Connector temperature rise measurement system, method, device, electronic equipment and medium

Abstract

The present disclosure relates to the field of hardware testing technology, and specifically to a connector temperature rise measurement system, method, device, electronic equipment, and medium. The system includes: a connector assembly, including a male connector and a female connector, a first through-hole is provided on the male outer conductor of the male connector, and a second through-hole is provided on the female outer conductor of the female connector. When the male connector and the female connector are connected, the male outer conductor contacts the female outer conductor, the male inner conductor of the male connector contacts the female inner conductor of the female connector, and the first through-hole and the second through-hole are connected; a temperature probe passes through the first through-hole and the second through-hole to contact the connection between the male inner conductor and the female inner conductor, and is used to measure the temperature of the connection between the male inner conductor and the female inner conductor. This technical solution can simply and conveniently measure the temperature of the inner conductor contact of the connector assembly when the inner conductor is in the working state, and is used to test the temperature rise of the inner conductor contact of the connector assembly.

Description

Technical Field

[0001] The present disclosure relates to the technical field of hardware testing, and in particular to a connector temperature rise measurement system, method, device, electronic equipment, and medium. Background Art

[0002] Connectors play a crucial role in energy and signal transmission in communication systems, such as RF and microwave systems. The performance of these systems is closely linked to the performance of their connectors. Connectors are typically used with two connectors of opposite polarity (male and female) interlocked, creating a contact surface. When current is applied, the thermal effect of the current causes the temperature of the connector contact surface to rise sharply, gradually exceeding the ambient temperature, creating a temperature rise effect. This temperature rise can significantly impact connector performance. To investigate the various impacts of connector temperature rise, it is necessary to measure the connector's internal temperature.

[0003] However, due to the complex structure of the connector, which is generally composed of an inner conductor, an insulating medium, an outer conductor, etc., during normal operation, when the male and female heads of a pair of connectors are connected, the highest temperature will appear on the contact surface of the inner conductor, which makes it difficult for the temperature measuring equipment to measure the working connector; in addition, when conducting test experiments, it is necessary to ensure that the signal transmission environment does not change. When high-frequency connectors transmit signals, the characteristic impedance must be stable, and the high-frequency parameters must meet the transmission standards. These temperature measurement conditions will further cause difficulties in measuring the internal temperature of the connector. Therefore, there is an urgent need for a measurement solution that can overcome the above difficulties and measure the internal temperature of the connector. Summary of the Invention

[0004] In order to solve the problems in the related art, embodiments of the present disclosure provide a connector temperature rise measurement system, method, device, electronic device, and medium.

[0005] In a first aspect, an embodiment of the present disclosure provides a temperature rise measurement system for a connector.

[0006] Specifically, the system includes:

[0007] A connector assembly comprising a male connector and a female connector, wherein a first through-hole is defined on the male outer conductor of the male connector, and a second through-hole is defined on the female outer conductor of the female connector. When the male connector and the female connector are connected, the male outer conductor contacts the female outer conductor, the male inner conductor of the male connector contacts the female inner conductor of the female connector, and the first through-hole and the second through-hole are connected.

[0008] A temperature measuring probe passes through the first through hole and the second through hole to contact the connection between the male end inner conductor and the female end inner conductor, and is used to measure the temperature of the connection between the male end inner conductor and the female end inner conductor.

[0009] In a possible implementation manner, a through-hole direction of the first through-hole is perpendicular to a surface of the male end outer conductor, and a through-hole direction of the second through-hole is perpendicular to a surface of the female end outer conductor.

[0010] In a possible implementation manner, the hole formed by the connection between the first through hole and the second through hole is located on a vertical plane of the connection between the male end inner conductor and the female end inner conductor.

[0011] In a possible implementation manner, the first through hole and the second through hole have the same radius.

[0012] In a possible embodiment, the radii of the first through hole and the second through hole meet preset conditions, and the preset conditions include that when the temperature measuring probe passes through the first through hole and the second through hole and contacts the connection between the male end inner conductor and the female end inner conductor, the standing wave ratio of the connector assembly is within a predetermined range corresponding to the connector assembly.

[0013] In a possible implementation manner, a heat conductive layer is provided on the probe surface of the temperature measuring probe.

[0014] In a possible implementation, the heat-conducting layer includes thermally conductive silicone grease.

[0015] In a possible implementation, the connector assembly includes an N-type radio frequency connector assembly.

[0016] In a possible implementation manner, the radius of the first through hole and the second through hole ranges from 1.70 mm to 1.90 mm.

[0017] In a possible implementation, the system further includes:

[0018] A high-power signal generator, used to generate a high-power signal;

[0019] The connector assembly is connected to the high-power signal generator and is used to transmit the high-power signal;

[0020] The load is connected to the connector assembly and is used to receive the signal output by the connector assembly;

[0021] A processor is connected to the temperature measuring probe and is used to obtain the temperature measured by the temperature measuring probe.

