An airborne structural heat dissipation device based on forced air cooling

Abstract

The present application discloses an airborne structural heat dissipation device based on forced air cooling, comprising: a chassis (1), in which a rack (2) is arranged, and a side wall of which is provided with an air inlet (8) and an air outlet (9), the chassis (1) comprises a frame (5), an upper cover (6) and a lower cover (7), the air inlet (8) and the air outlet (9) are arranged on the frame (5), and the frame (5) is manufactured by an integrated processing technology; the frame (5) comprises a tightly connected upper structure and a lower structure; the upper structure is used to provide an installation area (13) for a module; the lower structure serves as a forced air cooling heat dissipation area (14); the rack (2) is connected to the chassis (1) through a locking mechanism (3); and a vibration damping bar (3) is arranged between the rack (2) and the chassis (1) to provide a buffering effect for the rack (2). In view of the characteristics of airborne devices such as small installation space, high module density, high vibration level and high heat dissipation, this application designs an integrated structure to improve the heat dissipation capacity of the device.

Description

Technical Field

[0001] The present invention relates to the technical field of airborne equipment, and in particular to an airborne structural heat dissipation device based on forced air cooling. Background Art

[0002] With technological advancements, electronic equipment has achieved breakthroughs in lightweighting and miniaturization. Airborne devices, as a crucial infrastructure for electronic equipment, house and protect various circuit units, components, and mechanical parts within them, eliminating interference from complex environments and ensuring safe and reliable operation. This improves the efficiency and lifespan of electronic equipment and enhances its ease of maintenance.

[0003] Studies have shown that over 55% of electronic equipment failure rates are caused by excessive temperatures. Excessive temperatures not only damage circuit connectors and junctions, but also increase component resistance and thermal stress. Increased operating temperatures and the temperature of electronic devices themselves significantly reduce the lifespan of the devices and electronic systems. Therefore, when designing electronic equipment structures, it is crucial to analyze and study the thermal characteristics of the devices and components, and to optimize thermal design and heat dissipation structures.

[0004] Currently, the design of airborne devices often starts with structural strength design, and then the heat dissipation capacity of the chassis is analyzed. The structural design and heat dissipation design are relatively independent, which can easily result in the overall heat dissipation failing to meet expectations, or the strength requirements failing to meet expectations. Summary of the Invention

[0005] The embodiment of the present application provides an airborne structural heat dissipation device based on forced air cooling. In view of the characteristics of the airborne device such as small installation space, high module density, high vibration level and high heat dissipation, an integrated structure is designed to improve the heat dissipation capacity of the device.

[0006] The embodiment of the present application provides an airborne structural heat dissipation device based on forced air cooling, comprising:

[0007] A chassis 1 is provided with a frame 2 therein, and an air inlet 8 and an air outlet 9 are provided on its side wall. The chassis 1 includes a frame 5, an upper cover 6 and a lower cover 7. The air inlet 8 and the air outlet 9 are provided on the frame 5. The frame 5 is manufactured by an integrated processing technology.

[0008] The frame 5 includes a tightly connected upper structure and a lower structure;

[0009] The upper structure is used to provide a mounting area 13 for the module;

[0010] The lower structure serves as a forced air cooling heat dissipation area 14;

[0011] The frame 2 is connected to the chassis 1 through a locking mechanism 3;

[0012] The vibration damping strip 3 is provided between the frame 2 and the chassis 1 to provide a buffering effect for the frame 2 .

[0013] Optionally, the air inlet 8 and the air outlet 9 are a plurality of grooves on the side of the frame 5 .

[0014] Optionally, the forced air cooling heat dissipation area 14 is provided with a plurality of multifunctional fins 15 , so as to improve the strength and heat dissipation performance of the frame 5 based on the multifunctional fins 15 .

[0015] Optionally, a plurality of fans 11 are distributed and arranged at positions on the chassis 1 corresponding to the air inlet 8 .

[0016] Optionally, a plurality of punched flanging holes 16 are provided on the rack 2 , and positions of the punched flanging holes 16 correspond to positions of the fans 11 on the frame 5 .

[0017] Optionally, within the installation area 13, the modules are arranged in the following comprehensive layout:

[0018] Heavy and light modules are arranged alternately;

[0019] Arrange most modules towards the central axis of frame 5;

[0020] Arrange modules with light weight and low heat generation at the air outlet of frame 5;

[0021] Modules with high heat generation are placed near the air inlet;

[0022] Modules with low heat generation are placed away from the air inlet.

[0023] Optionally, the rack 2 and the chassis 1 are modeled synchronously using air ducts.

[0024] The present application also proposes an airborne device, comprising the airborne structural heat dissipation device as described above.

