract

A light emitting diode (LED) package assembly (100) includes a substrate (102). The substrate includes a top surface, a bottom surface (122), and an opening formed through the substrate (102). The opening includes a first portion (104) proximate the top surface and a second portion (106) proximate the bottom surface (122) that is wider than the first portion (104) such that portions of the substrate (102) overhang the second portion (106) of the opening. A pad (124) is disposed on the bottom surface of the portions of the substrate (102) that overhang the second portion (106) of the opening (102). The assembly further includes a hybrid device (210) in the opening. The hybrid device (210) includes a silicon backplane (214) having a top surface, a bottom surface, and an interconnect on the top surface. The interconnect (148) is electrically coupled to the pad (124). The hybrid device further includes an array of LEDs (212) on the top surface of the silicon backplane (214).

Description

[0001] Cross-references to (multiple) related applications

[0002] This application claims the benefits of U.S. Non-Provisional Application No. 17 / 132359, filed December 23, 2020, and U.S. Provisional Application No. 62 / 954121, filed December 27, 2019, both of which are incorporated herein by reference as if fully illustrated. Background Technology

[0003] Precision-controlled lighting applications may require the manufacture and fabrication of small addressable light-emitting diode (LED) lighting systems. The small size of such systems may necessitate unconventional components and manufacturing processes. Summary of the Invention

[0004] A light-emitting diode (LED) package assembly includes a substrate having a top surface, a bottom surface, and an opening formed through the substrate. The opening includes a first portion adjacent to the top surface and a second portion adjacent to the bottom surface, the second portion being wider than the first portion, such that portions of the substrate are suspended over the second portion of the opening. Pads are disposed on the bottom surface of the portions of the substrate suspended over the second portion of the opening. The assembly also includes a hybrid device within the opening. The hybrid device includes a silicon backplane having a top surface, a bottom surface, and interconnects on the top surface. The interconnects are electrically coupled to the pads. The hybrid device also includes an LED array on the top surface of the silicon backplane. Attached Figure Description

[0005] A more detailed understanding can be obtained from the following description, which is given by way of example and in conjunction with the accompanying figures, wherein:

[0006] Figure 1 This is a top view of an example LED array;

[0007] Figure 2A A cross-sectional view of an example hybrid device;

[0008] Figure 2B This is a cross-sectional view of an example LED package assembly;

[0009] Figure 2C A top view of an example hybrid device;

[0010] Figure 3 A flowchart illustrating an example method for fabricating LED packaging components;

[0011] Figure 4 For can be used Figure 3 A cross-sectional view of an example substrate for the method;

[0012] Figure 5 According to Figure 3A cross-sectional view of an example product manufactured by forming grooves in a substrate;

[0013] Figure 6 According to Figure 3 A cross-sectional view of an example product manufactured by forming holes in a substrate using this method;

[0014] Figure 7 According to Figure 3 A cross-sectional view of an example product manufactured by positioning the hybrid device in a substrate;

[0015] Figure 8 According to Figure 3 A cross-sectional view of an example product manufactured by coupling a hybrid device to a substrate via one or more flip-chip interconnects;

[0016] Figure 9 According to Figure 3 A cross-sectional view of an example product manufactured by forming an underfill material around a flip-chip interconnect;

[0017] Figure 10 According to Figure 3 A cross-sectional view of an example product manufactured by coupling electronic components to a substrate using this method;

[0018] Figure 11 According to Figure 3 A cross-sectional view of an example product manufactured by coupling a circuit board to a substrate using this method;

[0019] Figure 12 Here is a block diagram of an example system including LED packaging components;

[0020] Figure 13 Here is a block diagram of another example system;

[0021] Figure 14 A block diagram of an example lighting system; and

[0022] Figure 15 For implementation Figure 13 Example hardware layout of the system. Detailed Implementation

[0023] Examples of different light illumination systems and / or light-emitting diodes (“LEDs”) implementations will be described more fully below with reference to the accompanying drawings. These examples are not mutually exclusive, and features found in one example may be combined with features found in one or more other examples to achieve further implementations. Therefore, it will be understood that the examples shown in the accompanying drawings are provided for illustrative purposes only and are not intended to limit this disclosure in any way. Similar figures always refer to similar elements.

[0024] It will be understood that although the terms first, second, third, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms may be used to distinguish one element from another. For example, a first element may be referred to as a second element and a second element may be referred to as a first element without departing from the scope of the invention. As used herein, the term "and / or" may include any and all combinations of one or more of the associated listed items.

[0025] It will be understood that when an element, such as a layer, region, or substrate, is referred to as "on" or "extending" to another element, it may be directly on or directly extended to the other element, or there may be intermediate elements present. Conversely, when an element is referred to as "directly on" or "directly extended" to another element, there may be no intermediate elements present. It will also be understood that when an element is referred to as "connected" or "coupled" to another element, it may be directly connected or coupled to the other element and / or connected or coupled to the other element via one or more intermediate elements. Conversely, when an element is referred to as "directly connected" or "directly coupled" to another element, there are no intermediate elements between that element and the other element. It will be understood that, except for any orientation depicted in the figures, these terms are intended to cover different orientations of elements.

[0026] Relative terms such as “below,” “above,” “top,” “lower,” “horizontal,” or “vertical” may be used herein to describe the relationship of one element, layer, or region to another element, layer, or region illustrated in the figures. It will be understood that these terms are intended to cover different orientations of the device, in addition to those depicted in the figures.

[0027] Furthermore, whether LEDs, LED arrays, electrical components, and / or electronic components are housed on one, two, or more electronic boards may also depend on design constraints and / or application.

[0028] Semiconductor light-emitting devices (LEDs), or optical power-emitting devices—such as those emitting ultraviolet (UV) or infrared (IR) optical power—are among the most efficient light sources currently available. These devices (hereinafter “LEDs”) can include light-emitting diodes, resonant cavity light-emitting diodes, vertical cavity laser diodes, or edge-emitting lasers, etc. For example, due to their compact size and low power requirements, LEDs can be attractive candidates for many different applications. For example, they can be used as light sources (e.g., flashlights and camera flashes) in handheld battery-powered devices such as cameras and mobile phones. They can also be used for automotive lighting, head-up display (HUD) lighting, garden lighting, street lighting, video lighting, general lighting (e.g., home, shop, office, and studio lighting, theater / stage lighting, and architectural lighting), augmented reality (AR) lighting, virtual reality (VR) lighting, display backlighting, and IR spectrometers. A single LED can provide less light than an incandescent light source, and therefore, multi-junction devices or LED arrays (such as monolithic LED arrays, micro-LED arrays, etc.) can be used for applications that expect or require higher brightness.

[0029] For some applications, LEDs can be arranged in arrays. For example, LED arrays can support applications that benefit from fine-grained intensity, spatial, and temporal control of light distribution. This can include, but is not limited to, precise spatial patterning of emitted light from pixel blocks or individual pixels. Depending on the application, the emitted light can be spectrally distinct, time-adaptive, and / or environmentally responsive. LED arrays can provide pre-programmed light distributions with various intensities, spatial, or temporal patterns. The emitted light can be based at least in part on received sensor data and can be used for optical wireless communication. The associated electronics and optics can be distinctly different at the transmitter, transmitter block, or device level.