[0022] In a possible implementation, the system further includes:

[0023] a first coupler comprising a first input end, a first output end, and a second output end, wherein the first input end is connected to the high-power signal generator, and is configured to receive a high-power signal generated by the high-power signal generator through the first input end, and split the high-power signal into a first signal and a second signal according to a first predetermined ratio, wherein the first signal is output from the first output end, and the second signal is output from the second output end;

[0024] a first amplifier connected to the first output end, configured to receive a first signal from the first output end and output a first amplified signal, wherein the first amplified signal is a signal obtained by amplifying the first signal according to the first predetermined ratio;

[0025] The connector component is connected to the second output end and is used to receive the first signal from the second output end;

[0026] a second coupler comprising a second input end, a third output end, and a fourth output end, wherein the second input end is connected to the connector assembly and is configured to split the signal output by the connector assembly into a third signal and a fourth signal according to a second predetermined ratio, wherein the third signal is output from the third output end, and the fourth signal is output from the fourth output end;

[0027] a second amplifier connected to the third output terminal, configured to receive a third signal from the third output terminal and output a second amplified signal, wherein the second amplified signal is a signal obtained by amplifying the third signal according to the second predetermined ratio;

[0028] The load is connected to the fourth output terminal and is used to receive the fourth signal from the fourth output terminal;

[0029] The processor is used to obtain the input signal power and the output signal power of the connector assembly through the first amplifier and the second amplifier, and analyze the temperature rise of the connector assembly based on the temperature measured by the temperature measuring probe and the input signal power and the output signal power of the connector assembly to obtain an analysis result.

[0030] In a second aspect, an embodiment of the present disclosure provides a method for measuring the temperature rise of a connector.

[0031] Specifically, the method includes:

[0032] Measuring the temperature of the connection between the male end inner conductor and the female end inner conductor in the connector assembly by a temperature measuring probe;

[0033] Based on the temperature measured by the temperature measuring probe, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

[0034] In a possible implementation, it includes:

[0035] obtaining input signal power and output signal power of the connector assembly through a first amplifier and a second amplifier;

[0036] The analyzing the temperature rise of the connector assembly based on the temperature measured by the temperature measuring probe to obtain an analysis result includes:

[0037] Based on the temperature measured by the temperature measuring probe, the input signal power and the output signal power of the connector assembly, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

[0038] In a possible implementation, measuring the temperature of a connection between the male inner conductor and the female inner conductor in the connector assembly by using a temperature measuring probe includes:

[0039] Before the connector assembly is powered on, collecting the initial temperature measured by the temperature probe;

[0040] After the connector assembly, the temperature measured by the temperature measuring probe is periodically collected until the change in the collected temperature within a preset time period is less than a preset threshold.

[0041] In a third aspect, an embodiment of the present disclosure provides a temperature rise measurement device for a connector.

[0042] Specifically, the device includes:

[0043] a temperature measurement module configured to measure the temperature of a connection between the male end inner conductor and the female end inner conductor in the connector assembly through a temperature measurement probe;

[0044] The analysis module is configured to analyze the temperature rise of the connector assembly based on the temperature measured by the temperature measuring probe to obtain an analysis result.

[0045] In a possible implementation, it includes:

[0046] an acquisition module, configured to acquire input signal power and output signal power of the connector assembly through a first amplifier and a second amplifier;

[0047] The analysis module is configured to:

[0048] Based on the temperature measured by the temperature measuring probe, the input signal power and the output signal power of the connector assembly, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

[0049] In a possible implementation, the temperature measurement module is configured as follows:

[0050] Before the connector assembly is powered on, collecting the initial temperature measured by the temperature probe;

[0051] After the connector assembly, the temperature measured by the temperature measuring probe is periodically collected until the change in the collected temperature within a preset time period is less than a preset threshold.

[0052] In a fourth aspect, an embodiment of the present disclosure provides an electronic device comprising a memory and a processor, wherein the memory is used to store one or more computer instructions, and wherein the one or more computer instructions are executed by the processor to implement a method as described in any one of the second aspects.

[0053] In a fifth aspect, an embodiment of the present disclosure provides a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the method as described in any one of the second aspects is implemented.

[0054] According to the technical solution provided in the embodiment of the present disclosure, through holes can be opened at corresponding positions of the male connector and the female connector, so that the temperature measuring probe can pass through these through holes to contact the connection between the male inner conductor and the female inner conductor, and measure the temperature of the connection between the male inner conductor and the female inner conductor, thereby solving the problem that the temperature at the contact point of the inner conductor of the connector is difficult to measure, and is simple and easy. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Other features, objectives and advantages of the present disclosure will become more apparent through the following detailed description of non-limiting embodiments in conjunction with the accompanying drawings. In the accompanying drawings:

[0056] Figure 1 A schematic structural diagram of a connector temperature rise measurement system according to an embodiment of the present disclosure is shown.

[0057] Figure 2 1 is a block diagram illustrating a temperature rise measurement system for a connector according to an embodiment of the present disclosure.

[0058] Figure 3 1 is a block diagram illustrating a temperature rise measurement system for a connector according to an embodiment of the present disclosure.

