Information acquisition system and information acquisition method

Abstract

The present invention relates to an information acquisition system and an information acquisition method. A member located in the vicinity of a substrate handled by a substrate processing apparatus is prevented from being arranged at an inappropriate position to cause a processing failure. An information acquisition system is constituted for acquiring information related to a substrate processing apparatus that processes a substrate held by a substrate holding section, wherein the information acquisition system is constituted to include: a base body held by the substrate holding section in place of the substrate; interference detection sections each including one end side fixed with respect to the base body and the other end side movable with respect to the base body; and a signal acquisition section for acquiring a signal that varies in accordance with a deformation of the interference detection sections caused by an interference of a periphery of the base body with a detection target member.

Description

Technical Field

[0001] This disclosure relates to information acquisition systems and methods. Background Technology

[0002] In the semiconductor device manufacturing process, semiconductor wafers (hereinafter referred to as wafers) are transported to a substrate processing apparatus in a stored state to undergo processing. Examples of such processing include liquid processing such as forming a coating film by supplying a coating solution and developing a wafer. During this liquid processing, the processing solution is supplied to the wafer housed in a cup from a nozzle. Patent Document 1 describes a developing apparatus including a cup having an annular protrusion opposite to the lower surface of the wafer.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-13932 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] The purpose of this disclosure is to prevent components located near the substrate being processed by the substrate processing apparatus from being improperly positioned, which could lead to processing defects.

[0008] Solution for solving the problem

[0009] The information acquisition system disclosed herein is used to acquire information related to a substrate processing apparatus for processing a substrate held in a substrate holding portion, wherein...

[0010] The information acquisition system includes:

[0011] A base body, which is held by the substrate holding portion in place of the substrate;

[0012] Interference detection unit, comprising a fixed end side relative to the base body and a movable end side relative to the base body; and

[0013] The signal acquisition unit is used to acquire signals that vary according to the deformation of the interference detection unit caused by interference with the detection target member around the base.

[0014] The effects of the invention

[0015] This disclosure can prevent components located near the substrate being processed by the substrate processing apparatus from being improperly positioned, which could lead to processing defects. Attached Figure Description

[0016] Figure 1This is a top view of the substrate processing apparatus of the information acquisition system constituting an embodiment of the present disclosure.

[0017] Figure 2 This is a longitudinal sectional front view of the resist film forming assembly included in the substrate processing apparatus.

[0018] Figure 3 This is a top view of the resist film forming assembly.

[0019] Figure 4 This is an explanatory diagram showing the inspection wafer and computing device that constitute the information acquisition system.

[0020] Figure 5 This is a longitudinal sectional side view of the wafer used for inspection.

[0021] Figure 6 This is a top view of the wafer used for inspection.

[0022] Figure 7 This is a three-dimensional view of the wafer used for inspection.

[0023] Figure 8 This is an explanatory diagram showing the operation of the first beam-shaped body located on the inspection wafer.

[0024] Figure 9 This is an explanatory diagram showing the operation of the second beam-shaped body located on the inspection wafer.

[0025] Figure 10 This is an explanatory diagram showing an example of a detection signal obtained from the inspection wafer.

[0026] Figure 11 This is an explanatory diagram showing an image of a ring-shaped protrusion captured by a camera.

[0027] Figure 12 This is an explanatory diagram showing an image of a nozzle captured by a camera. Detailed Implementation

[0028] (First Embodiment)

[0029] exist Figure 1 An information acquisition system 1 according to an embodiment of the present disclosure is shown. The information acquisition system 1 includes a substrate processing apparatus 2, an inspection wafer 6, and a computing unit 9. First, an outline of the components constituting the information acquisition system 1 will be described. The substrate processing apparatus 2 described above transports a circular substrate, i.e., a wafer W, between processing components using a transport mechanism and performs processing. This processing includes supplying a resist to the wafer W stored in a cup 4 in a resist forming processing component to form the resist film.

[0030] The inspection wafer 6, replacing the wafer W, is transported to the processing assembly (resist film forming assembly 3) using the aforementioned transport mechanism. The inspection wafer 6 is equipped with an interference detection unit. The detection signal output from the inspection wafer 6 varies depending on whether the interference detection unit interferes with the structural members of the cup 4, namely the annular protrusion 46 and / or the nozzle 51B. This detection signal is wirelessly transmitted to the computing device 9, and its waveform is displayed on the display unit 95 included in the computing device 9. This allows for inspection of whether the annular protrusion 46 and / or the nozzle 51B are properly positioned during the processing of the wafer W. Furthermore, the nozzle 51B is an EBR (Edge Bead Removal) nozzle. EBR is a process that specifically removes the portion of the film (in this embodiment, a resist film) formed on the entire surface of the wafer W by solvent ejected from the nozzle, covering the periphery of the wafer W.

[0031] Furthermore, the inspection wafer 6 is also equipped with imaging units, namely cameras 81 and 82, which respectively capture image data of the annular protrusion 46 and the nozzle 51B. The information acquisition system 1 can acquire, based on the image data, the distance between the wafer W and the annular protrusion 46 (H0, described later) and the distance between the wafer W and the EBR nozzle 51B (H1, described later). The method for acquiring the above-described distances is described in the second embodiment, but a portion of the structure of the system used to acquire these distances is described in the description of this first embodiment.

[0032] The substrate processing apparatus 2 will now be described in detail. The substrate processing apparatus 2 includes a carrier module D1 and a processing module D2. The carrier module D1 and processing module D2 are arranged side-by-side and connected to each other. The wafer W, stored in a transport container, i.e., a carrier C, is transported to the carrier module D1 using a transport mechanism for the carrier C (not shown). The carrier module D1 includes a stage 21 for holding the carrier C. Furthermore, the carrier module D1 is provided with an opening / closing part 22 and a transport mechanism 23. The opening / closing part 22 is used to open and close a transport port formed on the side wall of the carrier module D1. The transport mechanism 23 transports the wafer W relative to the carrier C on the stage 21 via the aforementioned transport port.