[0030] LED arrays can be formed from one-dimensional, two-dimensional, or three-dimensional arrays of LEDs, VCSELs, OLEDs, or other controllable light-emitting systems. LED arrays can be formed as an emitter array on a monolithic substrate, through partial or complete segmentation of the substrate, using photolithography, additive or subtractive processing, or through assembly using pick-and-place or other suitable mechanical placement. LED arrays can be uniformly arranged in a grid pattern, or alternatively, can be positioned in a defined geometry, curves, randomness, or irregular layout.

[0031] Figure 1 This is a top view of example LED array 101. Figure 1 In the example shown, LED array 101 is an array of emitters 111. The emitters 111 in LED array 101 can be individually addressable or can be grouped / subgroup addressable.

[0032] Figure 1 An exploded view of a 3×3 portion of the LED array 101 is also shown. As shown in the 3×3 exploded view, the LED array 101 may include emitters 111, each emitter 111 having a width w1. In embodiments, the width w1 may be approximately 100 μm or less (e.g., 40 μm). The width of the channel 113 between the emitters 111 may be w2. In embodiments, the width w2 may be approximately 20 μm or less (e.g., 5 μm). In some embodiments, the width w2 may be as small as 1 μm. The channel 113 may provide an air gap between adjacent emitters, or may contain other materials. The distance D1 from the center of one emitter 111 to the center of an adjacent emitter 111 may be approximately 120 μm or less (e.g., 45 μm). It will be understood that the widths and distances provided herein are merely examples, and actual widths and / or dimensions may vary.

[0033] Will understand, although Figure 1 A rectangular emitter arranged in a symmetrical matrix is ​​shown, but emitters of any shape and arrangement can be applied to the embodiments described herein. For example, Figure 1 The LED array 101 may include more than 20,000 emitters in any suitable arrangement, such as a 200×100 matrix, a symmetric matrix, an asymmetric matrix, etc. It will also be understood that multiple sets of emitters, matrices, and / or boards may be arranged in any suitable form to implement the embodiments described herein.

[0034] As described above, an LED array (such as LED array 101) may include up to 20,000 or more emitters. Such an array may have a 90 mm diameter. 2 These LEDs may have a larger surface area and may require considerable power (such as 60 watts or more) to power them. Such LED arrays may be referred to as microLED arrays or simply microLEDs. In some embodiments, microLEDs may include hundreds, thousands, or even millions of LEDs or emitters located together on a substrate with an area of ​​centimeters or smaller. MicroLEDs may include an array of individual emitters disposed on a substrate, or may be individual silicon wafers or dies partially or completely divided into segments forming emitters.

[0035] The controller can be coupled to selectively power subgroups of emitters in the LED array, thereby providing different beam patterns. At least some of the emitters in the LED array can be individually controlled via connected traces. In other embodiments, groups or subgroups of emitters can be controlled together. In some embodiments, the emitters can be distinctly different non-white. For example, at least four of the emitters can be an RGBY emitter group.

[0036] LED array illuminators can include luminaires that can be programmed to project different lighting patterns based on selective emitter activation and intensity control. Such illuminators can emit multiple controllable beam patterns from a single lighting device without the use of moving parts. Typically, this is achieved by adjusting the brightness of individual LEDs in a 1D or 2D array. Optics—whether shared or individual—can selectively direct light towards specific target areas. In some embodiments, the height of the LEDs, their supporting substrates and traces, and associated micro-optics can be less than 5 millimeters.

[0037] LED arrays (including LED or μLED arrays) can be used to selectively and adaptively illuminate buildings or areas to improve visual presentation or reduce lighting costs. Furthermore, such LED arrays can be used for projection onto media facades for decorative motion or video effects. Selective lighting of areas around pedestrians is possible by combining tracking sensors and / or cameras. Emitters with distinctly different spectra can be used to adjust the color temperature of the lighting, as well as to support garden lighting at specific wavelengths.

[0038] Street lighting is an important application that can greatly benefit from the use of LED arrays. A single type of LED array can be used to simulate various street light types; for example, by appropriately activating or deactivating selected emitters, switching between Type I linear streetlights and Type IV semi-circular streetlights is possible. Furthermore, street lighting costs can be reduced by adjusting beam intensity or distribution according to environmental conditions or usage time. For example, when there are no pedestrians, light intensity and distribution area may be reduced. If the emitters are spectrally distinct, the color temperature of the light can be adjusted according to the corresponding daytime, dusk, or nighttime conditions.

[0039] LED arrays are also well-suited for applications requiring direct or projected displays. For example, warning, emergency, or information signs can be displayed or projected using LED arrays. This allows color-changing or flashing exit signs to be projected. If the LED array includes a large number of emitters, text or numerical information can be displayed. Directional arrows or similar indicators can also be provided.

[0040] Vehicle headlights are an application of LED arrays, which may require a large number of pixels and high data refresh rates. Motor vehicle headlights that actively illuminate only selected sections of the road can be used to reduce problems associated with glare or blindness for oncoming drivers. Using infrared cameras as sensors, LED arrays can activate only those transmitters needed to illuminate the road, while deactivating transmitters that might glare pedestrians or drivers of oncoming vehicles. Furthermore, pedestrians, animals, or signs outside the road can be selectively illuminated to improve driver awareness of their surroundings. If the transmitters are spectrally distinct, the color temperature of the light can be adjusted according to the corresponding daytime, dusk, or nighttime conditions. Some transmitters can be used for optical wireless vehicle-to-vehicle communication.

[0041] To individually drive or control individual LEDs or emitters in the array, a silicon backplane may be provided adjacent to the LED array. In some embodiments, the silicon backplane may include circuitry for receiving power from one or more power sources to power various portions of the silicon backplane, circuitry for receiving image input from one or more power sources to display an image via the LED array, circuitry for communication between the silicon backplane and an external controller (e.g., vehicle headlight control, general lighting control, etc.), circuitry for generating signals such as pulse width modulation (PWM) signals, circuitry for controlling the operation of individual LEDs or emitters in the array based on image input received from, for example, an external source and communication, and a plurality of LED drivers for individually driving the LEDs or emitters in the array based on the generated signals. In embodiments, the silicon backplane may be a complementary metal-oxide-semiconductor (CMOS) backplane, which may include the same number of drivers as the corresponding LEDs or emitters in the LED array. In some embodiments, the silicon backplane may be an application-specific integrated circuit (ASIC). In some embodiments, a driver may be provided for each group of a certain number of LEDs or emitters, and the LED group or emitter group may be controlled, rather than individually. Each driver may be individually electrically coupled to a corresponding LED or emitter or LED group or emitter group. While the silicon backplane has been described above for a specific circuit, those skilled in the art will understand that silicon backplanes used to drive LED arrays (such as those described herein) may include more, fewer, or different components that potentially perform different functions without departing from the embodiments described herein.