[0059] Figure 4 A schematic flow chart of a method for measuring the temperature rise of a connector according to an embodiment of the present disclosure is shown.

[0060] Figure 5 A structural block diagram of a temperature rise measuring device for a connector according to an embodiment of the present disclosure is shown.

[0061] Figure 6 A structural block diagram of an electronic device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0062] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement them. In addition, for the sake of clarity, parts not related to the description of the exemplary embodiments are omitted in the accompanying drawings.

[0063] In the present disclosure, it should be understood that terms such as "include" or "have" are intended to indicate the presence of features, numbers, steps, actions, components, parts, or combinations thereof disclosed in the present specification, and are not intended to exclude the possibility that one or more other features, numbers, steps, actions, components, parts, or combinations thereof exist or are added.

[0064] It should also be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present disclosure may be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0065] As mentioned above, due to the complex structure of the connector, which is generally composed of an inner conductor, an insulating medium, an outer conductor, etc., during normal operation, when the male and female connectors of a pair of connectors are connected, the highest temperature will appear on the contact surface of the inner conductor. This makes it difficult for temperature measuring equipment to measure the working connector; therefore, there is an urgent need for a measurement solution that can overcome the above difficulties and measure the internal temperature of the connector.

[0066] In order to solve the above problems, the present disclosure provides a connector temperature rise measurement system, method, device, electronic equipment and medium.

[0067] Figure 1 FIG. 1 is a schematic diagram showing a structure of a temperature rise measurement system for a connector according to an embodiment of the present disclosure. Figure 1 As shown, the connector temperature rise measurement system includes: a connector component 10 and a temperature measuring probe 11.

[0068] In one possible implementation, Figure 1 As shown, the connector assembly 10 includes a male connector 101 and a female connector 102 that matches the male connector 101. The male connector 101 includes a male outer conductor 1011, a male insulating medium 1012, and a male inner conductor 1013. The female connector 102 includes a female outer conductor 1021, a female insulating medium 1022, and a female inner conductor 1023. When the male connector 101 and the female connector 102 are connected, the male outer conductor 1011 contacts the female outer conductor 1021, and the male inner conductor 1013 contacts the female inner conductor 1023. In this way, they are connected to each other, which can ensure impedance matching and form a stable high-frequency signal transmission path. It should be noted here that in order to prevent the two connectors from loosening contact, the connection can be reinforced by the threaded connection lines of the threaded structure on the two connector shells.

[0069] In one possible embodiment, a first through hole 10111 is provided on the male end outer conductor 1011 of the connector assembly 10, and a second through hole 10211 is provided on the female end outer conductor 1021 of the female connector 102. When the male connector 101 and the female connector 102 are connected, the first through hole 10111 and the second through hole 10211 are connected; the temperature measuring probe 11 can pass through the first through hole 10111 and the second through hole 10211 to contact the connection between the male end inner conductor 1013 and the female end inner conductor 1023. Figure 1 As shown, the connection between the male inner conductor 1013 and the female inner conductor 1023 is the outer surface of the female inner conductor 1023 at the location where the male inner conductor 1013 and the female inner conductor 1023 are connected. In this way, the temperature measuring probe 11 can measure the temperature of the connection between the male inner conductor 1013 and the female inner conductor 1023.

[0070] In one possible embodiment, a milling machine can be used to drill holes in the outer conductors of the two connectors in the connector assembly 10, forming a first through hole 10111 on the male outer conductor 1011 of the male connector 101, and forming a second through hole 10211 on the female outer conductor 1021 of the female connector 102.

[0071] In one possible embodiment, the temperature measuring probe 11 may be a thermistor probe, and the total length of the probe and the pin of the temperature measuring probe is greater than the distance from the outer surface of the male end outer conductor 1011 to the outer surface of the female end inner conductor 1023, so that the probe of the temperature measuring probe 11 can contact the connection between the male end inner conductor 1013 and the female end inner conductor 1023 after passing through the first through hole 10111 and the second through hole 10211.

[0072] In this embodiment, through holes can be opened at corresponding positions of the male connector 101 and the female connector 102, so that the temperature measuring probe 11 can pass through these through holes to contact the connection between the male inner conductor 1013 and the female inner conductor 1023, and measure the temperature of the connection between the male inner conductor 1013 and the female inner conductor 1023, thereby solving the problem of difficulty in measuring the temperature at the contact point of the inner conductors of the connectors, and is simple and easy.

[0073] In a possible implementation, the through-hole direction of the first through-hole 10111 is perpendicular to the surface of the male outer conductor 1011 , and the through-hole direction of the second through-hole 10211 is perpendicular to the surface of the female outer conductor 1021 .

[0074] In this way, the thickness of the first through hole 10111 and the second through hole 10211 formed will be minimized, reducing the distance that the temperature measuring probe 11 passes through when measuring temperature, and preventing the temperature measuring probe 11 from being too short and unable to contact the connection of the inner conductor after passing through the through hole.

[0075] In a possible implementation manner, the hole formed by the connection between the first through hole 10111 and the second through hole 10211 is located on a vertical plane of the connection between the male end inner conductor 1013 and the female end inner conductor 1023 .