[0033] Processing module D2 includes a wafer W transport path 24 extending in a left-right direction and a transport mechanism 25 disposed on the transport path 24. The wafer W is transported between the carrier C and various processing components disposed in processing module D2 using the transport mechanism 25 and the aforementioned transport mechanism 23. Multiple processing components are arranged left-right on both the front and rear sides of the transport path 24. The rear-side processing component is a heating component 26, which performs a heating process to remove solvent from the resist film. The front-side processing component is a resist film forming component 3. Furthermore, a transfer component TRS for temporarily placing the wafer W is provided on the transport path 24 near the carrier module D1. The wafer W is transferred between the carrier module D1 and processing module D2 using this transfer component TRS.

[0034] Next, refer to Figure 2 Longitudinal section front view and Figure 3 The top view of the resist forming assembly 3 is used for illustration. The resist forming assembly 3 includes a substrate holding portion, namely a rotary chuck 31, which holds the center of the back side of the wafer W horizontally. The rotary chuck 31 is connected to a rotation mechanism 33 via a shaft 32 extending in the vertical direction, which rotates the wafer W held in the rotary chuck 31 about the vertical axis. In addition, a circular baffle 34 surrounding the shaft 32 is provided, and three lifting pins 35 extending in the vertical direction through the baffle 34 are provided (in Figure 2 (Only two are shown in the image). The lifting mechanism 36 is used to raise and lower the lifting pin 35, and the wafer W is transferred between the rotating chuck 31 and the transport mechanism 25 described above.

[0035] A circular cup 4 is provided from the lower side to the side of the periphery of the wafer W held in the rotating chuck 31, surrounding the wafer W. The cup 4 includes a cup body 41, a lower guide portion 42, a middle guide portion 43, and an upper guide portion 44. The cup body 41 is formed as an annular recess along the circumference of the wafer W to receive processing liquids (resist and solvent) falling or splashing from the wafer W. The portions constituting the cup body 41 are shown as an outer cylindrical portion 41A, a bottom body 41B, and an inner cylindrical portion 41C. The outer cylindrical portion 41A and the inner cylindrical portion 41C are upright cylindrical members that form the sidewalls of the aforementioned annular recess. The bottom body 41B is a horizontal annular plate connecting the lower end of the outer cylindrical portion 41A and the lower end of the inner cylindrical portion 41C, forming the bottom of the annular recess. The bottom body 41B is provided with an exhaust pipe 45A for venting the cup 4, and an opening for draining the processing liquid from the aforementioned recess 45B.

[0036] Next, the lower guide portion 42 will be described. This lower guide portion 42 is formed as an annular member that extends from the periphery of the previously described baffle 34, through the inner cylindrical portion 41C, and outwards to the outer cylindrical portion 41A. It is located below the wafer W held in the rotating chuck 31. Furthermore, the upper surface of the lower guide portion 42 is formed as inclined surfaces 42A and 42B, with inclined surface 42A located closer to the center of the cup 4 than inclined surface 42B. Inclined surface 42A rises towards the outside of the cup 4, and inclined surface 42B descends towards the outside of the cup 4, thus forming a mountain-shaped longitudinal section of the lower guide portion 42. Inclined surface 42B guides the processing liquid that falls or splashes from the wafer W down to the bottom body 41B.

[0037] The top of the mountain-shaped structure formed by the inclined surfaces 42A and 42B protrudes upward to form an annular protrusion 46. This annular protrusion 46 runs along the circumference of the wafer W placed on the rotating chuck 31 and is close to the periphery of the wafer W. The annular protrusion 46 prevents the processing liquid supplied to the surface of the wafer W from spreading to the back side of the wafer W and adhering to the center of the wafer W, or prevents the processing liquid mist from adhering to the center of the back side of the wafer W. The height of the lower guide portion 42 can be adjusted relative to the baffle 34 and the cup body 41; therefore, the height of the annular protrusion 46 can be adjusted relative to the lower surface of the wafer W. Figure 2 In the diagram, the distance between the annular protrusion 46 and the lower surface of the wafer W (as the cup separation distance) is denoted as H0.

[0038] The intermediate guide portion 43 constituting the cup 4 includes a vertical wall 43A mounted on the inner circumferential surface of the outer cylindrical portion 41A and an inclined portion 43B extending obliquely upward from the upper end of the vertical wall 43A toward the center of the cup 4. Furthermore, a through hole 43C for liquid discharge is longitudinally penetrating the inclined portion 43B. Additionally, the upper guide portion 44 constituting the cup 4 includes a vertical wall 44A mounted on the inner circumferential surface of the outer cylindrical portion 41A, a horizontal portion 44B extending horizontally from the upper end of the vertical wall toward the center of the cup 4, and a cylindrical opening wall 44C extending vertically upward from the front end of the horizontal portion 44B. The vertical wall 44A is positioned above the vertical wall 43A of the intermediate guide portion 43, and the horizontal portion 44B is positioned above the inclined portion 43B of the intermediate guide portion 43.

[0039] Next, the resist supply mechanism 5A and the EBR processing mechanism 5B provided in the resist film forming assembly 3 will be described. The resist supply mechanism 5A includes: a resist supply nozzle 51A, a resist supply section 52A, an arm 53A, a moving mechanism 54A, and a standby section 55A. The resist supply nozzle 51A sprays resist supplied under pressure from the resist supply section 52A vertically downwards. The arm 53A supports the resist supply nozzle 51A and is configured to move freely up and down and horizontally using the moving mechanism 54A. A standby section 55A with an upward opening is provided on the outside of the cup 4, and the moving mechanism 54A moves the resist supply nozzle 51A between the opening of the standby section 55A and the cup 4. The resist supply nozzle 51A, which has moved into the cup 4, sprays resist onto the center of the rotating wafer W, forming a resist film on the entire surface of the wafer W by spin coating.

[0040] The EBR processing unit 5B includes: a solvent supply nozzle 51B, a solvent supply section 52B, an arm 53B, a moving mechanism 54B, and a standby section 55B. The solvent supply nozzle 51B is a nozzle used for EBR, which ejects pressurized solvent supplied from the solvent supply section 52B from the center side of the wafer W towards the periphery in a downward-sloping manner. That is, the solvent is ejected in a direction inclined relative to the vertical direction. The arm 53B supports the solvent supply nozzle 51B and is configured to move freely up and down and horizontally using the moving mechanism 54B. A standby section 55B with an upward opening is provided on the outer side of the cup 4. The moving mechanism 54B moves the solvent supply nozzle 51B between the opening of the standby section 55B and a processing position above the wafer W within the cup 4. Furthermore, Figure 3 The solvent supply nozzle 51B, shown by solid line, is in the state of being moved to the processing position. The EBR described above is performed by spraying solvent from the solvent supply nozzle 51B at this processing position onto the rotating wafer W.