[0042] As described above, each driver in the silicon backplane can be electrically coupled to an individual LED or emitter, or a group of LEDs or emitter groups, in the LED array. Accordingly, the LED array must be placed adjacent to the silicon backplane. In embodiments, this can be achieved by individually coupling copper pillar bumps on the surface of the LED array or copper pillar bumps or other connectors in the connector array to corresponding connectors on the opposite surface of the silicon backplane. The silicon backplane, as described above, can become very hot during operation, especially considering its proximity to the LED array. Therefore, heat dissipation can be challenging for such devices. While some solutions for heat dissipation in semiconductor devices are known, these solutions typically involve structures that dissipate heat through the top of the device. However, due to light emission from the LED array, heat dissipation through the top of the device may be impractical or impossible. The embodiments described herein provide structures that enable effective and efficient heat dissipation through the bottom surface of the device.

[0043] Additionally, the LED array (such as LED array 101) and the associated silicon backplane may require placing numerous passive components (such as resistors, capacitors, and crystals) on a circuit board immediately adjacent to the silicon backplane. Besides providing heat dissipation through the bottom surface of the device, the embodiments described herein may also provide an LED package that allows for the placement of a large number of passive components (e.g., 27 or more) on the top surface of the circuit board, immediately adjacent to the backplane and the LED array. Furthermore, the embodiments described herein may provide a low-profile LED array package that can accommodate one or more passive components and allows for the dissipation of heat generated by the silicon backplane and the LED array.

[0044] Figure 2A This is a cross-sectional view of an example hybrid device 210. Figure 2AIn the example shown, the hybrid device 210 includes a silicon backplane 214. A first surface 213 of an LED array 212, such as a μLED, may be mounted on a first surface 215 of the silicon backplane 214. For simplicity, the first surface 215 of the silicon backplane 214 may also be referred to herein as the top surface, and the first surface 213 of the LED array 214 may also be referred to herein as the bottom surface. However, those skilled in the art will understand that if the hybrid device 210 is inverted, the first surface 215 may be the bottom surface; if the hybrid device 210 is flipped laterally, the first surface 215 may be the side surface, and so on. Similarly, if the hybrid device 210 is upside down, the first surface 213 may become the top surface; if the hybrid device 210 is flipped laterally, the first surface 213 may become the side surface, and so on. As described above, a connector array (not shown) on the first surface 215 of the silicon backplane 214 may be soldered, reflowed, or otherwise electrically and mechanically coupled to a connector array on the bottom surface of the LED array 212. The connector array can be any connector array, such as a copper pillar bump array. The LED array 212 can have a depth D2. In an embodiment, the depth D2 can be, for example, between 5 and 250 μm. The silicon backplane 214 can have a depth D3. In an embodiment, the depth D2 can be, for example, between 100 μm and 1 mm. The hybrid device 210 can also be referred to as a hybrid die.

[0045] Figure 2B To merge Figure 2A A cross-sectional view of an example LED package assembly 100 for an example hybrid device 210. Figure 2B In the example shown, the hybrid device 210 is encapsulated in a package substrate 102. The LED package assembly 100 can use flip-chip interconnects for one or more interconnects (as further described herein) and can be implemented in lighting systems, such as those having lamps (such as vehicle headlights and / or other lamps) and / or display systems (such as computer monitors, television displays and / or other displays).

[0046] Substrate 102 may include or be formed from a core material. For example, substrate 102 may be a high-density organic substrate, such as a glass-reinforced epoxy laminate substrate comprising FR-4 substrate material. Substrate 102 may include one or more conductive elements, such as conductive layers, traces, vias, pads, or some combination thereof (not shown). The conductive elements may be distributed within the core material and may provide conductivity through substrate 102 and / or provide coupling of other elements to the substrate. In some embodiments, substrate 102 may have a thickness 112 of approximately 1 mm (within 0.1 mm).

[0047] Substrate 102 may have a hole 104 formed in or through substrate 102 and a groove 106 extending into substrate 102. Hole 104 and groove 106 may be collectively referred to herein as an opening or cavity, wherein the hole and groove are referred to as first and second portions of the opening. Hole 104 may be located on a first side 108 of substrate 102. Groove 106 may extend from a second side 110 into substrate 102 and may abut the hole 104. Specifically, groove 106 may extend from the second side 110 and partially extend through substrate 102. Hole 104 may extend from the first side 108 of substrate 102 into groove 106, thereby connecting hole 104 to groove 106. Groove 106 may have a width 114, and hole 104 may have a width 116, wherein the width 114 of groove 106 is greater than the width 116 of hole 104. The substrate 102 may include an intermediate surface 118 located between a first or top surface 120 and a second or bottom surface 122 of the substrate 102. The intermediate surface 118 may abut and overhang the recess 106. In some embodiments, the intermediate surface 118 may be substantially (within 10 degrees) parallel to the first surface 120 and / or the second surface 122. The intermediate surface 118 may be approximately 500 μm (within 10 μm) from the first surface 120, wherein a portion of the substrate 102 located between the intermediate surface 118 and the first surface 120 may have a thickness 142 of approximately 500 μm (within 10 μm). Furthermore, the intermediate surface 118 may extend approximately 1.027 mm in length 144 (within 0.1 mm) from the side surface 146 of the recess 106. The intermediate surface 118 may be formed by the difference between the width 114 of the recess 106 and the width 116 of the hole 104.

[0048] Substrate 102 may include one or more pads 124 located on intermediate surface 118. Pads 124 may abut recess 106 and may be used to couple components to substrate 102 at intermediate surface 118. Pads 124 may be formed of conductive materials such as copper, silver, aluminum, alloys thereof, and / or combinations thereof and may be coupled to other conductive elements of the substrate. Thus, pads 124 can provide electrical coupling to components coupled to substrate 102 via pads 124.

[0049] The substrate 102 may further include one or more pads 126 located on the second surface 122 of the substrate 102. In some embodiments, the pads 126 may include a pad array. For example, in some embodiments, the pads 126 may include a pad grid array (LGA). In other embodiments, the pads 126 may include a ball grid array (BGA). The pads 126 may be used to electrically couple the substrate 102 to an external circuit board. In embodiments, the pads 126 may be coupled to other conductive elements of the substrate, the LED array 212, and / or the silicon backplane 214 to create electrical coupling between the external circuit board, electronic components provided on the substrate 102, the LED array 212, and / or the silicon backplane 214.

[0050] The LED package assembly 100 may further include one or more electronic components 128 mounted to a first surface 120 of the substrate 102. In some embodiments, the electronic component 128 may be a passive component, such as a resistor, capacitor, inductor, other passive component, or some combination thereof. In other embodiments, the electronic component 128 may include passive components, active components, or some combination thereof. The electronic component 128 may be coupled to one or more conductive elements of the substrate 102, and thereby also coupled to pads 126, silicon backplane 214, LED array 214, and / or one or more of other electronic components 128.