[0076] In this way, the direction of the hole formed after the first through hole 10111 and the second through hole 10211 are connected is perpendicular to the plane of the connection between the male end inner conductor 1013 and the female end inner conductor 1023. When the temperature measuring probe 11 passes through the two through holes and contacts the connection, the temperature measuring probe 11 is perpendicular to the connection. This can also reduce the distance that the temperature measuring probe 11 passes through when measuring temperature, and avoid the temperature measuring probe 11 being too short and unable to contact the connection of the inner conductor after passing through the through hole.

[0077] In a possible implementation manner, the radius of the first through hole 10111 and the radius of the second through hole 10211 are the same; thus, drilling is convenient and errors are avoided.

[0078] In a possible embodiment, it is also necessary to ensure that the signal transmission environment does not change when performing temperature measurement. The high-frequency connector needs to ensure the stability of the characteristic impedance when performing signal transmission, and also needs to ensure that the high-frequency parameters meet the transmission standards. Therefore, the radius of the first through hole 10111 and the second through hole 10211 meet the preset conditions. The preset conditions include that when the temperature measuring probe 11 passes through the first through hole 10111 and the second through hole 10211 and contacts the connection between the male end inner conductor 1013 and the female end inner conductor 1023, the standing wave ratio of the connector assembly 10 is within the predetermined range corresponding to the connector assembly.

[0079] In this embodiment, the radius of the first through hole 10111 and the second through hole 10211 cannot be too small, and it is necessary to ensure that the temperature probe 11 can pass through. At the same time, the radius of the first through hole 10111 and the second through hole 10211 cannot be too large, because a large through hole will affect the standing wave ratio of the connector assembly 10. Therefore, in this embodiment, the radius needs to satisfy the requirement that after the connector assembly 10 with holes is inserted into the temperature probe 11, its standing wave ratio is within the predetermined range corresponding to the connector assembly 10. Different types of connector assemblies 10 have different corresponding predetermined ranges. For example, when the connector assembly 10 is an N-type RF connector assembly, the predetermined range of its standing wave ratio includes less than or equal to 1.05; when the connector assembly 10 is a millimeter wave connector, the predetermined range of its standing wave ratio includes less than or equal to 1.50; and so on.

[0080] In one possible embodiment, in order to more accurately measure the temperature of the connection between the male inner conductor 1013 and the female inner conductor 1023, a heat-conducting layer can be provided on the probe surface of the temperature measuring probe 11, so that the heat-conducting layer can conduct the heat of the connection to the probe surface of the temperature measuring probe 11, so that the temperature measuring probe 11 can more accurately measure the temperature of the connection.

[0081] In one possible embodiment, the thermal conductive layer is thermal conductive silicone grease, which is commonly known as heat dissipation paste. It is a thermal conductive organic silicone grease-like composite made of organic silicone as the main raw material and added with heat-resistant and thermally conductive materials. The thermal conductive silicone grease has high thermal conductivity, excellent thermal conductivity and good electrical insulation. Using the thermal conductive silicone grease as a thermal conductive layer can better contact the connection and conduct the heat of the connection to the probe surface of the temperature probe 11 as much as possible, so that the temperature probe 11 can more accurately measure the temperature of the connection, and its temperature measurement accuracy is higher than 0.1K.

[0082] In a possible implementation, the connector assembly 10 includes an N-type radio frequency connector assembly.

[0083] In this embodiment, the N-type RF connector assembly has a suitable standing wave ratio, and the loss after the hole is opened is almost the same as that of the N-type RF connector without the hole, and is more suitable for this test system.

[0084] In a possible embodiment, when the connector assembly 10 is an N-type RF connector assembly, the radius values of the first through hole 10111 and the second through hole 10211 need to satisfy the requirement that the temperature probe 11 can pass through on the one hand, and on the other hand, need to ensure that the standing wave ratio of the connector assembly 10 with a hole is less than or equal to 1.05 after the temperature probe 11 is inserted. For example, it can be 1.65mm, 1.82mm, 1.94mm, etc.; preferably, the radius values of the first through hole 10111 and the second through hole 10211 range from 1.70mm to 1.90mm, for example, it can be 1.70mm, 1.80mm and 1.90mm, etc.

[0085] In this embodiment, the two connectors in the N-type RF connector assembly have different base materials, plating materials, and thicknesses, and the radii of the first through hole 10111 and the second through hole 10211 may be different. The plating material herein refers to the metal plating located on the inner conductor and outer conductor of the female connector 102 or the male connector 101. For example, the base material of the N-type RF connector assembly includes brass, and the plating materials include gold, silver, nickel, and a ternary alloy, with the plating thickness not exceeding 12 μm. In this case, the radii of the first through hole 10111 and the second through hole 10211 may be 1.80 mm.