[0041] For example, solvent supply nozzle 51B is mounted on arm 53B in a manner that allows for free height adjustment. Therefore, Figure 2 The distance (as nozzle separation distance) H1 between the solvent supply nozzle 51B and the surface of the wafer W at the processing position shown can be freely adjusted. By changing this nozzle separation distance H1, the landing position of the solvent ejected from the solvent supply nozzle 51B on the wafer W can be changed. Furthermore, although only... Figure 3 As shown, an illumination section 48 is provided near the cup 4, which can illuminate the cup 4. When the camera 82 takes a picture of the solvent supply nozzle 51B, the illumination section 48 is used to illuminate the solvent supply nozzle 51B.

[0042] The substrate processing apparatus 2 includes a control unit 20 composed of a computer (see reference). Figure 1The device is equipped with a program stored on storage media such as optical discs, hard disks, memory cards, and DVDs. The program contains instructions (steps) that output control signals to various parts of the substrate processing apparatus 2. Furthermore, these control signals are used to transport the wafer W via the transport mechanisms 23 and 25, and to process the wafer W by each processing component.

[0043] However, due to errors made by operators during the assembly and adjustment of the resist forming assembly 3, the cup separation distance H0 and / or the second distance, i.e., the nozzle separation distance H1, sometimes deviate from the appropriate range. When the wafer W is processed with the cup separation distance H0 inappropriate, the annular protrusion 46 may come into contact with the wafer W, damaging the back side of the wafer W, or the annular protrusion 46 may be too far away from the wafer W, failing to perform its function effectively. Furthermore, when the wafer W is processed with the nozzle separation distance H1 inappropriate, the solvent supply nozzle 51B may come into contact with the wafer W, damaging the wafer W, or abnormalities in the width of the resist removal area may occur due to abnormal landing positions.

[0044] The aforementioned inspection uses wafer 6 instead of wafer W, which is held in a rotating chuck 31. The interference detection using this inspection wafer 6 relative to the inspection target components (annular protrusion 46 and nozzle 51B) involves acquiring information about the height of the annular protrusion 46 and the height of the solvent supply nozzle 51B, such as whether the cup separation distance H0 and the nozzle separation distance H1 are within appropriate ranges. By acquiring this height information, it is possible to prevent contact between wafer W and the annular protrusion 46, contact between the solvent supply nozzle 51B and wafer W, and abnormal landing positions.

[0045] The following is for reference Figure 4 , Figure 5 Longitudinal sectional side view, Figure 6 The top view illustrates the structure of wafer 6 used for inspection. Figure 4 , Figure 5 The longitudinal sectional sides at different locations are shown. Additionally, in... Figure 6 in, omit Figure 4 , Figure 5 The structural elements shown are part of the design. The inspection wafer 6 includes a circular base 61 and a substrate 62. The base 61 is a substrate of the same size as the wafer W, and its lower surface is also flat, just like the lower surface of the wafer W. Therefore, the base 61, like the wafer W, can be transported by the transport mechanisms 23 and 25 and held by the rotary chuck 31. Figures 4-6 The substrate 61 (i.e., the inspection wafer 6 in the adsorbed and held state) is shown in the state of being held in the rotating chuck 31.

[0046] A substrate 62 is laminated on the upper side of the base body 61. The substrate 62 includes a main body portion 63 disposed on the central portion of the base body 61. Furthermore, in... Figure 6 and the following Figure 7 For ease of illustration, the main body 63 is shown as a circle, but it is not limited to a circle and can be any shape. Various circuit components and devices are provided on the main body 63, which are collectively referred to as component group 64 in the drawings.

[0047] The components and devices constituting component group 64 include a CPU, a communication device for wirelessly transmitting and receiving various data (including signals), etc. Data acquired by each sensor and camera can be wirelessly transmitted to the computing device 9 using this communication device. Furthermore, a trigger signal used to acquire this data can be transmitted to each camera and each sensor via this communication device. Additionally, as described later, cameras 81, 82, etc., are mounted on a substrate other than substrate 62, but data can be transmitted to and trigger signals received from the computing device 9 via leads 60 connecting the substrates. Furthermore, a battery 65 is provided at the center of the base 61 for supplying power to component group 64, each sensor, each camera, and the illumination unit 85 (described later).

[0048] Reference Figure 7 Further explanation is given regarding the substrate 62 on the base body 61, the main body 63 of which is fixed to the base body 61. A portion of the periphery of the main body 63 extends toward the periphery of the main body 63, forming an elongated beam-like body 66 along the radial direction of the base body 61. At the periphery of the base body 61, at a position overlapping the front end side of the beam-like body 66, a through hole 67 extending through the base body 61 in the thickness direction is formed. The through hole 67 forms a connection path connecting one side (upper side) and the other side (lower side) of the base body 61 in the longitudinal direction.

[0049] exist Figure 7 The area around the through hole 67 is magnified in front of the arrow. A protrusion 68 protrudes downwards and enters the through hole 67 on the lower surface of the front end side of the beam-like body 66. The front end (lower end) of the protrusion 68 is located below the lower surface of the main body 63, protruding from the lower surface of the main body 63 by, for example, about 1 mm (see reference). Figure 4 Furthermore, the protrusion 68 is located slightly further away from the base end than the front end of the beam 66, and the front end of the beam 66 is located closer to the periphery of the base body 61 than the through hole 67. Through this arrangement of the protrusion 68 and the through hole 67, the portion of the beam 66 closer to the base end than the through hole 67 and the portion closer to the front end than the through hole 67 are respectively supported by contact with the base body 61. In other words, the beam 66 is supported on the upper surface region of the base body 61, including the outer edge of the through hole 67.