[0025] In view of the characteristics of the airborne device, such as small installation space, high module density, high vibration level, and high heat dissipation, the embodiment of the present invention designs an integrated structure to improve the heat dissipation capacity of the device.

[0026] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference symbols are used throughout the drawings to represent the same components. In the drawings:

[0028] Figure 1 This is an exploded view of the airborne structural heat dissipation integrated device of the present application;

[0029] Figure 2 This is an example of the partial structure of the airborne structural heat dissipation integrated device of the present application after removing the upper cover plate;

[0030] Figure 3 A bottom view of the airborne structural heat dissipation integrated device of the present application;

[0031] Figure 4 、 5 Left and right views of the airborne structural heat dissipation integrated device of this application;

[0032] Figure 6 An exploded view of the chassis of the airborne structural heat dissipation integrated device of this application;

[0033] Figure 7 This is an example of a frame cross-section of the airborne structural heat dissipation integrated device of this application;

[0034] Figure 8 A bottom view of the frame of the airborne structural heat dissipation integrated device of the present application;

[0035] Figure 9 This is an example of the rack structure of the airborne structural heat dissipation integrated device of this application;

[0036] Figure 10 This is an example of the overall structure of the airborne structural heat dissipation integrated device of this application.

[0037] Figure markings: 1. Chassis; 2. Rack; 3. Locking mechanism; 4. Vibration damping strip; 5. Frame; 6. Upper cover; 7. Lower cover; 8. Air inlet; 9. Air outlet; 10. Module; 11. Fan; 12. Channel; 13. Module installation area; 14. Forced air cooling area; 15. Multifunctional fin; 16. Stamped flange hole. DETAILED DESCRIPTION

[0038] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0039] The embodiment of the present application provides an airborne structure heat dissipation device based on forced air cooling, such as Figures 1-10 Shown, including:

[0040] A chassis 1 is provided with a rack 2 therein, and its sidewalls are provided with air inlets 8 and air outlets 9. The chassis 1 includes a frame 5, an upper cover 6, and a lower cover 7. The air inlets 8 and air outlets 9 are provided on the frame 5. The frame 5 is manufactured using an integrated process, which ensures structural strength while reducing thermal resistance along the heat dissipation path. In some embodiments, the rack 2 and the chassis 1 are modeled using synchronized air ducts.

[0041] The frame 5 includes an upper structure and a lower structure that are tightly connected; the upper structure is used to provide an installation area 13 for the module, and the lower structure serves as a forced air cooling and heat dissipation area 14.

[0042] In this embodiment, the upper structure and the lower structure are tightly connected together, which can ensure that the overall structure of the frame 5 is compact and that the heat on the module 10 is quickly transferred to the heat dissipation area.

[0043] The frame 2 is connected to the chassis 1 through a locking mechanism 3;

[0044] The vibration damping strip 3 is provided between the frame 2 and the chassis 1 to provide a buffering effect for the frame 2 .

[0045] In some embodiments, within the installation area 13, the modules are arranged in the following comprehensive layout:

[0046] Heavy and light modules are arranged alternately;

[0047] Arrange most modules towards the central axis of frame 5;

[0048] Arrange modules with light weight and low heat generation at the air outlet of frame 5;

[0049] Modules with high heat generation are placed near the air inlet;

[0050] Modules with low heat generation are placed away from the air inlet.

[0051] Within the specific installation area 13, the relative weight of each module 10 is taken into consideration. Heavier and lighter modules 10 are arranged alternately, with the majority of modules 10 positioned as close to the central axis of the frame 5 as possible. Furthermore, lighter, less calorific modules 10 are positioned near the air outlet of the frame 5 to adjust the center of gravity of the entire chassis 1 and ensure its balance, positioning its center of gravity at the center of the structure. Furthermore, within the module installation area 13, modules 10 with greater calorific value are installed near the air inlet, while modules 10 with less calorific value are installed away from the air inlet. This improves the temperature uniformity of heat dissipation throughout the chassis 1 and enhances its heat dissipation capacity. This layout ensures both the balance of the entire frame 5, and ultimately the entire chassis 1, and the temperature uniformity of heat dissipation within the chassis 1.

[0052] In some embodiments, the air inlet 8 and the air outlet 9 are a plurality of grooves 12 on the side of the frame 5 , which can reduce the weight of the frame 5 and improve the heat dissipation capacity of the frame 5 while ensuring the strength of the frame 5 .

[0053] In some embodiments, the forced air cooling heat dissipation area 14 is provided with a plurality of multifunctional fins 15 to improve the strength and heat dissipation performance of the frame 5 based on the multifunctional fins 15. Specifically, in this application, the multifunctional fins 15 serve as both reinforcing ribs of the entire frame 5 and heat dissipation fins that expand the heat dissipation area, thereby increasing both the rigidity and heat dissipation capacity of the frame 5.