[0051] Hybrid device 210 can be coupled to substrate 102 and can be electrically coupled to one or more of electronic components 128 and pads 126 via conductive elements of substrate 102. Silicon backplane 214 can be coupled to substrate 102 via pads 124. Silicon backplane 214 can be partially or entirely located within recess 106. In some embodiments, silicon backplane 214 can have a thickness 140 of approximately 725 μm (within 10 micrometers (μm)) and silicon backplane 214 can extend beyond recess 106 beyond the second surface 122 of substrate 102 by approximately 325 μm (within 10 μm). In some embodiments, silicon backplane 214 can have a thickness between 300 μm and 750 μm. Furthermore, in some embodiments, the side surface 156 of silicon backplane 214 can be located approximately 500 μm (within 10 μm) from the side surface 146 of recess 106. The LED die 212 can be coupled to a first side 136 of the silicon backplane 214 and can be located between the first surface 120 of the substrate 102 and the silicon backplane 214. In some embodiments, the LED die 212 can be partially located within the hole 104.

[0052] LEDs or segments of LED array 212 can be guided through aperture 104, and light emitted by the LEDs or segments can be guided through aperture 104. In some embodiments, the edges of LED array 212 and the edges of the first surface 120 of substrate 102 adjacent to aperture 104 can be separated by a distance that allows light emitted by the LEDs of LED array 212 to be emitted at an angle 138 to the edges of LED array 212. In some embodiments, angle 138 can be approximately 45 degrees (within 10 degrees). In other embodiments, LED package assembly 100 can be designed to have different angles 138 at which light can be emitted from LED array 212.

[0053] The LED package assembly 100 may further include one or more flip-chip interconnects 148 that couple the hybrid device 210 to the substrate 102. Specifically, the flip-chip interconnects 148 may couple a silicon backplane 214 to pads 124 of the substrate 102. The flip-chip interconnects 148 may be or include one or more solder bump connectors, one or more copper pillar bump connectors, or combinations thereof. The flip-chip interconnects 148 may be conductive and may electrically couple the silicon backplane 214 to the substrate 102 to provide electrical coupling and / or signal exchange between the silicon backplane 214 and one or more of the electronic components 128 and pads 126 via conductive elements (not shown) in the substrate 102. In some embodiments, the flip-chip interconnects 148 may maintain a distance between the intermediate surface 118 and the first side 136 of the silicon backplane 214. For example, in some embodiments, the flip-chip interconnects 148 may have a thickness 150 of approximately 100 μm (within 10 μm). In addition, the flip-chip interconnect 148 may be located at a distance of approximately 340 μm (within 10 μm) from the side 154 of the via 104 and / or at a distance of approximately 0.187 μm (within 10 μm) from the side 156 of the silicon backplane 214 at a distance of 152.

[0054] Coupling the silicon backplane 214 to the pads 124 of the substrate 102 using flip-chip interconnects 148 can provide one or more advantages over other coupling methods. For example, flip-chip interconnects 148 can provide better thermal performance. Furthermore, flip-chip interconnects 148 can provide smaller pitch interconnects, which can allow for higher density interconnects. Additional advantages of using flip-chip interconnects 148 will be recognized by those skilled in the art.

[0055] The LED package assembly 100 may further include an underfill material 158 that may at least cover the flip-chip interconnects 148. For example, the underfill material 158 may surround each flip-chip interconnect 148 and prevent the flip-chip interconnects 148 from being exposed. In some embodiments, the underfill material 158 may be or include an electrically insulating material that can prevent short circuits between flip-chip interconnects 148 or between flip-chip interconnects 148 and other conductive elements. Furthermore, the underfill material 158 may provide physical support for the coupling between the silicon backplane 132 and the substrate 102. In some embodiments, the underfill material 158 may be omitted. In other embodiments, the underfill material 158 may cover more than... Figure 2B The larger surface area is shown, for example, by filling most of the empty space between the hybrid device 210 and the substrate 102.

[0056] LED package assembly 100 may include a circuit board 160. Circuit board 160 may be coupled to substrate 102 via pads 126. Board 160 may include circuitry that can provide control signaling and / or other data (such as image data) – which may be provided to hybrid device 210 – wherein the image data can affect the operation of LED array 212. Circuit board 160 may include an integrated heat sink 164. Integrated heat sink 164 may be or include a thermally conductive material, such as copper. Integrated heat sink 164 may be located near silicon backplane 214 and may be thermally coupled to a second side 162 of silicon backplane 214, opposite to the first side 136, and may provide cooling for silicon backplane 214. The direct coupling between silicon backplane 214 and integrated heat sink 164 allows for better heat dissipation of hybrid device 210 and also allows for heat dissipation through the bottom surface of hybrid device 210 rather than through the top surface, enabling effective heat dissipation without obstructing light emission from LED array 212.

[0057] Figure 2C According to some embodiments Figure 2A and Figure 2B A top view of an example hybrid device 210. Figure 2C In the example shown, the hybrid device 210 includes an LED array 212 and a silicon backplane 214. The silicon backplane 210 may be coupled to the LED array 212, such as through one or more interconnects, such as solder bump connectors and / or copper pillar bump connectors.

[0058] If possible Figure 2CAs seen, the coverage area of ​​the silicon backplane 214 can be larger than the coverage area of ​​the LED array 212, thereby allowing a portion of the silicon backplane 214 to extend beyond the coverage area of ​​the LED array 212. The silicon backplane 214 may include one or more pads 206. The pads 206 may be located on the portion of the silicon backplane 214 extending beyond the coverage area of ​​the LED array 212 and on the surface of the silicon backplane 214. The pads 206 can be coupled to circuitry within the silicon backplane 214 and can be used to couple components to the silicon backplane 214. For example, a flip-chip interconnect 148 can be coupled to the pads 206 and can be used to couple the substrate 102 to the silicon backplane 214.

[0059] Figure 3 This is a flowchart of an example method 300 for manufacturing an LED package assembly. For example, step 300 can be used to manufacture an LED package assembly 100.

[0060] Method 300 can begin with a substrate. For example, Figure 4 According to some embodiments, it can be used for Figure 3 The method 300 is an example cross-sectional view of a substrate 400. Substrate 400 may include one or more features of substrate 102. For example, substrate 400 may include one or more pads 402 located on a second surface 404 of the substrate, wherein the pads 402 include one or more features of pad 126. Furthermore, substrate 400 may include one or more pads 406, wherein the pads 406 include one or more features of pad 124. When method 300 begins, the pads 406 may be embedded within substrate 400. Substrate 400 may have been fabricated using a substrate fabrication process such as a multilayer process.

[0061] A groove (302) can be formed in the substrate. In an embodiment, the groove can be formed via a machine cutting process (such as a wiring process). Specifically, the machine cutting process can be applied to the surface of the substrate to remove a portion of material from the substrate, thereby forming the groove. The groove formed by the machine cutting process can extend from the surface of the substrate into the substrate, reaching one or more pads embedded within the substrate, wherein the machine cutting process exposes the pads.