[0086] In one possible implementation, Figure 2 FIG. 1 is a block diagram showing a temperature rise measurement system for a connector according to an embodiment of the present disclosure. Figure 2 As shown, the system further includes:

[0087] A high-power signal generator 13, used to generate a high-power signal;

[0088] The connector assembly 10 is connected to the high-power signal generator 13 for transmitting the high-power signal;

[0089] The load 14 is connected to the connector assembly 10 and is used to receive the signal output by the connector assembly 10;

[0090] The processor 15 is connected to the temperature measuring probe 11 and is used to obtain the temperature measured by the temperature measuring probe.

[0091] In this embodiment, when executing the temperature rise measurement method of the connector, it is necessary to measure the temperature rise of the connector under actual working conditions. The temperature measuring probe 11 can be first inserted into the first through hole 10111 and the second through hole 10211, so that the temperature measuring probe 11 contacts the connection between the male end inner conductor 1013 and the female end inner conductor 1023. At this time, the various components in the system can be started to put the connector assembly 10 into working state.

[0092] In this embodiment, the high-power signal generator 13 can generate a high-power signal. Optionally, the high-power signal generator 13 includes a signal generator and a power amplifier. The signal generator can generate an AC signal with a predetermined frequency (such as AGHz), and the AC signal is amplified by the power amplifier into a high-power signal (such as BW).

[0093] In this embodiment, the connector assembly 10 is in a working state and can transmit the high-power signal generated by the high-power signal generator 13 to the load 14. During the process of the connector assembly 10 transmitting the high-power signal, the temperature probe 11 can measure the temperature at the connection between the male inner conductor 1013 and the female inner conductor 1023 in the connector assembly 10 and send it to the processor 15. The processor 15 can sample and record the temperature measured by the temperature probe 11. The processor 15 can periodically obtain the temperature measured by the temperature probe 11 until the change in the obtained temperature within a preset time period is less than a preset threshold. For example, the processor 15 can obtain the temperature measured by the temperature probe 11 every 30 seconds until the change in the obtained temperature within 2 minutes is less than 0.5K. At this time, the temperature at the contact of the inner conductor of the connector has reached the maximum steady-state value and the acquisition can be stopped.

[0094] In this embodiment, the processor 15 may be a temperature display instrument, which may display the temperature measured by the temperature measuring probe 11 . The measurement personnel may record the temperature measured by the temperature measuring probe 11 based on the display of the temperature display instrument.

[0095] It should be noted here that when using this measurement system to measure temperature, sufficient flow of air in the measurement environment can be guaranteed and the room temperature remains unchanged.

[0096] In one possible implementation, Figure 3 FIG. 1 is a block diagram showing a temperature rise measurement system for a connector according to an embodiment of the present disclosure. Figure 3 As shown, the system further includes:

[0097] a first coupler 16 comprising a first input end, a first output end, and a second output end, wherein the first input end is connected to the high-power signal generator 13, and is configured to receive the high-power signal generated by the high-power signal generator 13 through the first input end, and split the high-power signal into a first signal and a second signal according to a first predetermined ratio, wherein the first signal is output from the first output end, and the second signal is output from the second output end;

[0098] a first amplifier 17 connected to the first output end, configured to receive the first signal from the first output end and output a first amplified signal, where the first amplified signal is a signal obtained by amplifying the first signal according to the first predetermined ratio;

[0099] The connector assembly 10 is connected to the second output end and is used to receive the first signal from the second output end;

[0100] a second coupler 18 comprising a second input terminal, a third output terminal, and a fourth output terminal, wherein the second input terminal is connected to the connector assembly 10 and is configured to split the signal output by the connector assembly 10 into a third signal and a fourth signal according to a second predetermined ratio, wherein the third signal is output from the third output terminal, and the fourth signal is output from the fourth output terminal;

[0101] a second amplifier 19 connected to the third output terminal, configured to receive a third signal from the third output terminal and output a second amplified signal, wherein the second amplified signal is a signal obtained by amplifying the third signal according to the second predetermined ratio;

[0102] The load 14 is connected to the fourth output terminal and is used to receive the fourth signal from the fourth output terminal;

[0103] The processor 15 is connected to the first amplifier 17 and the second amplifier 19, and is used to obtain the first amplified signal and the second amplified signal output by the first amplifier 17 and the second amplifier 19, and analyze the temperature rise of the connector component based on the temperature measured by the temperature measuring probe, the first amplified signal and the second amplified signal to obtain an analysis result.

[0104] In this embodiment, the power of the high-power signal generated by the high-power signal generator 13 can be divided into a first signal and a second signal according to a first predetermined ratio (such as 1000:1) through the first coupler 16. The first signal can be a low-power signal, and the second signal can be a high-power signal. The second signal is input into the connector assembly 10 and transmitted to the load 14. The first signal is transmitted to the first amplifier 17, and the first amplifier 17 outputs a first amplified signal. The first amplified signal is a signal obtained by amplifying the first signal according to the first predetermined ratio (such as amplifying 999 times. It should be noted here that it is amplified 1000 times in actual use). The first amplified signal is theoretically the same as the signal power input to the connector assembly 10, and plays a role in monitoring the input signal power of the connector assembly 10.