[0050] The first beam, namely the aforementioned beam 66, is formed as a cantilever, constituting a first interferometric detection unit for acquiring information about the height of the annular protrusion 46. More specifically, the lower surface of the beam 66 is not fixed to the base body 61, and it is flexible in the longitudinal direction (thickness direction of the base body 61). As described above, since the main body 63 connecting the beam 66 is fixed to the base body 61, the base end of the beam 66 is fixed to the base body 61. Therefore, the structure is such that one end of the beam 66 is fixed to the central portion of the base body 61, while the other end, extending towards the periphery of the base body 61, is movable relative to the base body 61. Furthermore, a strain gauge (strain sensor) 69 is provided on the upper side of the base end (one end) of the beam 66. The strain gauge 69 forming the first signal acquisition unit, together with the components included in the aforementioned component group 64, constitutes a Wheatstone bridge circuit, and the voltage signal output from this circuit is wirelessly transmitted to the computing device 9 as a detection signal.

[0051] When the base body 61 is attracted by the rotating chuck 31, the protrusion 68 of the beam-shaped body 66 is positioned above the annular protrusion 46. Both the lower surface of the wafer W and the lower surface of the base body 61 are flat surfaces, therefore, they are at the same height when placed on the rotating chuck 31. Thus, when the cup separation distance H0 (the distance between the wafer W and the annular protrusion 46) is below a reference value and interference occurs between the wafer W and the annular protrusion 46, as... Figure 8 As shown, interference also occurs between the protrusion 68 and the annular protrusion 46 on the inspection wafer 6. Thus, due to the interference at protrusion 68, the front end of the beam 66 deforms by being pushed upwards. Corresponding to the deformation of the beam 66, the strain gauge 69 also deforms, and the signal output from the aforementioned Wheatstone bridge circuit fluctuates according to the change in resistance of the strain gauge 69 caused by this deformation. Therefore, by monitoring this signal, the presence or absence of interference between the annular protrusion 46 and the protrusion 68 can be detected, and thus, it can be determined whether interference occurs between the wafer W and the annular protrusion 46.

[0052] Furthermore, a notch is provided at a position on the periphery of the upper surface of the base body 61, at a location different in the circumferential direction from the position where the beam 66 is provided. The base end of a second beam, namely beam 71, is fixedly provided on the base body 61 closer to the center than this notch. The front end of beam 71 is elongated in a manner extending radially along the notch on the base body 61. Therefore, the front end of beam 71 is in a state of floating above the base body 61. That is, a gap is formed between beam 71 and the base body 61 by the aforementioned notch, which is indicated by reference numeral 72.

[0053] Like beam 66, beam 71 is also cantilevered, forming a second interference detection unit for acquiring information about the height of the solvent supply nozzle 51B at the processing location. As described above, the front end of beam 71 is vertically movable due to its placement on gap 72. A strain gauge 73 is provided on the upper side of the base end of beam 71. The second signal acquisition unit, i.e., strain gauge 73, together with strain gauge 69 and the components included in component group 64, forms a Wheatstone bridge circuit, and the voltage signal from this circuit is wirelessly transmitted to the computing device 9 as a detection signal.

[0054] If the inspection wafer 6 is held in the rotating chuck 31 and the chuck 31 is rotated (causing the inspection wafer 6 to rotate as well), then when the nozzle separation distance H1 is below the reference value, if... Figure 9 As shown, there is interference between the beam 71 and the lower end of the solvent supply nozzle 51B. Due to this interference, the front end of the beam 71 is pressed downward through the gap 72, deforming it by narrowing the gap 72. Corresponding to the deformation of the beam 71, the strain gauge 73 also deforms, causing a change in the signal output from the Wheatstone bridge circuit including the strain gauge 73. Therefore, by monitoring this signal, the presence or absence of interference between the solvent supply nozzle 51B and the beam 71 can be detected, and it can be determined whether the processing position of the solvent supply nozzle 51B is appropriate.

[0055] In addition, such as Figure 5 , Figure 6 As shown, two substrates 80 are provided at the periphery of the base body 61, separated from the beams 66 and 71 in the circumferential direction. These two substrates 80 are also circumferentially separated from each other. A camera 81 is mounted on one substrate 80, and a camera 82 is mounted on the other substrate 80, with their fields of view facing the periphery of the base body 61, respectively. Cameras 81 and 82 are for capturing images through the annular protrusion 46 and the solvent supply nozzle 51B, respectively. A reflector 83 is positioned on the optical axis of the camera 81. Furthermore, a through-hole 84 is formed in the base body 61. When the inspection wafer 6 is held in the rotating chuck 31, the through-hole 84 is located on the annular protrusion 46, and a portion of the upper surface of the annular protrusion 46 in the circumferential direction is mapped onto the reflector 83 through the through-hole 84. The camera 81 can capture images of the portion of the upper surface of the annular protrusion 46 mapped onto the reflector 83. Additionally, two illumination units 85 are embedded in the base body 61. Each illumination unit 85 is arranged with a through hole 84 sandwiched in the circumference of the base body 61, illuminating light downwards. When taking pictures using the camera 81, light is illuminating the subject downwards from each illumination unit 85.

[0056] A circular cover 86, with its sidewalls running along the circumference of the base 61, is provided on the base 61, covering the main body 63 of the substrate 62, the battery 65, the cameras 81 and 82, and the reflector 83. An opening is provided on the sidewall of the cover 86 along the optical axis of the camera 82 to avoid obstructing the camera 82 from capturing images of the solvent supply nozzle 51B. Furthermore, a notch is cut at the lower end of the sidewall of the cover 86 in a manner that does not impede the deformation of the beams 66 and 71, through which the front ends of the beams 66 and 71 protrude outward from the cover 86. Additionally, to prevent interference with the solvent supply nozzle 51B, the side end of the cover 86 is positioned closer to the center of the base 61 than the solvent supply nozzle 51B at the processing position.

