Analog front-end chip, analog front-end circuit and signal processing device

By integrating an operational amplifier module and a multiplexer within the same chip, the parasitic capacitance and resistance sensitivity issues of signal transmission paths in analog front-end circuits are resolved, achieving high bandwidth and stable gain adjustment, and reducing system temperature drift and cost.

CN115149912BActive Publication Date: 2026-06-19RIGOL TECHNOLOGIES CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
RIGOL TECHNOLOGIES CO LTD
Filing Date
2022-07-20
Publication Date
2026-06-19

AI Technical Summary

⚠Technical Problem

Analog front-end circuits contain a large number of components, and the signal transmission path is sensitive to parasitic resistance and capacitance. Process deviations result in poor temperature drift characteristics, making it difficult to achieve high bandwidth and stable gain adjustment.

⚗Method used

By integrating the first operational amplifier module and the second operational amplifier module into the same chip, and combining a multiplexer and a variable gain amplifier, a wide range of variable gain and adjustable input impedance can be achieved, reducing peripheral devices and avoiding the effects of parasitic capacitance and resistance.

🎯Benefits of technology

It achieves high bandwidth performance and stable gain adjustment of analog front-end circuit, reduces system temperature drift, simplifies design and reduces cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application provides an analog front-end chip, an analog front-end circuit, and a signal processing device, including: a first operational amplifier module for amplitude adjustment of an electrical signal connected to a first input impedance network; and a second operational amplifier module for amplitude adjustment of an electrical signal connected to a second input impedance network. The second input impedance network has a different impedance than the first input impedance network. The first and second operational amplifier modules are integrated within the same chip. This solves the problem of parasitic capacitance and resistance sensitivity caused by external chip interconnections; avoids the influence of process deviations on the bandwidth of the signal transmission path; and easily achieves high bandwidth performance for the analog front-end circuit. Simultaneously, since all critical signal paths are within a single chip, the temperature characteristics are consistent, resulting in minimal system temperature drift.
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