[0105] In this embodiment, the output signal of the connector assembly 10 can be divided into a third signal and a fourth signal according to a second predetermined ratio (such as 1000:1) through the second coupler 18. The third signal can be a low-power signal and the fourth signal can be a high-power signal. The fourth signal is transmitted to the load 14, and the third signal is transmitted to the second amplifier 19. The second amplifier 19 outputs a second amplified signal. The second amplified signal is a signal obtained by amplifying the third signal according to the second predetermined ratio (such as amplified 1000 times). The second amplified signal has the same power as the signal output by the connector assembly 10, and plays a role in monitoring the output signal power of the connector assembly 10.

[0106] In this embodiment, the power of the first amplified signal output by the first amplifier 17 is the signal power input to the connector assembly 10, and the power of the second amplified signal output by the second amplifier 19 is the signal power output by the connector assembly 10. The processor 15 can obtain the input signal power and the output signal power of the connector assembly 10 through the first amplifier 17 and the second amplifier 19. Combined with the temperature measured by the temperature measuring probe 11, the temperature rise of the connector assembly 10 can be analyzed to obtain an analysis result. The analysis result can be obtained by statistically analyzing these data, such as the power loss of the connector (input signal power-output signal power), temperature rise (steady-state maximum value-current ambient temperature), etc.

[0107] It should be noted that the first amplifier 17 and the second amplifier 19 may be a spectrum analyzer. After receiving the signal, the spectrum analyzer may display the signal method, thereby outputting the amplified signal.

[0108] Figure 4 A schematic flow chart of a method for measuring the temperature rise of a connector according to an embodiment of the present disclosure is shown. Figure 4 As shown, the method may include the following steps:

[0109] In step S401, the temperature of the connection between the male end inner conductor and the female end inner conductor in the connector assembly is measured by a temperature measuring probe;

[0110] In step S402, the temperature rise of the connector assembly is analyzed based on the temperature measured by the temperature measuring probe to obtain an analysis result.

[0111] In this embodiment, the above-mentioned measurement system can be used to perform temperature rise measurement, and the temperature measuring probe 11 can be inserted into the above-mentioned first through hole 10111 and the second through hole 10211, so that the temperature measuring probe 11 contacts the connection between the male end inner conductor 1013 and the female end inner conductor 1023 in the connector assembly 10. In this way, the temperature of the connection between the male end inner conductor 1013 and the female end inner conductor 1023 in the connector assembly 10 can be measured.

[0112] In this embodiment, based on the temperature measured by the temperature measuring probe 11, the temperature rise of the connector assembly 10 can be analyzed to obtain an analysis result; for example, the temperature rise can be measured when the plating metal and the base metal in the same type of connector assembly 10 are different, and the plating metal and the base metal with the least temperature rise effect can be analyzed, etc.

[0113] In a possible implementation, the method may further include:

[0114] obtaining input signal power and output signal power of the connector assembly through a first amplifier and a second amplifier;

[0115] The analyzing the temperature rise of the connector assembly based on the temperature measured by the temperature measuring probe to obtain an analysis result includes:

[0116] Based on the temperature measured by the temperature measuring probe, the input signal power and the output signal power of the connector assembly, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

[0117] In this embodiment, you can also use Figure 3 The system shown obtains the input signal power and output signal power of the connector component 10 through the first amplifier 17 and the second amplifier 19. Through the input signal power and output signal power of the connector component 10, combined with the temperature measured by the temperature measuring probe 11, the temperature rise of the connector component 10 can be analyzed to obtain an analysis result. The analysis result can be obtained by statistically analyzing these data, such as the power loss of the connector (input signal power-output signal power), temperature rise (steady-state maximum value-current ambient temperature), etc.

[0118] In a possible implementation, measuring the temperature of a connection between the male inner conductor and the female inner conductor in the connector assembly by using a temperature measuring probe includes:

[0119] Before the connector assembly is powered on, collecting the initial temperature measured by the temperature probe;

[0120] After the connector assembly, the temperature measured by the temperature measuring probe is periodically collected until the change in the collected temperature within a preset time period is less than a preset threshold.

[0121] In this embodiment, when the change in the temperature measured by the temperature probe 11 within a preset time period is less than a preset threshold, it indicates that the temperature at the contact point of the inner conductor of the connector assembly 10 has stabilized. At this time, the temperature measurement can be ended, and the internal temperature rise of the connection assembly is obtained by subtracting the initial temperature from the stable temperature.

[0122] For example, the temperature measured by the temperature measuring probe 11 can be collected every 30 seconds until the collected temperature changes within a range of less than 0.5K within 2 minutes. At this time, the temperature at the contact point of the inner conductor of the connector has reached the maximum steady-state value and the collection can be stopped.

[0123] The technical terms and technical features mentioned in the implementation of this method are the same as or similar to those mentioned in the above-mentioned system implementation. For the interpretation and description of the technical terms and technical features involved in this method, please refer to the explanation and description of the above-mentioned system implementation, and no further details will be given here.