[0057] exist Figure 4 , Figure 5 In the example shown, the central portion of the cover 86 is formed to be higher than the periphery of the cover 86 and has an upward-facing protrusion 87. Matching this structure of the cover 86, as described above, the battery 65 and component assembly 64 can be arranged in the central portion of the base body 61, allowing the center of gravity of the base body 61 to be located in the center. Therefore, when the base body 61 is placed on the rotating chuck 31, sagging of the base body 61 due to its own weight can be prevented. Thus, changes in the height of the beams 66 and 71, and the cameras 81 and 82 due to sagging can be prevented, thus preventing any impact on the measurement results. Therefore, the cover 86 with the protrusion 87 helps improve the accuracy of anomaly detection. However, it is also possible to configure the cover 86 to have a relatively large thickness and a flat upper surface.

[0058] Furthermore, when operators are handling processes such as mounting the inspection wafer 6 on the carrier C or performing maintenance on the inspection wafer 6, the inspection wafer 6 may pass through a relatively narrow area. In this case, since the upper surface of the cover 86 is positioned higher than the beams 66 and 71, even if the inspection wafer 6 collides with the wall defining the narrow area, it is the cover 86 that collides, thus preventing the beams 66 and 71 from colliding with the wall. Therefore, plastic deformation or breakage of the beams 66 and 71 is suppressed. Thus, the cover 86 can effectively protect the beams 66 and 71.

[0059] Next, refer to Figure 4 The arithmetic unit 9 will be described below. The arithmetic unit 9 is a computer and includes a bus 91. The bus 91 is connected to a program storage unit 92, a wireless transmission / reception unit 93, a memory 94, a display unit 95, and an operation unit 96. The program storage unit 92 contains a program 90 stored on a storage medium such as an optical disc, hard disk, memory card, or DVD. This arithmetic unit is configured as an information acquisition unit for calculating the aforementioned separation distances H0 and H1.

[0060] The wireless transmitter / receiver unit 93 wirelessly transmits a trigger signal to the inspection wafer 6 for acquiring data, and wirelessly receives detection signals from each circuit including the strain gauges 69 and 73, as well as image data acquired by the cameras 81 and 82. Data acquired from each sensor and camera is stored in the memory 94. Reference data, which serves as a basis for determining the presence or absence of interference (described later), is also stored in the memory 94. Furthermore, data for acquiring separation distances H0 and H1 from the image data, as described in the second embodiment, is stored, for example.

[0061] The operation unit 96 includes a mouse, keyboard, etc., and the user of the information acquisition system 1 can use the operation unit 96 to instruct the execution of processes that can be performed by the program 90. In addition, for example, the computing device 9 is connected to the control unit 20 of the substrate processing device 2, and after holding, for example, the inspection wafer 6 on the rotating chuck 31, the control unit 20 sends signals from the computing device 9 indicating that various data can be acquired.

[0062] Next, the operation steps of the information acquisition system 1 described above will be explained. First, the carrier C storing the inspection wafer 6 is transported to the stage 21 of the substrate processing apparatus 2. The inspection wafer 6 is transported in the order of transport mechanism 23 → transfer assembly TRS → transport mechanism 25 → resist film forming assembly 3, and is placed on the rotary chuck 31 by means of lifting pin 35 and is adsorbed and held. Then, the solvent supply nozzle 51B moves from the standby section 55B to the processing position.

[0063] When the operator issues a specified instruction from the computing device 9, the rotary chuck 31 rotates, and the inspection wafer 6 rotates one revolution at a relatively low speed. During this revolution, the height of each part of the resist forming assembly 3 is adjusted in a manner that avoids interference between the annular protrusion 46 and the protrusion 68 of the beam 66, and also avoids interference between the solvent supply nozzle 51B and the beam 71. The detection signals from each circuit, including the strain gauges 69 and 71, during this revolution are sent to the computing device 9 and stored as reference data. After the inspection wafer 6 has rotated one revolution, the solvent supply nozzle 51B returns to the standby section 55B. Then, the inspection wafer 6 is transferred to the transport mechanism 25 via the lifting pin 35, and returns to the carrier C sequentially via the transfer assembly TRS and the transport mechanism 23.

[0064] Subsequently, at any given time, the carrier C containing the inspection wafer 6 is transported to the stage 21 of the substrate processing apparatus 2. Then, similarly to when acquiring reference data, the inspection wafer 6 is transported to the resist forming assembly 3, where it is placed on the rotating chuck 31 and held, and the solvent supply nozzle 51B is moved to the processing position. Similar to when acquiring reference data, when, for example, an operator issues an instruction, the inspection wafer 6 is rotated once using the rotating chuck 31. During this rotation, the detection signals from each circuit, including strain gauges 69 and 71, are sent to the arithmetic unit 9 and stored as interference detection data. The inspection wafer 6 after data acquisition is returned to the carrier C in the same manner as the inspection wafer 6 after reference data acquisition.

[0065] The operator displays the signal waveform of the interference detection data and the signal waveform of the reference data on the display unit 95 for comparison to detect the presence or absence of interference. Figure 10 Examples of signal waveforms obtained from a circuit including strain gauge 69 are shown. Solid lines represent signal waveforms of reference data, while dashed lines and single-dot lines represent waveforms of occurrence, respectively. Figure 8 The following are examples of signal waveforms for detection data under interference conditions. The signal waveforms represented by dashed lines and single-dot lines are acquired due to different types of interference, as described later. As shown in the figure, the signal level of the reference data does not change significantly at any point during data acquisition. The detection data without interference exhibits the same or approximately the same signal waveform as the reference data.

[0066] For example, by tilting the lower guide portion 42 constituting the annular protrusion 46, when only a portion of the annular protrusion 46 is interfered with, as shown by the dashed waveform, the signal level at a specific moment during the rotation of the inspection wafer 6 differs significantly from the signal level of the reference data. When the annular protrusion 46 and protrusion 68 are in continuous contact during the rotation of the inspection wafer 6, as shown by the dashed waveform, the signal level at each moment during data acquisition differs significantly from the signal level of the reference data.

[0067] Thus, the presence or absence of interference can be determined based on the different signal waveforms. The operator can make the interference judgment, but it can also be performed by procedure 90. Furthermore, the signal waveform obtained from the circuit including strain gauge 69 is shown, but the same applies to the signal waveform obtained from the circuit including strain gauge 73. That is, the signal level of the reference data does not change significantly at various times during data acquisition, and in the case of interference with the nozzle, such as... Figure 10 As shown by the dashed line, it changes drastically at specific moments.