[0062] Figure 5 According to Figure 3The method described is a cross-sectional view of an example product 500 manufactured by forming a groove in a substrate. The groove 502 may have been formed in the substrate 400 via a mechanical cutting process 302. The groove 502 may include one or more features of the groove 106. The mechanical cutting process may be applied to a second surface 404 of the substrate 400 to create the groove 502. The machine cutting process may be applied to a portion of the second surface 404 located between pads 402. The groove 502 may extend from the second surface 404 of the substrate 400 into the substrate 400, reaching the pads 406 and thus exposing the pads 406. Furthermore, forming the groove 502 may create an intermediate surface 504 of the substrate 400, wherein the intermediate surface 504 includes one or more features of the intermediate surface 118. For example, the pads 406 may be located at the intermediate surface 504 and may be exposed to the groove 502.

[0063] A hole (304) can be formed in the substrate. This hole can be formed via a mechanical cutting process (such as a wiring process). Specifically, the mechanical cutting process can be applied to the surface of the substrate to remove a portion of material from the substrate, thereby forming a hole through the substrate. The formed hole can extend from a groove formed on the surface of the substrate, located on the side of the substrate opposite to the groove.

[0064] Figure 6 According to Figure 3 The method described is a cross-sectional view of an example product 600 manufactured by forming holes in a substrate. Holes 602 may have been formed through the substrate 400 via a machine cutting process at stage 304. Hole 602 may include one or more features of hole 104. The machine cutting process may have been applied to the intermediate surface 504 or the first surface 604 of the substrate 400 to create hole 602. The machine cutting process for forming hole 602 may utilize a narrower tool than the machine cutting process for forming groove 502, resulting in hole 602 having a narrower width than groove 502. Hole 602 may extend from intermediate surface 504 through the substrate 400 to the first surface 604. Hole 602 may be located between pads 406 of the substrate 400.

[0065] Although Figure 3 In the illustrated example method, the groove 502 is shown to be formed prior to the formation of the hole 602; however, it should be understood that the order may be reversed in other embodiments. Specifically, in other embodiments, the hole 602 may be formed prior to the groove 502. The hole 602 may be formed through the substrate 400 from the first surface 604 to the second surface 404. The groove 502 may be formed from the second surface 404 after the hole 602 has been formed in the substrate 400.

[0066] The hybrid device can be positioned within a recess (306). For example, the silicon backplane of the hybrid device can be located within a recess in the substrate, with the LED array of the hybrid device pointing toward a hole in the substrate. When located within a recess, the silicon backplane can be partially or entirely located within the recess. Furthermore, the LED array can be located within the recess and / or partially within the hole. The LED array can be located between the silicon backplane and a first surface of the substrate. The LED array can be coupled to a surface of the silicon backplane. The silicon backplane can be aligned with pads of the substrate located at an intermediate surface adjacent to the recess, such that the silicon backplane can be coupled to the pads via flip-chip interconnects.

[0067] Figure 7 According to Figure 3 A cross-sectional view of an example product 700 manufactured by positioning a hybrid device within a substrate. Figure 7 In the example shown, the hybrid device 702 is located in a recess 502 of the substrate 400. The hybrid device 702 may include one or more features of an integrated LED 130. A silicon backplane 704 of the hybrid device 702 may be located within the recess 502. For example, the silicon backplane 704 may be partially or entirely located within the recess 502. In some embodiments, a portion of the silicon backplane 704 may extend beyond the second surface 404 and protrude from the recess 502. An LED array 706 of the hybrid device 702 may be coupled to the silicon backplane 704 and may point towards the aperture 602. The LED array 706 may be located within the recess 502 and / or may be partially located within the aperture 602. The LED array 706 may be located between the silicon backplane 704 and the first surface 604. The silicon backplane 704 may be aligned with a pad 406 of the substrate 400 such that the silicon backplane 704 can be coupled to the pad via a flip-chip interconnect. In particular, portions of the silicon backplane 704 may be located near the intermediate surface 504 where the pad 406 is located.

[0068] The hybrid device can be coupled to the substrate (308) via one or more flip-chip interconnects. For example, the flip-chip interconnect can be formed between a pad on the middle surface of the substrate and a silicon backplane for integrating the LED. The flip-chip interconnect can electrically couple the hybrid device and the substrate. The flip-chip interconnect can include solder bump connectors or copper pillar bump connectors. In some embodiments, the flip-chip interconnect can be formed using a waveflow process.

[0069] Figure 8 According to Figure 3This is a cross-sectional view of an example product 800 manufactured by coupling a hybrid device to a substrate via one or more flip-chip interconnects. One or more flip-chip interconnects 802 may be formed between the hybrid device 702 and the substrate 400. The flip-chip interconnect 802 may include one or more features of the flip-chip interconnect 148. The flip-chip interconnect 802 may be formed between a silicon backplane 704 and pads 406 at an intermediate surface 504 of the substrate 400. The flip-chip interconnect 802 may electrically couple the silicon backplane 704 to the pads 406 and may provide signal exchange between the hybrid device 702 and the substrate 400. The flip-chip interconnect 802 may include solder bump connectors or copper bump connectors.

[0070] An underfill material (310) can be formed around the flip-chip interconnect. The underfill material can surround the flip-chip interconnect and prevent it from being exposed. The underfill material can provide electrical insulation around the flip-chip interconnect, thereby preventing electrical short circuits between the flip-chip interconnect and / or other electrical components of the LED package assembly. The underfill material can further provide physical support for the flip-chip interconnect, thereby helping to maintain the physical coupling between the substrate and the integrated LED.

[0071] Figure 9 According to Figure 3 The method described is illustrated in a cross-sectional view of an example product 900 manufactured by forming an underfill material around a flip-chip interconnect. An underfill material 902 may be formed around the flip-chip interconnect 802. The underfill material 902 may include one or more features of the underfill material 158. The underfill material 902 may surround each flip-chip interconnect 802, thereby preventing the flip-chip interconnect 802 from being exposed. For example, the underfill material 902 may surround each flip-chip interconnect 802. The underfill material 902 may include an electrically insulating material that prevents short circuits between the flip-chip interconnect 802 and / or other electrical components of the LED package assembly. The underfill material 902 may extend between the substrate 400 and the hybrid device 702 and may physically couple the substrate 400 and the hybrid device 702. The underfill material 902 may provide physical support between the substrate 400 and the hybrid device 702. In particular, the underfill material 902 may help maintain the physical coupling between the substrate 400 and the hybrid device. In other embodiments, the bottom filler material 902 may be omitted, and the stage 310 for generating the bottom filler material 902 may be omitted.

[0072] The electronic component may be coupled to the substrate (312). For example, the electronic component may be coupled to a first surface of the substrate. The electronic component may be or include passive components, active components, or some combination thereof.