[0054] In some embodiments, a plurality of fans 11 are distributed on the chassis 1 at positions corresponding to the air inlet 8 .

[0055] In some embodiments, the rack 2 is provided with a plurality of punched flanging holes 16, the locations of which correspond to the positions of the fans 11 on the frame 5. These punched flanging holes 16 on the rack 2 are formed using a punched flanging process. They serve as reinforcement ribs, increasing the rigidity and reducing the weight of the rack 2, while also providing fresh air for the fans 11 embedded in the chassis 1. The punched flanging holes 16 on the rack 2 are symmetrically arranged to ensure the balance and lightweight nature of the rack 2.

[0056] This application adopts an integrated structural heat dissipation design method, the frame adopts an integrated processing technology, each module adopts a comprehensive layout method, and the chassis and rack adopt synchronous air duct modeling.

[0057] The frame of this application utilizes an integrated manufacturing process, which not only increases its strength but also reduces thermal resistance along its heat transfer path. Furthermore, the grooves on the frame's sides enhance strength, reduce mass, and improve heat dissipation. The double-layer structure reduces the frame's volume and weight while also improving its heat dissipation capacity. The multifunctional fins increase the frame's rigidity and enhance its heat dissipation capabilities.

[0058] The various modules of this application adopt a comprehensive layout method, which can not only ensure the balance of the entire frame and even the entire chassis, but also ensure the temperature uniformity of the chassis heat dissipation. In the module installation area, the relative weight of each module is taken into consideration, and the modules with large weight and small weight are arranged alternately. Most modules are arranged as close to the central axis of the frame as possible. In addition, modules with small weight and small heat generation are arranged near the air outlet of the chassis to adjust the center of gravity of the entire chassis so that the center of gravity of the chassis is located at the center of the structure to ensure its balance. At the same time, the modules with larger heat generation are installed near the air inlet, and the modules with smaller heat generation are installed near the air outlet, which improves the temperature uniformity of the heat dissipation of the entire chassis.

[0059] The chassis and rack of the present application adopt synchronous air duct modeling, and a number of symmetrically distributed stamped flange holes are provided on the rack, which can not only improve the rigidity of the rack and reduce the weight of the rack, but also serve as air inlets, enabling fresh air to be obtained for the embedded fans distributed on the chassis.

[0060] The present application also proposes an airborne device, comprising the airborne structural heat dissipation device as described above.

[0061] In view of the characteristics of the airborne device, such as small installation space, high module density, high vibration level, and high heat dissipation, the embodiment of the present invention designs an integrated structure to improve the heat dissipation capacity of the device.

[0062] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0063] The serial numbers of the above embodiments of the present invention are for description only and do not represent the advantages or disadvantages of the embodiments.

[0064] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are protected by the present invention.

Claims

1. An airborne structural heat dissipation device based on forced air cooling, characterized in that: include: A chassis (1) having an air inlet (8) and an air outlet (9) provided on its side wall, the chassis (1) comprising a frame (5), an upper cover (6) and a lower cover (7), the air inlet (8) and the air outlet (9) being provided on the frame (5), and the frame (5) being manufactured using an integrated processing technology; The frame (5) comprises a tightly connected upper structure and a lower structure; The upper structure is used to provide a mounting area (13) for the module; The lower structure serves as a forced air cooling heat dissipation area (14); A frame (2) is connected to the chassis (1) via a locking mechanism (3); a vibration damping strip (4) disposed between the frame (2) and the chassis (1) to provide a buffering effect for the frame (2); The air inlet (8) and the air outlet (9) are a plurality of grooves on the side of the frame (5); In the installation area (13), each module is arranged in the following comprehensive layout: Heavy and light modules are arranged alternately; Arrange most modules towards the central axis of the frame (5); Arrange modules with light weight and low heat generation at the air outlet of the frame (5); Modules with high heat generation are placed near the air inlet; Modules with low heat generation are placed away from the air inlet; The rack (2) and the chassis (1) are modeled synchronously using air ducts; The forced air cooling heat dissipation area (14) is provided with a plurality of multifunctional fins (15) so as to improve the strength and heat dissipation performance of the frame (5) based on the multifunctional fins (15); The frame (2) is provided with a plurality of punched flanging holes (16), and the positions of the punched flanging holes (16) correspond to the positions of the fans (11) on the frame (5).

2. The airborne structural heat dissipation device according to claim 1, wherein: A plurality of fans (11) are distributed and arranged at positions on the chassis (1) corresponding to the air inlet (8).

3. An airborne device, characterized in that: It comprises the airborne structural heat dissipation device as claimed in claim 1 or 2.

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