[0068] When the operator determines, based on a comparison of the aforementioned reference data and testing data, that the height of the annular protrusion 46 or the solvent supply nozzle 51B needs adjustment, adjustments are made as described above. Afterward, the carrier C containing the wafer W is transported to the stage 21 of the substrate processing apparatus 2. The wafer W is transported in the following sequence: transport mechanism 23 → transfer assembly TRS → transport mechanism 25 → resist film forming assembly 3 → transport mechanism 25 → heating assembly 26 → transport mechanism 25 → transfer assembly TRS, and then returned to the carrier C via the transport mechanism 23. During this transport, at the resist film forming assembly 3, resist is sprayed from the resist supply nozzle 51A onto the center of the surface of the wafer W, which is rotating using the rotary chuck 31, forming a resist film on the entire surface of the wafer W through spin coating. Afterward, the solvent supply nozzle 51B moves from the standby section 55B to the processing position and supplies solvent to the periphery of the rotating wafer W to remove the resist film from that periphery.

[0069] As described above, for the inspection wafer 6 constituting the information acquisition system 1, strain gauges 69 and 73 are respectively provided on beams 66 and 71 fixed to each inspection wafer 6 at only one end. Furthermore, these beams 66 and 71 serve as interference detection components, forming a structure that interferes with the annular protrusion 46 and the solvent supply nozzle 51B positioned at an abnormal height. Using this structure, the beams 66 and 71 deform considerably due to interference, and the strain gauges 69 and 73 also deform considerably. Therefore, relatively large signal variations can be detected, and interference detection can be performed based on these signal variations. Moreover, based on the interference detection results, the operator can adjust the resist forming assembly 3. Thus, it is possible to prevent poor processing of the wafer W by the resist forming assembly 3, thereby preventing a decrease in the yield of semiconductor products manufactured from the wafer W.

[0070] Alternatively, only one of the aforementioned beams 66 and 71 can be provided, and only the interference from the annular protrusion 46 and the interference from the solvent supply nozzle 51B can be detected. Furthermore, when detecting the aforementioned interference, the inspection wafer 6 is rotated. If the annular protrusion 46 has an abnormal height, interference will occur between the annular protrusion 46 and the beam 66 when the lifting pin 35 is lowered and the inspection wafer 6 is attached to the rotating chuck 31, thus enabling the detection of this interference. In other words, it is not necessarily necessary to rotate the inspection wafer 6 when detecting interference with the annular protrusion 46.

[0071] However, as already described, the beam 66 is supported from below by the base 61. The beam 66 vibrates up and down when interfering with the annular protrusion 46, but assuming there is no support from the base 61, it is assumed that during repeated interference processes, such as when the inspection wafer 6 is reused, the leading edge of the beam 66 would deform downwards due to the aforementioned vibration. That is, the support of the beam 66 from below can suppress such deformation, thereby extending the lifespan of the inspection wafer 6.

[0072] In addition, if obtained Figure 10 As shown in the example waveform with the dashed line, when only a portion of the annular protrusion 46 exhibits an abnormal height in the circumferential direction, the annular protrusion 46 comes into contact laterally with the protrusion 68 connected to the beam 66 due to the rotation of the inspection wafer 6. Thus, due to the lateral interference, an upward force is generated at the front end of the beam 66, while a downward force is generated at the base end. In other words, when viewed laterally, the beam 66 generates force in a torsional manner (rotating about an axis extending along the elongation direction of the beam 66). However, since the base end of the beam 66 is supported by the base body 61, downward deformation and torsion are suppressed, while upward deformation is promoted. That is, it becomes prone to upward deformation in the initial stage of deformation, therefore, the front end of the beam 66 bends significantly upward.

[0073] Furthermore, when the lateral interference described above occurs, considering the radial cross-section of the inspection wafer 6, the beam 66 experiences an upward force on the side of the interference and a downward force on the opposite side. Even on the side of the beam 66 opposite to the interference side, since the base 61 supports the beam 66 from below, downward deformation and torsion are suppressed, while upward deformation is promoted, similar to the above. Therefore, a larger signal change due to interference can be obtained, improving detection accuracy.

[0074] Thus, the portion of the base body 61 supporting the base end of the beam 66, specifically the portion closer to the center of the base body 61 and overlapping with the beam 66 compared to the through hole 67, can be considered a guide that reliably bends the front end of the beam 66 upwards. In this embodiment, the portion of the base body 61 supporting the beams 66 and 71 from below is a surface along the lower surface of the beams 66 and 71, but it can also exist at multiple different locations along the length of the beams 66 and 71 and / or the circumferential direction of the inspection wafer 6. That is, it can also support the beams 66 and 71 from below at multiple points with open intervals. Furthermore, for the beams 66 and 71, the longitudinal section observed in the elongation direction becomes a shape with a shorter longitudinal (vertical) dimension compared to the transverse dimension, thus becoming a structure that is more easily deformed in the longitudinal direction than in the transverse direction.

[0075] Furthermore, the protrusion 68 is configured to enter the through hole 67, which serves as the connection path connecting the upper and lower parts of the base body 61. However, it can also be configured such that a notch is provided at the periphery of the base body 61 facing the center of the base body 61 as the connection path, and the protrusion 68 enters the notch. Moreover, by supporting the beam-like body 66 in the region including the outer edge of the notch, this region can function as a guide as described above.

[0076] (Second Implementation)

[0077] In the second embodiment, image data acquired from camera 81 is used to obtain the cup separation distance H0, and image data acquired from camera 82 is used to obtain the nozzle separation distance H1. The method for obtaining the cup separation distance H0 will be described. Figure 11 The image data is captured by camera 81 at a portion of the circumferential direction of the upper surface of the annular protrusion 46. The dashed box represents the pixels of the image. The number of pixels of the width L3 of the annular protrusion 46 is detected based on the image data thus acquired (step S1). The cup separation distance H0 is calculated based on the pre-acquired correspondence between the number of pixels of the width L3 and the cup separation distance H0 (step S2). As this correspondence, an equation of any degree can be prepared in advance, which uses the cup separation distance H0 and the number of pixels of the width L3 as variables and expresses the relationship that L3 decreases as H0 increases. Then, the cup separation distance H0 calculated based on this correspondence is displayed on the display unit 95 of the arithmetic device 9 (step S3).