[0073] Figure 10According to Figure 3 The method described is a cross-sectional view of an example product 1000 manufactured by coupling electronic components to a substrate. One or more electronic components 1002 may be coupled to a first surface 604 of the substrate 400. Electronic component 1002 may include one or more features of electronic component 128. Electronic component 1002 may be electrically coupled to the substrate 400, thereby allowing signals to be exchanged between the electronic component and the substrate. In other embodiments, electronic component 1002 may be omitted, and the stage 312 of coupling electronic component 1002 to substrate 400 may be omitted.

[0074] The circuit board can be coupled to a substrate (314). Specifically, the circuit board can be coupled to pads on the substrate, wherein the pads are located on a second surface of the substrate. The coupling of the circuit board to the pads on the substrate can maintain the position of the circuit board and provide electrical coupling between the circuit board and the substrate. The circuit board may include an integrated heat sink. The integrated heat sink may be located near a silicon backplane and may be thermally coupled to the silicon backplane. In some embodiments, coupling the circuit board to the substrate may include applying a heat transfer compound between the silicon backplane and the integrated heat sink.

[0075] Figure 11 According to Figure 3 The method described is a cross-sectional view of an example product 1100 manufactured by coupling a circuit board to a substrate. Specifically, according to some embodiments, product 1100 may be a complete LED package assembly. Circuit board 1102 may be coupled to substrate 400. Circuit board 1102 may include one or more features of circuit board 160. Specifically, circuit board 1102 may be coupled to pads 402 of substrate 400. The coupling of circuit board 1102 to pads 402 may maintain the position of circuit board 1102 and provide electrical coupling between circuit board 1102 and substrate 400. Furthermore, substrate 400 may provide electrical coupling between circuit board 1102 and hybrid device 702. Circuit board 1102 may include an integrated heat sink 1106. Integrated heat sink 1106 may be positioned against a surface 1104 of silicon backplane 704, the surface 1104 of which is on the side of silicon backplane 704 opposite to hybrid device 706. The integrated heat sink 1106 can be thermally coupled to the silicon backplane 704 and can facilitate cooling of the hybrid device 702. In some embodiments, a heat transfer compound can be applied between the integrated heat sink 1106 and the silicon backplane 704 to facilitate heat transfer between the integrated heat sink 1106 and the hybrid device 702. In some embodiments, the integrated heat sink 1106 can be omitted from the circuit board 1102.

[0076] Figure 12This is a block diagram of an example system 1200 including an LED package assembly 1202. For example, system 1200 may include a lighting system or a display system that may utilize the LED package assembly 1202 to provide lighting and / or display. In some embodiments, system 1200 may be or include headlights for a vehicle, lamps, handheld devices (such as smartphones, smartwatches, and / or electronic notebooks), displays for a system (such as computer monitors and / or television displays), or some combination thereof. While components of system 1200 are shown, it should be understood that in some embodiments, system 1200 may include additional and / or alternative components that perform the functions of said components.

[0077] System 1200 may include controller 1204. Controller 1204 may determine an image to be displayed by the LEDs of LED package assembly 1202. For example, controller 1204 may include or be coupled to a processor that may instruct the image to be displayed by the LEDs or segments. The image may be a user interface, an arrangement of light, light intensity, one or more symbols to be displayed by the LEDs, or some combination thereof. Controller 1204 may generate image data indicative of the image to be displayed by the LEDs and may provide the image data to components of system 1200. The image data may be or include signals indicative of the image to be generated by the LEDs.

[0078] System 1200 may include LED package assembly 1202. LED package assembly 1202 may include one or more features of LED package assembly 100. For example, LED package assembly 1202 may include a substrate (such as substrate 102) wherein hybrid device 1206 is coupled to the substrate via one or more flip-chip interconnects (such as flip-chip interconnect 148). Hybrid device 1206 may include one or more features of hybrid device 210. For example, hybrid device 1206 may include a silicon backplane 1208 and LED array 1210, wherein silicon backplane 1208 may include one or more features of silicon backplane 214, and LED array 1210 may include one or more features of LED array 212. LED array 1210 may include one or more LEDs, μLEDs, and / or segments that provide light and / or display for system 1200.

[0079] The silicon backplane 1208 may include a controller 1212. The controller 1212 may be coupled to the controller 1204 and may receive image data from the controller 1204. The controller 1212 may determine the image to be displayed by the LEDs of the LED array 1210 based on the image data received from the controller 1204. The controller 1212 may determine the actions to be taken by the LED devices 1210 and the LEDs or segments of the LED array 1210 to generate the image, and may cause the LED devices 1210 and the LEDs or segments of the LED array 1210 to take actions. For example, the controller 1212 may determine when each LED or segment of the LED array 1210 is turned on to generate the image, and may cause the LEDs or segments to be turned on (e.g., by activating a corresponding switch of the silicon backplane 2108 so that the LEDs or segments are turned on according to the time when the LEDs or segments are turned on). Furthermore, the controller 1212 may determine the intensity and / or color of the light to be emitted by the LEDs, and may cause the LEDs to emit the determined intensity and / or color of the light.

[0080] Figure 13 This is a block diagram of another example system 1300. In some embodiments, system 1300 may be or include part of a vehicle headlight system. For example, in some embodiments, system 1300 may be or include an active headlight system, wherein the intensity and / or image of the light output by system 1300 may be varied. System 1300 or a portion thereof may be located in a vehicle, in the vehicle's headlights, or some combination thereof. System 1300 may implement a pixelated configuration possible via an LED array.

[0081] System 1300 may be coupled to vehicle bus 1302 and power supply 1304. Power supply 1304 may supply power to system 1300. Bus 1302 may be coupled to one or more components that can provide data and / or utilize data provided to system 1300. The data provided on bus 1302 may relate to environmental conditions around the vehicle (such as time of day, whether it is raining, whether there is fog, ambient light level, and other environmental data), vehicle conditions (such as whether the vehicle is parked, whether the vehicle is moving, the vehicle's current speed, and the vehicle's current direction of travel), and / or the presence / position of other vehicles or pedestrians around the vehicle. System 1300 may provide feedback (such as information about system operation) to components.

[0082] System 1300 may further include sensor module 1306. In some embodiments, sensor module 1306 may include one or more sensors capable of sensing the environment surrounding the vehicle. For example, one or more sensors may sense the surrounding environment that can affect the image produced by light emitted by system 1300. In some embodiments, the sensors may sense environmental conditions around the vehicle, and / or the presence / location of other vehicles or pedestrians around the vehicle. Sensor module 1306 may operate in combination with data provided on bus 1302, or may operate in lieu of a portion of the data (such as environmental conditions, and / or the presence / location of other vehicles or pedestrians) provided on bus 1302. Sensor module 1306 may output data indicating what the sensors have sensed.

[0083] System 1300 may further include transceiver 1308. In some embodiments, transceiver 1308 may have a Universal Asynchronous Receiver / Transmitter (UART) interface or a Serial Peripheral Interface (SPI). Transceiver 1308 may be coupled to bus 1302 and sensor module 1306, and may receive data from bus 1302 and sensor module 1306. In some embodiments, transceiver 1308 may multiplex data received from bus 1302 and sensor module 1306, and may direct feedback to bus 1302 or sensor module 1306.