[0124] Figure 5 The following is a block diagram of a temperature rise measurement device for a connector according to an embodiment of the present disclosure. The device can be implemented as part or all of an electronic device through software, hardware, or a combination of both. Figure 5 As shown, the temperature rise measuring device of the connector includes:

[0125] The temperature measurement module 501 is configured to measure the temperature of the connection between the male end inner conductor and the female end inner conductor in the connector assembly through a temperature measurement probe;

[0126] The analysis module 502 is configured to analyze the temperature rise of the connector assembly based on the temperature measured by the temperature measuring probe to obtain an analysis result.

[0127] In one possible implementation, the device further includes:

[0128] an acquisition module, configured to acquire input signal power and output signal power of the connector assembly through a first amplifier and a second amplifier;

[0129] The analysis module 502 is configured to:

[0130] Based on the temperature measured by the temperature measuring probe, the input signal power and the output signal power of the connector assembly, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

[0131] In a possible implementation, the temperature measurement module 501 is configured to:

[0132] Before the connector assembly is powered on, collecting the initial temperature measured by the temperature probe;

[0133] After the connector assembly, the temperature measured by the temperature measuring probe is periodically collected until the change in the collected temperature within a preset time period is less than a preset threshold.

[0134] The technical terms and technical features mentioned in the implementation of this device are the same as or similar to those mentioned in the above-mentioned system implementation. For the interpretation and description of the technical terms and technical features involved in this device, please refer to the explanation and description of the above-mentioned system implementation, and no further details will be given here.

[0135] The present disclosure also discloses an electronic device, Figure 6 A structural block diagram of an electronic device according to an embodiment of the present disclosure is shown.

[0136] like Figure 6As shown, the electronic device 600 includes a memory 601 and a processor 602, wherein the memory 601 is used to store one or more computer instructions, wherein the one or more computer instructions are executed by the processor 602 to implement the method according to the embodiment of the present disclosure.

[0137] The method includes:

[0138] Measuring the temperature of the connection between the male end inner conductor and the female end inner conductor in the connector assembly by a temperature measuring probe;

[0139] Based on the temperature measured by the temperature measuring probe, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

[0140] In one possible implementation, the method further includes:

[0141] obtaining the input signal power and the output signal power of the connector assembly through a first power amplifier and a second amplifier;

[0142] The analyzing the temperature rise of the connector assembly based on the temperature measured by the temperature measuring probe to obtain an analysis result includes:

[0143] Based on the temperature measured by the temperature measuring probe, the input signal power and the output signal power of the connector assembly, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

[0144] In a possible implementation, measuring the temperature of a connection between the male inner conductor and the female inner conductor in the connector assembly by using a temperature measuring probe includes:

[0145] Before the connector assembly is powered on, collecting the initial temperature measured by the temperature probe;

[0146] After the connector assembly, the temperature measured by the temperature measuring probe is periodically collected until the change in the collected temperature within a preset time period is less than a preset threshold.

[0147] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each box in the flowchart or block diagram can represent a module, program segment or part of code, and the module, program segment or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or can be implemented using a combination of dedicated hardware and computer instructions.

[0148] The units or modules involved in the embodiments described in this disclosure may be implemented by software or programmable hardware. The units or modules described may also be provided in a processor, and the names of these units or modules do not, in certain circumstances, constitute limitations on the units or modules themselves.

[0149] As another aspect, the present disclosure further provides a computer-readable storage medium. This computer-readable storage medium may be included in the electronic device or computer system described in the above embodiments, or may be a standalone computer-readable storage medium not incorporated into the device. The computer-readable storage medium stores one or more programs, which are used by one or more processors to execute the methods described in the present disclosure.

[0150] The above description is merely a preferred embodiment of the present disclosure and an illustration of the technical principles employed. Those skilled in the art should understand that the scope of the invention herein is not limited to the technical solutions formed by the specific combination of the above-mentioned technical features, but also encompasses other technical solutions formed by any combination of the above-mentioned technical features or their equivalents without departing from the inventive concept. For example, a technical solution formed by replacing the above-mentioned features with (but not limited to) technical features with similar functions disclosed in this disclosure.

Claims

1. A connector temperature rise measurement system, characterized in that: include: A connector assembly comprising a male connector and a female connector, wherein a first through-hole is defined on the male outer conductor of the male connector, and a second through-hole is defined on the female outer conductor of the female connector. When the male connector and the female connector are connected, the male outer conductor contacts the female outer conductor, the male inner conductor of the male connector contacts the female inner conductor of the female connector, and the first through-hole and the second through-hole are connected. a temperature measuring probe, passing through the first through hole and the second through hole and contacting the connection between the male end inner conductor and the female end inner conductor, for measuring the temperature of the connection between the male end inner conductor and the female end inner conductor; a first coupler comprising a first input end, a first output end, and a second output end, wherein the first input end is connected to a high-power signal generator, and is configured to receive a high-power signal generated by the high-power signal generator through the first input end, and split the high-power signal into a first signal and a second signal according to a first predetermined ratio, wherein the first signal is output from the first output end, and the second signal is output from the second output end; a first amplifier connected to the first output end, configured to receive a first signal from the first output end and output a first amplified signal, wherein the first amplified signal is a signal obtained by amplifying the first signal according to the first predetermined ratio; The connector component is connected to the second output end and is used to receive the first signal from the second output end; a second coupler comprising a second input end, a third output end, and a fourth output end, wherein the second input end is connected to the connector assembly and is configured to split the signal output by the connector assembly into a third signal and a fourth signal according to a second predetermined ratio, wherein the third signal is output from the third output end, and the fourth signal is output from the fourth output end; a second amplifier connected to the third output terminal, configured to receive a third signal from the third output terminal and output a second amplified signal, wherein the second amplified signal is a signal obtained by amplifying the third signal according to the second predetermined ratio; a load, connected to the fourth output terminal, and configured to receive the fourth signal from the fourth output terminal; A processor is connected to the first amplifier and the second amplifier, and is used to obtain the first amplified signal and the second amplified signal output by the first amplifier and the second amplifier, and analyze the temperature rise of the connector component based on the temperature measured by the temperature measuring probe, the first amplified signal, and the second amplified signal to obtain an analysis result.