[0078] The method for obtaining the nozzle separation distance H1 is explained. Figure 12The image data is an image of the side of the solvent supply nozzle 51B captured by camera 82. In this image data, the number of pixels corresponding to the width L4 of the solvent supply nozzle 51B is detected (step T1). Next, in the image data, the number of pixels of height H20 between the lower end of the solvent supply nozzle 51B determined in step T1 and the reference height H10 (a pixel with a pre-set height in the image data) is detected (step T2). This H20 is set as the nozzle reference height. Then, the number of pixels corresponding to the pre-obtained width L4 of the solvent supply nozzle 51B / the width L4 obtained in step T1 is calculated, and this calculated value is taken as a distance of 1 pixel (step T3). Then, the number of pixels of the nozzle reference height H20 obtained in step T2 is multiplied by the distance of 1 pixel obtained in step T3. That is, the number of pixels in the image data, i.e., the nozzle reference height H20, is converted into the actual height (distance) (step T4).

[0079] Furthermore, the height difference (denoted as H30) between the surface of the wafer W when it is held in the rotary chuck 31 and the reference height H10 described above, as seen in the image captured by the camera 82 when the wafer 6 for inspection is held in the rotary chuck 31, is obtained in advance. Based on the actual nozzle reference height H20 and the height difference H30 obtained in step T4 above, the nozzle separation distance H1 is calculated (step T5). Specifically, as... Figure 12 As shown, the nozzle separation distance H1 is calculated as follows: when the nozzle 51B in the image is mapped to a position higher than the reference height H20, it is H20+H30; when the nozzle 51B in the image is mapped to a position lower than the reference height H20, it is H30-H20. The calculated nozzle separation distance H1 is displayed on the display unit 95 of the calculation device 9 (step T6). Furthermore, the pre-acquired height difference H30 is used in this way because the field of view of the camera 82 is limited due to its placement on the base 61.

[0080] The above steps S1 to S3 and T1 to T6 are performed by the above program 90. The correspondence between the number of pixels of the width L3 used to perform the above steps and the cup separation distance H0, the height difference H30, and the actual width L4 of the solvent supply nozzle 51B are obtained in advance and stored in the memory 94 of the computing device 9.

[0081] The operating steps of the information acquisition system 1 when acquiring the cup separation distance H0 and the nozzle separation distance H1 are described as follows: As described in the first embodiment, the inspection wafer 6 is transported from the carrier C to the resist forming assembly 3 and held in the rotating chuck 31. Then, the nozzle 51B moves from the standby unit 55B to the processing position. When the user issues a predetermined instruction from the computing device 9, the rotating chuck 31 rotates intermittently at, for example, predetermined angle intervals, and when rotation stops, images are captured by cameras 81 and 82. The acquired image data is wirelessly transmitted sequentially to the computing device 9. When the inspection wafer 6 rotates one revolution, the solvent supply nozzle 51B returns to the standby unit 55B, and the inspection wafer 6 returns to the carrier C.

[0082] Steps S1 to S3 described above are performed on each image data acquired by camera 81 to calculate the cup separation distance H0 and display the image. Furthermore, one of the multiple image data acquired by camera 82 is selected, for example, according to program 90 of processing device 9. Figure 12 The data for the solvent supply nozzle 51B is mapped as shown. Then, steps T1 to T6 described above are performed on the selected image data to calculate the nozzle separation distance H1 and display it on the screen. The operator, seeing the separation distances H0 and H1 displayed, adjusts the height of the annular protrusion 46 and / or the nozzle 51B as needed.

[0083] It was explained that either the interference detection shown in the first embodiment or the acquisition of the separation distances H0 and H1 shown in the second embodiment can be performed, but both can also be performed. When only one is selected, acquiring the separation distances H0 and H1 can prevent various defects that might arise due to their large size. Specifically, to prevent image shift, the rotation of the inspection wafer 6 is stopped during image capture by the cameras 81 and 82, as described above. However, stopping the rotation of the inspection wafer 6 is not necessary during interference detection. Therefore, it has the advantage of shortening the inspection time.

[0084] Furthermore, in the second embodiment described above, the camera 81 takes multiple pictures to acquire images of various parts of the annular protrusion 46 in the circumferential direction, and obtains the cup separation distance H0 from each image data. However, it is also possible to acquire image data of only one part and obtain the cup separation distance H0 only for that part. In addition, in the first embodiment, any structure in which the output signal changes due to interference with the beams 66 and 81 is acceptable, and therefore, it is not limited to using strain gauges 69 and 73. Specifically, it is also possible to set a structure in which, for example, a vibration sensor is used instead of strain gauges 69 and 73 to output a vibration detection signal to the computing device 9. In addition, strain gauges 69 and 73 are shown being provided on the base end side of the beams 66 and 71, but it is not limited to the case where they are provided on the base end side as long as the signal change can be detected.

[0085] In the described information acquisition system 1, a control unit 20 and a processing unit 9 are provided, but the control unit 20 may also function as the processing unit 9. Furthermore, in the described example, data is wirelessly transmitted to the processing unit 9, but alternatively, a removable memory may be mounted on the base 61 of the inspection wafer 6, and the data may be stored in that memory. In this case, the operator only needs to remove the memory from the inspection wafer 6 after data acquisition is complete and it has returned to the carrier C, and transfer the data to the processing unit 9. Therefore, it is also possible not to wirelessly transmit image data to the inspection wafer 6. Alternatively, a structure may be used where the inspection wafer 6 and the processing unit 9 are connected by a wire, and various types of data are transmitted to the processing unit 9.

[0086] Furthermore, while the camera 82 is configured to photograph the solvent supply nozzle 51B, it could also be configured to photograph the resist supply nozzle 51A, thereby obtaining the distance between the resist supply nozzle 51A and the surface of the wafer W. Additionally, the liquid processing assembly provided in the substrate processing apparatus 2 is not limited to the resist film forming assembly 3. It could be an assembly that supplies a coating film forming liquid (other than a resist film) such as an anti-reflective film or an insulating film to the surface of the wafer W from the nozzle to form a film, or it could be an assembly that supplies a cleaning solution, a developing solution, or an adhesive for bonding multiple wafers W together from the nozzle to the surface of the wafer W. Thus, information regarding the height between the nozzle supplying the processing liquid (other than a resist film) and the surface of the wafer W can also be obtained using the method of the described embodiment.