[0084] System 1300 may further include processor 1310. Processor 1310 may be coupled to and exchange data with transceiver 1308. For example, processor 1310 may receive data from transceiver 1308 provided by bus 1302 and / or sensor module 1306. Processor 1310 may generate image data indicating an image produced by light emitted by system 1300. Processor 1310 may also generate one or more queries requesting information from one or more components of the system. Processor 1310 may also provide feedback to transceiver 1308 to be directed to bus 1302 or sensor module 1306.

[0085] System 1300 may further include a headlight 1312 for the vehicle. In some embodiments, the headlight 1312 may be or include an active headlight, wherein the active headlight can produce multiple different light outputs. The headlight 1312 may include a lighting system 1314. The lighting system 1314 may include an LED package assembly, such as LED package assembly 100 or a portion thereof. For example, in some embodiments, the lighting system 1314 may include a substrate 102 and a hybrid device 210. The headlight 1312 may be coupled to and can exchange data with the processor 1310. In particular, the lighting system 1314 may be coupled to and can exchange data with the processor 1310. The lighting system 1314 may receive image data and queries from the processor 1310 and may provide feedback to the processor 1310.

[0086] System 1300 may further include power protection 1316. Power protection 1316 may be coupled to power supply 1304 and may receive power from power supply. Power protection 1316 may include one or more filters that can reduce conducted emissions and provide power immunity. In some embodiments, power protection 1316 may provide electrostatic discharge (ESD) protection, load dump protection, alternator field attenuation protection, reverse polarity protection, or some combination thereof.

[0087] System 1300 may further include a processor power supply 1318. Processor power supply 1318 may be coupled to power protection 1316 and may receive power from power supply 1304. Processor power supply 1318 may include a low-dropout (LDO) regulator that can generate power from the power supplied by power supply 1304 to power processor 1310. Processor power supply 1318 may be further coupled to processor 1310 and may supply power to processor 1310.

[0088] System 1300 may further include a power supply 1320. Power supply 1320 may be coupled to power protection 1316 and may receive power from power supply 1304. In some embodiments, power supply 1320 may include a converter that converts power from power supply 1304 into power for headlamp 1312. For example, power supply 1320 may include a DC-to-DC converter that converts power from power supply 1320 from a first voltage to a second voltage for lighting system 1314 of headlamp 1312.

[0089] Figure 14 This is a block diagram of another example lighting system 1400 according to some embodiments. For example, Figure 13System 1300 may include one or more features of lighting system 1400. Lighting system 1400 may be used in headlamps (such as...) Figure 13 The headlamp (1312) is implemented.

[0090] The lighting system 1400 may include a control unit 1402. The control unit 1402 may be coupled to a processor, such as... Figure 13 The processor 1310. The control unit 1402 can receive image data and perform queries from the processor. The control unit 1402 can also provide feedback to the processor.

[0091] The controller 1402 may include a digital interface 1404. The digital interface 1404 facilitates communication with a processor and other components within the lighting system 1400. For example, in some embodiments, the digital interface 1404 may be or include an SPI interface, where the SPI interface facilitates communication.

[0092] The control unit 1402 may further include an image processor 1406. The image processor 1406 may receive image data via a digital interface 1404 and may process the image data to generate indications of pulse width modulation (PWM) duty cycle and / or light intensity for causing the lighting system 1400 to produce an image indicated by the image data.

[0093] The control unit 1402 may further include a frame buffer 1408 and a spare image storage 1410. The frame buffer 1408 may receive indications generated by the image processor 1406 and store indications for implementation. The spare image storage 1410 may further store indications of PWM duty cycle and / or light intensity. Indications stored in the spare image storage 1410 can be implemented without indications stored in the frame buffer 1408. For example, when the frame buffer 1408 is empty, the frame buffer 1408 can retrieve indications from the spare image storage 1410.

[0094] The controller 1402 may further include a PWM generator 1412. The PWM generator 1412 may receive an instruction from the frame buffer 1408 and may generate a PWM signal according to the instruction. The PWM generator 1412 may also determine the intensity of light based on the instruction and generate a signal to cause the intensity of light to be generated.

[0095] The lighting system 1400 may include a μLED array 1414. The μLED array 1414 may include multiple pixels, each pixel including a pixel unit 1416. Specifically, the pixel unit 1416 may include an LED 1418, a PWM switch 1420, and a current source 1422. The pixel unit 1416 may receive signals from a PWM generator 1412. The PWM signal from the PWM generator 1412 can cause the PWM switch 1420 to turn on and off according to the value of the PWM signal. A signal corresponding to the light intensity can cause the current source 1422 to generate current, thereby causing the LED 1418 to produce a corresponding light intensity.

[0096] The lighting system 1400 may further include an LED power supply 1424. The LED power supply 1424 may be coupled to... Figure 13 The power supply 1320 can be used to supply power to the LEDs of the μLED array 1414, and power can be received from the power supply 1320. The LED power supply 1424 can generate power for the LEDs of the μLED array 1414. The LED power supply 1424 can be coupled to the μLED array 1414 and can supply power to the μLED array 1414 for the LEDs.

[0097] Figure 15 It is based on some embodiments for implementation. Figure 13 Example hardware arrangement 1500 for system 1300. In particular, hardware arrangement 1500 may show hardware components that can implement system 1300.

[0098] Hardware arrangement 1500 may include LED packaging assembly 1512. LED packaging assembly 1512 may have been... Figure 3 Method 300 manufactures the LED package assembly 1512. Figure 1 The LED package assembly 1512 may include one or more features of the LED package assembly 100. For example, the LED package assembly 1512 may include a hybrid device 1508 having a silicon backplane 1504 and an LED array 1502. The LED array 1502 may be coupled to the silicon backplane via one or more interconnects 1510, wherein the interconnects 1510 may provide signal transmission between the LED die 1502 and the silicon backplane 1504. The interconnects 1510 may include one or more solder bump connectors, one or more copper pillar bump connectors, or some combination thereof.

[0099] LED array 1502 may also include implementation Figure 14The circuitry of the μLED array 1414. Specifically, the LED array 1502 may include multiple pixels of the μLED array 1414. The LED array 1502 may include a shared active layer and a shared substrate for the μLED array 1414, thus having the μLED array 1414 as a monolithic LED array. Each pixel of the μLED array 1414 may include a separate segmented active layer and / or substrate. Therefore, the LED array 1502 may be a monolithic die with a segmented surface, wherein a corresponding pixel of the μLED array 1414 occupies each segment of that surface. In some embodiments, the LED array 1502 may further include a PWM switch and a current source for the μLED array 1414. In other embodiments, the PWM switch and current source may be included in a silicon backplane 1504.