2. The system according to claim 1, wherein: The through-hole direction of the first through-hole is perpendicular to the surface of the male end outer conductor, and the through-hole direction of the second through-hole is perpendicular to the surface of the female end outer conductor.

3. The system according to claim 1, wherein: A hole formed by the communication between the first through hole and the second through hole is located on a vertical plane of a connection between the male end inner conductor and the female end inner conductor.

4. The system according to claim 1, wherein: The first through hole and the second through hole have the same radius.

5. The system according to claim 1, wherein: The radii of the first through hole and the second through hole meet preset conditions, and the preset conditions include that when the temperature measuring probe passes through the first through hole and the second through hole and contacts the connection between the male end inner conductor and the female end inner conductor, the standing wave ratio of the connector assembly is within a predetermined range corresponding to the connector assembly.

6. The system according to claim 1, wherein: A heat conducting layer is provided on the probe surface of the temperature measuring probe.

7. The system according to claim 6, characterized in that The heat-conducting layer includes thermally conductive silicone grease.

8. The system according to claim 1, wherein: The connector assembly includes an N-type radio frequency connector assembly.

9. The system according to claim 8, characterized in that The radius of the first through hole and the second through hole ranges from 1.70 mm to 1.90 mm.

10. A method for measuring the temperature rise of a connector, characterized in that: include: Using the connector temperature rise measurement system according to any one of claims 1 to 9, measuring the temperature of the connection between the male end inner conductor and the female end inner conductor in the connector assembly by a temperature measuring probe in the system; Based on the temperature measured by the temperature measuring probe, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

11. The method according to claim 10, characterized in that include: Obtaining input signal power and output signal power of the connector assembly through a first amplifier and a second amplifier, wherein the input signal power is the power of a first amplified signal output by the first amplifier, and the output signal power is the power of a second amplified signal output by the second amplifier; The analyzing the temperature rise of the connector assembly based on the temperature measured by the temperature measuring probe to obtain an analysis result includes: Based on the temperature measured by the temperature measuring probe, the input signal power and the output signal power of the connector assembly, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

12. The method according to claim 10, characterized in that Measuring the temperature of the connection between the male end inner conductor and the female end inner conductor in the connector assembly by using a temperature measuring probe in the system includes: Before the connector assembly is powered on, collecting the initial temperature measured by the temperature probe; After the connector assembly, the temperature measured by the temperature measuring probe is periodically collected until the change in the collected temperature within a preset time period is less than a preset threshold.

13. A temperature rise measuring device for a connector, characterized in that: include: a temperature measurement module configured to use the connector temperature rise measurement system according to any one of claims 1 to 9 to measure the temperature at the connection between the male inner conductor and the female inner conductor in the connector assembly through a temperature measurement probe in the system; The analysis module is configured to analyze the temperature rise of the connector assembly based on the temperature measured by the temperature measuring probe to obtain an analysis result.

14. The device according to claim 13, characterized in that include: an acquisition module configured to acquire an input signal power and an output signal power of the connector assembly through a first amplifier and a second amplifier, wherein the input signal power is the power of a first amplified signal output by the first amplifier, and the output signal power is the power of a second amplified signal output by the second amplifier; The analysis module is configured to: Based on the temperature measured by the temperature measuring probe, the input signal power and the output signal power of the connector assembly, the temperature rise of the connector assembly is analyzed to obtain an analysis result.

15. The device according to claim 13, characterized in that The temperature measurement module is configured as follows: Before the connector assembly is powered on, collecting the initial temperature measured by the temperature probe; After the connector assembly, the temperature measured by the temperature measuring probe is periodically collected until the change in the collected temperature within a preset time period is less than a preset threshold.

16. An electronic device, characterized in that: The method comprises a memory and a processor, wherein the memory is used to store one or more computer instructions, wherein the one or more computer instructions are executed by the processor to implement the method according to any one of claims 10 to 12.

17. A readable storage medium, characterized in that Computer instructions are stored thereon, and when the computer instructions are executed by a processor, the method according to any one of claims 10 to 12 is implemented.

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