[0087] Furthermore, the processing liquid supplied from the nozzle to the periphery of the wafer W is not limited to a solvent; for example, it could be a coating liquid for forming a coating film. Information about the height between the nozzle and the surface of the wafer W can be obtained using the methods described above. Additionally, the inspection wafer 6 is not limited to being transported from the carrier C to the substrate processing apparatus 2 from the outside. For example, a storage component for the inspection wafer 6 could be provided within the substrate processing apparatus 2, and transported between this component and the resist forming component 3.

[0088] The embodiments disclosed herein should be considered illustrative and not restrictive in all respects. Various omissions, substitutions, modifications, and combinations of the above embodiments may be made without departing from the claims and their spirit.

Claims

1. An information acquisition system for acquiring information related to a substrate processing apparatus for processing a substrate held in a substrate holding portion, characterized in that, The information acquisition system includes: A base body, which is held by the substrate holding portion in place of the substrate; Interference detection unit, comprising a fixed end side relative to the base body and a movable end side relative to the base body; and The signal acquisition unit is used to acquire a signal that varies according to the deformation of the interference detection unit caused by interference with the detection target member around the base body held in the substrate holding unit. The substrate holding part is rotatable together with the base body. Information about the height of the object to be detected is obtained based on the deformation of the interference detection unit during the rotation of the substrate holding part and the base body.

2. The information acquisition system according to claim 1, characterized in that, The interference detection unit is located on the upper side of the base body. A gap is provided between the other end of the interference detection unit and the base body.

3. An information acquisition system for acquiring information related to a substrate processing apparatus for processing a substrate held in a substrate holding portion, characterized in that, The information acquisition system includes: A base body, which is held by the substrate holding portion in place of the substrate; Interference detection unit, comprising a fixed end side relative to the base body and a movable end side relative to the base body; and The signal acquisition unit is used to acquire a signal that varies according to the deformation of the interference detection unit caused by interference with the detection target member around the base body held in the substrate holding unit. The interference detection unit is a beam-shaped body, with one end fixed to the central part of the base body and the other end extending toward the edge of the base body.

4. The information acquisition system according to claim 3, characterized in that, The base body has a connection path that connects one side and the other side in the longitudinal direction of the base body. This connection path is a notch or a hole. The beam-like body is located on one side of the longitudinal direction of the base body. A protrusion is provided at the other end of the beam-like body. This protrusion enters the connection path and protrudes longitudinally to the other side of the base body, facing the detection object component located on that other side. The outer edge of the connection path of the base body contacts the beam-like body.

5. The information acquisition system according to claim 4, characterized in that, The other side in the longitudinal direction is the lower side. The base body is provided with a camera unit for capturing image data by photographing the lower side of the base body. The information acquisition system is provided with an information acquisition unit, which acquires information about the distance between the base and the interference detection unit based on the image data.

6. The information acquisition system according to claim 3, characterized in that, The interference detection unit is located on the upper side of the base body. A gap is provided between the other end of the interference detection unit and the base body.

7. An information acquisition method for acquiring information related to a substrate processing apparatus for processing a substrate held in a substrate holding portion, characterized in that, The information acquisition method includes the following steps: The substrate is held by the substrate holding portion instead of the substrate holding base. The interference detection unit is deformed by interfering with the detection target member around the base body held by the substrate holding part. The interference detection unit includes one end fixed relative to the base body and another end movable relative to the base body. as well as Acquire the signal that varies according to the deformation of the interference detection unit. The information acquisition method also includes the following steps: The substrate holding part is rotated together with the base body; as well as Information about the height of the object to be detected is obtained based on the deformation of the interference detection unit during the rotation of the substrate holding part and the base body.

8. The information acquisition method according to claim 7, characterized in that, The interference detection unit is located on the upper side of the base body, and the other end of the interference detection unit is suspended from the base body. A gap is provided between the other end of the interference detection unit and the base body. The information acquisition method includes the following steps: using the interference between the interference detection part and the detection object component, the interference detection part is deformed in such a way that the gap narrows.

9. An information acquisition method for acquiring information related to a substrate processing apparatus for processing a substrate held in a substrate holding portion, characterized in that, The information acquisition method includes the following steps: The substrate is held by the substrate holding portion instead of the substrate holding base. The interference detection unit is deformed by interfering with the detection target member around the base body held by the substrate holding part. The interference detection unit includes one end fixed relative to the base body and another end movable relative to the base body. as well as Acquire the signal that varies according to the deformation of the interference detection unit. The interference detection unit is a beam-shaped body, with one end fixed to the central part of the base body and the other end extending toward the edge of the base body.

10. The information acquisition method according to claim 9, characterized in that, The base body has a connecting path that connects one side and the other side in the longitudinal direction of the base body. This connecting path is a notch or a hole. The beam-like body is located on one side in the longitudinal direction of the base body. A protrusion is provided at the other end of the beam-like body. This protrusion enters the connection path and protrudes longitudinally to the other side of the base body, facing the detection object component located on that other side. The outer edge of the connection path of the base body contacts the beam-like body. The information acquisition method includes the following steps: causing the protrusion and the detected object component to interfere with each other, thereby deforming the beam-like body.

11. The information acquisition method according to claim 10, characterized in that, The other side in the longitudinal direction is the lower side. The information acquisition method includes the following steps: Image data is acquired by capturing images of the lower side of the base body using a camera unit provided on the base body; and Information about the distance between the base and the interference detection unit is obtained based on the image data.

12. The information acquisition method according to claim 9, characterized in that, The interference detection unit is located on the upper side of the base body, and the other end of the interference detection unit is suspended from the base body. A gap is provided between the other end of the interference detection unit and the base body. The information acquisition method includes the following steps: using the interference between the interference detection part and the detection object component, the interference detection part is deformed in such a way that the gap narrows.

Images