[0100] Silicon backplane 1504 may include implementations Figure 14 Controller 1402 and Figure 14 The circuitry provides power to the LED array 1424. The silicon backplane 1504 can use interconnect 1510 to provide PWM and intensity signals to the μLED array 1414, so that the μLED array 1414 generates light according to the PWM signals and intensity.

[0101] The LED package assembly 1512 may further include a substrate 1516. The substrate 1516 may be coupled to a silicon backplane 1504 via one or more flip-chip interconnects 1518. The flip-chip interconnects 1518 may include one or more features of flip-chip interconnects 148.

[0102] The hardware arrangement 1500 may further include a circuit board 1506. The circuit board 1506 may include... Figure 1 The circuit board 160 may include one or more features. The circuit board 1506 may include implementations of Figure 13 Power protection 1316 Figure 13 Power supply 1320, Figure 13 Processor power supply 1318, Figure 13 Sensor module 1306, Figure 13 Transceiver 1308 Figure 13 The processor 1310, or a portion thereof, is a circuit. A circuit board 1506 may be coupled to a substrate 1516, whereby the substrate 1516 facilitates communication between the circuit board 1506 and the hybrid device 1508. For example, in the illustrated embodiment, the circuit board 1506 may be coupled to the substrate 1516 via pads 1520. The circuit board 1506 and the silicon backplane 1504 may exchange image data, power and / or feedback, and other signals via coupling through the substrate 1516.

[0103] The embodiments have been described in detail, and those skilled in the art will appreciate that, given this description, modifications can be made to the embodiments described herein without departing from the spirit of the inventive concept. Therefore, it is intended that the scope of the invention be limited to the specific embodiments illustrated and described.

Claims

1. An LED packaging assembly, comprising: A substrate including a top surface, a bottom surface, and an opening formed through the substrate, the opening including a first portion adjacent to the top surface and a second portion adjacent to the bottom surface, the second portion being wider than the first portion, such that portions of the substrate are suspended above the second portion of the opening; Multiple pads on the bottom surface of each portion of the substrate, which is suspended above the second portion of the opening; as well as The mixing device in the opening, the mixing device comprising: A silicon backplane includes a top surface, a bottom surface, and a plurality of interconnects on the top surface of the silicon backplane, the silicon backplane being an integrated circuit die, the plurality of interconnects being electrically coupled to a plurality of pads and having a thickness maintaining a predetermined distance between the bottom surface of a portion of a substrate suspended above a second portion of the opening and the top surface of the hybrid device. An LED array is located on the top surface of the silicon backplane.

2. The LED packaging assembly of claim 1, wherein the plurality of interconnects comprises at least one of solder bump connectors or copper pillar bump connectors.

3. The LED packaging assembly of claim 1, wherein the LED array is between the top surface of the substrate and the silicon backplane.

4. The LED packaging assembly of claim 1, wherein the entire silicon backplane is located within the second portion of the opening.

5. The LED packaging assembly of claim 1, wherein a portion of the LED array is within the first portion of the opening such that the top surface of the LED array is lower than the top surface of the substrate, and the outer edge of the LED array is spaced apart from the inner edge of the substrate adjacent to the first portion of the opening in the substrate, such that light is emitted at a predetermined angle.

6. The LED packaging assembly according to claim 5, wherein the predetermined angle is 45°.

7. The LED packaging assembly according to claim 1 further includes a heat sink thermally coupled to the bottom surface of the silicon backplane.

8. The LED packaging assembly according to claim 1, wherein the LED array is a monolithic array comprising multiple light-emitting segments.

9. The LED packaging assembly according to claim 1, wherein the predetermined distance is 100 μm.

10. The LED packaging assembly of claim 1 further includes a plurality of contact pads on the bottom surface of the substrate and configured to electrically couple at least one of a silicon backplane, an LED array, or a passive component on the top surface of the substrate to an external control board.

11. A vehicle headlight system, comprising: LED packaging components, which include: A substrate having a top surface, a bottom surface, and a cavity. An integrated circuit die, coupled to the substrate via one or more flip-chip interconnects, the integrated circuit die being at least partially disposed within the cavity. An LED array coupled to the integrated circuit die, the LED array being at least partially disposed between the integrated circuit die and a surface of a substrate positioned opposite to the integrated circuit die, and Multiple contact pads are located on the bottom surface of the substrate and configured to electrically couple at least one of an integrated circuit die, LED array, or passive component on the top surface of the substrate to an external control board; and A circuit board coupled to the LED package assembly, the circuit board including a processor configured to provide image data to the LED package assembly, the image data indicating an image to be displayed by the LED package assembly.

12. The vehicle headlight system according to claim 11, wherein: The one or more flip-chip interconnects include one or more solder bump connectors or one or more copper pillar bump connectors, the one or more flip-chip interconnects electrically couple the integrated circuit die to one or more pads of the substrate, the one or more flip-chip interconnects having a thickness that maintains a predetermined distance between the bottom surface of each portion of the substrate that is suspended above the top surface of the integrated circuit die and the one or more pads adjacent to the cavity.

13. The vehicle headlight system of claim 11, wherein the cavity has a first portion extending from a first surface of the substrate and a second portion extending from a second surface of the substrate into the substrate, the second surface being on the side of the substrate opposite to the first surface, the second portion of the cavity being wider than the first portion of the cavity, and the LED array being between the first surface and the integrated circuit die.

14. The vehicle headlight system of claim 11, wherein the thickness of the integrated circuit die is between 300 micrometers and 750 micrometers.

15. The vehicle headlight system according to claim 11, wherein: The integrated circuit die includes a controller, the LED array includes one or more LEDs coupled to the controller, and the controller is configured to cause the one or more LEDs to display an image indicated by the image data.

16. The vehicle headlight system of claim 11, wherein the circuit board includes an integrated heat sink in contact with the bottom surface of the integrated circuit die.

17. A method for manufacturing an LED encapsulation assembly, the method comprising: A hole is formed in the substrate via the top surface of the substrate; A groove is formed in the substrate via the bottom surface of the substrate, such that portions of the substrate adjacent to the hole are suspended above the groove and form an intermediate surface of the substrate; The mixing device is placed at least partially within the groove; as well as The hybrid device is coupled to the intermediate surface via one or more flip-chip interconnects, the flip-chip interconnects having a thickness that maintains a predetermined distance between the intermediate surface of the substrate and the top surface of the hybrid device. The hybrid device includes a silicon backplane that is an integrated circuit die and an LED array coupled to the silicon backplane.

18. The method of claim 17, wherein coupling the hybrid device to the intermediate surface comprises: The silicon backplane is at least partially positioned within the groove; The LED array is positioned at least partially within the aperture; as well as One or more flip-chip interconnects are formed between the silicon backplane and the intermediate surface.

19. The method of claim 17, wherein: Forming the recess within the substrate includes removing a portion of the substrate via a machine dicing process, which exposes one or more pads on the intermediate surface, and the one or more flip-chip interconnects couple the silicon backplane to the one or more pads.

20. The method of claim 17, wherein forming the hole in the substrate comprises removing a portion of the substrate via a mechanical cutting process to form the hole.

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